Imaging device, projection device, vehicle lamp device, display device, and vehicle

Abstract

Embodiments of the present application relate to the technical field of imaging, and provide an imaging device, a projection device, a vehicle lamp device, a display device, and a vehicle. The imaging device comprises a thermoelectric cooler, an imaging component, and a housing. The housing encloses a closed cavity, the thermoelectric cooler and the imaging component are arranged inside the closed cavity, the thermoelectric cooler is used for adjusting the temperature of the imaging component, and the imaging component generates imaging light that is emitted to the outside of the housing. According to the imaging device provided in the embodiments of the present application, by arranging the thermoelectric cooler and the imaging component in the closed cavity, it can be ensured that the imaging component is used in a severe environment.

Description

Imaging device, projection device, vehicle lighting device, display device and vehicle

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on December 28, 2023, with application number 202311862395.1 and application name “Imaging device, projection device, car lighting device, display device and vehicle”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The embodiments of the present application relate to the field of imaging technology, and in particular to an imaging device, a projection device, a vehicle lighting device, a display device, and a vehicle. Background Art

[0003] With the development of vehicles like automobiles, adaptive driving beams (ADBs) and taillights with projection capabilities can now be implemented using display devices with pixelated projection capabilities. These displays can use light-emitting diodes (LEDs) or lasers as light sources, and utilize imaging devices such as liquid crystal on silicon (LCOS) and digital micromirror devices (DMDs) to modulate the light in a pixelated manner, achieving pixelated lighting and improving interactivity and safety.

[0004] In related technologies, headlights include a light source, a reflector, an imaging device, and a lens. The light beam emitted by the light source passes through the reflector and hits the surface of the imaging device. The imaging device then modulates the light beam into pixels and reflects it to the lens, where it is projected onto a target (e.g., the road surface) to form an image. However, due to the harsh environment inside headlights, such as high temperature and humidity, the imaging device cannot be used.

[0005] Therefore, how to enable imaging devices to be used in harsh environments (such as car lighting environments) has become an urgent problem to be solved. Summary of the Invention

[0006] The embodiments of the present application provide an imaging device, a projection device, a vehicle lamp device, a display device, and a vehicle, which can ensure that the imaging device can be used in harsh environments.

[0007] In a first aspect, the present application provides an imaging device for generating imaging light directed toward a lens. The imaging device includes a thermoelectric cooler, an imaging device, and a housing. The housing encloses a sealed cavity, the thermoelectric cooler and the imaging device are disposed within the sealed cavity, the thermoelectric cooler is configured to adjust the temperature of the imaging device, and the imaging device generates imaging light directed toward the exterior of the housing.

[0008] By placing the thermoelectric cooler and imaging device within a sealed cavity, the housing can prevent moisture from entering the sealed cavity in harsh environments, thereby preventing environmental problems such as condensation and corrosion on the thermoelectric cooler and imaging device. This improves the environmental reliability of the thermoelectric cooler and imaging device, thereby ensuring the reliability of the thermoelectric cooler and imaging device in harsh environments (such as vehicle lighting environments), ensuring the use of the imaging device in harsh environments. In addition, by adjusting the temperature of the imaging device through the thermoelectric cooler, the operating temperature of the imaging device can be effectively controlled within its ideal operating temperature range for a long period of time, thereby improving the optical performance of the imaging device in harsh environments (such as vehicle lighting environments), thereby improving the reliability of the imaging device in harsh environments (such as vehicle lighting environments).

[0009] In a possible embodiment, the sealed cavity is a vacuum cavity, so that the interior of the sealed cavity is in a vacuum state, and the imaging device and the thermoelectric cooler can be vacuum-sealed, which can improve the reliability of the imaging device in harsh environments.

[0010] In one possible embodiment, the sealed cavity is filled with at least one inert gas. By filling the sealed cavity with the inert gas, the thermoelectric cooler and the imaging device can be hermetically sealed, thereby preventing the imaging device from coming into contact with oxygen and water vapor when the imaging device is in an environment with high humidity, and further improving the reliability of the thermoelectric cooler and the imaging device in harsh environments.

[0011] In one possible embodiment, the inert gas is helium, neon, argon, krypton, xenon or radon.

[0012] In a possible implementation, the imaging device is in contact with the thermoelectric cooler, which can reduce the thermal resistance between the imaging device and the thermoelectric cooler and further improve the heat dissipation effect.

[0013] In a possible implementation, the imaging device further includes a first heat-conducting layer, and the first heat-conducting layer is filled between the thermoelectric cooler and the imaging device.

[0014] The first thermally conductive layer promptly transfers heat generated by the imaging device to the thermoelectric cooler, ensuring the device's operating temperature remains within its optimal range. Furthermore, by filling the gap between the thermoelectric cooler and the imaging device with the first thermally conductive layer, the thermal resistance between the two devices is reduced, further improving heat dissipation.

[0015] In a possible implementation, the imaging device includes an imaging element, where the imaging element is used to generate imaging light, and the imaging element is used to contact the thermoelectric cooler or the first heat conductive layer.

[0016] By making the imaging element contact the first heat-conducting layer or the thermoelectric cooler, the thermal resistance between the imaging element and the thermoelectric cooler can be further reduced, and the heat dissipation effect can be further improved.

[0017] In a possible implementation, the imaging device includes a substrate and an imaging element, wherein the substrate is disposed between the imaging element and the thermoelectric cooler, and the imaging element is used to generate imaging light.

[0018] By adopting a substrate and an imaging element to form an imaging device and a thermoelectric cooler for cooperation, the difficulty of cooperation between the imaging device and the thermoelectric cooler can be reduced.

[0019] In one possible implementation, the imaging device is liquid crystal on silicon, a digital micromirror device, a liquid crystal display, a micro-electromechanical system, or an organic light emitting diode.

[0020] In a possible implementation, along the thickness direction of the thermoelectric cooler, the projection of the thermoelectric cooler covers the imaging device, which can increase the heat exchange area between the thermoelectric cooler and the imaging device and further improve the heat dissipation effect.

[0021] In one possible embodiment, the shell includes a light-transmitting portion, and the imaging device is arranged between the light-transmitting portion and the thermoelectric cooler. The light-transmitting portion is used to transmit light outside the shell to the inside of the shell and to transmit imaging light generated by the imaging device to the outside of the shell, which can ensure the use of the imaging device so that the imaging light forms a target image.

[0022] In a possible implementation, along the thickness direction of the thermoelectric cooler, the projection of the light-transmitting portion covers the imaging device, which can ensure that the imaging light generated by the imaging device can be transmitted to the outside of the housing.

[0023] In a possible implementation, the light-transmitting portion is a glass portion or an optical resin portion, which can transmit light outside the housing to the inside of the housing and transmit imaging light to the outside of the housing.

[0024] In one possible embodiment, the housing further includes a heat-conducting tube shell portion, and the thermoelectric cooler is in contact with the tube shell portion, and the heat transferred by the thermoelectric cooler can be transferred to the outside of the housing to control the operating temperature of the imaging device within an optimal temperature range.

[0025] In a possible implementation manner, the tube shell portion is a ceramic tube shell, a metal tube shell, or a thermally conductive plastic tube shell.

[0026] A second aspect of the present application provides a projection device, comprising a lens and an imaging device as described in any one of the first aspects, wherein the imaging device is configured to generate imaging light directed toward the lens.

[0027] A third aspect of the present application provides a vehicle lamp device, comprising a vehicle lamp housing and a projection device according to the second aspect, wherein at least a portion of the projection device is disposed inside the vehicle lamp housing.

[0028] In a possible embodiment, the projection device further includes a heat dissipation device and a second heat-conducting layer, at least a portion of the heat dissipation device is disposed inside the headlight housing, the second heat-conducting layer is filled between the heat dissipation device and the housing of the imaging device, and the thermoelectric cooler of the imaging device is disposed between the imaging device of the imaging device and the second heat-conducting layer.

[0029] In a possible implementation, the projection device further includes a light source and a reflection unit, the reflection unit is configured to reflect the light beam emitted by the light source to the imaging device, and the imaging device is configured to generate imaging light according to the light beam emitted by the light source.

[0030] A fourth aspect of the present application provides a display device comprising an imaging unit and a projection device as in the second aspect, wherein the imaging unit is configured to generate a target image based on imaging light emitted by the projection device.

[0031] A fifth aspect of the present application provides a vehicle comprising a vehicle lamp device as described in any one of the third aspects or a display device as described in the fourth aspect.

[0032] In one possible embodiment, the display device is installed in a dashboard of a vehicle.

[0033] In a possible implementation, the vehicle further includes a windshield, and the imaging light emitted by the display device is incident on the windshield, and the windshield reflects the imaging light to the human eye. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] FIG1 is a schematic structural diagram of a vehicle lamp device provided in an embodiment of the present application;

[0035] FIG2 is a schematic structural diagram of a usage scenario of a display device provided in an embodiment of the present application;

[0036] FIG3 is a schematic structural diagram of a display device provided in an embodiment of the present application installed on a vehicle;

[0037] FIG4 is a schematic structural diagram of a first imaging device provided in an embodiment of the present application;

[0038] FIG5 is a schematic structural diagram of a second imaging device provided in an embodiment of the present application;

[0039] FIG6 is a schematic structural diagram of a third imaging device provided in an embodiment of the present application;

[0040] FIG7 is a schematic structural diagram of a fourth imaging device provided in an embodiment of the present application.

[0041] Explanation of Reference Numerals: 100, imaging device; 110, housing; 111, light-transmitting portion; 112, tube housing portion; 113, sealed cavity; 120, imaging device; 121, imaging element; 1211, adhesive layer; 1212, silicon substrate layer; 1213, liquid crystal layer; 1214, glass cover layer; 1215, anti-reflection layer; 122, substrate; 123, lead wire; 124, contact pad; 130, thermoelectric cooler; 131, first substrate; 132, second substrate; 133, semiconductor particles; 140, first heat-conducting layer; 200, vehicle lamp device; 210, vehicle lamp housing; 211, lampshade; 212, lamp housing; 220 , projection device; 221 , lens; 222 , body; 223 , heat dissipation device; 2231 , main body; 2232 , fin portion; 224 , second heat-conducting layer; 225 , light source; 226 , reflection unit; 300 , display device; 400 , imaging unit. DETAILED DESCRIPTION

[0042] In the related art, a car lamp includes a light source, a collimating lens, a reflector, an imaging device and a lens. Among them, the collimating lens collimates the light beam emitted by the light source, and the reflector reflects the light beam collimated by the collimating lens to the surface of the imaging device. The imaging device is used to pixelate the collimated light beam and generate an imaging light beam directed to the lens. The lens projects the imaging light beam to the target (such as the road surface) to form an image on the target. However, due to the harsh environment inside the car lamp, such as high ambient temperature and high humidity inside the lamp, the imaging device cannot be used. Therefore, how to make the imaging device use in harsh environments (such as car lamp environments) has become a problem that needs to be solved urgently.

[0043] In view of this, the embodiments of the present application provide an imaging device 100, a projection device 220, a headlight device 200, a display device 300, and a vehicle. By disposing the imaging device 120 and the thermoelectric cooler 130 in a sealed cavity, the environmental reliability of the thermoelectric cooler 130 and the imaging device 120 can be improved, thereby improving the reliability of the thermoelectric cooler 130 and the imaging device 120 when used in harsh environments (such as headlight environments). In addition, by adjusting the temperature of the imaging device 120 through the thermoelectric cooler 130, the operating temperature of the imaging device 120 can be controlled within an optimal operating temperature range, thereby keeping the optical performance of the imaging device 120 within a reasonable range, thereby improving the reliability of the imaging device 120 when used in harsh environments (such as headlight environments). Therefore, the imaging device 120 can be used in harsh environments to meet usage requirements.

[0044] The vehicles provided in the embodiments of the present application may include, but are not limited to, automobiles, trucks, motorcycles, buses, boats, airplanes, helicopters, lawn mowers, recreational vehicles, amusement park vehicles, construction equipment, trams, golf carts, trains, or carts. In the embodiments of the present application, an automobile is used as an example of the above-mentioned vehicles for illustration. The vehicles may include a headlight device 200, which may be used for lighting, projection imaging, and the like.

[0045] The vehicle lighting device 200 provided in the embodiment of the present application may include but is not limited to the vehicle's external headlights (also called headlights), fog lights, taillights, cabin interior lighting or atmosphere lights, etc. For example, in the embodiment of the present application, the vehicle's external headlights are used as an example of the above-mentioned vehicle lighting device 200. The vehicle lighting device 200 can play the role of projection imaging and display lighting, such as lighting at night.

[0046] FIG1 is a schematic structural diagram of a vehicle lamp device provided in an embodiment of the present application.

[0047] As shown in FIG1 , a vehicle lamp device 200 may include a vehicle lamp housing 210 and a projection device 220. At least a portion of the projection device 220 is disposed within the vehicle lamp housing 210. For example, as shown in FIG1 , the projection device 220 is disposed within the vehicle lamp housing 210. Alternatively, a portion of the projection device 220 may be disposed within the vehicle lamp housing 210 and another portion may be disposed outside the vehicle lamp housing 210. The projection device 220 is used to project images and display illumination.

[0048] 1 , the vehicle lamp housing 210 includes a lampshade 211 and a lamp housing 212 . The lampshade 211 and the lamp housing 212 enclose a cavity that at least partially accommodates the projection device 220 . The lampshade 211 can transmit light to ensure that imaging light generated by the projection device 220 is transmitted.

[0049] As shown in FIG1 , projection device 220 includes lens 221 and imaging device 100. Imaging device 100 is configured to generate imaging light directed toward lens 221. Lens 221 is located adjacent to lampshade 211 and projects the imaging light onto the exterior of lamp housing 210 to form an image or illumination in front of the vehicle.

[0050] 1 , the projection device 220 may further include a body 222 , the lens 221 and the imaging device 100 are respectively mounted on the body 222 , and the body 222 is connected to the lamp housing 212 to achieve a fixed connection between the projection device 220 and the lamp housing 212 .

[0051] As shown in FIG1 , imaging device 100 includes an imaging device 120 and a thermoelectric cooler 130. Imaging device 120 is used to generate imaging light directed toward lens 221. Thermoelectric cooler 130 is used to adjust the temperature of imaging device 120 so that the operating temperature of imaging device 120 is within an optimal operating temperature range.

[0052] The imaging device 120 may include, but is not limited to, liquid crystal on silicon (LCOS), a digital micromirror device (DMD), a micro electromechanical system (MEMS), a liquid crystal display (LCD), an organic light-emitting diode (OLED), or a micro-light-emitting diode (micro-LED). For example, in the embodiments of the present application, liquid crystal on silicon (LCOS) is used as the imaging device 120 for illustration.

[0053] To further improve the heat dissipation capability of the imaging device 100, in some possible implementations, as shown in FIG1 , the projection device 220 may further include a heat sink 223 and a second heat-conducting layer 224. At least a portion of the heat sink 223 is disposed within the interior of the vehicle lamp housing 210. For example, as shown in FIG1 , the heat sink 223 may be disposed within the vehicle lamp housing 210. Alternatively, a portion of the heat sink 223 may be disposed within the vehicle lamp housing 210 and another portion may be disposed outside the vehicle lamp housing 210. The second heat-conducting layer 224 is interposed between the heat sink 223 and the housing 110 of the imaging device 100.

[0054] By dissipating heat from the imaging device 100 through the heat dissipation device 223, the heat dissipation capacity of the imaging device 100 can be improved, ensuring the normal operation of the imaging device 100. In addition, by filling the second heat conductive layer 224 between the housing 110 and the heat dissipation device 223, the thermal resistance between the heat dissipation device 223, the imaging device 100, and the heat dissipation device 223 can be reduced, thereby improving the heat dissipation capacity of the imaging device 100.

[0055] The heat sink 223 can dissipate heat from the imaging device 100 through air cooling, liquid cooling, or other cooling methods, without specific limitation. In some implementations, the heat sink 223 can be a liquid-cooled heat sink, which can include pipes and a liquid cooling plate, which is used to exchange heat with the imaging device. In other implementations, the heat sink 223 can also be an air-cooled heat sink, which can include a radiator and a fan, with the radiator positioned between the imaging device 100 and the fan. In still other implementations, the heat sink 223 can also be a radiator, which is used to increase the heat exchange area between the imaging device 100 and the air.

[0056] The specific structure of the heat sink 223 is not limited herein. For example, the heat sink 223 may be a finned heat sink, as shown in FIG1 . The finned heat sink may include a main body 2231 and a plurality of fins 2232 disposed on the same side of the main body 2231. The second heat-conducting layer 224 is interposed between the main body 2231 and the housing 110 of the imaging device 100. The heat sink 223 may increase the heat exchange area between the imaging device 100 and the air, thereby improving the heat dissipation capability of the imaging device 100.

[0057] There is no limitation on the specific material of the second heat-conducting layer 224. The second heat-conducting layer 224 may include, but is not limited to, thermally conductive silicone, silver thermal paste, copper gasket, thermal adhesive, thermal grease, thermal gel, thermal pad, graphite sheet, thermal insulating film, or thermally conductive ceramic sheet.

[0058] It should be noted that, in addition to the indirect contact between the heat dissipation device 223 and the housing 110 of the imaging device 100 through the second heat-conducting layer 224, the second heat-conducting layer 224 can also be removed. In this case, the heat dissipation device 223 can be in contact with the housing 110 of the imaging device 100, or the heat dissipation device 223 can also not be in contact with the housing 110 of the imaging device 100.

[0059] To reduce the size of the projection device 220 and ensure the generation of imaging light, in some possible implementations, as shown in FIG1 , the projection device 220 may further include a light source 225 and a reflection unit 226. The reflection unit 226 is configured to reflect the light beam emitted by the light source 225 toward the imaging device 100. The imaging device 100 is configured to generate imaging light toward the lens 221 based on the light beam emitted by the light source 225.

[0060] The light source 225 may include but is not limited to a light emitting diode (LED) device or a laser diode (LD).

[0061] It should be noted that when the imaging device 120 is an organic light-emitting diode, a micro-light-emitting diode (micro-LED) or other device, there is no need to set the light source 225. At this time, the projection device 220 may also include a reflection unit 226 or remove the reflection unit 226. The reflection unit 226 can be used to reflect the imaging light emitted by the imaging device 120 to the lens 221.

[0062] There is no limitation on the specific structure of the reflection unit 226 . For example, referring to FIG1 , the reflection unit 226 may be a curved mirror, and the light emitted by the light source 225 is reflected to the imaging device 100 by the curved surface of the curved mirror.

[0063] It should be noted that the projection device 220 provided in the embodiment of the present application can be used in addition to the vehicle lamp device 200 for projection imaging and display lighting. It can also be used in a display device 300 such as a projector, a head-up display, augmented reality (AR) glasses, a television, etc. to perform projection imaging. The display device 300 can be installed in a vehicle's dashboard, seat, passenger seat, or roof.

[0064] The following description will be made by taking a head-up display as the display device 300 as an example.

[0065] FIG2 is a schematic structural diagram of a usage scenario of a display device provided in an embodiment of the present application.

[0066] As shown in Figure 2, a head-up display (HUD) can project navigation information, instrument information, etc. into the driver's field of view in front of him, preventing the driver from looking down to view this information, which would affect driving safety. The image projected by the HUD is reflected by the windshield (windshield) to form a virtual image outside the vehicle. These virtual images can be superimposed on the real environment outside the vehicle, allowing the driver to obtain augmented reality (AR) visual effects, thereby realizing AR navigation, adaptive cruise control, lane departure warning and other functions. Among them, the types of HUD include but are not limited to windshield (W)-HUD, augmented reality head-up display (AR-HUD), etc.

[0067] FIG3 is a schematic structural diagram of a display device provided in an embodiment of the present application installed on a vehicle.

[0068] As shown in FIG3 , the display device 300 provided in an embodiment of the present application can be installed in the dashboard of a vehicle to achieve a concealed installation. Furthermore, the imaging light emitted by the display device 300 can be incident on the windshield, which can reflect the imaging light toward the human eye, allowing the human eye to see a virtual image located outside the windshield.

[0069] Continuing with FIG3 , the vehicle may further include a windshield. Imaging light emitted by the display device 300 is incident on the windshield, which then reflects the imaging light toward the user's eyes. Specifically, the display device 300 may include a projection device 220 and an imaging unit 400. The imaging unit 400 may reflect the imaging light emitted by the projection device 220 toward the windshield, which then reflects the imaging light toward the user's eyes to form a target image.

[0070] 3 , the projection device 220 may include the imaging device 100, a lens 221, and a light source 225. The imaging device 100 is configured to generate imaging light incident on the lens 221 based on the light beam emitted by the light source 225. The lens 221 is configured to project the imaging light generated by the imaging device 100 onto the imaging unit 400. The imaging unit 400 is configured to generate a target image based on the imaging light emitted by the projection device 220.

[0071] The specific structure of imaging unit 400 is not limited here. For example, as shown in Figure 3, imaging unit 400 may include a curved mirror that reflects the imaging light emitted by projection device 220 toward a windshield, which in turn reflects the imaging light toward the user's eye. Furthermore, because the concave surface of the curved mirror reflects the imaging light, the image generated by projection device 220 can be magnified by the curved mirror, allowing the user to see a magnified virtual image.

[0072] The following describes an implementation of the imaging device 100 provided in an embodiment of the present application.

[0073] FIG4 is a schematic structural diagram of a first imaging device provided in an embodiment of the present application.

[0074] As shown in FIG4 , an imaging device 100 provided in an embodiment of the present application includes a thermoelectric cooler 130 (TEC), an imaging device 120, and a housing 110. The housing 110 encloses a sealed cavity 113, and the thermoelectric cooler 130 and the imaging device 120 are disposed within the sealed cavity 113. The thermoelectric cooler 130 is used to adjust the temperature of the imaging device 120, and the imaging device 120 generates imaging light directed toward the exterior of the housing 110. During operation of the imaging device 100, the thermoelectric cooler 130 can transfer heat generated by the imaging device 120 to the housing 110, and the housing 110 can transfer the received heat to the exterior of the housing 110 to dissipate heat from the imaging device 120.

[0075] The thermoelectric cooler 130 can be used to lower or raise the temperature of the imaging device 120. Specifically, when the imaging device 100 is in a high-temperature environment, the cold end surface of the thermoelectric cooler 130 is close to the imaging device 120, while the hot end surface of the thermoelectric cooler 130 is close to the housing 110. The thermoelectric cooler 130 cools the imaging device 120, thereby controlling the temperature of the imaging device 120 within the optimal operating temperature range. When the imaging device 100 is in a low-temperature environment, the hot end surface of the thermoelectric cooler 130 is close to the imaging device 120, while the cold end surface of the thermoelectric cooler 130 is close to the housing 110. The thermoelectric cooler 130 heats the imaging device 120, thereby resolving the problem of insufficient performance of the imaging device 120 in low-temperature environments without requiring an additional heating device.

[0076] 4 , by placing the thermoelectric cooler 130 and the imaging device 120 inside the sealed cavity 113, the housing 110 can prevent moisture in a harsh environment from entering the sealed cavity 113. In other words, the imaging device 120 and the thermoelectric cooler 130 are in a low-humidity environment, which will not cause environmental problems such as condensation and corrosion of the thermoelectric cooler 130 and the imaging device 120. This can improve the environmental reliability of the thermoelectric cooler 130 and the imaging device 120, and further ensure the reliability of the thermoelectric cooler 130 and the imaging device 120 when used in harsh environments (such as car lighting environments).

[0077] Furthermore, by regulating the temperature of the imaging device 120 through the thermoelectric cooler 130, the operating temperature of the imaging device 120 can be effectively controlled within its ideal operating temperature range over a long period of time, thereby improving the optical performance and reliability of the imaging device 120 when used in harsh environments (such as vehicle lighting). Furthermore, the temperature control can be adjusted in real time based on changes in ambient temperature, ensuring that the imaging device 120 remains above the dew point to prevent condensation.

[0078] It should be noted that, as shown in FIG1 , when the imaging device 100 is applied to a projection device 220, the thermoelectric cooler 130 is disposed between the imaging device 120 and the second heat-conducting layer 224. Furthermore, the second heat-conducting layer 224 is disposed outside the housing 110 and is filled between the heat sink 223 and the housing 110. The second heat-conducting layer 224 can transfer heat transferred from the housing 110 to the heat sink 223.

[0079] There is no limitation on the specific structure of the thermoelectric cooler 130 . For example, any thermoelectric cooler 130 in the prior art that can cool or heat the imaging device 120 can be used.

[0080] For example, as shown in FIG4 , the thermoelectric cooler 130 may include a first substrate 131, a second substrate 132, and semiconductor particles 133 disposed opposite each other. The first substrate 131 and the second substrate 132 are disposed opposite each other, with the semiconductor particles 133 disposed between the first substrate 131 and the second substrate 132. The first substrate 131 is disposed between the imaging device 120 and the second substrate 132. The first substrate 131 may contact the imaging device 120 (e.g., as shown in FIG6 or FIG7 ) or the first heat-conducting layer 140 (e.g., as shown in FIG4 or FIG5 ), or the first substrate 131 may be spaced apart from the imaging device 120. The second substrate 132 may contact the housing 110 (e.g., as shown in FIG4 ), or may not contact the housing 110, or may contact a third heat-conducting layer (not shown), which is disposed between the thermoelectric cooler 130 and the housing 110.

[0081] The semiconductor particles 133 may be carriers of the thermoelectric effect. In addition, the first substrate 131 and the second substrate 132 may be made of thermally conductive materials, for example, each of the first substrate 131 and the second substrate 132 may be a silicon substrate or a ceramic substrate.

[0082] In order to further improve the sealing of the closed cavity 113, in some possible implementations, the closed cavity 113 can also be filled with at least one inert gas. For example, the closed cavity 113 is filled with an inert gas (such as N2 shown in Figure 4). Of course, the closed cavity 113 can also be filled with multiple inert gases.

[0083] Accordingly, by filling the sealed cavity 113 with inert gas, the thermoelectric cooler 130 and the imaging device 120 can be hermetically sealed, so that when the imaging device 100 is in an environment with high humidity, the inside of the sealed cavity 113 will not be at a high humidity level, which can further improve the reliability of the thermoelectric cooler 130 and the imaging device 100 in harsh environments.

[0084] The inert gas may include but is not limited to helium, neon, argon, krypton, xenon or radon.

[0085] In addition to improving the sealing performance of the sealed cavity 113 by filling it with an inert gas, in some possible implementations, the sealed cavity 113 may also be a vacuum cavity. By performing a vacuum treatment on the sealed cavity 113, the interior of the sealed cavity 113 is in a vacuum state, thereby forming a vacuum cavity. This can further vacuum-seal the imaging device 120 and the thermoelectric cooler 130, further improving the reliability of the thermoelectric cooler 130 and the imaging device 100 in harsh environments.

[0086] To improve heat dissipation capabilities for the imaging device 120, in some possible implementations, as shown in FIG4 , the imaging device 100 may further include a first heat-conducting layer 140, which is interposed between the thermoelectric cooler 130 and the imaging device 120. During operation of the imaging device 100, the first heat-conducting layer 140 can promptly transfer heat generated by the imaging device 120 to the thermoelectric cooler 130, thereby ensuring that the operating temperature of the imaging device 120 is within an optimal operating temperature range.

[0087] Accordingly, the first heat-conducting layer 140 fills the gap between the thermoelectric cooler 130 and the imaging device 120, thereby preventing the heat generated by the imaging device 120 from being transferred to the thermoelectric cooler 130 through the air. This can reduce the thermal resistance between the imaging device 120 and the thermoelectric cooler 130, and help to further improve the heat dissipation effect.

[0088] The specific material of the first heat-conducting layer 140 is not limited herein. The first heat-conducting layer 140 may include, but is not limited to, thermally conductive silicone, silver thermal paste, copper gasket, thermal adhesive, thermal grease, thermal gel, thermal pad, graphite sheet, thermal insulating film, thermally conductive ceramic sheet, or a solder metal layer.

[0089] There is no limitation on how to fix the imaging device 120. For example, the imaging device 120 can be fixedly connected to the thermoelectric cooler 130 through the first heat-conducting layer 140. Specifically, the first heat-conducting layer 140 can have adhesive properties, and the first heat-conducting layer 140 is bonded to the thermoelectric cooler 130 and the imaging device 120 respectively. By connecting the imaging device 120 and the thermoelectric cooler 130 through the first heat-conducting layer 140, the utilization rate of the first heat-conducting layer 140 can be improved and the difficulty of connecting the imaging device 120 and the thermoelectric cooler 130 can be reduced. Alternatively, in some embodiments, the imaging device 100 may further include a fixing member (not shown in the figure), and the thermoelectric cooler 130 can be fixedly connected to the imaging device 120 through the fixing member, and the fixing member may include but is not limited to screws, bolts or clips.

[0090] As shown in FIG4 , the imaging device 120 may include a substrate 122 and an imaging element 121. The substrate 122 is disposed between the imaging element 121 and the thermoelectric cooler 130, which is used to generate imaging light. Because a first heat-conducting layer 140 is located between the thermoelectric cooler 130 and the imaging device 120, the first heat-conducting layer 140 is located between the substrate 122 and the thermoelectric cooler 130. In other words, the substrate 122 is in indirect contact with the thermoelectric cooler 130 via the first heat-conducting layer 140.

[0091] Since the imaging device 120 is an LCOS, during the operation of the imaging apparatus 100 , the imaging element 121 is used to receive the light beam emitted by the light source 225 and generate imaging light toward the lens 221 according to the light beam emitted by the light source 225 .

[0092] During the operation of the imaging device 100, the substrate 122 transfers the heat generated by the imaging element 121 to the first heat-conducting layer 140, the first heat-conducting layer 140 transfers the received heat to the thermoelectric cooler 130, the thermoelectric cooler 130 transfers the received heat to the housing 110, and the housing 110 transfers the received heat to the outside of the housing 110 to dissipate heat from the imaging element 121.

[0093] By using the imaging device 120 composed of the substrate 122 and the imaging element 121 in conjunction with the thermoelectric cooler 130, existing imaging devices 120 can be used, eliminating the need to redesign the imaging device 120 and reducing the cost of the imaging device 120. Furthermore, the difficulty of connecting the imaging device 120 to the thermoelectric cooler 130 can be reduced.

[0094] In order to ensure that the heat generated by the imaging element 121 is transferred to the first heat-conducting layer 140 , the substrate 122 is made of a heat-conducting material, such as a ceramic substrate.

[0095] The specific structure of imaging element 121 is not limited here. It can be determined based on the specific type of imaging element 120. For example, when imaging element 120 is an LCOS, as shown in FIG4 , imaging element 121 can include a silicon substrate layer 1212, a glass cover layer 1214, an adhesive layer 1211, a liquid crystal layer 1213, and an anti-reflection layer 1215. Silicon substrate layer 1212 is connected to substrate 122 via adhesive layer 1211. Liquid crystal layer 1213 is disposed between glass cover layer 1214 and silicon substrate layer 1212. Glass cover layer 1214 is disposed between anti-reflection layer 1215 and liquid crystal layer 1213. Anti-reflection layer 1215 is used to reduce the intensity of reflected light and increase the intensity of projected light. Adhesive layer 1211 can be a die-bonding adhesive or double-sided tape, for example.

[0096] In which, a circuit board (not shown in the figure) is set in the substrate 122, and the imaging element 121 is electrically connected to the contact pad 124 on the substrate 122 through the lead 123, and is electrically connected to the circuit board through the contact pad 124. The circuit board transmits the image signal to the imaging element 121 so that the imaging element 121 generates imaging light.

[0097] In order to ensure the generation and emission of imaging light, in some possible implementations, as shown in Figure 4, the shell 110 may also include a light-transmitting portion 111, and the imaging device 120 is arranged between the light-transmitting portion 111 and the thermoelectric cooler 130. The light-transmitting portion 111 is used to transmit light outside the shell 110 to the inside of the shell 110 and to transmit the imaging light generated by the imaging device 120 to the outside of the shell 110, which can ensure the use of the imaging device 120 so that the imaging light forms a target image.

[0098] There are no specific restrictions on the material of the light-transmitting portion 111. Any material is acceptable as long as light can pass through the light-transmitting portion 111. For example, as shown in FIG4 , the light-transmitting portion 111 can be made of glass or an optical resin. Of course, the light-transmitting portion 111 can also be made of other light-transmitting materials. However, when the light-transmitting portion 111 is made of glass or an optical resin, it can transmit light from outside the housing 110 to the inside of the housing 110 and transmit imaging light to the outside of the housing 110.

[0099] To ensure that the heat transferred by the thermoelectric cooler 130 is transferred to the outside of the housing 110, in some possible implementations, as shown in Figure 4, the housing 110 may further include a heat-conducting tube shell portion 112. The thermoelectric cooler 130 is in contact with the tube shell portion 112. The tube shell portion 112 can transfer the heat transferred by the thermoelectric cooler to the outside of the housing 110 to ensure that the operating temperature of the imaging device 120 is within the optimal operating temperature range.

[0100] To further enhance the heat dissipation capability of the imaging device 120, as shown in FIG4 , the housing portion 112 may be a cylindrical structure, with the light-transmitting portion 111 disposed at the opening of the housing portion 112. The light-transmitting portion 111 and the housing portion 112 enclose a sealed cavity 113. The heat-conductive housing portion 112 and the light-transmitting portion 111 enclose the sealed cavity 113, which not only seals the thermoelectric cooler 130 and the imaging device 120 to enhance their reliability, but also allows heat to be transferred between the interior and exterior of the housing 110 to lower or raise the temperature of the imaging device 120.

[0101] The shell portion 112 may include, but is not limited to, a ceramic shell, a metal shell, a heat-conducting plastic shell, or other heat-conducting shells made of new materials with heat-conducting properties. For example, in this application example, a ceramic shell is used as the shell portion 112 for illustration.

[0102] It should be noted that, in addition to being in contact with the thermoelectric cooler 130, the housing portion 112 may also be spaced apart from the thermoelectric cooler 130. In other words, the hot end surface or the cold end surface of the thermoelectric cooler 130 does not contact the housing portion 112. Alternatively, in some embodiments, the imaging device 100 may further include a third heat-conducting layer (not shown) disposed between the housing portion 112 and the thermoelectric cooler 130. The third heat-conducting layer transfers heat from the thermoelectric cooler 130 to the housing portion 112.

[0103] The specific material of the third heat-conducting layer is not limited here. The third heat-conducting layer may include but is not limited to thermally conductive silica gel, silver thermal conductive paste or copper gasket.

[0104] In order to ensure that the imaging device 120 receives the light beam emitted by the light source 225 or emits the imaging light to the outside of the housing 110, in some possible implementations, as shown in Figure 4, along the thickness direction of the thermoelectric cooler 130 (such as the Y direction in Figure 4), the projection of the light-transmitting portion 111 can cover the imaging device 120, which can ensure that the imaging light generated by the imaging device 120 can be transmitted to the outside of the housing 110, and can ensure that the imaging device 120 receives the light beam emitted by the light source 225.

[0105] 4 , it can be seen that along the thickness direction of the thermoelectric cooler 130 (such as the Y direction in FIG4 ), the projected area of ​​the light-transmitting portion 111 is larger than the projected area of ​​the imaging device 120 . Of course, the projected area of ​​the light-transmitting portion 111 may also be equal to the projected area of ​​the imaging device 120 .

[0106] Since the imaging light is generated by the imaging element 121, in some embodiments, the projection of the light-transmitting portion 111 along the thickness direction of the thermoelectric cooler 130 (such as the Y direction in Figure 4) can also cover the imaging element 121, and can also ensure that the imaging element 121 generates imaging light according to the light beam emitted by the light source 225 or ensures that the imaging light is emitted to the outside of the shell 110.

[0107] In order to improve the heat dissipation capability of the imaging device 120, in some possible implementations, as shown in FIG4 , along the thickness direction of the thermoelectric cooler 130 (such as the Y direction in FIG4 ), the projection of the thermoelectric cooler 130 can cover the imaging device 120, thereby increasing the heat exchange area between the thermoelectric cooler 130 and the imaging device 120 and further improving the heat dissipation effect.

[0108] Since the imaging device 120 is composed of the substrate 122 and the imaging element 121, and the projection area of ​​the substrate 122 along the thickness direction of the thermoelectric cooler 130 (such as the Y direction in Figure 4) is larger than the projection area of ​​the imaging element 121, therefore, the projection of the thermoelectric cooler 130 in the thickness direction of the thermoelectric cooler 130 (such as the Y direction in Figure 4) must cover the substrate 122 to ensure that the heat transferred by the substrate 122 can be transferred to the thermoelectric cooler 130 through the first heat-conducting layer 140.

[0109] 4 , along the thickness direction of the thermoelectric cooler 130 (e.g., the Y direction in FIG. 4 ), the projected area of ​​the thermoelectric cooler 130 is equal to the projected area of ​​the substrate 122 . Of course, the projected area of ​​the thermoelectric cooler 130 may also be larger than the projected area of ​​the substrate 122 .

[0110] FIG5 is a schematic structural diagram of a second imaging device provided in an embodiment of the present application.

[0111] FIG5 differs from FIG4 in the structure of imaging device 120. Specifically, as shown in FIG5 , imaging device 120 removes substrate 122. Instead, imaging element 121 indirectly contacts thermoelectric cooler 130 via first heat-conducting layer 140. This reduces the thermal resistance between imaging device 120 and thermoelectric cooler 130, further improving the heat dissipation capability of imaging device 120.

[0112] Since the substrate 122 is removed, to ensure that the imaging element 121 can generate imaging light, the circuit board used to transmit the image signal to the imaging element 121 can be integrated into the thermoelectric cooler 130, or can be integrated into the interior of the tube shell 112, or can be provided outside the housing 110. For example, in the embodiment of the present application, the circuit board can be integrated into the thermoelectric cooler 130, and the lead 123 is electrically connected to the circuit board through the contact pad 124 provided on the thermoelectric cooler 130.

[0113] In order to ensure that the imaging element 121 is electrically connected to the circuit board, the first heat-conducting layer 140 may have a via for the lead 123 to pass through. Of course, the lead 123 may also be electrically connected to the imaging element 121 and the circuit board in other ways. For example, the inner wall of the tube shell portion 112 may be provided with a lead groove, and part of the lead 123 is arranged in the lead groove and electrically connected to the circuit board.

[0114] In the above description, a first heat-conducting layer 140 is provided between the imaging device 120 and the thermoelectric cooler 130. However, considering that the first heat-conducting layer 140 itself also has thermal resistance, in order to further reduce the thermal resistance of the imaging device 100, the imaging device 120 may also be in contact with the thermoelectric cooler 130. This can further reduce the thermal resistance between the imaging device 120 and the thermoelectric cooler 130 and further improve the heat dissipation effect. The structure of the imaging device 100 in which the imaging device 120 and the thermoelectric cooler 130 are in contact is described below.

[0115] As shown in FIG5 , since the imaging element 121 has the adhesive layer 1211, the imaging element 121 can be connected to the first heat-conducting layer 140 via the adhesive layer 1211. The imaging element 121 is also fixedly connected to the thermoelectric cooler 130 via the first heat-conducting layer 140. Of course, the imaging element 121 can also be fixedly connected to the thermoelectric cooler 130 via other methods. In addition, in some examples, the imaging element 121 can also be removed from the adhesive layer 1211.

[0116] FIG6 is a schematic structural diagram of a third imaging device provided in an embodiment of the present application.

[0117] FIG6 differs from FIG4 in that the first heat-conducting layer 140 is removed. Specifically, as shown in FIG6 , the imaging device 120 includes a substrate 122 and an imaging element 121. The substrate 122 is disposed between the imaging element 121 and the thermoelectric cooler 130. The substrate 122 is in contact with the thermoelectric cooler 130, which reduces the thermal resistance between the substrate 122 and the thermoelectric cooler 130, thereby further improving the heat dissipation capability of the imaging element 121.

[0118] In order to simplify the structure of the imaging device 100, the substrate 122 can be fixedly connected to the thermoelectric cooler 130. For example, the substrate 122 can be fixedly connected to the thermoelectric cooler 130 by welding. Of course, the substrate 122 can also be fixedly connected to the thermoelectric cooler 130 by other means, such as clamping or bonding.

[0119] FIG7 is a schematic structural diagram of a fourth imaging device provided in an embodiment of the present application.

[0120] Figure 7 differs from Figure 6 in that the imaging device 120 removes the substrate 122. Specifically, as shown in Figure 7 , the imaging device 120 includes an imaging element 121, which is in contact with a thermoelectric cooler 130 and is used to generate imaging light. This contact between the imaging element 121 and the thermoelectric cooler 130 further reduces the thermal resistance between the two, improving heat dissipation and enhancing the performance and reliability of the imaging device 120.

[0121] Since the substrate 122 is removed, to ensure that the imaging element 121 can generate imaging light, the circuit board used to transmit the image signal to the imaging element 121 can be integrated into the thermoelectric cooler 130, or can be integrated into the interior of the tube shell 112, or can be provided outside the housing 110. For example, in the embodiment of the present application, the circuit board can be integrated into the thermoelectric cooler 130, and the lead 123 is electrically connected to the circuit board through the contact pad 124 provided on the thermoelectric cooler 130.

[0122] In order to simplify the structure of the imaging device 100 , the imaging element 121 may be fixedly connected to the thermoelectric cooler 130 . For example, the imaging element 121 may be fixed to the thermoelectric cooler 130 by welding.

[0123] 7 , since the imaging element 121 has the adhesive layer 1211 , the imaging element 121 can be fixedly connected to the thermoelectric cooler 130 via the adhesive layer 1211 . Of course, the imaging element 121 can also be fixedly connected to the thermoelectric cooler 130 by other means without the adhesive layer 1211 .

[0124] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0125] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0126] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can, for example, be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0127] The term "plurality" in this document refers to two or more. The term "and / or" in this document simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can represent: A alone, A and B together, or B alone. Furthermore, the character " / " in this document generally indicates an "or" relationship between the related objects; in a formula, the character " / " indicates a "division" relationship between the related objects.

[0128] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0129] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An imaging device, characterized in that, The imaging device is used to generate imaging light directed towards the lens. The imaging device includes a thermoelectric cooler, an imaging device, and a housing; The housing encloses a sealed cavity. The thermoelectric cooler and the imaging device are disposed inside the sealed cavity. The thermoelectric cooler is used to adjust the temperature of the imaging device, and the imaging device generates the imaging light directed towards the outside of the housing.

2. The imaging device according to claim 1, characterized in that, The sealed cavity is a vacuum cavity or the sealed cavity is filled with at least one inert gas.

3. The imaging device according to claim 2, wherein The inert gas is helium, neon, argon, krypton, xenon, or radon.

4. The imaging device according to any one of claims 1 to 3, characterized in that, The imaging device is in contact with the thermoelectric cooler.

5. The imaging device according to any one of claims 1 to 3, characterized in that, The imaging device further includes a first heat-conducting layer, and the first heat-conducting layer is filled between the thermoelectric cooler and the imaging device.

6. The imaging device according to any one of claims 1 to 5, characterized in that, The imaging device includes an imaging element, and the imaging element is used to generate the imaging light. The imaging element is used to be in contact with the thermoelectric cooler or the first heat-conducting layer.

7. The imaging device according to any one of claims 1 to 5, characterized in that, The imaging device includes a substrate and an imaging element. The substrate is disposed between the imaging element and the thermoelectric cooler, and the imaging element is used to generate the imaging light.

8. The imaging device according to any one of claims 1 to 7, characterized in that, The imaging device is a liquid crystal on silicon, digital micromirror device, liquid crystal display, microelectromechanical system, or organic light-emitting diode.

9. The imaging device according to any one of claims 1 to 8, characterized in that, Along the thickness direction of the thermoelectric cooler, the projection of the thermoelectric cooler covers the imaging device.

10. The imaging device according to any one of claims 1 to 9, characterized in that, The housing includes a light-transmitting portion. The imaging device is disposed between the light-transmitting portion and the thermoelectric cooler. The light-transmitting portion is used to transmit the light outside the housing to the inside of the housing and is used to transmit the imaging light generated by the imaging device to the outside of the housing.

11. The imaging device according to claim 10, wherein, Along the thickness direction of the thermoelectric cooler, the projection of the light-transmitting portion covers the imaging device.

12. The imaging device according to claim 10 or 11, characterized in that, The light-transmitting portion is a glass portion or an optical resin portion.

13. The imaging device according to any one of claims 10 to 12, characterized in that, The housing further includes a heat-conducting shell portion, and the thermoelectric cooler is in contact with the shell portion.

14. The imaging device according to claim 13, wherein, The shell portion is a ceramic shell, a metal shell, or a heat-conducting plastic shell.

15. A projection device, characterized in that, It includes a lens and the imaging device according to any one of claims 1 to 14. The imaging device is used to generate imaging light directed towards the lens.

16. A vehicle lamp device, characterized in that, It includes a vehicle lamp housing and the projection device according to claim 15. At least part of the projection device is disposed inside the vehicle lamp housing.

17. The vehicle lamp device according to claim 16, characterized in that, The projection device further includes a heat dissipation device and a second heat-conducting layer. At least part of the heat dissipation device is disposed inside the vehicle lamp housing. The second heat-conducting layer is filled between the heat dissipation device and the housing of the imaging device. The thermoelectric cooler of the imaging device is disposed between the imaging device of the imaging device and the second heat-conducting layer.

18. The headlamp device according to claim 16 or 17, characterized in that, The projection device further includes a light source and a reflection unit. The reflection unit is used to reflect the light beam emitted by the light source to the imaging device, and the imaging device is used to generate imaging light according to the light beam emitted by the light source.

19. A display device, characterized in that, It includes an imaging unit and the projection device according to claim 15. The imaging unit is used to generate a target image according to the imaging light emitted by the projection device.

20. A vehicle, characterized in that, It includes the vehicle lamp device according to any one of claims 16 to 18 or includes the display device according to claim 19.

21. The vehicle according to claim 20, wherein, The display device is installed in the instrument panel of the vehicle.

22. The vehicle according to claim 20 or 21, characterized in that, The vehicle further includes a windshield, and the imaging light emitted by the display device is incident on the windshield, and the windshield reflects the imaging light to the human eye.

Images