Chip heat dissipation structure and terminal device

Abstract

Disclosed in embodiments of the present disclosure are a chip heat dissipation structure and a terminal device. The chip heat dissipation structure comprises a circuit board, a chipset arranged on the circuit board, and a cold plate and heat pipes which are arranged on the circuit board; the chipset comprises a main chip and chiplets arranged on the periphery of the main chip; the surface of the cold plate facing the circuit board is in contact with the main chip; and one end of each heat pipe is connected to the surface of the cold plate facing away from the circuit board, and the other end of the heat pipe is in contact with the corresponding chiplet.

Description

[0001]Chip Heat Dissipation Structure and Terminal Device Cross-Reference This disclosure claims priority to a Chinese patent application filed with the China Patent Office on December 29, 2023, application number 202323660895.5, entitled "Chip Heat Dissipation Structure and Terminal Device," the entire contents of which are incorporated herein by reference. Technical Field This disclosure relates to the field of chip manufacturing technology, and more particularly to a chip heat dissipation structure and terminal device. Background Chip heat dissipation is a significant factor affecting chip computing power, and better chip heat dissipation significantly improves chip computing power. Currently, a chip layout structure featuring a main chip and multiple surrounding chiplets is common. This structure typically uses a shared cold plate to dissipate heat. The surrounding chiplets transfer heat to the heat dissipation support frame through contact with a heat dissipation support frame. A cold plate support frame is provided on the heat dissipation support frame, and the cold plate in contact with the main chip is mounted on the cold plate support frame. Thermal pads are provided between the cold plate support frame and the heat dissipation support frame to dissipate heat from the main chip and the surrounding chiplets. However, this chip heat dissipation structure results in a long heat transfer path for the peripheral chiplets, resulting in high overall thermal resistance and weak heat dissipation, which can affect the overall heat dissipation effect. The cold plate support frame and the heat dissipation support frame are in hard contact via thermal pads, and tolerances and deformation of the thermal pads can easily affect contact between the cold plate and the main chip, impacting heat dissipation of the main chip. Furthermore, the overall structure requires at least two installation steps: the heat dissipation support frame and the cold plate support frame, resulting in low installation efficiency. In view of this, embodiments of the present disclosure provide a chip heat dissipation structure and terminal device to address at least one technical problem associated with current chip heat dissipation structures. In a first aspect, embodiments of the present disclosure provide a chip heat dissipation structure comprising: a circuit board; a chipset disposed on the circuit board, the chipset comprising a main chip and chiplets disposed around the main chip; a cold plate disposed on the circuit board, the cold plate contacting the main chip on its side facing the circuit board; and a heat pipe, one end of the heat pipe connected to the side of the cold plate facing away from the circuit board, the other end of the heat pipe contacting the chiplets. Furthermore, the device further includes a mounting bracket frame, the cold plate being disposed within the mounting bracket frame, and the mounting bracket frame being mounted on the circuit board via first screws. Furthermore, the cold plate is in contact with the main chip via a thermal conductive sheet. Furthermore, the heat pipe is in contact with the small chip via a thermal conductive pad. Furthermore, a first spring is provided between the mounting bracket frame and the screw cap of the first screw to enable adjustment of the spacing between the mounting bracket frame and the circuit board.Furthermore, the projection of the mounting bracket frame on the circuit board is between the main chip and the chiplet. Furthermore, the system further includes a heat dissipation bracket frame, which is connected to the circuit board via a second screw bracket. The mounting bracket frame is mounted on the side of the heat dissipation bracket frame facing away from the circuit board via the first screws. The end of the heat pipe facing away from the cold plate contacts the side of the heat dissipation bracket frame facing away from the circuit board. The chiplet contacts the side of the heat dissipation bracket frame facing the circuit board. The side of the cold plate facing the circuit board passes through the heat dissipation bracket frame and contacts the main chip. Furthermore, a second spring is provided between the heat dissipation bracket frame and the screw cap of the second screw to enable adjustment of the spacing between the heat dissipation bracket frame and the circuit board. Furthermore, the contact point between the chiplet and the heat dissipation bracket frame is directly opposite the contact point between the heat pipe and the heat dissipation bracket frame. Furthermore, the chiplet and the heat dissipation bracket are connected via a thermal pad. Furthermore, a thermal block is provided within the heat dissipation bracket frame above the chiplet, and both the heat pipe and the chiplet contact the thermal block. Furthermore, a surface of the cold plate facing away from the circuit board is provided with a liquid inlet and a liquid outlet facing in different directions. Furthermore, the heat pipe is a convex structure protruding above the circuit board. Furthermore, a self-circulating cooling medium is provided within the heat pipe. In a second aspect, embodiments of the present disclosure further provide a terminal device comprising: a chip heat dissipation structure according to any one of the first aspects above. In the chip heat dissipation structure and terminal device provided in embodiments of the present disclosure, a chipset disposed on a circuit board includes a main chip and chiplets disposed around the main chip; a cold plate disposed on the circuit board contacts the main chip on a surface facing the circuit board; one end of the heat pipe is connected to a surface of the cold plate facing away from the circuit board, and the other end of the heat pipe contacts the chiplet. By having the heat pipe contact the cold plate and the chiplet, respectively, the heat transfer path of the chiplet can be effectively shortened, the thermal resistance of the chipset can be reduced, and the heat dissipation effect of the chip heat dissipation structure can be improved, thereby increasing the computing power of the chip. To more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below illustrate some embodiments of the present disclosure. A person of ordinary skill in the art can derive other drawings based on these drawings without inventive effort. The drawings described herein are intended to provide a further understanding of the present disclosure and constitute a part of the present disclosure. The illustrative embodiments of the present disclosure and their descriptions are intended to explain the present disclosure and do not constitute undue limitations thereon.In the accompanying drawings: Figure 1 is a schematic diagram of a three-dimensional structure of a chip heat dissipation structure provided by an embodiment of the present disclosure; Figure 2 is a schematic diagram of a frame structure of a chip heat dissipation structure provided by an embodiment of the present disclosure; Figure 3 is a schematic diagram of another three-dimensional structure of a chip heat dissipation structure provided by an embodiment of the present disclosure; Figure 4 is a schematic diagram of another frame structure of a chip heat dissipation structure provided by an embodiment of the present disclosure; Figure 5 is a schematic diagram of another three-dimensional structure of a chip heat dissipation structure provided by an embodiment of the present disclosure; and Figure 6 is a schematic diagram of another frame structure of a chip heat dissipation structure provided by an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS The following describes the embodiments of the present disclosure in detail with reference to the accompanying drawings and embodiments, thereby enabling a thorough understanding and implementation of the present disclosure's application of technical means to solve technical problems and achieve technical effects. Certain terms are used in the specification and claims to refer to specific components. Those skilled in the art will appreciate that hardware manufacturers may use different terms to refer to the same component. This specification and claims do not distinguish components based on differences in name, but rather on differences in their functionality. Throughout the specification and claims, the term "including" is an open-ended term and should be interpreted as meaning "including, but not limited to." "Substantially" means that within an acceptable error range, a person skilled in the art can solve the technical problem and substantially achieve the technical effect. Furthermore, the terms "coupled" or "electrically connected" herein encompass any direct and indirect electrical coupling means. Therefore, if a first device is described as coupled to a second device, this means that the first device may be directly electrically coupled to the second device, or indirectly electrically coupled to the second device via other devices or coupling means. The following description provides preferred embodiments for implementing the present disclosure, but such description is intended to illustrate the general principles of the present disclosure and is not intended to limit the scope of the present disclosure. The scope of protection of the present disclosure shall be determined by the appended claims. It should also be noted that the terms "comprise," "include," or any other variations thereof are intended to encompass a non-exclusive inclusion, such that a process, method, product, or system comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, product, or system. In the absence of further restrictions, an element defined by the phrase "comprising a ..." does not exclude the existence of other identical elements in the process, method, product or system comprising the element.For a specific embodiment, please refer to FIG1 , which is a schematic diagram of a three-dimensional structure of a chip heat dissipation structure provided by an embodiment of the present disclosure. The chip heat dissipation structure includes a circuit board 10, a chipset 20 disposed on the circuit board 10, a cold plate 30 disposed on the circuit board 10, and a heat pipe 40. The chipset 20 includes a main chip 210 and chiplets 220 disposed around the main chip 210; the cold plate 30 contacts the main chip 210 on a side facing the circuit board 10; one end of the heat pipe 40 is connected to a side of the cold plate 30 facing away from the circuit board 10, and the other end of the heat pipe 40 contacts the chiplets 220.Specifically, referring to FIG2 , a schematic diagram of a frame structure of a chip heat dissipation structure provided in an embodiment of the present disclosure is shown. The circuit board 10 is a printed circuit board (PCB), which serves as a carrier for electronic components and their heat dissipation structure. The chipset 20, the cold plate 30, and the heat pipe 40 are all located on the circuit board 10. The main chip 210 and the chiplet 220 are all located on the circuit board 10 to form the chipset 20. Generally, a main chip 210 is combined with multiple chiplets 220. The number of chiplets 220 is not limited herein. As shown in the figure, one chiplet 220 is provided on each of the left and right sides of the main chip 210. This is merely an example. In actual applications, the chiplets 220 can be freely configured based on different product forms and specific computing power requirements. The chiplets 220 are arranged around the main chip 210 to provide auxiliary computing power for the main chip 210. The cold plate 30 is generally slightly larger than the main chip 210 and is located directly above the main chip 210. The outer edge of the cold plate 30 is directly connected to the circuit board 10 or is connected to the top of the circuit board 10 through a structure such as a bracket. When the cold plate 30 is connected to the circuit board 10, the side of the cold plate 30 facing the circuit board 10 just contacts the side of the main chip 210 facing away from the circuit board 10, so that the heat generated by the main chip 210 during operation can be quickly transferred to the cold plate 30. The cold plate 30 includes but is not limited to a water-cooling structure with a circulating cooling medium inside. The cold plate 30 can quickly transfer the heat generated by the main chip 210 during operation, thereby playing a role in dissipating heat for the main chip 210; the heat pipe 40 is connected between the cold plate 30 and the small chip 220, the first end 410 of the heat pipe 40 contacts the side of the cold plate 30 facing away from the circuit board 10, and the second end 420 of the heat pipe 40 contacts the side of the small chip 220 facing away from the circuit board 10. The heat generated by the chiplet 210 during operation can be quickly transferred to the heat pipe 40 , and then transferred to the cold plate 30 through the heat pipe 40 , thereby dissipating the heat of the chiplet 220 .In the disclosed embodiment, since only one heat pipe 40 is provided between the chiplet 220 and the cold plate 30 for heat transfer, the heat transfer path from the chiplet 220 to the cold plate 30 can be effectively shortened, reducing the thermal resistance of the chipset 20 and improving the heat dissipation effect of the chip heat dissipation structure, thereby increasing the computing power of the chip. Furthermore, referring to Figures 3 and 4 , in other preferred embodiments of the present disclosure, the chip heat dissipation structure also includes a mounting bracket frame 50. The cold plate 30 is disposed within the mounting bracket frame 50, and the mounting bracket frame 50 is mounted on the circuit board 10 via first screws 510. Here, the mounting bracket frame 50 can be considered a support for the cold plate 30. Its shape is similar to that of the cold plate 30, but its size is slightly larger than that of the cold plate 30. Its interior is hollowed out. The cold plate 30 is connected within the mounting bracket frame 50. Specific connection methods include, but are not limited to, screw connections or snap connections. Multiple first screw brackets 510 are provided along the perimeter of the mounting bracket frame 50 to connect the mounting bracket frame 50 to the circuit board 10. When the mounting bracket frame 50 is connected to the circuit board 10, the side of the cold plate 30 facing the circuit board 10 contacts the side of the main chip 210 facing away from the circuit board 10. Furthermore, a first spring 520 is provided between the mounting bracket frame 50 and the screw caps 5101 of the first screws 510, allowing the spacing between the mounting bracket frame 50 and the circuit board 10 to be adjusted. Here, the spacing between the mounting bracket frame 50 and the circuit board 10 is not fixed but adjustable. This is to prevent component tolerances, thermal deformation, and other factors from affecting the contact between the cold plate 30 and the main chip 210, and between the heat pipe 40 and the chiplet 220. This ensures close contact between the cold plate 30 and the main chip 210, and between the cold plate heat pipe 40 and the chiplet 220, ensuring the necessary pressure and improving heat transfer efficiency to the chipset 20. Specifically, a first spring 520 is provided below the screw cap 5101 of the first screw 510. The bottom of the first spring 520 contacts the side of the mounting bracket frame 50 facing away from the circuit board 10, thereby forming a flexible connection with a certain amount of elastic redundancy between the mounting bracket frame 50 and the circuit board 10. Furthermore, in other preferred embodiments of the present disclosure, the cold plate 30 and the main chip 210 are connected via a thermal pad 230.Specifically, the thermal pad 230 is made of, but not limited to, a thermal interface material (TIM). Positioned between the cold plate 30 and the main chip 210, it exhibits excellent thermal conductivity, enabling rapid and thorough transfer of heat generated by the main chip 210 during operation to the cold plate 30, thereby improving heat dissipation efficiency for the main chip 210. Furthermore, in other preferred embodiments of the present disclosure, the heat pipe 40 is connected to the chiplet 220 via a thermal pad 240. Specifically, the thermal pad 240 is made of a thermally conductive material with good thermal conductivity, has a certain thickness, and is elastic and compressible. It is positioned between the end of the heat pipe 40 away from the cold plate 30 and the side of the chiplet 220 facing away from the circuit board 10. This provides redundancy for components with different tolerances around the chiplet 220, preventing damage. It also quickly and thoroughly transfers heat generated by the chiplet 220 during operation to the heat pipe 40 and, in turn, to the cold plate 30, improving heat dissipation efficiency for the chiplet 220. In other embodiments of the present disclosure, the thermal pad 240 can be replaced with thermally conductive gel, achieving the same effects. Furthermore, the projection of the mounting bracket frame 50 on the circuit board 10 is between the main chip 210 and the chiplet 220. Specifically, the main chip 210 and the small chip 220 are usually arranged on the circuit board 10 with a distance between them, and the mounting bracket frame 50 is set along this distance, that is, the projection of the mounting bracket frame 50 on the circuit board 10 just falls within the distance between the main chip 210 and the small chip 220; this design is to ensure that the heat pipe 40 connecting the small chip 220 and the cold plate 30 has a minimum length, shorten the heat transfer path for the small chip 220 to transfer heat to the cold plate 30, and thus improve the heat dissipation efficiency of the small chip 220.In addition, referring to Figures 5 and 6, in other preferred embodiments of the present disclosure, the chip heat dissipation structure further includes a heat dissipation bracket frame 60, the heat dissipation bracket frame 60 is connected to the circuit board 10 via second screws 610, and the mounting bracket frame 50 is mounted on a side of the heat dissipation bracket frame 60 facing away from the circuit board 10 via the first screws 510; the end of the heat pipe 40 away from the cold plate 30 contacts a side of the heat dissipation bracket frame 60 facing away from the circuit board 10, the small chip 220 contacts a side of the heat dissipation bracket frame 60 facing the circuit board 10, and the side of the cold plate 30 facing the circuit board 10 passes through the heat dissipation bracket frame 60 and contacts the main chip 210. Specifically, the heat dissipation bracket frame 60 is arranged between the mounting bracket frame 50 and the circuit board 10. The heat dissipation bracket frame 60 and the mounting bracket frame 50 are both hollow-out structures with a shape similar to that of the mounting bracket frame 50, but the size of the heat dissipation bracket frame 60 is slightly larger than that of the mounting bracket frame 50. A plurality of second screws 610 are provided on the outer edge of the heat dissipation bracket frame 60. The heat dissipation bracket frame 60 can be connected to the circuit board 10 by the second screws 610, and then the mounting bracket frame 50 is mounted on the side of the heat dissipation bracket frame 60 away from the circuit board 10 by the first screws 510; at the same time, the end of the heat pipe 40 away from the cold plate 30 contacts the side of the heat dissipation bracket frame 60 away from the circuit board 10, and the chiplet 220 contacts the side of the heat dissipation bracket frame 60 facing the circuit board 10, so that the heat generated by the chiplet 220 can be transferred to the heat pipe 40 through the heat dissipation bracket frame 60, and then transferred to the cold plate 30; in addition, The side of the cold plate 30 facing the circuit board 10 contacts the main chip 210 through the heat dissipation bracket frame 60, ensuring that heat generated by the main chip 210 is directly transferred to the cold plate 30. In this embodiment, by mounting the mounting bracket frame 50, the heat pipe 40, and the cold plate 30 together on the heat dissipation bracket frame 60 to form an integrated structure, which is then mounted on the circuit board 10, the installation efficiency of the chip heat dissipation structure is improved. Furthermore, a second spring 620 is provided between the heat dissipation bracket frame 60 and the screw cap 6101 of the second screw 610, allowing the spacing between the heat dissipation bracket frame 60 and the circuit board 10 to be adjusted.Here, the distance between the heat dissipation bracket frame 60 and the circuit board 10 is not fixed, but can be adjusted to a certain value. The purpose is to prevent the contact between the cold plate 30 and the main chip 210, the contact between the cold plate heat pipe 40 and the small chip 220 due to component tolerance, thermal deformation, etc., so that the close contact between the cold plate 30 and the main chip 210, the heat dissipation bracket frame 60 and the small chip 220 ensures the necessary pressure, thereby improving the heat transfer efficiency of the chipset 20; the specific method is to add a second spring 620 under the nail cap 6101 of the second screw 610, and the bottom of the second spring 620 contacts the side of the heat dissipation bracket frame 60 facing away from the circuit board 10, thereby forming a soft connection with a certain elastic redundant space between the heat dissipation bracket frame 60 and the circuit board 10. Furthermore, the mounting bracket frame 50 is also flexibly connected to the heat dissipation bracket frame 60 via the first screws 510 and the first springs 520. This further prevents component tolerances, thermal deformation, and other factors from affecting the contact between the cold plate 30 and the main chip 210, and between the heat dissipation bracket frame 60 and the chiplet 220. This ensures close contact between the cold plate 30 and the main chip 210, and between the heat dissipation bracket frame 60 and the chiplet 220, ensuring the necessary pressure, thereby further improving the efficiency of heat transfer to the chipset 20. Furthermore, the contact point between the chiplet 220 and the heat dissipation bracket frame 60 directly opposes the contact point between the heat pipe 40 and the heat dissipation bracket frame 60. Specifically, the contact point between the heat pipe 40 and the heat dissipation bracket frame 60 is located directly above the contact point between the chiplet 220 and the heat dissipation bracket frame 60. This design allows the heat generated by the chiplet 220 to be transferred to the heat pipe 40 over the shortest distance, further shortening the heat transfer path from the chiplet 220 to the cold plate 30 and further improving the heat dissipation efficiency of the chiplet 220. Furthermore, the chiplet 220 and the heat dissipation bracket 60 are connected via a thermal pad 240.Specifically, the thermal pad 240 is made of a thermally conductive material with good thermal conductivity, has a certain thickness, and is elastic and compressible. It is positioned between the side of the heat dissipation bracket 60 facing the circuit board 10 and the side of the chiplet 220 facing away from the circuit board 10. On the one hand, it provides a certain degree of redundancy for components with different tolerances around the chiplet 220 to prevent component damage. On the other hand, it can quickly and completely transfer the heat generated by the chiplet 220 during operation to the heat pipe 40, and then to the cold plate 30, thereby improving the heat dissipation efficiency of the chiplet 220. Similarly, in other embodiments of the present disclosure, the thermal pad 240 here can also be replaced with a thermally conductive gel, which can also achieve the above effects. In addition, a thermal block 630 is provided within the heat dissipation bracket frame 60 above the chiplet 220. The heat pipe 40 and the chiplet 220 both contact the thermal block 630. The thermal block 630 can be made of, but is not limited to, metal or vinyl carbonate (VC). In a preferred embodiment, copper is used because of its excellent thermal conductivity. The thermal block 630 can also be part of the heat pipe 40, with both being made of the same material. In this embodiment, the thermal block 630 is embedded within the heat dissipation support frame 60 above the chiplet 220, ensuring contact between the heat pipe 40 and the chiplet 220. The remaining portions of the heat dissipation support frame 60 can be made of materials such as PC and plastic. This effectively reduces the amount of copper used in the heat dissipation support frame 60, ensuring good heat dissipation efficiency for the chiplet 220 while also reducing product cost and weight.Furthermore, in other preferred embodiments of the present disclosure, a liquid inlet 310 and a liquid outlet 320 facing in different directions are provided on a side of the cold plate 30 facing away from the circuit board 10. Specifically, a liquid working medium for heat exchange is provided in the cold plate 30 to transfer the heat on the cold plate 30. The liquid inlet 310 and the liquid outlet 320 are both provided on a side of the cold plate 30 facing away from the circuit board 10, and the two face different directions. In a preferred embodiment, the liquid inlet 310 and the liquid outlet 320 are oriented in opposite directions. The liquid working medium in the cold plate 30 can be circulated through the liquid inlet 310 and the liquid outlet 320. In addition, by setting the liquid inlet 310 and the liquid outlet 320 to face in different directions, the hot and cold parts can be separated to avoid mixing of hot and cold, further improving the heat dissipation efficiency of the chipset 20. Further, in other preferred embodiments of the present disclosure, The heat pipe 40 is a convex structure that protrudes upward from the circuit board 10. Here, the heat pipe 40 is not a straight tubular structure, but rather has a protrusion, specifically one that protrudes upward from the circuit board 10. Because the cold plate 30 is not fixed in height, it can float up and down. When the other end of the heat pipe 40 is connected to the heat dissipation support frame 60, the heat dissipation support frame 60 also floats up and down. In other words, the ends of the heat pipe 40 are not completely fixed. By configuring the heat pipe 40 as a convex structure, it can absorb a certain amount of deformation, thereby achieving floating adjustment of the above structure. Furthermore, the heat pipe 40 is made of solid copper, ensuring that the heat generated by the chiplet 220 is quickly transferred to the cold plate 30, thereby improving the heat dissipation efficiency of the chipset. Furthermore, in other preferred embodiments of the present disclosure, the heat pipe 40 is provided with a self-circulating cooling medium. Specifically, in this embodiment, the heat pipe 40 is not a solid structure, and a self-circulating cooling medium is provided inside it. The cooling medium includes but is not limited to water or other coolants. Such a design can effectively reduce the use of copper, reduce product cost and weight, while ensuring good heat dissipation efficiency for the small chip 220. It should be noted that, in the case of no structural conflict, the structures of the various parts mentioned in the above embodiments can be combined with each other. To avoid repetition, the technical solutions obtained after the combination will not be described again here, but the technical solutions obtained after the combination should also fall within the scope of protection of the present disclosure.In addition, embodiments of the present disclosure further provide a terminal device comprising any of the chip heat dissipation structures described in the above embodiments. The chip heat dissipation structure is configured to support and dissipate heat from a chipset, thereby improving chip heat dissipation and, in turn, increasing chip computing power. For details, please refer to the above embodiments and will not be elaborated upon here. Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present disclosure and are not intended to limit them. Although the present disclosure has been described in detail with reference to the above embodiments, persons of ordinary skill in the art will understand that the technical solutions described in the above embodiments may be modified or some of the technical features thereof may be replaced by equivalents. Such modifications or replacements do not deviate from the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present disclosure. Industrial Applicability In the chip heat dissipation structure and terminal device provided by the embodiments of the present disclosure, a chipset disposed on a circuit board includes a main chip and small chips disposed around the main chip. A cold plate disposed on the circuit board contacts the main chip on a side facing the circuit board. One end of a heat pipe is connected to a side of the cold plate facing away from the circuit board, and the other end of the heat pipe contacts the small chip. By having the heat pipe contact the cold plate and the small chip respectively, the heat transfer path of the small chip can be effectively shortened, the thermal resistance of the chipset can be reduced, and the heat dissipation effect of the chip heat dissipation structure can be improved, thereby increasing the computing power of the chip.

Claims

Claims 1. A chip heat dissipation structure, comprising: Circuit boards; A chipset disposed on the circuit board, the chipset comprising a main chip and small chips disposed around the main chip; A cold plate is arranged on the circuit board, wherein the side of the cold plate facing the circuit board is in contact with the main chip; a heat pipe, wherein one end of the heat pipe is connected to the side of the cold plate away from the circuit board, and the other end of the heat pipe is in contact with the small chip.

2. The chip heat dissipation structure according to claim 1, wherein, It also includes a mounting bracket frame, the cold plate is arranged in the mounting bracket frame, and the mounting bracket frame is mounted on the circuit board by a first screw.

3. The chip heat dissipation structure according to claim 1, wherein, The cold plate is in contact with the main chip via a heat conducting sheet.

4. The chip heat dissipation structure according to claim 1, wherein, The heat pipe is contact-connected with the chiplet via a thermal pad.

5. The chip heat dissipation structure according to claim 2, wherein, A first spring is provided between the mounting bracket frame and the nail cap of the first screw, so that the distance between the mounting bracket frame and the circuit board can be adjusted.

6. The chip heat dissipation structure according to claim 2, wherein, The projection of the mounting bracket frame on the circuit board is between the main chip and the small chip.

7. The chip heat dissipation structure according to any one of claims 1-6, wherein, It also includes a heat dissipation bracket frame, which is connected to the circuit board through a second screw bracket, and the mounting bracket frame is mounted on a side of the heat dissipation bracket frame away from the circuit board through the first screw; an end of the heat pipe away from the cold plate contacts with a side of the heat dissipation bracket frame away from the circuit board, the small chip contacts with a side of the heat dissipation bracket frame facing the circuit board, and a side of the cold plate facing the circuit board contacts the main chip through the heat dissipation bracket frame.

8. The chip heat dissipation structure according to claim 7, wherein A second spring is provided between the heat dissipation bracket frame and the nail cap of the second screw, so that the distance between the heat dissipation bracket frame and the circuit board can be adjusted.

9. The chip heat dissipation structure according to claim 7, wherein, The contact point between the small chip and the heat dissipation bracket frame is directly opposite to the contact point between the heat pipe and the heat dissipation bracket frame.

10. The chip heat dissipation structure according to claim 7, wherein, The small chip is contact-connected to the heat dissipation bracket via a thermal pad.

11. The chip heat dissipation structure according to claim 7, wherein, A heat conduction block is provided in the heat dissipation support frame above the small chip, and the heat pipe and the small chip are both in contact with the heat conduction block.

12. The chip heat dissipation structure according to any one of claims 1-6, wherein, A liquid inlet and a liquid outlet facing different directions are arranged on a side of the cold plate facing away from the circuit board. 7 13. The chip heat dissipation structure according to any one of claims 1-6, wherein, The heat pipe is a convex structure protruding above the circuit board.

14. The chip heat dissipation structure according to any one of claims 1-6, wherein, A self-circulating cooling medium is arranged in the heat pipe.

15. A terminal device, comprising the chip heat dissipation structure according to any one of claims 1-14.

Images