Curable composition, film, color filter, display device, and method for producing pixel

Abstract

Provided is a curable composition comprising perovskite particles, a photopolymerization initiator, a polymerizable compound, and a resin. The photopolymerization initiator contains an oxime compound. The resin contains a resin having an acid group. Also provided are a film, a color filter, a display device using the curable composition, and a method for producing a pixel.

Description

Curable composition, film, color filter, display device, and method for manufacturing pixel

[0001] The present invention relates to a curable composition containing perovskite particles. The present invention also relates to methods for producing a film, a color filter, a display device, and a pixel using the curable composition containing perovskite particles.

[0002] In recent years, there has been growing interest in perovskite compounds that have high quantum yields as wavelength conversion materials.

[0003] Patent Document 1 describes an invention relating to a light-emitting component including a light-emitting crystal having a perovskite structure.

[0004] Special table 2018-506625 publication

[0005] No attempt has been made to form pixels by patterning using a curable composition containing perovskite particles using a photolithography method. In recent years, the use of wavelength conversion materials in color filter pixels has been considered. In this color filter, when white or blue light is irradiated onto the color filter, the wavelength conversion material absorbs the light and emits a desired fluorescence, such as red or green. Therefore, in this color filter, if a pixel is chipped, white or blue light (backlight light) used as a backlight leaks from the chipped portion of the pixel, causing light mixing between the light emitted from the pixel and the backlight light, which tends to reduce color reproducibility. Therefore, an object of the present invention is to provide a curable composition capable of forming pixels with reduced chipping. Another object of the present invention is to provide a method for producing a film, color filter, display device, and pixel using the curable composition.

[0006] The present invention provides the following. <1> A curable composition comprising perovskite particles, a photopolymerization initiator, a polymerizable compound, and a resin, wherein the photopolymerization initiator comprises an oxime compound, and the resin comprises a resin having an acid group. <2> The curable composition according to <1>, wherein the photopolymerization initiator comprises an oxime compound and a compound other than an oxime compound. <3> The curable composition according to <1> or <2>, wherein the resin having an acid group comprises a resin having a graft chain. <4> The curable composition according to any one of <1> to <3>, further comprising a surfactant. <5> The curable composition according to any one of <1> to <4>, further comprising a compound having a cyclic ether group. <6> A film obtained by curing the curable composition according to any one of <1> to <5>. <7> A color filter comprising the film according to <6>. <8> A display device comprising the film according to <6>. <9> The display device according to <8>, having a protective layer adjacent to the film. <10> A method for manufacturing a pixel, comprising: a step of applying the curable composition according to any one of <1> to <5> onto a support to form a composition layer; a step of patternwise exposing the composition layer; a step of developing the composition layer after exposure to remove unexposed portions of the composition layer; and a step of exposing the developed composition layer.

[0007] According to the present invention, it is possible to provide a curable composition capable of forming pixels in which the occurrence of chipping is suppressed. Furthermore, according to the present invention, it is possible to provide a film, a color filter, a display device, and a method for manufacturing a pixel using the curable composition.

[0008] The present invention will be described in detail below. In this specification, the term "to" is used to mean that the numerical values ​​before and after the term are included as the lower and upper limits. In the description of groups (atomic groups) in this specification, a term without specifying whether it is substituted or unsubstituted encompasses both unsubstituted groups (atomic groups) and substituted groups (atomic groups). For example, the term "alkyl group" encompasses not only unsubstituted alkyl groups (unsubstituted alkyl groups) but also substituted alkyl groups (substituted alkyl groups). In this specification, unless otherwise specified, "exposure" includes not only exposure using light but also drawing using particle beams such as electron beams and ion beams. Examples of light used for exposure include the bright line spectrum of a mercury lamp, far ultraviolet light typified by excimer lasers, extreme ultraviolet light (EUV light), X-rays, electron beams, and other actinic rays or radiation. As used herein, "(meth)acrylate" refers to either or both of acrylate and methacrylate, "(meth)acrylic" refers to either or both of acrylic and methacrylic, and "(meth)acryloyl" refers to either or both of acryloyl and methacryloyl. In the structural formulae herein, Me refers to a methyl group, Et refers to an ethyl group, Bu refers to a butyl group, and Ph refers to a phenyl group. As used herein, the weight-average molecular weight and number-average molecular weight are values ​​measured in terms of polystyrene using gel permeation chromatography (GPC). As used herein, the term "total solids" refers to the total mass of all components of a composition excluding the solvent. As used herein, the term "process" refers not only to an independent process, but also to a process that cannot be clearly distinguished from other processes, as long as the intended effect of the process is achieved.

[0009] <Curable Composition> The curable composition of the present invention comprises perovskite particles, a photopolymerization initiator, a polymerizable compound, and a resin, wherein the photopolymerization initiator comprises an oxime compound, and the resin comprises a resin having an acid group.

[0010] Unlike chromatic organic pigments commonly used in color filters, perovskite particles are difficult to disperse uniformly in a film, which tends to result in chipping around pixels. Oxime compounds are less likely to inhibit polymerization. Therefore, by using an oxime compound as a photopolymerization initiator, radicals generated during exposure diffuse uniformly throughout the film, and the curing reaction proceeds even around pixels with an appropriate exposure dose, suppressing chipping caused by perovskite particles. Therefore, the curable composition of the present invention can form pixels in which chipping is suppressed, despite containing perovskite particles. More specifically, pixels in which chipping is suppressed can be formed by forming a pattern using a photolithography method using the curable composition of the present invention to form pixels.

[0011] Furthermore, perovskite particles tend to have lower durability against water, heat, and the like compared to chromatic organic pigments and the like. However, the curable composition of the present invention contains an oxime compound as a photopolymerization initiator, and therefore has excellent photocurability, making it possible to form a film that is sufficiently cured by exposure to light. In addition, despite containing perovskite particles, it is possible to form a film that has high durability against water, heat, and the like.

[0012] The curable composition of the present invention will be described in detail below.

[0013] <<Perovskite Particles>> The curable composition of the present invention contains perovskite particles. Perovskite particles are particles of a perovskite compound. The perovskite particles are preferably luminescent particles. More specifically, the perovskite particles are preferably luminescent particles capable of emitting fluorescence in the visible light wavelength region. The perovskite particles are preferably red-, green-, or blue-luminescent particles. Red-luminescent particles are luminescent particles that emit red light when irradiated with light, green-luminescent particles are luminescent particles that emit green light when irradiated with light, and blue-luminescent particles are luminescent particles that emit blue light when irradiated with light.

[0014] The perovskite compound may be a compound having a perovskite crystal structure and containing A, B, and X as components.

[0015] A is a monovalent cation and represents a component located at each vertex of a hexahedron centered at B in the perovskite crystal structure. X is at least one ion selected from the group consisting of halide ions and thiocyanate ions and represents a component located at each vertex of an octahedron centered at B in the perovskite crystal structure. B is a metal ion and represents a component located at the center of the hexahedron with A at the vertex and the octahedron with X at the vertex in the perovskite crystal structure.

[0016] The particle size of the perovskite particles is not particularly limited, but from the viewpoint of maintaining a good crystal structure, the diameter is preferably 1 nm or more, more preferably 2 nm or more, and even more preferably 3 nm or more. From the viewpoint of storage stability, the upper limit of the particle size of the perovskite particles is preferably 10 μm or less, more preferably 1 μm or less, and even more preferably 500 nm or less.

[0017] The particle size distribution of the perovskite particles is not particularly limited, but from the viewpoint of maintaining a good crystal structure, the median diameter D50 is preferably 3 nm or more, more preferably 4 nm or more, and even more preferably 5 nm or more. From the viewpoint of storage stability, the median diameter D50 is preferably 5 μm or less, more preferably 500 nm or less, and even more preferably 100 nm or less. The particle size and particle size distribution of the perovskite particles can be determined using a transmission electron microscope (TEM).

[0018] The perovskite compound is not particularly limited, and may be a compound having any of a three-dimensional structure, a two-dimensional structure, and a pseudo-two-dimensional structure. In the case of a three-dimensional structure, the perovskite compound is an ABX （３＋δ） In the case of a two-dimensional structure, the perovskite compound is represented by A ２ BX （４＋δ）Here, δ is a number that can be appropriately changed depending on the charge balance of B, and is between −0.7 and 0.7.

[0019] The perovskite compound is preferably a perovskite compound represented by formula (1).

[0020] ABX （３＋δ） ...(1) (In formula (1), A represents a monovalent cation, B represents a metal ion, X represents at least one ion selected from the group consisting of a halide ion and a thiocyanate ion, and δ is a number from -0.7 to 0.7.)

[0021] In the perovskite compound, A is a component located at each vertex of a hexahedron with B at the center in the perovskite crystal structure, and is a monovalent cation.

[0022] Examples of the monovalent cation represented by A include a cesium ion, an organic ammonium ion, and an aminidium ion. In the perovskite compound, when A is a cesium ion, an organic ammonium ion having 3 or less carbon atoms, or an aminidium ion having 3 or less carbon atoms, the perovskite compound is generally represented by the formula ABX （３＋δ） It has a three-dimensional structure represented by the following formula: A in the perovskite compound is preferably a cesium ion or an organic ammonium ion.

[0023] The organic ammonium ion includes a cation represented by formula (A1).

[0024] R Ａ１ ~R Ａ４ The alkyl group represented by may be linear, branched, or cyclic, and is preferably a linear or branched alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 30, and more preferably 1 to 20. The number of carbon atoms in the linear or branched alkyl group is preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 to 3. The number of carbon atoms in the cyclic alkyl group is preferably 3 to 30, more preferably 3 to 11, and even more preferably 3 to 8. R Ａ１ ~R Ａ４The alkyl group represented by may have an amino group as a substituent.

[0025] R Ａ１ ~R Ａ４ Specific examples of the alkyl group represented by include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, an n-butyl group, an isobutyl group, a sec-butyl group, a tert-butyl group, an n-pentyl group, an isopentyl group, a neopentyl group, a tert-pentyl group, a 1-methylbutyl group, an n-hexyl group, a 2-methylpentyl group, a 3-methylpentyl group, a 2,2-dimethylbutyl group, a 2,3-dimethylbutyl group, an n-heptyl group, a 2-methylhexyl group, a 3-methylhexyl group, a 2,2-dimethylpentyl group, a 2,3-dimethylpentyl group, a 2,4-dimethylpentyl group, and a 3,3-dimethylpentyl group. group, 3-ethylpentyl group, 2,2,3-trimethylbutyl group, n-octyl group, isooctyl group, 2-ethylhexyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, hexadecyl group, heptadecyl group, octadecyl group, nonadecyl group, icosyl group, cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl group, cyclodecyl group, norbornyl group, isobornyl group, 1-adamantyl group, 2-adamantyl group, and tricyclodecyl group.

[0026] By reducing the number of alkyl groups contained in formula (A1) and by reducing the number of carbon atoms in the alkyl groups, it is possible to obtain a compound having a three-dimensional perovskite crystal structure with a high quantum yield. When the alkyl group has four or more carbon atoms, it is possible to obtain a compound having a two-dimensional and / or quasi-two-dimensional (quasi-2D) perovskite crystal structure in part or in its entirety. When two-dimensional perovskite crystal structures are stacked infinitely, they become equivalent to a three-dimensional perovskite crystal structure (references: P.P. Boix et al., J. Phys. Chem. Lett. 2015, 6, 898-907, etc.).

[0027] R Ａ１ ~R Ａ４ The total number of carbon atoms contained in R is preferably 1 to 4.Ａ１ ~R Ａ４ Preferably, one of the groups is an alkyl group having 1 to 3 carbon atoms, and the rest are hydrogen atoms.

[0028] Specific examples of organic ammonium ions include CH ３ NH ３ ＋ (methylammonium ion), C ２ H ５ NH ３ ＋ (ethylammonium ion) and C ３ H ７ NH ３ ＋ (propylammonium ion), and CH ３ NH ３ ＋ or C ２ H ５ NH ３ ＋ Preferably, CH ３ NH ３ ＋ It is more preferable that:

[0029] Examples of the aminidium ion include an aminidium ion represented by formula (A2).

[0030] (R Ａ１０ R Ａ１１ N=CH-NR Ａ１２ R Ａ１３ ) ＋ ...(A2) In formula (A2), R Ａ１０ ~R Ａ１３ each independently represents a hydrogen atom or an alkyl group which may have an amino group as a substituent.

[0031] R Ａ１０ ~R Ａ１３The alkyl group represented by may be linear, branched, or cyclic, and is preferably a linear or branched alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 30, and more preferably 1 to 20. The number of carbon atoms in the linear or branched alkyl group is preferably 1 to 10, more preferably 1 to 4, and even more preferably 1 to 3. The number of carbon atoms in the cyclic alkyl group is preferably 3 to 30, more preferably 3 to 11, and even more preferably 3 to 8. R Ａ１０ ~R Ａ１３ The alkyl group represented by may have an amino group as a substituent. Ａ１０ ~R Ａ１３ Specific examples of the alkyl group represented by R Ａ１ ~R Ａ４ Examples of the alkyl groups include those exemplified in the above.

[0032] By reducing the number of alkyl groups contained in formula (A2) and the number of carbon atoms in the alkyl and cycloalkyl groups, it is possible to obtain a perovskite compound with a three-dimensional structure and a high quantum yield. When the alkyl group has four or more carbon atoms, it is possible to obtain a compound having a two-dimensional and / or quasi-two-dimensional (quasi-2D) perovskite-type crystal structure in part or in its entirety.

[0033] R Ａ１０ ~R Ａ１３ The total number of carbon atoms contained in R is preferably 1 or more and 4 or less. Ａ１０ is an alkyl group having 1 to 3 carbon atoms, and R Ａ１１ ~R Ａ１３ is preferably a hydrogen atom.

[0034] In the perovskite compound, B is a component located at the center of a hexahedron with A at the vertex and an octahedron with X at the vertex in the perovskite crystal structure, and is a metal ion.

[0035] The metal ions of component B may be one or more ions selected from the group consisting of monovalent metal ions, divalent metal ions, and trivalent metal ions. B preferably contains divalent metal ions, and more preferably contains one or more metal ions selected from the group consisting of lead and tin.

[0036] In the perovskite compound, X represents a component located at each vertex of an octahedron with B at the center in the perovskite crystal structure, and represents at least one ion selected from the group consisting of halide ions and thiocyanate ions.

[0037] X may be at least one ion selected from the group consisting of chloride ion, bromide ion, fluoride ion, iodide ion, and thiocyanate ion.

[0038] X can be appropriately selected depending on the desired emission wavelength, and for example, X can contain a bromide ion. When X is two or more types of halide ions, the content ratio of the halide ions can be appropriately selected depending on the emission wavelength, and can be, for example, a combination of bromide ion and chloride ion, or a combination of bromide ion and iodide ion.

[0039] A perovskite compound, ABX （３＋δ） Specific examples of compounds having a three-dimensional perovskite-type crystal structure represented by the formula: ３ NH ３ PbBr ３ , C.H. ３ NH ３ PbCl ３ , C.H. ３ NH ３ PbI ３ , C.H. ３ NH ３ PbBr （３－ｙ） I ｙ (0<y<3), CH ３ NH ３ PbBr （３－ｙ） Cl ｙ (0<y<3), (H ２ N=CH-NH ２ ) PbBr ３ , (H２ N=CH-NH ２ )PbCl ３ 、(H ２ N=CH-NH ２ )PbI ３ 、 CH ３ NH ３ Pb （１－ａ） Ca ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） Sr ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） La ａ Br （３＋δ） (0<a≦0.7,0<δ≦0.7)、CH ３ NH ３ Pb （１－ａ） Ba ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） Dy ａ Br （３＋δ） (0<a≦0.7,0<δ≦0.7)、 CH ３ NH ３ Pb （１－ａ） Na ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、CH ３ NH ３ Pb （１－ａ） Li ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、 CsPb （１－ａ） Na ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、CsPb （１－ａ） Li ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、 CH ３ NH ３ Pb （１－ａ） Na ａ Br （３＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH ３NH ３ Pb （１－ａ） Li ａ Br （３＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH ３ NH ３ Pb （１－ａ） Na ａ Br （３＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、CH ３ NH ３ Pb （１－ａ） Li ａ Br （３＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、 (H ２ N=CH-NH ２ )Pb （１－ａ） Na ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、(H ２ N=CH-NH ２ )Pb （１－ａ） Li ａ Br （３＋δ） (0<a≦0.7,-0.7≦δ<0)、(H ２ N=CH-NH ２ )Pb （１－ａ） Na ａ Br （３＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、(H ２ N=CH-NH ２ )Pb （１－ａ） Na ａ Br （３＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<3)、 CsPbBr ３ 、CsPbCl ３ 、CsPbI ３ 、CsPbBr （３－ｙ） I ｙ (0<y<3)、CsPbBr （３－ｙ） Cl ｙ (0<y<3)、CH ３ NH ３ PbBr （３－ｙ） Cl ｙ (0<y<3)、 CH ３NH ３ Pb （１－ａ） Zn ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） Al ａ Br （３＋δ） (0<a≦0.7,0≦δ≦0.7)、CH ３ NH ３ Pb （１－ａ） Co ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） Mn ａ Br ３ (0<a≦0.7)、CH ３ NH ３ Pb （１－ａ） Mg ａ Br ３ (0<a≦0.7)、 CsPb （１－ａ） Zn ａ Br ３ (0<a≦0.7)、CsPb （１－ａ） Al ａ Br （３＋δ） (0<a≦0.7,0<δ≦0.7)、CsPb （１－ａ） Co ａ Br ３ (0<a≦0.7)、CsPb （１－ａ） Mn ａ Br ３ (0<a≦0.7)、CsPb （１－ａ） Mg ａ Br ３ (0<a≦0.7)、 CH ３ NH ３ Pb （１－ａ） Zn ａ Br （３－ｙ） I ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Al ａ Br （３＋δ－ｙ） I ｙ (0<a≦0.7,0<δ≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Co ａ Br（３－ｙ） I ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Mn ａ Br （３－ｙ） I ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Mg ａ Br （３－ｙ） I ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Zn ａ Br （３－ｙ） Cl ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Al ａ Br （３＋δ－ｙ） Cl ｙ (0<a≦0.7,0<δ≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Co ａ Br （３＋δ－ｙ） Cl ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Mn ａ Br （３－ｙ） Cl ｙ (0<a≦0.7,0<y<3)、CH ３ NH ３ Pb （１－ａ） Mg ａ Br （３－ｙ） Cl ｙ (0<a≦0.7,0<y<3)、 (H ２ N=CH-NH ２ )Zn ａ Br ３） (0<a≦0.7)、(H ２ N=CH-NH ２ )Mg ａ Br ３ (0<a≦0.7)、(H ２ N=CH-NH ２ )Pb （１－ａ） Znａ Br （３－ｙ） I ｙ (0<a≦0.7, 0<y<3), (H ２ N=CH-NH ２ ) Pb （１－ａ） Zn ａ Br （３－ｙ） Cl ｙ (0<a≦0.7, 0<y<3), etc.

[0040] A perovskite compound, ２ BX （４＋δ） Preferable specific examples of the compound having a two-dimensional perovskite-type crystal structure represented by the formula (C ４ H ９ NH ３ ) ２ PbBr ４ , (C ４ H ９ NH ３ ) ２ PbCl ４ , (C ４ H ９ NH ３ ) ２ PbI ４ , (C ７ H １５ NH ３ ) ２ PbBr ４ , (C ７ H １５ NH ３ ) ２ PbCl ４ , (C ７ H １５ NH ３ ) ２ PbI ４ , (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Li ａ Br （４＋δ） (0<a≦0.7, -0.7≦δ<0), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Na ａ Br （４＋δ） (0<a≦0.7, -0.7≦δ<0), (C４ H ９ NH ３ ) ２ Pb （１－ａ） Rb ａ Br （４＋δ） (0<a≦0.7,-0.7≦δ<0)、 (C ７ H １５ NH ３ ) ２ Pb （１－ａ） Na ａ Br （４＋δ） (0<a≦0.7,-0.7≦δ<0)、(C ７ H １５ NH ３ ) ２ Pb （１－ａ） Li ａ Br （４＋δ） (0<a≦0.7,-0.7≦δ<0)、(C ７ H １５ NH ３ ) ２ Pb （１－ａ） Rb ａ Br （４＋δ） (0<a≦0.7,-0.7≦δ<0)、 (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Na ａ Br （４＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Li ａ Br （４＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Rb ａ Br （４＋δ－ｙ） I ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、 (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Naａ Br （４＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Li ａ Br （４＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Rb ａ Br （４＋δ－ｙ） Cl ｙ (0<a≦0.7,-0.7≦δ<0,0<y<4)、 (C ４ H ９ NH ３ ) ２ PbBr ４ 、(C ７ H １５ NH ３ ) ２ PbBr ４ 、 (C ４ H ９ NH ３ ) ２ PbBr （４－ｙ） Cl ｙ (0<y<4)、(C ４ H ９ NH ３ ) ２ PbBr （４－ｙ） I ｙ (0<y<4)、 (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Zn ａ Br ４ (0<a≦0.7)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mg ａ Br ４ (0<a≦0.7)、(C ４ H ９ NH ３ ) ２ Pb（１－ａ） Co ａ Br ４ (0<a≦0.7)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mn ａ Br ４ (0<a≦0.7)、 (C ７ H １５ NH ３ ) ２ Pb （１－ａ） Zn ａ Br ４ (0<a≦0.7)、(C ７ H １５ NH ３ ) ２ Pb （１－ａ） Mg ａ Br ４ (0<a≦0.7)、(C ７ H １５ NH ３ ) ２ Pb （１－ａ） Co ａ Br ４ (0<a≦0.7)、(C ７ H １５ NH ３ ) ２ Pb （１－ａ） Mn ａ Br ４ (0<a≦0.7)、 (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Zn ａ Br （４－ｙ） I ｙ (0<a≦0.7,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mg ａ Br （４－ｙ） I ｙ (0<a≦0.7,0<y<4)、(C ４ H ９ NH ３ ) ２ Pb （１－ａ） Co ａ Br （４－ｙ） I ｙ(0<a≦0.7, 0<y<4), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mn ａ Br （４－ｙ） I ｙ (0<a≦0.7, 0<y<4), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Zn ａ Br （４－ｙ） Cl ｙ (0<a≦0.7, 0<y<4), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mg ａ Br （４－ｙ） Cl ｙ (0<a≦0.7, 0<y<4), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Co ａ Br （４－ｙ） Cl ｙ (0<a≦0.7, 0<y<4), (C ４ H ９ NH ３ ) ２ Pb （１－ａ） Mn ａ Br （４－ｙ） Cl ｙ (0<a≦0.7, 0<y<4), etc.

[0041] In the perovskite compound, when X is a bromide ion, the compound can emit fluorescence having a maximum peak intensity in a wavelength range of usually 480 nm or more, preferably 500 nm or more, more preferably 520 nm or more, and usually 700 nm or less, preferably 600 nm or less, more preferably 580 nm or less. When X is an iodide ion, the compound can emit fluorescence having a maximum peak intensity in a wavelength range of usually 520 nm or more, preferably 530 nm or more, more preferably 540 nm or more, and usually 800 nm or less, preferably 750 nm or less, more preferably 730 nm or less. When X is a chloride ion, the compound can emit fluorescence having a maximum peak intensity in a wavelength range of usually 300 nm or more, preferably 310 nm or more, more preferably 330 nm or more, and usually 600 nm or less, preferably 580 nm or less, more preferably 550 nm or less.

[0042] The content of perovskite particles in the total solid content of the curable composition is preferably 5 to 60% by mass. The lower limit is preferably 10% by mass or more, and more preferably 20% by mass or more. The upper limit is preferably 55% by mass or less, and more preferably 50% by mass or less. The curable composition of the present invention may contain only one type of perovskite particles, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0043] <<Photopolymerization Initiator>> The curable composition of the present invention contains a photopolymerization initiator. The photopolymerization initiator is preferably a photoradical polymerization initiator.

[0044] The photopolymerization initiator used in the curable composition of the present invention contains an oxime compound.

[0045] Examples of oxime compounds include compounds described in paragraph 0142 of WO 2022 / 085485, compounds described in Japanese Patent No. 5430746, compounds described in Japanese Patent No. 5647738, compounds represented by the general formula (1) of JP-A-2021-173858 and compounds described in paragraphs 0022 to 0024, compounds represented by the general formula (1) of JP-A-2021-170089 and compounds described in paragraphs 0117 to 0120, and oxime-based photopolymerization initiators described in JP-A-2013-190459, Polymers described in JP 2020-172619 A, compounds represented by formula 1 described in WO 2020 / 152120 A, compounds described in JP 2021-181406 A, photopolymerization initiators described in JP 2022-013379 A, ​​compounds represented by formula (1) described in JP 2022-015747 A, fluorine-containing fluorene oxime ester photoinitiators described in JP 2021-507058 A, initiators described in Chinese Patent Application Publication No. 110764367, JP 2022- Initiators described in Patent Publication No. 518535, initiators described in International Publication No. 2021 / 175855, compounds described in Taiwan Patent Application Publication No. 202200534, compounds described in JP 2022-078550, compounds described in Korean Patent Publication No. 10-2017-0087330, compounds described in International Publication No. 2022 / 075452, oxime ester compounds described in Chinese Patent Application Publication No. 110066225, and compounds described in Korean Patent Publication No. 10-2022-0076157 Compounds having a triarylamine or N-arylcarbazole skeleton described in paragraphs 0042 to 0062 of International Publication No. 2019 / 013112, oxime ester photopolymerization initiators described in Japanese Patent No. 7219378, photopolymerization initiators described in Korean Patent Publication No. 10-2021-0146174, photopolymerization initiators described in International Publication No. 2019 / 013112, photopolymerization initiators described in JP-A-2023-033731, initiators described in JP-T-2022-515524. Initiators described in JP-T-2023-517304. Initiators described in Chinese Patent Application Publication No. 114149517, and the like.

[0046] Specific examples of the oxime compound include 3-benzoyloxyiminobutan-2-one, 3-acetoxyiminobutan-2-one, 3-propionyloxyiminobutan-2-one, 2-acetoxyiminopentan-3-one, 2-acetoxyimino-1-phenylpropan-1-one, 2-benzoyloxyimino-1-phenylpropan-1-one, 3-(4-toluenesulfonyloxy)iminobutan-2-one, 2-ethoxycarbonyloxyimino-1-phenylpropan-1-one, 1-[4-(phenylthio)phenyl]-3-cyclohexyl-propane-1,2-dione-2-(O-acetyloxime), etc. Commercially available products include Irgacure OXE01, Irgacure OXE02, Irgacure OXE03, Irgacure OXE04, Irgacure OXE05, Irgacure OXE06, Irgacure OXE07, Irgacure OXE08, Irgacure OXE09, Irgacure OXE10, Irgacure OXE11, Irgacure OXE12, Irgacure OXE13, Irgacure OXE14, Irgacure OXE15, Irgacure OXE16, Irgacure OXE17, Irgacure OXE18, Irgacure OXE19, Irgacure OXE20, Irgacure OXE21, Irgacure OXE22, Irgacure OXE23, Irgacure OXE24, Irgacure OXE25, Irgacure OXE26, Irgacure OXE27, Irgacure OXE28, Irgacure OX OXE04 (all manufactured by BASF), TR-PBG-301, TR-PBG-304, TR-PBG-305, TR-PBG-309, TR-PBG-3054, TR-PBG-3057, TR-PBG-314, TR-PBG-327, TR-PBG-345, TR-PBG-346, TR- Examples of the oxime compound include PBG-358, TR-PBG-365, TR-PBG-380, TR-PBG-610, TR-PBG-A, and TR-PBG-B (all manufactured by TRONLY Corporation), and ADEKA OPTOMER N-1919 (manufactured by ADEKA Corporation; photopolymerization initiator 2 described in JP 2012-014052 A). In addition, it is also preferable to use, as the oxime compound, a compound that is not colorable or a compound that is highly transparent and does not easily discolor. Commercially available products include ADEKA ARCLES NCI-730, NCI-831, NCI-831E, and NCI-930 (all manufactured by ADEKA Corporation).

[0047] Examples of the oxime compound that can be used include oxime compounds having a fluorene ring, oxime compounds having a skeleton in which at least one benzene ring of a carbazole ring is replaced with a naphthalene ring, oxime compounds having a fluorine atom, oxime compounds having a nitro group, oxime compounds having a benzofuran skeleton, oxime compounds in which a substituent having a hydroxy group is bonded to a carbazole skeleton, and compounds described in paragraphs 0143 to 0149 of WO 2022 / 085485.

[0048] As the oxime compound, a compound represented by formula (OX-1) can also be used.

[0049] In formula (OX-1), X １ａ represents a divalent linking group containing at least one ring selected from the group consisting of an aromatic ring and a heterocyclic ring; １ａ represents a hydrogen atom or an acyl group; R ２ａ represents an alkyl group or an aryl group; R ３ａ and R ４ａ each independently represents a hydrogen atom or an alkyl group; Alk １ and Alk ２ each independently represents an alkyl group; R ３ａ and R ４ａ may be bonded to form a ring, Alk １ and Alk ２ may be bonded to form a ring, and n represents 0 or 1.

[0050] X in formula (OX-1) １ａ Examples of the divalent linking group represented by include a divalent aromatic ring group, a divalent heterocyclic group, a divalent group in which two or more aromatic rings are bonded via a single bond or a linking group, a divalent group in which two or more heterocycles are bonded via a single bond or a linking group, and a divalent group in which an aromatic ring and a heterocycle are bonded via a single bond or a linking group. Examples of the linking group that bonds the above-mentioned aromatic rings, heterocyclic groups, or aromatic rings and heterocycles include -CH ２ -, -O-, -CO-, -S-, -NR ｘ - and groups combining these. ｘ represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heterocyclic group.

[0051] X in formula (OX-1) １ａ is preferably a group represented by any one of formulas (X-1) to (X-13), more preferably a group represented by formula (X-1), formula (X-2), formula (X-4), formula (X-6) or formula (X-8), and further preferably a group represented by formula (X-2) or formula (X-6).

[0052]

[0053] In the formula R Ｘ１ ~R Ｘ９ each independently represents a hydrogen atom, an alkyl group, an alkenyl group, an alkynyl group, an aryl group, or a heteroaryl group, and * represents a bond.

[0054] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, and more preferably 1 to 10. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heteroaryl group.

[0055] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkenyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkenyl group may be linear, branched, or cyclic. The alkenyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heteroaryl group.

[0056] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the alkynyl group represented by is preferably 2 to 15, and more preferably 2 to 10. The alkynyl group may be linear, branched, or cyclic. The alkynyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, and a heteroaryl group.

[0057] R Ｘ１ ~R Ｘ９ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heteroaryl group.

[0058] R Ｘ１ ~R Ｘ９The heteroaryl group represented by is preferably a 5-membered or 6-membered ring. The heteroatoms contained in the heteroaryl group are preferably oxygen atoms, nitrogen atoms, and sulfur atoms. The number of heteroatoms contained in the heteroaryl group is preferably 1 to 3. The heteroaryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and an aryl group.

[0059] R in formula (OX-1) １ａ represents a hydrogen atom or an acyl group, and is preferably an acyl group.

[0060] R in formula (OX-1) ２ａ represents an alkyl group or an aryl group, and is preferably an alkyl group because the reactivity of the generated radical is high. ２ａ The number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ２ａ The alkyl group represented by R is preferably an unsubstituted linear or branched alkyl group, and more preferably an unsubstituted linear alkyl group. ２ａ The number of carbon atoms in the aryl group represented by is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. The aryl group may have a substituent, but is preferably an unsubstituted aryl group.

[0061] R in formula (OX-1) ３ａ and R ４ａ R each independently represents a hydrogen atom or an alkyl group, and is preferably a hydrogen atom. ３ａ and R ４ａThe number of carbon atoms in the alkyl group represented by is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. R ３ａ and R ４ａ may be bonded to form a ring. The ring formed is preferably a 5- or 6-membered ring, and more preferably a 5- or 6-membered aliphatic hydrocarbon ring.

[0062] Alk of formula (OX-1) １ and Alk ２ each independently represents an alkyl group. The number of carbon atoms in the alkyl group is preferably 1 to 15, more preferably 1 to 10, even more preferably 1 to 5, and even more preferably 1 to 3. The alkyl group may be linear, branched, or cyclic, but is preferably linear or branched, and more preferably linear. The alkyl group may have a substituent, but is preferably an unsubstituted alkyl group. Alk １ and Alk ２ may be bonded to form a ring, and preferably form a ring. The ring formed is preferably a 5- or 6-membered ring, more preferably a 5- or 6-membered aliphatic hydrocarbon ring, and more preferably a cyclopentane ring or a cyclohexane ring.

[0063] In formula (OX-1), n ​​represents 0 or 1, and is preferably 0.

[0064] Specific examples of the compound represented by formula (OX-1) include the compounds described in paragraphs 0092 to 0096 of JP-A No. 2012-113104 and the compound described in paragraph 0041 of JP-A No. 2012-189997.

[0065] As the oxime, a compound represented by formula (OX-2) can also be used.

[0066]

[0067] In formula (OX-2), R １ｂ and R ２ｂ each independently represents a substituent, R ３ｂ ~R ７ｂ each independently represents a hydrogen atom or a substituent, Ar １ｂ represents an aryl group which may have a substituent or a heteroaryl group which may have a substituent; n represents 0 or 1;

[0068] R １ｂ and R ２ｂ Examples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heteroaryl group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heteroaryl group.

[0069] R ３ｂ ~R ７ｂ Examples of the substituent represented by R include a halogen atom, an alkyl group, and an aryl group. ３ｂ ~R ７ｂ is preferably a hydrogen atom.

[0070] Ar １ｂ represents an aryl group which may have a substituent or a heteroaryl group which may have a substituent, Ar １ｂis preferably an aryl group which may have a substituent. The number of carbon atoms in the aryl group is preferably 6 to 20, more preferably 6 to 12, still more preferably 6 to 10, and particularly preferably 6. Examples of the substituent include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group, an alkylthio group, an arylthio group, a nitro group, and an acyl group, and an acyl group is preferred.

[0071] As the oxime compound, a compound represented by formula (OX-3) can also be used.

[0072]

[0073] In formula (OX-3), Ar １ｃ represents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group; Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group; R １ｃ ~R ３ｃ each independently represents a substituent; １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ each independently represents a hydrogen atom, an alkyl group, or an aryl group; １ｃ Ha-CH ２ represents -, -N-, -O- or -S-; k represents 0 or 1; m represents an integer of 0 to 4; and n represents 0 or 1.

[0074] R １ｃ and R ２ｃExamples of the substituent represented by include an alkyl group and an aryl group, and an alkyl group is preferred. The alkyl group preferably has 1 to 15 carbon atoms, and more preferably 1 to 10 carbon atoms. The alkyl group may be linear, branched, or cyclic. The alkyl group may have a substituent. Examples of the substituent include a halogen atom, an aryl group, an alkenyl group, an alkynyl group, and a heteroaryl group. The aryl group preferably has 6 to 20 carbon atoms, more preferably 6 to 12 carbon atoms, even more preferably 6 to 10 carbon atoms, and particularly preferably 6 carbon atoms. The aryl group may have a substituent. Examples of the substituent include a halogen atom, an alkyl group, an alkenyl group, an alkynyl group, and a heteroaryl group. R ２ｃ is preferably an alkyl group having a branched or cyclic structure.

[0075] R ３ｃ Examples of the substituent represented by include a halogen atom, an alkyl group, an alkoxy group, an aryl group, an aryloxy group and an acyl group, and an acyl group is preferred.

[0076] L １ｃ is a single bond or CR １１ｃ R １２ｃ represents R １１ｃ and R １２ｃ R each independently represents a hydrogen atom, an alkyl group, or an aryl group. １１ｃ and R １２ｃ The alkyl group and aryl group in R １ｃ and R ２ｃ When k is 1, L １ｃ is preferably a single bond.

[0077] X １ｃ is -CH ２ It represents -, -N-, -O- or -S-, and is preferably -O- or -S-.

[0078] Ar １ｃrepresents a (k+m+1)-valent aromatic ring group or a (k+m+1)-valent heterocyclic group, and is preferably a (k+m+1)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0079] Ar ２ｃ represents a (k+2)-valent aromatic ring group or a (k+2)-valent heterocyclic group, and is preferably a (k+2)-valent aromatic ring group. The aromatic ring group is preferably a benzene ring group or a naphthalene ring group, and more preferably a benzene ring group.

[0080] k represents 0 or 1, and is preferably 0. m represents an integer of 0 to 4, and is preferably 0 or 1, and more preferably 1. n represents 0 or 1, and is preferably 0.

[0081] As the oxime compound, a bifunctional or trifunctional or higher functional oxime compound may be used. Specific examples of the bifunctional or trifunctional or higher functional oxime compound include the compounds described in paragraph 0148 of WO 2022 / 065215.

[0082] Specific examples of the oxime compound include the compounds shown below.

[0083]

[0084]

[0085]

[0086]

[0087]

[0088] It is also preferable that the curable composition of the present invention further contains a compound other than the oxime compound (hereinafter also referred to as other photopolymerization initiator). According to this embodiment, the adhesion of the film can be further improved. Furthermore, the occurrence of chipping can be further suppressed.

[0089] When the curable composition of the present invention contains another photopolymerization initiator, the content of the other photopolymerization initiator is preferably 5 to 500 parts by mass relative to 100 parts by mass of the oxime compound. The upper limit is preferably 250 parts by mass or less, more preferably 100 parts by mass or less. The lower limit is preferably 10 parts by mass or more, more preferably 20 parts by mass or more.

[0090] Other photopolymerization initiators include trihalomethyltriazine compounds, benzyl dimethyl ketal compounds, α-hydroxyketone compounds, α-aminoketone compounds, acylphosphine compounds, phosphine oxide compounds, metallocene compounds, hexaarylbiimidazole compounds, onium compounds, benzothiazole compounds, benzophenone compounds, acetophenone compounds, cyclopentadiene-benzene-iron complexes, halomethyloxadiazole compounds, 3-aryl-substituted coumarin compounds, phenyl glyoxylate compounds, and thioxanthone compounds, with α-hydroxyketone compounds or α-aminoketone compounds being preferred. Phenyl glyoxylate compounds include phenyl glyoxylic acid methyl ester. Commercially available products include Omnirad MBF (manufactured by IGM Resins B.V.) and Irgacure MBF (manufactured by BASF).

[0091] Examples of the hexaarylbiimidazole compound include 2,2',4-tris(2-chlorophenyl)-5-(3,4-dimethoxyphenyl)-4,5-diphenyl-1,1'-biimidazole.

[0092] Examples of the acylphosphine compound include the acylphosphine compounds described in Japanese Patent No. 4225898. Specific examples include bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide. Commercially available acylphosphine compounds include Omnirad 819 and Omnirad TPO (both manufactured by IGM Resins B.V.), Irgacure 819 and Irgacure TPO (both manufactured by BASF).

[0093] Examples of the α-aminoketone compound include the α-aminoketone compounds described in JP-A-10-291969. Commercially available α-aminoketone compounds include Omnirad 907, Omnirad 369, Omnirad 369E, Omnirad 379, and Omnirad 379EG (all manufactured by IGM Resins B.V.), and Irgacure 907, Irgacure 369, Irgacure 369E, Irgacure 379, and Irgacure 379EG (all manufactured by BASF).

[0094] Commercially available α-hydroxyketone compounds include Omnirad 184, Omnirad 1173, Omnirad 2959, and Omnirad 127 (all manufactured by IGM Resins B.V.), and Irgacure 184, Irgacure 1173, Irgacure 2959, and Irgacure 127 (all manufactured by BASF).

[0095] The content of the photopolymerization initiator in the total solid content of the curable composition is preferably 1 to 20% by mass. The upper limit is preferably 15% by mass or less, and more preferably 10% by mass or less. The lower limit is preferably 2% by mass or more, and more preferably 3% by mass or more. The curable composition of the present invention may contain only one type of photopolymerization initiator, or may contain two or more types. When two or more types are contained, the total amount thereof is preferably within the above range.

[0096] The content of the oxime compound in the total solid content of the curable composition is preferably 1 to 15% by mass. The lower limit is preferably 1.5% by mass or more, and more preferably 2% by mass or more. The upper limit is preferably 12.5% ​​by mass or less, and more preferably 10% by mass or less. The curable composition of the present invention may contain only one type of oxime compound, or may contain two or more types. When two or more types are contained, the total amount thereof preferably falls within the above range.

[0097] The content of the oxime compound in the photopolymerization initiator contained in the curable composition is preferably 10% by mass or more, more preferably 25% by mass or more, and even more preferably 50% by mass or more.

[0098] <<Polymerizable Compound>> The curable composition of the present invention contains a polymerizable compound. Examples of the polymerizable compound include a compound having an ethylenically unsaturated bond-containing group. Examples of the ethylenically unsaturated bond-containing group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, and a (meth)acryloyloxy group. The polymerizable compound used in the present invention is preferably a radically polymerizable compound.

[0099] The polymerizable compound may be in any chemical form, such as a monomer, prepolymer, or oligomer, but is preferably a monomer. The molecular weight of the polymerizable compound is preferably 100 to 3,000. The upper limit is preferably 2,000 or less, more preferably 1,500 or less. The lower limit is preferably 150 or more, more preferably 250 or more.

[0100] The ethylenically unsaturated bond-containing group value (hereinafter referred to as C═C value) of the polymerizable compound is preferably 2 to 14 mmol / g from the viewpoint of the stability over time of the curable composition. The lower limit is preferably 3 mmol / g or more, more preferably 4 mmol / g or more, and even more preferably 5 mmol / g or more. The upper limit is preferably 12 mmol / g or less, more preferably 10 mmol / g or less, and even more preferably 8 mmol / g or less. The C═C value of the polymerizable compound is a value calculated by dividing the number of ethylenically unsaturated bond-containing groups contained in one molecule of the polymerizable compound by the molecular weight of the polymerizable compound.

[0101] The polymerizable compound is preferably a compound containing three or more ethylenically unsaturated bond-containing groups, more preferably a compound containing 3 to 15 ethylenically unsaturated bond-containing groups, and even more preferably a compound containing 3 to 6 ethylenically unsaturated bond-containing groups. Furthermore, the polymerizable compound is preferably a trifunctional to 15-functional (meth)acrylate compound, and more preferably a trifunctional to hexafunctional (meth)acrylate compound. Specific examples of the polymerizable compound include the compounds described in paragraphs 0075 to 0083 of WO 2022 / 065215 and the compounds described in Taiwan Patent Application Publication No. 201832008.

[0102] Preferred polymerizable compounds include dipentaerythritol tri(meth)acrylate (commercially available product: KAYARAD D-330, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol tetra(meth)acrylate (commercially available product: KAYARAD D-320, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol penta(meth)acrylate (commercially available product: KAYARAD D-310, manufactured by Nippon Kayaku Co., Ltd.), dipentaerythritol hexa(meth)acrylate (commercially available products: KAYARAD DPHA, manufactured by Nippon Kayaku Co., Ltd., and NK Ester A-DPH-12E, manufactured by Shin-Nakamura Chemical Co., Ltd.), and compounds having a structure in which the (meth)acryloyl group is bonded via an ethylene glycol and / or propylene glycol residue (e.g., SR454, SR499, commercially available from Sartomer).Examples of polymerizable compounds include diglycerin EO (ethylene oxide) modified (meth)acrylate (commercially available product: M-460, manufactured by Toagosei Co., Ltd.), pentaerythritol tetraacrylate (NK Ester A-TMMT, manufactured by Shin-Nakamura Chemical Co., Ltd.), and 1,6-hexanediol diacrylate (KAYARAD, manufactured by Nippon Kayaku Co., Ltd.). HDDA), RP-1040 (manufactured by Nippon Kayaku Co., Ltd.), Aronix TO-2349 (manufactured by Toagosei Co., Ltd.), NK Oligo UA-7200 (manufactured by Shin-Nakamura Chemical Industry Co., Ltd.), DPHA-40H (manufactured by Nippon Kayaku Co., Ltd.), UA-306H, UA-306T, UA-306I, AH-600, T-600, AI-600, LINC-202UA (manufactured by Kyoeisha Chemical Co., Ltd.), 8UH-1 006, 8UH-1012 (all manufactured by Taisei Fine Chemical Co., Ltd.), Light Acrylate POB-A0 (manufactured by Kyoeisha Chemical Co., Ltd.), Aronix MT-3041, 3042 (manufactured by Toagosei Co., Ltd., polymerizable compounds containing amines), Aronix M-510, 520 (manufactured by Toagosei Co., Ltd., polymerizable compounds having an acidic group), Etercure 6361-100 (Eternal Materials, polymerizable compound having a hyperbranched structure), EBECRYL80 (amine-containing tetrafunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), EBECRYL7100 (amine-containing bifunctional monomer, manufactured by Daicel-Olknes Co., Ltd.), CN371NS (amine-containing bifunctional monomer, manufactured by Arkema), HOA-MPL (2-acryloyloxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), HOA-MPE (2-acryloyloxyethyl-2-hydroxyethyl-phthalic acid: manufactured by Kyoeisha Chemical Co., Ltd.), polymerizable compounds having a dendrimer structure or hyperbranched structure described in JP-A No. 2023-043479, and polymerizable compounds described in JP-A No. 2023-529984 can also be used.

[0103] It is also preferred that the polymerizable compound is a compound containing an ethylenically unsaturated bond-containing group and an alkyleneoxy group. According to this embodiment, the film becomes flexible, the reaction proceeds more easily even in the peripheral areas of pixels during exposure, and the occurrence of chipping during pixel formation can be more effectively suppressed. The number of alkyleneoxy groups contained in one molecule of the polymerizable compound is preferably 3 or more, more preferably 4 or more. The upper limit is preferably 20 or less.

[0104] Examples of the compound having an ethylenically unsaturated bond-containing group and an alkyleneoxy group include compounds represented by formula (EO-1).

[0105] In the formula, R １ represents an alkylene group, and R ２ represents a hydrogen atom or a methyl group, m represents an integer of 1 to 30, n represents an integer of 2 or more, L １ represents an n-valent linking group.

[0106] R １ The number of carbon atoms in the alkylene group represented by R is preferably 1 to 10, more preferably 1 to 5, even more preferably 1 to 3, particularly preferably 2 or 3, and most preferably 2. １ The alkylene group represented by R is preferably linear or branched, and more preferably linear. １ Specific examples of the alkylene group represented by include an ethylene group and a linear or branched propylene group, with an ethylene group being preferred.

[0107] L １Examples of the n-valent linking group represented by include an aliphatic hydrocarbon group, an aromatic hydrocarbon group, a heterocyclic group, and a group formed by combining these groups, as well as a group formed by combining at least one group selected from an aliphatic hydrocarbon group, an aromatic hydrocarbon group, and a heterocyclic group with at least one group selected from -O-, -CO-, -COO-, -OCO-, and -NH-. The aliphatic hydrocarbon group preferably has 1 to 30 carbon atoms, more preferably 1 to 20, and even more preferably 1 to 15. The aliphatic hydrocarbon group may be linear, branched, or cyclic, and linear or branched is preferred. The aromatic hydrocarbon group preferably has 6 to 30 carbon atoms, more preferably 6 to 20, and even more preferably 6 to 10. The heterocyclic group may be a non-aromatic heterocyclic group or an aromatic heterocyclic group. The heterocyclic group is preferably a 5- or 6-membered ring. Examples of heteroatoms constituting the heterocyclic group include nitrogen atoms, oxygen atoms, and sulfur atoms. The number of heteroatoms constituting the heterocyclic group is preferably 1 to 3. The heterocyclic group may be a monocyclic group or a condensed ring. １ The n-valent linking group represented by is also preferably a group derived from a polyfunctional alcohol.

[0108] m represents an integer of 1 to 30, preferably an integer of 1 to 20, more preferably an integer of 1 to 10, and even more preferably an integer of 1 to 5.

[0109] n represents an integer of 2 or greater, and preferably an integer of 3 or greater. The upper limit of n is preferably an integer of 15 or less, more preferably an integer of 10 or less, and even more preferably an integer of 6 or less.

[0110] The content of the polymerizable compound in the total solid content of the curable composition is preferably 5 to 40% by mass, with the upper limit being preferably 35% by mass or less, and more preferably 30% by mass or less, and the lower limit being preferably 10% by mass or more, and more preferably 15% by mass or more.

[0111] The ratio of the polymerizable compound to the oxime compound is preferably 40 to 800 parts by mass of the polymerizable compound per 100 parts by mass of the oxime compound. The upper limit is preferably 600 parts by mass or less, more preferably 400 parts by mass or less. The lower limit is preferably 70 parts by mass or more, more preferably 100 parts by mass or more.

[0112] The ratio of the polymerizable compound to the photopolymerization initiator is preferably 25 to 1,000 parts by mass of the polymerizable compound per 100 parts by mass of the photopolymerization initiator. The upper limit is preferably 750 parts by mass or less, more preferably 500 parts by mass or less. The lower limit is preferably 50 parts by mass or more, more preferably 75 parts by mass or more.

[0113] The ratio of the polymerizable compound to the resin is preferably 10 to 1,000 parts by mass of the polymerizable compound per 100 parts by mass of the resin. The upper limit is preferably 500 parts by mass or less, more preferably 250 parts by mass or less. The lower limit is preferably 50 parts by mass or more, more preferably 100 parts by mass or more.

[0114] The curable composition of the present invention may contain only one polymerizable compound or may contain two or more polymerizable compounds. When two or more polymerizable compounds are contained, the total amount thereof is preferably within the above range.

[0115] <<Resin>> The curable composition of the present invention contains a resin. Examples of the resin include (meth)acrylic resins, epoxy resins, (meth)acrylamide resins, ene-thiol resins, polycarbonate resins, polyether resins, polyarylate resins, polysulfone resins, polyethersulfone resins, polyphenylene resins, polyarylene ether phosphine oxide resins, polyimide resins, polyamideimide resins, polyolefin resins, cyclic olefin resins, polyester resins, styrene resins, and siloxane resins. Further, examples of the resin include the resins described in paragraphs 0091 to 0099 of WO 2022 / 065215, the blocked polyisocyanate resins described in JP 2016-222891 A, the resins described in JP 2020-122052 A, the resins described in JP 2020-111656 A, the resins described in JP 2020-139021 A, and the resins described in JP 2017-138503 A having a structural unit having a ring structure in the main chain and a biphenyl group in the side chain. Resins containing structural units, resins described in paragraphs 0199 to 0233 of JP-A-2020-186373, alkali-soluble resins described in JP-A-2020-186325, resins represented by formula 1 described in Korean Patent Publication No. 10-2020-0078339, copolymers containing epoxy groups and acid groups described in WO 2022 / 030445, resins described in JP-A-2018-135514, and copolymers described in JP-A-2020-041046 can also be used.

[0116] The weight average molecular weight (Mw) of the resin is preferably 5,000 to 2,000,000. The upper limit is preferably 1,000,000 or less, and more preferably 500,000 or less. The lower limit is preferably 6,000 or more, and more preferably 7,000 or more.

[0117] The glass transition temperature of the resin is preferably -125 to 100°C. If the glass transition temperature of the resin is within the above range, the perovskite particles can be more uniformly dispersed in the film, and chipping during pixel formation can be more effectively suppressed. The upper limit of the glass transition temperature is preferably 50°C or less, more preferably 25°C or less. The lower limit is preferably -100°C or less, more preferably -75°C or less. Note that, in this specification, the glass transition temperature (Tg) of the resin is an actually measured value (hereinafter also referred to as the measured Tg). Specifically, the measured Tg can be a value measured under normal measurement conditions using a differential scanning calorimeter (DSC) EXSTAR6220 manufactured by SII Nanotechnology, Inc. However, if it is difficult to measure the glass transition temperature due to polymer decomposition or the like, the calculated value calculated using the following formula (hereinafter also referred to as the calculated Tg) is applied.

[0118]

[0119] Here, the resin to be calculated is assumed to be a copolymer of n types of monomer components. ｃａｌ is the calculated Tg of the resin (unit: K), and X ｉ is the mass fraction of the i-th monomer (ΣX ｉ = 1), and Tgm ｉ is the glass transition temperature (unit: K) of the homopolymer of the i-th monomer, and n is an integer of 1 or more. The glass transition temperature value (Tgm ｉ ) are values ​​described in Polymer Handbook (3rd Edition) (by J. Brandrup and EH Immergut (Wiley-Interscience, 1989)).

[0120] The resin used includes a resin having an acid group, such as a carboxy group, a phosphate group, a sulfo group, or a phenolic hydroxy group.

[0121] The acid value of the resin having an acid group is preferably 30 to 500 mgKOH / g. The lower limit is preferably 40 mgKOH / g or more, and more preferably 50 mgKOH / g or more. The upper limit is preferably 400 mgKOH / g or less, more preferably 300 mgKOH / g or less, and even more preferably 200 mgKOH / g or less.

[0122] The weight average molecular weight (Mw) of the resin having an acid group is preferably 5,000 to 100,000. The upper limit is preferably 80,000 or less, and more preferably 60,000 or less. The lower limit is preferably 6,000 or more, and more preferably 8,000 or more. The number average molecular weight (Mn) of the resin having an acid group is preferably 1,000 to 20,000.

[0123] The glass transition temperature of the resin having an acid group is preferably −125 to 100° C. The upper limit is preferably 50° C. or less, more preferably 25° C. or less. The lower limit is preferably −100° C. or less, more preferably −75° C. or less.

[0124] The resin having an acid group preferably contains a repeating unit having an acid group on a side chain, and more preferably contains 5 to 70 mol% of the repeating units having an acid group on a side chain based on all repeating units of the resin. The upper limit of the content of repeating units having an acid group on a side chain is preferably 50 mol% or less, more preferably 30 mol% or less. The lower limit of the content of repeating units having an acid group on a side chain is preferably 10 mol% or more, more preferably 20 mol% or more.

[0125] The resin having an acid group is also preferably a resin having an aromatic carboxy group. In a resin having an aromatic carboxy group, the aromatic carboxy group may be contained in the main chain of the repeating unit or in the side chain of the repeating unit. The aromatic carboxy group is preferably contained in the main chain of the repeating unit. In this specification, an aromatic carboxy group refers to a group having a structure in which one or more carboxy groups are bonded to an aromatic ring. In the aromatic carboxy group, the number of carboxy groups bonded to the aromatic ring is preferably 1 to 4, and more preferably 1 to 2. Examples of resins having an aromatic carboxy group include the resins described in paragraphs 0082 to 0107 of WO 2021 / 166858.

[0126] For resins having acid groups, please refer to the descriptions in paragraphs

[0558] to

[0571] of JP 2012-208494 A (corresponding to paragraphs

[0685] to

[0700] of U.S. Patent Application Publication No. 2012 / 0235099 A) and paragraphs

[0076] to

[0099] of JP 2012-198408 A, the contents of which are incorporated herein by reference. Commercially available resins having acid groups can also be used. There are no particular limitations on the method for introducing acid groups into the resin, and examples include the method described in Japanese Patent No. 6,349,629 A. Furthermore, methods for introducing acid groups into the resin include a method in which an acid anhydride is reacted with a hydroxy group generated by a ring-opening reaction of an epoxy group to introduce the acid group.

[0127] The resin having an acid group is preferably a resin having a graft chain (hereinafter also referred to as an acidic graft resin). According to this embodiment, the occurrence of chipping during pixel formation can be more effectively suppressed.

[0128] In this specification, the term "graft chain" refers to a polymer chain that branches off and extends from the main chain of a repeating unit. The graft chain preferably has 40 to 10,000 atoms excluding hydrogen atoms, more preferably 50 to 2,000 atoms excluding hydrogen atoms, and even more preferably 60 to 500 atoms excluding hydrogen atoms. The graft chain preferably contains repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, a polystyrene structure, a polyurethane structure, a polyurea structure, and a polyamide structure, more preferably contains repeating units of at least one structure selected from a polyether structure, a polyester structure, a poly(meth)acrylic structure, and a polystyrene structure, even more preferably contains repeating units of a polyether structure or a polyester structure, and particularly preferably contains repeating units of a polyester structure.

[0129] Examples of repeating units of polyester structures include repeating units of structures represented by formula (G-1), formula (G-4), or formula (G-5). Examples of repeating units of polyether structures include repeating units of structures represented by formula (G-2). Examples of repeating units of poly(meth)acrylic structures include repeating units of structures represented by formula (G-3). Examples of repeating units of polystyrene structures include repeating units of structures represented by formula (G-6).

[0130]

[0131] In the above formula, R Ｇ１ and R Ｇ２ R each independently represents an alkylene group. Ｇ１ The number of carbon atoms in the alkylene group represented by R is preferably 1 to 20, more preferably 2 to 16, and even more preferably 2 to 12. The alkylene group is preferably linear or branched, and more preferably linear. Ｇ２The number of carbon atoms in the alkylene group represented by is preferably 1 to 10, more preferably 1 to 5, even more preferably 2 to 5, and still more preferably 2 or 3. The alkylene group is preferably linear or branched, and more preferably linear.

[0132] In the above formula, R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１ represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent.

[0133] L Ｇ１ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 12 carbon atoms), an alkyleneoxy group (preferably an alkyleneoxy group having 1 to 12 carbon atoms), an oxyalkylenecarbonyl group (preferably an oxyalkylenecarbonyl group having 1 to 12 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ Examples thereof include -, -CO-, -O-, -COO-, -OCO-, -S- and groups formed by combining two or more of these.

[0134] R Ｇ４ Examples of the substituent represented by include a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, a heteroarylthioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

[0135] R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group. Ｇ６ The number of carbon atoms in the aryl group represented by R is preferably 6 to 30, more preferably 6 to 20, and even more preferably 6 to 12. Ｇ６The aryl group represented by may have a substituent, such as a hydroxy group, a carboxy group, an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, a heteroarylthioether group, an ethylenically unsaturated bond-containing group, an epoxy group, an oxetanyl group, and a blocked isocyanate group.

[0136] The terminal structure of the graft chain is not particularly limited. It may be a hydrogen atom or a substituent. Examples of the substituent include a group represented by formula (W-1).

[0137] -L ｗ１ -R ｗ１ ...(W-1) In the formula, L ｗ１ represents a single bond or a divalent linking group, R ｗ１ represents an alkyl group, an aryl group, a heteroaryl group, an alkoxy group, an aryloxy group, a heteroaryloxy group, an alkylthioether group, an arylthioether group, or a heteroarylthioether group.

[0138] L ｗ１ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, OCO-, -CONR Ｌ１ -, -S-, and groups combining two or more of these groups. Ｌ１ represents a hydrogen atom, an alkyl group, or an aryl group.

[0139] R ｗ１ is preferably an alkyl group or an alkoxy group.

[0140] The graft chain preferably has a structure represented by the following formula (G-1a), (G-2a), (G-3a), (G-4a), (G-5a) or (G-6a), and more preferably has a structure represented by formula (G-1a), (G-4a) or (G-5a).

[0141]

[0142] In the above formula, R Ｇ１ and R Ｇ２ each represents an alkylene group, and R Ｇ３ represents a hydrogen atom or a methyl group, and Q Ｇ１ represents —O— or —NH—, L Ｇ１ represents a single bond or a divalent linking group, R Ｇ４ represents a hydrogen atom or a substituent, R Ｇ５ represents a hydrogen atom or a methyl group, R Ｇ６ represents an aryl group; W １００ represents a hydrogen atom or a substituent, and n1 to n6 each independently represent an integer of 2 or more. Ｇ１ ~R Ｇ６ , Q Ｇ１ , L Ｇ１ Regarding the formula (G-1) to (G-6), Ｇ１ ~R Ｇ６ , Q Ｇ１ , L Ｇ１ The same applies to the preferred range.

[0143] In formulae (G-1a) to (G-6a), W １００ is preferably a substituent. Examples of the substituent include the group represented by the above formula (W-1).

[0144] In formulae (G-1a) to (G-6a), n1 to n6 are each preferably an integer of 2 to 100, more preferably an integer of 2 to 80, and even more preferably an integer of 8 to 60.

[0145] In formula (G-1a), when n1 is 2 or more, R Ｇ１ may be the same or different. Ｇ１ In the case where the repeating unit has two or more different repeating units, the arrangement of the repeating units is not particularly limited and may be random, alternating, or block. The same applies to formulas (G-2a) to (G-6a). The graft chain has a structure represented by formula (G-1a), formula (G-4a), or formula (G-5a), and R Ｇ１It is also preferable that the repeating unit has a structure containing two or more different repeating units.

[0146] The acidic graft resin is preferably a resin having a repeating unit having a graft chain and a repeating unit having an acid group. Examples of the repeating unit having a graft chain include a repeating unit represented by formula (e3).

[0147] In the formula, A ｅ３０ represents a trivalent linking group, L ｅ３０ represents a single bond or a divalent linking group; W ｅ３０ represents a graft chain.

[0148] A ｅ３０ Examples of the trivalent linking group represented by are a poly(meth)acrylic linking group, a polyalkyleneimine linking group, a polyester linking group, a polyurethane linking group, a polyurea linking group, a polyamide linking group, a polyether linking group, and a polystyrene linking group. A poly(meth)acrylic linking group or a polyalkyleneimine linking group is preferred, and a poly(meth)acrylic linking group is more preferred.

[0149] L ｅ３０ Examples of the divalent linking group represented by include an alkylene group (preferably an alkylene group having 1 to 10 carbon atoms), an arylene group (preferably an arylene group having 6 to 20 carbon atoms), -NH-, -SO-, -SO ２ -, -CO-, -O-, -COO-, OCO-, -CONR ｘ３ -, -S-, and groups combining two or more of these groups. ｘ３ represents a hydrogen atom, an alkyl group, or an aryl group. The alkylene group and arylene group may have a substituent.

[0150] W ｅ３０ Examples of the graft chain represented by include the graft chains described above.

[0151] The content of the repeating units having graft chains in the total repeating units of the acidic graft resin is preferably 1 mol% or more, more preferably 2 mol% or more, and even more preferably 3 mol% or more, with the upper limit being 90 mol% or less, 80 mol% or less, or 70 mol% or less.

[0152] The content of repeating units having an acid group in all repeating units of the acidic graft resin is preferably 1 mol% or more, more preferably 2 mol% or more, and even more preferably 3 mol% or more, with the upper limit being 90 mol% or less, 80 mol% or less, or 70 mol% or less.

[0153] The acidic graft resin may further have a repeating unit having a crosslinkable group. Examples of the crosslinkable group include ethylenically unsaturated bond-containing groups such as vinyl groups, (meth)allyl groups, and (meth)acryloyl groups, and cyclic ether groups such as epoxy groups and oxetanyl groups. The content of the repeating unit having a crosslinkable group is preferably 1 mol% or more, more preferably 2 mol% or more, and even more preferably 3 mol% or more, of the total repeating units of the acidic graft resin. The upper limit can be 90 mol% or less, 80 mol% or less, or 70 mol% or less.

[0154] The weight average molecular weight of the acidic graft resin is preferably 5,000 to 100,000. The upper limit is preferably 80,000 or less, and more preferably 60,000 or less. The lower limit is preferably 6,000 or more, and more preferably 8,000 or more.

[0155] The acid value of the acidic graft resin is preferably 30 to 500 mgKOH / g, with the upper limit being preferably 400 mgKOH / g or less, more preferably 300 mgKOH / g or less, and the lower limit being preferably 40 mgKOH / g or more, more preferably 50 mgKOH / g or more.

[0156] The glass transition temperature of the acidic graft resin is preferably −125 to 100° C. The upper limit is preferably 50° C. or less, more preferably 25° C. or less. The lower limit is preferably −100° C. or less, more preferably −75° C. or less.

[0157] The resin content of the curable composition is preferably 5 to 50% by mass based on the total solid content. The lower limit is preferably 10% by mass or more, and more preferably 15% by mass or more. The upper limit is preferably 40% by mass or less, and more preferably 30% by mass or less.

[0158] The content of the resin having an acid group in the resin contained in the curable composition is preferably 7.5% by mass or more, more preferably 12.5% ​​by mass or more, even more preferably 15% by mass or more, still more preferably 50% by mass or more, even more preferably 80% by mass or more, and particularly preferably 90% by mass or more.

[0159] The curable composition of the present invention may contain only one resin or two or more resins. When two or more resins are contained, the total amount thereof is preferably within the above range.

[0160] <<Ligands>> The curable composition of the present invention may contain a ligand. Examples of the ligand include carboxylic acid compounds, phosphoric acid compounds, sulfonic acid compounds, carboxylates, phosphates, sulfonates, and compounds having an amino group. Specific examples include oleic acid (OA), 2-hexyldecanoic acid (DA), decanoic acid (CA), propanoic acid (PA), octanoic acid (OTAc), lauric acid (LA), benzenesulfonic acid, dodecylbenzenesulfonic acid, octyl phosphoric acid, n-octylphosphonic acid, 1-tetradecyl phosphoric acid, bis(2,4,4-trimethylpentyl)phosphinic acid (TMPPA), trioctylphosphine oxide (TOPO), trioctylphosphine (TOP), sodium lauryl sulfate, sodium dodecylbenzenesulfonate, oleylamine (OAm), octylamine, phenethylamine (PEA), and butylamine (BLA).

[0161] The content of the ligand in the curable composition is preferably 0.1 to 10% by mass. The lower limit is preferably 0.5% by mass or more, and more preferably 1.0% by mass or more. The upper limit is preferably 5% by mass or less, and more preferably 2.5% by mass or less. The curable composition of the present invention may contain only one type of ligand, or may contain two or more types. When two or more types of resins are contained, the total amount thereof is preferably within the above range.

[0162] <<Compound Having a Cyclic Ether Group>> The curable composition of the present invention can contain a compound having a cyclic ether group. Examples of the cyclic ether group include an epoxy group and an oxetanyl group. The epoxy group may be an alicyclic epoxy group. The alicyclic epoxy group refers to a monovalent functional group having a cyclic structure in which an epoxy ring and a saturated hydrocarbon ring are condensed. The compound having a cyclic ether group is preferably a compound having an epoxy group (hereinafter also referred to as an epoxy compound). Examples of the compound having a cyclic ether group include compounds having 1 to 100 cyclic ether groups per molecule. The upper limit of the number of cyclic ether groups can be, for example, 10 or less, or 5 or less. The lower limit of the number of cyclic ether groups is preferably 2 or more.

[0163] The compound having a cyclic ether group may be a low molecular weight compound (for example, a molecular weight of less than 2000, or even less than 1000) or a high molecular weight compound (macromolecule) (for example, a molecular weight of 1000 or more, and in the case of a polymer, a weight average molecular weight of 1000 or more). The weight average molecular weight of the compound having a cyclic ether group is preferably 200 to 100,000, more preferably 500 to 50,000. The upper limit of the weight average molecular weight is more preferably 10,000 or less, particularly preferably 5,000 or less, and even more preferably 3,000 or less.

[0164] As the compound having a cyclic ether group, the compounds described in paragraphs 0034 to 0036 of JP-A-2013-011869, the compounds described in paragraphs 0147 to 0156 of JP-A-2014-043556, the compounds described in paragraphs 0085 to 0092 of JP-A-2014-089408, and the compounds described in JP-A-2017-179172 can also be used.

[0165] Commercially available compounds having a cyclic ether group include Denacol EX-212L, EX-212, EX-214L, EX-214, EX-216L, EX-216, EX-321L, EX-321, EX-850L, and EX-850 (all manufactured by Nagase ChemteX Corporation), ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (all manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (all manufactured by ADEKA Corporation), Celloxide 2021P, Celloxide 2081, Celloxide 2083, Celloxide 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (all manufactured by Daicel Corporation), Cyclomer P ACA 200M, ACA 230AA, ACA Z250, ACA Z251, ACA Z300, ACA Z320 (all manufactured by Daicel Corporation), jER1031S, jER157S65, jER152, jER154, jER157S70 (all manufactured by Mitsubishi Chemical Corporation), Aron Oxetane OXT-121, OXT-221, OX-SQ, PNOX (all manufactured by Toagosei Co., Ltd.), Adeka Glycirol Examples of such monomers include ED-505 (manufactured by ADEKA Corporation, epoxy group-containing monomer), Marproof G-0150M, G-0105SA, G-0130SP, G-0250SP, G-1005S, G-1005SA, G-1010S, G-2050M, G-01100, and G-01758 (manufactured by NOF Corporation, epoxy group-containing polymers), OXT-101, OXT-121, OXT-212, and OXT-221 (manufactured by Toagosei Co., Ltd., oxetanyl group-containing monomers), and OXE-10 and OXE-30 (manufactured by Osaka Organic Chemical Industry Ltd., oxetanyl group-containing monomers).

[0166] The content of the compound having a cyclic ether group in the total solid content of the curable composition is preferably 0.1 to 10% by mass. The upper limit is preferably 5% by mass or less, more preferably 3% by mass or less. The lower limit is preferably 0.25% by mass or more, more preferably 0.5% by mass or more.

[0167] The ratio of the compound having a cyclic ether group to the polymerizable compound is preferably 1 to 400 parts by mass, more preferably 1 to 100 parts by mass, and even more preferably 1 to 50 parts by mass, of the compound having a cyclic ether group relative to 100 parts by mass of the polymerizable compound. The compound having a cyclic ether group may be used alone, or two or more types may be used in combination. When two or more types are used in combination, it is preferable that the total amount thereof is within the above range.

[0168] <<Solvent>> The curable composition of the present invention preferably contains a solvent. Examples of the solvent include organic solvents. The type of solvent is basically not particularly limited as long as it satisfies the solubility of each component and the coatability of the curable composition. Examples of organic solvents include ester-based solvents, ketone-based solvents, alcohol-based solvents, amide-based solvents, ether-based solvents, and hydrocarbon-based solvents. For details of these, please refer to paragraph

[0223] of WO 2015 / 166779, the contents of which are incorporated herein by reference. Furthermore, ester-based solvents substituted with a cyclic alkyl group and ketone-based solvents substituted with a cyclic alkyl group can also be preferably used. Specific examples of organic solvents include polyethylene glycol monomethyl ether, dichloromethane, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, ethyl cellosolve acetate, ethyl lactate, diethylene glycol dimethyl ether, butyl acetate, methyl 3-methoxypropionate, 2-heptanone, 2-pentanone, 3-pentanone, 4-heptanone, cyclohexanone, 2-methylcyclohexanone, 3-methylcyclohexanone, 4-methylcyclohexanone, cycloheptanone, cyclooctanone, cyclohexyl acetate, cyclopentanone, ethyl carbitol acetate, butyl carbitol acetate, propylene glycol monomethyl ether ... Examples of suitable ethylene glycol monomethyl ether acetate include 3-methoxy-N,N-dimethylpropanamide, 3-butoxy-N,N-dimethylpropanamide, propylene glycol diacetate, 3-methoxybutanol, methyl ethyl ketone, gamma butyrolactone, sulfolane, anisole, 1,4-diacetoxybutane, diethylene glycol monoethyl ether acetate, butane-1,3-diyl diacetate, dipropylene glycol methyl ether acetate, diacetone alcohol (also known as diacetone alcohol, 4-hydroxy-4-methyl-2-pentanone), 2-methoxypropyl acetate, 2-methoxy-1-propanol, and isopropyl alcohol.However, it may be preferable to reduce the amount of aromatic hydrocarbons (benzene, toluene, xylene, ethylbenzene, etc.) used as organic solvents for environmental reasons (for example, the amount may be 50 ppm by mass (parts per million) or less, 10 ppm by mass or less, or 1 ppm by mass or less, relative to the total amount of organic solvents).

[0169] The metal content of the organic solvent is preferably low. The metal content of the organic solvent is preferably, for example, 10 parts per billion (ppb) by mass or less. If necessary, an organic solvent with a mass ppt (parts per trillion) level may be used, and such an organic solvent is provided, for example, by Toyo Gosei Co., Ltd. (The Chemical Daily, November 13, 2015).

[0170] Methods for removing impurities such as metals from organic solvents include, for example, distillation (molecular distillation, thin-film distillation, etc.) and filtration using a filter. The pore size of the filter used for filtration is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The filter material is preferably polytetrafluoroethylene, polyethylene, or nylon.

[0171] The organic solvent may contain isomers (compounds with the same number of atoms but different structures). The organic solvent may contain only one type of isomer, or multiple types of isomers. The organic solvent preferably contains 0.8 mmol / L or less of peroxide, and more preferably contains substantially no peroxide.

[0172] The content of the solvent in the curable composition is preferably from 10 to 95% by mass, more preferably from 20 to 90% by mass, and even more preferably from 30 to 90% by mass.

[0173] From the viewpoint of environmental regulations, it is preferable that the curable composition of the present invention is substantially free of environmentally restricted substances. In the present invention, "substantially free of environmentally restricted substances" means that the content of environmentally restricted substances in the curable composition is 50 ppm by mass or less, preferably 30 ppm by mass or less, more preferably 10 ppm by mass or less, and particularly preferably 1 ppm by mass or less. Examples of environmentally restricted substances include benzene; alkylbenzenes such as toluene and xylene; and halogenated benzenes such as chlorobenzene. These substances are registered as environmentally restricted substances under the REACH (Registration Evaluation Authorization and Restriction of Chemicals) regulations, the PRTR (Pollutant Release and Transfer Register) Act, the VOC (Volatile Organic Compounds) regulations, etc., and their usage amounts and handling methods are strictly regulated. These compounds may be used as solvents when producing the components used in the curable composition, and may be mixed into the curable composition as residual solvents. From the viewpoints of human safety and environmental considerations, it is preferable to reduce these substances as much as possible. Examples of methods for reducing environmentally restricted substances include a method in which the system is heated or depressurized to a temperature above the boiling point of the environmentally restricted substance, thereby distilling off the environmentally restricted substance from the system. Furthermore, when distilling off a small amount of environmentally regulated substances, it is useful to perform azeotropy with a solvent having a boiling point equivalent to that of the solvent in question in order to increase efficiency. Furthermore, when a radically polymerizable compound is contained, a polymerization inhibitor or the like may be added prior to distillation under reduced pressure to prevent intermolecular crosslinking due to the progress of a radical polymerization reaction during distillation under reduced pressure. These distillation methods can be used at any stage, such as the stage of raw materials, the stage of a product obtained by reacting the raw materials (e.g., a resin solution or a polyfunctional monomer solution after polymerization), or the stage of a curable composition prepared by mixing these compounds.

[0174] <<Curing Accelerator>> The curable composition of the present invention may contain a curing accelerator. Examples of the curing accelerator include thiol compounds, methylol compounds, amine compounds, phosphonium salt compounds, amidine salt compounds, amide compounds, base generators, isocyanate compounds, alkoxysilane compounds, and onium salt compounds. Specific examples of the curing accelerator include the compounds described in paragraph 0164 of WO 2022 / 085485 and the compounds described in JP 2021-181406 A. The content of the curing accelerator in the total solids content of the curable composition is preferably 0.3 to 8.9% by mass, more preferably 0.8 to 6.4% by mass.

[0175] <<Silane Coupling Agent>> The curable composition of the present invention may contain a silane coupling agent. Examples of the silane coupling agent include silane compounds having a hydrolyzable group, and preferably silane compounds having a hydrolyzable group and other functional groups. The hydrolyzable group refers to a substituent directly bonded to a silicon atom that can form a siloxane bond by at least one of a hydrolysis reaction and a condensation reaction. Examples of the hydrolyzable group include a halogen atom, an alkoxy group, and an acyloxy group, with an alkoxy group being preferred. That is, the silane coupling agent is preferably a compound having an alkoxysilyl group. Examples of functional groups other than the hydrolyzable group include a vinyl group, a (meth)allyl group, a (meth)acryloyl group, a mercapto group, an epoxy group, an oxetanyl group, an amino group, a ureido group, a sulfide group, an isocyanate group, and a phenyl group, with an amino group, a (meth)acryloyl group, and an epoxy group being preferred. Specific examples of the silane coupling agent include the compound described in paragraph 0177 of WO 2022 / 085485 and the compound described in JP 2019-183020 A. The content of the silane coupling agent in the total solid content of the curable composition is preferably 0.01 to 15.0 mass%, more preferably 0.05 to 10.0 mass%. Only one type of silane coupling agent may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is within the above range.

[0176] <<Polymerization Inhibitor>> The curable composition of the present invention may contain a polymerization inhibitor. Examples of polymerization inhibitors include hydroquinone, p-methoxyphenol, di-tert-butyl-p-cresol, pyrogallol, tert-butylcatechol, benzoquinone, 4,4'-thiobis(3-methyl-6-tert-butylphenol), 2,2'-methylenebis(4-methyl-6-t-butylphenol), and N-nitrosophenylhydroxyamine salts (ammonium salts, cerous salts, etc.). Of these, p-methoxyphenol is preferred. The content of the polymerization inhibitor in the total solid content of the curable composition is preferably 0.0001 to 5 mass%. One type of polymerization inhibitor may be used alone, or two or more types may be used. When two or more types are used, the total amount is preferably within the above range.

[0177] <<UV Absorber>> The curable composition of the present invention may contain an UV absorber. Examples of UV absorbers include conjugated diene compounds, aminodiene compounds, salicylate compounds, benzophenone compounds, benzotriazole compounds, acrylonitrile compounds, hydroxyphenyltriazine compounds, indole compounds, triazine compounds, and dibenzoyl compounds. Specific examples of such compounds include the compound described in paragraph 0179 of WO 2022 / 085485, the reactive triazine UV absorber described in JP 2021-178918 A, the UV absorber described in JP 2022-007884 A, the compound described in Korean Patent Publication No. 10-2022-0014454, and the compound described in JP 2023-013321 A can also be used. The content of the UV absorber in the total solids content of the curable composition is preferably 0.01 to 10% by mass, more preferably 0.01 to 5% by mass. In the present invention, the ultraviolet absorber may be used alone or in combination of two or more kinds. When two or more kinds are used, it is preferable that the total amount is in the above range.

[0178] <<Surfactant>> The curable composition of the present invention may contain a surfactant. As the surfactant, various surfactants such as a fluorine-based surfactant, a nonionic surfactant, a cationic surfactant, an anionic surfactant, and a silicone-based surfactant may be used. The surfactant is preferably a silicone-based surfactant or a fluorine-based surfactant, and more preferably a silicone-based surfactant. For details of the surfactant, reference may be made to the surfactants described in paragraphs 0238 to 0245 of WO 2015 / 166779, the contents of which are incorporated herein by reference.

[0179] As the fluorine-based surfactant, compounds described in paragraphs 0167 to 0173 of WO 2022 / 085485 can be used.

[0180] Examples of nonionic surfactants include the compounds described in paragraph 0174 of WO 2022 / 085485.

[0181] Silicone surfactants include DOWSIL SH8400, SH8400 FLUID, FZ-2122, 67 Additive, 74 Additive, M Additive, and SF 8419. OIL (all manufactured by Dow Toray Industries, Inc.), TSF-4300, TSF-4445, TSF-4460, TSF-4452 (all manufactured by Momentive Performance Materials), KP-341, KF-6000, KF-6001, KF-6002, KF-6003 (all manufactured by Shin-Etsu Chemical Co., Ltd.), BYK-307, BYK-322, BYK-323, BYK-330, BYK-333, BYK-3760, BYK-UV3510 (all manufactured by BYK-Chemie). As the silicone surfactant, compounds having the following structure can also be used.

[0182] The content of the surfactant in the total solid content of the curable composition is preferably 0.001% by mass to 5.0% by mass, more preferably 0.005% by mass to 3.0% by mass. The surfactant may be one type or two or more types. When two or more types are used, it is preferable that the total amount is in the above range.

[0183] <<Antioxidant>> The curable composition of the present invention may contain an antioxidant. Examples of the antioxidant include phenolic antioxidants, amine antioxidants, phosphorus-based antioxidants, and sulfur-based antioxidants. Examples of the phenolic antioxidant include hindered phenol compounds. The phenolic antioxidant is preferably a compound having a substituent at the position adjacent to the phenolic hydroxy group (ortho position). The substituent is preferably a substituted or unsubstituted alkyl group having 1 to 22 carbon atoms. The antioxidant is also preferably a compound having a phenol group and a phosphite ester group in the same molecule. Examples of phosphorus-based antioxidants include tris[2-[[2,4,8,10-tetrakis(1,1-dimethylethyl)dibenzo[d,f][1,3,2]dioxaphosphepin-6-yl]oxy]ethyl]amine, tris[2-[(4,6,9,11-tetra-tert-butyldibenzo[d,f][1,3,2]dioxaphosphepin-2-yl)oxy]ethyl]amine, ethyl bis(2,4-di-tert-butyl-6-methylphenyl)phosphite, and tris(2,4-di-tert-butylphenyl)phosphite. Commercially available antioxidants include, for example, ADK STAB AO-20, ADK STAB AO-30, ADK STAB AO-40, ADK STAB AO-50, ADK STAB AO-50F, ADK STAB AO-60, ADK STAB AO-60G, ADK STAB AO-80, ADK STAB AO-330 (manufactured by ADEKA Corporation), and JP-650 (manufactured by Johoku Chemical Industry Co., Ltd.). Antioxidants include the compounds described in paragraphs 0023 to 0048 of Japanese Patent No. 6268967, the compounds described in WO 2017 / 006600, the compounds described in WO 2017 / 164024, and the compounds described in Korean Patent Publication No. 10-2019-0059371. The content of the antioxidant in the total solid content of the curable composition is preferably 0.01 to 20 mass %, more preferably 0.3 to 15 mass %. Only one type of antioxidant may be used, or two or more types may be used. When two or more types are used, it is preferable that the total amount is in the above range.

[0184] <<Other Components>> The curable composition of the present invention may contain, as necessary, a sensitizer, a plasticizer, and other auxiliaries (e.g., conductive particles, fillers, antifoaming agents, flame retardants, leveling agents, release promoters, fragrances, surface tension modifiers, chain transfer agents, etc.). By appropriately incorporating these components, properties such as film properties can be adjusted. As these components, the compounds described in paragraph 0182 of WO 2022 / 085485 can be used.

[0185] The curable composition of the present invention may contain a metal oxide in order to adjust the refractive index of the resulting film. Examples of the metal oxide include TiO ２ , ZrO ２ , Al ２ O ３ , SiO ２ The primary particle size of the metal oxide is preferably 1 to 100 nm, more preferably 3 to 70 nm, and even more preferably 5 to 50 nm. The metal oxide may have a core-shell structure. In this case, the core may be hollow.

[0186] The curable composition of the present invention may contain a light resistance improver. Examples of the light resistance improver include the compounds described in paragraph 0183 of WO 2022 / 085485.

[0187] It is also preferable that the curable composition of the present invention is substantially free of terephthalic acid esters. Here, "substantially free" means that the content of terephthalic acid esters in the total amount of the composition is 1,000 ppb by mass or less, more preferably 100 ppb by mass or less, and particularly preferably zero.

[0188] In view of environmental regulations, the curable composition of the present invention preferably has a melamine content of 10,000 ppm by mass or less.

[0189] The curable composition of the present invention preferably has a free metal content of 100 ppm or less, more preferably 50 ppm or less. The free halogen content is preferably 100 ppm or less, more preferably 50 ppm or less. Methods for reducing the free metals and halogens in the curable composition include washing with ion-exchanged water, filtration, ultrafiltration, and purification with an ion-exchange resin.

[0190] From the viewpoint of environmental regulations, the use of perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts may be restricted. When the content of the above-mentioned compounds in the curable composition of the present invention is reduced, the content of perfluoroalkyl sulfonic acids (particularly perfluoroalkyl sulfonic acids having a perfluoroalkyl group of 6 to 8 carbon atoms) and their salts, and perfluoroalkyl carboxylic acids (particularly perfluoroalkyl carboxylic acids having a perfluoroalkyl group of 6 to 8 carbon atoms) and their salts is preferably in the range of 0.01 ppb to 1,000 ppb, more preferably in the range of 0.05 ppb to 500 ppb, and even more preferably in the range of 0.1 ppb to 300 ppb, relative to the total solids content of the curable composition. The curable composition of the present invention may be substantially free of perfluoroalkyl sulfonic acids and their salts, and perfluoroalkyl carboxylic acids and their salts. For example, by using a compound that can replace perfluoroalkyl sulfonic acid and its salt, and a compound that can replace perfluoroalkyl carboxylic acid and its salt, a curable composition that is substantially free of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt may be selected. Examples of compounds that can replace restricted compounds include compounds that are exempt from restrictions due to differences in the number of carbon atoms in the perfluoroalkyl group. However, the above does not preclude the use of perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt. The curable composition of the present invention may contain perfluoroalkyl sulfonic acid and its salt, and perfluoroalkyl carboxylic acid and its salt, within the maximum allowable range.

[0191] From the viewpoint of environmental regulations, the use of fluorine-containing compounds may be restricted. When the content of the fluorine-containing compound in the curable composition is reduced, the content of the fluorine-containing compound in the curable composition is preferably 5% by mass or less, more preferably 1% by mass or less, and even more preferably 0.1% by mass or less. The curable composition may be substantially free of fluorine-containing compounds.

[0192] <<Storage Container>> The container for storing the curable composition is not particularly limited, and any known container can be used. In addition, the container described in paragraph 0187 of WO 2022 / 085485 can be used as the storage container.

[0193] <Method for producing curable composition> The curable composition of the present invention can be produced by mixing the above-mentioned components. When producing the curable composition, all components may be simultaneously dissolved and / or dispersed in a solvent to produce the curable composition, or, if necessary, each component may be appropriately prepared as two or more solutions or dispersions, which may be mixed at the time of use (application) to produce the curable composition. When preparing the curable composition, it is preferable to filter the curable composition with a filter for purposes such as removing foreign matter and reducing defects. Examples of the type of filter and filtration method used for filtration include the filters and filtration methods described in paragraphs 0196 to 0199 of WO 2022 / 085485.

[0194] <Film> The film of the present invention is a film obtained by curing the above-described curable composition of the present invention. The film of the present invention is preferably a film having luminescence. "Luminescence" refers to the property of emitting light. Luminescence is preferably the property of emitting light upon excitation, and more preferably the property of emitting light upon excitation by excitation light. The wavelength of the excitation light may be, for example, 200 nm or more and 800 nm or less, 250 nm or more and 750 nm or less, or 300 nm or more and 700 nm or less. The film of the present invention can be used in optical filters such as color filters.

[0195] The film thickness of the film of the present invention can be adjusted appropriately depending on the purpose. For example, the film thickness is preferably 0.5 to 10.0 μm. The lower limit is preferably 0.8 μm or more, more preferably 1.0 μm or more, and even more preferably 1.1 μm or more. The upper limit is preferably 7.5 μm or less, more preferably 5.0 μm or less, and even more preferably 2.0 μm or less. The line width (pattern size) of the film is preferably 2.0 to 10.0 μm. The upper limit is preferably 7.5 μm or less, more preferably 5.0 μm or less, and even more preferably 4.0 μm or less. The lower limit is preferably 2.25 μm or more, more preferably 2.5 μm or more, and even more preferably 2.75 μm or more.

[0196] <Color filter> The color filter of the present invention will be described. The color filter of the present invention has the above-described film of the present invention. It is preferable that the film of the present invention is used as a pixel of the color filter. The color filter of the present invention can be used in a solid-state imaging device or a display device.

[0197] In the color filter, the pixel line width (pattern size) is preferably 2.0 to 10.0 μm. The upper limit is preferably 7.5 μm or less, more preferably 5.0 μm or less, and even more preferably 4.0 μm or less. The lower limit is preferably 2.25 μm or more, more preferably 2.5 μm or more, and even more preferably 2.75 μm or more.

[0198] The color filter may have a structure in which each pixel is embedded in a space partitioned by partition walls, for example, in a grid pattern. In this case, it is preferable that the partition walls have a lower refractive index than each pixel. Alternatively, the partition walls may be formed as described in U.S. Patent Application Publication No. 2018 / 0040656.

[0199] The color filter may have a protective layer provided on the surface of the film of the present invention. By providing a protective layer, various functions can be imparted, such as oxygen blocking, low reflectivity, hydrophilicity / hydrophobicity, and blocking of light of specific wavelengths (ultraviolet rays, near-infrared rays, etc.). The thickness of the protective layer is preferably 0.01 to 10 μm, more preferably 0.1 to 5 μm. Methods for forming the protective layer include a method of applying a resin composition dissolved in an organic solvent, a chemical vapor deposition method, and a method of attaching a molded resin with an adhesive. Components constituting the protective layer include (meth)acrylic resin, ene-thiol resin, polycarbonate resin, polyether resin, polyarylate resin, polysulfone resin, polyethersulfone resin, polyphenylene resin, polyarylene ether phosphine oxide resin, polyimide resin, polyamideimide resin, polyolefin resin, cyclic olefin resin, polyester resin, styrene resin, polyol resin, polyvinylidene chloride resin, melamine resin, urethane resin, aramid resin, polyamide resin, alkyd resin, epoxy resin, modified silicone resin, fluororesin, polycarbonate resin, polyacrylonitrile resin, cellulose resin, Si, C, W, and Al. ２ O ３ , Mo, SiO ２ , Si ２ N ４ For example, in the case of a protective layer intended to block oxygen, the protective layer may contain a polyol resin and SiO ２ and Si ２ N ４ In the case of a protective layer intended to reduce reflection, the protective layer preferably contains a (meth)acrylic resin and a fluorine resin.

[0200] When forming a protective layer by applying a resin composition, known methods such as spin coating, casting, screen printing, and inkjet printing can be used as the method for applying the resin composition. Known organic solvents (e.g., propylene glycol 1-monomethyl ether 2-acetate, cyclopentanone, ethyl lactate, etc.) can be used as the organic solvent contained in the resin composition. When forming the protective layer by chemical vapor deposition, known chemical vapor deposition methods (thermal chemical vapor deposition, plasma chemical vapor deposition, photochemical vapor deposition) can be used as the chemical vapor deposition method.

[0201] The protective layer may contain additives such as organic or inorganic fine particles, absorbers for light of specific wavelengths (e.g., ultraviolet light, near-infrared light, etc.), refractive index adjusters, antioxidants, adhesives, and surfactants, as needed. Examples of organic or inorganic fine particles include polymeric fine particles (e.g., silicone resin fine particles, polystyrene fine particles, melamine resin fine particles), titanium oxide, zinc oxide, zirconium oxide, indium oxide, aluminum oxide, titanium nitride, titanium oxynitride, magnesium fluoride, hollow silica, silica, calcium carbonate, and barium sulfate. Known absorbers for light of specific wavelengths can be used. The content of these additives can be adjusted as appropriate, but is preferably 0.1 to 70% by mass, and more preferably 1 to 60% by mass, of the total mass of the protective layer.

[0202] As the protective layer, the protective layers described in paragraphs 0073 to 0092 of JP-A-2017-151176 can also be used.

[0203] <Pixel Manufacturing Method> Next, a pixel manufacturing method using the curable composition of the present invention will be described. The pixel manufacturing method includes the steps of applying the above-described curable composition of the present invention onto a support to form a composition layer, exposing the composition layer patternwise, and developing the exposed composition layer to remove unexposed portions of the composition layer. The pixel manufacturing method preferably further includes a step of exposing the developed composition layer (additional exposure treatment step). By including the additional exposure treatment step, the film becomes more robust and deterioration of the light-emitting properties over time can be further suppressed. Each step will be described in detail below.

[0204] In the step of forming the composition layer, the curable composition is applied onto a support to form the composition layer. Examples of the support include a glass substrate, a polycarbonate substrate, a polyester substrate, an aromatic polyamide substrate, a polyamideimide substrate, and a polyimide substrate. An organic light-emitting layer may be formed on these substrates. An undercoat layer may also be provided on the substrate to improve adhesion with an upper layer, prevent diffusion of substances, or flatten the surface. The surface contact angle of the undercoat layer is preferably 20 to 70° when measured with diiodomethane. Furthermore, it is preferably 30 to 80° when measured with water.

[0205] Known methods can be used as the coating method for the curable composition. For example, a dropping method (drop casting); a slit coating method; a spray method; a roll coating method; a rotary coating method (spin coating); a casting coating method; a slit and spin method; a pre-wetting method (for example, the method described in JP 2009-145395 A); inkjet (for example, on-demand method, piezo method, thermal method), various printing methods such as nozzle jet and other ejection printing, flexographic printing, screen printing, gravure printing, reverse offset printing, metal mask printing; a transfer method using a mold or the like; a nanoimprint method, etc. can also be mentioned. In addition, the coating method described in paragraph 0207 of WO 2022 / 085485 A can also be used.

[0206] The composition layer formed on the support may be dried (prebaked). When prebaking is performed, the prebaking temperature is preferably 80°C or lower, more preferably 70°C or lower, even more preferably 60°C or lower, and particularly preferably 50°C or lower. The lower limit can be, for example, 40°C or higher. The prebaking time is preferably 10 to 3600 seconds. Prebaking can be performed using a hot plate, an oven, or the like.

[0207] Next, the composition layer is exposed to light in a pattern. For example, the composition layer can be exposed to light in a pattern by using a stepper exposure machine, a scanner exposure machine, or the like, through a mask having a predetermined mask pattern. This allows the exposed portion to be cured.

[0208] Examples of radiation (light) that can be used for exposure include g-line and i-line. Light with a wavelength of 300 nm or less (preferably light with a wavelength of 180 to 300 nm) can also be used. Examples of light with a wavelength of 300 nm or less include KrF line (wavelength 248 nm) and ArF line (wavelength 193 nm), with KrF line (wavelength 248 nm) being preferred. Long-wave light sources of 300 nm or more can also be used.

[0209] The exposure may be performed by continuous irradiation with light or by pulsed irradiation (pulse exposure), which is an exposure method in which light is repeatedly irradiated and paused in a short cycle (for example, on the order of milliseconds or less).

[0210] The irradiation amount (exposure amount) is 30 to 2500 mJ / cm ２ The lower limit is preferably 50 mJ / cm ２ It is preferable that the concentration is 100 mJ / cm or more. ２ More preferably, it is 500 mJ / cm or more. ２ More preferably, it is 800 mJ / cm or more. ２ It is even more preferable that the value is 1000 mJ / cm or more. ２ The upper limit is 2000 mJ / cm. ２ Preferably, it is 1500 mJ / cm or less. ２ The exposure illuminance can be appropriately set, for example, to 50 mW / cm or less. ２ ~10 W / cm ２ The lower limit of the exposure illuminance is preferably 500 mW / cm. ２ It is preferable that the power is 800 mW / cm or more. ２ More preferably, it is 1000 mW / cm or more. ２ The upper limit of the exposure illuminance is 10 W / cm or more. ２ It is preferable that the density is 7 W / cm or less. ２ More preferably, it is 5 W / cm or less. ２ It is more preferable that:

[0211] The oxygen concentration during exposure can be appropriately selected. In addition to being performed in the atmosphere, exposure may be performed in a low-oxygen atmosphere with an oxygen concentration of 19% by volume or less (e.g., 15% by volume, 5% by volume, or substantially oxygen-free), or in a high-oxygen atmosphere with an oxygen concentration of more than 21% by volume (e.g., 22% by volume, 30% by volume, or 50% by volume). The oxygen concentration and exposure illuminance may be appropriately combined, for example, at an oxygen concentration of 10% by volume and an illuminance of 1 W / cm. ２ , oxygen concentration 35% by volume, illuminance 2 W / cm ２ etc.

[0212] The composition layer is exposed to light having a wavelength of more than 250 nm and not more than 380 nm at 100 mJ / cm ２ It is preferable to irradiate with the above exposure dose.

[0213] Next, the composition layer after exposure is developed to remove the unexposed portions of the composition layer. The unexposed portions of the composition layer can be removed using a developer. As a result, the unexposed portions of the composition layer are dissolved into the developer, leaving only the photocured portions. The temperature of the developer is preferably, for example, 20 to 30°C. The development time is preferably 20 to 180 seconds. Furthermore, to improve residue removability, the process of shaking off the developer every 60 seconds and then supplying fresh developer may be repeated several times.

[0214] Examples of the developer include organic solvents and alkaline developers, and alkaline developers are preferred. The developer and the washing (rinsing) method after development can be the developer and washing method described in paragraph 0214 of WO 2022 / 085485.

[0215] After development and drying, it is also preferable to carry out additional exposure treatment or heat treatment (post-baking). The additional exposure treatment and post-baking are hardening treatments after development to ensure complete hardening.

[0216] When post-baking is performed, the heating temperature is preferably 150°C or lower. The upper limit of the heating temperature is preferably 120°C or lower, more preferably 100°C or lower. The lower limit of the heating temperature is preferably 50°C or higher, more preferably 75°C or higher. The heating time is preferably 1 minute or longer, more preferably 5 minutes or longer, and even more preferably 10 minutes or longer. There is no particular upper limit, but from the viewpoint of productivity, 20 minutes or shorter is preferable. Post-baking is also preferably performed in an inert gas atmosphere. According to this embodiment, thermal polymerization can proceed with extremely high efficiency without being inhibited by oxygen. Even when pixels are manufactured at a temperature of 150°C or lower throughout the entire process, pixels with good flatness and excellent properties such as moisture resistance can be manufactured. Examples of inert gases include nitrogen gas, argon gas, and helium gas, and nitrogen gas is preferable. The oxygen concentration during post-baking is preferably 100 ppm or lower.

[0217] When additional exposure treatment is performed, the additional exposure treatment is preferably performed by irradiating with light having a wavelength of 254 to 350 nm. In a more preferred embodiment, the step of patternwise exposing the composition layer (exposure before development) is performed by irradiating the composition layer with light having a wavelength of more than 350 nm and not more than 380 nm (preferably light having a wavelength of 355 to 370 nm, more preferably i-line), and the additional exposure treatment (exposure after development) is preferably performed by irradiating the developed composition layer with light having a wavelength of 254 to 350 nm (preferably light having a wavelength of 254 nm). According to this embodiment, the composition layer can be moderately cured by the first exposure (exposure before development), and the entire composition layer can be almost completely cured by the next exposure (exposure after development). As a result, the composition layer can be sufficiently cured even under low temperature conditions, and pixels having excellent properties such as moisture resistance, adhesion, and rectangularity can be formed.

[0218] The exposure after development can be carried out using, for example, an ultraviolet photoresist curing device, which may irradiate light with a wavelength of, for example, 254 to 350 nm as well as other light (for example, i-line).

[0219] Furthermore, the exposure source spectrum when performing additional exposure processing is preferably a continuous spectrum, and more preferably has a spectral distribution different from that of the exposure before development. Examples include the following radiations (a) to (c): (a) radiation having a spectral distribution different from that of the exposure before development, wherein the peak intensity at a wavelength of 313 nm (j-line) is 1 / 6 or more and less than 1 / 3 of that at a wavelength of 365 nm (i-line); (b) radiation having a spectral distribution different from that of the exposure before development, wherein the peak intensity at a wavelength of 313 nm (j-line) is 1 / 3 or more of that at a wavelength of 365 nm (i-line). While there is no particular upper limit for the peak intensity at 313 nm, it is preferably smaller than the peak intensity at 365 nm, and more preferably 3 / 4 or less. (c) Radiation having a different spectral distribution from that of the exposure light before development, including wavelengths of 405 nm (h-line) and 436 nm (g-line), with peak intensities at wavelengths of 313 nm (j-line) and 365 nm (i-line) being ¼ or less, preferably 1 / 10 or less, and more preferably 1 / 20 of the smaller of the peak intensities at wavelengths of 405 nm (h-line) and 436 nm (g-line). The lower limits of the peak intensities at wavelengths of 313 nm (j-line) and 365 nm (i-line) are not particularly limited. In this case, the exposure light before development is preferably radiation including wavelengths of 365 nm (i-line), 405 nm (h-line), and 436 nm (g-line), with the peak intensity at wavelength 313 nm (j-line) being less than ⅙ of the peak intensity at wavelength 365 nm (i-line). Radiation exhibiting such spectral characteristics can be obtained, for example, by using a light source exhibiting the above-mentioned spectral characteristics, or by passing radiation emitted from a high-pressure mercury lamp through an ultraviolet cut filter or bandpass filter.

[0220] The exposure dose after development is 30 to 4000 mJ / cm ２ is preferred, and 50 to 3500 mJ / cm ２The difference in wavelength between the light used for exposure before development and the light used for exposure after development is preferably 200 nm or less, more preferably 100 to 150 nm.

[0221] <Display Device> The display device of the present invention has the film of the present invention described above. The display device preferably has a protective layer adjacent to the film of the present invention. Examples of the protective layer include those described above. Examples of display devices include liquid crystal display devices and organic electroluminescence display devices. The present invention can also be used in display devices having the configurations described in Automotive Technology Vol. 10, No. 4, 2023, pages 19-23. Definitions of display devices and details of each display device are described, for example, in "Electronic Display Devices" (written by Akio Sasaki, published by Kogyo Chosakai Co., Ltd. in 1990) and "Display Devices" (written by Nobuaki Ibuki, published by Sangyo Tosho Co., Ltd. in 1989). Liquid crystal display devices are described, for example, in "Next Generation Liquid Crystal Display Technology" (edited by Tatsuo Uchida, published by Kogyo Chosakai Co., Ltd. in 1994). There are no particular limitations on the liquid crystal display device to which the present invention can be applied, and the present invention can be applied to various types of liquid crystal display devices described in the above-mentioned "Next Generation Liquid Crystal Display Technology."

[0222] The organic electroluminescence display device may be a microdisplay. The diagonal length of the display surface of the microdisplay may be, for example, 4 inches or less, 2 inches or less, 1 inch or less, or 0.2 inches or less. Applications of the microdisplay are not particularly limited, but include electronic viewfinders, smart glasses, and head-mounted displays.

[0223] The organic electroluminescent display device may have a white organic electroluminescent element or a blue organic electroluminescent element as a light source. The organic electroluminescent element preferably has a tandem structure. Tandem structures of organic electroluminescent elements are described in, for example, JP 2003-045676 A and Akiyoshi Mikami, "The Frontline of Organic EL Technology Development - High Brightness, High Precision, Long Life, and Know-How Collection," Technical Information Association, pp. 326-328, 2008. The spectrum of white light emitted by the organic electroluminescent element preferably has strong maximum emission peaks in the blue region (430 nm-485 nm), green region (530 nm-580 nm), and yellow region (580 nm-620 nm). In addition to these emission peaks, an organic electroluminescent element that also has a maximum emission peak in the red region (650 nm-700 nm) is more preferred.

[0224] In an organic electroluminescent display device that combines a color filter and a white organic electroluminescent element to extract light of the three primary colors, transparent pixels may be provided to directly use the white light for emission. This can also increase the brightness of the display device. The organic electroluminescent display device may also have a lens on the color filter. The lens may have various shapes derived from optical system design, such as a convex shape or a concave shape. For example, a concave shape (concave lens) can easily improve the light collection ability. The lens may be in direct contact with the color filter, or another layer, such as an adhesion layer or a planarization layer, may be provided between the lens and the color filter. The lens may also be arranged and used in the manner described in International Publication No. WO 2018 / 135189.

[0225] <Solid-state imaging device> The curable composition of the present invention can also be used for a solid-state imaging device. The configuration of the solid-state imaging device is not particularly limited as long as it functions as a solid-state imaging device, and examples thereof include the following configurations.

[0226] The substrate includes a plurality of photodiodes constituting a light-receiving area of ​​a solid-state imaging device (such as a CCD (charge-coupled device) image sensor or a CMOS (complementary metal-oxide semiconductor) image sensor) and transfer electrodes made of polysilicon or the like. A light-shielding film is formed on the photodiodes and transfer electrodes, with only the light-receiving portions of the photodiodes exposed. A device protection film made of silicon nitride or the like is formed on the light-shielding film so as to cover the entire light-shielding film and the light-receiving portions of the photodiodes. A color filter is also formed on the device protection film. Furthermore, a light-collecting means (e.g., a microlens, etc.; the same applies hereinafter) may be formed on the device protection film below the color filter (on the side closer to the substrate), or on the color filter. Furthermore, the pixels of the color filter may be embedded in spaces partitioned by partitions, for example, in a grid pattern. In this case, the refractive index of the partitions is preferably lower than that of the pixels. Examples of imaging devices having such a structure include those described in Japanese Patent Laid-Open No. 2012-227478, Japanese Patent Laid-Open No. 2014-179577, International Publication No. 2018 / 043654, and U.S. Patent Application Publication No. 2018 / 0040656. Imaging devices equipped with a solid-state imaging element can be used for digital cameras, electronic devices with imaging functions (such as mobile phones), as well as in-vehicle cameras and surveillance cameras.

[0227] The present invention will be explained in more detail below with reference to examples. The materials, amounts used, ratios, processing details, processing procedures, etc. shown in the following examples can be appropriately changed without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

[0228] <Preparation of Curable Composition> The materials shown in the table below were mixed with 0.004 parts by mass of p-methoxyphenol as a polymerization inhibitor and 0.004 parts by mass of a polydimethylsiloxane (hydroxyl value 62 mgKOH / g) modified at both ends with carbinol as a surfactant, and the mixture was stirred and then filtered through a nylon filter (manufactured by Nippon Pall Co., Ltd.) with a pore size of 0.45 μm to prepare a curable composition.

[0229]

[0230] (Perovskite particles) P1: CH having a perovskite structure ５ N ２ PbBr ３ 100 mL of a dispersion containing luminescent particles (Sigma-Aldrich, 905062) was mixed with 200 mL of hexane, and the resulting suspension was centrifuged at 4000 rpm for 1 minute, after which the supernatant was removed to obtain perovskite particles. P2: CsPbI having a perovskite structure ３ 100 mL of a dispersion containing luminescent particles (manufactured by Sigma-Aldrich) was mixed with 200 mL of hexane, and the resulting suspension was centrifuged at 4000 rpm for 1 minute, after which the supernatant was removed to obtain perovskite particles.

[0231] (Photopolymerization initiators) I1: Irgacure OXE01 (manufactured by BASF, oxime compound) I2: Irgacure OXE02 (manufactured by BASF, oxime compound) I3: NCI-831E (manufactured by ADEKA Corporation, oxime compound) I4: TR-PBG-304 (manufactured by TRONLY, oxime compound) O1: Omnirad 2959 (manufactured by IGM Resins B.V., α-hydroxyketone compound) O2: Irgacure 184 (manufactured by BASF, α-hydroxyketone compound) H1: KAYACURE DETX-S (manufactured by Nippon Kayaku Co., Ltd., thioxanthone compound, compound having the following structure)

[0232] (Polymerizable compounds) M1 to M5: compounds having the following structures

[0233] (Resin) B1: 40% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the number attached to the main chain is the number of moles, and the number attached to the side chain is the number of repeating units; weight average molecular weight 24,000, acid value 50.0 mgKOH / g, glass transition temperature −60° C., graft resin having an acid group). B2: 40% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the numerical values ​​attached to the main chain are molar ratios; weight average molecular weight 11,000, acid value 31.5 mg KOH / g, glass transition temperature 45°C, resin having an acid group) B3: 40% by mass propylene glycol monomethyl ether acetate (PGMEA) solution of a resin having the following structure (the numerical values ​​attached to the main chain are molar ratios; weight average molecular weight 14,000, acid value 80.0 mgKOH / g, glass transition temperature 80°C, resin having an acid group)

[0234] (Epoxy compound) E1: an epoxy resin having the following structure (cyclic ether group content: 5.70 mmol / g, weight average molecular weight: 2282, n=15, R=C ６ H １３ O ２ )

[0235] (Solvent) J1: Propylene glycol monomethyl ether acetate (PGMEA)

[0236] <Evaluation of pixel chipping> Each curable composition was applied to a glass substrate by spin coating so that the film thickness after formation would be 2.0 μm. Then, using a hot plate, the composition was heated at 100° C. for 2 minutes. Next, using an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Inc.), 200 mJ / cm ２ The resist was exposed to light through a mask with a 10 μm square dot pattern at an exposure dose of 3000 mJ / cm using a 0.3 mass % aqueous solution of tetramethylammonium hydroxide. Puddle development was then carried out at 23°C for 60 seconds. After that, the resist was rinsed with a spin shower and then washed with pure water. Next, an ultraviolet photoresist curing device (UMA-802-HC-552; manufactured by Ushio Electric Co., Ltd.) was used to cure the resist with 3000 mJ / cm. ２Additional exposure was performed to form pixels. Blue light was irradiated from a commercially available blue light source from behind the glass substrate having pixels, and the presence or absence of light leakage of the blue light was observed using an optical microscope. 5: 100 pixels were checked and there was one or less defective pixel with light leakage. 4: 100 pixels were checked and there was more than one but not more than three defective pixels with light leakage. 3: 100 pixels were checked and there was more than three but not more than five defective pixels with light leakage. 2: 100 pixels were checked and there was more than five but not more than ten defective pixels with light leakage. 1: 100 pixels were checked and there was more than ten defective pixels with light leakage.

[0237]

[0238] As shown in the table above, the examples were able to suppress the occurrence of pixel chipping. A reliability test was performed on the curable compositions of each example using the method described below, and the quantum yield was found to be almost unchanged before and after the reliability test.

[0239] (Reliability Test) Each curable composition was applied to a glass substrate by spin coating so that the film thickness after formation would be 2.0 μm. Then, the substrate was heated at 100° C. for 2 minutes using a hot plate. Next, an i-line stepper exposure system FPA-3000i5+ (manufactured by Canon Inc.) was used to apply 200 mJ / cm ２ Then, the resist was exposed to an ultraviolet light with an exposure dose of 3000 mJ / cm using an ultraviolet photoresist curing device (UMA-802-HC-552; manufactured by Ushio Electric Co., Ltd.). ２ The obtained film was stored at a humidity of 85% and 85° C. for 500 hours, and then a reliability test was performed.

Claims

1. A curable composition comprising perovskite particles, a photoinitiator, a polymerizable compound, and a resin, wherein the photoinitiator contains an oxime compound, and the resin contains a resin having an acid group.

2. The curable composition according to claim 1, wherein the photoinitiator contains an oxime compound and a compound other than the oxime compound.

3. The curable composition according to claim 1 or 2, wherein the resin having an acid group contains a resin having a graft chain.

4. The curable composition according to claim 1 or 2, further comprising a surfactant.

5. The curable composition according to claim 1 or 2, further comprising a compound having a cyclic ether group.

6. A film obtained by curing the curable composition according to claim 1 or 2.

7. A color filter having the film according to claim 6.

8. A display device having the film according to claim 6.

9. The display device according to claim 8, having a protective layer adjacent to the film.

10. A method for manufacturing a pixel, comprising: a step of applying the curable composition according to claim 1 or 2 onto a support to form a composition layer; a step of exposing the composition layer in a pattern; a step of developing the exposed composition layer to remove the unexposed portion of the composition layer; and a step of exposing the developed composition layer.

Images