Antenna and electronic device comprising same

By spacing conductive antennas from molding members using non-conductive segments, the issue of degraded radiation performance due to coupling is resolved, enabling efficient wireless communication in electronic devices with large displays.

WO2025143599A1PCT designated stage expired Publication Date: 2025-07-03SAMSUNG ELECTRONICS CO LTD
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Patent Information

Application Number
PCT/KR2024/019457
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-01-30
Filing Date
2024-12-02
Publication Date
2025-07-03

AI Technical Summary

Technical Problem

The challenge of maintaining antenna radiation performance in electronic devices with large-screen displays is exacerbated by the proximity of molding members and adhesive materials to conductive portions, which can couple and degrade antenna performance.

Method used

The conductive portions used as antennas are physically segmented by non-conductive portions, and the molding member is spaced apart to reduce coupling effects, maintaining radiation performance while allowing for a large-screen display.

Benefits of technology

This configuration enhances antenna radiation performance by minimizing coupling between the conductive portions and molding members, ensuring effective wireless communication without compromising display size.

✦ Generated by Eureka AI based on patent content.

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Abstract

According to various embodiments, an electronic device may comprise: a housing including at least one conductive portion configured to form at least a part of a side surface thereof; a display disposed to be visible from the outside through at least a part of the housing, the display comprising a display panel, an extension portion extending from the display panel while being positioned to correspond to the at least one conductive portion and disposed to be folded onto the back surface of the display, and a display control circuit disposed on the extension portion; a molding member disposed to cover at least a part of the extension portion; and a wireless communication circuit configured to transmit or receive radio signals through the at least one conductive portion. The molding member may be disposed to be spaced apart from the at least one conductive portion.
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Description

Antenna and electronic device including it

[0001] Embodiments of the present disclosure relate to an antenna and an electronic device including the same.

[0002] Electronic devices are becoming increasingly slimmer to meet consumer purchasing demands as the functional gap between manufacturers narrows. These devices are being developed to increase their rigidity, enhance their design, and differentiate their functional elements. Electronic devices may include at least one antenna, among their components, for communication. This at least one antenna may be implemented via a metal bezel (e.g., a side member) that serves as part of the electronic device's housing and needs to be improved to enhance radiation performance.

[0003] The above information may be provided as background art to aid in understanding the present disclosure. No claim or determination is made as to whether any of the above is applicable as prior art related to the present disclosure.

[0004] An electronic device may include at least one housing (e.g., a housing structure) that includes a space for accommodating electronic components. The housing may include a side member that serves as at least a portion of a side of the electronic device. The side member may be formed at least partially of a metallic material (e.g., a conductive member, a conductive portion, or a conductive material) to reinforce the rigidity of the electronic device and / or perform a specific function (e.g., an antenna function), and the remaining portion may be formed of a polymer (e.g., a non-conductive member, a non-conductive portion, or a non-conductive material) combined with the metallic material. For example, the side member may include at least one conductive portion that is physically segmented by at least one non-conductive portion (e.g., a segmented portion). The at least one conductive portion may be electrically connected to a wireless communication circuit of the electronic device, thereby operating as at least one antenna that operates in at least one frequency band.

[0005] Meanwhile, to implement a large-screen display relative to the size of the electronic device, the bezel area needs to be reduced. As part of this method, a method may be considered in which the display includes a molding member arranged to cover the edge (e.g., the edge area) of the display panel, and the molding member extends inward from the side member and is attached to an extension member supporting at least a portion of the display via an adhesive member.

[0006] However, such a layout structure may cause the molding member and / or the leaked adhesive member to be in close proximity to or in contact with the conductive portion used as the antenna, and the molding member and / or the adhesive member may act as a coupling element with the conductive structure of the display (e.g., chip on plastics (COP) or Cu sheet), thereby reducing the radiation performance of the antenna.

[0007] Embodiments of the present disclosure can provide an antenna and an electronic device including the same that can help improve the performance of the antenna.

[0008] Embodiments of the present disclosure can provide an antenna and an electronic device including the same that can help implement a large-screen display while maintaining the performance of the antenna.

[0009] However, the problem to be solved in this disclosure is not limited to the problem mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0010] According to various embodiments, an electronic device includes a housing including at least one conductive portion forming at least a portion of a side surface, a display arranged to be externally visible through at least a portion of the housing, the display including a display panel, an extension portion extending from the display panel at a position corresponding to the at least one conductive portion and arranged to be folded toward a rear surface of the display, and a display control circuit arranged in the extension portion, a molding member arranged to cover at least a portion of the extension portion, and a wireless communication circuit configured to transmit or receive a wireless signal through the at least one conductive portion, wherein the molding member can be arranged to be spaced apart from the at least one conductive portion.

[0011] According to various embodiments, an electronic device includes a housing including at least one conductive portion forming at least a portion of a side surface, a display arranged to be externally visible through at least a portion of the housing, the display including a display panel and a conductive sheet disposed below the display panel, a molding member arranged to cover an edge of the display, and a wireless communication circuit configured to transmit or receive a wireless signal through the at least one conductive portion, wherein the molding member can be arranged to be spaced apart from the at least one conductive portion.

[0012] An electronic device according to exemplary embodiments of the present disclosure has a configuration in which a conductive portion of a side member used as an antenna and a molding member covering an edge of a display are spaced apart by a specific distance, thereby reducing a coupling effect through the molding member or the adhesive member, thereby helping to improve the radiation performance of the antenna.

[0013] In addition, various effects may be provided, either directly or indirectly, through this document.

[0014] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned can be clearly understood by a person having ordinary skill in the art to which the present disclosure belongs from the description below.

[0015] In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

[0016] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0017] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure.

[0018] FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0019] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1 according to various embodiments of the present disclosure.

[0020] FIG. 4 is a configuration diagram of a side member according to various embodiments of the present disclosure.

[0021] FIG. 5A is an exploded perspective view illustrating a laminated structure of a display according to various embodiments of the present disclosure.

[0022] FIG. 5b is a drawing illustrating the back surface of a display according to various embodiments of the present disclosure.

[0023] FIGS. 6A and 6B are schematic diagrams illustrating a process of applying a molding member to a display according to various embodiments of the present disclosure.

[0024] FIG. 7 is a cross-sectional view of a portion of an electronic device taken along line 7-7 of FIG. 2A according to various embodiments of the present disclosure.

[0025] FIG. 8 is a graph comparing the radiation characteristics of an antenna according to the distance between a cutting portion and a molding member according to various embodiments of the present disclosure.

[0026] FIG. 9A is a cross-sectional view of a portion of an electronic device according to various embodiments of the present disclosure.

[0027] FIG. 9b is a cross-sectional view of a portion of an electronic device according to various embodiments of the present disclosure.

[0028] FIG. 10 is a graph comparing the radiation characteristics of an antenna according to the distance between the inner surface of a conductive portion and a molding member according to various embodiments of the present disclosure.

[0029] FIG. 11a is a schematic diagram illustrating the distance arrangement between a conductive portion and a molding member according to various embodiments of the present disclosure.

[0030] FIG. 11b is a diagram showing the current distribution of a conductive portion used as an antenna according to various embodiments of the present disclosure.

[0031] FIG. 11c is a drawing schematically illustrating the distance arrangement between a conductive portion and a molding member according to various embodiments of the present disclosure.

[0032] FIGS. 12A to 12C are schematic drawings illustrating distance arrangements between a conductive portion and a molding member according to various embodiments of the present disclosure.

[0033] FIG. 13 is a drawing illustrating the back surface of a display according to various embodiments of the present disclosure.

[0034] FIGS. 14A to 14D are drawings illustrating the configuration of the molding member of FIG. 13 according to the antenna arrangement according to various embodiments of the present disclosure.

[0035] FIG. 15A is a perspective view of an electronic device according to various embodiments of the present disclosure.

[0036] FIG. 15b is a schematic diagram of an electronic device including conductive parts used as an antenna according to various embodiments of the present disclosure.

[0037] FIG. 15c is a drawing illustrating the back surface of the flexible display of FIG. 15a according to various embodiments of the present disclosure.

[0038] FIG. 16A is a block diagram of an electronic device according to various embodiments of the present disclosure.

[0039] FIG. 16B is a cross-sectional view of an electronic device taken along line 16B-16B of FIG. 16A according to various embodiments of the present disclosure.

[0040] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings so that those skilled in the art can easily implement the present disclosure. However, the present disclosure may be implemented in various different forms and is not limited to the embodiments described herein. In connection with the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and conciseness.

[0041] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0042] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0043] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121). For example, when the electronic device (101) includes the main processor (121) and the auxiliary processor (123), the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0044] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0045] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0046] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0047] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0048] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0049] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0050] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), the sound output module (155), or the electronic device (101) and 450.

[0051] Sound can be output through an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) connected directly or wirelessly.

[0052] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0053] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0054] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0055] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0056] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0057] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0058] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0059] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0060] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0061] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0062] According to various embodiments, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0063] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0064] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0065] FIG. 2A is a perspective view of the front of an electronic device according to various embodiments of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device of FIG. 2A according to various embodiments of the present disclosure.

[0066] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include other embodiments of the electronic device.

[0067] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0068] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) and the rear plate (211) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0069] According to one embodiment, the electronic device (200) may include at least one of a display (400), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0070] The display (400) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (400) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (400) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0071] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used in common for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210). In some embodiments, the electronic device (200) may also include a tray member arranged through at least a portion of the side bezel structure (218).

[0072] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (400) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0073] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0074] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In other embodiments, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in another form, such as a soft key, on the display (400). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (400).

[0075] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In another embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0076] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0077] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (400). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (400). In one embodiment, an area where the display (400) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. In one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. This transparent area may include an area overlapping with the effective area (e.g., field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (400) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (400) facing the sensor module may not require a perforated opening.

[0078] FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a according to various embodiments of the present disclosure.

[0079] Referring to FIG. 3, the electronic device (200) may include a side member (218) (e.g., the side bezel structure (218) of FIGS. 2A and 2B), an extension member (2181a) (e.g., a bracket or a support member), a front plate (202) (e.g., a front cover), a display (400), a substrate (240), a battery (250), a support bracket (260) (e.g., a rear case or a support member), an antenna (270), and a rear plate (211) (e.g., a rear cover). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the extension member (2181a) or the support bracket (260)) or may additionally include other components. At least one of the components of the electronic device (200) may be identical or similar to at least one of the components of the electronic device (200) of FIG. 2a or FIG. 2b, and any overlapping description will be omitted below.

[0080] According to various embodiments, the extension member (2181a) may be disposed inside the electronic device (200) and structurally coupled to the side member (218) or formed integrally with the side member (218). The extension member (2181a) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The extension member (2181a) may have a display (400) coupled to one surface and a substrate (240) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (240). The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0081] The memory may include, for example, volatile memory or non-volatile memory.

[0082] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (200) to an external electronic device, for example, and may include a USB connector, an SD card / MMC (multi-media card) connector, or an audio connector.

[0083] The battery (250) is a device for supplying power to at least one component of the electronic device (200), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (250) may be disposed substantially on the same plane as, for example, the substrate (340). The battery (250) may be integrally disposed within the electronic device (200). In another embodiment, the battery (250) may be disposed so as to be detachable from the electronic device (200).

[0084] Antenna (270) may be positioned between the rear plate (211) and the battery (250). The antenna (270) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (270) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or a combination of the side member (218) and / or the extension member (2181a).

[0085] FIG. 4 is a configuration diagram of a side member according to various embodiments of the present disclosure.

[0086] Referring to FIG. 4, the side member (218) (e.g., the side member (218) of FIG. 2A) may be formed by combining a conductive material (e.g., a metal) and a non-conductive material (e.g., a polymer). In one embodiment, the side member (218) may include an extension member (2181a) that extends at least partially from the side into an interior space of an electronic device (e.g., the electronic device (200) of FIG. 2A). In one embodiment, the side member (218) may be configured such that the side of the electronic device (200) and at least a portion of the extension member (2181a) are formed of a conductive material, and at least a portion of the extension member (2181a) and non-conductive portions (321, 322, 323, 324, 325, 326) to be described below are formed of a non-conductive material. In one embodiment, the side member (218) may include a first side (2181) having a first length, a second side (2182) extending from one end of the first side (2181) in a direction perpendicular to the first side (2181) (e.g., in the y-axis direction) to have a second length, a third side (2183) extending from the second side (2182) substantially parallel to the first side (2181) and having the first length, and a fourth side (2184) extending from the third side (2183) to the other end of the first side (2181) and having the second length, substantially parallel to the second side (2182).

[0087] According to various embodiments, the side member (218) may include conductive portions (310, 311, 312, 313, 314, 315) (e.g., conductive members) arranged to be physically segmented by spaced apart non-conductive portions (321, 322, 323, 324, 325, 326) (e.g., segments or gaps). In one embodiment, the conductive portions (310, 311, 312, 313, 314, 315) form at least a portion of a side surface of the electronic device (200) and may be arranged to be visible from the outside. For example, at least one of the first, second, third, and fourth sides (2181, 2182, 2183, 2184) of the side member (218) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., substrate (340) of FIG. 3) of the electronic device (200) via conductive portions (310, 311, 312, 313, 314, 315), thereby operating in a designated frequency band (e.g., a legacy band in the range of about 600 MHz to 6000 MHz). In one embodiment, the conductive portions (310, 311, 312, 313, 314, 315) can be used as an antenna operating in at least one frequency band of about 600 MHz to 960 MHz low band, about 1700 MHz to 2200 MHz mid band, about 2300 MHz to 2800 MHz high band, about 5 GHz to 6 GHz sub-6 band, about 3.2 GHz to 4.5 GHz UHB band, BT (Bluetooth), GPS (Global Positioning System) or WIFI (Wireless Fidelity).

[0088] According to various embodiments, the non-conductive portions (321, 322, 323, 324, 325, 326) include a first non-conductive portion (321) disposed between the first conductive portion (310) and the sixth conductive portion, a second non-conductive portion (322) disposed between the first conductive portion (310) and the second conductive portion (311), a third non-conductive portion (323) disposed between the second conductive portion (311) and the third conductive portion (312), a fourth non-conductive portion (324) disposed between the third conductive portion (312) and the fourth conductive portion (313), a fifth non-conductive portion (325) disposed between the fourth conductive portion (313) and the fifth conductive portion (314), and a fifth conductive portion (314). A sixth non-conductive portion (326) may be disposed between the sixth conductive portions (315). In one embodiment, the first conductive portion (310) may be disposed on a portion of the first side (2181) via the first non-conductive portion (321) and the second non-conductive portion (322) disposed on the first side (2181). In one embodiment, the second conductive portion (311) may be disposed to extend from a portion of the first side (2181) to a portion of the second side (2182) via the second non-conductive portion (322) and the third non-conductive portion (323) disposed on the second side (2182). In one embodiment, the third conductive portion (312) may be disposed on a portion of the second side (2182) via a third non-conductive portion (323) and a fourth non-conductive portion (324) disposed on the second side (2182). In one embodiment, the fourth conductive portion (313) may be disposed to extend from a portion of the second side (2182) to a portion of the third side (2183) via the fourth non-conductive portion (324) and the fifth non-conductive portion (325) disposed on the third side (2183). In one embodiment, the fifth conductive portion (314) may be arranged to extend from a portion of the third side (2183) to a portion of the fourth side (2184) via the fifth non-conductive portion (325) and the sixth non-conductive portion (326) arranged on the fourth side (2184).In one embodiment, the sixth conductive portion (315) may be arranged to extend from a portion of the fourth side (2184) to a portion of the first side (2181) through the sixth non-conductive portion (326) and the first non-conductive portion (321).

[0089] According to an exemplary embodiment of the present disclosure, edges (e.g., first, second, third, and fourth edges (401, 402, 403, 404) of FIG. 5B) of a display (e.g., display (400) of FIG. 5B) arranged to be supported by side members (218) and / or extension members (2181a) can be arranged to be in proximity to conductive portions (310, 311, 312, 313, 314, 315). In one embodiment, at least one edge of the edges (401, 402, 403, 404) of the display (400) can be covered by a molding member (e.g., molding member (450) of FIG. 5B), and the molding member (450) can be attached to the extension member (2181a) of the side member (218) and an adhesive member (e.g., first adhesive member (481) of FIG. 5B), thereby providing a fixed structure and a waterproof structure of the display (400). In one embodiment, the molding member (450) and the conductive portions (310, 311, 312, 313, 314, 315) used as the antenna are spaced apart from each other by a specific distance or more to reduce coupling between the conductive structure (e.g., bending portion (e.g., COP) and / or conductive sheet (e.g., Cu sheet)) of the display (400) through the molding member (450) and / or the adhesive member (481), thereby helping to reduce degradation of the radiation performance of the antenna.

[0090] FIG. 5A is an exploded perspective view illustrating a laminated structure of a display according to various embodiments of the present disclosure.

[0091] Referring to FIG. 5A, the display (400) may include a polarizing layer (POL; polarizer) (432) (e.g., a polarizing film), a display panel (431), and / or at least one auxiliary material layer (440) sequentially laminated on the back surface of a front plate (202) (e.g., a transparent cover, a front cover, a glass plate, or a cover member) via an adhesive member (e.g., the adhesive members P1, P2, P3, and P4 of FIG. 7). In one embodiment, the adhesive member may include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape. In one embodiment, the display panel (431) and the polarizing layer (432) may be formed integrally. In some embodiments, the display (400) may further include a touch sensor disposed between the front plate (202) and the polarizing layer (432), between the display panel (431) and the polarizing layer (432), or within the display panel (431).

[0092] According to various embodiments, the display panel (431) may include a plurality of pixels and a wiring structure (e.g., an electrode pattern). In one embodiment, the polarizing layer (432) may selectively transmit light generated from a light source of the display panel (431) and vibrating in a certain direction. In one embodiment, the display panel (431) and the polarizing layer (432) may be formed integrally.

[0093] According to various embodiments, at least one auxiliary material layer (440) may include a polymer member (441) sequentially attached to the back surface (-z axis direction) of the display panel (431), at least one functional member (442) disposed on the back surface (-z axis direction) of the polymer member (441), and / or a conductive sheet (443) disposed on the back surface (-z axis direction) of the at least one functional member (442). In one embodiment, the polymer member (441) may include a light-blocking layer (e.g., a black layer) for removing air bubbles that may be generated between the display panel (431) and its underlying attachments and for blocking light generated in the display panel (431) or light incident from the outside, and / or a buffer layer disposed for shock absorption. In one embodiment, at least one functional member (442) may include a heat dissipation sheet (e.g., a graphite sheet) for heat dissipation, a force-touch FPCB, a fingerprint sensor FPCB, a communication antenna radiator, a conductive / non-conductive tape, or an open cell sponge. In one embodiment, the conductive sheet (443) is a metal sheet (e.g., a metal plate) that may help reinforce the rigidity of an electronic device (e.g., the electronic device (200) of FIG. 2A), shield ambient noise, and dissipate heat emitted from surrounding heat-dissipating components. In one embodiment, the conductive sheet (443) may include Cu, Al, Mg, SUS, or CLAD (e.g., a laminated member in which SUS and Al are alternately arranged). In another embodiment, the display (400) may further include a detection member (444) for detecting an input via an electromagnetic induction type electronic pen. In one embodiment, the detection member (444) may include a digitizer. In one embodiment, the detection member (444) may be positioned between the polymer member (441) and the functional member (442). In another embodiment, the detection member (444) may be positioned between the display panel (431) and the polymer member (441).

[0094] FIG. 5b is a drawing illustrating the back surface of a display according to various embodiments of the present disclosure.

[0095] The display (400) according to exemplary embodiments of the present disclosure may include an unbreakable (UB) type OLED display (e.g., a curved display or a flexible display). However, the present invention is not limited thereto, and the display (400) may also include a flat type display of an on-cell touch AMOLED (active matrix organic light-emitting diode) (OCTA) type.

[0096] Referring to FIG. 5B, the display (400) may be formed in a rectangular shape. In one embodiment, the display (400) may include a first edge (401), a second edge (402) extending in a vertical direction from the first edge (401), a third edge (403) extending in a direction parallel to the first edge (401) from the second edge (402), and a fourth edge (404) extending from the third edge (403) to the first edge (401). In one embodiment, the display (400) may be arranged such that the first edge (401) corresponds to a first side (e.g., the first side (2181) of FIG. 4) of a side member (e.g., the side member (218) of FIG. 4), the second edge (402) corresponds to a second side (e.g., the second side (2182) of FIG. 4) of the side member (218), the third edge (403) corresponds to a third side (e.g., the third side (2183) of FIG. 4) of the side member (218), and the fourth edge (404) corresponds to a fourth side (e.g., the fourth side (2184) of FIG. 4) of the side member (218).

[0097] According to various embodiments, the display (400) may include a bending portion (432) arranged in a manner that folds from a display panel (e.g., display panel (431) of FIG. 5A) to at least a portion of a back surface (405) of the display (400) at a first edge (401). In one embodiment, the bending portion (432) may include an extension portion (4321) extending from the display panel (431) and including a control circuit (4321a) (e.g., a display control circuit), and a flexible substrate (4322) electrically connected to the extension portion (4321) and including a plurality of electrical elements (4322a). In one embodiment, the control circuit (4321a) may include a display driver IC (DDI) or a touch display driver IC (TDDI) arranged in the extension portion (4321) having an electrical wiring structure. In one embodiment, the bending portion (432) may include a chip on panel (COP) or chip on plastics (COP) structure in which the control circuit (4321a) is directly disposed on the extension portion (4321). In some embodiments, the bending portion (432) may also include a chip on film (COF) structure in which the control circuit (4321a) is mounted on a separate connecting film (not shown) that connects the extension portion (4321) and the flexible substrate (4322). In one embodiment, the display (400) may include a connector portion (4323) that extends from the flexible substrate (4322) and is electrically connected to a substrate (e.g., substrate 240 of FIG. 3) of an electronic device (e.g., electronic device (200) of FIG. 3). In one embodiment, the plurality of electrical components (4322a) may include passive components such as a touch IC, a flash memory for a display, an ESD prevention diode, a pressure sensor, a fingerprint sensor, or a decap. In some embodiments, the bending portion (432) may extend from any one of the second edge (402), the third edge (403), or the fourth edge (404) of the display.

[0098] According to various embodiments, an electronic device (e.g., the electronic device (200) of FIG. 2A) may include a buffer member (450) (e.g., a molding member, a protective member, a protective layer, a coating layer, a filling member, or a buffer member) arranged to surround at least the bending portion (432) at a first edge (401) of a display (400). In one embodiment, the molding member (450) may be formed in such a way that a molding liquid of a resin material injected through a molding injector is cured. In one embodiment, the cured molding liquid may be a molding member (450) having a specified molding modulus value and may be arranged to protect the bending portion (432). In one embodiment, the molding member (450) may be arranged to cover the bending portion (432) except for the control circuit (4321a). In some embodiments, the molding member (450) may also be arranged to cover up to the control circuit (4321a). In one embodiment, the molding member (450) may have a molding modulus value of about 10 Mpa or more, thereby performing a cushioning function against external impact.

[0099] According to various embodiments, an electronic device (e.g., electronic device (200) of FIG. 2A) may include at least one adhesive member (481, 482, 483, 484) (e.g., at least one waterproof member). In one embodiment, the at least one adhesive member (481, 482, 483, 484) may be arranged to form a closed-loop waterproof space (4801) between a back surface (405) of the display (400) and an extension member (e.g., an extension member (2181a) of FIG. 4) of a side member (e.g., a side member (218) of FIG. 4). In one embodiment, the waterproof space (4801) may protect a control circuit (4321a) arranged in an extension member (4321) of a bending member (4322) and a plurality of electronic components (4322a) arranged in a flexible substrate (4322) from external moisture and / or foreign substances. In one embodiment, at least one adhesive member (481, 482, 483, 484) may include a first adhesive member (481) positioned between the molding member (450) and the extension member (e.g., the extension member (2181a) of FIG. 4), a second adhesive member (482) positioned between the back surface (405) of the display (400) and the extension member (2181a), and third and fourth adhesive members (483, 484) positioned to connect a step structure between opposite ends of the first adhesive member (481) and opposite ends of the second adhesive member (482). In one embodiment, the third and fourth adhesive members (483, 484) may include a cure in place gasket (CIPG) that is injected through a through hole formed in the extension member (2181a) and then cured. In one embodiment, the first, second, third, and fourth adhesive members (481, 482, 483, 484) may include an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat-reactive adhesive, a general adhesive, or a double-sided tape.

[0100] FIGS. 6A and 6B are schematic diagrams illustrating a process of applying a molding member to a display according to various embodiments of the present disclosure.

[0101] Referring to FIGS. 6A and 6B, the display (400) can be fixed in an aligned manner through a molding jig (510). For example, a first edge (401) of the display (400) can be placed between a lower mold (520) and an upper mold (530) in the molding jig (510). In one embodiment, the lower mold (520) and the upper mold (530) can be formed of a silicone material. For example, the upper mold (530) can include an injection port (531) for injecting a molding liquid and an outlet port (532) for discharging an excessively injected molding liquid. According to one embodiment, the injection port (531) and the outlet port (532) can be placed at positions corresponding to both ends of a bending portion (432) in the first edge (401) of the display (400). In one embodiment, when the molding liquid is injected into the injection port (531) of the upper mold (530), the molding liquid fills the space including the bending portion (432) of the display (400) and can be cured into a molding member (450) to cover the bending portion (432) through at least one of natural curing, thermal curing, or ultraviolet curing.

[0102] FIG. 7 is a cross-sectional view of a portion of an electronic device taken along line 7-7 of FIG. 2A according to various embodiments of the present disclosure.

[0103] Referring to FIG. 7, the electronic device (100) may include a display (400) arranged to be supported by an extension member (2181a) extending from a side member (218). In one embodiment, the display (400) may include a polarizing layer (432), a display panel (431), a polymer layer (441), and / or a conductive sheet (443) sequentially arranged on a back surface of a front plate (202). In one embodiment, the polarizing layer (432), the display panel (431), the polymer layer (441), and / or the conductive sheet (443) may be attached to each other via adhesive members (P1, P2, P3, P4) (or an adhesive). In one embodiment, the display (400) may include a bending portion (432) extending from the display panel (431) and arranged in a manner of bending toward the back surface of the display (400). In one embodiment, the bending portion (432) may include a bending portion protection layer (432a) attached to the outer surface.

[0104] According to various embodiments, the bending portion (432) of the display (400) disposed near the first side (2181) of the side member (218) may be disposed to be covered by the molding member (450). In one embodiment, the display (400) may be disposed in such a way that it is attached to the extension member (2181a) by means of a first adhesive member (481) disposed between the molding member (450) and the extension member (2181a). In one embodiment, the first adhesive member (481) may be disposed at a position where it at least partially overlaps the molding member (450) when the display (400) is viewed from above. In one embodiment, the first adhesive member (481) may be disposed at a position where it at least partially overlaps the bending portion (432) when the display (400) is viewed from above. Accordingly, the arrangement structure of the first adhesive member (481) disposed between the molding member (450) and the extension member (2181a) can help reduce the bezel area (e.g., the inactive area or the BM (black matrix) area) of the display (400).

[0105] According to various embodiments, the first side (2181) of the side member (218) may include a first conductive portion (310) used as an antenna (e.g., a conductive portion or antenna radiator). In one embodiment, the first conductive portion (310) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., a substrate (240) of FIG. 3) of the electronic device (200). In one embodiment, the conductive portion (310) used as an antenna is advantageous in exhibiting excellent radiation performance as the distance between the bending portion (432) and the conductive portion (310) at least partially including a conductive material (e.g., a wiring structure or trace) increases. However, the molding member (450) and / or the first adhesive member (481) provided to reduce the bezel area may act as a coupling element between the first conductive portion (310) and the bending portion (432), thereby adversely affecting the radiation performance of the antenna.

[0106] According to an exemplary embodiment of the present disclosure, the first conductive portion (310) may include a cut portion (2185) formed at least partially lower than the inner surface to physically separate the molding member (450) and the first conductive portion (310) by a specific separation distance (d1). In one embodiment, the cut portion (2185) may be formed such that the distance (d1) (e.g., the shortest distance) between the first conductive portion (310) and the molding member (450) is about 0.25 mm or more. In one embodiment, the cut portion (2185) may be arranged so as to at least partially overlap the molding member (450) when the first side (2181) is viewed from the outside (e.g., when viewed in a direction perpendicular to the first side (2181) (y-axis direction). For example, the cutting portion (2185) may be formed to have a length substantially the same as the length of the molding member (450) when the first side (2181) is viewed from the outside. In some embodiments, the cutting portion (2185) may be formed to have a length shorter than the molding member (450). In some embodiments, the cutting portion (2185) may be formed to have a length longer than the molding member (450). In one embodiment, the cutting portion (2185) may have a width substantially the same as a width in a direction perpendicular to the length of the molding member (450) (e.g., in the ±z-axis direction) when the first side (2181) is viewed from the outside. In some embodiments, the cutting portion (2185) may have a width greater than a width in a direction perpendicular to the length of the molding member (450) (e.g., in the ±z-axis direction). In some embodiments, the cutting portion (2185) may have a width smaller than a width in a direction perpendicular to the length of the molding member (450) (e.g., in the ±z-axis direction). For example, the cutting portion (2185) may be formed to have a width of about 1.3 mm or more in a direction perpendicular to the length of the molding member (450) (e.g., in the ±z-axis direction), and a depth from the inner surface (218a) of the first conductive portion (310) may be formed in a range of about 0 mm to 0.5 mm.Accordingly, since the distance (d1) between the inner surface (218a) of the first conductive portion (310) and the molding member (450) is arranged to be relatively farther than the inner surface (218a) where the cutting portion (2185) is not formed, coupling between the first conductive portion (310) and the bending portion (432) by the molding member (450) is reduced, and performance deterioration of the antenna using the first conductive portion (310) can be reduced.

[0107] FIG. 8 is a graph comparing the radiation characteristics of an antenna according to the distance between a cutting portion and a molding member according to various embodiments of the present disclosure.

[0108] Referring to FIG. 8, it can be confirmed that the frequency band of the antenna using the first conductive portion (310) is about 60 MHz lower than the target frequency band when the molding member (450) is attached to the extension member (2181a) via the first adhesive member (481) without forming the cutting portion (2185) in the first conductive portion (310) (e.g., graph 801), which is expressed only by the first conductive portion (310) when the molding member (450) and the first adhesive member (481) are not arranged. This may mean that the molding member (450) and / or the first adhesive member (481) arranged between the bending portion (432) of the display (450) and the first conductive portion (310) act as a coupling element and affect the antenna.

[0109] According to an exemplary embodiment of the present disclosure, when the first conductive portion (310) includes a cutting portion (2185) formed at a position corresponding to the molding member (450), and the first conductive portion (310) is physically spaced apart from the molding member (450) by a specific distance or more (e.g., about 0.25 mm or more) (e.g., graph 802), it can be confirmed that when the molding member (450) and the first adhesive member (481) are not arranged, the frequency band is high-shifted compared to the frequency band in the case where the molding member (450) is attached to the extension member (2181a) via the first adhesive member (481) (e.g., graph 801) and is expressed only by the first conductive portion (310) (e.g., graph 803). This may mean that when the distance between the molding member (450) and / or the first adhesive member (481) and the bending member (432) is physically increased through the cutting member (2185), the radiation performance of the antenna through the first conductive portion (310) is improved.

[0110] FIG. 9A is a cross-sectional view of a portion of an electronic device according to various embodiments of the present disclosure.

[0111] In describing the electronic device (200) of FIG. 9a, the same symbols are given to components that are substantially the same as those of the electronic device (200) of FIG. 7, and a detailed description thereof may be omitted.

[0112] Referring to FIG. 9A, the first conductive portion (310) may be used as at least a portion of the side member (218) of the electronic device (200). In one embodiment, if a cutting portion (e.g., the cutting portion (2185) of FIG. 7) is formed in the side member (218), it may place restrictions on the rigidity design of the electronic device (200). Therefore, the molding member (450) according to an exemplary embodiment of the present disclosure may be designed in consideration of the distance (d2) between the inner surface (218a) of the first conductive portion (310) and the first conductive portion (310). For example, the distance (d2) between the molding member (450) and the inner surface of the first conductive portion (310) may be designed to be about 0.25 mm or more. In one embodiment, the molding member (450) may be formed in various shapes, such as having an incline or having a partially different distance from the inner surface (218a) of the first conductive portion (310). In this case, the distance (d2) between the molding member (450) and the inner surface (218a) of the first conductive portion (310) can be set based on the shortest distance between the molding member (450) and the inner surface (218a) of the first conductive portion (310).

[0113] FIG. 9b is a cross-sectional view of a portion of an electronic device according to various embodiments of the present disclosure.

[0114] In describing the electronic device (200) of FIG. 9b, the same symbols are given to components that are substantially the same as those of the electronic device (200) of FIG. 9a, and a detailed description thereof may be omitted.

[0115] Referring to FIG. 9B, the molding member (450) may be configured such that the surface corresponding to the inner surface (218a) of the side member (218) is formed as an inclined surface (450-1). In some embodiments, the molding member (450) may be formed such that the surface corresponding to the inner surface (218a) of the side member (218) is formed as a surface of various shapes (e.g., a curved surface or an uneven surface). In this case, the distance between the molding member (450) and the inner surface (218a) of the first conductive portion (310), which is set to improve the radiation performance of the antenna, may be set based on the shortest distance between the molding member (450) and the inner surface (218a) of the first conductive portion (310).

[0116] Although not shown, the molding member (450) of FIG. 7 may also be formed into an inclined surface and / or various shapes. In this case, the distance between the molding member (450) set to improve antenna radiation performance and the cutting portion (2185) formed on the inner surface (218a) of the first conductive portion (310) may be set based on the shortest distance between the molding member (450) and the cutting portion (2185).

[0117] FIG. 10 is a graph comparing the radiation characteristics of an antenna according to the distance between the inner surface of a conductive portion and a molding member according to various embodiments of the present disclosure.

[0118] Referring to FIG. 10, it can be confirmed that the frequency band of the antenna using the first conductive portion (310) is about 70 MHz lower than the target frequency band expressed only by the first conductive portion (310) when the molding member (450) is positioned close to the first conductive portion (e.g., graph 1001) without considering the distance between the first conductive portion (310) and the molding member (450) and the first adhesive member (481) is not positioned (e.g., graph 1003). This may mean that the molding member (450) and / or the first adhesive member (481) positioned close to the first conductive portion (310) of the display (450) act as a coupling element and affect the antenna.

[0119] According to an exemplary embodiment of the present disclosure, when the molding member (450) is set to be physically spaced apart from the inner surface of the first conductive portion (310) by a specific distance or more (e.g., about 0.25 mm or more) (e.g., graph 1002), it can be seen that the frequency is shifted closer to the target frequency by about 50 MHz higher than the frequency band when the molding member (450) is placed close to the first conductive portion (310) and acts as a coupling element (e.g., graph 1001). This may mean that when the separation distance of the molding member (450) from the first conductive portion (310) is set to be spaced apart by a specific distance or more, the radiation performance of the antenna through the first conductive portion (310) is improved.

[0120] FIG. 11a is a schematic diagram illustrating the distance arrangement between a conductive portion and a molding member according to various embodiments of the present disclosure. FIG. 11b is a diagram illustrating the current distribution of a conductive portion used as an antenna according to various embodiments of the present disclosure.

[0121] Referring to FIGS. 11A and 11B , the electronic device (200) may include a first conductive portion (310) disposed on a first side surface (2181) of a side member (218). In one embodiment, the first conductive portion (310) may be disposed to be segmented through a first non-conductive portion (321) and a second non-conductive portion (322) that are spaced apart from the first side surface (2181). In one embodiment, the first conductive portion (310) may be electrically connected to a wireless communication circuit (e.g., a power supply unit) (e.g., a wireless communication module (192) of FIG. 1) disposed on a substrate (e.g., substrate (240) of FIG. 3) of the electronic device (200) to operate as an antenna. In one embodiment, the first conductive portion (310) can be powered near the first non-conductive portion (321) or near the second non-conductive portion (322).

[0122] According to various embodiments, the electronic device (200) may include a display (400). In one embodiment, the display (400) may include a bending portion (432) including an extension portion (4321) extending from a display panel (e.g., display panel (431) of FIG. 7) and a flexible substrate (4322) electrically connected to the extension portion (4321). In one embodiment, the bending portion (432) may be extended outwardly from the display (400) and then bent, and may be attached to a back surface of the display (400). In one embodiment, the display (400) may be attached to at least a portion of a side member (218) (e.g., an extension member (2181a) of FIG. 7) via a molding member (450) arranged to cover the bending portion (432). In this case, the bending portion (432) and the molding member (450) can be positioned close to the first conductive portion (310) of the first side (2181).

[0123] According to various embodiments, the first conductive portion (310) used as an antenna may include an inwardly recessed cutting portion (2185) to reduce coupling phenomenon with the bending portion (432) through the molding member (450). In one embodiment, the cutting portion (2185) may be formed on a part of the first conductive portion (310) with a length shorter than the length of the bending portion (432), thereby being advantageous in reinforcing the rigidity of the side member (218).

[0124] According to various embodiments, the first conductive portion (310) may include a first portion (310a) having a first separation distance from the molding member (450) and a second portion (310b) arranged to have a second separation distance greater than the first separation distance from the molding member (450) through a cutting portion (2185). In one embodiment, the second portion (310b) in which the cutting portion (2185) is arranged may be formed at a designated length at the center of the first conductive portion (310). For example, the length and arrangement position of the cutting portion (2185) may be formed at a position corresponding to a position in which the current density of the conductive portion (310) is the highest, as illustrated in FIG. 11B. Accordingly, when the first conductive portion (310) operates as an antenna, the distance between the first conductive portion (310) and the molding member (450) is increased through the cutting portion (2185) positioned at the position with the highest current density, thereby reducing the coupling effect with the bending portion (432) through the molding member (450), thereby helping to reduce performance deterioration of the antenna. In addition, even when corresponding to the bending portion (432), the portion other than the portion with the high current density of the first conductive portion (310) maintains its original thickness, thereby helping to reinforce the rigidity of the electronic device (200).

[0125] FIG. 11c is a drawing schematically illustrating the distance arrangement between a conductive portion and a molding member according to various embodiments of the present disclosure.

[0126] In describing the electronic device (200) of FIG. 11c, the same symbols are given to components that are substantially the same as those of the electronic device (200) of FIG. 11a, and a detailed description thereof may be omitted.

[0127] Referring to FIG. 11c, the first conductive portion (310) may include a cutting portion (2185) formed in a second portion (310b) having a relatively high current density. In one embodiment, the cutting portion (2185) may include a first cutting portion (2185a) and a second cutting portion (2185b) spaced apart from the first cutting portion (2185a). In one embodiment, a portion (310c) between the first cutting portion (2185a) and the second cutting portion (2185b) spaced apart from the second portion (310b) may be formed with an original thickness of the side member (218) substantially the same as that of the first portion (310a), thereby helping to reinforce the rigidity of the side member (218). In some embodiments, the cutting portion (2185) may be divided into three or more cutting portions spaced apart at a specific interval in the second portion (310b). In some embodiments, the cutting portion (2185) may be divided into multiple cutting portions through the first portion (310a) and the second portion (310b) corresponding to the entire length of the first conductive portion (310).

[0128] FIGS. 12A to 12C are schematic drawings illustrating distance arrangements between a conductive portion and a molding member according to various embodiments of the present disclosure.

[0129] In describing the electronic device (200) of FIGS. 12a to 12c, the same reference numerals are given to components that are substantially the same as those of the electronic device (200) of FIG. 11a, and a detailed description thereof may be omitted.

[0130] Referring to FIG. 12A, the molding member (450) may include a third part (450a) having a first separation distance from the first conductive part (310) and a fourth part (450b) arranged to have a second separation distance greater than the first separation distance from the first conductive part (310). In one embodiment, the fourth part (450b) may be arranged at a position corresponding to a position having a relatively high current density of the first conductive part (310). In one embodiment, the fourth part (450b) of the molding member (450) may be formed to have a relatively large separation distance from the first conductive part (310) and may include a removal portion (451) in which a portion of the molding member (450) is removed or omitted. Accordingly, when the first conductive portion (310) operates as an antenna, the distance between the first conductive portion (310) and the molding member (450) is increased through the removal portion (451) positioned at the corresponding position of the molding member (450) corresponding to the relatively high current density position of the first conductive portion (310), thereby reducing the coupling effect with the bending portion (432) through the molding member (450), thereby helping to reduce performance degradation of the antenna. In addition, even when corresponding to the bending portion (432), the corresponding area of ​​the molding member (450) other than the portion having the high current density of the first conductive portion (310) maintains the original thickness, thereby strengthening the adhesive force between the display (400) and the extension member (e.g., the extension member (2181a) of FIG. 7) and helping to protect the bending portion (432).

[0131] Referring to FIG. 12b, the molding member (450) may include a removal portion (451) formed in an area corresponding to a fourth portion (450b) corresponding to an area of ​​the first conductive portion (310) having a relatively high current density. In one embodiment, the removal portion (451) may include a first removal portion (451a) and a second removal portion (451b) spaced apart from the first removal portion (451a). In one embodiment, in the fourth portion (450b), a portion (450c) between the spaced apart first removal portion (451a) and second removal portion (451b) is formed to have substantially the same original thickness as the third portion (450a), thereby helping to protect the bending portion (432) and strengthen the adhesive strength. In some embodiments, the removal portion (451) may be divided into three or more removal portions spaced apart at specific intervals in the fourth portion (450b). In some embodiments, the removal portion (451) may be divided into a plurality of cutting portions through the third portion (450a) and the fourth portion (450b) corresponding to the entire length of the molding member (450).

[0132] Referring to FIG. 12C, the electronic device (200) may include a cutting portion (2185) formed in a second portion (e.g., the second portion (310b) of FIG. 11C) having a relatively high current density of the first conductive portion (310) and a removal portion (451) formed in a fourth portion (e.g., the fourth portion (450b) of FIG. 12B) of the molding member (450) corresponding to the second portion (310b). In one embodiment, the facing arrangement of the cutting portion (2185) and the removal portion (451) may help reduce performance degradation of the antenna by increasing the distance between the first conductive portion (310) and the molding member (450) when the first conductive portion (310) is operated as an antenna, thereby reducing the coupling effect with the bending portion (432) through the molding member (450). In some embodiments, the cutting portion (2185) may be divided into at least two cutting portions (2185a, 2185b), as illustrated in FIG. 11c, and / or the removal portion (451) may be divided into at least two removal portions (451a, 451b), as illustrated in FIG. 12b.

[0133] FIG. 13 is a drawing illustrating the back surface of a display according to various embodiments of the present disclosure.

[0134] In describing the display (400) of FIG. 13, the same symbols are given to components that are substantially the same as the display (400) of FIG. 5b, and a detailed description thereof may be omitted.

[0135] Referring to FIG. 13, the display (400) may include a molding member (452) positioned along edges (401, 402, 403, 404) of the display (400). In one embodiment, the molding member (452) may be positioned to cover a fourth edge (404) from the first edge (401) through the second and third edges (402, 403), and may form a closed-loop waterproof space (4801). In one embodiment, the display (400) may include an adhesive member (485) in a closed-loop shape attached along the molding member (452). In one embodiment, the display (400) may be positioned in such a manner that it is supported and attached to the extension member (2181a) by means of an adhesive member (485) positioned between the extension member (e.g., the extension member (2181a) of FIG. 3) of the electronic device (e.g., the electronic device (200) of FIG. 3) and the molding member (452).

[0136] FIGS. 14A to 14D are drawings illustrating the configuration of the molding member of FIG. 13 according to the antenna arrangement according to various embodiments of the present disclosure.

[0137] According to various embodiments, the molding member (452) arranged in a closed loop shape along the edges (401, 402, 403, 404) of the display (400) illustrated in FIG. 13 includes removal parts that are at least partially removed or omitted according to the arrangement structure of the conductive parts (e.g., the conductive parts (310, 311, 312, 313, 314, 315) of FIG. 4) and / or the non-conductive parts (e.g., the non-conductive parts (321, 322, 323, 324, 325, 326, 327) of FIG. 4) of the side member (e.g., the side member (218) of FIG. 4) used as an antenna. The separation distance between the antenna (some of 314, 315) and the conductive structure (e.g., the bending portion (e.g., the bending portion (432) of FIG. 7) and / or the conductive sheet (e.g., the conductive sheet (443) of FIG. 7)) of the display (400) can be increased to reduce the deterioration of the radiation performance of the antenna.

[0138] Referring to FIG. 14a, the molding member (452) is disposed in an area at least partially corresponding to a first conductive portion (e.g., a first conductive portion (310) of FIG. 4) disposed on a first side (e.g., a first side (2181) of FIG. 4) of a side member (e.g., a side member (218) of FIG. 4) near a first edge (401) of the display (400) and a second removal portion (4521a) (e.g., a removal portion (451) of FIG. 12a) and a fourth conductive portion (e.g., a third conductive portion (313) of FIG. 4) disposed on a third side (e.g., a third side (2183) of FIG. 4) of the side member (e.g., a side member (218) of FIG. 4)) near a first edge (401) of the display (400). A removal part (451) may be included. In one embodiment, the first removal part (4521a) and the second removal part (4521b) may be arranged in corresponding areas of the molding member (452) corresponding to the parts having relatively high current densities of the first conductive part (310) and the fourth conductive part (313) used as an antenna.

[0139] Referring to FIG. 14b, the molding member (452) is disposed near the first edge (401) of the display (400), in an area at least partially corresponding to the first conductive portion (e.g., the first conductive portion (310) of FIG. 4) disposed on the first side (e.g., the first side (2181) of FIG. 4) of the side member (e.g., the side member (218) of FIG. 4), the first removal portion (4522a) (e.g., the removal portion (451) of FIG. 12a), and the fourth conductive portion (e.g., the third conductive portion (313) of FIG. 4) and the fifth conductive portion (e.g., the fifth conductive portion (314) of FIG. 4) disposed on the third side (e.g., the third side (2183) of FIG. 4) of the side member (e.g., the side member (218) of FIG. 4). A second removal portion (4522b) may be disposed (e.g., removal portion (451) of FIG. 12a). In one embodiment, the first removal portion (4522a) and the second removal portion (4522b) may be disposed in corresponding regions of the molding member (452) corresponding to portions having relatively high current densities of the first conductive portion (310), the fourth conductive portion (313), and the fifth conductive portion (314) used as an antenna.

[0140] Referring to FIG. 14c, the molding member (452) may include a first removal portion (4523a), a second removal portion (4523b), a third removal portion (4523c), a fourth removal portion (4523d), a fifth removal portion (4523e), and / or a sixth removal portion (4523f) arranged in areas corresponding to non-conductive portions (e.g., first, second, third, fourth, fifth, and sixth non-conductive portions (321, 322, 323, 324, 325, and 326) of the side member (e.g., the side member (218) of FIG. 4). In one embodiment, the first, second, third, fourth, fifth, and sixth removal portions (4523a, 4523b, 4523c, 4523d, 4523e, 4523f) (e.g., the removal portion (451) of FIG. 12a) may be arranged in corresponding regions of the molding member (452) corresponding to portions having relatively high current densities of conductive portions (e.g., the first, second, third, fourth, fifth, and sixth conductive portions (310, 311, 312, 313, 314, 315, 316) of FIG. 4) of a side member (e.g., the side member (218) of FIG. 4) used as an antenna.

[0141] Referring to FIG. 14d, the molding member (452) is disposed in an area at least partially corresponding to a first removal portion (4524a) (e.g., removal portion (451) of FIG. 12a) and / or a second conductive portion (e.g., second conductive portion (311) of FIG. 4) disposed in a corner portion connecting a first side (e.g., first side (2181) of FIG. 4) of a side member (e.g., side member (218) of FIG. 4) to a part of a second side (e.g., second side (2182) of FIG. 4)) of a side member (e.g., side member (218) of FIG. 4) and / or a third side (e.g., third side (2183) of FIG. 4) of a side member (e.g., side member (218) of FIG. 4) to a fourth side (e.g., side member (218) of FIG. 4)) of the side member. The second removal portion (4524b) (e.g., the removal portion (451) of FIG. 12a) may be disposed in an area at least partially corresponding to a fifth conductive portion (e.g., the fifth conductive portion (314) of FIG. 4) disposed in a corner portion connected to a portion of the fourth side (2184)). In one embodiment, the first removal portion (4524a) and the second removal portion (4524b) may be disposed in corresponding areas of the molding member (452) corresponding to portions of the second conductive portion (312) and the fifth conductive portion (314) used as an antenna, which have relatively high current densities.

[0142] FIG. 15A is a perspective view of an electronic device according to various embodiments of the present disclosure. FIG. 15B is a schematic diagram of an electronic device including conductive parts used as an antenna according to various embodiments of the present disclosure.

[0143] The electronic device (700) of FIG. 15a may be at least partially similar to the electronic device (100) of FIG. 1, or may further include other embodiments of the electronic device.

[0144] Referring to FIGS. 15A and 15B, the electronic device (700) may include a first housing (710) and a second housing (720) that is foldably coupled to the first housing (710) via a hinge device (730). In one embodiment, the electronic device (700) may include a flexible display (600) that is arranged to be supported by the first housing (710) and the second housing (720) and that bends together according to a folding operation. In one embodiment, the first housing (710) may include a first side member (710a) including a first side surface (711), a second side surface (712) extending vertically from one end of the first side surface (711), and a third side surface (713) extending vertically from the other end of the first side surface (711) and being parallel to the second side surface (712). In one embodiment, the second housing (720) may include a second side member (720a) including a fourth side surface (721), a fifth side surface (722) extending vertically from one end of the fourth side surface (721) and being disposed colinear with the second side surface (712), and a sixth side surface (723) extending vertically from the other end of the fourth side surface (721) and being disposed colinear with the third side surface (713). In one embodiment, at least a portion of the first side member (710a) and the second side member (720a) may be formed of a conductive material (e.g., a metal material).

[0145] According to various embodiments, the first housing (710) may include a first conductive portion (741) disposed on a portion of the first side (711) of the first side member (710a), a second conductive portion (742) disposed on a portion of the first side (711) and a portion of the second side (712), a third conductive portion (743) disposed on a portion of the second side (712), a fourth conductive portion (744) disposed on a portion of the second side (712), a fifth conductive portion (745) disposed on a portion of the first side (711) and a portion of the third side (713), a sixth conductive portion (746) disposed on a portion of the third side (713), and / or a seventh conductive portion (747) disposed on a portion of the third side (713). In one embodiment, the first housing (710) may include a first segment (751) positioned between the first conductive portion (741) and the second conductive portion (742), a second segment (752) positioned between the first conductive portion (741) and the fifth conductive portion (745), a third segment (753) positioned between the second conductive portion (742) and the third conductive portion (743), a fourth segment (754) positioned between the third conductive portion (743) and the fourth conductive portion (744), a fifth segment (755) positioned between the fifth conductive portion (745) and the sixth conductive portion (746), and / or a sixth segment (756) positioned between the sixth conductive portion (746) and the seventh conductive portion (747).

[0146] According to various embodiments, the second housing (720) may include an eighth conductive portion (761) disposed on a portion of the fourth side (721) of the second side member (720a), a ninth conductive portion (762) disposed on a portion of the fourth side (721) and a portion of the fifth side (722), a tenth conductive portion (763) disposed on a portion of the fifth side (722), a eleventh conductive portion (764) disposed on a portion of the fifth side (722), a twelfth conductive portion (765) disposed on a portion of the fourth side (721) and a portion of the sixth side (723), a thirteenth conductive portion (766) disposed on a portion of the sixth side (723), and / or a fourteenth conductive portion (767) disposed on a portion of the sixth side (723). In one embodiment, the second housing (720) may include a seventh segment (771) positioned between the eighth conductive portion (761) and the ninth conductive portion (762), an eighth segment (772) positioned between the eighth conductive portion (761) and the twelfth conductive portion (765), a ninth segment (773) positioned between the ninth conductive portion (762) and the tenth conductive portion (763), a tenth segment (774) positioned between the tenth conductive portion (763) and the eleventh conductive portion (764), an eleventh segment (775) positioned between the twelfth conductive portion (765) and the thirteenth conductive portion (766), and / or a twelfth segment (776) positioned between the thirteenth conductive portion (766) and the fourteenth conductive portion (767). In one embodiment, the first segment (751), the second segment (752), the third segment (753), the fourth segment (754), the fifth segment (755), and the sixth segment (756) formed in the first housing (710) may be formed at positions corresponding to the seventh segment (771), the eighth segment (772), the ninth segment (773), the tenth segment (774), the eleventh segment (775), and the twelfth segment (776) formed in the second housing (720) when the electronic device (700) is in a folded state.

[0147] According to various embodiments, at least one conductive portion among the plurality of conductive portions (741, 742, 743, 744, 745, 746, 747) disposed in the first housing and at least one conductive portion among the plurality of conductive portions (761, 762, 763, 764, 765, 766, 767) disposed in the second housing may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed in the electronic device (700), thereby operating as an antenna.

[0148] FIG. 15c is a drawing illustrating the back surface of the flexible display of FIG. 15a according to various embodiments of the present disclosure.

[0149] Referring to FIG. 15c, the flexible display (600) may include a first edge (601), a second edge (602) extending in a vertical direction from the first edge (601), a third edge (603) extending in a parallel direction from the second edge (602) to the first edge (601), and a fourth edge (604) extending from the third edge (603) to the first edge (601). In one embodiment, the first edge (601) may be positioned corresponding to a fourth side (e.g., the fourth side (721) of FIG. 15a) of a second housing (e.g., the second housing (720) of FIG. 15a). In one embodiment, the second edge (602) may be positioned at a position corresponding to a second side (e.g., a second side (712) of FIG. 15A) of the first housing (e.g., a first housing (710) of FIG. 15A) and a fifth side (e.g., a fifth side (722) of FIG. 15A) of the second housing (e.g., a second housing (720) of FIG. 15A). In one embodiment, the third edge (603) may be positioned at a position corresponding to a first side (e.g., a first side (711) of FIG. 15A) of the first housing (e.g., a first housing (710) of FIG. 15A). In one embodiment, the fourth edge (604) may be positioned at a third side (e.g., a first housing (710) of FIG. 15A) of the first housing (e.g., a first housing (710) of FIG. 15A). It can be positioned at a position corresponding to the third side (713)) and the sixth side (e.g., the sixth side (723) of FIG. 15a) of the second housing (e.g., the second housing (720) of FIG. 15a).

[0150] According to various embodiments, the flexible display (600) may include a bending portion (632) arranged in a manner that folds from a display panel (not shown) to at least a portion of a back surface (e.g., in the -z-axis direction) of the flexible display (600) at a first edge (601). In one embodiment, the bending portion (632) may include an extension portion (6321) extending from the display panel and including a control circuit (6321a), and a flexible substrate (6322) electrically connected to the extension portion (6321) and including a plurality of electrical elements (6322a). In one embodiment, the flexible display (600) may include an FPCB connection portion (6323) (e.g., a connector portion) extending from the flexible substrate (6322) and electrically connected to a substrate of an electronic device (e.g., an electronic device (700) of FIG. 15A).

[0151] According to various embodiments, the flexible display (600) may include a molding member (650) arranged to cover at least a portion of the bending portion (632) at the first edge (601). In one embodiment, the molding member (650) may be arranged to be close to the fourth side (721) of the second housing (720). In one embodiment, the electronic device (700) may include a first adhesive member (681) arranged between the molding member (650) and the second side member (720a), a second adhesive member (682) arranged to surround the control circuit (6321a) in the second housing (720), and third and fourth adhesive members (683, 684) (e.g., CIPG) connecting both ends of the second adhesive member (682) to both ends of the first adhesive member (681).

[0152] According to various embodiments, the eighth conductive portion (e.g., the eighth conductive portion (761) of FIG. 15b) disposed on the fourth side (e.g., the fourth side (721) of FIG. 15a) and used as an antenna may be arranged to be coupled with the bending portion (632) via the molding member (650) and / or the first adhesive member (681), thereby deteriorating the radiation performance.

[0153] According to exemplary embodiments of the present disclosure, the eighth conductive portion (761) used as an antenna can help reduce the deterioration of the radiation performance of the antenna by increasing the separation distance between the eighth conductive portion (761) and the molding member (650) through a cutting portion (e.g., cutting portion (2185) of FIG. 7) formed on the inner surface of the eighth conductive portion (761) of the fourth side (721) and / or a removal portion (e.g., removal portion (451) of FIG. 12a) of the molding member (650). For example, the spacing structure between the molding member (650) and the eighth conductive portion (761) according to an embodiment of the present disclosure and / or the spacing structure of the molding member (650) arranged along at least a portion of an edge of the flexible display (600) and a plurality of conductive portions (e.g., conductive portions (741, 742, 743, 744, 745, 746, 761, 762, 763, 764, 765, 766, 767) of FIG. 15b) may be substantially the same as the spacing structure of the molding member (450, 451, 452) and conductive portions (e.g., conductive portions (310, 311, 312, 313, 314, 315) of FIG. 4) of FIG. 5a to FIG. 14d described above.

[0154] FIG. 16A is a schematic diagram of an electronic device according to various embodiments of the present disclosure. FIG. 16B is a cross-sectional view of the electronic device taken along line 16B-16B of FIG. 16A according to various embodiments of the present disclosure.

[0155] The electronic device (800) of FIGS. 16A and 16B may be at least partially similar to the electronic device (100) of FIG. 1, or may further include other embodiments of the electronic device.

[0156] Referring to FIGS. 16A and 16B, the electronic device (800) may include a first housing (810) and a second housing (820) that is slidably coupled to the first housing (810) in a designated direction and a designated reciprocating distance. In one embodiment, the electronic device (800) may include a flexible display (900) that is fixed to at least a portion of the second housing (820) and has a variable display area by being slid in or out of the internal space (8101) of the first housing (810) according to the sliding motion of the second housing (820). For example, the flexible display (900) may have a first display area when the second housing (820) is slid out from the first housing (810) in a first direction (e.g., direction ①). In one embodiment, the flexible display (900) may have a second display area smaller than the first display area when the second housing (820) is inserted in a second direction (e.g., direction ②) opposite to the first direction (e.g., direction ①).

[0157] According to various embodiments, the first housing (810) may include a first side member (810a) including a first side surface (811), a second side surface (812) extending in a vertical direction from one end of the first side surface (811), and a third side surface (813) extending in a vertical direction from the other end of the first side surface (811). In one embodiment, the second housing (820) may include a second side member (820a) including a fourth side surface (821) extending in a parallel direction with the first side surface (811), a fifth side surface (822) extending from one end of the fourth side surface (821) to at least partially face the second side surface (812), and a sixth side surface (823) extending from the other end of the fourth side surface (821) to at least partially face the third side surface (813). In one embodiment, the second side member (820a) may be formed at least partially of a conductive material (e.g., metal). In one embodiment, the second side member (820a) comprises a first conductive portion (830) disposed through a first non-conductive portion (841) and a second non-conductive portion (842) spaced apart from the fourth side (821), a second conductive portion (831) disposed through the first non-conductive portion (841) and a third non-conductive portion (843) disposed on the fifth side (822), a third conductive portion (832) disposed on another portion of the fifth side (822) through the third non-conductive portion (843), a fourth conductive portion (833) disposed through the second non-conductive portion (842) and a fourth non-conductive portion (844) disposed on the sixth side (823), and a fourth non-conductive portion (844) disposed on another portion of the sixth side (823). A fifth conductive portion (834) may be included. In one embodiment, at least one conductive portion among the first, second, third, fourth, and fifth conductive portions (830, 831, 832, 833, and 834) may be electrically connected to a wireless communication circuit of the electronic device (800) (e.g., a wireless communication module (192) of FIG. 1) and may operate as an antenna.

[0158] According to various embodiments, the flexible display (900) may include a window layer (910) laminated on a first surface (9301) of a display panel (930) via an adhesive member (P), a polarizing layer (920), a polymer layer (940), and / or a conductive sheet (950) sequentially disposed on a second surface (9302) of the display panel (930) opposite to the first surface (9301) and attached via the adhesive member (P). In one embodiment, the window layer (910) may include a first layer (911) formed of a polymer (e.g., a PET layer or a TPU layer) and a second layer (912) formed of glass (e.g., a UTG layer) disposed below the first layer (911). In some embodiments, the polarizing layer (920) may be omitted.

[0159] According to various embodiments, the flexible display (900) may include a first planar region (830a) fixed to a second housing (820), a bending region (830b) extending from the first planar region (830a) and exposed to be visible to the outside in a pulled-out state and introduced into an internal space (8101) of the first housing (810) through a bending motion in a pulled-in state so as to be invisible to the outside, and a second planar region (830c) extending from the bending region (830b), not always exposed to the outside, and positioned in the internal space (8101) of the first housing (810). In one embodiment, the flexible display (900) may include a bending portion (932) (e.g., COP or COF) extending from an end of the first planar region (830a) and arranged in a curved manner toward the back surface of the flexible display (900). In one embodiment, the bending portion (932) may be protected by a bending portion protection layer (931).

[0160] According to various embodiments, the electronic device (800) may include a molding member (965) arranged to cover a bending portion (932) disposed at an end of a first planar area (830a) of a flexible display (900). In one embodiment, the molding member (965) may be attached to at least a portion of the second side member (820a) via an adhesive member (966). In this case, the first conductive portion (830) of the second side member (820a) used as an antenna may have an inner surface (821a) of the fourth side (821) disposed close to the molding member (965), thereby causing unintended coupling with the bending portion (932) and deteriorating the radiation performance of the antenna.

[0161] According to an exemplary embodiment of the present disclosure, the electronic device (800) includes a cutting portion (821b) formed lower than the inner surface (821a) of the fourth side (821) of the second side member (820a) in an area corresponding to the molding member (965), and by relatively increasing the distance between the molding member (965) and the inner surface (821a), it can help reduce the deterioration of the radiation performance of the antenna through a reduction in coupling between the second side member (820a) and the bending portion (932).

[0162] According to various embodiments, an electronic device includes a housing (e.g., housing (210) of FIG. 2A) including at least one conductive portion (e.g., first conductive portion (310) of FIG. 4) forming at least a portion of a side surface (e.g., first side surface (2181) of FIG. 4), a display (e.g., display (400) of FIG. 2A) arranged to be visible from the outside through at least a portion of the housing, the display including a display panel (e.g., display panel (431) of FIG. 7), an extension portion (e.g., extension portion (4321) of FIG. 7) extending from the display panel at a position corresponding to the at least one conductive portion and arranged to be folded toward a back surface of the display, and a display control circuit (e.g., control circuit (4321a) of FIG. 5B) arranged in the extension portion, and a molding member (e.g., molding member (450) of FIG. 7) arranged to cover at least a portion of the extension portion, and transmitting or receiving a wireless signal through the at least one conductive portion. A wireless communication circuit configured to receive (e.g., wireless communication circuit (192) of FIG. 1) is included, and the molding member can be positioned to be spaced apart from the at least one conductive portion.

[0163] According to various embodiments, the molding member may be arranged to cover the display control circuit.

[0164] According to various embodiments, the at least one conductive portion may include at least one cut portion (e.g., cut portion (2185) of FIG. 7) formed at least partially lower than an inner surface of the at least one conductive portion (e.g., inner surface (218a) of FIG. 7).

[0165] According to various embodiments, the cutting portion may be formed at a position that at least partially overlaps the molding member when the side surface is viewed from the outside.

[0166] According to various embodiments, the cutting portion may be formed to have a length equal to a length of the at least one conductive portion.

[0167] According to various embodiments, the cutting portion may be formed to have a length shorter than the length of the at least one conductive portion.

[0168] According to various embodiments, the length and / or placement position of the cutting portion may be determined based on the current density of the at least one conductive portion.

[0169] According to various embodiments, the length and / or arrangement position of the cutting portion may be determined by taking into account the rigidity of the at least one conductive portion.

[0170] According to various embodiments, the housing includes a side member (e.g., side member (218) of FIG. 7) including the at least one conductive portion and an extension member (e.g., extension member (2181a) of FIG. 7) extending from the side member into an interior space of the housing, and at least a portion of the display may be arranged to be supported by the extension member.

[0171] According to various embodiments, at least a portion of the display may be attached to the molding member via an adhesive member (e.g., the first adhesive member (481) of FIG. 7).

[0172] According to various embodiments, the adhesive member may be positioned at a position that at least partially overlaps the molding member when the display is viewed from above.

[0173] According to various embodiments, the molding member may include at least one first portion (e.g., the third portion (450a) of FIG. 12a) having a first separation distance from the at least one conductive portion and at least one second portion (e.g., the fourth portion (450b) of FIG. 12a) arranged to have a second separation distance from the at least one conductive portion that is greater than the first separation distance.

[0174] According to various embodiments, the placement location of the at least one second portion may be determined based on the current density of the at least one conductive portion.

[0175] According to various embodiments, the distance between the at least one conductive portion and the molding member may be 0.25 mm or greater.

[0176] According to various embodiments, the housing includes a first housing (e.g., the first housing (710) of FIG. 15a) and a second housing (e.g., the second housing (720) of FIG. 15a) foldably coupled to the first housing via a hinge device (e.g., the hinge device (730) of FIG. 15b), the display (e.g., the flexible display (600) of FIG. 15a) is foldably arranged to be supported by the first housing and the second housing, and the at least one conductive portion (e.g., the eighth conductive portion (761) of FIG. 15b) may be arranged on at least a portion of a side surface of the first housing and / or at least a portion of a side surface of the second housing (e.g., the fourth side surface (721) of FIG. 15b).

[0177] According to various embodiments, the housing includes a first housing (e.g., the first housing (810) of FIG. 16a) and a second housing (e.g., the second housing (820) of FIG. 16a) slidably coupled from the first housing, and the display (e.g., the flexible display (900) of FIG. 16a) is at least partially accommodated in an internal space of the first housing (e.g., the internal space (8101) of FIG. 16b) so as not to be visible from the outside when in a retracted state, and the at least one conductive portion (e.g., the first conductive portion (830) of FIG. 16a) can be disposed on at least a portion of a side surface of the first housing or at least a portion of a side surface of the second housing (e.g., the fourth side surface (821) of FIG. 16a).

[0178] According to various embodiments, an electronic device includes a housing (e.g., the housing (210) of FIG. 2A) including at least one conductive portion (e.g., the first non-conductive portion (310), the second non-conductive portion (311), the third non-conductive portion (312), the fourth non-conductive portion (313), the fifth non-conductive portion (314) and the fifth non-conductive portion (315) of FIG. 4) forming at least a portion of a side surface (e.g., the first side surface (2181), the second side surface (2182), the third side surface (2183) and the fourth side surface (2184) of FIG. 4), and a display (e.g., the display (400) of FIG. 7) disposed so as to be visible from the outside through at least a portion of the housing and including a display panel (e.g., the display panel (431) of FIG. 7) and a conductive sheet (e.g., the conductive sheet (443) of FIG. 7) disposed under the display panel, A molding member (e.g., a molding member (450) of FIG. 7 or a molding member (452) of FIG. 14a) arranged to cover at least one edge of the display (e.g., a first edge (401), a second edge (402), a third edge (403) and a fourth edge (404) of FIG. 5a) and a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) configured to transmit or receive a wireless signal through the at least one conductive portion, wherein the molding member may be arranged to have a specific separation distance from an inner surface of the at least one conductive portion.

[0179] According to various embodiments, the at least one conductive portion (e.g., the first conductive portion (310) of FIG. 4) may include at least one cut portion (e.g., the cut portion (2185) of FIG. 7) formed at least partially lower than the inner surface (e.g., the inner surface (218a) of FIG. 7).

[0180] According to various embodiments, the length and / or placement position of the cutting portion may be determined based on the current density of the at least one conductive portion.

[0181] According to various embodiments, the molding member (e.g., the molding member (450) of FIG. 7) includes at least one first portion (e.g., the third portion (450a) of FIG. 12a) having a first separation distance from the at least one conductive portion (e.g., the first conductive portion (310) of FIG. 4)) and at least one second portion (e.g., the fourth portion (450b) of FIG. 12a) arranged to have a second separation distance from the at least one conductive portion that is greater than the first separation distance, wherein the separation distance includes the second separation distance, and the arrangement position of the at least one second portion can be determined based on a current density of the at least one conductive portion.

[0182] In addition, the embodiments of the present disclosure disclosed in this specification and drawings are merely specific examples to easily explain the technical contents according to the embodiments of the present disclosure and to help understand the embodiments of the present disclosure, and are not intended to limit the scope of the embodiments of the present disclosure. Therefore, the scope of the various embodiments of the present disclosure should be interpreted as including all changes or modified forms derived based on the technical ideas of the various embodiments of the present disclosure in addition to the embodiments disclosed herein.

Claims

1. In electronic devices, A housing (210) comprising at least one conductive portion (310) forming at least a portion of a side surface (2181); A display (400) positioned so as to be visible from the outside through at least a portion of the housing, Display panel (431); An extension (4321) extending from the display panel and arranged to be folded toward the back surface of the display, at a position corresponding to at least one of the challenging portions; and A display including a display control circuit (4321a) arranged in the above extension; A molding member (450) arranged to cover at least a portion of the above extension; and A wireless communication circuit (192) configured to transmit or receive a wireless signal through at least one of the above-described conductive portions, An electronic device wherein the molding member is positioned so as to be spaced apart from the at least one conductive portion.

2. In paragraph 1, An electronic device in which the above molding member is arranged to cover the display control circuit.

3. In paragraph 1, An electronic device wherein said at least one conductive portion includes at least one cutting portion (2185) formed at least partially lower than an inner surface (218a) of said at least one conductive portion.

4. In paragraph 3, An electronic device in which the above-mentioned cutting portion is formed at a position that at least partially overlaps the molding member when the side surface is viewed from the outside.

5. In paragraph 3, An electronic device wherein the cutting portion is formed to have a length equal to the length of at least one conductive portion.

6. In paragraph 3, An electronic device wherein the cutting portion is formed to have a length shorter than the length of the at least one conductive portion.

7. In paragraph 3, An electronic device wherein the length and / or arrangement position of the cutting portion is determined based on the current density of the at least one conductive portion.

8. In paragraph 3, An electronic device in which the length and / or arrangement position of the cutting portion is determined in consideration of the rigidity of the at least one conductive portion.

9. In paragraph 1, The housing comprises a side member (218) including at least one conductive portion and an extension member (2181a) extending from the side member into the interior space of the housing, An electronic device wherein at least a portion of said display is arranged to be supported by said extension member.

10. In paragraph 9, An electronic device wherein at least a portion of the display is attached to the molding member via an adhesive member (481).

11. In paragraph 10, An electronic device wherein the adhesive member is positioned at a position at least partially overlapping the molding member when the display is viewed from above.

12. In paragraph 1, The above molding member, At least one first portion (450a) having a first separation distance from at least one of the above challenging portions; and An electronic device comprising at least one second portion (450b) arranged to have a second separation distance greater than the first separation distance from the at least one challenging portion.

13. In paragraph 12, An electronic device wherein the arrangement location of at least one of the second portions is determined based on the current density of the at least one conductive portion.

14. In paragraph 1, An electronic device wherein a gap between at least one of the conductive portions and the molding member is 0.25 mm or more.

15. In paragraph 1, The above housing, First housing (710); and It includes a second housing (720) that is foldably connected to the first housing through a hinge device (730), The above display (600) is arranged foldably to be supported by the first housing and the second housing, An electronic device wherein at least one of the above-described conductive portions (761) is disposed on at least a portion of a side surface of the first housing and / or at least a portion of a side surface (721) of the second housing.

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