Electronic device including molding portion

Abstract

An electronic device according to an embodiment disclosed herein comprises: a housing; a display disposed in the housing; and a molding portion formed at an end portion of the display. The display includes: a panel layer including a bending region in at least a portion of the end portion; and a protective layer disposed on the panel layer. The protective layer includes a first recessed region in which at least a portion of an end portion of the protective layer is recessed, and the molding portion may be disposed so as to fill the first recessed region.

Description

Electronic device including a molded part

[0001] The present disclosure relates to an electronic device including a molding portion.

[0002] An electronic device may include a molding portion positioned at an end of a display. The molding portion may be positioned to surround a bending region of the display formed at the end of the display. The bending region may be an area where the display bends and extends from a chip on panel (COP) portion positioned at the end of the display.

[0003] A waterproof tape may be placed between the bottom of the molding portion and the housing. The molding portion may be joined to the housing using the waterproof tape. When the waterproof tape is placed on the molding portion, the black masking (BM) area of ​​the electronic device may be reduced.

[0004] The above information may be provided as background information to aid in understanding the present disclosure. None of the above is claimed to be prior art related to the present disclosure, nor can it be used to determine prior art.

[0005] When a molding is placed at the end of a display of an electronic device, the air gap between the end of the display and other components of the electronic device may be reduced. If the electronic device is subjected to impact (e.g., if the electronic device is dropped), the reduced air gap may cause damage to the panel layer of the display. Since both ends of the display's bending area are vulnerable to impact, cushioning may be necessary in these areas.

[0006] An electronic device according to one embodiment of the present disclosure may include a housing, a display, and a molding part.

[0007] In one embodiment, the display may be disposed in the housing.

[0008] In one embodiment, the molding portion may be formed at an end of the display.

[0009] In one embodiment, the display may include a panel layer including a bending region at least in a portion of the distal end and a protective layer disposed on the panel layer.

[0010] In one embodiment, the protective layer may include a first concave region in which at least a portion of a distal end of the protective layer is formed concavely.

[0011] In one embodiment, the molding portion may be positioned to fill the first concave region.

[0012] In one embodiment, the housing may include a placement space and a side wall surrounding the placement space.

[0013] In one embodiment, the display is positioned in the layout space and may face the side wall.

[0014] In one embodiment, the molding portion may be formed at an end of the display.

[0015] In one embodiment, the display may include a panel layer and a protective layer disposed on the panel layer.

[0016] In one embodiment, the molding portion may include a first molding region formed at an end of the panel layer and a second molding region formed at an end of the protective layer.

[0017] In one embodiment, the first distance between the side wall and the first molding region can be formed longer than the second distance between the side wall and the second molding region.

[0018] An electronic device according to one embodiment of the present disclosure can prevent or reduce the display from moving relative to the molding portion when an impact is applied to the electronic device by applying a molding stopper structure (e.g., a convex region of the molding portion) through a reverse step structure at both ends of a bending region.

[0019] An electronic device according to one embodiment of the present disclosure can prevent or reduce damage to a display due to movement of the display by applying a molding stopper structure (e.g., a convex region of a molding portion) through a reverse step structure at both ends of a bending region.

[0020] An electronic device according to one embodiment of the present disclosure may form a step region on a portion of a side wall of a housing to prevent or reduce direct impact on a panel layer of a display.

[0021] FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment.

[0022] FIG. 2A and FIG. 2B are perspective views of an electronic device according to one embodiment of the present disclosure.

[0023] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0024] FIG. 4 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 5 is a diagram illustrating an electronic device according to one embodiment of the present disclosure.

[0026] FIGS. 6A, 6B, and 6C are diagrams illustrating an electronic device according to one embodiment of the present disclosure.

[0027] FIGS. 7A, 7B, and 7C are drawings showing a molding part according to one embodiment of the present disclosure.

[0028] FIG. 8 is a cross-sectional perspective view showing a display according to one embodiment of the present disclosure.

[0029] FIGS. 9A, 9B, 9C, and 9D are diagrams illustrating a display according to one embodiment of the present disclosure.

[0030] FIG. 10 is a drawing showing a protective layer according to one embodiment of the present disclosure.

[0031] FIGS. 11A and 11B are drawings showing side walls of a housing according to one embodiment of the present disclosure.

[0032] FIG. 12 and FIG. 13 are drawings showing an electronic device according to one embodiment of the present disclosure.

[0033] FIG. 1 is a block diagram of an electronic device (101) within a network environment (100) according to one embodiment. Referring to FIG. 1, in the network environment (100), the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (104) or the server (108) via a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) via the server (108). According to one embodiment, the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197). In some embodiments, the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added. In some embodiments, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).

[0034] The processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations. According to one embodiment, as at least a part of the data processing or calculations, the processor (120) may store commands or data received from other components (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the commands or data stored in the volatile memory (132), and store result data in a non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., a central processing unit or processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together therewith. For example, if the electronic device (101) includes a main processor (121) and a secondary processor (123), the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a specified function. The secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.

[0035] The auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (123) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (180) or a communication module (190)). In one embodiment, the auxiliary processor (123) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0036] The memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101). The data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto. The memory (130) can include volatile memory (132) or non-volatile memory (134).

[0037] The program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0038] The input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101). The input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0039] The audio output module (155) can output audio signals to the outside of the electronic device (101). The audio output module (155) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0040] The display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0041] The audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).

[0042] The sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0043] The interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)). In one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0044] The connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0045] The haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. According to one embodiment, the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0046] The camera module (180) can capture still images and videos. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0047] The power management module (188) can manage power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0048] A battery (189) may power at least one component of the electronic device (101). In one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0049] The communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module). Among these communication modules, the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules can be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).

[0050] The wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)). According to one embodiment, the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.

[0051] The antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (197) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (197).

[0052] In one embodiment, the antenna module (197) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.

[0053] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0054] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199). Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101). According to one embodiment, all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In one embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server utilizing machine learning and / or a neural network. According to one embodiment, the external electronic device (104) or the server (108) may be included in the second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0055] FIG. 2A is a perspective view of the front of an electronic device (200) according to one embodiment of the present disclosure. FIG. 2B is a perspective view of the rear of the electronic device (200) of FIG. 2A according to one embodiment of the present disclosure.

[0056] The electronic device (200) of FIGS. 2A and 2B may be at least partially similar to the electronic device (101) of FIG. 1 or may include at least some of the components of the electronic device (101).

[0057] Referring to FIGS. 2A and 2B , an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In one embodiment (not shown), the housing (210) may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C). According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (or “side member”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0058] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2B), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region or the second region.

[0059] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0060] The display (201) may be exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first surface (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0061] The input device (203) may include a microphone. In some embodiments, the input device (203) may include multiple microphones arranged to detect the direction of sound. The audio output device (207, 214) may include speakers. The speakers may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone, speakers, and connector (208) may be arranged in the space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone and speakers. In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0062] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210). A fingerprint sensor (e.g., an ultrasonic or optical fingerprint sensor) may be disposed under the display (201) on the first surface (210A). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor (204).

[0063] Camera modules (205, 212, 213) may include a first camera device (205) disposed on a first side (210A) of the electronic device (200), a second camera device (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device (200).

[0064] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In one embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In one embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0065] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light. In one embodiment, the light-emitting element may provide a light source that is linked to the operation of, for example, the camera module (205). The indicator may include, for example, an LED, an IR LED, and a xenon lamp.

[0066] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector or an IF module (interface connector port module)) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0067] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 5% to about 20%. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area having a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In one embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0068] FIG. 3 is an exploded perspective view of an electronic device according to one embodiment of the present disclosure.

[0069] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (101) of FIG. 1 and / or the electronic device (200) of FIG. 2A, or may include at least some of the components of the electronic devices (101, 200).

[0070] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2) may include a side member (310) (e.g., the side bezel structure (218) of FIG. 2A), a support member (311) (e.g., a bracket or a support structure), a front cover (320) (e.g., the front plate (202) of FIG. 2A), a display (330) (e.g., the display (201) of FIG. 2A), at least one substrate (341, 342) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (R-FPCB)), a battery (350), at least one additional support member (361, 362) (e.g., a rear case), an antenna (370), and a rear cover (380) (e.g., the rear plate (211) of FIG. 2). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the support member (311), or at least one additional support member (361, 362)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (101) of FIG. 1 or the electronic device (200) of FIG. 2A, and any redundant description may be omitted.

[0071] According to one embodiment, the side member (310) may include a first surface (3101) facing a first direction (e.g., the z-axis direction), a second surface (3102) facing an opposite direction to the first surface (3101), and a side surface (3103) surrounding a space (e.g., an internal space (4001) of FIG. 4) between the first surface (3101) and the second surface (3102). According to one embodiment, at least a portion of the side surface (3103) may form an exterior appearance of the electronic device. According to one embodiment, the support member (311) may be arranged to extend from the side member (310) toward the internal space of the electronic device (300) (e.g., the internal space (4001) of FIG. 4). In some embodiments, the support member (311) may be arranged separately from the side member (310). According to one embodiment, the side member (310) and / or the support member (311) may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). According to one embodiment, the support member (311) may support at least a portion of the display (330) through the first surface (3101) and may be arranged to support at least a portion of at least one substrate (341, 342) and / or the battery (350) through the second surface (3102). According to one embodiment, the at least one substrate (341, 342) may include a first substrate (341) (e.g., a main substrate) arranged on one side with respect to the battery (350) in the internal space of the electronic device (300) and a second substrate (342) (e.g., a sub substrate) arranged on the other side. According to one embodiment, the first substrate (341) and / or the second substrate (342) may include a processor, memory, and / or an interface. According to one embodiment, the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor. According to one embodiment, the memory may include, for example, volatile memory or non-volatile memory.According to one embodiment, the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, and may include, for example, a USB connector, an SD card / MMC connector, or an audio connector. According to one embodiment, the battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially coplanar with, for example, at least one substrate (341, 342). According to one embodiment, the battery (350) may be disposed in a manner that is built into the electronic device (300). In some embodiments, the battery (350) may be disposed detachably from the electronic device (300).

[0072] In one embodiment, the antenna (370) may be disposed between the rear cover (380) and the battery (350). In one embodiment, the antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In some embodiments, the antenna may be formed by a portion or a combination of the side member (310) and / or the support member (311). In some embodiments, the electronic device (300) may further include a digitizer for detecting an external electronic pen.

[0073] FIG. 4 is a drawing showing an electronic device (400) according to one embodiment of the present disclosure.

[0074] The electronic device (400) illustrated in FIG. 4 may refer to the electronic device (101) of FIG. 1 or may include at least a part of the electronic device (101) of FIG. 1.

[0075] The electronic device (300) illustrated in FIG. 4 may refer to the electronic devices (200, 300) of FIGS. 2a, 2b, and 3, or may include at least a part of the electronic devices (200, 300) of FIGS. 2a, 2b, and 3.

[0076] In describing an electronic device (400) according to one embodiment of the present disclosure, the width direction of the electronic device (400) may mean the X-axis direction, and the length direction of the electronic device (400) may mean the Y-axis direction. The height direction of the electronic device (400) may mean the Z-axis direction.

[0077] In one embodiment, the electronic device (400) may include a housing (410) and / or a window cover (420).

[0078] In one embodiment, the housing (410) may have substantially the same configuration as the housing (210) of FIG. 2A.

[0079] In one embodiment, the housing (410) forms the exterior of the electronic device (400) and may provide a space in which components of the electronic device (400) are arranged. Components of the electronic device (400) may be arranged inside the housing (410).

[0080] In one embodiment, a window cover (420) may be disposed on one side of a display (430, see FIG. 5). The window cover (420) may have substantially the same configuration as the front cover (320) of FIG. 3. The window cover (420) may serve to protect the display (430, see FIG. 5).

[0081] FIG. 5 is a drawing showing an electronic device (400) according to one embodiment of the present disclosure.

[0082] FIG. 5 is a cross-sectional view showing an electronic device (400) viewed along line A-A' of FIG. 4.

[0083] In one embodiment, the electronic device (400) may include a housing (410), a window cover (420), a display (430), a molding (440), and / or a waterproof member (450).

[0084] In one embodiment, the housing (410) forms the exterior of the electronic device (400) and may provide a space in which components of the electronic device (400) are arranged. For example, the housing (410) may include a placement space (411) in which components of the electronic device (400) are arranged.

[0085] In one embodiment, the housing (410) may be formed of a metal (e.g., aluminum, stainless steel (STS), or magnesium).

[0086] In one embodiment, the display (430) may be disposed in the housing (410). For example, the display (430) may be disposed in the placement space (411) of the housing (410).

[0087] In one embodiment, the window cover (420) may be positioned to cover at least a portion of the placement space (411) of the housing (410).

[0088] In one embodiment, a window cover (420) may be placed on a display (430). The window cover (420) may be positioned in the positive Z-axis direction relative to the display (430).

[0089] In one embodiment, the window cover (420) may serve to protect the display (430).

[0090] In one embodiment, the display (430) may be a display module for visually providing information to an external party (e.g., a user) of the electronic device (400).

[0091] In one embodiment, the display (430) may include at least one layer. In one embodiment, the display (430) may include a panel layer (431), a resin layer (432), a protective layer (433), a sensor layer (434), a shielding layer (435), a polarizing layer (436), and / or a bonding layer (437).

[0092] In one embodiment, the panel layer (431) may be a layer including a display panel.

[0093] In one embodiment, a portion of the panel layer (431) may include an organic light emitting diode (OLED). For example, the OLED may be disposed in a portion of the panel layer (431) facing the polarizing layer (436). The panel layer (431) is not limited to including the OLED, and in one embodiment, the panel layer (431) and the OLED may be disposed as separate layers.

[0094] In one embodiment, the panel layer (431) can visually display information. Information can be visually displayed on the panel layer (431) by a control circuit (e.g., control circuit (465) of FIG. 9A).

[0095] In one embodiment, the panel layer (431) may include a bending region (4315) that is bent and extends. The bending region (4315) may be formed at a distal end of the panel layer (431) (e.g., an end facing the negative Y-axis direction of the panel layer (431).

[0096] In one embodiment, the bending region (4315) of the panel layer (431) may be an area where the display (430) bends and extends from a chip on panel (COP) portion located at an end of the display (430).

[0097] In one embodiment, the panel layer (431) may include a first region (431a) and a second region (431b) spaced apart from the first region (431a) in the height direction (e.g., Z-axis direction) of the display (430). A bending region (4315) may connect the first region (431a) and the second region (431b). The bending region (4315) may be a region that bends and extends to connect the first region (431a) and the second region (431b).

[0098] In one embodiment, the shielding layer (435), the sensor layer (434), the protective layer (433), the resin layer (432), the panel layer (431), and the polarizing layer (436) may be laminated in the height direction (e.g., the Z-axis direction) of the display (430). For example, the shielding layer (435), the sensor layer (434), the protective layer (433), the resin layer (432), the panel layer (431), and the polarizing layer (436) may be laminated in this order along the positive Z-axis direction.

[0099] In one embodiment, the resin layer (432) may be disposed on the panel layer (431). In one embodiment, the resin layer (432) may include polyimide (PI). The resin layer (432) may be positioned in the negative Z-axis direction based on a portion of the panel layer (431) that is in contact with the polarizing layer (436).

[0100] In one embodiment, a protective layer (433) may be disposed on the resin layer (432). The protective layer (433) may serve to protect the panel layer (431) from impact applied to the panel layer (431). In one embodiment, the protective layer (433) may include an embossing sheet and / or a cushion sheet. The protective layer (433) may be positioned in the negative Z-axis direction with respect to the resin layer (432).

[0101] In one embodiment, the sensor layer (434) may be disposed on the protective layer (433). The sensor layer (434) may include a sensor circuit that detects the operation of an external input device (e.g., a digital pen). For example, the sensor layer (434) may include a digitizer that detects the input of a magnetic field-type stylus pen. The sensor layer (434) may be positioned in the negative Z-axis direction with respect to the protective layer (433).

[0102] In one embodiment, a shielding layer (435) may be disposed on the sensor layer (434). The shielding layer (435) may serve to shield noise. The shielding layer (435) may include a copper (Cu) sheet. The shielding layer (435) may be positioned in the negative Z-axis direction with respect to the sensor layer (434).

[0103] In one embodiment, the polarizing layer (436) may be disposed on the panel layer (431). The polarizing layer (436) may be disposed on the opposite side of the panel layer (431) to the side on which the resin layer (432) is disposed. The polarizing layer (436) may function as a polarizing plate.

[0104] In one embodiment, the bonding layer (437) may serve to bond each layer included in the display (430) or to bond the display (430) and other components of the electronic device (400) to each other.

[0105] In one embodiment, the bonding layer (437) may include an adhesive material. For example, the bonding layer (437) may include at least one of an optical clear adhesive (OCA), a pressure sensitive adhesive (PSA), a heat reactive adhesive, a general adhesive, or a double-sided tape.

[0106] In one embodiment, the bonding layer (437) may include a first bonding layer (4371), a second bonding layer (4372), a third bonding layer (4373), a fourth bonding layer (4374), and / or a fifth bonding layer (4375).

[0107] In one embodiment, the first bonding layer (4371), the second bonding layer (4372), the third bonding layer (4373), the fourth bonding layer (4374), and the fifth bonding layer (4375) may serve to bond two layers positioned between the bonding layers (4371, 4372, 4373, 4374, 4375).

[0108] In one embodiment, the first bonding layer (4371) may be disposed between the shielding layer (435) and the panel layer (431) (e.g., the second region (431b) of the panel layer (431)). The second bonding layer (4372) may be disposed between the shielding layer (435) and the sensor layer (434). The third bonding layer (4373) may be disposed between the sensor layer (434) and the protective layer (433). The fourth bonding layer (4374) may be disposed between the protective layer (433) and the resin layer (432). The fifth bonding layer (4375) may be disposed between the polarizing layer (436) and the window cover (420).

[0109] In one embodiment, the molding portion (440) may be formed at the distal end of the display (430). The molding portion (440) may be formed around the bending region (4315) of the panel layer (431) located at the distal end of the display (430).

[0110] In one embodiment, the molding portion (440) may serve to protect the bending region (4315) of the panel layer (431). In one embodiment, the molding portion (440) may serve to reinforce the rigidity of the bending region (4315).

[0111] In one embodiment, the outer surface of the bending region (4315) may refer to a surface of the bending region (4315) that faces the housing (410) and / or the window cover (420). The inner surface of the bending region (4315) may refer to a surface opposite to the outer surface of the bending region (4315). In one embodiment, the molding portion (440) may be disposed on the outer surface and the inner surface of the bending region (4315).

[0112] In one embodiment, the molding portion (440) may be formed by curing a molding material. For example, a molding material may be injected around the distal end of the display (430), and the injected molding material may be cured to form the molding portion (440).

[0113] In one embodiment, the molding portion (440) may include silicone, epoxy, and / or poly methyl methacrylate (PMMA).

[0114] In one embodiment, a cover member (463) may be disposed on the panel layer (431). The cover member (463) may be disposed to cover a control circuit (e.g., a control circuit (465) of FIG. 9A). In one embodiment, the cover member (463) may be a tape disposed to cover a control circuit (e.g., a control circuit (465) of FIG. 6A).

[0115] In one embodiment, a waterproof member (450) may be positioned between the molding portion (440) and the housing (410). The waterproof member (450) may include a waterproof material and an adhesive material. For example, the waterproof member (450) may include a waterproof tape having a waterproof material.

[0116] In one embodiment, the waterproof member (450) may serve to seal the space between the molding portion (440) and the housing (410) to prevent or reduce foreign substances from entering the electronic device (400).

[0117] In FIG. 5, the waterproof member (450) is illustrated as not being attached to the molding part (440), but this is exemplary, and the waterproof member (450) according to one embodiment may be placed in the housing (410) in a form attached to the molding part (440).

[0118] FIG. 6a, FIG. 6b, and FIG. 6c are drawings showing an electronic device (400) according to one embodiment of the present disclosure.

[0119] Fig. 6a may be a drawing showing an end portion (e.g., a negative Y-axis direction end portion) of an electronic device (400). Fig. 6b is a cross-sectional view showing an electronic device (400) taken along line B-B' of Fig. 6a. Fig. 6c is a cross-sectional view showing an electronic device (400) taken along line C-C' or line D-D' of Fig. 6b.

[0120] Referring to FIG. 6A, the electronic device (400) may include a housing (410), a display (430), and / or a molding portion (440).

[0121] Referring to FIG. 6A, the bending region (4315) of the display (430) may extend from a first end (4315a) to a second end (4315b) along the longitudinal direction (e.g., X-axis direction) of the bending region (4315). In one embodiment, the first end (4315a) may be an end located opposite the second end (4315b).

[0122] In one embodiment, the longitudinal direction of the bending region (4315) may mean a direction in which the bending region (4315) extends relatively long. For example, the longitudinal direction of the bending region (4315) may mean the X-axis direction.

[0123] The ends (4315a, 4315b) of the bending region (4315) may be vulnerable to impact. The ends (4315a, 4315b) of the bending region (4315) are formed at a position overlapping the molding portion (440) and may be vulnerable to external impact. For example, when an impact is applied to the electronic device (400), the ends (4315a, 4315b) of the bending region (4315) may collide with the molding portion (440), thereby damaging the panel layer (431) of the display (430).

[0124] An electronic device (400) according to one embodiment of the present disclosure may include a convex region (445) of a molding portion (440) that is formed at a position overlapping the ends (4315a, 4315b) of a bending region (4315) and performs a stopper function. For example, the convex region (445) of the molding portion (440) may serve to prevent the display (430) from moving in the longitudinal direction (e.g., Y-axis direction) and the width direction (e.g., X-axis direction) of the electronic device (400) with respect to the molding portion (440). Since the electronic device (400) according to one embodiment prevents the display (430) from moving relative to the molding portion (440), when the electronic device (400) receives an external impact, the impact applied to the display (430) may be reduced.

[0125] Referring to FIG. 6A, in one embodiment, the first part (410A) of the housing (410) may be a portion of the housing (410) that faces the bending area (4315) of the display (430). For example, the first part (410A) of the housing (410) may overlap the bending area (4315). The second part (410B) of the housing (410) may be a portion of the housing (410) that does not face the bending area (4315). For example, the second part (410B) of the housing (410) may not overlap the bending area (4315).

[0126] Referring to FIGS. 6a, 6b and 6c, a molding portion (440) may be placed at the end of the display (430).

[0127] In one embodiment, the molding portion (440) may be formed by curing a molding material (e.g., silicone, epoxy, and / or poly methyl methacrylate (PMMA)) at the distal end of the display (430).

[0128] In one embodiment, the bending region (4315) of the panel layer (431) may extend along the width direction (e.g., the X-axis direction) of the electronic device (400). For example, the bending region (4315) may extend along the X-axis direction from the first end (4315a) to the first end (4315b).

[0129] In one embodiment, the central portion of the bending region (4315) may refer to a portion located at the center of the bending region (4315) with respect to the longitudinal direction (e.g., X-axis direction) of the bending region (4315). The central portion of the bending region (4315) may be a portion that is not adjacent to the two ends (4315a, 4315b) of the bending region (4315) and is located at a distance therefrom.

[0130] FIG. 6b may be a drawing showing an electronic device (400) viewed along line B-B' of FIG. 6a from a location that is not adjacent to either end of the bending region (4315) (e.g., the center of the bending region (4315)).

[0131] In one embodiment, the protective layer (433) and the sensor layer (434) may extend longer in the longitudinal direction (e.g., in the negative Y-axis direction) of the electronic device (400) than the shielding layer (435) and the first bonding layer (4371) at locations that are not adjacent to the ends of the bending region (4315) (e.g., at the center of the bending region (4315). For example, referring to FIG. 6B, the ends of the protective layer (433) and the sensor layer (434) at locations that overlap the center of the bending region (4315) may extend longer toward the sidewall (415) of the housing (410) in the longitudinal direction (e.g., in the negative Y-axis direction) of the electronic device (400) than the ends of the shielding layer (435) and the first bonding layer (4371).

[0132] Although the protective layer (433) and the sensor layer (434) are shown as extending longer than the shielding layer (435) and the first bonding layer (4371) at locations that are not adjacent to the ends of the bending region (4315) in FIG. 6B (e.g., the center of the bending region (4315)), this may be exemplary. For example, in one embodiment, the protective layer (433) and the sensor layer (434) may extend substantially the same length as the shielding layer (435) and the first bonding layer (4371) at locations that overlap the center of the bending region (4315). The positions of the ends of the protective layer (433) and the sensor layer (434) with respect to the longitudinal direction (e.g., negative Y-axis direction) of the electronic device (400) at positions overlapping the center of the bending region (4315) may be substantially the same as the positions of the ends of the shielding layer (435) and the first bonding layer (4371).

[0133] Referring to FIG. 6B, the display (430) may form a stepped structure at a location that is not adjacent to either end of the bending region (4315) (e.g., the center of the bending region (4315)). In one embodiment, the stepped structure may mean a structure in which a layer positioned in a lower direction (e.g., in the negative Z-axis direction) of the protective layer (433) and the sensor layer (434) extends shorter toward the side wall (415) of the housing (410) than the protective layer (433) and the sensor layer (434).

[0134] In one embodiment, the two ends of the bending region (4315) may mean the ends (4315a, 4315b) of the bending region (4315) based on the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0135] FIG. 6c may be a drawing showing an electronic device (400) viewed along line C-C' or line D-D' of FIG. 6a adjacent to both ends (4315a, 4315b) of a bending region (4315).

[0136] In one embodiment, a cross-section of the electronic device (400) viewed along line C-C' of FIG. 6A may be substantially identical to a cross-section of the electronic device (400) viewed along line D-D' of FIG. 6A.

[0137] In one embodiment, the shielding layer (435) and the first bonding layer (4371) at locations adjacent to both ends of the bending region (4315) may extend longer in the longitudinal direction (e.g., in the negative Y-axis direction) of the electronic device (400) than the protective layer (433) and the sensor layer (434). For example, referring to FIG. 6C, in one embodiment, the ends of the shielding layer (435) and the first bonding layer (4371) at locations adjacent to both ends of the bending region (4315) may extend longer in the longitudinal direction (e.g., in the negative Y-axis direction) of the electronic device (400) toward the sidewall (415) of the housing (410) than the ends of the protective layer (433). In one embodiment, the ends of the shielding layer (435) and the first bonding layer (4371) adjacent to the two ends of the bending region (4315) may extend further toward the sidewall (415) of the housing (410) in the longitudinal direction (e.g., in the negative Y-axis direction) of the electronic device (400) than the ends of the sensor layer (434).

[0138] Referring to FIG. 6C, the display (430) may form a reverse step structure at positions adjacent to both ends of the bending region (4315). In one embodiment, the reverse step structure may mean a structure in which a layer positioned in a lower direction (e.g., in the negative Z-axis direction) of the protective layer (433) and the sensor layer (434) extends longer toward the side wall (415) of the housing (410) than the protective layer (433) and the sensor layer (434). In one embodiment, the reverse step structure may be formed by removing a portion of the protective layer (433) and the sensor layer (434) at positions adjacent to both ends of the bending region (4315).

[0139] Referring to FIGS. 6B and 6C, the molding portion (440) according to one embodiment may be disposed on the inner surface of the bending region (4315). For example, the molding portion (440) may be disposed to fill a space surrounded by the inner surface of the bending region (4315) and the resin layer (432), the protective layer (433), the sensor layer (434), the shielding layer (435), the first bonding layer (4371), the second bonding layer (4372), the third bonding layer (4373), and the fourth bonding layer (4374).

[0140] Referring to FIG. 6c, the molding portion (440) may include a convex region (445) at a position adjacent to both ends of the bending region (4315). The convex region (445) may be formed in a shape in which a portion of the molding portion (440) protrudes in the positive Y-axis direction.

[0141] Referring to FIG. 6c, the convex region (445) can be arranged to fill a space surrounded by the panel layer (431), the resin layer (432), the protective layer (433), the sensor layer (434), the shielding layer (435), and the first bonding layer (4371).

[0142] Referring to FIG. 6c, the convex region (445) of the molding portion (440) may be arranged to fill the reverse step structure of the display (430) and serve to alleviate the impact applied to the display (430). For example, the convex region (445) of the molding portion (440) may be arranged to fill the reverse step structure of the display (430) and serve to reduce the impact applied to the bending region (4315) of the display (430) in the longitudinal direction (e.g., Y-axis direction) and the width direction (e.g., X-axis direction) of the electronic device (400).

[0143] FIG. 7a, FIG. 7b and FIG. 7c are drawings showing a molding portion (440) according to one embodiment of the present disclosure.

[0144] Fig. 7a is a plan view showing a molding part (440) according to one embodiment. Fig. 7b is a perspective view showing the S region shown in Fig. 7a. Fig. 7c is a drawing showing a molding part (440) arranged in a housing (410) according to one embodiment.

[0145] Referring to FIG. 7A, the molding portion (440) may be formed to extend in the width direction (e.g., X-axis direction) and the length direction (e.g., Y-axis direction) of the electronic device (400). The molding portion (440) may extend longer in the width direction (e.g., X-axis direction) of the electronic device (400) than in the length direction (e.g., Y-axis direction) of the electronic device (400).

[0146] Referring to FIG. 7a, the molding portion (440) may include two convex regions (445).

[0147] In one embodiment, the two convex regions (445) may be formed with substantially identical shapes.

[0148] In one embodiment, the convex region (445) may be formed at a position where at least a portion of the curved region (4315, see FIG. 6A) of the display (430, see FIG. 6A) overlaps with both ends (4315a, 4315b, see FIG. 6A). For example, at least a portion of the convex region (445) may overlap with both ends (4315a, 4315b, see FIG. 6A) of the curved region (4315, see FIG. 6A) in the longitudinal direction (e.g., X-axis direction).

[0149] Referring to FIG. 7B, the convex region (445) may be formed in a shape in which a portion of the molding portion (440) protrudes compared to other portions of the molding portion (440). For example, the convex region (445) may be formed in a shape in which a portion of the molding portion (440) protrudes compared to the reference surface (440A).

[0150] Referring to FIGS. 7B and 7C, the convex region (445) may be a region in which a portion of the molding portion (440) protrudes in the positive Y-axis direction compared to the reference surface (440A). In one embodiment, the convex region (445) may extend in the X-axis direction. The convex region (445) may have a thickness in the Z-axis direction.

[0151] Referring to FIG. 7b, the convex region (445) may include a first convex region (4451) and / or a second convex region (4452).

[0152] Referring to FIG. 7b, the first convex region (4451) may be more protruding than the second convex region (4452).

[0153] In one embodiment, the convex region (445) may overlap the longitudinal (e.g., X-axis direction) ends (4315a, 4315b, see FIG. 6a) of the bend region (4315, see FIG. 6a) in the first convex region (4451).

[0154] Referring to FIG. 7c, the molding portion (440) may be disposed in the housing (410). In one embodiment, the molding portion (440) may be disposed at a distal end (e.g., a negative Y-axis direction distal end) of the housing (410). In one embodiment, the molding portion (440) may be formed by curing a molding material (e.g., silicone, epoxy, and / or poly methyl methacrylate (PMMA)) at the distal end (e.g., a negative Y-axis direction distal end) of the housing (410).

[0155] Referring to FIG. 7c, the molding portion (440) may be positioned so that at least a portion faces the side wall (415) of the housing (410).

[0156] FIG. 8 is a cross-sectional perspective view showing a display (430) according to one embodiment of the present disclosure.

[0157] FIG. 8 may be a cross-sectional perspective view showing the display (430) cut along line C-C' of FIG. 6a. For example, FIG. 8 may be a cross-sectional perspective view showing the display (430) cut along the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0158] FIG. 8 may be a drawing showing a display (430) before a molding part (440, see FIG. 7b) is placed. For example, FIG. 8 may be a drawing showing a display (430) with the molding part (440, see FIG. 7b) placed on the display (430) omitted.

[0159] Referring to FIG. 8, the protective layer (433) may include a first concave region (4335).

[0160] In one embodiment, the first concave region (4335) may be a space formed by concavely shaping a portion of the protective layer (433). In one embodiment, the first concave region (4335) may be formed by removing a portion of the protective layer (433).

[0161] In one embodiment, the first concave region (4335) may be formed at a position overlapping both ends (4315a, 4315b, see FIG. 6a) of the bending region (4315) with respect to the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0162] In one embodiment, the molding portion (440, see FIG. 7B) can be positioned so that at least a portion of the molding portion fills the first concave region (4335). For example, a convex region (445, see FIG. 7B) of the molding portion (440, see FIG. 7B) can fill the first concave region (4335).

[0163] In one embodiment, at least a portion of the molding portion (440, see FIG. 7B) is positioned to fill the first concave region (4335) and the display (430) can be secured to the molding portion (440, see FIG. 7B). The display (430) is secured to the molding portion (440, see FIG. 7B) and movement of the display (430) in the longitudinal direction (e.g., Y-axis direction) and / or width direction (e.g., X-axis direction) of the electronic device (400) relative to the molding portion (440, see FIG. 7B) can be prevented or reduced.

[0164] Referring to FIG. 8, the sensor layer (434) may include a second concave region (4345).

[0165] In one embodiment, the second concave region (4345) may be a space formed by concavely shaping a portion of the sensor layer (434). In one embodiment, the second concave region (4345) may be formed by removing a portion of the sensor layer (434).

[0166] In one embodiment, the second concave region (4345) may be formed at a position overlapping both ends (4315a, 4315b, see FIG. 6a) of the bending region (4315) with respect to the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0167] In one embodiment, the second concave region (4345) may be formed at a position that at least partially overlaps the first concave region (4335) in a downward direction (e.g., in the Z-axis direction).

[0168] In one embodiment, the molding portion (440, see FIG. 7B) can be positioned so that at least a portion of the molding portion fills the second concave region (4345). For example, a convex region (445, see FIG. 7B) of the molding portion (440, see FIG. 7B) can fill the second concave region (4345).

[0169] In one embodiment, at least a portion of the molding portion (440, see FIG. 7B) is positioned to fill the second concave region (4345) and the display (430) can be secured to the molding portion (440, see FIG. 7B). The display (430) is secured to the molding portion (440, see FIG. 7B) and movement of the display (430) in the longitudinal direction (e.g., Y-axis direction) and / or width direction (e.g., X-axis direction) of the electronic device (400) relative to the molding portion (440, see FIG. 7B) can be prevented or reduced.

[0170] In one embodiment, the intermediate layer (4341) may include a portion of the third bonding layer (4373) and / or a portion of the sensor layer (434) positioned between the first concave region (4335) and the second concave region (4345).

[0171] Although FIG. 8 illustrates that an intermediate layer (4341) is positioned between the first concave region (4335) and the second concave region (4345), this may be exemplary. For example, in one embodiment, the intermediate layer (4341) may not be positioned between the first concave region (4335) and the second concave region (4345). In one embodiment, the first concave region (4335) and the second concave region (4345) may be connected to each other.

[0172] In FIG. 8, the first concave region (4335) and the second concave region (4345) are illustrated as being formed at positions overlapping the two ends of the bending region (4315) (4315a, 4315b, see FIG. 6a), but the positions at which the first concave region (4335) and the second concave region (4345) are formed may not be limited thereto. In one embodiment, the first concave region (4335) and / or the second concave region (4345) may be formed at positions that do not overlap the bending region (4315). For example, at least a portion of an end portion of the protective layer (433) (e.g., an end portion facing the negative Y-axis direction) may be formed concavely at a position that does not overlap the bending region (4315), and the first concave region (4335) may be formed. At least a portion of the distal end of the sensor layer (434) (e.g., the distal end facing the negative Y-axis direction) may be formed concavely at a position that does not overlap with the bending area (4315), and a second concave area (4345) may be formed.

[0173] FIGS. 9A, 9B, 9C, and 9D are diagrams illustrating a display (430) according to one embodiment of the present disclosure.

[0174] FIG. 9A is a drawing showing a first end (4315a) of a bending region (4315) of a display (430). FIG. 9B is a drawing showing a second end (4315b) of a bending region (4315) of a display (430). FIG. 9C is a drawing showing an enlarged view of the first end (4315a) of a display (430) according to one embodiment. FIG. 9D is a drawing showing an electronic device (400) in which a molding portion (440) is arranged.

[0175] Referring to FIGS. 9A and 9B, the electronic device (400) may include a housing (410), a display (430), a control circuit (465), and / or a flexible printed circuit board (467).

[0176] In one embodiment, the display (430) may be disposed in the housing (410).

[0177] In one embodiment, a control circuit (465) and a flexible printed circuit board (467) may be disposed on a panel layer (431) of a display (430).

[0178] In one embodiment, the control circuit (465) may include a display driver IC (DDI) and / or a touch display driver IC (TDDI).

[0179] In one embodiment, a flexible printed circuit board (467) is electrically connected to the panel layer (431) and can transmit signals received from the control circuit (465) to the printed circuit board inside the electronic device (400).

[0180] In one embodiment, the control circuit (465) may be attached to the panel layer (431) in the form of a COP (chip on panel) structure or a COF (chip on film) structure. The COP (chip on panel) structure may refer to a structure in which the control circuit (465) is directly attached to the panel layer (431). The COF (chip on film) structure may refer to a structure in which the control circuit (465) is not directly attached to the panel layer (431) but is arranged on a flexible printed circuit board (467). In FIGS. 9A and 9B , the control circuit (465) is illustrated as being arranged on the panel layer (431) in the form of a COP (chip on panel) structure, but this is exemplary, and the control circuit (465) may also be arranged in the form of a COF (chip on film) structure.

[0181] In one embodiment, the bending region (4315) of the panel layer (431) of the display (430) may extend from a first end (4315a) to a second end (4315b) along the longitudinal direction (e.g., X-axis direction) of the bending region (4315). In one embodiment, the first end (4315a) may be an end located opposite the second end (4315b) in the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0182] In one embodiment, the bending region (4315) of the panel layer (431) may extend between the first end (4315a) and the second end (4315b). The bending region (4315) of the panel layer (431) may be a region formed to be at least partially bent between the first end (4315a) and the second end (4315b).

[0183] Referring to FIGS. 9a and 9b, the first end (4315a) and the second end (4315b) of the bending region (4315) can be formed to have substantially the same shape with respect to the Y-axis.

[0184] Referring to FIGS. 9A and 9B , in one embodiment, a first part (410A) of the housing (410) may be a portion of the housing (410) that faces the bending area (4315) of the display (430). For example, the first part (410A) of the housing (410) may overlap the bending area (4315). A second part (410B) of the housing (410) may be a portion of the housing (410) that does not face the bending area (4315). For example, the second part (410B) of the housing (410) may not overlap the bending area (4315).

[0185] In one embodiment, the convex region (445) of the molding portion (440) may be positioned at a position that at least partially overlaps the two ends (4315a, 4315b) of the bending region (4315). For example, referring to FIGS. 9c and 9d , the convex region (445) of the molding portion (440) may be positioned at a position that overlaps the first end (4315a) of the bending region (4315).

[0186] In one embodiment, the convex region (445) of the molding portion (440) can act as a stopper to prevent the display (430) from moving relative to the molding portion (440). The convex region (445) of the molding portion (440) is positioned to overlap with both ends (4315a, 4315b) of the bending region (4315), and the display (430) can be fixed to the molding portion (440).

[0187] In one embodiment, the convex region (445) of the molding portion (440) may extend a predetermined length in a direction parallel to the longitudinal direction (e.g., the X-axis direction) of the bending portion (4315) based on the ends (4315a, 4315b) of the bending portion (4315). For example, referring to FIGS. 9c and 9d, the convex region (445) of the molding portion (440) may extend a first length (L1) in a first direction (e.g., the positive X-axis direction) based on the first end (4315a) of the bending portion (4315). The convex region (445) of the molding portion (440) can extend by a second length (L2) in a second direction (e.g., negative X-axis direction) opposite to the first direction (e.g., positive X-axis direction) based on the first end (4315a) of the bending region (4315).

[0188] In one embodiment, the first length (L1) may be a length within a range of 0.8 mm to 2.5 mm. For example, the first length (L1) may be approximately 0.954 mm.

[0189] In one embodiment, the second length (L2) may be a length within a range of 1.3 mm to 2.5 mm. For example, the second length (L2) may be approximately 1.45 mm.

[0190] Although the second length (L2) is illustrated as being longer than the first length (L1) in FIGS. 9C and 9D , this is merely exemplary, and the second length (L2) and the first length (L1) may not be limited thereto. For example, the first length (L1) and the second length (L2) may be formed to be substantially the same length. In one embodiment, the first length (L1) and the second length (L2) may be formed to be approximately 2.5 mm in consideration of manufacturing tolerances.

[0191] Although only the first end (4315a) of the bending region (4315) is illustrated in FIGS. 9c and 9d, this is an example for explanation, and the convex region (445) of the molding portion (440) may extend by a predetermined length in a direction parallel to the longitudinal direction (e.g., X-axis direction) of the bending region (4315) based on the second end (4315a) of the bending region (4315). For example, the convex region (445) of the molding portion (440) may extend by a second length (L2) in the first direction (e.g., positive X-axis direction) based on the second end (4315b) of the bending region (4315). The convex region (445) of the molding portion (440) can extend in a second direction (e.g., in the negative X-axis direction) by a first length (L1) based on the second end (4315b) of the bending region (4315).

[0192] In one embodiment, when the convex region (445) of the molding portion (440) is formed to extend by a length determined in the longitudinal direction (e.g., X-axis direction) of the bending region (4315), the display (430) can be easily fixed to the molding portion (440).

[0193] FIG. 10 is a drawing showing a protective layer (433) according to one embodiment of the present disclosure.

[0194] Referring to FIG. 10, a protective layer (433) according to one embodiment may extend in the width direction (e.g., X-axis direction) and the length direction (e.g., Y-axis direction) of the electronic device (400, see FIG. 4). The protective layer (433) may have a thickness in the height direction (e.g., Z-axis direction) of the electronic device (400, see FIG. 4).

[0195] In one embodiment, the protective layer (433) may include a first concave region (4335).

[0196] In one embodiment, the first concave region (4335) may be formed at a distal end of the protective layer (433). For example, the first concave region (4335) may be formed at a distal end facing the negative Y-axis direction in the protective layer (433).

[0197] In one embodiment, the first concave region (4335) may be a space in which a portion of the protective layer (433) is formed in a concave shape. In one embodiment, the first concave region (4335) may be formed by removing a portion of the protective layer (433).

[0198] In one embodiment, the protective layer (433) may include two first concave regions (4335).

[0199] The two first concave regions (4335) can be formed at positions overlapping with both ends (4315a, 4315b, see FIGS. 9a and 9b) of the bending region (4315, see FIG. 9a) of the display (430, see FIG. 9a) in the longitudinal direction (e.g., X-axis direction) of the bending region (4315, see FIG. 9a).

[0200] In one embodiment, the protective layer (433) may serve to protect the panel layer (431) from impact applied to the panel layer (431). In one embodiment, the protective layer (433) may include an emboss sheet and / or a cushion sheet.

[0201] In one embodiment, the sensor layer (434, see FIG. 8) may be disposed on one surface of the protective layer (433). For example, the sensor layer (434, see FIG. 8) may be disposed on a surface of the protective layer (433) facing the negative Z-axis direction.

[0202] In one embodiment, the sensor layer (434, see FIG. 8) may include two second concave regions (4345, see FIG. 8) formed by recessing a portion of the sensor layer (434, see FIG. 8). The second concave regions (4345, see FIG. 8) may be formed at positions overlapping the first concave regions (4335) with respect to the Z-axis direction.

[0203] FIGS. 11A and 11B are drawings showing a side wall (415) of a housing (410) according to one embodiment of the present disclosure.

[0204] FIG. 11A is a drawing showing a step area (4151) formed on a side wall (415) according to one embodiment. FIG. 11B is a cross-sectional view showing a step area (4151) and a display (430) according to one embodiment.

[0205] FIG. 11B is a drawing showing a step area (4151) and a display (430) located corresponding to the second part (410B, see FIG. 6A, FIG. 9A and FIG. 9B) of the housing (410).

[0206] In one embodiment, the housing (410) may include a side wall (415) surrounding a placement space (411).

[0207] Referring to FIGS. 11A and 11B, a side wall (415) of a housing (410) according to one embodiment may include a step region (4151). In one embodiment, the step region (4151) may be an area in which at least a portion of a surface facing the placement space (411) is formed in a step shape.

[0208] In one embodiment, the step region (4151) may be formed in a region of the side wall (415) located in a second part (410B, see FIGS. 6A, 9A, and 9B) of the housing (410). For example, the step region (4151) may be formed in a portion of the housing (410) that does not face the bend region (4315).

[0209] Referring to FIG. 11b, the display (430) may be positioned to face the side wall (415) of the housing (410).

[0210] In one embodiment, the molding portion (440) may include a molding region (447) formed at the end of the display (430) facing the step region (4151).

[0211] In one embodiment, the molding area (447) may be formed in a step shape at the end of the display (430).

[0212] In one embodiment, the molding region (447) may include a first molding region (4471), a second molding region (4472), and / or a third molding region (4473).

[0213] Referring to FIG. 11B, a first molding region (4471) may be formed at an end of the panel layer (431). A second molding region (4472) may be formed at an end of the protective layer (433). A third molding region (4473) may be formed at an end of the fifth bonding layer (4375).

[0214] In one embodiment, the distance between the molding region (447) and the housing (410) may be formed differently depending on the position where the molding region (447) is formed. For example, the distance between the first molding region (4471) and the side wall (415) of the housing (410) and the distance between the second molding region (4472) and the side wall (415) of the housing (410) may be formed differently.

[0215] In one embodiment, the first molding region (4471) and the step region (4151) of the side wall (415) may be arranged at a first distance (D1) in the longitudinal direction (e.g., Y-axis direction) of the electronic device (400). In one embodiment, the first distance (D1) may be formed to have a length within a range of 0.6 mm to 0.65 mm.

[0216] In one embodiment, the second molding region (4472) and the step region (4151) of the side wall (415) may be spaced apart from each other by a second distance (D2) in the longitudinal direction (e.g., Y-axis direction) of the electronic device (400). In one embodiment, the second distance (D2) may be formed to have a length within a range of 0.4 mm to 0.55 mm.

[0217] In one embodiment, the third molding region (4473) and the step region (4151) of the side wall (415) may be spaced apart from each other by a third distance (D3) in the longitudinal direction (e.g., Y-axis direction) of the electronic device (400). In one embodiment, the third distance (D2) may be formed to have a length within a range of 0.4 mm to 0.55 mm.

[0218] In one embodiment, a first distance (D1), which is a distance between a first molding region (4471) and a step region (4151), may be formed to be longer than a second distance (D2), which is a distance between a second molding region (4472) and a step region (4151).

[0219] In one embodiment, the first distance (D1), which is the distance between the first molding region (4471) and the step region (4151), may be formed longer than the third distance (D3), which is the distance between the third molding region (4473) and the step region (4151).

[0220] In one embodiment, the housing (410) and the molding portion (440) may include a step shape in at least a portion thereof to prevent or reduce direct impact to the panel layer (431) of the display (430). For example, when an impact is applied to the electronic device (400), the other layers of the display (430) (e.g., the protective layer (433), the fifth bonding layer (4375)) may first contact the housing (410) before the panel layer (431) contacts the housing (410) due to the step region (4151) and the molding region (447) formed in a step shape, thereby preventing or reducing direct impact to the panel layer (431) of the display (430).

[0221] FIG. 12 and FIG. 13 are drawings showing an electronic device (1200, 1300) according to one embodiment of the present disclosure.

[0222] FIG. 12 is a drawing showing an electronic device (1200) including a waterproof tape (1250) according to one embodiment. FIG. 13 is a drawing showing an electronic device (1300) including a bonding member (1350) according to one embodiment.

[0223] The electronic device (1200) of FIG. 12 may refer to the electronic device (400) of FIG. 5 or may include at least some of the components of the electronic device (400) of FIG. 5.

[0224] Referring to FIG. 12, an electronic device (1200) according to one embodiment may include a housing (1210), a window cover (1220), a display (1230), a molding part (1240), a waterproof tape (1250), and / or a control circuit (1265).

[0225] The housing (1210), window cover (1220), display (1230), and molding portion (1240) illustrated in FIG. 12 may be substantially identical to the housing (410), window cover (420), display (430), and molding portion (440) illustrated in FIG. 5, respectively. The control circuit (1265) illustrated in FIG. 12 may be substantially identical to the control circuit (465) illustrated in FIG. 9A.

[0226] In one embodiment, the display (1230) may include a panel layer (1231). The panel layer (1231) may include a bending region (1231a) that extends and bends at an end. In one embodiment, a molding portion (1240) may be formed to surround the bending region (1231a).

[0227] In one embodiment, the waterproof tape (1250) may be disposed on the molding portion (1240). For example, referring to FIG. 12, the waterproof tape (1250) may be disposed on the molding portion (1240) across the first waterproof section (P1). The waterproof tape (1250) may be positioned in the negative Z-axis direction with respect to the molding portion (1240). For example, the waterproof tape (1250) may be disposed on a surface of the molding portion (1240) facing the negative Z-axis direction. The waterproof tape (1250) may have a thickness (e.g., t1) in the height direction (e.g., Z-axis direction) of the electronic device (1200). The waterproof tape (1250) may extend in the length direction (e.g., Y-axis direction) of the electronic device (1200).

[0228] The BM (black masking) area of ​​the electronic device (1200) may reduce the AA (active area) area where an image is displayed on the display (1230) and increase unnecessary space in the electronic device (1200). If a waterproof member (e.g., waterproof tape (1250)) is placed on the molding portion (1240) rather than the window cover (1220), the BM (black masking) area of ​​the electronic device (1200) may be reduced.

[0229] The electronic device (1300) of FIG. 13 may refer to the electronic device (400) of FIG. 5 or may include at least some of the components of the electronic device (400) of FIG. 5.

[0230] Referring to FIG. 13, an electronic device (1300) according to one embodiment may include a housing (1310), a window cover (1320), a display (1330), a molding portion (1340), a bonding member (1350), and / or a control circuit (1365).

[0231] The housing (1310), window cover (1320), display (1330), and molding portion (1340) illustrated in FIG. 13 may be substantially identical to the housing (410), window cover (420), display (430), and molding portion (440) illustrated in FIG. 5, respectively. The control circuit (1365) illustrated in FIG. 13 may be substantially identical to the control circuit (465) illustrated in FIG. 9A.

[0232] In one embodiment, the display (1330) may include a panel layer (1331). The panel layer (1331) may include a bending region (1331a) that extends and bends at an end. In one embodiment, a molding portion (1340) may be formed to surround the bending region (1331a).

[0233] In one embodiment, the bonding member (1350) may be disposed on the molding portion (1340). For example, referring to FIG. 13, the bonding member (1350) may be disposed on the molding portion (1340) across the second waterproof section (P2). The bonding member (1350) may be positioned in the negative Z-axis direction with respect to the molding portion (1340). For example, the bonding member (1350) may be disposed on a surface of the molding portion (1340) facing the negative Z-axis direction. The bonding member (1350) may have a thickness (e.g., t2) in the height direction (e.g., Z-axis direction) of the electronic device (1300). The bonding member (1350) may extend in the length direction (e.g., Y-axis direction) of the electronic device (1300).

[0234] Referring to FIG. 13, a second waterproof section (P2) according to one embodiment may be located in an outer direction (e.g., in the negative Y-axis direction) of the electronic device (1200, 1300) compared to the first waterproof section (P1) of FIG. 12.

[0235] As the waterproofing member (e.g., waterproofing tape (1250), bonding member (1350)) is positioned toward the outer edge (e.g., negative Y-axis direction) of the electronic device (1200, 1300), the stress applied to the panel layer (1231, 1331) of the display (1230, 1330) can be reduced. In the electronic device (1300) according to the embodiment illustrated in FIG. 13, since the bonding member (1350) is positioned toward the outer edge (e.g., negative Y-axis direction) of the electronic device (1200, 1300) compared to the waterproofing tape (1250) of the electronic device (1200) according to the embodiment illustrated in FIG. 12, the stress applied to the panel layer (1331) can be reduced.

[0236] In one embodiment, the bonding member (1350) may be formed to have a thinner thickness than the waterproof tape (1250). For example, the thickness of the bonding member (1350) may refer to a length that the bonding member (1350) extends in the height direction (e.g., Z-axis direction) of the electronic device (1300). The thickness of the waterproof tape (1250) may refer to a length that the waterproof tape (1250) extends in the height direction (e.g., Z-axis direction) of the electronic device (1200). The second thickness (e.g., t2) of the bonding member (1350) may be thinner than the first thickness (e.g., t1 of FIG. 12) of the waterproof tape (1250).

[0237] In one embodiment, the bonding member (1350) may include an adhesive formed to a thin thickness compared to the tape.

[0238] When a molding is placed at the end of a display of an electronic device, the air gap between the end of the display and other components of the electronic device may be reduced. If the electronic device is subjected to impact (e.g., if the electronic device is dropped), the reduced air gap may cause damage to the panel layer of the display. Since both ends of the display's bending area are vulnerable to impact, cushioning may be necessary in these areas.

[0239] An electronic device (400) according to one embodiment of the present disclosure may include a housing (410), a display (430), and a molding part (440).

[0240] In one embodiment, the display (430) may be disposed in the housing (410).

[0241] In one embodiment, the molding portion (440) may be formed at the distal end of the display (430).

[0242] In one embodiment, the display (430) may include a panel layer (431) including a bending region (4315) on at least a portion of the distal end and a protective layer (433) disposed on the panel layer (431).

[0243] In one embodiment, the protective layer (433) may include a first concave region (4335) in which at least a portion of a distal end of the protective layer (433) is formed concavely.

[0244] In one embodiment, the molding portion (440) may be positioned to fill the first concave area (4335).

[0245] In one embodiment, the first concave region (4335) may be formed at a position overlapping both ends (4315a, 4315b) of the bending region (4315) with respect to the longitudinal direction (e.g., X-axis direction) of the bending region (4315).

[0246] In one embodiment, the display (430) may include a sensor layer (434) disposed on a protective layer (433).

[0247] In one embodiment, the sensor layer (434) may include a second concave region (4345) that is formed concavely at a position overlapping the first concave region (4335).

[0248] In one embodiment, the molding portion (440) may be positioned to fill the first concave region (4335) and the second concave region (4345).

[0249] In one embodiment, the molding portion (440) may include a convex region (445) that fills the first concave region (4335) to secure the display (430) to the molding portion (440).

[0250] An electronic device (400) according to one embodiment of the present disclosure can prevent or reduce the display (430) from moving relative to the molding portion (440) when an impact is applied to the electronic device (400) by applying a molding stopper structure (e.g., a convex region (445) of the molding portion (440)) through a reverse step structure to both ends (4315a, 4315b) of the bending region (4315).

[0251] An electronic device (400) according to one embodiment of the present disclosure can prevent or reduce damage to the display (430) due to movement of the display (430) by applying a molding stopper structure (e.g., a convex region (445) of the molding portion (440)) through a reverse step structure to both ends (4315a, 4315b) of the bending region (4315).

[0252] In one embodiment, the convex region (445) is formed at a position overlapping both ends (4315a, 4315b) of the bending region (4315), and can extend from both ends (4315a, 4315b) of the bending region (4315) by a set length in a first direction parallel to the longitudinal direction of the bending region (4315) (e.g., positive X-axis direction) and a second direction opposite to the first direction (e.g., negative X-axis direction).

[0253] In one embodiment, the panel layer (431) may include a first region (431a) and a second region (431b) spaced apart from the first region (431a) in the height direction of the display.

[0254] In one embodiment, the bending region (4315) may connect the first region (431a) and the second region (431b).

[0255] In one embodiment, the display (430) may include a bonding layer (e.g., a first bonding layer (4371)) disposed between the second region (431b) of the panel layer (431) and the protective layer (433).

[0256] In one embodiment, at a location overlapping both ends (4315a, 4315b) of the bending region (4315), the bonding layer (e.g., the first bonding layer (4371)) may extend longer in the longitudinal direction of the electronic device (400) toward the side wall (415) of the housing (410) than the protective layer (433).

[0257] In one embodiment, at a location overlapping the two ends (4315a, 4315b) of the bending region (4315), the bonding layer (e.g., the first bonding layer (4371)) may extend longer in the longitudinal direction of the electronic device (400) toward the side wall (415) of the housing (410) than the sensor layer (434).

[0258] In one embodiment, the housing (410) may include a placement space (411) in which a display (430) is placed and a side wall (415) surrounding the placement space (411).

[0259] In one embodiment, the sidewall (415) may include a step region (4151) in which at least a portion of the sidewall (415) facing the inside of the electronic device (400) is formed in a step shape.

[0260] In one embodiment, the molding portion (440) may include a first molding region (4471) formed at an end of the panel layer (431) and a second molding region (4472) formed at an end of the protective layer (433).

[0261] In one embodiment, the first distance (D1) between the step region (4151) and the first molding region (4471) may be formed longer than the second distance (D2) between the step region (4151) and the second molding region (4472).

[0262] In one embodiment, the step region (4151) may be formed in an area of ​​the side wall (415) that does not overlap with the bending region (4315) of the display (430).

[0263] An electronic device (400) according to one embodiment of the present disclosure can form a step region (4151) on a portion of a side wall (415) of a housing (410) to prevent or reduce direct impact on a panel layer (431) of a display (430).

[0264] In one embodiment, the display (430) may include a polarizing layer (436) disposed on a panel layer (431), a sensor circuit for detecting the operation of an external input device, a sensor layer (434) disposed on a protective layer (433), and a shielding layer (435) disposed on the sensor layer (434) for shielding noise.

[0265] In one embodiment, the display (430) includes a window cover (420) on which the display (430) is disposed, and the molding portion (440) may be formed to fill at least a portion of the space between the distal end of the display (430) and the window cover (420).

[0266] In one embodiment, the housing (410) may include a placement space (411) and a side wall (415) surrounding the placement space (411).

[0267] In one embodiment, the display (430) is positioned in the placement space (411) and may face the side wall (415).

[0268] In one embodiment, the molding portion (440) may be formed at the distal end of the display (430).

[0269] In one embodiment, the display (430) may include a panel layer (431) and a protective layer (433) disposed on the panel layer (431).

[0270] In one embodiment, the molding portion (440) may include a first molding region (4471) formed at an end of the panel layer (431) and a second molding region (4472) formed at an end of the protective layer (433).

[0271] In one embodiment, the first distance (D1) between the side wall (415) and the first molding region (4471) may be formed longer than the second distance (D2) between the side wall (415) and the second molding region (4472).

[0272] In one embodiment, the display (430) may include a bonding layer (e.g., a fifth bonding layer (4375)) disposed between the panel layer (431) and the window cover (420).

[0273] In one embodiment, the molding portion (440) further includes a third molding region (4473) formed at an end of the bonding layer (e.g., the fifth bonding layer (4375)), and a first distance (D1) between the side wall (415) and the first molding region (4471) may be formed to be longer than a third distance (D3) between the side wall (415) and the third molding region (4473).

[0274] In one embodiment, the panel layer (430) includes a bending region (4315) at least in a portion of the distal end, and the first molding region (4471) and the second molding region (4472) can be formed at positions that do not overlap with the bending region (4315).

[0275] The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by a person having ordinary knowledge in the technical field to which the present disclosure pertains.

[0276] The effects that can be obtained from the present disclosure are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by a person having ordinary skill in the art to which the present disclosure pertains.

[0277] An electronic device according to an embodiment of the present disclosure may take various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. The electronic device according to an embodiment of the present disclosure is not limited to the aforementioned devices.

[0278] It should be understood that the embodiments of the present disclosure and the terminology used herein are not intended to limit the technical features described in the present disclosure to specific embodiments, but include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In the present disclosure, each of the phrases "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among the phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0279] The term "module" used in one embodiment of the present disclosure may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0280] An embodiment of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0281] According to one embodiment, a method according to one embodiment of the present disclosure may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0282] According to one embodiment, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to one embodiment, one or more components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each component of the plurality of components in a manner identical to or similar to that performed by the corresponding component among the plurality of components prior to the integration.

[0283] According to one embodiment, the operations performed by a module, program or other component may be performed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device (400), Housing (410); A display (430) placed in the above housing; and It includes a molding part (440) formed at the end of the above display, The above display is, A panel layer (431) including a bending region (4315) in at least a portion of the distal end; and It includes a protective layer (433) placed on the above panel layer, The above protective layer includes a first concave region (4335) in which at least a portion of a terminal portion of the protective layer is formed concavely, The above molding part, An electronic device positioned to fill the first concave area.

2. In paragraph 1, The above first concave region is, An electronic device formed at a position overlapping both ends (4315a, 4315b) of the above-described bending region based on the longitudinal direction of the above-described bending region.

3. In paragraph 1, The above display is, It further includes a sensor layer (434) arranged on the above protective layer, The above sensor layer, It includes a second concave region (4345) that is formed concavely at a position overlapping the first concave region, The above molding part, An electronic device arranged to fill the first concave area and the second concave area.

4. In paragraph 1, The above molding part, In order to fix the display to the molding part, it includes a convex area (445) filled in the first concave area, The above convex region is, An electronic device formed at a position overlapping both ends of the above-mentioned bending region, and extending from both ends of the above-mentioned bending region in a first direction parallel to the longitudinal direction of the above-mentioned bending region and in a second direction opposite to the first direction by a set length.

5. In paragraph 1, The above panel layer includes a first region (431a) and a second region (431b) spaced apart from the first region in the height direction of the display. The above bending region connects the first region and the second region, An electronic device wherein the display further includes a bonding layer (4371) disposed between the second region of the panel layer and the protective layer.

6. In paragraph 5, An electronic device in which, at a position overlapping both ends (4315a, 4315b) of the above-described bending region, the bonding layer extends longer in the longitudinal direction of the electronic device toward the side wall (415) of the housing than the protective layer.

7. In paragraph 5, The above display is, It further includes a sensor layer (434) arranged on the above protective layer, An electronic device in which, at a position overlapping both ends (4315a, 4315b) of the above-mentioned bending region, the bonding layer extends longer in the longitudinal direction of the electronic device toward the side wall (415) of the housing than the sensor layer.

8. In paragraph 1, The above housing, It includes a placement space (411) in which the above display is placed and a side wall (415) surrounding the placement space, An electronic device in which the side wall includes a step region (4151) in which at least a portion of a surface of the side wall facing the inside of the electronic device is formed in a step shape.

9. In paragraph 8, The above molding part, A first molding region (4471) formed at the end of the above panel layer; and It includes a second molding region (4472) formed at the end of the above protective layer, An electronic device in which a first distance (D1) between the step region and the first molding region is formed longer than a second distance (D2) between the step region and the second molding region.

10. In paragraph 8, The above stair area is, An electronic device formed in an area of ​​the side wall that does not overlap with the bending area of ​​the display.

11. In paragraph 1, It further includes a window cover (420) on which the above display is placed, The above molding part, An electronic device wherein at least a portion of the electronic device is formed to fill a space between an end portion of the display and the window cover.

12. In electronic devices, A housing (410) including a placement space (411) and a side wall (415) surrounding the placement space; A display (430) placed in the above arrangement space and facing the side wall; and It includes a molding part (440) formed at the end of the above display, The above display is, panel layer (431); and It includes a protective layer (433) placed on the above panel layer, The above molding part, A first molding region (4471) formed at the end of the above panel layer; and It includes a second molding region (4472) formed at the end of the above protective layer, An electronic device in which a first distance (D1) between the side wall and the first molding region is formed longer than a second distance (D2) between the side wall and the second molding region.

13. In paragraph 12, The side wall includes a step region (4151) in which at least a portion of a surface of the side wall facing the inside of the electronic device is formed in a step shape. An electronic device wherein the first distance between the step region and the first molding region is formed longer than the second distance between the step region and the second molding region.

14. In paragraph 12, It further includes a window cover (420) covering the above-mentioned arrangement space and in which the display is arranged, The above display is, It further includes a bonding layer (4375) disposed between the above panel layer and the above window cover, The above molding part, It further includes a third molding region (4473) formed at the end of the above bonding layer, An electronic device in which the first distance between the side wall and the first molding region is formed longer than the third distance (D3) between the side wall and the third molding region.

15. In paragraph 12, The above panel layer includes a bending region (4315) in at least a portion of the distal end, The above first molding area and the above second molding area, An electronic device formed at a location that does not overlap the above-mentioned bending region.

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