Energy-saving heat dissipation apparatus and system for liquid immersion cooling system

Abstract

Provided in the embodiments of the present disclosure are an energy-saving heat dissipation apparatus and system for a liquid immersion cooling system. The apparatus comprises: one or more TANK containers, each of the TANK containers being provided therein with at least one heat dissipation station for arrangement of a workpiece to be cooled; a plurality of radiators installed at the heat dissipation stations and attached to devices to be cooled of said workpieces; a plurality of fan modules located at upstream positions of the radiators and used for increasing the flow velocity of a cooling medium around said devices; and a controller used for acquiring internal temperature data of said devices and, when the temperature data is higher than a device underclocking threshold value, controlling the fan modules corresponding to said devices to operate.

Description

Energy-saving heat dissipation device and system for immersion liquid cooling system

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] The present disclosure is based on Chinese patent application CN2024100100906 filed on January 3, 2024, entitled “Energy-saving heat dissipation device and system for immersion liquid cooling system”, and claims the priority of the patent application, and all the contents disclosed therein are incorporated into the present disclosure by reference. Technical Field

[0003] The embodiments of the present disclosure relate to the technical field of heat dissipation, and in particular, to an energy-saving heat dissipation device and system for an immersion liquid cooling system. Background Art

[0004] A submerged liquid cooling system is a cooling system that uses a liquid medium to dissipate heat. Unlike traditional air cooling systems, it completely or partially immerses electronic equipment or computer components in liquid for cooling. In an immersion liquid cooling system, the device or component is placed in a tank filled with a specific liquid cooling medium (such as water or oil). The device is in direct contact with the liquid, and heat is absorbed and carried away by the liquid through conduction and convection. The cooling medium is then directed to an external heat dissipation device (such as a cooling tower or heat exchanger) via a circulation pump to dissipate heat before being recirculated into the system.

[0005] In the related art, a centralized liquid supply device is generally used to supply and circulate cooling medium for tank containers. However, this centralized liquid supply device generally circulates heat to heat-dissipating components in one or more tank containers simultaneously, making it difficult to provide targeted heat dissipation for heat-dissipating components in a single tank container. Summary of the Invention

[0006] The embodiments of the present disclosure provide an energy-saving heat dissipation system and device for an immersion liquid cooling system, which at least solves the problem in the related art that it is difficult to perform targeted heat dissipation on a heat-dissipating device in a single TANK container.

[0007] According to one embodiment of the present disclosure, there is provided an energy-saving heat dissipation device for an immersion liquid cooling system, comprising: one or more TANK containers, each of the TANK containers being provided with at least one heat dissipation station configured to place a workpiece to be cooled; a plurality of radiators installed at the heat dissipation stations and fitted with the heat dissipation devices of the workpiece to be cooled; a plurality of fan modules located upstream of the radiators and configured to accelerate the flow rate of the cooling medium around the heat dissipation devices; a controller configured to obtain temperature data inside the heat dissipation devices, and to control the fan modules corresponding to the heat dissipation devices to operate when the temperature data is higher than the device frequency reduction threshold.

[0008] According to another embodiment of the present disclosure, an energy-saving heat dissipation system of an immersion liquid cooling system is provided, comprising any of the above-mentioned devices, and further comprising: a centralized liquid supply device configured to circulate and supply cooling medium to a plurality of the TANK containers. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] FIG1 is a structural schematic diagram of an energy-saving heat dissipation device of an immersion liquid cooling system according to an embodiment of the present disclosure;

[0010] FIG2 is a second structural schematic diagram of an energy-saving heat dissipation device of an immersion liquid cooling system according to an embodiment of the present disclosure;

[0011] FIG3 is a schematic structural diagram of an energy-saving heat dissipation system of an immersion liquid cooling system according to an embodiment of the present disclosure;

[0012] FIG4 is a schematic diagram of the connection relationship between a centralized liquid supply device and a plurality of TANK containers according to an embodiment of the present disclosure.

[0013] Explanation of reference numerals: 100, cooling tower; 200, cooling water pump; 301, cooling water supply pressure sensor; 302, cooling water supply flow sensor; 303, cooling water supply temperature sensor; 304, cooling water return pressure sensor; 305, cooling water return temperature sensor; 306, circulating supply pressure sensor; 307, circulating supply flow sensor; 308, circulating supply temperature sensor; 309, circulating return pressure sensor; 310, circulating return temperature Sensor; 400, centralized liquid supply device; 401, circulation pump; 500, liquid supply electric bypass valve; 600, TANK container; 601, inner cavity temperature sensor; 602, liquid level sensor; 603, inner cavity flow equalizing plate; 604, heat dissipation station; 605, fan module; 606, radiator; 607, temperature sensor of the heat dissipated device; 610, TANK container return liquid pump; 611, composite cold plate; 700, liquid supply pipeline assembly; 800, cooling water electric valve. DETAILED DESCRIPTION

[0014] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings and in conjunction with embodiments.

[0015] It should be noted that the terms "first", "second", etc. in the specification and claims of the present disclosure and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0016] In this embodiment, an energy-saving heat dissipation device for an immersion liquid cooling system is provided. Figure 1 is a structural schematic diagram of an energy-saving heat dissipation device for an immersion liquid cooling system according to an embodiment of the present disclosure. As shown in Figure 1, the device includes: a TANK container 600, multiple groups of radiators 606, multiple groups of fan modules 605, and a controller.

[0017] The TANK container 600 is provided with at least one heat dissipation station 604 for placing a workpiece to be cooled.

[0018] In an exemplary embodiment, the number of TANK containers 600 can be one or more, and one or more TANK containers 600 are placed in a cooling station for using the stored cooling medium to dissipate heat to the workpiece being dissipated. The cooling medium can be a special liquid (such as fluorinated liquid, oil, etc.), which is pumped into the TANK container 600 to use the cooling medium contained in the TANK container 600. The workpiece being dissipated is immersed in the cooling medium to absorb and take away the heat generated by the workpiece being dissipated through the cooling medium. As shown in Figure 1, five heat dissipation stations 604 can be set in a TANK container 600 to place 10 workpieces being dissipated. Of course, Figure 1 is only an example, and the number of heat dissipation stations 604 in each can be set according to actual conditions, and this disclosure does not limit it. Moreover, the number of workpieces being dissipated placed in each heat dissipation station 604 is also not limited and can be set according to actual conditions.

[0019] A plurality of heat sinks 606 are installed in the heat dissipation station 604 and fit in with the heat dissipation components of the workpiece to be cooled.

[0020] In one embodiment, the heat sink 606 is a copper heat sink or a VC composite heat sink.

[0021] In an exemplary embodiment, a copper heat sink 606 is made of copper. Through the design of heat pipes and heat sinks, copper's excellent thermal conductivity and heat dissipation capabilities are utilized to quickly and efficiently dissipate heat generated by the workpiece being dissipated into the cooling medium, maintaining the temperature of the workpiece within a safe range. A VC composite heat sink 606 is a heat sink 606 that combines copper and aluminum materials and utilizes evaporation chamber technology. The combination of copper and aluminum in an evaporation chamber provides more efficient heat dissipation.

[0022] The plurality of fan modules 605 are located upstream of the heat sink 606 and are configured to increase the flow rate of the cooling medium around the heat dissipating components.

[0023] In an exemplary embodiment, as shown in FIG1 , the cooling medium flows from the location of the fan module 605 within the tank container 600 to the location of the radiator 606. Based on the flow direction of the cooling medium, the fan module 605 is located upstream of the radiator 606. As the cooling medium flows within the tank container 600, the fan module 605 disrupts the cooling medium. This disruptive flow changes the cooling medium's flow path and velocity, thereby "pushing" the cooling medium near the radiator 606 away, allowing the cooling medium near the fan module 605 to flow to the vicinity of the radiator 606 to convert energy for the radiator 606.

[0024] In one embodiment, the device further includes an inner cavity flow balancing plate 603, which is disposed within the tank container 600. Multiple sets of inner cavity flow balancing plates 603 may be provided, with multiple inner cavity flow balancing plates 603 disposed parallel to each other within the tank container 600. Alternatively, the plurality of inner cavity flow balancing plates 603 may be installed and disposed in accordance with practical circumstances, which is not limited in this disclosure. The inner cavity flow balancing plates 603 are connected to multiple shunt pipes, each of which is connected to a heat dissipation station 604 at one end away from the inner cavity flow balancing plate 603 to allow the cooling medium to circulate.

[0025] The controller is configured to obtain temperature data inside the heat dissipation device, and control the fan module 605 corresponding to the heat dissipation device to operate when the temperature data is higher than the device frequency reduction threshold.

[0026] In an exemplary embodiment, each heat dissipation component is integrated with a heat dissipation component temperature sensor 607 during installation. The heat dissipation component is installed in the heat dissipation workpiece. The heat dissipation workpiece can be communications equipment such as servers, routers, switches, and BBUs, while the heat dissipation workpiece can be chips such as CPUs and GPUs. By receiving the temperature collected by the heat dissipation component temperature sensor 607, the controller can determine the operating temperature of the heat dissipation component corresponding to the heat dissipation component temperature sensor 607. By comparing the received temperature data with the device frequency reduction threshold, the controller controls the operation of the corresponding fan module 605 to cool the heat dissipation component.

[0027] In an exemplary embodiment, a plurality of heat dissipation device temperature sensors 607 are installed in the heat dissipation workpiece, and each heat dissipation device temperature sensor 607 is placed near the heat dissipation device to collect temperature data of the heat dissipation device.

[0028] In an exemplary embodiment, a thermistor network is used to measure the temperatures of multiple heat dissipation devices. The thermistor network connects multiple thermistors to a circuit board, with each thermistor connected to a heat dissipation device. The temperature of each heat dissipation device is obtained by measuring the change in resistance of each thermistor. For example, a table is pre-established that correlates resistance values ​​with temperatures. The temperature corresponding to each resistance value is obtained based on the table. Alternatively, the thermistor values ​​at known temperatures are pre-measured, and a calibration curve is generated based on the measurement results. The calibration curve represents a functional relationship between resistance value and temperature. The measured resistance value is then used to find the corresponding temperature based on the functional relationship.

[0029] According to the present disclosure, each tank container 600 is provided with at least one heat dissipation station 604, which is configured to accommodate a workpiece to be cooled. Each heat dissipation station 604 is equipped with a radiator 606, which fits snugly against the workpiece to effectively conduct heat from the workpiece to the radiator 606. Furthermore, a fan module 605 is installed upstream of each radiator 606 to increase the flow rate of the cooling medium around the cooled component.

[0030] In addition, the present disclosure includes a controller configured to acquire temperature data from the heat dissipation device. When the temperature data exceeds a preset device frequency reduction threshold, the controller activates the corresponding fan module 605. This allows for targeted cooling of the heat dissipation device within a single tank container 600, overcoming the limitation of the centralized liquid supply device 400 in its inability to precisely control heat dissipation.

[0031] In one embodiment, the fan module 605 may be an axial flow fan or a mixed flow fan.

[0032] In an exemplary embodiment, the use of an axial flow fan or a mixed flow fan can bring the following technical effects:

[0033] Improved heat dissipation efficiency: The fan quickly removes heat from the cooling medium through forced circulation and convection, effectively reducing the temperature of the cooling medium. This helps the heat dissipated components maintain a normal operating temperature and improves heat dissipation efficiency.

[0034] Uniform cooling: The fan generates airflow that evenly transfers heat from the cooling medium to the entire cooling area. This avoids hot spots, ensures comprehensive and uniform cooling of the cooling medium, and prevents overheating of the heat dissipated components.

[0035] Enhanced heat transfer: The convection effect of fans can enhance the heat transfer process. By generating air flow, fans accelerate the heat exchange between the cooling medium and the heat dissipation surface, thereby enhancing the heat transfer effect.

[0036] Improved heat dissipation efficiency: The fan can directly remove heat from the cooling medium and discharge it, preventing the cooling medium from being exposed to overheating. This can help improve heat dissipation efficiency and effectively protect the normal operation of the components being dissipated.

[0037] Better controllability: Axial and mixed flow fans can usually be adapted to different cooling requirements by adjusting the fan speed or using a multi-stage speed control design. This improves the flexibility and controllability of the entire device and allows adjustments based on actual conditions.

[0038] In one embodiment, the device further includes a liquid level sensor 602 .

[0039] The liquid level sensor 602 is configured to detect the liquid level of the coolant in the tank container 600 and transmit the liquid level result and the tank container number 600 to the controller. Each liquid level sensor 602 is provided with an IP address, and the tank container number 600 can be obtained by identifying the IP address of the liquid level sensor 602.

[0040] In an exemplary embodiment, in order to measure the liquid level of the cooling medium in the TANK container 600, the following installation methods can be used:

[0041] 1. Immersion installation: Immerse the liquid level sensor 602 directly into the tank container 600 so that it is exposed to the liquid surface. The sensor will measure the height of the liquid and convert it into a corresponding liquid level signal.

[0042] 2. External installation: Install the sensor on the outside of the TANK container 600 and connect it to the liquid through the wall or side hole. The sensor determines the liquid level by measuring the pressure difference between the liquid and the sensor.

[0043] 3. Plug-around installation: Install a pipe around the tank 600 on the wall and install the sensor inside the pipe. The liquid will be connected to the sensor through the pipe, and the sensor will measure the liquid level.

[0044] 4. Non-contact installation: Use a non-contact liquid level sensor 602, such as a radar or ultrasonic sensor. These sensors transmit a signal from the outside of the container to the inside and measure the liquid level by receiving the reflection of the signal.

[0045] In one embodiment, the controller is further configured to: when it is identified that the liquid level result is higher than the maximum liquid level height, reduce the rotation speed of the fan module 605 until the liquid level result is lower than the maximum liquid level height.

[0046] In an exemplary embodiment, because the tank container 600 is often a semi-enclosed container, i.e., the top of the tank container 600 is often open or equipped with a removable dust cover, resulting in a weak seal, the liquid level of the coolant in the tank container 600 is monitored in real time by a liquid level sensor 602, thereby controlling the rotation speed of the fan module 605 to reduce the probability of the coolant overflowing from the tank container 600 when the fan module 605 is operating.

[0047] In one embodiment, the controller is further configured to start the fan module 605 when the temperature data is higher than the device frequency reduction threshold and the liquid level result is lower than the maximum liquid level height.

[0048] In an exemplary embodiment, when the liquid level is below the maximum liquid level and the temperature data is above the device frequency reduction threshold, it indicates that the heat dissipation device needs to be cooled. When the liquid level is below the maximum liquid level, the activation conditions of the fan module 605 are met, and the fan module 605 is used to cool the heat dissipation device, thereby improving the heat dissipation efficiency of the heat dissipation device.

[0049] In one embodiment, the device further includes an internal temperature sensor 601 configured to measure the temperature of the cooling medium within one or more tank containers 600 and output the temperature result and the serial number of the tank container 600. Each temperature sensor is provided with an IP address, and the serial number of the corresponding tank container 600 can be obtained by identifying the IP address of the temperature sensor.

[0050] In an exemplary embodiment, in order to measure the temperature of the cooling medium in the TANK container 600, the following installation methods can be used:

[0051] Insertion sensor: The temperature sensor is inserted into the tank container 600. The sensor can be mounted on the wall or top of the tank container 600 through a hole or flange connector, directly contacting the cooling medium to measure the temperature.

[0052] Surface-mounted sensor: The temperature sensor is attached to the outer surface of the TANK container 600. The sensor can be fixed to the container surface by adhesive or magnetism to measure the temperature of the outer wall in real time.

[0053] Sensing through thermal conductive materials: Use thermal conductive materials, such as thermal film or thermal patch, to place the temperature sensor in direct contact with the TANK container 600. The thermal conductive material can help the sensor sense the temperature change of the cooling medium more quickly and transfer heat from the cooling medium to the sensor.

[0054] Inlet / outlet pipe installation: Install the temperature sensor on the inlet or outlet pipe of the cooling medium to measure the temperature of the cooling medium entering or leaving the TANK container 600. This method can provide monitoring of instantaneous temperature changes of the cooling medium.

[0055] Figure 2 is a second structural schematic diagram of an energy-saving heat dissipation device of an immersion liquid cooling system according to an embodiment of the present disclosure. In one embodiment, as shown in Figure 2, the fan module 605 and the radiator 606 can be replaced by a TANK container return liquid pump 610, a composite cold plate 611, and a branch electric valve 612.

[0056] In an exemplary embodiment, a composite cold plate 611 is installed at a heat dissipation station, aligned with the device being dissipated. A tank return pump 610 is installed in the cooling medium loop of the tank 600, providing circulation power for the cooling medium. A branch electric valve 612 is installed in the diversion pipeline of the inner cavity flow equalizing plate 603 to control the flow of cooling medium at the corresponding heat dissipation station. The branch electric valve is electrically connected to a controller.

[0057] The controller obtains temperature data from the temperature sensor in the heat-dissipating device. When the temperature data is higher than the device frequency reduction threshold, the controller controls the TANK container liquid return pump 610 to operate and opens the branch electric valve 612 corresponding to the heat-dissipating device. The TANK container liquid return pump pumps cooling medium to the heat dissipation station corresponding to the heat-dissipating device, so that the cooling medium dissipates heat from the composite cold plate 611, thereby dissipating heat for the heat-dissipating device.

[0058] Figure 3 is a structural schematic diagram of an energy-saving heat dissipation system of an immersion liquid cooling system according to an embodiment of the present disclosure. In this embodiment, an energy-saving heat dissipation system of an immersion liquid cooling system is also provided. As shown in Figure 3, the system not only includes the device of the above-mentioned embodiment, but also includes: a centralized liquid supply device 400, which is configured to circulate and supply cooling medium to one or more TANK containers 600.

[0059] In one exemplary embodiment, the system includes not only a cooling module formed by a fan module 605 and a radiator 606, but also a centralized liquid supply device 400 as a second cooling module. These two cooling modules work together to dissipate heat, improving the efficiency of heat dissipation for the components being cooled. Furthermore, the centralized liquid supply device 400 not only dissipates heat for the components being cooled, but also enables timely replenishment of cooling medium into the TANT container, enhancing the device's applicability.

[0060] In one embodiment, the centralized liquid supply device 400 includes a circulation pump 401 configured to provide circulation power for the cooling medium in the liquid supply pipeline assembly 700 so that the cooling medium circulates between the centralized liquid supply device 400 and the TANK container 600 .

[0061] In one embodiment, the system also includes a liquid supply electric bypass valve 500, which is arranged between the heat dissipation input pipe and the heat dissipation output pipe of the centralized liquid supply device 400, and is configured to form a diversion branch between the heat dissipation input pipe and the heat dissipation output pipe when the speed of the circulation pump 401 of the centralized liquid supply device 400 is reduced to a first speed.

[0062] In an exemplary embodiment, as shown in Figure 3, when a centralized liquid supply device 400 is used to dissipate heat for a heat-dissipating device, an additional flow path is created between the centralized liquid supply device 400 and the heat-dissipating device when the liquid supply electric bypass valve 500 is open. If the cooling medium in the tank container 600 becomes saturated, the cooling medium can be easily diverted back to the centralized liquid supply device 400 through the diversion branch of the liquid supply electric bypass valve 500, thereby reducing the probability of cooling medium overflowing from the tank container 600. Alternatively, the cooling medium can flow from the tank container 600 through the diversion branch and then back into the tank container 600, effectively conserving cooling medium.

[0063] In one embodiment, the system further includes: a cooling tower 100 and a cooling water pump 200. The cooling tower 100 is configured to perform heat exchange for the cooling medium of the centralized liquid supply device 400.

[0064] In an exemplary embodiment, the cooling tower 100 may be one or more of the following types:

[0065] Open air cooling tower: can include an open pool and several tower bodies, supply cooling medium through the tower fill and spray system for heat exchange, while fans enhance the heat dissipation effect by generating air flow.

[0066] Closed Cooling Tower: Closed cooling tower is also known as cooling tower cover, which is a sealed type that uses a water filtration system or air cooling system to introduce the cooling medium into the tower through pipes.

[0067] Cold Plate Heat Exchanger: A cold plate heat exchanger is a cooling device that exchanges heat directly through a cooling plate. The cold plate can be made of metal and uses a cooling medium to cool the plate surface, efficiently transferring heat to the ambient air or other cooling medium.

[0068] Radiator: A radiator is a device that transfers heat through fins and a fan. The fins are typically made of aluminum or copper. The cooling medium cools the fins, while the fan generates airflow to enhance the heat dissipation.

[0069] The cooling tower 100 may include the following components:

[0070] Cooling tower shell: The cooling tower shell is the outer structure of the entire cooling tower 100, which is used to protect the internal components and provide structural support. The shell can be made of corrosion-resistant materials such as metal or composite materials.

[0071] The tower body is the main part of the cooling tower 100, containing the space where the cooling medium flows. It can be a flow type (horizontal or vertical flow) or a counterflow type (horizontal or vertical flow).

[0072] Tower packing: Tower packing is the filling material inside the tower body, used to increase the surface area and contact area, and promote heat exchange between the cooling medium and the ambient air. The packing material can be plastic, metal or ceramic.

[0073] Spraying system: The spraying system is responsible for evenly spraying the cooling medium in the centralized liquid supply device 400 onto the tower packing. The spraying system may include a spray head, a recirculation pump, a water tank, and related pipes.

[0074] Fan: The fan is a major component in the cooling tower 100, creating air flow to facilitate heat transfer. The fan can be mounted on the top of the tower and can be an axial flow fan or a mixed flow fan.

[0075] Air vent: The air vent is the outlet where the air flow generated by the fan is discharged from the cooling tower 100. The air vent can be located on the side or top of the tower, and a guide cover or wind direction plate can be set to control the direction and distribution of the air flow.

[0076] Multi-stage spray system: The multi-stage spray system provides higher cooling effect through multi-stage nozzles and tower body, and performs multiple cooling during the heat exchange process.

[0077] Delivery pipes and valves: Delivery pipes and valves are used to guide the cooling medium from the centralized liquid supply device 400 to the cooling tower 100 and control the flow of the cooling medium.

[0078] Control system: The control system is configured to monitor and adjust operating parameters of the cooling tower 100, such as temperature, pressure, and flow. The control system may include components such as sensors, controllers, and automatic regulating valves.

[0079] The control system of the cooling tower 100 is connected to the controller so that the controller communicates with the control system of the cooling tower 100 .

[0080] The cooling water pump 200 is configured to provide circulation power for the coolant circulating between the cooling tower 100 and the centralized liquid supply device 400 .

[0081] In an exemplary embodiment, the cooling water pump 200 may be one or more of the following: a centrifugal pump, an axial flow pump, a positive displacement pump, and a micro pump.

[0082] Centrifugal pumps use a rotating impeller to generate centrifugal force, drawing liquid into the pump body and pushing it to the pump outlet as the impeller rotates. Axial flow pumps use the rotating impeller to push liquid along the axis, enabling both pumping and draining. Positive displacement pumps, also known as gear pumps or screw pumps, use a chamber with varying volume to draw in and discharge liquid. Micropumps are small, electric pumps used for low-flow and low-pressure applications.

[0083] In one embodiment, the cooling liquid is water or an ethylene glycol solution.

[0084] In one embodiment, the system also includes a cooling water electric valve 800, which is arranged between the cooling water input pipe and the cooling water output pipe of the cooling tower 100, and is configured to form a diversion branch between the cooling water input pipe and the cooling water output pipe when the speed of the cooling water pump 200 is reduced to a preset speed.

[0085] In an exemplary embodiment, as shown in FIG3 , since the cooling water electric valve 800 is disposed between the cooling water inlet and outlet pipes of the cooling tower 100, when the cooling water electric valve 800 is opened, a shunt branch is created between the cooling tower 100 and the centralized liquid supply device 400. When the speed of the cooling water pump 200 decreases to a preset speed, the cooling water circulation needs to be stopped. The cooling water between the cooling tower 100 and the centralized liquid supply device 400 can flow back into the cooling tower 100 or back into the centralized liquid supply device 400 through the shunt branch, thereby accelerating the efficiency of stopping the cooling water circulation.

[0086] In one embodiment, the controller is further configured to obtain the rotational speed of the fan module 605. When the temperature data exceeds the device frequency reduction threshold and the fan module 605 is outputting at full power, at least one of the following factors is increased: the rotational speed of the cooling water pump 200, the rotational speed of the fan of the cooling tower 100, or the flow output of the centralized liquid supply device 400.

[0087] In an exemplary embodiment, the following method may be used:

[0088] Use a bidirectional communication interface: Ensure that the fan module 605 can communicate bidirectionally with the controller. You can choose a communication protocol such as Modbus or CAN bus so that the controller can send commands to the fan module 605 and receive speed data.

[0089] Install a speed sensor: Install a speed sensor on the fan module 605 to measure the rotor's rotational speed. The sensor can be an optical encoder, a Hall effect sensor, or a magnetic sensor. Choose the appropriate sensor type based on the characteristics of the fan module 605.

[0090] Connect the sensor to the controller: Connect the speed sensor to the controller. This can be done either wired or wirelessly. If you choose a wired connection, use a cable to connect the sensor's output signal to the controller's input port. If you choose a wireless connection, use a wireless transmission module to transmit the sensor signal to the controller.

[0091] Data processing and analysis: After receiving the speed data from the sensor, the controller needs to process and analyze it. Depending on the sensor type and communication protocol specifications, the controller can parse the received raw data and convert it into speed values ​​for subsequent control and monitoring.

[0092] Control and Monitoring: The controller can control and monitor fan module 605 based on the acquired speed data. Based on system requirements, a speed control strategy can be developed, such as adjusting the fan speed to achieve the desired cooling effect or energy efficiency. The controller can also monitor speed data in real time to detect abnormalities and perform fault diagnosis.

[0093] In an exemplary embodiment, when the temperature data is higher than the device frequency reduction threshold and the fan module 605 is outputting at full power, it indicates that the fan module 605 can no longer meet the heat dissipation demand of the heat-dissipating device. By increasing the rotation speed of the cooling water pump 200, the rotation speed of the fan of the cooling tower 100, and the flow output of the centralized liquid supply device 400, the centralized liquid supply device 400, the cooling tower 100, and the fan module 605 can work together to dissipate heat for the heat-dissipating device, thereby further improving the heat dissipation efficiency of the heat-dissipating device.

[0094] In one embodiment, the controller is also configured to: when the temperature data is lower than a preset difference of the device frequency reduction threshold, first control the reduction of the speed of the cooling water pump 200 and the speed of the fan of the cooling tower 100, then control the reduction of the flow output of the centralized liquid supply device 400, and finally control the reduction of the speed of the fan module 605.

[0095] In an exemplary embodiment, when the temperature data is lower than the preset difference of the device frequency reduction threshold, it indicates that the temperature of the heat dissipated device has dropped to the required reasonable range. At this time, it is necessary to stop the cooling tower 100, the centralized liquid supply device 400, and the fan module 605 to continue heat dissipation. Since the power consumption of the cooling tower 100 is greater than the power consumption of the centralized liquid supply device 400, and the power consumption of the centralized liquid supply device 400 is greater than the power consumption of the fan module 605, the work is gradually stopped according to the order of power consumption from high to low to meet the energy saving needs.

[0096] In one embodiment, the system further includes: a cooling water supply pressure sensor 301 , a cooling water supply flow sensor 302 , a cooling water supply temperature sensor 303 , a cooling water return pressure sensor 304 , and a cooling water return temperature sensor 305 .

[0097] In an exemplary embodiment, the cooling water supply pressure sensor 301, the cooling water supply flow rate sensor 302, and the cooling water supply temperature sensor 303 are all installed in the piping assembly of the liquid supply line between the cooling tower 100 and the centralized liquid supply device 400, and are respectively used to monitor the pressure, flow rate, and temperature of the cooling water flowing from the cooling tower 100 to the centralized liquid supply device 400, and transmit the pressure data, flow data, and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400. The cooling water return pressure sensor 304 and the cooling water return temperature sensor 305 are both installed in the piping assembly of the liquid return line between the cooling tower 100 and the centralized liquid supply device 400, and are respectively used to monitor the pressure and temperature of the cooling water flowing back from the centralized liquid supply device 400 to the cooling tower 100, and transmit the pressure data and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400.

[0098] In one embodiment, the system further includes: a circulating liquid supply pressure sensor 306 , a circulating liquid supply flow sensor 307 , a circulating liquid supply temperature sensor 308 , a circulating liquid return pressure sensor 309 , and a circulating liquid return temperature sensor 310 .

[0099] In an exemplary embodiment, the circulating liquid supply pressure sensor 306, the circulating liquid supply flow rate sensor 307, and the circulating liquid supply temperature sensor 308 are all installed in the piping assembly of the liquid supply line between the centralized liquid supply device 400 and the TANK container 600, and are respectively used to monitor the pressure, flow rate, and temperature of the cooling medium flowing from the centralized liquid supply device 400 to the TANK container 600, and transmit the pressure data, flow data, and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400. The circulating liquid return pressure sensor 309 and the circulating liquid return temperature sensor 310 are both installed in the piping assembly of the liquid return line between the centralized liquid supply device 400 and the TANK container 600, and are respectively used to monitor the pressure and temperature of the cooling medium flowing from the TANK container 600 to the centralized liquid supply device 400, and transmit the pressure data and temperature data to the controller and / or the control system of the cooling tower 100 and / or the control system of the centralized liquid supply device 400.

[0100] FIG4 is a schematic diagram of the connection relationship between a centralized liquid supply device and multiple TANK containers according to an embodiment of the present disclosure. In an exemplary embodiment, as shown in FIG4 , a centralized liquid supply device 400 can be connected to TANK container 1, TANK container 2, ..., TANK container N. Of course, the illustration is only an example, and a centralized liquid supply device 400 can also be connected to only one large TANK container. Among them, an electric valve is provided in the pipeline assembly connecting a centralized liquid supply device to each TANK container, and the electric valve is electrically connected to the controller and / or the centralized liquid supply device 400 control system so that the controller and / or the centralized liquid supply device 400 control system can control the working state of each electric valve.

[0101] The foregoing is merely an exemplary embodiment of the present disclosure and is not intended to limit the present disclosure. Those skilled in the art will readily appreciate that the present disclosure is susceptible to various modifications and variations. Any modifications, equivalent substitutions, improvements, and the like made within the principles of the present disclosure shall be included within the scope of protection of the present disclosure.

Claims

1. An energy-saving heat dissipation device for an immersion liquid cooling system, comprising: One or more TANK containers, each of which is provided with at least one heat dissipation station for placing the workpiece to be cooled; Multiple groups of radiators, installed at the heat dissipation station and in contact with the heat dissipation devices of the workpiece to be cooled; Multiple groups of fan modules, located upstream of the radiators and configured to accelerate the flow rate of the cooling medium around the heat dissipation devices; A controller, configured to obtain the temperature data inside the heat dissipation devices and, when the temperature data is higher than the device downclocking threshold, control the corresponding fan module of the heat dissipation devices to operate.

2. The device according to claim 1, wherein It further comprises: A liquid level sensor, configured to obtain the liquid level of the cooling medium in the TANK container and transmit the liquid level result and the number of the TANK container to the controller; The controller is further configured to: When it is recognized that the liquid level result is higher than the maximum liquid level height, reduce the rotation speed of the fan module until the liquid level result is lower than the maximum liquid level height.

3. The device according to claim 2, wherein The controller is further configured to: When the temperature data is higher than the device downclocking threshold and the liquid level result is lower than the maximum liquid level height, start the fan module.

4. The device according to claim 1, wherein The radiator is a copper radiator or a VC composite radiator.

5. The apparatus according to claim 1, wherein, The fan module can be an axial flow fan or a mixed flow fan.

6. An energy-saving heat dissipation system for an immersion liquid cooling system, comprising the device according to any one of claims 1 to 5, and further comprising: A centralized liquid supply device, configured to circulate and supply the cooling medium to multiple TANK containers.

7. The system according to claim 6, wherein, It further comprises: A cooling tower, configured to exchange heat for the cooling medium of the centralized liquid supply device; A cooling water pump, configured to provide circulating power for the coolant circulating between the cooling tower and the centralized liquid supply device.

8. The system according to claim 7, wherein, The controller is further configured to: Obtain the rotation speed of the fan module; When the temperature data is higher than the device downclocking threshold and the fan module outputs at full power, increase at least one of the following factors: the rotation speed of the cooling water pump, the rotation speed of the fan of the cooling tower, the flow output of the centralized liquid supply device.

9. The system according to claim 7, wherein, The controller is further configured to: When the temperature data is lower than a preset difference of the device downclocking threshold, first control to reduce the rotation speed of the cooling water pump and the rotation speed of the fan of the cooling tower, then control to reduce the flow output of the centralized liquid supply device, and finally control to reduce the rotation speed of the fan module.

10. The system according to claim 7, wherein, The coolant is water or ethylene glycol solution.

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