Electronic device and electronic device system

Abstract

Embodiments of present application provide an electronic device and an electronic device system. The electronic device comprises a display screen, a metal plate, and a first coil. The metal plate is arranged on a backlight side of the display screen. At least part of the metal plate is attached to the display screen so as to support the display screen. The first coil is arranged on the side of the metal plate facing away from the display screen. The metal plate and the first coil are insulated from each other. The metal plate comprises a gap. In the thickness direction of the metal plate, the orthographic projection of the gap and the orthographic projection of the first coil have an overlapping area. According to the electronic device provided by the embodiments of the present application, even though the metal plate is arranged between the first coil and an external coil, a wireless charging function still can be realized, and a good wireless charging effect is guaranteed.

Description

Electronic equipment and electronic equipment system Technical Field

[0001] The embodiments of the present application relate to the field of terminal technology, and in particular to an electronic device and an electronic device system. Background Art

[0002] Wireless charging technology is a type of inductive charging technology. It involves a transmitter and a receiver. Energy is transferred between the two terminals through electromagnetic induction. The transmitter can be a transmitting coil, and the receiver can be a receiving coil. When the transmitting coil and receiving coil are in close proximity, energy is transferred through magnetic coupling. When the transmitting coil generates current, it produces an alternating magnetic field. This alternating magnetic field then generates current in the receiving coil, thus achieving energy transfer. A complete metal structure is typically not allowed between the transmitting and receiving coils. Otherwise, the metal structure absorbs electromagnetic energy, causing eddy current losses and heating. The dimensions of both the transmitting and receiving coils are smaller than the complete metal structure, completely shielding them. This metal structure can affect the electromagnetic induction effect of the receiving coil, resulting in poor wireless charging performance. However, in some structural designs, a metal structure is required between the transmitting and receiving coils to meet structural reliability requirements. Therefore, ensuring good wireless charging performance with a metal structure between the transmitting and receiving coils is a pressing issue.

[0003] Summary of the Invention

[0004] The embodiments of the present application provide an electronic device and an electronic device system, which can realize a wireless charging function and ensure a good wireless charging effect when a metal plate is provided between the first coil and the external coil.

[0005] A first aspect of an embodiment of the present application provides an electronic device, which includes a display screen, a metal plate, and a first coil.

[0006] The metal plate is disposed on the backlight side of the display screen. At least a portion of the metal plate is positioned in contact with the display screen to support the display screen. The first coil is disposed on the side of the metal plate facing away from the display screen. The metal plate and the first coil are insulated from each other. The metal plate includes a gap. Along the thickness direction of the metal plate, the orthographic projection of the gap overlaps with the orthographic projection of the first coil.

[0007] The electronic device of an embodiment of the present application includes a display screen, a metal plate and a first coil. The display screen, the metal plate and the first coil are stacked on each other. The metal plate includes a gap. Along the thickness direction of the metal plate, the orthographic projection of the gap and the orthographic projection of the first coil have an overlapping area. The gap provided on the metal plate can effectively change the current flow path, so that annular eddy currents with large diameters are less likely to appear on the metal plate, thereby helping to reduce eddy current losses. Since the gap is provided on the metal plate, the first coil, the metal plate and the external coil can form a coupling structure. When the metal plate is in a magnetic field, the eddy current loss of the metal plate itself is relatively low, so as to reduce the degree of shielding of the metal plate itself to the magnetic field. The first coil, the metal plate and the external coil have a relatively high electromagnetic wave energy conversion efficiency, so that when a metal plate is provided between the first coil and the external coil, the wireless charging function can also be realized, while ensuring a good wireless charging effect.

[0008] In one possible implementation, the first coil includes an inner boundary and an outer boundary. Along the thickness direction of the metal plate, an orthographic projection of the gap is located between the inner boundary and the outer boundary.

[0009] The gap does not extend beyond the inner and outer boundaries of the first coil. Along the thickness of the metal plate, the orthographic projection of the gap can lie within the orthographic projection of the first coil. When current is generated on the metal plate in a magnetic field, the gap between the inner and outer boundaries effectively alters the current flow path, making it less likely for large-diameter annular eddy currents to form on the metal plate, thereby reducing eddy current losses.

[0010] In one possible embodiment, the first coil includes an inner boundary and an outer boundary. The gap includes a first region and a second region. The first region and the second region are connected. Along the thickness direction of the metal plate, an orthographic projection of the first region is located outside at least one of the outer boundary and the inner boundary. Along the thickness direction of the metal plate, an orthographic projection of the second region is located between the inner boundary and the outer boundary.

[0011] When current is generated on the metal plate in the magnetic field, the first area and the second area of ​​the gap can be used together to change the current flow path, so that annular eddy currents with larger diameters are less likely to appear on the metal plate, thereby further reducing eddy current losses.

[0012] In a possible embodiment, the metal plate is continuous and uninterrupted in the area outside the gap.

[0013] In a possible embodiment, the metal plate is an integrally formed structure, which is relatively easy to process.

[0014] In a possible implementation manner, a non-magnetic body is provided in the gap.

[0015] The non-magnetic material can provide support for the metal plate. The metal plate itself is relatively thin, so after the gap is set, the portion of the metal plate near the gap may bend due to internal stress or external stress. In the embodiments of the present application, the non-magnetic material can provide support for the metal plate, thereby reducing the possibility of bending in the portion of the metal plate near the gap.

[0016] In a possible embodiment, the number of the metal plates is more than two, and the more than two metal plates are stacked along the thickness direction of the metal plates.

[0017] In a possible implementation, the shapes of the gaps on any two metal plates are different. The shape of the gap on each metal plate can be flexibly selected.

[0018] In a possible implementation manner, the shapes of the slots on at least two metal plates are the same.

[0019] In a possible implementation, the first coil is bonded to the metal plate, thereby facilitating connection between the first coil and the metal plate.

[0020] In one possible embodiment, the width of the gap ranges from 0.1 mm to 0.5 mm.

[0021] In one possible implementation, the thickness of the metal plate ranges from 0.03 mm to 0.3 mm.

[0022] In a possible implementation, the gap includes a first sub-gap and a second sub-gap, the first sub-gap and the second sub-gap are connected to each other, and the extension direction of the first sub-gap is different from the extension direction of the second sub-gap.

[0023] The first sub-gap and the second sub-gap can change the current flow path in different directions, so that annular eddy currents with large diameters are less likely to appear on the metal plate. At the same time, the current generated on the metal plate has areas with opposite flow directions, which is beneficial to reducing eddy current losses.

[0024] In a possible implementation manner, one first sub-slot is provided corresponding to two or more second sub-slots, and the two or more second sub-slots are spaced apart from each other.

[0025] In a possible implementation manner, second sub-slots are respectively provided on two opposite sides of the first sub-slot.

[0026] In a possible implementation manner, a second sub-slot is provided on one side of the first sub-slot.

[0027] In a possible implementation, in two or more second sub-slots located on the same side of the first sub-slot, the extension directions of the second sub-slots are arranged parallel to each other, so that the second sub-slots are arranged regularly and orderly, which helps to reduce the difficulty of processing.

[0028] In a possible implementation, the number of the first sub-slots is more than two, the number of the second sub-slots is more than two, and the first sub-slots and the second sub-slots are alternately arranged.

[0029] In a possible implementation, the extension directions of the first sub-slits are arranged parallel to each other, so that the first sub-slits are arranged regularly and orderly, which helps to reduce the difficulty of processing.

[0030] In a possible implementation manner, an extending direction of the first sub-slit and an extending direction of the second sub-slit are perpendicular to each other.

[0031] In a possible implementation, a first sub-slit passes through the edge of the metal plate to form a gap, and a gap exists between the second sub-slit and the edge of the metal plate.

[0032] The way in which the first sub-gap passes through the edge of the metal plate to form a gap can, on the one hand, be conducive to the coupling structure formed by the first coil, the metal plate and the external coil to achieve a relatively high electromagnetic wave energy conversion efficiency; on the other hand, there is no need to set up additional capacitors on the metal plate, so as to eliminate the connection process between the metal plate and the capacitor (such as welding process), and at the same time avoid the additional capacitors from occupying space in the thickness direction of the metal plate.

[0033] In a possible implementation manner, there is a distance between the first sub-slit and the edge of the metal plate, and there is a distance between the second sub-slit and the edge of the metal plate.

[0034] In a possible implementation manner, the gap is spiral-shaped.

[0035] The spiral gap is conducive to changing the current flow path, so that the current generated on the metal plate has an area with opposite flow direction, and the generated magnetic field has a relatively low magnetic induction intensity, which can help further reduce the eddy current loss on the metal plate.

[0036] In a possible implementation, the number of the gaps is two or more, and the two or more gaps are arranged at intervals.

[0037] In a possible embodiment, the slit passes through the edge of the metal plate to form a notch.

[0038] The method of forming a gap by passing through the edge of the metal plate can, on the one hand, help the coupling structure formed by the first coil, the metal plate and the external coil to achieve a relatively high electromagnetic wave energy conversion efficiency; on the other hand, there is no need to set up additional capacitors on the metal plate, so as to eliminate the connection process between the metal plate and the capacitor (such as welding process), and at the same time avoid the additional capacitors from occupying space in the thickness direction of the metal plate.

[0039] In one possible embodiment, there is a distance between the gap and the edge of the metal plate.

[0040] In one possible embodiment, the slit extends through the edge of the metal plate to form a notch. The electronic device further includes a capacitor. The capacitor includes a first electrode and a second electrode. The metal plate includes a first connection point and a second connection point. The first connection point and the second connection point are respectively located on opposite sides of the notch. The first electrode and the second electrode are electrically connected to the first connection point and the second connection point, respectively.

[0041] The method of additionally arranging a capacitor on the metal plate can help the coupling structure formed by the first coil, the metal plate and the external coil to achieve relatively high electromagnetic wave energy conversion efficiency.

[0042] In a possible implementation, the electronic device includes a housing, and the display screen is a flexible display screen.

[0043] The housing includes a frame and a hinge. The two frames are rotatably connected to the hinges. The two frames rotate relative to the hinges to switch between a folded state and an unfolded state. The flexible display includes a non-bending portion and a bendable portion. The bendable portion is located between the two non-bending portions. The two non-bending portions are connected to the two frames, respectively. When the two frames are in the folded state, both frames are located between the two non-bending portions. When the two frames are in the unfolded state, the flexible display is unfolded. The first coil is provided corresponding to each non-bending portion. The metal plate is located between the first coil and the non-bending portion.

[0044] In one possible embodiment, the electronic device further includes a housing. The housing includes a middle plate. The metal plate and the first coil are both disposed between the middle plate and the display screen. The first coil is disposed on a surface of the metal plate facing the middle plate.

[0045] A second aspect of the embodiments of the present application provides an electronic device system, which includes the electronic device and a charging device as described in the above embodiments.

[0046] The charging device includes a second coil. When the electronic device is placed on the charging device and at least a portion of the display screen faces the second coil, the first coil can be used to generate electromagnetic coupling with the second coil, so that the charging device charges the electronic device.

[0047] A third aspect of the embodiments of the present application provides an electronic device system, which includes the electronic device as described in the above embodiments and a device to be charged.

[0048] The device to be charged includes a receiving coil. When the device to be charged is placed on the light-emitting side of a display screen of an electronic device, the first coil can be used for electromagnetic coupling with the receiving coil, so that the electronic device charges the device to be charged. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] FIG1 is a schematic structural diagram of an electronic device provided in one embodiment of the present application;

[0050] FIG2 is a schematic structural diagram of an electronic device in a semi-folded state according to an embodiment of the present application;

[0051] FIG3 is a schematic structural diagram of an electronic device in a folded state according to an embodiment of the present application;

[0052] FIG4 is a schematic diagram of a partial cross-sectional structure of a flexible display screen provided in one embodiment of the present application;

[0053] FIG5 is a schematic diagram of a partially exploded structure of a foldable electronic device in the related art;

[0054] FIG6 is a schematic diagram of a foldable electronic device in the related art performing wireless charging;

[0055] FIG7 is a schematic diagram showing the positional relationship between the first coil, the external coil, and the metal plate during simulated wireless charging in one scenario;

[0056] FIG8 is a schematic diagram of the current distribution of the metal plate;

[0057] FIG9 is a schematic diagram of the relative position relationship between the metal plate and the first coil provided in the related art;

[0058] FIG10 is a schematic diagram of a partially exploded structure of an electronic device provided in one embodiment of the present application;

[0059] FIG11 is a schematic diagram of a partially exploded structure of an electronic device provided in one embodiment of the present application;

[0060] FIG12 is a schematic diagram of a partially exploded structure of an electronic device provided in one embodiment of the present application;

[0061] FIG13 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0062] FIG14 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0063] FIG15 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0064] FIG16 is a schematic diagram of a partially exploded structure of an electronic device provided in one embodiment of the present application;

[0065] FIG17 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0066] FIG18 is a schematic diagram of current distribution of a metal plate provided in one embodiment of the present application;

[0067] FIG19 is a schematic structural diagram of an electronic device system provided in one embodiment of the present application;

[0068] FIG20 is a schematic diagram of an electronic device and a charging device provided in an embodiment of the present application in a separated state;

[0069] FIG21 is a schematic diagram of a state in which an electronic device according to an embodiment of the present application is charging other devices;

[0070] FIG22 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0071] FIG23 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0072] FIG24 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0073] FIG25 is a schematic diagram of current distribution of a metal plate provided in one embodiment of the present application;

[0074] FIG26 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0075] FIG27 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0076] FIG28 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0077] FIG29 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0078] FIG30 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0079] FIG31 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0080] FIG32 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0081] FIG33 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0082] FIG34 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0083] FIG35 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0084] FIG36 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0085] FIG37 is a schematic diagram of a partial structure of an electronic device provided in one embodiment of the present application;

[0086] FIG38 is a schematic structural diagram of an electronic device in the related art;

[0087] FIG39 is a schematic diagram of a partially exploded structure of an electronic device in the related art;

[0088] FIG40 is a schematic diagram of a partially exploded structure of an electronic device provided in another embodiment of the present application;

[0089] FIG41 is an equivalent circuit diagram of a first coil, a metal plate, and an external coil provided in one embodiment of the present application;

[0090] FIG42 is a graph showing transmission efficiency versus resonant capacitance of a metal plate according to an embodiment of the present application;

[0091] FIG43 is a graph showing output power versus resonant capacitance of a metal plate according to an embodiment of the present application;

[0092] FIG44 is a graph showing transmission efficiency versus resonant capacitance of an external coil according to an embodiment of the present application;

[0093] FIG45 is a graph showing output power versus resonant capacitance of an external coil according to an embodiment of the present application;

[0094] FIG46 is a graph showing transmission efficiency as a function of resonant capacitance of the first coil according to an embodiment of the present application;

[0095] FIG47 is a graph showing the output power according to an embodiment of the present application as the resonant capacitance of the first coil changes.

[0096] Explanation of reference numerals: 10. electronic device; 20. flexible display screen; 201. substrate; 202. thin film transistor layer; 203. first electrode layer; 204. light-emitting structure layer; 205. second electrode layer; 206. encapsulation layer; 21. non-bending portion; 22. bendable portion; 30. housing; 31. frame; 311. battery cover; 32. hinge; 41. metal plate; 41a. hollow hole; 41b. edge; 411. first support portion; 412. second support portion; 413. intermediate support portion; 414. first connection point; 415. second connection point; 42. first coil; 421. inner boundary; 422. outer boundary; 43. gap; 43a. first region; 43b. second region; 431. first sub-gap; 432. second sub-gap; 44. non-magnetic body; 45. notch; 46. ​​Capacitor; 461. First electrode; 462. Second electrode; 50. Middle frame; 60. Display screen; 70. Battery; 100. Electronic device system; 200. Charging device; 210. Second coil; 300. Charging base; 400. External coil; 500. Through hole; 600. Back cover; 700. Middle plate; X, thickness direction. DETAILED DESCRIPTION

[0097] The electronic device in the embodiments of the present application may be referred to as user equipment (UE) or terminal, etc. For example, the electronic device may be a tablet computer (portable Android device, PAD), a personal digital assistant (PDA), a handheld device with wireless communication function, a computing device, an in-vehicle device, a wireless terminal in industrial control, a wireless terminal in remote medical, a wireless terminal in transportation safety, a wireless terminal in smart city, a wireless terminal in smart home, and other mobile terminals or fixed terminals. The embodiments of the present application do not specifically limit the form of the electronic device.

[0098] In an embodiment of the present application, FIG1 schematically illustrates the structure of an electronic device 10. Referring to FIG1 , the electronic device 10 is described as an electronic device with wireless communication capabilities. For example, the electronic device with wireless communication capabilities may be a foldable screen device. The foldable screen device may be a foldable mobile phone. The foldable screen device includes a foldable flexible display screen.

[0099] Figure 2 schematically illustrates the structure of an electronic device 10 in a semi-folded state. Figure 3 schematically illustrates the structure of an electronic device 10 in a folded state. Referring to Figures 2 and 3 , embodiments of the present application are described using an externally folding electronic device 10 as an example. The electronic device 10 includes a display. The display may be a flexible display 20. For an externally folding electronic device 10, when the electronic device 10 is in the folded state, the flexible display 20 is located on the outside, i.e., the flexible display 20 is visible.

[0100] Electronic device 10 includes a housing 30. Housing 30 is used to support a flexible display screen 20. Flexible display screen 20 includes a display portion for displaying image information. Flexible display screen 20 is inherently bendable and can be folded upon application of an external force. When electronic device 10 is in the unfolded state, the display portion of flexible display screen 20 unfolds to present image information to the user.

[0101] The housing 30 includes a frame 31 and a hinge 32. The frame 31 is rotatably connected to the hinge 32. When a rotational torque is applied to the frame 31, the frame 31 can rotate and fold relative to the hinge 32. In the embodiment of the present application, an electronic device 10 including two frames 31 is used as an example for description. One frame 31 can serve as a main support body, and the other can serve as a secondary support body. The two frames 31 rotate relative to the hinge 32 respectively to switch between a folded state and an unfolded state. When the two frames 31 are stacked on each other, the electronic device 10 is in a folded state. When the two frames 31 move away from each other from the stacked state and unfold to a plane, the electronic device 10 is in an unfolded state. The process of the frame 31 from the folded state to the unfolded state is the unfolding process, and the process from the unfolded state to the folded state is the folding process. Accordingly, when the electronic device 10 is in the unfolded state, the flexible display 20 remains flat to present a good display effect.

[0102] The flexible display 20 may include a non-bending portion 21 and a bendable portion 22. The non-bending portion 21 is arranged in correspondence with the frame 31. The two non-bending portions 21 are respectively connected to the two frames 31. The bendable portion 22 is located between the two non-bending portions 21, that is, the bendable portion 22 is located between the two non-bending portions 21. The bendable portion 22 may be arranged in correspondence with the hinge 32.

[0103] When the two frames 31 are folded, the flexible display 20 is in a bent state. When the two frames 31 are folded, both frames 31 are located between the two non-bending portions 21. The flexible display 20 is located outside the frames 31, allowing it to be seen from the outside. The bendable portion 22 of the flexible display 20 can be bent into an arc. The flexible display 20 has a light-emitting side and a backlight side that are opposite to each other along its thickness. The light-emitting side of the flexible display 20 can be used to emit light to display a corresponding image.

[0104] When the two frames 31 are in the unfolded state, the flexible display 20 is unfolded, that is, the non-bending portion 21 and the bendable portion 22 of the flexible display 20 are in the unfolded state. The electronic device 10 can change its overall size by folding or unfolding, and can also have a relatively large display area in the unfolded state.

[0105] Figure 4 schematically shows a partial cross-sectional view of the flexible display 20. As shown in Figure 4, the flexible display 20 includes a substrate 201, a thin-film transistor layer 202, a first electrode layer 203, a light-emitting structure layer 204, a second electrode layer 205, and an encapsulation layer 206. The substrate 201 can be made of glass or plastic. The thin-film transistor layer 202 includes a source electrode and a drain electrode. The first electrode layer 203 can be electrically connected to the drain electrode. A second electrode layer 205 is disposed above the light-emitting structure layer 204. The first electrode layer 203 can serve as an anode, while the second electrode layer 205 can serve as a cathode. The encapsulation layer 206 prevents moisture or oxygen from entering the display area of ​​the flexible display 20.

[0106] In the related art, Figure 5 schematically shows a partial decomposition structure of the electronic device 10. As shown in Figure 5, the electronic device 10 of the embodiment of the present application includes a metal plate 41. The metal plate 41 is arranged on the backlight side of the flexible display screen 20. At least a portion of the metal plate 41 is arranged in contact with the flexible display screen 20 to support the flexible display screen 20. The flexible display screen 20 and the metal plate 41 are two independently processed structural parts. The flexible display screen 20 and the metal plate 41 are connected by assembly. After the flexible display screen 20 is connected to the metal plate 41, the substrate 201 is close to the metal plate 41, and the encapsulation layer 206 is away from the metal plate 41.

[0107] The flexible display 20 itself is susceptible to concave deformation when subjected to external forces. For example, if the flexible display 20 is pressed on its light-emitting side, the flexible display 20 may sag. In this embodiment of the present application, the metal plate 41 can provide support for the flexible display 20, thereby ensuring that the flexible display 20 has good flatness and is less susceptible to concave deformation when subjected to external forces.

[0108] The metal plate 41 has a relatively high rigidity compared to the flexible display 20. Therefore, when an external force is applied to the metal plate 41 along its thickness, the metal plate 41 is less likely to sag or deform. Therefore, when the metal plate 41 is positioned on the backlight side of the flexible display 20, the flexible display 20 is less likely to sag or deform when an external force is applied to the flexible display 20 along its thickness.

[0109] The metal plate 41 has a relatively small thickness, allowing it to bend and deform, thereby allowing it to be folded or unfolded synchronously with the flexible display 20. For example, the thickness of the metal plate 41 may range from 0.03 mm to 0.3 mm. For example, the thickness of the metal plate 41 may be 0.03 mm, 0.05 mm, 0.1 mm, 0.15 mm, 0.2 mm, or 0.3 mm.

[0110] In some examples, the material of the metal plate 41 may be, but is not limited to, steel, titanium, or a titanium alloy. For example, the material of the metal plate 41 may be stainless steel or a titanium alloy.

[0111] The electronic device 10 may further include a battery 70 and a first coil 42. The frame 31 may include a battery cover 311. The battery 70 is located between the metal plate 41 and the first coil 42. The first coil 42 is located between the battery 70 and the battery cover 311. The battery cover 311 may be made of an insulating material, such as plastic or glass. When the electronic device 10 is wirelessly charged, the battery cover 311 does not shield the magnetic field. It should be noted that the electronic device 10 also includes a mid-plate (not shown), and the battery 70 and the flexible display 20 are respectively arranged on both sides of the mid-plate.

[0112] When the externally foldable electronic device 10 is folded and wirelessly charging, the flexible display 20 forms the majority of the electronic device 10's exterior surface. Therefore, when wireless charging is performed between the first coil 42 and the charging base, the magnetic induction lines must penetrate the flexible display 20. As previously mentioned, the metal plate 41 supports the flexible display 20, so the magnetic induction lines must penetrate the metal plate 41. However, the metal plate 41 shields the magnetic field, making wireless charging impossible using the first coil 42.

[0113] Figure 6 schematically illustrates a foldable electronic device 10 undergoing wireless charging. As shown in Figure 6 , when wireless charging is required, the foldable electronic device 10 must be placed in an unfolded state. In the unfolded state, the front of the electronic device 10 corresponds to the light-emitting side of the flexible display 20, while the back of the electronic device 10 corresponds to the backlight side of the flexible display 20. The back of the electronic device 10 faces the charging base 300, allowing the first coil 42 within the electronic device 10 to form a coupling structure with the transmitting coil in the charging base 300. Mutual inductance exists between the first coil 42 and the transmitting coil in the charging base 300, enabling wireless charging via electromagnetic induction. However, the back of the foldable electronic device 10 exhibits uneven flatness, making it unstable and prone to shaking. Furthermore, this can lead to a discrepancy in the spacing between the first coil 42 and the transmitting coil in the charging base 300, resulting in improper charging or low charging efficiency.

[0114] In one embodiment, if the first coil 42 is directly set on the side of the electronic device 10 close to the display screen, the positional relationship between the first coil 42, the external coil 400, and the metal plate 41 when simulating wireless charging is shown schematically in FIG7 . FIG8 schematically shows the current distribution on the metal plate 41 . As shown in FIG7 and FIG8 , the metal plate 41 is a unitary structure. No gap is provided in the area corresponding to the first coil 42 on the metal plate 41. If the first coil 42 is provided on the metal plate 41 and the external coil 400 is located on one side of the metal plate 41, when simulating wireless charging, the metal plate 41 is located between the first coil 42 and the external coil 400. One of the first coil 42 and the external coil 400 serves as a transmitting coil, and the other serves as a receiving coil. When simulating wireless charging, the metal plate 41 shields the magnetic field and forms large eddy currents in the metal plate 41, resulting in high eddy current losses on the metal plate 41, making it difficult for the magnetic field to pass through the metal plate 41. The overall continuous and uninterrupted metal plate 41 may affect the electromagnetic induction effect, resulting in low efficiency of wireless charging between the first coil 42 and the external coil 400 or failure to effectively perform wireless charging.

[0115] In one embodiment, FIG9 schematically shows the relative positional relationship between the metal plate 41 and the first coil 42. As shown in FIG9 , a through hole 500 is provided on the metal plate 41. The diameter of the through hole 500 is larger than the diameter of the first coil 42, so that the metal plate 41 avoids the first coil 42, thereby reducing the influence of the metal plate 41 on the electromagnetic induction effect, and then when the electronic device 10 is in a folded state, the first coil 42 can be used on the light-emitting side of the flexible display 20 to achieve a wireless charging function. However, since the size of the first coil 42 is relatively large, the size of the through hole 500 is also relatively large, resulting in a relatively small area of ​​the metal plate 41 itself. The metal plate 41 cannot play a good supporting role at the through hole 500, which is not conducive to achieving good support for the flexible display 20 through the metal plate 41.

[0116] In the embodiment of the present application, Figures 10 and 11 schematically illustrate a partially exploded structure of an electronic device 10. Referring to Figures 10 and 11 , the electronic device 10 includes a metal plate 41 and a first coil 42. The metal plate 41 is provided with the first coil 42. The first coil 42 is disposed on the surface of the metal plate 41 facing away from the flexible display 20. The size of the first coil 42 is smaller than that of the metal plate 41, so that the first coil 42 does not extend beyond the edge of the metal plate 41.

[0117] In some possible implementations, FIG12 schematically shows a partially exploded structure of the electronic device 10. As shown in FIG12 , the housing 30 further includes a middle plate 700. The middle plate 700 can be connected to the frame 31. The battery 70 and the flexible display 20 are respectively disposed on both sides of the middle plate 700. The metal plate 41 and the first coil 42 are both disposed between the middle plate 700 and the flexible display 20. The first coil 42 is disposed on the surface of the metal plate 41 facing the middle plate 700. The material of the middle plate 700 can be a metal material, such as aluminum or an aluminum alloy.

[0118] In an embodiment of the present application, a first coil 42 is provided on one side of the metal plate 41 along the thickness direction X of the metal plate 41. The first coil 42 can be connected to the metal plate 41. The metal plate 41 and the first coil 42 are provided independently of each other. The metal plate 41 and the first coil 42 are insulated from each other. In some examples, an insulating sheet can be provided between the metal plate 41 and the first coil 42. The metal plate 41 and the first coil 42 can be insulated by the insulating sheet. Alternatively, the first coil 42 includes a conductive core material and an insulating layer. The insulating layer covers the conductive core material. The metal plate 41 and the first coil 42 can be insulated by the insulating layer. For example, the material of the conductive core material can be copper or a copper alloy.

[0119] In the embodiment of the present application, as shown in Figures 11 and 12, the metal plate 41 includes a slit 43. The metal plate 41 is continuous and uninterrupted in the area outside the slit 43, that is, the patterned slit 43 will not divide the metal plate 41 into multiple unconnected metal areas. The metal plate 41 with the slit 43 is still an integral structure. Along the thickness direction X of the metal plate 41, the slit 43 is set through the metal plate 41. The portion of the first coil 42 corresponding to the slit 43 may not be blocked by the metal plate 41, so that the first coil 42 can be observed through the slit 43.

[0120] In the embodiment of the present application, the width of the gap 43 ranges from 0.1 mm to 0.5 mm. For example, the width of the gap 43 can be 0.1 mm, 0.15 mm, 0.2 mm, 0.25 mm, 0.3 mm, 0.4 mm, or 0.5 mm.

[0121] Since the size of the gap 43 is relatively small, when the metal plate 41 is used in the electronic device 10 with an external folding design, the gap 43 does not significantly affect the support effect of the metal plate 41. The metal plate 41 with the gap 43 can still provide good support for the flexible display 20 as a whole.

[0122] Along the thickness direction X of the metal plate 41 , the orthographic projection of the slit 43 and the orthographic projection of the first coil 42 have an overlapping area. The orthographic projection of the slit 43 may completely overlap with the orthographic projection of the first coil 42 .

[0123] Along the thickness direction X of the metal plate 41 , the orthographic projection of the metal plate 41 and the orthographic projection of the first coil 42 have an overlapping area.

[0124] During wireless charging, the first coil 42, the metal plate 41, and the external coil can form a coupling structure. Mutual inductance exists between the first coil 42 and the external coil. Mutual inductance exists between the first coil 42 and the metal plate 41. Mutual inductance exists between the external coil and the metal plate 41.

[0125] Figures 13 and 14 schematically illustrate partial structures of the electronic device 10. Referring to Figures 13 and 14, when a metal plate 41 is used in the externally folding electronic device 10 of the embodiment of the present application, the metal plate 41 includes a first support portion 411, a second support portion 412, and an intermediate support portion 413. A first coil 42 is disposed on either the first support portion 411 or the second support portion 412. The flexible display 20 can cover the first support portion 411, the second support portion 412, and the intermediate support portion 413. The two non-bending portions 21 of the flexible display 20 are connected to the first support portion 411 and the second support portion 412, respectively. The bendable portion 22 is disposed corresponding to the intermediate support portion 413. The metal plate 41 has a folded state and an unfolded state. When the metal plate 41 is in the folded state, the intermediate support portion 413 can be bent into an arc. When the metal plate 41 is in the unfolded state, the first support portion 411, the second support portion 412, and the intermediate support portion 413 are aligned with each other.

[0126] In some implementations, the metal plate 41 is an integrally formed structure. The metal plate 41 with an integrally formed structure is relatively easy to manufacture. When the metal plate 41 with an integrally formed structure is used in the externally folding electronic device 10 of the embodiment of the present application, the metal plate 41 is relatively easy to manufacture, and the assembly between the metal plate 41 and the flexible display 20 is relatively easy.

[0127] In some possible implementations, there may be one metal plate 41 , which is located between the first coil 42 and the flexible display 20 . The first coil 42 is located on a side of the metal plate 41 facing away from the flexible display 20 .

[0128] The non-bending portion 21 of the flexible display 20 can be connected to the metal plate 41. A first coil 42 is provided corresponding to each non-bending portion 21. The first coil 42 is located on the side of the metal plate 41 facing away from the flexible display 20. The metal plate 41 is located between the first coil 42 and the non-bending portion 21.

[0129] In some possible implementations, FIG15 schematically illustrates a partial structure of an electronic device 10. Referring to FIG15 , the present embodiment of the present application is described using an example in which the electronic device 10 includes two metal plates 41. The two metal plates 41 are stacked along the thickness direction X of the metal plates 41. Each metal plate 41 includes a gap 43. The two metal plates 41 can simultaneously provide support for the flexible display 20, further reducing the possibility of the flexible display 20 being deformed by a force. The first coil 42 is disposed on the metal plate 41 away from the flexible display 20.

[0130] In some possible implementations, the metal plate 41 close to the flexible display 20 has a first thickness, while the metal plate 41 away from the flexible display 20 has a second thickness. In some examples, the first thickness may be less than the second thickness. In some examples, FIG16 schematically shows a partially exploded structure of the electronic device 10. As shown in FIG16, on the metal plate 41 away from the flexible display 20, the middle support portion 413 is provided with a plurality of hollow holes 41a to reduce the rigidity of the middle support portion 413, so that the middle support portion 413 is relatively easy to bend and deform. In some examples, the middle support portion 413 of the metal plate 41 close to the flexible display 20 can be a complete structure, that is, the middle support portion 413 of the metal plate 41 close to the flexible display 20 may not be provided with the hollow holes 41a.

[0131] In some examples, the number of metal plates 41 may be more than three. The embodiment of the present application does not specifically limit the number of metal plates 41.

[0132] Figure 17 schematically illustrates a partial structure of electronic device 10. Figure 18 schematically illustrates the current distribution on metal plate 41. As shown in Figures 17 and 18, a portion of the orthographic projection of slot 43 can overlap with the orthographic projection of first coil 42. During wireless charging, metal plate 41 is exposed to an alternating magnetic field. Under the influence of the alternating magnetic field, current is generated on metal plate 41. When current is generated on metal plate 41 within the magnetic field, slot 43 effectively alters the current flow path, making it less likely for large-diameter annular eddy currents to form on metal plate 41, thereby reducing eddy current losses. Furthermore, slot 43 effectively alters the current flow path, creating regions of current on metal plate 41 with opposite flow directions. This generates a magnetic field with relatively low magnetic induction intensity, further reducing eddy current losses on metal plate 41. Therefore, metal plate 41 with slot 43 can exhibit relatively low eddy current losses, reducing the degree of magnetic field shielding provided by metal plate 41, enabling the coupled structure formed by first coil 42, metal plate 41, and external coil to achieve wireless charging.

[0133] When the first coil 42 functions as a receiver, the magnetic field generated by the external coil can pass through the metal plate 41, allowing the first coil 42 to sense the external magnetic field. Alternatively, when the first coil 42 functions as a transmitter, the magnetic field generated by the first coil 42 can pass through the metal plate 41, allowing the external coil to sense the magnetic field of the first coil 42.

[0134] In some feasible embodiments, when wireless charging technology is used to charge the electronic device 10, the first coil 42 in the electronic device 10 can be used as a receiving coil. For example, FIG19 schematically shows the structure of the electronic device system 100. Referring to FIG19 , the electronic device system 100 includes an electronic device 10 and a charging device 200. FIG20 schematically shows the electronic device 10 and the charging device 200 in a separated state. Referring to FIG20 , the charging device 200 is used to charge the electronic device 10 in a folded state, that is, the electronic device 10 can be charged on the light-emitting side of the flexible display screen 20 of the electronic device 10. The charging device 200 may include a second coil 210. The second coil 210 can be used as a transmitting coil. Relative to the electronic device 10, the second coil 210 is an external coil.

[0135] When the electronic device 10 is placed on the charging device 200 and at least a portion of the display screen faces the second coil 210 , the first coil 42 can be used to generate electromagnetic coupling with the second coil 210 so that the charging device 200 charges the electronic device 10 .

[0136] During wireless charging, the folded electronic device 10 is placed in a charging device 200. The first coil 42 in the electronic device 10 corresponds to the second coil 210 in the charging device 200. Electromagnetic coupling can be generated between the first coil 42 and the second coil 210. Electromagnetic wave energy can be transferred from the second coil 210 to the first coil 42 through electromagnetic coupling. The first coil 42 can be electrically connected to a battery in the electronic device 10. By converting the electromagnetic wave energy accordingly, the battery can be charged.

[0137] In other possible implementations, Figure 21 schematically illustrates the electronic device 10 charging another device. As shown in Figure 21 , using wireless charging technology, the electronic device 10 can charge another device to be charged. For example, the folded electronic device 10 can charge another device to be charged by reversing the light-emitting side of the flexible display 20.

[0138] When the device to be charged is placed on the light-emitting side of the display screen of the electronic device 10, the first coil 42 can be used to electromagnetically couple with the receiving coil, so that the electronic device 10 can charge the device to be charged. For example, the device to be charged can be a mobile phone. The first coil 42 in the electronic device 10 can serve as a transmitting coil. For example, the device to be charged can include a receiving coil. During wireless charging, the device to be charged is placed on the electronic device 10. The device to be charged is located on the light-emitting side of the flexible display screen 20. The first coil 42 in the electronic device 10 is arranged corresponding to the receiving coil. The metal plate 41 is located between the first coil 42 and the receiving coil. Electromagnetic coupling can be generated between the first coil 42 and the receiving coil, so that electromagnetic wave energy can be transferred from the first coil 42 to the receiving coil in an electromagnetic coupling manner. By converting the electromagnetic wave energy accordingly, the battery in the device to be charged can be charged.

[0139] In some examples, the metal plate 41 can be manufactured by etching, punching, or die processing to form patterned gaps 43. For example, a laser etching process is used to etch a whole sheet of metal to form the integrally formed metal plate 41. The etched areas form gaps 43.

[0140] In some examples, a wire is used to form the first coil 42 in a helical shape.

[0141] In some examples, there may be two or more metal plates 41. The two or more metal plates 41 are stacked along the thickness direction X of the metal plates 41, so that the structure formed by the stacked two or more metal plates 41 has a high resistance to bending deformation. Each metal plate 41 includes a gap 43, so that the eddy current loss of each metal plate 41 is relatively low, resulting in a relatively low degree of shielding of the magnetic field by each metal plate 41.

[0142] Exemplarily, the shapes of the slits 43 on any two metal plates 41 are different. The shape of the slits 43 on each metal plate 41 can be flexibly selected.

[0143] Exemplarily, the shapes of the gaps 43 on at least two metal plates 41 are the same.

[0144] Exemplarily, the shapes of the slits 43 on each metal plate 41 are the same. Exemplarily, along the thickness direction X of the metal plate 41 , the slits 43 on each metal plate 41 may be aligned.

[0145] The electronic device 10 of the embodiment of the present application includes a metal plate 41 and a first coil 42. The metal plate 41 and the first coil 42 are stacked on top of each other. The metal plate 41 includes a gap 43. Along the thickness direction X of the metal plate 41, the orthographic projection of the gap 43 overlaps with the orthographic projection of the first coil 42. The gap 43 provided on the metal plate 41 can effectively change the current flow path, making it less likely for large-diameter annular eddy currents to form on the metal plate 41, thereby helping to reduce eddy current losses. Due to the gap 43 provided on the metal plate 41, the first coil 42, the metal plate 41, and the external coil can form a coupled structure. When the metal plate 41 is in a magnetic field, the eddy current loss of the metal plate 41 itself is relatively low, thereby reducing the degree of shielding of the metal plate 41 against the magnetic field. The first coil 42, the metal plate 41, and the external coil have a relatively high electromagnetic wave energy conversion efficiency. Therefore, even with the metal plate 41 provided between the first coil 42 and the external coil, wireless charging can be achieved while ensuring good wireless charging performance.

[0146] In the embodiment of the present application, when the externally folding electronic device 10 is folded, the two non-bending portions 21 of the flexible display 20 are located on opposite sides of the electronic device 10. The metal plate 41 in the electronic device 10 provides good support for the flexible display 20. Furthermore, because the metal plate 41 provides relatively low shielding of magnetic fields, the electronic device 10 can be wirelessly charged using an external charging device, which improves the ease of use of the externally folding electronic device 10.

[0147] In some embodiments, as shown in FIG. 17 , the first coil 42 includes an inner boundary 421 and an outer boundary 422. In a radial direction of the first coil 42, the inner boundary 421 and the outer boundary 422 are arranged relative to each other. The radial direction of the first coil 42 is perpendicular to the thickness direction X of the metal plate 41. In the thickness direction X of the metal plate 41, the inner contour of the orthographic projection of the first coil 42 can serve as the inner boundary 421, while the outer contour of the orthographic projection of the first coil 42 can serve as the outer boundary 422. The first coil 42 has a central hole.

[0148] In some examples, the inner boundary 421 of the first coil 42 may be circular or square. The outer boundary 422 of the first coil 42 may be circular or square.

[0149] In some examples, the gap 43 includes a first region 43a and a second region 43b. The first region 43a and the second region 43b are interconnected. The first region 43a is disposed outside at least one of the outer boundary 422 and the inner boundary 421. Along the thickness direction X of the metal plate 41, the orthographic projection of the first region 43a is located outside at least one of the inner boundary 421 and the outer boundary 422. The second region 43b is located between the inner boundary 421 and the outer boundary 422. The orthographic projection of the second region 43b is located between the inner boundary 421 and the outer boundary 422.

[0150] It should be noted that along the thickness direction of first coil 42, the outer contour of the orthographic projection of first coil 42 serves as outer boundary 422, while the inner contour serves as inner boundary 421. The area outside outer boundary 422 and the area outside inner boundary 421 refer to the area outside first coil 42, i.e., the area without a coil.

[0151] Exemplarily, a first region 43a is provided outside the outer boundary 422. The portion of the gap 43 that extends beyond the outer boundary 422 forms the first region 43a. Along the thickness direction X of the metal plate 41, the orthographic projection of the first region 43a is located outside the orthographic projection of the first coil 42, while the orthographic projection of the second region 43b may be located within the orthographic projection of the first coil 42. The orthographic projection of the first region 43a does not overlap with the orthographic projection of the first coil 42. When current is generated on the metal plate 41 in a magnetic field, the first region 43a and the second region 43b can be used together to change the current flow path so that annular eddy currents with larger diameters are less likely to appear on the metal plate 41, thereby helping to further reduce eddy current losses.

[0152] Exemplarily, a first region 43a is provided outside the inner boundary 421. The portion of the gap 43 that extends beyond the inner boundary 421 forms the first region 43a. The first region 43a is provided corresponding to the center hole of the first coil 42. Along the thickness direction X of the metal plate 41, the orthographic projection of the first region 43a is located outside the orthographic projection of the first coil 42, while the orthographic projection of the second region 43b can be located within the orthographic projection of the first coil 42. When current is generated on the metal plate 41 in a magnetic field, the first region 43a and the second region 43b can be used together to change the current flow path, so that annular eddy currents with larger diameters are less likely to appear on the metal plate 41, thereby helping to further reduce eddy current losses.

[0153] Exemplarily, first regions 43a are provided outside inner boundary 421 and outer boundary 422. In the radial direction of first coil 42, the portion of gap 43 beyond inner boundary 421 and the portion beyond outer boundary 422 respectively form first regions 43a.

[0154] In some examples, FIG22 schematically illustrates a partial structure of electronic device 10. As shown in FIG22 , along the thickness direction X of metal plate 41, the orthographic projection of slit 43 is located between inner boundary 421 and outer boundary 422. Slit 43 is located between inner boundary 421 and outer boundary 422, meaning that slit 43 does not extend beyond inner boundary 421 or outer boundary 422 of first coil 42. For example, along the thickness direction X of metal plate 41, the orthographic projection of slit 43 can be located within the orthographic projection of first coil 42. For example, there is a gap between the boundary of slit 43 and inner boundary 421, and there is a gap between the boundary of slit 43 and outer boundary 422. For example, a portion of the boundary of slit 43 overlaps with inner boundary 421. Alternatively, a portion of the boundary of slit 43 overlaps with outer boundary 422. Alternatively, a portion of the boundary of slit 43 overlaps with inner boundary 421 and a portion of the boundary of slit 43 overlaps with outer boundary 422. When current is generated on the metal plate 41 in the magnetic field, the gap 43 between the inner boundary 421 and the outer boundary 422 can effectively change the current flow path, so that annular eddy currents with larger diameters are less likely to appear on the metal plate 41, thereby helping to reduce eddy current losses.

[0155] In some feasible embodiments, Figure 23 schematically shows the local structure of the electronic device 10. As shown in Figure 23, a non-magnetic body 44 is provided in the gap 43. The non-magnetic body 44 fills the gap 43. The shape of the non-magnetic body 44 matches the shape of the gap 43. The non-magnetic body 44 can be connected to the metal plate 41. When the non-magnetic body 44 is in a magnetic field, no eddy current is generated on the non-magnetic body 44. The non-magnetic body 44 can provide support for the metal plate 41. The thickness of the metal plate 41 itself is relatively small, so after the gap 43 is provided, the part of the metal plate 41 close to the gap 43 is likely to bend under its own internal stress or external stress. In the embodiment of the present application, the non-magnetic body 44 can support the metal plate 41 to reduce the possibility of bending of the part of the metal plate 41 close to the gap 43.

[0156] In some examples, the non-magnetic body 44 may be a non-magnetic adhesive. The non-magnetic body 44 may be bonded to the metal plate 41. After the gap 43 is formed on the metal plate 41, the gap 43 is filled with the non-magnetic adhesive.

[0157] In some examples, when the metal plate 41 is used in an externally foldable electronic device 10, the metal plate 41 is connected to the flexible display 20. The metal plate 41 and the non-magnetic body 44 can jointly provide support for the flexible display 20, thereby ensuring that the flexible display 20 has good flatness and is less likely to sag or deform when subjected to external forces. For example, the metal plate 41 and the non-magnetic body 44 can both be bonded to the flexible display 20.

[0158] In some feasible embodiments, the first coil 42 is bonded to the metal plate 41 , thereby facilitating connection between the first coil 42 and the metal plate 41 .

[0159] In some examples, after the slit 43 is formed on the metal plate 41 , an adhesive is provided on at least one of the first coil 42 and the metal plate 41 , and then the first coil 42 and the metal plate 41 are bonded together.

[0160] In some examples, after the gap 43 is formed on the metal plate 41, a non-magnetic material 44 is filled into the gap 43. Then, an adhesive is placed on the first coil 42. Alternatively, an adhesive is placed on the metal plate 41 and the non-magnetic material 44 simultaneously. Alternatively, an adhesive is placed on the first coil 42, the metal plate 41, and the non-magnetic material 44 simultaneously. The first coil 42 is then bonded to the metal plate 41. For example, the adhesive can be adhesive glue.

[0161] In some implementations, as shown in FIG. 17 or FIG. 23 , there is a gap between the slit 43 and the edge 41 b of the metal plate 41. Along the thickness direction X of the metal plate 41, the orthographic projection of the slit 43 is located within the orthographic projection of the metal plate 41. The slit 43 does not penetrate the edge 41 b of the metal plate 41 at any position.

[0162] In other possible implementations, Figure 24 schematically shows a local structure of the electronic device 10. As shown in Figure 24, the gap 43 passes through the edge 41b of the metal plate 41 to form a notch 45. The metal plate 41 is disconnected at the notch 45. Since the size of the gap 43 is relatively small, the notch 45 formed by the gap 43 passing through the edge 41b of the metal plate 41 can be equivalent to a capacitor with a relatively small capacitance value connected in parallel. The way in which the gap 43 passes through the edge 41b of the metal plate 41 to form the notch 45 can, on the one hand, be conducive to the coupling structure formed by the first coil 42, the metal plate 41 and the external coil to achieve a relatively high electromagnetic wave energy conversion efficiency; on the other hand, there is no need to set an additional capacitor on the metal plate 41 to cancel the connection process (such as welding process) between the metal plate 41 and the capacitor, while avoiding the additional capacitor from occupying space in the thickness direction X of the metal plate 41.

[0163] When current is generated on the metal plate 41 in the magnetic field, the gap 45 formed by the gap 43 penetrating the edge 41 b of the metal plate 41 can block the flow of current.

[0164] In some examples, the metal plate 41 can be rectangular in a flattened state. Along the length of the metal plate 41, the metal plate 41 has two opposing edges 41 b. A slit 43 extends through one edge 41 b of the metal plate 41 to form a notch 45. Alternatively, along the width of the metal plate 41, the metal plate 41 has two opposing edges 41 b. A slit 43 extends through one edge 41 b of the metal plate 41 to form a notch 45.

[0165] In some examples, each gap 43 corresponds to one notch 45 .

[0166] In some achievable embodiments, FIG25 schematically shows the current distribution of the metal plate 41. Referring to FIG24 and FIG25, the gap 43 includes a first sub-gap 431 and a second sub-gap 432. The first sub-gap 431 and the second sub-gap 432 are connected to each other. The extension direction of the first sub-gap 431 (for example, the W direction in FIG24) is different from the extension direction of the second sub-gap 432 (for example, the M direction in FIG24). There is an angle between the extension direction of the first sub-gap 431 and the extension direction of the second sub-gap 432. The extension direction of the first sub-gap 431 and the extension direction of the second sub-gap 432 are both perpendicular to the thickness direction X of the metal plate 41. The first sub-gap 431 and the second sub-gap 432 can change the current flow path in different directions, so that annular eddy currents with larger diameters are less likely to appear on the metal plate 41. At the same time, the current generated on the metal plate 41 has an area with opposite flow directions, which is conducive to reducing eddy current losses.

[0167] In some examples, the first coil 42 has an outer boundary 422 and an inner boundary 421. The first sub-slot 431 includes a first region 43a and a second region 43b. A portion of the first sub-slot 431 is located outside the outer boundary 422. Alternatively, a portion of the first sub-slot 431 is located outside the inner boundary 421. Alternatively, a portion of the first sub-slot 431 is located outside the outer boundary 422 and a portion of the first sub-slot 431 is located outside the inner boundary 421.

[0168] The second sub-slit 432 may include a first region 43a and a second region 43b. A portion of the second sub-slit 432 is located outside the outer boundary 422. Alternatively, a portion of the second sub-slit 432 is located outside the inner boundary 421. Alternatively, a portion of the second sub-slit 432 is located outside the outer boundary 422 and a portion of the second sub-slit 432 is located outside the inner boundary 421.

[0169] In some examples, the first sub-slit 431 may be linear, making the shape of the first sub-slit 431 relatively simple and reducing processing difficulty. Alternatively, the second sub-slit 432 may be linear, making the shape of the second sub-slit 432 relatively simple and reducing processing difficulty.

[0170] In some examples, the shape of the first sub-slit 431 can be linear, and the shape of the second sub-slit 432 can be linear, so that the shapes of the first sub-slit 431 and the second sub-slit 432 are relatively simple, which helps to reduce processing difficulty.

[0171] In some examples, FIG26 schematically illustrates a partial structure of the electronic device 10. As shown in FIG26 , the first sub-slit 431 may be curved. For example, the first sub-slit 431 may include two or more arc segments, which are interconnected.

[0172] In some examples, as shown in FIG26 , the second sub-slit 432 may be curved. For example, the second sub-slit 432 may include two or more arc segments, which are connected to each other.

[0173] In some possible implementations, as shown in FIG26 , the number of slits 43 on the metal plate 41 may be one. Alternatively, FIG27 schematically shows a partial structure of the electronic device 10. As shown in FIG27 , the number of slits 43 on the metal plate 41 may be two or more. Among the two or more slits 43 , each slit 43 is spaced apart. For example, among the two or more slits 43 , no two slits 43 are connected. For example, the metal plate 41 shown in FIG27 is provided with three slits 43 .

[0174] In some implementations, as shown in FIG. 26 or FIG. 27 , one first sub-slot 431 corresponds to two or more second sub-slots 432. The two or more second sub-slots 432 are spaced apart from each other. Any two second sub-slots 432 can be connected through the first sub-slot 431. For example, the two or more second sub-slots 432 are spaced apart along the extension direction of the first sub-slot 431.

[0175] In some examples, a second sub-slot 432 is provided on opposite sides of the first sub-slot 431. The number of second sub-slots 432 on one side of the first sub-slot 431 can be the same as the number of second sub-slots 432 on the other side. Alternatively, the number of second sub-slots 432 on one side of the first sub-slot 431 can be different from the number of second sub-slots 432 on the other side.

[0176] For example, the number of second sub-slots 432 on one side of the first sub-slot 431 may be the same as the number of second sub-slots 432 on the other side.

[0177] In some examples, FIG28 schematically shows a partial structure of the electronic device 10. As shown in FIG28, a second sub-slit 432 is provided on one side of the first sub-slit 431. For example, one first sub-slit 431 may correspond to multiple second sub-slits 432.

[0178] In some examples, in two or more second sub-slots 432 located on the same side of the first sub-slot 431 , the extension directions of the second sub-slots 432 are arranged parallel to each other, so that the second sub-slots 432 are arranged regularly and orderly, which helps to reduce the processing difficulty.

[0179] In some examples, as shown in Figure 27 or Figure 28, the extension direction of the first sub-slit 431 and the extension direction of the second sub-slit 432 are perpendicular to each other. Exemplarily, the shape of the first sub-slit 431 and the shape of the second sub-slit 432 are both linear.

[0180] In some examples, Figure 29 schematically illustrates a partial structure of the electronic device 10. As shown in Figure 29 , the extension direction of the first sub-slit 431 intersects the extension direction of the second sub-slit 432. For example, the shapes of the first sub-slit 431 and the second sub-slit 432 are both linear.

[0181] In some examples, as shown in FIG. 26 , FIG. 27 , or FIG. 28 , the first sub-slit 431 penetrates the edge 41 b of the metal plate 41 to form a notch 45, and a gap is formed between the second sub-slit 432 and the edge 41 b of the metal plate 41. Along the thickness direction X of the metal plate 41, the orthographic projection of the second sub-slit 432 is located within the orthographic projection of the metal plate 41. The second sub-slit 432 does not penetrate the edge 41 b of the metal plate 41 at any position.

[0182] In some examples, FIG30 schematically shows a partial structure of the electronic device 10. As shown in FIG30 , there is a gap between the first sub-slit 431 and the edge 41b of the metal plate 41. Along the thickness direction X of the metal plate 41, the orthographic projection of the first sub-slit 431 is located within the orthographic projection of the metal plate 41. The first sub-slit 431 does not penetrate the edge 41b of the metal plate 41 at any position. There is a gap between the second sub-slit 432 and the edge 41b of the metal plate 41. Along the thickness direction X of the metal plate 41, the orthographic projection of the second sub-slit 432 is located within the orthographic projection of the metal plate 41. The second sub-slit 432 does not penetrate the edge 41b of the metal plate 41 at any position.

[0183] In some implementations, FIG31 and FIG32 schematically illustrate partial structures of the electronic device 10. Referring to FIG31 or FIG32 , there are two or more first sub-slots 431. There are two or more second sub-slots 432. The first sub-slots 431 and the second sub-slots 432 are alternately arranged. The two ends of a first sub-slot 431 are each connected to a second sub-slot 432. Two adjacent first sub-slots 431 can be connected via a second sub-slot 432.

[0184] In some examples, as shown in Figure 31, the extension directions of the first sub-slits 431 are arranged parallel to each other, so that the first sub-slits 431 are arranged regularly and orderly, which helps to reduce the difficulty of processing.

[0185] Exemplarily, the first sub-slots 431 and the second sub-slots 432 have the same shape.

[0186] Exemplarily, the second sub-slot 432 is located outside the outer boundary 422 of the first coil 42 .

[0187] In some examples, the extension directions of the second sub-slits 432 are arranged parallel to each other, so that the first sub-slits 431 are arranged in a regular and orderly manner, which helps to reduce the difficulty of processing.

[0188] In some examples, as shown in Figure 31 or Figure 32, the extension direction of the first sub-slit 431 and the extension direction of the second sub-slit 432 are perpendicular to each other. Exemplarily, the shape of the first sub-slit 431 and the shape of the second sub-slit 432 are both linear.

[0189] In some examples, as shown in FIG31 or FIG32 , among the two or more first sub-slits 431, any one first sub-slit 431 penetrates the edge 41b of the metal plate 41 to form a notch 45, and a gap is provided between the remaining first sub-slits 431 and the edge 41b of the metal plate 41. A gap is provided between the second sub-slits 432 and the edge 41b of the metal plate 41. Along the thickness direction X of the metal plate 41, the orthographic projection of the second sub-slit 432 is located within the orthographic projection of the metal plate 41. The second sub-slits 432 do not penetrate the edge 41b of the metal plate 41 at any position.

[0190] In some possible implementations, FIG33 schematically illustrates a partial structure of electronic device 10. As shown in FIG33 , slot 43 is spirally shaped. The spiral slot 43 facilitates altering the current flow path, thereby creating regions on metal plate 41 where the current flows in opposite directions. This creates a magnetic field with relatively low magnetic induction intensity, further reducing eddy current losses on metal plate 41.

[0191] In some examples, the slit 43 penetrates the edge 41 b of the metal plate 41 to form a notch 45 .

[0192] In some examples, there are two or more slits 43. The two or more slits 43 are spaced apart. No two slits 43 are connected. For example, FIG34 schematically illustrates a partial structure of an electronic device 10. As shown in FIG34 , two spiral slits 43 are provided on a metal plate 41. FIG35 schematically illustrates a partial structure of an electronic device 10. As shown in FIG35 , three spiral slits 43 are provided on a metal plate 41.

[0193] In some possible implementations, Figures 36 and 37 schematically illustrate partial structures of the electronic device 10. As shown in Figures 36 and 37, a gap 43 extends through the edge 41b of the metal plate 41 to form a notch 45. The metal plate 41 includes a first connection point 414 and a second connection point 415. The first connection point 414 and the second connection point 415 are located on either side of the notch 45, respectively. The electronic device 10 also includes a capacitor 46. The capacitor 46 includes a first electrode 461 and a second electrode 462. The first electrode 461 and the second electrode 462 are electrically connected to the first connection point 414 and the second connection point 415, respectively.

[0194] The additional arrangement of the capacitor 46 on the metal plate 41 can help the coupling structure formed by the first coil 42 , the metal plate 41 and the external coil to achieve relatively high electromagnetic wave energy conversion efficiency.

[0195] In some examples, the capacitance value of capacitor 46 may range from 1 nanofarad (nF) to 5 microfarads (μF). For example, the capacitance value of capacitor 46 may range from 5 nanofarads to 50 nanofarads. For example, the capacitance value of capacitor 46 may be 10 nanofarads.

[0196] In some examples, the first electrode 461 and the second electrode 462 are welded to the first connection point 414 and the second connection point 415 , respectively, to achieve electrical connection.

[0197] In the related art, Figure 38 schematically shows the structure of the electronic device 10. Figure 39 schematically shows the decomposed structure of the electronic device 10. As shown in Figures 38 and 39, the electronic device 10 can be a straight-screen mobile phone. The electronic device 10 includes a middle frame 50, a display screen 60, a metal plate 41, a battery 70, a first coil 42 and a back cover 600. The first coil 42 is arranged between the back cover 600 and the battery 70. The material of the back cover 600 can be an insulating material, such as plastic or glass. When the electronic device 10 is wirelessly charged, the back cover 600 does not shield the magnetic field. The electronic device 10 can achieve wireless charging through the first coil 42 or reversely charge other devices wirelessly.

[0198] In one embodiment, if the first coil 42 is directly placed on the metal plate 41 near the display screen in the electronic device 10, since the metal plate 41 is a monolithic structure and shields the magnetic field, the electronic device 10 cannot use the first coil 42 to charge the light-emitting side of the display screen 60 or wirelessly charge other devices in reverse.

[0199] In some examples, FIG40 schematically shows a partially exploded structure of an electronic device 10. As shown in FIG40 , the electronic device 10 may include a middle frame 50, a display screen 60, and the electronic device 10. There is one display screen 60. The display screen 60 is connected to the middle frame 50. A metal plate 41 is connected to the display screen 60. The metal plate 41 is disposed on the backlight side of the display screen 60. At least a portion of the metal plate 41 is disposed in contact with the display screen 60 to support the display screen 60. The first coil 42 is located on the side of the metal plate 41 facing away from the display screen 60. For example, the first coil 42 is disposed on the surface of the metal plate 41 facing away from the display screen 60.

[0200] For example, the first coil 42 can be used as a receiving coil. The electronic device 10 can implement a wireless charging function on the light-emitting side of the display screen 60 .

[0201] The housing of electronic device 10 includes a middle frame 50 and a middle plate 700. Middle plate 700 is connected to middle frame 50. Battery 70 and display screen 60 are disposed on either side of middle plate 700, respectively. Metal plate 41 and first coil 42 are disposed between middle plate 700 and display screen 60. First coil 42 is disposed on the surface of metal plate 41 facing middle plate 700. Middle frame 50 may be made of a metal material, such as aluminum, an aluminum alloy, or steel. Middle plate 700 may be made of a metal material, such as aluminum or an aluminum alloy.

[0202] The embodiment of the present application further provides an electronic device system 100. The electronic device system 100 includes an electronic device 10 and a charging device 200.

[0203] The charging device 200 includes a second coil 210. The charging device 200 has a storage area for the electronic device 10. The second coil 210 is positioned in correspondence with the storage area. When the electronic device 10 is placed in the charging device 200, the electronic device 10 is located in the storage area. When the electronic device 10 is placed in the charging device 200, the first coil 42 is positioned in correspondence with the second coil 210. Relative to the electronic device 10, the second coil 210 is an external coil.

[0204] In the embodiment of the present application, the charging device 200 can be used to charge the electronic device 10. The second coil 210 of the charging device 200 can serve as a transmitting coil, and the first coil 42 of the electronic device 10 can serve as a receiving coil.

[0205] During wireless charging, the electronic device 10 is placed in the charging device 200. The first coil 42 in the electronic device 10 corresponds to the second coil 210 in the charging device 200. The metal plate 41 is located between the first coil 42 and the second coil 210. The metal plate 41 is located on the side of the first coil 42 facing the second coil 210. The metal plate 41 is located between the first coil 42 and the second coil 210.

[0206] The first coil 42, the metal plate 41, and the second coil 210 can form a coupled structure. Mutual inductance exists between the first coil 42 and the second coil 210. Mutual inductance also exists between the first coil 42 and the metal plate 41. Mutual inductance also exists between the second coil 210 and the metal plate 41. Therefore, electromagnetic wave energy can be transferred to the first coil 42. The first coil 42 can be electrically connected to a battery in the electronic device 10. By converting the electromagnetic wave energy accordingly, the battery can be charged.

[0207] In some examples, the electronic device 10 in the electronic device system 100 may be a mobile phone with an outward folding design or a mobile phone with a display screen 60 .

[0208] In some examples, the second coil 210 may include a conductive core material and an insulating layer. The insulating layer covers the conductive core material. For example, the conductive core material may be made of copper or a copper alloy.

[0209] In some examples, the charging device 200 may include a housing, and the second coil 210 may be disposed within the housing.

[0210] In the embodiment of the present application, the first coil 42 is used as a receiving coil, and the external coil is used as a transmitting coil. The first coil 42, the metal plate 41 with the gap 43, and the external coil can form a coupled structure, and the equivalent circuit diagram is shown in Figure 41.

[0211] Among them, V1 is the equivalent input voltage of the external coil side after passing through the inverter bridge, L1 is the inductance of the external coil, C1 is the resonant capacitance of the external coil, and R1 is the equivalent series resistance of the external coil.

[0212] L2 is the inductance of the metal plate 41 , C2 is the resonant capacitance of the metal plate 41 , and R2 is the equivalent series resistance of the metal plate 41 .

[0213] L3 is the inductance of the first coil 42, C3 is the resonant capacitance of the first coil 42, and R3 is the equivalent series resistance of the first coil 42. L is the equivalent series resistance of the load.

[0214] M 12 is the mutual inductance between the external coil and the metal plate 41 .

[0215] M13 is the mutual inductance between the external coil and the first coil 42 .

[0216] M 23 is the mutual inductance between the metal plate 41 and the first coil 42 .

[0217] When the coupling structure is in working state, i1 is the current of the external coil, i2 is the current of the metal plate 41, and i3 is the current of the first coil 42, which satisfies the following expression:

[0218] The transmission efficiency of the coupled structure is expressed as follows:

[0219] Substituting formula (1) into formula (2), we get the following expression:

[0220] Where A=(-w 2 M 12 M 23 +wX2M 13 ) 2 B=[-X2X3+R2(R L +R3)+w 2 M 23 2 ] 2 C=(-w 2 M 13 M 23 +wX3M 12 ) 2

[0221] Where w is equal to 2πf (f is the operating frequency of the system), k 12 is the coupling coefficient between the external coil and the metal plate 41, k 13 is the coupling coefficient between the external coil and the first coil 42, k 23 is the coupling coefficient between the metal plate 41 and the first coil 42 .

[0222] The inductance L2 and equivalent series resistance R2 of the metal plate 41 after processing and manufacturing are both fixed values. The resonant capacitor C2 of the metal plate 41 can be designed according to product requirements.

[0223] Slit 43 extends through edge 41b of metal plate 41 to form notch 45. Capacitor 46 includes a first electrode 461 and a second electrode 462. Metal plate 41 includes a first connection point 414 and a second connection point 415. First connection point 414 and second connection point 415 are located on either side of notch 45, respectively. First electrode 461 and second electrode 462 are electrically connected to first connection point 414 and second connection point 415, respectively.

[0224] Exemplarily, the resonant capacitor C2 of the metal plate 41 may be an additional capacitor, for example, the resonant capacitor C2 of the metal plate 41 may be the capacitor 46 shown in FIG. 37 .

[0225] For example, the slit 43 extends through the edge 41b of the metal plate 41 to form a notch 45. Since the slit 43 is relatively small, the notch 45 formed by the slit 43 extending through the edge 41b of the metal plate 41 can be equivalent to a capacitor with a smaller capacitance connected in parallel. The resonant capacitor C2 of the metal plate 41 can serve as this equivalent capacitor.

[0226] After the number of turns of the first coil 42 and the external coil is determined, the inductance L1 of the external coil, the equivalent series resistance R1 of the external coil, the inductance L3 of the first coil 42, and the equivalent series resistance R3 of the first coil 42 are all fixed values. 12 、k 13 and k 23 The operating frequency f of the system is fixed. Therefore, the equivalent series resistance R L When is also a fixed value, the transmission efficiency of the coupling structure is related to the resonant capacitance C1 of the external coil, the resonant capacitance C2 of the metal plate 41, and the resonant capacitance C3 of the first coil 42. The transmission efficiency can be adjusted by adjusting the capacitance values ​​of the resonant capacitance C1 of the external coil, the resonant capacitance C2 of the metal plate 41, and the resonant capacitance C3 of the first coil 42.

[0227] The output power expression of the equivalent circuit is as follows: P=0.5|i3| 2 R L (4)

[0228] The values ​​of i1, i2, and i3 can be obtained according to equation (1). In equation (4), i3 is the current of the first coil 42.

[0229] The following is an illustration of the specific examples, but does not limit the scope of protection of the embodiments of the present application.

[0230] The inductance L1 of the external coil, the inductance L2 of the metal plate 41, and the inductance L3 of the first coil 42 are fixed values. 12 、k 13 and k 23The equivalent series resistance R1 of the external coil, the equivalent series resistance R2 of the metal plate 41, and the equivalent series resistance R3 of the first coil 42 are all fixed values. See Table 1 for details:

[0231] Table 1:

[0232] In some examples, the resonant capacitance C1 of the external coil is 247 nanofarads (nF). The resonant capacitance C3 of the first coil 42 is 800 nanofarads. FIG42 shows a graph of transmission efficiency as the resonant capacitance C2 of the metal plate 41 varies with different values ​​of the resonant capacitance C2 of the metal plate 41. For example, the graph shown in FIG42 can be output by simulation software.

[0233] As shown in FIG42 , when the value of the resonant capacitance C2 of the metal plate 41 exceeds 5 microfarads (μF), the transmission efficiency decreases. For example, the value of the resonant capacitance C2 of the metal plate 41 can be selected to be between 8 nanofarads and 800 nanofarads. In this case, the value of the resonant capacitance C2 of the metal plate 41 does not significantly affect the transmission efficiency. For example, the value of the resonant capacitance C2 of the metal plate 41 can be selected to be 10 nanofarads.

[0234] 43 , there is a graph showing how the output power changes with the resonant capacitance C2 of the metal plate 41 when the resonant capacitance C2 of the metal plate 41 has different values. For example, the graph shown in FIG43 can be output by simulation software.

[0235] As shown in FIG43 , when the value of the resonant capacitor C2 of the metal plate 41 exceeds 5 microfarads (μF), the output power decreases. For example, the value of the resonant capacitor C2 of the metal plate 41 can be selected to be between 8 nanofarads and 800 nanofarads. In this case, the value of the resonant capacitor C2 of the metal plate 41 does not significantly affect the output power. For example, the value of the resonant capacitor C2 of the metal plate 41 can be selected to be 10 nanofarads.

[0236] In some examples, the resonant capacitance C2 of the metal plate 41 is set to 10 nanofarads. The resonant capacitance C3 of the first coil 42 is set to 800 nanofarads. FIG44 shows a graph showing transmission efficiency as the resonant capacitance C1 of the external coil varies with different values ​​of the resonant capacitance C1 of the external coil. For example, the graph shown in FIG44 can be output using simulation software.

[0237] As shown in Figure 44, the value of the resonant capacitor C1 of the external coil does not affect the transmission efficiency. For example, when the resonant capacitor C1 of the external coil is 247 nanofarads, it can meet the product design requirements.

[0238] 45 , a graph showing the output power as the resonant capacitance C1 of the external coil changes with different values ​​of the resonant capacitance C1 of the external coil is shown. For example, the graph shown in FIG45 can be output by simulation software.

[0239] As shown in Figure 45, the value of the resonant capacitor C1 of the external coil affects the output power. For example, when the resonant capacitor C1 of the external coil is 247 nanofarads, it can meet the product design requirements.

[0240] In some examples, the resonant capacitance C1 of the external coil is set to 247 nanofarads. The resonant capacitance C2 of the metal plate 41 is set to 10 nanofarads. FIG46 shows a graph of transmission efficiency as the resonant capacitance C3 of the first coil 42 changes with different values. For example, simulation software can output the graph shown in FIG46.

[0241] As shown in Figure 46, the transmission efficiency varies depending on the value of the resonant capacitance C3 of the first coil 42. For example, the resonant capacitance C3 of the first coil 42 can be 880 nanofarads. A value of 880 nanofarads for the resonant capacitance C3 of the first coil 42 meets product design requirements.

[0242] 47 , a graph showing output power as the resonant capacitance C3 of the first coil 42 changes when the resonant capacitance C3 of the first coil 42 has different values ​​is shown. For example, the graph shown in FIG47 can be output by simulation software.

[0243] As shown in Figure 47, different values ​​of the resonant capacitor C3 of the first coil 42 result in different output powers. For example, the resonant capacitor C3 of the first coil 42 can be 880 nanofarads. A value of 880 nanofarads for the resonant capacitor C3 of the first coil 42 meets product design requirements.

[0244] Therefore, the coupling structure formed by the first coil 42, the metal plate 41 with the gap 43, and the external coil in the embodiment of the present application can achieve relatively high transmission efficiency. The metal plate 41 is provided between the first coil 42 and the external coil to also achieve wireless charging function.

[0245] In the description of the embodiments of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to a fixed connection, an indirect connection via an intermediate medium, internal communication between two components, or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of this application based on specific circumstances.

[0246] In the embodiments of the present application, any device or element referred to or implied must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise specifically specified.

[0247] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequential order. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described here. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, systems, products or devices.

[0248] Whenever the term "plurality" appears in this document, it refers to two or more. Whenever the term "and / or" appears in this document, it simply describes a relationship between related objects, indicating that three possible relationships exist. For example, "A and / or B" can mean: A exists alone, A and B exist simultaneously, or B exists alone. Additionally, whenever the character " / " appears in this document, it generally indicates an "or" relationship between the related objects. In a formula, the character " / " indicates a "division" relationship between the related objects.

[0249] It will be understood that the various numerical numbers involved in the embodiments of the present application are merely distinctions for the convenience of description and are not intended to limit the scope of the embodiments of the present application.

[0250] It can be understood that in the embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

Claims

1. An electronic device, characterized in that, Comprising: A display screen; A metal plate, the metal plate being disposed on the backlight side of the display screen, and at least a part of the metal plate being attached to the display screen to support the display screen; A first coil, the first coil being disposed on a side of the metal plate facing away from the display screen, and the first coil being insulated from the metal plate; Wherein, the metal plate includes a slit, and along the thickness direction of the metal plate, a positive projection of the slit and a positive projection of the first coil have an overlapping area.

2. The electronic device according to claim 1, wherein The first coil includes an inner boundary and an outer boundary, and along the thickness direction of the metal plate, the positive projection of the slit is located between the inner boundary and the outer boundary.

3. The electronic device according to claim 1, characterized in that, The first coil includes an inner boundary and an outer boundary, the slit includes a first region and a second region, the first region and the second region are connected, and along the thickness direction of the metal plate, a positive projection of the first region is located outside at least one of the outer boundary and the inner boundary, and a positive projection of the second region is located between the inner boundary and the outer boundary.

4. The electronic device according to any one of claims 1 to 3, characterized in that, The metal plate is continuous and unbroken in a region outside the slit.

5. The electronic device according to any one of claims 1 to 4, characterized in that, The metal plate is an integrally formed structure.

6. The electronic device according to any one of claims 1 to 5, characterized in that, A non-magnetic body is disposed in the slit.

7. The electronic device according to any one of claims 1 to 6, characterized in that, The number of the metal plates is two or more, and two or more of the metal plates are stacked along the thickness direction of the metal plate.

8. The electronic device according to claim 7, wherein The shapes of the slits on any two of the metal plates are different; or, The shapes of the slits on at least two of the metal plates are the same.

9. The electronic device according to any one of claims 1 to 8, characterized in that, The first coil is bonded to the metal plate.

10. The electronic device according to any one of claims 1 to 9, characterized in that, The width range of the slit is from 0.1 millimeter to 0.5 millimeter.

11. The electronic device according to any one of claims 1 to 10, characterized in that, The thickness range of the metal plate is from 0.03 millimeter to 0.3 millimeter.

12. The electronic device according to any one of claims 1 to 11, characterized in that, The slit includes a first sub-slit and a second sub-slit, the first sub-slit and the second sub-slit are connected to each other, and an extending direction of the first sub-slit is different from an extending direction of the second sub-slit.

13. The electronic device according to claim 12, wherein One first sub-slit is disposed corresponding to two or more second sub-slits, and the two or more second sub-slits are spaced apart from each other.

14. The electronic device according to claim 13, wherein The second sub-slits are respectively disposed on two opposite sides of the first sub-slit; or, The second sub-slit is disposed on one side of the first sub-slit.

15. The electronic device according to claim 14, characterized in that, Among two or more second sub-slits located on the same side of the first sub-slit, the extending directions of the respective second sub-slits are parallel to each other.

16. The electronic device according to claim 12, wherein The number of the first sub-slits is two or more, the number of the second sub-slits is two or more, and the first sub-slits and the second sub-slits are alternately disposed.

17. The electronic device according to claim 16, wherein The extending directions of the respective first sub-slits are parallel to each other.

18. The electronic device according to claim 15 or 17, characterized in that, The extending direction of the first sub-slit and the extending direction of the second sub-slit are perpendicular to each other.

19. The electronic device according to claim 13 or 16, characterized in that, One first sub-slit penetrates through an edge of the metal plate to form a notch, and there is a spacing between the second sub-slit and the edge of the metal plate; or, There is a spacing between the first sub-slit and the edge of the metal plate, and there is a spacing between the second sub-slit and the edge of the metal plate.

20. The electronic device according to any one of claims 1 to 11, characterized in that, The slit is spiral.

21. The electronic device according to claim 20, wherein The number of the slits is two or more, and the two or more slits are spaced apart from each other.

22. The electronic device according to any one of claims 1 to 21, characterized in that, The gap penetrates through the edge of the metal plate to form a notch; or, there is a spacing between the gap and the edge of the metal plate.

23. The electronic device according to any one of claims 1 to 21, characterized in that, The gap penetrates through the edge of the metal plate to form a notch. The electronic device further includes a capacitor, which includes a first electrode and a second electrode. The metal plate includes a first connection point and a second connection point, and the first connection point and the second connection point are respectively located on two sides of the notch. The first electrode and the second electrode are respectively electrically connected to the first connection point and the second connection point.

24. The electronic device according to any one of claims 1 to 23, characterized in that, The electronic device further includes: a housing, including a frame and a hinge. Two of the frames are respectively rotatably connected to the hinge, and the two frames respectively rotate relative to the hinge to switch between a folded state and an unfolded state; the display screen is a flexible display screen, which includes a non-bendable portion and a bendable portion. The bendable portion is located between the two non-bendable portions, and the two non-bendable portions are respectively connected to the two frames. When the two frames are in the folded state, the two frames are both located between the two non-bendable portions. When the two frames are in the unfolded state, the flexible display screen unfolds; The first coil is correspondingly arranged for one of the non-bendable portions, and the metal plate is located between the first coil and the non-bendable portion.

25. The electronic device according to any one of claims 1 to 24, characterized in that, The electronic device further includes a housing, and the housing includes a middle plate. The metal plate and the first coil are both arranged between the middle plate and the display screen, and the first coil is arranged on the surface of the metal plate facing the middle plate.

26. An electronic device system, characterized in that, including: the electronic device according to any one of claims 1 to 25; a charging device, including a second coil; When the electronic device is placed in the charging device and at least part of the display screen faces the second coil, the first coil can be used to perform electromagnetic coupling with the second coil, so that the charging device charges the electronic device.

27. An electronic device system, characterized in that, including: the electronic device according to any one of claims 1 to 25; a device to be charged, including a receiving coil; When the device to be charged is placed on the light-emitting side of the display screen of the electronic device, the first coil can be used to perform electromagnetic coupling with the receiving coil, so that the electronic device charges the device to be charged.

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