Optical module

Abstract

An optical module, comprising: a light receiving assembly (500), a first end of the light receiving assembly (500) being connected to a fiber optic adapter (700), a second end of the light receiving assembly (500) being connected to a light emitting assembly (400), and a light emitting direction of the light emitting assembly (400) facing the fiber optic adapter (700); the light receiving assembly (500) comprising a first light receiving component (530), a second light receiving component (520), and a third light receiving component (540), the first light receiving component (530) and the second light receiving component (520) being located on one side of the light receiving assembly (500), and the third light receiving component (540) being located on the other side of the light receiving assembly (500); and the light receiving assembly (500) further comprising a wavelength demultiplexing component (5172) for dividing emitted light into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal and then transmitting same; and the light emitting assembly (400), comprising a first laser component (440), a second laser component (450), and a third laser component (460) which are in a triangular distribution state, wherein the light emitting assembly (400) further comprises a wavelength multiplexing component, and the wavelength multiplexing component is configured to combine a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal into a transmitted optical signal.

Description

optical modules

[0001] This application claims the priority of application number 202410764520.3 filed with the China Patent Office on June 13, 2024; the priority of application number 202420189506.0 filed with the China Patent Office on January 25, 2024; the priority of application number 202420621329.9 filed with the China Patent Office on March 28, 2024; the priority of application number 202410765686.7 filed with the China Patent Office on June 13, 2024; and the priority of application number 202420062434.3 filed with the China Patent Office on January 10, 2024; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals, and are key components in optical communication equipment. Furthermore, the transmission rates of optical modules are constantly increasing as optical communication technology evolves.

[0004] Summary of the Invention

[0005] An embodiment of the present disclosure provides an optical module, including:

[0006] A light receiving component, wherein a first end of the light receiving component is connected to the optical fiber adapter, a second end of the light receiving component is connected to the light emitting component, and a light emitting direction of the light emitting component is toward the optical fiber adapter;

[0007] The light receiving component includes a first light receiving component, a second light receiving component and a third light receiving component, wherein the first light receiving component and the second light receiving component are located on one side of the light receiving component, and the third light receiving component is located on the other side of the light receiving component;

[0008] The optical receiving component further includes a wave splitting component, wherein the transmitted optical signal emitted by the optical transmitting component is incident on the transmitted light input of the wave splitting component and is emitted through the received light input of the wave splitting component; the received optical signal including the first wavelength, the second wavelength and the third wavelength emitted by the optical fiber adapter is incident on the received light input of the wave splitting component, is reflected by the transmitted light input of the wave splitting component and then split into the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal before being emitted, the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal are respectively incident on the corresponding optical receiving components, wherein the first wavelength optical signal includes the received optical signal of the first wavelength, the second wavelength optical signal includes the received optical signal of the second wavelength, and the third wavelength optical signal includes the received optical signal of the third wavelength;

[0009] The optical emitting component includes a first laser assembly, a second laser assembly, and a third laser assembly in a triangular distribution state, wherein the first laser assembly is configured to generate a fourth wavelength optical signal, the second laser assembly is configured to generate a fifth wavelength optical signal, and the third laser assembly is configured to generate a sixth wavelength optical signal;

[0010] The optical transmission component further includes a combining assembly configured to combine the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal into the transmission optical signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0012] FIG1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure;

[0013] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure;

[0014] FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0015] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0016] FIG5 is an assembly diagram of an optical transceiver component, an optical fiber adapter, and a circuit board from another perspective according to some embodiments of the present disclosure;

[0017] FIG6 is an exploded view of an optical transceiver component, an optical fiber adapter, and a circuit board according to some embodiments of the present disclosure;

[0018] FIG7 is an exploded view of a flexible circuit board according to some embodiments of the present disclosure;

[0019] FIG8 is an assembly diagram of an optical transceiver component, a circuit board, and a portion of a flexible circuit board according to some embodiments of the present disclosure;

[0020] FIG9 is an assembly diagram of an optical transceiver component, a circuit board, and another portion of a flexible circuit board according to some embodiments of the present disclosure;

[0021] FIG10 is an assembly diagram of an optical transceiver component and an optical fiber adapter according to some embodiments of the present disclosure;

[0022] FIG11 is an exploded view of an optical transceiver component and an optical fiber adapter according to some embodiments of the present disclosure;

[0023] FIG12 is a structural diagram of a first cavity provided according to some embodiments of the present disclosure;

[0024] FIG13 is an assembly diagram of a first light receiving assembly, a bracket, and a first filter according to some embodiments of the present disclosure;

[0025] FIG14 is a cross-sectional view of a first light receiving assembly, a bracket, and a first filter according to some embodiments of the present disclosure;

[0026] FIG15 is an exploded view of a first light receiving assembly, a bracket, and a first filter according to some embodiments of the present disclosure;

[0027] FIG16 is a structural diagram of a bracket provided according to some embodiments of the present disclosure;

[0028] FIG17 is a structural diagram of a bracket provided according to some embodiments of the present disclosure from another perspective;

[0029] FIG18 is an exploded view of a first cavity according to some embodiments of the present disclosure;

[0030] FIG19 is an exploded view of a first housing and a light receiving assembly according to some embodiments of the present disclosure;

[0031] FIG20 is a light path diagram of a receiving light component according to some embodiments of the present disclosure;

[0032] FIG21 is a structural diagram of a first housing provided at a first viewing angle according to some embodiments of the present disclosure;

[0033] FIG22 is a structural diagram of a first housing at a second viewing angle according to some embodiments of the present disclosure;

[0034] FIG23 is a cross-sectional view of a first housing according to some embodiments of the present disclosure;

[0035] FIG24 is a cross-sectional view of a light receiving component according to some embodiments of the present disclosure;

[0036] FIG25 is a cross-sectional view of a light receiving component provided in another perspective according to some embodiments of the present disclosure;

[0037] FIG26 is an assembly diagram of another light receiving component and an adapter plate according to some embodiments of the present disclosure;

[0038] FIG27 is an assembly diagram of another light receiving component, a fiber optic adapter, and a circuit board according to some embodiments of the present disclosure;

[0039] FIG28 is an exploded schematic diagram of another light receiving component according to some embodiments of the present disclosure;

[0040] FIG29 is a second exploded schematic diagram of another light receiving component provided according to some embodiments of the present disclosure;

[0041] FIG30 is an exploded view of another first housing and another light receiving assembly according to some embodiments of the present disclosure;

[0042] FIG31 is a first structural diagram of a light emitting component according to some embodiments of the present disclosure;

[0043] FIG32 is a second structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0044] FIG33 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0045] FIG34 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0046] FIG35 is a second schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure;

[0047] FIG36 is a first cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0048] FIG37 is a third schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0049] FIG38 is a second cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0050] FIG39 is a third cross-sectional view of a light emitting component according to some embodiments of the present disclosure;

[0051] FIG40 is a transmission optical path diagram of an optical transmission signal according to some embodiments of the present disclosure;

[0052] FIG41 is a first structural diagram of a mounting bracket according to some embodiments of the present disclosure;

[0053] FIG42 is a second structural diagram of a mounting bracket provided according to some embodiments of the present disclosure;

[0054] FIG43 is a diagram illustrating a mounting bracket in use according to some embodiments of the present disclosure;

[0055] FIG44 is a structural diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0056] FIG45 is an assembly diagram of another optical transceiver component and an optical fiber adapter according to some embodiments of the present disclosure;

[0057] FIG46 is an exploded schematic diagram of another light emitting component according to some embodiments of the present disclosure;

[0058] FIG47 is a second exploded schematic diagram of another light emitting component provided according to some embodiments of the present disclosure;

[0059] FIG48 is an exploded view of a light emitting assembly according to some embodiments of the present disclosure;

[0060] FIG49 is a cross-sectional view of a light emitting assembly according to some embodiments of the present disclosure;

[0061] FIG50 is a diagram of an emission light path according to some embodiments of the present disclosure;

[0062] FIG51 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure;

[0063] FIG52 is an exploded view of an optical transceiver component according to some embodiments of the present disclosure;

[0064] FIG53 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0065] FIG54 is an exploded view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0066] FIG55 is a cross-sectional view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure;

[0067] FIG56 is an exploded view of a transceiver cavity according to some embodiments of the present disclosure;

[0068] FIG57 is a structural diagram of a transceiver housing according to some embodiments of the present disclosure;

[0069] FIG58 is a light path diagram of a second optical assembly according to some embodiments of the present disclosure;

[0070] FIG59 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0071] FIG60 is an exploded view of a first optical assembly and a transmitting housing according to some embodiments of the present disclosure;

[0072] FIG61 is a structural diagram of a launch housing according to some embodiments of the present disclosure;

[0073] FIG62 is a light path diagram of a first optical assembly according to some embodiments of the present disclosure;

[0074] FIG63 is another optical path diagram of the first optical assembly according to some embodiments of the present disclosure;

[0075] FIG64 is a combined optical path diagram of a first optical component and a second optical component according to some embodiments of the present disclosure;

[0076] FIG65 is a schematic diagram illustrating the optical axis of a wave plate, the polarization direction of an incident light signal, and the polarization direction of an outgoing light signal according to some embodiments of the present disclosure;

[0077] FIG66 is an exploded view of a supporting member, a second polarization combining member, and a third polarization combining member according to some embodiments of the present disclosure;

[0078] FIG67 is a structural diagram of a supporting member according to some embodiments of the present disclosure;

[0079] FIG68 is a structural diagram of a supporting member provided in accordance with some embodiments of the present disclosure from another perspective;

[0080] FIG69 is a cross-sectional view of a support member according to some embodiments of the present disclosure;

[0081] FIG70 is a partial schematic diagram of the connection between an unlocking component and an upper housing according to some embodiments of the present disclosure;

[0082] FIG71 is a partial exploded schematic diagram of an unlocking component and an upper housing according to some embodiments of the present disclosure;

[0083] FIG72 is an exploded schematic diagram of a pull ring according to some embodiments of the present disclosure;

[0084] FIG73 is a second angled schematic diagram of a pull ring provided according to some embodiments of the present disclosure;

[0085] FIG74 is a schematic diagram of a first-angle structural view of an unlocking member provided according to some embodiments of the present disclosure;

[0086] FIG75 is a schematic diagram of a second angle structure of an unlocking member provided according to some embodiments of the present disclosure;

[0087] FIG76 is a schematic diagram of an unlocking member provided at a third angle according to some embodiments of the present disclosure;

[0088] FIG77 is a schematic diagram of a first-angle structural view of an upper housing provided according to some embodiments of the present disclosure;

[0089] FIG78 is a schematic diagram of a second angle structure of an upper housing according to some embodiments of the present disclosure;

[0090] FIG79 is a first cross-sectional schematic diagram of an upper housing according to some embodiments of the present disclosure;

[0091] FIG80 is a second cross-sectional schematic diagram of an upper housing according to some embodiments of the present disclosure;

[0092] FIG81 is a first cross-sectional diagram of an upper housing and an unlocking component according to some embodiments of the present disclosure;

[0093] FIG82 is a second cross-sectional diagram of an upper housing and an unlocking component according to some embodiments of the present disclosure;

[0094] FIG83 is a third cross-sectional diagram of an upper housing and an unlocking component according to some embodiments of the present disclosure;

[0095] FIG84 is a first schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0096] FIG85 is a second schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure;

[0097] FIG86 is a schematic diagram of the internal structure and circuit connections of an optical module according to some embodiments of the present disclosure;

[0098] FIG87 is a diagram illustrating a support member in use according to some embodiments of the present disclosure;

[0099] FIG88 is a diagram showing a usage state of a DSP chip according to some embodiments of the present disclosure;

[0100] FIG89 is a schematic diagram of the internal structure and circuit connections of an optical module according to some embodiments of the present disclosure;

[0101] Figure 90 is a usage status diagram of another DSP chip provided according to some embodiments of the present disclosure. DETAILED DESCRIPTION

[0102] Some embodiments of the present disclosure will be described in detail below with reference to the accompanying drawings. However, the embodiments described are only some of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments provided in the present disclosure are within the scope of protection of the present disclosure.

[0103] Unless the context requires otherwise, throughout the specification and claims, the term "including" is to be interpreted as open and inclusive, that is, "including, but not limited to"; the terms "first" and "second" are not to be understood as indicating or implying relative importance or indicating an upper limit on quantity; the term "plurality" means two or more; the term "connected" is to be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, or an integral connection, and can be directly connected or indirectly connected through an intermediate medium; the use of the terms "suitable for" or "configured to" means open and inclusive language, which does not exclude equipment that is suitable for or configured to perform additional tasks or steps; terms such as "parallel", "perpendicular", "same", "consistent", "level" and so on are not limited to absolute mathematical theoretical relationships, but also include acceptable error ranges generated in practice, and also include differences based on the same design concept but due to manufacturing reasons.

[0104] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0105] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0106] Figure 1 is a partial structural diagram of an optical communication system provided according to some embodiments of the present disclosure. As shown in Figure 1, the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0107] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0108] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0109] The host computer 100 includes a substantially rectangular housing and an optical module connection hole 102 provided on the housing. The optical module connection hole 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0110] The host computer 100 also includes an external electrical connection port that can be connected to an electrical signal network. For example, the external electrical connection port includes a Universal Serial Bus (USB) connection port or a network cable connection port 104. The network cable connection port 104 is configured to connect to a network cable 103 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0111] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0112] FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, FIG2 only shows the structure of the host computer 100 related to the optical module 200. As shown in FIG2, the host computer 100 also includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed inside the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0113] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0114] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0115] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square.

[0116] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0117] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0118] The direction of the line connecting the two openings 204 and 205 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 204 is located at the end of the optical module 200 (the right end in Figure 3), and opening 205 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 204 is located at the end of the optical module 200, while opening 205 is located on the side of the optical module 200. Opening 204 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the electrical connector of the host computer 100; opening 205 is an optical port, which is configured to connect to the external optical fiber 101, so that the optical fiber 101 connects the optical emitting component 400 and the optical receiving component 500 in the optical module 200.

[0119] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of the circuit board 300, the light emitting component 400, and the light receiving component 500 within the housing. The upper housing 201 and the lower housing 202 provide encapsulation and protection for these components. Furthermore, during assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily positioned, facilitating automated production.

[0120] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials, which facilitates electromagnetic shielding and heat dissipation.

[0121] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0122] For example, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0123] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, microcontroller units (MCUs), laser driver chips, transimpedance amplifiers (TIAs), limiting amplifiers (LIAs), clock and data recovery chips (CDRs), power management chips, and digital signal processing (DSP) chips.

[0124] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0125] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0126] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0127] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0128] In some embodiments, at least one of the light emitting component 400 or the light receiving component 500 may be directly disposed on the circuit board 300. For example, at least one of the light emitting component 400 or the light receiving component 500 may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0129] The optical emitting component and the optical receiving component constitute the optical transceiver component, which is electrically connected to the circuit board 300. The optical emitting component is the transmitting end of the optical transceiver component, and the optical receiving component is the receiving end of the optical transceiver component. Both the transmitting end and the receiving end of the optical transceiver component are electrically connected to the circuit board 300.

[0130] In some embodiments, one end of the light receiving component 500 can be connected to the light emitting component 400. For example, the light input end of the light receiving component 500 can be connected to the light output end of the light emitting component 400.

[0131] In some embodiments, the optical receiving component 500 can receive optical signals having multiple wavelengths. For example, the optical receiving component 500 receives optical signals having three wavelengths, each having different rates, such as a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal having different rates. The first wavelength optical signal includes a first wavelength optical signal, the second wavelength optical signal includes a second wavelength optical signal, and the third wavelength optical signal includes a third wavelength optical signal.

[0132] In some embodiments, the wavelength range of the first wavelength optical signal may be 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the wavelength range of the first wavelength optical signal is 1284-1288 nm, such as the wavelength of the first wavelength optical signal is 1286 nm.

[0133] In some embodiments, the wavelength range of the second wavelength optical signal may be 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the wavelength range of the second wavelength optical signal is 1290-1330 nm, such as the wavelength of the second wavelength optical signal is 1310 nm.

[0134] In some embodiments, the wavelength range of the third wavelength optical signal may be 1284-1288 nm, or 1290-1330 nm, or 1260-1280 nm. For example, the wavelength range of the third wavelength optical signal is 1260-1280 nm, such as the wavelength of the third wavelength optical signal is 1270 nm.

[0135] In some embodiments, the optical emitting component 400 can generate optical signals of multiple wavelengths. The optical signals of multiple wavelengths can be combined into a single transmitted optical signal, so that the number of transmitted optical signals emitted by the optical emitting component 400 is one. For example, the optical emitting component 400 can generate optical signals of three wavelengths, each with different rates, such as a fourth wavelength optical signal, a fifth wavelength optical signal, and a sixth wavelength optical signal having different rates.

[0136] In some embodiments, the wavelength range of the fourth wavelength optical signal is 1340-1344 nm, such as the wavelength of the fourth wavelength optical signal is 1342 nm; the wavelength range of the fifth wavelength optical signal is 1575-1580 nm, such as the wavelength of the fifth wavelength optical signal is 1577 nm; the wavelength range of the sixth wavelength optical signal is 1480-1500 nm, such as the wavelength of the sixth wavelength optical signal is 1490 nm.

[0137] As shown in FIG4 , in some embodiments, a fiber optic adapter 700 may be disposed within the housing of the optical module 200. One end of the fiber optic adapter 700 may be connected to the other end of the optical receiving component 500, so that an externally inputted received optical signal is input to the optical receiving component 500 through the fiber optic adapter 700. For example, one end of the fiber optic adapter 700 may be connected to the optical input and output ends of the optical receiving component 500.

[0138] In some embodiments, the light input end of the light receiving component 500 and the light input and output ends of the light receiving component 500 may be disposed at both ends of the light receiving component 500 along the length direction of the light receiving component 500 .

[0139] One end of the optical receiving component 500 can be connected to the optical transmitting component 400, and the other end of the optical receiving component 500 can be connected to one end of the optical fiber adapter 700. The light emitting direction of the optical transmitting component 400 is toward the optical fiber adapter 700, so that the transmitted optical signal emitted by the optical transmitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700. The optical receiving component 500 and the optical transmitting component 400 share the optical fiber adapter 700, and thus the uplink and downlink optical signals of the optical module share the optical fiber 101.

[0140] In some embodiments, among the optical signals incident on the optical receiving component 500, the number of transmitted optical signals (i.e., transmitted light beams) emitted by the optical transmitting component 400 is less than the number of externally input received optical signals (i.e., received light beams). For example, among the optical signals incident on the optical receiving component 500, the number of transmitted optical signals (i.e., transmitted light beams) emitted by the optical transmitting component 400 is at least two less than the number of externally input received optical signals (i.e., received light beams), thereby reducing the difficulty of splitting the optical signals within the optical receiving component 500.

[0141] Figure 5 illustrates an assembly diagram of an optical transceiver component, a fiber optic adapter, and a circuit board from another perspective, according to some embodiments of the present disclosure. Figure 6 illustrates an exploded view of an optical transceiver component, a fiber optic adapter, and a circuit board, according to some embodiments of the present disclosure. As shown in Figures 4, 5, and 6, in some embodiments, the optical emitting component 400 and the circuit board 300 can be connected via a flexible circuit board 900. For example, the electrical input terminal of the optical emitting component 400 can be connected to the circuit board 300 via the flexible circuit board 900.

[0142] In some embodiments, the electrical input terminal of the light emitting component 400 may include a first electrical input terminal. The first electrical input terminal may be located on a side wall of the light emitting component 400. The first electrical input terminal may be located on a side wall of the light emitting component 400 close to the circuit board 300.

[0143] In some embodiments, the electrical input terminal of the light emitting component 400 may include a second electrical input terminal. The second electrical input terminal may be located on a side wall of the light emitting component 400. The second electrical input terminal and the first electrical input terminal may be located on different side walls of the light emitting component 400.

[0144] In some embodiments, the sidewall where the second electrical input terminal is located is adjacent to the sidewall where the first electrical input terminal is located. For example, the first electrical input terminal can be located on the third sidewall of the light emitting component 400, and the second electrical input terminal can be located on the fourth sidewall of the light emitting component 400, and the third sidewall and the fourth sidewall are adjacent to each other and connected.

[0145] 4 , 5 and 6 , in some embodiments, the light receiving component 500 and the circuit board 300 may be connected via a flexible circuit board 900 . For example, the electrical input terminal of the light receiving component 500 and the circuit board 300 may be connected via the flexible circuit board 900 .

[0146] In some embodiments, the electrical input end of the light receiving component 500 may be disposed along a width direction of the light receiving component 500 .

[0147] In some embodiments, the electrical input terminal of the light receiving component 500 may include a first electrical input terminal. The first electrical input terminal may be located on a side wall of the light receiving component 500.

[0148] In some embodiments, the electrical input terminal of the light receiving component 500 may include a second electrical input terminal. The second electrical input terminal may be located on a side wall of the light receiving component 500.

[0149] In some embodiments, the electrical input terminal of the light receiving component 500 may include a third electrical input terminal. The third electrical input terminal may be located on a side wall of the light receiving component 500.

[0150] In some embodiments, any two of the first electrical input terminal, the second electrical input terminal, and the third electrical input terminal can be located on a side wall of the light receiving component 500, and the other electrical input terminal can be located on another side wall of the light receiving component 500, so as to reduce the length of the light receiving component 500. For example, the first electrical input terminal is located on the fourth side wall of the light receiving component 500, and the second electrical input terminal and the third electrical input terminal are located on the second side wall of the light receiving component 500.

[0151] In some embodiments, the side wall where the first electrical input terminal, the second electrical input terminal, and the third electrical input terminal are located is the same side wall.

[0152] Figure 7 is an exploded view of a flexible circuit board according to some embodiments of the present disclosure. Figure 8 is an assembled view of an optical transceiver component and a portion of a flexible circuit board according to some embodiments of the present disclosure. Figure 9 is an assembled view of an optical transceiver component and another portion of a flexible circuit board according to some embodiments of the present disclosure. As shown in Figures 7, 8, and 9, in some embodiments, the flexible circuit board 900 may include a first flexible circuit board 901. One end of the first flexible circuit board 901 may be connected to the upper surface of the circuit board 300. The other end of the first flexible circuit board 901 may be connected to the first electrical input terminal of the optical emitting component 400.

[0153] One end of the first flexible circuit board 901 can be connected to the upper surface of the circuit board 300, and the other end of the first flexible circuit board 901 can be connected to the first electrical input end of the light emitting component 400, so that the first electrical input end of the light emitting component 400 and the circuit board 300 are connected through the first flexible circuit board 901, so that the electrical signal between the first electrical input end of the light emitting component 400 and the circuit board 300 is transmitted through the first flexible circuit board 901.

[0154] As shown in Figures 7, 8, and 9, in some embodiments, the flexible circuit board 900 may include a second flexible circuit board 902. One end of the second flexible circuit board 902 may be connected to the lower surface of the circuit board 300. The other end of the second flexible circuit board 902 may be connected to the second electrical input terminal of the light emitting component 400. The other end of the second flexible circuit board 902 may be connected to the first electrical input terminal of the light receiving component 500.

[0155] In some embodiments, the second flexible circuit board 902 may include a first end 921 . The first end 921 may be connected to the bottom surface of the circuit board 300 .

[0156] In some embodiments, the second flexible circuit board 902 may include a second end 922. The second end 922 may be connected to the second electrical input end of the light emitting component 400. The second end 922 may be connected to the first end 921.

[0157] In some embodiments, the second flexible circuit board 902 may include a third end 923. The third end 923 may be connected to the first electrical input terminal of the light receiving component 500. The third end 923 may be connected to the first end 921. A gap may be provided between the third end 923 and the second end 922 so that the second end 922 and the third end 923 are not connected.

[0158] The first end of the second flexible circuit board 902 can be connected to the lower surface of the circuit board 300, the second end of the second flexible circuit board 902 can be connected to the second electrical input terminal of the light emitting component 400, and the third end of the second flexible circuit board 902 can be connected to the first electrical input terminal of the light receiving component 500, so that the second electrical input terminal of the light emitting component 400 and the first electrical input terminal of the light receiving component 500 are both connected to the circuit board 300 through the second flexible circuit board 902, so that the electrical signals between the second electrical input terminal of the light emitting component 400 and the first electrical input terminal of the light receiving component 500 and the circuit board 300 are transmitted through the second flexible circuit board 902.

[0159] As shown in Figures 7, 8, and 9, in some embodiments, the flexible circuit board 900 may include a third flexible circuit board 903. One end of the third flexible circuit board 903 may be connected to the lower surface of the circuit board 300. The other end of the third flexible circuit board 903 may be connected to the second electrical input terminal of the light receiving component 500.

[0160] One end of the third flexible circuit board 903 can be connected to the lower surface of the circuit board 300, and the other end of the third flexible circuit board 903 can be connected to the second electrical input end of the light receiving component 500, so that the second electrical input end of the light receiving component 500 and the circuit board 300 are connected through the third flexible circuit board 903, thereby allowing the electrical signal between the second electrical input end of the light receiving component 500 and the circuit board 300 to be transmitted through the third flexible circuit board 903.

[0161] As shown in Figures 7, 8, and 9, in some embodiments, the flexible circuit board 900 may include a fourth flexible circuit board 904. One end of the fourth flexible circuit board 904 may be connected to the upper surface of the circuit board 300. The other end of the fourth flexible circuit board 904 may be connected to the third electrical input terminal of the light receiving component 500.

[0162] One end of the fourth flexible circuit board 904 can be connected to the upper surface of the circuit board 300, and the other end of the fourth flexible circuit board 904 can be connected to the third electrical input terminal of the light receiving component 500, so that the third electrical input terminal of the light receiving component 500 and the circuit board 300 are connected through the fourth flexible circuit board 904, thereby allowing the electrical signal between the third electrical input terminal of the light receiving component 500 and the circuit board 300 to be transmitted through the fourth flexible circuit board 904.

[0163] Figure 10 is an assembly diagram of an optical transceiver component and a fiber optic adapter according to some embodiments of the present disclosure. Figure 11 is an exploded view of an optical transceiver component and a fiber optic adapter according to some embodiments of the present disclosure. Figure 12 is a structural diagram of a first cavity according to some embodiments of the present disclosure. As shown in Figures 10, 11, and 12, in some embodiments, the first end of the optical receiving component 500 can be connected to the fiber optic adapter 700. The second end of the optical receiving component 500 can be connected to the optical transmitting component 400.

[0164] In some embodiments, the light receiving component 500 may include a first cavity. One end of the first cavity may be connected to the light emitting component 400. The other end of the first cavity may be connected to the fiber optic adapter 700, so that the first cavity can receive the received optical signal emitted by the fiber optic adapter 700. One end of the first cavity may be connected to the light emitting component 400, and the other end of the first cavity may be connected to one end of the fiber optic adapter 700, so that the transmitted optical signal emitted by the light emitting component 400 is first transmitted into the first cavity, then transmitted through the first cavity to the fiber optic adapter 700, and finally output through the fiber optic adapter 700.

[0165] As shown in Figures 10, 11, and 12, in some embodiments, the optical receiving component 500 may include at least one optical receiving assembly. The at least one optical receiving assembly may be connected to the first cavity, so that an externally input received optical signal (including optical signals of multiple wavelengths) is input into the first cavity through the optical fiber adapter 700 and then transmitted to the at least one optical receiving assembly through the first cavity.

[0166] In some embodiments, the at least one optical receiving component may include a first optical receiving component 530. The first optical receiving component 530 may receive an optical signal of a third wavelength. For example, the wavelength of the optical signal received by the first optical receiving component 530 may be in the range of 1260-1280 nm.

[0167] In some embodiments, the at least one optical receiving component may include a second optical receiving component 520. The second optical receiving component 520 may receive an optical signal of a first wavelength. For example, the wavelength of the optical signal received by the second optical receiving component 520 may be in the range of 1284-1288 nm.

[0168] In some embodiments, the at least one optical receiving component may include a third optical receiving component 540. The third optical receiving component 540 may receive an optical signal of a second wavelength. For example, the wavelength of the optical signal received by the third optical receiving component 540 is in the range of 1290-1330 nm.

[0169] The at least one optical receiving component includes a first optical receiving component 530 , a second optical receiving component 520 , and a third optical receiving component 540 , so that the optical receiving unit 500 can receive optical signals of three wavelengths having different rates.

[0170] In some embodiments, the first optical receiving assembly 530, the second optical receiving assembly 520, and the third optical receiving assembly 540 can be coaxially packaged. Exemplarily, the receiving optical axes of the first optical receiving assembly 530, the second optical receiving assembly 520, and the third optical receiving assembly 540 are parallel to each other. That is, the first optical receiving assembly 530, the second optical receiving assembly 520, and the third optical receiving assembly 540 each include a receiving tube cap and a receiving tube base. The receiving tube cap is mounted on the receiving tube base to form a receiving cavity. A light receiving chip is disposed within the receiving cavity. The light receiving chip receives optical signals and converts the optical signals into electrical signals.

[0171] The receiver socket is also provided with a receiver pin, one end of which is connected to the circuit board 300 via the flexible circuit board 900, thereby electrically connecting the receiver pin and the circuit board 300. The receiver pin extends upward from the bottom of the receiver socket until it extends beyond the top of the receiver socket, where it is wired to the pad where the optical receiver chip is located, thereby electrically connecting the receiver pin and the optical receiver chip, thereby transmitting the electrical signal through the receiver pin to the circuit board 300.

[0172] The receiving pins of the optical receiving components serve as electrical inputs for the optical receiving element 500. For example, the receiving pin of the first optical receiving component 530 serves as the second electrical input of the optical receiving component 500, the receiving pin of the second optical receiving component 520 serves as the third electrical input of the optical receiving component 500, and the receiving pin of the third optical receiving component 540 serves as the first electrical input of the optical receiving component 500. As shown in Figures 6, 8, and 9, the fourth flexible printed circuit board 904 is connected to the receiving pin of the second optical receiving component 520, the third flexible printed circuit board 903 is connected to the receiving pin of the first optical receiving component 530, and the second flexible printed circuit board 902 is connected to the receiving pin of the third optical receiving component 540.

[0173] In some embodiments, a second lens is disposed on the top of the receiving tube cap of the optical receiving assembly. The second lens is a converging lens that can converge and couple the optical signal incident on the second lens to the optical receiving chip in the receiving cavity.

[0174] The second lens may or may not protrude from the receiving tube cap. When the second lens does not protrude from the receiving tube cap, a 0° filter may be directly mounted on the top of the optical receiving component. The 0° filter allows light signals of a certain wavelength to pass through, thereby reducing the incidence of light signals of other wavelengths on the light receiving chip of the optical receiving component. As shown in Figure 11, a second filter 5178 is directly mounted on the top of the second optical receiving component 520. The second filter 5178 is a 0° filter that allows light signals of a second wavelength to pass through.

[0175] When the second lens protrudes from the receiving tube cap, a bracket 550 is provided on the top of the optical receiving assembly to mount a 0° filter. As shown in Figure 11, the top of the first optical receiving assembly 530 is mounted with a first filter 5177 via bracket 550. First filter 5177 is a 0° filter that allows the first wavelength optical signal to pass through.

[0176] In some embodiments, the receiving rates of the optical receiving chip of the first optical receiving assembly 530, the receiving rates of the optical receiving chip of the second optical receiving assembly 520, and the receiving rates of the optical receiving chip of the third optical receiving assembly 540 may all be different. For example, the receiving rate of the optical receiving chip of the second optical receiving assembly 520 is greater than the receiving rate of the optical receiving chip of the first optical receiving assembly 530, and greater than the receiving rate of the optical receiving chip of the third optical receiving assembly 540. For example, the receiving rate of the optical receiving chip of the first optical receiving assembly 530 is 10G, the receiving rate of the optical receiving chip of the second optical receiving assembly 520 is 25G, and the receiving rate of the optical receiving chip of the third optical receiving assembly 540 is 2.5G.

[0177] In some embodiments, the first light receiving component 530 , the second light receiving component 520 , and the third light receiving component 540 are all located on the same side of the light receiving member 500 .

[0178] In some embodiments, the first light receiving component 530 and the second light receiving component 520 may be located on one side of the light receiving component 500 , and the third light receiving component 540 may be located on the other side of the light receiving component 500 to reduce the length of the light receiving component 500 .

[0179] As shown in Figures 10, 11, and 12, in some embodiments, the first cavity may include a first connection hole 5111. The first connection hole 5111 may be located at the optical input and output ends of the light receiving component 500. The first connection hole 5111 may be connected to the optical fiber adapter 700 to connect the optical fiber adapter 700 to the first cavity. For example, one end of a connecting sleeve 710 is inserted into the first connection hole 5111, and the other end of the connecting sleeve 710 is connected to the optical fiber adapter 700, thereby connecting the optical fiber adapter 700 to the first cavity via the connecting sleeve 710.

[0180] 10, 11 and 12, in some embodiments, the first cavity may include a second connection hole 5131. The second connection hole 5131 may be located at the light input end of the light receiving component 500 to connect the light emitting component 400 to the first cavity.

[0181] In some embodiments, the first connection hole 5111 and the second connection hole 5131 may be arranged opposite to each other.

[0182] In some embodiments, an isolator may be provided in the second connection hole 5131. The isolator may allow the optical transmission signal emitted by the optical transmission component 400 to be incident on the optical reception component 500, and prevent the optical transmission signal incident on the optical reception component 500 from returning to the optical transmission component 400.

[0183] As shown in Figures 10, 11, and 12, in some embodiments, the first cavity may include a third connection hole 5141. The third connection hole 5141 can be used to insert one of the at least one light receiving assembly to connect the at least one light receiving assembly to the first cavity. For example, the third connection hole 5141 can be used to insert a third light receiving assembly 540 to connect the third light receiving assembly 540 to the first cavity.

[0184] As shown in Figures 10, 11, and 12, in some embodiments, the first cavity may include a fourth connection hole 5121. The fourth connection hole 5121 can be used to insert another light receiving component in the at least one light receiving component to connect the other light receiving component in the at least one light receiving component to the first cavity. For example, the fourth connection hole 5121 can be used to insert the second light receiving component 520 to connect the second light receiving component 520 to the first cavity.

[0185] As shown in Figures 10, 11, and 12, in some embodiments, the first cavity may include a fifth connection hole 5122. The fifth connection hole 5122 can be used to insert another light receiving component in the at least one light receiving component to connect the at least one light receiving component to the first cavity. For example, the fifth connection hole 5122 can be used to insert the first light receiving component 530 to connect the first light receiving component 530 to the first cavity.

[0186] In some embodiments, the fourth connection hole 5121 and the fifth connection hole 5122 may be located on one side wall of the first cavity, and the third connection hole 5141 may be located on the other side wall of the first cavity, so as to reduce the length of the first cavity.

[0187] Figure 13 is an assembly diagram of a first light receiving assembly, a bracket, and a first filter according to some embodiments of the present disclosure. Figure 14 is a cross-sectional view of the first light receiving assembly, the bracket, and the first filter according to some embodiments of the present disclosure. Figure 15 is an exploded view of the first light receiving assembly, the bracket, and the first filter according to some embodiments of the present disclosure. As shown in Figures 13, 14, and 15, in some embodiments, the first light receiving assembly 530 may include a receiving socket 532, a receiving cap 533, and receiving pins 531. The receiving cap 533 is positioned on top of the receiving socket 532 to form a receiving cavity, within which a light receiving chip is disposed. The receiving pins 531 extend upward from the bottom of the receiving socket 532 until they protrude from the top of the receiving socket 532. In other words, the receiving pins 531 extend from the bottom of the receiving socket 532 into the receiving cavity, so that the ends of the receiving pins 531 are located within the receiving cavity and connect to the light receiving chip and other components within the cavity. The receiving cap 533 is provided with a second lens 534.

[0188] As shown in FIG. 11 , FIG. 13 and FIG. 14 , a bracket 550 is provided on the top of the first light receiving assembly 530 , and a first filter 5177 is mounted on the bracket 550 .

[0189] Figure 16 is a structural diagram of a bracket according to some embodiments of the present disclosure. Figure 17 is a structural diagram of a bracket according to some embodiments of the present disclosure from another perspective. As shown in Figures 16 and 17, in some embodiments, the bracket 550 may include a first fixing portion 551. The bottom surface of the first fixing portion 551 may contact and connect with the outer top surface of the receiving tube cap 533, thereby fixing the first fixing portion 551 to the receiving tube cap 533.

[0190] As shown in Figures 16 and 17, in some embodiments, the bracket 550 may include a second fixing portion 552. The bottom surface of the second fixing portion 552 may contact and connect with the top surface of the first fixing portion 551, thereby fixing the second fixing portion 552 to the first fixing portion 551. It should be noted that the second fixing portion 552 may be integrally formed with the first fixing portion 551. The top surface of the second fixing portion 552 may be mounted with the first filter 5177.

[0191] As shown in Figures 16 and 17, in some embodiments, the bracket 550 may include a blocking portion 553. The inner surface of the blocking portion 553 contacts and connects with the outer surface of the second fixing portion 552, so that the blocking portion 553 and the second fixing portion 552 are fixedly connected.

[0192] In some embodiments, the height of the enclosing portion 553 is greater than the height of the second fixing portion 552 to enclose the first filter 5177 to prevent the first filter 5177 from shaking as much as possible, thereby causing instability in optical signal transmission.

[0193] As shown in Figures 16 and 17, in some embodiments, the bracket 500 has a first light-through hole 554. The first light-through hole 554 can extend from the first fixing portion 551 to the second fixing portion 552, so that the first light-through hole 554 can pass through the bracket 500, thereby allowing the optical signal of the first cavity to be incident on the first light receiving component 530 through the first light-through hole 554.

[0194] In some embodiments, the first filter 5177 is placed at the end of the first light hole 554 to block the end of the first light hole 554, thereby allowing the optical signal (i.e., the third wavelength optical signal) that passes through the first filter 5177 to be incident on the first light receiving component 530 through the first light hole 554. For example, the size of the first filter 5177 is larger than the size of the first light hole 554.

[0195] In some embodiments, the size of the first light hole 554 is greater than or equal to the size of the second lens 534, so that the first light hole 554 can accommodate the second lens 534, that is, the second lens 534 is at least partially located in the first light hole 554, so that the optical signal of the first cavity is coupled to the optical receiving chip of the first optical receiving component 530 through the second lens 534 in the first light hole 554.

[0196] The first light hole 554 can accommodate the second lens 534, and the first filter 5177 is placed on the first light hole 554 so that the optical signal of the first filter 5177 (i.e., the third wavelength optical signal) is coupled to the optical receiving chip of the first optical receiving component 530 through the second lens 534 in the first light hole 554.

[0197] Figure 18 is an exploded view of a first cavity according to some embodiments of the present disclosure. Figure 19 is an exploded view of a first housing and a light receiving assembly according to some embodiments of the present disclosure. As shown in Figures 18 and 19, in some embodiments, the first cavity may include a first cover plate 515.

[0198] As shown in Figures 18 and 19, in some embodiments, the first cavity may include a first housing 510. A first cover 515 may be placed over the first housing 510 to form the first cavity. A receiving optical component 517 may be disposed within the first cavity. The receiving optical component 517 may transmit a transmitted optical signal to the fiber optic adapter 700, or may split a received optical signal transmitted by the fiber optic adapter 700 to the first cavity and transmit the split optical signal to a corresponding optical receiving component.

[0199] During the assembly process, the light receiving component 517 is first fixed in the first housing 510 , and then the first cover 515 is covered on the first housing 510 to form a first cavity.

[0200] Figure 20 is an optical path diagram of a receiving optical assembly according to some embodiments of the present disclosure. As shown in Figure 20 , in some embodiments, receiving optical assembly 517 may include a first lens 5171. First lens 5171 is used to collimate / focus optical signals. For example, received optical signals transmitted from the first cavity to the fiber optic adapter 700 are focused by first lens 5171, and optical signals transmitted from the fiber optic adapter 700 to the first cavity are collimated by first lens 5171.

[0201] As shown in FIG20 , in some embodiments, the receiving optical component 517 may include a wave splitting component 5172. The first end of the wave splitting component 5172 may be disposed correspondingly to the first end of the optical receiving component, and the second end of the wave splitting component 5172 may be disposed correspondingly to the second end of the optical receiving component, so that the wave splitting component 5172 may be disposed along the length direction of the optical receiving component 500.

[0202] The wave splitter assembly 5172 can be positioned along the length of the optical receiving component 500, that is, along the length of the first housing 510, thereby reducing the width of the first housing 510 and, in turn, the width of the optical receiving component 500. When the wave splitter assembly 5172 is positioned along the length of the first housing 510, the width of the first housing 510 required to accommodate the wave splitter assembly 5172 can be reduced to meet the requirement. Because the optical receiving component's receiving pins are relatively short, reducing the width of the first housing 510 also reduces the width of the optical receiving component 500.

[0203] In some embodiments, the wave splitting assembly 5172 can be located between the first lens 5171 and the optical emitting component 400. The wave splitting assembly 5172 is disposed along the length of the optical receiving component 500 so that the wave splitting assembly 5172 can transmit the transmitted optical signal emitted by the optical emitting component 400 to the first lens 5171. The wave splitting assembly 5172 can split the optical signal collimated by the first lens 5171 according to wavelength. For example, the wave splitting assembly 5172 splits a received optical signal including a first wavelength, a second wavelength, and a third wavelength into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal according to wavelength.

[0204] The wave splitting component 5172 can transmit the transmitted light signal (i.e., the transmitted light beam) emitted by the light emitting component 400 to the first lens 5171, and can also split the received light signal (i.e., the received light beam) collimated by the first lens 5171 according to the wavelength, thereby reducing the distance between the transmitted light beam and the received light beam in the width direction of the first shell 510, and thereby reducing the width dimension of the light receiving component 500.

[0205] In some embodiments, the first end of the wave splitter assembly 5172 has a receiving light input port, and the second end of the wave splitter assembly 5172 has a transmitting light input port. The transmitted light signal emitted by the optical transmitting component 400 is incident on the transmitting light input port at the second end of the wave splitter assembly 5172 and is emitted through the receiving light input port at the first end of the wave splitter assembly 5172. The received light signal, including the first wavelength, the second wavelength, and the third wavelength, emitted by the optical fiber adapter 700 is incident on the receiving light input port at the first end of the wave splitter assembly 5172 and is reflected from the transmitting light input port at the second end of the wave splitter assembly 5172. The optical paths of the transmitted light signal and the received light signal overlap in the width direction of the optical receiving component 500, thereby reducing the width dimension of the optical receiving component 500.

[0206] In some embodiments, the first end of the wave splitter component 5172 has a first light output, and the second end of the wave splitter component 5172 has a second light output and a third light output. The received optical signal is reflected by the transmitted light input at the second end of the wave splitter component 5172 and then split into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal. The first wavelength optical signal is emitted through the second light output of the second end of the wave splitter component 5172, the third wavelength optical signal is emitted through the first light output of the first end of the wave splitter component 5172, and the third wavelength optical signal is emitted through the third light output of the second end of the wave splitter component 5172.

[0207] In some embodiments, the first end of the wave splitter assembly 5172 and the second end of the wave splitter assembly 5172 are arranged in parallel so that the transmitted optical signal incident to the second end of the wave splitter assembly 5172 and the transmitted optical signal emitted through the first end of the wave splitter assembly 5172 are parallel to each other.

[0208] In some embodiments, the tilt angle of the first end of the wave splitting assembly 5172 is within a first preset range, so that a received optical signal including the first wavelength, the second wavelength, and the third wavelength incident on the wave splitting assembly 5172 can be separated into the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal by the wave splitting assembly 5172. By way of example, the first preset range is 8°±1°.

[0209] In some embodiments, the wave splitting assembly 5172 may include a substrate 51721. The substrate 51721 is a block substrate. A first end surface of the substrate 51721 is disposed corresponding to the first end of the light receiving component 500, and a second end surface of the substrate 51721 is disposed corresponding to the second end of the light receiving component 500, such that the substrate 51721 is disposed along the length of the light receiving component 500. The first end surface of the substrate 51721 may face the first lens 5171. The second end surface of the substrate 51721 may face the second connection hole 5131.

[0210] The first end surface of the substrate 51721 and the second end surface of the substrate 51721 are arranged in parallel, so that the optical signal incident on the substrate 51721 and the optical signal emitted through the substrate 51721 are parallel to each other.

[0211] The first end surface of the substrate 51721 may face the first lens 5171 , and the second end surface of the substrate 51721 may face the second connection hole 5131 , so that the substrate 51721 may be disposed along the horizontal direction of the first cavity.

[0212] In some embodiments, the wave splitting assembly 5172 may include a first wave plate 51722. The first wave plate 51722 may be disposed on a first end surface of the substrate 51721. The first wave plate 51722 may be located between the first lens 5171 and the substrate 51721. The first wave plate 51722 serves as a light input point for received light at the first end of the wave splitting assembly 5172. The first wave plate 51722 may allow both transmitted and received optical signals to pass therethrough.

[0213] The central axis of the first wave plate 51722 can coincide with the central axis of the first lens 5171 , so that the received light signal collimated by the first lens 5171 is incident on the first wave plate 51722 , and the transmitted light signal of the first wave plate 51722 can be focused and coupled by the first lens 5171 .

[0214] In some embodiments, the wave splitting assembly 5172 may include a second wave plate 51723. The second wave plate 51723 may be disposed on a first end surface of the substrate 51721. One side of the second wave plate 51723 may be connected to the first wave plate 51722. The second wave plate 51723 may allow for reflection of the received optical signal.

[0215] In some embodiments, the wave splitting assembly 5172 may include a third wave plate 51724. The third wave plate 51724 may be disposed on a first end surface of the substrate 51721. One side of the third wave plate 51724 may be connected to the other side of the second wave plate 51273. The third wave plate 51724 serves as a first light output port at the first end of the wave splitting assembly 5172.

[0216] In some embodiments, the third wave plate 51724 may be a low-pass filter that allows low-frequency signals to pass through and blocks high-frequency signals from passing through. For example, the third wave plate 51724 may allow a third wavelength optical signal to pass through and may also allow a second wavelength optical signal to reflect.

[0217] In some embodiments, the wave splitting assembly 5172 may include a fourth wave plate 51725. The fourth wave plate 51725 may be disposed on the second end surface of the substrate 51721. The fourth wave plate 51725 may be disposed opposite the first wave plate 51722. The fourth wave plate 51725 may be located between the substrate 51721 and the second connection hole 5131. The fourth wave plate 51725 serves as the entrance point for transmitted light at the second end of the wave splitting assembly 5172. The fourth wave plate 51725 may allow for reflection of received optical signals or transmission of transmitted optical signals.

[0218] The central axis of the fourth wave plate 51725 may coincide with the central axis of the second connection hole 5131 , so that the emission light signal incident on the first cavity through the second connection hole 5131 is incident on the fourth wave plate 51725 .

[0219] In some embodiments, the wave splitting assembly 5172 may include a fifth wave plate 51726. The fifth wave plate 51726 may be disposed on the second end surface of the substrate 51721. The fifth wave plate 51726 may be disposed opposite the second wave plate 51723. One side of the fifth wave plate 51726 may be connected to the fourth wave plate 51725. The fifth wave plate 51726 serves as the second light output port at the second end of the wave splitting assembly 5172.

[0220] In some embodiments, the fifth wave plate 51726 may be a bandpass filter that allows signals within a certain frequency range to pass through while blocking signals of other frequencies. For example, the fifth wave plate 51726 may allow a first wavelength optical signal to pass through, while also allowing a third wavelength optical signal and a second wavelength optical signal to reflect, that is, reflecting the third wavelength optical signal and the second wavelength optical signal to the third paddle 51724.

[0221] In some embodiments, the wave splitting assembly 5172 may include a sixth wave plate 51727. The sixth wave plate 51727 may be disposed on the second end surface of the substrate 51721. The sixth wave plate 51727 may be disposed opposite the third wave plate 51724. The sixth wave plate 51727 may be connected to the other side of the fifth wave plate 51726. The sixth wave plate 51727 serves as the third light output port at the second end of the wave splitting assembly 5172.

[0222] In some embodiments, the sixth wave plate 51727 may be a high-pass filter that allows high-frequency signals to pass through and blocks low-frequency signals from passing through. For example, the sixth wave plate 51727 may allow the second wavelength optical signal to transmit and may also allow the third wavelength optical signal to reflect.

[0223] The fourth wave plate 51725 , the fifth wave plate 51726 , and the sixth wave plate 51727 may be connected in sequence to shorten the length of the second end surface of the substrate 51721 .

[0224] In some embodiments, the center-to-center distance between any two of the fourth wave plate 51725, the fifth wave plate 51726, and the sixth wave plate 51727 is greater than a first preset value, thereby increasing the distance between the first wavelength optical signal transmitted by the fifth wave plate 51726 and the second wavelength optical signal transmitted by the sixth wave plate 51727, thereby improving isolation. For example, the first preset value is 1000 nm, and the center-to-center distance between any two of the fourth wave plate 51725, the fifth wave plate 51726, and the sixth wave plate 51727 is greater than 1000 nm.

[0225] The first wave plate 51722 , the second wave plate 51723 , and the third wave plate 51724 may be connected in sequence to reduce the length of the first end surface of the substrate 51721 .

[0226] Since the multiple wave plates on the first end surface of the substrate 51721 and the multiple wave plates on the second end surface of the substrate 51721 are arranged relative to each other, the center distance between any two wave plates among the first wave plate 51722, the second wave plate 51723 and the third wave plate 51724 is 1000 nm.

[0227] The third wave plate 51724 is located on the first end face of the substrate 51721, and the fifth wave plate 51726 and the sixth wave plate 51727 are located on the second end face of the substrate 51721, so that the emission direction of the optical signal transmitted through the third wave plate 51724 is opposite to the emission direction of the optical signal transmitted through the fifth wave plate 51726 or the optical signal transmitted through the sixth wave plate 51727, thereby improving the isolation.

[0228] As shown in FIG20 , in some embodiments, the receiving optical component 517 may include a first reflector 5173. The first reflector 5173 may be located on the output optical path of the fifth wave plate 51726 to reflect the optical signal transmitted through the fifth wave plate 51726. The first reflector 5173 may allow the first wavelength optical signal transmitted through the fifth wave plate 51726 to be reflected.

[0229] As shown in FIG20 , in some embodiments, the receiving optical component 517 may include a second reflector 5176. The second reflector 5176 may be located on the output optical path of the third wave plate 51724 to reflect the optical signal transmitted through the third wave plate 51726. The second reflector 5176 may allow the third wavelength optical signal transmitted through the third wave plate 51724 to be reflected.

[0230] As shown in FIG20 , in some embodiments, the receiving optical component 517 may include a third reflector 5175. The third reflector 5175 may be located on the output optical path of the sixth wave plate 51727 to reflect the optical signal transmitted through the sixth wave plate 51727. The third reflector 5175 may allow the second wavelength optical signal transmitted through the sixth wave plate 51727 to be reflected.

[0231] 20 , the light receiving assembly 517 may include a first filter 5177 . The first filter 5177 may be located on a reflected light path of the second reflector 5176 .

[0232] In some embodiments, the first filter 5177 can be mounted on the top of the first optical receiving component 530 to filter the optical signal so that the first optical receiving component 530 receives the third wavelength optical signal.

[0233] 20 , the light receiving assembly 517 may include a second filter 5178 . The second filter 5178 may be located on the reflected light path of the first reflector 5173 .

[0234] In some embodiments, the second filter 5178 can be mounted on the top of the second optical receiving component 520 to filter the optical signal so that the second optical receiving component 520 receives the first wavelength optical signal.

[0235] As shown in FIG20 , in some embodiments, the receiving optical component 517 may include a third filter 5174. The third filter 5174 may be located in the output optical path of the sixth wave plate 51727. The third filter 5174 may allow the optical signal transmitted by the sixth wave plate to pass through. For example, the third filter 5174 may allow the second wavelength optical signal to pass through.

[0236] In some embodiments, the third filter 5174 can be mounted on the top of the third optical receiving component 540 to filter the optical signal so that the third optical receiving component 540 receives the second wavelength optical signal.

[0237] In some embodiments, the third filter 5174 can be located between the sixth wave plate 51727 and the corresponding light receiving component, and the third filter 5174 is not connected to the corresponding light receiving component. For example, the third filter 5174 can be located between the sixth wave plate 51727 and the third light receiving component 540, and the third filter 5174 is not connected to the third light receiving component 540.

[0238] As shown in Figure 20, the light path is as follows:

[0239] The transmitted optical signal is sequentially transmitted through the fourth wave plate 51725 and the first wave plate 51722 , and then focused and coupled to the optical fiber adapter 700 by the first lens 5171 .

[0240] The received optical signal is first collimated by the first lens 5171, then transmitted through the first wave plate 51722, and then reflected by the fourth wave plate 51725 and the second wave plate 51723 before entering the fifth wave plate 51726. The first wavelength optical signal in the received optical signal is first transmitted through the fifth wave plate 51726, then reflected by the first reflector 5173, and then entered the second filter 5178.

[0241] The third wavelength optical signal in the received optical signal is first reflected by the fifth wave plate 51726 , then transmitted by the third wave plate 51724 , and finally reflected by the second reflector 5176 before entering the first filter 5177 .

[0242] The second wavelength optical signal in the received optical signal is first reflected by the fifth wave plate 51726 , then transmitted by the sixth wave plate 51727 , filtered again by the third filter 5174 , and finally reflected by the third reflector 5175 .

[0243] Figure 21 is a structural diagram of a first shell provided according to some embodiments of the present disclosure at a first viewing angle. Figure 22 is a structural diagram of a first shell provided according to some embodiments of the present disclosure at a second viewing angle. Figure 23 is a cross-sectional view of a first shell provided according to some embodiments of the present disclosure. As shown in Figures 21, 22, and 23, in some embodiments, the first shell 510 may include a first side wall 511. The first side wall 511 is a side wall of the first shell 510 that is close to the optical fiber adapter 700. The first side wall 511 may have a first connection hole 5111. The first connection hole 5111 may cross the first side wall 511 so that the first connection hole 5111 can be connected to the inner cavity of the first cavity, thereby allowing the optical signal to be transmitted inside and outside the first cavity along the first connection hole 5111.

[0244] 21 , 22 , and 23 , in some embodiments, the first housing 510 may include a second sidewall 512 . One end of the second sidewall 512 may be connected to one end of the first sidewall 511 .

[0245] As shown in Figures 21, 22, and 23, in some embodiments, the first housing 510 may include a third sidewall 513. One end of the third sidewall 513 may be connected to the other end of the second sidewall 512. The third sidewall 513 is a sidewall of the first housing 510 that is adjacent to the light emitting component 400. The third sidewall 513 may be disposed opposite the first sidewall 511. The third sidewall 513 may have a second connection hole 5131. The second connection hole 5131 may extend through the third sidewall 513 so as to communicate with the inner cavity of the first cavity, thereby allowing the transmitted light signal emitted by the light emitting component 400 to enter the first cavity along the second connection hole 5131.

[0246] As shown in Figures 19, 22, and 23, in some embodiments, the third sidewall 513 may have a first bearing surface 5132. The first bearing surface 5132 may be formed by an inward depression of the inner surface of the third sidewall 513. The first bearing surface 5132 may face the third connection hole 5141.

[0247] As shown in Figures 19, 22, and 23, in some embodiments, the third sidewall 513 may have a second bearing surface 5133. The second bearing surface 5133 may be formed by an inward depression of the inner surface of the third sidewall 513. One end of the second bearing surface 5133 may be connected to the first bearing surface 5132. The second bearing surface 5133 may face the fourth connection hole 5121 and the first connection hole 5111.

[0248] As shown in Figures 19, 22, and 23, in some embodiments, the third sidewall 513 may have a fifth bearing surface 5134. The fifth bearing surface 5134 may be formed by an inward depression of the inner surface of the third sidewall 513. The fifth bearing surface 5134 may be connected to the other end of the second bearing surface 5133. A second connection hole 5131 may be provided between the fifth bearing surface 5134 and the bottom plate of the first housing 510. The fifth bearing surface 5134 may face the first connection hole 5111.

[0249] As shown in Figures 19 and 23, in some embodiments, the first housing 510 may include a fourth sidewall 514. One end of the fourth sidewall 514 may be connected to one end of the third sidewall 513. The other end of the fourth sidewall 514 may be connected to the other end of the first sidewall 511. The fourth sidewall 514 may be disposed opposite the second sidewall 512.

[0250] As shown in FIG. 21 , in some embodiments, the fourth sidewall 514 may have a third supporting surface 5143 . The third supporting surface 5143 may be a partial area of ​​the inner surface of the fourth sidewall 514 .

[0251] 21 , 22 , and 23 , the fourth sidewall 514 may have a fourth supporting surface 5144. The fourth supporting surface 5144 may be a partial area of ​​the inner surface of the fourth sidewall 514. The fourth supporting surface 5144 may be connected to or not connected to the third supporting surface 5143.

[0252] In some embodiments, the third supporting surface 5143 is tilted relative to the fourth supporting surface 5114 so that the third supporting surface 5413 can face the fifth connecting hole 5122.

[0253] As shown in Figures 18, 19, and 22, in some embodiments, the first housing 510 may include a bottom plate 5161. The bottom plate 5161 may be used to support the light receiving assembly 517. The bottom plate 5161 may be connected to the first side wall 511. The bottom plate 5161 may be connected to the second side wall 512. The bottom plate 5161 may be connected to the third side wall 513. The bottom plate 5161 may be connected to the fourth side wall 514.

[0254] In some embodiments, the bottom plate of the first housing 510 may have a reserved hole 518. The reserved hole 518 may traverse the bottom plate 5161 of the first housing 510. The reserved hole 518 may be located below the second bearing surface 5133 and the fifth bearing surface 5134, so that the reserved hole 518 can be arranged corresponding to the second bearing surface 5133 and the fifth bearing surface 5134, thereby facilitating the formation of the second bearing surface 5133 and the fifth bearing surface 5134.

[0255] The first side wall 511 , the second side wall 512 , the third side wall 513 and the fourth side wall 514 are sequentially connected and respectively connected to the bottom plate 5161 to form a first housing 510 having an opening. The opening of the first housing 510 may face the lower housing 202 .

[0256] As shown in Figures 21, 22, and 23, in some embodiments, the first housing 510 is recessed inward to form a receiving cavity 516. The receiving cavity 516 can be an inner cavity of the first cavity, such that the receiving cavity 516 can communicate with the first connection hole 5111, the second connection hole 5131, the third connection hole 5141, the fourth connection hole 5121, and the fifth connection hole 5122. The receiving cavity 516 can accommodate other components of the receiving light assembly 517 in addition to the first filter 5177 and the second filter 5178.

[0257] In some embodiments, the fourth connection hole 5121 and the fifth connection hole 5122 may be located on one side wall of the second side wall 512 and the fourth side wall 514, and the third connection hole 5141 may be located on the other side wall of the second side wall 512 and the fourth side wall 514. For example, the fourth connection hole 5121 and the fifth connection hole 5122 may be located on the second side wall 512, and the third connection hole 5141 may be located on the fourth side wall 514.

[0258] As shown in Figures 21, 22, and 23, the second side wall 512 may have a fourth connection hole 5121. The fourth connection hole 5121 may traverse the second side wall 512 so that the fourth connection hole 5121 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the fourth connection hole 5121. For example, the optical signal of the inner cavity of the first cavity can be incident on the second optical receiving component 520.

[0259] As shown in FIG. 21 and FIG. 23 , in some embodiments, the fourth connection hole 5121 may include a first sub-connection hole 51211 .

[0260] As shown in Figures 21 and 23, in some embodiments, the fourth connection hole 5121 may include a second sub-connection hole 51212. One end of the second sub-connection hole 51212 may be connected to the inner cavity of the first housing 510. The other end of the second sub-connection hole 51212 may be connected to the first sub-connection hole 51211. The size of the second sub-connection hole 51212 is smaller than that of the first sub-connection hole 51211.

[0261] One end of the second sub-connection hole 51212 can be connected to the inner cavity of the first shell 510, and the other end of the second sub-connection hole 51212 can be connected to the first sub-connection hole 51211, so that the fourth connection hole 5121 can be connected to the inner cavity of the first cavity.

[0262] As shown in Figures 21, 22, and 23, the second sidewall 512 may have a fifth connection hole 5122. The fifth connection hole 5122 may be closer to the first sidewall 512 than the fourth connection hole 5121. The fifth connection hole 5122 may traverse the second sidewall 512 so that the fifth connection hole 5122 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the fifth connection hole 5122. For example, the optical signal of the inner cavity of the first cavity can be incident on the first optical receiving component 530.

[0263] In some embodiments, the fourth connection hole 5121 is closer to the second connection hole 5131 than the fifth connection hole 5122 , so that the light receiving component placed in the fourth connection hole 5121 is closer to the light emitting component 400 than the light receiving component placed in the fifth connection hole 5122 .

[0264] As shown in FIG. 21 and FIG. 23 , in some embodiments, the fifth connection hole 5122 may include a third sub-connection hole 51221 .

[0265] As shown in Figures 21 and 23, in some embodiments, the fifth connection hole 5122 may include a fourth sub-connection hole 51222. One end of the fourth sub-connection hole 51222 may communicate with the inner cavity of the first housing 510. The other end of the fourth sub-connection hole 51222 may communicate with the third sub-connection hole 51221. The size of the fourth sub-connection hole 51222 is smaller than that of the third sub-connection hole 51221.

[0266] One end of the fourth sub-connection hole 51222 can be connected to the inner cavity of the first shell 510, and the other end of the fourth sub-connection hole 51222 can be connected to the third sub-connection hole 51221, so that the fifth connection hole 5122 can be connected to the inner cavity of the first cavity.

[0267] As shown in Figures 21, 22, and 23, in some embodiments, the second sidewall 512 may have a first step 5123. The first step 5123 may be located between the fourth connection hole 5121 and the fifth connection hole 5122. The first step 5123 can cause the surface of the area where the fifth connection hole 5122 is located to be at a different height than the surface of the area where the fourth connection hole 5121 is located. In other words, the depth of the fifth connection hole 5122 is different from the depth of the fourth connection hole 5121. This ensures that the light receiving components placed in the fifth connection hole 5122 and the fourth connection hole 5121 are both located within the corresponding connection holes, thereby improving the connection stability between the fifth connection hole 5122 and the fourth connection hole 5121 and their corresponding light receiving components. For example, the second light receiving component 520 is placed in the fourth connection hole 5121, and the first light receiving component 530 is placed in the fifth connection hole 5122. The first step 5123 causes the depth of the fifth connection hole 5122 to be greater than the depth of the fourth connection hole 5121.

[0268] As shown in Figures 21, 22, and 23, the fourth sidewall 514 may have a third connection hole 5141. The third connection hole 5141 may traverse the fourth sidewall 514 so that the third connection hole 5141 can communicate with the inner cavity of the first cavity, thereby allowing the optical signal of the inner cavity of the first cavity to be incident on the optical receiving component connected to the third connection hole 5141. For example, the optical signal of the inner cavity of the first cavity can be incident on the third optical receiving component 540.

[0269] In some embodiments, the central axis of the fourth connection hole 5121 is closer to the first connection hole 5131 than the central axis of the third connection hole 5141 , so that the optical receiving component placed in the fourth connection hole 5121 is closer to the optical fiber adapter 700 than the optical receiving component placed in the third connection hole 5141 .

[0270] As shown in Figures 19 and 23, in some embodiments, the fourth side wall 514 may have a second step 5142 so that the area where the third connecting hole 5141 in the fourth side wall 514 is located is recessed relative to other areas of the fourth side wall 514, thereby providing an accommodation space for the third light receiving component 540 inserted into the third connecting hole 5141 and increasing the strength of the first shell 510.

[0271] FIG24 is a cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure. FIG25 is a cross-sectional view of a light receiving component provided according to some embodiments of the present disclosure from another perspective. As shown in FIG24 and FIG25 , in some embodiments, the first lens 5171 can be located outside the first connection hole 5111, that is, within the accommodating cavity 516, to facilitate active coupling of the first lens 5171. Because the space of the accommodating cavity 516 is larger than the space of the first connection hole 5111, active coupling of the first lens 5171 is facilitated, reducing assembly difficulty.

[0272] In some embodiments, the first lens 5171 can be passively mounted in the first connection hole 5111 to reduce the volume of the first cavity.

[0273] As shown in Figures 24 and 25, in some embodiments, the second optical receiving component 520 can be located on the reflected light path of the first reflector 5173, and the first reflector 5173 faces the fifth wave plate 51726 and the second optical receiving component 520, so that the first wavelength optical signal transmitted by the fifth wave plate 51726 is reflected to the second optical receiving component 520 through the first reflector 5173.

[0274] As shown in Figures 24 and 25, in some embodiments, the first optical receiving component 530 can be located on the reflected light path of the second reflector 5176, and the second reflector 5176 faces the third wave plate 51724 and the first optical receiving component 530, so that the three-wavelength optical signal transmitted by the third wave plate 51724 is reflected to the first optical receiving component 530 through the second reflector 5176.

[0275] As shown in Figures 24 and 25, in some embodiments, the third optical receiving component 540 can be located on the reflected light path of the third reflector 5175, and the third reflector 5175 faces the sixth wave plate 51727 and the third optical receiving component 540, so that the second wavelength optical signal transmitted by the sixth wave plate 51727 is reflected to the third optical receiving component 540 through the third reflector 5175.

[0276] In some embodiments, the wavelength range of the first wavelength optical signal received by the second optical receiving component 520 is 1284-1288 nm, and the receiving rate of the second optical receiving component 520 is greater than the receiving rates of the first optical receiving component 530 and the third optical receiving component 540, resulting in the receiving photosensitive surface of the second optical receiving component 520 being smaller than the receiving photosensitive surfaces of the first optical receiving component 530 and the third optical receiving component 540, so that the transmission path of the first wavelength optical signal received by the second optical receiving component 520 is the shortest, and the optical receiving chip of the second optical receiving component 520 can receive the first wavelength optical signal with high coupling efficiency.

[0277] In some embodiments, the wavelength range of the first wavelength optical signal received by the second optical receiving component 520 is 1284-1288 nm, the wavelength range of the third wavelength optical signal received by the first optical receiving component 510 is 1260-1280 nm, and the wavelength range of the second wavelength optical signal received by the third optical receiving component 540 is 1290-1330 nm. The receiving rates of the second optical receiving component 520, the first optical receiving component 530 and the third optical receiving component 540 decrease successively, and the receiving photosensitive surfaces of the second optical receiving component 520, the first optical receiving component 530 and the third optical receiving component 540 increase successively, so that the transmission paths of the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal increase successively, and the second optical receiving component 520, the first optical receiving component 530 and the third optical receiving component 540 can all receive the corresponding wavelength receiving optical signals with high efficiency.

[0278] As shown in Figures 22, 23, and 24, in some embodiments, the second light receiving assembly 520 can be placed in the fourth connection hole 5121. The second light receiving assembly 520 can be placed in the first sub-connection hole 51211, and the second filter 5178 on the second light receiving assembly 520 can be placed in the second sub-connection hole 51212.

[0279] As shown in Figures 24 and 25, in some embodiments, the first light receiving assembly 530 can be placed in the fifth connection hole 5122. The first light receiving assembly 530 is placed in the third sub-connection hole 51221, and the bracket 550 on the first light receiving assembly 530 is partially located in the third sub-connection hole 51221 and partially located in the fourth sub-connection hole 51222. The first filter 5177 on the bracket 550 is located in the fourth sub-connection hole 51222.

[0280] As shown in FIG. 24 and FIG. 25 , in some embodiments, the third light receiving assembly 540 may be disposed in the third connection hole 5141 .

[0281] As shown in Figures 22, 23 and 24, the first reflector 5173 can be supported on the second supporting surface 5133 so that the first reflector 5173 can face the fifth wave plate 51726 and the second optical receiving component 520 in the fourth connecting hole 5121, so that the first reflector 5173 can reflect the first wavelength optical signal to the second optical receiving component 520.

[0282] 22 and 25 , the first reflective sheet 5173 can rest on the fifth supporting surface 5134. The first reflective sheet 5173 rests on the second supporting surface 5133 and the fifth supporting surface 5134 to increase the contact area between the first reflective sheet 5173 and the first housing 510 and improve the connection stability between the first reflective sheet 5173 and the first housing 510.

[0283] As shown in Figures 21 and 24, the second reflective plate 5176 can be supported on the third supporting surface 5143 so that the second reflective plate 5176 can face the fifth connecting hole 5122, and then the second reflective plate 5176 can face the first optical receiving component 530 in the fifth connecting hole 5122, so that the second reflective plate 5176 can reflect the third wavelength optical signal to the first optical receiving component 530.

[0284] 23 and 25 , a side wall of the wave splitter assembly 5172 can be supported on the fourth supporting surface 5144 to facilitate bonding of the wave splitter assembly 5172 to the first housing 510. The fourth supporting surface 5144 can be located on the inner surface of the fourth side wall 514 or on the inner surface of the second side wall 512.

[0285] As shown in Figures 19, 22 and 24, the third reflector 5175 can be supported on the first supporting surface 5132 so that the third reflector 5175 can face the third connecting hole 5141, and then the third reflector 5175 can face the third optical receiving component 540 in the third connecting hole 5141, so that the third reflector 5175 can reflect the second wavelength optical signal to the third optical receiving component 540.

[0286] In some embodiments, the third reflector 5175 may include an incident surface, a reflective surface, and an exit surface. The incident surface is located between the sixth wave plate 51727 and the reflective surface, the exit surface is located between the third light receiving component 540 and the reflective surface, and the reflective surface is inclined relative to the incident surface. The second wavelength optical signal is incident on the third reflector 5175 through the incident surface, and is reflected by the reflective surface of the third reflector 5175 and then emitted through the exit surface.

[0287] In some embodiments, one side of the reflective surface may be connected to one side of the incident surface via a connecting surface.

[0288] In some embodiments, the other side of the reflective surface may be connected to one side of the emitting surface.

[0289] In some embodiments, the other side of the exit surface may be connected to the other side of the incident surface.

[0290] One side of the reflecting surface can be connected to one side of the incident surface through a connecting surface, the other side of the reflecting surface can be connected to one side of the exit surface, and the other side of the exit surface can be connected to the other side of the incident surface. This can reduce the width of the third reflecting plate 5175 and increase the contact area between the third reflecting plate 5175 (the connecting surface of the third reflecting plate 5175) and the first supporting surface 5132, thereby improving the connection stability between the third reflecting plate 5175 and the first shell 510.

[0291] As shown in FIG. 22 and FIG. 24 , the third filter 5174 can be supported on the first supporting surface 5132 .

[0292] In some embodiments, the third filter 5174 may be located between the sixth wave plate 51717 and the third reflector 5175 to reduce the distance between the third reflector 5175 and the third light receiving assembly 540 , thereby reducing the width of the first housing 510 .

[0293] In some embodiments, the third filter 5174 is connected to the incident surface of the third reflector 5175 so that the third filter 5174 is in contact with the third reflector 5175 , thereby reducing the length of the first shell 510 .

[0294] As shown in Figures 23, 24 and 25, in some embodiments, the central axis of the fourth connecting hole 5121 is closer to the first connecting hole 5131 relative to the central axis of the third connecting hole 5141, which not only reduces the interference between the first reflector 5173 and the third reflector 5175, but also provides a placement space for the third filter 5174, and also reduces the width of the first shell 510.

[0295] After the wavelength splitting component 5172 splits the received optical signal into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal, the optical path is shown in FIG24 . The first wavelength optical signal is reflected by the first reflector 5173 to the second filter 5178, filtered by the second filter 5178, and then incident on the second optical receiving component 520; the third wavelength optical signal is reflected by the second reflector 5176 to the first filter 5177 for filtration, and then incident on the first optical receiving component 530; the second wavelength optical signal is filtered by the third filter 5174, and then incident on the third reflector 5175, and reflected by the third reflector 5175 to the third optical receiving component 540.

[0296] Figure 26 illustrates an assembly diagram of another optical receiving component and an adapter board according to some embodiments of the present disclosure. Figure 27 illustrates an assembly diagram of another optical receiving component, an optical fiber adapter, and a circuit board according to some embodiments of the present disclosure. Figure 28 illustrates an exploded schematic diagram of another optical receiving component according to some embodiments of the present disclosure. As shown in Figures 26, 27, and 28, in some embodiments, the optical input end of the optical receiving component 500 can be connected to the optical output end of the optical transmitting component 400. The optical input and output ends of the optical receiving component 500 can be connected to the optical fiber adapter 700.

[0297] As shown in FIG. 27 , the light emitting component 400 and the circuit board 300 may be connected via a flexible circuit board 900 .

[0298] In some embodiments, the flexible circuit board 900 may include a first end that may be connected to a surface of the circuit board 300 .

[0299] In some embodiments, the flexible circuit board 900 may include a second end that may be connected to the first electrical input end of the light emitting component 400 and connected to the first end.

[0300] In some embodiments, the flexible circuit board 900 may include a third end. The third end may be connected to the second electrical input end of the light emitting component 400. The third end may be connected to the first end. A gap may be provided between the third end and the second end so that the second end of the flexible circuit board 900 is not connected to the third end.

[0301] As shown in Figures 26, 27, and 28, in some embodiments, an adapter plate 310 may be disposed within the housing of the optical module. One end of the adapter plate 310 may be inserted into the light receiving component 500. The other end of the adapter plate 310 may be connected to the circuit board 300. One end of the adapter plate 310 may be inserted into the light receiving component 500, and the other end of the adapter plate 310 may be connected to the circuit board 300, thereby enabling electrical signal transmission between the light receiving component 500 and the circuit board 300 through the adapter plate 310.

[0302] In some embodiments, the other end of the adapter plate 310 is stacked with the circuit board 300 , and the adapter plate 310 and the circuit board 300 are electrically connected through a connector.

[0303] As shown in Figures 26, 27 and 28, in some embodiments, the adapter plate 310 and the light receiving component 500 may enclose a first avoidance opening 320. The light emitting component 400 may be placed in the first avoidance opening 320 of the adapter plate 310 to provide space for the light emitting component 400.

[0304] As shown in FIG. 28 , in some embodiments, the light receiving member 500 may include a first cover plate 515 .

[0305] As shown in FIG. 28 , in some embodiments, the optical receiving component 500 may include a first housing 510 . A first cover 515 may be placed over the first housing 510 to form a first cavity. A receiving optical component 517 may be disposed within the first cavity. The receiving optical component 517 may transmit a transmitted optical signal to the fiber optic adapter 700 , or may split a received optical signal transmitted by the fiber optic adapter 700 into the first cavity and direct the splitted received optical signal to a corresponding optical receiving component.

[0306] Figure 29 is a second exploded schematic diagram of another optical receiving component provided according to some embodiments of the present disclosure. Figure 30 is an exploded view of another first housing and another optical receiving assembly provided according to some embodiments of the present disclosure. As shown in Figures 29 and 30, in some embodiments, at least one optical receiving chip is disposed on one end surface of the adapter plate 310 extending into the optical receiving component 500.

[0307] In some embodiments, the at least one light receiving chip may include a first light receiving chip 3132 .

[0308] In some embodiments, the at least one light receiving chip may include a second light receiving chip 3131 .

[0309] In some embodiments, the at least one light receiving chip may include a third light receiving chip 3121 .

[0310] Any two of the first light receiving chip 3132, the second light receiving chip 3131 and the third light receiving chip 3121 can be located on one side of the adapter board 310, and the remaining one of the first light receiving chip 3132, the second light receiving chip 3131 and the third light receiving chip 3121 can be located on the other side of the adapter board 310 to reduce the length dimension of the light receiving component 500.

[0311] As shown in Figures 29 and 30, in some embodiments, the adapter board 310 may include a connecting portion 311. The connecting portion 311 may be stacked with the circuit board 300 and electrically connected via a connector.

[0312] As shown in Figures 29 and 30 , in some embodiments, the adapter plate 310 may include a first clamping portion 312. One end of the first clamping portion 312 is inserted into the first housing 510. The other end of the first clamping portion 312 may be connected to the connecting portion 311.

[0313] As shown in Figures 29 and 30, in some embodiments, the adapter plate 310 may include a second clamping portion 313. One end of the second clamping portion 313 is inserted into the first housing 510. The other end of the second clamping portion 313 may be connected to the connecting portion 311. The first clamping portion 312 may be disconnected from the second clamping portion 313, so that the first clamping portion 312, the connecting portion 311, and the second clamping portion 313 form an adapter plate 310 having a second avoidance opening.

[0314] In some embodiments, the size of the first avoidance opening 320 is smaller than the size of the second avoidance opening.

[0315] In some embodiments, the third light receiving chip 3121 may be located on a surface of the first clamping portion 312 , and the first light receiving chip 3132 and the second light receiving chip 3131 may be located on a surface of the second clamping portion 313 .

[0316] 29 and 30 , in some embodiments, the first housing 510 may include a first side wall 511. The first side wall 511 may be connected to the fiber optic adapter 700. The first side wall 511 may have a first connection hole 5111.

[0317] As shown in Figures 29 and 30, in some embodiments, the first housing 510 may include a third sidewall 513. The third sidewall 513 may be connected to the light emitting component 400. The third sidewall 513 is disposed opposite the first sidewall 511. The third sidewall 513 may have a second connection hole 5131. The second connection hole 5131 may be connected to the light emitting component 400, so that the transmission light signal emitted by the light emitting component 400 can be incident on the first cavity through the second connection hole 5131.

[0318] In some embodiments, the third sidewall 513 may have a first notch 5135. The opening of the first notch 5135 may face a side edge of the first housing 510. The first notch 5135 may be disposed corresponding to the first engaging portion 312. The first engaging portion 312 may be inserted into the first housing 510 through the first notch 5135.

[0319] In some embodiments, there is a gap between the first notch 5135 and the bottom of the third side wall 513 so that the height of the bottom of the first notch 5135 is flush with the height of the bottom of the adapter plate 310, thereby facilitating the first clamping portion 312 to be inserted into the first shell 510 through the first notch 5135.

[0320] In some embodiments, the width of the first notch 5135 can be greater than or equal to the thickness of the first clamping portion 312, so that the first clamping portion 312 can be inserted into the first housing 510 through the first notch 5135. For example, the width of the first notch 5135 is equal to the thickness of the first clamping portion 312 to improve the sealing performance of the third sidewall 513.

[0321] In some embodiments, the length of the first notch 5135 may be greater than or equal to the width of the first engaging portion 312 . For example, the length of the first notch 5135 is equal to the width of the first engaging portion 312 .

[0322] In some embodiments, the third sidewall 513 may have a second notch 5136. The opening of the second notch 5136 may face the other side of the first housing 510. The second notch 5136 may correspond to the second engaging portion 313. The second engaging portion 313 may be inserted into the first housing 510 through the second notch 5136.

[0323] In some embodiments, there is a gap between the second notch 5136 and the bottom of the third side wall 513 so that the height of the bottom of the second notch 5136 is flush with the height of the bottom of the adapter plate 310, thereby facilitating the second clamping portion 313 to be inserted into the first shell 510 through the second notch 5136.

[0324] In some embodiments, the width of the second notch 5136 can be greater than or equal to the thickness of the second clamping portion 313, so that the second clamping portion 313 can be inserted into the first housing 510 through the second notch 5136. For example, the width of the second notch 5136 is equal to the thickness of the second clamping portion 313 to improve the sealing performance of the third sidewall 513.

[0325] In some embodiments, the length of the second notch 5136 may be greater than or equal to the width of the second engaging portion 313 . For example, the length of the second notch 5136 is equal to the width of the second engaging portion 313 .

[0326] In some embodiments, the first notch 5135 and the second notch 5136 may be located on both sides of the second connection hole 5131 to improve the connection stability between the adapter plate 310 and the first shell 510 .

[0327] As shown in FIG29 and FIG30 , in some embodiments, the first housing 510 may include a bottom plate 5161 . The light receiving assembly 517 may be disposed on the bottom plate 5161 to support the light receiving assembly 517 .

[0328] 28 , the first cover 515 covering the first housing 510 may include a first connecting portion 5151. The first connecting portion 5151 may be disposed opposite to the bottom plate 5161.

[0329] In some embodiments, the first cover plate 515 may include a second connecting portion 5152. One side of the second connecting portion 5152 may be connected to the first connecting portion 5151. The other side of the second connecting portion 5152 may be connected to a side wall of the bottom plate 5161 near the first clamping portion 312.

[0330] In some embodiments, the first cover plate 515 may include a third connecting portion 5153. The third connecting portion 5153 is disposed opposite the second connecting portion 5152. One side of the third connecting portion 5153 may be connected to the first connecting portion 5151. The other side of the third connecting portion 5153 may be connected to a side wall of the bottom plate 5161 near the second engaging portion 313.

[0331] As shown in Figures 28, 29, and 30, in some embodiments, the light receiving assembly 517 may include a first lens 5171, a wave splitting assembly 5172, a first reflector 5173, a second reflector 5176, a third reflector 5175, and a third filter 5174. The functions and relative positions of the above components have been described above and will not be repeated here.

[0332] As shown in FIG. 28 , FIG. 29 and FIG. 30 , in some embodiments, the receiving light assembly 517 may include a second lens 5179 .

[0333] As shown in FIG. 28 , FIG. 29 and FIG. 30 , in some embodiments, the receiving light assembly 517 may include a second lens 5181 .

[0334] As shown in FIG. 28 , FIG. 29 and FIG. 30 , in some embodiments, the receiving light assembly 517 may include a second lens 5183 .

[0335] As shown in Figures 28, 29, and 30, in some embodiments, the receiving light assembly 517 may include a turning prism 5180. The turning prism 5180 can reflect the optical signal converged by the second lens 5179 to the corresponding optical receiving chip. For example, the turning prism 5180 can reflect the optical signal converged by the second lens 5179 to the first optical receiving chip 3132.

[0336] As shown in Figures 28, 29, and 30, in some embodiments, the receiving light assembly 517 may include a turning prism 5182. The turning prism 5182 can reflect the optical signal converged by the second lens 5181 to the corresponding optical receiving chip. For example, the turning prism 5182 can reflect the optical signal converged by the second lens 5181 to the second optical receiving chip 3131.

[0337] As shown in Figures 28, 29, and 30, in some embodiments, the receiving light assembly 517 may include a turning prism 5184. The turning prism 5184 can reflect the optical signal converged by the second lens 5183 to the corresponding optical receiving chip. For example, the turning prism 5184 can reflect the optical signal converged by the second lens 5183 to the third optical receiving chip 3121.

[0338] Each of the turning prisms 5180 , 5182 and 5184 has a reflecting surface, which is tilted above the corresponding light receiving chip so that the light signal is reflected by the reflecting surface to the corresponding light receiving chip.

[0339] As shown in Figures 28, 29, and 30, in some embodiments, the bottom plate 5161 may include a first support portion 51611. The first support portion 51611 may support the first lens 5171, the wave splitter assembly 5172, the first reflector 5173, the second reflector 5176, the third reflector 5175, the third filter 5174, the second lens 5179, the turning prism 5180, the second lens 5181, the turning prism 5182, the second lens 5183, and the turning prism 5184.

[0340] In some embodiments, the bottom plate 5161 may include a second support portion 51612. The second support portion 51612 may be located on one side of the first support portion 51611. The second support portion 51612 may support the first clamping portion 312. The height of the second support portion 51612 is lower than that of the first support portion 51611, so that the height of the light receiving chip on the first clamping portion 312 is lower than that of the turning prism 5184.

[0341] In some embodiments, the bottom plate 5161 may include a third support portion 51613. The third support portion 51613 may be located on the other side of the first support portion 51611. The third support portion 51613 may support the second clamping portion 313. The height of the third support portion 51613 is lower than that of the first support portion 51611, so that the height of the light receiving chip on the second clamping portion 313 is lower than that of the turning prism.

[0342] In some embodiments, one end of the turning prism 5180 is fixed to the first support portion 51611 and the other end is suspended on the third support portion 51613 so that the optical signal reflected by the turning prism 5180 can be incident on the corresponding optical receiving chip placed on the third support portion 51613.

[0343] In some embodiments, one end of the turning prism 5182 is fixed to the first support portion 51611 and the other end is suspended on the third support portion 51613 so that the optical signal reflected by the turning prism 5182 can be incident on the corresponding optical receiving chip placed on the third support portion 51613.

[0344] In some embodiments, one end of the turning prism 5184 is fixed to the first support portion 51611 and the other end is suspended on the second support portion 51612 so that the optical signal reflected by the turning prism 5184 can be incident on the corresponding optical receiving chip placed on the second support portion 51612.

[0345] As shown in Figures 28, 29, and 30, in some embodiments, a first supporting plate 51614 may be provided on the first supporting portion 51611. The first supporting plate 51614 may be provided along the length of the first housing 510. The substrate of the wave splitting assembly 5172 rests on the side of the first supporting plate 51614.

[0346] As shown in Figures 28, 29, and 30, in some embodiments, a second supporting plate 51615 may be provided on the first supporting portion 51611. The inner surface of the second supporting plate 51615 is a supporting surface, which faces the second lens 5179. The second reflective sheet 5176 rests on the supporting surface of the second supporting plate 51615.

[0347] As shown in FIG. 28 , FIG. 29 and FIG. 30 , the first bearing surface 5132 may be provided on the first supporting portion 51611 .

[0348] As shown in FIG. 28 , FIG. 29 and FIG. 30 , the second supporting surface and the fifth supporting surface for supporting the first reflective sheet 5173 are also located on the first supporting portion 51611 .

[0349] The above is a description of the different parts of two different light receiving components. The same parts have been introduced in the introduction of one light receiving component and will not be repeated here.

[0350] Figure 31 is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 32 is a schematic diagram of the structure of a light emitting component according to some embodiments of the present disclosure. Figure 33 is an exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure. As shown in Figures 31, 32, and 33, in some embodiments, the light emitting component 400 may include a second cavity. The second cavity may be connected to one end of the first cavity.

[0351] In some embodiments, the second cavity may include a second cover plate 420 .

[0352] In some embodiments, the second cavity may include a second housing 410. A second cover 420 may cover the second housing 410 to form the second cavity.

[0353] In some embodiments, the second housing 410 may include a bottom plate 411. The bottom plate 411 may be used to support the device.

[0354] In some embodiments, the second housing 410 may include a first sidewall 412. The first sidewall 412 may be located at one end of the second housing 410. The bottom of the first sidewall 412 may be connected to the bottom plate 411.

[0355] In some embodiments, the second housing 410 may include a second sidewall 413. The second sidewall 413 may be located on a side of the first housing 510510. The bottom of the second sidewall 413 may be connected to the bottom plate 411. One end of the second sidewall 413 may be connected to one end of the second sidewall 413.

[0356] In some embodiments, the second housing 410 may include a third sidewall 414. The third sidewall 414 may be located at the other end of the first housing 510-510. The third sidewall 414 may be close to the circuit board 300. The bottom of the third sidewall 414 may be connected to the bottom plate 411. One end of the third sidewall 414 may be connected to the other end of the second sidewall 413.

[0357] In some embodiments, the second housing 410 may include a fourth sidewall 415. The fourth sidewall 415 may be located on a side of the first housing 510. The fourth sidewall 415 may be disposed opposite the second sidewall 413. The bottom of the fourth sidewall 415 may be connected to the bottom plate 411. One end of the fourth sidewall 415 may be connected to the other end of the third sidewall 414. The other end of the fourth sidewall 415 may be connected to the other end of the first sidewall 412.

[0358] The first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are sequentially connected and their bottoms are connected to the bottom plate 411 to form a second inner cavity. The tops of the first side wall 412, the second side wall 413, the third side wall 414, and the fourth side wall 415 are supported and connected to the second cover plate 420. In some embodiments, the second housing 410 is a housing integrally formed of a metal material.

[0359] In some embodiments, a sixth connection hole 4121 may be provided on the first sidewall 412. The sixth connection hole 4121 communicates with the second inner cavity and serves as a light outlet for the second cavity. The sixth connection hole 4121 connects to the first shell 510, allowing the second shell 410 to communicate with the accommodating cavity 516 through the sixth connection hole 4121. Exemplarily, the other end of the first shell 510 is embedded with the sixth connection hole 4121. In some embodiments, a boss 4122 is provided on the outer side of the first sidewall 412, one end of the sixth connection hole 4121 passes through the boss 4122, and the end of the first shell 510 is embedded with the connection boss 4122.

[0360] In some implementations, two rows of pins may be provided on the third sidewall 414, each row of pins including a plurality of pins 430. The pins 430 on the third sidewall 414 are electrically connected to the circuit board 300 via corresponding flexible circuit boards.

[0361] In some embodiments, two rows of parallel pins may be provided on the fourth side wall 415, each row of pins including a plurality of pins 430. The pins 430 on the fourth side wall 415 are electrically connected to the circuit board 300 via corresponding flexible circuit boards.

[0362] Two rows of pins are respectively provided on the third side wall 414 and the fourth side wall 415, each row of pins includes a plurality of pins 430. For the convenience of description, the row of pins on the third side wall 414 and the fourth side wall 415 close to the bottom plate 411 is referred to as the bottom row of pins on the third side wall 414 and the fourth side wall 415; the pins 430 on the third side wall 414 and the pins 430 on the fourth side wall 415 are respectively electrically connected to the circuit board 300 through corresponding flexible circuit boards.

[0363] As shown in Figures 31, 32, and 33, in some embodiments, a first laser assembly 440 may be disposed within the second housing 410. The first laser assembly 440 may be located on a side wall of the second housing 410. The first laser assembly 440 may generate a fourth wavelength optical signal.

[0364] As shown in Figures 31, 32, and 33, in some embodiments, a second laser assembly 450 may be disposed in the second housing 410. The second laser assembly 450 may be located on a side wall of the second housing 410. The second laser assembly 450 may generate an optical signal at a fifth wavelength.

[0365] As shown in Figures 31, 32, and 33, in some embodiments, a third laser assembly 460 may be disposed within the second housing 410. The third laser assembly 460 may be located on a side wall of the second housing 410. The third laser assembly 460 may generate an optical signal at a sixth wavelength.

[0366] In some embodiments, the first laser assembly 440 , the second laser assembly 450 , and the third laser assembly 460 are all located on a side of the third sidewall 414 , such that the first laser assembly 440 , the second laser assembly 450 , and the third laser assembly 460 are arranged in a row.

[0367] In some embodiments, the first laser assembly 440 is located on the sides of the second side wall 413 and the third side wall 414; the second laser assembly 450 and the third laser assembly 460 are located on the side of the fourth side wall 415, and the third laser assembly 460 is located on the side of the second laser assembly 450 away from the third side wall 414, and the third laser assembly 460 is located on the side of the first side wall 412, so that the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 are distributed on the sides of two connected side walls on the second shell 410, thereby making the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460 in a triangular distribution state instead of being arranged in a row, so as to reduce the packaging volume of the light emitting component 400.

[0368] In some embodiments, the third sidewall 414 is disposed along the width direction of the second housing 410, and the fourth sidewall is disposed along the length direction of the second housing 410. This allows the first laser assembly 440 to be disposed within the width direction of the second housing 410, thereby reducing the width dimension of the second housing 410. The second laser assembly 450 and the third laser assembly 460 are disposed within the length direction of the second housing 410, in conjunction with the first laser assembly 440 disposed within the width direction of the second housing 410. This allows sufficient laser assemblies to be disposed within the second housing 410, while reducing the overall dimension of the second housing 410 and, consequently, the dimension of the light-emitting component 400.

[0369] In some embodiments, the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 have different transmission rates. For example, the transmission rate of the first laser assembly 440 is greater than the transmission rate of the second laser assembly 450, and the transmission rate of the second laser assembly 450 is greater than the transmission rate of the third laser assembly 460. For example, the transmission rate of the first laser assembly 440 is 50G, the transmission rate of the second laser assembly 450 is 10G, and the transmission rate of the third laser assembly 460 is 2.5G.

[0370] In some embodiments, the second housing 410 may be provided with a combining component that can combine the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal into a single transmit optical signal.

[0371] In some embodiments, the wavelength division multiplexer can be a wavelength division multiplexer. The input side of the wavelength division multiplexer faces the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460, and the output side of the wavelength division multiplexer faces the sixth connection hole 4121. The wavelength division multiplexer combines the optical signals of the first wavelength, the second wavelength, and the third wavelength emitted by the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 into a single transmitted optical signal.

[0372] In some embodiments, the combining assembly includes a polarization assembly and a polarization combining assembly. The polarization assembly is used to adjust the polarization direction of the optical signal, and the polarization combining assembly combines multiple polarized light beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then the polarization combining assembly combines the multiple polarized light beams into a single beam, thereby achieving wave combining in the optical emitting component.

[0373] The above two types of multiplexing modules are applicable to the case where the first laser module 440 , the second laser module 450 and the third laser module 460 are arranged in a row.

[0374] In some embodiments, the wavelength combining component includes a plurality of optical filters, and the plurality of optical filters cooperate with each other to combine the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal into a beam of transmitted optical signal.

[0375] The multiplexer component composed of multiple filters is not only applicable to the situation where the first laser component 440, the second laser component 450 and the third laser component 460 are arranged in a row, but also applicable to the situation where the first laser component 440, the second laser component 450 and the third laser component 460 are distributed in a triangle.

[0376] In some embodiments, the multiplexing assembly may include a second optical filter 416. The second optical filter 416 may be disposed on the side of the sixth connection hole 4121. The second optical filter 416 is located in the output optical path of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The second optical filter 416 may be used to transmit the fourth wavelength optical signal and the fifth wavelength optical signal, and may also be used to reflect the sixth wavelength optical signal.

[0377] In some embodiments, the wavelength combining assembly may include a third optical filter 417. The third optical filter 417 may be disposed on the side of the sixth connection hole 4121. The third optical filter 417 may be located in the output optical path of the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460. The third optical filter 417 may be disposed side by side with the second optical filter 416. The third optical filter 417 may be configured to transmit the fourth wavelength optical signal and reflect the fifth wavelength optical signal.

[0378] The second filter 416 and the third filter 417 are both arranged on the side of the sixth connecting hole 4121 and are both located on the output optical path of the first laser assembly 440, the second laser assembly 450 and the third laser assembly 460. The second filter 416 and the third filter 417 are arranged side by side to change the transmission optical path of the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal, so that the fourth wavelength optical signal, the fifth wavelength optical signal and the sixth wavelength optical signal can pass through the sixth connecting hole 4121.

[0379] In some embodiments, the second filter 416 and the third filter 417 are arranged on the side where the first side wall 412 and the second side wall 413 are connected, so that the second filter 416, the third filter 417 and the first laser assembly 440 are arranged compactly, which facilitates controlling the length direction of the second shell 410.

[0380] In some embodiments, second filter 416 is disposed at the intersection of the output optical paths of first laser assembly 440 and third laser assembly 460, and third filter 417 is disposed at the intersection of the output optical paths of first laser assembly 440 and second laser assembly 450. First laser assembly 440 is located on the transmissive side of third filter 417, second laser assembly 450 is located on the reflective side of third filter 417, and third laser assembly 460 is located on the reflective side of second filter 416. Exemplarily, second filter 416 includes a first optical surface and a second optical surface, which are primary optical surfaces of second filter 416. Third filter 417 includes a third optical surface and a fourth optical surface, which are primary optical surfaces of third filter 417. The first optical surface faces third laser assembly 460, the second optical surface faces third filter 417, the third optical surface faces second laser assembly 450, and the fourth optical surface faces first laser assembly 440.

[0381] In some embodiments, a mounting bracket 470 may be provided within the second housing 410. The mounting bracket 470 may be provided on the side of the sixth connection hole 4121 and secured within the second housing 410. The mounting bracket 470 may support and connect the second optical filter 416 and the third optical filter 417. The second optical filter 416 and the third optical filter 417 are secured within the second housing 410 via the mounting bracket 470, facilitating securing the second optical filter 416 and the third optical filter 417 within the second housing 410.

[0382] In some embodiments, a lens 418 may be disposed within the second housing 410. The lens 418 may be disposed on the optical path from the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460 to the second filter 416 or the third filter 417. For example, a first lens 4181 is disposed on the optical path from the first laser assembly 440 to the third filter 417 to collimate the fourth wavelength optical signal; a second lens 4182 is disposed on the optical path from the second laser assembly 450 to the third filter 417 to collimate the fifth wavelength optical signal; and a third lens 4183 is disposed on the optical path from the third laser assembly 460 to the second filter 416 to collimate the sixth wavelength optical signal.

[0383] Figure 34 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 35 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 36 is a cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 34, 35, and 36, in some embodiments, the first laser assembly 440 may include a first laser chip 442. The first laser chip 442 integrates an electro-absorption modulated laser and a semiconductor optical amplifier.

[0384] 34 , 35 , and 36 , in some embodiments, the first laser assembly 440 may include a first substrate 441 . A first laser chip 442 may be mounted on the first substrate 441 .

[0385] In some embodiments, a ground layer 4410 may be disposed on the first substrate 441 , and a first laser chip 442 may be mounted on the ground layer 4410 .

[0386] In some embodiments, a first high-frequency pad 4411 may be disposed on the first substrate 441. The first high-frequency pad 4411 may be located on a side of the first laser chip 442. The first high-frequency pad 4411 may be wire-bonded to the first laser chip 442.

[0387] In some embodiments, a first LD pad 4412 may be provided on the first substrate 441. The first LD pad 4412 may be located at a side of the first laser chip 442. The first LD pad 4412 may be wire-bonded to the first laser chip 442.

[0388] In some embodiments, a first SOA pad 4413 may be provided on the first substrate 441. The first SOA pad 4413 may be located at a side of the first laser chip 442. The first SOA pad 4413 may be wire-bonded to the first laser chip 442.

[0389] The first high-frequency pad 4411 , the first LD pad 4412 and the first SOA pad 4413 are all located on the side of the first laser chip 442 , and are respectively wire-bonded to the first laser chip 442 .

[0390] A first high-frequency pin 4301, a first SOA pin 4302 and a first LD pin 4303 are provided on the third side wall 414. The first high-frequency pin 4301, the first SOA pin 4302 and the first LD pin 4303 are embedded in the third side wall 414 and their ends extend into the inner cavity of the second shell 410 respectively. The first high-frequency pin 4301, the first SOA pin 4302 and the first LD pin 4303 are respectively insulated from the third side wall 414 by an insulating layer. The first high-frequency pin 4301 is located in the bottom row of pins on the third side wall 414.

[0391] The first high-frequency pin 4301 is electrically connected to the first high-frequency pad 4411, the first SOA pin 4302 is electrically connected to the first SOA pad 4413, and the first LD pin 4303 is electrically connected to the first LD pad 4412. For example, one end of the first high-frequency pin 4301 is wired to the first high-frequency pad 4411, one end of the first SOA pin 4302 is wired to the first SOA pad 4413, and one end of the first LD pin 4303 is wired to the first LD pad 4412.

[0392] In some embodiments, the height of the first high-frequency pin 4301 on the third sidewall 414 is lower than the height of the first SOA pin 4302 and the first LD pin 4303 on the third sidewall 414, that is, the first high-frequency pin 4301 is closer to the bottom plate 411. A first ground pin 4304 is also provided on the third sidewall 414. The first ground pin 4304 is located to the side of the first high-frequency pin 4301 and is electrically connected to the third sidewall 414.

[0393] In some embodiments, a first adapter board 481 may be disposed within the second housing 410. A circuit pattern may be disposed on the first adapter board 481 to enable electrical connection between the first high-frequency pin 4301 and the first laser assembly 440 via the first adapter board 481. The first adapter board 481 may be used to impedance match the first laser chip 442 to ensure impedance continuity of the high-frequency transmission link.

[0394] In some embodiments, a first high-frequency transmission line 4811 may be provided on the front surface of the first adapter plate 481. A first ground layer 4812 may be provided on one side of the first high-frequency transmission line 4811. A second ground layer 4813 may be provided on the other side of the first high-frequency transmission line 4811. One end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is electrically connected to the first high-frequency pin 4301. Exemplarily, one end of the first high-frequency transmission line 4811 is wire-bonded to the first high-frequency pad 4411, and the other end of the first high-frequency transmission line 4811 is soldered to the first high-frequency pin 4301; the ground layer 4110 is wire-bonded to the first ground layer 4812 and the second ground layer 4813.

[0395] In some embodiments, a ground layer may be provided on the back of the first adapter board 481 , and via holes may be provided on the first ground layer 4812 and the second ground layer 4813 , respectively. The first ground layer 4812 and the second ground layer 4813 are connected to the ground layer on the back of the first adapter board 481 through the via holes.

[0396] Figure 37 is a third schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure. Figure 38 is a second cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. Figure 39 is a third cross-sectional view of a light emitting component provided according to some embodiments of the present disclosure. As shown in Figures 37, 38, and 39, in some embodiments, the second laser assembly 450 may include a second laser chip 452. The second laser chip 452 integrates an electro-absorption modulated laser and a semiconductor optical amplifier.

[0397] 37 , 38 , and 39 , in some embodiments, the second laser assembly 450 may include a second substrate 451 . A second laser chip 452 is mounted on the second substrate 451 .

[0398] In some embodiments, a ground layer may be disposed on the second substrate 451. The second laser chip 452 may be mounted on the ground layer.

[0399] In some embodiments, a second high-frequency pad 4511 may be provided on the second substrate 451. The second high-frequency pad 4511 may be located on a side of the second laser chip 452. The second high-frequency pad 4511 may be wire-bonded to the second laser chip 452.

[0400] In some embodiments, a second LD pad 4512 may be provided on the second substrate 451. The second LD pad 4512 may be located on a side of the second laser chip 452. The second LD pad 4512 may be wire-bonded to the second laser chip 452.

[0401] In some embodiments, a second SOA pad 4513 may be provided on the second substrate 451. The second SOA pad 4513 may be located at a side of the second laser chip 452. The second SOA pad 4513 may be wire-bonded to the second laser chip 452.

[0402] The second high-frequency pad 4511 , the second LD pad 4512 and the second SOA pad 4513 are all located on the side of the second laser chip 452 . The second high-frequency pad 4511 , the second LD pad 4512 and the second SOA pad 4513 are respectively connected to the second laser chip 452 by wire bonding.

[0403] Pins 430 may include a second high-frequency pin 4305, a second SOA pin 4306, and a second LD pin 4307. Second high-frequency pin 4305 is located in the bottom row of pins on third sidewall 414. Second high-frequency pin 4305 is electrically connected to second high-frequency pad 4511, second SOA pin 4306 is electrically connected to second SOA pad 4513, and second LD pin 4307 is electrically connected to second LD pad 4512.

[0404] In some embodiments, a second adapter board 482 may be disposed within the second housing 410. A circuit board pattern may be provided on the second adapter board 482. The second adapter board 482 is used to electrically connect the second high-frequency pin 4305 to the second laser assembly 450. The second adapter board 482 may also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link.

[0405] In some embodiments, a second high-frequency pin 4305 is embedded in and connected to the third sidewall 414, insulated from the third sidewall 414 by an insulating layer. A second adapter plate 482 is disposed on a side of the third sidewall 414. A second SOA pin 4306 and a second LD pin 4307 are embedded in and connected to the fourth sidewall 415 and insulated from the fourth sidewall 415 by an insulating layer. The second SOA pin 4306 is wired to the second SOA pad 4513, and the second LD pin 4307 is wired to the second LD pad 4512. A second ground pin 4308 is also disposed on the third sidewall 414, located on a side of the second high-frequency pin 4305 and electrically connected to the third sidewall 414. Exemplarily, the second ground pin 4308 is located on a side of the second high-frequency pin 4305 that is proximal to the first high-frequency pin 4301. The second adapter plate 482 and the first adapter plate 481 are located on the same side of the second shell 410 , which facilitates the assembly of the second adapter plate 482 and improves the assembly density of components in the second shell 410 , thereby helping to reduce the size of the second shell 410 .

[0406] In some embodiments, a second high-frequency transmission line 4821 is disposed on the front surface of the second adapter plate 482, a third ground layer 4822 is disposed on one side of the second high-frequency transmission line 4821, and a fourth ground layer 4823 is disposed on the other side of the second high-frequency transmission line 4821. One end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is electrically connected to the second high-frequency pin 4305. Exemplarily, one end of the second high-frequency transmission line 4821 is bonded to the second high-frequency pad 4511, and the other end of the second high-frequency transmission line 4821 is soldered to the second high-frequency pin 4305; the ground layer 4510 electrically connects the third ground layer 4822 and the fourth ground layer 4823.

[0407] In some embodiments, a ground layer is provided on the back of the second adapter plate 482, and vias are provided in the third and fourth ground layers 4822 and 4823, respectively. The third and fourth ground layers 4822 and 4823 are connected to the ground layer on the back of the second adapter plate 482 through the vias. In some embodiments, a third adapter plate 483 is further provided within the second housing 410, with a circuit pattern provided thereon. The third adapter plate 483 is positioned between the second laser assembly 450 and the second adapter plate 482, with the side edges of the third adapter plate 483 adjacent to the first laser assembly 440. The third adapter plate 483 is used to achieve an electrical connection between the second laser assembly 450 and the second adapter plate 482. The third adapter plate 483 can also be used to impedance match the second laser chip 452 to ensure impedance continuity of the high-frequency transmission link. The third adapter plate 483 helps reduce the length of the wires between the second laser assembly 450 and the second adapter plate 482, thereby reducing parasitic inductance and ensuring high-frequency signal transmission quality.

[0408] In some embodiments, a third high-frequency transmission line 4831 is disposed on the front surface of the third adapter plate 483, a fifth ground layer 4832 is disposed on one side of the third high-frequency transmission line 4831, and a sixth ground layer 4833 is disposed on the other side of the third high-frequency transmission line 4831. One end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is electrically connected to the second high-frequency transmission line 4821. Exemplarily, one end of the second high-frequency transmission line 4821 is wired to the second high-frequency pad 4511, and the other end of the third high-frequency transmission line 4831 is wired to one end of the second high-frequency transmission line 4821; the fifth ground layer 4832 is wired to the third ground layer 4822, the sixth ground layer 4833 is wired to the fourth ground layer 4823, and the fifth and sixth ground layers 4832 and 4833 are each wired to the ground layer 4510.

[0409] In some embodiments, a third LD pad 4834 and a third SOA pad 4835 are further provided on the front surface of the third adapter board 483. The third LD pad 4834 and the third SOA pad 4835 are located near the first laser assembly 440. The first LD pad 4412 and the first LD pin 4303 are electrically connected to the third LD pad 4834, respectively. The first SOA pad 4413 and the first SOA pin 4302 are electrically connected to the third SOA pad 4835, respectively. This allows the first laser assembly 440, the first LD pin 4303, and the first SOA pin 4302 to be electrically connected via the third adapter board 483, thereby facilitating control of the bonding arc height and thus facilitating bonding. In some embodiments, capacitors are mounted on third LD pad 4834 and third SOA pad 4835, respectively. First LD pad 4412 and first LD pin 4303 are connected to the capacitors mounted on third LD pad 4834, respectively. First SOA pad 4413 and first SOA pin 4302 are wired to connect the capacitors mounted on third SOA pad 4835. A third adapter plate 483 is disposed at the junction of third sidewall 414 and fourth sidewall 415, enabling third adapter plate 483 to serve both first laser assembly 440 and second laser assembly 450, thereby facilitating coordinated use of space within second housing 410.

[0410] In some embodiments, the third laser assembly 460 may include a third laser chip 462 .

[0411] In some embodiments, the third laser assembly 460 may include a third substrate 461 , on which a cathode pad 4611 may be disposed. A third laser chip 462 may be mounted on the cathode pad 4611 .

[0412] In some embodiments, a positive electrode pad 4612 may be provided on the third substrate, and the third laser chip 462 is connected to the positive electrode pad 4612 by wire bonding.

[0413] Pins 430 may include a third LD pin 4309 and a fourth LD pin 4310. Third LD pin 4309 is wired to positive electrode pad 4612, and fourth LD pin 4310 is wired to negative electrode pad 4611. Exemplarily, third LD pin 4309 and fourth LD pin 4310 are embedded in fourth sidewall 415, with their ends extending into the inner cavity of second housing 410 and insulated from fourth sidewall 415 by an insulating layer.

[0414] In some embodiments, the third laser assembly 460 may include a backlight detector 463 disposed on the third substrate 461 and located on the backlight side of the third laser chip 462. The backlight detector 463 is configured to receive backlight from the third laser chip 462 to monitor the optical signal at the sixth wavelength.

[0415] The pins 430 may include an MPD pin 4311, which is wired to the backlight detector 463. For example, the MPD pin 4311 is embedded in the fourth side wall 415, with the end of the MPD pin 4311 extending into the inner cavity of the second housing 410. The MPD pin 4311 is insulated from the fourth side wall 415 by an insulating layer.

[0416] In some embodiments, a thermoelectric cooler (TEC) 490 may be disposed within the second housing 410. The bottom of the TEC 490 is connected to the base plate 411, and the top of the TEC 490 supports the first laser assembly 440, the second laser assembly 450, and the third laser assembly 460.

[0417] The side of TEC 490 includes a first TEC pad 491 and a second TEC pad 492, which are located on the side of second sidewall 413. Pins 430 also include a first TEC pin 4312 and a second TEC pin 4313. The first TEC pin 4312 is electrically connected to the first TEC pad 491, and the second TEC pin 4313 is electrically connected to the second TEC pad 492. Exemplarily, the first TEC pin 4312 and the second TEC pin 4313 are embedded in the third sidewall 414, with their ends extending into the inner cavity of the second housing 410 and insulated from the third sidewall 414 by an insulating layer.

[0418] In some embodiments, a support plate 419 can be disposed within second housing 410 and positioned on top of TEC 490. The bottom of support plate 419 connects to the top of TEC 490, while the top of support plate 419 supports and connects first laser assembly 440, second laser assembly 450, and third laser assembly 460. In some embodiments, support plate 419 is electrically connected to the ground layer on the front surface of third adapter plate 483.

[0419] In some embodiments, a fourth adapter plate 484 may be disposed within the second housing 410. The fourth adapter plate 484 is disposed on the support plate 419 and has a circuit pattern disposed thereon. The fourth adapter plate 484 is used to connect the TEC pads and TEC pins. Exemplarily, the fourth adapter plate 484 includes a fourth substrate 4841 on which a first metal layer 4842 and a second metal layer 4843 are disposed. The first metal layer 4842 and the second metal layer 4843 extend along the length of the fourth substrate 4841. The fourth adapter plate 484 is disposed adjacent to the second sidewall 413 and adjacent to the first laser assembly 440. One end of the first metal layer 4842 is wire-bonded to the first TEC pad 491, and the other end of the first metal layer 4842 is wire-bonded to the first TEC pin 4312. One end of the second metal layer 4843 is wire-bonded to the second TEC pad 492, and the other end of the second metal layer 4843 is wire-bonded to the second TEC pin 4313.

[0420] In some embodiments, a temperature sensor 4836 may be provided on the third adapter board 483. Exemplarily, the temperature sensor 4836 is a thermistor.

[0421] The pin 430 may include an RTH pin 4314, which is embedded in the third side wall 414. One end of the RTH pin 4314 extends into the inner cavity of the second shell 410. The RTH pin 4314 is insulated from the third side wall 414 by an insulating layer; one end of the RTH pin 4314 is electrically connected to the temperature sensor 4836.

[0422] In some embodiments, a transfer pad 4837 may be provided on the third transfer board 483. Transfer pad 4837 is provided on the side of temperature sensor 4836 and is wired to temperature sensor 4836 and RTH pin 4314. Transfer pad 4837 facilitates the connection between temperature sensor 4836 and RTH pin 4314, thereby reducing the risk of heat being transferred to RTH pin 4314 through the wires when temperature sensor 4836 is directly wired to RTH pin 4314, which could result in inaccurate temperature detection within the second cavity by temperature sensor 4836.

[0423] In some embodiments, the inner side of the third sidewall 414 may include a first side surface 4141. The inner side of the third sidewall 414 may include a second side surface 4142. The inner side of the third sidewall 414 may include a first stepped surface 4143. The inner side of the third sidewall 414 may include a second stepped surface 4144. The first side surface 4141 is connected to the first stepped surface 4143, one end of the second stepped surface 4144 is connected to the first side surface 4141, and the other end of the second stepped surface 4144 is connected to the second side surface 4142. The first stepped surface 4143 is closer to the bottom plate 411 than the second stepped surface 4144, that is, the height position of the first stepped surface 4143 in the second shell 410 is lower than the height position of the second stepped surface 4144 in the second shell 410.

[0424] The first stepped surface 4143 supports and connects the first adapter plate 481 and the second adapter plate 482. One end of the first high-frequency pin 4301 and one end of the second high-frequency pin 4305 each pass through the first side surface 4141. One end of the first high-frequency pin 4301 extends above the first adapter plate 481, while one end of the second high-frequency pin 4305 extends to the second adapter plate 482. One end of the RTH pin 4314 passes through the first side surface 4141, while one end of the first SOA pin 4302, one end of the first LD pin 4303, one end of the first TEC pin 4312, and one end of the second TEC pin 4313 each pass through the second side surface 4142. The second ground pin 4308 is located between the first high-frequency pin 4301 and the second high-frequency pin 4305. The first ground pin 4304 is located on the side of the first high-frequency pin 4301 away from the second high-frequency pin 4305.

[0425] In some embodiments, the pins extending through the first side surface 4141 form a first row of pins 430a, and the pins extending through the second side surface 4142 form a second row of pins 430b. That is, the pins disposed on the third side wall 414 are arranged in two rows. The pins in the first row of pins 430a are staggered with the pins in the second row of pins 430b to facilitate pin bonding and adaption to flexible printed circuit boards, while also reducing the risk of air leakage caused by deformation of the insulating layer used to secure the pins.

[0426] In some embodiments, the MPD pin 4311 and the second SOA pin 4306 are located in a row, and the second LD pin 4307 , the third LD pin 4309 , and the fourth LD pin 4310 are located in a row.

[0427] In some embodiments, the sixth connection hole 4121 is a stepped through hole that gradually becomes smaller from one side of the boss 4122 to the inside of the second housing 410. A sealing window 4123 is provided in the sixth connection hole 4121 at the boss 4122 to seal the sixth connection hole 4121.

[0428] FIG40 is a transmission optical path diagram of an optical transmission signal provided according to some embodiments of the present disclosure, and FIG40 shows the transmission optical path of the optical transmission signal. As shown in Figure 40, the fourth wavelength optical signal generated by the first laser assembly 440 is transmitted to the first lens 4181, collimated by the first lens 4181, and then transmitted to the third filter 417. It is transmitted through the third filter 417 to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416; the fifth wavelength optical signal generated by the second laser assembly 450 is transmitted to the second lens 4182, collimated by the second lens 4182, and then transmitted to the third filter 417. It is reflected by the third filter 417 and transmitted to the second filter 416, and then transmitted to the sixth connection hole 4121 through the second filter 416; the sixth wavelength optical signal generated by the third laser assembly 460 is transmitted to the third lens 4183, collimated by the third lens 4183, and then transmitted to the second filter 416. It is reflected by the second filter 416 and transmitted to the sixth connection hole 4121. The second filter 416 and the third filter 417 allow the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal to have a common optical path when outputting from the second housing 410 .

[0429] Figure 41 is a schematic diagram (I) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 42 is a schematic diagram (II) of the structure of a mounting bracket according to some embodiments of the present disclosure. Figure 43 is a diagram of a mounting bracket in use according to some embodiments of the present disclosure. As shown in Figures 41, 42, and 43, in some embodiments, a mounting bracket 470 includes a bracket body 471. A first support 472 and a second support 473 may be provided on the sides of the bracket body 471. The bottom of the bracket body 471 is connected to the support plate 419. One end of the first support 472 is connected to the bracket body 471, and the other end of the first support 472 extends away from the bracket body 471. One end of the second support 473 is connected to the bracket body 471, and the other end of the second support 473 extends away from the bracket body 471. A gap 474 is formed between the first support 472 and the second support 473. The gap 474 is configured to transmit the fourth wavelength optical signal and the sixth wavelength optical signal.

[0430] In some embodiments, a first support surface 4721 may be provided on one side of the first support body 472, a second support surface 4722 may be provided on the other side of the first support body 472, a third support surface 4731 may be provided on one side of the second support body 473, and a fourth support surface 4732 may be provided on the other side of the second support body 473. The first support surface 4721 and the third support surface 4731 are inclined at a first preset angle, while the second support surface 4722 and the fourth support surface 4732 are inclined at a second preset angle. The first support surface 4721 and the third support surface 4731 support and connect the second optical filter 416, while the second support surface 4722 and the fourth support surface 4732 support and connect the third optical filter 417, thereby facilitating the fixing of the second filter 416 and the third filter 417.

[0431] In some embodiments, the bracket body 471 may be provided with a first limiting surface 4711 and a second limiting surface 4712, respectively located on the side edges of the bracket body 471. The first limiting surface 4711 is located at one end of the first support surface 4721, and the second limiting surface 4712 is located at one end of the second support surface 4722. For example, one end of the first limiting surface 4711 and one end of the second limiting surface 4712 extend to the top of the bracket body 471, respectively, while the other ends of the first limiting surface 4711 and the other ends of the second limiting surface 4712 extend to the bottom of the bracket body 471. The first limiting surface 4711 is provided for retaining the second filter 416, while the second limiting surface 4712 is provided for retaining the third filter 417. The first limiting surface 4711 and the second limiting surface 4712 facilitate precise assembly of the second filter 416 and the third filter 417.

[0432] Figure 44 is a structural diagram of another optical transmitting component provided according to some embodiments of the present disclosure. Figure 45 is an assembly diagram of another optical transceiver component and a fiber optic adapter provided according to some embodiments of the present disclosure. As shown in Figures 44 and 45, in some embodiments, the optical transmitting component 400 may include a second cavity. The second cavity may be connected to the optical receiving component 500 so that the transmitted optical signal emitted by the optical transmitting component 400 can be incident on the optical receiving component 500.

[0433] As shown in Figures 44 and 45, in some embodiments, the optical emitting component 400 may include at least one optical emitting assembly. The at least one optical emitting assembly may be connected to the second cavity so that the optical emitting component 400 can emit at least one wavelength optical signal.

[0434] 44 and 45 , in some embodiments, the at least one optical transmission assembly may include a first optical transmission assembly 402. The first optical transmission assembly 402 may transmit an optical signal at a fourth wavelength.

[0435] 44 and 45 , in some embodiments, at least one optical transmission component may include a second optical transmission component 401. The second optical transmission component may transmit an optical signal at a fifth wavelength.

[0436] 44 and 45 , in some embodiments, the at least one optical transmission component may include a third optical transmission component 403. The third optical transmission component 403 may transmit an optical signal at a sixth wavelength.

[0437] The at least one optical transmission assembly includes a first optical transmission assembly 402, a second optical transmission assembly 401 and a third optical transmission assembly 403, so that the optical transmission component 400 can transmit optical signals of three wavelengths with different rates.

[0438] In some embodiments, the first optical transmitter assembly 402, the second optical transmitter assembly 401, and the third optical transmitter assembly 403 can be coaxially packaged. Exemplarily, the emission optical axes of the first optical transmitter assembly 402, the second optical transmitter assembly 401, and the third optical transmitter assembly 403 are parallel to each other. Specifically, the first optical transmitter assembly 402, the second optical transmitter assembly 401, and the third optical transmitter assembly 403 each include a transmitter cap and a transmitter base. The transmitter cap is mounted on the transmitter base to form a transmitter cavity. A laser chip is disposed within the transmitter cavity to transmit optical signals.

[0439] The transmitter socket is also equipped with a transmitter pin, one end of which is connected to the circuit board 300 via the flexible circuit board 900, thereby electrically connecting the transmitter pin and the circuit board 300. The transmitter pin extends upward from the bottom of the transmitter socket until it extends beyond the top of the transmitter socket, where it is wired to the pad where the laser chip is located, thus electrically connecting the transmitter pin and the laser chip. This allows the electrical signal from the circuit board 300 to be transmitted to the laser chip via the transmitter pin.

[0440] In some embodiments, the first light emitting assembly 402, the second light emitting assembly 401, and the third light emitting assembly 403 are respectively located on different sidewalls of the light emitting component 400 to reduce the size of the light emitting component 400. For example, the first light emitting assembly 402 is located on the third sidewall of the light emitting component 400, the second light emitting assembly 401 is located on the second sidewall of the light emitting component 400, and the third light emitting assembly 403 is located on the fourth sidewall of the light emitting component 400.

[0441] Figure 46 is an exploded schematic diagram (I) of another optical emitting component provided according to some embodiments of the present disclosure. Figure 47 is an exploded schematic diagram (II) of another optical emitting component provided according to some embodiments of the present disclosure. As shown in Figures 46 and 47, in some embodiments, the second cavity may include a sixth connection hole 4121. The sixth connection hole 4121 may extend through a side wall of the second cavity near the optical receiving component 500, so that optical signals within the second cavity can be transmitted to the optical receiving component 500 through the sixth connection hole 4121.

[0442] In some embodiments, the second cavity may include a seventh connection hole 4131. The seventh connection hole 4131 may be used to insert one of the at least one optical transmission assembly to connect the at least one optical transmission assembly to the second cavity. For example, the seventh connection hole 4131 may be used to insert the second optical transmission assembly 401 to connect the second optical transmission assembly 401 to the second cavity.

[0443] In some embodiments, the second cavity may include an eighth connection hole 4145. The eighth connection hole 4145 may be used to insert another light emitting assembly in the at least one light emitting assembly to connect the other light emitting assembly in the at least one light emitting assembly to the second cavity. For example, the eighth connection hole 4145 may be used to insert the first light emitting assembly 402 to connect the first light emitting assembly 402 to the second cavity.

[0444] In some embodiments, the second cavity may include a ninth connection hole 4151. Ninth connection hole 4151 may be used to insert another light emitting assembly in the at least one light emitting assembly, thereby connecting the at least one light emitting assembly to the second cavity. For example, ninth connection hole 4151 may be used to insert third light emitting assembly 403, thereby connecting third light emitting assembly 403 to the second cavity.

[0445] The seventh connection hole 4131, the eighth connection hole 4145, and the ninth connection hole 4151 are respectively located on different side walls of the second cavity to reduce the size of the second cavity. For example, the seventh connection hole 4131 is located on the second side wall of the second cavity, the eighth connection hole 4145 is located on the third side wall of the second cavity, and the ninth connection hole 4151 is located on the fourth side wall of the second cavity.

[0446] As shown in FIG. 46 and FIG. 47 , in some embodiments, the second cavity may include a second cover plate 420 .

[0447] As shown in Figures 46 and 47, in some embodiments, the second cavity may include a second housing 410. A second cover plate 420 may be attached to the second housing 410 to form the second cavity. An optical transmitter assembly 404 may be disposed within the second cavity. The optical transmitter assembly 404 may be located in the output optical path of at least one optical transmitter assembly, so that at least one optical signal emitted by the at least one optical transmitter assembly can be transmitted through the optical transmitter assembly 404.

[0448] Figure 48 is an exploded view of a light emitting assembly according to some embodiments of the present disclosure. Figure 49 is a cross-sectional view of a light emitting assembly according to some embodiments of the present disclosure. Figure 50 is a diagram of a light emitting path according to some embodiments of the present disclosure. As shown in Figures 48, 49, and 50, in some embodiments, light emitting assembly 404 may include a first reflective-transmissive sheet 4043.

[0449] The first reflective-transmissive sheet 4043 allows transmission of optical signals of a single wavelength. The first reflective-transmissive sheet 4043 can be located in the output optical path of one of the at least one optical emitting assembly to transmit the optical signal of the single wavelength emitted by the at least one optical emitting assembly. For example, the first reflective-transmissive sheet 4043 can be located in the output optical path of the first optical emitting assembly 402 to transmit the optical signal of a fourth wavelength emitted by the first optical emitting assembly 402 through the first reflective-transmissive sheet 4043.

[0450] The first reflective-transmissive sheet 4043 can allow reflection of optical signals of another wavelength. The first reflective-transmissive sheet 4043 can be located in the output optical path of another optical transmitting assembly in the at least one optical transmitting assembly to reflect the optical signal of the other wavelength emitted by the other optical transmitting assembly in the at least one optical transmitting assembly. For example, the first reflective-transmissive sheet 4043 can be located in the output optical path of the second optical transmitting assembly 401 to reflect the optical signal of the fifth wavelength emitted by the second optical transmitting assembly 401 through the first reflective-transmissive sheet 4043.

[0451] As shown in FIG. 48 , FIG. 49 and FIG. 50 , in some embodiments, the emitting light assembly 404 may include a second reflective-transmissive sheet 4042 .

[0452] The second reflective-transmissive plate 4042 allows optical signals of one wavelength to pass through. The second reflective-transmissive plate 4042 can be located on the transmission light path of the first reflective-transmissive plate 4043 so that the optical signals of one wavelength that have passed through the first reflective-transmissive plate 4043 can be transmitted out through the first reflective-transmissive plate 4043.

[0453] The second reflective-transmissive plate 4042 allows light signals of another wavelength to pass through. The second reflective-transmissive plate 4042 can be located on the reflection light path of the first reflective-transmissive plate 4043 so that the light signals of another wavelength reflected by the first reflective-transmissive plate 4043 can be transmitted through the second reflective-transmissive plate 4042 .

[0454] The second reflective-transmissive sheet 4042 can allow reflection of an optical signal of a further wavelength. The second reflective-transmissive sheet 4042 can be located in the output optical path of another optical transmitting assembly among the at least one optical transmitting assembly, so that the optical signal of the further wavelength emitted by the further optical transmitting assembly among the at least one optical transmitting assembly is reflected off the second reflective-transmissive sheet 4042. For example, the second reflective-transmissive sheet 4042 can be located in the output optical path of the third optical transmitting assembly 403, so that the optical signal of the sixth wavelength emitted by the third optical transmitting assembly 403 is reflected off the second reflective-transmissive sheet 4042.

[0455] Taking the example of the first reflective-transmissive sheet 4043 transmitting the fourth wavelength optical signal emitted by the first optical emitting assembly 402 and reflecting the fifth wavelength optical signal emitted by the second optical emitting assembly 401, and the second reflective-transmissive sheet 4042 reflecting the sixth wavelength optical signal emitted by the third optical emitting assembly, the optical path of the optical emitting component 400 is described. As shown in Figure 50, the optical path is as follows:

[0456] The fourth wavelength optical signal is emitted through the first optical transmission component 402, and is transmitted through the first reflective-transmissive plate 4043 and the second reflective-transmissive plate 4042 before being emitted. The fifth wavelength optical signal is emitted through the second optical transmission component 401, and is reflected by the first reflective-transmissive plate 4043, and is transmitted through the second reflective-transmissive plate 4042 before being emitted. The sixth wavelength optical signal is emitted through the third optical transmission component 403, and is reflected through the second reflective-transmissive plate 4042 before being emitted.

[0457] The coupling margin of the fourth wavelength optical signal is smaller than that of the fifth wavelength optical signal and the sixth wavelength optical signal. The fourth wavelength optical signal emitted by the first optical transmitting assembly 402 is sequentially transmitted through the first reflective and transmissive plate 4043 and the second reflective and transmissive plate 4042 before being emitted to improve coupling efficiency.

[0458] 47 and 50 , in some embodiments, the second housing 410 may include a bottom plate 411. The bottom plate 411 may be used to support the device.

[0459] As shown in Figures 47 and 50, in some embodiments, the second housing 410 may include a first sidewall 412. The bottom of the first sidewall 412 may be connected to the bottom plate 411. The first sidewall 412 may be connected to the light receiving component 500. The first sidewall 412 may have a sixth connection hole 4121. The sixth connection hole 4121 may pass through the first sidewall 412. The sixth connection hole 4121 may communicate with the inner cavity of the second cavity, thereby allowing the transmission light signal emitted by the light emitting component 400 to be transmitted to the light receiving component 500 through the sixth connection hole 4121.

[0460] As shown in Figures 47 and 50, in some embodiments, the second housing 410 may include a second sidewall 413. The bottom of the second sidewall 413 may be connected to the base plate 411. One end of the second sidewall 413 may be connected to one end of the first sidewall 412. The second sidewall 413 may have a seventh connection hole 4131. The seventh connection hole 4131 may extend through the second sidewall 413. The seventh connection hole 4131 may communicate with the inner cavity of the second cavity, so that the optical signal emitted by the optical transmission component placed in the seventh connection hole 4131 can be incident on the inner cavity of the second cavity. For example, the optical signal of the fifth wavelength emitted by the second optical transmission component 401 is incident on the inner cavity of the second cavity.

[0461] In some embodiments, the seventh connection hole 4131 may face one side of the first reflective-transmissive sheet 4043 , so that the fifth wavelength optical signal emitted by the second optical transmission assembly 401 placed in the seventh connection hole 4131 may be reflected by the first reflective-transmissive sheet 4043 .

[0462] As shown in Figures 47 and 50, in some embodiments, the second housing 410 may include a third sidewall 414. The bottom of the third sidewall 414 may be connected to the base plate. One end of the third sidewall 414 may be connected to the other end of the second sidewall 413. The third sidewall 414 is disposed opposite the first sidewall 412. The third sidewall 414 may have an eighth connection hole 4145. The eighth connection hole 4145 may extend through the third sidewall 414. The eighth connection hole 4145 may communicate with the inner cavity of the second cavity, so that the optical signal emitted by the optical transmission component placed in the eighth connection hole 4145 can be incident on the inner cavity of the second cavity. For example, the fourth wavelength optical signal emitted by the first optical transmission component is incident on the inner cavity of the second cavity.

[0463] In some embodiments, the eighth connection hole 4145 may face the other side of the first reflective-transmissive plate 4043 , so that the fourth wavelength optical signal emitted by the first optical transmission assembly 402 placed in the eighth connection hole 4145 may be incident on the first reflective-transmissive plate 4043 .

[0464] In some embodiments, one surface of the first reflective-transmissive sheet 4043 is disposed opposite to the other surface of the first reflective-transmissive sheet 4043 , so that the fourth wavelength optical signal incident on the first reflective-transmissive sheet 4043 can be transmitted out.

[0465] As shown in Figures 47 and 50, in some embodiments, the second housing 410 may include a fourth sidewall 415. The bottom of the fourth sidewall 415 may be connected to the base plate. One end of the fourth sidewall 415 may be connected to the other end of the third sidewall 414. The other end of the fourth sidewall 415 may be connected to the other end of the first sidewall 412. The fourth sidewall 415 may be disposed opposite the second sidewall 413. The fourth sidewall 415 may have a ninth connection hole 4151. The ninth connection hole 4151 may extend through the fourth sidewall 415. The ninth connection hole 4151 may communicate with the inner cavity of the second cavity, so that the optical signal emitted by the optical transmission assembly placed in the ninth connection hole 4151 can be incident on the inner cavity of the second cavity. For example, the optical signal of the sixth wavelength emitted by the third optical transmission assembly 403 is incident on the inner cavity of the second cavity.

[0466] In some embodiments, the ninth connection hole 4151 may face one side of the second reflective-transmissive sheet 4042 , so that the sixth wavelength optical signal emitted by the third optical transmission assembly 403 placed in the ninth connection hole 4151 may be reflected by the second reflective-transmissive sheet 4042 .

[0467] In some embodiments, the first reflective-transmissive plate 4043 may face the other side of the second reflective-transmissive plate 4042 so that the fifth wavelength optical signal reflected by the first reflective-transmissive plate 4043 and the fourth wavelength optical signal transmitted by the first reflective-transmissive plate 4043 may be incident on the second reflective-transmissive plate 4042 .

[0468] In some embodiments, one surface of the second reflective-transmissive sheet 4042 is disposed opposite to the other surface of the second reflective-transmissive sheet 4042 , so that the fourth wavelength optical signal and the fifth wavelength optical signal incident on the second reflective-transmissive sheet 4042 can be transmitted out.

[0469] The first side wall 412 , the second side wall 413 , the third side wall 414 and the fourth side wall 415 are sequentially connected and respectively connected to the bottom plate 411 to form a second housing 410 having an opening. The opening of the second housing 410 may face the lower housing 202 .

[0470] As shown in Figures 47, 49, and 50, in some embodiments, the vertical distance between the second end of the first reflective-transmissive sheet 4043 and the second sidewall 413 is smaller than the vertical distance between the first end of the first reflective-transmissive sheet 4043 and the second sidewall 413, so that the first reflective-transmissive sheet 4043 and the second sidewall 413 are arranged at an angle, thereby allowing the second wavelength emitted by the second light emitting assembly 401 located on the second sidewall 413 to be reflected by the first reflective-transmissive sheet 4043. The end of the first reflective-transmissive sheet 4043 away from the first light emitting assembly 402 is the first end of the first reflective-transmissive sheet 4043, and the end of the first reflective-transmissive sheet 4043 close to the first light emitting assembly 402 is the second end of the first reflective-transmissive sheet 4043.

[0471] In some embodiments, the inclination angle between the first reflective-transmissive sheet 4043 and the second sidewall 413 is 45°, so that the second wavelength emitted by the second light emitting assembly 401 can be reflected by the first reflective-transmissive sheet 4043 and then emitted along the length direction of the second housing 410 .

[0472] As shown in Figures 47, 49, and 50, in some embodiments, the vertical distance between the second end of the second reflective-transmissive sheet 4042 and the fourth sidewall 415 is smaller than the vertical distance between the first end of the second reflective-transmissive sheet 4042 and the fourth sidewall 415, so that the second reflective-transmissive sheet 4042 and the fourth sidewall 415 are arranged at an angle, thereby allowing the third wavelength emitted by the third light emitting assembly 403 located on the fourth sidewall 415 to be reflected by the second reflective-transmissive sheet 4042. The end of the second reflective-transmissive sheet 4042 away from the first light emitting assembly 402 is the first end of the second reflective-transmissive sheet 4042, and the end of the second reflective-transmissive sheet 4042 close to the first light emitting assembly 402 is the second end of the second reflective-transmissive sheet 4042.

[0473] In some embodiments, the inclination angle between the second reflective-transmissive sheet 4042 and the fourth sidewall 415 is 45°, so that the third wavelength emitted by the third light emitting assembly 403 can be reflected by the second reflective-transmissive sheet 4042 and then emitted along the length direction of the second housing 410 .

[0474] The second reflective transmissive sheet 4042 and the fourth side wall 415 have an inclination angle of 45°, and the first reflective transmissive sheet 4043 and the second side wall 413 have an inclination angle of 45°, so that the angle between the first reflective transmissive sheet 4043 and the second reflective transmissive sheet 4042 is a right angle, i.e., 90°.

[0475] As shown in Figures 48, 49, and 50, in some embodiments, the optical transmission component 404 may include a fixing member 4041. The fixing member 4041 may include a first connection surface 40414. The first connection surface 40414 may be disposed adjacent to the second sidewall 413. The first connection surface 40414 may be disposed parallel to the second sidewall 413 so that the fifth wavelength optical signal emitted by the second optical transmission component 401 is perpendicularly incident on the first connection surface 40414.

[0476] In some embodiments, the first connecting surface 40414 may have a second light-through hole 40413 , so that the fifth wavelength optical signal incident on the fixing member 4041 can be transmitted through the second light-through hole 40413 .

[0477] As shown in Figures 48, 49, and 50, in some embodiments, the fixing member 4041 may include a second connecting surface 40415. One end of the second connecting surface 40415 may be connected to one end of the first connecting surface 40414. The second connecting surface 40415 may be connected to the first reflective-transmissive sheet 4043. The second connecting surface 40415 may be arranged at an angle relative to the second sidewall 413, so that the first reflective-transmissive sheet 4043 is arranged at an angle relative to the second sidewall 413.

[0478] In some embodiments, the second connection surface 40415 may have a third light hole 40411 , so that the fourth wavelength optical signal transmitted through the first reflective-transmissive sheet 4043 is incident on the fixing member 4041 and then transmitted along the third light hole 40411 .

[0479] In some embodiments, the third light hole 40411 can be connected to the second light hole 40413, so that the fifth wavelength optical signal passes through the second light hole 40413 and the third light hole 40411 in sequence and is incident on the first reflective transmissive plate 4043 and reflected by the first reflective transmissive plate 4043.

[0480] As shown in Figures 48, 49, and 50, in some embodiments, the fixing member 4041 may include a third connecting surface 40416. One end of the third connecting surface 40416 may be connected to the other end of the second connecting surface 40415. The other end of the third connecting surface 40416 may be connected to the other end of the first connecting surface 40414. The third connecting surface 40416 may be connected to the second reflective-transmissive sheet 4042. The third connecting surface 40416 may be arranged at an angle relative to the fourth sidewall 415, so that the second reflective-transmissive sheet 4042 is arranged at an angle relative to the fourth sidewall 415.

[0481] In some embodiments, the second connecting surface 40415 may have a fourth light hole 40412, and the fourth light hole 40412 may be connected to the second light hole 40413 and the third light hole 40411, so that the fifth wavelength optical signal and the fourth wavelength optical signal transmitted through the third light hole 40411 can be transmitted out through the fourth light hole 40412.

[0482] In addition to the structure of the optical receiving component disclosed in the above embodiments, the embodiments of the present disclosure also provide an optical receiving component, which may include multiple optical receiving components, for example, a first optical receiving component, a second optical receiving component and a third optical receiving component, and the above multiple optical receiving components may be located on the same side of the optical receiving component. The specific setting method can be understood by referring to the following examples.

[0483] Figure 51 is an exploded view of an optical transceiver component and a circuit board according to some embodiments of the present disclosure. As shown in Figure 51 , in some embodiments, the circuit board 300 includes a first circuit board 301 and a second circuit board 302 , wherein the first circuit board 301 is a rigid circuit board and the second circuit board 302 is a flexible circuit board. The optical emitting component 400 and the optical receiving component 500 are both electrically connected to the first circuit board 301 via the second circuit board 302 .

[0484] One end of the optical receiving component 500 is connected to the optical fiber adapter 700, and the other end of the optical receiving component 500 is connected to the optical transmitting component 400. The optical signal generated by the optical transmitting component 400 is first transmitted to the optical receiving component 500, then transmitted to the optical fiber adapter 700 through the optical receiving component 500, and finally output through the optical fiber adapter 700. The external input optical signal is input to the optical receiving component 500 through the optical fiber adapter 700, so that the optical receiving component 500 and the optical transmitting component 400 share the optical fiber adapter 700. In addition, the uplink optical signal and the downlink optical signal of the optical module share the optical fiber 101.

[0485] In some embodiments, the optical transmitting component 400 can generate optical signals of multiple wavelengths, and the optical signals of multiple wavelengths can be combined into a single optical signal. The optical receiving component 500 can receive optical signals including multiple wavelengths. For example, the optical transmitting component 400 generates optical signals of three wavelengths, and the optical receiving component 500 receives optical signals of three wavelengths.

[0486] Figure 52 is an exploded view of an optical transceiver assembly according to some embodiments of the present disclosure. As shown in Figure 52, the optical receiving assembly 500 includes a transceiver cavity 510 and multiple optical receiving assemblies, each of which is connected to the transceiver cavity 510. For example, the multiple optical receiving assemblies include a first optical receiving assembly 520, a second optical receiving assembly 530, and a third optical receiving assembly 540.

[0487] In some embodiments, the optical emitting component 400 utilizes a micro-optical package, and the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 utilize a coaxial package. Exemplarily, the receiving optical axes of the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 are parallel to each other. That is, the first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a receiving tube cap and a receiving tube socket. The receiving tube cap is mounted on the receiving tube socket to form a receiving cavity. A light receiving chip is disposed within the receiving cavity. The light receiving chip receives optical signals and converts them into electrical signals.

[0488] The receiver socket is also provided with a receiver pin, one end of which is connected to the first circuit board 301 via the second circuit board 302, thereby electrically connecting the receiver pin and the first circuit board 301. The receiver pin extends upward from the bottom of the receiver socket until it extends beyond the top of the receiver socket, where it is wired to the pad where the optical receiver chip is located, thereby electrically connecting the receiver pin and the optical receiver chip, thereby transmitting the electrical signal to the first circuit board 301 through the receiver pin.

[0489] In some embodiments, the optical module 200 is configured to receive a beam of optical signals including three wavelength ranges and to transmit a beam of optical signals including three wavelength ranges. For example, the optical transmitting component 400 is configured to output a beam of optical signals including a first wavelength, a second wavelength, and a third wavelength, the first optical receiving component 520 is configured to receive an optical signal at a fourth wavelength, the second optical receiving component 530 is configured to receive an optical signal at a fifth wavelength, and the third optical receiving component 540 is configured to receive an optical signal at a sixth wavelength.

[0490] In some embodiments, the first side of the transceiver cavity 510 is connected to the fiber optic adapter 700, the second side of the transceiver cavity 510 is provided with the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540, and the third side of the transceiver cavity 510 is provided with the light emitting component 400. For example, the first side of the transceiver cavity 510 is adjacent to the optical port of the optical module, the second side of the transceiver cavity 510 is adjacent to the lower side plate 2022 of the lower housing 202, and the third side of the transceiver cavity 510 is adjacent to the electrical port of the optical module.

[0491] In some embodiments, a first connection hole is provided on the first side of the transceiver cavity 510, a second connection hole is provided on the second side of the transceiver cavity 510, a third connection hole is provided on the fourth side of the transceiver cavity 510, and a fifth connection hole is provided on the third side of the transceiver cavity 510. The first connection hole, the second connection hole, the third connection hole, the fourth connection hole, and the fifth connection hole are respectively connected to the inner cavity of the transceiver cavity 510. The other end of the fiber optic adapter 700 is connected to the first connection hole; the first light receiving assembly 520 is connected to the second connection hole, the second light receiving assembly 530 is connected to the third connection hole, the third light receiving assembly 540 is connected to the fourth connection hole, and the light emitting component 400 is connected to the fifth connection hole. For example, the second connection hole, the third connection hole, and the fourth connection hole are arranged in sequence on the second side of the transceiver cavity 510.

[0492] Figure 53 is a structural diagram of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. Figure 54 is an exploded view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. Figure 55 is a cross-sectional view of a fiber optic adapter and a transceiver cavity according to some embodiments of the present disclosure. As shown in Figures 53, 54, and 55, in some embodiments, a fiber optic adapter 700 is disposed on a first side of a transceiver cavity 510. One end of the fiber optic adapter 700 is used to connect to an optical fiber, and the other end of the fiber optic adapter 700 communicates with the transceiver cavity 510, enabling optical connection of the transceiver cavity 510 to the optical fiber through the fiber optic adapter 700. For example, a first connection hole 5111 is disposed on one side of the transceiver cavity 510, and a connecting sleeve 710 is disposed on the other end of the fiber optic adapter 700. One end of the connecting sleeve 710 is embedded with the fiber optic adapter 700, and the other end of the connecting sleeve 710 connects to the transceiver cavity 510, connecting the fiber optic adapter 700 to the first connection hole 5111. The connecting sleeve 710 facilitates connection of the fiber optic adapter 700 to the transceiver cavity 510. Exemplarily, the other end of the optical fiber adapter 700 is embedded in the connecting sleeve 710 , and the end of the optical fiber ferrule in the optical fiber adapter 700 is located in the connecting sleeve 710 .

[0493] In some embodiments, the first connection hole 5111 extends from the inside of the transceiver cavity 510 to the outside of the transceiver cavity 510, that is, the first connection hole 5111 is a through hole that passes through the first side panel of the transceiver cavity 510, so as to facilitate the transmission of optical signals back and forth between the transceiver cavity 510 and the optical fiber adapter 700 outside the transceiver cavity 510.

[0494] In some embodiments, a fourth lens 5174 is disposed within the first connection hole 5111. The fourth lens 5174 is used to collimate / converge optical signals. For example, optical signals transmitted from the transceiver cavity 510 to the fiber optic adapter 700 are converged by the fourth lens 5174, while optical signals transmitted from the fiber optic adapter 700 to the transceiver cavity 510 are collimated by the fourth lens 5174. The fourth lens 5174 disposed within the first connection hole 5111 saves space within the transceiver cavity 510 that would otherwise be occupied by the fourth lens 5174, helping to reduce the size of the optical receiving component 500 and facilitating assembly of the optical receiving component 500 within the optical module.

[0495] In some embodiments, a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123 are provided on the second side of the transceiver cavity 510. The top of the first light receiving assembly 520 is embedded in the second connection hole 5121, the top of the second light receiving assembly 530 is embedded in the third connection hole 5122, and the top of the third light receiving assembly 540 is embedded in the fourth connection hole 5123. The separation of the second connection hole 5121, the third connection hole 5122, and the fourth connection hole 5123 allows the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540 to be isolated from each other, effectively reducing high-frequency crosstalk, thermal crosstalk, etc. between the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540. For example, corresponding connection holes are embedded in the receiving tube caps of the first light receiving assembly 520, the second light receiving assembly 530, and the third light receiving assembly 540.

[0496] In some embodiments, a fifth connection hole 5131 is provided on the third side of the transceiver cavity 510, one end of the fifth connection hole 5131 is connected to the inner cavity of the transceiver cavity 510, the other end of the fifth connection hole 5131 is connected to one end of the connecting portion 5132, the other end of the connecting portion 5132 is connected to the light emitting component 400, and a fourth through hole 51321 is provided inside the connecting portion 5132, the fourth through hole 51321 is connected to the fifth connection hole 5131, so that the optical signal emitted by the light emitting component 400 can be incident on the interior of the transceiver cavity 510.

[0497] Figure 56 is an exploded view of a transceiver cavity according to some embodiments of the present disclosure. Figure 57 is a structural diagram of a transceiver housing according to some embodiments of the present disclosure. As shown in Figures 56 and 57, in some embodiments, transceiver cavity 510 includes a transceiver cover 515 and a transceiver housing. The transceiver cover 515 covers the transceiver housing to form transceiver cavity 510. A second optical assembly 517 is disposed within transceiver cavity 510 to transmit optical signals to fiber optic adapter 700 and receive optical signals transmitted by fiber optic adapter 700.

[0498] In some embodiments, the transceiver housing is recessed inward to form an accommodating cavity 516 , and the second optical component 517 is disposed in the accommodating cavity 516 to accommodate the second optical component 517 .

[0499] In some embodiments, the transceiver housing has an opening. For example, the transceiver housing includes a first transceiver side panel 511, a second transceiver side panel 512, a third transceiver side panel 513, and a fourth transceiver side panel 514. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are connected end to end in sequence. The first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are located at the edge of the accommodating cavity 516. The first transceiver side panel 511 is located on a first side of the transceiver housing, the second transceiver side panel 512 is located on a second side of the transceiver housing, the third transceiver side panel 513 is located on a third side of the transceiver housing, and the fourth transceiver side panel 514 is located on a fourth side of the transceiver housing. The fourth side of the transceiver housing is adjacent to the lower side panel 2022 of the lower housing 202 and is located on a different side of the transceiver housing than the second side of the transceiver housing. The first transceiver side panel 511 is provided with a first connection hole 5111, the second transceiver side panel 512 is provided with a second connection hole 5121, a third connection hole 5122, and a fourth connection hole 5123, and the third transceiver side panel 513 is provided with a fifth connection hole 5131. Exemplarily, the first transceiver side panel 511, the second transceiver side panel 512, the third transceiver side panel 513, and the fourth transceiver side panel 514 are integrally formed.

[0500] In some embodiments, the third transceiver side panel 513 includes a first sub-transceiver side panel 5133 and a second sub-transceiver side panel 5134, one end of the first sub-transceiver side panel 5133 is connected to the second transceiver side panel 512, the other end of the first sub-transceiver side panel 5133 is connected to one end of the second sub-transceiver side panel 5134, and the other end of the second sub-transceiver side panel 5134 is connected to the fourth transceiver side panel 514, so that the third transceiver side panel 513 has an avoidance notch to avoid the light emitting component 400.

[0501] In some embodiments, the second sub-transceiver side panel 5134 is provided with an avoidance gap 5135, which is formed by the inner wall of the second sub-transceiver side panel 5134 being recessed toward the outer wall of the second sub-transceiver side panel 5134, and the side wall of the avoidance gap 5135 includes one end of the fifth connection hole 5131.

[0502] In some embodiments, the accommodating cavity 516 includes a first accommodating cavity, a second accommodating cavity 5165 and a third accommodating cavity 5166, and the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are interconnected so that the optical signal can be transmitted from the first accommodating cavity to the second accommodating cavity 5165 and from the first accommodating cavity to the third accommodating cavity 5166.

[0503] In some embodiments, the first transceiver side panel 511 and the second transceiver side panel 512 form a second accommodating cavity 5165 , and the first sub-transceiver side panel 5133 and the second transceiver side panel 512 form a third accommodating cavity 5166 .

[0504] In some embodiments, the first accommodating cavity includes an accommodating cavity body 5163, a storage piece 5169, a second storage groove 5162 and a third storage groove 5164, the first connecting hole 5111 is located on the first side of the accommodating cavity body 5163, the third storage groove 5164 is located on the second side of the accommodating cavity body 5163, the storage piece 5169 is located on the third side of the accommodating cavity body 5163, the second storage groove 5162 is located on the fourth side of the accommodating cavity body 5163, the second storage groove 5162 and the third storage groove 5164 are more recessed relative to the accommodating cavity body 5163, and the storage piece 5169 is more protruding relative to the accommodating cavity body 5163.

[0505] The third storage groove 5164 is communicated with the accommodating cavity body 5163, the second accommodating cavity 5165 and the third accommodating cavity 5166 respectively, so that the first accommodating cavity, the second accommodating cavity 5165 and the third accommodating cavity 5166 are communicated with each other.

[0506] In some embodiments, the first end of the placement piece 5169 is connected to the accommodating cavity body 5163, and the second end of the placement piece 5169 is connected to the inner side wall of the second sub-transceiver side panel 5134 of the third transceiver side panel 513. The placement piece 5169 is more recessed relative to the second sub-transceiver side panel 5134 to facilitate the mounting of optical components.

[0507] In some embodiments, a first storage groove 5161 is provided on the storage member 5169. The first storage groove 5161 is located between the accommodating cavity body 5163 and the avoidance gap 5135. The first storage groove 5161 is recessed relative to the storage member 5169 to facilitate the placement of optical components.

[0508] In some embodiments, the first storage slot 5161 is located between the accommodating cavity body 5163 and the second sub-transceiver side plate 5134 of the third transceiver side plate 513, the first port of the first storage slot 5161 is connected to the fifth connecting hole 5131, and the second port of the first storage slot 5161 is located at the notch of the first support surface 5167, so that the second port of the first storage slot 5161 is connected to the accommodating cavity body 5163, so that the optical signal incident through the fifth connecting hole 5131 can be transmitted along the first storage slot 5161 to the accommodating cavity body 5163.

[0509] In some embodiments, the central axes of the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other, that is, the first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not coincide with each other on the Y axis.

[0510] In some embodiments, the accommodating cavity body 5163 includes a first sidewall and a second sidewall. The first sidewall of the accommodating cavity body 5163 is disposed opposite the second sidewall of the accommodating cavity body 5163. The second sidewall of the accommodating cavity body 5163 is connected to the first end of the storage member 5169. The second sidewall of the accommodating cavity body 5163 includes a first support surface 5167. The first support surface 5167 is the connection surface between the first storage slot 5161 and the accommodating cavity body 5163. The first support surface 5167 is used to support a portion of the second optical assembly. For example, the first support surface 5167 is an inclined surface, sloping from one end to the other end along the inner sidewall of the third transceiver side plate 513. That is, the central axis of the fifth connection hole 5131 is not perpendicular to the first support surface 5167.

[0511] In some embodiments, the second side wall of the accommodating cavity body 5163 also includes a second supporting surface 5168, which is used to support part of the second optical component. The first supporting surface 5167 and the second supporting surface 5168 are connected, and the first supporting surface 5167 and the second supporting surface 5168 are arranged non-parallel to each other, so that the second supporting surface 5168 is arranged parallel to the inner wall of the second sub-transceiver side panel 5134.

[0512] FIG58 is an optical path diagram of a second optical assembly according to some embodiments of the present disclosure. As shown in FIG58 , in some embodiments, the second optical assembly 517 includes a first displacement prism 5171, a first optical filter 5172, a second displacement prism 5173, a fourth lens 5174, a first reflector 5175, a wave splitter 5176, a second optical filter 5177, a third displacement prism 5178, and a fourth displacement prism 5179. The fourth lens 5174 is located in the first connecting hole 5111, and the first displacement prism 5171, the first optical filter 5172, the second displacement prism 5173, the first reflector 5175, the wave splitter 5176, the second optical filter 5177, the third displacement prism 5178, and the fourth displacement prism 5179 are located in the accommodating cavity 516.

[0513] The first port of the first storage slot 5161 and the second port of the first storage slot 5161 do not overlap on the Y-axis. To adjust the position of the optical signal on the Y-axis so that the optical signal propagates from the first port of the first storage slot 5161 to the second port of the first storage slot 5161, in some embodiments, a first displacement prism 5171 is disposed within the first storage slot 5161. The optical signal enters the first displacement prism 5171 through the incident surface of the first displacement prism 5171. The optical signal is reflected from the first reflection surface of the first displacement prism 5171 to the second reflection surface of the first displacement prism 5171. The optical signal is then reflected from the second reflection surface of the first displacement prism 5171 to the exit surface of the first displacement prism 5171, and then exits through the exit surface of the first displacement prism 5171.

[0514] In some embodiments, a first optical filter 5172 is disposed on the first supporting surface 5167, covering the second port of the first storage slot 5161. The signal light output by the light emitting component 400 is transmitted to the first optical filter 5172. The first optical filter 5172 is configured to transmit the optical signal output by the light emitting component 400 and transmit it to the second displacement prism 5173. The first optical filter 5172 is also configured to reflect the optical signal output from the second displacement prism 5173 to the first reflector 5175. Exemplarily, the first surface of the first optical filter 5172 faces the second displacement prism 5173, and the second surface of the first filter 5172 rests on the first supporting surface 5167.

[0515] In some embodiments, the second displacement prism 5173 is used to adjust the position of the optical signal in the Y direction of the transceiver housing to accommodate the optical module's requirements for the assembly position of the fiber optic adapter 700 and to provide sufficient space for the installation of the first reflector 5175 and the first filter 5172. The optical signal enters the second displacement prism 5173 through its incident surface. The optical signal is reflected from its first reflective surface to its second reflective surface. The optical signal is then reflected from its second reflective surface to its exit surface, where it is emitted.

[0516] For transmitted optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174. For received optical signals, the incident surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the fourth lens 5174, and the exit surface of the second displacement prism 5173 refers to the side of the second displacement prism 5173 facing the first optical filter 5172.

[0517] In some embodiments, the second displacement prism 5173 is located at the edge of the first connection hole 5111, so that the optical signal passing through the first connection hole 5111 is transmitted to the second displacement prism 5173, and the optical signal output by the second displacement prism 5173 is transmitted to the first connection hole 5111. Exemplarily, the first side surface of the second displacement prism 5173 abuts against the first side wall of the accommodating cavity body 5163 (i.e., the inner side wall of the first transceiver side plate 511), or the first side surface of the second displacement prism 5173 is sealedly connected to the first connection hole 5111.

[0518] In some embodiments, the first side surface of the second displacement prism 5173 is perpendicular or approximately perpendicular to the central axis of the first connecting hole 5111, so that the optical signal incident on the first side surface of the second displacement prism 5173 through the first connecting hole 5111 is transmitted perpendicularly or approximately perpendicularly to the first side surface of the second displacement prism 5173, and the optical signal output from the first side surface of the second displacement prism 5173 can be transmitted to the first connecting hole 5111 along the central axis of the first connecting hole 5111.

[0519] In some embodiments, a first reflector 5175 is disposed within the second storage slot 5162 and is configured to reflect the optical signal reflected by the first filter 5172 to the wave splitter 5176. To facilitate the first reflector 5175 reflecting the optical signal to the wave splitter 5176, the first reflector 5175 is disposed at an angle within the first accommodating cavity, that is, the reflective surface of the first reflector 5175 is non-parallel to the second side surface of the second displacement prism 5173 and the angle between the two is less than 90°.

[0520] In some embodiments, a side wall of the second storage slot 5162 is the inner side wall of the fourth transceiver side panel 514. A first support member 5141 is attached to the inner side wall of the fourth transceiver side panel 514. The first side wall of the first support member 5141 is attached parallel to the inner side wall of the fourth transceiver side panel 514. The second side wall of the first support member 5141 is perpendicular to the first side wall of the first support member 5141. The third side wall of the first support member 5141 is connected to the first side wall and the second side wall of the first support member 5141 at both ends, respectively. The third side wall of the first support member 5141 is an inclined surface, i.e., one end of the third side wall of the first support member 5141 is closer to the first side wall of the first support member 5141 than the other end of the third side wall of the first support member 5141. For example, a first reflector 5175 is attached to the third side wall of the first support member 5141.

[0521] In some embodiments, the side of the splitter 5176 rests on the second support surface 5168 , and the side of the splitter 5176 contacts the positioning notch 51681 , and the positioning notch 51681 facilitates the positioning and assembly of the splitter 5176 .

[0522] In some embodiments, a wave splitter 5176 is disposed at the bottom of the housing cavity body 5163, with the light incident side of the wave splitter 5176 facing the first reflector 5175 and the light splitting output side of the wave splitter 5176 facing the second transceiver side panel 512. The wave splitter 5176 is configured to split the optical signal reflected by the first reflector 5175 according to wavelength. Exemplarily, the wave splitter 5176 splits a beam of optical signals including a fourth wavelength, a fifth wavelength, and a sixth wavelength into three beams according to wavelength.

[0523] In some embodiments, a third displacement prism 5178 is disposed in the second accommodating cavity 5165, and the first wavelength optical signal output by the wave splitter 5176 is transmitted to the third displacement prism 5178. A fourth displacement prism 5179 is disposed in the third accommodating cavity 5166, and the third wavelength optical signal output by the wave splitter 5176 is transmitted to the fourth displacement prism 5179. The third displacement prism 5178 and the fourth displacement prism 5179 are used to adjust the position of the optical signal in the X direction of the transceiver housing, so that the optical signal split by the wave splitter 5176 can be transmitted to the corresponding first optical receiving assembly 520, second optical receiving assembly 530, and third optical receiving assembly 540.

[0524] In some embodiments, multiple second filters are disposed within the second and third accommodating cavities 5165 and 5166, such as a second filter disposed at the output end of the third displacement prism 5178 and a second filter disposed at the output end of the fourth displacement prism 5179. The second filters are used to filter the optical signal before it enters the corresponding optical receiving component, reducing noise in the corresponding wavelength optical signal and ensuring the quality of optical signal reception. For example, a second filter 5177 is disposed within the third storage slot 5164 and is located at the end of the third connecting hole 5122. The second filter 5177 is located at the light input front end of the second optical receiving assembly 530. The second filter 5177 is used to filter out noise in the optical signal about to enter the second optical receiving assembly 530, thereby improving the quality of the light entering the second optical receiving assembly 530.

[0525] As shown in Figure 58, the emission light signal output by the light emitting component 400 is first adjusted in position in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172, then incident on the second displacement prism 5173 through the first filter 5172, and then adjusted in position in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174, and finally converged by the fourth lens 5174.

[0526] A beam of received optical signals including the fourth wavelength, the fifth wavelength and the sixth wavelength is first collimated by the fourth lens 5174 and then transmitted to the second displacement prism 5173. Then, the position in the Y direction is adjusted by the second displacement prism 5173 and then incident on the first filter 5172. Then, the received optical signals are reflected by the first filter 5172 again and transmitted to the first reflector 5175. Then, the received optical signals are reflected by the first reflector 5175 and transmitted to the wavelength splitter 5176. Finally, the received optical signals are split into the first wavelength optical signal, the second wavelength optical signal and the third wavelength optical signal according to the wavelength of the optical signals by the wavelength splitter 5176.

[0527] The light signal is reflected by the first reflection surface of the second displacement prism 5173 to the second reflection surface of the second displacement prism 5173 , and then reflected by the second reflection surface of the second displacement prism 5173 to the exit surface of the second displacement prism 5173 , and then emitted through the exit surface of the second displacement prism 5173 .

[0528] The first wavelength optical signal is transmitted to the incident surface of the third displacement prism 5178. The optical signal passes through the incident surface of the third displacement prism 5178 and is incident on the first reflection surface of the third displacement prism 5178. The optical signal is reflected from the first reflection surface of the third displacement prism 5178 to the second reflection surface of the third displacement prism 5178. The optical signal is reflected from the second reflection surface of the third displacement prism 5178 to the exit surface of the third displacement prism 5178. The optical signal is emitted from the exit surface of the third displacement prism 5178 to the first light receiving component 520. The second wavelength optical signal passes through the second filter 5177 and is transmitted to the second light receiving component 530. The third wavelength optical signal is transmitted to the incident surface of the fourth displacement prism 5179. The optical signal passes through the incident surface of the fourth displacement prism 5179 and is incident on the first reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the first reflection surface of the fourth displacement prism 5179 to the second reflection surface of the fourth displacement prism 5179. The optical signal is reflected by the second reflection surface of the fourth displacement prism 5179 to the exit surface of the fourth displacement prism 5179. The optical signal is emitted through the exit surface of the fourth displacement prism 5179 to the third optical receiving component 540.

[0529] The first wavelength optical signal is transmitted to the first optical receiving component 520, the second wavelength optical signal is transmitted to the second optical receiving component 530, and the third wavelength optical signal is transmitted to the third optical receiving component 540. Of course, in some embodiments, the optical signal transmitted to the first optical receiving component 520 is not limited to the first wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the first wavelength optical signal; the optical signal transmitted to the second optical receiving component 530 is not limited to the second wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the second wavelength optical signal; the optical signal transmitted to the third optical receiving component 540 is not limited to the third wavelength optical signal and may also include optical signals of other wavelengths, but is mainly the third wavelength optical signal.

[0530] In some embodiments, the wavelength of the first wavelength optical signal is smaller than the wavelength of the second wavelength optical signal, and the wavelength of the second wavelength optical signal is smaller than the wavelength of the third wavelength optical signal. For example, the wavelength range of the first wavelength optical signal received by the first optical receiving component 520 is 1260-1280 nm, such as the wavelength of the first wavelength optical signal is 1270 nm; the wavelength range of the second wavelength optical signal received by the second optical receiving component 530 is 1284-1288 nm, such as the wavelength of the second wavelength optical signal is 1286 nm; and the wavelength range of the third wavelength optical signal received by the third optical receiving component 540 is 1290-1330 nm, such as the wavelength of the third wavelength optical signal is 1310 nm.

[0531] The first optical receiving assembly 520, the second optical receiving assembly 530, and the third optical receiving assembly 540 each include a photodetector, which is used to receive optical signals and convert them into electrical signals. In some embodiments, the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the first optical receiving assembly 520, and the receiving rate of the photodetector in the second optical receiving assembly 530 is greater than the receiving rate of the photodetector in the third optical receiving assembly 540. This ensures that the second wavelength optical signal with the highest transmission rate has the shortest and simplest optical path from the output of the demultiplexer 5176 to the photodetector, allowing the photodetector in the second optical receiving assembly 530 to receive the optical signal with high coupling efficiency. For example, the receiving rate of the photodetector in the first optical receiving assembly 520 is 10G, the receiving rate of the photodetector in the second optical receiving assembly 530 is 50G, and the receiving rate of the photodetector in the third optical receiving assembly 540 is 2.5G.

[0532] In some embodiments, one end of the light emitting component 400 is connected to the second sub-transceiver side panel 5134, and one side of the light emitting component 400 is close to the first sub-transceiver side panel 5133, so that the light emitting component 400 is located at the avoidance corner of the transceiver shell, thereby making the assembly of the light emitting component 400 and the light receiving component 500 more compact, effectively reducing the overall size of the light emitting component 400 and the light receiving component 500.

[0533] In addition to the structure of the optical emitting component disclosed in the above embodiment, the optical module provided in the embodiment of the present disclosure also includes another optical emitting component structure, which includes a first laser component, a second laser component, and a third laser component, wherein the first laser component emits a first wavelength optical signal, the second laser component emits a second wavelength optical signal, and the third laser component emits a third wavelength optical signal, which is the same as the optical emitting component in the above embodiment. The difference is that this example uses a polarization component and a polarization combining component to combine the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal, and then transmits the combined optical signal to the optical fiber adapter through the above-mentioned optical receiving component.

[0534] Figure 59 is an exploded view of an optical transmission component provided according to some embodiments of the present disclosure. Figure 60 is an exploded view of a second optical component and a transmission housing provided according to some embodiments of the present disclosure. Figure 61 is a structural diagram of a transmission housing provided according to some embodiments of the present disclosure. As shown in Figures 59, 60, and 61, the optical transmission component 400 includes a transmission cover 401 and a transmission housing 402. The transmission cover 401 covers the transmission housing 402 to form a transmission cavity. A first optical component 403 is disposed in the transmission cavity, and the first optical component 403 is used to transmit an optical signal.

[0535] In some embodiments, the first end of the transmitting housing 402 is provided with a third through hole 4211. A light window is positioned within the third through hole 4211, configured to transmit the transmitted light signal and seal the light hole. The light window is embedded within the third through hole 4211 to seal the third through hole 4211; the light window can be made of transparent glass. The light window seals the third through hole 4211, allowing the transmitted light signal to pass through while also sealing the third through hole 4211 to ensure the sealing performance of the transmitting housing 402. In some embodiments, the light window may also be embedded in a connection with the fourth through hole 51321.

[0536] In some embodiments, a notch is provided at the second end of the launch housing 402, and the notch passes through the second end of the launch housing 402. One end of the first circuit board 301 is embedded in the notch, that is, one end of the first circuit board 301 passes through the notch and extends into the inner cavity of the launch housing 402.

[0537] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. The laser assembly 431 is positioned near one end of the first circuit board 301 to facilitate electrical connection of the laser assembly 431 to the first circuit board 301. The laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, the laser assembly 431 is connected to the first circuit board 301 by wire bonding.

[0538] In some embodiments, a socket 4234 is provided at the second end of the launch shell 402, and the socket 4234 passes through the second end of the launch shell 402. The first end of the launch pin 405 is connected to the second circuit board 302, and the second end of the launch pin 405 passes through the socket 4234 and extends into the inner cavity of the launch shell 402.

[0539] In some embodiments, a first optical assembly 403 is disposed within the inner cavity of the transmitting housing 402. The first optical assembly 403 includes a laser assembly 431. Laser assembly 431 is positioned near one end of the transmitting pin 405 to facilitate electrical connection of laser assembly 431 to the transmitting pin 405. Laser assembly 431 is configured to transmit multiple optical signals of different wavelengths. Exemplarily, laser assembly 431 is connected to transmitting pin 405 via wire bonding.

[0540] In some embodiments, the first optical component 403 further includes a lens component 432 , which is disposed on the optical path from the laser component 431 to the combiner component for collimating the optical signal generated by the laser component 431 and transmitting it to the combiner component.

[0541] In some embodiments, the first optical component 403 further includes a combining component, which is used to combine multiple optical signals of different wavelengths emitted by the laser component 431 into one transmitted optical signal.

[0542] As shown in Figures 59, 60, and 61, in some embodiments, the second end of the transmitting housing 402 is provided with multiple jacks 4234. The multiple jacks 4234 include a first jack and a second jack. The first jack is closer to the bottom of the transceiver housing 402. The first jack is used to insert a first transmitting pin, and the second jack is used to insert a second transmitting pin, thereby reducing signal crosstalk between the first transmitting pin and the second transmitting pin. The first transmitting pin is a rate-related transmitting pin 405, and the second transmitting pin is a rate-independent transmitting pin 405.

[0543] As shown in Figures 59 and 60, in some embodiments, a first soldering pad 406 is further provided at the second end of the launch shell 402, one end of the first soldering pad 406 is welded to the first launch pin located on the first socket, and the other end of the first soldering pad 406 is wired to the soldering pad where the laser component 431 is located.

[0544] In some embodiments, the first optical component 403 is fixed in the emission cavity through the substrate 404, and the soldering pad where the laser component 431 is located is connected to the first soldering pad 406 by wire bonding, so that the soldering pad where the laser component 431 is located is flush with the height of the first soldering pad 406, thereby shortening the wire bonding length between the soldering pad where the laser component 431 is located and the first soldering pad 406.

[0545] In some embodiments, the launch housing 402 has an opening. For example, the launch housing 402 includes a first launch side panel 421, a second launch side panel 422, a third launch side panel 423, a fourth launch side panel 424, and a launch bottom panel 425. The first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are connected end to end, and the first launch side panel 421, the second launch side panel 422, the third launch side panel 423, and the fourth launch side panel 424 are all connected to the launch bottom panel 425 to form a launch cavity having an opening.

[0546] The first emitting side plate 421 has a third through hole 4211 .

[0547] The third launching side panel 423 includes a first sub-launching side panel 4231, a second sub-launching side panel 4232 and a third sub-launching side panel 4233. The first sub-launching side panel 4231 is connected to the launching base panel 425. The distances between the first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 and the launching base panel 425 increase successively. The first sub-launching side panel 4231, the second sub-launching side panel 4232 and the third sub-launching side panel 4233 are connected successively so that the third launching side panel 423 is stepped.

[0548] A first solder pad 406 is provided on the surface of the first sub-emitting side panel 4231 facing the opening of the emission housing 402. A first socket is provided on the surface of the second sub-emitting side panel 4232 facing the laser assembly 431. The first socket passes through the second sub-emitting side panel 4232 to facilitate insertion of the first emission pin from the emission housing 402 into the emission housing 402. A second socket is provided on the surface of the third sub-emitting side panel 4233 facing the laser assembly 431. The second socket passes through the third sub-emitting side panel 4233 to facilitate insertion of the second emission pin from the emission housing 402 into the emission housing 402.

[0549] The first jack passes through the second sub-transmitting side panel 4232, and the second jack passes through the third sub-transmitting side panel 4233. The second sub-transmitting side panel 4232 and the third sub-transmitting side panel 4233 are stepped, so as to extend the distance between the first jack and the second jack in the length direction of the transmitting shell 402, reduce the distance between the first jack and the second jack in the height direction of the transmitting shell 402, and thereby reduce the signal crosstalk between the first transmitting pin inserted into the first jack and the second transmitting pin inserted into the second jack.

[0550] The fourth emitting side panel 424 includes a fourth sub-emitting side panel 4241 and a fifth sub-emitting side panel 4242. One side surface of the fourth sub-emitting side panel 4241 is connected to the emitting bottom panel 425, and the other side surface of the fourth sub-emitting side panel 4241 is connected to the fifth sub-emitting side panel 4242, so that the fourth emitting side panel 424 is stepped; one end of the fourth sub-emitting side panel 4241 is connected to the first emitting side panel 421, and the other end of the fourth sub-emitting side panel 4241 is connected to the first sub-emitting side panel 4231; one end of the fifth sub-emitting side panel 4242 is connected to the first emitting side panel 421, and the other end of the fifth sub-emitting side panel 4242 is connected to the second sub-emitting side panel 4232 and the third sub-emitting side panel 4233.

[0551] One end of the fourth sub-emitting side plate 4241 is connected to the first emitting side plate 421 , and the fourth sub-emitting side plate 4241 is connected to the first sub-emitting side plate 4231 to reduce the storage space of the emitting cavity and further limit the substrate 404 .

[0552] Figure 62 is an optical path diagram of a first optical assembly according to some embodiments of the present disclosure. Figure 63 is another optical path diagram of a first optical assembly according to some embodiments of the present disclosure. Figure 64 is a combined optical path diagram of the first and second optical assemblies according to some embodiments of the present disclosure. As shown in Figures 62, 63, and 64, laser assembly 431 includes a first laser assembly 4311, a second laser assembly 4312, and a third laser assembly 4313. Second laser assembly 4312 is located between first laser assembly 4311 and third laser assembly 4313. The light output directions of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are directed toward the multiplexing assembly. In some embodiments, first laser assembly 4311 emits an optical signal at a fourth wavelength, second laser assembly 4312 emits an optical signal at a fifth wavelength, and third laser assembly 4313 emits an optical signal at a sixth wavelength. The optical axes of the fourth, fifth, and sixth wavelength optical signals are parallel to the longitudinal extension of the transmitting housing. Exemplarily, the wavelength range of the fourth wavelength optical signal is 1340-1344 nm, such as the wavelength of the fourth wavelength optical signal is 1342 nm; the wavelength range of the fifth wavelength optical signal is 1480-1500 nm, such as the wavelength of the fifth wavelength optical signal is 1490 nm; the wavelength range of the sixth wavelength optical signal is 1575-1580 nm, such as the wavelength of the sixth wavelength optical signal is 1577 nm.

[0553] In some embodiments, the transmission rate of the first laser assembly 4311 is greater than the transmission rate of the third laser assembly 4313, and the transmission rate of the third laser assembly 4313 is greater than the transmission rate of the second laser assembly 4312. For example, the transmission rate of the first laser assembly 4311 is 50G, the transmission rate of the second laser assembly 4312 is 2.5G, and the transmission rate of the third laser assembly 4313 is 10G.

[0554] In some embodiments, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are not flush, that is, the light-emitting end faces of the first laser assembly 4311, the second laser assembly 4312 and the third laser assembly 4313 are located on different length surfaces of the emitting shell.

[0555] In some embodiments, first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 utilize a chip-on-carrier (COC) package, which can also be referred to as chip-on-ceramic substrate (CPC). Therefore, the side profiles of first laser assembly 4311, second laser assembly 4312, and third laser assembly 4313 are relatively regular, such as rectangular.

[0556] In some embodiments, lens assembly 432 includes a first lens 4321, a second lens 4322, and a third lens 4323. First lens 4321 is disposed on the optical transmission path from first laser assembly 4311 to the combiner assembly, second lens 4322 is disposed on the optical transmission path from second laser assembly 4312 to the combiner assembly, and third lens 4323 is disposed on the optical transmission path from third laser assembly 4313 to the combiner assembly. In some embodiments, first lens 4321, second lens 4322, and third lens 4323 are disposed on substrate 404. However, embodiments of the present disclosure are not limited to first lens 4321, second lens 4322, and third lens 4323 being disposed on substrate 404.

[0557] In some embodiments, the combining component includes a wavelength division multiplexer, the input side of the wavelength division multiplexer faces the laser component, and the output side of the wavelength division multiplexer faces the third through hole 4211. The wavelength division multiplexer combines the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength emitted by the laser component 431 into one optical signal.

[0558] In some embodiments, the wavelength combining component includes a plurality of optical filters, which cooperate with each other to combine the optical signal of the first wavelength, the optical signal of the second wavelength, and the optical signal of the third wavelength into one optical signal.

[0559] In some embodiments, the combining assembly includes a polarization assembly 433 and a polarization combining assembly 434. Polarization assembly 433 is used to adjust the polarization direction of the optical signal, and polarization combining assembly 434 combines multiple polarized beams into a single beam. The polarization assembly adjusts the polarization direction of the optical signal, and then combines the multiple polarized beams into a single beam by the polarization combining assembly, thereby achieving wave combining in the optical emitting component.

[0560] As shown in FIG62 , in some embodiments, the polarization component 433 includes a first polarization component 4331, a second polarization component 4332, and a third polarization component 4333. The first polarization component 4331 is located in the light-emitting direction of the first laser assembly 4311 and is used to adjust the deflection direction of the fourth wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the fourth wavelength optical signal is horizontal, i.e., horizontally polarized light. The second polarization component 4332 is located in the light-emitting direction of the second laser assembly 4312 and is used to adjust the deflection direction of the fifth wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the fifth wavelength optical signal is vertical, i.e., second vertically polarized light. The third polarization component 4333 is located in the light-emitting direction of the third laser assembly 4313 and is used to adjust the deflection direction of the sixth wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the sixth wavelength optical signal is vertical, i.e., first vertically polarized light.

[0561] As shown in Figure 62, in some embodiments, the polarization combiner 434 includes a first polarization combiner 4341, a second polarization combiner 4342 and a third polarization combiner 4343. The first polarization combiner 4341 is located on the left side of the first polarization component 4331. The first polarization combiner 4341 is located between the third through hole 4211 and the first polarization component 4331. The first polarization combiner 4341 is used to transmit the horizontal polarized light (horizontally polarized light) of the fourth wavelength optical signal, and is also used to reflect the vertical polarized light (second vertical polarized light) of the fifth wavelength optical signal and the vertical polarized light (first vertical polarized light) of the sixth wavelength optical signal, and then combine the three into one optical signal. The second polarization combiner 4342 is located to the left of the second polarization component 4332. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertically polarized light) of the fifth wavelength optical signal to the first polarization combiner 4341, and to transmit the vertically polarized light (first vertically polarized light) of the sixth wavelength optical signal to the first polarization combiner 4341. The third polarization combiner 4343 is located to the left of the third polarization component 4333. The third polarization combiner 4343 is configured to reflect the vertically polarized light (first vertically polarized light) of the sixth wavelength optical signal to the second polarization combiner 4342.

[0562] In some embodiments, the first polarization combining element 4341 is a polarization beam splitter, which can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, while the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0563] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the fifth wavelength optical signal and transmit the sixth wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is tilted relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°.

[0564] In some embodiments, the third polarization combiner 4343 is a reflector that reflects the sixth wavelength optical signal. The third polarization combiner 4343 is tilted relative to the central axis of the third polarization component 4333. For example, the angle between the third polarization combiner 4343 and the central axis of the third polarization component 4333 is 45°.

[0565] The polarization component 433 and the polarization combining component 434 shown in Figure 62 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening of the transmitting shell 402 is facing downward in the opposite direction to the opening of the transceiver shell.

[0566] As shown in FIG63 , in some embodiments, a first polarization component 4331 is used to adjust the deflection direction of the fourth wavelength optical signal emitted by the first laser assembly 4311 so that the polarization direction of the fourth wavelength optical signal is vertical, i.e., first vertical polarization. A second polarization component 4332 is used to adjust the deflection direction of the fifth wavelength optical signal emitted by the second laser assembly 4312 so that the polarization direction of the fifth wavelength optical signal is vertical, i.e., second vertical polarization. A third polarization component 4333 is used to adjust the deflection direction of the sixth wavelength optical signal emitted by the third laser assembly 4313 so that the polarization direction of the sixth wavelength optical signal is horizontal, i.e., horizontal polarization.

[0567] As shown in FIG63 , in some embodiments, a third polarization combiner 4343 is located between the third through-hole 4211 and the third polarization component 4333. The first polarization combiner 4341 is configured to reflect the vertically polarized light (first polarized light) of the fourth wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 is configured to reflect the vertically polarized light (second vertical polarized light) of the fifth wavelength optical signal to the third polarization combiner 4343, and further configured to transmit the vertically polarized light (first polarized light) of the fourth wavelength optical signal to the third polarization combiner 4343. The third polarization combiner 4343 is configured to transmit the horizontally polarized light (horizontally polarized light) of the sixth wavelength optical signal and reflect the vertically polarized light (first polarized light) of the fourth wavelength optical signal and the vertically polarized light (second vertical polarized light) of the fifth wavelength optical signal to achieve beam combining.

[0568] In some embodiments, the first polarization combiner 4341 is a reflector that reflects the fourth wavelength optical signal. The first polarization combiner 4341 is tilted relative to the central axis of the first polarization component 4331. For example, the angle between the first polarization combiner 4341 and the central axis of the first polarization component 4331 is 45°.

[0569] In some embodiments, the second polarization combiner 4342 is a filter that can reflect the fifth wavelength optical signal and transmit the fourth wavelength optical signal to achieve beam combining. The second polarization combiner 4342 is tilted relative to the central axis of the second polarization component 4332. For example, the angle between the second polarization combiner 4342 and the central axis of the second polarization component 4332 is 45°. In some embodiments, the third polarization combiner 4343 is a polarization beam splitter that can transmit horizontally polarized light and reflect vertically polarized light to achieve beam combining. For example, the first vertically polarized light and the second vertically polarized light are reflected by the polarization beam splitter, and the horizontally polarized light is transmitted by the polarization beam splitter to achieve beam combining.

[0570] The polarization component 433 and the polarization combining component 434 shown in Figure 63 are placed in the transmitting shell 402. The third through hole 4211 of the transmitting shell 402 is coaxial with the third polarization combining component 4343. The opening direction of the transmitting shell 402 is the same as the downward direction of the opening of the transceiver shell.

[0571] As shown in FIG62 , the fourth wavelength optical signal emitted by the first laser assembly 4311 is transmitted to the first lens 4321, collimated by the first lens 4321, and transmitted to the first polarization component 4331. The polarization direction of the fourth wavelength optical signal is adjusted by the first polarization component 4331 before being transmitted to the first polarization combiner 4341. The fifth wavelength optical signal emitted by the second laser assembly 4312 is transmitted to the second lens 4322, collimated by the second lens 4322, and transmitted to the second polarization component 4332. The polarization direction of the fifth wavelength optical signal is adjusted by the second polarization component 4332 before being transmitted to the second polarization combiner 4342. The sixth wavelength optical signal emitted by the third laser assembly 4313 is transmitted to the third lens 4323, collimated by the third lens 4323, and transmitted to the third polarization component 4333. The polarization direction of the sixth wavelength optical signal is adjusted by the third polarization component 4333 before being transmitted to the third polarization combiner 4343. The third polarization combiner 4343 reflects the vertically polarized light of the sixth wavelength optical signal to the second polarization combiner 4342. The second polarization combiner 4342 reflects the vertically polarized light of the fifth wavelength optical signal to the first polarization combiner 4341 and transmits the vertically polarized light of the sixth wavelength optical signal to the first polarization combiner 4341. The first polarization combiner 4341 transmits the horizontally polarized light of the fourth wavelength optical signal and reflects the vertically polarized light of the fifth wavelength optical signal and the sixth wavelength optical signal, so that the horizontally polarized light of the fourth wavelength optical signal, the vertically polarized light of the fifth wavelength optical signal, and the vertically polarized light of the sixth wavelength optical signal are combined into one optical signal.

[0572] As shown in FIG64 , after the horizontally polarized light of the fourth wavelength optical signal, the vertically polarized light of the fifth wavelength optical signal, and the sixth wavelength optical signal are combined into a beam of optical signals, the optical signal is first adjusted in the Y direction by the first displacement prism 5171 and then incident on the first filter 5172. Then, the optical signal is incident on the second displacement prism 5173 through the first filter 5172. Then, the optical signal is adjusted in the Y direction by the second displacement prism 5173 and incident on the fourth lens 5174. Finally, the optical signal is converged by the fourth lens 5174.

[0573] Figure 65 is a schematic diagram of the optical axis of the wave plate, the polarization direction of the incident light signal, and the polarization direction of the outgoing light signal provided according to some embodiments of the present disclosure. As shown in Figure 65, a is the polarization direction of the incident light signal, b is the optical axis of the first wave plate, and c is the polarization direction of the outgoing light signal. Figure A is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate, which is horizontal. Figure B is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate, which is horizontal. Figure C is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 45° passes through the wave plate, which is vertical. Figure C is a schematic diagram of the polarization direction of the outgoing light signal obtained after the incident light signal with a polarization direction of 135° passes through the wave plate, which is vertical. As shown in Figure 65, in some embodiments, the wave plate is a half-wave plate, and the incident linearly polarized light emits linearly polarized light after passing through the half-wave plate. The characteristic of a half-wave plate is that the polarization direction of the incident light and the polarization direction of the outgoing light are symmetrical with respect to the optical axis of the half-wave plate.

[0574] The following only uses the polarization component 433 and the polarization combining component 434 shown in Figure 62 as an example to introduce the beam combining principle of the optical emitting component. Since the optical signal after the polarization combining component combines includes a vertical polarization state and a horizontal polarization state, if a structural component for reverse isolation is provided after the polarization combining component, then at least two isolators need to be provided after the polarization combining component to achieve the reverse isolation effect. Therefore, an isolator can be provided before the polarization combining component. Since the isolator includes a first polarizer, a Faraday plate, and a second polarizer, an isolator is provided before the polarization combining component, and the optical signal emits non-horizontally polarized light and non-vertically polarized light after passing through the isolator. In order to make the optical signal emit horizontally polarized light or vertically polarized light after passing through the polarization component, it is necessary to add a wave plate after the second polarizer. Non-horizontally polarized light emits horizontally polarized light after passing through the wave plate, and non-vertically polarized light emits horizontally polarized light or vertically polarized light after passing through the wave plate. The reverse isolation principle of the isolator is as follows: the Faraday plate rotates in the same direction, and the polarized light passing through the first polarizer cannot return to the first polarizer after the Faraday rotation, so that the isolator composed of the first polarizer, the Faraday plate and the second polarizer has a reverse isolation effect.

[0575] In some embodiments, the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 all include a first polarizer, a Faraday plate, a second polarizer and a wave plate. The first polarizer, the Faraday plate, the second polarizer and the wave plate are sequentially away from the first laser component. The fourth wavelength light signal emitted by the first laser component passes through the first polarizer, the Faraday plate, the second polarizer and the wave plate in sequence and is emitted. The angle between the optical axis of the wave plate and the horizontal plane is a preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light or vertical polarized light after passing through the wave plate. For example, the angle between the optical axis of the wave plate of the first polarization component 4331 and the horizontal plane is a first preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to horizontal polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the second polarization component 4332 and the horizontal plane is a second preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate; the angle between the optical axis of the wave plate of the third polarization component 4333 and the horizontal plane is a third preset angle, so that the light signal with the same polarization direction as the second polarizer is adjusted to vertical polarized light after passing through the wave plate.

[0576] The first preset angle is different from the second preset angle. The polarization direction of the second polarizer of the second polarization assembly is the same as the polarization direction of the second polarizer of the third polarization assembly, so that the second preset angle is the same as the third preset angle.

[0577] In some embodiments, the first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer. For example, the first polarization component 4331 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, the second polarization component 4332 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer, and the third polarization component 4333 includes a horizontal polarizer, a Faraday plate, and a 45° polarizer.

[0578] In some embodiments, the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer. For example, the first polarization assembly 4331 includes a vertical polarizer, a Faraday plate, and a 135° polarizer; the second polarization assembly 4332 includes a vertical polarizer, a Faraday plate, and a 135° polarizer; and the third polarization assembly 4333 includes a vertical polarizer, a Faraday plate, and a 135° polarizer. In some embodiments, the first polarizer, the Faraday plate, and the second polarizer are sequentially connected to form an isolator, with the wave plate located outside the isolator and mounted on the substrate 404. For example, the horizontal polarizer, the Faraday plate, and the 45° polarizer are sequentially connected to form an isolator; the vertical polarizer, the Faraday plate, and the 135° polarizer form an isolator. In some embodiments, the first polarizer, the Faraday plate, and the second polarizer are sequentially bonded using glue.

[0579] In some embodiments, a first polarizer, a Faraday plate, a second polarizer, and a wave plate are sequentially connected to form an isolator. This not only facilitates the mounting of the wave plate but also reduces the space required for the transmitter housing. For example, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a wave plate are sequentially connected to form an isolator; a vertical polarizer, a Faraday plate, a 135° polarizer, and a wave plate are sequentially connected to form an isolator. In some embodiments, the first polarizer, Faraday plate, second polarizer, and wave plate are sequentially bonded using glue.

[0580] Since the structures of the first polarization component 4331, the second polarization component 4332 and the third polarization component 4333 are the same, only the optical axis angles of the wave plates are slightly different. Instead of introducing each polarization component in detail, only the first polarization component 4331 and the second polarization component 4332 are used as examples to introduce the polarization components.

[0581] Taking the first polarization assembly 4331 as an example, the first polarization assembly 4331 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After passing through the horizontal polarizer, Faraday plate, and 45° polarizer, the optical signal emits 45° polarized light. As shown in A of FIG65 , 45° polarized light (i.e., an incident light signal with a 45° polarization direction) is polarized by the first wave plate to obtain horizontal polarized light (i.e., an outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first preset angle of 22.5°.

[0582] In some embodiments, a horizontal polarizer, a Faraday plate, and a 45° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator. In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and the first wave plate are sequentially connected to form a first isolator.

[0583] In some embodiments, the first polarization assembly 4331 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and first wave plate are sequentially positioned away from the first laser assembly 4311. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in FIG65B , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the first wave plate to produce horizontally polarized light (i.e., the outgoing light signal with a horizontal polarization direction). The optical axis of the first wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the first wave plate and the horizontal plane is a first predetermined angle, which is 157.5°. In some embodiments, the vertical polarizer, Faraday plate, and 135° polarizer are sequentially connected to form a fourth isolator, and the first wave plate is located outside the fourth isolator.

[0584] In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a first wave plate are sequentially connected to form a first isolator.

[0585] The above configuration does not consider adjusting the magnetic poles of the first or fourth isolators. If the magnetic poles of the fourth isolator are adjusted, the fourth isolator includes a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the first isolator are adjusted, the first isolator includes a vertical polarizer, a Faraday plate, a 45° polarizer, and a first wave plate. The first wave plate's optical axis forms an angle of 22.5° with the horizontal plane.

[0586] Taking the second polarization assembly 4332 as an example, the second polarization assembly 4332 includes a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The horizontal polarizer, Faraday plate, 45° polarizer, and second wave plate are sequentially positioned away from the second laser assembly 4312. After the optical signal passes through the horizontal polarizer, Faraday plate, and 45° polarizer, it emits 45° polarized light. As shown in C in FIG65 , the 45° polarized light (i.e., the incident light signal with a 45° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal counterclockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second predetermined angle of 67.5°. In some embodiments, the horizontal polarizer, Faraday plate, and 45° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator.

[0587] In some embodiments, a horizontal polarizer, a Faraday plate, a 45° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0588] In some embodiments, the second polarization assembly 4332 includes a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate. The vertical polarizer, Faraday plate, 135° polarizer, and second wave plate are sequentially positioned away from the second laser assembly 4312. After the optical signal passes through the vertical polarizer, Faraday plate, and 135° polarizer, it emits 135° polarized light. As shown in D of FIG65 , the 135° polarized light (i.e., the incident light signal with a 135° polarization direction) is polarized by the second wave plate to obtain vertically polarized light (i.e., the outgoing light signal with a vertical polarization direction). The optical axis of the second wave plate is obtained by rotating the polarization direction of the incident light signal clockwise by 22.5°. That is, the angle between the optical axis of the second wave plate and the horizontal plane is a second predetermined angle, which is 112.5°.

[0589] In some embodiments, a vertical polarizer, a Faraday plate, and a 135° polarizer are sequentially connected to form a fifth isolator, and the second wave plate is located outside the fifth isolator. In some embodiments, a vertical polarizer, a Faraday plate, a 135° polarizer, and a second wave plate are sequentially connected to form a second isolator.

[0590] The above configuration does not consider adjusting the magnetic poles of the second or fifth isolators. If the magnetic poles of the fifth isolator are adjusted, the fifth isolator will include a vertical polarizer, a Faraday plate, and a 45° polarizer. If the magnetic poles of the second isolator are adjusted, the second isolator will include a vertical polarizer, a Faraday plate, a 45° polarizer, and a second wave plate. The angle between the optical axis of the second wave plate and the horizontal plane is 67.5°.

[0591] The third polarization component 4333 may include a sixth isolator and a third wave plate, or may include a third isolator, wherein the third isolator includes a third wave plate, and the angle between the third wave plate and the horizontal plane is a third preset angle. The third polarization component 4333 and the second polarization component 4332 both function to adjust the deflection direction of the optical signal so that the polarization direction of the optical signal is vertical. Therefore, the sixth isolator is the same as the fifth isolator, and the third isolator is the same as the second isolator, and they will not be repeated here. The sixth isolator is the same as the fifth isolator, which means that the sixth isolator can be any embodiment of the fifth isolator; the third isolator is the same as the second isolator, which means that the third isolator can be any embodiment of the second isolator.

[0592] Figure 66 is a decomposition diagram of the supporting member, the second polarization combining member and the third polarization combining member provided according to some embodiments of the present disclosure. As shown in FIG66 , a supporting member 407 is further provided on the substrate 404. One side of the supporting member 407 supports the third polarization combiner 4343, and the other side of the supporting member 407 supports the second polarization combiner 4342. The third polarization combiner 4343 is arranged parallel to the second polarization combiner 4342. The supporting member 407 is provided with a first through hole, one end of which is connected to the third polarization combiner 4343, and the other end of the first through hole is directed toward the third polarization component 4333, so that the vertically polarized light of the sixth wavelength optical signal emitted by the third polarization component 4333 is incident on the third polarization combiner 4343 through the first through hole. The supporting member 407 is also provided with a second through hole, one end of which is connected to the second polarization combiner 4342, and the other end of the second through hole is connected to the third polarization combiner 4343, so that the sixth wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 through the second through hole.

[0593] Figure 67 is a structural diagram of a supporting member provided according to some embodiments of the present disclosure. Figure 68 is a structural diagram of a supporting member provided according to some embodiments of the present disclosure from another perspective. Figure 69 is a cross-sectional view of a supporting member provided according to some embodiments of the present disclosure. As shown in Figures 67, 68 and 69, in some embodiments, the side surface of the supporting member 407 includes a first limiting surface 471, a first supporting surface 472, a second limiting surface 473, a first connecting surface 474, a second connecting surface 475, a third limiting surface 476, a second supporting surface 477, a third connecting surface and a fourth connecting surface, and the first limiting surface 471, the first supporting surface 472, the second limiting surface 473, the first connecting surface 474, the second connecting surface 475, the third limiting surface 476, the second supporting surface 477, the third connecting surface and the fourth connecting surface are connected in sequence. The first supporting surface 472 supports the third polarization combining component 4343, and the first limiting surface 471, the first supporting surface 472 and the second limiting surface 473 are connected in sequence to form a recessed limiting groove to limit the third polarization combining component 4343; the first connecting surface 474 is in contact and connected with the fourth sub-emitting side plate 4241 of the fourth emitting side plate 424, and the second connecting surface 475 faces the third polarization component 4333; the second supporting surface 477 supports the second polarization combining component 4342, and the third limiting surface 476 is connected to the second supporting surface 477 to form a recessed limiting groove to limit the second polarization combining component 4342.

[0594] In some embodiments, the first supporting surface 472 and the second supporting surface 477 are arranged in parallel to ensure that the vertically polarized light of the sixth wavelength optical signal reflected by the third polarization combiner 4343 is reflected to the second polarization combiner 4342 as much as possible.

[0595] As shown in Figures 67, 68 and 69, one end of the first through hole 478 is located at the second connecting surface 475, the other end of the first through hole 478 is located at the first supporting surface 472, one end of the second through hole 479 is located at the first supporting surface 472, and the other end of the second through hole 479 is located at the second supporting surface 477. The first through hole 478 is connected to the second through hole 479, so that the third polarization combiner 4343 receives the vertical polarized light of the sixth wavelength optical signal through the first through hole 478, and reflects the vertical polarized light of the sixth wavelength optical signal to the second polarization combiner 4342 through the second through hole 479.

[0596] Since the optical module provided by the embodiment of the present disclosure needs to be frequently plugged in and out of the host computer during use, in order to avoid the problem that the unlocking component of the optical module is not applicable due to the long linear movement distance between the pull ring and the optical module when the pull ring of the unlocking component of the optical module applies force in the direction of pulling out the optical module, causing interference with other components in some equipment, the optical module provided by the embodiment of the present disclosure can effectively solve the problem that the unlocking component of the optical module is not applicable. The specific structure of the optical module can be understood with reference to the following example.

[0597] Figure 70 is a partial schematic diagram of the connection between an unlocking component and an upper housing according to some embodiments of the present disclosure. Figure 71 is a partial exploded schematic diagram of an unlocking component and an upper housing according to some embodiments of the present disclosure. As shown in Figures 70 and 71, the cover plate 2011 of the upper housing 201 is provided with a matching protrusion 2013 on its surface, which engages with a corresponding component on the cage.

[0598] The upper shell 201 is provided with a clamping shaft and a mounting seat 220 . The unlocking component 600 includes a pull ring 610 and an unlocking member 620 .

[0599] The pull ring 610 is arranged on the outer wall of one end of the shell surrounded by the upper shell and the lower shell, and the pull ring 610 is provided with an axial hole, and the card shaft is installed in the axial hole. When the pull ring is pulled from the electrical port to the optical port, the pull ring 610 rotates along the card shaft. The unlocking member 620 is movably arranged in the mounting seat 220, and has a locked position and an unlocked position during the movement relative to the mounting seat. Specifically, when the unlocking member is in the locked position, the matching protrusion is buckled with the matching buckle on the cage. At this time, the optical module is matched with the cage, and the entire optical module cannot be removed. When the unlocking member is in the unlocking position, the unlocking member can drive the end of the matching buckle to lift, so that the matching buckle moves along the surface of the matching protrusion and separates from the matching protrusion to release the buckling relationship, so that the optical module can be separated from the cage, thereby realizing the unlocking of the optical module.

[0600] In some embodiments, to better enable the mating protrusion 2013 to fit within the mating buckle, a snap groove 2014 is provided on the surface of the cover 2011. The surface of the snap groove 2014 is recessed relative to the surface of the cover 2011, toward the lower housing. The mating protrusion 2013 is positioned within the snap groove 2014, such that the bottom of the snap groove 2014 is lower than the surface of the cover 2011. The profile area of ​​the mating buckle is smaller than the bottom area of ​​the snap groove 2014. When the unlocking member is in the locked position, the mating buckle is completely positioned within the snap groove 2014.

[0601] In some embodiments, the mating protrusion 2013 is a triangular protrusion structure that can be snapped into place with the annular mating buckle on the cage to fix the position of the optical module relative to the cage, ensuring stable operation of the optical module. From left to right, the height of the mating protrusion 2013 gradually decreases to reduce friction between the mating buckle and the mating protrusion during movement from right to left, thereby preventing the mating buckle from abutting against the step caused by the different heights.

[0602] In some embodiments, the triangular protrusion, from left to right, is shaped like an inverted triangle, with one corner of the triangular protrusion pointing toward the electrical port. The shape of the mating buckle matches the shape of the triangular protrusion. The corners of the triangular protrusion are chamfered in an arc shape, making the connection between the triangular protrusion and the mating buckle smoother and reducing friction between the mating buckle and the mating protrusion.

[0603] Figure 72 is a schematic diagram of an exploded view of a pull ring provided according to some embodiments of the present disclosure. Figure 73 is a schematic diagram of a pull ring provided according to some embodiments of the present disclosure from a second angle. Figures 72 and 73 show the pull ring from different angles. As shown in Figures 72 and 73, the pull ring 610 includes a pull ring body 611 and a pull ring kit 612. The pull ring body 611 is a sealed or semi-sealed annular structure, and the pull ring kit 612 is sleeved on one side arm of the pull ring body 311. The type of optical module can be distinguished by setting a mark on the pull ring kit 612. For example, the mark set on the pull ring kit 612 can be distinguished by color or letter.

[0604] The pull ring body 611 includes a first arm 6111, a second arm 6112, a third arm 6113, and a fourth arm 6114, which are connected end to end, and a bent portion 6115 located on the first arm 6111. To reduce the space occupied by the optical module and enhance the strength of the pull ring body 611, the width of each arm of the pull ring body 611 is greater than its thickness.

[0605] The first arm 6111 and the third arm 6113 are positioned opposite each other, while the second arm 6112 and the fourth arm 6114 are positioned opposite each other. When the unlocking member is in the unlocked position, to reduce the space occupied by the optical module, the second arm 6112 and the fourth arm 6114 are located on the outer walls of the two side panels of the upper housing. The first arm 6111611 is located at the optical port, and the width of the first arm 6111611 is distributed vertically along the outer wall of the optical module. The third arm 6113 is located on the outer wall of the support plate 2016. In some embodiments, the first arm 6111 and the third arm are arranged perpendicularly, and the third arm 6113 is located on the outer wall of the support plate 2016, reducing the space occupied by the optical module in the left and right directions.

[0606] The bent portion 6115 is located on the sidewall of the first arm 6111 and between the second arm 6112 and the fourth arm 6114. The second arm and the fourth arm can protect the bent portion 6115.

[0607] The lower surface of the bent portion 6115 is higher than the lower surface of the first arm 6111, positioning the bent portion 6115 above the cover. A gap exists between the lower surface of the bent portion 6115 and the upper surface of the cover. The second arm 6112 has a first axial hole 6117, and the fourth arm 6114 has a second axial hole 6118. The centerline of the first and second axial holes 6117 and 6118 is flush with the surface of the cover 3011, ensuring that the pull ring 610 maintains balance during rotation and reducing friction between the pull ring 610 and the surface of the upper housing 201.

[0608] In some embodiments, the bent portion 6115 includes a curved component 61151 and a reinforcing component 61152. The curved component 61151 is located between the first arm 6111 and the reinforcing component 61152 and has an arcuate shape. When the unlocking member is in the locked position, the reinforcing component 61152 is attached to the optical port, and the left end of the unlocking member 620 contacts the reinforcing component 61152. The reinforcing component 61152 is perpendicular to the cover plate 2011. The first arm 6111 is located to the left of the reinforcing component 61152. The reinforcing component is parallel to the first arm.

[0609] In some embodiments, both the first arm 6111 and the reinforcement component 61152 are plate-like structures, and a gap may be provided between the first arm 6111 and the reinforcement component 61152. To increase the strength of the pull ring and prevent deformation during unlocking, the gap between the first arm 6111 and the reinforcement component 61152 may be filled with reinforcing material.

[0610] During unlocking, the pull ring is pulled upward and to the left, causing the first arm 6111 and the bent portion 6115 to move downward and to the right around the axis of rotation. The contact point between the pull ring 610 and the unlocking member 620 gradually shifts from the reinforcing member 61152 to the curved member 61151, pushing the unlocking member 620 to the right. The curved member 61151 makes the unlocking process smoother and reduces jamming.

[0611] When the unlocking member is in the unlocked position, the reinforcement member 61152 is arranged parallel to the cover plate 2011, and the first arm 6111 is located above the reinforcement member 61152. In some embodiments, the third arm 6113 can be a single piece of sheet material or formed from two sheets of sheet material. As shown in FIG72 , the third arm 6113 is formed from two sheets of sheet material and has an arm gap 6116. The pull ring assembly 612 is mounted on the surface of the third arm 6113, and the pull ring assembly 612 covers the arm gap 6116.

[0612] In some embodiments, the width of the arm gap 6116 is smaller than the width of the housing gap 2015, and the pull ring assembly 612 covers the arm gap 6116, and the pull ring assembly 612 covers the housing gap 2015. In some embodiments, the upper right corner of the second arm 6112 is provided with a first chamfer 614. The first chamfer is arc-shaped, which allows for smoother sliding between the second arm 6112 and the cover plate when the pull ring is pulled upward to the left, reducing sticking. In some embodiments, the upper right corner of the fourth arm 6114 is provided with a second chamfer 613. The third chamfer is arc-shaped, which allows for smoother sliding between the fourth arm 6114 and the cover plate when the pull ring is pulled upward to the left, reducing sticking.

[0613] Figure 74 is a schematic diagram of the first angle of view of an unlocking member provided according to some embodiments of the present disclosure. Figure 75 is a schematic diagram of the second angle of view of an unlocking member provided according to some embodiments of the present disclosure. Figures 74 and 75 illustrate the unlocking member from different angles. As shown in Figures 74 and 75, the unlocking member 620 includes an unlocking body 621, an unlocking guide, and a spring compression portion.

[0614] The first end of the unlocking member 621 is in contact with the pull ring, and the second end of the unlocking member 621 is located in the buckle groove 2014. When the unlocking member is in the locked position, the second end of the unlocking member 621 is located to the left of the mating buckle. During the unlocking process, the pull ring is pulled upward and to the left, causing the first arm 6111 and the bent portion 6115 to move downward and to the right around the axis of rotation. The contact point between the pull ring 610 and the first end of the unlocking member 620 gradually moves from the reinforcing component 61152 to the curved component 61151, pushing the second end of the unlocking member 620 under the mating buckle, raising the mating buckle and disengaging the mating buckle from the mating protrusion.

[0615] In some embodiments, a first elastic sheet guide portion 6211 and a second elastic sheet guide portion 6212 are provided at the second end of the unlocking body 621 , and an avoidance groove 6213 is provided between the first elastic sheet guide portion 6211 and the second elastic sheet guide portion 6212 .

[0616] In some embodiments, the first spring clip guide portion 6211 has an inclined first guide slope 62111, and the inclination direction of the first guide slope is toward the right. The first guide slope 62111 of the first spring clip guide portion 6211 causes the thickness of the first spring clip guide portion 6211 to gradually increase from right to left. The right side of the first spring clip guide portion 6211 is thinner, which facilitates insertion into the gap formed by the mating buckle and the upper cover 3011 during the unlocking process. The left side of the first spring clip guide portion 6211 is thicker than the maximum thickness of the matching protrusion 2013. To facilitate unlocking and prevent the mating buckle from tilting during the lifting process, the first spring clip guide portion 6211 and the second spring clip guide portion 6212 have the same inclined slope.

[0617] The rightmost end of the first guide slope 62111 of the first spring sheet guide part 6211 is provided with a reinforced section, which is perpendicular to the surface of the cover plate, so that the thickness of the rightmost end of the first spring sheet guide part 6211 is increased, thereby increasing the thickness of the first spring sheet guide part 6211 when the first spring sheet guide part 6211 initially contacts the mating buckle during the unlocking process, thereby preventing the first spring sheet guide part 6211 from bending.

[0618] In some embodiments, the second spring clip guide portion 6212 has an inclined second guide slope 62121, and the inclination direction of the guide slope is toward the right. The second guide slope 62121 causes the thickness of the first spring clip guide portion 6211 to gradually increase from right to left. The right side of the first spring clip guide portion 6211 is thinner, which facilitates insertion into the gap formed by the mating buckle and the upper cover plate 3011 during the unlocking process. The left side of the first spring clip guide portion 6211 is thicker than the maximum thickness of the mating protrusion 2013. To facilitate unlocking and prevent the mating buckle from tilting during the lifting process, the first spring clip guide portion 6211 and the second spring clip guide portion 6212 have the same inclined slope.

[0619] The rightmost end of the second guide slope 62121 of the second spring sheet guide part 6212 is provided with a reinforced section, which is perpendicular to the surface of the cover plate, so that the thickness of the rightmost end of the second spring sheet guide part 6212 is increased, and the thickness of the second spring sheet guide part 6212 is increased when the second spring sheet guide part 6212 initially contacts the mating buckle during the unlocking process, thereby preventing the second spring sheet guide part 6212 from bending or breaking.

[0620] The width of the relief groove 6213 is greater than the side length of the mating protrusion 6213. In the unlocked position, the mating protrusion 6213 fits between the first spring guide 6211 and the second spring guide 6212, lifting both ends of the mating buckle and facilitating unlocking. The width of the relief groove 6213 is the distance between the first spring guide 6211 and the second spring guide 6212.

[0621] In some embodiments, a first unlocking guide portion 6221 is provided on a side wall of the unlocking body 621. The first unlocking guide portion 6221 protrudes outward from the side wall of the unlocking body 621. The length of the first unlocking guide portion 6221 is shorter than the length of the unlocking body 621, and the upper surface of the first unlocking guide portion 6221 is lower than the upper surface of the unlocking body 621, so that the first unlocking guide portion 6221 slides within the first fixing portion.

[0622] The first spring compression portion 6231 is located outside the first unlocking guide portion 6221. The first spring compression portion 6231 protrudes outward relative to the side wall of the unlocking body 621. The length of the first spring compression portion 6231 is shorter than the length of the first unlocking guide portion 622.

[0623] For example, the left end of the first spring compression portion 6231 is flush with the left end of the first unlocking guide portion 6221. For example, to ensure that the forces on both sides of the unlocking body 621 are balanced during the unlocking process, the unlocking body 621 is further provided with a second unlocking guide portion 6222 and a second spring compression portion 6232.

[0624] A second unlocking guide 6222 is provided on the other side wall of the unlocking body 621. The second unlocking guide 6222 protrudes outward from the side wall of the unlocking body 621. The length of the second unlocking guide 6222 is shorter than that of the unlocking body 621, and the upper surface of the second unlocking guide 6222 is lower than the upper surface of the unlocking body 621, so that the second unlocking guide 6222 slides within the second fixing portion.

[0625] The second spring compression portion 6232 is located outside the second unlocking guide portion 6222. The second spring compression portion 6232 protrudes outward relative to the side wall of the unlocking body 621. The length of the second spring compression portion 6232 is shorter...

Claims

1. An optical module, comprising: An optical receiving component, a first end of the optical receiving component is connected to an optical fiber adapter, a second end of the optical receiving component is connected to an optical transmitting component, and a light emitting direction of the optical transmitting component faces the optical fiber adapter; The optical receiving component includes a first optical receiving assembly, a second optical receiving assembly, and a third optical receiving assembly. The first optical receiving assembly and the second optical receiving assembly are located on one side of the optical receiving component, and the third optical receiving assembly is located on the other side of the optical receiving component; The optical receiving component further includes a wavelength division component. An emitted optical signal emitted by the optical transmitting component is incident on an emitted light input of the wavelength division component and exits through a received light input of the wavelength division component. A received optical signal including a first wavelength, a second wavelength, and a third wavelength emitted by the optical fiber adapter is incident on the received light input of the wavelength division component, is reflected by the emitted light input of the wavelength division component, and then is divided into a first wavelength optical signal, a second wavelength optical signal, and a third wavelength optical signal and exits. The first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal are respectively incident on corresponding optical receiving assemblies. Among them, the first wavelength optical signal includes a received optical signal of the first wavelength, the second wavelength optical signal includes a received optical signal of the second wavelength, and the third wavelength optical signal includes a received optical signal of the third wavelength; An optical transmitting component, including a first laser assembly, a second laser assembly, and a third laser assembly distributed in a triangular state. The first laser assembly is configured to generate a fourth wavelength optical signal, the second laser assembly is configured to generate a fifth wavelength optical signal, and the third laser assembly is configured to generate a sixth wavelength optical signal; The optical transmitting component further includes a multiplexing component, and the multiplexing component is configured to combine the fourth wavelength optical signal, the fifth wavelength optical signal, and the sixth wavelength optical signal into the emitted optical signal.

2. The optical module according to claim 1, wherein A first end of the wavelength division component is correspondingly arranged with a first end of the optical receiving component, and a second end of the wavelength division component is correspondingly arranged with a second end of the optical receiving component; The first end of the wavelength division component corresponds to the received light input, and the second end of the wavelength division component corresponds to the emitted light input.

3. The optical module according to claim 2, wherein, The first end of the wavelength division component has a first light output, the second end of the wavelength division component has a second light output and a third light output. The first wavelength optical signal exits through the second light output and is incident on the second optical receiving assembly, the third wavelength optical signal exits through the first light output and is incident on the first optical receiving assembly, and the second wavelength optical signal exits through the third light output and is incident on the third optical receiving assembly.

4. The optical module according to claim 2, wherein, The wavelength division component includes a substrate. The first end face of the substrate is correspondingly arranged with the first end of the optical receiving component, and the second end face of the substrate is correspondingly arranged with the second end of the optical receiving component. A first wave plate, a second wave plate, and a third wave plate are sequentially arranged on the first end face of the substrate, and a fourth wave plate, a fifth wave plate, and a sixth wave plate are sequentially arranged on the second end face of the substrate. The first wave plate and the fourth wave plate are arranged opposite to each other, the second wave plate and the fifth wave plate are arranged opposite to each other, and the third wave plate and the sixth wave plate are arranged opposite to each other; The emission optical signal emitted by the optical transmitting component is sequentially transmitted through the fourth wave plate and the first wave plate to the fiber optic adapter; the received optical signal emitted by the fiber optic adapter is sequentially transmitted through the first wave plate, reflected by the fourth wave plate and the second wave plate, reflected and transmitted by the fifth wave plate, reflected by the fifth wave plate and then reflected and transmitted by the third wave plate, and finally transmitted through the sixth wave plate after being reflected by the third wave plate, so that the first wavelength optical signal is emitted through the fifth wave plate, the third wavelength optical signal is emitted through the third wave plate, and the second wavelength optical signal is emitted through the sixth wave plate.

5. The optical module according to claim 4, wherein, The optical receiving component further includes a first reflector, a second reflector, and a third reflector; The first reflector is located between the fifth wave plate and the second optical receiving component, and the first reflector faces the fifth wave plate and the second optical receiving component, so that the first wavelength optical signal is reflected to the second optical receiving component; The second reflector is located between the third wave plate and the first optical receiving component, and the second reflector faces the third wave plate and the first optical receiving component, so that the third wavelength optical signal is reflected to the first optical receiving component; The third reflector is located between the sixth wave plate and the third optical receiving component, and the third reflector faces the sixth wave plate and the third optical receiving component, so that the second wavelength optical signal is reflected to the third optical receiving component; The optical receiving component further includes a first filter, a second filter, and a third filter. The first filter is located on the reflection optical path of the second reflector, the second filter is located on the reflection optical path of the first reflector, and the third filter is located on the emission optical path of the sixth wave plate; The first filter is mounted on the top of the first optical receiving component, the second filter is mounted on the top of the second optical receiving component, and the third filter is connected to the third reflector.

6. The optical module according to claim 5, wherein, The first optical receiving component, the second optical receiving component, and the third optical receiving component all include a receiving tube cap and a receiving tube base. The receiving tube cap covers the receiving tube base, and a photo-receiving chip is arranged on the receiving tube base to receive an optical signal; The receiving tube cap of the first optical receiving component has a lens, the lens protrudes from the receiving tube cap, a bracket is arranged on the receiving tube cap, the bracket has a first light passing hole, and the first filter is arranged on the bracket. The first filter plugs the first light passing hole, so that the optical signal is filtered by the first filter and then incident on the first optical receiving component; The receiving tube cap of the second optical receiving component has a lens, the lens does not protrude from the receiving tube cap, a second filter is arranged on the receiving tube cap, and the second filter covers the second lens so that the optical signal is incident on the second optical receiving component after being filtered by the second filter.

7. The optical module according to claim 2, wherein the optical receiving component includes a first housing, the first housing includes a bottom plate, and a first side wall, a second side wall, a third side wall and a fourth side wall connected in sequence. The first side wall is connected to the fiber optic adapter, the second side wall is respectively connected to the first optical receiving component and the second optical receiving component, the third side wall is connected to the optical transmitting component, the fourth side wall is connected to the third optical receiving component, and the light emitting direction of the optical transmitting component faces the fiber optic adapter.

8. The optical module according to claim 7, wherein, The optical receiving component further includes a first cover plate, and the first cover plate covers the first housing to form a first cavity; a wavelength division component is arranged in the first cavity, and the wavelength division component is arranged along the length direction of the second side wall so that the wavelength division component is arranged along the length direction of the first housing.

9. The optical module according to claim 7, wherein the first housing has a first bearing surface, a second bearing surface, a third bearing surface and a fourth bearing surface. The first bearing surface faces the third optical receiving component, the second bearing surface faces the second optical receiving component, the third bearing surface faces the first optical receiving component, and the fourth bearing surface faces the second side wall; the wavelength division component bears on the fourth bearing surface so that the wavelength division component is arranged along the length direction of the first housing; the emitted optical signal emitted by the optical transmitting component is incident on the fiber optic adapter through the wavelength division component, and the received optical signal emitted by the fiber optic adapter is split by the wavelength division component and then emitted.

10. The optical module according to claim 9, wherein, The optical receiving component further includes a first reflector, a second reflector and a third reflector; the first reflector bears on the second bearing surface so that the received optical signal emitted by the wavelength division component is reflected to the second optical receiving component; the second reflector bears on the third bearing surface so that the received optical signal emitted by the wavelength division component is reflected to the first optical receiving component; the third reflector bears on the first bearing surface so that the received optical signal emitted by the wavelength division component is reflected to the third optical receiving component.

11. The optical module according to claim 9, wherein The first side wall has a first connection hole, the third side wall has a second connection hole, the second side wall has a fourth connection hole and a fifth connection hole, the fourth side wall has a third connection hole, the third connection hole is connected to the third optical receiving component, the fourth connection hole is connected to the second optical receiving component, and the fifth connection hole is connected to the first optical receiving component; the first connection hole, the second connection hole, the third connection hole, the fourth connection hole and the fifth connection hole are respectively communicated with the accommodating cavity of the first housing, and a first lens is arranged in the accommodating cavity, and the first lens is located between the first connection hole and the first wave plate.

12. The optical module according to claim 11, wherein, The second side wall has a first step, and the first step is located between the fourth connection hole and the fifth connection hole, so that the depth of the fourth connection hole is less than the depth of the fifth connection hole; The fourth side wall has a second step, and the second step is located on one side of the third connection hole to enhance the strength of the first housing; The fourth connection hole is closer to the second connection hole than the fifth connection hole, and the central axis of the fourth connection hole is closer to the first connection hole than the central axis of the third connection hole.

13. The optical module according to claim 12, wherein, The optical receiving component further includes a first filter, a second filter, and a third filter; The first filter is located on the reflection optical path of the second reflector, the first filter is located in the fifth connection hole, the first filter is located between the second reflector and the first optical receiving component, and is connected to the first optical receiving component; The second filter is located on the reflection optical path of the first reflector, the second filter is located in the fourth connection hole, the second filter is located between the first reflector and the second optical receiving component, and is connected to the second optical receiving component; The third filter is located between the wavelength division component and the third optical receiving component, and the fourth filter component is located between the wavelength division component and the third reflector and is connected to the third reflector.

14. The optical module according to claim 13, wherein, The fourth connection hole includes a first sub-connection hole and a second sub-connection hole. One end of the first sub-connection hole is communicated with one end of the second sub-connection hole. The other end of the second sub-connection hole is communicated with the inner cavity of the first housing. The size of the second sub-connection hole is smaller than the size of the first sub-connection hole, and the first filter is located in the second sub-connection hole; The fifth connection hole includes a third sub-connection hole and a fourth sub-connection hole. One end of the third sub-connection hole is communicated with one end of the fourth sub-connection hole. The other end of the fourth sub-connection hole is communicated with the inner cavity of the first housing. The size of the fourth sub-connection hole is smaller than the size of the third sub-connection hole, and the second filter is located in the fourth sub-connection hole.

15. The optical module according to claim 1, wherein, The optical transmitting component further includes: A polarization component configured to adjust the polarization direction of the optical signal; the polarization component includes a first polarization component, a second polarization component, and a third polarization component. The first polarization component, the second polarization component, and the third polarization component each include a first polarizer, a Faraday rotator, a second polarizer, and a wave plate. The first polarizer, the Faraday rotator, the second polarizer, and the wave plate are arranged away from the laser component in sequence. The fourth-wavelength optical signal passes through the first polarizer, the Faraday rotator, the second polarizer, and the wave plate of the first polarization component in sequence and then emits horizontally polarized light. The sixth-wavelength optical signal passes through the first polarizer, the Faraday rotator, the second polarizer, and the wave plate of the third polarization component in sequence and then emits first vertically polarized light. The fifth-wavelength optical signal passes through the first polarizer, the Faraday rotator, the second polarizer, and the wave plate of the second polarization component in sequence and then emits second vertically polarized light; The multiplexing component is a polarization multiplexing component, configured to combine multiple polarized light beams into one beam; the polarization multiplexing component includes a first polarization multiplexing element, a second polarization multiplexing element, and a third polarization multiplexing element. The third polarization multiplexing element is configured to reflect the first vertically polarized light to the second polarization multiplexing element. The second polarization multiplexing element is configured to transmit the first vertically polarized light to the first polarization multiplexing element and also reflect the second vertically polarized light to the first polarization multiplexing element. The first polarization multiplexing element is configured to reflect the second vertically polarized light and the first vertically polarized light and also transmit the horizontally polarized light to achieve beam combination.

16. The optical module according to claim 15, wherein, The first polarizer, the Faraday rotator, the second polarizer, and the wave plate are connected in sequence to form an isolator; The optical axis of the wave plate of the first polarization component forms a first preset angle with the horizontal plane so that the first polarization component emits horizontally polarized light; the optical axis of the wave plate of the second polarization component forms a second preset angle with the horizontal plane so that the second polarization component emits vertically polarized light; the optical axis of the wave plate of the third polarization component forms a third preset angle with the horizontal plane so that the third polarization component emits vertically polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the second polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the second preset angle is the same as the third preset angle.

17. The optical module according to claim 15, wherein, The first polarizer, the Faraday rotator, and the second polarizer are connected in sequence to form an isolator, and the wave plate is located outside the isolator; The optical axis of the wave plate of the first polarization component forms a first preset angle with the horizontal plane so that the first polarization component emits horizontally polarized light; the optical axis of the wave plate of the second polarization component forms a second preset angle with the horizontal plane so that the second polarization component emits vertically polarized light; the optical axis of the wave plate of the third polarization component forms a third preset angle with the horizontal plane so that the third polarization component emits vertically polarized light; The first preset angle is different from the second preset angle; The polarization direction of the second polarizer of the second polarization component is the same as the polarization direction of the second polarizer of the third polarization component, so that the second preset angle is the same as the third preset angle.

18. The optical module according to claim 15, wherein, The first polarizer is a horizontal polarizer, and the second polarizer is a 45° polarizer; the first polarizer is a vertical polarizer, and the second polarizer is a 135° polarizer.

19. The optical module according to claim 15, wherein The light emitting component further includes a supporting member, the supporting member includes a first supporting surface and a second supporting surface. The first supporting surface is configured to support the third polarization multiplexing element, and the second supporting surface is configured to support the second polarization multiplexing element. The first supporting surface and the second supporting surface are arranged in parallel; The bearing member has a first through hole and a second through hole. One end of the first through hole and one end of the second through hole are both located on the first bearing surface. The other end of the first through hole is located on the surface of the bearing member facing the third polarization beam combining member. The other end of the second through hole is located on the second bearing surface. The first through hole and the second through hole are communicated with each other.

20. The optical module according to claim 19, wherein, The optical emission component further includes an emission housing. A third through hole is provided at the first end of the emission. The central axis of the third through hole coincides with the central axis of the first polarization beam combining member, so that the optical signal combined by the first polarization beam combining member is emitted through the first through hole. An emission pin is provided at the second end of the emission housing. One end of the emission pin is connected to the circuit board, and the other end of the emission pin extends into the emission housing and is wire-connected to the laser component in the emission housing.

21. The optical module according to claim 20, wherein, The emission housing includes a first emission side plate, a second emission side plate, a third emission side plate, and a fourth emission side plate. The first emission side plate, the second emission side plate, the third emission side plate, and the fourth emission side plate are connected end to end. The first emission side plate is provided with a third through hole. The third emission side plate includes a first sub-emission side plate, a second sub-emission side plate, and a third sub-reflection plate. The first sub-emission side plate, the second sub-emission side plate, and the third sub-reflection plate are in a stepped shape. The fourth emission side plate includes a fourth sub-emission side plate and a fifth sub-emission side plate. The fourth sub-emission side plate and the fifth sub-emission side plate are in a stepped shape. The first sub-emission side plate is connected to the fourth sub-emission side plate to limit the substrate, where the substrate supports the laser component.

22. The optical module according to claim 1, wherein, The optical module further includes: A circuit board, with a gold finger provided on the surface of one end. A DSP chip, which is provided on the circuit board and connected to the pins in the gold finger. The receiving signal input end of the DSP chip is connected to the optical receiving component to convert the initial received electrical signal converted by the optical receiving component into two received electrical signals, and send the two received electrical signals to the host computer through the pins in the gold finger. A second control port is provided on the DSP chip. A DEMUX is included in the DSP chip. The second control port is configured to receive a control signal, and the control signal is configured to reset the DEMUX. An MCU, which is provided on the circuit board. A first control port is provided on the MCU. The first control port is connected to the second control port, so that the MCU controls and connects to the DSP chip through the first control port to send a control signal through the first control port when the received electrical signal output by the DSP chip does not follow the preset rule.

23. The optical module according to claim 22, wherein, A first transmission channel and a second transmission channel are provided on the circuit board. The DSP chip includes a first output end and a second output end. One end of the first transmission channel is connected to the first output end, and the other end of the first transmission channel is connected to the gold finger. The DEMUX sends the first received optical signal to the host computer through the first transmission channel. One end of the second transmission channel is connected to the second output end, and the other end of the second transmission channel is connected to the gold finger. The DEMUX sends the second received optical signal to the host computer through the second transmission channel; The DEMUX decomposes the initial received electrical signal into the first received optical signal and the second received optical signal.

24. The optical module according to claim 22, wherein, The gold finger includes a first pin, and the MCU is connected to the first pin. The MCU determines whether to send a control signal to the DSP chip according to the level state of the first pin.

25. The optical module according to claim 22, wherein, The optical module further includes: A laser driver, which is arranged on the circuit board and electrically connected to the optical transmitting component. The laser driver drives the optical transmitting component to emit an optical signal according to the transmitted electrical signal; The DSP chip is connected to the laser driver. The DSP chip includes a MUX, and the MUX converts two initial transmitted electrical signals received from the host computer into one transmitted electrical signal and transmits the transmitted electrical signal to the laser driver.

26. The optical module according to claim 25, wherein, A third transmission channel and a fourth transmission channel are arranged on the circuit board, and the DSP chip includes a first input end and a second input end; One end of the third transmission channel is connected to the first input end, and the other end of the third transmission channel is connected to the gold finger. The MUX inputs the first initial transmitted electrical signal through the third transmission channel; One end of the fourth transmission channel is connected to the second input end, and the other end of the fourth transmission channel is connected to the gold finger. The MUX inputs the second initial transmitted electrical signal through the fourth transmission channel; The MUX synthesizes the first initial transmitted electrical signal and the second initial transmitted electrical signal into the transmitted electrical signal.

27. The optical module according to claim 25, wherein, The optical receiving component and the optical transmitting component are respectively located outside the other end of the circuit board. The optical receiving component is electrically connected to the circuit board through a flexible circuit board, and the optical transmitting component is electrically connected to the circuit board through a flexible circuit board.

28. The optical module according to claim 27, wherein, A first pad group is arranged on the front surface of the end of the circuit board away from the gold finger, and the first pad group is electrically connected to the optical receiving component through a second flexible circuit board; A second pad group is arranged on the back surface of the end of the circuit board away from the gold finger, and the second pad group is electrically connected to the optical transmitting component through a first flexible circuit board.

29. The optical module according to claim 25, wherein, The MCU and the DSP chip are located on the front surface of the circuit board, and the laser driver is arranged on the back surface of the circuit board.

30. An optical module, comprising: An optical receiving component, the first end of which is connected to an optical fiber adapter, and the second end of which is connected to an optical transmitting component. The light-emitting direction of the optical transmitting component faces the optical fiber adapter; The optical receiving component includes a first optical receiving component, a second optical receiving component and a third optical receiving component. The first optical receiving component and the second optical receiving component are located on one side of the optical receiving component, and the third optical receiving component is located on the other side of the optical receiving component; The optical receiving component further includes a wavelength division component. The first end of the wavelength division component is correspondingly arranged with the first end of the optical receiving component, and the second end of the wavelength division component is correspondingly arranged with the second end of the optical receiving component. The emitted optical signal emitted by the optical transmitting component is incident on the emitted light input point at the second end of the wavelength division component and is emitted from the received light input point at the first end of the wavelength division component. The received optical signal including the first wavelength, the second wavelength, and the third wavelength emitted by the fiber optic adapter is incident on the received light input point at the first end of the wavelength division component, is reflected by the emitted light input point at the second end of the wavelength division component, and then is divided into the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal and then emitted. The first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal are respectively incident on the corresponding optical receiving components. Among them, the first wavelength optical signal includes the received optical signal of the first wavelength, the second wavelength optical signal includes the received optical signal of the second wavelength, and the third wavelength optical signal includes the received optical signal of the third wavelength.

31. The optical module according to claim 30, wherein, The first end of the wavelength division component has a first light output point, the second end of the wavelength division component has a second light output point and a third light output point. The first wavelength optical signal is emitted from the second light output point and then is incident on the second optical receiving component. The third wavelength optical signal is emitted from the first light output point and then is incident on the first optical receiving component. The second wavelength optical signal is emitted from the third light output point and then is incident on the third optical receiving component.

32. The optical module according to claim 30, wherein The wavelength division component includes a substrate. The first end face of the substrate is correspondingly arranged with the first end of the optical receiving component, and the second end face of the substrate is correspondingly arranged with the second end of the optical receiving component. A first wave plate, a second wave plate, and a third wave plate are sequentially arranged on the first end face of the substrate. A fourth wave plate, a fifth wave plate, and a sixth wave plate are sequentially arranged on the second end face of the substrate. The first wave plate and the fourth wave plate are arranged opposite to each other, the second wave plate and the fifth wave plate are arranged opposite to each other, and the third wave plate and the sixth wave plate are arranged opposite to each other. The emitted optical signal emitted by the optical transmitting component is transmitted through the fourth wave plate and the first wave plate in sequence to the fiber optic adapter. The received optical signal emitted by the fiber optic adapter is transmitted through the first wave plate in sequence, reflected by the fourth wave plate and the second wave plate, reflected and transmitted by the fifth wave plate, reflected by the fifth wave plate and then reflected and transmitted by the third wave plate, and finally transmitted through the sixth wave plate after being reflected by the third wave plate, so that the first wavelength optical signal is emitted from the fifth wave plate, the third wavelength optical signal is emitted from the third wave plate, and the second wavelength optical signal is emitted from the sixth wave plate.

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