Information processing device and method for creating model data

Abstract

An information processing device according to the present invention creates model data on the basis of imaging data obtained as a result of a two-dimensional camera that has been fixed at a prescribed position and at a prescribed height on a stage capturing images of a plurality of components that are of the same type and have been placed at a plurality of positions on the stage.

Description

Information processing device and method for creating model data

[0001] The present invention relates to an information processing device or the like that creates model data for identifying a part on a stage.

[0002] The following patent document describes model data for identifying parts on a stage.

[0003] International Publication No. 2015 / 097904

[0004] An object of the present invention is to appropriately create model data for identifying parts on a stage.

[0005] In order to solve the above problems, this specification discloses an information processing device that creates model data based on image data captured by a two-dimensional camera fixedly arranged at a predetermined position at a predetermined height on a stage, of multiple parts of the same type placed at multiple positions on the stage.

[0006] This specification also discloses a method for creating model data for identifying a plurality of parts of the same type scattered on a stage, the method comprising: a part placing step of placing parts of the same type one by one in the same orientation at a plurality of different positions on the stage; and a part imaging step of simultaneously capturing images of the parts of the same type and with the same orientation placed at a plurality of different positions on the stage using a two-dimensional camera fixedly disposed at a predetermined position at a predetermined height on the stage; and determining part identification data as model data for identifying the plurality of parts of the same type scattered on the stage when the number of identifiable parts of the same type and with the same orientation captured at one time in the part imaging step exceeds a predetermined number.

[0007] According to the present disclosure, a two-dimensional camera fixedly installed at a predetermined position at a predetermined height on a stage captures images of multiple parts of the same type placed at multiple positions on the stage, and model data is created based on the captured image data, thereby making it possible to appropriately create model data for identifying parts on the stage.

[0008] 17 is a perspective view of a component mounter. FIG. 18 is a perspective view of a component mounting device of the component mounter. FIG. 19 is a perspective view of a bulk component supply device. FIG. 19 is a perspective view of a component supply unit. FIG. 19 is a see-through view of the component supply unit. FIG. 19 is a see-through view of the component supply unit. FIG. 19 is a perspective view of a component scattering device. FIG. 19 is a perspective view of a component scattering device. FIG. 19 is a perspective view of a component holding head. FIG. 19 is a view of a component receiving member with electronic circuit components stored therein. FIG. 19 is a block diagram of a control device of a component mounter. FIG. 19 is a view of lead components of the same shape scattered on a stage. FIG. 20 is a view showing model data used for pattern matching. FIG. 21 is a schematic view of a two-dimensional camera that images a plurality of lead components placed in different positions on a stage. FIG. 22 is a schematic view of a two-dimensional camera that images lead components illuminated with light from an LED light disposed on the side. FIG. 22 is a schematic view of a two-dimensional camera that images lead components illuminated with light from an LED light disposed on the side. FIG. 23 is a view showing lead components placed in the same orientation at five locations on a stage. FIG. 24 is a view showing lead components placed in an orientation different from that of FIG. 19 is a diagram showing lead components placed at five locations on the stage in orientations different from those in FIGS. 17 and 18. FIG. 19 is a diagram showing lead components placed at five locations on the stage in orientations different from those in FIGS. 17 to 19. FIG. 20 is a diagram showing 20 types of lead components for which pattern matching is performed when creating model data candidates. FIG. 21 is a diagram showing correlation values ​​when pattern matching is performed using model data candidates for lead components having an edge level of 50 and an orientation of 270° at the center of the stage. FIG. 22 is a diagram showing the average correlation values ​​when pattern matching is performed using 16 types of model data candidates. FIG. 21 is a diagram showing five types of lead components for which pattern matching is performed when creating first model data candidates for creating first model data. FIG. 22 is a diagram showing correlation values ​​when pattern matching is performed using first model data candidates for lead components having an edge level of 200 and an orientation of 180° at the bottom right of the stage. FIG. 23 is a diagram showing the average correlation values ​​when pattern matching is performed using 20 types of first model data candidates. FIG. 24 is a diagram showing two types of lead components for which pattern matching is performed when creating second model data candidates.10A and 10B are diagrams showing correlation values ​​when pattern matching is performed using candidates for second model data of a lead component whose edge level is 100 and whose posture is 270° at the lower right of the stage. 10B are diagrams showing average correlation values ​​when pattern matching is performed using eight types of candidates for second model data.

[0009] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings as modes for carrying out the present invention.

[0010] 1 shows a component mounter 10. The component mounter 10 is a device for performing the operation of mounting components on a circuit board 12. The component mounter 10 includes a device main body 20, a substrate transport and holding device 22, a component mounting device 24, imaging devices 26 and 28, a component supply device 30, a bulk component supply device 32, and a control device (see FIG. 11) 34. The circuit board 12 may be a circuit board or a substrate with a three-dimensional structure, and the circuit board may be a printed wiring board or a printed circuit board.

[0011] The device main body 20 is composed of a frame 40 and a beam 42 suspended from the frame 40. The substrate transport and holding device 22 is disposed in the center of the frame 40 in the front-to-rear direction and includes a transport device 50 and a clamping device 52. The transport device 50 transports the circuit board 12, and the clamping device 52 holds the circuit board 12. As a result, the substrate transport and holding device 22 transports the circuit board 12 and securely holds the circuit board 12 at a predetermined position. In the following description, the transport direction of the circuit board 12 is referred to as the X-direction, the horizontal direction perpendicular to that direction is referred to as the Y-direction, and the vertical direction is referred to as the Z-direction. In other words, the width direction of the component mounter 10 is the X-direction, and the front-to-rear direction is the Y-direction.

[0012] The component mounting device 24 is mounted on the beam 42 and includes two work heads 60, 62 and a work head moving device 64. Each work head 60, 62 has a suction nozzle 66 (see FIG. 2) that holds a component. The work head moving device 64 also includes an X-direction moving device 68, a Y-direction moving device 70, and a Z-direction moving device 72. The X-direction moving device 68 and the Y-direction moving device 70 move the two work heads 60, 62 together to any position on the frame 40. As shown in FIG. 2, each work head 60, 62 is detachably attached to a slider 74, 76, and the Z-direction moving device 72 moves the slider 74, 76 individually in the vertical direction. That is, the work heads 60, 62 are moved individually in the vertical direction by the Z-direction moving device 72.

[0013] The imaging device 26 is attached to a slider 74 facing downward, and is movable in the X, Y, and Z directions together with the work head 60. This allows the imaging device 26 to capture an image of any position on the frame 40. As shown in Figure 1, the imaging device 28 is disposed on the frame 40 between the substrate material conveying and holding device 22 and the component supply device 30 facing upward. This allows the imaging device 28 to capture an image of a component held by the suction nozzle 66 of the work heads 60, 62.

[0014] The component supply device 30 is disposed at one end of the frame 40 in the front-to-rear direction. The component supply device 30 has a tray-type component supply device 78 and a feeder-type component supply device (not shown). The tray-type component supply device 78 is a device that supplies components placed on a tray. The feeder-type component supply device is a device that supplies components using a tape feeder (not shown) or a stick feeder (not shown).

[0015] The bulk component supply device 32 is disposed at the other end of the frame 40 in the front-to-rear direction. The bulk component supply device 32 aligns a plurality of components scattered loosely and supplies the aligned components. In other words, it aligns a plurality of components in any orientation into a predetermined orientation and supplies the components in the predetermined orientation. The configuration of the component supply device 32 is described in detail below. Components supplied by the component supply device 30 and the bulk component supply device 32 include electronic circuit components, solar cell components, and power module components. Electronic circuit components include components with leads and components without leads.

[0016] As shown in FIG. 3, the bulk component supply device 32 includes a main body 80, a component supply unit 82, an imaging device 84, and a component delivery device 86.

[0017] The component supply unit 82 includes a component supply device 88, a component scattering device (see FIG. 4) 90, and a component returning device (see FIG. 4) 92, and these component supply devices 88, component scattering device 90, and component returning device 92 are integrally configured. The component supply units 82 are detachably attached to a base 96 of the main body 80, and in the bulk component supply device 32, five component supply units 82 are arranged in a row in the X direction.

[0018] The component supply device 88 has a generally rectangular box shape and is disposed so as to extend in the Y direction as shown in Figures 4 and 5. The Y direction is described as the front-to-rear direction of the component supply device 88, and in the component supply unit 82, the direction toward the side where the component returning device 92 is disposed is described as the front, and the direction toward the side where the component supply device 88 is disposed is described as the rear.

[0019] The component supply device 88 has openings on the top and front, with the opening on the top serving as a component inlet 97 and the opening on the front serving as a component outlet 98. The component supply device 88 has an inclined plate 104 disposed below the inlet 97. The inclined plate 104 is disposed so as to slope downward from the rear end face of the component supply device 88 toward the center.

[0020] 5, a conveyor device 106 is disposed on the front side of the inclined plate 104. The conveyor device 106 is disposed so as to slope upward from the front end of the inclined plate 104 toward the front of the component supply device 88. The conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 5. In other words, the conveying direction of the conveyor device 106 is diagonally upward from the front end of the inclined plate 104 toward the front.

[0021] An inclined plate 126 is disposed below the front end of the conveyor device 106. The inclined plate 126 is disposed from the front end face of the component supply device 88 toward the bottom of the conveyor device 106, with its rear end slanted diagonally downward. Furthermore, an inclined plate 128 is disposed below the inclined plate 126. The inclined plate 128 is inclined from below the center of the conveyor device 106 toward the discharge port 98 of the component supply device 88 so that its front end is positioned downward.

[0022] 4, a pair of side frames 130 are attached to the base 96. The pair of side frames 130 are erected facing each other and parallel to each other, extending in the Y direction. The distance between the pair of side frames 130 is slightly larger than the width dimension of the component supplier 88, and the component supplier 88 is detachably mounted between the pair of side frames 130.

[0023] The component scattering device 90 includes a component support member 150 and a component support member moving device 152. The component support member 150 is composed of a stage 156 and a pair of side walls 158. The stage 156 is generally in the shape of a longitudinal plate and is disposed so as to extend forward from below the component supply device 88, which is mounted between a pair of side frames 130. The upper surface of the stage 156 is generally horizontal and, as shown in FIG. 5, is disposed with a slight clearance from the front end of the inclined plate 128 of the component supply device 88. The pair of side walls 158 are fixed in an upright position on both longitudinal sides of the stage 156, as shown in FIG. 4, and the upper ends of the side walls 158 extend above the upper surface of the stage 156.

[0024] The component support moving device 152 slides the component support 150 in the Y direction by operating an air cylinder (see FIG. 11) 166. At this time, the component support 150 moves between a stored state (see FIG. 6) in which it is stored below the component feeder 88 and an exposed state (see FIG. 5) in which it is exposed from below the component feeder 88.

[0025] As shown in FIG. 7 , the component returning device 92 includes an object storage container 180 and a container swinging device 181. The object storage container 180 is generally box-shaped with an arc-shaped bottom. The object storage container 180 is swingably held at the front end of the stage 156 of the component support member 150 and swings when the container swinging device 181 is activated. In this state, the object storage container 180 swings between a storage position (see FIG. 7 ) in which the opening faces upward and a return position (see FIG. 8 ) in which the opening faces the upper surface of the stage 156 of the component support member 150.

[0026] As shown in FIG. 3 , the imaging device 84 includes a two-dimensional camera 290, a camera moving device 292, and an LED light (see FIG. 11 ) 294. The camera moving device 292 includes a guide rail 296 and a slider 298. The guide rail 296 is fixed to the main body 80 above the component supply device 88 so as to extend in the width direction (X direction) of the bulk component supply device 32. The slider 298 is slidably attached to the guide rail 296 and can be slid to any position by the operation of an electromagnetic motor (see FIG. 11 ) 299. The two-dimensional camera 290 is attached to the slider 298 while facing downward. Note that the two-dimensional camera 290 is not a three-dimensional camera capable of detecting height information, depth information, etc. of a three-dimensional object, nor is it equipped with a three-dimensional image processing device. It is a camera that captures two-dimensional images that cannot detect height information, depth information, etc. of a three-dimensional object. In other words, the two-dimensional camera 290 is a camera that captures two-dimensional images of three-dimensional components projected onto the XY plane. Furthermore, the two-dimensional camera 290 does not use a telecentric lens in which the aperture stop is at the focal position of the lens, but rather uses a general lens, i.e., a lens with a non-zero angle of view. Furthermore, the LED light 294 is the light source for the two-dimensional camera 290, and is disposed on the side of the two-dimensional camera 290, on the part delivery device 86 side. In other words, the two-dimensional camera 290 captures a two-dimensional image of an object illuminated by the LED light 294 from the side.

[0027] As shown in FIG. 3, the component delivery device 86 includes a component holding head moving device 300, a component holding head 302, and two shuttle devices 304.

[0028] The component holder head moving device 300 includes an X-direction moving device 310, a Y-direction moving device 312, and a Z-direction moving device 314. The Y-direction moving device 312 has a Y-slider 316 arranged above the component supply unit 82 so as to extend in the X direction. The Y-slider 316 is moved to any position in the Y direction by driving an electromagnetic motor (see FIG. 11) 319. The X-direction moving device 310 has an X-slider 320 arranged on the side of the Y-slider 316. The X-slider 320 is moved to any position in the X direction by driving an electromagnetic motor (see FIG. 11) 321. The Z-direction moving device 314 has a Z-slider 322 arranged on the side of the X-slider 320. The Z-slider 322 is moved to any position in the Z direction by driving an electromagnetic motor (see FIG. 11) 323.

[0029] As shown in FIG. 9 , the component holding head 302 includes a head main body 330, a suction nozzle 332, a nozzle swiveling device 334, and a nozzle rotating device 335. The head main body 330 is integrally formed with the Z-slider 322. The suction nozzle 332 holds a component and is detachably attached to the lower end of a holder 340. The holder 340 is bendable about a support shaft 344, and the nozzle swiveling device 334 bends the holder 340 upward by 90 degrees. This causes the suction nozzle 332 attached to the lower end of the holder 340 to rotate 90 degrees and reach the swiveled position. In other words, the suction nozzle 332 rotates between a non-swiveled position and a swiveled position by operating the nozzle swiveling device 334. Of course, it is also possible to position and stop the suction nozzle 332 at an angle between the non-swiveled position and the swiveled position. The nozzle swiveling device 335 also rotates the suction nozzle 332 around its axis.

[0030] 3, each of the two shuttle devices 304 includes a component carrier 388 and a component carrier moving device 390, and is fixed to the main body 80, side-by-side with the component supply unit 82 in the horizontal direction. Five component receiving members 392 are attached to the component carrier 388, lined up in a horizontal direction, and components are placed on each of the component receiving members 392.

[0031] The bulk component supply device 32 is capable of supplying a variety of components, and various component receiving members 392 are prepared according to the shape of the components. Here, as an example of an electronic circuit component supplied by the bulk component supply device 32, a component receiving member 392 corresponding to a lead component 410 having leads, as shown in Figure 10, will be described. The lead component 410 is composed of a block-shaped component body 412 and two leads 414 protruding from the bottom surface of the component body 412.

[0032] The component receiving member 392 is also formed with a component receiving recess 416 shaped to accommodate the lead component 410. The component receiving recess 416 is a stepped recess, and is composed of a main body receiving recess 418 that opens onto the top surface of the component receiving member 392, and a lead receiving recess 420 that opens onto the bottom surface of the main body receiving recess 418. The lead component 410 is inserted into the component receiving recess 416 with the leads 414 facing downward. As a result, the leads 414 are inserted into the lead receiving recess 420, and the lead component 410 is placed inside the component receiving recess 416 with the component body 412 inserted into the main body receiving recess 418.

[0033] 3, the component carrier moving device 390 is a plate-shaped longitudinal member disposed in front of the component supply unit 82 so as to extend in the front-rear direction. A component carrier 388 is disposed on the upper surface of the component carrier moving device 390 so as to be slidable in the front-rear direction, and is driven by an electromagnetic motor 430 (see FIG. 11) to slide to any position in the front-rear direction. When the component carrier 388 slides toward the component supply unit 82, it slides to a component receiving position located within the range of movement of the component holding head 302 by the component holding head moving device 300. On the other hand, when the component carrier 388 slides away from the component supply unit 82, it slides to a component supply position located within the range of movement of the work heads 60, 62 by the work head moving device 64.

[0034] 11 , the control device 34 includes an overall control device 450, a plurality of individual control devices (only one of which is shown in the figure), and an image processing device 454. The overall control device 450 is configured mainly by a computer and is connected to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32. As a result, the overall control device 450 controls the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 in an overall manner. The plurality of individual control devices 452 are also configured mainly by a computer and are provided corresponding to the substrate conveying and holding device 22, the component mounting device 24, the imaging device 26, the imaging device 28, the component supply device 30, and the bulk component supply device 32 (only the individual control device 452 corresponding to the bulk component supply device 32 is shown in the figure).

[0035] The individual control device 452 of the bulk component supply device 32 is connected to the imaging device 84, the component scattering device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. As a result, the individual control device 452 of the bulk component supply device 32 controls the imaging device 84, the component scattering device 90, the component returning device 92, the component holding head moving device 300, the component holding head 302, and the shuttle device 304. The image processing device 454 is also connected to the two-dimensional camera 290 and processes the image data captured by the two-dimensional camera 290. The image processing device 454 is also connected to the individual control device 452 of the bulk component supply device 32. As a result, the individual control device 452 of the bulk component supply device 32 acquires the image data captured by the two-dimensional camera 290.

[0036] The bulk component supply device 32 also has a storage device 458. The storage device 458 is connected to the individual control device 452, and stores various information in accordance with commands from the individual control device 452.

[0037] The component mounter 10, with the above-described configuration, performs a component mounting operation on the circuit board 12 held by the substrate conveying and holding device 22. Specifically, the circuit board 12 is conveyed to the work position and fixedly held at that position by the clamping device 52. Next, the imaging device 26 moves above the circuit board 12 and captures an image of the circuit board 12. This provides information regarding an error in the holding position of the circuit board 12. Furthermore, the component supply device 30 or the bulk component supply device 32 supplies components at a predetermined supply position. Note that the supply of components by the bulk component supply device 32 will be described in detail later. Then, one of the work heads 60, 62 moves above the component supply position and holds the component with the suction nozzle 66. Next, the work head 60, 62 holding the component moves above the imaging device 28, and the imaging device 28 captures an image of the component held by the suction nozzle 66. This provides information regarding an error in the holding position of the component. Then, the work heads 60, 62 holding the components move above the circuit board 12, and the components they are holding are mounted on the circuit board 12 after correcting any errors in the holding position of the circuit board 12, errors in the holding position of the components, etc.

[0038] Next, we will explain the supply of components by the bulk component supply device 32. In the bulk component supply device 32, a worker inserts lead components 410 into the inlet 97 of the component supply device 88. The component supply unit 82 and the component delivery device 86 then operate to supply the inserted lead components 410 placed on the component receiving members 392 of the component carrier 388.

[0039] Specifically, the operator loads a plurality of lead components 410 of the same type, i.e., a plurality of lead components 410 of the same shape, through the loading port 97 on the top surface of the component supply device 88. At this time, the component support member 150 has been moved to a position below the component supply device 88 by the operation of the component support member moving device 152, and is in a stored state (see FIG. 6). Note that when the component support member 150 is stored, the component storage container 180 disposed at the front end of the component support member 150 is positioned in front of the component supply device 88, with the opening of the component storage container 180 facing upward (the storage position).

[0040] The lead components 410 fed through the inlet 97 of the component supply device 88 fall onto the inclined plate 104 of the component supply device 88 and roll down to the lower end of the front side of the inclined plate 104. At this time, the lead components 410 that have rolled down to the lower end of the front side of the inclined plate 104 are piled up between the lower end of the front side of the inclined plate 104 and the lower end of the rear side of the conveyor device 106. Then, the conveyor belt 112 of the conveyor device 106 rotates counterclockwise in FIG. 6. As a result, the lead components 410 piled up between the inclined plate 104 and the conveyor belt 112 are transported diagonally upward by the conveyor belt 112.

[0041] Then, the lead components 410 transported by the conveyor belt 112 drop from the upper front end of the conveyor device 106 onto the inclined plate 126. The lead components 410 that have fallen onto the inclined plate 126 roll backward along the inclined plate 126 and drop onto the inclined plate 128. The lead components 410 that have fallen onto the inclined plate 128 roll forward and are discharged from the discharge port 98 on the front side of the component supply device 88.

[0042] As a result, the lead components 410 discharged from the discharge port 98 of the component supply device 88 are accommodated inside the component storage container 180. Then, when a predetermined amount of lead components 410 has been discharged from the component supply device 88, that is, when the conveyor device 106 has operated a certain amount, the conveyor device 106 stops. Next, the component support member 150 is moved forward from the stored state by operation of the component support member moving device 152.

[0043] Then, when the component support member 150 moves forward a predetermined distance from the stored state, the container swinging device 181 of the component returning device 92 is activated, swinging the component housing container 180. As a result, the orientation of the component housing container 180 changes vigorously from an orientation in which the opening faces upward (storage orientation) to an orientation in which the opening faces the stage 156 (return orientation). At this time, the lead components 410 accommodated in the component housing container 180 are expelled vigorously toward the stage 156. As a result, lead components 410 of the same shape are scattered from the component housing container 180 onto the stage 156, as shown in FIG. 12 .

[0044] The lead components 410 are scattered on the stage 156 in four different orientations. Specifically, in a first orientation, the lead components 410 are scattered with the extending surfaces of the leads 414 facing sideways, with two of the leads 414 aligned generally horizontally. In a second orientation, the lead components 410 are scattered with the extending surfaces of the leads 414 facing sideways, with two of the leads 414 aligned generally vertically. In a third orientation, the lead components 410 are scattered with the extending surfaces of the leads 414 facing upward. In a fourth orientation, the lead components 410 are scattered with two or more lead components 410 overlapping each other. The four positions in which the lead components 410 are scattered will be referred to as lead components 410a in a first position, lead components 410b in a second position, lead components 410c in a third position, and lead components 410d in a fourth position.

[0045] When the lead components 410 are scattered on the stage 156 as described above, the two-dimensional camera 290 of the imaging device 84 is moved above the component support member 150 by the operation of the camera moving device 292. The two-dimensional camera 290 then captures images of the lead components 410 of the same shape scattered on the stage 156. Because the viewing angle, i.e., the imaging range, of the two-dimensional camera 290 is wider than that of the stage 156, the two-dimensional camera 290 captures an image of the entire stage 156, i.e., all of the lead components 410 scattered on the stage 156, all at once. In other words, the two-dimensional camera 290 captures an image of all of the lead components 410 scattered on the stage 156 all at once, with the image captured within the imaging range. When the two-dimensional camera 290 captures an image of the lead components 410 on the stage 156, the LED light 294 irradiates light onto the top surface of the stage 156. Then, based on the image data captured by the two-dimensional camera 290, the individual control device 452 identifies the lead component to be picked up by a pattern matching method.

[0046] Specifically, the individual control device 452 identifies the outline of the lead component 410 based on the image data of the lead component 410 captured by the two-dimensional camera 290, and calculates the shape of the upper surface of the lead component 410, that is, the shape of the lead component 410 as viewed from above. Meanwhile, the storage device 458 stores model data corresponding to the outline of the lead component 410a in the first orientation, as shown in Fig. 13 .

[0047] Then, the individual control device 452 calculates the shape of the top surface of the lead component 410 based on the image data of the lead component 410 captured by the two-dimensional camera 290, and determines whether or not the calculated shape of the top surface of the lead component 410 matches the model data stored in the storage device 458. Then, if the calculated shape of the top surface of the lead component 410 matches the model data, the individual control device 452 sets the lead component 410 whose shape matches the top surface of the lead component 410 as the component to be picked up.

[0048] That is, lead component 410a in the first position is set as the component to be picked up, while lead component 410b in the second position, lead component 410c in the third position, and lead component 410d in the fourth position are not set as components to be picked up. This is because the area of ​​the top surface of lead component 410b in the second position is small, making it impossible for suction nozzle 332 to properly hold lead component 410b. Also, lead component 410c in the third position has leads 414 on its top surface, which get in the way and make it impossible for suction nozzle 332 to properly hold lead component 410c. Also, lead component 410d in the fourth position cannot be properly held by suction nozzle 332 because the top surface of lead component 410d is not horizontal, for example.

[0049] The individual control device 452 then calculates the position information of the lead component 410 that has been set as the component to be picked up based on the image data. Next, based on the calculated position information of the component to be picked up, the component holding head 302 is moved above the component to be picked up by the component holding head moving device 300, and the suction nozzle 332 sucks and holds the component to be picked up. Note that when the suction nozzle 332 sucks and holds the component to be picked up, the suction nozzle 332 is located in a non-rotating position.

[0050] Next, after the suction nozzle 332 holds the lead component 410, which is the component to be picked up, the component holding head 302 moves above the component carrier 388. At this time, the component carrier 388 has been moved to the component receiving position by the operation of the component carrier moving device 390. Also, when the component holding head 302 moves above the component carrier 388, the suction nozzle 332 pivots to the pivot position. Note that the suction nozzle 332 pivots by the operation of the nozzle rotation device 335 so that the leads 414 of the lead component 410 held by the suction nozzle 332 in the pivot position face vertically downward.

[0051] When the component holding head 302 moves above the component carrier 388, the component holding head 302 descends and inserts the lead component 410, with its leads 414 facing vertically downward, into the component receiving recess 416 of the component receiving member 392. As a result, the lead component 410 is placed on the component receiving member 392 with its leads 414 facing vertically downward, as shown in FIG.

[0052] Then, when the lead components 410 are placed on the component receiving member 392, the component carrier 388 is moved to the component supply position by operation of the component carrier moving device 390. Because the component supply position is located within the movement range of the work heads 60, 62, the bulk component supply device 32 supplies the lead components 410 to the component mounter 10 at this position. In this way, in the bulk component supply device 32, the individual control device 452 identifies a component to be picked up from among the multiple lead components 410 scattered on the stage 156 based on one piece of model data, and the component holding head 302 holds the lead component 410 identified as the component to be picked up and places it on the component receiving member 392, thereby supplying the lead component 410.

[0053] For this reason, it is necessary to appropriately identify, based on a single piece of model data, the component to be picked up from among the multiple lead components 410 scattered on the stage 156. However, in the bulk component supply device 32, the component to be picked up is identified based on the image data captured by the two-dimensional camera 290, and therefore there is a risk that the component to be picked up may not be appropriately identified due to the parallax of the two-dimensional camera 290.

[0054] 14, two-dimensional camera 290 is fixedly disposed at a predetermined position at a predetermined height above stage 156, for example, at a position above the center of stage 156. Two-dimensional camera 290 is moved to any position in the X direction at the predetermined height by camera moving device 292, but when imaging a plurality of lead components scattered on the stage, it stops above the center of stage 156 to be imaged, and therefore is fixedly positioned at a position above the center of stage 156 at the predetermined height above stage 156. Two-dimensional camera 290 then images a plurality of lead components 410 scattered at multiple positions on stage 156 all at once. In this case, for example, if two-dimensional camera 290 simultaneously captures images of lead component 410A and lead component 410B, the image of lead component 410A captures surface 460 from which lead 414 extends, while the image of lead component 410B captures surface 462 opposite surface 460 from which lead 414 extends. Therefore, the images of lead component 410A and lead component 410B have different shapes. Thus, when two-dimensional camera 290 positioned at a fixed location captures images of multiple objects at different positions, the images of the objects have different shapes. However, the differences between the images of the objects at different positions are not large but relatively small. However, even if the differences are relatively small, there is a risk that the component to be picked up cannot be properly identified from among the multiple lead components 410 scattered at different positions on stage 156.

[0055] Furthermore, the LED light 294, which is used as illumination when the two-dimensional camera 290 captures an image of the object, emits light from the side of the two-dimensional camera 290 toward the stage 156, and the light reflected from the light emitted by the LED light 294 differs depending on the orientation of the lead components 410. Specifically, for example, as shown in FIG. 15 , when the two-dimensional camera 290 captures lead components 410C scattered on the stage 156 with the leads 414 facing away from the LED light 294, the two-dimensional camera 290 captures reflected light 470, which is light emitted by the LED light 294 and reflected by the lead components 410C. On the other hand, for example, as shown in FIG. 16 , when the two-dimensional camera 290 captures lead components 410D scattered on the stage 156 with the leads 414 facing the LED light 294, the two-dimensional camera 290 captures reflected light 480, which is light emitted by the LED light 294 and reflected by the lead components 410D. As described above, the reflected light 470 reflected by lead component 410C is different from the reflected light 480 reflected by lead component 410D, and therefore the image captured of reflected light 470 reflected by lead component 410C and the image captured of reflected light 480 reflected by lead component 410D will have different shapes. Thus, when imaging objects with different orientations using light irradiated from the side as a light source, the images captured of the objects will have different shapes. However, the differences between the images captured of the objects with different orientations are not large, but relatively small. However, even if the differences are relatively small, there is a risk that the component to be picked up will not be properly identified from among the multiple lead components 410 scattered in different orientations on stage 156.

[0056] One possible solution is to lower the criteria for identifying components to be picked up by pattern matching from among the multiple lead components 410 scattered on the stage 156. Specifically, in pattern matching, the individual control device 452 identifies the outline of the lead component 410 from the image data of the lead component 410 captured by the two-dimensional camera 290 and calculates a correlation value between the outline of the lead component 410 and the outline of the model data. The correlation value is the rate of match between the outline of the lead component 410 and the outline of the model data. When the outline of the lead component 410 and the outline of the model data match perfectly, the correlation value is 100. When the outline of the lead component 410 and the outline of the model data do not match at all, the correlation value is 0. In other words, the higher the correlation value, the more similar the outline of the lead component 410 and the outline of the model data are, and the lower the correlation value, the less similar the outline of the lead component 410 and the outline of the model data are. Therefore, for example, if the correlation value between the outline of the lead component 410 to be determined as a target for pickup and the outline of the model data is 90 or greater, the individual control device 452 identifies the lead component 410 as a target for pickup because they are very similar. However, as described above, the differences between images of multiple imaged objects at different positions are relatively small, and the differences between images of multiple imaged objects at different postures are also relatively small. Therefore, for example, by lowering the correlation value threshold, it is possible to identify a target for pickup while allowing for relatively small differences. Specifically, for example, the individual control device 452 can identify a lead component 410 with a correlation value of 70 or greater as a target for pickup. However, if the correlation value threshold is lowered and pattern matching is performed, there is a risk that a lead component 410 to be held that is slightly tilted and therefore cannot be held by the suction nozzle 332 will be identified as a target for pickup. Therefore, it is not particularly desirable to perform pattern matching of components with a low correlation value threshold.

[0057] To address this issue, the component mounter 10 creates one piece of model data based on image data of multiple lead components 410 placed in the same first orientation at multiple positions on the stage 156 and image data of multiple lead components 410 placed in an orientation different from the first orientation at multiple positions on the stage 156. Specifically, as shown in FIG. 17 , a worker places five lead components 410 in the same orientation at five locations on the stage 156 (stage center, lower right, lower left, upper right, and upper left). At this time, the worker places the five lead components 410 on the stage in the same orientation, with the surfaces from which the leads 414 of the lead components 410 extend facing the same direction. In other words, the worker places the five lead components 410 on the stage in the same orientation, with the leads 414 of the lead components 410 extending in the same direction. Note that in FIG. 17 , the direction in which the leads 414 of the lead components 410 extend is set to 0°. Then, the two-dimensional camera 290 simultaneously captures images of the five lead components 410 that are placed on the stage with their leads 414 extending at 0°.

[0058] 18 , an operator places five lead components 410 at five locations on stage 156 (stage center, lower right, lower left, upper right, and upper left) with the leads 414 extending in a direction rotated 90° counterclockwise from 0°. Note that the direction in which the leads 414 extend is rotated 90° counterclockwise from 0° is defined as 90°. Then, two-dimensional camera 290 simultaneously captures images of the five lead components 410 placed on stage 156 with the leads 414 extending at 90°.

[0059] 19 , an operator places five lead components 410 at five locations on stage 156 (stage center, lower right, lower left, upper right, and upper left) with the leads 414 extending in a direction rotated 180° counterclockwise from 0°. Note that the direction in which the leads 414 extend is defined as 180° when the direction is rotated 180° counterclockwise from 0°. Then, two-dimensional camera 290 simultaneously captures images of the five lead components 410 placed on stage 156 with the leads 414 extending at 180°.

[0060] 20 , an operator places five lead components 410 at five locations on stage 156 (stage center, lower right, lower left, upper right, and upper left) with the leads 414 extending in a direction rotated 270° counterclockwise from 0°. Note that the direction in which the leads 414 extend is defined as 270° when rotated 270° counterclockwise from 0°. Then, two-dimensional camera 290 simultaneously captures images of the five lead components 410 placed on stage 156 with the leads 414 extending at 270°.

[0061] Hereinafter, the lead component 410 placed on the stage at the center of the stage 156 in Fig. 17 with the leads 414 extending at a 0° angle will be referred to as a lead component with a 0° angle at the center of the stage. Also, the lead component 410 placed on the stage at the lower right of the stage 156 in Fig. 18 with the leads 414 extending at a 90° angle will be referred to as a lead component with a 90° angle at the lower right of the stage. Also, for example, the lead component 410 placed on the stage at the lower left of the stage 156 in Fig. 19 with the leads 414 extending at a 180° angle will be referred to as a lead component with a 180° angle at the lower left of the stage. Also, the lead component 410 placed on the stage at the upper right of the stage 156 in Fig. 20 with the leads 414 extending at a 270° angle will be referred to as a lead component with a 270° angle at the upper right of the stage.

[0062] In this way, when two-dimensional camera 290 captures images of a plurality of lead components in the same orientation placed on stage 156 shown in Figures 17 to 20, imaging data of 20 types of lead components 410 is created as shown in Figure 21. The imaging data of these 20 types of lead components 410 is imaging data of lead components 410 that differ in at least one of the orientation of lead components 410 and the placement position of lead components 410.

[0063] The individual control device 452 also generates model data candidates based on the image data of a lead component whose orientation is 0° at the center of the stage, a lead component whose orientation is 90° at the center of the stage, a lead component whose orientation is 180° at the center of the stage, and a lead component whose orientation is 270° at the center of the stage. In this case, the individual control device 452 generates four types of model data candidates with edge levels of 50, 100, 200, and 300. Specifically, since the model data of the lead components is data corresponding to the outline of the lead components, when the individual control device 452 generates the model data, it identifies the outline of the lead components based on the image data of the lead components. In this case, the individual control device 452 identifies the boundary line between the stage 156 and the lead components as the outline of the lead components. In this case, the individual control device 452 identifies the boundary line between the stage 156 and the lead components as the outline of the lead components at locations where the difference in brightness between adjacent pixels in the image data of the lead components is equal to or greater than the edge level. For example, if the edge level is 50, the individual control device 452 identifies, as the outline of the lead component, any location in the imaging data of the lead component where the difference in brightness between adjacent pixels is 50 or more. If the edge level is 100, the individual control device 452 identifies, as the outline of the lead component, any location in the imaging data of the lead component where the difference in brightness between adjacent pixels is 100 or more. If the edge level is 200, the individual control device 452 identifies, as the outline of the lead component, any location in the imaging data of the lead component where the difference in brightness between adjacent pixels is 200 or more. If the edge level is 300, the individual control device 452 identifies, as the outline of the lead component, any location in the imaging data of the lead component where the difference in brightness between adjacent pixels is 300 or more. The individual control device 452 then creates the identified outline of the lead component as a candidate for model data.

[0064] In this way, the individual control device 452 generates model data candidates with edge levels of 50, 100, 200, and 300 for each of the four types of lead component orientations based on the imaging data of a lead component with an orientation of 0° at the center of the stage, a lead component with an orientation of 90° at the center of the stage, a lead component with an orientation of 180° at the center of the stage, and a lead component with an orientation of 270° at the center of the stage. In other words, the individual control device 452 generates 16 (= 4 × 4) types of model data candidates. These 16 types of model data candidates are component identification data used when performing pattern matching. The individual control device 452 performs pattern matching with each of the 20 types of lead components 410 shown in FIG. 21 based on each model data candidate.

[0065] Specifically, for example, the individual control device 452 performs pattern matching between a candidate model data for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage and each of the 20 types of lead components 410 shown in Fig. 21. As a result, as shown in Fig. 22, the individual control device 452 calculates that the correlation value between the candidate model data for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage and the imaging data for a lead component having an orientation of 0° at the center of the stage is 96.8837. The individual control device 452 also calculates that the correlation value between the candidate model data for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage and the imaging data for a lead component having an orientation of 90° at the center of the stage is 61.969. Then, the individual control device 452 performs pattern matching between the candidate model data for a lead component having an edge level of 50 and an attitude of 270° at the center of the stage and each of the 20 types of lead components 410 shown in Fig. 21, and calculates the average of the correlation values ​​between the candidate model data and the 20 types of lead components 410. As a result, as shown in Fig. 22, the average of the calculated correlation values ​​is 90.99298.

[0066] The individual control device 452 also performs pattern matching between each of the model data candidates for lead components having an edge level other than 50 and an attitude of 270° at the center of the stage and each of the 20 types of lead components 410 shown in Fig. 21, and calculates the average of the correlation values ​​between each of the model data candidates and each of the 20 types of lead components 410. The individual control device 452 also performs pattern matching between each of the model data candidates for lead components having an attitude of 270° at each edge level and at the center of the stage and each of the 20 types of lead components 410 shown in Fig. 21, and calculates the average of the correlation values ​​of the 20 types of lead components 410.

[0067] Figure 23 shows the average correlation values ​​when pattern matching was performed between each of the 16 types of model data candidates and 20 types of lead components 410. As can be seen from this figure, the correlation value when pattern matching was performed with each of the 20 types of lead components 410 using model data candidates for lead components with an edge level of 50 and an orientation of 270° at the center of the stage was 90.99298, the highest value of all correlation values. In other words, when pattern matching was performed using model data candidates for lead components with an edge level of 50 and an orientation of 270° at the center of the stage, the probability of recognizing the outlines of the 20 types of lead components 410 shown in Figure 21 was the highest. Therefore, the model data candidate for lead components with an edge level of 50 and an orientation of 270° at the center of the stage is determined as model data and stored in storage device 458.

[0068] 22 , when pattern matching is performed between a candidate model data for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage and each of the 20 types of lead components 410, including a lead component having an orientation of 90° at the center of the stage, a lead component having an orientation of 180° at the bottom right of the stage, a lead component having an orientation of 270° at the bottom right of the stage, a lead component having an orientation of 90° at the bottom left of the stage, and a lead component having an orientation of 90° at the top left of the stage, the correlation value is less than 90. On the other hand, the correlation value with the remaining 15 types of lead components is 90 or greater. Therefore, when pattern matching is performed using a candidate model data for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage, the outlines of the 15 types of lead components out of the 20 types of lead components 410 can be properly recognized, but the outlines of the 5 types of lead components may not be properly recognized. Therefore, the individual control device 452 creates additional candidates for the first model data that can appropriately recognize the outlines of the above-mentioned five types of lead components.

[0069] Specifically, the individual control device 452 creates additional first model data candidates with edge levels of 50, 100, 200, and 300 based on the imaging data for each of the five types of lead components that may be unrecognizable. In other words, the individual control device 452 creates 20 (= 5 × 4) types of additional first model data candidates. These 20 types of additional first model data candidates are data that serve as model data candidates used when performing pattern matching, and are data for component identification. The individual control device 452 then performs pattern matching between each of the 20 types of additional first model data candidates and each of the five types of lead components 410 shown in FIG. 24 .

[0070] Specifically, for example, the individual control device 452 performs pattern matching between an additionally created candidate for first model data of a lead component having an edge level of 200 and an orientation of 180° at the lower right of the stage and each of the five types of lead components 410 shown in Fig. 24. As a result, as shown in Fig. 25, the individual control device 452 calculates that the correlation value between the additionally created candidate for first model data of a lead component having an edge level of 200 and an orientation of 180° at the lower right of the stage and the imaging data of a lead component having an orientation of 90° at the center of the stage is 90. The individual control device 452 also calculates that the correlation value between the additionally created candidate for first model data and the imaging data of a lead component having an orientation of 180° at the lower right of the stage is 100. In this way, the individual control device 452 performs pattern matching between the additionally created candidate first model data of a lead part having an edge level of 200 and an attitude of 180° at the lower right of the stage and each of the five types of lead parts 410 that may not be recognized, as shown in Fig. 24, and calculates the average of their correlation values. As shown in Fig. 25, the average of the correlation values ​​calculated by the individual control device 452 is 80.

[0071] In this way, the individual control device 452 performs pattern matching between each of the 20 additionally created first model data candidates, which are model data candidates, and each of the five types of lead components 410 shown in FIG. 24 that may be unrecognizable, and calculates the average correlation value. FIG. 26 shows the results of the individual control device 452 calculating the average of each correlation value. As can be seen from this figure, the correlation value obtained when pattern matching was performed using the first model data candidate of a lead component having an edge level of 200 and a posture of 180° at the lower right of the stage, among the 20 additionally created model data candidates, was 80, the highest of all correlation values. In other words, when the first model data candidate of a lead component having an edge level of 200 and a posture of 180° at the lower right of the stage, among the 20 additionally created first model data candidates, is used, the outlines of the five types of lead components 410 shown in FIG. 24 can be best recognized. Therefore, of the 20 types of first model data candidates that have been additionally created, the first model data candidate for a lead component with an edge level of 200 and an orientation of 180° at the bottom right of the stage is stored in the memory device 458 as model data to be used when performing pattern matching.

[0072] 25 , when pattern matching is performed between the five types of lead components 410 and a first model data candidate of the 20 additionally created model data candidates for lead components having an edge level of 200 and an orientation of 180° at the lower right of the stage, the correlation values ​​of the lead components of the five types of lead components 410 having an orientation of 270° at the lower right of the stage and the lead components of the five types of lead components 410 having an orientation of 90° at the lower left of the stage are less than 90. Therefore, when pattern matching is performed between the five types of lead components 410 and a first model data candidate of the 20 additionally created first model data candidates for lead components having an edge level of 200 and an orientation of 180° at the lower right of the stage, the outlines of the three types of lead components can be recognized, but the outlines of the two types of lead components may not be recognized. Therefore, the individual control device 452 additionally creates a second model data candidate that can properly recognize the outlines of the two types of lead components that may not be recognized.

[0073] Specifically, the individual control device 452 generates additional second model data candidates for edge levels of 50, 100, 200, and 300 based on the imaging data for each of the two types of lead components that may be unrecognizable. In other words, the individual control device 452 generates eight (=2×4) types of additional second model data candidates. These eight additionally generated model data candidates are component identification data used when performing pattern matching. The individual control device 452 then performs pattern matching between each of the additionally generated second model data candidates and each of the two types of lead components 410 shown in FIG. 27 .

[0074] Specifically, for example, the individual control device 452 performs pattern matching between a candidate for second model data of a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage and each of the two types of lead components 410 shown in Fig. 27. As a result, as shown in Fig. 28, the individual control device 452 calculates that the correlation value between the candidate for second model data of a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage and the imaging data obtained by imaging a lead component having an orientation of 270° at the lower right of the stage is 100. The individual control device 452 also calculates that the correlation value between the additionally created candidate for second model data of a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage and the imaging data obtained by imaging a lead component having an orientation of 90° at the lower left of the stage is 90. In this way, the individual control device 452 performs pattern matching between the additionally created candidate second model data for a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage and each of the two types of lead components 410 that may not be recognized, as shown in Fig. 27, and calculates the average of their correlation values. As shown in Fig. 28, the calculated average correlation value is 95.

[0075] In this way, the individual control device 452 performs pattern matching between each of the eight additionally created second model data candidates, which are model data candidates, and each of the two types of lead components 410 shown in FIG. 27 that may be unrecognizable, and calculates the average correlation value. The results of the calculation of the average correlation value by the individual control device 452 are shown in FIG. 29 . As can be seen from this figure, the correlation value, 95, was the highest among all the correlation values ​​when pattern matching was performed using a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage, among the eight additionally created second model data candidates. In other words, when using a model data candidate for a lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage, among the eight additionally created second model data candidates, the outlines of the two types of lead components 410 shown in FIG. 27 can be best recognized. 28 , when pattern matching is performed between the second model data candidate of the lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage, out of the eight additionally created second model data candidates, and the above two types of lead components 410, the correlation value with the above two types of lead components is 90 or more. Therefore, the second model data candidate of the lead component having an edge level of 100 and an orientation of 270° at the lower right of the stage, out of the eight additionally created second model data candidates, is stored in storage device 458 as model data to be used when performing pattern matching.

[0076] In this way, storage device 458 stores, as model data for pattern matching, a model data candidate for a lead component having an edge level of 50 and an orientation of 270° at the center of the stage, a first model data candidate for a lead component having an edge level of 200 and an orientation of 180° at the lower right of the stage, and a second model data candidate. By performing pattern matching using the model data candidates, first model data candidates, and second model data candidates stored in storage device 458, it is possible to recognize all of the outlines of lead components placed in four different orientations at five different positions on stage 156 as shown in FIGS. 17 to 20 , i.e., all of the outlines of the 20 types of lead components shown in FIG. 21 . Specifically, by performing pattern matching using the model data candidates, it is possible to recognize the outlines of 15 types of lead components other than the five types of lead components shown in FIG. 24 . Furthermore, by performing pattern matching using the first model data candidates, it is possible to recognize the outlines of three types of lead components other than the two types of lead components shown in FIG. 27 out of the remaining five types of lead components. Furthermore, by performing pattern matching using the second model data candidates, it is possible to recognize the outlines of the remaining two types of lead components.

[0077] In this way, by performing pattern matching using the model data candidate, the first model data candidate, and the second model data candidate, it is possible to properly recognize the outlines of all of the lead components placed in five different positions and four different attitudes on stage 156. In other words, when identifying a component to be picked up from among the plurality of lead components scattered on stage 156, individual control device 452 performs pattern matching with the plurality of lead components scattered on stage 156 using the model data candidate, the first model data candidate, and the second model data candidate.

[0078] Specifically, first, the two-dimensional camera 290 captures an image of a plurality of lead components scattered on the stage 156. Then, the individual control device 452 calculates a correlation value between the image data of the plurality of lead components captured by the two-dimensional camera 290 and the model data candidates. As a result, the individual control device 452 identifies lead components having a correlation value of 90 or greater with the model data candidates as components to be picked up. Next, the individual control device 452 calculates a correlation value between the image data of lead components other than the lead components previously identified as components to be picked up and the first model data candidates. As a result, the individual control device 452 identifies lead components having a correlation value of 90 or greater with the first model data candidates as components to be picked up. Next, the individual control device 452 calculates a correlation value between the image data of lead components other than the lead components previously identified as components to be picked up and the second model data candidates. As a result, the individual control device 452 identifies lead components having a correlation value of 90 or greater with the second model data candidates as components to be picked up. The individual control device 452 does not identify as a target for pickup any lead component whose correlation value with the second model data candidate is less than 90. In other words, any lead component whose correlation value with the second model data is less than 90 is regarded as a component that cannot be picked up.

[0079] In this way, by performing pattern matching using the model data candidate, the first model data candidate, and the second model data candidate, it is possible to identify the component to be picked up from among multiple lead components 410 scattered in different positions and with different attitudes on the stage 156 without lowering the threshold value of the correlation value.

[0080] Incidentally, the stage 156 is an example of a stage. The two-dimensional camera 290 is an example of a two-dimensional camera. The lead components 410 are an example of components of the same type. The individual control devices 452 are an example of an information processing device.

[0081] The present invention is not limited to the above-described embodiment, and various modifications or improvements can be made based on the knowledge of those skilled in the art. Specifically, for example, in the above-described embodiment, a worker manually places multiple lead components 410 of the same type at multiple positions on stage 156. Alternatively, a robot arm or the like may be provided in bulk component supply device 32, and the robot arm may automatically place lead components 410 on stage 156.

[0082] Furthermore, in the above embodiment, two-dimensional camera 290 images multiple lead components 410 of the same type placed at multiple positions on stage 156 at one time, i.e., at a panoramic view, and individual control device 452 acquires imaging data obtained by imaging multiple lead components 410 at a panoramic view. Alternatively, one lead component may be placed at a predetermined position on stage 156, and each time the position of that lead component is changed, two-dimensional camera 290 may image the single lead component placed on stage 156, and individual control device 452 may acquire imaging data obtained by imaging each of the multiple lead components 410 placed at multiple positions on stage 156.

[0083] Furthermore, in the above embodiment, the worker places five lead components 410 in five locations on stage 156 (stage center, lower right, lower left, upper right, and upper left), but the locations are not limited, and lead components may be placed in any location on stage 156. Furthermore, there is no limit to the number of components placed on stage 156, and any number of lead components may be placed in any location.

[0084] In the above embodiment, the individual control device 452 of the mounter 10 creates the model data, but the model data may be created by an information processing device different from the mounter 10. The model data created by an information processing device different from the mounter 10 is stored in the storage device 458.

[0085] Furthermore, in the above embodiment, the individual control device 452 creates a model data candidate, a first model data candidate, and a second model data candidate, but it may also create a third or subsequent model data candidate. That is, for example, the individual control device 452 creates a second model data candidate, performs pattern matching between the model data candidate, the first model data candidate, and the second model data candidate and the 20 types of lead components shown in FIG. 21 , and if any of the correlation values ​​is not 90 or greater, creates a third model data candidate. In this way, by the individual control device 452 creating third or subsequent model data candidates, it becomes possible to make all of the correlation values ​​of the 20 types of lead components 90 or greater. On the other hand, if the individual control device 452 creates a first model data candidate, performs pattern matching between the model data candidate and the first model data candidate and the 20 types of lead components, and if all of the correlation values ​​are 90 or greater, it is not necessary to create a second model data candidate.

[0086] In the above embodiment, the present invention is applied to the lead component 410, but the present invention can be applied to various types of components. Specifically, the present invention can be applied to components of solar cells, components of power modules, electronic circuit components without leads, etc.

[0087] Furthermore, in the above embodiment, the two-dimensional camera 290 captures an image of the parts scattered across one stage 156 in a panoramic view, but the parts scattered across the stage 156 may be divided into multiple areas and then imaged, or, for example, each part may be imaged separately.

[0088] 156: Stage 290: 2D camera 410: Lead component (component) 452: Individual control device (information processing device)

Claims

1. An information processing apparatus that creates model data based on imaging data obtained by a two-dimensional camera fixedly disposed at a predetermined position at a predetermined height on a stage, the imaging data being of a plurality of parts of the same type placed at a plurality of positions on the stage.

2. The information processing apparatus according to claim 1, wherein the model data is created based on imaging data obtained by the two-dimensional camera imaging a plurality of parts of the same type placed at a plurality of positions on the stage at once.

3. The information processing apparatus according to claim 1 or claim 2, wherein the model data is created based on imaging data obtained by the two-dimensional camera imaging a plurality of parts of the same type placed at a plurality of positions on the stage in the same posture.

4. The information processing apparatus according to claim 3, wherein the model data is created based on imaging data obtained by the two-dimensional camera imaging a plurality of parts of the same type placed at a plurality of positions on the stage in the same posture and imaging data obtained by the two-dimensional camera imaging a plurality of parts of the same type placed at a plurality of positions on the stage in a posture different from the same posture.

5. A method for creating model data for identifying a plurality of parts of the same type scattered on a stage, the method comprising: a parts placement step of placing one by one the parts of the same type in the same posture at a plurality of different positions on the stage; a parts imaging step of imaging at once, with a two-dimensional camera fixedly disposed at a predetermined position at a predetermined height on the stage, the parts of the same type placed at a plurality of different positions on the stage and having the same posture; and executing the parts imaging step to determine, as model data for identifying a plurality of parts of the same type scattered on the stage, data for identifying parts, among the parts of the same type and having the same posture imaged at once in the parts imaging step, for which identification is possible and the number of which exceeds a predetermined number.

Images