Stacked assembly and electronic device

Abstract

The present application provides a stacked assembly and an electronic device. The stacked assembly comprises a circuit board module, a chip module, a heat dissipation module, and a thermally conductive module, wherein the chip module is fixed to the circuit board module, and the heat dissipation module is arranged on the side of the chip module facing away from the circuit board module; and the thermally conductive module comprises a plurality of thermally conductive blocks, the two ends of each thermally conductive block are respectively connected to the heat dissipation module and the circuit board module, and each thermally conductive block is spaced apart from any chip. The stacked assembly provides a vertical heat dissipation channel and a lateral heat dissipation channel for the chip module, and can improve the heat dissipation capability of the assembly.

Description

Stacked components and electronic devices

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of the People's Republic of China on January 18, 2024, with application number 202410078784.3 and invention name "Stacked Components and Electronic Devices", the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of chip technology, and in particular to a stacking assembly and an electronic device. Background Art

[0004] Package-on-package (POP) technology integrates upper and lower packages, offering advantages in terms of versatility, convenience, and compact size. However, POP packaging structures are facing increasing heat dissipation challenges. Excessive heat can degrade the performance of the packaged chip and affect the reliability of the package.

[0005] In order to fully unleash the chip performance of the stacked components, the stacked structure needs to be well cooled. Summary of the Invention

[0006] The present application provides a stacking assembly and an electronic device, wherein the stacking assembly has better heat dissipation performance and can optimize the power consumption and performance design of the heat dissipation design of the entire device.

[0007] In a first aspect, a stack assembly is provided that can be used in the motherboard of an electronic device. The stack assembly includes a circuit board module, a chip module, a heat sink module, and a thermal conductivity module. The circuit board module can be part of the motherboard of the electronic device. The chip module is fixed to the circuit board module, and the heat sink module is located on the side of the chip module facing away from the circuit board module. Heat generated by the chip module can be transferred upward to the heat sink module and downward to the circuit board module. The thermal conductivity module includes multiple thermal blocks, each of which is connected to the heat sink module and the circuit board module at both ends, forming a heat conduction channel between the circuit board module and the heat sink module. Heat generated by the chip module can be transferred downward to the circuit board module, and then laterally transferred to the thermal blocks within the circuit board module, and then transferred to the heat sink module through the thermal blocks. Each thermal block is spaced apart from any chip, that is, the thermal block and the chip module do not contact each other, providing an excellent heat dissipation environment for the chip module. Among them, the direction of heat transfer along the heat dissipation module pointing to the circuit board module and the direction of heat transfer along the circuit board module 1 pointing to the heat dissipation module 3 can be considered as longitudinal heat transfer, and the direction of heat transfer perpendicular to the heat dissipation module pointing to the circuit board module can be considered as transverse heat transfer.

[0008] In this stacked assembly, the thermal block is connected between the heat sink module and the circuit board module, establishing a thermal path between the circuit board and the heat sink. This allows heat generated by the chip module to dissipate through both vertical and horizontal paths, resulting in improved heat dissipation. The thermal block has no impact on the stacked assembly's original structure, facilitating cost control and facilitating mass production.

[0009] In one possible implementation, the chip module adopts a stacked package design. Specifically, the chip module may include at least two chips arranged in a stack. The stacked package chip module can better utilize device space and achieve miniaturization.

[0010] In one possible implementation, the circuit board module includes a baseboard, to which the chip module is fixed, and each thermal block has two ends connected to the heat dissipation module and the baseboard, respectively. In this structure, the chip module is soldered to the baseboard, and the thermal blocks are connected between the baseboard and the heat dissipation module.

[0011] Specifically, a heat-conducting structure can be provided on the side of the substrate facing away from the chip module, and a heat-conducting protrusion can be provided on the side of the heat-conducting structure facing the substrate. The substrate has an opening that extends through the substrate along the stacking direction of the chip modules, and the heat-conducting protrusion passes through the opening and contacts the chip module. Some of the heat generated by the chip module can also be transferred to the heat-conducting structure via the heat-conducting protrusion to achieve heat dissipation.

[0012] In one possible implementation, the circuit board module includes a baseboard and a connecting circuit board mounted on the baseboard. The chip module is fixed to the surface of the connecting circuit board facing away from the baseboard. Each thermal block has two ends connected to the heat dissipation module and the baseboard, respectively. In this structure, the connecting circuit board acts as an adapter circuit board between the chip module and the baseboard. The chip module is soldered to the adapter circuit board, and the thermal blocks are connected between the connecting circuit board and the heat dissipation module.

[0013] Specifically, a heat-conducting structure can be provided on the side of the substrate facing away from the chip module, and a heat-conducting protrusion can be provided on the side of the heat-conducting structure facing the substrate. The substrate has an opening that extends through the substrate along the stacking direction of the chip modules, and the heat-conducting protrusion passes through the opening and contacts the connecting circuit board. Some of the heat generated by the chip module can also be transferred to the heat-conducting structure via the connecting circuit board and the heat-conducting protrusion for dissipation.

[0014] A plurality of first resistors and capacitors are disposed on the side of the connection circuit board facing the substrate. Along the stacking direction of the chip modules, the orthographic projections of the plurality of first resistors and capacitors on the substrate are located within the opening, which provides space for the first resistors and capacitors. Each first resistor and capacitor is spaced apart from the thermally conductive protrusion, allowing the thermally conductive protrusion to avoid the first resistor and capacitor, without affecting the first resistor and capacitor.

[0015] In one possible implementation, along the chip module's stacking direction, the chip module includes a Class I heating device and a Class II heating device. The Class I heating device generates more heat at maximum power than the Class II heating device. Therefore, the Class I heating device can be considered the core heat source of the chip module. The orthographic projection of the Class I heating device on the heat-conducting structure covers at least one thermally conductive protrusion, allowing for targeted heat conduction to the Class I heating device.

[0016] In one possible implementation, the opening is filled with a thermal interface material, which can increase the size of the thermal channel and enhance the thermal conductivity.

[0017] The heat-conducting structure may be one of a heat sink, a graphite sheet, a copper block, and a temperature-dispersing plate, or a combination of at least two of them.

[0018] In one possible implementation, the circuit board module includes multiple conductive layers and multiple thermally conductive plating holes. The multiple conductive layers are spaced apart along the stacking direction of the chip module, and any two conductive layers can be separated by an insulating layer. One end of each thermally conductive plating hole is located on the surface of the circuit board module facing the chip module and is in contact with the thermally conductive block, and each thermally conductive plating hole is connected to at least one conductive layer. The conductive layer can conduct heat in a direction perpendicular to the stacking direction of the chip module, and the thermally conductive plating hole can connect at least one conductive layer to the thermally conductive block to achieve rapid heat conduction. When the thermally conductive block is connected between the substrate of the circuit board module and the heat dissipation module, the multiple conductive layers and the multiple thermally conductive plating holes are formed on the substrate. When the thermally conductive block is connected between the connecting circuit board of the circuit board module and the heat dissipation module, the multiple conductive layers and the multiple thermally conductive plating holes are formed on the connecting circuit board.

[0019] In order to improve the thermal conductivity, the conductive layer can be designed to be thicker, with at least one conductive layer having a thickness of 0.5-1 ounce.

[0020] In one possible implementation, the circuit board module is provided with multiple second RC arrays, each second RC array includes multiple second RCs arranged in an array, at least one of the second RC arrays is arranged in the same layer as the chip module and is located around the chip module; along the stacking direction perpendicular to the chip module, the length direction of the heat conductive block adjacent to the second RC array is parallel to the length direction of the arrangement of the second RC array, and the provision of the heat conductive block will not affect the second RC.

[0021] In one possible implementation, along a stacking direction perpendicular to the chip module, the length direction of the heat conducting block is parallel to the edge of the chip module, and the provision of the heat conducting block will not affect the chip module.

[0022] In one possible implementation, the heat conducting block is one or a combination of at least two of a copper block, an aluminum block, and a heat conducting pad. In a specific embodiment, the material, shape, and size of the heat conducting block can be reasonably selected as needed.

[0023] When the thermal block is a copper block, both ends of the block, which connect the heat sink module and the circuit board module, have a solder coating. This solder coating improves soldering performance and increases structural stability. Alternatively, the thermal block, heat sink module, and circuit board module can be connected using thermal adhesive or other methods.

[0024] In one possible implementation, the distance between any heat-conducting block and the chip module can be less than or equal to 1.5 mm. This spacing range can ensure good heat dissipation and the heat-conducting block will not affect the chip module.

[0025] In order to achieve better heat dissipation effect, thermal interface material can be filled between the heat dissipation module and the chip module. Here, the thermal interface material has good thermal conductivity and can play a good thermal conductivity effect between the two structures. Among them, the heat dissipation module and the chip module can be welded by solder balls, and the gap between the heat dissipation module and the chip module can be filled with thermal interface material. Similarly, multiple chips in the chip module can also be connected by solder balls and the gaps between the multiple chips in the chip module can be filled with thermal interface material. The chip module and the circuit board module can also be connected by solder balls and the gaps between the chip module and the circuit board module can be filled with thermal interface material.

[0026] In a second aspect, an electronic device is provided. This electronic device can be a server for a terminal such as a computer host, or a terminal device such as a laptop or tablet computer. The electronic device includes a housing and the stacking assembly provided in the first aspect, disposed within the housing. The electronic device incorporating this stacking assembly achieves improved heat dissipation design power consumption and performance, achieving the desired performance without frequency throttling. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] FIG1a is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0028] FIG1b is a schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0029] FIG2 is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0030] FIG3 is a schematic diagram of a heat dissipation path of a stacked assembly provided in an embodiment of the present application;

[0031] FIG4 is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0032] FIG5 is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0033] FIG6a is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0034] FIG6 b is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0035] FIG6 c is a schematic diagram of a heat dissipation path of a stacked assembly provided in an embodiment of the present application;

[0036] FIG7a is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0037] FIG7 b is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0038] FIG8 a is a top view of a stacking assembly provided in an embodiment of the present application;

[0039] FIG8 b is a bottom view of a stacking assembly provided in an embodiment of the present application;

[0040] FIG9 is a schematic diagram of a connection structure between a circuit board and a conductive block in a stack assembly provided in an embodiment of the present application;

[0041] FIG10 is a schematic diagram of the structure of a connected circuit board in a stack assembly provided in an embodiment of the present application;

[0042] FIG11a is a schematic structural diagram of a stacking assembly provided in an embodiment of the present application;

[0043] FIG11 b is a schematic diagram of a heat dissipation path of a stacked assembly provided in an embodiment of the present application.

[0044] Figure markings: 10-stack assembly; 20-housing; 30-cooling fan; 40-heat conduction channel; 1-circuit board module; 11-substrate; 12-connecting circuit board; 121-first resistor and capacitor; 101-conductive layer; 102-insulating layer; 103-thermal conductive plating hole; 122-second resistor and capacitor; 2-chip module; 21-memory chip; 22-processing chip; 3-heat dissipation module; 4-thermal conductive module; 41-thermal conductive block; 411-soldering coating; 5-thermal conductive structure; 51-thermal conductive protrusion; 6-thermal conductive interface material; 7-solder ball; K-opening. DETAILED DESCRIPTION

[0045] In the field of semiconductor technology, a stacked structure consists of two layers of packaging, one on top of the other, offering a higher level of integration. The bottom layer typically houses a processing chip, such as a baseband unit or application processor, while the top layer houses storage chips, such as memory. Heat dissipation from both layers of the stack is a critical issue, as conventional heat dissipation technologies currently offer limited performance in stacked structures.

[0046] Based on this, an embodiment of the present application provides a stacking assembly and an electronic device having the stacking assembly, which optimizes the heat dissipation path of the chip, can improve the heat dissipation capacity of the structure, and achieve better heat dissipation effect.

[0047] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0048] The terms used in the following embodiments are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and appended claims of this application, the singular expressions "a", "an", "said", "above", "the", and "this" are intended to also include expressions such as "one or more", unless the context clearly indicates otherwise.

[0049] References to "one embodiment" or "some embodiments" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present application. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in yet other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more but not all embodiments," unless otherwise specifically emphasized. The terms "including," "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0050] An electronic device with a stacking structure provided in an embodiment of the present application can be specifically a server for a terminal such as a computer host, or a terminal device such as a laptop computer or a tablet computer. Figure 1a shows a schematic diagram of a partial structure of a server. As shown in Figure 1a, the server includes a housing 20 and a stacking assembly 10 arranged in the housing 20. The stacking assembly 10 includes a circuit board module 1, a chip module 2, a heat dissipation module 3 and a heat conduction module 4. The heat generated by the chip module 2 can be dissipated through the heat dissipation module 3. Among them, the stacking assembly 10 can be the mainboard of the server or a partial structure of the mainboard, and the heat dissipation module 3 can be exposed from the housing 20 to contact the external environment. When the heat dissipation module 3 is an air-cooled radiator, the heat dissipation module 3 can be arranged on the housing 20, and the heat dissipation module 3 can be directly connected to the external environment to conduct heat to the external space. In the example of Figure 1a, the heat dissipation module 3 is arranged in the housing 20, and a cooling fan 30 is arranged at a position corresponding to the heat dissipation module 3 in the housing 20 to enhance the heat exchange between the heat dissipation module 3 and the external environment.

[0051] In some embodiments, the cooling fan 30 may be located in a limited position and relatively far from the stack assembly 10. As shown in Figure 1b , the server may also be provided with a heat conduction channel 40, which may be in the form of a pipe and can direct heat from the heat dissipation module 3 within the housing 20 to the location of the cooling fan 30, thereby enhancing heat exchange between the heat dissipation module 3 and the external environment. The heat conduction channel 40 should be in contact with the heat dissipation module 3 over as large an area as possible, thereby directing heat from the heat dissipation module 3 to the cooling fan 30 more evenly and quickly.

[0052] Figure 2 illustrates the structure of a stack assembly 10 provided in an embodiment of the present application. As shown in Figure 2, stack assembly 10 includes a circuit board module 1, a chip module 2, a heat dissipation module 3, and a thermal conductivity module 4. Chip module 2 is secured to circuit board module 1. Exemplarily, chip module 2 includes two stacked chips, with the stacking direction of the two chips perpendicular to circuit board module 1. Chip module 2 utilizes stacking technology to re-integrate the packages of the two chips.

[0053] Exemplarily, the two chips are a memory chip 21 located on the upper layer and a processing chip 22 located on the lower layer. The chip module 2 integrates the memory chip 21 and the processing chip 22 using stacked packaging technology. The heat dissipation module 3 is disposed on the side of the chip module 2 facing away from the circuit board module 1. The memory chip 21 located on the upper layer of the chip module 2 is disposed between the processing chip 22 on the lower layer and the heat dissipation module 3, while the processing chip 22 located on the lower layer is disposed between the memory chip 21 on the upper layer and the circuit board module 1. Specifically, the memory chip 21 is connected to the heat dissipation module 3, and the processing chip 22 is connected to the circuit board module 1. The two chips in the chip module 2 can be transferred upward to the heat dissipation module 3 for heat dissipation, or downward to the circuit board module 1 for heat dissipation. The heat conduction module 4 includes multiple heat conduction blocks 41. The two ends of each heat conduction block 41 are respectively connected to the heat dissipation module 3 and the circuit board module 1. Each heat conduction block 41 can form a heat conduction channel between the circuit board module 1 and the heat dissipation module 3, so that heat from the circuit board module 1 can be quickly transferred to the heat dissipation module 3 for heat dissipation. Each heat conducting block 41 is spaced apart from any chip. Heat transferred from the chip in chip module 2 to the surrounding environment can be transferred to the heat dissipation module 3 via the heat conducting block 41. The heat dissipation module 3 can be a heat sink with multiple fins, or a plate or heat pipe made of a material with good thermal conductivity. Materials with good thermal conductivity include metals such as copper and aluminum, as well as non-metals such as graphite sheets and vapor chambers (VC).

[0054] Figure 3 is a schematic diagram of the heat dissipation path of the stacked assembly 10. As shown in Figure 3, in the chip module 2, the heat generated by the upper memory chip 21 can be transferred upward to the heat dissipation module 3. The heat generated by the lower processing chip 22 can be transferred upward to the memory chip 21, and then transferred to the heat dissipation module 3 via the memory chip 21. The heat generated by the processing chip 22 can be transferred downward to the circuit board module 1. The heat generated by the memory chip 21 can also be transferred downward to the lower processing chip 22, and then transferred to the circuit board module 1 via the processing chip 22. The heat from the circuit board module 1 can be transferred to the heat dissipation module 3 via the heat conductive blocks 41. Multiple heat conductive blocks 41 form a heat conduction channel between the heat dissipation module 3 and the circuit board module 1, directing the heat transferred downward from the two chips to the circuit board module 1 to the heat dissipation module 3 for heat dissipation. Multiple heat conductive blocks 41 are distributed around the chip module 2, and the heat from the chip module 2 can be transferred to the heat conductive blocks 41 via the circuit board module 1. According to the principle of the shortest path for heat transfer, when the heat of the chip module 2 is transferred to the circuit board module 1, it will be dispersed laterally along the circuit board module 1 to shorten the distance that the heat passes through the circuit board module 1. At this time, the heat of the chip module 2 can be transferred laterally along the circuit board module 1, which can enhance the lateral heat dissipation capacity of the chip module 2. The heat-conducting block 41 does not contact the two chips in the chip module 2, creating a lower temperature environment for the chip module 2 and improving the heat dissipation effect of the chip module 2. Among them, the direction in which heat is transferred from the heat dissipation module 3 to the circuit board module 1 and the direction in which heat is transferred from the circuit board module 1 to the heat dissipation module 3 can be considered as longitudinal heat transfer, and the direction in which heat is transferred perpendicular to the heat dissipation module 3 to the circuit board module 1 can be considered as lateral heat transfer. For the stacking assembly 10 as a whole, the heat generated by the chip module 2 has two heat dissipation paths, a longitudinal path parallel to the stacking direction and a lateral path perpendicular to the stacking direction, which provides a better heat dissipation effect.

[0055] The heat conducting block 41 may specifically include, but is not limited to, a solderable copper block, an aluminum block, a high thermal pad, or other high thermal conductivity materials. To maintain good heat dissipation, in some embodiments, the distance between the heat conducting block 41 and any chip may be set to no more than 1.5 mm.

[0056] Taking the thermal block 41 as a copper block as an example, as shown in Figure 4, solder coatings 411 can be provided on both ends of the thermal block 41 used to connect the heat sink module 3 and the circuit board module 1. That is, the end of the thermal block 41 used to connect to the heat sink module 3 is provided with solder coating 411 and is soldered to the heat sink module 3 via solder coating 411, while the end of the thermal block 41 used to connect to the circuit board module 1 is provided with solder coating 411 and is soldered to the circuit board module 1 via solder coating 411. Solder coating 411 can improve the reliability of the soldering between the thermal block 41 and the heat sink module 3 and the circuit board module 1, thereby improving production efficiency. In some embodiments, when the thermal block 41 is a copper block, the dimensions of a single thermal block 41 perpendicular to the stacking direction do not exceed 10 mm x 3 mm. Of course, the thermal block 41 and the heat sink module 3, and the thermal block 41 and the circuit board module 1, can also be connected via other methods such as bonding with thermal conductive adhesive. Thermal conductive adhesive can provide a good connection and enhance the thermal conductivity between the two structures.

[0057] In the stack assembly 10 provided in the embodiment of the present application, the material, shape, and size of the heat conductive block 41 are not specifically limited, and different heat conductive blocks 41 can be selected according to the specific usage scenario. For the stack assembly 10, the heat conductive block 41 is equivalent to adding it to the originally idle space of the stack assembly 10, without affecting the original structure of the stack assembly 10, which has certain advantages in cost control and mass production.

[0058] Specifically, as shown in FIG5 , the heat dissipation module 3 and the memory chip 21 can be connected together via a thermal interface material 6. The memory chip 21 and the processing chip 22 can be connected via solder balls 7, with the thermal interface material 6 supplementally filling the gap between the memory chip 21 and the processing chip 22. Similarly, the processing chip 22 and the circuit board module 1 can also be connected via solder balls 7, with the thermal interface material 6 supplementally filling the gap between the processing chip 22 and the circuit board module 1. The thermal interface material 6 can specifically be a thermally conductive adhesive, which not only serves as a connection but also increases the heat transfer rate between two adjacent structures, thereby enhancing the heat dissipation effect.

[0059] In a specific embodiment, the devices included in the chip module 2 can be divided into a type of heat-generating device and a type of heat-generating device according to the heat generated when operating at maximum power. The heat generated by the type of heat-generating device when operating at maximum power is greater than the heat generated by the type of heat-generating device when operating at maximum power. The type of heat-generating device can be considered as the core heat source of the chip module 2. As shown in Figure 5, the memory chip 21 is specifically a double data rate synchronous dynamic random access memory (DDR SDRAM). The processing chip 22 can be specifically a system-on-chip (SOC), including a central processing unit (CPU) and a graphics processing unit (GPU). The central processing unit and the graphics processing unit can be considered as a type of heat-generating device, that is, the core heat source of the chip module 2. When the chip module 2 is working, the central processing unit and the graphics processing unit are manufactured, and the memory chip 21 can be soldered on the processing chip 22. The two constitute independent devices, that is, the chip module 2.

[0060] In some embodiments, as shown in FIG6a , the circuit board module 1 includes a substrate 11 and a connecting circuit board 12 disposed on the substrate 11. The connecting circuit board 12 can be a land grid array (LGA) package module. The connecting circuit board 12 can be soldered to the substrate 11 via solder balls 7, and the gap between the connecting circuit board 12 and the substrate 11 can be filled with thermal interface material 6. The chip module 2 is fixed to the side of the connecting circuit board 12 facing away from the substrate 11. The processing chip 22 therein is soldered to the connecting circuit board 12 via solder balls 7, and the gap between the processing chip 22 and the connecting circuit board 12 can be filled with thermal interface material 6. Each end of each thermal block 41 is connected to the heat dissipation module 3 and the connecting circuit board 12, respectively, so that heat transferred from the chip module 2 to the connecting circuit board 12 can be transferred to the heat dissipation module 3 via the thermal block 41. An opening K is defined in the substrate 11, allowing a portion of the connecting circuit board 12 to be exposed from the bottom of the substrate 11. During manufacturing, the chip module 2 can be soldered to the connection circuit board 12 to form a smaller system module, and then the system module can be soldered to the substrate 11 to form a part of the electronic device.

[0061] Continuing with FIG6a , a heat-conducting structure 5 is provided on the side of the substrate 11 away from the connecting circuit board 12. The heat-conducting structure 5 may be one of a heat sink, a heat-conducting material, a graphite sheet, a temperature-vaporizing plate, or a combination of at least two thereof. A plurality of heat-conducting protrusions 51 are provided on the side of the heat-conducting structure 5 facing the substrate 11. The heat-conducting protrusions 51 protrude from the surface of the heat-conducting structure 5 facing the connecting circuit board 12. The plurality of heat-conducting protrusions 51 are accommodated in the opening K, and the end of each heat-conducting protrusion 51 away from the substrate 11 is close to or in contact with the connecting circuit board 12. The heat-conducting protrusions 51 may be an integral structure with the heat-conducting structure 5. Specifically, the heat-conducting structure 5 having the heat-conducting protrusions 51 may be formed by mold molding or other methods. Alternatively, the heat-conducting protrusions 51 may be fixed to the heat-conducting structure 5 by welding, bonding, or other methods. The heat transferred from the chip module 2 to the connecting circuit board 12 may be partially transferred to the heat-conducting structure 5 via the heat-conducting protrusions 51. Along the stacking direction of the chip modules 2, at least one thermally conductive protrusion 51 corresponds to the position of the central processing unit, and at least one thermally conductive protrusion 51 corresponds to the position of the graphics processor. It can be considered that, along the stacking direction of the chip modules 2, the orthographic projection of at least one thermally conductive protrusion 51 on the processing chip 22 is located within the range corresponding to the central processing unit, and at least one thermally conductive protrusion 51 on the processing chip 22 is located within the range corresponding to the graphics processor. This positional correspondence between the thermally conductive structure 5 and the core heat source can reduce the heat transfer distance between the core heat source and the thermally conductive structure 5, thereby improving heat dissipation.

[0062] To enhance thermal conductivity, opening K can be filled with a thermal interface material 6, which can be a thermally conductive adhesive. As shown in Figure 6b, the thermal interface material 6 filling opening K and the thermal interface material 6 connecting circuit board 12 and substrate 11 can be connected together, filling the gap between opening K and circuit board 12 and substrate 11, thereby improving thermal conductivity. As shown in Figure 6b, the thermal interface material 6 can at least partially wrap around the thermally conductive protrusion 51, increasing the size of the heat conduction channel and further enhancing heat conduction.

[0063] Taking the stack assembly 10 structure shown in Figure 6a as an example, Figure 6c illustrates a schematic diagram of the heat dissipation path of the stack assembly 10 shown in Figure 6a. Part of the heat generated by the chip module 2 is transferred directly upward to the heat dissipation module 3, while part of the heat is transferred downward to the connecting circuit board 12 and then transferred to the heat dissipation module 3 via the connecting circuit board 12 and the heat conductive block 41. Heat generated by the core heat source of the chip module 2 is also transferred to the heat conductive structure 5 via the heat conductive protrusions 51 for heat dissipation.

[0064] Based on the stacking assembly 10 shown in FIG6a , a stacking assembly 10 shown in FIG7a has multiple first resistors and capacitors 121 disposed on the side of the connecting circuit board 12 facing the substrate 11. Each first resistor and capacitor 121 protrudes from the surface of the connecting circuit board 12 facing the substrate 11 along the stacking direction of the chip modules 2. Here, the multiple first resistors and capacitors 121 protrude and extend into the opening K of the substrate 11. The space in the opening K can be used to accommodate the multiple first resistors and capacitors 121. Along the stacking direction of the chip modules 2, the orthographic projections of the multiple first resistors and capacitors 121 on the substrate 11 are located within the opening K. When arranged, the thermal protrusions 51 need to avoid the first resistors and capacitors 121, so that any first resistor and capacitor 121 is spaced apart from the thermal protrusion 51 to prevent the thermal protrusion 51 from affecting the function of the first resistor and capacitor 121. Along the stacking direction of the chip modules 2, the orthographic projections of any first resistor and capacitor 121 on the thermal structure 5 are spaced apart and do not overlap with the thermal protrusion 51. Illustratively, the heat-conducting protrusion 51 in FIG. 7 a is cylindrical. Of course, the heat-conducting protrusion 51 may also be in the shape of a cubic block or an irregular protrusion, and no shape limitation is made here.

[0065] The first resistors and capacitors 121 are collectively referred to as capacitors and resistors disposed on the side of the connection circuit board 12 facing the substrate 11. The multiple first resistors and capacitors 121 in the embodiments of the present application include at least one of capacitors and resistors. In different circuit connections, the first resistors and capacitors 121 select specific devices based on their functions. For example, when some first resistors and capacitors 121 are used for filtering, these first resistors and capacitors 121 can be capacitors. When some first resistors and capacitors 121 are used for bypass circuits, these first resistors and capacitors 121 can be resistors.

[0066] Figure 7b is a schematic diagram of a partial structural cross-section of the stacking assembly 10. Referring to Figures 7a and 7b together, the thermally conductive protrusion 51 of the thermally conductive structure 5 can pass through the opening K on the substrate 11 to approach or contact the connecting circuit board 12. The opening K can provide a storage space for the first resistor and capacitor 121 on the connecting circuit board 12, preventing the substrate 11 from interfering with the first resistor and capacitor 121. The first resistor and capacitor 121 do not contact the thermally conductive protrusion 51 structure, and there will be no structural interference between the two. In order to simplify the diagram, Figure 7b only shows the solder balls 7 and thermal interface material 6 between some adjacent structures.

[0067] Along the stacking direction of the chip modules 2 , FIG. 8 a illustrates the structure of the stack assembly 10 observed from the heat dissipation module 3 to the substrate 11 , and FIG. 8 b illustrates the structure of the stack assembly 10 observed from the substrate 11 to the heat dissipation module 3 .

[0068] As shown in Figure 8a, when observing the stacking assembly 10 from the side of the heat dissipation module 3 along the stacking direction of the chip module 2, the orthographic projection of the heat dissipation module 3 on the substrate 11 can cover the orthographic projection of the connecting circuit board 12 on the substrate 11. The connecting circuit board 12 is blocked by the heat dissipation module 3 and is shown in dotted lines. The chip module 2 fixed on the connecting circuit board 12 and the multiple heat-conducting blocks 41 connected between the connecting circuit board 12 and the heat dissipation module 3 are also shown in dotted lines. A power control unit (PCU), a power management unit (PMU) and a microcontroller unit (MCU) are also provided on the connecting circuit board 12. Both are soldered to the surface of the connecting circuit board 12 facing away from the substrate 11 and are shown in dotted lines. Among them, in the plane perpendicular to the stacking direction of the chip module 2, the heat-conducting block 41 is exemplarily rectangular. In Figure 8a, multiple heat-conducting blocks 41 are arranged around the chip module 2. The length of each heat-conducting block 41 is parallel to the edge of the chip module 2. This allows the heat-conducting blocks 41 to be placed as close to the chip module 2 as possible, providing a better heat dissipation environment for the chip module 2. Heat-conducting blocks 41 can also be placed around the power controller, power management unit, and microcontroller unit. Similarly, the length of the heat-conducting blocks 41 around the power controller is parallel to the edge of the power controller, the length of the heat-conducting blocks 41 around the power management unit is parallel to the edge of the power management unit, and the length of the heat-conducting blocks 41 around the microcontroller is parallel to the edge of the microcontroller. When the heat-conducting blocks 41 are soldered to the connecting circuit board 12, the impact of the heat-conducting blocks 41 on surrounding structures such as the chip module 2 is reduced. For ease of understanding, Figure 8a shows the length direction h of one heat-conducting block 41 arranged horizontally and the length direction h of one heat-conducting block 41 arranged vertically. The length direction h is parallel to the surface of the connecting circuit board 12 where the heat-conducting blocks 41 are placed and perpendicular to the stacking direction of the chip modules 2.

[0069] As shown in Figure 8b, the stack assembly 10 is viewed from the substrate 11 side along the stacking direction of the chip modules 2. The substrate 11 obscures the connecting circuit board 12, which is shown in dashed lines. The chip module 2 is soldered to the side of the connecting circuit board 12 facing away from the substrate 11, also shown in dashed lines. The orthographic projection of the chip module 2 on the substrate 11 at least partially overlaps with the opening K, and the orthographic projections of the CPU and the image processor on the substrate 11 at least partially fall within the area of ​​the opening K. The thermal conductive structure 5 covers the opening K of the substrate 11. The thermal conductive protrusions 51 of the thermal conductive structure 5 projecting toward the connecting circuit board 12 can pass through the opening K and abut the connecting circuit board 12, so that the CPU and the image processor each correspond to at least one thermal conductive protrusion 51. The CPU, image processor, and thermal conductive protrusions 51 are shown in dashed lines. Multiple first resistors and capacitors 121 on the side of the connecting circuit board 12 facing the substrate 11 extend into the opening K, and the first resistors 121 are designed to avoid the thermal conductive protrusions 51. For ease of understanding, FIG8 b simplifies the illustration and does not show the heat conducting block 41 , the power controller, the power management unit, and the micro control unit.

[0070] As shown in FIG9 , in the stacking assembly 10 provided in an embodiment of the present application, the connecting circuit board 12 includes multiple conductive layers 101, an insulating layer 102 is provided between any two conductive layers 101, and multiple conductive layers 101 and multiple insulating layers 102 are alternately stacked, so that the multiple conductive layers 101 can be spaced apart along the stacking direction of the chip module 2. The connecting circuit board 12 is provided with at least one thermal conductive plating hole 103, each thermal conductive plating hole 103 is connected between a thermal conductive block 41 and at least one conductive layer 101. The thermal conductive block 41 here is provided with a solder plating layer 411 at one end for connecting to the connecting circuit board 12. The thermal conductive plating hole 103 can be filled with metal material or a metal plating layer can be formed on the inner wall, so that the thermal conductive plating hole 103 has good heat conduction function. For example, the mouth of the thermal conductive plating hole 103 is located on the surface of the connecting circuit board 12 facing the chip module 2, and the bottom end of the thermal conductive plating hole 103 is in contact with one conductive layer 101, that is, the thermal conductive plating hole 103 is a blind hole. Along the stacking direction of the chip module 2, the orthographic projection of the opening of the thermal conductive via 103 on the thermal block 41 falls on the surface of the thermal block 41 facing the connecting circuit board 12. The opening of the thermal conductive via 103 can contact the thermal block 41, thereby rapidly transferring heat from the connecting circuit board 12 to the thermal block 41 through the thermal conductive via 103. Each thermal block 41 can be connected to at least one conductive layer 101 via at least one thermal conductive via 103. As shown in Figure 9, the thermal conductive via 103 can connect the surface of the connecting circuit board 12 facing the chip module 2 with one of the conductive layers 101, or it can connect the surface of the connecting circuit board 12 facing the chip module 2 with multiple conductive layers 101. When heat from the chip module 2 is transferred to the connecting circuit board 12, the heat can be transferred laterally along the multiple conductive layers 101 and then to the thermal block 41 through the thermal conductive via 103 connected to the conductive layers 101, thereby improving the heat transfer rate. To improve the thermal conductivity of the conductive layers 101, the conductive layers 101 can be thickened. Illustratively, the thickness of the at least one conductive layer 101 is 0.5-1 ounce.

[0071] In a specific implementation, the connecting circuit board 12 can be provided with a plurality of heat-conducting plating holes 103 corresponding to each heat-conducting block 41, and the plurality of heat-conducting plating holes 103 are arranged in an array. Specifically, in order to achieve good results, the heat-conducting plating hole matrix composed of the plurality of heat-conducting plating holes 103 can correspond to the area of ​​the connecting circuit board 12 used to connect the heat-conducting block 41. A structure of a connecting circuit board 12 is shown in Figure 10, which shows the surface of the connecting circuit board 12 facing the heat dissipation module 3. As shown in Figure 10, a chip module 2 and a power controller, a power management unit, and a micro control unit are provided on the connecting circuit board 12, and heat-conducting plating holes 103 are respectively provided around the chip module 2, the power controller, the power management unit, and the micro control unit. Among them, the plurality of heat-conducting plating holes 103 are arranged in a matrix, and each heat-conducting plating hole matrix is ​​used to connect to a corresponding heat-conducting block 41. Therefore, the shape of the matrix composed of the plurality of heat-conducting plating holes 103 is adapted to the shape of the heat-conducting block 41 and is rectangular. Therefore, on the surface of the connection circuit board 12 used to connect to the thermally conductive block 41, the length direction of the thermally conductive via matrix is ​​also the length direction h of the thermally conductive block 41. Specifically, the length direction h of the thermally conductive via matrix surrounding the chip module 2 is parallel to the edge of the chip module 2, the length direction h of the thermally conductive via matrix surrounding the power controller is parallel to the edge of the power controller, the length direction h of the thermally conductive via matrix surrounding the power management unit is parallel to the edge of the power management unit, and the length direction h of the thermally conductive via matrix surrounding the microcontroller unit is parallel to the edge of the microcontroller unit.

[0072] Continuing with FIG10 , the surface of the connecting circuit board 12 facing the heat dissipation module 3 is further provided with a plurality of second RC matrices, each of which includes a plurality of second RCs 122 arranged in a matrix. The second RC matrices are arranged around the chip module 2, the power controller, the power management unit, and the microcontroller unit and are spaced apart from the thermal conductive hole matrix, that is, the second RC matrix does not contact any of the components and there is a certain gap between them. For example, when the second RC matrix is ​​arranged in a rectangular shape on the surface of the connecting circuit board 12 facing the heat dissipation module 3, the length of the second RC matrix is ​​parallel to the length direction of the thermal conductive hole matrix, and the length of the second RC matrix is ​​parallel to the length direction h of the heat conductive block 41. When the heat conductive block 41 is soldered to the connecting circuit board 12, the influence of the heat conductive block 41 on the surrounding second RCs 122 can be reduced.

[0073] The second resistors and capacitors 122 collectively refer to capacitors and resistors disposed on the side of the connection circuit board 12 facing the heat dissipation module 3. The second resistors and capacitors 122 are essentially the same as the first resistors and capacitors 121, differing only in their placement. The multiple second resistors and capacitors 122 in the present embodiment also include at least one of capacitors and resistors, and the type of device can be selected as needed in the circuit connection.

[0074] In some embodiments, the circuit board module 1 includes a substrate 11. As shown in FIG11a , the difference from the above-described embodiment is that the circuit board module 1 does not include a connecting circuit board 12. The chip module 2 is fixed to the substrate 11, and each heat-conducting block 41 is connected to the heat dissipation module 3 and the substrate 11 at both ends. Specifically, the processing chip 22 in the chip module 2 can be fixed to the substrate 11 via solder balls 7, and the heat-conducting blocks 41 are connected between the substrate 11 and the heat dissipation module 3. As shown in FIG11a , an opening K is provided in the substrate 11. The opening K passes through the substrate 11 along the stacking direction of the chip module 2, allowing the processing chip 22 to be exposed from the substrate 11 through the opening K. A heat-conducting structure 5 is provided on the side of the substrate 11 facing away from the chip module 2, and the heat-conducting structure 5 covers the opening K. A heat-conducting protrusion 51 for abutting the chip module 2 is provided on the side of the heat-conducting structure 5 facing the chip module 2. The heat-conducting protrusion 51 is located within the opening K, and the end of the heat-conducting protrusion 51 facing away from the heat-conducting structure 5 can approach or contact the chip module 2. The thermally conductive protrusions 51 connect the chip module 2 to the thermally conductive structure 5, quickly directing heat from the chip module 2 to the thermally conductive structure 5. Along the stacking direction of the chip modules 2, the thermally conductive protrusions 51 are positioned to correspond to core heat sources. Specifically, at least one thermally conductive protrusion 51 corresponds to the position of the central processing unit (CPU), and at least one thermally conductive protrusion 51 corresponds to the position of the graphics processor (GPU). This positional relationship between the thermally conductive structure 5 and the core heat source reduces the heat transfer distance between the core heat source and the thermally conductive structure 5, thereby improving heat dissipation.

[0075] Figure 11b illustrates a schematic diagram of the heat dissipation path of the stacked assembly 10 shown in Figure 11a. A portion of the heat generated by the chip module 2 is transferred via the substrate 11 to the heat-conducting block 41 and further to the heat dissipation module 3 for dissipation. Heat generated by the core heat source of the chip module 2 is also transferred to the heat-conducting structure 5 via the heat-conducting protrusions 51 for dissipation.

[0076] It should be understood that when the thermally conductive block 41 is connected between the heat dissipation module 3 and the substrate 11, the substrate 11 includes the conductive layer 101 and the insulating layer 102 shown in FIG9 , and the thermally conductive vias 103 are formed in the substrate 11. The substrate 11 and the thermally conductive block 41 may also be connected via a plurality of thermally conductive vias 103. The connection structure between the substrate 11 and the thermally conductive block 41 can be shown in FIG9 .

[0077] In summary, the stacking assembly 10 provided in the embodiment of the present application forms a heat transfer channel between the circuit board module 1 and the heat dissipation module 3 by setting a plurality of heat-conducting blocks 41 with high thermal conductivity between the heat dissipation module 3 and the circuit board module 1. In addition to being directly transferred to the heat dissipation module 3, the heat generated by the chip module 2 can also be transferred longitudinally to the circuit board module 1, and transferred laterally along the circuit board module 1 through the heat-conducting blocks 41 to the heat dissipation module 3. The heat-conducting blocks 41 are arranged around the chip module 2 and do not contact any chip, which can form a good heat dissipation environment around the chip module 2 and further enhance the heat dissipation capacity. The substrate 11 is hollowed out, and by setting a heat-conducting structure 5, the core heat source in the chip module 2 can be subjected to targeted heat conduction and heat dissipation.

[0078] The stacked assembly 10 can be applied to electronic devices to improve the thermal design power (TDP) and performance of the entire device, achieving the effect of no frequency throttling even at full load. Compared to electronic devices that only use fans for heat dissipation, the thermal design power (TDP) of the entire device can be optimized by approximately 35%, and performance can be improved by approximately 6%.

[0079] The above are only specific embodiments of the present application, but the scope of protection of this application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this application should be included in the scope of protection of this application. Therefore, the scope of protection of this application should be based on the scope of protection of the claims.

Claims

1. A stacked component, characterized in that, It includes a circuit board module, a chip module, a heat dissipation module, and a heat conduction module; The chip module is fixed to the circuit board module, and the heat dissipation module is disposed on a side of the chip module facing away from the circuit board module; The heat conduction module includes a plurality of heat conduction blocks, with two ends of each heat conduction block respectively connected to the heat dissipation module and the circuit board module, and each heat conduction block is spaced apart from the chip module.

2. The stacked component according to claim 1, wherein, The chip module includes at least two chips, and the at least two chips are stacked in a direction from the circuit board module to the heat dissipation module.

3. The stacked component according to claim 1 or 2, wherein The circuit board module includes a substrate, the chip module is fixed to the substrate, and two ends of each heat conduction block are respectively connected to the heat dissipation module and the substrate.

4. The stacked component according to claim 3, wherein, A heat conduction structure is disposed on a side of the substrate facing away from the chip module, and heat conduction protrusions are disposed on a side of the heat conduction structure facing the substrate; The substrate has an opening that penetrates the substrate in a direction from the circuit board module to the heat dissipation module, and the heat conduction protrusion passes through the opening to contact the chip module.

5. The stacked component according to claim 1 or 2, characterized in that, The circuit board module includes a substrate and a connection circuit board disposed on the substrate, the chip module is fixed to a surface of the connection circuit board facing away from the substrate, and two ends of each heat conduction block are respectively connected to the heat dissipation module and the connection circuit board.

6. The stacked component according to claim 5, wherein A heat conduction structure is disposed on a side of the substrate facing away from the chip module, and heat conduction protrusions are disposed on a side of the heat conduction structure facing the substrate; The substrate has an opening that penetrates the substrate in a direction from the circuit board module to the heat dissipation module, and the heat conduction protrusion passes through the opening to contact the connection circuit board.

7. The stacked component according to claim 6, characterized in that, A plurality of first resistors and capacitors are disposed on a side of the connection circuit board facing the substrate, and in a direction from the circuit board module to the heat dissipation module, a positive projection of the plurality of first resistors and capacitors on the substrate is located within the opening; Any one of the first resistors and capacitors is spaced apart from the heat conduction protrusion.

8. The stacked component according to claim 4, 6 or 7, wherein, The chip module includes a first type of heat generating device and a second type of heat generating device, and the heat generation amount of the first type of heat generating device at the maximum power is greater than the heat generation amount of the second type of heat generating device at the maximum power; In a direction from the heat dissipation module to the circuit board module, a positive projection of the first type of heat generating device on the heat conduction structure covers at least one of the heat conduction protrusions.

9. The stacked component according to any one of claims 4 or 6 - 8, characterized in that, The opening is filled with a heat conduction interface material.

10. The stacked component according to any one of claims 4 or 6-9, characterized in that The heat conduction structure is one or a combination of at least two of a heat sink, a graphite sheet, a copper block, and a heat pipe.

11. The stacked component according to any one of claims 1-10, characterized in that, The circuit board module includes a plurality of conductive layers and a plurality of heat conduction plating holes; In a direction from the circuit board module to the heat dissipation module, the plurality of conductive layers are spaced apart; One end of each heat conduction plating hole is located on a surface of the circuit board module facing the chip module and is connected to the heat conduction block, and each heat conduction plating hole is connected to at least one of the conductive layers.

12. The stacked component according to claim 11, wherein The thickness of at least one of the conductive layers is 0.5 - 1 ounce.

13. The stacked component according to any one of claims 1 to 12, characterized in that, The circuit board module is provided with a plurality of second resistor and capacitor arrays, each second resistor and capacitor array includes a plurality of second resistors and capacitors arranged in an array, and each second resistor and capacitor array is disposed on the same layer as the chip module and around the chip module; The length direction of the heat conducting block adjacent to the second resistor-capacitor array is parallel to the length direction of the arrangement of the second resistor-capacitor array.

14. The stacked component according to any one of claims 1-13, characterized in that, The length direction of the heat conducting block is parallel to the edge of the chip module.

15. The stacked component according to any one of claims 1 to 14, characterized in that, The heat conducting block is one or a combination of at least two of a copper block, an aluminum block, and a heat conducting pad.

16. The stacked component according to claim 15, wherein The heat conducting block is a copper block, and the two ends of the heat conducting block for contact connection with the heat dissipation module and the circuit board module have welding coatings.

17. The stacked component according to any one of claims 1-16, characterized in that, At least one of between the heat dissipation module and the chip module, between multiple chips in the chip module, and between the chip module and the circuit board module is filled with a thermal interface material.

18. An electronic device, characterized in that, It includes a housing and the stacked component according to any one of claims 1-17, and the stacked component is arranged in the housing.

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