Main control board of battery management system, and battery management system

Abstract

Provided in the present application are a main control board of a battery management system, and a battery management system. The main control board of a battery management system comprises a high-voltage board, a low-voltage board and a connector, wherein the high-voltage board is provided with a controller minimal system, a power supply module and a field signal collection module, and both the power supply module and the field signal collection module are connected to the controller minimal system; the low-voltage board is provided with a communication module and an input and output module; and the connector is respectively connected to the high-voltage board and the low-voltage board, and both the communication module and the input and output module are connected to the controller minimal system by means of the connector. In the present application, a high-voltage board and a low-voltage board are separately arranged, such that the reliability and safety of a main control board can be effectively improved.

Description

Battery management system main control board and battery management system

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on September 10, 2024, with application number 202422220632.0. The entire contents of the above application are incorporated by reference into this application.

[0002] Technical Field

[0003] The present application relates to the technical field of battery management, and in particular to a main control board of a battery management system and a battery management system.

[0004] Background Art

[0005] The main control board in the battery management system needs to integrate a large number of functional modules to support its battery management functions, such as multiple types of sensor signal acquisition modules and communication modules.

[0006] Technical issues

[0007] The main control board's circuit structure is complex, with complicated wiring. This makes signal interference between different functional modules easy. Furthermore, the voltage levels of different functional modules vary, affecting the safety of the main control board. As a result, the reliability and safety of the main control board in the battery management system are poor.

[0008] Technical Solutions

[0009] In a first aspect, an embodiment of the present application provides a main control board of a battery management system, comprising:

[0010] A strong power board; the strong power board is provided with a minimum controller system, a power module and a field signal acquisition module; the power module and the field signal acquisition module are connected to the minimum controller system;

[0011] Weak current board; the weak current board is provided with a communication module and an input and output module;

[0012] The connectors are respectively connected to the strong current board and the weak current board; the communication module and the input / output module are both connected to the controller minimum system through the connectors.

[0013] In a second aspect, an embodiment of the present application provides a battery management system, including: a main control board of the battery management system provided by any embodiment of the present application.

[0014] Beneficial effects

[0015] Beneficial effects of this application:

[0016] In the main control board of the battery management system provided by the embodiment of the present application, the high-current board and the low-current board are arranged separately, and a connector is used to connect the high-current board and the low-current board. Among them, the functional module of the main control board that connects to external devices of high voltage level is mainly integrated in the high-current board, and the functional module that connects to external devices of low voltage level is mainly integrated in the low-current board. The embodiment of the present application divides the high-voltage and low-voltage boards and arranges the functional modules of different voltage levels separately, which can effectively reduce the coupling and interference between strong and weak current signals, and reduce the risk of high-voltage level functional module failure affecting low-voltage level functional modules, and the strong and weak current boards can be separately and independently detected for faults, which is beneficial to the later maintenance of the main control board. Therefore, the embodiment of the present application can effectively improve the reliability and safety of the main control board.

[0017] BRIEF DESCRIPTION OF THE DRAWINGS

[0018] FIG1 is a schematic structural diagram of a main control board of a battery management system provided in an embodiment of the present application;

[0019] FIG2 is a schematic structural diagram of a main control board of another battery management system provided in an embodiment of the present application;

[0020] FIG3 is a schematic structural diagram of a battery management system provided in an embodiment of the present application.

[0021] In the picture:

[0022] 10. Power board; 110. Minimum controller system; 120. Power supply module; 130. Field signal acquisition module; 20. Weak board; 210. Input / output module; 220. Communication module; 30. Connector; 310. Connector;

[0023] 21. DCDC converter; 22. Isolation power supply chip; 23. First power conversion chip; 24. Second power conversion chip; 131. Temperature acquisition unit; 132. Current acquisition unit; 133. Insulation detection unit; 31. Temperature acquisition circuit; 32. Negative insulation detection circuit; 33. Positive insulation detection circuit; 34. Signal isolation circuit; OP1, first op amp circuit; OP2, second op amp circuit; ADC1, first analog-to-digital conversion circuit; ADC2, second analog-to-digital conversion circuit; 41. Watchdog circuit; 42. Select jumper;

[0024] 211, output unit; 212, input unit; 51, first dry contact circuit; 52, second dry contact circuit; 53, low-side output circuit; 61, address assignment circuit; 62, isolation circuit; 485-0, first RS485 communication circuit; 485-1, second RS485 communication circuit; CAN0, first CAN communication circuit; CAN1, second CAN communication circuit; CAN2, third CAN communication circuit;

[0025] J1, power input interface; J2, Hall power supply interface; J3, temperature interface; J4, current acquisition interface; J5, group terminal voltage negative interface; PE, insulation acquisition interface; J6, group terminal voltage positive interface; J7, first output interface; J8, second output interface; J9, input interface; J10, first communication interface; J11, second communication interface;

[0026] 70. Main control board; 80. Slave board.

[0027] Modes for Carrying Out the Invention

[0028] An embodiment of the present application provides a main control board of a battery management system, which has good anti-interference and safety. Figure 1 is a structural schematic diagram of a main control board of a battery management system provided by an embodiment of the present application. Referring to Figure 1, the main control board includes: a high-voltage board 10, a low-voltage board 20 and a connector 30. Among them, the high-voltage board 10 is provided with a controller minimum system 110, a power module 120 and a field signal acquisition module 130; the power module 120 and the field signal acquisition module 130 are both connected to the controller minimum system 110. A communication module 220 and an input-output module 210 are provided on the low-voltage board 20. The connector 30 is respectively connected to the high-voltage board 10 and the low-voltage board 20; the communication module 220 and the input-output module 210 are both connected to the controller minimum system 110 through the connector 30.

[0029] The controller minimum system 110 is the core processing component of the main control board and can be considered as a collection of the controller chip and its minimal peripheral circuits and components required for basic operation; the controller chip is, for example, a microcontroller unit (MCU). The power module 120 can connect to an external power source and convert the power signal provided by the external power source into the voltage required by multiple functional modules of the main control board to meet the power supply needs of the multiple functional modules of the main control board. The main control board can be deployed, for example, in the field. The field signal acquisition module 130 can connect to various sensors deployed in the field and be configured to convert the received sensor signals into signals that can be recognized by the controller minimum system 110. The field signal acquisition module 130 can, for example, receive temperature, voltage, and current signals from the battery pack. In summary, the external devices connected to the power board 10 include an external power source and various sensors installed in the field for signal acquisition. The voltage levels of these external devices are generally high, making the power board 10 equivalent to a high-voltage board. Placing the controller minimum system 110 on the high-voltage board 10 can ensure that the power supply and sensor signal transmission paths of the controller minimum system 110 are short, thereby ensuring the power supply stability and signal transmission reliability of the controller minimum system 110 and thus ensuring the reliability of the main control board.

[0030] The communication module 220 can be connected to the communication components in the external device in a wired or wireless manner so that the main control board can communicate with the external device. The input and output module 210 can be connected to the control components in the external device and transmit switch signals and drive signals, etc. For example, the input and output module 210 can output switch signals to control the on and off states of switch components such as external relays, and receive switch signals provided by external devices to control the working states of relevant functional modules in the main control board. For example, the external device connected to the weak-current board 20 is, for example, a slave board in a battery management system. The main control board can control whether the slave board is started through the input and output module 210, and receive signals such as the temperature and voltage of the battery cell collected by the slave board through the communication module 220. In summary, the weak-current board 10 interacts with the connected external device through communication signals and switch / drive signals. The voltage level borne by the relevant interfaces for realizing the above functions is relatively low, and the weak-current board 20 is equivalent to a low-voltage board.

[0031] The connector 30 serves as a connecting component between the strong current board 10 and the weak current board 20, and it may include at least one connector; the communication module 220 and the input and output module 210 are both connected to the relevant connectors through the wiring on the weak current board 20, and the controller minimum system 110 is connected to at least one connector through the wiring on the strong current board 10. The type and quantity of the connectors can be selected according to actual needs and are not limited here. When the functional module of the weak current board 20 needs to be connected to other functional modules in the strong current board 10, the connection is also achieved through the connector 30.

[0032] In the main control board of the battery management system provided by the embodiment of the present application, the strong current board 10 and the weak current board 20 are arranged separately, and the strong current board 10 and the weak current board 20 are connected by a connector 30. Among them, the functional module of the main control board that connects to external devices of high voltage level is mainly integrated in the strong current board 10, and the functional module that connects to external devices of low voltage level is mainly integrated in the weak current board 20. The embodiment of the present application divides the strong and weak current boards and arranges the functional modules of different voltage levels separately, which can effectively reduce the coupling and interference between strong and weak current signals, and reduce the risk of high voltage level functional module failure affecting low voltage level functional modules, and the strong and weak current boards can perform fault detection separately and independently, which is beneficial to the later maintenance of the main control board. Therefore, the embodiment of the present application can effectively improve the reliability and safety of the main control board.

[0033] Based on the aforementioned embodiments, the controller chip in the controller minimum system 110 can optionally be a domestically produced chip. Compared to imported chips, this can significantly improve the cost-effectiveness and safety of the main control board product. For example, the main control board can collect the total voltage, current, and temperature of the battery pack via the field signal acquisition module 130 and receive information from at least one individual battery cell collected by the slave board via the communication module 220. All of this parameter information is aggregated and processed by the controller minimum system 110. Based on this process, the main control board can be configured to control and manage information from the entire battery pack, collect the total voltage, current, and temperature of the entire pack, gather information from individual batteries, and generate alarms and protection for abnormalities in the battery pack. For example, the main control board can protect the battery pack according to relevant safety processing rules, ensuring safe and stable operation. When abnormal faults such as severe overvoltage, undervoltage, overcurrent, or leakage occur, the main control board can issue control instructions via the communication module 220 and / or drive control signals via the input / output module 210 to control the disconnection of the entire battery pack, preventing overcharging, overdischarge, and overcurrent.

[0034] Based on the above embodiments, the high-current board 10 and the low-current board 20 are optionally stacked, and the connector 30 is disposed between the high-current board 10 and the low-current board 20. Referring to FIG2 , for example, the connector 30 may include at least one (two shown) connectors 310 disposed on the side of the high-current board 10 close to the low-current board 20 and on the side of the low-current board 20 close to the high-current board 10, to achieve plug-in connection between the high-current board 10 and the low-current board 20. The connection relationship between the functional modules in the low-current board 20 and the at least one connector 310 can be arranged according to actual needs. For example, the connection between at least one functional module and the corresponding connector 310 should be as short as possible, and at least one connection should not cross. For example, the controller minimum system 110, the power supply module 120 and the field signal acquisition module 130 can all be arranged on the side of the high-voltage board 10 close to the low-voltage board 20, and the communication module 220 and the input-output module 210 can all be arranged on the side of the low-voltage board 20 away from the high-voltage board 10. However, this is not a limitation of the present application, and the components in the high-voltage board 10 and the low-voltage board 20 can be arranged on the same side or both sides of the board as needed.

[0035] This embodiment stacks the high-voltage board 10 and the low-voltage board 20 to form a double-layer main control board, effectively reducing product size and facilitating on-site installation. For example, the high-voltage board 10 and the low-voltage board 20 can be of identical shape and size and completely overlap to minimize product size.

[0036] The above embodiments describe the main functional modules of the main control board. The following, in conjunction with Figure 2, provides an exemplary description of the possible structures of the various functional modules, but this does not limit the present application. The following describes the structure of the high-voltage board 10, followed by the structure of the low-voltage board 20.

[0037] Referring to Figure 2, in one embodiment, the power module 120 optionally includes: a power input interface J1, a direct current to direct current (DCDC) converter 21, an isolated power chip 22, and a first power conversion chip 23, connected in sequence. The power input interface J1 is configured to connect to a DC power source, such as a ±24V power source; the first power conversion chip 23 is connected to the controller minimum system 110. The DCDC converter 21 can, for example, step down the power signal provided by the DC power source. The isolated power chip 22 ensures power supply security. The first power conversion chip 23 can, for example, output a 3.3V voltage to power the controller minimum system 110. The first power conversion chip 23 can also supply power to other components that require the same supply voltage as the controller minimum system 110. The power module 120 may also include other power conversion chips to supply power to components on the main control board that require other supply voltages.

[0038] Based on the above embodiments, the power module 120 optionally further includes a second power conversion chip 24 and a Hall-effect power supply interface J2. The second power conversion chip 24 is connected to the isolated power chip 22 and the Hall-effect power supply interface J2, respectively. The Hall-effect power supply interface J2 can be configured to connect to a Hall-effect current sensor, and the second power conversion chip 24 can output, for example, a ±12V power signal to power the Hall-effect current sensor. The Hall-effect current sensor can be configured to detect the bus current of the DC bus to which the battery pack is connected.

[0039] Based on the above-mentioned multiple embodiments, the power module 120 optionally further includes: a wake-up circuit, wherein the input end of the wake-up circuit is connected to the power supply control signal, and the output end of the wake-up circuit is connected to the enable end of the DCDC converter 21. The wake-up circuit is configured to control whether the DCDC converter 21 is enabled according to the power supply control signal. The power supply control signal can be provided by a host computer or a power supply control button in the battery management system. In this embodiment, the DCDC converter 21 can be disabled when the main control board is in standby or idle for a long time, so that the main control board is dormant and operates in the lowest power consumption state, thereby reducing the power consumption of the main control board; when the main control board needs to resume operation, the DCDC converter 21 can be enabled by the wake-up circuit to wake up the main control board. Exemplarily, the power supply voltage of the power supply connected to the power input interface J1 is DC24V±10% Vdc. Under this mechanism, the power consumption of the main control board can be guaranteed to be less than 3W.

[0040] The field signal acquisition module 130 includes a temperature acquisition unit 131 and / or a current acquisition unit 132 and / or an insulation detection unit 133 .

[0041] Continuing with FIG2 , in one embodiment, the field signal acquisition module 130 optionally includes a temperature acquisition unit 131. The temperature acquisition unit 131 includes a temperature interface J3 and a temperature acquisition circuit 31; the temperature acquisition circuit 31 is respectively connected to the temperature interface J3 and the controller minimum system 110. The temperature interface J3 is configured to connect to a temperature sensor deployed on-site, such as one located around the battery pack; illustratively, the temperature interface J3 may include multiple groups (e.g., four groups) of connecting pins, each group of connecting pins connected to a temperature sensor, to enable acquisition of multiple temperature signals. The temperature sensor may include, for example, a thermistor, which may be a negative temperature coefficient thermistor (NTC). The temperature acquisition circuit 31 is configured to convert the signal collected by the temperature interface J3 into a signal recognizable by the controller minimum system 110; the temperature acquisition circuit 31 is, for example, an NTC circuit.

[0042] In another embodiment, optionally, the field signal acquisition module 130 includes: a current acquisition unit 132. The current acquisition unit 132 includes: a current acquisition interface J4, a first operational amplifier circuit OP1, and a first analog-to-digital conversion circuit ADC1 connected in sequence. Among them, the current acquisition interface J4 can be configured to connect to a shunt, and the shunt can be set on the DC bus connected to the battery pack to detect the bus current; the first analog-to-digital conversion circuit ADC1 is connected to the controller minimum system 110. Exemplarily, the first operational amplifier circuit OP1 may include a low-offset single operational amplifier and its peripheral circuits, and the first analog-to-digital conversion circuit ADC1 may include an analog-to-digital converter and its peripheral circuits. This embodiment is configured in this way, in conjunction with the Hall current sensor-related interfaces and circuits mentioned in the above embodiment, which is equivalent to providing two bus current detection methods, which is conducive to improving the compatibility and applicability of the main control board.

[0043] In another embodiment, the field signal acquisition module 130 optionally includes an insulation detection unit 133. The insulation detection unit 133 may include a negative terminal voltage interface J5, a positive terminal voltage interface J6, an insulation acquisition interface PE, a positive terminal insulation detection circuit 33, a negative terminal insulation detection circuit 32, a second operational amplifier circuit OP2, and a second analog-to-digital conversion circuit ADC2. The negative terminal voltage interface J5 can be connected to the negative terminal of the battery pack to obtain the negative terminal voltage, the positive terminal voltage interface J6 can be connected to the positive terminal of the battery pack to obtain the positive terminal voltage, and the insulation acquisition interface PE can be connected to the insulation terminal (e.g., the housing) of a device powered by the battery pack to obtain the insulation terminal voltage. The negative terminal voltage interface J5 is connected to the negative terminal insulation detection circuit 32, and the positive terminal voltage interface J6 is connected to the positive terminal insulation detection circuit 33. The insulation acquisition interface PE is connected to the positive terminal insulation detection circuit 33 and the negative terminal insulation detection circuit 32, respectively. The positive terminal insulation detection circuit 33 and the negative terminal insulation detection circuit 32 are both connected to the second operational amplifier circuit OP2, which is connected to the second analog-to-digital conversion circuit ADC2. The second analog-to-digital conversion circuit ADC2 is connected to the controller minimum system 110. The output of the positive terminal insulation detection circuit 33, for example, represents the insulation resistance of the positive terminal of the battery pack, and the output of the negative terminal insulation detection circuit 32, for example, represents the insulation resistance of the negative terminal of the battery pack. The second operational amplifier circuit OP2 can be provided with two sets of operational amplifiers (e.g., low-offset single operational amplifiers) configured to process the outputs of the positive terminal insulation detection circuit 33 and the negative terminal insulation detection circuit 32, respectively. Furthermore, the second analog-to-digital conversion circuit ADC2 can be provided with two sets of analog-to-digital converters to process the outputs of the two sets of operational amplifiers.

[0044] The field signal acquisition module 130 may be configured with one or more of the temperature acquisition unit 131 , the current acquisition unit 132 and the insulation detection unit 133 as needed.

[0045] Based on the above embodiments, the field signal acquisition module 130 optionally includes a current acquisition unit 132 and an insulation detection unit 133. The field signal acquisition module 130 also includes a signal isolation circuit 34. The first analog-to-digital conversion circuit ADC1 in the current acquisition unit 132 and / or the second analog-to-digital conversion circuit ADC2 in the insulation detection unit 133 can be connected to the controller minimum system 110 via the signal isolation circuit 34 to isolate different signals, prevent mutual interference between them, and improve the anti-interference capability of the main control board. The isolation circuit 34 can be any form of signal isolation circuit, such as an inter-integrated circuit (IIC) isolator. The field signal acquisition module 130 includes the current acquisition unit 132, and the first analog-to-digital conversion circuit ADC1 is connected to the controller minimum system 110 via the signal isolation circuit 34; and / or the field signal acquisition module 130 includes the insulation detection unit 133, and the second analog-to-digital conversion circuit ADC2 is connected to the controller minimum system 110 via the signal isolation circuit 34.

[0046] Continuing with FIG. 2 , based on the aforementioned embodiments, the power board 10 may optionally further include a watchdog circuit 41 and a selection jumper 42 , wherein the selection jumper 42 is connected between the watchdog circuit 41 and the controller minimum system 110 . The selection jumper 42 allows for selecting whether to provide the watchdog function to the controller minimum system 110 . When the watchdog circuit 41 is enabled, the watchdog function may be configured to cause the controller minimum system 110 to reset if it does not receive a feed signal from the controller minimum system 110 within a preset period of time, thereby preventing the impact of failures such as program runaway.

[0047] The above embodiments have described the detailed structure of the high-current board 10 . Now, the structure of the low-current board 20 will be described.

[0048] Continuing to refer to FIG. 2 , in one embodiment, optionally, the input-output module 210 includes: an output unit 211 and an input unit 212 .

[0049] Exemplarily, the output unit 211 includes: a multi-channel dry contact circuit, a multi-channel low-side output circuit, a first output interface J7, and a second output interface J8. The multi-channel dry contact circuit and the multi-channel low-side output circuit are both connected to the controller minimum system 110 via the connector 30; some dry contact circuits are connected to the first output interface J7, and the remaining dry contact circuits and the multi-channel low-side output circuits are both connected to the second output interface J8. This enables the output of multiple channels and multiple types of signals, ensuring the main control board's ability to control external devices. Exemplarily, different dry contact circuits can be connected to different pins in the first output interface J7, and the dry contact circuits and low-side output circuits can be connected to different pins in the second output interface J8, to avoid signal competition.

[0050] For example, two dry contact circuits and six low-side output circuits can be configured in the weak current board 20. As shown in FIG2 , a second dry contact circuit 52 can be set to connect to the first output interface J7, and the first dry contact circuit 51 and the multiple low-side output circuits 53 can be connected to different pins in the second output interface J8.

[0051] The input unit 212 may include: an input interface J9, an address allocation circuit 61 and an isolation circuit 62; the address allocation circuit 61 and the isolation circuit 62 are both connected to the controller minimum system 110 through the connector 30, and the address allocation circuit 61 and the isolation circuit 62 are both connected to the input interface J9. Among them, the address allocation circuit 61 can be configured to parse the signal source address; the isolation circuit 62 is configured to isolate the external signal and transmit it to the controller minimum system 110 to ensure the safety of the main control board and avoid introducing the failure of the external device into the main control board. The isolation circuit 62 is, for example, an isolation switch input circuit, which is composed of isolation devices such as optocouplers. Exemplarily, the address allocation circuit 61 and the isolation circuit 62 can be connected to different pins in the input interface J9 respectively to avoid signal competition. Among them, the address allocation circuit 61 can be connected to the address line in the system through the input interface J9, and the isolation circuit 62 can be connected to six groups of pins in the input interface J9, and is configured to receive six input signals.

[0052] Continuing with FIG. 2 , in one embodiment, the communication module 220 optionally includes: multiple RS485 communication circuits, multiple Controller Area Network (CAN) communication circuits, a first communication interface J10, and a second communication interface J11. The multiple RS485 communication circuits and the multiple CAN communication circuits are both connected to the controller minimum system 110 via a connector 30. Part of the RS485 communication circuits and part of the CAN communication circuits are both connected to the first communication interface J10, and the remaining RS485 communication circuits and the remaining CAN communication circuits are both connected to the second communication interface J11. This configuration of this embodiment makes the main control board compatible with both RS485 and CAN communication modes, effectively expanding the scope of application of the main control board.

[0053] For example, some RS485 communication circuits and some CAN communication circuits can be connected to different pins in the first communication interface J10, and the remaining RS485 communication circuits and the remaining CAN communication circuits can be connected to different pins in the second communication interface J11 to avoid signal competition. For example, referring to Figure 2, the weak current board 20 can be configured with two RS485 communication circuits and three CAN communication circuits; the first CAN communication circuit CAN0, the third CAN communication circuit CAN2, and the second RS485 communication circuit 485-1 can be connected to the first communication interface J10, and the second CAN communication circuit CAN1 and the first RS485 communication circuit 485-0 can be connected to the second communication interface J11.

[0054] Based on the main control board shown in Figure 2, its weak current board 20 is equipped with six low-side outputs, two dry contact outputs, and six inputs; three CAN transmission channels, and two RS485 transmission channels. The main control board's basic functions include real-time monitoring of the battery pack's terminal voltage, current, temperature, and insulation resistance; real-time calculation of the battery pack's state of charge (SOC) and state of health (SOH); and real-time data and alarm information reception and upload, enabling remote monitoring of the battery pack. The DC power supply provides a DC24V ±10% VDC voltage and consumes less than 3W.

[0055] In summary, in the main control board provided in the embodiment of the present application, by separating the strong and weak current boards, the main control board can have better anti-interference performance. Compared with the traditional main control board suitable for most application scenarios, the main control board provided in the embodiment of the present application has streamlined the functional modules, retaining the functional modules required for application in the battery management system. At least one functional module in the main control board is necessary in battery management, and at least one interface can have a high utilization rate in the application. Combined with the setting of the double-layer board structure of the main control board, the product size can be effectively reduced and it is convenient for on-site installation. Furthermore, the raw materials of at least one functional module in the main control board can be selected from domestic chips, which can effectively improve the cost-effectiveness, safety and market competitiveness of the product.

[0056] For the high-voltage board 10 and the low-voltage board 20, for ease of illustration, FIG2 shows the interfaces and circuits on the boards divided by dotted lines. At least one interface is the portion of the board that connects to external devices, and at least one circuit is a functional circuit arranged to implement the actual functions of the board, connected to at least one interface. FIG2 is merely an exemplary display and does not serve as the actual circuit layout structure of the main control board. When the high-voltage board 10 and the low-voltage board 20 are actually wired, the relative positions of at least one circuit and interface can be adjusted according to actual circumstances. For example, the connection between the functional circuit and the corresponding interface can be set as short as possible to simplify the wiring of the main control board.

[0057] The embodiments of the present application also provide a battery management system, including the main control board provided in any embodiment of the present application, which has the corresponding effect. For example, the battery management system can be a battery management system with a multi-level architecture, including a main control board 70 and multiple slave boards 80. The main control board 70 can be configured to monitor the voltage, current, temperature, insulation and other status parameters of the battery pack as a whole, and the slave board 80 can be configured to monitor the voltage and temperature and other status parameters of the battery cells in the battery pack. The control unit of the switch component connected to the battery pack, the host computer and the slave board 80 can all be connected to the main control board 70 through the interface in the weak current board, for example, through the input and output module to perform signal interaction with the controller minimum system, and / or, through the communication module to perform signal interaction with the controller minimum system.

[0058] The above embodiments do not limit the scope of protection of this application. Various modifications, combinations, sub-combinations, and substitutions may be made based on design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application shall be included in the scope of protection of this application.

Claims

1. A main control board of a battery management system, comprising: A high-voltage board (10); a controller minimum system (110), a power supply module (120), and a field signal acquisition module (130) are arranged on the high-voltage board (10); the power supply module (120) and the field signal acquisition module (130) are both connected to the controller minimum system (110); A low-voltage board (20); a communication module (220) and an input / output module (210) are arranged on the low-voltage board (20); A connector (30) that is respectively connected to the high-voltage board (10) and the low-voltage board (20); the communication module (220) and the input / output module (210) are both connected to the controller minimum system (110) through the connector (30).

2. The main control board of the battery management system according to claim 1, wherein, The power supply module (120) includes: a power input interface (J1), a DC-DC converter (21), an isolated power supply chip (22), and a first power conversion chip (23) that are connected in sequence; the first power conversion chip (23) is connected to the controller minimum system (110).

3. The main control board of the battery management system according to claim 2, wherein, The power supply module (120) further includes: a second power conversion chip (24) and a Hall power supply interface (J2); the second power conversion chip (24) is respectively connected to the isolated power supply chip (22) and the Hall power supply interface (J2).

4. The main control board of the battery management system according to claim 1, wherein, The field signal acquisition module (130) includes at least one of the following: A temperature acquisition unit (131), including: a temperature interface (J3) and a temperature acquisition circuit (31); the temperature acquisition circuit (31) is respectively connected to the temperature interface (J3) and the controller minimum system (110); Or, a current acquisition unit (132), including: a current acquisition interface (J4), a first operational amplifier circuit (OP1), and a first analog-to-digital conversion circuit (ADC1) that are connected in sequence; the first analog-to-digital conversion circuit (ADC1) is connected to the controller minimum system (110); Or, an insulation detection unit (133), including: a group terminal voltage negative interface (J5), a group terminal voltage positive interface (J6), an insulation acquisition interface (PE), a positive pole insulation detection circuit (33), a negative pole insulation detection circuit (32), a second operational amplifier circuit (OP2), and a second analog-to-digital conversion circuit (ADC2); the group terminal voltage negative interface (J5) is connected to the negative pole insulation detection circuit (32), the group terminal voltage positive interface (J6) is connected to the positive pole insulation detection circuit (33), and the insulation acquisition interface (PE) is respectively connected to the positive pole insulation detection circuit (33) and the negative pole insulation detection circuit (32), the positive pole insulation detection circuit (33) and the negative pole insulation detection circuit (32) are both connected to the second operational amplifier circuit (OP2), the second operational amplifier circuit (OP2) is connected to the second analog-to-digital conversion circuit (ADC2), and the second analog-to-digital conversion circuit (ADC2) is connected to the controller minimum system (110).

5. The main control board of the battery management system according to claim 4, wherein, The field signal acquisition module (130) further includes: a signal isolation circuit (34); Wherein, the main control board includes at least one of the following: The on-site signal acquisition module (130) includes the current acquisition unit (132), and the first analog-to-digital conversion circuit (ADC1) is connected to the controller minimum system (110) through the signal isolation circuit (34); Or, The on-site signal acquisition module (130) includes the insulation detection unit (133), and the second analog-to-digital conversion circuit (ADC2) is connected to the controller minimum system (110) through the signal isolation circuit (34).

6. The main control board of the battery management system according to claim 1, wherein, The power board (10) further includes: a watchdog circuit (41) and a selection jumper (42), and the selection jumper (42) is connected between the watchdog circuit (41) and the controller minimum system (110).

7. The main control board of the battery management system according to claim 1, wherein, The input / output module (210) includes: An output unit (211), including: a multi-channel dry contact circuit, a multi-channel low-side output circuit (53), a first output interface (J7), and a second output interface (J8); both the multi-channel dry contact circuit and the multi-channel low-side output circuit (53) are connected to the controller minimum system (110) through the connector (30), some of the dry contact circuits are connected to the first output interface (J7), and the remaining dry contact circuits and the multi-channel low-side output circuit (53) are both connected to the second output interface (J8); An input unit (212), including: an input interface (J9), an address allocation circuit (61), and an isolation circuit (62); both the address allocation circuit (61) and the isolation circuit (62) are connected to the controller minimum system (110) through the connector (30), and both the address allocation circuit (61) and the isolation circuit (62) are connected to the input interface (J9).

8. The main control board of the battery management system according to claim 1, wherein, The communication module (220) includes: a multi-channel RS485 communication circuit, a multi-channel controller area network CAN communication circuit, a first communication interface (J10), and a second communication interface (J11); both the multi-channel RS485 communication circuit and the multi-channel CAN communication circuit are connected to the controller minimum system (110) through the connector (30), some of the RS485 communication circuits and some of the CAN communication circuits are both connected to the first communication interface (J10), and the remaining RS485 communication circuits and the remaining CAN communication circuits are both connected to the second communication interface (J11).

9. The main control board of the battery management system according to any one of claims 1 to 8, wherein, The power board (10) and the weak current board (20) are stacked, and the connector (30) is arranged between the power board (10) and the weak current board (20).

10. A battery management system, comprising: The main control board (70) and multiple slave boards (80) of the battery management system according to any one of claims 1 to 9, and the slave boards (80) are connected to the main control board (70) through the interfaces in the weak current board (20).

Images