Sample holder

Abstract

This sample holder comprises a ceramic body, a base member, and a heat insulation part. The heat insulation part is positioned between the ceramic body and the base member. The heat insulation part has a heat insulation layer.

Description

Sample holder

[0001] SUMMARY OF THE INVENTION The disclosed embodiments relate to a sample holder.

[0002] There are sample holders for holding samples such as semiconductor wafers to be plasma processed. Such sample holders are constructed by bonding a ceramic body having a sample support surface to a metal cooling member.

[0003] Furthermore, a structure has been proposed for a sample holder in which a composite material with a thermal expansion coefficient relatively close to that of the ceramic body is placed between a ceramic body and a cooling member, the composite material and the cooling member are joined with an adhesive, and the composite material and the ceramic body are joined with a metal (see, for example, Patent Document 1).

[0004] JP 2017-126640 A

[0005] According to one aspect of the embodiment, a sample holder includes a ceramic body, a base member, and a thermal insulator, the thermal insulator being positioned between the ceramic body and the base member, the thermal insulator having a thermal insulating layer.

[0006] FIG. 1A is a perspective view schematically showing the configuration of a sample holder according to the first embodiment. FIG. 1B is a cross-sectional view schematically showing the sample holder according to the first embodiment. FIG. 2 is a cross-sectional view schematically showing the sample holder according to the second embodiment. FIG. 3A is a cross-sectional view schematically showing the sample holder according to the third embodiment. FIG. 3B is a cross-sectional view schematically showing the sample holder according to the fourth embodiment. FIG. 4 is a cross-sectional view schematically showing the sample holder according to the fifth embodiment. FIG. 5 is a cross-sectional view schematically showing the sample holder according to the sixth embodiment. FIG. 6 is a cross-sectional view schematically showing the sample holder according to the seventh embodiment. FIG. 7 is a cross-sectional view schematically showing the sample holder according to the eighth embodiment. FIG. 8 is a cross-sectional view schematically showing the sample holder according to the ninth embodiment. FIG. 9 is a cross-sectional view schematically showing the sample holder according to the tenth embodiment. FIG. 10A is a diagram showing an example of the configuration of the buffer member shown in FIG. 9. FIG. 10B is a diagram showing another example of the configuration of the buffer member shown in FIG. 9. FIG. 10C is a diagram showing another example of the configuration of the buffer member shown in FIG. 9. FIG. 10D is a diagram showing another example of the configuration of the buffer member shown in FIG. 9 . FIG. 11 is a cross-sectional view schematically showing a sample holder according to an eleventh embodiment. FIG. 12 is a cross-sectional view schematically showing a sample holder according to a twelfth embodiment. FIG. 13A is a cross-sectional view schematically showing a sample holder according to a thirteenth embodiment. FIG. 13B is a cross-sectional view schematically showing a sample holder according to a fourteenth embodiment. FIG. 14A is a diagram showing an example of the configuration of the protrusions shown in FIGS. 13A and 13B . FIG. 14B is a diagram showing another example of the configuration of the protrusions shown in FIGS. 13A and 13B . FIG. 14C is a diagram showing another example of the configuration of the protrusions shown in FIGS. 13A and 13B . FIG. 14D is a diagram showing another example of the configuration of the protrusions shown in FIGS. 13A and 13B . FIG. 14E is a diagram showing another example of the configuration of the protrusions shown in FIGS. 13A and 13B . FIG. 14F is a diagram showing another example of the configuration of the protrusions shown in FIGS. 13A and 13B . Fig. 15 is a cross-sectional view schematically showing a sample holder according to a fifteenth embodiment. Fig. 16 is a cross-sectional view schematically showing a sample holder according to a sixteenth embodiment. Fig. 17A is a diagram showing an example of an in-plane distribution of protrusions. Fig. 17B is a diagram showing another example of an in-plane distribution of protrusions. Fig. 17C is a diagram showing another example of an in-plane distribution of protrusions.Fig. 18 is a cross-sectional view schematically showing a sample holder according to the seventeenth embodiment. Fig. 19 is a cross-sectional view schematically showing a sample holder according to the eighteenth embodiment. Fig. 20 is a cross-sectional view schematically showing a sample holder according to the nineteenth embodiment. Fig. 21 is a cross-sectional view schematically showing a sample holder according to the twentieth embodiment. Fig. 22 is a cross-sectional view schematically showing a sample holder according to the twenty-first embodiment. Fig. 23 is a cross-sectional view schematically showing a sample holder according to the twenty-second embodiment. Fig. 24 is a cross-sectional view schematically showing the II cross section shown in Fig. 23.

[0007] Hereinafter, embodiments of the sample holder disclosed in the present application will be described with reference to the accompanying drawings. Note that the present disclosure is not limited to the embodiments shown below. It should be noted that the drawings are schematic, and the dimensional relationships and ratios of each element may differ from reality. Furthermore, the dimensional relationships and ratios may differ between the drawings.

[0008] Furthermore, in the following embodiments, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not necessarily mean "constant," "orthogonal," "perpendicular," or "parallel" in the strict sense. In other words, the above expressions allow for deviations due to, for example, manufacturing precision, installation precision, etc.

[0009] When a ceramic body is used at a high temperature, for example, above 300°C, a difference in thermal expansion occurs between the surface of the composite material sandwiched between the high-temperature ceramic body and a cooling member, which faces the ceramic body, and the back surface of the composite material, which faces the cooling member, causing warping of the composite material. As a result, warping also occurs in the ceramic body in response to the warping of the composite material, reducing thermal uniformity and the in-plane temperature uniformity of the sample held on the sample-supporting surface of the ceramic body.

[0010] It is hoped that a sample holder that can solve the above problems and easily improve thermal uniformity in high-temperature environments will be realized.

[0011] <First embodiment> Fig. 1A is a perspective view schematically showing the configuration of a sample holder according to a first embodiment, and Fig. 1B is a cross-sectional view schematically showing the sample holder according to the first embodiment.

[0012] As shown in FIGS. 1A and 1B, the sample holder 100 includes a ceramic plate (ceramic body) 10, a base member 20, and a heat insulating portion 30.

[0013] The ceramic plate 10 is a member obtained by forming a ceramic-containing raw material into a substantially circular disk shape and firing it. The ceramic plate 10 utilizes electrostatic force to attract and hold a sample, such as a semiconductor wafer. The ceramic plate 10 contains, for example, aluminum nitride (AlN) as a main component. In the present disclosure, the main component is, for example, a material that accounts for 50 mass % or more of the material. The ceramic plate 10 may also contain a ceramic other than aluminum nitride, such as aluminum oxide (Al ２ O ３ ) or yttria (Y ２ O ３ ) may be contained as a main component.

[0014] A first electrode 11 for electrostatic attraction and a second electrode 12 for heating are located inside the ceramic plate 10 below the first electrode 11. The first electrode 11 attracts a sample held on the ceramic plate 10 by electrostatic force. The second electrode 12 heats the ceramic plate 10 to adjust the temperature to that of the sample. The first electrode 11 and the second electrode 12 can be made of metals such as platinum, tungsten, and molybdenum. However, the materials for the first electrode 11 and the second electrode 12 are not limited to these.

[0015] The base member 20 is a substantially cylindrical member. The material of the base member 20 may be, for example, a metal such as aluminum, titanium, or stainless steel, or a composite material of a ceramic such as silicon carbide and a metal such as aluminum. However, the material of the base member 20 is not limited to these.

[0016] The base member 20 has a flow path 20c through which a liquid or gaseous heat exchange medium flows. By adjusting the temperature of the heat exchange medium flowing through the flow path 20c, the base member 20 may function as a cooling member that cools members around the base member 20. The base member 20 may be, for example, a heat exchanger. The base member 20 may also serve as, for example, a high-frequency electrode.

[0017] The heat insulating portion 30 is located between the ceramic plate 10 and the base member 20. The heat insulating portion 30 has a heat insulating layer. The heat insulating layer 30A shown in FIG. 1B is an example of a heat insulating layer. The heat insulating layer 30A is a solid structure having heat insulating properties. The heat insulating layer 30A can be composed of one structure or multiple structures.

[0018] The heat insulating layer may have a hollow heat insulating region. In other words, the heat insulating layer may have a space that is not in direct contact with the ceramic plate 10 and the base member 20 and is separated from the ceramic plate 10 and the base member 20, and this space is called the heat insulating region. The heat insulating region may be a space in an atmospheric pressure atmosphere or a vacuum (reduced pressure) atmosphere. The heat insulating region may be filled with a specific gas.

[0019] The second electrode 12 for the heater heats the ceramic plate 10. This allows the second electrode 12 to adjust the sample temperature to, for example, 300°C or higher. Furthermore, when plasma processing is performed on a sample, the ceramic plate 10 becomes hot due to heat input from the plasma. By flowing a heat exchange medium at a predetermined temperature through the flow path 20c of the base member 20, the base member 20 is cooled and adjusted to a lower temperature than the ceramic plate 10. If a composite material with a thermal expansion coefficient relatively close to that of the ceramic plate 10 is placed between the ceramic plate 10 and the base member 20, a difference in thermal expansion occurs between the surface of the composite material sandwiched between the high-temperature ceramic plate 10 and the low-temperature base member 20, facing the ceramic plate 10, and the back surface of the composite material facing the base member 20, causing warping of the composite material. As a result, warping of the ceramic body occurs in response to the warping of the composite material, reducing thermal uniformity and the in-plane temperature uniformity of the sample held on the sample-holding surface of the ceramic plate 10.

[0020] In contrast, if the composite is made of a material with a relatively low thermal expansion coefficient, the difference in thermal expansion between the front and back surfaces of the composite is unlikely to occur, making the composite less likely to warp. However, in this case, the difference in thermal expansion between the ceramic plate 10 and the composite may cause stress in the bonding layer between the ceramic plate 10 and the composite, potentially leading to peeling of the bonding layer. This may result in a decrease in thermal uniformity and a decrease in the in-plane temperature uniformity of the sample held on the sample support surface of the ceramic plate 10.

[0021] Therefore, in the embodiment, a heat insulating portion 30 having a heat insulating layer 30A is provided between the ceramic plate 10 and the base member 20. The heat insulating portion 30 has an excellent function of suppressing mutual diffusion of heat between the ceramic plate 10 and the base member 20. For example, the heat insulating portion 30 is made of a material that has better heat insulating properties than a heat-resistant material such as cordierite, and has an excellent function of suppressing heat transfer between the ceramic plate 10 and the base member 20. However, the heat insulating portion 30 does not function to prevent any heat transfer between the ceramic plate 10 and the base member 20.

[0022] By positioning the heat insulating portion 30 between the ceramic plate 10 and the base member 20, the temperature of the cooled base member 20 is less likely to be transmitted to the ceramic plate 10, which is used at high temperatures. This makes it less likely that a temperature gradient will occur within the ceramic plate 10, and the ceramic plate 10 will not warp, improving thermal uniformity. This makes it possible to improve the in-plane temperature uniformity of the sample held on the ceramic plate 10.

[0023] The insulating layer 30A has a first surface 30a and a second surface 30b located opposite the first surface 30a. In the embodiment, the insulating layer 30A coincides with the insulating section 30, but the insulating layer 30A may be located in a part of the insulating section 30.

[0024] The base member 20 is located opposite the ceramic plate 10 with the thermal insulation layer 30A sandwiched therebetween. The base member 20 is a support member that supports the ceramic plate 10 and the thermal insulation portion 30. The base member 20 is attached to, for example, a semiconductor manufacturing device, and causes the sample holder 100 to function as a semiconductor holder that holds samples such as semiconductor wafers. The base member 20 has a third surface 20a and a fourth surface 20b located opposite the third surface 20a. The second surface 30b of the thermal insulation layer 30A and the third surface 20a of the base member 20 face each other.

[0025] The ceramic plate 10 has a fifth surface 10a for holding a sample and a sixth surface 10b located opposite the fifth surface 10a. A sample such as a semiconductor wafer is held on the fifth surface 10a. That is, the fifth surface 10a serves as a sample support surface for holding the sample. The first surface 30a of the heat insulating layer 30A and the sixth surface 10b of the ceramic plate 10 face each other.

[0026] 2 to 9, 11 to 13B, 15 to 18, and 23, which will be referred to in the next embodiment, the first electrode 11, the second electrode 12, and the flow path 20c are omitted from the illustration.

[0027] Second Embodiment Fig. 2 is a cross-sectional view schematically showing a sample holder according to a second embodiment. The sample holder 100 shown in Fig. 2 further includes a heat diffusion member 40. The heat diffusion member 40 is located between the ceramic plate 10 and the heat insulating portion 30. The heat diffusion member 40 may be made of aluminum nitride (AlN) or tungsten (W). However, the material of the heat diffusion member 40 is not limited to these.

[0028] The heat diffusion member 40 uses a material with higher thermal conductivity than the ceramic plate 10. Therefore, the heat diffusion member 40 may be made of either the same material as the ceramic plate 10 or a different material, as long as it has higher thermal conductivity than the ceramic plate 10. The heat diffusion member 40 facilitates heat transfer in the in-plane direction (planar direction). This can further improve the thermal uniformity of the ceramic plate 10, making the in-plane temperature of the ceramic plate 10 more uniform.

[0029] The heat diffusion member 40 has a seventh surface 40 a and an eighth surface 40 b located opposite the seventh surface 40 a. The seventh surface 40 a of the heat diffusion member 40 faces the sixth surface 10 b of the ceramic plate 10, and the eighth surface 40 b of the heat diffusion member 40 faces the first surface 30 a of the heat insulating portion 30.

[0030] Third Embodiment Fig. 3A is a cross-sectional view schematically illustrating a sample holder according to a third embodiment. The sample holder 100 illustrated in Fig. 3A further includes a protective member 50 positioned around the heat insulating section 30. The protective member 50 is annular, which facilitates uniform temperature distribution across the protective member 50. The protective member 50 is disposed around the heat insulating section 30 and covers the entire outer periphery of the heat insulating section 30. One end face 50a of the protective member 50 is positioned around the eighth surface 40b of the heat diffusion member 40, and the other end face 50b of the protective member 50 is positioned around the third surface 20a of the base member 20. Here, "positioned around the heat insulating section 30" means, for example, that the protective member 50 covers at least a portion of the outer periphery of the heat insulating section 30.

[0031] By covering the outer periphery of the heat insulating unit 30 with the protective member 50, the temperature of the outer periphery of the heat insulating unit 30 becomes uniform before heat dissipates from the outer periphery to the outside. Therefore, the uniform temperature of the outer periphery of the heat insulating unit 30 further improves the thermal uniformity of the ceramic plate 10. The protective member 50 may be made of a heat-resistant insulating material, such as mullite, aluminum nitride, cordierite, or aluminum oxide. Furthermore, the protective member 50 may be made of multiple annular materials of approximately the same shape stacked one on top of the other, with the material facing the ceramic plate 10 being heat-resistant, such as mullite, aluminum nitride, cordierite, or aluminum oxide. The material facing the base member 20 may be a heat-resistant material, or may be a resin material such as PTFE (polytetrafluoroethylene) or glass primarily composed of silicon oxide. Incidentally, grooves or steps along the periphery on the upper and lower surfaces of the protective member 50 allow it to be bonded to the ceramic plate 10 and the base member 20. However, the protective member 50 is not limited to these materials.

[0032] 3B is a cross-sectional view schematically illustrating a sample holder according to a fourth embodiment. The sample holder 100 shown in FIG. 3B does not have a heat diffusion member 40. In this case, one end face 50a of the protective member 50 is located on the outer periphery of the sixth surface 10b of the ceramic plate 10, and the other end face 50b of the protective member 50 is located on the outer periphery of the third surface 20a of the base member 20.

[0033] The protective member 50 covers the entire outer periphery of the heat insulating section 30. One end face 50a of the protective member 50 is located on the outer periphery of the sixth surface 10b of the ceramic plate 10, and the other end face 50b of the protective member 50 is located on the outer periphery of the third surface 20a of the base member 20. However, the protective member 50 may cover at least a portion of the outer periphery of the heat insulating section 30. By having the protective member 50 cover the outer periphery of the heat insulating section 30, the temperature of the outer periphery of the heat insulating section 30 becomes uniform. This can further improve the thermal uniformity of the ceramic plate 10.

[0034] 4 is a cross-sectional view schematically showing a sample holder according to a fifth embodiment. In the sample holder 100 shown in Fig. 4, one end face 50a of a protective member 50 is joined to the eighth face 40b of the heat diffusion member 40 by a first bonding material 61, and the other end face 50b is joined to the third face 20a of the base member 20 by a second bonding material 62.

[0035] By arranging the first bonding material 61 and the second bonding material 62 so as to surround the outer periphery of the protective member 50, the outer periphery temperature of the insulating section 30 becomes uniform, thereby further improving the thermal uniformity of the ceramic plate 10.

[0036] Since the temperature of the ceramic plate 10 is relatively high, the first bonding material 61 ２ O ３ Glass or the like can be used. Silicone resin or the like can be used for the second bonding material 62 because the temperature of the base member 20 is relatively low. However, the materials of the first bonding material 61 and the second bonding material 62 are not limited to this.

[0037] The heat diffusion member 40 may be omitted if necessary. In this case, one end surface 50a of the protective member 50 is joined to the sixth surface 10b of the ceramic plate 10 by a first bonding material 61, and the other end surface 50b is joined to the third surface 20a of the base member 20 by a second bonding material 62. Note that either the first bonding material 61 or the second bonding material 62 can be omitted if necessary.

[0038] Sixth Embodiment Fig. 5 is a cross-sectional view showing a sample holder according to a sixth embodiment. The sample holder 100 shown in Fig. 5 further includes a third bonding material 63. The third bonding material 63 is located between the ceramic plate 10 and the heat diffusion member 40. The material of the third bonding material 63 is Y ２ O ３ The third bonding material 63 may be glass or metal, and the bonding may be brazing or metal bonding.

[0039] The third bonding material 63 can relieve stress caused by the difference in thermal expansion between the ceramic plate 10 and the heat diffusion member 40. The third bonding material 63 also facilitates heat transfer in the in-plane direction of the ceramic plate 10 and the heat diffusion member 40. This makes it possible to make the in-plane temperature of the ceramic plate 10 more uniform.

[0040] Seventh Embodiment Fig. 6 is a cross-sectional view schematically showing a sample holder according to a seventh embodiment. The sample holder 100 shown in Fig. 6 further includes graphite materials 71 and 72. The graphite material 71 is located at least either between the first surface 30a of the heat insulating part 30 (heat insulating layer 30A) and the eighth surface 40b of the heat diffusion member 40, or between the second surface 30b of the heat insulating layer 30A and the third surface 20a of the base member 20.

[0041] The graphite materials 71 and 72 are, for example, sheet-shaped and have a structure in which multiple graphene layers are stacked, resulting in excellent thermal conductivity. Graphene may be a sheet-shaped substance in which a honeycomb structure formed by bonding carbon atoms is spread in a two-dimensional direction. The graphite materials 71 and 72 having such a structure have a significantly higher thermal conductivity in a direction perpendicular to the graphene stacking direction (in-plane direction) than in the graphene stacking direction. This facilitates uniform in-plane temperatures of the heat diffusion member 40 and the base member 20. Furthermore, the graphite materials 71 and 72 have excellent moisture resistance, eliminating the effect of temperature changes in the heat diffusion member 40, base member 20, and other components due to moisture adsorption. This allows for uniform in-plane temperatures of the ceramic plate 10, further improving the thermal uniformity of the ceramic plate 10.

[0042] Eighth Embodiment Fig. 7 is a cross-sectional view schematically showing a sample holder according to an eighth embodiment. The sample holder 100 shown in Fig. 7 further includes a first fixing mechanism 75. One or more first fixing mechanisms 75 may be arranged on the base member 20.

[0043] The first fixing mechanism 75 is, for example, a fixing screw, but is not limited thereto. The material of the first fixing mechanism 75 is a metal such as iron or stainless steel. A thread groove is formed on at least the side surface of the tip of the first fixing mechanism 75. Furthermore, a thread groove corresponding to the thread groove on the tip of the first fixing mechanism 75 is formed on the inner surface of the eighth surface 40b of the heat diffusion member 40. The heat insulating section 30 has a first through hole 31 penetrating the first surface 30a and the second surface 30b. The first fixing mechanism 75 is located contiguous with the first through hole 31. For example, the first fixing mechanism 75 penetrates the through hole 21 and the first through hole 31 formed in the base member 20.

[0044] The thread grooves at the tip of the first fixing mechanism 75 engage with the thread grooves of the heat diffusion member 40, thereby fixing the heat diffusion member 40 to the base member 20 via the heat insulating portion 30. As a result, the heat insulating portion 30 is sandwiched between the ceramic plate 10 and the base member 20, thereby fixing the positions of the ceramic plate 10, the base member 20, and the heat insulating portion 30. Therefore, the heat insulating portion 30 can further suppress mutual diffusion of heat between the ceramic plate 10 and the base member 20, thereby suppressing warping of the ceramic plate 10 due to differences in thermal expansion between the ceramic plate 10 and the base member 20. Furthermore, because the ceramic plate 10, the base member 20, and the heat insulating portion 30 are physically fixed by the first fixing mechanism 75 rather than by adhesive, the ceramic plate 10 is less likely to warp. As a result, the thermal uniformity of the ceramic plate 10 can be further improved.

[0045] The through hole 21 expands toward the fourth surface 20b of the base member 20. The elastic member 76 is located between the expanded portion of the through hole 21 and the first fixing mechanism 75. The elastic member 76 is, for example, a rubber O-ring. When the elastic member 76 is provided between the expanded portion of the through hole 21 and the first fixing mechanism 75 in this manner, even if the first fixing mechanism 75 tilts due to thermal deformation of the ceramic plate 10, the first fixing mechanism 75 is less likely to interfere with the base member 20.

[0046] The elastic member 76 may be omitted if necessary. Also, the heat diffusion member 40, the protective member 50, the first bonding material 61, and the second bonding material 62 may be omitted if necessary. Also, when the heat diffusion member 40 is omitted, the ceramic plate 10 is fixed to the base member 20 via the heat insulating portion 30 by the first fixing mechanism 75.

[0047] Ninth Embodiment Fig. 8 is a cross-sectional view showing a sample holder according to a ninth embodiment. The heat insulating part 30 shown in Fig. 8 has a heat insulating layer 30B.

[0048] The heat insulating layer 30B has a hollow heat insulating region. The heat insulating region of the heat insulating layer 30B is filled with a fibrous insulating material. The fibrous insulating material is, for example, insulating wool, and is made of fibrous alumina (Al ２ O ３ However, the fibrous insulating material is not limited to alumina, and other insulating materials may be used.

[0049] Filling the heat insulating layer 30B with fibrous insulating material can prevent heat convection in the heat insulating region. In addition, since heat is transferred along the fibers of the insulating material, heat is not transferred in a straight line, and the thermal uniformity of the ceramic plate 10 can be further improved.

[0050] Tenth Embodiment Fig. 9 is a cross-sectional view that schematically shows a sample holder according to a tenth embodiment. The heat insulating part 30 shown in Fig. 9 has a heat insulating layer 30C.

[0051] The thermal insulation layer 30C has a hollow thermal insulation region. The thermal insulation region may be a space under atmospheric pressure or a vacuum (reduced pressure) atmosphere. The thermal insulation region may be filled with a specific gas. The thermal insulation layer 30C has a buffer member 80 located between the ceramic plate 10 and the base member 20 in the thermal insulation region. One or more buffer members 80 are arranged in the thermal insulation layer 30C. The thermal insulation region may be provided, for example, around the buffer member 80 shown by the dotted line in Figure 9. In this case, the region of the thermal insulation layer 30C other than the periphery of the buffer member 80 may be formed of a solid structure having thermal insulation properties.

[0052] The buffer member 80 includes an elastic or porous material. The buffer member 80 may be, for example, the spring 80A shown in FIG. 9 . The spring 80A may be, for example, an insulating material such as alumina. FIGS. 10A to 10D are diagrams illustrating an example of the configuration of the buffer member 80 shown in FIG. 9 . As an example of a configuration for disposing the spring 80A in the thermal insulation layer 30C, as shown in FIG. 10A , disk-shaped pedestals 81a and 81b are connected to the upper and lower ends of the spring 80A via engagement portions 82a and 82b. The disk-shaped pedestal 81a is bonded to the heat diffusion member 40, and the disk-shaped pedestal 81a is bonded to the base member 20. This disposes the spring 80A in the thermal insulation layer 30C. The engagement portions 82a and 82b are cylindrical, with their side surfaces tapering from the joint with the spring 80A toward the pedestals 81a and 81b. The tapered shape of the engaging portions 82a, 82b can alleviate stress. The diameter of the pedestals 81a, 81b is larger than the diameter of the engaging portions 82a, 82b. By providing such pedestals 81a, 81b, it is possible to ensure a sufficient bonding area between the heat diffusion member 40 and the base member 20. Note that the engaging portions 82a, 82b and the pedestals 81a, 81b are not shown in Figures 9 to 12.

[0053] By providing the thermal insulation layer 30C with a buffer member 80, heat is transferred along the structural shape of the buffer member 80, preventing heat from being transferred in a straight line, thereby improving the thermal uniformity of the ceramic plate 10.

[0054] The buffer member 80 may be a spring tube 80B shown in FIG. 10B or porous ceramics 80C and 80D shown in FIGS. 10C and 10D. The spring tube 80B shown in FIG. 10B has slits formed in multiple stages in a cylindrical ceramic body. For example, the first stage slit 80B1, the third stage slit 80B3, and the fifth stage slit 80B5 are formed in positions that overlap in a circumferential direction of the cylindrical body in a plan view. The second stage slit 80B2 and the fourth stage slit 80B4 are formed in positions that overlap in a circumferential direction of the cylindrical body in a plan view. The second stage slit 80B2 and the fourth stage slit 80B4 partially overlap with the other slits in a plan view. However, the second stage slit 80B2 and the fourth stage slit 80B4 may be positioned so as not to overlap with the other slits in a plan view.

[0055] The porous ceramic 80C shown in Fig. 10C is a porous body having a structure in which a large number of through-holes 80C1 are formed inside a cylindrical ceramic body, for example. The cross section of the through-holes 80C1 is not limited to a circle, but may be a polygon. The porous ceramic 80C may have a honeycomb structure. The porous ceramic 80D shown in Fig. 10D is a porous body having gaps (pores) inside a cylindrical ceramic body, for example.

[0056] The spring 80A has excellent stress relaxation properties. The spring tube 80B can relieve stress regardless of the direction of stress. The porous ceramics 80C and 80D have poor thermal conductivity and a large surface area, making them easy to dissipate heat and providing excellent stress relaxation and thermal shock resistance. The spring 80A, spring tube 80B, and porous ceramic 80D have long paths, slowing down heat transfer. This further improves the thermal uniformity of the ceramic plate 10. Furthermore, these characteristics of the buffer member 80 allow it to be used stably for long periods of time, even when placed between the relatively high-temperature ceramic plate 10 and the low-temperature base member 20.

[0057] 11 is a cross-sectional view schematically showing a sample holder according to an eleventh embodiment. The sample holder 100 shown in FIG.

[0058] The fourth bonding material 64 is positioned between the buffer member 80 (spring 80A in FIG. 11 ) and the base member 20. Because the temperature of the base member 20 is relatively low, a silicone resin or the like can be used for the fourth bonding material 64. However, the material of the fourth bonding material 64 is not limited to this.

[0059] By positioning the fourth bonding material 64 between the buffer member 80 and the base member 20, even when the buffer member 80 thermally expands, the fourth bonding material 64 relieves stress. As a result, the ceramic plate 10 is not distorted, and the thermal uniformity of the ceramic plate 10 can be further improved.

[0060] Furthermore, by bonding the buffer member 80 and the base member 20 together with the fourth bonding material 64, it is possible to reduce misalignment between the buffer member 80 and the base member 20.

[0061] 12 is a cross-sectional view schematically showing a sample holder according to a twelfth embodiment of the present invention. The sample holder 100 shown in FIG.

[0062] The fifth bonding material 65 is located between the buffer member 80 (spring 80A in FIG. 12) and the ceramic plate 10. Since the temperature of the ceramic plate 10 is relatively high, the fifth bonding material 65 is ２ O ３ Glass or the like can be used, but the material of the fifth bonding material 65 is not limited to this.

[0063] By positioning the fifth bonding material 65 between the buffer member 80 and the ceramic plate 10, even if the buffer member 80 thermally expands, the fifth bonding material 65 relieves stress. As a result, the ceramic plate 10 does not warp, and the thermal uniformity of the ceramic plate 10 can be further improved.

[0064] In addition, the fifth bonding material 65 has a lower thermal conductivity than the Y bonding material 65. ２ O ３ The use of glass can further improve the thermal uniformity of the ceramic plate 10. Furthermore, by bonding the buffer member 80 and the heat diffusion member 40 with the fifth bonding material 65, it is possible to reduce misalignment between the buffer member 80 and the heat diffusion member 40.

[0065] 13A is a cross-sectional view schematically showing a sample holder according to a 13th embodiment. The heat insulating part 30 shown in Fig. 13A has a heat insulating layer 30D. The heat insulating layer 30D has a hollow heat insulating region, and has one or more protrusions 200 (plurality in Fig. 13A) in the heat insulating region.

[0066] The thermal insulation region may be a space under atmospheric pressure or a vacuum (reduced pressure). The thermal insulation region may be filled with a specific gas. Each of the multiple protrusions 200 has the same shape and connects the ceramic plate 10 and the base member 20 in the thermal insulation region. However, each of the multiple protrusions 200 may have a different shape. Each of the multiple protrusions 200 is formed of a material with high thermal conductivity. Each of the multiple protrusions 200 may be formed of the same material or different materials. Examples of materials that can be used for the protrusions 200 include aluminum nitride, aluminum oxide, mullite, cordierite, and glass primarily composed of silicon oxide. However, the material of the protrusions 200 is not limited to these. Although not shown, a protective member positioned around the thermal insulation layer 30D may also be provided.

[0067] The plurality of protrusions 200 are formed on the ceramic plate 10. The plurality of protrusions 200 may be formed integrally with the ceramic plate 10. The plurality of protrusions 200 may be formed separately from the ceramic plate 10 and joined to the ceramic plate 10. One end face of the protrusion 200 is joined to the ceramic plate 10, and the protrusion 200 extends from the ceramic plate 10 toward the base member 20.

[0068] By contacting the plurality of protrusions 200 with the ceramic plate 10 and the base member 20 at a plurality of scattered positions, the heat insulating portion 30 has excellent stress relaxation properties and can dissipate heat around the plurality of protrusions 200. Therefore, a sharp temperature gradient is not formed between the ceramic plate 10 and the base member 20. This allows the temperature of the ceramic plate 10 to be uniform across its surface.

[0069] <Fourteenth embodiment> Fig. 13B is a cross-sectional view schematically showing a sample holder according to a fourteenth embodiment. The heat insulating part 30 shown in Fig. 13B has a heat insulating layer 30D. The heat insulating layer 30D has a hollow heat insulating region and has one or more protrusions 200 (plural in Fig. 13B) in the heat insulating region. As shown in Fig. 13B, a heat diffusion member 40 may be further provided between the ceramic plate 10 and the protrusions 200. Although not shown, a protective member may also be further provided around the heat insulating layer 30D. Since the other configurations of the sample holders shown in Figs. 13A and 13B are the same, a description of these other configurations will be omitted.

[0070] 14A to 14F are diagrams showing an example of the configuration of the protrusion 200 shown in FIGS. 13A and 13B. The protrusion 200A shown in FIG. 14A has a cylindrical shape. One end face 200A1 of the protrusion 200A is flat and is the face that joins with the ceramic plate 10. The other end face (tip face) 200A2 of the protrusion 200A is flat and is the face that comes into contact with the base member 20. The end faces 200A1 and 200A2 of the protrusion 200A may be circles including perfect circles and ellipses.

[0071] 14B is a rectangular pillar shape. One end surface 200B1 and the other end surface 200B2 of the protrusion 200B are flat. The end surfaces 200B1 and 200B2 of the protrusion 200B may be polygonal, including triangular and quadrangular.

[0072] 14C has a conical shape. One end surface 200C1 of the protrusion 200C is flat, and the other end surface 200C2 is a point.

[0073] 14D has a cylindrical shape. One end surface 200D1 of the protrusion 200D is flat, and the other end surface 200D2 is spherical.

[0074] 14E is a pyramidal shape. One end surface 200E1 of the protrusion 200E is a flat surface, and the other end surface 200E2 is a point.

[0075] The protrusion 200F shown in Figure 14F has a cylindrical shape. One end face 200F1 and the other end face 200F2 of the protrusion 200F are flat. The area of ​​the end face 200F1 of the protrusion 200F is larger than the area of ​​the end face 200F2. That is, the side face of the protrusion 200F has a tapered shape, and its width decreases from the end face 200F1 to the end face 200F2.

[0076] The other end faces (ends) 200A2 to 200F2 of the protrusions 200A to 200F are the tips of the protrusions 200A to 200F. When the tips of the protrusions 200 contact the base member 20, the area of ​​the tip face can be reduced to reduce the contact area between the protrusions 200 and the base member 20. This suppresses heat conduction between the ceramic plate 10 and the base member 20 via the protrusions 200, thereby improving the thermal uniformity of the ceramic plate 10.

[0077] Furthermore, by distributing contact positions between the plurality of protrusions 200 and the base member 20 and reducing the contact area between each protrusion 200 and the base member 20, it is possible to alleviate stress caused by the temperature difference between the ceramic plate 10 and the base member 20. In order to minimize the contact area between each protrusion 200 and the base member 20, protrusions 200C, 200D, and 200E may be used, which allow point contact between each protrusion 200 and the base member 20. However, the shape of the protrusions 200 is not limited to this.

[0078] Furthermore, by providing a plurality of protrusions 200, the surface area of ​​each protrusion 200 can be increased, allowing heat to be dissipated to the heat insulating region around the protrusions 200. This prevents a sharp temperature gradient from being formed between the ceramic plate 10 and the base member 20, improving the temperature uniformity of the ceramic plate 10 within its surface.

[0079] <Fifteenth embodiment> Fig. 15 is a cross-sectional view schematically showing a sample holder according to a fifteenth embodiment. The sample holder 100 shown in Fig. 15 further includes a temperature relaxation portion 210. The temperature relaxation portion 210 is located between the plurality of protrusions 200 and the base member 20. The temperature relaxation portion 210 contacts the tip surfaces of the plurality of protrusions 200 and the base member 20.

[0080] The temperature mitigation unit 210 may be, for example, a vacuum container or a heat insulating material such as a heat insulating sheet. The temperature mitigation unit 210 may be, for example, a flat container with a vacuum inside, such as a thermos-type container. Examples of heat insulating materials that can be used include PTFE (polytetrafluoroethylene), cordierite, and porous ceramic. However, the heat insulating material is not limited to these.

[0081] Even if the protrusions 200 are made of a material with high thermal conductivity, the presence of the temperature mitigating portions 210 prevents poor thermal conductivity and the formation of a steep temperature gradient between the ceramic plate 10 and the base member 20. This makes it possible to further improve the in-plane temperature uniformity of the ceramic plate 10.

[0082] <Sixteenth embodiment> Fig. 16 is a cross-sectional view schematically showing a sample holder according to a sixteenth embodiment. The sample holder 100 shown in Fig. 16 further includes temperature mitigation sections 210. The temperature mitigation sections 210 are scattered between the plurality of protrusions 200 and the base member 20. The temperature mitigation sections 210 are located between the tip surfaces of some of the protrusions 200, namely, protrusions 200A, and the base member 20.

[0083] Depending on the heater pattern (pattern of the second electrode 12) of the ceramic plate 10, localized temperature unevenness may occur in the ceramic plate 10, resulting in a temperature distribution among the multiple protrusions 200. To address this issue, protrusions 200B whose tip surfaces are not in contact with each other and protrusions 200A that contact the base member 20 via temperature mitigation portions 210 are provided. This allows for uniform heating throughout the ceramic plate 10. For example, the temperature mitigation portions 210 are provided between the base member 20 and protrusions 200 in high-temperature areas of the ceramic plate 10. This allows the temperature of the ceramic plate 10 on the protrusions 200 that contact the base member 20 via the temperature mitigation portions 210 to be lower than the temperature of the ceramic plate 10 on the other protrusions 200 that do not contact the base member 20, thereby improving the thermal uniformity of the ceramic plate 10.

[0084] Fig. 17A is a diagram showing an example of the in-plane distribution of the protrusions 200 on the upper surface (third surface 20a) of the base member 20. Figs. 17B and 17C are diagrams showing other examples of the in-plane distribution of the protrusions 200. Figs. 17A to 17C show the in-plane distribution of the tip surfaces of the protrusions 200 that contact the base member 20.

[0085] 17A , protrusion 200F (see FIG. 14F ) is shown as an example of the plurality of protrusions 200. The tip surfaces 200F2 that contact the base member 20 are densely and evenly arranged. That is, the areas of the tip surfaces 200F2 of the plurality of protrusions 200 and the spacing between the tip surfaces 200F2 of adjacent protrusions 200 are all the same.

[0086] 17B, ​​the tip surfaces 200F2 of the protrusions 200F have portions where the distance between the tip surfaces 200F2 of adjacent protrusions 200F is wider than the distance between the other tip surfaces 200F2, as indicated by distance B. In other words, the plurality of protrusions 200 may include two or more protrusions 200 in which the distances between the tip surfaces 200F2 of adjacent protrusions 200 are different.

[0087] 17C , protrusion 200A (see FIG. 14A ) and protrusion 200F (see FIG. 14F ) are shown as examples of the plurality of protrusions 200. The area of ​​tip surface 200A2 of protrusion 200A shown in FIG. 17C is larger than the area of ​​tip surface 200F2 of protrusion 200F. That is, the plurality of protrusions 200 may include two or more protrusions 200 whose tip surfaces in contact with the base member 20 have different areas.

[0088] By controlling the in-plane distribution of the protrusions 200 in contact with the base member 20 in accordance with the temperature unevenness of the ceramic plate 10, it is possible to control heat dissipation in accordance with the heater zone (pattern of the second electrode 12), thereby achieving excellent thermal uniformity and making the in-plane temperature uniform as a whole across the ceramic plate 10. For example, the protrusions 200 in areas where it is desired to lower the temperature of the ceramic plate 10 may be in contact with the base member 20, while the protrusions 200 in areas where it is desired not to lower the temperature of the ceramic plate 10 may not be in contact with the base member 20.

[0089] Furthermore, for example, the area of ​​the tip surface (contact surface) of the protrusion 200 at a location where it is desired to lower the temperature of the ceramic plate 10 may be larger than the area of ​​the tip surface (contact surface) of the protrusion 200 at a location where it is desired not to lower the temperature of the ceramic plate 10. By controlling at least either the contact area of ​​the protrusions 200 or the spacing between adjacent protrusions 200, it is possible to further improve the uniformity of the temperature within the surface of the ceramic plate 10.

[0090] 17th Embodiment Fig. 18 is a cross-sectional view schematically showing a sample holder according to a 17th embodiment. The sample holder 100 shown in Fig. 18 further includes a second fixing mechanism 75A. One or more second fixing mechanisms 75A may be arranged on the base member 20.

[0091] The second fixing mechanism 75A is, for example, a fixing screw, but is not limited thereto. The second fixing mechanism 75A is made of a metal such as iron or stainless steel. A thread groove is formed on at least the side surface of the tip of the second fixing mechanism 75A. Furthermore, a thread groove corresponding to the thread groove on the tip of the second fixing mechanism 75A is formed on the inner surface of the sixth surface 10b of the ceramic plate 10. The heat insulating unit 30 has an insulating region (space) through which the second fixing mechanism 75A is inserted. The second fixing mechanism 75A is inserted into the through hole 21 formed in the base member 20, passes through the through hole of the temperature mitigation unit 210, and is positioned in the gap between the multiple protrusions 200 of the heat insulating unit 30 (heat insulating layer 30D).

[0092] The thread grooves at the tip of the second fixing mechanism 75A engage with the thread grooves of the ceramic plate 10, thereby fixing the ceramic plate 10 to the base member 20 via the heat insulating portion 30. As a result, the heat insulating portion 30 and the temperature mitigating portion 210 are sandwiched between the ceramic plate 10 and the base member 20, thereby fixing the positions of the ceramic plate 10, the base member 20, the heat insulating portion 30, and the temperature mitigating portion 210. This prevents warping or distortion of the ceramic plate 10 due to differences in thermal expansion between the ceramic plate 10 and the base member 20. Furthermore, because the ceramic plate 10, the base member 20, the heat insulating portion 30, and the temperature mitigating portion 210 are physically fixed by the second fixing mechanism 75A rather than by adhesive, the ceramic plate 10 is less likely to warp. As a result, the thermal uniformity of the ceramic plate 10 can be further improved.

[0093] The through hole 21 expands toward the fourth surface 20b of the base member 20. The elastic member 76 is located between the expanded portion of the through hole 21 and the second fixing mechanism 75A. The elastic member 76 is, for example, a rubber O-ring. In this way, when the elastic member 76 is provided between the expanded portion of the through hole 21 and the second fixing mechanism 75A, even if the second fixing mechanism 75A tilts due to thermal deformation of the ceramic plate 10, the second fixing mechanism 75A is less likely to interfere with the base member 20.

[0094] 18th Embodiment Fig. 19 is a cross-sectional view schematically showing a sample holder according to an 18th embodiment. The sample holder 100 shown in Fig. 19 further includes a second fixing mechanism 75B. One or more second fixing mechanisms 75B may be arranged on the base member 20.

[0095] The base member 20 has a third surface 20a, a fourth surface 20b opposite the third surface 20a, and a second through-hole 21a penetrating the third surface 20a and the fourth surface 20b. The second fixing mechanism 75B is located in correspondence with the second through-hole 21a of the base member 20. The second fixing mechanism 75B fixes the base member 20 and the ceramic plate 10. By fixing the base member 20 and the ceramic plate 10 at the position of the second through-hole 21a of the base member 20, the base member 20 and the ceramic plate 10 can be tightly attached to each other. This suppresses warping of the ceramic plate 10 due to differences in thermal expansion between the base member 20 and the ceramic plate 10. This suppresses uneven in-plane heat transfer between the sample support surface of the ceramic plate 10 and the base member 20, thereby improving the in-plane thermal uniformity of the sample holder 100. Furthermore, since the second fixing mechanism 75B fixes the base member 20 and the ceramic plate 10 without using a fixing material such as an adhesive, sliding between the ceramic plate 10 and the base member 20 is permitted, and the difference in expansion and contraction between the base member 20 and the ceramic plate 10 due to thermal cycles is alleviated.

[0096] The second fixing mechanism 75B has a pillar-shaped member 77 and a fastening member 78. The pillar-shaped member 77 is made of metal. The pillar-shaped member 77 is inserted into the second through-hole 21a. One end 77a of the pillar-shaped member 77 is joined to the sixth surface 10b of the ceramic plate 10 by a joining material 79. The other end 77b of the pillar-shaped member 77 is housed in an expanded portion of the second through-hole 21a. A thread groove is formed on the side surface of at least the end 77b of the pillar-shaped member 77.

[0097] The fastening member 78 is located on the end 77b side of the columnar member 77. The material of the fastening member 78 is, for example, a metal such as iron or stainless steel. For example, the fastening member 78 is a nut having a threaded hole with a threaded groove formed on the inner surface corresponding to the threaded groove of the end 77b of the columnar member 77. The fastening member 78 is rotatably attached to the end 77b of the columnar member 77 by engaging the threaded hole with the end 77b of the columnar member 77. When the fastening member 78 rotates, it moves along the axis of the columnar member 77 toward the base member 20, generating a pressing force that presses the base member 20 against the sixth surface 10b of the ceramic plate 10. This pressing force allows the fastening member 78 to fix the base member 20 to the ceramic plate 10. Furthermore, by brazing the second fixing mechanism 75B to the ceramic plate 10 with a bonding material 79, the temperature of the second fixing mechanism 75B can be kept constant, further improving thermal uniformity. The bonding material 79 may be, for example, a brazing material containing silver or copper.

[0098] The second fixing mechanism 75B further includes an elastic member 76. The elastic member 76 is, for example, a rubber O-ring. The elastic member 76 is positioned between the fastening member 78 and the base member 20. The fastening member 78 presses the base member 20 toward the sixth surface 10b of the ceramic plate 10 via the elastic member 76 to fix the base member 20 to the ceramic plate 10. The elastic member 76 may be an elastic ring-shaped body. In such a case, the elastic member 76 may be, for example, an O-ring. By positioning the elastic member 76 between the fastening member 78 and the base member 20, the elastic force of the elastic member 76 can be used to tightly contact the base member 20 and the ceramic plate 10. That is, the fastening member 78 rotates to move toward the base member 20 along the axis of the columnar member 77, generating a pressing force that presses the base member 20 against the sixth surface 10b of the ceramic plate 10 via the elastic member 76. This further improves the thermal uniformity within the surface of the sample holder 100. The elastic member 76 may be omitted if necessary.

[0099] The inner surface of the second through hole 21a is covered with a cylindrical member 220, and the columnar member 77 is inserted into the cylindrical member 220. The cylindrical member 220 can be made of an insulating material such as mullite. However, the material of the cylindrical member 220 is not limited to this. This allows the second fixing mechanism 75B and the base member 20 to be insulated from each other.

[0100] <19th embodiment> Fig. 20 is a cross-sectional view schematically showing a sample holder according to the 19th embodiment. The heat diffusion member 40 shown in Fig. 20 has a third electrode 13 for a heater inside. Heating the heat diffusion member 40 with the third electrode 13 can prevent heat dissipation from the second electrode 12 in the ceramic plate 10 to the base member 20. Since heat can be controlled for each heater zone, the thermal uniformity of the ceramic plate 10 can be further improved.

[0101] 20th Embodiment FIG. 21 is a cross-sectional view schematically illustrating a sample holder according to the 20th embodiment. At least a portion of the second electrode 12 shown in FIG. 21 is located outside the third electrode 13 in a plan view. Here, "outside" means being farther from the center of the ceramic plate 10. The second electrode 12 is located within the ceramic plate 10, and the third electrode 13 is located within the heat diffusion member 40. By locating at least a portion of the second electrode 12 outside the third electrode 13 in a plan view, heat dissipation from the periphery of the ceramic plate 10 can be prevented. Since heat can be controlled for each zone, the thermal uniformity of the ceramic plate 10 can be further improved. Although the second electrode 12 shown in FIG. 21 is located outside the third electrode 13 in a plan view, a portion of the second electrode 12 may overlap the third electrode 13 in a plan view.

[0102] 21st Embodiment Fig. 22 is a cross-sectional view schematically illustrating a sample holder according to a 21st embodiment. The sample holder 100 shown in Fig. 22 includes a protective member 50, a first bonding material 61, and a second bonding material 62. Also, at least a portion of the second electrode 12 shown in Fig. 22 is located outside the third electrode 13 in a plan view. The second electrode 12 is located within the ceramic plate 10, and the third electrode 13 is located within the heat diffusion member 40. By arranging at least a portion of the second electrode 12 outside the third electrode 13 in a plan view, heat dissipation from the periphery of the ceramic plate 10 can be prevented. Because heat can be controlled for each zone, the thermal uniformity of the ceramic plate 10 can be further improved.

[0103] 22nd Embodiment Fig. 23 is a cross-sectional view schematically showing a sample holder according to the 22nd embodiment. The heat insulating part 30 shown in Fig. 23 further has a spacer 230. Cordierite or the like can be used for the spacer 230. However, the material of the spacer 230 is not limited to this.

[0104] The spacer 230 is located in the heat insulating region. One end of the spacer 230 contacts the ceramic plate 10, and the other end contacts the base member 20. The length of the spacer 230 is longer than the length of the protrusion 200. This allows the protrusion 200 to be suspended in the air, thereby separating the protrusion 200 from the base member 20.

[0105] By separating the protrusions 200 from the base member 20, the heat conduction from the protrusions 200 to the base member 20 is worse than when the protrusions 200 and the base member 20 are in contact with each other. This makes it difficult for a steep temperature gradient to form between the ceramic plate 10 and the base member 20, thereby improving the thermal uniformity of the ceramic plate 10.

[0106] Figure 24 is a cross-sectional view schematically showing the II cross section shown in Figure 23. Four second fixing mechanisms 75B shown in Figure 24 are arranged evenly around the ceramic plate 10 in the circumferential direction. However, the number and positions of the second fixing mechanisms 75B are not limited to this. One or more second fixing mechanisms 75B may be arranged around the ceramic plate 10. Note that the heat insulating section 30 (heat insulating layer) does not have to have the protrusions 200.

[0107] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents.

[0108] For example, the ceramic plate 10 may not have the first electrode 11 and the second electrode 12, if necessary. Furthermore, the base member 20 may not have the flow path 20c, if necessary. Furthermore, the heat diffusion member 40, the protective member 50, the first to fifth bonding materials 61 to 65, the graphite members 71 and 72, the first fixing mechanism 75, the second fixing mechanisms 75A and 75B, the buffer member 80, the protrusion 200, the temperature mitigation member 210, and the elastic member 76 may be omitted, if necessary.

[0109] The present technology can take the following configurations: (1) A sample holder comprising: a ceramic body; a base member; and a heat insulating section positioned between the ceramic body and the base member and having a heat insulating layer. (2) The sample holder according to (1), further comprising a heat diffusion member positioned between the ceramic body and the heat insulating section. (3) The sample holder according to (1) or (2), further comprising a protective member positioned around the heat insulating section. (4) The sample holder according to (3), further comprising a heat diffusion member positioned between the ceramic body and the heat insulating section, and a first bonding material positioned between the heat diffusion member and the protective material. (5) The sample holder according to (3) or (4), further comprising a second bonding material positioned between the base member and the protective material. (6) The sample holder according to (2) or (4), further comprising a third bonding material positioned between the ceramic body and the heat diffusion member. (7) The sample holder according to any one of (1) to (6), wherein the heat insulating layer has a first surface and a second surface opposite to the first surface, and further comprises a graphite material located on at least one of the first surface or the second surface. (8) The sample holder according to (2) or (4), wherein the heat insulating layer has a first surface, a second surface opposite to the first surface, and a first through hole penetrating the second surface, and further comprises a first fixing mechanism located in the first through hole and fixing the heat diffusion member and the base member. (9) The sample holder according to any one of (1) to (8), wherein the heat insulating layer has a hollow heat insulating region filled with a fibrous insulating member. (10) The sample holder according to any one of (1) to (8), wherein the heat insulating layer has a hollow heat insulating region and comprises a buffer member located between the ceramic body and the base member in the heat insulating region. (11) The sample holder according to (10), wherein the buffer member includes an elastic body or a porous body. (12) The sample holder according to (10) or (11), further comprising a fourth bonding material positioned between the buffer member and the base member.(13) The sample holder according to any one of (10) to (12), further comprising: a heat diffusion member positioned between the ceramic body and the heat insulation part; and a fifth bonding material positioned between the buffer member and the heat diffusion member. (14) The sample holder according to any one of (1) to (13), wherein the heat insulation layer has a hollow heat insulation region and has one or more protrusions in the heat insulation region. (15) The sample holder according to (14), wherein the shape of the protrusion is a cylinder, a prism, a cone, or a pyramid. (16) The sample holder according to (15), wherein one end face of the protrusion is a plane, and the other end face of the protrusion is a plane, a point, or a sphere. (17) The sample holder according to any one of (14) to (16), wherein one end face of the protrusion is joined to the ceramic body and extends from the ceramic body toward the base member. (18) The sample holder according to any one of (14) to (17), further comprising a temperature relaxation part located between the protrusions and the base member. (19) The sample holder according to (18), wherein the heat insulating layer has a plurality of the protrusions, and the temperature relaxation part is located between the tip surfaces of some of the plurality of protrusions and the base member. (20) The sample holder according to (18), further comprising a second fixing mechanism that fixes the ceramic body and the base member via the heat insulating layer. (21) The sample holder according to (20), wherein the base member has a third surface, a fourth surface opposite the third surface, and a second through-hole penetrating the third surface and the fourth surface, the second fixing mechanism has a columnar member inserted into the second through-hole, and a fastening member, one end of the columnar member is joined to the ceramic body, and the fastening member is located on the other end side of the columnar member and presses the base member toward the ceramic body to fix the ceramic body to the base member. (22) The sample holder according to any one of (14) to (17), wherein the ceramic body has therein a first electrode for electrostatic attraction and a second electrode for a heater, and the base member has therein a flow path for circulating a heat exchange medium.(23) The sample holder according to any one of (16) to (22), wherein the heat insulating layer has a plurality of the protrusions, and the plurality of protrusions include two or more protrusions that differ in at least one of the area of ​​the other end face or the spacing between adjacent other end faces. (24) The sample holder according to (22), which has a heat diffusion member located between the ceramic body and the heat insulating part, and the heat diffusion member has a third electrode for a heater therein. (25) The sample holder according to (24), wherein at least a part of the second electrode is located outside the third electrode in a plan view. (26) The sample holder according to any one of (21) to (25), wherein the heat insulating part has a spacer located in the heat insulating region, one end of which contacts the ceramic body and the other end of which contacts the base member, and the length of the spacer is longer than the length of the protrusions.

[0110] 10 ceramic plate 11 first electrode 12 second electrode 13 third electrode 20 base member 30 heat insulating portion 30A to 30D heat insulating layer 30a first surface 30b second surface 40 heat diffusion member 50 protective member 61 first bonding material 62 second bonding material 63 third bonding material 64 fourth bonding material 65 fifth bonding material 71, 72 graphite material 75 first fixing mechanism 75A, 75B second fixing mechanism 80 buffer member 80A spring 80B spring tube 80C, 80D porous ceramic 100 sample holder 200 protrusion 210 temperature relaxation portion 220 cylindrical member 230 spacer

Claims

1. A sample holder comprising: a ceramic body; a base member; and a heat insulating portion located between the ceramic body and the base member and having a heat insulating layer.

2. The sample holder according to claim 1, further comprising a heat diffusion member located between the ceramic body and the heat insulating portion.

3. The sample holder according to claim 1 or 2, further comprising a protective member located around the heat insulating portion.

4. The sample holder according to claim 3, further comprising a heat diffusion member located between the ceramic body and the heat insulating portion, and a first bonding material located between the heat diffusion member and the protective member.

5. The sample holder according to claim 3 or 4, further comprising a second bonding material located between the base member and the protective member.

6. The sample holder according to claim 2 or 4, further comprising a third bonding material located between the ceramic body and the heat diffusion member.

7. The sample holder according to any one of claims 1 to 6, wherein the heat insulating layer has a first surface and a second surface located opposite to the first surface, and further comprises a graphite material located on at least one of the first surface or the second surface.

8. The sample holder according to claim 2 or 4, wherein the heat insulating layer has a first surface, a second surface located opposite to the first surface, and a first through hole penetrating the second surface, and further comprises a first fixing mechanism located in the first through hole for fixing the heat diffusion member and the base member.

9. The sample holder according to any one of claims 1 to 8, wherein the heat insulating layer has a hollow heat insulating region, and the heat insulating region is filled with a fibrous insulating member.

10. The sample holder according to any one of claims 1 to 8, wherein the heat insulating layer has a hollow heat insulating region, and the heat insulating region has a buffer member located between the ceramic body and the base member.

11. The sample holder according to claim 10, wherein the buffer member includes an elastic body or a porous body.

12. The sample holder according to claim 10 or 11, further comprising a fourth bonding material located between the buffer member and the base member.

13. The sample holder according to any one of claims 10 to 12, further comprising a heat diffusion member located between the ceramic body and the heat insulating portion, and a fifth bonding material located between the buffer member and the heat diffusion member.

14. The sample holder according to any one of claims 1 to 13, wherein the heat insulating layer has a hollow heat insulating region and has one or more protrusions in the heat insulating region.

15. The sample holder according to claim 14, wherein the shape of the protrusion is a cylindrical shape, a prismatic shape, a conical shape, or a pyramidal shape.

16. The sample holder according to claim 15, wherein one end face of the protrusion is a flat surface, and the other end face of the protrusion is any one of a flat surface, a point, or a spherical surface.

17. The sample holder according to any one of claims 14 to 16, wherein one end face of the protrusion is joined to the ceramic body and extends from the ceramic body toward the base member.

18. The sample holder according to any one of claims 14 to 17, further comprising a temperature relaxation portion located between the protrusion and the base member.

19. The sample holder according to claim 18, wherein the heat insulating layer has a plurality of the protrusions, and the temperature relaxation portion is located between the tip end faces of some of the plurality of protrusions and the base member.

20. The sample holder according to claim 18, further comprising a second fixing mechanism for fixing the ceramic body and the base member via the heat insulating layer.

21. The base member has a third surface, a fourth surface located opposite to the third surface, and a second through hole penetrating the third surface and the fourth surface. The second fixing mechanism has a columnar member inserted into the second through hole and a fastening member. One end of the columnar member is joined to the ceramic body, and the fastening member is located on the other end side of the columnar member and presses the base member toward the ceramic body to fix the ceramic body to the base member. The sample holder according to claim 20.

22. The sample holder according to any one of claims 14 to 17, wherein the ceramic body has a first electrode for electrostatic adsorption and a second electrode for a heater inside, and the base member has a flow path for allowing a heat exchange medium to flow through inside.

23. The sample holder according to any one of claims 16 to 22, wherein the heat insulating layer has a plurality of the protrusions, and the plurality of the protrusions include two or more protrusions in which at least one of the area of the other end face or the interval between the adjacent other end faces is different.

24. The sample holder according to claim 22, having a heat diffusion member positioned between the ceramic body and the heat insulating portion, wherein the heat diffusion member has a third electrode for a heater inside.

25. The sample holder according to claim 24, wherein at least a part of the second electrode is positioned outside the third electrode in a plan view.

26. The sample holder according to any one of claims 21 to 25, wherein the heat insulating portion is located in the heat insulating region and has a spacer having one end in contact with the ceramic body and the other end in contact with the base member, and the length of the spacer is longer than the length of the protrusion.

Images