Aromatic polycarbonate resin composition and molded article formed therefrom

Abstract

This resin composition contains: (A) 100 parts by weight of an aromatic polycarbonate resin (component A) containing an aromatic polycarbonate resin having a branched structure with a branching ratio of 0.2-1.5 mol%; (B) 0.005-0.15 parts by weight of an organic alkali (earth) metal salt (component B); (C) 0.03-1.2 parts by weight of a colorant (component C) having an absorption maximum at a wavelength of less than 680 nm; (D) 0.01-0.5 parts by weight of a phenolic thermal stabilizer (component D); and 0.025-0.5 parts by weight of a phosphorus-based heat stabilizer (component E), with the total amount of component D and component E being 0.6 parts by weight or less. The average light transmittance in the thickness direction of a molded article with a thickness of 3 mm is 1.5% or less at a wavelength of 400-700 nm, and the light transmittance at a wavelength of 1550 nm is 80% or more.

Description

Aromatic polycarbonate resin composition and molded article obtained by molding the same

[0001] The present invention relates to an aromatic polycarbonate resin composition that has excellent moist heat resistance and flame retardancy, and when molded into an article, has wavelength-selective absorption properties and is excellent in light stability of the absorption properties, and to a molded article obtained by molding the same.

[0002] In recent years, infrared sensors have been used in a variety of fields. One example is the field of autonomous driving technology, where monitoring systems for passengers, including drivers, and LiDAR for detecting other vehicles and buildings are examples. Near-infrared light with wavelengths of approximately 800 to 1600 nm is typically used for infrared sensor sensing. However, because visible light to near-infrared light becomes noise when performing infrared sensing, a cover material is required that transmits the wavelength range used for sensing and blocks transmission of wavelengths below that range. Glass and resin are commonly used as cover materials, and transparent resins such as acrylic resin and polycarbonate resin are commonly used. However, there is a great demand for polycarbonate resin, which has good transparency and excellent impact and heat resistance. Furthermore, it is expected that in the future, thin-walled molded products will require high flame retardancy equivalent to UL94 V-0.

[0003] Studies on polycarbonate resins with wavelength selection controllability have been conducted in the past. These studies have disclosed techniques for blocking light from the visible light region to a portion of the near-infrared region by combining multiple colorants with different absorption wavelength bands (see Patent Documents 1 to 6). However, these studies have not disclosed techniques for imparting flame retardancy while maintaining infrared transmittance. Meanwhile, Patent Documents 7 to 10 disclose techniques for imparting flame retardancy equivalent to V-0 while maintaining the transparency (good infrared transmittance) of polycarbonate resins, but there have been no examples of applying this to wavelength selection controllable polycarbonate resins, and no studies have been conducted on compositional techniques that achieve both wavelength selection controllability and flame retardancy.

[0004] JP 2008-9222 A JP 2018-109734 A JP 2021-25029 A JP 2021-188010 A WO2023 / 145197 A JP 2022-125331 A JP 2007-31583 A JP 2011-84670 A JP 2011-84692 A JP 2012-97223 A

[0005] The object of the present invention is to provide an aromatic polycarbonate resin composition which has excellent moist heat resistance and flame retardancy, and from which molded articles have wavelength-selective absorption properties and excellent light stability of the absorption properties, and to provide molded articles obtained by molding the same.

[0006] As a result of extensive research, the present inventors have found that the above-mentioned problems can be solved by an aromatic polycarbonate resin composition comprising a specific polycarbonate resin, a flame retardant, a colorant, and a heat stabilizer. That is, the present inventors have found that the above-mentioned problems can be solved by the following resin composition.

[0007] 1. A resin composition comprising: (A) 100 parts by weight of an aromatic polycarbonate resin (component A) containing an aromatic polycarbonate resin having a branched structure with a branching ratio of 0.2 to 1.5 mol%, (B) 0.005 to 0.15 parts by weight of an organic alkaline (earth) metal salt (component B), (C) 0.03 to 1.2 parts by weight of a colorant (component C) having an absorption maximum at a wavelength of less than 680 nm, (D) 0.01 to 0.5 parts by weight of a phenolic heat stabilizer (component D), and (E) 0.025 to 0.5 parts by weight of a phosphorus-based heat stabilizer (component E), wherein the total amount of components D and E is 0.6 parts by weight or less, and the average light transmittance in the thickness direction at wavelengths of 400 to 700 nm in a 3 mm thick molded article is 1.5% or less, and the light transmittance at a wavelength of 1550 nm is 80% or more. 2. The resin composition according to item 1 above, wherein Component A contains 50 to 100% by weight of an aromatic polycarbonate resin having a branched structure with a branching ratio of 0.2 to 1.5 mol%. 3. The resin composition according to item 1 or 2 above, comprising, per 100 parts by weight of Component A, 0.001 to 1.2 parts by weight of (F) a coloring agent (Component F) having an absorption maximum at a wavelength of 680 to less than 1,000 nm, and the total amount of Components C and F is 1.3 parts by weight or less. 4. The resin composition according to item 3 above, wherein a molded article having a thickness of 3 mm has an average light transmittance in the thickness direction of 1.5% or less at wavelengths from 700 nm at which Component F has an absorption maximum. 5. The resin composition according to item 3 or 4 above, wherein Component F is at least one coloring agent selected from the group consisting of anthraquinone-based coloring agents, phthalocyanine-based coloring agents, perylene-based coloring agents, and heterocyclic coloring agents. 6. 6. The resin composition according to any one of items 1 to 5 above, which contains, per 100 parts by weight of Component A, (G) 0.1 to 6 parts by weight of a silicone compound (Component G) containing an Si—H group in the molecule. 7. The resin composition according to any one of items 1 to 6 above, which contains, per 100 parts by weight of Component A, (H) 0.01 to 1 part by weight of a benzotriazole-based ultraviolet absorber and / or a triazine-based ultraviolet absorber (Component H). 8. A molded article obtained by molding the resin composition according to any one of items 1 to 7 above. 9. The molded article according to item 8 above, which is a cover material for covering an infrared sensor.10. The molded article according to item 9 above, which is a cover material for covering an infrared sensor used in a monitoring system for monitoring passengers including the driver, and LiDAR for detecting other vehicles and buildings.

[0008] The resin composition of the present invention has excellent moist heat resistance and flame retardancy, and molded articles obtained by molding it have wavelength-selective absorption properties and excellent light stability of the absorption properties, making it applicable to infrared sensor components that require flame retardancy and stable use even under conditions of long-term exposure to light.Example applications include a cover material for infrared sensors used in monitoring systems that monitor passengers including drivers, and LiDAR for detecting other vehicles and buildings, which can contribute to the safety of future autonomous driving systems.

[0009] (Component A: Aromatic polycarbonate resin containing an aromatic polycarbonate resin having a branched structure with a branching rate of 0.2 to 1.5 mol%) The aromatic polycarbonate resin used as component A must contain an aromatic polycarbonate resin having a branched structure with a branching rate of 0.2 to 1.5 mol%. From the viewpoint of imparting better flame retardancy, component A preferably contains 50 to 100 wt%, more preferably 80 to 100 wt%, even more preferably 90 to 100 wt%, and most preferably 100 wt% of the aromatic polycarbonate resin. If the content is less than 50 wt%, the flame retardancy may be poor.

[0010] The branched aromatic polycarbonate resin must have a branching ratio of 0.2 to 1.5 mol%, preferably 0.4 to 1.1 mol%, and more preferably 0.7 to 1.1 mol%. The branching ratio means the number of moles of structural units derived from a branching agent relative to the total number of moles of structural units derived from a dihydric phenol used in the production of the entire resin [(number of moles of structural units derived from a branching agent / total number of moles of structural units derived from a dihydric phenol) × 100 mol%], and such branching ratio is １This can be measured by H-NMR. If the branching ratio is less than 0.2 mol%, the anti-drip property is not exhibited and the flame retardancy of the resin composition is reduced. On the other hand, if the branching ratio exceeds 1.5 mol%, the polymer crosslinks and generates a gel, which reduces the infrared light transmittance.

[0011] The aromatic polycarbonate resin having a branched structure preferably has a total N (nitrogen) content of 0 to 20 ppm, more preferably 0 to 10 ppm, and a total Cl (chlorine) content of 0 to 200 ppm, more preferably 0 to 150 ppm. If the total N content in the resin exceeds 20 ppm or the total Cl content exceeds 200 ppm, the thermal stability may be impaired.

[0012] The polycarbonate resin having a branched structure can be obtained by reacting a dihydric phenol, a branching agent, a monohydric phenol and phosgene.

[0013] Representative examples of dihydric phenols that can be used include 2,2-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A), hydroquinone, resorcinol, 4,4'-biphenol, 1,1-bis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxy-3-methylphenyl)propane, 2,2-bis(4-hydroxyphenyl)butane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 1,1-bis(4-hydroxyphenyl)cyclohexane ...-1-phenylethane, Examples of suitable hydroxyphenyl compounds include (4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 2,2-bis(4-hydroxyphenyl)pentane, 4,4'-(p-phenylenediisopropylidene)diphenol, 4,4'-(m-phenylenediisopropylidene)diphenol, 1,1-bis(4-hydroxyphenyl)-4-isopropylcyclohexane, bis(4-hydroxyphenyl)oxide, bis(4-hydroxyphenyl)sulfide, and bis(4-hydroxyphenyl)sulfoxide. These compounds may be used alone or in combination of two or more. Of these, 2,2-bis(4-hydroxyphenyl)propane, i.e., bisphenol A, is preferred.

[0014] Representative examples of branching agents (trivalent or higher phenols) used in the present invention include 1,1,1-tris(4-hydroxyphenyl)ethane, 4,6-dimethyl-2,4,6-tri(4-hydroxyphenyl)heptene-2,4,6-dimethyl-2,4,6-tri(4-hydroxyphenyl)heptane, 1,3,5-tri(4-hydroxyphenyl)benzene, 2,6-bis(2-hydroxy-5-methylbenzyl)-4-methylphenol, tetra(4-hydroxyphenyl)methane, trisphenol, bis(2,4-dihydroxyphenyl)ketone, phloroglucin, phloroglucside, isanthin bisphenol, 1,4-bis(4,4-dihydroxytriphenylmethyl)benzene, trimellitic acid, and pyromellitic acid. These may be used alone or in combination of two or more. Of these, 1,1,1-tris(4-hydroxyphenyl)ethane is preferred.

[0015] The monohydric phenol (end-stopper) may have any structure and is not particularly limited. Examples include p-tert-butylphenol, p-tert-octylphenol, p-cumylphenol, 4-hydroxybenzophenone, and phenol. These may be used alone or in combination of two or more. Of these, p-tert-butylphenol is preferred. That is, it is preferable that the polycarbonate resin having a branched structure has a structure in which the branched structure portion is derived from 1,1,1-tris(4-hydroxyphenyl)ethane, a linear structure portion excluding the branched structure portion is derived from bisphenol A, and the terminals are derived from p-tert-butylphenol.

[0016] The polycarbonate resin having a branched structure of the present invention is preferably produced by the following first or second method.

[0017] In the first production method, a dihydric phenol and phosgene are reacted in the presence of a solvent to obtain a polycarbonate oligomer, which is then reacted with a monohydric phenol. The resulting polycarbonate oligomer is then reacted with a branching agent, after which the polycarbonate oligomer is emulsified and polymerized under unstirred conditions. The reaction temperature from phosgenation to before emulsification is preferably 10 to 40°C, more preferably 15 to 30°C. The reaction temperature after emulsification is preferably 20 to 50°C, more preferably 30 to 40°C. The polymerization time is preferably 1 to 6 hours, more preferably 2 to 4 hours. The resulting reaction mixture is treated by conventional means such as washing and separation to obtain the desired polycarbonate resin having the branched structure of the present invention.

[0018] In the second production method, a dihydric phenol, a branching agent, and phosgene are first reacted in the presence of a solvent to obtain a polycarbonate oligomer, which is then reacted with a monohydric phenol. After emulsifying the obtained polycarbonate oligomer, a dihydric phenol is added in an amount preferably 1 / 30 to 1 / 200, more preferably 1 / 40 to 1 / 100, of the amount of the dihydric phenol initially reacted, and polymerization is carried out under stirring conditions.

[0019] The reaction temperature from phosgenation to before emulsification is preferably 10 to 40°C, more preferably 15 to 30°C. The reaction temperature after emulsification is preferably 20 to 50°C, more preferably 30 to 40°C. When the polymerization reaction is carried out continuously, the stirring speed in each polymerization vessel is preferably 100 rpm or less, more preferably 50 rpm or less, and the high-viscosity emulsified fluid in the polymerization vessel is mixed in a substantially piston flow manner in a direction perpendicular to the direction of fluid flow so that there is little difference in residence time. The polymerization time is preferably 1 to 6 hours, more preferably 2 to 4 hours. The resulting reaction mixture is treated by conventional means such as washing and separation to obtain the desired polycarbonate resin having a branched structure of the present invention.

[0020] Although tertiary amines such as triethylamine, tetra-n-butylammonium bromide, and tetra-n-butylphosphonium bromide can be used as reaction catalysts, these catalysts may react with chloroformate groups to form thermally unstable urethane bonds, or the remaining catalyst may increase the total N content in the polycarbonate resin having a branched structure. Therefore, the amount of tertiary amine used is preferably 0.2 mol % or less, more preferably 0.1 mol % or less, and even more preferably 0.05 mol % or less, relative to the dihydric phenol used. It is particularly preferred to carry out the above reaction without a catalyst.

[0021] Furthermore, in order to reduce the total Cl content in the polycarbonate resin having a branched structure, it is necessary to remove chlorinated hydrocarbon solvents used as reaction solvents, such as dichloromethane (methylene chloride), dichloroethane, trichloroethane, tetrachloroethane, pentachloroethane, hexachloroethane, dichloroethylene, chlorobenzene, and dichlorobenzene. For example, this can be achieved by thoroughly drying the polycarbonate resin powder and pellets having a branched structure.

[0022] The aromatic polycarbonate resin having a branched structure may be used alone or in combination of two or more.

[0023] The branched aromatic polycarbonate resin is preferably substantially free of halogen atoms. "Substantially free of halogen atoms" means that the molecule does not contain halogen-substituted dihydric phenols or the like, and does not include trace amounts of solvent (halogenated hydrocarbon) or carbonate precursors remaining in the above-mentioned production method.

[0024] The viscosity average molecular weight of the aromatic polycarbonate resin containing the aromatic polycarbonate resin having a branched structure of the present invention is preferably in the range of 16,000 to 32,000, more preferably in the range of 17,000 to 30,000, and even more preferably in the range of 19,000 to 26,000. If the molecular weight exceeds 32,000, the melt tension may be high and moldability may be poor, while if the molecular weight is less than 16,000, drip prevention properties may not be easily achieved when a molded piece is burned, and the flame retardancy of the resin composition may be reduced.

[0025] The viscosity average molecular weight (M) in the present invention is determined by first determining the specific viscosity (ηSP) calculated by the following formula using an Ostwald viscometer from a solution prepared by dissolving 0.7 g of the aromatic polycarbonate resin in 100 ml of methylene chloride at 20°C: Specific viscosity (ηSP) = (t - t ０ ) / t ０ [t ０ is the number of seconds for methylene chloride to fall, and t is the number of seconds for the sample solution to fall.] The viscosity average molecular weight M is calculated from the determined specific viscosity (ηSP) using the following formula: ηSP / c = [η] + 0.45 × [η] ２ c (where [η] is the intrinsic viscosity) [η] = 1.23 × 10 －４ M ０．８３ c=0.7

[0026] Component A may contain a linear aromatic polycarbonate resin. The linear aromatic polycarbonate resin is typically obtained by reacting a dihydric phenol with a carbonate precursor by an interfacial polycondensation method or a melt transesterification method, or by polymerizing a carbonate prepolymer by a solid-phase transesterification method or by polymerizing a cyclic carbonate compound by a ring-opening polymerization method.

[0027] Representative examples of the dihydric phenol used herein include hydroquinone, resorcinol, 4,4'-dihydroxydiphenyl, bis(4-hydroxyphenyl)methane, bis{(4-hydroxy-3,5-dimethyl)phenyl}methane, 1,1-bis(4-hydroxyphenyl)ethane, 1,1-bis(4-hydroxyphenyl)-1-phenylethane, 2,2-bis(4-hydroxyphenyl)propane (commonly known as bisphenol A), 2,2-bis{(4-hydroxy-3-methyl)phenyl}propane, 2,2-bis{(4- 2,2-bis{(3-isopropyl-4-hydroxy)phenyl}propane, 2,2-bis{(4-hydroxy-3-phenyl)phenyl}propane, 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)-3-methylbutane, 2,2-bis(4-hydroxyphenyl)-3,3-dimethylbutane, 2,4-bis(4-hydroxyphenyl)-2-methylbutane, 2,2-bis(4-hydroxyphenyl)pentane, 2,2-bis(4-hydroxyphenyl)pentane, 1,1-bis(4-hydroxyphenyl)-4-methylpentane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-4-isopropylcyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 9,9-bis(4-hydroxyphenyl)fluorene, 9,9-bis{(4-hydroxy-3-methyl)phenyl}fluorene, α,α'-bis(4-hydroxyphenyl)-o-diisopropylbenzene, α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene Examples of the dihydroxydiphenyl ether include 4,4'-diisopropylbenzene, α,α'-bis(4-hydroxyphenyl)-p-diisopropylbenzene, 1,3-bis(4-hydroxyphenyl)-5,7-dimethyladamantane, 4,4'-dihydroxydiphenyl sulfone, 4,4'-dihydroxydiphenyl sulfoxide, 4,4'-dihydroxydiphenyl sulfide, 4,4'-dihydroxydiphenyl ketone, 4,4'-dihydroxydiphenyl ether, and 4,4'-dihydroxydiphenyl ester, and these can be used alone or in combination of two or more.

[0028] Among these, homopolymers or copolymers obtained from at least one bisphenol selected from the group consisting of bisphenol A, 2,2-bis{(4-hydroxy-3-methyl)phenyl}propane, 2,2-bis(4-hydroxyphenyl)butane, 2,2-bis(4-hydroxyphenyl)-3-methylbutane, 2,2-bis(4-hydroxyphenyl)-3,3-dimethylbutane, 2,2-bis(4-hydroxyphenyl)-4-methylpentane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, and α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene are preferred, and homopolymers of bisphenol A and copolymers of 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane with bisphenol A, 2,2-bis{(4-hydroxy-3-methyl)phenyl}propane, or α,α'-bis(4-hydroxyphenyl)-m-diisopropylbenzene are particularly preferred. Of these, 2,2-bis(4-hydroxyphenyl)propane, ie, bisphenol A, is more preferable.

[0029] The carbonate precursor may be a carbonyl halide, a carbonate ester, or a haloformate, and specifically may be phosgene, diphenyl carbonate, or a dihaloformate of a dihydric phenol, etc. Of these, phosgene or diphenyl carbonate is industrially advantageous.

[0030] When the dihydric phenol and the carbonate precursor are reacted by the interfacial polycondensation method or the melt transesterification method to produce the linear aromatic polycarbonate resin, a catalyst, a terminal terminator, an antioxidant for the dihydric phenol, etc. may be used as needed. In addition, a mixture of two or more of the obtained linear aromatic polycarbonate resins may also be used.

[0031] The reaction using the interfacial polycondensation method typically involves a reaction between a dihydric phenol and phosgene, carried out in the presence of an acid binder and an organic solvent. Examples of acid binders include alkali metal hydroxides such as sodium hydroxide and potassium hydroxide, or amine compounds such as pyridine. Examples of organic solvents include halogenated hydrocarbons such as methylene chloride and chlorobenzene. To accelerate the reaction, catalysts such as tertiary amines (e.g., triethylamine, tetra-n-butylammonium bromide, and tetra-n-butylphosphonium bromide), quaternary ammonium compounds, and quaternary phosphonium compounds can also be used. The reaction temperature is typically 0 to 40°C, the reaction time is approximately 10 minutes to 5 hours, and the pH during the reaction is preferably maintained at 9 or higher. Furthermore, a terminal terminator (monohydric phenol) is typically used in such polymerization reactions. Monofunctional phenols can be used as such terminal terminators. Monofunctional phenols are commonly used as terminal terminators for molecular weight control. Examples of such monofunctional phenols include phenol or lower alkyl-substituted phenols, and include monofunctional phenols represented by the following general formula (1):

[0032] (In the formula, A is a hydrogen atom or a linear or branched alkyl group having 1 to 9 carbon atoms or a phenyl-substituted alkyl group, and r is an integer of 1 to 5, preferably 1 to 3.)

[0033] Specific examples of the monofunctional phenols include phenol, p-tert-butylphenol, p-cumylphenol, and isooctylphenol.

[0034] Other monofunctional phenols include phenols or benzoic acid chlorides having a long-chain alkyl group or an aliphatic polyester group as a substituent, or long-chain alkylcarboxylic acid chlorides. Among these, phenols having a long-chain alkyl group as a substituent, represented by the following general formulas (2) and (3), are preferably used.

[0035] (In the formula, X is —R—O—, —R—CO—O—, or —R—O—CO—, where R is a single bond or a divalent aliphatic hydrocarbon group having 1 to 10, preferably 1 to 5, carbon atoms, and n is an integer of 10 to 50.)

[0036] The substituted phenols of the general formula (2) preferably have n of 10 to 30, particularly 10 to 26, and specific examples thereof include decylphenol, dodecylphenol, tetradecylphenol, hexadecylphenol, octadecylphenol, eicosylphenol, docosylphenol, and triacontylphenol.

[0037] Suitable substituted phenols of general formula (3) are compounds in which X is -R-CO-O- and R is a single bond, and those in which n is 10 to 30, particularly 10 to 26, are preferred, and specific examples thereof include decyl hydroxybenzoate, dodecyl hydroxybenzoate, tetradecyl hydroxybenzoate, hexadecyl hydroxybenzoate, eicosyl hydroxybenzoate, docosyl hydroxybenzoate, and triacontyl hydroxybenzoate. The end-capping agents may be used alone or in combination of two or more.

[0038] The reaction by the melt transesterification method is usually a transesterification reaction between a dihydric phenol and a carbonate ester, and is carried out by mixing the dihydric phenol and the carbonate ester while heating them in the presence of an inert gas, and distilling off the resulting alcohol or phenol. The reaction temperature varies depending on the boiling point of the resulting alcohol or phenol, but is usually in the range of 120 to 350°C. At the later stage of the reaction, the system is heated to 1.33 x 10 ３ The pressure is reduced to about 13.3 Pa to facilitate distillation of the produced alcohol or phenol. The reaction time is usually about 1 to 4 hours.

[0039] Examples of carbonate esters include esters of an aryl group or aralkyl group having 6 to 10 carbon atoms, which may be substituted, or an alkyl group having 1 to 4 carbon atoms. Specific examples include diphenyl carbonate, bis(chlorophenyl)carbonate, dinaphthyl carbonate, bis(diphenyl)carbonate, dimethyl carbonate, diethyl carbonate, and dibutyl carbonate, with diphenyl carbonate being preferred.

[0040] In addition, a polymerization catalyst can be used to increase the polymerization rate. Examples of such a polymerization catalyst include alkali metal compounds such as sodium hydroxide, potassium hydroxide, and sodium and potassium salts of dihydric phenols; alkaline earth metal compounds such as calcium hydroxide, barium hydroxide, and magnesium hydroxide; nitrogen-containing basic compounds such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, trimethylamine, and triethylamine; alkoxides of alkali metals and alkaline earth metals; organic acid salts of alkali metals and alkaline earth metals; zinc compounds, boron compounds, aluminum compounds, silicon compounds, germanium compounds, organic tin compounds, lead compounds, osmium compounds, antimony compounds, manganese compounds, titanium compounds, and zirconium compounds, which are commonly used in esterification and transesterification reactions. The catalysts may be used alone or in combination of two or more. The amount of these polymerization catalysts used is preferably 1 × 10 per mole of the raw material dihydric phenol. －８ ~1 x 10 －３ equivalent, more preferably 1 x 10 －７ ~5 x 10 －４ It is selected within the range of equivalents.

[0041] In order to reduce the number of phenolic terminal groups in such a polymerization reaction, compounds such as bis(chlorophenyl)carbonate, bis(bromophenyl)carbonate, bis(nitrophenyl)carbonate, bis(phenylphenyl)carbonate, chlorophenylphenylcarbonate, bromophenylphenylcarbonate, nitrophenylphenylcarbonate, phenylphenylcarbonate, methoxycarbonylphenylphenylcarbonate, and ethoxycarbonylphenylphenylcarbonate can be added in the latter stage of the polycondensation reaction or after its completion. Of these, 2-chlorophenylphenylcarbonate, 2-methoxycarbonylphenylphenylcarbonate, and 2-ethoxycarbonylphenylphenylcarbonate are preferred, with 2-methoxycarbonylphenylphenylcarbonate being particularly preferred.

[0042] Furthermore, it is preferable to use a deactivator that neutralizes the activity of the catalyst in such a polymerization reaction. Specific examples of this deactivator include sulfonic acid esters such as benzenesulfonic acid, p-toluenesulfonic acid, methyl benzenesulfonate, ethyl benzenesulfonate, butyl benzenesulfonate, octyl benzenesulfonate, phenyl benzenesulfonate, methyl p-toluenesulfonate, ethyl p-toluenesulfonate, butyl p-toluenesulfonate, octyl p-toluenesulfonate, and phenyl p-toluenesulfonate; and further, trifluoromethanesulfonic acid, naphthalenesulfonic acid, sulfonated polystyrene, methyl acrylate-sulfonated styrene copolymer, 2-phenyl-2-propyl dodecylbenzenesulfonate, 2-phenyl-2-butyl dodecylbenzenesulfonate, tetrabutylphosphonium octylsulfonate, tetrabutylphosphonium decylsulfonate, tetrabutylphosphonium benzenesulfonate, and tetraethyl dodecylbenzenesulfonate. Examples of compounds that can be used include, but are not limited to, phosphonium salts, dodecylbenzenesulfonic acid tetrabutylphosphonium salts, dodecylbenzenesulfonic acid tetrahexylphosphonium salts, dodecylbenzenesulfonic acid tetraoctylphosphonium salts, decylammonium butyl sulfate, decylammonium decyl sulfate, dodecylammonium methyl sulfate, dodecylammonium ethyl sulfate, dodecylmethylammonium methyl sulfate, dodecyldimethylammonium tetradecyl sulfate, tetradecyldimethylammonium methyl sulfate, tetramethylammonium hexyl sulfate, decyltrimethylammonium hexadecyl sulfate, tetrabutylammonium dodecylbenzyl sulfate, tetraethylammonium dodecylbenzyl sulfate, and tetramethylammonium dodecylbenzyl sulfate. Two or more of these compounds can also be used in combination.

[0043] Among the deactivators, phosphonium salt or ammonium salt type deactivators are preferred. The amount of such a deactivator is preferably 0.5 to 50 moles per mole of the remaining catalyst, and is used in an amount of 0.01 to 500 ppm, more preferably 0.01 to 300 ppm, and particularly preferably 0.01 to 100 ppm, based on the linear aromatic polycarbonate resin after polymerization.

[0044] Although the molecular weight of the linear polycarbonate resin is not specified, a viscosity-average molecular weight of less than 10,000 results in poor high-temperature properties, and a viscosity-average molecular weight of more than 50,000 results in poor moldability. Therefore, a viscosity-average molecular weight of 10,000 to 50,000 is preferred, 14,000 to 30,000 is more preferred, 18,000 to 26,000 is even more preferred, and 19,000 to 23,000 is most preferred. Two or more linear aromatic polycarbonate resins may be mixed. In this case, it is naturally possible to mix linear aromatic polycarbonate resins with viscosity-average molecular weights outside the above range, as long as the viscosity-average molecular weight of the resulting mixture is within the preferred range.

[0045] In particular, a mixture with a linear aromatic polycarbonate resin having a viscosity average molecular weight of more than 50,000 is preferred because it has a high drip prevention ability and can more efficiently exhibit the effects of the present invention. A mixture with a linear aromatic polycarbonate resin having a viscosity average molecular weight of 80,000 or more is more preferred, and a mixture with a linear aromatic polycarbonate resin having a viscosity average molecular weight of 100,000 or more is even more preferred. That is, a mixture having a clear two-peak distribution as determined by methods such as GPC (gel permeation chromatography) is preferably used. The viscosity average molecular weight can be calculated in the same way as for aromatic polycarbonate resins containing aromatic polycarbonate resins having a branched structure.

[0046] The linear aromatic polycarbonate resin is preferably substantially free of halogen atoms. "Substantially free of halogen atoms" means that the molecule does not contain halogen-substituted dihydric phenols or the like, and does not include trace amounts of chlorinated solvents, carbonate precursors, and the like remaining in the production method for the linear aromatic polycarbonate resin.

[0047] (Component B: Organic Alkali(Earth) Metal Salt) The resin composition of the present invention contains an organic alkali(earth) metal salt. As the organic alkali(earth) metal salt, various metal salts conventionally used to flame-retardant polycarbonate resins can be used. Examples of suitable organic alkali(earth) metal salts include alkali(earth) metal salts of organic sulfonic acids, alkali(earth) metal salts of aromatic imides, alkali(earth) metal salts of sulfates, and alkali(earth) metal salts of phosphoric acid partial esters. (Here, the term "alkali(earth) metal salt" is used to include both alkali metal salts and alkaline earth metal salts.) These salts can be used alone or in combination of two or more. The metal constituting the organic alkali(earth) metal salt is an alkali metal or alkaline earth metal, and preferably an alkali metal. Examples of alkali metals include lithium, sodium, potassium, rubidium, and cesium. Examples of alkaline earth metals include beryllium, magnesium, calcium, strontium, and barium. Particularly preferred are lithium, sodium, and potassium.

[0048] Examples of the alkali (earth) metal salt of organic sulfonic acid include alkali (earth) metal salts of aliphatic sulfonic acid, alkali (earth) metal salts of aromatic sulfonic acid, etc. Preferred examples of the alkali (earth) metal salt of such aliphatic sulfonic acid include alkali (earth) metal alkylsulfonates, alkali (earth) metal sulfonates in which a portion of the alkyl group of such alkali (earth) metal alkylsulfonates is substituted with a fluorine atom, and alkali (earth) metal perfluoroalkylsulfonates, and these can be used alone or in combination of two or more.

[0049] Preferred examples of the alkali (earth) metal alkylsulfonate include methanesulfonate, ethanesulfonate, propanesulfonate, butanesulfonate, methylbutanesulfonate, hexanesulfonate, heptanesulfonate, and octanesulfonate, which can be used alone or in combination of two or more. Metal salts in which a portion of the alkyl group is substituted with a fluorine atom are also included.

[0050] On the other hand, preferred examples of perfluoroalkylsulfonic acid alkali (earth) metal salts include perfluoromethanesulfonate, perfluoroethanesulfonate, perfluoropropanesulfonate, perfluorobutanesulfonate, perfluoromethylbutanesulfonate, perfluorohexanesulfonate, perfluoroheptanesulfonate, and perfluorooctane sulfonate, and particularly preferred are those having a carbon number of 1 to 8. These can be used alone or in combination of two or more.

[0051] Among these, alkali metal perfluoroalkylsulfonates are the most preferred. Among these alkali metals, rubidium and cesium are suitable when higher flame retardancy is required, but they are not widely used and are difficult to purify, which can result in cost disadvantages. On the other hand, lithium and sodium, while advantageous in terms of cost, can be disadvantageous in terms of flame retardancy. Taking these factors into consideration, different alkali metals can be used in alkali metal perfluoroalkylsulfonates, but potassium perfluoroalkylsulfonates, which have an excellent balance of properties in all respects, are most preferred. Such potassium salts can also be used in combination with alkali metal perfluoroalkylsulfonates made of other alkali metals.

[0052] Specific examples of perfluoroalkylsulfonic acid alkali metal salt include potassium trifluoromethanesulfonate, potassium perfluorobutanesulfonate, potassium perfluorohexanesulfonate, potassium perfluorooctane sulfonate, sodium pentafluoroethanesulfonate, sodium perfluorobutanesulfonate, sodium perfluorooctane sulfonate, lithium trifluoromethanesulfonate, lithium perfluorobutanesulfonate, lithium perfluoroheptanesulfonate, cesium trifluoromethanesulfonate, cesium perfluorobutanesulfonate, cesium perfluorooctane sulfonate, cesium perfluorohexanesulfonate, rubidium perfluorobutanesulfonate and rubidium perfluorohexanesulfonate, and these can be used alone or in combination of two or more.Among these, potassium perfluorobutanesulfonate is particularly preferred.

[0053] The aromatic sulfonic acid used in the alkali (earth) metal salt of aromatic sulfonate may be at least one acid selected from the group consisting of sulfonic acids of monomeric or polymeric aromatic sulfides, sulfonic acids of aromatic carboxylic acids and esters, sulfonic acids of monomeric or polymeric aromatic ethers, sulfonic acids of aromatic sulfonates, monomeric or polymeric aromatic sulfonic acids, monomeric or polymeric aromatic sulfone sulfonic acids, sulfonic acids of aromatic ketones, heterocyclic sulfonic acids, sulfonic acids of aromatic sulfoxides, and condensates of aromatic sulfonic acids with a methylene bond, and these may be used alone or in combination of two or more.

[0054] Alkali (earth) metal sulfonates of monomeric or polymeric aromatic sulfides are described in JP-A-50-98539, and examples thereof include disodium diphenyl sulfide-4,4'-disulfonate and dipotassium phenyl sulfide-4,4'-disulfonate.

[0055] Alkali (earth) metal sulfonates of aromatic carboxylic acids and esters are described in JP-A-50-98540, and examples thereof include potassium 5-sulfoisophthalate, sodium 5-sulfoisophthalate, and polysodium polyethylene terephthalate polysulfonate.

[0056] Examples of alkali (earth) metal sulfonates of monomeric or polymeric aromatic ethers are described in JP-A-50-98542, and examples thereof include calcium 1-methoxynaphthalene-4-sulfonate, disodium 4-dodecylphenyl ether disulfonate, polysodium poly(2,6-dimethylphenylene oxide) polysulfonate, polysodium poly(1,3-phenylene oxide) polysulfonate, polysodium poly(1,4-phenylene oxide) polysulfonate, polypotassium poly(2,6-diphenylphenylene oxide) polysulfonate, and lithium poly(2-fluoro-6-butylphenylene oxide) polysulfonate.

[0057] Alkali (earth) metal sulfonate salts of aromatic sulfonates are described in JP-A-50-98544, and examples thereof include potassium sulfonate of benzenesulfonate.

[0058] Monomeric or polymeric alkali (earth) metal aromatic sulfonates are described in JP-A-50-98546, and examples thereof include sodium benzenesulfonate, strontium benzenesulfonate, magnesium benzenesulfonate, dipotassium p-benzenedisulfonate, dipotassium naphthalene-2,6-disulfonate, and calcium biphenyl-3,3′-disulfonate.

[0059] Monomeric or polymeric alkali (earth) metal salts of aromatic sulfone sulfonates are described in JP-A-52-54746, and examples thereof include sodium diphenylsulfone-3-sulfonate, potassium diphenylsulfone-3-sulfonate, dipotassium diphenylsulfone-3,3'-disulfonate, and dipotassium diphenylsulfone-3,4'-disulfonate.

[0060] Alkali (earth) metal sulfonates of aromatic ketones are described in JP-A-50-98547, and examples thereof include sodium α,α,α-trifluoroacetophenone-4-sulfonate and dipotassium benzophenone-3,3'-disulfonate.

[0061] Examples of the heterocyclic alkali (earth) metal sulfonates are described in JP-A-50-116542, and include, for example, disodium thiophene-2,5-disulfonate, dipotassium thiophene-2,5-disulfonate, calcium thiophene-2,5-disulfonate, and sodium benzothiophenesulfonate.

[0062] Alkali (earth) metal sulfonates of aromatic sulfoxides are described in Japanese Patent Application Laid-Open No. 52-4745, and examples thereof include potassium diphenyl sulfoxide-4-sulfonate.

[0063] Examples of the condensation products of aromatic alkali (earth) metal sulfonates with a methylene bond include formalin condensation products of sodium naphthalenesulfonate and formalin condensation products of sodium anthracenesulfonate.

[0064] Examples of the alkali(earth) metal salts of sulfates include, in particular, alkali(earth) metal salts of sulfates of monohydric and / or polyhydric alcohols, such as methyl sulfate, ethyl sulfate, lauryl sulfate, hexadecyl sulfate, sulfates of polyoxyethylene alkylphenyl ethers, mono-, di-, tri-, and tetrasulfates of pentaerythritol, sulfates of lauric acid monoglyceride, sulfates of palmitic acid monoglyceride, sulfates of stearic acid monoglyceride, etc. Preferred examples of the alkali(earth) metal salts of these sulfates include alkali(earth) metal salts of lauryl sulfate.

[0065] Specific examples of the alkali (earth) metal salts of the phosphoric acid partial esters include alkali (earth) metal salts such as bis(2,6-dibromo-4-cumylphenyl)phosphate, bis(4-cumylphenyl)phosphate, bis(2,4,6-tribromophenyl)phosphate, bis(2,4-dibromophenyl)phosphate, bis(4-bromophenyl)phosphate, diphenylphosphate, and bis(4-tert-butylphenyl)phosphate.

[0066] Examples of the alkali (earth) metal salts of aromatic imides include alkali (earth) metal salts of saccharin, N-(p-tolylsulfonyl)-p-toluenesulfonamide (i.e., di(p-toluenesulfon)imide), N-(N'-benzylaminocarbonyl)sulfanilimide, N-(phenylcarboxyl)sulfanilimide, bis(diphenylphosphoric acid)imide, and the like.

[0067] Among these, preferred components include one or more compounds selected from the group consisting of alkali (earth) metal salts of perfluoroalkylsulfonates, alkali (earth) metal salts of aromatic sulfonates, and alkali (earth) metal salts of aromatic imides, and among these, one or more compounds selected from the group consisting of potassium perfluorobutanesulfonate, sodium perfluorobutanesulfonate, sulfonates of diphenylsulfones represented by the following general formula (4), potassium salts of di(p-toluenesulfone)imide, and sodium salts of di(p-toluenesulfone)imide are more preferred. Furthermore, potassium perfluorobutanesulfonate is most preferred.

[0068] (wherein n represents 0 to 3, and M represents K or Na.)

[0069] The content of Component B is 0.005 to 0.15 parts by weight, preferably 0.01 to 0.12 parts by weight, more preferably 0.03 to 0.1 parts by weight, and particularly preferably 0.05 to 0.1 parts by weight, relative to 100 parts by weight of Component A. If the content of Component B is less than 0.005 parts by weight, the flame retardancy of the resin composition will be insufficient. On the other hand, if the content exceeds 0.15 parts by weight, the infrared light transmittance will decrease.

[0070] (Component C: Colorant Having an Absorption Maximum at a Wavelength of Less than 680 nm) The aromatic polycarbonate resin composition of the present invention contains a colorant having an absorption maximum at a wavelength of less than 680 nm. If the wavelength at which the absorption maximum exists exceeds 680 nm, sufficient cutoff characteristics cannot be obtained in the 400 to 700 nm range. The lower limit of the wavelength at which the absorption maximum exists is not particularly specified, but 300 nm is preferred. The colorant can be selected from various dyes, pigments, etc., as long as it is possible to obtain the aromatic polycarbonate resin composition intended by the present invention. However, inorganic pigments such as carbon black, which have absorption over a wide wavelength range from visible to infrared, are not suitable because their addition reduces the transmittance of infrared light used in sensors. Furthermore, dyes are preferred because they do not cause diffuse reflection of light on the particle surfaces. Examples of dye-based colorants include anthraquinone-based colorants, perinone-based colorants, perylene-based colorants, methine-based colorants, azo-based colorants, quinoline-based colorants, phthalocyanine-based colorants, squarylium-based colorants, and heterocyclic-based colorants.

[0071] The content of Component C is 0.03 to 1.2 parts by weight, preferably 0.05 to 0.8 parts by weight, and more preferably 0.1 to 0.5 parts by weight, per 100 parts by weight of Component A. If the content of Component C is less than 0.03 parts by weight, sufficient cutoff characteristics at wavelengths of 400 nm to 700 nm cannot be obtained. On the other hand, if the content exceeds 1.2 parts by weight, the flame retardancy of the resin composition deteriorates.

[0072] (Component D: Phenol-Based Heat Stabilizer) The aromatic polycarbonate resin composition of the present invention contains a phenol-based heat stabilizer. The phenolic heat stabilizer is not particularly limited as long as it has an antioxidant function, and examples thereof include n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, tetrakis{methylene-3-(3',5'-di-t-butyl-4-hydroxyphenyl)propionate}methane, distearyl(4-hydroxy-3-methyl-5-t-butylbenzyl)malonate, triethyleneglycol-bis{3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate}, 1,6-hexanediol-bis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiodiethyl olefinbis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 2,2-thiobis(4-methyl-6-t-butylphenol), 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 2,4-bis{(octylthio) methyl}-o-cresol, isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, 2,5,7,8-tetramethyl-2(4',8',12'-trimethyltridecyl)chroman-6-ol, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a"-(mesitylene-2,4,6-triyl)tri-p-cresol, and the like.

[0073] Among these, n-octadecyl-3-(4'-hydroxy-3',5'-di-t-butylphenyl)propionate, pentaerythrityl-tetrakis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, 3,3',3",5,5',5"-hexa-t-butyl-a,a',a'-(mesitylene-2,4,6-triyl)tri-p-cresol, 2,2-thiodiethylenebis{3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate}, and the like are preferred.

[0074] The content of Component D is 0.01 to 0.5 parts by weight, preferably 0.015 to 0.3 parts by weight, and more preferably 0.02 to 0.2 parts by weight, per 100 parts by weight of Component A. If the content of Component D is less than 0.01 part by weight, the flame retardancy of the resin composition will deteriorate. On the other hand, if the content exceeds 0.5 parts by weight, the moist heat resistance of the resin composition will deteriorate.

[0075] (Component E: Phosphorus-Based Heat Stabilizer) The aromatic polycarbonate resin composition of the present invention contains a phosphorus-based heat stabilizer. Examples of phosphorus-based heat stabilizers include phosphorous acid, phosphoric acid, phosphonous acid, phosphonic acid, and esters thereof, as well as tertiary phosphines. Specific examples of the phosphite compound include triphenyl phosphite, tris(nonylphenyl)phosphite, tridecyl phosphite, trioctyl phosphite, trioctadecyl phosphite, didecyl monophenyl phosphite, dioctyl monophenyl phosphite, diisopropyl monophenyl phosphite, monobutyl diphenyl phosphite, monodecyl diphenyl phosphite, monooctyl diphenyl phosphite, 2,2-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, tris(diethylphenyl)phosphite, tris(di-iso-propylphenyl)phosphite, and tris(di-n-butylphenyl)phosphite. bis(2,6-di-tert-butylphenyl) phosphite, tris(2,4-di-tert-butylphenyl) phosphite, distearyl pentaerythritol diphosphite, bis(2,4-di-tert-butylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-ethylphenyl) pentaerythritol diphosphite, phenyl bisphenol A pentaerythritol diphosphite, bis(nonylphenyl) pentaerythritol diphosphite, dicyclohexyl pentaerythritol diphosphite, etc. Furthermore, as other phosphite compounds, those which react with dihydric phenols to have a cyclic structure can also be used.For example, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2,4-di-tert-butylphenyl)phosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-methylenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, 2,2'-ethylidenebis(4-methyl-6-tert-butylphenyl)(2-tert-butyl-4-methylphenyl)phosphite, and the like can be mentioned.

[0076] Examples of the phosphate compound include tributyl phosphate, trimethyl phosphate, tricresyl phosphate, triphenyl phosphate, trichlorophenyl phosphate, triethyl phosphate, diphenyl cresyl phosphate, diphenyl monoorthoxenyl phosphate, tributoxyethyl phosphate, dibutyl phosphate, dioctyl phosphate, and diisopropyl phosphate, and preferred are triphenyl phosphate and trimethyl phosphate.

[0077] Examples of the phosphonite compounds include tetrakis(2,4-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,4-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,4'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-4,3'-biphenylene diphosphonite, tetrakis(2,6-di-tert-butylphenyl)-3,3'-biphenylene diphosphonite, bis(2,4-di-tert-butylphenyl)-4-phenyl ... Examples of suitable phosphonite compounds include (2,4-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-n-butylphenyl)-3-phenyl-phenyl phosphonite, bis(2,6-di-tert-butylphenyl)-4-phenyl-phenyl phosphonite, and bis(2,6-di-tert-butylphenyl)-3-phenyl-phenyl phosphonite. Preferred are tetrakis(di-tert-butylphenyl)-biphenylene diphosphonite and bis(di-tert-butylphenyl)-phenyl-phenyl phosphonite. Tetrakis(2,4-di-tert-butylphenyl)-biphenylene diphosphonite and bis(2,4-di-tert-butylphenyl)-phenyl-phenyl phosphonite are more preferred. Such phosphonite compounds can be used in combination with the above-mentioned phosphite compounds having an aryl group substituted with two or more alkyl groups, which is preferred. Examples of suitable phosphonate compounds include dimethyl benzenephosphonate, diethyl benzenephosphonate, and dipropyl benzenephosphonate.

[0078] Examples of tertiary phosphines include triethylphosphine, tripropylphosphine, tributylphosphine, trioctylphosphine, triamylphosphine, dimethylphenylphosphine, dibutylphenylphosphine, diphenylmethylphosphine, diphenyloctylphosphine, triphenylphosphine, tri-p-tolylphosphine, trinaphthylphosphine, and diphenylbenzylphosphine. A particularly preferred tertiary phosphine is triphenylphosphine. The above phosphorus-based heat stabilizers can be used alone or in combination of two or more. Among the above phosphorus-based heat stabilizers, it is preferable to incorporate an alkyl phosphate compound, such as trimethyl phosphate. It is also a preferred embodiment to use such an alkyl phosphate compound in combination with a phosphite compound and / or a phosphonite compound.

[0079] The content of Component E is 0.025 to 0.5 parts by weight, preferably 0.025 to 0.3 parts by weight, and more preferably 0.03 to 0.2 parts by weight, per 100 parts by weight of Component A. If the content of Component E is less than 0.025 parts by weight, the flame retardancy of the resin composition will deteriorate. On the other hand, if the content exceeds 0.5 parts by weight, the moist heat resistance of the resin composition will deteriorate.

[0080] The total content of the D and E components is 0.6 parts by weight or less, preferably 0.4 parts by weight or less, and more preferably 0.3 parts by weight or less. If the content exceeds 0.6 parts by weight, the moist heat resistance of the resin composition deteriorates. The lower limit of the content is not particularly limited, but is preferably 0.035 parts by weight.

[0081] (Component F: Colorant Having an Absorption Maximum at a Wavelength of 680 to Less than 1000 nm) The aromatic polycarbonate resin composition of the present invention may contain a colorant having an absorption maximum at a wavelength of 680 to less than 1000 nm. The colorant can be selected from various dyes, pigments, and the like, as long as the aromatic polycarbonate resin composition of the present invention can be obtained. However, inorganic pigments such as carbon black, which have absorption over a wide wavelength range from visible to infrared, are not suitable because their addition reduces the transmittance of infrared light used in sensors. In addition, dyes are preferred because they do not cause diffuse reflection on the particle surfaces. Examples of dye-based colorants include anthraquinone-based colorants, perinone-based colorants, perylene-based colorants, methine-based colorants, azo-based colorants, quinoline-based colorants, phthalocyanine-based colorants, squarylium-based colorants, and heterocyclic-based colorants. Among these, anthraquinone-based colorants, phthalocyanine-based colorants, perylene-based colorants, and heterocyclic-based colorants, which have high heat resistance, are more preferred.

[0082] The content of the F component is preferably 0.001 to 1.2 parts by weight, more preferably 0.003 to 0.5 parts by weight, and even more preferably 0.005 to 0.3 parts by weight, relative to 100 parts by weight of the A component. If the F component content is less than 0.001 part by weight, sufficient cutoff characteristics may not be obtained at wavelengths from 400 nm to the wavelength at which the absorption of the F component is maximum. On the other hand, if the content exceeds 1.2 parts by weight, the flame retardancy of the resin composition may deteriorate.

[0083] The total content of the C and F components is preferably 1.3 parts by weight or less, more preferably 1.0 parts by weight or less, and even more preferably 0.8 parts by weight or less. If the content exceeds 1.3 parts by weight, the flame retardancy of the resin composition may deteriorate. The lower limit of the content is not particularly limited, but is preferably 0.031 parts by weight.

[0084] (Component G: Silicone Compound Containing Si-H Groups in the Molecule) The resin composition of the present invention may contain a silicone compound containing Si-H groups in the molecule. Silicone compounds used as silicone-based flame retardants improve flame retardancy through a chemical reaction during combustion. As such compounds, various compounds that have previously been proposed as flame retardants for aromatic polycarbonate resins can be used. Silicone compounds are thought to impart a high flame retardant effect, particularly when used with polycarbonate resins, by bonding with themselves or with components derived from the resin during combustion to form a structure, or by a reduction reaction during the formation of this structure.

[0085] Therefore, it is necessary for the silicone compound to contain groups that are highly active in such reactions, and more specifically, to contain Si—H groups. The content of such Si—H groups is preferably in the range of 0.1 to 1.2 mol / 100 g, more preferably in the range of 0.12 to 1 mol / 100 g, and even more preferably in the range of 0.15 to 0.6 mol / 100 g. This ratio can be determined by measuring the amount of hydrogen or alcohol generated per unit weight of the silicone compound using an alkali decomposition method.

[0086] Generally, the structure of a silicone compound is formed by any combination of the following four types of siloxane units: M unit: (CH ３ ) ３ SiO １／２ , H(CH ３ ) ２ SiO １／２ , H ２ (CH ３ ) SiO １／２ , (CH ３ ) ２ (CH ２ =CH)SiO １／２ , (CH ３ ) ２ (C ６ H ５ ) SiO １／２ , (CH ３ ) (C ６ H ５ ) (CH ２ =CH)SiO１／２ monofunctional siloxane units such as D units: (CH ３ ) ２ SiO, H(CH ３ ) SiO, H ２ SiO, H(C ６ H ５ )SiO, (CH ３ ) (CH ２ =CH)SiO, (C ６ H ５ ) ２ Bifunctional siloxane units such as SiO, T units: (CH ３ ) SiO ３／２ , (C ３ H ７ ) SiO ３／２ , HSiO ３／２ , (CH ２ =CH)SiO ３／２ , (C ６ H ５ ) SiO ３／２ trifunctional siloxane units such as Q units: SiO ２ It is a tetrafunctional siloxane unit represented by the formula:

[0087] Specific examples of the structure of the silicone compound used in the silicone-based flame retardant include rational formulas Dn, Tp, MmDn, MmTp, MmQq, MmDnTp, MmDnQq, MmTpQq, MmDnTpQq, DnTp, DnQq, and DnTpQq. Among these, preferred structures of the silicone compound are MmDn, MmTp, MmDnTp, and MmDnQq, and more preferred structures are MmDn and MmDnTp.

[0088] Here, the coefficients m, n, p, and q in the rational formula are integers of 1 or greater representing the degree of polymerization of each siloxane unit, and the sum of the coefficients in each rational formula represents the average degree of polymerization of the silicone compound. This average degree of polymerization is preferably in the range of 3 to 150, more preferably 3 to 80, even more preferably 3 to 60, and particularly preferably 4 to 40. The more preferred the range, the better the flame retardancy may be. Furthermore, as described below, silicone compounds containing a predetermined amount of aromatic groups may also have excellent transparency and hue. As a result, good reflected light can be obtained. Furthermore, when any of m, n, p, and q is a value of 2 or greater, the siloxane unit with that coefficient can be two or more types of siloxane units with different hydrogen atoms or organic residues bonded to them.

[0089] The silicone compound may be linear or branched. The organic residue bonded to the silicon atom preferably has 1 to 30 carbon atoms, more preferably 1 to 20 carbon atoms. Specific examples of such organic residues include alkyl groups such as methyl, ethyl, propyl, butyl, hexyl, and decyl; cycloalkyl groups such as cyclohexyl; aryl groups such as phenyl; and aralkyl groups such as tolyl. Alkyl groups, alkenyl groups, and aryl groups having 1 to 8 carbon atoms are even more preferred. As alkyl groups, alkyl groups having 1 to 4 carbon atoms, such as methyl, ethyl, and propyl, are particularly preferred. Furthermore, silicone compounds used as silicone flame retardants preferably contain aryl groups. Meanwhile, silane and siloxane compounds used as organic surface treatment agents for titanium dioxide pigments are clearly distinguished from silicone flame retardants in their preferred aspects, in that the absence of aryl groups provides more favorable effects. The silicone compound used as the silicone-based flame retardant may contain a reactive group in addition to the Si—H group. Examples of such reactive groups include an alkoxy group, an amino group, a carboxyl group, an epoxy group, a vinyl group, a mercapto group, and a methacryloxy group.

[0090] The content of Component G is preferably 0.1 to 6 parts by weight, more preferably 0.3 to 5 parts by weight, and even more preferably 0.5 to 4 parts by weight, per 100 parts by weight of Component A. If the content of Component G is less than 0.1 part by weight, the flame retardancy may be insufficient. On the other hand, if the content exceeds 6 parts by weight, the light transmittance in the near-infrared wavelength region including 1550 nm may decrease.

[0091] (Component H: Benzotriazole-Based Ultraviolet Absorber and / or Triazine-Based Ultraviolet Absorber) The aromatic polycarbonate resin composition of the present invention preferably contains a benzotriazole-based ultraviolet absorber and / or a triazine-based ultraviolet absorber.

[0092] Examples of benzotriazole-based ultraviolet absorbers include 2-(2-hydroxy-5-methylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octylphenyl)benzotriazole, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, 2,2′-methylene Bis[4-(1,1,3,3-tetramethylbutyl)-6-(2H-benzotriazol-2-yl)phenol], 2-(2-hydroxy-3,5-di-tert-butylphenyl)benzotriazole, 2-(2-hydroxy-3,5-di-tert-butylphenyl)-5-chlorobenzotriazole, 2-(2-hydroxy-3,5-di-tert-amylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-octyl Examples of the 2-hydroxyphenyl-2H-benzotriazole skeleton include 2-(2-hydroxy-5-acryloxyethylphenyl)benzotriazole, 2-(2-hydroxy-5-tert-butylphenyl)benzotriazole, 2-(2-hydroxy-4-octoxyphenyl)benzotriazole, 2,2'-methylenebis(4-cumyl-6-benzotriazolephenyl), 2,2'-p-phenylenebis(1,3-benzoxazin-4-one), and 2-[2-hydroxy-3-(3,4,5,6-tetrahydrophthalimidomethyl)-5-methylphenyl]benzotriazole, and polymers having a 2-hydroxyphenyl-2H-benzotriazole skeleton such as copolymers of 2-(2'-hydroxy-5-methacryloxyethylphenyl)-2H-benzotriazole and vinyl monomers copolymerizable with the monomer, and copolymers of 2-(2'-hydroxy-5-acryloxyethylphenyl)-2H-benzotriazole and vinyl monomers copolymerizable with the monomer. Furthermore, the ultraviolet absorber may be a polymeric ultraviolet absorber obtained by copolymerizing such an ultraviolet absorbing monomer and / or a photostable monomer with a monomer such as alkyl (meth)acrylate by adopting a structure of a radically polymerizable monomer compound. Suitable examples of the ultraviolet absorbing monomer include compounds containing a benzotriazole skeleton in the ester substituent of a (meth)acrylic acid ester.Among these, 2-[2-hydroxy-3,5-bis(α,α-dimethylbenzyl)phenyl]-2H-benzotriazole, typified by TINUVIN 234 (BASF Japan Ltd.), and 2-(2-hydroxy-3-tert-butyl-5-methylphenyl)-5-chlorobenzotriazole, typified by TINUVIN 326 (BASF Japan Ltd.), are more preferred.

[0093] Examples of triazine-based compounds include 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-hexyloxyphenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-methyloxyphenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-ethyloxyphenol, 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-propyloxyphenol, and 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5-butyloxyphenol. Further examples include compounds in which the phenyl group of the above-mentioned compounds is replaced with a 2,4-dimethylphenyl group, such as 2-(4,6-bis(2,4-dimethylphenyl)-1,3,5-triazin-2-yl)-5-hexyloxyphenol.

[0094] The content of component H is preferably 0.01 to 1 part by weight, more preferably 0.03 to 0.8 parts by weight, and even more preferably 0.05 to 0.5 parts by weight, relative to 100 parts by weight of component A. If the content of component G is less than 0.01 part by weight, the light stability of the absorption characteristics may deteriorate, while if it exceeds 1 part by weight, the thermal stability of the resin composition may decrease.

[0095] (Other Additives) The aromatic polycarbonate resin composition of the present invention may contain other additives, which will be specifically described below.

[0096] (I) Heat Stabilizers Other Than Components D and E The aromatic polycarbonate resin composition of the present invention can also contain heat stabilizers other than components D and E. Suitable examples of such heat stabilizers include lactone-based stabilizers, such as the reaction product of 3-hydroxy-5,7-di-tert-butyl-furan-2-one and o-xylene. Details of such stabilizers are described in Japanese Patent Application Laid-Open No. 7-233160. This compound is commercially available as Irganox HP-136 (trademark, manufactured by CIBA SPECIALTY CHEMICALS), and this compound can be used. Furthermore, stabilizers containing this compound mixed with various phosphite compounds and hindered phenol compounds are commercially available. A suitable example is Irganox HP-2921 manufactured by the same company. The content of the lactone-based stabilizer is preferably 0.0005 to 0.05 parts by weight, more preferably 0.001 to 0.03 parts by weight, per 100 parts by weight of Component A. Other stabilizers include sulfur-containing stabilizers such as pentaerythritol tetrakis(3-mercaptopropionate), pentaerythritol tetrakis(3-laurylthiopropionate), and glycerol-3-stearylthiopropionate. The content of such sulfur-containing stabilizers is preferably 0.001 to 0.1 parts by weight, more preferably 0.01 to 0.08 parts by weight, per 100 parts by weight of Component A. An epoxy compound can be blended into the aromatic polycarbonate resin composition of the present invention as needed. Such epoxy compounds are blended for the purpose of inhibiting mold corrosion, and essentially any compound having an epoxy functional group can be used. Specific examples of preferred epoxy compounds include 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylcarboxylate, 1,2-epoxy-4-(2-oxiranyl)cyclohexane adduct of 2,2-bis(hydroxymethyl)-1-butanol, copolymers of methyl methacrylate and glycidyl methacrylate, and copolymers of styrene and glycidyl methacrylate.The content of such an epoxy compound is preferably 0.003 to 0.2 parts by weight, more preferably 0.004 to 0.15 parts by weight, and even more preferably 0.005 to 0.1 parts by weight, per 100 parts by weight of component A.

[0097] (II) Mold Release Agent In order to further improve the releasability from a mold during melt molding, the aromatic polycarbonate resin composition of the present invention may contain a mold release agent within a range that does not impair the object of the present invention.

[0098] Examples of such release agents include higher fatty acid esters of monohydric or polyhydric alcohols, higher fatty acids, paraffin wax, beeswax, olefin waxes, olefin waxes containing a carboxy group and / or a carboxylic acid anhydride group, silicone oil, organopolysiloxane, etc. As the higher fatty acid ester, partial or complete esters of monohydric or polyhydric alcohols having 1 to 20 carbon atoms and saturated fatty acids having 10 to 30 carbon atoms are preferred. Examples of such partial or complete esters of monohydric or polyhydric alcohols with saturated fatty acids include stearic acid monoglyceride, stearic acid diglyceride, stearic acid triglyceride, stearate monosorbitate, stearyl stearate, behenic acid monoglyceride, behenyl behenate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol tetrapelargonate, propylene glycol monostearate, palmityl palmitate, butyl stearate, methyl laurate, isopropyl palmitate, biphenyl biphenate, sorbitan monostearate, and 2-ethylhexyl stearate. Among these, stearic acid monoglyceride, stearic acid triglyceride, pentaerythritol tetrastearate, and behenyl behenate are preferred. As the higher fatty acid, saturated fatty acids having 10 to 30 carbon atoms are preferred. Such fatty acids include myristic acid, lauric acid, palmitic acid, stearic acid, and behenic acid.

[0099] These release agents may be used alone or in combination of two or more. The content of such release agents is preferably 0.01 to 1 part by weight per 100 parts by weight of component A.

[0100] (Method for Producing Resin Composition) Any method can be used to produce the aromatic polycarbonate resin composition of the present invention. For example, the components and optionally other components can be premixed, followed by melt-kneading and pelletizing. Examples of premixing methods include a Nauta mixer, a V-blender, a Henschel mixer, a mechanochemical device, and an extrusion mixer. In premixing, granulation can be performed using an extrusion granulator or a briquetting machine, depending on the situation. After premixing, the mixture is melt-kneaded in a melt kneader, typically a vented twin-screw extruder, and pelletized using equipment such as a pelletizer. Other examples of melt kneaders include a Banbury mixer, a kneading roll, and a thermostatically controlled stirring vessel, with a vented twin-screw extruder being preferred. Alternatively, the components and optionally other components can be independently fed to a melt kneader, typically a twin-screw extruder, without premixing.

[0101] (Regarding Molded Products) The pellets produced as described above can be injection molded to produce various products. Furthermore, it is also possible to directly mold sheets, films, profile extrusions, and injection-molded products from the melt-kneaded resin in an extruder without first passing through the pelletizing process. In such injection molding, molded products can be obtained using not only conventional molding methods but also injection compression molding, injection press molding, gas-assisted injection molding, foam molding (including supercritical fluid injection), insert molding, in-mold coating molding, adiabatic mold molding, rapid heating and cooling mold molding, two-color molding, sandwich molding, and ultra-high-speed injection molding, depending on the purpose. The advantages of these various molding methods are already widely known. Molding can be performed using either a cold runner system or a hot runner system. The resin composition of the present invention can also be extrusion molded into various profile extrusions and sheets.

[0102] Molded articles obtained by molding the resin composition of the present invention must have an average light transmittance in the thickness direction of a 3 mm-thick molded article at wavelengths of 400 to 700 nm of 1.5% or less. The average light transmittance is preferably 1.0% or less, and more preferably 0.5% or less. If the average light transmittance exceeds 1.5%, the amount of sunlight that becomes noise increases, adversely affecting sensing. While there are no particular limitations on the lower limit of the average light transmittance, it is preferably 0%.

[0103] Furthermore, a molded article obtained by molding the resin composition of the present invention must have a light transmittance in the thickness direction of a 3 mm thick molded article at a wavelength of 1550 nm of 80% or more. The light transmittance is preferably 83% or more, and more preferably 86% or more. If the light transmittance is less than 80%, sensing will be adversely affected. While there are no particular limitations on the upper limit of the light transmittance, it is preferably 100%.

[0104] Furthermore, in a molded article obtained by molding the resin composition of the present invention, the average light transmittance in the thickness direction of a 3 mm-thick molded article at wavelengths from 700 nm to wavelengths at which the absorption of the F component is maximum is preferably 1.5% or less, more preferably 1.0% or less, and even more preferably 0.5% or less. If the average light transmittance exceeds 1.5%, the amount of sunlight that becomes noise increases, which may adversely affect sensing. The lower limit of the average light transmittance is not particularly limited, but is preferably 0%.

[0105] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, "parts" are parts by weight. Evaluations were carried out by the following methods.

[0106] [Evaluation of Resin Composition] 1. Flame Retardancy The UL94 vertical flame test was performed on 1.5 mm and 1.8 mm thick molded articles for flame retardancy evaluation prepared by the method described below, and the grade was evaluated. Note that if the evaluation did not meet any of the criteria of V-0, V-1, or V-2, it will be indicated as "not V." Flame retardancy must be V-0 when evaluated at a thickness of 1.8 mm.

[0107] 2. Visible light absorption characteristics (average light transmittance at wavelengths of 400 to 700 nm and at wavelengths of 700 nm to the maximum absorption wavelength of the F component) For molded products for optical evaluation prepared by the method described below, the spectral light transmittance was measured in the wavelength range of 300 to 2500 nm using an ultraviolet-visible-near-infrared spectrophotometer (V-770 manufactured by JASCO Corporation). From the obtained spectral spectrum, the average light transmittance T ４００～７００ and the average light transmittance T at wavelengths from 700 nm to the maximum absorption wavelength of the F component ７００～Ｆ was calculated.

[0108] 3. Infrared transmittance characteristics The spectral light transmittance of the molded article for optical evaluation was measured in the same manner as in "2. Visible light absorption characteristics." From the obtained spectrum, the light transmittance T １５５０ It was read as follows.

[0109] 4. Light Stability of Absorption Characteristics The spectral light transmittance of the molded article for optical evaluation was measured using the same method as in "2. Visible Light Absorption Characteristics." The obtained spectrum was scanned from a wavelength of 400 nm toward longer wavelengths, and the wavelength at which transmittance first reached 70% or more (transmission wavelength λt) was read. The transmission wavelength λtx was also read using the same method for the light-exposed product. When λtx - λt was 0 to -5, it was rated A, when it was -6 to -10, it was rated B, when it was -11 to -20, it was rated C, and when it was -21 or less, it was rated D.

[0110] 5. Moisture and heat resistance (viscosity average molecular weight) The viscosity average molecular weight (M ｏ ) and the viscosity average molecular weight (M ｗ ) was measured by the following method. ｏ -M ｗ The case where the condition <1,500 is satisfied is designated as A, and the case where the condition is not satisfied is designated as B. The viscosity average molecular weight (M) is determined by first calculating the specific viscosity (ηSP) using the following formula, by dissolving 0.7 g of the molded product obtained by the method described below in 100 ml of methylene chloride at 20°C, using an Ostwald viscometer: Specific viscosity (ηSP) = (t - t ０ ) / t ０ [t ０is the number of seconds for methylene chloride to fall, and t is the number of seconds for the sample solution to fall. The viscosity average molecular weight M was calculated from the determined specific viscosity (ηSP) using the following formula: ηSP / c = [η] + 0.45 × [η] ２ c (where [η] is the intrinsic viscosity) [η] = 1.23 × 10 －４ M ０．８３ c=0.7

[0111] [Examples 1 to 42, Comparative Examples 1 to 12] 1. Preparation of Resin Pellets Based on the components and amounts shown in Tables 1 to 3, various blending components were mixed using a tumbler, and melt-kneaded using a twin-screw extruder (TEX30α, manufactured by The Japan Steel Works, Ltd.) at a cylinder temperature of 280°C to obtain various pellets.

[0112] 2. Preparation of Molded Articles for Flame Retardancy Evaluation The pellets obtained by the above method were dried in a hot air circulation dryer at 120°C for 5 hours, and then molded into molded articles for flame retardancy evaluation conforming to the UL94 standard and having thicknesses of 1.5 mm and 1.8 mm using an injection molding machine (NEX50-5E manufactured by Nissei Plastic Industrial Co., Ltd.) at a cylinder temperature of 300°C and a mold temperature of 90°C.

[0113] 3. Production of molded article for optical evaluation The pellets obtained by the above method were dried in a hot air circulation dryer at 120°C for 5 hours, and then molded into a molded article for optical evaluation having a thickness of 3 mm using an injection molding machine (ROBOSHOT α-S100iA manufactured by FANUC Corporation) under conditions of a cylinder temperature of 300°C and a mold temperature of 90°C.

[0114] 4. Light exposure treatment of molded articles for optical evaluation The molded articles for optical evaluation obtained by the above method were subjected to light exposure treatment using a xenon weather meter (NX75Z, manufactured by Suga Testing Instruments Co., Ltd.) at a black panel temperature of 63°C, a chamber temperature of 50°C, a relative humidity of 50%, and an irradiation intensity of 0.35 W / m ２ The molded article was subjected to a light exposure treatment under the conditions of (@340 nm) for 1000 hours. The molded article was designated as a light-exposed article.

[0115] 5. Moisture-heat treatment of molded article for optical evaluation The molded article for optical evaluation obtained by the above method was subjected to a moisture-heat treatment for 1000 hours under conditions of a temperature of 80°C and a humidity of 85% using a thermo-hygrostat (PR-3J, manufactured by Espec Corporation). This molded article was designated as a moisture-heat-treated article.

[0116] (Component A) A-1-1: Panlite L-1250WQ (Teijin Limited, viscosity average molecular weight 25,100) A-2-1: Aromatic polycarbonate resin having a branched structure (branching ratio 0.28 mol%, viscosity average molecular weight 25,000) (Method for producing A-2-1) A reactor equipped with a thermometer, a stirrer, and a reflux condenser was charged with 2,340 parts of ion-exchanged water, 947 parts of a 25% aqueous sodium hydroxide solution, and 0.7 parts of hydrosulfite, and 710 parts of bisphenol A was dissolved therein with stirring (bisphenol A solution). Then, 2,299 parts of methylene chloride, 112 parts of a 48.5% aqueous sodium hydroxide solution, and 10.7 parts (0.28 mol %) of an aqueous solution in which 1,1,1-tris(4-hydroxyphenyl)ethane was dissolved at a concentration of 25% in a 14% aqueous sodium hydroxide solution were added, and 348 parts of phosgene was blown in at 15 to 25° C. over about 90 minutes to carry out a phosgenation reaction. After completion of phosgenation, 160 parts of an 11% concentration p-tert-butylphenol methylene chloride solution and 88 parts of a 48.5% aqueous sodium hydroxide solution were added, and stirring was stopped. The mixture was allowed to stand for 10 minutes, followed by emulsification with stirring. After 5 minutes, the mixture was treated with a homomixer (Tokushu Kika Kogyo Co., Ltd.) at a rotation speed of 1200 rpm and 35 passes to obtain a highly emulsified dope. The highly emulsified dope was reacted in a polymerization tank (equipped with a stirrer) at a temperature of 35°C for 3 hours under non-stirring conditions to complete the polymerization. After completion of the reaction, the mixture was diluted with 5728 parts of methylene chloride, and the methylene chloride phase was separated from the reaction mixture. 5000 parts of ion-exchanged water was added to the separated methylene chloride phase and mixed with stirring. Stirring was then stopped, and the aqueous and organic phases were separated. Next, washing with water was repeated until the conductivity of the aqueous phase was almost the same as that of the ion-exchanged water, to obtain a purified polycarbonate resin solution. Next, the purified polycarbonate resin solution was placed in a 1000 L kneader containing 100 L of ion-exchanged water, and the methylene chloride was evaporated at a liquid temperature of 75° C. to obtain a powder or granule. 25 parts of the powder or granule and 75 parts of water were placed in a hot water treatment tank equipped with an agitator, and the mixture was stirred and mixed for 30 minutes at a water temperature of 95° C. Next, the mixture of the powder or granule and water was separated using a centrifuge to obtain a powder or granule containing 0.5 wt % of methylene chloride and 45 wt % of water.Next, this powder was continuously fed at 50 kg / hr (polycarbonate resin equivalent) to a SUS316L, heat-transfer, grooved, two-screw agitator, continuous dryer controlled at 140°C, and dried for an average drying time of 3 hours to obtain polycarbonate resin powder having a branched structure.

[0117] A-2-2: Aromatic polycarbonate resin having a branched structure (branching ratio 0.41 mol%, viscosity average molecular weight 25,000) (Production method of A-2-2) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method of A-2-1, except that the amounts used were changed to 350 parts of phosgene, 16.0 parts (0.42 mol%) of an aqueous solution prepared by dissolving 1,1,1-tris(4-hydroxyphenyl)ethane at a concentration of 25% in a 14% aqueous sodium hydroxide solution, and 184 parts of an 11% methylene chloride solution of p-tert-butylphenol.

[0118] A-2-3: Aromatic polycarbonate resin having a branched structure (branching ratio 0.71 mol%, viscosity average molecular weight 25,200) (Production method of A-2-3) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method of A-2-1, except that the amounts used were changed to 352 parts of phosgene, 28.6 parts (0.75 mol%) of an aqueous solution prepared by dissolving 1,1,1-tris(4-hydroxyphenyl)ethane at a concentration of 25% in a 14% aqueous sodium hydroxide solution, and 209 parts of an 11% methylene chloride solution of p-tert-butylphenol.

[0119] A-2-4: Aromatic polycarbonate resin having a branched structure (branching ratio 0.95 mol%, viscosity average molecular weight 20,300) (Production method for A-2-4) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method for A-2-1, except that the amounts used were changed to 354 parts of phosgene, 38.1 parts (1.00 mol%) of an aqueous solution prepared by dissolving 1,1,1-tris(4-hydroxyphenyl)ethane at a concentration of 25% in a 14% aqueous sodium hydroxide solution, and 261 parts of an 11% methylene chloride solution of p-tert-butylphenol.

[0120] A-2-5: Aromatic polycarbonate resin having a branched structure (branching ratio 1.20 mol%, viscosity average molecular weight 25,000) (Production method of A-2-5) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method of A-2-1, except that the amounts used were changed to 356 parts of phosgene, 47.6 parts (1.25 mol%) of an aqueous solution prepared by dissolving 1,1,1-tris(4-hydroxyphenyl)ethane at a concentration of 25% in a 14% aqueous sodium hydroxide solution, and 229 parts of an 11% methylene chloride solution of p-tert-butylphenol.

[0121] A-2-6: Aromatic polycarbonate resin having a branched structure (branching ratio 1.46 mol%, viscosity average molecular weight 20,100) (Production method for A-2-6) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method for A-2-1, except that the ingredients were changed to 359 parts of phosgene, 59.8 parts (1.57 mol%) of an aqueous solution in which 1,1,1-tris(4-hydroxyphenyl)ethane was dissolved at a concentration of 25% in a 14% aqueous sodium hydroxide solution, and 280 parts of an 11% methylene chloride solution of p-tert-butylphenol.

[0122] A-2-7 (Comparative Example): Aromatic polycarbonate resin having a branched structure (branching ratio 1.52 mol%, viscosity average molecular weight 24,800) (Production method of A-2-7) A polycarbonate resin powder having a branched structure was obtained in the same manner as in the production method of A-2-1, except that the amount of phosgene was changed to 357 parts, the amount of 1,1,1-tris(4-hydroxyphenyl)ethane was changed to 61.0 parts (1.60 mol%) of a 25% aqueous solution of 1,1,1-tris(4-hydroxyphenyl)ethane dissolved in a 14% aqueous sodium hydroxide solution, and the amount of 245 parts of an 11% methylene chloride solution of p-tert-butylphenol were changed.

[0123] (Component B) B-1: Potassium perfluorobutanesulfonate (Dainippon Ink Co., Ltd., Megafac F-114P) B-2: Sodium perfluorobutanesulfonate (Dainippon Ink Co., Ltd., Megafac F-114S) B-3: Potassium diphenylsulfonesulfonate (UCB Japan Co., Ltd., KSS)

[0124] (Component C) C-1: NUBIAN BLACK PC-5857 (Orient Chemical Industries Co., Ltd., dye with maximum absorption wavelength of 599 nm) C-2: Lumogen Black K0088 (BASF Japan Ltd., organic pigment with maximum absorption wavelength of 669 nm) C-3 (Comparative Example): SBF-T-5669G (Resino Color Industries Co., Ltd., carbon black master mix of carbon black and polystyrene resin with maximum absorption wavelength of <680 nm)

[0125] (Component D) D-1: Phenolic heat stabilizer AO-50 (ADEKA Corporation) D-2: Phenolic heat stabilizer AO-80 (ADEKA Corporation)

[0126] (Component E) E-1: Phosphorus-based heat stabilizer Adekastab 2112 (ADEKA Corporation) E-2: Phosphorus-based heat stabilizer PEP-36 (ADEKA Corporation)

[0127] (Component F) F-1: Phthalocyanine colorant FDR-004 (Yamada Chemical Co., Ltd., maximum absorption wavelength 720 nm) F-2: Anthraquinone colorant SDO-7 (Arimoto Chemical Co., Ltd., maximum absorption wavelength 676 nm) F-3: Anthraquinone colorant SDO-11 (Arimoto Chemical Co., Ltd., maximum absorption wavelength 761 nm) F-4: Heterocyclic colorant SDO-C33 (Arimoto Chemical Co., Ltd., maximum absorption wavelength 847 nm) F-5: Perylene colorant Lumogen IR-765 (BASF Japan Ltd., maximum absorption wavelength 769 nm) F-6: Phthalocyanine colorant FDN-008 (Yamada Chemical Co., Ltd., maximum absorption wavelength 992 nm)

[0128] (Component G) G-1: Silicone compound X40-2600J containing an Si—H group in the molecule (Shin-Etsu Chemical Co., Ltd.) G-2: Silicone compound KF-56 containing an Si—H group in the molecule (Shin-Etsu Chemical Co., Ltd.)

[0129] (Component H) H-1: Benzotriazole-based UV absorber Seesorb 709 (Shipro Chemical Co., Ltd.) H-2: Benzotriazole-based UV absorber Tinuvin 234 (BASF Japan Ltd.) H-3: Benzotriazole-based UV absorber Tinuvin 326 (BASF Japan Ltd.) H-4: Benzotriazole-based UV absorber Adekastab LA-31 (ADEKA Corporation) H-5: Triazine-based UV absorber Tinuvin 1577 (BASF Japan Ltd.)

[0130] (Other components) I-1: Mold release agent Unistar H476S (NOF Corporation) J-1: Rust inhibitor Marproof G-0250SP (NOF Corporation)

[0131]

[0132]

[0133]

[0134] The examples shown in Tables 1 to 3 have excellent moist heat resistance and flame retardancy, and molded articles made therefrom have wavelength-selective absorption properties and excellent light stability of the absorption properties. Therefore, they can be used as components for infrared sensors used in fields such as autonomous driving technology.

Claims

1. An aromatic polycarbonate resin composition containing 100 parts by weight of an aromatic polycarbonate resin (Component A) containing an aromatic polycarbonate resin having a branched structure with a branching ratio of 0.2 to 1.5 mol%, 0.005 to 0.15 parts by weight of an organic alkali (earth) metal salt (Component B), 0.03 to 1.2 parts by weight of a colorant having a maximum absorption at a wavelength of less than 680 nm (Component C), 0.01 to 0.5 parts by weight of a phenolic heat stabilizer (Component D), and 0.025 to 0.5 parts by weight of a phosphorus-based heat stabilizer (Component E), wherein the total amount of Component D and Component E is 0.6 parts by weight or less, and the average value of the light transmittance in the thickness direction of a molded article having a thickness of 3 mm at a wavelength of 400 to 700 nm is 1.5% or less, and the light transmittance at a wavelength of 1550 nm is 80% or more.

2. The resin composition according to claim 1, wherein the content of the aromatic polycarbonate resin having a branched structure with a branching ratio of 0.2 to 1.5 mol% in Component A is 50 to 100% by weight.

3. The resin composition according to claim 1 or 2, containing 0.001 to 1.2 parts by weight of a colorant having a maximum absorption at a wavelength of 680 or more and less than 1000 nm (Component F) with respect to 100 parts by weight of Component A, and the total of Component C and Component F is 1.3 parts by weight or less.

4. The resin composition according to claim 3, wherein the average value of the light transmittance in the thickness direction of a molded article having a thickness of 3 mm at a wavelength of 700 nm to the wavelength at which the absorption of Component F is maximum is 1.5% or less.

5. The resin composition according to claim 3, wherein Component F is at least one colorant selected from the group consisting of anthraquinone-based colorants, phthalocyanine-based colorants, perylene-based colorants, and heterocyclic-based colorants.

6. The resin composition according to claim 1 or 2, containing 0.1 to 6 parts by weight of a silicone compound containing an Si-H group in the molecule (Component G) with respect to 100 parts by weight of Component A.

7. The resin composition according to claim 1 or 2, containing 0.01 to 1 part by weight of a benzotriazole-based ultraviolet absorber and / or a triazine-based ultraviolet absorber (Component H) with respect to 100 parts by weight of Component A.

8. A molded article obtained by molding the resin composition according to claim 1 or 2.

9. The molded article according to claim 8, which is a cover material for covering an infrared sensor.

10. The molded article according to claim 9, which is a cover material covering an infrared sensor used for a LiDAR for detecting other vehicles and buildings and monitoring a passenger including a driver.

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