Light-emitting assembly and preparation method therefor, and display substrate

Abstract

The present application relates to the technical field of display. Disclosed are a light-emitting assembly and a preparation method therefor, and a display substrate. The light-emitting assembly comprises a packaging part, a light-emitting unit and a driving unit, wherein a first contact area of a third surface of the light-emitting unit is connected to the driving unit, a second contact area in the third surface of the light-emitting unit is connected to a first packaging sub-part of the packaging part, and the second contact area is arranged around the first contact area. By means of the above manner of configuration, the first packaging sub-part is enabled to form a sealed space with the light-emitting unit, such that the position where the light-emitting unit and the driving unit are electrically connected to each other can be located in the sealed space, the sealing effect on the position of electrical connection is ensured, and the impact of an external environment on the position of electrical connection is avoided, thereby improving the reliability of the light-emitting assembly.

Description

Light-emitting component and preparation method thereof, and display substrate Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting component and a preparation method thereof, and a display substrate. Background Art

[0002] The display substrate includes a driving backplane and a plurality of light-emitting components connected to the driving backplane, wherein the driving backplane can provide driving signals for the light-emitting components to make the light-emitting components emit light, thereby realizing display.

[0003] Summary of the Invention

[0004] This application provides a light-emitting component and a method for preparing the same, and a display substrate. The technical solutions are as follows:

[0005] In one aspect, a light emitting assembly is provided, comprising:

[0006] An encapsulation portion, a light-emitting unit, and a driving unit located between the encapsulation portion and the light-emitting unit, wherein the light-emitting unit is electrically connected to the driving unit;

[0007] The driving unit includes a first surface facing the light emitting unit, a second surface facing away from the light emitting unit, and a target side surface located between the first surface and the second surface;

[0008] The light emitting unit includes a third surface facing the driving unit, the encapsulation portion includes a first sub-encapsulation portion, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-encapsulation portion, and the second contact area is arranged around the first contact area;

[0009] The first sub-packaging portion is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light emitting unit and the driving unit are electrically connected to each other is located in a confined space.

[0010] Optionally, the light emitting component further includes an adhesive layer, and the adhesive layer is located between the first sub-encapsulation portion and the third surface;

[0011] The first sub-encapsulation portion is connected to the third surface through the adhesive layer.

[0012] Optionally, a ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7;

[0013] A ratio of a length of a target path of the encapsulation portion to a thickness of the adhesive layer is greater than or equal to 10;

[0014] The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.

[0015] Optionally, the length of the target path of the packaging portion is greater than or equal to 35 micrometers, the thickness of the driving unit is greater than or equal to 5 micrometers, and the thickness of the adhesive layer is greater than or equal to 0.5 micrometers.

[0016] Optionally, the light emitting component further includes a pad structure located between the first sub-encapsulation portion and the third surface;

[0017] The first sub-encapsulation portion is connected to the third surface through the pad layer structure.

[0018] Optionally, the light-emitting component further includes an adhesive layer located between the pad structure and the first sub-package part, the pad structure is arranged in direct contact with the third surface, and the first sub-package part is connected to the pad structure through the adhesive layer.

[0019] Optionally, the maximum distance between the surface of the cushion structure in contact with the adhesive layer and the third surface is smaller than the maximum distance between the second surface and the third surface.

[0020] Optionally, a ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7;

[0021] The ratio of the length of the target path of the encapsulation portion to the sum of the thicknesses of the adhesive layer and the cushion structure is greater than or equal to 10;

[0022] The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.

[0023] Optionally, the length of the target path of the packaging portion is greater than or equal to 35 microns, the thickness of the driving unit is greater than or equal to 5 microns, and the sum of the thicknesses of the adhesive layer and the cushion structure is less than or equal to 5 microns.

[0024] Optionally, the second surface of the driving unit includes a surface edge and a surface center, and the surface edge is arranged around the surface center;

[0025] The distance between the edge of the surface and the third surface is smaller than the distance between the center of the surface and the third surface.

[0026] Optionally, the second surface of the driving unit is conformal to a surface of the packaging portion close to the driving unit.

[0027] Optionally, the packaging portion further includes a second sub-packaging portion covering the second surface;

[0028] The first sub-packaging portion and the second sub-packaging portion are an integrated structure, and the driving unit is located inside the enclosed space surrounded by the packaging portion and the light-emitting unit.

[0029] Optionally, the packaging portion is made of a flexible material.

[0030] Optionally, the second sub-package includes a through hole, the light-emitting component includes a conductive structure located in the through hole, the conductive structure is electrically connected to the driving unit, and is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate.

[0031] Optionally, the conductive structure includes a first conductive substructure and a second conductive substructure that are electrically connected;

[0032] The first conductive substructure is arranged farther away from the light-emitting unit than the second conductive substructure, an orthographic projection of the second conductive substructure on a reference plane is located within an orthographic projection of the first conductive substructure on the reference plane, and the reference plane is parallel to a fourth surface of the light-emitting unit away from the driving unit;

[0033] The first conductive substructure is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate, and the second conductive substructure is electrically connected to the driving unit.

[0034] Optionally, the light-emitting unit includes: a first electrode, a second electrode, and a light-emitting layer electrically connected to the first electrode and the second electrode respectively;

[0035] The driving unit includes a third electrode, a fourth electrode and a driving circuit, wherein the third electrode and the fourth electrode are both located on a side of the driving circuit close to the light-emitting unit, the third electrode and the fourth electrode are electrically connected to the driving circuit respectively, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode.

[0036] Optionally, the target side is a side of the driving circuit.

[0037] Optionally, the second sub-package includes a through hole, and the light-emitting component includes a conductive structure located in the through hole; the driving circuit includes a plurality of thin film transistors and at least one storage capacitor, and each of the thin film transistors includes a gate, a source, and a drain;

[0038] The conductive structure is connected to a source electrode of a thin film transistor among the plurality of thin film transistors, and is used to provide the driving circuit with a data driving signal transmitted from a driving backplane in the display substrate.

[0039] Optionally, the driving circuit includes a buffer insulating layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source and drain layer, and a planar layer stacked in sequence; the third electrode and the fourth electrode are located on a side of the planar layer away from the buffer insulating layer;

[0040] The active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, and each of the active patterns includes a source region, a drain region, and a channel region;

[0041] The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source region, and the drain electrode of the thin film transistor is connected to the drain region;

[0042] The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is a region where the active pattern and the orthographic projections of the gate patterns overlap.

[0043] Optionally, the light emitting assembly includes a plurality of light emitting units and the driving units corresponding to the plurality of light emitting units;

[0044] The plurality of light emitting units include a first color light emitting unit, a second color light emitting unit and a third color light emitting unit, and the first color, the second color and the third color are different from each other.

[0045] Optionally, the light-emitting unit includes a color filter layer, a color conversion layer, and a light-emitting layer stacked in sequence in a direction away from the packaging portion; the light-emitting color of the light-emitting layer is blue;

[0046] The light-emitting layer includes a first doped layer, a multi-quantum well layer and a second doped layer that are stacked, wherein the first doped layer is electrically connected to the first electrode, the second doped layer is electrically connected to the second electrode, and the light-emitting layer includes a first light-emitting portion, a second light-emitting portion and a third light-emitting portion.

[0047] In another aspect, a method for preparing a light-emitting component is provided, the method comprising:

[0048] Obtaining a temporary substrate, an initial packaging portion located on the temporary substrate, and a driving unit located on a side of the initial packaging portion away from the temporary substrate, wherein the temporary substrate is a rigid substrate, and an orthographic projection of the driving unit on the initial packaging portion is located within the initial packaging portion;

[0049] Obtaining a substrate and a light-emitting unit located on the substrate;

[0050] Bonding the light-emitting unit and the driving unit to each other through a bonding process to obtain a target structure, wherein the target structure includes the temporary substrate, the initial packaging portion, the driving unit, the light-emitting unit, and the base arranged in sequence, the driving unit including a first surface facing the light-emitting unit, a second surface facing away from the light-emitting unit, and a target side surface located between the first surface and the second surface, and the light-emitting unit including a third surface facing the driving unit;

[0051] When the gravity direction of the initial packaging part is toward the light-emitting unit, the temporary substrate is peeled off from one side of the initial packaging part, so that the initial packaging part is deformed toward the side closer to the light-emitting unit under the action of its own gravity to form the packaging part;

[0052] In which, the packaging part includes a first sub-packaging part, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-packaging part, the second contact area is arranged around the first contact area, and the first sub-packaging part is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light-emitting unit and the driving unit are electrically connected to each other is located in a confined space.

[0053] Optionally, when the gravity direction of the initial packaging portion is toward the light-emitting unit, peeling the temporary substrate from one side of the initial packaging portion includes:

[0054] When the gravity direction of the initial packaging part is toward the light-emitting unit, a laser device is arranged on a side of the temporary substrate away from the initial packaging part;

[0055] The target structure is driven to move so that the laser light bar of the laser device sweeps across the target structure. After the target structure is swept across by the laser light bar, the temporary substrate can be peeled off from one side of the initial packaging portion.

[0056] In another aspect, a display substrate is provided, comprising a driving backplane, and a plurality of light-emitting components as described in the above aspects arranged in an array and located on one side of the driving backplane;

[0057] The driving unit included in the light-emitting assembly is located between the driving backplane and the light-emitting unit included in the light-emitting assembly, and the driving backplane and the driving unit are electrically connected;

[0058] The driving backplane is used to provide a driving signal to the driving unit so that the driving unit drives the light-emitting unit to emit light.

[0059] Optionally, the driving backplane includes: a backplane substrate, and a pad located on one side of the backplane substrate, wherein the pad includes a plurality of conductive pads;

[0060] The conductive pad is used to be electrically connected to the first conductive substructure of the conductive structure included in the light-emitting component. BRIEF DESCRIPTION OF THE DRAWINGS

[0061] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0062] FIG1 is a schematic structural diagram of a light-emitting component provided in an embodiment of the present application;

[0063] FIG2 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0064] FIG3 is a top view of a light-emitting component provided in an embodiment of the present application;

[0065] FIG4 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0066] FIG5 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0067] FIG6 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0068] FIG7 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0069] FIG8 is a schematic structural diagram of a light-emitting unit provided in an embodiment of the present application;

[0070] FIG9 is a schematic structural diagram of another light-emitting unit provided in an embodiment of the present application;

[0071] FIG10 is a schematic structural diagram of another light-emitting assembly provided in an embodiment of the present application;

[0072] FIG11 is a flow chart of a method for preparing a light-emitting component provided in an embodiment of the present application;

[0073] FIG12 is a schematic diagram of obtaining a temporary substrate, an initial packaging portion, and a plurality of driving units according to an embodiment of the present application;

[0074] FIG13 is a schematic diagram of an acquisition substrate and a plurality of light-emitting units provided in an embodiment of the present application;

[0075] FIG14 is a schematic diagram of a bonding connection between a driving unit and a light-emitting unit provided in an embodiment of the present application;

[0076] FIG15 is a schematic diagram of a laser lift-off process provided in an embodiment of the present application;

[0077] FIG16 is a schematic diagram of a temporary substrate after removal provided by an embodiment of the present application;

[0078] FIG17 is a cutting schematic diagram provided in an embodiment of the present application;

[0079] FIG18 is a schematic structural diagram of a display substrate provided in an embodiment of the present application;

[0080] FIG19 is a schematic cross-sectional view of a display substrate provided in an embodiment of the present application. DETAILED DESCRIPTION

[0081] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0082] A micro light emitting diode (Micro LED) display substrate generally includes a driving backplane, a driving unit integrated on the driving backplane, and a light-emitting chip bonded to the driving unit. When preparing the Micro LED display substrate, in order to achieve color display, it is necessary to transfer and bond light-emitting chips of different colors to a driving backplane integrated with a driving unit, and light-emitting chips of the same color are transferred at the same time, and light-emitting chips of different colors are transferred in batches. That is, the number of transfers is the number of colors of the light-emitting chip. Optionally, the light-emitting chip includes light-emitting chips of three colors, such as a red (red, R) light-emitting chip, a green (green, G) light-emitting chip, and a blue (blue) light-emitting chip, and thus three transfers are required. This solution requires more transfers when preparing the Micro LED display substrate, and the process is more complicated.

[0083] Furthermore, to reduce the manufacturing cost of Micro LED display substrates, the driver backplane is designed to be small (because if it is too large, if some of the light-emitting chips fail to emit light after transfer, the entire product will be scrapped, resulting in high costs). Therefore, if this solution needs to achieve a large-scale display, it can only be achieved through splicing, which results in poor display quality.

[0084] The red, green and blue micro-display chip (RGB Micro LED) is bonded to the driving unit to form a new active-matrix light-emitting diode (AM-LED) chip with its own driving circuit. The AM-LED chip includes light-emitting chips of three colors, red, green and blue, and a driving unit for driving the light-emitting chip. Furthermore, depending on the size of the display substrate that needs to be prepared, a corresponding number of AM-LED chips are used to perform one-time transfer bonding with the driving backplane to realize the preparation of a glass-based color light-emitting diode (LED) display substrate. At the same time, this solution only requires one transfer process, and the process is relatively simple. In addition, large-size display can be achieved without splicing, which can improve the glass utilization rate of the driving backplane, thereby reducing costs.

[0085] Furthermore, this AM-LED chip utilizes dual electrical and optical testing technology to select chips that meet both optical and driving performance requirements. This improves chip yield on the display substrate compared to solutions that integrate the driver circuitry onto the driver backplane to form the display substrate, and also facilitates the repair and replacement of defective chips.

[0086] However, since the connection position between the driving unit and the light-emitting unit is exposed, it is easily affected by the external environment and has poor reliability.

[0087] Figure 1 is a schematic diagram of the structure of a light-emitting assembly provided in an embodiment of the present application. Referring to Figure 1 , light-emitting assembly 10 includes: an encapsulation portion 101, a light-emitting unit 102, and a driving unit 103 located between encapsulation portion 101 and light-emitting unit 102. Light-emitting unit 102 and driving unit 103 are electrically connected, and driving unit 103 provides a driving signal to light-emitting unit 102, thereby driving light-emitting unit 102 to emit light.

[0088] Referring to Figure 1 , the driving unit 103 includes a first surface 103a facing the light-emitting unit 102, a second surface 103b facing away from the light-emitting unit 102, and a target side surface 103c located between the first surface 103a and the second surface 103b. Optionally, the target side surface 103c may be an annular side surface, i.e., a closed side surface. For example, if the driving unit 103 is square in shape, the target side surface 103c may include four sides of the square.

[0089] The light-emitting unit 102 includes a third surface 102a facing the driving unit 103. The package portion 101 includes a first sub-package portion 1011. The third surface 102a includes a first contact region 102a1 electrically connected to the driving unit 103 and a second contact region 102a2 connected to the first sub-package portion 1011. The second contact region 102a2 is arranged around the first contact region 102a1.

[0090] In addition, the first sub-package portion 1011 is further disposed in contact with at least one of the second surface 103b and the target side surface 103c. That is, the first sub-package portion 1011 may be disposed in contact with the second surface 103b, or the first sub-package portion 1011 may be disposed in contact with the target side surface 103c, or the first sub-package portion 1011 may be disposed in contact with both the second surface 103b and the target side surface 103c.

[0091] As a result, the packaging portion 101 and the light-emitting unit 102 are connected to form a sealed space, and the location where the light-emitting unit 102 and the driving unit 103 are electrically connected is located within the sealed space. Furthermore, the location where the light-emitting unit 102 and the driving unit 103 are electrically connected is protected from being affected by the external environment, thereby improving the reliability of the light-emitting assembly.

[0092] In summary, an embodiment of the present application provides a light-emitting component, which includes a packaging portion, a light-emitting unit, and a driving unit. The first contact area on the third surface of the light-emitting unit is connected to the driving unit, the second contact area on the third surface of the light-emitting unit is connected to the first sub-packaging portion of the packaging portion, and the second contact area is arranged around the first contact area. The above-mentioned arrangement allows the first sub-packaging portion to form a sealed space with the light-emitting unit, thereby allowing the position where the light-emitting unit and the driving unit are electrically connected to each other to be located within the sealed space, thereby ensuring the sealing effect of the electrical connection position, preventing the external environment from affecting the electrical connection position, and improving the reliability of the light-emitting component.

[0093] In the embodiment of the present application, the first sub-package portion 1011 can be directly connected to the second contact area 102a2, or can be indirectly connected to the second contact area 102a2. For example, referring to FIG2 , the light-emitting component 10 further includes an adhesive layer 104, which is located between the first sub-package portion 1011 and the third surface 102a. The first sub-package portion 1011 and the third surface 102a are connected via the adhesive layer 104.

[0094] In this case, the second contact area 102a2 is the orthographic projection area of ​​the adhesive layer 104 on the third surface 102a. Due to the adhesive layer 104 provided between the first sub-package 1011 and the third surface 102a, the connection effect between the first sub-package 1011 and the second contact area 102a2 of the third surface 102a can be guaranteed.

[0095] Optionally, the ratio of the length h1 of the target path of the packaging portion 101 to the thickness h2 of the driving unit 103 is greater than or equal to 7. In addition, the ratio of the length h1 of the target path of the packaging portion 101 to the thickness h3 of the adhesive layer 104 is greater than or equal to 10. In this way, it can be ensured that the first sub-packaging portion 1011 in the packaging portion 101 can be bonded to the adhesive layer 104, thereby enclosing a closed space.

[0096] Referring to Figure 3 , the driving unit 103 includes multiple electrodes Q, including a target electrode Qm located near an edge of the driving unit 102. The projection of the edge of the target electrode Qm away from the center of the driving unit 103 onto the packaging portion 101 along the thickness direction of the light-emitting unit 102 (see Figure 3 , the z-direction) includes a first end (which may be referred to as a starting end, denoted as t1 in Figure 3 ). The edge of the packaging portion 101 adjacent to the edge of the target electrode Qm away from the center of the driving unit 103 corresponding to the first end is a second end (which may be referred to as an ending end, denoted as t2 in Figure 3 ). The target path may be the minimum path of the portion of the packaging portion 101 located between the first end and the second end.

[0097] Among them, the projection of the edge of the target electrode Qm away from the center of the driving unit 103 on the packaging part 101 along the thickness direction of the light-emitting unit 102 includes a first end, which can be understood as: the edge of the target electrode Qm away from the center of the driving unit 103 is translated to the packaging part 101 along the thickness direction of the light-emitting unit 102, and the position where it is translated to the packaging part 101 is the first end.

[0098] The edge of the packaging part 101 adjacent to the edge of the target electrode Qm corresponding to the first end away from the center of the driving unit 103 is the second end. It can be understood that: the first end corresponds to a second end, and the second end is the edge of the packaging part 101 adjacent to the edge of the target electrode Qm away from the center of the driving unit 103.

[0099] As shown in Figure 3 , the multiple electrodes Q include multiple target electrodes Qm. The projection of the edge of each target electrode Qm away from the center of the driver unit 103 onto the package portion 101 along the thickness direction of the light-emitting unit 102 can be considered a first end. Furthermore, the edge of the package portion 101 adjacent to the edge of the target electrode Qm away from the center of the driver unit 103 corresponding to the first end is considered a second end. For example, in Figure 3 , t1 is the first end, t2 is the second end corresponding to t1, t1′ is the first end, and t2′ is the second end corresponding to t1′.

[0100] 3 , each edge of the packaging portion 101 can have a target path length, thereby enabling each edge of the packaging portion 101 to adhere to the adhesive layer 104, thereby ensuring the sealing effect of the enclosed space. Specifically, the lengths of the target paths at each edge of the packaging portion 101 can be the same or different.

[0101] For example, the target path length h1 of the packaging portion 101 may be greater than or equal to 35 μm, the thickness h2 of the driving unit 103 may be greater than or equal to 5 μm, and the thickness h3 of the adhesive layer 104 may be greater than or equal to 0.5 μm, for example, 3.5 μm.

[0102] It should be noted that FIG2 may be a cross-sectional view taken along the AA' direction of FIG3. In FIG3, h* may be used to represent the length of the orthographic projection of the target path on the third surface 102a when the first end is t1 and the second end is t2, and h*' may be used to represent the length of the orthographic projection of the target path on the third surface 102a when the first end is t1' and the second end is t2'.

[0103] Optionally, the driving unit 103 and the light-emitting unit 102 can be connected by bonding. Normally, the bonding accuracy of the driving unit 103 and the light-emitting unit 102 is within the range of ±5μm. Therefore, the length of the adhesive layer 104 needs to be greater than or equal to 10μm so that the first sub-package 1011 and the adhesive layer 104 can be connected.

[0104] The length of the adhesive layer 104 may be the length of the adhesive layer 104 along a target direction, where the target direction is the direction of a line connecting the center of the light-emitting component and the edge of the light-emitting component.

[0105] 4 , the light-emitting assembly 10 further includes a cushion structure 105. The cushion structure 105 can be located between the first sub-package 1011 and the third surface 102a, with the first sub-package 1011 and the third surface 102a connected via the cushion structure 105. The cushion structure 105 can reduce deformation of the package 101 and improve structural reliability.

[0106] 4 , the light-emitting assembly 10 further includes an adhesive layer 104, which can be located between the cushion structure 105 and the first sub-package 1011. The cushion structure 105 is disposed in direct contact with the third surface 102a, and the first sub-package 1011 is connected to the cushion structure 105 via the adhesive layer 104. This ensures a secure connection between the first sub-package 1011 and the cushion structure 105. In this case, the enclosed space is formed by the interconnection of the package 101, the cushion structure 105, and the light-emitting unit 102.

[0107] Optionally, the maximum distance h4 between the surface of the pad structure 105 in contact with the adhesive layer 104 and the third surface 102a is less than the maximum distance h5 between the second surface 103b and the third surface 102a. In other words, in the light-emitting component 10, the height of the portion provided with the pad structure 105 is lower than the height of the portion not provided with the pad structure 105.

[0108] Alternatively, the adhesive layer 104 may be located between the cushion structure 105 and the third surface 102a, with the cushion structure 105 and the first sub-package portion 1011 being in direct contact with each other. The third surface 102a is connected to the cushion structure 105 via the adhesive layer 104. In other words, the positions of the cushion structure 105 and the adhesive layer 104 may be interchanged, and this is not limited in the present embodiment.

[0109] Optionally, the ratio of the length h1 of the target path of the packaging part 101 to the thickness h2 of the driving unit 103 is greater than or equal to 7. In addition, the ratio of the length h1 of the target path of the packaging part 101 to the sum of the thicknesses h6 of the adhesive layer 104 and the cushion structure 105 is greater than or equal to 10. In this way, it can be ensured that the first sub-packaging part 1011 in the packaging part 101 can be connected to the third surface 102a through the cushion structure 105 and the adhesive layer 104, thereby forming a closed space. Among them, the relevant description of the target path of the packaging part 101 can be found in the above embodiment, and the embodiments of the present application will not be repeated here.

[0110] For example, the length h1 of the target path of the packaging part 101 can be greater than or equal to 35μm, the thickness h2 of the driving unit 103 is greater than or equal to 5μm, and the sum of the thicknesses h6 of the adhesive layer 104 and the pad structure 105 is less than or equal to 5μm, for example 3.5μm.

[0111] Figure 5 is a schematic diagram of the structure of a light-emitting assembly provided in an embodiment of the present application. Referring to Figure 5 , the second surface 103b of the driving unit 103 includes a surface edge 103b1 and a surface center 103b2, wherein the surface edge 103b1 is arranged around the surface center 103b2. The distance between the surface edge 103b1 and the third surface 102a is smaller than the distance between the surface center 103b2 and the third surface 102a.

[0112] Among them, the surface edge 103b1 may refer to the surface outside the area formed by the position where the driving unit 103 and the light-emitting unit 102 are electrically connected in the second surface 103b, and the surface center 103b2 may refer to the surface within the area formed by the position where the driving unit 103 and the light-emitting unit 102 are electrically connected in the second surface 103b.

[0113] Alternatively, the film layers at the edge of the driving unit 103 may be influenced by gravity and move closer to the third surface 102a. However, the electrical connection between the driving unit 103 and the light-emitting unit 102 is a rigid node, so the force exerted on the film layers at the center toward the third surface 102a is relatively small. Consequently, the distance between the surface edge 103b1 and the third surface 102a may be smaller than the distance between the surface center 103b2 and the third surface 102a.

[0114] Optionally, the second surface 103b of the driving unit 103 is conformal to the surface of the packaging portion 101 proximal to the driving unit 103. For example, the second surface 103b of the driving unit 103 is in contact with the surface of the packaging portion 101 proximal to the driving unit 103, and the surface edge 103b1 of the second surface 103b of the driving unit 103 and the portion of the packaging portion 101 in contact with the surface proximal to the driving unit 103 can both move closer to the second surface 103b. In other words, the edge of the driving unit 103 can bend as the packaging portion 101 bends.

[0115] Furthermore, after the surface edge 103b1 of the second surface 103b of the driving unit 103 approaches the second surface 103b, a portion of the first surface 103a of the driving unit 103 may be connected to the second contact area 102a2. In this case, the first sub-encapsulation portion 1011 of the encapsulation portion 101 is also connected to the second contact area 102a2, that is, the location where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can also be located within a confined space.

[0116] Referring to Figures 1 to 5, the packaging portion 101 also includes a second sub-packaging portion 1012 covering the second surface 103b. The first sub-packaging portion 1011 and the second sub-packaging portion 1012 are integrally structured, and the drive unit 103 is located within the enclosed space enclosed by the packaging portion 101 and the light-emitting unit 102. In other words, except for the location where the drive unit 103 and the light-emitting unit 102 are electrically connected to each other, the entire drive unit 103 is also located within the enclosed space. This prevents the target side 103c of the drive unit 103 from being exposed, ensuring the reliability of the drive unit 103.

[0117] Alternatively, the enclosed space may be formed by the interconnection of the packaging portion 101 and the light-emitting unit 102, i.e., the packaging portion 101 and the light-emitting unit 102 are connected to form a closed space. Alternatively, the enclosed space may be formed by the combination and connection of the packaging portion 101, the light-emitting unit 102, and other structures other than the driving unit 103, i.e., the combination and connection of the packaging portion 101, the light-emitting unit 102, and other structures other than the driving unit 103, to form a closed space.

[0118] Optionally, the material of the packaging part 101 may be a flexible material, for example, the material of the packaging part 101 may be polyimide (PI).

[0119] It should be noted that if the target side 103c of the driver unit 103 is exposed, on the one hand, the metal film layer in the driver circuit (described below) included in the driver unit 103 may be corroded by water and oxygen, which may increase the resistance of the film layer or cause the film layer to short-circuit. On the other hand, it may cause the active layer in the driver circuit included in the driver unit 103 to come into contact with water and oxygen, resulting in drift failure.

[0120] FIG6 is a schematic diagram of the structure of another light-emitting component provided in an embodiment of the present application. Referring to FIG6 , the second sub-package portion 1012 includes a through hole, and the light-emitting component 10 includes a conductive structure 106 located within the through hole. The conductive structure 106 can be electrically connected to the driving unit 103 and is used to electrically connect to the conductive pad of the driving backplane included in the display substrate. In other words, the conductive pad of the driving backplane can provide a driving signal (e.g., a data driving signal) to the driving unit 103 through the conductive structure 106, so that the driving unit 103 can drive the light-emitting unit 102 to emit light.

[0121] 6 , the conductive structure 106 includes an electrically connected first conductive substructure 1061 and a second conductive substructure 1062. The first conductive substructure 1061 is located farther away from the light-emitting unit 102 than the second conductive substructure 1062. The orthographic projection of the second conductive substructure 1062 on a reference plane is located within the orthographic projection of the first conductive substructure 1061 on the reference plane. That is, the area of ​​the orthographic projection of the second conductive substructure 1062 on the reference plane is smaller than the area of ​​the orthographic projection of the first conductive substructure 1061 on the reference plane. The reference plane is parallel to the fourth surface 102 b of the light-emitting unit 102, which is away from the driving unit 103.

[0122] Optionally, the first conductive substructure 1061 is configured to be electrically connected to a conductive pad of a driving backplane included in the display substrate, and the second conductive substructure 1062 is electrically connected to the driving unit 103. That is, the conductive pad of the driving backplane can sequentially provide a driving signal (e.g., a data driving signal) to the driving unit 103 through the first conductive substructure 1061 and the second conductive substructure 1062, thereby enabling the driving unit 103 to drive the light-emitting unit 102 to emit light.

[0123] In an embodiment of the present application, the first conductive substructure 1061 and the second conductive substructure 1062 in the conductive structure 106 can both be located within a through-hole. A method for fabricating the conductive structure 106 can include: forming the first conductive substructure 1061 on a temporary substrate using a patterning process; forming an encapsulation film on a side of the first conductive substructure 1061 away from the temporary substrate; forming a through-hole in the encapsulation film, wherein the through-hole is configured to expose at least a portion of the first conductive substructure 1061, and the orthographic projection of the through-hole on the temporary substrate is located within the orthographic projection of the first conductive substructure 1061 on the temporary substrate; and forming the second conductive substructure 1062 within the through-hole. The patterning process includes: photoresist coating, exposure, development, etching, and photoresist removal.

[0124] As such, referring to FIG. 6 , the surface of the first conductive substructure 1061 away from the second conductive substructure 1062 may be flush with the surface of the packaging portion 101 away from the driving unit 103 .

[0125] It should be noted that the first conductive substructure 1061 in the conductive structure 106 can be located outside the through-hole, and the second conductive substructure 1062 is located inside the through-hole. That is, the first conductive substructure 1061 is located on the side of the packaging portion 101 away from the driving unit 103, and the surface of the first conductive substructure 1061 away from the packaging portion 101 protrudes from the surface of the packaging portion 101 away from the driving unit 103. In this case, the preparation method of the conductive structure 106 includes: forming a packaging film on one side of a temporary substrate; forming a through-hole in the packaging film; and forming the second conductive substructure 1062 in the through-hole. Thereafter, the various film layers of the driving unit are formed in sequence, the driving unit and the light-emitting unit are bonded and connected, and the temporary substrate is removed. Finally, the first conductive substructure 1061 is formed on the side of the second conductive substructure 1062 away from the driving unit 103 by electroplating or chemical plating.

[0126] As such, referring to FIG. 7 , the surface of the first conductive substructure 1061 close to the second conductive substructure 1062 may be flush with the surface of the packaging portion 101 away from the driving unit 103 .

[0127] The embodiment of the present application does not limit the specific structure of the conductive structure 106 . It is only necessary that the conductive structure 106 can be connected to the conductive pad of the driving backplane and the driving unit 103 to transmit the driving signal provided by the driving backplane to the driving unit 103 .

[0128] Optionally, the light-emitting assembly 10 includes a plurality of light-emitting units 102 and a driving unit 103 corresponding to the plurality of light-emitting units 102. Thus, the location where each of the plurality of light-emitting units 102 and the driving unit 103 are electrically connected to each other can be confined within a confined space, thereby protecting the location where each light-emitting unit 102 and the driving unit 103 are electrically connected to each other and preventing interference from the external environment.

[0129] Optionally, the plurality of light-emitting units 102 include a first color light-emitting unit, a second color light-emitting unit, and a third color light-emitting unit. The first color, the second color, and the third color are different from each other. For example, the first color is red (R), the second color is green (G), and the third color is blue (B).

[0130] In the embodiment of the present application, referring to Figures 1 to 7 , the light-emitting unit 102 includes a first electrode 1021, a second electrode 1022, and a light-emitting layer 1023 electrically connected to the first electrode 1021 and the second electrode 1022, respectively. The light-emitting layer 1023 emits blue light. Furthermore, referring to Figure 8 , the light-emitting unit 102 also includes a color filter layer 1024 and a color conversion layer 1025. The color filter layer 1024, the color conversion layer 1025, and the light-emitting layer 1023 are stacked sequentially in a direction away from the encapsulation portion 101.

[0131] Furthermore, the light-emitting layer 1023 includes a first light-emitting portion, a second light-emitting portion, and a third light-emitting portion. That is, the first light-emitting portion, the second light-emitting portion, and the third light-emitting portion all emit blue light. FIG8 illustrates only one light-emitting portion.

[0132] The color conversion layer 1025 includes a first color conversion portion, a second color conversion portion, and a transparent portion. Figure 8 shows only one color conversion portion 10251. The first color conversion portion overlaps with the orthographic projection of the first light-emitting portion and is used to convert the light emitted by the first light-emitting portion into the color corresponding to the first color conversion portion (for example, red). The second color conversion portion overlaps with the orthographic projection of the second light-emitting portion and is used to convert the light emitted by the second light-emitting portion into the color corresponding to the second color conversion portion (for example, green). The third color conversion portion overlaps with the orthographic projection of the transparent portion and is used to transmit light emitted by the third light-emitting portion.

[0133] Optionally, the color conversion layer 1025 further includes a spacer 10252 located between any two adjacent structures among the first color conversion portion, the second color conversion portion and the transparent portion, and the spacer is used to distinguish and separate different color conversion portions 10251 and the transparent portion.

[0134] The color filter layer 1024 includes a first color block, a second color block, a third color block, and a black matrix 10242. Figure 8 only illustrates one color block 10241. The black matrix 10242 is located between adjacent color blocks 10241. The first color block overlaps with the orthographic projection of the first color conversion portion. The first color block is used to transmit light of the corresponding color after conversion by the first color conversion portion and block light of other colors. The second color block overlaps with the orthographic projection of the second color conversion portion. The second color block is used to transmit light of the corresponding color after conversion by the second color conversion portion and block light of other colors. The third color block overlaps with the orthographic projection of the transparent portion. The third color block is used to transmit light of the corresponding color transmitted by the transparent portion and block light of other colors.

[0135] For example, the first color block is a red color block, the second color block is a green color block, and the third color block is a blue color block.

[0136] 9 , the light emitting layer 1023 includes a stacked first doping layer 10231 , a multi-quantum well layer 10232 , and a second doping layer 10233 . The first doping layer 10231 is electrically connected to the first electrode 1021 , and the second doping layer 10233 is electrically connected to the second electrode 1022 .

[0137] Optionally, the first doped layer 10231 may be an N-type doped layer, and the second doped layer 10233 may be a P-type doped layer. Accordingly, the first electrode 1021 may be referred to as an N-type electrode, and the second electrode 1022 may be referred to as a P-type electrode. Optionally, the material of the first doped layer 10231 may be N-type gallium nitride (GaN), and the first doped layer 10231 is denoted as N-GaN. The material of the second doped layer 10233 may be P-type gallium nitride (GaN), and the second doped layer 10233 is denoted as P-GaN.

[0138] Referring to Figure 9, the second doped layer 10233 and the multi-quantum well layer 10232 are used to expose the target portion of the first doped layer 10231. The light-emitting layer 1023 also includes a raised electrode 10234, a conductive layer 10235, and an insulating layer 10236. The raised electrode 10234 is connected to the target portion of the first doped layer 10231. The conductive layer 10235 is located on the side of the second doped layer 10233 away from the first doped layer 10231. The insulating layer 10236 is located on the side of the raised electrode 10234 and the conductive layer 10235 away from the first doped layer 10231. The insulating layer 10236 has a first via (N-type via) and a second via (P-type via). The first via is used to expose the raised electrode 10234, which is connected to the first electrode 1021. The second via is used to expose the conductive layer 10235, which is connected to the second electrode 1022. Optionally, the material of the conductive layer 10235 may be indium tin oxide (ITO), and the insulating layer 10236 may be a passivation layer (PVX).

[0139] In the embodiment of the present application, referring to Figures 1 to 7, the driving unit 103 includes: a third electrode 1031, a fourth electrode 1032, and a driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 can each be one of the multiple electrodes included in the driving unit 103 in Figure 4. The third electrode 1031 and the fourth electrode 1032 are both located on the side of the driving unit 103 facing the light-emitting unit 102, that is, the third electrode 1031 and the fourth electrode 1032 are closer to the light-emitting unit 102 than the driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 are respectively electrically connected to the driving circuit 1033, the third electrode 1031 is electrically connected to the first electrode 1021, and the fourth electrode 1032 is electrically connected to the second electrode 1022.

[0140] Optionally, the target side surface 103c may be a side surface of the driving circuit 1033. That is, the first sub-package portion 1011 may be in contact with at least one of the second surface 103b and the side surface of the driving circuit 1033, thereby forming a sealed space with the first sub-package portion 1011 and the light emitting unit 102.

[0141] In the embodiment of the present application, the driving circuit 1033 may include a plurality of thin film transistors and at least one storage capacitor. Optionally, the driving circuit 1033 may include seven thin film transistors and one storage capacitor, that is, the driving circuit 1033 is a 7T1C driving circuit. Alternatively, the driving circuit 1033 may include other numbers of thin film transistors and other numbers of storage capacitors. The embodiment of the present application does not limit the number of thin film transistors included in the driving circuit 1033 and the number of storage capacitors included.

[0142] Each thin film transistor includes a gate, a source, and a drain. The driving circuit 1033 includes multiple thin film transistors that are interconnected to achieve the function of driving the light emitting unit 102 to emit light.

[0143] Optionally, the plurality of thin film transistors include at least a data writing transistor, the source of which is connected to a data line of a driving backplane in the display substrate. The data line can transmit a data driving signal to the driving circuit 1033 through the data writing transistor.

[0144] In an embodiment of the present application, the conductive structure 106 included in the light-emitting component 10 is connected to the source of the data writing transistor in the driving circuit 1033, and the data writing transistor is connected to the third electrode 1031 of the driving unit 103 through other thin film transistors, so that the conductive pad corresponding to the data line included in the driving backplane in the display substrate transmits the data driving signal to the first electrode 1021 of the light-emitting unit 102 through the conductive structure 106, the driving circuit 1033, and the third electrode 1031 in sequence.

[0145] It should be noted that in order for the driving unit 103 to drive the light-emitting unit 102 to emit light, in addition to providing the data driving signal to the first electrode 1021 of the light-emitting unit, it is also necessary to provide a power signal (such as a VSS signal) to the second electrode 1022 of the light-emitting unit 102. Optionally, the power signal provided by the driving backplane to multiple light-emitting components can be the same signal, so the power signal can be provided to the second electrodes 1022 of the light-emitting units 102 in the multiple light-emitting components via the conductive structure 106 located in the peripheral area of ​​the display substrate.

[0146] Referring to Figure 5, the driver circuit 1033 includes a buffer insulating layer m1, an active layer m2, a first gate insulating layer m3, a first gate layer m4, a second gate insulating layer m5, a second gate layer m6, an interlayer dielectric layer m7, a source / drain layer m8, and a planar layer m9, which are stacked in sequence. The third electrode 1031 and the fourth electrode 1032 included in the driver unit 103 are located on a side of the planar layer m9 away from the buffer insulating layer m1.

[0147] The active layer m2 includes multiple active patterns corresponding to multiple thin film transistors, each of which includes a source region, a drain region, and a channel region. The source and drain of the thin film transistor are located in the source-drain layer, and the source of the thin film transistor is connected to the source region, and the drain is connected to the drain region.

[0148] The first gate layer m4 includes a plurality of gate patterns corresponding to the plurality of thin film transistors. The channel region is an area where the orthographic projections of the active pattern and the gate pattern overlap.

[0149] 10 , the light-emitting assembly 10 further includes a substrate 107. The substrate 107 may be located on a side of the light-emitting unit 102 away from the driving unit 103, and the substrate 107 may be used to support the light-emitting unit 102. Of course, the light-emitting assembly 10 may also not include the substrate 107. The substrate 107 may be used to support the light-emitting assembly 10 during its preparation, and the substrate 107 may be removed later.

[0150] In summary, an embodiment of the present application provides a light-emitting component, which includes a packaging portion, a light-emitting unit, and a driving unit. The first contact area on the third surface of the light-emitting unit is connected to the driving unit, the second contact area on the third surface of the light-emitting unit is connected to the first sub-packaging portion of the packaging portion, and the second contact area is arranged around the first contact area. The above-mentioned arrangement allows the first sub-packaging portion to form a sealed space with the light-emitting unit, thereby allowing the position where the light-emitting unit and the driving unit are electrically connected to each other to be located within the sealed space, thereby ensuring the sealing effect of the electrical connection position, preventing the external environment from affecting the electrical connection position, and improving the reliability of the light-emitting component.

[0151] FIG11 is a flow chart of a method for preparing a light-emitting component according to an embodiment of the present application. Referring to FIG11 , the method includes:

[0152] Step S101 : obtaining a temporary substrate, an initial packaging portion located on the temporary substrate, and a driving unit located on a side of the initial packaging portion away from the temporary substrate.

[0153] In an embodiment of the present application, the initial packaging portion 101a can be located on a temporary substrate, and the drive unit 103 is located on a side of the initial packaging portion 101a away from the temporary substrate. The temporary substrate can be a rigid substrate, thereby providing support for the initial packaging portion 101a and the drive unit 103 to prevent deformation of the initial packaging portion 101a and the drive unit 103. Furthermore, the orthographic projection of the drive unit 103 on the initial packaging portion 101a is located within the initial packaging portion 101a. For example, the initial packaging portion 101a can have a portion that extends beyond the drive unit 103.

[0154] Optionally, the driving unit 103 includes a third electrode 1031, a fourth electrode 1032, and a driving circuit 1033. The third electrode 1031 and the fourth electrode 1032 are both located on a side of the driving unit 103 away from the initial packaging portion 101a, that is, the third electrode 1031 and the fourth electrode 1032 are farther away from the initial packaging portion 101a than the driving circuit 1033.

[0155] Step S102: obtaining a substrate and a light-emitting unit located on the substrate.

[0156] In the embodiment of the present application, referring to FIG13 , the light-emitting unit 102 may include a first electrode 1021, a second electrode 1022, and a light-emitting layer 1023 electrically connected to the first electrode 1021 and the second electrode 1022. The first electrode 1021 and the second electrode 1022 are located on a side of the light-emitting layer 1023 away from the substrate.

[0157] Step S103 : bonding the light emitting unit and the driving unit together through a bonding process to obtain a target structure.

[0158] In an embodiment of the present application, referring to Figure 14, after the light-emitting unit 102 and the driving unit 103 are bonded and connected, the first electrode 1021 of the light-emitting unit 102 and the third electrode 1031 of the driving unit 103 can be electrically connected, and the second electrode 1022 of the light-emitting unit 102 and the fourth electrode 1032 of the driving unit 103 can be electrically connected.

[0159] Referring to Figure 14 , the target structure includes a temporary substrate, an initial encapsulation portion 101a, a driver unit 103, a light-emitting unit 102, and a base, arranged in this order. The driver unit 103 includes a first surface 103a facing the light-emitting unit 102, a second surface 103b facing away from the light-emitting unit 102, and a target side surface 103c located between the first and second surfaces 103a, 103b. The light-emitting unit 102 includes a third surface 102a facing the driver unit 103.

[0160] Step S104 : When the gravity direction of the initial packaging part is toward the light emitting unit, peel the temporary substrate from one side of the initial packaging part so that the initial packaging part is deformed toward the side close to the light emitting unit under the action of its own gravity.

[0161] In an embodiment of the present application, after the driving unit 103 and the light-emitting unit 102 are bonded and connected, the temporary substrate, the initial packaging part 101a, the driving unit 103, the light-emitting unit 102 and the base can be arranged in order from top to bottom. Thereafter, referring to FIG15 , a laser device is set on the side of the temporary substrate away from the initial packaging part 101a. The target structure is driven to move so that the laser light bar of the laser device sequentially scans each area of ​​the target structure along the moving direction. Among them, after the target structure is scanned by the laser light bar, the temporary substrate can be peeled off from one side of the initial packaging part 101a. That is, the temporary substrate is removed from one side of the initial packaging part 101a by laser lift-off (LLO).

[0162] After the temporary substrate is peeled off from one side of the initial packaging part 101 a , the initial packaging part 101 a loses the support of the temporary substrate and is deformed toward the side close to the light emitting unit 102 under the action of its own gravity.

[0163] At the same time, because the driver unit 103 is disposed between the initial packaging portion 101a and the light-emitting unit 102, and the location where the driver unit 103 and the light-emitting unit 102 are electrically connected is generally a rigid node, the portion of the driver unit 103 within the area formed by the rigid node still provides support for the initial packaging portion 101a. As a result, the portion of the initial packaging portion 101a outside the area formed by the rigid node can deform toward the side closer to the light-emitting unit 102 under the action of its own gravity.

[0164] In the embodiment of the present application, the packaging portion 101 includes a first sub-packaging portion 1011, and the third surface 102a includes a first contact area 102a1 electrically connected to the driving unit 103 and a second contact area 102a2 connected to the first sub-packaging portion 1011. The second contact area 102a2 is arranged around the first contact area 102a1, and the first sub-packaging portion 1011 is arranged in contact with at least one of the second surface 103b and the target side surface 103c. In this way, the packaging portion 101 and the light-emitting unit 102 can form a closed space, and the position where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can be located within the closed space. Furthermore, the position where the light-emitting unit 102 and the driving unit 103 are electrically connected to each other can be prevented from being affected by the external environment, thereby improving the reliability of the light-emitting component 10.

[0165] As shown in Figures 12 to 16 , multiple light-emitting assemblies 10 can be prepared using a single process, thereby facilitating mass production of the light-emitting assemblies 10. Subsequently, referring to Figure 17 , the multiple light-emitting assemblies 10 can be cut using a cutting process to obtain multiple light-emitting assemblies 10. Figures 12 to 17 each use two light-emitting assemblies 10 as an example.

[0166] In summary, an embodiment of the present application provides a method for preparing a light-emitting component, wherein the light-emitting component prepared by the method includes a packaging part, a light-emitting unit, and a driving unit. The first contact area on the third surface of the light-emitting unit is connected to the driving unit, the second contact area on the third surface of the light-emitting unit is connected to the first sub-packaging part of the packaging part, and the second contact area is arranged around the first contact area. The above-mentioned arrangement method can make the first sub-packaging part and the light-emitting unit form a closed space, thereby making the position where the light-emitting unit and the driving unit are electrically connected to each other located in the sealed space, ensuring the sealing effect of the electrical connection position, avoiding the influence of the external environment on the electrical connection position, and improving the reliability of the light-emitting component.

[0167] FIG18 is a schematic diagram of the structure of a display substrate provided in an embodiment of the present application. Referring to FIG18 , the display substrate 00 includes a driver backplane 20 and a plurality of light-emitting components 10. For example, the plurality of light-emitting components 10 are located in a display area 00a of the display substrate 00 and are arranged in an array.

[0168] The driving unit 103 included in the light-emitting assembly 10 is located between the driving backplane 20 and the light-emitting unit 102 included in the light-emitting assembly 10, and the driving backplane 20 and the driving unit 103 are electrically connected. The driving backplane 20 is used to provide a driving signal to the driving unit 103 so that the driving unit 103 drives the light-emitting unit 102 to emit light.

[0169] 19 , the driving backplane 20 includes a backplane substrate 201 and a pad (not shown) located on one side of the backplane substrate 201. The pad includes a plurality of conductive pads 202. The conductive pads 202 are used to electrically connect to the first conductive substructure 1061 of the conductive structure 106 included in the light-emitting component 10.

[0170] Since the display substrate can have substantially the same technical effects as the light-emitting assembly described in the previous embodiment, the technical effects of the display substrate will not be repeatedly described here for the purpose of brevity.

[0171] The terms used in the embodiments of this application are only used to explain the embodiments of this application and are not intended to limit this application. Unless otherwise defined, the technical terms or scientific terms used in the embodiments of this application should have the common meaning understood by people with ordinary skills in the field to which this application belongs.

[0172] The terms used in the embodiments of this application are intended solely to illustrate the embodiments of this application and are not intended to limit this application. Unless otherwise defined, technical or scientific terms used in the embodiments of this application should have the same ordinary meaning as those understood by persons of ordinary skill in the art to which this application belongs. The terms "first," "second," "third," and similar terms used in this patent specification and claims do not denote any order, quantity, or importance, but are simply used to distinguish between different components. Similarly, terms such as "a" or "an" do not denote a limitation of quantity, but rather denote the presence of at least one. Terms such as "include" or "comprising" and similar terms mean that the elements or objects listed before "include" or "comprising" include the elements or objects listed after "include" or "comprising," and their equivalents, and do not exclude other elements or objects. Terms such as "connected" or "connected" are not limited to physical or mechanical connections but may include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used solely to indicate relative positions. When the absolute position of the described objects changes, the relative positions may also change accordingly.

[0173] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A light emitting component, characterized in that: The light emitting component comprises: An encapsulation portion, a light-emitting unit, and a driving unit located between the encapsulation portion and the light-emitting unit, wherein the light-emitting unit is electrically connected to the driving unit; The driving unit includes a first surface facing the light emitting unit, a second surface facing away from the light emitting unit, and a target side surface located between the first surface and the second surface; The light emitting unit includes a third surface facing the driving unit, the encapsulation portion includes a first sub-encapsulation portion, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-encapsulation portion, and the second contact area is arranged around the first contact area; The first sub-packaging portion is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light emitting unit and the driving unit are electrically connected to each other is located in a confined space.

2. The light emitting assembly according to claim 1, characterized in that: The light emitting component further includes an adhesive layer, wherein the adhesive layer is located between the first sub-encapsulation portion and the third surface; The first sub-encapsulation portion is connected to the third surface through the adhesive layer.

3. The light emitting assembly according to claim 2, characterized in that: A ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7; A ratio of a length of a target path of the encapsulation portion to a thickness of the adhesive layer is greater than or equal to 10; The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.

4. The light emitting assembly according to claim 3, characterized in that: The length of the target path of the packaging portion is greater than or equal to 35 micrometers, the thickness of the driving unit is greater than or equal to 5 micrometers, and the thickness of the adhesive layer is greater than or equal to 0.5 micrometers.

5. The light emitting assembly according to claim 1, characterized in that: The light emitting assembly further includes a pad structure located between the first sub-encapsulation portion and the third surface; The first sub-encapsulation portion is connected to the third surface through the pad layer structure.

6. The light emitting assembly according to claim 5, characterized in that: The light emitting component further includes an adhesive layer located between the pad structure and the first sub-package portion. The pad structure is disposed in direct contact with the third surface, and the first sub-package portion is connected to the pad structure via the adhesive layer.

7. The light emitting assembly according to claim 6, characterized in that: A maximum distance between a surface of the cushion structure in contact with the adhesive layer and the third surface is smaller than a maximum distance between the second surface and the third surface.

8. The light emitting assembly according to claim 5, characterized in that: A ratio of a length of a target path of the packaging portion to a thickness of the driving unit is greater than or equal to 7; The ratio of the length of the target path of the encapsulation portion to the sum of the thicknesses of the adhesive layer and the cushion structure is greater than or equal to 10; The driving unit includes a plurality of electrodes, and the plurality of electrodes include a target electrode close to the edge of the driving unit; a projection of an edge of the target electrode away from the center of the driving unit on the packaging portion along the thickness direction of the light-emitting unit includes a first end, and an edge of the packaging portion corresponding to the first end and adjacent to the edge of the target electrode away from the center of the driving unit is a second end, and the target path is the minimum path of a portion of the packaging portion located between the first end and the second end.

9. The light emitting assembly according to claim 8, characterized in that: The length of the target path of the packaging portion is greater than or equal to 35 micrometers, the thickness of the driving unit is greater than or equal to 5 micrometers, and the sum of the thicknesses of the adhesive layer and the cushion structure is less than or equal to 5 micrometers.

10. The light emitting assembly according to claim 1, wherein: The second surface of the driving unit includes a surface edge and a surface center, and the surface edge is arranged around the surface center; The distance between the edge of the surface and the third surface is smaller than the distance between the center of the surface and the third surface.

11. The light emitting assembly according to claim 10, characterized in that: The second surface of the driving unit is conformal to a surface of the packaging portion close to the driving unit.

12. The light-emitting assembly according to any one of claims 1 to 11, characterized in that: The packaging portion further includes a second sub-packaging portion covering the second surface; The first sub-packaging portion and the second sub-packaging portion are an integrated structure, and the driving unit is located inside the enclosed space surrounded by the packaging portion and the light-emitting unit.

13. The light emitting assembly according to claim 12, characterized in that: The packaging part is made of flexible material.

14. The light emitting assembly according to claim 13, characterized in that: The second sub-package includes a through hole, and the light-emitting component includes a conductive structure located in the through hole. The conductive structure is electrically connected to the driving unit and is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate.

15. The light emitting assembly according to claim 14, characterized in that: The conductive structure includes a first conductive substructure and a second conductive substructure that are electrically connected; The first conductive substructure is arranged farther away from the light-emitting unit than the second conductive substructure, an orthographic projection of the second conductive substructure on a reference plane is located within an orthographic projection of the first conductive substructure on the reference plane, and the reference plane is parallel to a fourth surface of the light-emitting unit away from the driving unit; The first conductive substructure is used to be electrically connected to a conductive pad of a driving backplane included in the display substrate, and the second conductive substructure is electrically connected to the driving unit.

16. The light emitting assembly according to any one of claims 1 to 11, characterized in that: The light emitting unit includes: a first electrode, a second electrode, and a light emitting layer electrically connected to the first electrode and the second electrode respectively; The driving unit includes a third electrode, a fourth electrode and a driving circuit, wherein the third electrode and the fourth electrode are both located on a side of the driving circuit close to the light-emitting unit, the third electrode and the fourth electrode are electrically connected to the driving circuit respectively, the third electrode is electrically connected to the first electrode, and the fourth electrode is electrically connected to the second electrode.

17. The light emitting assembly according to claim 16, wherein: The target side is a side of the driving circuit.

18. The light emitting assembly according to claim 16, wherein: The second sub-package includes a through hole, and the light-emitting component includes a conductive structure located in the through hole; the driving circuit includes a plurality of thin film transistors and at least one storage capacitor, and each thin film transistor includes a gate, a source, and a drain; The conductive structure is connected to a source electrode of a thin film transistor among the plurality of thin film transistors, and is used to provide the driving circuit with a data driving signal transmitted from a driving backplane in the display substrate.

19. The light emitting assembly according to claim 18, wherein: The driving circuit includes a buffer insulating layer, an active layer, a first gate insulating layer, a first gate layer, a second gate insulating layer, a second gate layer, an interlayer dielectric layer, a source-drain layer, and a planar layer stacked in sequence; the third electrode and the fourth electrode are located on a side of the planar layer away from the buffer insulating layer; The active layer includes a plurality of active patterns corresponding to the plurality of thin film transistors, and each of the active patterns includes a source region, a drain region, and a channel region; The source electrode and the drain electrode of the thin film transistor are located in the source-drain electrode layer, the source electrode of the thin film transistor is connected to the source region, and the drain electrode of the thin film transistor is connected to the drain region; The first gate layer includes a plurality of gate patterns corresponding to the plurality of thin film transistors, and the channel region is a region where the active pattern and the orthographic projection of the gate pattern overlap.

20. The light emitting assembly according to any one of claims 1 to 11, characterized in that: The light emitting assembly includes a plurality of light emitting units and the driving units corresponding to the plurality of light emitting units; The plurality of light emitting units include a first color light emitting unit, a second color light emitting unit, and a third color light emitting unit, and the first color, the second color, and the third color are different from each other.

21. The light emitting assembly according to claim 20, characterized in that The light-emitting unit comprises a color filter layer, a color conversion layer and a light-emitting layer stacked in sequence in a direction away from the packaging portion; the light-emitting layer emits blue light; The light-emitting layer includes a first doped layer, a multi-quantum well layer and a second doped layer that are stacked, wherein the first doped layer is electrically connected to the first electrode, the second doped layer is electrically connected to the second electrode, and the light-emitting layer includes a first light-emitting portion, a second light-emitting portion and a third light-emitting portion.

22. A method for preparing a light-emitting component, characterized in that: The method comprises: Obtaining a temporary substrate, an initial packaging portion located on the temporary substrate, and a driving unit located on a side of the initial packaging portion away from the temporary substrate, wherein the temporary substrate is a rigid substrate, and an orthographic projection of the driving unit on the initial packaging portion is located within the initial packaging portion; Obtaining a substrate and a light-emitting unit located on the substrate; Bonding the light-emitting unit and the driving unit to each other through a bonding process to obtain a target structure, wherein the target structure includes the temporary substrate, the initial packaging portion, the driving unit, the light-emitting unit, and the base arranged in sequence, the driving unit including a first surface facing the light-emitting unit, a second surface facing away from the light-emitting unit, and a target side surface located between the first surface and the second surface, and the light-emitting unit including a third surface facing the driving unit; When the gravity direction of the initial packaging part is toward the light-emitting unit, the temporary substrate is peeled off from one side of the initial packaging part, so that the initial packaging part is deformed toward the side closer to the light-emitting unit under the action of its own gravity to form the packaging part; In which, the packaging part includes a first sub-packaging part, the third surface includes a first contact area electrically connected to the driving unit and a second contact area connected to the first sub-packaging part, the second contact area is arranged around the first contact area, and the first sub-packaging part is arranged in contact with at least one of the second surface and the target side surface, so that the position where the light-emitting unit and the driving unit are electrically connected to each other is located in a confined space.

23. The method according to claim 21, characterized in that The step of peeling the temporary substrate from one side of the initial packaging portion when the gravity direction of the initial packaging portion is toward the light-emitting unit comprises: When the gravity direction of the initial packaging part is toward the light-emitting unit, a laser device is arranged on a side of the temporary substrate away from the initial packaging part; The target structure is driven to move so that the laser light bar of the laser device sweeps across the target structure. After the target structure is swept across by the laser light bar, the temporary substrate can be peeled off from one side of the initial packaging portion.

24. A display substrate, characterized in that: The display substrate includes a driving backplane, and a plurality of light-emitting components according to any one of claims 1 to 21 arranged in an array and located on one side of the driving backplane; The driving unit included in the light-emitting assembly is located between the driving backplane and the light-emitting unit included in the light-emitting assembly, and the driving backplane and the driving unit are electrically connected; The driving backplane is used to provide a driving signal to the driving unit so that the driving unit drives the light-emitting unit to emit light.

25. The display substrate according to claim 24, wherein: The driving backplane includes: a backplane substrate, and a pad located on one side of the backplane substrate, wherein the pad includes a plurality of conductive pads; The conductive pad is used to be electrically connected to the first conductive substructure of the conductive structure included in the light-emitting component.

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