Display substrate and display device

Abstract

Provided is a display substrate, comprising: a base substrate; a plurality of light-emitting devices which are arranged in an array on the base substrate, each light-emitting device comprising a first electrode portion located on the base substrate, a light-emitting functional portion located on the side of the first electrode portion that faces away from the base substrate, and a second electrode portion located on the side of the light-emitting functional portion that faces away from the base substrate; a plurality of partition portions which are located on the base substrate, at least one partition portion being provided between every two adjacent light-emitting devices; and a first encapsulation layer which is located on the side of the light-emitting devices that faces away from the base substrate, wherein the first encapsulation layer is partitioned into a plurality of encapsulation portions by the plurality of partition portions, at least one partition portion is provided between every two adjacent encapsulation portions, and each encapsulation portion covers a light-emitting device, the orthographic projection of each encapsulation portion on the base substrate covering the orthographic projection of the light-emitting device on the base substrate.

Description

Display substrate and display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display substrate, a preparation method thereof, and a display device. Background Art

[0002] Microdisplays have a broad market application space and are particularly suitable for use in helmet displays, stereoscopic displays, and eye-type displays. Among them, silicon-based OLED microdisplays, which combine Organic Light Emitting Diode (OLED) technology with Complementary Metal Oxide Semiconductor (CMOS) technology, are products that are cross-integrated between the optoelectronics and microelectronics industries. Silicon-based OLED microdisplays have excellent display characteristics, including high brightness, rich colors, low driving voltage, fast response speed, and low power consumption, and provide an excellent user experience. How to improve the reliability of silicon-based OLED microdisplays is a technical problem that needs to be urgently solved in this field.

[0003] The above information disclosed in this section is only for understanding the background of the inventive concept of the present disclosure and therefore the above information may contain information that does not constitute prior art.

[0004] Summary of the Invention

[0005] In one aspect, a display substrate is provided, comprising:

[0006] substrate;

[0007] A plurality of light-emitting devices, wherein the plurality of light-emitting devices are arrayed on the base substrate, the light-emitting devices comprising a first electrode portion located on the base substrate, a light-emitting functional portion located on a side of the first electrode portion away from the base substrate, and a second electrode portion located on a side of the light-emitting functional portion away from the base substrate;

[0008] a plurality of partitioning portions, each of which is located on the base substrate, and at least one partitioning portion is provided between two adjacent light-emitting devices; and

[0009] The first encapsulation layer is located on the side of the light-emitting device away from the base substrate. The first encapsulation layer is divided into multiple encapsulation parts by multiple partition parts. There is at least one partition part between two adjacent encapsulation parts. Each encapsulation part covers each light-emitting device respectively, and the orthographic projection of the encapsulation part on the base substrate covers the orthographic projection of the light-emitting device on the base substrate.

[0010] According to some exemplary embodiments, the encapsulation portion continuously extends from a surface of the light emitting device to a side surface of the partition portion, and the encapsulation portion covers at least a portion of the side surface of the partition portion.

[0011] According to some exemplary embodiments, the partition portion includes a first partition sub-portion and a second partition sub-portion, the second partition sub-portion is located on a side of the first partition sub-portion away from the base substrate, and an edge of the second partition sub-portion protrudes from an edge of the first partition sub-portion along a direction parallel to the base substrate.

[0012] According to some exemplary embodiments, the encapsulation portion covers a side surface of the first partition sub-portion intersecting with the base substrate and a side surface of the second partition sub-portion opposite to the base substrate.

[0013] According to some exemplary embodiments, the display substrate further includes a plurality of second electrode overlapping portions located between the base substrate and the isolation layer, two adjacent second electrode portions are located on both sides of at least one of the isolation portions and are electrically connected through a second electrode overlapping portion, and the second electrode overlapping portion is spaced apart from the adjacent light-emitting functional portion.

[0014] According to some exemplary embodiments, the display substrate further includes a pixel defining layer located between the base substrate and the isolation layer, the pixel defining layer having a plurality of openings, the openings exposing at least a portion of the first electrode portion, the light-emitting functional portion overlapping the first electrode portion through the openings, and the pixel defining layer is further away from the plane of the base substrate than the first electrode portion is away from the plane of the base substrate.

[0015] According to some exemplary embodiments, a distance between a plane of the second partition portion close to the base substrate and a plane of the pixel defining layer away from the base substrate is a first distance, and the first distance is greater than the sum of a thickness of the light-emitting functional portion and a thickness of the second electrode portion.

[0016] According to some exemplary embodiments, an edge of the second partition sub-section protrudes a second distance from an edge of the first partition sub-section, wherein the ratio of the second distance to the first distance is ≥1:2.

[0017] According to some exemplary embodiments, an orthographic projection of the opening on the base substrate is spaced apart from an orthographic projection of the second electrode overlapping portion on the base substrate.

[0018] According to some exemplary embodiments, a distance between an orthographic projection of the opening on the base substrate and an orthographic projection of the second electrode overlapping portion on the base substrate is a third distance, wherein the second distance>the third distance.

[0019] According to some exemplary embodiments, the second electrode overlapping portion is located between the pixel defining layer and the partition portion, the orthographic projection of the first partition sub-portion on the base substrate is located within the orthographic projection of the second electrode overlapping portion on the base substrate, and the orthographic projection of the second electrode overlapping portion on the base substrate is located within the orthographic projection of the second partition sub-portion on the base substrate.

[0020] According to some exemplary embodiments, a plane of the second electrode overlapping portion close to the base substrate is farther away from the base substrate than a plane of the first electrode portion far away from the base substrate.

[0021] According to some exemplary embodiments, the display substrate further includes an insulating protection portion, the insulating protection portion covering a side surface of the second electrode overlapping portion, and the second electrode portion overlaps the second electrode overlapping portion away from a plane of the base substrate.

[0022] According to some exemplary embodiments, the pixel defining layer has a groove, at least a portion of the second electrode overlapping portion is embedded in the groove, the orthographic projection of the first partition sub-portion on the base substrate is located within the orthographic projection of the second electrode overlapping portion on the base substrate, and the orthographic projection of the second electrode overlapping portion on the base substrate is located within the orthographic projection of the second partition sub-portion on the base substrate.

[0023] According to some exemplary embodiments, a plane of the second electrode overlapping portion close to the base substrate is located between a plane of the first electrode portion away from the base substrate and a plane of the first electrode portion close to the base substrate; and

[0024] The second electrode overlapping portion is further away from the plane of the base substrate than the first electrode portion is from the plane of the base substrate.

[0025] According to some exemplary embodiments, the display substrate further includes an insulating protection portion, the insulating protection portion and the pixel defining layer cover a side surface of the second electrode overlapping portion, and the second electrode portion and the second electrode overlapping portion overlap away from a plane of the base substrate.

[0026] According to some exemplary embodiments, the groove exposes a portion of the base substrate, and the second electrode overlapping portion is closer to the base substrate than the pixel defining layer is to the base substrate.

[0027] According to some exemplary embodiments, the second electrode overlapping portion and the first electrode portion are located in the same layer.

[0028] According to some exemplary embodiments, a material of the first partition sub-portion is silicon nitride, and a material of the second partition sub-portion is silicon oxide.

[0029] According to some exemplary embodiments, the display substrate further includes a second encapsulation layer, which covers the first encapsulation layer and each of the partition portions, and the second encapsulation layer is further away from the plane of the base substrate than the partition portions are from the plane of the base substrate.

[0030] According to some exemplary embodiments, the plurality of light-emitting devices include a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices, the plurality of encapsulation parts include a plurality of first encapsulation parts, a plurality of second encapsulation parts, and a plurality of third encapsulation parts, the first encapsulation parts covering the first light-emitting devices, the second encapsulation parts covering the second light-emitting devices, and the third encapsulation parts covering the third light-emitting devices;

[0031] The thickness of the first packaging part is greater than the thickness of the second packaging part, and the thickness of the second packaging part is greater than the thickness of the third packaging part.

[0032] According to some exemplary embodiments, the thickness of a portion of the second encapsulation layer located on the first encapsulation portion is less than the thickness of a portion of the second encapsulation layer located on the second encapsulation portion, and the thickness of a portion of the second encapsulation layer located on the second encapsulation portion is less than the thickness of a portion of the second encapsulation layer located on the third encapsulation portion.

[0033] According to some exemplary embodiments, the light-emitting functional portion includes a first light-emitting portion, a second light-emitting portion located on a side of the first light-emitting portion away from the base substrate, and a charge generating portion located between the first light-emitting portion and the second light-emitting portion, and there is at least one partition portion between two adjacent charge generating portions.

[0034] According to some exemplary embodiments, the plurality of light-emitting devices include a plurality of first light-emitting devices, a plurality of second light-emitting devices and a plurality of third light-emitting devices, the first light-emitting devices emit a first color light, the second light-emitting devices emit a second color light, and the third light-emitting devices emit a third color light.

[0035] According to some exemplary embodiments, the first light emitting device includes a first light emitting functional portion, the second light emitting device includes a second light emitting functional portion, and the third light emitting device includes a third light emitting functional portion;

[0036] The display substrate further includes a second light-emitting functional structure located on a side of the packaging portion away from the first light-emitting device, and a third light-emitting functional structure located on a side of the second light-emitting functional structure away from the first light-emitting device; and

[0037] The display substrate further includes a third light-emitting functional structure located on a side of the packaging portion away from the second light-emitting device;

[0038] The second light-emitting functional structure and the second light-emitting functional portion are located in the same layer, and the third light-emitting functional structure and the third light-emitting functional portion are located in the same layer.

[0039] In another aspect, a method for preparing a display substrate is provided, the method comprising the following steps:

[0040] providing a substrate;

[0041] forming a plurality of light-emitting devices on the base substrate, the plurality of light-emitting devices being arranged in an array, the light-emitting devices comprising a first electrode portion located on the base substrate, a light-emitting functional portion located on a side of the first electrode portion away from the base substrate, and a second electrode portion located on a side of the light-emitting functional portion away from the base substrate;

[0042] forming a plurality of partitions on the base substrate, with at least one partition between two adjacent light-emitting devices; and

[0043] A first encapsulation layer is formed on a side of each light-emitting device away from the base substrate, the first encapsulation layer is divided into a plurality of encapsulation parts by a plurality of the partition parts, there is at least one partition part between two adjacent encapsulation parts, each of the encapsulation parts covers each light-emitting device respectively, and the orthographic projection of one encapsulation part on the base substrate covers the orthographic projection of one light-emitting device on the base substrate.

[0044] In another aspect, a display device is provided, comprising the above-mentioned display substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Other objects and advantages of the present disclosure will become apparent from the following description of the present disclosure with reference to the accompanying drawings, which will help to provide a comprehensive understanding of the present disclosure.

[0046] FIG1 schematically shows a plan view of a display substrate according to an embodiment of the present disclosure.

[0047] FIG. 2A schematically shows a cross-sectional view taken along line AA′ in FIG. 1 .

[0048] FIG. 2B exemplarily shows an enlarged structural diagram of the region M in FIG. 2A .

[0049] FIG2C exemplarily shows a schematic cross-sectional view of the first stacked film layer group.

[0050] FIG2D exemplarily shows a schematic cross-sectional view of a second stacked film layer group.

[0051] FIG2E exemplarily shows an enlarged structural diagram of area N in FIG2A .

[0052] FIG. 3 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0053] FIG. 4 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0054] FIG. 5 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0055] FIG. 6 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0056] FIG7 schematically shows a flow chart of a method for preparing a display substrate according to an embodiment of the present disclosure.

[0057] 8A-8P schematically illustrate a formation process diagram of a display substrate provided according to an embodiment of the present disclosure.

[0058] 9A-9R schematically illustrate another forming process of a display substrate provided according to an embodiment of the present disclosure.

[0059] It should be noted that, for the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the sizes of layers, structures or regions may be enlarged or reduced, that is, these drawings are not drawn according to the actual scale. DETAILED DESCRIPTION

[0060] In the following description, for the purpose of explanation, many specific details are set forth to provide a comprehensive understanding of the various exemplary embodiments. However, it is apparent that the various exemplary embodiments can be implemented without these specific details or with one or more equivalent arrangements. In other cases, well-known structures and devices are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. In addition, the various exemplary embodiments can be different, but not necessarily exclusive. For example, the specific shape, configuration, and characteristics of the exemplary embodiment can be used or implemented in another exemplary embodiment without departing from the inventive concept.

[0061] In the accompanying drawings, the sizes and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. Thus, the sizes and relative sizes of the individual elements are not necessarily limited to those shown in the drawings. When the exemplary embodiments can be implemented differently, the specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent the same elements.

[0062] When an element is described as being "on" another element, "connected to" another element, or "coupled to" another element, the element may be directly on, directly connected to, or directly coupled to another element, or there may be an intermediate element. However, when an element is described as being "directly on" another element, "directly connected to," or "directly coupled to," another element, there is no intermediate element. Other terms and / or expressions used to describe the relationship between elements should be interpreted in a similar manner, for example, "between" versus "directly between," "adjacent" versus "directly adjacent," or "on" versus "directly on," etc. In addition, the term "connected" may refer to a physical connection, an electrical connection, a communication connection, and / or a fluid connection. In addition, the X-axis, the Y-axis, and the Z-axis are not limited to the three axes of a rectangular coordinate system, and may be interpreted in a broader sense. For example, the X-axis, the Y-axis, and the Z-axis may be perpendicular to each other, or may represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” may be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as XYZ, XY, YZ, and XZ. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0063] It should be understood that although the terms first, second, etc. may be used herein to describe different elements, these elements should not be limited by these terms. These terms are merely used to distinguish one element from another. For example, a first element may be named a second element, and similarly, a second element may be named a first element without departing from the scope of the exemplary embodiments.

[0064] In silicon-based OLED microdisplays, color screen display is usually achieved by superimposing a color filter layer on a white light emitting device. Since the organic light emitting material in the light emitting device is sensitive to temperature, in order to avoid the high temperature process affecting the luminous performance of the light emitting device, a low temperature color glue process is required to form a color filter layer on the light emitting device, and the preparation process is complicated. In addition, the light emitting device adopts a stacked (Tandem) device, and a charge generation layer (CGL) is provided in the Tandem device. The resistivity of the CGL layer is low and it is easy to cause crosstalk between adjacent sub-pixels. Therefore, a partition structure is required to separate the CGL layers in adjacent light emitting devices. However, at the partition structure, the cathode will form a sharp-angle structure. The sharp-angle structure has the risk of puncturing the film layer below and causing a short circuit between the cathode and the CGL layer. The short circuit between the cathode and the CGL layer will cause leakage problems, which in turn causes abnormal low grayscale blue light display.

[0065] Fig. 1 schematically shows a plan view of a display substrate according to an embodiment of the present disclosure. Fig. 2A schematically shows a cross-sectional view taken along line AA' in Fig. 1 .

[0066] 1 , the display substrate includes a base substrate 100 and a plurality of light-emitting devices (EL) arranged in an array on the base substrate 100. Referring to FIG2A , the light-emitting device EL includes a first electrode portion 210, a light-emitting functional portion 220, and a second electrode portion 230. The first electrode portion 210 is located on the base substrate 100, the light-emitting functional portion 220 is located on a side of the first electrode portion 210 away from the base substrate 100, and the second electrode portion 230 is located on a side of the light-emitting functional portion 220 away from the base substrate 100.

[0067] Referring to Figure 2A, the display substrate further includes a plurality of partitions 300 and a first encapsulation layer 400. The plurality of partitions 300 are located on the base substrate 100, with at least one partition 300 located between two adjacent light-emitting devices EL. Specifically, in two adjacent light-emitting devices EL, at least one partition 300 is located between two adjacent light-emitting functional portions 220, and at least one partition 300 is located between two adjacent second electrode portions 230. This means that each film layer in the two adjacent light-emitting devices EL is separated by the partitions 300, and each light-emitting device EL is independent of one another. Therefore, when the second electrode portions 230 in two adjacent light-emitting devices EL are separated into two independent parts by the partitions 300, the second electrode portions 230 no longer pierce the light-emitting functional portion 220 at the partitions 300, thereby short-circuiting with the film layers in the light-emitting functional portion 220 and causing leakage.

[0068] The first encapsulation layer 400 is located on the side of the light-emitting device EL away from the base substrate 100. The first encapsulation layer 400 is divided into a plurality of encapsulation sections 410 by a plurality of partitions 300. At least one partition 300 is located between two adjacent encapsulation sections 410. Each encapsulation section 410 covers a respective light-emitting device EL, and the orthographic projection of an encapsulation section 410 on the base substrate 100 covers the orthographic projection of the light-emitting device EL on the base substrate 100. In other words, each light-emitting device EL is independently encapsulated by a corresponding encapsulation section 410. Compared to a full-surface encapsulation structure that encapsulates all light-emitting devices EL together, this independent encapsulation structure offers superior encapsulation performance and reliability. In particular, even if an encapsulation section 410 of a light-emitting device EL fails, it will not affect the encapsulation performance of the encapsulation sections 410 of other light-emitting devices EL.

[0069] For example, the base substrate 100 may be a silicon-based substrate. Because the semiconductor manufacturing process used for silicon-based substrates is mature, the performance is stable, and they have small size and precision, they are advantageous for manufacturing micro-display devices. Of course, the embodiments of the present disclosure include but are not limited to these, and the base substrate 100 may also be other types of drive substrates.

[0070] For example, for each light-emitting device EL, the first electrode portion 210 includes a metal electrode portion and a transparent electrode portion stacked in a direction perpendicular to the first surface 101 of the base substrate 100, with the transparent electrode portion covering the metal electrode portion. Exemplarily, the metal electrode portion has a Ti / Al / Ti / stacked structure. That is, the metal electrode portion includes a titanium layer, an aluminum layer, and a titanium layer stacked on the base substrate 100. Exemplarily, the material of the transparent electrode portion is a transparent conductive material, such as ITO, IZO, etc. Exemplarily, the first electrode portion 210 has a Ti / Al / Ti / ITO stacked structure.

[0071] For example, the second electrode portion 230 is made of a transparent conductive material, such as ITO, IZO, etc.

[0072] According to some exemplary embodiments, the light-emitting device EL may be a single-layer organic light-emitting diode device or a tandem organic light-emitting diode (Tandem OLED) device. A tandem OLED device is formed by stacking multiple individual OLED light-emitting structures in series using one or more charge generation layers. A tandem OLED device may include two, three, or more light-emitting structures. The number of light-emitting structures is closely related to the efficiency and lifespan of the tandem OLED device. Through stacking technology, the efficiency of the OLED device can be further improved, which is beneficial for achieving high-brightness display in OLED display panels and also helps to increase the lifespan of OLED display panels.

[0073] FIG. 2B exemplarily shows an enlarged structural diagram of the region M in FIG. 2A .

[0074] For example, the light-emitting device EL is a dual-layer OLED device. As shown in FIG2B , the light-emitting functional portion 220 includes: a first stacked film layer group T1 located on the side of the first electrode portion 210 away from the substrate 100 100; a charge generation portion 222 disposed on the side of the first stacked film layer group T1 away from the substrate 100; and a second stacked film layer group T2 disposed on the side of the charge generation portion 222 away from the substrate 100. The charge generation portion 222 connects the first stacked film layer group T1 and the second stacked film layer group T2, so that excitons emit twice as many excitons under the action of an electric field, thereby achieving more than double the photoelectric conversion efficiency. Referring to FIG2A , at least one partition 300 is located between two adjacent charge generation portions 222. This means that the charge generation portions 222 of two adjacent light-emitting devices EL are separated by the partition 300, thereby preventing crosstalk between adjacent sub-pixels caused by lateral leakage current from the charge generation portion 222.

[0075] FIG2C exemplarily shows a schematic cross-sectional view of the first stacked film layer group.

[0076] For example, referring to Figure 2C, the first stacked film layer group T1 includes: a first hole injection portion 221a arranged on the side of the first electrode portion 210 away from the base substrate 100; a first hole transport portion 221b arranged on the side of the first hole injection portion 221a away from the base substrate 100; a first electron blocking portion 221c arranged on the side of the first hole transport portion 221b away from the base substrate 100; a first light-emitting portion 221 arranged on the side of the first electron blocking portion 221c away from the base substrate 100; a first hole blocking portion 221d arranged on the side of the first light-emitting portion 221 away from the base substrate 100; a first electron transport portion 221e arranged on the side of the first hole blocking portion 221d away from the base substrate 100; and a first electron injection portion 221f arranged on the side of the first electron transport portion 221e away from the base substrate 100.

[0077] FIG2D exemplarily shows a schematic cross-sectional view of a second stacked film layer group.

[0078] For example, referring to Figure 2D, the second stacked film layer group T2 includes: a second hole injection portion 223a arranged on the side of the first electrode portion 210 away from the substrate 100; a second hole transport portion 223b arranged on the side of the second hole injection portion 223a away from the substrate 100; a second electron blocking portion 223c arranged on the side of the second hole transport portion 223b away from the substrate 100; a second light-emitting portion 223 arranged on the side of the second electron blocking portion 223c away from the substrate 100; a second hole blocking portion 223d arranged on the side of the second light-emitting portion 223 away from the substrate 100; a second electron transport portion 223e arranged on the side of the second hole blocking portion 223d away from the substrate 100; and a second electron injection portion 223f arranged on the side of the second electron transport portion 223e away from the substrate 100.

[0079] According to some exemplary embodiments, referring to FIG. 2A , the encapsulation portion 410 extends continuously from the surface of the light-emitting device EL to the side surface of the partition portion 300, and the encapsulation portion 410 covers at least a portion of the side surface of the partition portion 300. By further extending the encapsulation portion 410 to the side surface of the partition portion 300, the path for external water and oxygen to intrude into the light-emitting device EL is lengthened, thereby effectively improving the barrier effect of the partition portion 300 against external water and oxygen.

[0080] According to some exemplary embodiments, referring to FIG. 2A , the partition portion 300 includes a first partition sub-portion 310 and a second partition sub-portion 320. The second partition sub-portion 320 is located on a side of the first partition sub-portion 310 away from the base substrate 100. Along a direction parallel to the first surface 101 of the base substrate 100, the edge of the second partition sub-portion 320 protrudes beyond the edge of the first partition sub-portion 310. In other words, the first partition sub-portion 310 and the second partition sub-portion 320 form an undercut structure, which effectively isolates the light-emitting functional portion 220 and the second electrode portion 230 formed by the evaporation process.

[0081] According to some exemplary embodiments, to facilitate forming the partition portion 300 having an undercut structure, the first partition sub-portion 310 and the second partition sub-portion 320 are each formed of materials having different etching rates. Specifically, the etching rate of the material of the first partition sub-portion 310 is greater than the etching rate of the material of the second partition sub-portion 320. This allows the edge of the second partition sub-portion 320 to protrude beyond the edge of the first partition sub-portion 310 through a single patterning process. For example, the material of the first partition sub-portion 310 may be silicon nitride, and the material of the second partition sub-portion 320 may be silicon oxide.

[0082] According to some exemplary embodiments, referring to FIG2A , the encapsulation portion 410 extends from the surface of the light-emitting device EL to the side 310a where the first partition sub-portion 310 intersects with the substrate 100, and then extends from the side where the first partition sub-portion 310 intersects with the substrate 100 to the side 320a where the second partition sub-portion 320 is opposite to the substrate 100, that is, the encapsulation portion 410 covers the side 310a where the first partition sub-portion 310 intersects with the substrate 100 and the side 320a where the second partition sub-portion 320 is opposite to the substrate 100.

[0083] FIG. 2E exemplarily shows an enlarged structural diagram of region N in FIG. 2A .

[0084] According to some exemplary embodiments, with reference to FIG2A and FIG2E , the encapsulation portion 410 includes: a first encapsulation sub-portion 411 located on a side of the light-emitting device EL away from the substrate 100; and a second encapsulation sub-portion 412 located on a side of the first encapsulation sub-portion 411 away from the substrate 100. The first encapsulation sub-portion 411 is made of silicon oxide and is formed by a chemical vapor deposition (CVD) process. Due to factors such as the thin film deposition process, the first encapsulation sub-portions of two adjacent light-emitting devices EL are separated by the partition portion 300, and the first encapsulation sub-portion 411 substantially does not cover the side surfaces of the partition portion 300. The second encapsulation sub-section 412 is made of aluminum oxide and formed via an atomic layer deposition (ALD) process. Because the aluminum oxide layer formed by the ALD process has a highly conformal coverage, the second encapsulation sub-section 412 extends to cover the sidewalls of the partition portion 300. Specifically, the second encapsulation sub-section 412 extends to the side surface 310a where the first partition sub-section 310 intersects with the base substrate 100, and then extends from the side surface where the first partition sub-section 310 intersects with the base substrate 100 to the side surface 320a of the second partition sub-section 320 opposite the base substrate 100. Two adjacent second encapsulation sub-sections may even be connected on a plane of the partition portion 300 that is away from the base substrate 100. However, to form independent encapsulation sections 410, the second encapsulation sub-section film material deposited on the plane of the partition portion 300 that is away from the base substrate 100 is etched away via a patterning process.

[0085] According to some exemplary embodiments, referring to FIG. 2A , the display substrate further includes a second encapsulation layer 500, which covers the first encapsulation layer 400 and each partition portion 300. The second encapsulation layer 500 is further away from the plane of the base substrate 100 than the partition portion 300 is from the plane of the base substrate 100. In addition to independently encapsulating each light-emitting device EL using the encapsulation portion 410, a second encapsulation layer 500 is further provided to encapsulate each light-emitting device EL as a whole. The composite encapsulation structure composed of multiple encapsulation portions 410 arranged at intervals and the second encapsulation layer 500 continuously distributed across the entire surface has excellent encapsulation reliability. Furthermore, the second encapsulation layer 500 fills the recessed portion of the lower film layer and also serves a certain flattening function.

[0086] For example, the material of the second encapsulation layer 500 may be at least one of silicon oxide and silicon nitride. Exemplarily, the material of the second encapsulation layer 500 is silicon nitride.

[0087] According to some exemplary embodiments, referring to FIG1 , the plurality of light-emitting devices EL include a plurality of first light-emitting devices EL1, a plurality of second light-emitting devices EL2, and a plurality of third light-emitting devices EL3. The first light-emitting devices EL1 emit light of a first color, the second light-emitting devices EL2 emit light of a second color, and the third light-emitting devices EL3 emit light of a third color. For example, the first light-emitting devices EL1 emit red light, the second light-emitting devices EL2 emit green light, and the third light-emitting devices EL3 emit blue light. This eliminates the need to form a color filter layer on the light-emitting devices EL, simplifying the display substrate manufacturing process.

[0088] According to some exemplary embodiments, referring to FIG. 2A , the plurality of light-emitting devices EL include a plurality of first light-emitting devices EL1, a plurality of second light-emitting devices EL2, and a plurality of third light-emitting devices EL3. The plurality of encapsulation portions 410 include a plurality of first encapsulation portions 411, a plurality of second encapsulation portions 412, and a plurality of third encapsulation portions 413. The first encapsulation portions 411 cover the first light-emitting devices EL1, the second encapsulation portions 412 cover the second light-emitting devices EL2, and the third encapsulation portions 413 cover the third light-emitting devices EL3. The thickness of the first encapsulation portion 411 is greater than that of the second encapsulation portion 412, and the thickness of the second encapsulation portion 412 is greater than that of the third encapsulation portion 413.

[0089] It should be understood that during the actual fabrication of the display substrate, because the light-emitting functional portions of the first, second, and third light-emitting devices EL1, EL2, and EL3 are made of different materials, three film-forming and etching processes are required to sequentially form the first, second, and third light-emitting functional portions 221, 222, and 223. For example, if the first light-emitting functional portion 221 is formed first, followed by the second light-emitting functional portion 222, and finally the third light-emitting functional portion 223, the first light-emitting functional portion 221 will inevitably be etched and damaged during the etching process to form the second light-emitting functional portion 222. To avoid this problem, a first encapsulation portion 411 can be formed on the first light-emitting functional portion 221 before forming the second light-emitting functional portion 222. Similarly, a second encapsulation portion 412 can be formed on the second light-emitting functional portion 222 before forming the third light-emitting functional portion 223. In other words, the first encapsulation portion 411 and the second encapsulation portion 412 can also serve as etch stops for the first and second light-emitting functional portions 221 and 222, respectively.

[0090] Furthermore, since the first light-emitting device EL1 is formed first, the first encapsulation portion 411 is etched during both the etching process to form the second light-emitting functional portion 222 and the etching process to form the third light-emitting functional portion 223. Furthermore, the second encapsulation portion 412 is only etched during the etching process to form the third light-emitting functional portion 223, while the third encapsulation portion 413 is not etched. Therefore, the thickness of the first encapsulation portion 411 is set to be greater than that of the second encapsulation portion 412, and the thickness of the second encapsulation portion 412 is set to be greater than that of the third encapsulation portion 413. This effectively acts as an etching barrier for the first and second light-emitting functional portions 221, 222, thereby preventing etching damage to the first and second light-emitting functional portions 221, 222 and causing display problems.

[0091] According to some exemplary embodiments, on the basis that the thickness of the first encapsulation portion 411 is greater than the thickness of the second encapsulation portion 412, and the thickness of the second encapsulation portion 412 is greater than the thickness of the third encapsulation portion 413, the thickness of the portion of the second encapsulation layer 500 located on the first encapsulation portion 411 is further made smaller than the thickness of the portion of the second encapsulation layer 500 located on the second encapsulation portion 412, and the thickness of the portion of the second encapsulation layer 500 located on the second encapsulation portion 412 is further made smaller than the thickness of the portion of the second encapsulation layer 500 located on the third encapsulation portion 413. This makes the thicknesses of the encapsulation film layers on the first light-emitting device EL1, the second light-emitting device EL2, and the third light-emitting device EL3, that is, the first encapsulation layer and the second encapsulation layer, similar, thereby improving the uniformity of the display effect.

[0092] FIG. 3 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0093] 3 , the first light emitting device EL1 includes a first light emitting functional portion 221, the second light emitting device EL2 includes a second light emitting functional portion 222, and the third light emitting device EL3 includes a third light emitting functional portion 223. The plurality of encapsulation portions 410 include a plurality of first encapsulation portions 411, a plurality of second encapsulation portions 412, and a plurality of third encapsulation portions 413. The first encapsulation portions 411 cover the first light emitting device EL1, the second encapsulation portions 412 cover the second light emitting device EL2, and the third encapsulation portions 413 cover the third light emitting device EL3.

[0094] The display substrate further includes a second light-emitting functional structure 222a located on a side of the first encapsulation portion 411 away from the first light-emitting device EL1, and a third light-emitting functional structure 223a located on a side of the second light-emitting functional structure 222a away from the first light-emitting device. The display substrate further includes a third light-emitting functional structure 223a located on a side of the second encapsulation portion 412 away from the second light-emitting device EL2. The second light-emitting functional structure 222a and the second light-emitting functional portion 222 are located on the same layer, and the third light-emitting functional structure 223a and the third light-emitting functional portion 223 are located on the same layer.

[0095] That is, after the first light-emitting device EL1 and the first packaging portion 411 are manufactured, during the process of forming the second light-emitting device EL2's second light-functional portion 222, the second electrode portion 230, and the second packaging portion 412, corresponding structures are also formed on the first light-emitting device EL1. Specifically, these structures include the second light-emitting functional structure 222a located on the first packaging portion 411, the second electrode structure 230a located on the second light-emitting functional structure 222a, and the packaging structure 410a located on the second electrode structure 230a. The second light-emitting functional structure 222a and the second light-emitting functional portion 222 are located on the same layer, the second electrode structure 230a and the second electrode portion 230 of the second light-emitting device are located on the same layer, and the packaging structure 410a and the second packaging portion 412 are located on the same layer.

[0096] Furthermore, the second light-emitting functional structure 222a, the second electrode structure 230a, and the encapsulation structure 410a are retained on the first light-emitting device EL1 to avoid damage to the underlying first encapsulation portion 411 and the first light-emitting device EL1 caused by etching of the aforementioned structures. It should be understood that the aforementioned structures are separated from the first light-emitting device EL1 by the first encapsulation portion 411, and therefore do not affect the light-emitting effect of the first light-emitting device EL1. Furthermore, the retained second light-emitting functional structure 222a, the second electrode structure 230a, and the encapsulation structure 410a further enhance the encapsulation effect of the first light-emitting device EL1.

[0097] Similarly, after the second light-emitting device EL2 and the second packaging portion 412 located on the second light-emitting device EL2 are completed, in the process of further forming the third optical function portion 223, the second electrode portion 230 and the third packaging portion 413 located on the third light-emitting device EL3 in the third light-emitting device EL3, corresponding structures will also be formed on the first light-emitting device EL1 and the second light-emitting device EL2.

[0098] Specifically, the structure formed on the first light-emitting device EL1 includes a third light-emitting functional structure 223a located on the encapsulation structure 410a, a second electrode structure 230a located on the third light-emitting functional structure 223a, and an encapsulation structure 410a located on the second electrode structure 230a. The structure formed on the second light-emitting device EL2 includes a third light-emitting functional structure 222a located on the second light-emitting device EL2, a second electrode structure 230a located on the second light-emitting functional structure 222a, and an encapsulation structure 410a located on the second electrode structure 230a. The aforementioned third light-emitting functional structure 222a, second electrode structure 230a, and encapsulation structure 410a also remain on the first and second light-emitting devices EL1 and EL2. The third light-emitting functional structure 223a and the third light-emitting functional portion 223 are located on the same layer, the second electrode structure 230a and the second electrode portion 230 of the third light-emitting device EL3 are located on the same layer, and the encapsulation structure 410a and the third encapsulation portion 413 are located on the same layer.

[0099] According to some exemplary embodiments, referring to FIG2A , the display substrate further includes a plurality of second electrode overlapping portions 600 located between the base substrate 100 and the partition portion 300 , two adjacent second electrode portions 230 are located on both sides of at least one partition portion 300 and are electrically connected through a second electrode overlapping portion 600 , and the plurality of second electrode overlapping portions 600 electrically connect the respective second electrode portions 230 into a whole so as to connect a constant second power supply signal to the respective second electrode portions 230 .

[0100] According to some exemplary embodiments, referring to FIG. 2A , the second electrode overlapping portion 600 is spaced apart from the adjacent light emitting functional portion 220 to avoid leakage caused by the second electrode overlapping portion 600 being connected to each functional portion in the light emitting functional portion 220 .

[0101] For example, the second electrode overlapping portion 600 is a Ti / Al / Ti / ITO stacked structure.

[0102] According to some exemplary embodiments, referring to Figure 2A, the display substrate further includes a pixel defining layer 700 located between the base substrate 100 and the partition portion 300, the pixel defining layer 700 has a plurality of openings K, the openings K expose at least a portion of the first electrode portion 210, the light-emitting functional portion 220 overlaps with the first electrode portion 210 through the openings K, and the pixel defining layer 700 is further away from the plane of the base substrate 100 than the first electrode portion 210 is away from the plane of the base substrate 100.

[0103] For example, the material of the pixel defining layer 700 is selected from at least one of silicon nitride and silicon oxide. Exemplarily, the pixel defining layer 700 is a SiO film layer.

[0104] According to some exemplary embodiments, referring to FIG2A , a first distance D1 is defined between a plane of the second partitioning sub-portion 320 close to the base substrate 100 and a plane of the pixel defining layer 700 away from the base substrate 100. The first distance D1 is greater than the sum of the thicknesses of the light-emitting functional portion 220 and the second electrode portion 230. Setting the first distance D1 ensures that the two light-emitting functional portions 220 in two adjacent light-emitting devices EL are partitioned at the partitioning portion 300, and that the two second electrode portions 230 in two adjacent light-emitting devices EL are partitioned at the partitioning portion 300.

[0105] According to some exemplary embodiments, referring to FIG. 2A , the edge of the second partitioning sub-portion 320 protrudes from the edge of the first partitioning sub-portion 310 by a second distance D2, where the second distance D2:first distance D1 ≥ 1:2. To ensure that the partitioning portion 300 can effectively separate the adjacent light-emitting functional portion 220 from the adjacent second electrode portion 230, while allowing the encapsulation portion 410 to extend and cover the side surfaces of the partitioning portion 300, the ratio of the second distance D2 to the first distance D1 is set to be greater than or equal to one-half.

[0106] According to some exemplary embodiments, referring to FIG2A , the orthographic projection of the opening K on the base substrate 100 is spaced apart from the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100. That is, a certain distance exists between the edge of the first electrode portion 210 exposed by the opening K and the edge of the second electrode overlapping portion 600 to prevent the edge of the second electrode overlapping portion 600 from being short-circuited with the first electrode portion 210 through the opening K due to fluctuations in the manufacturing process.

[0107] According to some exemplary embodiments, referring to FIG. 2A , the orthographic projection of the opening K on the base substrate 100 and the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100 are separated by a third distance D3, where the second distance D2 is greater than the third distance D3. By setting the second distance D2 greater than the third distance D3, the partitioning effect of the partition portion 300 is enhanced.

[0108] According to some exemplary embodiments, referring to FIG. 2A , the second electrode overlapping portion 600 is located between the pixel defining layer 700 and the partition portion 300 . The orthographic projection of the first partition sub-portion 310 on the base substrate 100 is located within the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100 . The orthographic projection of the second electrode overlapping portion 600 on the base substrate 100 is also located within the orthographic projection of the second partition sub-portion 320 on the base substrate 100 . In other words, the edge of the second partition sub-portion 320 extends further outward than the edge of the second electrode overlapping portion 600 . Furthermore, the second electrode overlapping portion 600 protrudes beyond the edge of the first partition sub-portion 310 . This arrangement allows the second electrode portion 230 to effectively overlap with the second electrode overlapping portion 600 after the partition portion 300 is used to separate the adjacent second electrode portion 230 . This also helps reduce the space required for the partition portion 300 and the second electrode overlapping portion 600, thereby improving the display resolution of the display substrate.

[0109] According to some exemplary embodiments, referring to FIG. 2A , a plane of the second electrode overlapping portion 600 close to the base substrate 100 is further away from the base substrate 100 than a plane of the first electrode portion 210 away from the base substrate 100, thereby facilitating overlapping of the second electrode portion 230 with the second electrode overlapping portion 600. A fourth distance D4 is defined between a plane of the second electrode overlapping portion 600 close to the base substrate 100 and a plane of the first electrode portion 210 away from the base substrate 100. The fourth distance D4 is set to be greater than or equal to 200 angstroms.

[0110] FIG. 4 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0111] According to some exemplary embodiments, referring to FIG. 4 , the display substrate further includes an insulating protective portion 800 , which covers the side surfaces of the second electrode overlapping portion 600 . The second electrode portion 230 overlaps the second electrode overlapping portion 600 away from the plane of the base substrate 100 . Providing the insulating protective portion 800 on the side surfaces of the second electrode overlapping portion 600 effectively prevents the edge of the second electrode overlapping portion 600 from short-circuiting with the first electrode portion 210 through the opening K. Furthermore, because the side surfaces of the second electrode overlapping portion 600 are covered by the insulating protective portion 800 , the distance between the orthographic projection of the opening K on the base substrate 100 and the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100, i.e., the third distance D3, can be set to be smaller, thereby meeting the high-resolution requirements of the display substrate.

[0112] For example, the material of the insulating protection portion 800 may be at least one of silicon oxide and silicon nitride. Exemplarily, the material of the insulating protection portion 800 is silicon oxide.

[0113] FIG. 5 schematically shows another cross-sectional view taken along line AA′ of FIG. 1 .

[0114] According to some exemplary embodiments, referring to FIG. 5 , the pixel defining layer 700 has a groove G, and at least a portion of the second electrode overlapping portion 600 is embedded within the groove G. Furthermore, the orthographic projection of the first partitioning sub-portion 310 on the base substrate 100 is located within the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100, and the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100 is located within the orthographic projection of the second partitioning sub-portion 320 on the base substrate 100. In other words, the edge of the second partitioning sub-portion 320 extends further outward than the edge of the second electrode overlapping portion 600, and the second electrode overlapping portion 600 protrudes beyond the edge of the first partitioning sub-portion 310. This arrangement allows the second electrode portion 230 to effectively overlap with the second electrode overlapping portion 600 after the partitioning portion 300 is used to separate the adjacent second electrode portion 230. This also helps reduce the space required for the partitioning portion 300 and the second electrode overlapping portion 600, thereby improving the display resolution of the display substrate.

[0115] According to some exemplary embodiments, referring to FIG. 5 , the depth of the groove G is less than the thickness of the second electrode overlapping portion 600, and a portion of the second electrode overlapping portion 600 is embedded within the groove G. The plane of the second electrode overlapping portion 600 close to the base substrate 100 is located between the plane of the first electrode portion 210 away from the base substrate 100 and the plane of the first electrode portion 210 close to the base substrate 100. Furthermore, the plane of the second electrode overlapping portion 600 away from the base substrate 100 is further away from the base substrate 100 than the plane of the first electrode portion 210 away from the base substrate 100. By embedding a portion of the second electrode overlapping portion 600 within the groove G, the height of the second electrode overlapping portion 600 relative to the base substrate 100 is changed, thereby changing the overlapping position of the second electrode overlapping portion 600 and the second electrode portion 230, thereby matching the thickness of the light-emitting functional portion 220. The depth of the groove G depends on the thickness of the light-emitting functional part 220 . The depth of the groove G can be adjusted to meet different thickness requirements of the light-emitting functional part 220 , thereby realizing the development of a high-efficiency and high-strength microcavity light-emitting device.

[0116] According to some exemplary embodiments, referring to FIG. 5 , the display substrate further includes an insulating protective portion 800. The insulating protective portion 800 and the pixel defining layer 700 jointly cover the side of the second electrode overlapping portion 600. That is, a portion of the side of the second electrode overlapping portion 600 that is close to the base substrate 100 is covered by the pixel defining layer 700, while a portion of the side of the second electrode overlapping portion 600 that is away from the base substrate 100 is covered by the insulating protective portion 800. The second electrode portion 230 overlaps the plane of the second electrode overlapping portion 600 that is away from the base substrate 100. By using the insulating protective portion 800 and the pixel defining layer 700 to cover the side of the second electrode overlapping portion 600, the problem of the edge of the second electrode overlapping portion 600 being short-circuited with the first electrode portion 210 through the opening K can be effectively avoided. Furthermore, since the side surfaces of the second electrode overlapping portion 600 are covered with the insulating protection portion 800 and the pixel defining layer 700, the spacing distance between the orthographic projection of the opening K on the base substrate 100 and the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100 can be set to be smaller, thereby meeting the high-resolution requirements of the display substrate.

[0117] FIG. 6 schematically shows another cross-sectional view taken along line AA′ in FIG. 1 .

[0118] According to some exemplary embodiments, referring to FIG6 , the groove G exposes a portion of the base substrate 100, that is, the groove G penetrates the pixel defining layer 700, the second electrode overlapping portion 600 directly contacts the base substrate 100, and the second electrode overlapping portion 600 is closer to the base substrate 100 than the pixel defining layer 700 is to the base substrate 100. With this arrangement, the side surfaces of the second electrode overlapping portion 600 are completely covered by the pixel defining layer 700, eliminating the need for an additional insulating protective portion 800 while achieving the same effect, thereby simplifying the manufacturing process of the display substrate.

[0119] According to some exemplary embodiments, the second electrode overlapping portion 600 and the first electrode portion 210 are located in the same layer.

[0120] It should be understood that the term "located in the same layer" as used herein refers to two (or more) structures formed by the same deposition process and patterned by the same patterning process, and these structures may be made of the same or different materials. For example, the precursor materials of multiple structures in the same layer may be the same, but the resulting materials may be the same or different.

[0121] FIG7 schematically shows a flow chart of a method for preparing a display substrate according to an embodiment of the present disclosure.

[0122] As shown in FIG. 7 , the method for preparing a display substrate according to an embodiment of the present disclosure includes steps S100 to S400 .

[0123] In step S100 , a base substrate is provided.

[0124] In step S200, a plurality of light-emitting devices are formed on a base substrate, and the plurality of light-emitting devices are arranged in an array. The light-emitting devices include a first electrode portion located on the base substrate, a light-emitting functional portion located on a side of the first electrode portion away from the base substrate, and a second electrode portion located on a side of the light-emitting functional portion away from the base substrate.

[0125] In step S300 , a plurality of partitions are formed on a base substrate, with at least one partition between two adjacent light emitting devices.

[0126] In step S400, a first encapsulation layer is formed on a side of each light-emitting device away from the base substrate. The first encapsulation layer is divided into multiple encapsulation parts by multiple partition parts. There is at least one partition part between two adjacent encapsulation parts. Each encapsulation part covers each light-emitting device respectively. The orthographic projection of one encapsulation part on the base substrate covers the orthographic projection of one light-emitting device on the base substrate.

[0127] 8A-7P schematically illustrate a formation process diagram of a display substrate provided according to an embodiment of the present disclosure.

[0128] 8A , a base substrate 100 is provided, a first electrode material layer L1 is formed on the base substrate 100 , and a first photoresist layer PR1 is formed on the first electrode material layer L1 .

[0129] For example, the substrate 100 may be a silicon-based substrate. Because silicon-based substrates utilize mature semiconductor manufacturing processes, have stable performance, and are relatively small and precise, they are advantageous for fabricating micro-display devices. Of course, the embodiments of the present disclosure include but are not limited to these, and the substrate 100 may also utilize other types of drive substrates.

[0130] For example, the first electrode material layer L1 is formed by a physical vapor deposition process, and the first electrode material layer L1 is a stacked film layer of Ti / Al / Ti / ITO.

[0131] 8B , under the shielding of the first photoresist layer PR1 , the first electrode material layer L1 is etched to form a plurality of first electrode portions 210 arranged at intervals, and the first photoresist layer PR1 is stripped and removed.

[0132] For example, the process of etching the first electrode material layer L1 is a dry etching process.

[0133] Referring to FIG8C , a pixel-defining material layer L2 is formed on the first electrode portion 210 and the base substrate 100. The pixel-defining material layer L2 includes a first portion L2a located on the first electrode portion 210 and a second portion L2b located on the base substrate 100. The first portion L2a is further away from the base substrate 100 than the second portion L2b. The second portion L2b is further away from the base substrate 100 than the first electrode portion 210. A second photoresist layer PR2 is then formed on the pixel-defining material layer L2, covering the second portion L2b and exposing the first portion L2a.

[0134] For example, the material of the pixel defining material layer L2 is silicon oxide.

[0135] 8D , under the shielding of the second photoresist layer PR2, the first portion L2a in the pixel defining material layer L2 is etched until the plane where the first portion L2a is away from the base substrate 100 is flush with the plane where the second portion L2b is away from the base substrate 100, thereby obtaining a pixel defining intermediate layer L21, and then the second photoresist layer PR2 is stripped off and removed.

[0136] 8E , a second electrode bonding material layer L3 is formed on the pixel defining intermediate layer L21 , and a third photoresist layer PR3 is formed on the second electrode bonding material layer L3 .

[0137] For example, the second electrode bonding material layer L3 is a stacked film layer of Ti / Al / Ti / ITO.

[0138] 8E and 8F , under the shielding of the third photoresist layer PR3, the second electrode overlapping material layer L3 is etched to obtain a plurality of second electrode overlapping portions 600. The third photoresist layer PR3 is then stripped and removed.

[0139] For example, the process of etching the second electrode bonding material layer L3 may be a dry etching process.

[0140] Referring to Figure 8G, a partition material layer L4 is formed on the pixel defining intermediate layer L21 and the second electrode overlapping portion 600. The partition material layer L4 includes a first partition material layer L41 and a second partition material layer L42 located on the side of the first partition material layer L41 away from the base substrate 100. A fourth photoresist layer PR4 is formed on the partition material layer. The orthographic projection of the fourth photoresist layer PR4 on the base substrate 100 covers the orthographic projection of the second electrode overlapping portion 600 on the base substrate 100.

[0141] For example, the material of the first partition material layer L41 is silicon nitride, and the material of the second partition material layer L42 is silicon oxide.

[0142] Referring to Figure 8H , under the shielding of the fourth photoresist layer PR4, the second barrier material layer L42, the first barrier material layer L41, and the pixel defining intermediate layer L21 are etched simultaneously. The second barrier material layer L42 is etched to form a plurality of second barrier sub-portions 320, and the first barrier material layer L41 is etched to form a plurality of first barrier sub-portions 310. The first barrier sub-portions 310 and the second barrier sub-portions 320 constitute the barrier portion 300. The pixel defining intermediate layer L21 is etched to form a plurality of openings K, thereby forming a pixel defining layer 700. The plurality of openings K in the pixel defining layer 700 each include at least a portion of the plurality of first electrode portions 210.

[0143] The plurality of openings K in the pixel defining layer 700 include a plurality of first openings K1, a plurality of second openings K2, and a plurality of third openings K3. The plurality of partitioning portions 300 enclose a plurality of first partitioning spaces R1, a plurality of second partitioning spaces R2, and a plurality of third partitioning spaces R3. The first partitioning spaces R1 expose the first openings K, the second partitioning spaces R2 expose the second openings K, and the third partitioning spaces R3 expose the third openings K.

[0144] The second partition sub-portion 320 and the first partition sub-portion 310 together constitute the partition portion 300. Since the material of the first partition material layer L41 is silicon nitride and the material of the second partition material layer L42 is silicon oxide, the etching rate of silicon nitride is greater than the etching rate of silicon oxide through the selection of the etching process gas, so that the portion of the second partition material layer L42 etched and removed is less than the portion of the first partition material layer L41 etched and removed, that is, in the formed partition portion 300, the edge of the second partition sub-portion 320 protrudes from the edge of the first partition sub-portion 310, and the partition portion 300 has a bottom cut structure.

[0145] For example, the process of etching the second partition material layer L42 , the first partition material layer L41 and the pixel defining intermediate layer L21 may be a dry etching process.

[0146] 8I , a first light-emitting functional material layer L51, a second electrode material layer L6, and a first encapsulation material layer L7 are sequentially formed on a base substrate 100 having partitions 300 formed thereon. Due to the presence of the partitions 300, the formed first light-emitting functional material layer L51 is disconnected at the partitions 300, thereby forming a plurality of first light-emitting functional portions 221 located between the partitions 300 and a first light-emitting functional portion to be removed located on the side of the partitions 300 away from the base substrate 100. Adjacent first light-emitting functional portions 221 are disconnected from the first light-emitting functional portion to be removed at the side of the partitions 300.

[0147] Similarly, the second electrode material layer L6 is disconnected at the partition portion 300 , thereby forming a plurality of second electrode portions 230 located in the region between the partition portions 300 and a second electrode portion 230 to be removed located on the side of the partition portion 300 away from the base substrate 100 . Adjacent second electrode portions 230 and the second electrode portion 230 to be removed are disconnected at the side of the partition portion 300 .

[0148] In addition, the first packaging material layer L7 continuously covers each second electrode portion 230 and the partition portion 300. Specifically, the portion of the first packaging material layer L7 located on the second electrode portion 230 is connected to the portion located on the side of the partition portion 300, and the portion of the first packaging material layer L7 located on the side of the partition portion 300 is connected to the portion located on the partition portion 300 away from the plane of the base substrate 100.

[0149] For example, the first light-emitting functional material layer L51 and the second electrode material layer L6 can be formed by an evaporation process. By adjusting the evaporation angles of the first light-emitting functional material layer L51 and the second electrode material layer L6, respectively, the first light-emitting functional portion 220 completely covers the first electrode portion 210 and is spaced apart from the adjacent second electrode overlapping portion 600, and the second electrode portion 230 completely covers the first light-emitting functional portion 220 and overlaps the adjacent second electrode overlapping portion 600.

[0150] For example, the first packaging material layer L7 includes a first packaging material sublayer and a second packaging material sublayer located on a side of the first packaging material sublayer away from the base substrate 100. The material of the first packaging material sublayer is silicon oxide, which is formed by a chemical vapor deposition (CVD) process. Due to the influence of factors such as the thin film deposition process, the first packaging material sublayer will be isolated by the partition portion 300, and the first packaging material sublayer basically does not cover the side of the partition portion 300. The material of the second packaging material sublayer is aluminum oxide, which is formed by an atomic layer deposition (ALD) process. Since the aluminum oxide layer formed by the atomic layer deposition process has a high conformal covering ability, the second packaging material sublayer is an integrated structure that continuously covers the first packaging material sublayer.

[0151] 8J , a fifth photoresist layer PR5 is formed within the first partition space R1. The fifth photoresist layer PR5 covers the first encapsulation material layer L7 within the first partition space R1 and exposes the first encapsulation material layer L7 within the second partition space R2 and the third partition space R3. Simultaneously, the fifth photoresist layer PR5 also exposes the first encapsulation material layer L7 on the side where the second partition sub-portion 320 intersects with the base substrate 100, as well as the first encapsulation material layer L7 on the side where the second partition sub-portion 320 intersects with the base substrate 100.

[0152] 8J and 8K , under the shielding of the fifth photoresist layer PR5, the first light-emitting functional material layer L51, the second electrode material layer L6, and the first packaging material layer L7 are etched. Specifically, the first light-emitting functional portion 220, the second electrode portion 230, and the first packaging material layer L7 located within the second partition space R2 are etched away; the first light-emitting functional portion 220, the second electrode portion 230, and the first packaging material layer L7 located within the third partition space R3 are etched away; the first light-emitting functional portion 220 and the second electrode portion 230 to be removed located on each second partition sub-portion 320 are etched away; the portion of the first packaging material layer L7 located on the side where the second partition sub-portion 320 intersects with the base substrate 100 is etched away; and the portion of the first packaging material layer L7 located on the plane of the second partition sub-portion 320 away from the base substrate 100 is etched away.

[0153] After etching is complete, the fifth photoresist layer PR5 is stripped and removed. The first light-emitting functional portion 220, the second electrode portion 230, and the connected first electrode portion 210, which remain within the first partition space R1 and are shielded by the fifth photoresist layer PR5, form the first light-emitting device EL1. The first light-emitting device EL1 emits light of the first color. The encapsulation portion 410, which remains within the first partition space R1, covers the first light-emitting device EL1 and extends continuously to the side of the first partition sub-portion 310 facing the base substrate 100 and the plane of the second partition sub-portion 320 facing the base substrate 100.

[0154] Referring to Figure 8L , a second light-emitting functional material layer L52, a second electrode material layer L6, and a first encapsulation material layer L7 are sequentially formed on the base substrate 100 having the first light-emitting device formed thereon. Due to the presence of the partition 300, the formed second light-emitting functional material layer L52 is disconnected at the partition 300, thereby forming multiple second light-emitting functional units 222 located in the regions between the partitions 300 and a first light-emitting functional unit to be removed located on the side of the partition 300 away from the base substrate 100. Adjacent first light-emitting functional units 222 are disconnected from the first light-emitting functional units to be removed at the side of the partition 300. Specifically, the first light-emitting functional unit 220 located within the first partition space R1 is formed on the encapsulation unit 410, while the first light-emitting functional unit 220 located within the second partition space R2 and the third partition space R3 is formed on the first electrode unit 210.

[0155] Similarly, the second electrode material layer L6 is disconnected at the partition portion 300 , thereby forming a plurality of second electrode portions 230 located in the region between the partition portions 300 and a second electrode portion 230 to be removed located on the side of the partition portion 300 away from the base substrate 100 . Adjacent second electrode portions 230 and the second electrode portion 230 to be removed are disconnected at the side of the partition portion 300 .

[0156] In addition, the first packaging material layer L7 continuously covers each second electrode portion 230 and the partition portion 300. Specifically, the portion of the first packaging material layer L7 located on the second electrode portion 230 is connected to the portion located on the side of the partition portion 300, and the portion of the first packaging material layer L7 located on the side of the partition portion 300 is connected to the portion located on the partition portion 300 away from the plane of the base substrate 100.

[0157] For example, the second light-emitting functional material layer L52 and the second electrode material layer L6 can be formed by an evaporation process. By adjusting the evaporation angles of the second light-emitting functional material layer L52 and the second electrode material layer L6, respectively, the second light-emitting functional portion 220 completely covers the first electrode portion 210 and is spaced apart from the adjacent second electrode overlapping portion 600, and the second electrode portion 230 completely covers the second light-emitting functional portion 220 and overlaps the adjacent second electrode overlapping portion 600.

[0158] For example, the first packaging material layer L7 includes a first packaging material sublayer and a second packaging material sublayer located on a side of the first packaging material sublayer away from the base substrate 100. The material of the first packaging material sublayer is silicon oxide, which is formed by a chemical vapor deposition (CVD) process. Due to the influence of factors such as the thin film deposition process, the first packaging material sublayer will be isolated by the partition portion 300, and the first packaging material sublayer basically does not cover the side of the partition portion 300. The material of the second packaging material sublayer is aluminum oxide, which is formed by an atomic layer deposition (ALD) process. Since the aluminum oxide layer formed by the atomic layer deposition process has a high conformal covering ability, the second packaging material sublayer is an integrated structure that continuously covers the first packaging material sublayer.

[0159] 8M , a sixth photoresist layer PR6 is formed within the second partition space R2. The sixth photoresist layer PR6 covers the first encapsulation material layer L7 within the second partition space R2, exposing the first encapsulation material layer L7 within the first partition space R1 and the third partition space R3. Simultaneously, the fifth photoresist layer PR5 also exposes the first encapsulation material layer L7 on the side where the second partition sub-portion 320 intersects with the base substrate 100, as well as the first encapsulation material layer L7 on the side where the second partition sub-portion 320 intersects with the base substrate 100.

[0160] 8M and 8N , under the shielding of the sixth photoresist layer PR6, the second light-emitting functional material layer L52, the second electrode material layer L6, and the first packaging material layer L7 are etched. Specifically, the second light-emitting functional portion 220, the second electrode portion 230, and the first packaging material layer L7 located within the first partition space R1 are etched away; the second light-emitting functional portion 220, the second electrode portion 230, and the first packaging material layer L7 located within the third partition space R3 are etched away; the second light-emitting functional portion 220 and the second electrode portion 230 to be removed located on each second partition sub-portion 320 are etched away; the portion of the first packaging material layer L7 located on the side where the second partition sub-portion 320 intersects with the base substrate 100 is etched away; and the portion of the first packaging material layer L7 located on the plane of the second partition sub-portion 320 away from the base substrate 100 is etched away.

[0161] After etching is complete, the sixth photoresist layer PR6 is stripped and removed. The second light-emitting functional portion 220, the second electrode portion 230, and the connected first electrode portion 210, which remain within the second partition space R2, shielded by the sixth photoresist layer PR6, form the second light-emitting device EL2. The second light-emitting device EL2 emits light of the second color. The encapsulation portion 410, which remains within the second partition space R2, covers the second light-emitting device EL2 and extends continuously to the side of the first partition sub-portion 310 facing the base substrate 100 and the plane of the second partition sub-portion 320 facing the base substrate 100.

[0162] Referring to Figure 80 , following a similar process to forming the first and second light-emitting devices, a third light-emitting functional portion 220, a second electrode portion 230, and an encapsulation portion 410 are formed within the third partition space R3. The third light-emitting functional portion 220, the second electrode portion 230, and the connected first electrode portion 210 form the third light-emitting device EL3, which emits light of a third color. The encapsulation portion 410 covers the third light-emitting device EL3 and extends continuously to the side of the first partition sub-portion 310 facing the base substrate 100 and the plane of the second partition sub-portion 320 facing the base substrate 100.

[0163] Referring to FIG8P , a second encapsulation layer 500 is formed on the side of the encapsulation portion 410 and the partition portion 300 away from the base substrate 100. The second encapsulation layer 500 covers each encapsulation portion 410 and each partition portion 300. The plane of the second encapsulation layer 500 away from the base substrate 100 is farther away from the base substrate 100 than the plane of the partition portion 300 away from the base substrate 100. At this point, the display substrate is fabricated.

[0164] 9A-8R schematically illustrate another formation process diagram of a display substrate provided according to an embodiment of the present disclosure.

[0165] 9A , a base substrate 100 is provided, a first electrode material layer L1 is formed on the base substrate 100 , and a first photoresist layer PR1 is formed on the first electrode material layer L1 .

[0166] For example, the substrate 100 may be a silicon-based substrate. Because silicon-based substrates utilize mature semiconductor manufacturing processes, have stable performance, and are relatively small and precise, they are advantageous for fabricating micro-display devices. Of course, the embodiments of the present disclosure include but are not limited to these, and the substrate 100 may also utilize other types of drive substrates.

[0167] For example, the first electrode material layer L1 is formed by a physical vapor deposition process, and the first electrode material layer L1 is a stacked film layer of Ti / Al / Ti / ITO.

[0168] 9B , under the shielding of the first photoresist layer PR1 , the first electrode material layer L1 is etched to form a plurality of first electrode portions 210 arranged at intervals, and the first photoresist layer PR1 is stripped and removed.

[0169] For example, the process of etching the first electrode material layer L1 is a dry etching process.

[0170] Referring to FIG9C , a pixel-defining material layer L2 is formed on the first electrode portion 210 and the base substrate 100. The pixel-defining material layer L2 includes a first portion L2a located on the first electrode portion 210 and a second portion L2b located on the base substrate 100. The first portion L2a is further away from the base substrate 100 than the second portion L2b. The second portion L2b is further away from the base substrate 100 than the first electrode portion 210. A second photoresist layer PR2 is then formed on the pixel-defining material layer L2, covering the second portion L2b and exposing the first portion L2a.

[0171] For example, the material of the pixel defining material layer L2 is silicon oxide.

[0172] 9D , under the shielding of the second photoresist layer PR2, the first portion L2a in the pixel defining material layer L2 is etched until the plane where the first portion L2a is away from the base substrate 100 is flush with the plane where the second portion L2b is away from the base substrate 100, thereby obtaining a pixel defining intermediate layer L21, and then the second photoresist layer PR2 is stripped off and removed.

[0173] 9E , a second electrode bonding material layer L3 is formed on the pixel defining intermediate layer L21 , and a third photoresist layer PR3 is formed on the second electrode bonding material layer L3 .

[0174] For example, the second electrode bonding material layer L3 is a stacked film layer of Ti / Al / Ti / ITO.

[0175] 9E and 9F , under the shielding of the third photoresist layer PR3, the second electrode overlapping material layer L3 is etched to obtain a plurality of second electrode overlapping portions 600. The third photoresist layer PR3 is then stripped and removed.

[0176] For example, the process of etching the second electrode bonding material layer L3 may be a dry etching process.

[0177] 9G , a partition material layer is formed on the pixel defining intermediate layer L21 and the second electrode overlapping portion 600. The partition material layer includes a first partition material layer L41 and a second partition material layer L42 located on the side of the first partition material layer L41 away from the base substrate 100. A seventh photoresist layer PR7 is formed on the partition material layer L4. The seventh photoresist layer PR7 only exposes the second partition material layer L42 in the area where the first partition space is to be formed.

[0178] For example, the material of the first partition material layer L41 is silicon nitride, and the material of the second partition material layer L42 is silicon oxide.

[0179] Referring to Figures 9G and 9H , under the shielding of the seventh photoresist layer PR7, the second partitioning material layer L42, the first partitioning material layer L41, and the pixel-defining intermediate layer L21 are etched simultaneously. A first partitioning space R1 is formed within the partitioning material layer L4, and a first opening K1 is formed in the pixel-defining intermediate layer L21. The first partitioning space R1 and the first opening K expose a portion of the first electrode portion 210. The first partitioning space R1 also exposes a portion of the second electrode overlapping portion 600. Furthermore, within the first partitioning space R1, the edge of the second partitioning material layer L42 protrudes beyond the edge of the first partitioning material layer L41, forming an undercut structure.

[0180] 9I , a first light-emitting functional material layer L51, a second electrode material layer L6, and a first encapsulation material layer L7 are sequentially formed on a base substrate 100 having a first partitioning space R1 formed therein. Due to the presence of the first partitioning space R1, the formed first light-emitting functional material layer L51 is disconnected at the edge of the first partitioning space R1, thereby forming a first light-emitting functional portion 221 located within the first partitioning space R1 and a portion of the first light-emitting functional portion to be removed located on the surface of the second partitioning material layer L42.

[0181] Similarly, the second electrode material layer L6 is disconnected at the edge of the first partition space R1, thereby forming a second electrode portion 230 located within the first partition space R1 and a second electrode portion 230 to be removed located on the surface of the second partition material layer L42. The second electrode portion 230 formed within the first partition space R1, the first light-emitting functional portion 220, and the connected first electrode portion 210 constitute the first light-emitting device EL1, which emits light of the first color.

[0182] Furthermore, the first encapsulation material layer L7 is not interrupted at the edge of the first partition space R1, but rather forms a single, integrated structure extending continuously from the surface of the second electrode portion 230 to the surface of the second partition material layer L42. A first stacked film layer La, comprising the first light-emitting functional material layer L51, the second electrode material layer L6, and the first encapsulation material layer L7, is formed on the surface of the second partition material layer L42.

[0183] 9J , an eighth photoresist layer PR8 is formed, and the eighth photoresist layer PR8 exposes only the first stacked film layer La in a region where the second partition space is to be formed.

[0184] 9J and 9K , under the shielding of the eighth photoresist layer PR8, the portion of the first stacked film layer La located on the second partition material layer L42 is first etched away. The second partition material layer L42 and a portion of the first partition material layer L41 are then etched away to form the second partition space R2. Finally, a portion of the pixel-defining intermediate layer L21 is etched away to form the second opening K2. After the etching is completed, the eighth photoresist layer PR8 is stripped away. Here, the portion of the first partition material layer L41 retained between the first partition space R1 and the second partition space R2 forms the first partition sub-portion 310, and the portion of the second partition material layer L42 retained between the first partition space R1 and the second partition space R2 forms the second partition sub-portion 320. The first partition sub-portion 310 and the second partition sub-portion 320 together constitute the partition portion 300.

[0185] 9L , a second light-emitting functional material layer L52 , a second electrode material layer L6 and a first encapsulation material layer L7 are sequentially formed on the base substrate 100 having the second partition space R2 formed therein.

[0186] The second light-emitting functional material layer L52 is disconnected at the edges of the partition portion 300 and the second partition space R2, thereby forming a second light-emitting functional portion 222 located in the second partition space R2 and the first partition space R1, and a second light-emitting functional portion to be removed located on the surface of the second partition material layer L42. The first light-emitting functional portion 222 located in the first partition space R1 is formed on the first encapsulation material layer L7, and the first light-emitting functional portion 220 located in the second partition space R2 is formed on the first electrode portion 210.

[0187] Similarly, the second electrode material layer L6 is disconnected at the edges of the partition portion 300 and the second partition space R2, thereby forming a second electrode portion 230 located in the second partition space R2 and the first partition space R1, and a second electrode portion 230 to be removed located on the surface of the second partition material layer L42. The second electrode portion 230 formed in the second partition space R2, the second light-emitting functional portion 220, and the connected first electrode portion 210 constitute the second light-emitting device EL2, which emits light of the second color.

[0188] Furthermore, the first encapsulation material layer L7 is not interrupted at the partition portion 300 and the edge of the first partition space R1. The first encapsulation material layer L7 forms a single, integrated structure extending continuously from the surface of the second electrode portion 230 to the surface of the second partition material layer L42. At this point, the surface of the second partition material layer L42 is formed with a second stacked film layer Lb comprising a first light-emitting functional material layer, a second electrode material layer, a first encapsulation material layer, a second light-emitting functional material layer, a second electrode material layer, and a first encapsulation material layer.

[0189] 9M, a ninth photoresist layer PR9 is formed, the ninth photoresist layer PR9 exposes the second stacked film layer Lb at the region where the third partition space is to be formed, and the ninth photoresist layer PR9 also exposes the first packaging material layer L7 located in the first partition space R1.

[0190] 9M and 9N , under the shielding of the ninth photoresist layer PR9, the first packaging material layer L7, the second electrode portion and the second light-emitting functional portion 222 located in the first partition space R1 are etched away; a portion of the second stacked film layer Lb located on the second partition material layer L42 is etched away; the second partition material layer L42 and a portion of the first partition material layer L41 are etched away to form a third partition space R3; and finally, a portion of the pixel-defining intermediate layer L21 is etched away to form a third opening K3. Here, the portion of the first partition material layer L41 retained between the first partition space R1 and the third partition space R3 forms the first partition sub-portion 310, the portion of the first partition material layer L41 retained between the second partition space R2 and the third partition space R3 forms the first partition sub-portion 310, the portion of the second partition material layer L42 retained between the first partition space R1 and the third partition space R3 forms the second partition sub-portion 320, and the portion of the second partition material layer L42 retained between the second partition space R2 and the third partition space R3 forms the second partition sub-portion 320. The first partition sub-portion 310 and the second partition sub-portion 320 that are in contact constitute the partition portion 300.

[0191] 90 , a third light-emitting functional material layer L53 , a second electrode material layer L6 and a first encapsulation material layer L7 are sequentially formed on the base substrate 100 having the third partition space R3 formed therein.

[0192] The third light-emitting functional material layer L53 is disconnected at the edges of the partition portion 300 and the third partition space R3, thereby forming the third light-emitting functional portion 223 located in the third partition space R3, the second partition space R2, and the first partition space R1, and the third light-emitting functional portion to be removed located on the surface of the second partition material layer L42. The third light-emitting functional portion 223 located in the first partition space R1 and the second partition space R2 is formed on the first encapsulation material layer L7, while the third light-emitting functional portion 223 located in the third partition space R3 is formed on the first electrode portion 210.

[0193] Similarly, the second electrode material layer L6 is disconnected at the edges of the partition portion 300 and the third partition space R3, thereby forming a second electrode portion 230 located in the third partition space R3, the second partition space R2, and the first partition space R1, as well as a second electrode portion 230 to be removed located on the surface of the second partition material layer L42. The second electrode portion 230 formed in the third partition space R3, the third light-emitting functional portion 220, and the connected first electrode portion 210 constitute the third light-emitting device EL3, which emits light of a third color.

[0194] In addition, the first encapsulation material layer L7 is not isolated at the partition portion 300 and the edge of the third partition space R3. The first encapsulation material layer L7 has an integrated structure on the entire surface, and the first encapsulation material layer L7 extends continuously from the surface of the second electrode portion 230 to the surface of the second partition material layer L42. At this time, the surface of the second partition material layer is formed with a third stacked film layer Lc composed of a first light-emitting functional material layer, a second electrode material layer, a first encapsulation material layer, a second light-emitting functional material layer, a second electrode material layer, a first encapsulation material layer, a third light-emitting functional material layer, a second electrode material, and a first encapsulation material layer.

[0195] 9P , a tenth photoresist layer PR10 is formed, and the tenth photoresist layer PR10 covers only the first encapsulation material layer L7 located in the third partition space R3 .

[0196] 9P and 9Q , under the shielding of the tenth photoresist layer PR10, the first encapsulation material layer L7, the second electrode portion, and the third light-emitting functional portion 223 within the first partition space R1 are etched away. The first encapsulation material layer L7, the second electrode portion, and the third light-emitting functional portion 223 within the second partition space R2 are also etched away. The third stacked film layer Lc on the second partition material layer L42 is also etched away. After removing the third stacked film layer Lc on the second partition material layer L42, the first encapsulation material layer L7 is patterned into the encapsulation portion 410 located within the first partition space R1, the second partition space R2, and the third partition space R3.

[0197] Referring to FIG9R , a second encapsulation layer 500 is formed on the side of the encapsulation portion 410 and the partition portion 300 away from the base substrate 100. The second encapsulation layer 500 covers each encapsulation portion 410 and each partition portion 300. The plane of the second encapsulation layer 500 away from the base substrate 100 is farther away from the base substrate 100 than the plane of the partition portion 300 away from the base substrate 100. At this point, the display substrate is prepared.

[0198] In another aspect, a display device is provided, comprising the display substrate described above. For example, the display device may be an electronic product with a display function, such as a television, a monitor, an electronic picture frame, an electronic photo frame, a navigation system, a laptop computer, a tablet computer, or a smartphone.

[0199] It should be understood that the display devices according to some exemplary embodiments of the present disclosure have all the features and advantages of the above-mentioned display substrate. These features and advantages can be referred to in the above description of the display substrate and will not be repeated here.

[0200] As used herein, the terms "substantially," "about," "approximately," and other similar terms are used as terms of approximation rather than as terms of degree, and are intended to account for the inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. To account for factors such as process fluctuations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), "about" or "approximately," as used herein, are inclusive of the stated value and mean within an acceptable range of deviation for the particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within ±10% or ±5% of the stated value.

[0201] Although some embodiments according to the general inventive concept of the present disclosure have been illustrated and described, it will be appreciated by those skilled in the art that changes may be made to these embodiments without departing from the principles and spirit of the general inventive concept of the present disclosure, the scope of which is defined by the claims and their equivalents.

Claims

1. A display substrate, wherein: The display substrate comprises: substrate; A plurality of light-emitting devices, wherein the plurality of light-emitting devices are arrayed on the base substrate, the light-emitting devices comprising a first electrode portion located on the base substrate, a light-emitting functional portion located on a side of the first electrode portion away from the base substrate, and a second electrode portion located on a side of the light-emitting functional portion away from the base substrate; a plurality of partitioning portions, each of which is located on the base substrate, and at least one partitioning portion is provided between two adjacent light-emitting devices; and The first encapsulation layer is located on the side of the light-emitting device away from the base substrate. The first encapsulation layer is divided into multiple encapsulation parts by multiple partition parts. There is at least one partition part between two adjacent encapsulation parts. Each encapsulation part covers each light-emitting device respectively, and the orthographic projection of the encapsulation part on the base substrate covers the orthographic projection of the light-emitting device on the base substrate.

2. The display substrate according to claim 1, wherein The encapsulation portion continuously extends from the surface of the light emitting device to the side surface of the partition portion, and the encapsulation portion covers at least a portion of the side surface of the partition portion.

3. The display substrate according to claim 2, wherein: The partition portion includes a first partition sub-portion and a second partition sub-portion. The second partition sub-portion is located on a side of the first partition sub-portion away from the base substrate. Along a direction parallel to the base substrate, an edge of the second partition sub-portion protrudes from an edge of the first partition sub-portion.

4. The display substrate according to claim 3, wherein: The encapsulation portion covers a side surface of the first partition sub-portion intersecting with the base substrate and a side surface of the second partition sub-portion opposite to the base substrate.

5. The display substrate according to claim 4, wherein: The display substrate further includes a plurality of second electrode overlapping portions located between the base substrate and the isolation layer, two adjacent second electrode portions are located on both sides of at least one of the isolation portions and are electrically connected through one second electrode overlapping portion, and the second electrode overlapping portion is spaced apart from the adjacent light-emitting functional portion. The display substrate according to claim 5 , wherein: The display substrate also includes a pixel defining layer located between the base substrate and the isolation layer, the pixel defining layer having a plurality of openings, the openings exposing at least a portion of the first electrode portion, the light-emitting functional portion overlapping the first electrode portion through the openings, and the pixel defining layer is further away from the plane of the base substrate than the first electrode portion is away from the plane of the base substrate.

7. The display substrate according to claim 6, wherein: A first distance is provided between a plane of the second partition portion close to the base substrate and a plane of the pixel defining layer away from the base substrate. The first distance is greater than the sum of the thickness of the light emitting functional portion and the thickness of the second electrode portion.

8. The display substrate according to claim 7, wherein: The distance that the edge of the second partition sub-part protrudes from the edge of the first partition sub-part is a second distance, wherein the second distance ∶ First distance ≥ 1 ∶ 2.

9. The display substrate according to claim 6 , wherein: An orthographic projection of the opening on the base substrate is spaced apart from an orthographic projection of the second electrode overlapping portion on the base substrate.

10. The display substrate according to claim 9, wherein: The distance between the orthographic projection of the opening on the base substrate and the orthographic projection of the second electrode overlapping portion on the base substrate is a third distance, wherein the second distance is greater than the third distance.

11. The display substrate according to any one of claims 6 to 10, wherein: The second electrode overlapping portion is located between the pixel defining layer and the partition portion, the orthographic projection of the first partition sub-portion on the base substrate is located within the orthographic projection of the second electrode overlapping portion on the base substrate, and the orthographic projection of the second electrode overlapping portion on the base substrate is located within the orthographic projection of the second partition sub-portion on the base substrate.

12. The display substrate according to claim 11, wherein: A plane of the second electrode overlapping portion close to the base substrate is farther away from the base substrate than a plane of the first electrode portion far away from the base substrate.

13. The display substrate according to claim 12, wherein: The display substrate further includes an insulating protection portion, which covers a side surface of the second electrode overlapping portion. The second electrode portion overlaps the second electrode overlapping portion away from a plane of the base substrate.

14. The display substrate according to any one of claims 6 to 10, wherein: The pixel defining layer has a groove, at least a portion of the second electrode overlapping portion is embedded in the groove, the orthographic projection of the first partition sub-portion on the base substrate is located within the orthographic projection of the second electrode overlapping portion on the base substrate, and the orthographic projection of the second electrode overlapping portion on the base substrate is located within the orthographic projection of the second partition sub-portion on the base substrate.

15. The display substrate according to claim 14, wherein: The plane of the second electrode overlapping portion close to the base substrate is located between the plane of the first electrode portion away from the base substrate and the plane of the first electrode portion close to the base substrate; and The second electrode overlapping portion is further away from the plane of the base substrate than the first electrode portion is from the plane of the base substrate.

16. The display substrate according to claim 15, wherein: The display substrate further includes an insulating protection portion, wherein the insulating protection portion and the pixel defining layer cover a side surface of the second electrode overlapping portion, and the second electrode portion overlaps the second electrode overlapping portion away from a plane of the base substrate.

17. The display substrate according to claim 14, wherein: The groove exposes a portion of the base substrate, and a plane where the second electrode overlapping portion is away from the base substrate is closer to the base substrate than a plane where the pixel defining layer is away from the base substrate.

18. The display substrate according to claim 17, wherein: The second electrode overlapping portion and the first electrode portion are located in the same layer.

19. The display substrate according to any one of claims 3 to 18, wherein: The material of the first partition sub-portion is silicon nitride, and the material of the second partition sub-portion is silicon oxide.

20. The display substrate according to any one of claims 1 to 19, wherein: The display substrate further includes a second encapsulation layer covering the first encapsulation layer and the partition portions. The second encapsulation layer is further away from the plane of the base substrate than the partition portions are from the plane of the base substrate.

21. The display substrate according to claim 20, wherein: The plurality of light-emitting devices include a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of third light-emitting devices, the plurality of encapsulation parts include a plurality of first encapsulation parts, a plurality of second encapsulation parts, and a plurality of third encapsulation parts, the first encapsulation parts cover the first light-emitting devices, the second encapsulation parts cover the second light-emitting devices, and the third encapsulation parts cover the third light-emitting devices; The thickness of the first packaging part is greater than the thickness of the second packaging part, and the thickness of the second packaging part is greater than the thickness of the third packaging part.

22. The display substrate according to any one of claims 21, wherein: The thickness of the second encapsulation layer located on the first encapsulation part is smaller than the thickness of the second encapsulation layer located on the second encapsulation part, and the thickness of the second encapsulation layer located on the second encapsulation part is smaller than the thickness of the second encapsulation layer located on the third encapsulation part.

23. The display substrate according to any one of claims 1 to 19, wherein: The light-emitting functional portion includes a first light-emitting portion, a second light-emitting portion located on a side of the first light-emitting portion away from the base substrate, and a charge generating portion located between the first light-emitting portion and the second light-emitting portion, and at least one partition portion is provided between two adjacent charge generating portions.

24. The display substrate according to any one of claims 1 to 19, wherein: The plurality of light emitting devices include a plurality of first light emitting devices, a plurality of second light emitting devices and a plurality of third light emitting devices. The first light emitting devices emit a first color light, the second light emitting devices emit a second color light, and the third light emitting devices emit a third color light.

25. The display substrate according to claim 24, wherein: The first light emitting device includes a first light emitting functional portion, the second light emitting device includes a second light emitting functional portion, and the third light emitting device includes a third light emitting functional portion; The display substrate further includes a second light-emitting functional structure located on a side of the packaging portion away from the first light-emitting device, and a third light-emitting functional structure located on a side of the second light-emitting functional structure away from the first light-emitting device. structure; as well as The display substrate further includes a third light-emitting functional structure located on a side of the packaging portion away from the second light-emitting device; The second light-emitting functional structure and the second light-emitting functional portion are located in the same layer, and the third light-emitting functional structure and the third light-emitting functional portion are located in the same layer.

26. A method for preparing a display substrate, wherein: The preparation method comprises the following steps: providing a substrate; forming a plurality of light-emitting devices on the base substrate, the plurality of light-emitting devices being arranged in an array, the light-emitting devices comprising a first electrode portion located on the base substrate, a light-emitting functional portion located on a side of the first electrode portion away from the base substrate, and a second electrode portion located on a side of the light-emitting functional portion away from the base substrate; forming a plurality of partitions on the base substrate, with at least one partition between two adjacent light-emitting devices; and A first encapsulation layer is formed on a side of each light-emitting device away from the base substrate, the first encapsulation layer is divided into a plurality of encapsulation parts by a plurality of the partition parts, there is at least one partition part between two adjacent encapsulation parts, each of the encapsulation parts covers each light-emitting device respectively, and the orthographic projection of one encapsulation part on the base substrate covers the orthographic projection of one light-emitting device on the base substrate.

27. A display device, wherein: The display device comprises the display substrate according to any one of claims 1-25.

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