server

Abstract

The present application relates to the technical field of servers, and discloses a server. The server comprises: a chassis, which is internally provided with a mounting cavity; node racks, each provided with a female connector, the node racks being arranged in the mounting cavity, the node racks being used for mounting node modules, and male connectors of the node modules being adapted to be connected to the female connectors; PCIE racks, each provided with a female high-density terminal, the PCIE racks being arranged in the mounting cavity, the PCIE racks being used for mounting PCIE devices, and male high-density terminals of the PCIE devices being adapted to be connected to the female high-density terminals of the PCIE racks; and a device rack, arranged in the mounting cavity, the device rack being used for mounting auxiliary devices, and the auxiliary devices at least comprising a mounting fan, a baseboard management controller and a power supply, wherein cables are arranged in the node racks, the PCIE racks and the device rack, and the female connectors, the female high-density terminals and the auxiliary devices are in communication connection by means of the cables. According to the embodiments of the present application, by providing the node racks and the PCIE racks, the node modules and the PCIE devices can carry out an electric hot plugging operation; and after an interconnect cable is made into a fixed pluggable connector, a blind plugging operation can be realized, so that rapid switching of different interconnection modes can be realized. Furthermore, the server does not need to be powered off for maintenance, ensuring the normal operation of services of users, and meeting the use requirements of the users.

Description

server

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to a Chinese patent application filed with the China Patent Office on January 30, 2024, with application number 202410129734.3 and application name “Server,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of servers, and in particular to a server. Background Art

[0004] Currently, when multiple nodes are installed in a server, various cables, such as signal cables and power cables, are connected between the multiple nodes and each control board. Therefore, if one of the nodes in the server experiences an abnormality or failure, it is impossible to directly perform maintenance on the failed node while the node is still powered on. Typically, all nodes need to be powered off and shut down, and then the various cables connecting to the various control boards must be removed. After completing the node maintenance operations, the cables between the multiple nodes and the various control boards are reconnected.

[0005] Therefore, during the node power outage maintenance period, customer business will be affected. Even if the data is migrated through the standby node, the data loss and data errors during the data transmission process between the standby node and the maintenance node will further affect customer business and fail to meet customer usage needs.

[0006] Summary of the Invention

[0007] In view of this, the present application provides a server to solve the problem of affecting customer services during node power outage maintenance.

[0008] In a first aspect, the present application provides a server, comprising:

[0009] A chassis having a mounting cavity provided therein;

[0010] A node bracket is provided with a female connector; the node bracket is arranged in the installation cavity and is used to install a node module; the male connector of the node module is suitable for connecting with the female connector;

[0011] A PCIE bracket is provided with a female high-density terminal; the PCIE bracket is arranged in the installation cavity, and the PCIE bracket is used to install a PCIE device; the male high-density terminal of the PCIE device is suitable for connecting with the female high-density terminal of the PCIE bracket;

[0012] An equipment bracket is provided in the installation cavity; the equipment bracket is used to install auxiliary equipment, and the auxiliary equipment at least includes an installation fan, a baseboard management controller and a power supply;

[0013] Cables are provided in the node bracket, the PCIE bracket and the device bracket, and the female connector, the female high-density terminal and the auxiliary device are communicatively connected through the cables.

[0014] Beneficial effect: The embodiment of the present application can enable the node module and PCIE device to perform hot-swappable operation under power by setting the node bracket and the PCIE bracket, that is, when multiple node modules are set in the server, if one node module is abnormal or fails, the failed node module can be operated and maintained under normal power supply of the server, without the need to power off and shut down another normal node module. Specifically, when maintaining the node module, if it is necessary to unplug the node module, since it is a pluggable connector such as a female connector and a male connector, it can be directly unplugged without removing various cables first. After completing the operation and maintenance of the node module, the node module can be directly plugged back into the node bracket. Similarly, when it is necessary to maintain the PCIE device, the PCIE device can be directly unplugged. Therefore, after the interconnection cable is made into a fixed pluggable connector, a blind plug operation can be realized, thereby realizing rapid switching of different interconnection modes. Furthermore, there is no need to power off the server for maintenance, ensuring the normal operation of customer business and meeting customer usage needs.

[0015] In an optional implementation, when the node module is installed on the node bracket and the PCIE device is installed on the PCIE bracket, the node module and the PCIE device are communicatively connected via the cable.

[0016] Beneficial effect: The embodiment of the present application sets up a node bracket and a PCIE bracket. Since cables are set in the node bracket, the PCIE bracket and the device bracket, and the female connector, the female high-density terminal and the auxiliary equipment are connected for communication through the cables, it is only necessary to connect the node module to the node bracket and the PCIE device to the PCIE bracket to achieve communication connection between the node module and the PCIE device. At the same time, during the actual installation process, there is no need to search for the cables to be plugged in and unplugged. The technicians can directly install the node module and the PCIE device, thereby realizing fast switching between different interconnection modes. Moreover, since the positions of the female connector and the female high-density terminal are fixed, and the female connector and the female high-density terminal are large in size, the technicians can perform blind plugging operations, thereby simplifying the technicians' operating procedures.

[0017] In an optional implementation, when the node module is installed on the node bracket and the PCIE device is installed on the PCIE bracket, a power supply on the device bracket supplies power to the node module and the PCIE device.

[0018] Beneficial effect: The embodiment of the present application sets up a node bracket and a PCIE bracket. Since the node bracket, the PCIE bracket and the device bracket are provided with cables, and the female connector, the female high-density terminal and the auxiliary equipment are connected to each other through the cables, it is only necessary to connect the node module with the node bracket and the PCIE device with the PCIE bracket, and the node module and the PCIE device can be powered by a power supply. At the same time, during the actual installation process, there is no need to separately search for and insert dedicated power supply lines. The technicians can directly install the node modules and PCIE devices, thereby simplifying the technicians' operating procedures to a certain extent and improving the technicians' work efficiency during equipment assembly.

[0019] In an optional implementation, when the node module is installed on the node bracket and the PCIE device is installed on the PCIE bracket, the baseboard management controller sends a low-speed logic control signal to the node module and the PCIE device.

[0020] Beneficial effect: The embodiment of the present application sets up a node bracket and a PCIE bracket. Since cables are set in the node bracket, the PCIE bracket and the device bracket, and the female connector, the female high-density terminal and the auxiliary equipment are connected to each other through the cables, it is only necessary to connect the node module with the node bracket and the PCIE device with the PCIE bracket, and the low-speed logic control signal can be sent to the node module and the PCIE device through the baseboard management controller. At the same time, in the actual installation process, there is no need to separately find and insert dedicated control lines. The technicians can directly install the node module and the PCIE device, which simplifies the technicians' operating procedures to a certain extent and improves the technicians' work efficiency during equipment assembly. In addition, since the positions of the female connector and the female high-density terminal are fixed, and the female connector and the female high-density terminal are large in size, the technicians can perform blind insertion operations, thereby simplifying the technicians' operating procedures.

[0021] In an optional embodiment, the node bracket, the PCIE bracket, and the device bracket are fixed to the bottom of the installation cavity through a detachable component.

[0022] Beneficial Effects: The embodiments of the present application utilize detachable components to flexibly adjust the location and quantity of node brackets, PCIE brackets, and device brackets, thereby meeting users' varying server configuration requirements, improving the ability to coordinate different server configurations, and enhancing server compatibility. Furthermore, when node brackets, PCIE brackets, and device brackets reach their maintenance and replacement cycles, technicians can easily disassemble them, thereby simplifying the technicians' operational processes and improving their work efficiency during equipment assembly.

[0023] In an optional embodiment, the detachable component is a hand screw and a first screw hole correspondingly opened on the node bracket, the PCIE bracket and the device bracket and a second screw hole opened in the installation cavity.

[0024] Beneficial effect: The embodiment of the present application provides hand screws, which can eliminate the need for additional tools for disassembly and assembly when fixing the lower outer shell to the chassis. After the hand screws are aligned with the first screw hole and the second screw hole, the technician can simply screw the hand screws into the first screw hole and the second screw hole by hand, thereby improving the efficiency of disassembly and assembly.

[0025] In an optional embodiment, the node bracket, the PCIE bracket and the device bracket are integrally formed into an integral bracket, and a cable channel is formed in the integral bracket, and cables are arranged in the cable channel.

[0026] Beneficial effects: The embodiment of the present application forms the node bracket, the PCIE bracket and the device bracket into an integral bracket, without the need to separately open molds for each bracket, and can be directly pressed and formed using a set of molds, which can save production costs to a certain extent. Furthermore, during molding, the cable channel can be directly formed inside the integral bracket according to a predetermined design, so that the cables can interconnect the various devices in the cable channel, thereby eliminating the need for technicians to plug in each cable individually, thereby improving installation efficiency. At the same time, since the cables are located in the cable channel, they will not affect the installation space outside the integral bracket, thereby improving space utilization, making the internal space of the server more tidy, and further facilitating maintenance by technicians.

[0027] In an optional embodiment, the PCIE bracket is located on the front window of the chassis, the fan on the device bracket is located in the middle of the chassis, the power supply on the device bracket is located on one side of the rear window of the chassis, and the node bracket is located on the other side of the rear window of the chassis.

[0028] In an optional embodiment, the equipment support includes:

[0029] A power board is provided with two stacked power connectors, and a power supply is suitable for being plugged into the power connectors;

[0030] An auxiliary equipment board is connected to the power board via a board-to-board terminal, and the auxiliary equipment board and the power board are arranged vertically; the auxiliary equipment board is used to install the fan and the baseboard management controller.

[0031] Beneficial Effects: The embodiments of the present application connect the auxiliary device board to the power board via board-to-board terminals. During installation, the actual position of the board-to-board terminals can be changed based on the actual layout of the server chassis, thereby changing the actual position of the power board or auxiliary device board, allowing the power board or auxiliary device board to be aligned with the actual chassis layout during installation. Furthermore, when performing maintenance on the power board or auxiliary device board alone, there is no need to disassemble the entire device bracket, making it easier for technicians to disassemble the equipment. This simplifies the technician's operating process to a certain extent and improves their work efficiency during equipment assembly.

[0032] In an optional embodiment, a power supply connector is also provided on the auxiliary device board, and the power supply supplies power to the node module and PCIE device through the power connector, the power board, the board-to-board terminal, the auxiliary device board, and the power supply connector in sequence.

[0033] In an optional embodiment, two node supports are provided, and the two node supports are stacked.

[0034] Beneficial Effects: Because the memory capacity of the next generation platforms from Intel and AMD exceeds the 12 memory sticks per processor, the traditional left-right dual-node architecture will be incompatible with existing server architectures and unable to meet the maximum memory support requirements. Therefore, changing from the traditional left-right dual-node design to a top-down dual-node design not only maintains compatibility with existing server architectures, but also ensures the use of multi-node hot-swappable operations under power.

[0035] In an optional embodiment, the node module is provided with a processor, and multiple memory sticks are provided at both ends of the processor. The node module is provided with multiple male connectors, and the male connectors are high-density connectors, and the high-density connectors include at least a first node male connector, a second node male connector, a first control signal male connector, and a first power supply male connector;

[0036] The first node male connector and the second node male connector are used to provide PCIE high-speed signals for PCIE devices and NVME storage hard drives;

[0037] The first control signal male connector is used to provide a control signal for the interconnection between the node module and the baseboard management controller;

[0038] The first power supply male connector is used to interconnect with a power source to at least supply power to the processor and memory.

[0039] In an optional implementation, the server further includes:

[0040] A PCIE expansion board is provided with multiple PCIE slots, and the PCIE slots are used to expand and connect PCIE devices. The PCIE devices include at least a GPU, a smart network card, a multihost network card, and a RAID card;

[0041] The PCIE expansion board is provided with the male high-density terminal, and the male high-density terminal is suitable for connecting with the female high-density terminal of the PCIE bracket.

[0042] In an optional embodiment, when both node brackets are provided with node modules, the male high-density terminal includes a third node male connector, a fourth node male connector, a second control signal male connector, and a second power supply male connector;

[0043] The third node male connector and the fourth node male connector are used to receive PCIE signals from the processors of the two node modules;

[0044] The second control signal male connector is used to communicate with the baseboard management controller;

[0045] The second power supply male connector is used to interconnect with the power board, draw power from the power board, and supply power to the PCIE device on the PCIE expansion board.

[0046] In an optional embodiment, when two node brackets are provided with only one node module, the male high-density terminal includes a fifth node male connector, a third control signal male connector, and a third power supply male connector;

[0047] The fifth node male connector is used to receive a PCIE signal from the processor of the node module;

[0048] The third control signal male connector is used to communicate with the baseboard management controller;

[0049] The third power supply male connector is used to interconnect with the power board, draw power from the power board, and supply power to the PCIE device on the PCIE expansion board.

[0050] Beneficial Effects: In the embodiments of the present application, for business scenarios with low performance requirements, customers may consider using only one node. When a customer only requires one node, the overall structure of the node bracket, PCIE bracket, and device bracket remains unchanged. Since only one node is used, only the other node and its associated peripheral cables need to be removed, thus meeting the needs of different customers. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] In order to more clearly illustrate the specific implementation methods of this application or the technical solutions in related technologies, the following is a brief introduction to the drawings required for use in the specific implementation methods or related technical descriptions. Obviously, the drawings described below are some implementation methods of this application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0052] FIG1 is a comparison diagram of node modules in left-right placement and stacked placement according to an embodiment of the present application;

[0053] FIG2 is an overall internal schematic diagram of a server according to an embodiment of the present application;

[0054] FIG3 is an overall schematic diagram of the integral bracket in an embodiment of the present application;

[0055] FIG4 is a schematic structural diagram of a node module according to an embodiment of the present application;

[0056] FIG5 is a schematic diagram comparing the front and back sides of a power board in an embodiment of the present application;

[0057] FIG6 is a schematic structural diagram of an auxiliary equipment board in an embodiment of the present application;

[0058] FIG7 is a communication diagram of a baseboard management controller according to an embodiment of the present application;

[0059] FIG8 is a schematic diagram of the installation of a node module and a PCIE device according to an embodiment of the present application;

[0060] FIG9 is a communication diagram of a PCIE expansion board when two node modules are provided in an embodiment of the present application;

[0061] FIG10 is a communication diagram of a PCIE expansion board when only one node module is provided in an embodiment of the present application; FIG.

[0062] Description of reference numerals:

[0063] 1. Node module; 11. First node male connector; 12. Second node male connector; 13. First control signal male connector; 14. First power supply male connector;

[0064] 2. PCIE device; 3. Fan; 4. Power supply; 5. Chassis;

[0065] 6. Overall bracket; 61. Node bracket; 62. PCIE bracket; 63. Equipment bracket; 631. Power board; 6311. Power connector; 632. Auxiliary equipment board; 6321. Power connector; 633. Board-to-board terminal; 64. Cable channel; 7. Baseboard management controller; 8. PCIE expansion board; 81. Third node male connector; 82. Fourth node male connector; 83. Second control signal male connector; 84. Second power supply male connector; 85. First interface; 86. Second interface; 87. Third interface; 88. Fifth node male connector; 89. Third control signal male connector; 90. Third power supply male connector. DETAILED DESCRIPTION

[0066] To make the purpose, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of this application.

[0067] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this application and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0068] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; internal connections between two components; wireless connections or wired connections. A person skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0069] In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0070] In order to minimize the impact of node failures on customers, in this technical solution, both the node module 1 and the PCIE device 2 need to be designed as hot-swappable with power on. That is, when one of the two nodes in the server is abnormal or fails, the failed node can be operated and maintained while the system has power, without the need to power off the other normal node.

[0071] Therefore, it can maximize the guarantee of business continuity support and minimize the additional business migration actions before the customer shuts down both nodes. Even if the customer has designed disaster recovery and data migration, it will need to deploy more spare machines. In addition, there will be data loss and inaccuracy in the data migration process, which will affect the customer's business and directly affect the user's sensory experience. In more serious cases, it will lead to data loss.

[0072] Based on this, it becomes urgent and important to perform hot maintenance on the node module 1 and PCIE device 2 in the server.

[0073] The following describes an embodiment of the present application with reference to FIG. 1 to FIG. 10 .

[0074] According to an embodiment of the present application, on one hand, a server is provided, which includes a chassis 5, a node bracket 61, a PCIE bracket 62 and a device bracket 63.

[0075] Specifically, in the embodiment of the present application, as shown in FIG2 , an installation cavity is provided inside the chassis 5 , and the node bracket 61 , the PCIE bracket 62 and the device bracket 63 can be directly provided at the bottom of the installation cavity.

[0076] Furthermore, as shown in Figure 3, a node bracket 61 is provided with a female connector. The node bracket 61 is disposed in the mounting cavity and is used to mount the node module 1. As shown in Figure 8, the male connector of the node module 1 is adapted to connect with the female connector. In other words, the power supply, high-speed signals, and low-speed signals of the node module 1 can all be transmitted through the male and female connectors.

[0077] Similarly, as shown in Figure 3 , a PCIE bracket 62 is provided with female high-density terminals. The PCIE bracket 62 is disposed in the mounting cavity and is used to mount the PCIE device 2. As shown in Figure 8 , the male high-density terminals of the PCIE device 2 are adapted to connect to the female high-density terminals of the PCIE bracket 62. In other words, the power supply, high-speed signals, and low-speed signals of the PCIE device 2 can all be transmitted via the male and female high-density terminals.

[0078] Furthermore, in an embodiment of the present application, a device bracket 63 is provided in the installation cavity, and the device bracket 63 is used to install auxiliary equipment, and the auxiliary equipment at least includes an installation fan 3, a baseboard management controller 7 and a power supply 4.

[0079] Cables are installed within the node bracket 61, the PCIE bracket 62, and the device bracket 63. These cables enable communication between the female connector, the female high-density terminals, and the auxiliary devices. Once all components are installed, the power supply 4 in the device bracket 63 can independently power on and off each node module 1 and PCIE device 2 via the cables.

[0080] With this arrangement, the embodiment of the present application, by providing a node bracket 61 and a PCIE bracket 62, can enable the node module 1 and the PCIE device 2 to perform hot-swappable operations under power. That is, when multiple node modules 1 are provided in a server, if one node module 1 experiences an abnormality or failure, the failed node module 1 can be operated and maintained while the server is powered normally, without having to power down and shut down the other normal node module 1. Specifically, when maintaining the node module 1, if it is necessary to unplug the node module 1, since it is a pluggable connector such as a female connector or a male connector, it can be directly unplugged without having to remove various cables first. After completing the operation and maintenance of the node module 1, the node module 1 can be directly plugged back into the node bracket 61. Similarly, when it is necessary to maintain the PCIE device 2, the PCIE device 2 can be directly unplugged. Therefore, after the interconnection cable is made into a fixed pluggable connector, blind plugging operation can be achieved, thereby enabling rapid switching between different interconnection modes. Furthermore, there is no need to power down the server for maintenance, ensuring the normal operation of customer services and meeting customer usage needs.

[0081] Furthermore, in an optional embodiment, when the node module 1 is installed on the node bracket 61 and the PCIE device 2 is installed on the PCIE bracket 62, the node module 1 and the PCIE device 2 are communicatively connected via the cable.

[0082] In this way, the embodiment of the present application sets up a node bracket 61 and a PCIE bracket 62. Since cables are set in the node bracket 61, the PCIE bracket 62 and the device bracket 63, and the female connector, the female high-density terminal and the auxiliary equipment are connected to each other through the cables, it is only necessary to connect the node module 1 to the node bracket 61 and the PCIE device 2 to the PCIE bracket 62, so that the node module 1 and the PCIE device 2 can be connected to each other. At the same time, during the actual installation process, there is no need to search for the cables to be plugged in and unplugged. The technician can directly install the node module 1 and the PCIE device 2, so that fast switching between different interconnection methods can be achieved. In addition, since the positions of the female connector and the female high-density terminal are fixed, and the female connector and the female high-density terminal are large in size, the technician can perform blind insertion operations, thereby simplifying the technician's operating procedures.

[0083] Furthermore, in an optional embodiment, when the node module 1 is installed on the node bracket 61 and the PCIE device 2 is installed on the PCIE bracket 62, the power supply 4 on the device bracket 63 supplies power to the node module 1 and the PCIE device 2.

[0084] In this way, the embodiment of the present application sets up a node bracket 61 and a PCIE bracket 62. Since cables are set in the node bracket 61, the PCIE bracket 62 and the device bracket 63, and the female connector, the female high-density terminal and the auxiliary equipment are connected to each other through the cables, it is only necessary to connect the node module 1 to the node bracket 61 and the PCIE device 2 to the PCIE bracket 62, and the node module 1 and the PCIE device 2 can be powered by the power supply 4. At the same time, during the actual installation process, there is no need to separately search for and insert a dedicated power supply line 4. The technician can directly install the node module 1 and the PCIE device 2, which simplifies the technician's operating process to a certain extent and improves the technician's work efficiency when assembling the equipment.

[0085] Furthermore, in an optional embodiment, when the node module 1 is installed on the node bracket 61 and the PCIE device 2 is installed on the PCIE bracket 62, the baseboard management controller 7 sends a low-speed logic control signal to the node module 1 and the PCIE device 2.

[0086] In this way, the embodiment of the present application sets up a node bracket 61 and a PCIE bracket 62. Since cables are set in the node bracket 61, the PCIE bracket 62 and the device bracket 63, and the female connector, the female high-density terminal and the auxiliary equipment are connected to each other through the cables, it is only necessary to connect the node module 1 to the node bracket 61 and the PCIE device 2 to the PCIE bracket 62, and the low-speed logic control signal can be sent to the node module 1 and the PCIE device 2 through the baseboard management controller 7. At the same time, during the actual installation process, there is no need to separately find and insert dedicated control lines. The technician can directly install the node module 1 and the PCIE device 2, which simplifies the technician's operating process to a certain extent and improves the technician's work efficiency during equipment assembly. In addition, since the positions of the female connector and the female high-density terminal are fixed, and the female connector and the female high-density terminal are large in size, the technician can perform blind insertion operations, thereby simplifying the technician's operating process.

[0087] Furthermore, in an optional embodiment, the node bracket 61, the PCIE bracket 62 and the device bracket 63 are fixed to the bottom of the installation cavity through detachable components.

[0088] With this arrangement, the embodiment of the present application utilizes detachable components to flexibly adjust the location and quantity of the node bracket 61, PCIE bracket 62, and device bracket 63, thereby meeting the user's varying server configuration requirements, improving the server's ability to coordinate different configurations, and enhancing server compatibility. Furthermore, when the node bracket 61, PCIE bracket 62, and device bracket 63 reach their maintenance and replacement cycles, technicians can easily disassemble them, thereby simplifying the technician's operational process to a certain extent and improving their work efficiency during equipment assembly.

[0089] Furthermore, the node bracket 61, PCIE bracket 62, and device bracket 63 can be fixedly connected to the installation cavity or detachably connected. For fixed connection, welding, bonding, etc. can be used. For detachable connection, screws, screw holes, snap-on slots, or magnetic attraction can be used for fixation.

[0090] The following is an example of a detachable connection method. For example, an additional fixing plate can be provided at the bottom of the installation cavity. Those skilled in the art can change the number of fixing plates according to actual conditions, such as 1, 2, 3, 4, etc., and then open a screw hole on the fixing plate. Then, another screw hole is opened on the node bracket 61, PCIE bracket 62, or device bracket 63 at the position of the screw hole. Then, the screw is passed through the screw hole on the fixing plate and the screw hole on the node bracket 61, PCIE bracket 62, or device bracket 63 in sequence, thereby connecting the installation cavity to the node bracket 61, PCIE bracket 62, or device bracket 63. Furthermore, when fixing is performed by means of clips and slots, additional clips can be provided at the bottom of the installation cavity. Technicians in this field can change the number of clips according to actual conditions, to 1, 2, 3, 4, etc., and then open a slot that can cooperate with the clip at the position corresponding to the clip on the node bracket 61, PCIE bracket 62 or device bracket 63, and then directly embed the clip on the installation cavity into the slot on the node bracket 61, PCIE bracket 62 or device bracket 63, thereby connecting the installation cavity with the node bracket 61, PCIE bracket 62 or device bracket 63. When fixing by magnetic attraction, an additional magnetic sheet can be set at the bottom of the installation cavity. Technical personnel in this field can change the number of magnetic sheets according to actual conditions, 1, 2, 3, 4, etc., and then open opposite-sex magnetic sheets that can be attracted to the magnetic sheets at positions corresponding to the magnetic sheets on the node bracket 61, PCIE bracket 62 and device bracket 63. Then, the magnetic sheets on the installation cavity are directly aligned with the opposite-sex magnetic sheets embedded on the node bracket 61, PCIE bracket 62 and device bracket 63, so as to magnetically connect the installation cavity with the node bracket 61, PCIE bracket 62 or device bracket 63.

[0091] Of course, this embodiment is only an example of a fixed connection method and a detachable connection method, but it does not limit this. Those skilled in the art can make changes according to actual conditions as long as the same technical effect can be achieved.

[0092] Furthermore, in an optional embodiment, the detachable component is a hand screw and a first screw hole correspondingly opened on the node bracket 61, the PCIE bracket 62 and the device bracket 63 and a second screw hole opened in the installation cavity.

[0093] With such a configuration, the embodiment of the present application can fix the lower outer shell to the chassis 5 by providing hand screws, without the need for additional tools for disassembly and assembly. After the hand screws are aligned with the first screw hole and the second screw hole, the technician can directly screw the hand screws into the first screw hole and the second screw hole by hand, thereby improving the efficiency of disassembly and assembly.

[0094] Furthermore, in an optional embodiment, as shown in FIG3 , the node bracket 61 , the PCIE bracket 62 and the device bracket 63 are integrally formed into an integral bracket 6 , and a cable channel 64 is formed in the integral bracket 6 , and cables are arranged in the cable channel 64 .

[0095] With such a configuration, the embodiment of the present application forms the node bracket 61, the PCIE bracket 62 and the device bracket 63 into an integral bracket 6. There is no need to separately mold each bracket, and they can be directly pressed together by a set of molds, which can save production costs to a certain extent. Furthermore, during molding, the cable channel 64 can be directly molded inside the integral bracket 6 according to a predetermined design, so that the cables can interconnect the various devices in the cable channel 64, thereby eliminating the need for technicians to plug in each cable separately, thereby improving installation efficiency. At the same time, since the cables are located in the cable channel 64, they will not affect the installation space outside the integral bracket 6, thereby improving space utilization, making the internal space of the server more tidy, and further facilitating maintenance by technicians.

[0096] Furthermore, in an optional implementation, the customer has a requirement for two nodes to share one smart network card and a requirement for multiple hosts. On this basis, the system design architecture is as follows: the front window of the chassis 5 can be a PCIE device 2 and a storage hard disk, the middle of the chassis 5 is a fan 3, the left side of the rear window of the chassis 5 is two stacked node modules 1, and one side of the rear window of the chassis 5 is two stacked power supplies 4.

[0097] Specifically in an embodiment of the present application, the PCIE bracket 62 can be located on the front window of the chassis 5, the fan 3 on the device bracket 63 can be located in the middle of the chassis 5, the power supply 4 on the device bracket 63 can be located on one side of the rear window of the chassis 5, and the node bracket 61 can be located on the other side of the rear window of the chassis 5.

[0098] Furthermore, in an optional embodiment, as shown in Figure 5, the device bracket 63 includes a power board 631 and an auxiliary device board 632. Specifically, in the embodiment of the present application, the power board 631 is provided with two stacked power connectors 6311, and the power supply 4 is suitable for being plugged into the power connector 6311 in a horizontal direction. The auxiliary device board 632 can be connected to the power board 631 through a board-to-board terminal 633, and the auxiliary device board 632 is arranged vertically to the power board 631. The auxiliary device board 632 is used to install the fan 3 and the baseboard management controller 7. In this way, the power board 631 can be connected to the auxiliary device board 632 through the board-to-board terminal 633 to ultimately realize the transmission of the power supply path, and supply power to the node, PCIE device, fan 3 and storage device.

[0099] Furthermore, in the embodiment of the present application, the baseboard management controller 7 can currently use an AST2700 processor to cooperate with the CPLD control component to achieve management of the dual systems, and also realize intelligent control of the heat dissipation of the entire system through the baseboard management controller 7.

[0100] Specifically, in an embodiment of the present application, as shown in FIG7 , the baseboard management controller 7 is interconnected with the processor of the node module 1 via X1 PCIE, and the startup function of the processor is detected and identified via the eSPI signal. The two interconnection signals, I3C_MGMT and I3C_DBG, are used to manage and debug the processor of the node module 1. The SMBUS signal is used to identify the temperature information of the processor of the node module 1, thereby performing heat dissipation control. The baseboard management controller 7 extends the system peripheral low-speed interface. The USB interface is used to extend USB devices such as keyboards and mice, and the VGA interface / DP interface is used to connect to a display. The baseboard management controller 7 extends the RJ45 network port through the PHY chip to provide users with a way to perform out-of-band management through the baseboard management controller 7. The baseboard management controller 7 obtains and manages information of the de-expanded PCIE device 2 via the I2C expander. The baseboard management controller 7 controls the speed of the fan 3 via the PWM interface.

[0101] With this arrangement, the embodiment of the present application connects the auxiliary device board 632 to the power board 631 via the board-to-board terminal 633. During the actual installation process, the actual position of the board-to-board terminal 633 can be changed according to the actual layout of the server chassis 5, thereby changing the actual position of the power board 631 or the auxiliary device board 632, so that the power board 631 or the auxiliary device board 632 is compatible with the actual layout of the chassis 5 during installation. Furthermore, when performing maintenance on the power board 631 or the auxiliary device board 632 alone, there is no need to disassemble the entire equipment bracket 63, thereby facilitating disassembly by technicians, simplifying the technicians' operating procedures to a certain extent, and improving their work efficiency during equipment assembly.

[0102] Furthermore, in an optional embodiment, as shown in Figure 6, a power supply connector 6321 is also provided on the auxiliary equipment board 632, and the power supply 4 supplies power to the node module 1 and the PCIE device 2 through the power connector 6311, the power board 631, the board-to-board terminal 633, the auxiliary equipment board 632, and the power supply connector 6321 in sequence.

[0103] Furthermore, in an optional embodiment, two node brackets 61 are provided, and the two node brackets 61 are stacked. Specifically, in an embodiment of the present application, the traditional dual nodes are placed left and right. As shown in FIG1 , in a 19-inch chassis 5, the nodes are placed left and right. The maximum number of memories on each node is 12. However, considering that the number of memories of a single processor of a new platform of Intel and AMD is 16, it is necessary to consider the compatible design of the single processor of the new platform. Therefore, it is necessary to place the node module 1 up and down, that is, to stack the node module 1, as shown in FIG1 .

[0104] With this setup, the traditional left-right dual-node architecture will be incompatible with existing server architectures, as both Intel and AMD's next-generation platforms will have more memory than the 12 sticks per processor. Therefore, switching from the traditional left-right dual-node design to a top-down dual-node design not only maintains compatibility with existing server architectures but also enables hot-swappable multi-node operations.

[0105] Furthermore, in an optional embodiment, as shown in Figure 4, the node module 1 is provided with a processor, and there are multiple memory sticks at both ends of the processor, for example, there can be 6 memory sticks, and the node module 1 is provided with multiple male connectors, and the male connectors are high-density connectors, and the high-density connectors include at least a first node male connector 11, a second node male connector 12, a first control signal male connector 13, and a first power supply male connector 14.

[0106] Specifically, in the embodiment of the present application, the first node male connector 11 and the second node male connector 12 are used to provide PCIE high-speed signals for the PCIE device 2 and the NVME storage hard disk;

[0107] The first control signal male connector 13 is used to provide a control signal for the interconnection between the node module 1 and the baseboard management controller 7;

[0108] The first power supply male connector 14 is used to interconnect with the power supply 4 to at least power the processor and the memory. Typically, a voltage regulator is provided on the processor, and the first power supply male connector 14 can also power the voltage regulator.

[0109] Furthermore, in an optional embodiment, the server further includes a PCIE expansion board 8, which is provided with multiple PCIE slots for expanding and connecting PCIE devices 2, wherein the PCIE devices 2 include at least a GPU, a smart network card, a multihost network card, a RAID card, etc. The PCIE expansion board 8 is provided with the male high-density terminal, which is suitable for connecting with the female high-density terminal of the PCIE bracket 62.

[0110] Furthermore, in an optional embodiment, as shown in Figure 9, when both node brackets 61 are provided with node modules 1, that is, when the customer uses two nodes, the male high-density terminal includes a third node male connector 81, a fourth node male connector 82, a second control signal male connector 83, and a second power supply male connector 84.

[0111] Specifically, in the embodiment of the present application, the third node male connector 81 and the fourth node male connector 82 are used to receive PCIE signals from the processors of the two node modules 1. The third node male connector 81 can be connected to the first node module 1, with a total of 32 PCIE Lanes connected, 16 of which are connected to the first interface 85 to extend the X16 PCIE device 2 of the first node module 1, such as a GPU card or a smart network card, and the other 8 PCIE Lanes are connected to the third interface 87 to provide 8 PCIE Lanes from the processor of the first node module 1 for the X16 multi-host network card.

[0112] Furthermore, in an embodiment of the present application, the fourth node male connector 82 can be connected to the second node module 1, with a total of 16 PCIE Lanes connected, of which 8 PCIE Lanes are connected to the second interface 86, and 8 PCIE Lanes are connected to the third interface 87, providing the X16 multi-host network card with 8 PCIE Lanes from the processor of the second node module 1.

[0113] When there are two PCIE brackets 62, the principle design of the PCIE expansion boards 8 installed on the two PCIE brackets 62 is the same, except that the source of the upstream high-speed PCIE signal of the high-density connector on the PCIE expansion board 8 is different. The 16 PCIE lanes of the first interface 85 on the other PCIE expansion board 8 come from the processor of the second node module 1. Therefore, the GPU card or smart network card installed on the two PCIE brackets 62 can achieve a better balanced design, so that PCIE resources are evenly distributed, that is, the two node modules 1 have expanded their respective GPU cards or smart network cards.

[0114] Furthermore, in this embodiment of the present application, the second control signal male connector 83 is used to communicate with the baseboard management controller 7, specifically to implement I2C and control signal interconnection. The second power supply male connector 84 is used to connect to the power board 631, draw power from the power board 631, and power the PCIE device 2 on the PCIE expansion board 8.

[0115] Furthermore, in an optional embodiment, as shown in Figure 10, when two node brackets 61 are only provided with one node module 1, that is, when the customer only uses one node, the male high-density terminal includes a fifth node male connector 88, a third control signal male connector 89, and a third power supply male connector 90.

[0116] Specifically, in the embodiment of the present application, the fifth node male connector 88 is used to receive PCIE signals from the processor of the node module 1. The PCIE signals from the processor of the node module 1 are connected to a total of 32 PCIE Lanes, of which 16 PCIE Lanes are connected to the first interface 85 for extending the X16 PCIE device 2, such as a GPU card or a smart network card, 8 PCIE Lanes are connected to the second interface 86, and the remaining 8 lanes are connected to the third interface 87.

[0117] Furthermore, in this embodiment of the present application, the third control signal male connector 89 is used to achieve communication interconnection with the baseboard management controller 7, specifically, to achieve interconnection of I2C and control signals. The third power supply male connector 90 is used to interconnect with the power board 631, draw power from the power board 631, and power the PCIE device 2 on the PCIE expansion board 8.

[0118] With this configuration, in the embodiments of the present application, for business scenarios with low performance requirements, customers may consider using only one node. When a customer only requires one node, the overall structure of node bracket 61, PCIE bracket 62, and device bracket 63 remains unchanged. Since only one node is used, only the other node and its associated peripheral cables need to be removed, thus meeting the needs of different customers.

[0119] Furthermore, in an embodiment of the present application, the dual nodes of the client system can use or support multi-host network card requirements, that is, the processors of the two node modules 1 each have an X8 PCIE Lane connected to the X16 network card, and the task requirements of the dual-node processors can be processed simultaneously through a single network card.

[0120] Due to the high cost of smart network cards and the current business scenarios of customers, using one smart network card on a single node cannot fully utilize the resources of the smart network card. Therefore, the application scenarios in which two or more nodes share a smart network card at the same time are also increasing. By adjusting the internal interconnection cables, the above demands can be quickly met.

[0121] For customers' different node usage scenarios, such as high-end multi-way servers or other multi-node servers, such as four-node, eight-node, and 16-node servers, combined with the above design, when the server is powered on, faulty nodes and faulty PCIE devices 2 can be quickly hot-maintained and seamlessly replaced to ensure business continuity and enhance customer experience.

[0122] Although the embodiments of the present application have been described with reference to the accompanying drawings, those skilled in the art may make various modifications and variations without departing from the spirit and scope of the present application, and such modifications and variations shall fall within the scope defined by the appended claims.

Claims

1. A server, characterized in that: include: A chassis (5) is provided with a mounting cavity therein; A node bracket (61) is provided with a female connector; the node bracket (61) is arranged in the installation cavity, and the node bracket (61) is used to install the node module (1); the male connector of the node module (1) is suitable for connecting with the female connector; A PCIE bracket (62) is provided with a female high-density terminal; the PCIE bracket (62) is arranged in the installation cavity, and the PCIE bracket (62) is used to install the PCIE device (2); the male high-density terminal of the PCIE device (2) is suitable for connecting with the female high-density terminal of the PCIE bracket (62); A device bracket (63) is arranged in the installation cavity; the device bracket (63) is used to install auxiliary equipment, and the auxiliary equipment at least includes an installation fan (3), a baseboard management controller (7) and a power supply (4); Cables are provided in the node bracket (61), the PCIE bracket (62) and the device bracket (63), and the female connector, the female high-density terminal and the auxiliary device are communicatively connected via the cables.

2. The server according to claim 1, wherein: When the node module (1) is installed on the node bracket (61) and the PCIE device (2) is installed on the PCIE bracket (62), the node module (1) and the PCIE device (2) are communicatively connected via the cable.

3. The server according to claim 2, wherein: When the node module (1) is installed on the node bracket (61) and the PCIE device (2) is installed on the PCIE bracket (62), the power supply (4) on the device bracket (63) supplies power to the node module (1) and the PCIE device (2).

4. The server according to claim 3, wherein: When the node module (1) is installed on the node bracket (61) and the PCIE device (2) is installed on the PCIE bracket (62), the baseboard management controller (7) sends a low-speed logic control signal to the node module (1) and the PCIE device (2).

5. The server according to any one of claims 1 to 4, characterized in that: The node bracket (61), the PCIE bracket (62) and the device bracket (63) are fixed to the bottom of the installation cavity through detachable components.

6. The server according to claim 5, wherein: The detachable components are hand screws and corresponding first screw holes opened on the node bracket (61), the PCIE bracket (62) and the device bracket (63), and second screw holes opened in the installation cavity.

7. The server according to any one of claims 1 to 5, characterized in that: The node bracket (61), the PCIE bracket (62) and the device bracket (63) are integrally formed into an integral bracket (6), and a cable channel (64) is formed in the integral bracket (6), and cables are arranged in the cable channel (64).

8. The server according to claim 7, wherein: The PCIE bracket (62) is located at the front window of the chassis (5), the fan (3) on the device bracket (63) is located in the middle of the chassis (5), the power supply (4) on the device bracket (63) is located on one side of the rear window of the chassis (5), and the node bracket (61) is located on the other side of the rear window of the chassis (5).

9. The server according to claim 8, wherein: The equipment support (63) comprises: A power board (631) is provided with two stacked power connectors (6311), and a power supply (4) is suitable for being plugged into the power connectors (6311); An auxiliary device board (632) is connected to the power board (631) via a board-to-board terminal (633), and the auxiliary device board (632) and the power board (631) are arranged vertically; the auxiliary device board (632) is used to install the fan (3) and the baseboard management controller (7).

10. The server according to claim 9, wherein: The auxiliary device board (632) is also provided with a power supply connector (6321), and the power supply (4) supplies power to the node module (1) and the PCIE device (2) in sequence through the power supply connector (6311), the power board (631), the board-to-board terminal (633), the auxiliary device board (632), and the power supply connector (6321).

11. The server according to claim 9 or 10, characterized in that: The node supports (61) are provided with two nodes, and the two node supports (61) are stacked.

12. The server according to claim 11, wherein: The node module (1) is provided with a processor, and a plurality of memory sticks are provided at both ends of the processor. The node module (1) is provided with a plurality of male connectors, and the male connectors are high-density connectors, and the high-density connectors at least include a first node male connector (11), a second node male connector (12), a first control signal male connector (13), and a first power supply male connector (14); The first node male connector (11) and the second node male connector (12) are used to provide PCIE high-speed signals for the PCIE device (2) and the NVME storage hard disk; The first control signal male connector (13) is used to provide a control signal for interconnection between the node module (1) and the baseboard management controller (7); The first power supply male connector (14) is used to be interconnected with a power supply (4) to at least supply power to the processor and the memory.

13. The server according to claim 12, wherein: The server further includes: A PCIE expansion board (8) is provided with a plurality of PCIE slots, wherein the PCIE slots are used for extending and connecting PCIE devices (2), wherein the PCIE devices (2) include at least a GPU, a smart network card, a multihost network card, and a RAID card; The PCIE expansion board (8) is provided with the male high-density terminal, and the male high-density terminal is suitable for connecting with the female high-density terminal of the PCIE bracket (62).

14. The server according to claim 13, wherein: When both node brackets (61) are provided with node modules (1), the male high-density terminal includes a third node male connector (81), a fourth node male connector (82), a second control signal male connector (83), and a second power supply male connector (84); The third node male connector (81) and the fourth node male connector (82) are used to receive PCIE signals from the processors of the two node modules (1); The second control signal male connector (83) is used to achieve communication interconnection with the baseboard management controller (7); The second power supply male connector (84) is used to interconnect with the power supply board (631), draw power from the power supply board (631), and supply power to the PCIE device (2) on the PCIE expansion board (8).

15. The server according to claim 13, wherein: When two node brackets (61) are provided with only one node module (1), the male high-density terminal includes a fifth node male connector (88), a third control signal male connector (89), and a third power supply male connector (90); The fifth node male connector (88) is used to receive a PCIE signal from the processor of the node module (1); The third control signal male connector (89) is used to achieve communication interconnection with the baseboard management controller (7); The third power supply male connector (90) is used to interconnect with the power supply board (631), draw power from the power supply board (631), and supply power to the PCIE device (2) on the PCIE expansion board (8).

16. The server according to claim 1, wherein: The power supply (4) in the device bracket (63) performs independent power supply and power-off operations on the node module (1) and the PCIE device (2) through cables.

17. The server according to any one of claims 1 to 4, characterized in that: The node bracket (61), the PCIE bracket (62) and the device bracket (63) are fixedly connected to the bottom of the installation cavity.

18. The server according to claim 5, wherein: A plurality of fixing plates are provided at the bottom of the installation cavity, and screw holes are opened on the fixing plates; another screw hole is opened on the node bracket (61), the PCIE bracket (62) and the device bracket (63) at a position corresponding to the screw hole, and the installation cavity is connected to the node bracket (61), the PCIE bracket (62) and the device bracket (63) by using screws.

19. The server according to claim 9, wherein: The baseboard management controller (7) is interconnected with the processor of the node module (1) via X1PCIE.

20. The server according to claim 19, wherein: The baseboard management controller (7) expands the system peripheral low-speed interface.

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