Distribution box, battery pack, and vehicle

Abstract

A vehicle. The vehicle comprises a battery pack, the battery pack comprises a distribution box, and the distribution box comprises a box body, a positive electrode loop, a negative electrode loop, a circuit breaker, and a heat dissipation device. The positive electrode loop is arranged in the box body, and the positive electrode loop comprises a first conductive connecting member and a second conductive connecting member. The negative electrode loop is arranged in the box body, and the negative electrode loop comprises a third conductive connecting member and a fourth conductive connecting member. A first positive terminal of the circuit breaker is connected to one end of the first conductive connecting member, a second positive terminal of the circuit breaker is connected to one end of the second conductive connecting member, a first negative terminal of the circuit breaker is connected to one end of the third conductive connecting member, and a second negative terminal of the circuit breaker is connected to one end of the fourth conductive connecting member. The heat dissipation device is arranged at a heat dissipation opening of the box body.

Description

Distribution boxes, battery packs and vehicles

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office of China on January 31, 2024, with application number 202420242382.8 and titled “Distribution box, battery pack and vehicle,” the entire contents of which are incorporated by reference into this application. Technical Field

[0003] The present application relates to the field of batteries, and more specifically to a distribution box, a battery pack and a vehicle. Background Art

[0004] In the distribution box of the battery pack, multiple high-voltage components are arranged in a plastic shell, and metal conductors are used to connect the high-voltage components to form a circuit. As users' demand for long-range and high-power electric vehicles increases, the voltage and current in the high-voltage circuit of the distribution box continue to increase, resulting in the need to use larger-sized high-voltage components. However, the space in the distribution box is small, which is not conducive to heat dissipation. In related technologies, the heat generated by components such as relays and fuses during operation can only be dissipated through the heat dissipation holes on the outer shell of the distribution box. This method has low heat dissipation efficiency and can easily cause components to overheat, which reduces the service life of high-voltage components.

[0005] Public content

[0006] The present application is made to solve at least one of the above problems.

[0007] According to a first aspect of the present application, a distribution box is provided, comprising: a box body; a positive circuit, the positive circuit being arranged in the box body, the positive circuit comprising a first conductive connector and a second conductive connector; a negative circuit, the negative circuit being arranged in the box body, the negative circuit comprising a third conductive connector and a fourth conductive connector; a circuit breaker, the first positive terminal of the circuit breaker being connected to one end of the first conductive connector, the second positive terminal of the circuit breaker being connected to one end of the second conductive connector, the first negative terminal of the circuit breaker being connected to one end of the third conductive connector, and the second negative terminal of the circuit breaker being connected to one end of the fourth conductive connector; and a heat dissipation device, the heat dissipation device being arranged at a heat dissipation port of the box body; wherein the heat dissipation port is provided on a side of the box body corresponding to the connection position of the circuit breaker with the positive circuit and the negative circuit.

[0008] In one embodiment of the present application, the heat dissipation device includes: a first thermally conductive adhesive and a heat dissipation module; the first side of the first thermally conductive adhesive is thermally connected to the first conductive connector, the second conductive connector, the third conductive connector and the fourth conductive connector respectively, and the second side of the first thermally conductive adhesive is thermally connected to the heat dissipation module.

[0009] In one embodiment of the present application, the heat dissipation module includes: a semiconductor refrigeration plate and a heat sink; the second side of the first thermal conductive adhesive is thermally connected to the first side of the semiconductor refrigeration plate, and the second side of the semiconductor refrigeration plate is thermally connected to the heat sink.

[0010] In one embodiment of the present application, the heat dissipation module further includes: a second thermally conductive adhesive, which is fixed between the semiconductor refrigeration fin and the heat sink.

[0011] In one embodiment of the present application, the distribution box also includes: a temperature sensor, which is arranged on the surface of the first conductive connector and is configured to collect the temperature of the first conductive connector; a battery management system, which is respectively connected to the temperature sensor and the semiconductor refrigeration chip, and is configured to control the on and off of the current in the semiconductor refrigeration chip according to the collection results of the temperature sensor.

[0012] In one embodiment of the present application, the semiconductor refrigeration fins and the heat sink are fixed to the outside of the box by bolts.

[0013] In one embodiment of the present application, the heat dissipation module is one of a liquid cooling plate and a phase change material.

[0014] In one embodiment of the present application, the first conductive connection member, the second conductive connection member, the third conductive connection member, and the fourth conductive connection member are copper busbars.

[0015] In one embodiment of the present application, the first conductive connector includes a first lead-out copper bar and a first connecting copper bar, the first lead-out copper bar, the first connecting copper bar and the first positive terminal of the circuit breaker are connected in sequence, the first lead-out copper bar partially extends to the outside of the box, and the first connecting copper bar is located in the box; the second conductive connector includes a second lead-out copper bar and a second connecting copper bar, the second lead-out copper bar, the second connecting copper bar and the second positive terminal of the circuit breaker are connected in sequence, the second lead-out copper bar partially extends to the outside of the box, and the second connecting copper bar is located Inside the box; the third conductive connector includes a third lead-out copper bar and a third connecting copper bar, the third lead-out copper bar, the third connecting copper bar and the first negative terminal of the circuit breaker are connected in sequence, the third lead-out copper bar partially extends to the outside of the box, and the third connecting copper bar is located in the box; the fourth conductive connector includes a fourth lead-out copper bar and a fourth connecting copper bar, the fourth lead-out copper bar, the fourth connecting copper bar and the second negative terminal of the circuit breaker are connected in sequence, the fourth lead-out copper bar partially extends to the outside of the box, and the fourth connecting copper bar is located in the box.

[0016] In one embodiment of the present application, the distribution box further includes: a high-voltage sampling unit, which is connected between the third lead-out copper bus and the third connection copper bus and is configured to stabilize the voltage.

[0017] In one embodiment of the present application, the distribution box also includes: a pre-charging circuit, which is arranged in the box body, and the pre-charging circuit includes a pre-charging resistor and a pre-charging relay connected in sequence, the first end of the pre-charging resistor is connected to the first conductive connector, the second end of the pre-charging resistor is connected to the first end of the pre-charging relay, and the second end of the pre-charging relay is connected to the second conductive connector.

[0018] According to a second aspect of the present application, a battery pack is provided, comprising: any one of the above-mentioned distribution boxes.

[0019] According to a third aspect of the present application, a vehicle is provided, comprising: the above-mentioned battery pack.

[0020] According to the distribution box, battery pack, and vehicle provided in the embodiments of the present application, the distribution box of the present application uses a circuit breaker to reduce the number of components within the distribution box, lowering manufacturing costs and reducing the heat generated within the distribution box. The use of a heat dissipation device allows the components within the distribution box to dissipate heat more quickly through the heat dissipation vents, thereby extending the service life of the components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0022] FIG1 is a bottom view of a distribution box provided in one embodiment of the present application;

[0023] FIG2 is a schematic diagram of the internal structure of a distribution box provided in one embodiment of the present application;

[0024] FIG3 is an exploded view of a distribution box provided in one embodiment of the present application;

[0025] FIG4 is a schematic diagram of a linear structure provided by an embodiment of the present application;

[0026] FIG5 is a schematic diagram of a straight line + stepped structure provided in one embodiment of the present application;

[0027] FIG6 is a schematic diagram of a step-type structure provided by an embodiment of the present application;

[0028] FIG7 is a schematic diagram of a smooth curve provided by an embodiment of the present application;

[0029] FIG8 is a schematic diagram of a circuit breaker provided in one embodiment of the present application;

[0030] FIG9 is a schematic diagram of a circuit breaker provided by an embodiment of the present application from another angle;

[0031] FIG10 is a schematic structural diagram of a battery pack provided in one embodiment of the present application;

[0032] FIG11 is a schematic structural diagram of a vehicle provided in an embodiment of the present application.

[0033] Reference numerals:

[0034] Vehicle 1,

[0035] Battery pack 10, distribution box 100,

[0036] Box 1001, positive electrode circuit 1002, first conductive connector 10021, first lead copper bar 100211, first connecting copper bar 100212, second conductive connector 10022, second lead copper bar 100221, second connecting copper bar 100222, negative electrode circuit 1003, third conductive connector 10031, third lead copper bar 100311, third connecting copper bar 100312, fourth conductive connector 10032, fourth lead copper bar 100321, fourth connecting copper bar 100322, circuit breaker 1004, first positive terminal 10041, first negative terminal 10042, second positive terminal 10043, second Negative terminal 10044, heat dissipation device 1005, first thermally conductive adhesive 10051, first side surface 100511 of the first thermally conductive adhesive, second side surface 100512 of the first thermally conductive adhesive, heat dissipation module 10052, semiconductor refrigeration plate 100521, first side surface 1005211 of the semiconductor refrigeration plate, second side surface 1005212 of the semiconductor refrigeration plate, heat sink 100522, second thermally conductive adhesive 100523, bolt 100524, low-voltage connector 1006, temperature sensor 1007, battery management system 1008, pre-charging circuit 1009, pre-charging resistor 10091, pre-charging relay 10092, and high-voltage sampling unit 1010. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solutions and advantages of the present application more apparent, the following will describe in detail an example embodiment of the present application with reference to the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application, and it should be understood that the present application is not limited to the example embodiments described herein. Based on the embodiments of the present application described in this application, all other embodiments obtained by those skilled in the art without creative work should fall within the scope of protection of this application.

[0038] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it will be apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, some technical features well known in the art are not described in order to avoid confusion with the present application.

[0039] It should be understood that the present application can be implemented in different forms and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and will fully convey the scope of the present application to those skilled in the art.

[0040] In order to fully understand the present application, a detailed structure will be provided in the following description to illustrate the technical solution proposed by the present application. The optional embodiments of the present application are described in detail below. However, in addition to these detailed descriptions, the present application may also have other implementation methods.

[0041] The following describes some embodiments of the present application in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0042] The present application provides a distribution box, as shown in Figures 1 and 2, 8 and 9, the distribution box 100 includes a box body 1001, a positive circuit 1002, a negative circuit 1003, a circuit breaker 1004 and a heat dissipation device 1005.

[0043] The positive electrode circuit 1002 is disposed in the box 1001 , and the positive electrode circuit 1002 includes a first conductive connector 10021 and a second conductive connector 10022 .

[0044] The negative electrode circuit 1003 is disposed in the box 1001 , and includes a third conductive connector 10031 and a fourth conductive connector 10032 .

[0045] The first positive terminal 10041 of the circuit breaker 1004 is connected to one end of the first conductive connector 10021, the second positive terminal 10043 of the circuit breaker 1004 is connected to one end of the second conductive connector 10022, the first negative terminal 10042 of the circuit breaker 1004 is connected to one end of the third conductive connector 10031, and the second negative terminal 10044 of the circuit breaker 1004 is connected to one end of the fourth conductive connector 10032.

[0046] It should be noted that circuit breaker 1004 effectively controls and protects the circuit. When current flows through circuit breaker 1004 and a fault such as an overload or short circuit occurs, circuit breaker 1004 automatically disconnects the circuit to protect circuit components from damage caused by the overcurrent. Furthermore, by replacing the fuses and relays originally present in distribution box 100 with circuit breaker 1004, the number of components is reduced, thereby lowering heat generation within distribution box 100.

[0047] The heat dissipation device 1005 is provided at the heat dissipation opening of the box body 1001. A heat dissipation opening is provided on one side of the box body 1001 corresponding to the connection position of the circuit breaker 1004 with the positive circuit 1002 and the negative circuit 1003.

[0048] As an example, the heat sink 1005 can remove heat from the distribution box 100 through the heat dissipation port. Specifically, the heat sink 1005 can contact the aforementioned connection locations through a heat-conducting but non-conductive component to transfer heat from the first conductive connector 10021, the second conductive connector 10022, the third conductive connector 10031, the fourth conductive connector 10032, and the circuit breaker 1004 to the heat sink 1005.

[0049] As another example, the distribution box 100 further includes a low-voltage connector 1006 , which is connected to the entire vehicle to control the battery pack and provide stable and reliable power distribution.

[0050] The distribution box 100 of the embodiment of the present application uses a circuit breaker 1004, which reduces the number of components within the distribution box 100, lowers manufacturing costs, and reduces the heat generated within the distribution box 100. The use of a heat sink 1005 accelerates heat dissipation from components within the distribution box 100 through heat dissipation ports, thereby increasing the service life of the components.

[0051] In some embodiments, the heat dissipation device 1005 includes a first thermally conductive adhesive 10051 and a heat dissipation module 10052. A first side 100511 of the first thermally conductive adhesive 10051 is thermally connected to the first conductive connector 10021, the second conductive connector 10022, the third conductive connector 10031, and the fourth conductive connector 10032, respectively. A second side 100512 of the first thermally conductive adhesive 10051 is thermally connected to the heat dissipation module 10052.

[0052] Specifically, the first thermally conductive adhesive 10051 transfers heat from the first conductive connector 10021 , the second conductive connector 10022 , the third conductive connector 10031 and the fourth conductive connector 10032 to the heat dissipation module 10052 , and the heat dissipation module 10052 quickly takes the heat away from the first thermally conductive adhesive 10051 .

[0053] In this embodiment, the first thermal conductive adhesive 10051 and the heat dissipation module 10052 can effectively reduce the temperature inside the distribution box 100, ensuring that the components operate within a normal temperature range, thereby extending the service life of the components and improving stability.

[0054] In some embodiments, as shown in FIG3 , the heat dissipation module 10052 includes a semiconductor cooling plate 100521 and a heat sink 100522. The second side 100512 of the first thermally conductive adhesive 10051 is thermally connected to the first side 1005211 of the semiconductor cooling plate 100521, and the second side 1005212 of the semiconductor cooling plate 100521 is thermally connected to the heat sink 100522.

[0055] The semiconductor cooling plate 100521 shown in FIG. 3 can be connected to the battery management system 1008 via a wire.

[0056] It should be noted that semiconductor cooling chip 100521 has the characteristics of being vibration-free, noise-free, refrigerant-free, providing real-time temperature control, and a wide controllable temperature range. Semiconductor cooling chip 100521 is a heat transfer tool. When current flows through a thermocouple pair composed of an N-type semiconductor material and a P-type semiconductor material, heat transfer occurs between the two ends. Heat is transferred from one end to the other, creating a temperature difference between the hot and cold ends, which removes heat from the distribution box 100.

[0057] Specifically, each terminal of the circuit breaker 1004 can be designed to face the direction of the semiconductor cooling plate 100521 to facilitate the arrangement of the first thermal conductive adhesive 10051.

[0058] As an example, the box body 1001 of the distribution box 100 may be open at the bottom to form a heat dissipation vent. Meanwhile, the connection points of the circuit breaker 1004, the positive circuit 1002, and the negative circuit 1003 are arranged at the bottom of the distribution box 100, and the semiconductor cooling plate 100521 is also correspondingly arranged at the bottom of the distribution box 100.

[0059] Specifically, the heat dissipation module 10052 also includes a second thermally conductive adhesive 100523 , which is fixed between the semiconductor refrigeration plate 100521 and the heat dissipation plate 100522 .

[0060] In this embodiment, heat within the distribution box 100 is efficiently transferred from the semiconductor cooling fins 100521 to the heat sinks 100522 via the semiconductor cooling fins 100521, ensuring that components operate within a suitable temperature range. Furthermore, the use of thermally conductive adhesive for fixing the components reduces the size of the distribution box 100, saving space.

[0061] In some embodiments, as shown in FIG. 2 , the distribution box 100 further includes a temperature sensor 1007 and a battery management system 1008 .

[0062] The temperature sensor 1007 is disposed on the surface of the first conductive connection member 10021 and is configured to collect the temperature of the first conductive connection member 10021 .

[0063] The battery management system 1008 (BMS) is connected to the temperature sensor 1007 and the semiconductor refrigeration chip 100521 respectively, and is configured to control the on-off of the current in the semiconductor refrigeration chip 100521 according to the collection results of the temperature sensor 1007.

[0064] As an example, when the distribution box 100 is overcurrent, the first conductive connector 10021 will generate heat, and the temperature sensor 1007 collects the temperature on the first conductive connector 10021 and sends it to the battery management system 1008. When it is detected that the collected temperature is greater than the preset temperature, the battery management system 1008 supplies power to the semiconductor refrigeration chip 100521, and the semiconductor refrigeration chip 100521 starts working to take away the heat in the distribution box 100.

[0065] As another example, the distribution box 100 may also include a BMC (Battery Management Controller), which is connected to the BMS and the semiconductor refrigeration chip 100521 respectively, and is configured to control the on and off of the current in the semiconductor refrigeration chip 100521 according to information provided by the BMS.

[0066] Since the semiconductor refrigeration chip 100521 is easy to control accurately, an operating strategy can be set in the BMS to match the temperature with the heat dissipation power, rather than running at full power immediately after reaching the set temperature, which can reduce energy consumption.

[0067] Specifically, the operation strategy can be set to straight line, straight line + step, step and smooth curve.

[0068] As an example, as shown in Figure 4, the linear operation strategy, where heat dissipation power is proportional to temperature, is relatively simple and places less pressure on the BMS. However, this control strategy is limited. When temperatures rise to extremely high levels, the semiconductors cannot operate at full power, significantly impacting heat dissipation. As shown in Figure 5, adding a high-temperature control point to the linear strategy transforms it into a linear-plus-stepped operation strategy. This strategy achieves linear power control before the high-temperature control point and enables full power operation of the semiconductor cooling element 100521 after the high-temperature control point. As shown in Figure 6, adding multiple temperature control points to the linear-plus-stepped operation strategy transforms it into a stepped operation strategy. This strategy is more temperature-sensitive, more closely matches the heating curve of the electrical distribution box, and achieves better heat dissipation. As shown in Figure 7, further adding temperature control points results in a smoother curve, meaning it more closely matches the actual heating curve and improves heat dissipation. However, a smooth curve operation strategy is challenging, places high demands on the BMS, and requires extensive experimental data for fitting.

[0069] In this embodiment, the semiconductor refrigeration plate 100521 can be precisely controlled through the battery management system 1008 and the temperature sensor 1007, so that the distribution box 100 is in the best working state, thereby increasing the service life of the components.

[0070] In some embodiments, as shown in FIG3 , the semiconductor cooling fins 100521 and the heat sinks 100522 are fixed to the outside of the box 1001 by bolts 100524 .

[0071] As an example, the number of bolts 100524 can be 4, located at the four corners of the heat sink 100522 respectively.

[0072] In some embodiments, the heat dissipation module 10052 is one of a liquid cooling plate and a phase change material.

[0073] It should be noted that a liquid cold plate utilizes a liquid cooling medium (usually water or other coolant) to absorb and dissipate heat. In a liquid cold plate, the coolant flows through a thermally conductive material or pipe, absorbing heat before flowing to a radiator, where it transfers the heat to the surrounding environment. Phase change material (PCM) is a material that can absorb or release large amounts of heat when the temperature changes. PCMs typically exist in solid form. When the temperature rises, they absorb heat and undergo a phase change, storing the heat. When the temperature drops, they release the stored heat.

[0074] In this embodiment, the temperature inside the distribution box 100 can be effectively reduced by the liquid cooling plate or the phase change material, thereby improving the heat dissipation effect of the heat dissipation module 10052 .

[0075] In some embodiments, the first conductive connection 10021 , the second conductive connection 10022 , the third conductive connection 10031 , and the fourth conductive connection 10032 are copper busbars.

[0076] Specifically, as shown in Figures 8 and 9, the first conductive connector 10021 includes a first lead-out copper bar 100211 and a first connecting copper bar 100212. The first lead-out copper bar 100211, the first connecting copper bar 100212, and the first positive terminal 10041 of the circuit breaker 1004 are connected in sequence. The first lead-out copper bar 100211 partially extends outside the box 1001, and the first connecting copper bar 100212 is located inside the box 1001. The second conductive connector 10022 includes a second lead-out copper bar 100221 and a second connecting copper bar 100222. The second lead-out copper bar 100221, the second connecting copper bar 100222, and the second positive terminal 10043 of the circuit breaker 1004 are connected in sequence. The second lead-out copper bar 100221 partially extends outside the box 1001, and the second connecting copper bar 100222 is located inside the box 1001. The third conductive connector 10031 includes a third lead-out copper bar 100311 and a third connecting copper bar 100312. The third lead-out copper bar 100311, the third connecting copper bar 100312, and the first negative terminal 10042 of the circuit breaker 1004 are sequentially connected. The third lead-out copper bar 100311 partially extends outside the box 1001, and the third connecting copper bar 100312 is located inside the box 1001. The fourth conductive connector 10032 includes a fourth lead-out copper bar 100321 and a fourth connecting copper bar 100322. The fourth lead-out copper bar 100321, the fourth connecting copper bar 100322, and the second negative terminal 10044 of the circuit breaker 1004 are sequentially connected. The fourth lead-out copper bar 100321 partially extends outside the box 1001, and the fourth connecting copper bar 100322 is located inside the box 1001.

[0077] In this embodiment, copper has excellent thermal conductivity, transferring heat quickly and aiding in dissipating the heat.

[0078] In some embodiments, as shown in FIG2 , the distribution box 100 further includes a pre-charging circuit 1009. The pre-charging circuit 1009 is disposed within the box body 1001 and includes a pre-charging resistor 10091 and a pre-charging relay 10092 connected in sequence. The first end of the pre-charging resistor 10091 is connected to the first conductive connector 10021, the second end of the pre-charging resistor 10091 is connected to the first end of the pre-charging relay 10092, and the second end of the pre-charging relay 10092 is connected to the second conductive connector 10022.

[0079] In this embodiment, the pre-charging circuit 1009 provides a pre-charging function when the distribution box 100 is started, thereby controlling the rate of current rise and protecting the circuit from damage caused by excessive starting current. At the same time, it prevents the temperature of components in the circuit from rising due to excessive current.

[0080] In some embodiments, the distribution box 100 further includes a high voltage sampling unit 1010 (High Voltage Sampling Unit, HVSU), which is connected between the third lead copper bus 100311 and the third connection copper bus 100312 and is configured to stabilize the voltage.

[0081] In this embodiment, the high voltage sampling unit 1010 can monitor the output voltage in real time and adjust it as needed to ensure stable voltage output.

[0082] In addition, the present application provides a battery pack 10 , as shown in FIG10 , the battery pack 10 includes any one of the above-mentioned distribution boxes 100 .

[0083] The battery pack 10 of the embodiment of the present application can reduce the production cost of the battery pack 10 and improve the heat dissipation efficiency of the battery pack 10 by using the distribution box 100.

[0084] In addition, the present application provides a vehicle 1 , as shown in FIG11 , the vehicle 1 includes the above-mentioned battery pack 10 .

[0085] The vehicle 1 according to the embodiment of the present application can reduce the production cost of the entire vehicle and improve the heat dissipation efficiency by using the battery pack 10.

[0086] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely illustrative and are not intended to limit the scope of the present application. Various changes and modifications may be made therein by those skilled in the art without departing from the scope and spirit of the present application. All such changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0087] In the several embodiments provided in this application, it should be understood that the disclosed devices can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is only one functional division. In actual implementation, other division methods may be used. For example, multiple units or components may be combined or integrated into another device, or some features may be ignored or not implemented.

[0088] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known structures and technologies are not shown in detail so as not to obscure the understanding of this description.

[0089] Similarly, it should be understood that in order to streamline the present application and aid understanding of one or more of the various application aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. The claimed application requires more features than those explicitly recited in each claim. More specifically, as reflected in the corresponding claims, the claim is that the corresponding technical problem can be solved with fewer features than all the features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into the detailed description, with each claim itself serving as a separate embodiment of the present application.

[0090] It will be understood by those skilled in the art that, except where mutually exclusive, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all units of any device disclosed herein may be combined in any combination. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature providing the same, equivalent, or similar purpose.

[0091] Furthermore, those skilled in the art will appreciate that although some embodiments described herein include certain features that are included in other embodiments but not other features, combinations of features from different embodiments are intended to be within the scope of this application and to form different embodiments. For example, in the claims, any of the claimed embodiments may be used in any combination.

[0092] It should be noted that the above embodiments illustrate rather than limit the present application, and that a person skilled in the art may devise alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbols placed between brackets should not be construed as limiting the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements. The present application may be implemented by means of hardware comprising several different elements and by means of appropriately programmed computers. In a unit claim enumerating several means, several of these means may be embodied by the same item of hardware. The use of the words first, second, and third etc. does not indicate any order. These words may be interpreted as names.

[0093] The above description is merely a specific embodiment or illustration of a specific embodiment of the present application, and the scope of protection of the present application is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present application should be included in the scope of protection of the present application. The scope of protection of the present application should be based on the scope of protection of the claims.

Claims

1. A distribution box (100), characterized in that: The distribution box (100) comprises: Box (1001); A positive electrode circuit (1002), the positive electrode circuit (1002) is arranged in the box (1001), and the positive electrode circuit (1002) includes a first conductive connector (10021) and a second conductive connector (10022); A negative electrode circuit (1003), the negative electrode circuit (1003) is arranged in the box (1001), and the negative electrode circuit (1003) includes a third conductive connector (10031) and a fourth conductive connector (10032); A circuit breaker (1004), wherein a first positive terminal (10041) of the circuit breaker (1004) is connected to one end of the first conductive connector (10021), a second positive terminal (10043) of the circuit breaker (1004) is connected to one end of the second conductive connector (10022), a first negative terminal (10042) of the circuit breaker (1004) is connected to one end of the third conductive connector (10031), and a second negative terminal (10044) of the circuit breaker (1004) is connected to one end of the fourth conductive connector (10032); and a heat dissipation device (1005), the heat dissipation device (1005) being arranged at a heat dissipation opening of the box (1001); The heat dissipation opening is provided on one side of the box (1001) corresponding to the connection position between the circuit breaker (1004) and the positive circuit (1002) and the negative circuit (1003).

2. The distribution box (100) according to claim 1, characterized in that: The heat dissipation device (1005) comprises: a first thermally conductive adhesive (10051) and a heat dissipation module (10052); The first side surface (100511) of the first thermally conductive adhesive (10051) is thermally connected to the first conductive connector (10021), the second conductive connector (10022), the third conductive connector (10031) and the fourth conductive connector (10032), respectively; and the second side surface (100512) of the first thermally conductive adhesive (10051) is thermally connected to the heat dissipation module (10052).

3. The distribution box (100) according to claim 2, characterized in that: The heat dissipation module (10052) comprises: a semiconductor refrigeration plate (100521) and a heat dissipation plate (100522); The second side surface (100512) of the first thermally conductive adhesive (10051) is thermally connected to the first side surface (1005211) of the semiconductor refrigeration sheet (100521), and the second side surface (1005212) of the semiconductor refrigeration sheet (100521) is thermally connected to the heat sink (100522).

4. The distribution box (100) according to claim 3, characterized in that: The heat dissipation module (10052) further includes: a second heat-conducting adhesive (100523), wherein the second heat-conducting adhesive (100523) is fixed between the semiconductor refrigeration plate (100521) and the heat dissipation plate (100522).

5. The distribution box (100) according to claim 3 or 4, characterized in that: The distribution box (100) further includes: a temperature sensor (1007), the temperature sensor (1007) being provided on the surface of the first conductive connection member (10021) and being configured to collect the temperature of the first conductive connection member (10021); A battery management system (1008) is connected to the temperature sensor (1007) and the semiconductor refrigeration chip (100521) respectively, and is configured to control the on / off of the current in the semiconductor refrigeration chip (100521) according to the collection result of the temperature sensor (1007).

6. The distribution box (100) according to any one of claims 3 to 5, characterized in that: The semiconductor refrigeration fin (100521) and the heat sink (100522) are fixed to the outside of the box (1001) by bolts (100524).

7. The distribution box (100) according to any one of claims 2 to 6, characterized in that: The heat dissipation module (10052) is one of a liquid cooling plate and a phase change material.

8. The distribution box (100) according to any one of claims 1 to 7, characterized in that: The first conductive connecting member (10021), the second conductive connecting member (10022), the third conductive connecting member (10031) and the fourth conductive connecting member (10032) are copper busbars.

9. The distribution box (100) according to any one of claims 1 to 8, characterized in that: The first conductive connecting member (10021) comprises a first lead-out copper bar (100211) and a first connecting copper bar (100212); the first lead-out copper bar (100211), the first connecting copper bar (100212), and the first positive terminal (10041) of the circuit breaker (1004) are connected in sequence; a portion of the first lead-out copper bar (100211) extends outside the box (1001), and the first connecting copper bar (100212) is located inside the box (1001); The second conductive connecting member (10022) comprises a second lead-out copper bar (100221) and a second connecting copper bar (100222); the second lead-out copper bar (100221), the second connecting copper bar (100222) and the second positive terminal (10043) of the circuit breaker (1004) are connected in sequence; the second lead-out copper bar (100221) partially extends to the outside of the box (1001), and the second connecting copper bar (100222) is located inside the box (1001); The third conductive connecting member (10031) comprises a third lead-out copper bar (100311) and a third connecting copper bar (100312); the third lead-out copper bar (100311), the third connecting copper bar (100312) and the first negative terminal (10042) of the circuit breaker (1004) are connected in sequence; a portion of the third lead-out copper bar (100311) extends outside the box (1001), and the third connecting copper bar (100312) is located inside the box (1001); The fourth conductive connecting member (10032) comprises a fourth lead-out copper bar (100321) and a fourth connecting copper bar (100322); the fourth lead-out copper bar (100321), the fourth connecting copper bar (100322) and the second negative terminal (10044) of the circuit breaker (1004) are connected in sequence; the fourth lead-out copper bar (100321) partially extends to the outside of the box (1001), and the fourth connecting copper bar (100322) is located inside the box (1001).

10. The distribution box (100) according to claim 9, characterized in that: The distribution box (100) further comprises: a high-voltage sampling unit (1010), wherein the high-voltage sampling unit (1010) is connected between the third lead-out copper bus (100311) and the third connection copper bus (100312) and is configured to stabilize the voltage.

11. The distribution box (100) according to any one of claims 1 to 10, characterized in that: The distribution box (100) further comprises: a pre-charging circuit (1009), wherein the pre-charging circuit (1009) is arranged in the box body (1001), and the pre-charging circuit (1009) comprises a pre-charging resistor (10091) and a pre-charging relay (10092) connected in sequence, wherein the first end of the pre-charging resistor (10091) is connected to the first conductive connecting member (10021), the second end of the pre-charging resistor (10091) is connected to the first end of the pre-charging relay (10092), and the second end of the pre-charging relay (10092) is connected to the second conductive connecting member (10022).

12. A battery pack (10), characterized in that: include: The distribution box (100) according to any one of claims 1 to 11.

13. A vehicle (1), characterized in that include: The battery pack (10) as claimed in claim 12.

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