Tiling substrate for LED display device

Abstract

Provided is a tiling substrate for an LED display device, which facilitates the layout of wires connected to respective LEDs while securing the area to mount the LEDs. The tiling substrate comprises: an image signal wire and a scan signal wire installed on the front side; an image pad group and a scan pad group installed on the rear side; an image signal through-hole installation unit having an image signal through-hole formed to connect the wire from the image pad group and the image signal wire; and a scan signal through-hole installation unit having a scan signal through-hole formed to connect the wire from the scan pad group and the scan signal wire. The image pad group is disposed at a portion at which the scan signal through-hole installation unit is not disposed, or is disposed such that a dummy pad is disposed at the portion at which the scan signal through-hole installation unit is disposed. The scan pad group is disposed at a portion at which the image signal through-hole installation unit is not disposed, or is disposed such that a dummy pad is disposed at the portion at which the image signal through-hole installation unit is disposed.

Description

Tiling substrate for LED display devices

[0001] The present invention relates to a tiling substrate for an LED display device.

[0002] Recently, the screen size of display devices has become possible through tiling modules formed by arranging multiple tiling substrates equipped with LEDs (Light Emitting Diodes) in a tile shape.

[0003] The following patent document describes the following prior art. A module substrate having a plurality of light-emitting elements mounted on its upper surface is provided with a through hole penetrating the module substrate and a via provided within the through hole, which is installed in a non-pixel area outside the pixel area of ​​the module substrate. Each light-emitting element is connected to a driving circuit provided on the lower surface of the module substrate through an upper pad and wiring, via, and a lower pad and wiring on the lower surface of the module substrate. Then, a plurality of display modules are arranged on a supporting substrate.

[0004] [Prior Art Literature]

[0005] [Patent Document; Japanese Patent Publication No. 2023-504666]

[0006] However, due to the increasing density of LED mounting, it is becoming increasingly difficult to lay out the wiring connecting each LED while ensuring sufficient LED mounting area. The above-mentioned prior art cannot address this issue.

[0007] The present invention has been made to solve the above problem. That is, the purpose of the present invention is to provide a tiling substrate for an LED display device that facilitates the layout of wiring connecting each LED while sufficiently securing an area for mounting the LED.

[0008] The above task is solved by the following means.

[0009] A plurality of video signal wirings installed on the surface side of a tiling substrate for an LED display device and for supplying power to a plurality of LEDs installed on the surface side;

[0010] Wiring for a scan signal arranged on the surface side and controlling the conduction and non-conduction of power to the plurality of LEDs;

[0011] At least one group of image pads installed on the back side of the tiling substrate for the LED display device and connected to an output terminal of at least one image driver IC that outputs an image signal;

[0012] At least one scan pad group installed on the back side and connected to an output terminal of at least one scan driver IC that outputs a scan signal;

[0013] At least one video signal through-hole installation part for forming a video signal through-hole for connecting the video signal wiring and the wiring extending from each video pad of the video pad group; and

[0014] At least one scan signal through-hole installation part is provided for forming a scan signal through-hole for connecting the wiring extending from each scan pad of the scan pad group and the wiring for the scan signal,

[0015] The wiring extending from each image pad of the image pad group and the at least one through-hole installation portion for the image signal, and the wiring extending from each scan pad of the scan pad group and the through-hole installation portion for the scan signal are electrically insulated from each other,

[0016] The above image pad group is arranged so that, when viewed from a plane, the through-hole installation portion for the scan signal is not arranged in a portion where the through-hole installation portion for the scan signal is arranged, or an electrically floating dummy pad is installed in a portion where the through-hole installation portion for the scan signal is arranged.

[0017] A tiling substrate for an LED display device, wherein the above scan pad group is arranged in a portion where the through-hole installation portion for the image signal is not arranged when viewed from a plane, or an electrically floating dummy pad is installed in a portion where the through-hole installation portion for the image signal is arranged.

[0018] In a tiling substrate for an LED display device, it is possible to easily layout wiring connecting to each LED while securing a sufficient area for mounting the LED.

[0019] Figure 1 is a schematic diagram showing an example of the configuration of a tiling substrate.

[0020] Figure 2 is a schematic diagram showing the connection relationship between each LED and the TGV for the image signal and the TGV for the scan signal on the surface of the tiling substrate.

[0021] Figure 3 is a cross-sectional view of a portion of a tiling substrate where an LED is mounted.

[0022] Fig. 4 is a schematic diagram illustrating some layout configurations of TGVs for image signals and TGVs for scan signals on a tiling substrate.

[0023] Fig. 5 is a drawing showing a cross-sectional view of a tiling substrate.

[0024] Figure 6 is a schematic diagram illustrating an example of a layout configuration of a tiling substrate surface.

[0025] Figure 7 is a schematic diagram showing an example of a layout configuration on the back of a tiling substrate.

[0026] Figure 8 is an explanatory diagram showing a state in which a film substrate is connected to each of the FOG pad group for image signals and the FOG pad group for scan signals on the back of the tiling substrate.

[0027] Figure 9 is an explanatory diagram showing the layout of wiring extending from the FOG pad group for scan signals, the TGV group for image signals, and the FOG pad group for scan signals.

[0028] Figure 10 is an explanatory diagram showing an example of the layout of a FOG pad group for a scan signal and a TGV group for a video signal.

[0029] Figure 11 is an explanatory diagram showing an example of the layout of wiring extending from a TGV group for a video signal and a FOG pad group for a scan signal.

[0030] Figure 12 is an explanatory diagram showing another example of the layout of wiring extending from a TGV group for a video signal and a FOG pad group for a scan signal.

[0031] Figure 13 is a drawing showing a modified example of a dummy pad.

[0032] Figure 14 is a schematic diagram illustrating another example of a layout configuration on the back of a tiling substrate.

[0033] Figure 15 is a schematic diagram illustrating another example of a tiling substrate configuration.

[0034] Fig. 16 is a diagram showing a pixel circuit that performs constant current control and PWM control for each LED.

[0035] Figure 17 is a cross-sectional view showing a TFT layer in which a TFT of a pixel circuit is formed.

[0036] Fig. 18 is a drawing showing a first example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0037] Fig. 19 is a drawing showing a second example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0038] Fig. 20 is a drawing showing a third example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0039] Figure 21 is a drawing showing a fourth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0040] Fig. 22 is a drawing showing a fifth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0041] Fig. 23 is a drawing showing a sixth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0042] Fig. 24 is a drawing showing a seventh example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0043] Fig. 25 is a drawing showing an eighth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0044] Fig. 26 is a drawing showing a ninth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0045] Fig. 27 is a drawing showing a tenth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0046] Fig. 28 is a drawing showing an eleventh example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0047] Fig. 29 is a drawing showing a twelfth example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0048] Fig. 30 is a drawing showing a 13th example of the layout of a TGV area for a scan signal and a FOG pad group for a scan signal.

[0049] Figure 31 is a drawing showing the surface of a tiling module in which a plurality of tiling substrates are arranged in a tile shape.

[0050] Figure 32 is a drawing showing the back side of a tiling module in which multiple tiling substrates are arranged in a tile shape.

[0051] Figure 33 is a drawing showing each LED and wiring for image signals and wiring for scan signals on the surface of a tiling substrate of a comparative example.

[0052] Figure 34 is an explanatory drawing for explaining side wiring.

[0053] Below, a tiling substrate for an LED display device is described in detail based on the drawings. The described embodiments are merely exemplary, and various modifications are possible from these embodiments. In the drawings, like reference numerals designate like elements, and the sizes of each element in the drawings are exaggerated for clarity and convenience.

[0054] Hereinafter, the expression "upper" or "upper" includes not only things that are directly above / below / left / right in contact, but also things that are directly above / below / left / right in non-contact.

[0055] Terms like "first" and "second" are used to describe various components, but are used solely to distinguish one component from another. These terms do not limit the differences in material or structure of the components.

[0056] Singular expressions include plural expressions unless the context clearly indicates otherwise. Furthermore, when a particular part is said to "include" a particular component, this means that it may additionally include other components, without excluding other components, unless the contrary is specifically stated.

[0057] Additionally, terms such as “unit” and “module” described in this specification mean a unit that processes one or more functions or operations, which is implemented by hardware or software, or by a combination of hardware and software.

[0058] Hereinafter, for ease of explanation, the side on which the LEDs (101 to 103) (see Fig. 2) of the tiling substrate (100) are mounted is referred to as the “surface,” and the side opposite to the “surface” is also referred to as the “back side.”

[0059] Fig. 1 is a schematic diagram showing an example of the configuration of a tiling substrate (100). Fig. 2 is a schematic diagram showing a connection relationship between each LED and a TGV (Through Glass Via) (110) for an image signal and a TGV (120) for a scan signal on the surface of the tiling substrate (100). Fig. 3 is a cross-sectional view of a portion of the tiling substrate (100) on which LEDs (101 to 103) are mounted. Fig. 4 is a schematic diagram showing a partial layout configuration of a TGV (110) for an image signal and a TGV (120) for a scan signal on the tiling substrate (100). Fig. 5 is a drawing showing a cross-sectional view of the tiling substrate (100). Fig. 6 is a schematic diagram showing an example of the layout configuration on the surface of the tiling substrate (100). Fig. 7 is a schematic diagram showing an example of the layout configuration on the back surface of the tiling substrate (100).

[0060] Figures 1 and 2 illustrate the configuration and connection relationship of a passive matrix driving method.

[0061] As illustrated in FIG. 1, in the tiling substrate (100), each LED (101 to 103) mounted on the surface of the glass substrate (190) (see FIG. 3) is connected to an image driver IC (integrated circuit chip) (150) and a scan driver IC (170) mounted on the back surface of the glass substrate (190). LEDs 101, LED 102, and LED 103 may be red light-emitting diodes, green light-emitting diodes, and blue light-emitting diodes, respectively. LEDs (101 to 103) may be micro LEDs (uLEDs). One pixel is configured by three LEDs that emit light in different colors (red, green, and blue). LEDs (101 to 103) are arranged in a matrix shape. Hereinafter, LEDs (101 to 103) arranged in the same row in the column direction are referred to as LEDs (101 to 103) of the same row. In addition, LEDs (101 to 103) arranged in the same row in the row direction are called LEDs (101 to 103) of the same row. The column direction may correspond to the vertical direction when the tiling substrate (100) is viewed in a plane. The row direction may correspond to the horizontal direction when the tiling substrate (100) is viewed in a plane. However, the vertical direction and the horizontal direction are preferably directions that are relatively orthogonal to each other, and the relationship is that when one direction is set, the other direction is determined.

[0062] The image driver IC (integrated circuit chip) (150) supplies image signals to the LEDs (101 to 103) through image signal wires (111) respectively connected to each LED (101 to 103) of the same column. That is, the image driver IC (150) supplies different image signals to each column through a plurality of image signal wires (111) corresponding to the plurality of columns. Accordingly, power is supplied to each LED (101 to 103) of the row selected by the scan signal supplied from the scan driver IC (170).

[0063] The scan driver IC (170) supplies scan signals to the LEDs (101 to 103) through scan signal wires (121) respectively connected to each LED (101 to 103) of the same row. That is, the scan driver IC (170) supplies different scan signals to each row through a plurality of scan signal wires (121) corresponding to a plurality of rows. Therefore, by the scan signal supplied from the scan driver IC (170), any one row can be selected as a row capable of supplying power to the LEDs (101 to 103).

[0064] As illustrated in FIG. 2, in the tiling substrate (100), a plurality of blocks including a plurality of pixels are set. In FIG. 2, three blocks (block 1, block 2, and block 3) are illustrated to simplify the explanation. For each block, a TGV (110) for an image signal and a TGV (120) for a scan signal may be installed. In addition, on the surface of the tiling substrate (100), a common image signal wiring (111) may be connected to the LEDs (101 to 103) of the same column for each block. In addition, on the surface of the tiling substrate (100), a common scan signal wiring (121) may be connected to the LEDs (101 to 103) of the same row for each block. The TGV (110) for an image signal and the TGV (120) for a scan signal are vias corresponding to the through-holes for an image signal and the through-holes for a scan signal, respectively. In addition, in the example of Fig. 2, simultaneous control is performed by six video signal wires (111), but the number of video signal wires (111) for simultaneous control is not limited to six.

[0065] The passive matrix driving method controls the current of all LEDs (101 to 103) by the image driver IC (150) and scan driver IC (170) mounted on the back of the tiling substrate (100). Therefore, the passive matrix driving method is less likely to cause fluctuations in the current applied to the LEDs (101 to 103) compared to the active matrix driving method described later.

[0066] As shown in FIG. 3, a wiring layer (180) is formed on a glass substrate (190) of a tiling substrate (100), and each LED can be connected to an LED pad formed as the uppermost layer (M3) (see FIG. 5) of the wiring layer (180).

[0067] In Fig. 4, the TGV (110) for the video signal is indicated by a thin circle, and the TGV (120) for the scan signal is indicated by a thick circle. In addition, the wiring (111) for the video signal is indicated by a thick dashed line, and the wiring (121) for the scan signal is indicated by a thick solid line. In Fig. 4, only a portion of the wiring (111) for the video signal and the wiring (121) for the scan signal are illustrated.

[0068] As illustrated in Fig. 5, as a wiring layer (180) on the surface side of the tiling substrate (100), three metal wiring layers, namely, the M1 layer to the M3 layer, can be laminated through an interlayer insulating film. For example, the M1 layer is used to form a wiring (121) for a scan signal, and the M2 layer is used to form a wiring (111) for an image signal. The M1 layer and the M2 layer can be connected through a first via (Via 1). The M3 layer can be used to form a pad for connecting the terminals of the LEDs (101 to 103) and the wiring (111) for an image signal and the wiring (121) for a scan signal. The M2 layer and the M3 layer can be connected through a second via (Via 2).

[0069] As a wiring layer (185) on the back side of the tiling substrate (100), three metal wiring layers, namely, the M4 layer to the M6 ​​layer, can be laminated through an interlayer insulating film. For example, the M4 layer is used to form a wiring (121) for a scan signal, and the M5 layer is used to form a wiring (111) for an image signal. The M4 layer and the M5 layer can be connected through a third via (Via 3). The M6 ​​layer can be used to form a film on glass (FOG) pad for connecting the wiring (111) for an image signal and the wiring (121) for a scan signal to a film substrate (160) (see FIG. 8) on which an image driver IC (150) and a scan driver IC (170) are respectively mounted. The film substrate (160) is configured of, for example, an FPC (Flexible Printed Circuits). The M5 layer and the M6 ​​layer can be connected through a fourth via (Via 4).

[0070] The M1 and M4 floors are connected by a TGV (110) for video signals or a TGV (120) for scan signals.

[0071] As illustrated in FIG. 6, a TGV region (112) for a video signal and a TGV region (122) for a scan signal are set on the tiling substrate (100). The TGV region (112) for a video signal is a region for forming a TGV (110) for a video signal and constitutes a through-hole installation portion for a video signal. Hereinafter, a plurality of TGVs (110) for a video signal formed in the TGV region (112) for a video signal are also referred to as a “TGV group (114) for a video signal.” The TGV region (122) for a scan signal is a region for forming a TGV (120) for a scan signal and constitutes a through-hole installation portion for a scan signal. Hereinafter, a plurality of TGVs (120) for a scan signal formed in the TGV region (122) for a scan signal are also referred to as a “TGV group (124) for a scan signal.”

[0072] In the tiling substrate (100), LEDs (101 to 103) in the same column in the same block are connected to each other by image signal wiring (111) of the M2 layer connected to one image signal TGV (110). LEDs (101 to 103) in the same row in the same block are connected to each other by scan signal wiring (121) of the M1 layer connected to one scan signal TGV (120).

[0073] In Fig. 6, only a portion of the TGV (110) for the video signal, the wiring (111) for the video signal, the TGV (120) for the scan signal, and the wiring (121) for the scan signal of the M1 layer are illustrated.

[0074] As illustrated in FIG. 7, on the back side of the tiling substrate (100), a group of FOG (Film On Glass) pads (113) for an image signal and a group of FOG pads (123a) for a scan signal (hereinafter also referred to as “group of FOG pads (123) for a scan signal”) are formed. The group of FOG pads (113a) for an image signal is a FOG pad connected to an output terminal of an image driver IC (150). The group of FOG pads (123a) for a scan signal is a FOG pad connected to an output terminal of a scan driver IC (170). One or more FOG pad groups (113) for an image signal are formed. One or more FOG pad groups (123) for a scan signal are formed. The group of FOG pads (113) for an image signal constitutes an image pad group. The group of FOG pads (123) for a scan signal constitutes a scan pad group.

[0075] In the example of Fig. 7, the FOG pad group (113) for the image signal is arranged in a portion where the TGV region (122) for the scan signal is not arranged when the back surface of the tiling substrate (100) is viewed from a plan view. The FOG pad group (123) for the scan signal is also arranged in a portion where the TGV region (112) for the image signal is arranged when the back surface of the tiling substrate (100) is viewed from a plan view. In this case, as described below, the FOG pad group (123) for the scan signal may be arranged so that an electrically floating dummy pad (see Fig. 10) is arranged in the portion where the TGV region (112) for the image signal is arranged. For example, among the pads of the FOG pad group (123) for the scan signal, the pad(s) arranged in the TGV region (112) for the image signal may be dummy pad(s) that are not connected to the wiring for the scan signal.

[0076] The FOG pad group (123) for the scan signal can be arranged in a portion where the TGV area (112) for the image signal is not arranged when the back surface of the tiling substrate (100) is viewed from a plane.

[0077] The FOG pad group (113) for the image signal may also be arranged in the portion where the TGV area (122) for the scan signal is arranged when the back surface of the tiling substrate (100) is viewed from the plane. In this case, the FOG pad group (113) for the image signal may be arranged so that a dummy pad without electrical conductivity is arranged in the portion where the TGV area (122) for the scan signal is arranged.

[0078] The M5 layer wiring extending from each video signal FOG pad of the video signal FOG pad group (113) is respectively connected to the video signal TGV (110). By the video signal TGV (110), the M5 layer wiring extending from each video signal FOG pad and the M2 layer video signal wiring (111) connected to the LEDs (101 to 103) are connected through the first via (via 1) and the third via (via 3), etc. In addition, for convenience, the wiring extending from each video signal FOG pad of the video signal FOG pad group (113) is distinguished from the video signal wiring (111), but when the two are connected, it can be said that both form the video signal wiring (111). For example, each pad of the video signal FOG pad group (113) can be understood as being part of the video signal wiring (111).

[0079] The wiring of the M4 layer extending from each FOG pad (123a) for a scan signal of the FOG pad group (123) for a scan signal is respectively connected to the TGV (120) for a scan signal. The wiring of the M4 layer extending from each FOG pad (123a) for a scan signal and the wiring for a scan signal (121) for a M1 layer connected to the LEDs (101 to 103) are connected by the TGV (120) for a scan signal. In addition, for convenience, the wiring extending from each FOG pad (123a) for a scan signal of the FOG pad group (123) for a scan signal is distinguished from the wiring for a scan signal (121), but when the two are connected, it can be said that both form the wiring for a scan signal (121). For example, each FOG pad (123a) for a scan signal of the FOG pad group (123) for a scan signal can be understood as being part of the wiring for a scan signal (121).

[0080] The wiring and TGV (110) for the video signal extending from each FOG pad for the video signal of the FOG pad group (113) for the video signal, and the wiring and TGV (120) for the scan signal extending from each FOG pad for the scan signal of the FOG pad group (123) for the scan signal are laid out so as to be electrically insulated from each other.

[0081] Figure 8 is an explanatory diagram showing a state in which a film substrate (160) is connected to each of a FOG pad group (113) for a video signal and a FOG pad group (123) for a scan signal on the back of a tiling substrate (100).

[0082] A film substrate (160) on which an image driver IC (150) is mounted is mounted on a FOG pad group (113) for an image signal. Specifically, the film substrate (160) is mounted on the FOG pad group (113) for an image signal so that each FOG pad for an image signal and each wire of the film substrate (160) connected to the output terminal of the image driver IC (150) are connected. The film substrate (160) is mounted on the FOG pad group (113) for an image signal using, for example, an anisotropic conductive film (ACF).

[0083] A film substrate (160) on which a scan driver IC (170) is mounted is mounted on a FOG pad group (123) for a scan signal. Specifically, the film substrate (160) is mounted on the FOG pad group (123) for a scan signal so that each wire of the film substrate (160), to which each FOG pad (123a) for a scan signal and the output terminal of the scan driver IC (170) are connected, are connected. The film substrate (160) is mounted on the FOG pad group (123) for a scan signal using, for example, ACF.

[0084] Additionally, the number of image driver ICs (150) and scan driver ICs (170) mounted on the tiling substrate (100) is not limited.

[0085] Fig. 9 is an explanatory diagram showing the layout of the FOG pad group (123) for a scan signal, the TGV group (114) for a video signal, and the wiring extending from the FOG pad group (123) for a scan signal. In Fig. 9, only a portion of the wiring extending from the FOG pad group (123) for a scan signal is shown. Fig. 10 is an explanatory diagram showing an example of the layout of the FOG pad group (123) for a scan signal and the TGV group (114) for a video signal. Fig. 10 is a diagram corresponding to the part surrounded by a thin line in Fig. 9. Fig. 11 is an explanatory diagram showing an example of the layout of the wiring (the wiring (121) for a scan signal) extending from the TGV group (114) for a video signal and the FOG pad group (123) for a scan signal. Fig. 11 is a diagram corresponding to the part surrounded by a thick line in Fig. 9.

[0086] In the example of FIG. 9, the FOG pad group (123) for the scan signal is also arranged in the portion where the TGV area (112) for the image signal is arranged. As illustrated in FIG. 10, the FOG pad group (123) for the scan signal may be arranged so that dummy pads without electrical conductivity are arranged in the portion where the TGV area (112) for the image signal is arranged. The dummy pads may be electrically floated. Therefore, no problem occurs even if the dummy pads come into contact with the TGV (110) for the image signal. Here, the 'dummy pads without electrical conductivity' may refer to dummy pads that are part of the pads of the FOG pad group (123) for the scan signal but are not electrically connected to the wiring (121) for the scan signal. In one embodiment, the dummy pad(s) among the pads of the FOG pad group (123) for the scan signal may be in contact with the TGV (110) for the image signal without being electrically connected to the wiring (121) for the scan signal.

[0087] As illustrated in Fig. 11, the wirings (also referred to as wirings (121) for scan signals) extending from the FOG pad group (123) for scan signals are arranged parallel to each other at the portion where they intersect with the TGV area (112) for image signals. In the example of Fig. 11, a plurality of wirings extending from the FOG pad group (123) for scan signals are adjacent through one TGV (110) for image signals. The width of the wirings extending from the FOG pad group (123) for scan signals may be 185 μm, and the diameter of the TGV (110) for image signals may be 170 μm. The minimum distance between the wirings extending from the FOG pad group (123) for scan signals and the TGV (110) for image signals may be 30 μm. However, these numbers are examples, and the present invention is not limited to the above numbers as long as the wirings extending from the FOG pad group (123) for scan signals are arranged parallel to each other. Additionally, the extension direction of the wiring extending from the FOG pad group (123) for the scan signal can be in a direction that matches the regular arrangement direction of the TGV group (114) for the image signal.

[0088] Fig. 12 is an explanatory diagram showing another example of the layout of a TGV group (114) for a video signal and a wiring (121) for a scan signal.

[0089] In the example of Fig. 12, the wirings extending from the FOG pad group (123) for the scan signal are arranged parallel to each other at the portion where they intersect with the TGV area (112) for the image signal. In the example of Fig. 12, the wirings extending from the FOG pad group (123) for the scan signal are adjacent every two without passing through the TGV (110) for the image signal. One pair of two wirings adjacent without passing through the TGV (110) for the image signal is adjacent to the other pair of two wirings adjacent without passing through the TGV (110) for the image signal through one TGV (110) for the image signal. The minimum spacing between the two wirings constituting this pair may be 30 μm. However, this value is an example, and the present invention is not limited to the above value as long as the wirings extending from the FOG pad group (123) for the scan signal are arranged parallel to each other.

[0090] Additionally, the angles of the plurality of wires extending in parallel from the FOG pad group (123) for the scan signal may be different at both ends of the parallel direction of the tiling substrate (100).

[0091] Figure 13 is a drawing showing a modified example of a dummy pad.

[0092] As illustrated in Fig. 13, some dummy pads (123d) may be divided so that one dummy pad (123d) corresponds to one TGV (110) for a video signal. That is, the dummy pad (123d) may be laid out so that only one TGV (110) for a video signal overlaps. Accordingly, for example, by arranging two TGVs (110) for a video signal on one dummy pad (123d), the corresponding two TGVs (110) for a video signal can be prevented from being short-circuited. In addition, all dummy pads (123d) may be divided.

[0093] Fig. 14 is a schematic diagram illustrating another example of the layout configuration on the back of a tiling substrate (100).

[0094] In the example of Fig. 14, the FOG pad group (123) for the scan signal is arranged in a portion where the TGV area (112) for the image signal is not arranged when the back surface of the tiling substrate (100) is viewed in a plane.

[0095] Fig. 15 is a schematic diagram illustrating another example of a tiling substrate (100) configuration. Fig. 16 is a diagram illustrating a pixel circuit that performs constant current control and PWM control for each LED (101 to 103). Fig. 17 is a cross-sectional diagram illustrating a TFT layer (181) on which a TFT (Thin Film Transistor) of the pixel circuit is formed.

[0096] Figure 15 illustrates the configuration and connection relationship of an active matrix driving method.

[0097] An image signal supplied from an image driver IC (150) through an image signal wire (111) is supplied to each LED (101 to 103) of a row selected by a scan signal supplied from a scan driver IC (170) through a scan signal wire (121) through a PWM (Pulse Width Modulation) control circuit. The PWM control circuit generates a PWM control signal for supplying power corresponding to the image signal and outputs the signal to the LED (101 to 103). A constant current source transistor generates a constant current based on a constant current control voltage and applies the signal to the LED (101 to 103). Each LED (101 to 103) emits light according to the power based on the supplied image signal. By employing constant voltage driving and PWM driving, the occurrence of chromaticity shift can be suppressed.

[0098] Fig. 18 is a drawing showing a first example of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal.

[0099] In the example of Fig. 18, the TGV region (122) for the scan signal extends vertically from the center of the tiling substrate (100) when the back surface of the tiling substrate (100) is viewed in plan view, and is installed as a single continuum from top to bottom. The FOG pad group (123) for the scan signal is installed as two continuums in which the FOG pads (123a) for the scan signal are arranged vertically at both ends in the horizontal direction of the tiling substrate (100).

[0100] According to one embodiment, although not shown, similarly to the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 18, the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100). For example, when the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 18 is defined as extending in the vertical direction of the tiling substrate (100), the TGV area (112) for the image signal and the FOG pad group (133) for the image signal may be implemented on the tiling substrate (100) in a form extending in the horizontal direction. In one embodiment, the through-hole installation portion for the image signal, for example, the TGV area (112) for the image signal, may be implemented along the horizontal direction from the left end to the right end on the back surface of the tiling substrate (100). In one embodiment, a group of video pads, for example, a group of FOG pads (133) for video signals, may be implemented along a horizontal direction from left to right.

[0101] Fig. 19 is a drawing showing a second example of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal.

[0102] In the example of Fig. 19, the TGV region (122) for the scan signal extends vertically from the center of the tiling substrate (100) when the back surface of the tiling substrate (100) is viewed in plan view, and is installed as a single continuum from top to bottom. The FOG pad group (123) for the scan signal is installed as two continuums in which the FOG pads (123a) for the scan signal are respectively arranged vertically on different vertical axes.

[0103] According to one embodiment, although not shown, similarly to the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 19, the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100). For example, when the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 19 is defined as extending in the vertical direction of the tiling substrate (100), the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100) in a form extending in the horizontal direction.

[0104] Fig. 20 is a drawing showing a third example of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal.

[0105] In the example of Fig. 20, the TGV region (122) for the scan signal extends vertically when the back surface of the tiling substrate (100) is viewed in plan, and is installed as two continuums on different vertical axes from the top to the bottom. The FOG pad group (123) for the scan signal is installed as two continuums at both ends in the horizontal direction of the tiling substrate (100), each having the FOG pads (123a) for the scan signal arranged in the vertical direction.

[0106] By installing the TGV area (122) for the scan signal as two continuums on different vertical axes from the top to the bottom, the wiring resistance difference from each TGV on the surface of the tiling substrate (100) to each LED (101 to 103) can be reduced compared to arranging them as one continuum.

[0107] According to one embodiment, although not shown, similarly to the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 20, the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100). For example, when the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 20 is defined as extending in the vertical direction of the tiling substrate (100), the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100) in a form extending in the horizontal direction.

[0108] Fig. 21 is a drawing showing a fourth example of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal.

[0109] In the example of Fig. 21, the TGV area (122) for the scan signal extends vertically when the back surface of the tiling substrate (100) is viewed in plan, and is installed as three continuums on different vertical axes from the top to the bottom. The FOG pad group (123) for the scan signal is installed as two continuums in which the FOG pads (123a) for the scan signal are each arranged side by side on a vertical axis passing through the centers of the three continuums of the TGV area (122) for the scan signal.

[0110] By installing the TGV area (122) for the scan signal as three continuums on different vertical axes from the top to the bottom, the wiring resistance difference from each TGV on the surface of the tiling substrate (100) to each LED (101 to 103) can be further reduced than when arranging them as two continuums.

[0111] According to one embodiment, although not shown, similarly to the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 21, the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100). For example, when the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIG. 21 is defined as extending in the vertical direction of the tiling substrate (100), the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100) in a form extending in the horizontal direction.

[0112] Figures 22 to 24 are drawings showing fifth to seventh examples of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal, respectively.

[0113] In the fifth to seventh examples, the TGV region (122) for the scan signal is installed as four continuums extending in the vertical direction from the top to the bottom on different vertical axes when the back surface of the tiling substrate (100) is viewed in plan. The FOG pad group (123) for the scan signal is installed as two continuums in which the FOG pads (123a) for the scan signal are each arranged on a vertical axis passing through the centers of two continuums corresponding to dividing the four continuums of the TGV region (122) for the scan signal into two continuum pairs. The fifth to seventh examples are different from each other in at least one of the spacing between the continuums of the TGV region (122) for the scan signal, the spacing between the continuums of the TGV region (122) for the scan signal and the continuums of the FOG pad group (123) for the scan signal, and the spacing between the continuums of the FOG pad group (123) for the scan signal.

[0114] By installing the TGV area (122) for the scan signal as four continuums on different vertical axes from top to bottom, the wiring resistance difference from each TGV on the surface of the tiling substrate (100) to each LED (101 to 103) can be further reduced than when arranging them as three continuums.

[0115] Figures 25 to 30 are drawings showing examples 8 to 13 of the layout of a TGV area (122) for a scan signal and a FOG pad group (123) for a scan signal.

[0116] In examples 8 to 13, the TGV area (122) for the scan signal is installed as four continuums extending in the vertical direction when the back surface of the tiling substrate (100) is viewed in plan, and the sum of the lengths of the corresponding plurality of continuums is an integer multiple of the vertical length of the tiling substrate (100). The FOG pad group (123) for the scan signal is installed as two continuums in which the FOG pads (123a) for the scan signal are respectively arranged side by side in the vertical direction on a vertical axis passing through the centers of the corresponding two continuums when dividing the four continuums of the TGV area (122) for the scan signal into two continuum pairs. Examples 8 to 13 are different in at least one of the spacing between the continuums of the TGV area (122) for the scan signal, the length and vertical position of the continuum of the TGV area (122) for the scan signal, the spacing between the continuum of the TGV area (122) for the scan signal and the continuum of the FOG pad group (123) for the scan signal, and the spacing between the continuums of the FOG pad group (123) for the scan signal.

[0117] The first to thirteenth examples of the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal, shown in FIGS. 18 to 30, can be applied in the same way of thinking to the layout of the TGV area (112) for the image signal and the FOG pad group (113) for the image signal.

[0118] According to one embodiment, although not shown, similarly to the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIGS. 22 to 30, the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100). For example, when the layout of the TGV area (122) for the scan signal and the FOG pad group (123) for the scan signal of FIGS. 22 to 30 is defined as extending in the vertical direction of the tiling substrate (100), the TGV area (112) for the image signal and the FOG pad group (113) for the image signal may be implemented on the tiling substrate (100) in a form extending in the horizontal direction.

[0119] Fig. 31 is a drawing showing the surface of a tiling module (10) in which a plurality of tiling substrates (100) are arranged in a tile shape. Fig. 32 is a drawing showing the back surface of a tiling module (10) in which a plurality of tiling substrates (100) are arranged in a tile shape. The tiling module (10) constitutes an LED display device. Depending on the number of tiling substrates (100) arranged, a large screen of the tiling module (10) can be easily realized.

[0120] (Comparative example)

[0121] Fig. 33 is a drawing showing each LED and wiring for image signals and wiring for scan signals on the surface of a tiling substrate of a comparative example. Fig. 34 is an explanatory drawing for explaining side wiring.

[0122] As shown in FIG. 33 and FIG. 34, a method of using side wiring is known to connect image signal wiring and scan signal wiring formed on the surface of a tiling substrate to an image driver IC and a scan driver IC mounted on the back surface of the tiling substrate.

[0123] However, when using side wiring, it is necessary to extend the video signal wiring of each block to one side to connect to the side wiring, making it difficult to secure space for wiring layout. In addition, there is a problem that the area required for the layout of the video signal wiring increases on the side where the side wiring is installed, which may reduce the aperture ratio of the tiling substrate (100).

[0124] The embodiment has the following effects:

[0125] A tiling substrate for an LED display device, comprising: a plurality of image signal wirings for supplying power to a plurality of LEDs installed on the surface side of a tiling substrate for an LED display device; a scan signal wiring for controlling conduction and non-conduction of power to the plurality of LEDs, arranged on the surface side; at least one image pad group for connecting to an output terminal of at least one image driver IC for outputting an image signal, arranged on the back side of the tiling substrate for an LED display device; at least one scan pad group for connecting to an output terminal of at least one scan driver IC for outputting a scan signal; at least one image signal through-hole installation portion for forming an image signal through-hole for connecting a wiring extending from each pad of the image pad group and the image signal wiring; and at least one scan signal through-hole installation portion for forming an image signal through-hole for connecting a wiring extending from each scan pad of the scan pad group and the scan signal wiring, wherein when the image pad group is viewed in a plan view, the scan signal through-hole installation portion is not arranged. The scan pad group is arranged so that the through-hole installation unit for the image signal is not arranged in a portion where it is not installed, or an electrically floating dummy pad is installed in a portion where the through-hole installation unit for the image signal is installed, when the scan pad group is viewed from a plane, the through-hole installation unit for the image signal is not arranged in a portion where it is installed, or an electrically floating dummy pad is installed in a portion where the through-hole installation unit for the image signal is installed. As a result, in a tiling substrate for an LED display device, it is possible to facilitate the layout of wiring connected to each LED while sufficiently securing an area for mounting the LED.

[0126] In addition, the through-hole installation portion for the scan signal extends vertically from the center of the tiling substrate for the LED display device when viewed in a flat plane, and is installed as a single continuous body from top to bottom. This effectively facilitates the layout of wiring connecting each LED while sufficiently securing the area for mounting the LED.

[0127] In addition, the through-hole installation portion for the scan signal extends vertically when viewed in a plan view, and is installed as a plurality of continuums on different vertical axes from top to bottom. This effectively reduces the wiring resistance difference for each LED from the through-hole for the scan signal.

[0128] In addition, the through-hole installation portion for the scan signal is installed as a plurality of continuous bodies extending in the vertical direction when viewed in a plane, and the sum of the lengths of the plurality of continuous bodies is an integer multiple of the vertical length of the tiling substrate for the LED display device. Therefore, the wiring resistance difference for each LED from the through-hole for the scan signal can be effectively reduced.

[0129] In addition, the through-hole installation portion for the video signal is configured to extend horizontally when viewed from a flat surface. This effectively facilitates the layout of the video signal wiring and the scan signal wiring connected to each LED.

[0130] In addition, the through-hole installation portion for the video signal is installed as a plurality of continuous units extending horizontally in a plan view and extending from the left end to the right end on different horizontal axes. This effectively reduces the wiring resistance difference for each LED from the through-hole for the video signal.

[0131] In addition, the image pad group is installed as a plurality of image pad continuums extending horizontally when viewed in a plane and extending from the left end to the right end on the same horizontal axis, and a through-hole installation portion for a scan signal is arranged between the horizontally adjacent image pad continuums. As a result, interference between the fan-out wiring for the image pad group and the through-hole for the scan signal can be easily avoided.

[0132] In addition, the wiring extending from each scan pad of the scan pad group is arranged parallel to each other at the point where it intersects the through-hole installation portion for the image signal. This makes it easy to avoid interference between the fan-out wiring for the scan pad group and the through-hole installation portion for the image signal.

[0133] The above-described embodiments are merely illustrative, and those skilled in the art will understand that various modifications and equivalent alternative embodiments are possible. Therefore, the disclosed embodiments should be considered illustrative, not restrictive. The scope of the claims is set forth in the claims, and all configurations within the scope equivalent to the claims should be construed as being included within the scope of the claims.

Claims

1. A plurality of video signal wirings installed on the surface side of a tiling substrate for an LED display device and for supplying power to a plurality of LEDs installed on the surface side; A wiring for a scan signal arranged on the surface side and controlling the conduction and non-conduction of power to the plurality of LEDs, At least one image pad group installed on the back side of the tiling substrate for the above LED display device and connected to an output terminal of at least one image driver IC that outputs an image signal; At least one scan pad group installed on the back side and connected to an output terminal of at least one scan driver IC that outputs a scan signal, At least one video signal through-hole installation part for forming a video signal through-hole for connecting the wiring extending from each pad of the video pad group and the video signal wiring, At least one scan signal through-hole installation part is provided for forming a scan signal through-hole for connecting the wiring extending from each scan pad of the above scan pad group and the wiring for the scan signal, The wiring extending from each image pad of the image pad group and the at least one through-hole installation portion for the image signal, and the wiring extending from each scan pad of the scan pad group and the through-hole installation portion for the scan signal are electrically insulated from each other, The above image pad group is arranged so that, when viewed from a plane, the through-hole installation portion for the scan signal is not arranged in a portion where the through-hole installation portion for the scan signal is arranged, or an electrically floating dummy pad is installed in a portion where the through-hole installation portion for the scan signal is arranged. A tiling substrate for an LED display device, wherein the above scan pad group is arranged so that, when viewed from a plane, the through-hole installation portion for the image signal is not arranged in a portion where the through-hole installation portion for the image signal is arranged, or an electrically floating dummy pad is installed in a portion where the through-hole installation portion for the image signal is arranged.

2. In paragraph 1, A tiling substrate for an LED display device, wherein the through-hole installation portion for the above scan signal extends vertically from the center of the tiling substrate for the LED display device when viewed in a plane, and is installed as a single continuum from top to bottom.

3. In paragraph 1, A tiling substrate for an LED display device, wherein the through-hole installation portion for the above scan signal extends in a vertical direction when viewed from a plane and is installed as a plurality of continuums on different vertical axes from top to bottom.

4. In paragraph 1, A tiling substrate for an LED display device, wherein the through-hole installation portion for the above scan signal is installed as a plurality of continuous bodies extending in a vertical direction when viewed from a plane, and the sum of the lengths of the plurality of continuous bodies is an integer multiple of the vertical length of the tiling substrate for the LED display device.

5. In any one of paragraphs 2 to 4, A tiling substrate for an LED display device, wherein the through-hole installation portion for the above video signal extends in a horizontal direction when viewed from a plane.

6. In any one of paragraphs 2 to 4, A tiling substrate for an LED display device, wherein the through-hole installation portion for the above video signal extends horizontally when viewed from a plane and is installed as a plurality of continuums on different horizontal axes from the left end to the right end.

7. In paragraph 5, The above image pad group, when viewed in a plane, extends horizontally and is installed as a continuum of multiple image pads on the same horizontal axis from the left end to the right end. A tiling substrate for an LED display device, wherein a through-hole installation portion for the scan signal is arranged between the horizontally adjacent image pad continuums.

8. In paragraph 1, A tiling substrate for an LED display device, wherein the wiring extending from each scan pad of the above scan pad group is arranged parallel to each other at a portion where it intersects with the through-hole installation portion for the image signal.

9. In the LED display device, An LED display device comprising a tiling substrate according to any one of claims 1 to 8.

Images