Display module and display apparatus

Abstract

Disclosed in embodiments of the present application are a display module and a display apparatus. The display module comprises a display panel, a first backplane, a second backplane, and a bonding structure, the display panel comprising a display portion, a binding portion, and a bending portion. The bonding structure is disposed between the first backplane and the second backplane, and comprises a first adhesive layer, a base layer, and a second adhesive layer arranged in a stacked configuration in the direction from the first backplane toward the second backplane, and a recessed portion is formed on a surface of at least one of the first adhesive layer and the second adhesive layer.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202410190018.6 filed on February 20, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of display, and in particular to a display module and a display device. Background Art

[0003] With the advancement of display technology, organic light-emitting diodes (OLEDs) are gaining popularity due to their flexible and bendable screens, offering users a better visual experience. However, OLED display modules can suffer from burn-in and uneven brightness due to localized overheating during use. In particular, components such as driver chips in current high-refresh OLED display modules consume high power and are compact, resulting in significant heat generation during operation. Consequently, current OLED display modules often use adhesive tape as a bonding mechanism to connect the two backplanes within the display module. SUMMARY OF THE INVENTION

[0004] The embodiments of the present application provide a display module and a display device, which can solve the problem that heat in the display module is easily transferred to the display panel through the adhesive structure, causing the display panel to overheat and fail.

[0005] An embodiment of the present application provides a display module, comprising:

[0006] The display panel includes a display portion, a binding portion, and a bending portion, wherein the display portion and the binding portion are arranged opposite to each other, and the bending portion is connected between the display portion and the binding portion;

[0007] a first back plate, disposed on a side of the display portion facing the binding portion;

[0008] a second back plate, disposed on a side of the binding portion facing the display portion;

[0009] an adhesive structure disposed between the first backplane and the second backplane, the adhesive structure comprising a first adhesive layer, a base layer, and a second adhesive layer stacked in a direction from the first backplane toward the second backplane;

[0010] Wherein, a concave portion is formed on the surface of at least one of the first adhesive layer and the second adhesive layer.

[0011] Accordingly, an embodiment of the present application provides a display device, comprising the display module described above. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0013] FIG1 is a schematic structural diagram of a display module provided in an embodiment of the present application;

[0014] FIG2 is a schematic structural diagram of a bonding structure provided in an embodiment of the present application;

[0015] FIG3 is a schematic structural diagram of a first adhesive layer provided in an embodiment of the present application;

[0016] FIG4 is a schematic structural diagram of a second adhesive layer provided in an embodiment of the present application;

[0017] FIG5 is a schematic structural diagram of a display device provided in an embodiment of the present application.

[0018] Description of reference numerals:

[0019] 10. Display device;

[0020] 100, display module; 110, display panel; 111, display portion; 112, binding portion; 113, bending portion; 120, first backplane; 130, second backplane; 140, bonding structure; 141, first adhesive layer; 142, base layer; 143, second adhesive layer; 144, recessed portion; 1441, first sub-recessed portion; 1442, second sub-recessed portion; 145, first connecting portion; 146, second connecting portion; 147, first cavity; 148, second cavity; 150, supporting layer; 160, buffer layer; 170, polarizer; 180, cover plate; 190, driving element; 200, protective layer;

[0021] 300, control circuit;

[0022] 400, shell. Modes for Carrying Out the Invention

[0023] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative work are within the scope of protection of the present application. In addition, it should be understood that the specific implementation methods described herein are only used to illustrate and explain the present application, and are not used to limit the present application. In the present application, unless otherwise specified, the directional words used, such as "upper" and "lower", generally refer to the upper and lower parts of the device in actual use or working state, specifically the drawing direction in the accompanying drawings; and "inside" and "outside" refer to the outline of the device.

[0024] The embodiments of the present application provide a display module and a display device, which are described in detail below. It should be noted that the order of description of the following embodiments does not limit the preferred order of the embodiments.

[0025] First, an embodiment of the present application provides a display module. As shown in Figure 1, the display module 100 includes a display panel 110. The display panel 110 includes a display portion 111, a binding portion 112 and a bending portion 113. The display portion 111 and the binding portion 112 are arranged opposite to each other, and the bending portion 113 is connected between the display portion 111 and the binding portion 112. Among them, the display part 111 serves as the display body of the display panel 110 and is used for displaying pictures; the side of the binding part 112 away from the display part 111 is used to bind and connect the driving element 190 to receive the control signal and adjust the display picture of the display part 111; the bending part 113 is connected between the display part 111 and the binding part 112, and is used to electrically connect the control circuit in the display part 111 with the driving element 190 on the binding part 112, that is, a conductive circuit structure is provided in the bending part 113 to lead the control circuit of the display part 111 in the display panel 110 to the binding part 112 of the display panel 110, so as to reduce the size of the frame area of ​​the display panel 110 while facilitating the adjustment of the display mode of the display panel 110.

[0026] The display module 100 includes a first backplane 120 and a second backplane 130. The first backplane 120 is disposed on the side of the display portion 111 facing the binding portion 112, while the second backplane 130 is disposed on the side of the binding portion 112 facing the display portion 111. In other words, the first backplane 120 and the second backplane 130 are disposed opposite each other. The first backplane 120 and the second backplane 130 serve as supporting substrates within the display module 100, supporting other functional structures within the display module 100 and ensuring the structural stability of the display module 100.

[0027] As shown in Figures 1 and 2, the display module 100 includes an adhesive structure 140 disposed between the first backplane 120 and the second backplane 130. The adhesive structure 140 comprises a first adhesive layer 141, a base layer 142, and a second adhesive layer 143 stacked and arranged along the direction from the first backplane 120 toward the second backplane 130. Specifically, the adhesive structure 140 is a double-sided adhesive structure, with the first adhesive layer 141 facing the first backplane 120 and the second adhesive layer 143 facing the second backplane 130. By connecting the adhesive structure 140 between the first backplane 120 and the second backplane 130, the relative stability of the binding portion 112, the bending portion 113, and the display portion 111 of the display panel 110 is ensured, thereby ensuring the overall structural stability of the display module 100.

[0028] As shown in Figures 3 and 4 , a recessed portion 144 is formed on the surface of at least one of the first adhesive layer 141 and the second adhesive layer 143. Specifically, the first adhesive layer 141 has a recessed portion 144 formed on its surface, or the second adhesive layer 143 has a recessed portion 144 formed on its surface, or both the first adhesive layer 141 and the second adhesive layer 143 have recessed portions 144 formed on their surfaces. The surface of the first adhesive layer 141 refers to the side of the first adhesive layer 141 facing the first backplane 120 and the side of the first adhesive layer 141 facing away from the first backplane 120, while the surface of the second adhesive layer 143 refers to the side of the second adhesive layer 143 facing the second backplane 130 and the side of the second adhesive layer 143 facing away from the second backplane 130.

[0029] When the recessed portion 144 is formed on the surface of the first adhesive layer 141 and / or the second adhesive layer 143, air can be used as a conductive medium at the position corresponding to the recessed portion 144 on the first adhesive layer 141 and / or the second adhesive layer 143. The thermal conductivity of the position corresponding to the recessed portion 144 on the first adhesive layer 141 and / or the second adhesive layer 143 is equal to the thermal conductivity of air. Air is a good thermal insulation medium and its thermal conductivity is much lower than the thermal conductivity of the material of the adhesive structure 140 itself. Therefore, the overall thermal conductivity of the adhesive structure 140 can be reduced, thereby reducing the efficiency of heat transfer from the adhesive structure 140 to the display panel 110, thereby reducing the risk of overheating and failure of the display panel 110.

[0030] It should be noted that the recessed portion 144 in the embodiment of the present application refers to a recessed area formed on the surface of the first adhesive layer 141 and / or the second adhesive layer 143, that is, a thinner area on the first adhesive layer 141 and / or the second adhesive layer 143, wherein the recessed portion 144 includes at least one of a groove and a through hole, that is, the recessed portion 144 can be formed by partially thinning the surface of the first adhesive layer 141 and / or the second adhesive layer 143 or directly opening a hole. In addition, the contour of the recessed portion 144 can be a straight line or a curve, or other regular or irregular shapes, and is not specifically limited here.

[0031] In the embodiment of the present application, the display module 100 includes a display panel 110, a first backplane 120, a second backplane 130 and an adhesive structure 140. The display panel 110 includes a display portion 111, a binding portion 112 and a bending portion 113. The display portion 111 and the binding portion 112 are arranged opposite to each other, and the bending portion 113 is connected between the display portion 111 and the binding portion 112. The first backplane 120 is arranged on the side of the display portion 111 facing the binding portion 112, and the second backplane 130 is arranged on the side of the binding portion 112 facing the display portion 111. The adhesive structure 140 is arranged between the first backplane 120 and the second backplane 130. The adhesive structure 140 includes a first adhesive layer 141, a base layer 142 and a second adhesive layer 143 stacked in a direction from the first backplane 120 to the second backplane 130; wherein, a recessed portion 144 is formed on the surface of at least one of the first adhesive layer 141 and the second adhesive layer 143. The present application forms a recessed portion 144 on the surface of at least one of the first adhesive layer 141 and the second adhesive layer 143 of the adhesive structure 140, so that air can be used as a conductive medium in the recessed portion 144, thereby reducing the overall thermal conductivity of the adhesive structure 140 and lowering the efficiency of heat transfer to the display panel 110, thereby reducing the risk of overheating failure of the display panel 110.

[0032] Optionally, the display module 100 further includes a driving element 190, which is disposed on a side of the binding portion 112 facing away from the display portion 111, i.e., the driving element 190 is bonded to the binding portion 112. The recessed portion 144 includes a first sub-recessed portion 1441 and a second sub-recessed portion 1442. The first sub-recessed portion 1441 is formed on the first adhesive layer 141, and the second sub-recessed portion 1442 is formed on the second adhesive layer 143. The orthographic projections of the first sub-recessed portion 1441, the second sub-recessed portion 1442, and the driving element 190 on the binding portion 112 at least partially overlap. That is, in the thickness direction of the display module 100, the driving element 190, the first sub-recessed portion 1441 on the first adhesive layer 141, and the second sub-recessed portion 1442 on the second adhesive layer 143 are correspondingly disposed.

[0033] During operation of the display module 100, the driving element 190, as the primary heat generating element, generates a large amount of heat. This heat is then transferred to the display panel 110 via the adhesive structure 140, potentially causing overheating and failure of the display panel 110. By forming a first sub-recess 1441 on the first adhesive layer 141 and a second sub-recess 1442 on the second adhesive layer 143, and by aligning the first and second sub-recesses 1441, 1442 in corresponding areas of the driving element 190, portions of the heat conduction path between the driving element 190 and the display panel 110 are simultaneously blocked by the air passage formed by the first and second sub-recesses 1441, 1442. This helps reduce the heat conduction efficiency between the driving element 190 and the display panel 110, thereby lowering the risk of overheating and failure of the display panel 110.

[0034] It should be noted that, except for the area corresponding to the driver element 190, in other areas where the first adhesive layer 141 and the second adhesive layer 143 face each other, the first sub-recess 1441 on the first adhesive layer 141 and the second sub-recess 1442 on the second adhesive layer 143 can be staggered. Because heat transfer in these areas is less concentrated, staggering the first sub-recess 1441 and the second sub-recess 1442 in these areas allows the heat conduction channel of the adhesive structure 140 corresponding to these areas to be blocked by the air passage formed by the first sub-recess 1441 or the second sub-recess 1442, respectively. This also helps reduce the efficiency of heat generated by the driver element 190 being transferred to the display panel 110 through the surrounding area, thereby reducing the risk of overheating and failure of the display panel 110.

[0035] Optionally, as shown in Figure 3, the recessed portion 144 includes a first sub-recessed portion 1441, and the first sub-recessed portion 1441 is formed on the first adhesive layer 141. The first sub-recessed portion 1441 penetrates the first adhesive layer 141 along the direction of the first back plate 120 toward the second back plate 130, that is, the first sub-recessed portion 1441 penetrates the first adhesive layer 141 along the thickness direction of the first adhesive layer 141 to form a through hole in the first adhesive layer 141, so as to further reduce the efficiency of heat transfer to the display panel 110 through the adhesive structure 140, thereby reducing the risk of overheating failure of the display panel 110.

[0036] In addition, when the bonding structure 140 is bonded, bonding bubbles may be caused due to the flatness of the bonding jig, thereby forming a bonding bulge, which may eventually cause stress in the display panel 110 circuit and cause functional problems. By forming a first sub-recessed portion 1441 that penetrates the first adhesive layer 141 on the first adhesive layer 141, it is also helpful to discharge bubbles generated by the first adhesive layer 141 of the bonding structure 140 during the bonding process along the first sub-recessed portion 1441, thereby reducing the risk of forming a bonding bulge on the side where the first adhesive layer 141 is located.

[0037] It should be noted that the first sub-recess 1441 refers to the recess 144 formed on the first adhesive layer 141 . The definition of the first sub-recess 1441 here is only to distinguish the first adhesive layer 141 from the recess 144 on the second adhesive layer 143 and has no other special meaning.

[0038] In some embodiments, the recessed portion 144 includes a first sub-recessed portion 1441. A plurality of first sub-recessed portions 1441 are formed on the first adhesive layer 141. Furthermore, a plurality of first connecting portions 145 are formed on the first adhesive layer 141. At least some of the first sub-recessed portions 1441 are interconnected via the first connecting portions 145. Specifically, among the plurality of first sub-recessed portions 1441 on the first adhesive layer 141, a first connecting portion 145 is provided between at least some adjacent first sub-recessed portions 1441 to interconnect the corresponding adjacent first sub-recessed portions 1441. This further facilitates the discharge of bubbles generated during the lamination process of the first adhesive layer 141 of the adhesive structure 140 along the interconnected first sub-recessed portions 1441, thereby reducing the risk of forming lamination bulges on the side of the first adhesive layer 141.

[0039] Part of the first sub-recesses 1441 on the first adhesive layer 141 extends through the side surface of the first adhesive layer 141. Specifically, among the multiple first sub-recesses 1441 on the first adhesive layer 141, the first sub-recesses 1441 located closest to the side surface of the first adhesive layer 141 directly extend through the corresponding side surface and form openings on the corresponding side surface, allowing these first sub-recesses 1441 to communicate with the outside world. This arrangement allows some heat to flow directly to the outside world through these first sub-recesses 1441, further reducing the risk of overheating and failure of the display panel 110. Furthermore, connecting these first sub-recesses 1441 to the outside world also helps bubbles generated during the bonding process of the first adhesive layer 141 to be discharged through these first sub-recesses 1441, further reducing the risk of forming bulges on the side of the first adhesive layer 141.

[0040] In other embodiments, the multiple first sub-recesses 1441 on the first adhesive layer 141 are interconnected with the multiple first connecting portions 145 to form a first cavity 147. The first cavity 147 passes through at least one of the side surfaces of the first adhesive layer 141. That is, the multiple first sub-recesses 1441 and the multiple first connecting portions 145 on the first adhesive layer 141 as a whole constitute a continuous first cavity 147, and the first cavity 147 is connected to the outside through at least one side surface of the first adhesive layer 141, thereby facilitating heat to flow directly to the outside through the first cavity 147, reducing the risk of overheating and failure of the display panel 110, and also facilitating bubbles generated by the first adhesive layer 141 during the bonding process to be directly discharged to the outside through the first cavity 147, thereby reducing the risk of bonding bulges forming on the side where the first adhesive layer 141 is located.

[0041] Among them, the first cavity 147 can penetrate the corresponding side surface of the first adhesive layer 141 through the first connecting part 145 located in the peripheral area, and form an opening on the corresponding side surface, so that the first cavity 147 is connected to the outside world as a whole, thereby facilitating the circulation of heat to the outside world and the discharge of bubbles during the bonding process.

[0042] Correspondingly, the opening area of ​​the first connecting portion 145 on the first adhesive layer 141 is smaller than the opening area of ​​the first sub-recessed portion 1441, that is, the first sub-recessed portion 1441 is the main area in the first adhesive layer 141 for heat circulation and bubble discharge, and the first connecting portion 145 mainly plays a connecting role. By setting the opening area of ​​the first connecting portion 145 to be smaller than the opening area of ​​the first sub-recessed portion 1441, while ensuring the function of the first adhesive layer 141 to discharge heat and bubbles, it can also ensure that the first adhesive layer 141 has a sufficient bonding area, thereby ensuring the bonding effect of the first adhesive layer 141.

[0043] In some other embodiments, the multiple first sub-recesses 1441 on the first adhesive layer 141 can be distributed in an array, that is, the multiple first sub-recesses 1441 are distributed in multiple rows and columns; when the multiple first sub-recesses 1441 and the multiple first connecting portions 145 are interconnected to form the first cavity 147, the first cavity 147 can be in a grid shape. This opening method can make the multiple first sub-recesses 1441 and the multiple first connecting portions 145 evenly distributed on the first adhesive layer 141, thereby facilitating uniform heat conduction on the adhesive structure 140 and reducing the risk of overheating failure of the display panel 110 due to local overheating.

[0044] It should be noted that the shape, size, and distribution of the first sub-recess 1441 and the first connecting portion 145 on the first adhesive layer 141 can be selected and adjusted according to actual design requirements. It is only necessary to ensure that the formation of the first sub-recess 1441 and the first connecting portion 145 can effectively reduce the efficiency of heat transfer to the display panel 110, thereby reducing the risk of overheating and failure of the display panel 110, while ensuring the bonding effect of the first adhesive layer 141. No special restrictions are imposed here.

[0045] Optionally, as shown in Figure 4, the recessed portion 144 includes a second sub-recessed portion 1442, and the second sub-recessed portion 1442 is formed on the second adhesive layer 143. The second sub-recessed portion 1442 penetrates the second adhesive layer 143 along the direction from the first back plate 120 toward the second back plate 130, that is, the second sub-recessed portion 1442 penetrates the second adhesive layer 143 along the thickness direction of the second adhesive layer 143 to form a through hole in the second adhesive layer 143, so as to further reduce the efficiency of heat transfer to the display panel 110 through the adhesive structure 140, thereby reducing the risk of overheating failure of the display panel 110.

[0046] In addition, when the bonding structure 140 is bonded, bonding bubbles may be generated due to the flatness of the bonding jig, thereby forming bonding bulges, which may eventually cause stress in the display panel 110 circuit and cause functional problems. By forming a second sub-recessed portion 1442 that penetrates the second adhesive layer 143 on the second adhesive layer 143, it is also helpful to discharge bubbles generated by the second adhesive layer 143 of the bonding structure 140 during the bonding process along the second sub-recessed portion 1442, thereby reducing the risk of bonding bulges forming on the side where the second adhesive layer 143 is located.

[0047] It should be noted that the second sub-recess 1442 refers to the recess 144 formed on the second adhesive layer 143 . The definition of the second sub-recess 1442 here is only to distinguish the recess 144 on the first adhesive layer 141 from the second adhesive layer 143 and has no other special meaning.

[0048] In some embodiments, the recessed portion 144 includes a second sub-recessed portion 1442. A plurality of second sub-recessed portions 1442 are formed on the second adhesive layer 143. Furthermore, a plurality of second connecting portions 146 are formed on the second adhesive layer 143. At least some of the second sub-recessed portions 1442 are interconnected via the second connecting portions 146. Specifically, among the plurality of second sub-recessed portions 1442 on the second adhesive layer 143, a second connecting portion 146 is provided between at least some adjacent second sub-recessed portions 1442, thereby interconnecting the corresponding adjacent second sub-recessed portions 1442. This further facilitates the discharge of bubbles generated during the lamination process of the second adhesive layer 143 of the adhesive structure 140 along the interconnected second sub-recessed portions 1442, thereby reducing the risk of forming lamination bulges on the side of the second adhesive layer 143.

[0049] Part of the second sub-recesses 1442 on the second adhesive layer 143 penetrates the side surface of the second adhesive layer 143. Specifically, among the multiple second sub-recesses 1442 on the second adhesive layer 143, the second sub-recesses 1442 closest to the side surface of the second adhesive layer 143 can directly penetrate the corresponding side surface and form an opening on the corresponding side surface, allowing this portion of the second sub-recesses 1442 to communicate with the outside world. This arrangement allows some heat to flow directly to the outside world through this portion of the second sub-recesses 1442, further reducing the risk of overheating and failure of the display panel 110. Furthermore, connecting this portion of the second sub-recesses 1442 to the outside world also helps bubbles generated during the lamination process of the second adhesive layer 143 to be discharged to the outside world through this portion of the second sub-recesses 1442, further reducing the risk of lamination bulges forming on the side of the second adhesive layer 143.

[0050] In other embodiments, the multiple second sub-recesses 1442 on the second adhesive layer 143 are connected to the multiple second connecting portions 146 to form a second cavity 148. The second cavity 148 passes through at least one side surface of the second adhesive layer 143. That is, the multiple second sub-recesses 1442 and the multiple second connecting portions 146 on the second adhesive layer 143 as a whole constitute a continuous second cavity 148. The second cavity 148 is connected to the outside through at least one side surface of the second adhesive layer 143, thereby facilitating heat to flow directly to the outside through the second cavity 148, reducing the risk of overheating and failure of the display panel 110. At the same time, it also helps bubbles generated by the second adhesive layer 143 during the bonding process to be directly discharged to the outside through the second cavity 148, thereby reducing the risk of bonding bulges forming on the side where the second adhesive layer 143 is located.

[0051] Among them, the second cavity 148 can penetrate the corresponding side surface of the second adhesive layer 143 through the second connecting part 146 located in the peripheral area, and form an opening on the corresponding side surface, so that the second cavity 148 is connected to the outside world as a whole, thereby facilitating the circulation of heat to the outside world and the discharge of bubbles during the bonding process.

[0052] Correspondingly, the opening area of ​​the second connecting portion 146 on the second adhesive layer 143 is smaller than the opening area of ​​the second sub-recessed portion 1442, that is, the second sub-recessed portion 1442 is the main area in the second adhesive layer 143 for heat circulation and bubble discharge, and the second connecting portion 146 mainly plays a connecting role. By setting the opening area of ​​the second connecting portion 146 to be smaller than the opening area of ​​the second sub-recessed portion 1442, while ensuring the function of the second adhesive layer 143 to discharge heat and bubbles, it can also ensure that the second adhesive layer 143 has a sufficient bonding area, thereby ensuring the bonding effect of the second adhesive layer 143.

[0053] In some other embodiments, the multiple second sub-recesses 1442 on the second adhesive layer 143 can be distributed in an array, that is, the multiple second sub-recesses 1442 are distributed in multiple rows and columns; when the multiple second sub-recesses 1442 and the multiple second connecting portions 146 are interconnected to form the second cavity 148, the second cavity 148 can be in a grid shape. This opening method can make the multiple second sub-recesses 1442 and the multiple second connecting portions 146 evenly distributed on the second adhesive layer 143, thereby facilitating uniform heat conduction on the adhesive structure 140 and reducing the risk of overheating failure of the display panel 110 due to local overheating.

[0054] It should be noted that the shape, size, and distribution of the second sub-recessed portion 1442 and the second connecting portion 146 on the second adhesive layer 143 can be selected and adjusted according to actual design requirements. It is only necessary to ensure that the formation of the second sub-recessed portion 1442 and the second connecting portion 146 can effectively reduce the efficiency of heat transfer to the display panel 110, thereby reducing the risk of overheating and failure of the display panel 110, while ensuring the bonding effect of the second adhesive layer 143. No special restrictions are imposed here.

[0055] Optionally, as shown in FIG1 , the display module 100 further includes a support layer 150 disposed between the first back plate 120 and the adhesive structure 140. The first adhesive layer 141 is connected to the support layer 150. Specifically, the adhesive structure 140 is connected to the first back plate 120 via the first adhesive layer 141 and the support layer 150. The support layer 150 can be a rigid structure such as stainless steel, and is used to support the overall structure of the display module 100 to ensure the overall structural stability of the display module 100.

[0056] In some embodiments, the recess 144 includes a first sub-recess 1441 and a second sub-recess 1442. A plurality of first sub-recesses 1441 are formed on the first adhesive layer 141, and a plurality of second sub-recesses 1442 are formed on the second adhesive layer 143. The ratio of the sum of the opening areas of the plurality of first sub-recesses 1441 to the area of ​​the first adhesive layer 141 is greater than the ratio of the sum of the opening areas of the plurality of second sub-recesses 1442 to the area of ​​the second adhesive layer 143, that is, the proportion of the opening area on the first adhesive layer 141 is greater than the proportion of the opening area on the second adhesive layer 143.

[0057] Since the first adhesive layer 141 is connected to the support layer 150 and the second adhesive layer 143 is connected to the second back plate 130, and the support layer 150 is made of a rigid material such as stainless steel, and the second back plate 130 is made of an organic material, the bonding effect between the second adhesive layer 143 and the second back plate 130 is lower than the bonding effect between the first adhesive layer 141 and the support layer 150; at the same time, as the opening area on the first adhesive layer 141 and the second adhesive layer 143 increases, the overall thermal conductivity of the adhesive structure 140 decreases, and the heat conduction efficiency also decreases, thereby helping to reduce the risk of overheating failure of the display panel 110. In the embodiment of the present application, by setting the ratio of the sum of the opening areas of the multiple first sub-recesses 1441 to the area of ​​the first adhesive layer 141 to be greater than the ratio of the sum of the opening areas of the multiple second sub-recesses 1442 to the area of ​​the second adhesive layer 143, while utilizing the recesses 144 on the first adhesive layer 141 and the second adhesive layer 143 to reduce the risk of overheating failure of the display panel 110, it can also ensure the bonding effect of the adhesive structure 140 between the second back plate 130 and the support layer 150, thereby ensuring the structural stability of the display module 100.

[0058] It should be noted that when multiple first connecting portions 145 are formed on the first adhesive layer 141 and multiple second connecting portions 146 are formed on the second adhesive layer 143, the ratio of the sum of the opening areas of the multiple first sub-recesses 1441 and the multiple first connecting portions 145 to the area of ​​the first adhesive layer 141 is also greater than the ratio of the sum of the opening areas of the multiple second sub-recesses 1442 and the multiple second connecting portions 146 to the area of ​​the second adhesive layer 143. The ratio of the sum of the opening areas of the multiple first sub-recesses 1441 to the area of ​​the first adhesive layer 141, the ratio of the sum of the opening areas of the multiple second sub-recesses 1442 to the area of ​​the second adhesive layer 143, and the difference between the two ratios can be selected and adjusted according to actual design requirements and are not particularly limited here.

[0059] The display module 100 also includes a buffer layer 160 disposed between the support layer 150 and the first backplane 120. The buffer layer 160 is compressible, such as a foam or other cushioning structure. When the display module 100 is subjected to external forces such as impact, the buffer layer 160 absorbs the force, providing a buffering effect and preventing damage to the display module 100.

[0060] Optionally, the display module 100 also includes a polarizer 170, which is arranged on the side of the display portion 111 of the display panel 110 that is away from the first back plate 120, that is, the polarizer 170 is attached to the light-emitting side of the display panel 110. By attaching the polarizer 170 to the display portion 111 of the display panel 110, on the one hand, it is beneficial to improve the contrast of the display image of the display panel 110, and on the other hand, it helps to improve the display viewing angle of the display panel 110 and improve the overall display effect of the display module 100.

[0061] The display module 100 also includes a cover plate 180, which is disposed on the light-emitting side of the display panel 110 and covers the entire display panel 110. This protects the display panel 110 from corrosion by external moisture or oxygen, thereby ensuring normal display performance. Because the cover plate 180 is located on the light-emitting side of the display panel 110, a material with high light transmittance, such as glass, is selected for manufacturing the cover plate 180. This ensures that the cover plate 180 protects the display panel 110 while ensuring sufficient light output from the display panel 110, thereby maintaining the overall display quality of the display panel 110.

[0062] Among them, the cover plate 180 is adhered to the polarizer 170 through an optical adhesive layer set on the polarizer 170. The optical adhesive layer used also has a large light transmittance, which ensures the stability of the adhesion between the cover plate 180 and the polarizer 170 while avoiding affecting the light output of the display panel 110, thereby ensuring the normal display of the display module 100.

[0063] It should be noted that the cover plate 180 in the display module 100 can be a single-layer structure or a multi-layer structure, and its specific structure type can be selected and adjusted according to actual use requirements, and is not particularly limited here.

[0064] The display module 100 also includes a protective layer 200, which is arranged on the display panel 110 and covers at least the bent portion 113 of the display panel 110 to protect the display panel 110 and prevent external moisture or oxygen from corroding the display panel 110. At the same time, the provision of the protective layer 200 can also relieve the stress generated when the bent portion 113 is bent, thereby avoiding damage to the conductive circuit structure within the bent portion 113 due to stress concentration on the bent portion 113, thereby ensuring normal display of the display panel 110.

[0065] Optionally, in some embodiments of the present application, the display module further includes a driving element, which is arranged on the side of the binding portion away from the display portion; the recessed portion includes a first sub-recessed portion and a second sub-recessed portion, the first sub-recessed portion is formed on the first adhesive layer, and the second sub-recessed portion is formed on the second adhesive layer, and the orthographic projection of the first sub-recessed portion on the binding portion, the orthographic projection of the second sub-recessed portion on the binding portion, and the orthographic projection of the driving element on the binding portion at least partially overlap.

[0066] Optionally, in some embodiments of the present application, the recess includes a first sub-recess, the first sub-recess is formed on the first adhesive layer, and the first sub-recess passes through the first adhesive layer along the direction from the first backplane toward the second backplane.

[0067] Optionally, in some embodiments of the present application, the recessed portion includes a first sub-recessed portion, a plurality of the first sub-recessed portions are formed on the first adhesive layer, and a plurality of first connecting portions are also formed on the first adhesive layer, and at least some of the first sub-recessed portions are connected to each other through the first connecting portions.

[0068] Optionally, in some embodiments of the present application, part of the first sub-recess passes through the side surface of the first adhesive layer.

[0069] Optionally, in some embodiments of the present application, a plurality of the first sub-recesses and a plurality of the first connecting portions are interconnected to form a first cavity, and the first cavity passes through at least one of the side surfaces of the first adhesive layer.

[0070] Optionally, in some embodiments of the present application, the first cavity passes through the corresponding side surface of the first adhesive layer through the first connecting portion.

[0071] Optionally, in some embodiments of the present application, the opening area of ​​the first connecting portion is smaller than the opening area of ​​the first sub-recessed portion.

[0072] Optionally, in some embodiments of the present application, the recess includes a second sub-recess, the second sub-recess is formed on the second adhesive layer, and the second sub-recess passes through the second adhesive layer along the direction from the first backplane toward the second backplane.

[0073] Optionally, in some embodiments of the present application, the recessed portion includes a second sub-recessed portion, a plurality of the second sub-recessed portions are formed on the second adhesive layer, and a plurality of second connecting portions are also formed on the second adhesive layer, and at least some of the second sub-recessed portions are connected to each other through the second connecting portions.

[0074] Optionally, in some embodiments of the present application, part of the second sub-recess passes through the side surface of the second adhesive layer.

[0075] Optionally, in some embodiments of the present application, a plurality of the second sub-recesses and a plurality of the second connecting portions are interconnected to form a second cavity, and the second cavity passes through at least one side surface of the second adhesive layer.

[0076] Optionally, in some embodiments of the present application, the second cavity passes through the corresponding side surface of the second adhesive layer through the second connecting portion.

[0077] Optionally, in some embodiments of the present application, the opening area of ​​the second connecting portion is smaller than the opening area of ​​the second sub-recessed portion.

[0078] Optionally, in some embodiments of the present application, a plurality of recessed portions are formed on the surface of at least one of the first adhesive layer and the second adhesive layer, and the plurality of recessed portions are distributed in an array.

[0079] Optionally, in some embodiments of the present application, the display module further includes a supporting layer, the supporting layer is disposed between the first back plate and the adhesive structure, and the first adhesive layer is connected to the supporting layer.

[0080] Optionally, in some embodiments of the present application, the recess includes a first sub-recess and a second sub-recess, a plurality of the first sub-recesses are formed on the first adhesive layer, and a plurality of the second sub-recesses are formed on the second adhesive layer, and the ratio of the sum of the opening areas of the plurality of the first sub-recesses to the area of ​​the first adhesive layer is greater than the ratio of the sum of the opening areas of the plurality of the second sub-recesses to the area of ​​the second adhesive layer.

[0081] Optionally, in some embodiments of the present application, a plurality of first connecting portions are formed on the first adhesive layer, and a plurality of second connecting portions are formed on the second adhesive layer, and the ratio of the sum of the opening areas of the plurality of first sub-recesses and the plurality of first connecting portions to the area of ​​the first adhesive layer is greater than the ratio of the sum of the opening areas of the plurality of second sub-recesses and the plurality of second connecting portions to the area of ​​the second adhesive layer.

[0082] Optionally, in some embodiments of the present application, the display module further includes:

[0083] a buffer layer, disposed between the support layer and the first backplane;

[0084] a polarizer, disposed on a side of the display portion facing away from the first back plate;

[0085] a cover plate, disposed on a side of the polarizer facing away from the first back plate;

[0086] A protective layer is provided on the display panel, and the protective layer at least covers the bent portion of the display panel.

[0087] In an embodiment of the present application, a display module includes a display panel, a first backplane, a second backplane, and an adhesive structure. The display panel includes a display portion, a binding portion, and a bending portion. The display portion and the binding portion are arranged opposite to each other, and the bending portion is connected between the display portion and the binding portion. The first backplane is arranged on the side of the display portion facing the binding portion, and the second backplane is arranged on the side of the binding portion facing the display portion. The adhesive structure is arranged between the first backplane and the second backplane. The adhesive structure includes a first adhesive layer, a base layer, and a second adhesive layer stacked in a direction from the first backplane to the second backplane; wherein a recessed portion is formed on the surface of at least one of the first adhesive layer and the second adhesive layer. The present application forms a recessed portion on the surface of at least one of the first adhesive layer and the second adhesive layer of the adhesive structure, so that air can be used as a conductive medium in the recessed portion, thereby reducing the thermal conductivity of the adhesive structure as a whole, reducing the efficiency of heat transfer to the display panel, and reducing the risk of overheating failure of the display panel.

[0088] Secondly, an embodiment of the present application also provides a display device, which includes a display module. The specific structure of the display module refers to the above embodiment. Since this display device adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here one by one.

[0089] As shown in FIG5 , the display device 10 includes a display module 100, a control circuit 300, and a housing 400. The housing 400 is connected to the display module 100 to support and secure the display module 100. The control circuit 300 is disposed within the housing 400 and electrically connected to the display module 100 to control the display module 100 to display images.

[0090] Specifically, the display module 100 includes a display panel 110, a first backplane 120, a second backplane 130 and an adhesive structure 140. The display panel 110 includes a display part 111, a binding part 112 and a bending part 113. The display part 111 and the binding part 112 are arranged opposite to each other, and the bending part 113 is connected between the display part 111 and the binding part 112. The first backplane 120 is arranged on the side of the display part 111 facing the binding part 112, and the second backplane 130 is arranged on the side of the binding part 112 facing the display part 111. The adhesive structure 140 is arranged between the first backplane 120 and the second backplane 130. The adhesive structure 140 includes a first adhesive layer 141, a base layer 142 and a second adhesive layer 143 stacked in a direction from the first backplane 120 to the second backplane 130; wherein, a recessed portion 144 is formed on the surface of at least one of the first adhesive layer 141 and the second adhesive layer 143. The present application forms a recessed portion 144 on the surface of at least one of the first adhesive layer 141 and the second adhesive layer 143 of the adhesive structure 140, so that air can be used as a conductive medium in the recessed portion 144, thereby reducing the overall thermal conductivity of the adhesive structure 140 and lowering the efficiency of heat transfer to the display panel 110, thereby reducing the risk of overheating failure of the display panel 110.

[0091] The display module 100 can be fixed to the housing 400 to form an integral unit with the housing 400. The display module 100 and the housing 400 form a sealed space for accommodating the control circuit 300. The control circuit 300 can be the mainboard of the display device 10. At the same time, the control circuit 300 can also integrate one or more functional components such as a battery, an antenna structure, a microphone, a speaker, a headphone jack, a universal serial bus interface, a camera, a distance sensor, an ambient light sensor, a receiver, and a processor, so that the display device 10 can be adapted to various application fields.

[0092] It should be noted that the display device 10 is not limited to the above content. It can also include other devices, such as a camera, an antenna structure, a fingerprint unlocking module, etc., to expand its scope of use, which is not limited here.

[0093] The display device 10 in the embodiment of the present application has a wide range of applications, including flexible displays and lighting such as televisions, computers, mobile phones, foldable and rollable displays, and wearable devices such as smart bracelets and smart watches, all of which are within the scope of the application field of the display device 10 in the embodiment of the present application.

[0094] The above is a detailed introduction to a display module and a display device provided in the embodiments of the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea. At the same time, for those skilled in the art, based on the ideas of the present application, there may be changes in the specific implementation methods and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

Claims

1. A display module, comprising: The display panel includes a display portion, a binding portion, and a bending portion, wherein the display portion and the binding portion are arranged opposite to each other, and the bending portion is connected between the display portion and the binding portion; a first back plate, disposed on a side of the display portion facing the binding portion; a second back plate, disposed on a side of the binding portion facing the display portion; an adhesive structure disposed between the first backplane and the second backplane, the adhesive structure comprising a first adhesive layer, a base layer, and a second adhesive layer stacked in a direction from the first backplane toward the second backplane; Wherein, a concave portion is formed on the surface of at least one of the first adhesive layer and the second adhesive layer.

2. The display module according to claim 1, further comprising a driving element, wherein the driving element is arranged on a side of the binding portion away from the display portion; the recessed portion comprises a first sub-recessed portion and a second sub-recessed portion, the first sub-recessed portion is formed on the first adhesive layer, and the second sub-recessed portion is formed on the second adhesive layer, and the orthographic projection of the first sub-recessed portion on the binding portion, the orthographic projection of the second sub-recessed portion on the binding portion, and the orthographic projection of the driving element on the binding portion at least partially overlap.

3. The display module according to claim 1, wherein: The recessed portion includes a first sub-recessed portion, which is formed on the first adhesive layer. The first sub-recessed portion penetrates the first adhesive layer along a direction from the first back plate toward the second back plate.

4. The display module according to claim 1, wherein: The recessed portion includes a first sub-recessed portion, a plurality of the first sub-recessed portions are formed on the first adhesive layer, and a plurality of first connecting portions are also formed on the first adhesive layer. At least some of the first sub-recessed portions are connected to each other through the first connecting portions.

5. The display module according to claim 4, wherein: Part of the first sub-recessed portion passes through the side surface of the first adhesive layer.

6. The display module according to claim 4, wherein: The plurality of first sub-recesses and the plurality of first connecting portions are connected to each other to form a first cavity, and the first cavity at least passes through one of the side surfaces of the first adhesive layer.

7. The display module according to claim 6, wherein: The first cavity passes through the corresponding side surface of the first adhesive layer through the first connecting portion.

8. The display module according to claim 4, wherein: An opening area of ​​the first connecting portion is smaller than an opening area of ​​the first sub-recessed portion.

9. The display module according to claim 1, wherein: The recessed portion includes a second sub-recessed portion, the second sub-recessed portion is formed on the second adhesive layer, and the second sub-recessed portion penetrates the second adhesive layer along a direction from the first back plate toward the second back plate.

10. The display module according to claim 1, wherein: The recessed portion includes a second sub-recessed portion, a plurality of the second sub-recessed portions are formed on the second adhesive layer, and a plurality of second connecting portions are also formed on the second adhesive layer. At least some of the second sub-recessed portions are connected to each other through the second connecting portions.

11. The display module according to claim 10, wherein: Part of the second sub-recessed portion passes through the side surface of the second adhesive layer.

12. The display module according to claim 10, wherein: The plurality of second sub-recesses and the plurality of second connecting portions are connected to each other to form a second cavity, and the second cavity at least passes through one of the side surfaces of the second adhesive layer.

13. The display module according to claim 12, wherein: The second cavity passes through the corresponding side surface of the second adhesive layer through the second connecting portion.

14. The display module according to claim 10, wherein: An opening area of ​​the second communicating portion is smaller than an opening area of ​​the second sub-recessed portion.

15. The display module according to any one of claims 1 to 14, wherein: A plurality of recessed portions are formed on a surface of at least one of the first adhesive layer and the second adhesive layer, and the plurality of recessed portions are distributed in an array. 16 . The display module according to claim 1 , further comprising a supporting layer, wherein the supporting layer is disposed between the first back plate and the adhesive structure, and the first adhesive layer is connected to the supporting layer.

17. The display module according to claim 16, wherein: The recessed portion includes a first sub-recessed portion and a second sub-recessed portion. A plurality of the first sub-recessed portions are formed on the first adhesive layer, and a plurality of the second sub-recessed portions are formed on the second adhesive layer. The ratio of the sum of the opening areas of the plurality of the first sub-recessed portions to the area of ​​the first adhesive layer is greater than the ratio of the sum of the opening areas of the plurality of the second sub-recessed portions to the area of ​​the second adhesive layer.

18. The display module according to claim 17, wherein: A plurality of first connecting portions are formed on the first adhesive layer, and a plurality of second connecting portions are formed on the second adhesive layer. A ratio of a sum of opening areas of the plurality of first sub-recesses and the plurality of first connecting portions to an area of ​​the first adhesive layer is greater than a ratio of a sum of opening areas of the plurality of second sub-recesses and the plurality of second connecting portions to an area of ​​the second adhesive layer.

19. The display module according to claim 16, further comprising: a buffer layer, disposed between the support layer and the first backplane; a polarizer, disposed on a side of the display portion facing away from the first back plate; a cover plate, disposed on a side of the polarizer facing away from the first back plate; A protective layer is provided on the display panel, and the protective layer at least covers the bent portion of the display panel.

20. A display device comprising the display module according to any one of claims 1 to 19.

Images