Light-emitting device and lighting device

Abstract

This light-emitting device comprises a substrate, a light-emitting element, and a wavelength conversion unit. The substrate has a first surface and a second surface on the opposite side thereof from the first surface. The light-emitting element is located on the second surface. The wavelength conversion unit is located on the second surface and covers the light-emitting element. The substrate includes, in a first direction running along a direction perpendicular to the first surface, a first portion located on the first surface-side and a second portion located on the second surface-side. The first portion protrudes further than the wavelength conversion unit in a second direction running along the second surface.

Description

Light-emitting device and lighting device CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims priority from Japanese Application No. 2024-24663 (filed February 21, 2024), the entire disclosure of which is incorporated herein by reference.

[0002] The present disclosure relates to a light emitting device and an illumination device.

[0003] There is a light emitting device that includes a substrate, a light emitting element that emits excitation light and is located on the upper surface of the substrate (also referred to as the upper surface of the substrate), and a wavelength conversion member that is located on the upper surface of the substrate and seals the light emitting element (see, for example, the description in Patent Document 1).

[0004] In this light-emitting device, the wavelength conversion member has a surface facing the substrate (also referred to as the bottom surface or the member bottom surface), a surface opposite the substrate (also referred to as the top surface or the member top surface), and a surface connecting the bottom surface and the member top surface (also referred to as the side surface or the member side surface), and in response to excitation light incident from the light-emitting element, light of a wavelength different from the excitation light is emitted from the top surface and the side surface of the member to the outside of the light-emitting device. A light-emitting device having this structure is also called a chip size package (CSP) type light-emitting device.

[0005] Furthermore, there is a lighting device that includes a mounting board on which one or more light emitting devices or a plurality of light emitting devices are mounted (see, for example, the description in Patent Document 1).

[0006] In recent years, there has been an increasing demand for light emitting devices and lighting devices to reduce damage caused by external forces, for example.

[0007] International Publication No. 2023 / 054199

[0008] Light emitting devices and lighting devices are disclosed.

[0009] One aspect of the light emitting device includes a substrate, a light emitting element, and a wavelength converting portion. The substrate has a first surface and a second surface opposite to the first surface. The light emitting element is located on the second surface. The wavelength converting portion is located on the second surface and covers the light emitting element. The substrate includes, in a first direction perpendicular to the first surface, a first portion located on the first surface side and a second portion located on the second surface side. In the second direction along the second surface, the first portion protrudes more than the wavelength converting portion.

[0010] One aspect of the lighting device includes a plurality of the light-emitting devices according to the above aspect.

[0011] FIG. 1 is a plan view showing the appearance of an example of a light-emitting device according to the first embodiment. FIG. 2 is a front view showing the appearance of an example of a light-emitting device according to the first embodiment. FIG. 3 is a side view showing the appearance of an example of a light-emitting device according to the first embodiment. FIG. 4 is a diagram showing an example of the configuration of a light-emitting device according to the first embodiment. FIG. 5 is a cross-sectional view showing a virtual cross section of an example of a light-emitting device taken at position V-V in FIGS. 1 and 4 , viewed toward the +Y direction. FIG. 6 is a cross-sectional view showing a virtual cross section of an example of a light-emitting device taken at position VI-VI in FIGS. 1 and 4 , viewed toward the +X direction. FIG. 7 is a front view showing region VII surrounded by a dashed rectangular line in FIG. 2 . FIG. 8 is a front view showing region VIII surrounded by a dashed rectangular line in FIG. 2 . FIG. 9 is a side view showing region IX surrounded by a dashed rectangular line in FIG. 3 . FIG. 10 is a side view showing region X surrounded by a dashed rectangular line in FIG. 3 . FIG. 11 is a front view showing the appearance of an example of a light-emitting device according to a second embodiment. FIG. 12 is a side view showing the appearance of an example of a light-emitting device according to the second embodiment. FIG. 13 is a front view showing a region XIII surrounded by a dashed-dotted rectangular line in FIG. 11 . FIG. 14 is a front view showing a region XIV surrounded by a dashed-dotted rectangular line in FIG. 11 . FIG. 15 is a side view showing a region XV surrounded by a dashed-dotted rectangular line in FIG. 12 . FIG. 16 is a side view showing a region XVI surrounded by a dashed-dotted rectangular line in FIG. 12 . FIG. 17 is a front view showing the appearance of an example of a light-emitting device according to the third embodiment. FIG. 18 is a side view showing the appearance of an example of a light-emitting device according to the third embodiment. FIG. 19 is a front view showing a region XIX surrounded by a dashed-dotted rectangular line in FIG. 17 . FIG. 20 is a front view showing a region XX surrounded by a dashed-dotted rectangular line in FIG. 17 . FIG. 21 is a side view showing a region XXI surrounded by a dashed-dotted rectangular line in FIG. 18 . FIG. 22 is a side view showing a region XXII surrounded by a dashed-dotted rectangular line in FIG. 18 . Fig. 23 is a front view showing an area XXIII surrounded by a dashed line in a rectangle in Fig. 17. Fig. 24 is a front view showing an area XXIV surrounded by a dashed line in a rectangle in Fig. 17. Fig. 25 is a side view showing an area XXV surrounded by a dashed line in a rectangle in Fig. 18. Fig. 26 is a side view showing an area XXVI surrounded by a dashed line in a rectangle in Fig. 18. Fig. 27 is a diagram showing an example of the configuration of a light-emitting device according to a fourth embodiment.Fig. 28 is a front view showing the appearance of an example of a light-emitting device according to a fifth embodiment. Fig. 29 is a diagram showing an example of the configuration of a light-emitting device according to the fifth embodiment. Fig. 30 is a cross-sectional view showing a virtual cross section of an example of a light-emitting device viewed in the +Y direction at the position XXX-XXX shown in Fig. 29. Fig. 31 is a schematic view showing the appearance of an example of a lighting device.

[0012] There are light emitting devices that include a substrate, a light emitting element, and a wavelength conversion member, and there are also lighting devices that include a mounting board on which one or more light emitting devices or a plurality of light emitting devices are mounted.

[0013] In this light-emitting device, the substrate has an upper surface (also referred to as the substrate upper surface). The light-emitting element is located on the substrate upper surface and emits excitation light. The wavelength conversion member is located on the substrate upper surface and seals the light-emitting element. This wavelength conversion member has a surface facing the substrate (also referred to as the bottom surface or the member bottom surface), a surface opposite the substrate (also referred to as the top surface or the member top surface), and a surface connecting the member bottom surface and the member top surface (also referred to as the side surface or the member side surface). In response to the incidence of excitation light from the light-emitting element, this wavelength conversion member emits light of a wavelength different from the excitation light from the member top surface and the member side surface to the outside of the light-emitting device. A light-emitting device having this structure is called a chip-size package (CSP) type light-emitting device.

[0014] In this CSP type light emitting device, the wavelength conversion member has exposed upper and side surfaces, and therefore may be deformed by application of an external force and peeled off from the upper surface of the substrate.

[0015] That is, there is room for improvement in reducing damage caused by external forces with respect to light-emitting devices and lighting devices equipped with light-emitting devices.

[0016] Therefore, the inventors of the present disclosure have created a technology that can reduce damage to light-emitting devices and lighting devices caused by external forces.

[0017] In this regard, various embodiments and examples will be described below with reference to the drawings. In the drawings, parts having the same or similar configurations and functions are denoted by the same reference numerals. Duplicate explanations will be omitted in the following description. The drawings are schematic. Each of FIGS. 1 to 31 is illustrated with a right-handed XYZ coordinate system. In this XYZ coordinate system, one direction along the second surface 2f2 of the substrate 2 is the +X direction, another direction along the second surface 2f2 of the substrate 2 is the +Y direction, and one direction along a normal to the second surface 2f2 of the substrate 2 is the +Z direction.

[0018] <1. First Embodiment> <1-1. Configuration of Light-Emitting Device> FIG. 1 is a plan view showing the appearance of an example of a light-emitting device 1 according to the first embodiment. FIG. 2 is a front view showing the appearance of an example of a light-emitting device 1 according to the first embodiment. FIG. 3 is a side view showing the appearance of an example of a light-emitting device 1 according to the first embodiment. FIG. 4 is a diagram showing an example of the configuration of a light-emitting device 1 according to the first embodiment. FIG. 5 is a cross-sectional view showing a virtual cross section of an example of a light-emitting device 1 viewed toward the +Y direction at position V-V shown in FIGS. 1 and 4. FIG. 6 is a cross-sectional view showing a virtual cross section of an example of a light-emitting device 1 viewed toward the +X direction at position VI-VI shown in FIGS. 1 and 4. FIG. 4 shows the relative positional relationships between the substrate 2, the light-emitting element 3, the wavelength conversion unit 4, and the electronic component 5 when the light-emitting device 1 is viewed in a planar perspective view in the -Z direction. In FIG. 4, the outer edge of the portion of the substrate 2 facing the +Z direction is depicted with a solid line, the outer edges of the light-emitting element 3 and the electronic component 5 are depicted with thin dashed lines, and the outer edge of the wavelength conversion unit 4 is depicted with a thin two-dot chain line.

[0019] As shown in FIGS. 1 to 6 , the light-emitting device 1 includes a substrate 2, a light-emitting element 3, and a wavelength conversion unit 4. The light-emitting element 3 is located on the substrate 2. The wavelength conversion unit 4 is located on the substrate 2 and the light-emitting element 3. In other words, the light-emitting element 3 is sandwiched between the substrate 2 and the wavelength conversion unit 4. The wavelength conversion unit 4 is located on the substrate 2 so as to cover the light-emitting element 3. In the light-emitting device 1, for example, the light-emitting element 3 can emit excitation light. The excitation light emitted from the light-emitting element 3 may be directly incident on the wavelength conversion unit 4. In response to the incidence of the excitation light emitted from the light-emitting element 3, the wavelength conversion unit 4 can emit light having a spectrum (also referred to as a spectral distribution) different from that of the excitation light. The light emitted from the wavelength conversion unit 4 can be emitted to the outside of the light-emitting device 1 as illumination light. The light-emitting device 1 may further include, for example, an electronic component 5.

[0020] When the light emitting device 1 is viewed in a plan view in the −Z direction, the shape of the outer edge of the light emitting device 1 may be, for example, rectangular. The rectangular shape may be oblong or square.

[0021] <1-1-1. Substrate> The substrate 2 has a first surface (also referred to as the substrate bottom surface) 2f1 and a second surface (also referred to as the substrate top surface) 2f2. The second surface 2f2 is the surface opposite to the first surface 2f1. The first surface 2f1 faces the -Z direction as the first direction D1. The second surface 2f2 faces the +Z direction as the opposite direction to the first direction D1. Here, it is assumed that the light emitting device 1 is viewed from above in the -Z direction as the first direction D1. In other words, it is assumed that the substrate 2, the light emitting element 3, and the wavelength conversion unit 4 are viewed from above in the -Z direction as the first direction D1. In this case, for example, as shown in FIG. 4, the second surface 2f2 may include a region A1 (also referred to as a first region) surrounding the light emitting element 3.

[0022] The substrate 2 has a side surface 2fs (also referred to as a substrate side surface) connecting the first surface 2f1 and the second surface 2f2. The shape of the outer edges of each of the first surface 2f1 and the second surface 2f2 may be, for example, rectangular. In other words, the first surface 2f1 may have a rectangular outer edge, and the second surface 2f2 may have a rectangular outer edge. In this case, for example, the substrate 2 can be easily formed, and the light-emitting device 1 can be easily manufactured.

[0023] If the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, the substrate 2 has four substrate side surfaces 2fs. In the example of FIGS. 1 to 6, the four substrate side surfaces 2fs include a first substrate side surface 2fs1, a second substrate side surface 2fs2, a third substrate side surface 2fs3, and a fourth substrate side surface 2fs4. The first substrate side surface 2fs1 faces in the −X direction, which is the second direction D2 along the first surface 2f1. The second substrate side surface 2fs2 faces in the +X direction, which is the third direction D3 opposite to the second direction D2. The third substrate side surface 2fs3 faces in the −Y direction, which is the fourth direction D4 perpendicular to the second direction D2 along the second surface 2f2. The fourth substrate side surface 2fs4 faces in the +Y direction, which is the fifth direction D5 opposite to the fourth direction D4.

[0024] The first surface 2f1 has a side connected to the substrate side surface 2fs. If the outer edge of the first surface 2f1 is rectangular, the first surface 2f1 has four sides each connected to the substrate side surface 2fs. In the examples of FIGS. 1 to 6, the first surface 2f1 has a side connected to the first substrate side surface 2fs1, a side connected to the second substrate side surface 2fs2, a side connected to the third substrate side surface 2fs3, and a side connected to the fourth substrate side surface 2fs4. The four sides include two sides each located along the −Y direction as the fourth direction D4 and two sides each located along the −X direction as the second direction D2.

[0025] The second surface 2f2 has a side connected to the substrate side surface 2fs. If the outer edge of the second surface 2f2 is rectangular, the second surface 2f2 has four sides each connected to the substrate side surface 2fs. In the examples of FIGS. 1 to 6, the second surface 2f2 has a side connected to the first substrate side surface 2fs1, a side connected to the second substrate side surface 2fs2, a side connected to the third substrate side surface 2fs3, and a side connected to the fourth substrate side surface 2fs4. The four sides include two sides each located along the −Y direction as the fourth direction D4 and two sides each located along the −X direction as the second direction D2.

[0026] The substrate 2 may have a thickness of, for example, approximately 100 micrometers (μm) or more and approximately 1000 μm or less. The thickness of the substrate 2 may be the length of the substrate 2 in the −Z direction, which is the first direction D1. The substrate 2 may have a first width of, for example, approximately 1 millimeter (mm) or more and approximately 4 mm or less. The first width of the substrate 2 may be the length of the substrate 2 in the −X direction, which is the second direction D2 of the substrate 2. The substrate 2 may have a second width of, for example, approximately 1 mm or more and approximately 4 mm or less. The second width of the substrate 2 may be the length of the substrate 2 in the −Y direction, which is the fourth direction D4 of the substrate 2. The first width may be simply referred to as the width, and the second width may be simply referred to as the depth. For example, if the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, the first surface 2f1 may be a rectangular surface having a first width and a second width.

[0027] The substrate 2 includes, for example, a main body portion (also referred to as a substrate main body portion) 21. The substrate 2 also includes, for example, two first electrodes 22 and two second electrodes 23. In the first embodiment, the substrate 2 includes, for example, a reflective portion 24. The substrate 2 may further include, for example, two third electrodes 25.

[0028] <<Substrate Main Body>> The substrate main body 21 may be insulating. The substrate main body 21 may be made of, for example, an insulating material (also referred to as an insulating material). Examples of the insulating material constituting the substrate main body 21 include ceramic materials such as aluminum oxide (alumina) or mullite, or glass ceramic materials. Examples of the insulating material constituting the substrate main body 21 include a mixture of two or more ceramic materials (also referred to as a composite material), or a mixture of one or more ceramic materials and a glass ceramic material (composite material). Examples of the insulating material constituting the substrate main body 21 include a polymer resin material in which metal oxide particles are dispersed to adjust the thermal expansion coefficient of the substrate main body 21. Examples of the insulating material constituting the substrate main body 21 include aluminum nitride, or a material containing aluminum nitride or silicon carbide. This can improve the thermal conductivity of the substrate main body 21. As a result, the heat dissipation performance of the light-emitting device 1 is improved.

[0029] The substrate main body 21 has a third surface 21f3 located on the first surface 2f1 side and a fourth surface 21f4 located on the second surface 2f2 side. The substrate main body 21 may have a plate-like shape. The outer edges of the third surface 21f3 and the fourth surface 21f4 may be, for example, rectangular. In other words, the third surface 21f3 may have a rectangular outer periphery, and the fourth surface 21f4 may have a rectangular outer periphery.

[0030] The substrate body portion 21 may have a thickness of, for example, approximately 80 micrometers (μm) or more and approximately 980 μm or less. The thickness of the substrate body portion 21 may be the length of the substrate 2 in the −Z direction, which is the first direction D1 of the substrate body portion 21. The substrate body portion 21 may have a third width of, for example, approximately 1 mm or more and approximately 4 mm or less. The third width of the substrate body portion 21 may be the length of the substrate body portion 21 in the −X direction, which is the second direction D2 of the substrate body portion 21. The substrate body portion 21 may have a fourth width of, for example, approximately 1 mm or more and approximately 4 mm or less. The fourth width of the substrate body portion 21 may be the length of the substrate body portion 21 in the −Y direction, which is the fourth direction D4 of the substrate body portion 21. The third width may be simply referred to as width, and the fourth width may be referred to as depth. For example, when the outer edges of the third surface 21f3 and the fourth surface 21f4 are rectangular, the third surface 21f3 may be a rectangular surface having a third width and a fourth width.

[0031] <<First Electrodes>> Each of the two first electrodes 22 is located on the first surface 2f1 side of the substrate 2. Each of the two first electrodes 22 may be located on the third surface 21f3 of the substrate main body portion 21. Each of the two first electrodes 22 may have a film-like or thin plate-like shape. For each of the two first electrodes 22, the surface of the first electrode 22 opposite the substrate main body portion 21 constitutes part of the first surface 2f1. The two first electrodes 22 are spaced apart from each other in the −X direction as the second direction D2 and are aligned in the −X direction as the second direction D2. The two first electrodes 22 include a first first electrode 22 (also referred to as a firstA electrode 22a) located on the −X direction side as the second direction D2 and a second first electrode 22 (also referred to as a firstB electrode 22b) located on the +X direction side as the third direction D3. Each of the two first electrodes 22 may be referred to as a back electrode. Here, the firstA electrode 22a and the firstB electrode 22b may each function as an electrode that supplies power to the light-emitting element 3. For example, the firstA electrode 22a may function as a positive electrode, and the firstB electrode 22b may function as a negative electrode. For example, the firstA electrode 22a may function as a negative electrode, and the firstB electrode 22b may function as a positive electrode. The two first electrodes 22 may be bonded to a substrate of the lighting device, for example, when the light-emitting device 1 is mounted in the lighting device.

[0032] The first electrode 22 may be made of a conductive material such as tungsten (W), molybdenum (Mo), manganese (Mn), or copper (Cu).

[0033] <<Second Electrode>> Each of the two second electrodes 23 is located on the second surface 2f2 side of the substrate 2. Each of the two second electrodes 23 may be located on the fourth surface 21f4 of the substrate main body 21. The two second electrodes 23 are located on the −Y direction side of the fourth surface 21f4 of the substrate main body 21, which is defined as the fourth direction D4. Each of the two second electrodes 23 may have a film-like or thin plate-like shape. For each of the two second electrodes 23, the surface of the second electrode 23 opposite the substrate main body 21 constitutes part of the second surface 2f2. The two second electrodes 23 are spaced apart from each other in the −X direction, which is defined as the second direction D2 along the second surface 2f2, and are aligned in the −X direction, which is defined as the second direction D2. The two second electrodes 23 include a first second electrode 23 (also referred to as the second A electrode 23a) located on the -X direction side as the second direction D2, and a second second electrode 23 (also referred to as the second B electrode 23b) located on the +X direction side as the third direction D3.

[0034] The second-A electrode 23a may be electrically connected to the first-A electrode 22a by a wiring (also referred to as a first through wiring) penetrating the substrate main body 21. The second-B electrode 23b may be electrically connected to the first-B electrode 22b by a wiring (also referred to as a second through wiring) penetrating the substrate main body 21. In other words, the substrate 2 may include a first through wiring electrically connecting the first-A electrode 22a and the second-A electrode 23a. The substrate 2 may include a second through wiring electrically connecting the first-B electrode 22b and the second-B electrode 23b. Here, each of the second-A electrode 23a and the second-B electrode 23b may function as an electrode supplying power to the light-emitting element 3. For example, the second-A electrode 23a may function as a positive electrode, and the second-B electrode 23b may function as a negative electrode. For example, the second-A electrode 23a may function as a negative electrode, and the second-B electrode 23b may function as a positive electrode.

[0035] The second electrode 23, the first through-wire, and the second through-wire may be made of a conductive material such as W, Mo, Mn, or Cu, similar to the first electrode 22.

[0036] <<Third Electrode>> Each of the two third electrodes 25 is located on the second surface 2f2 side of the substrate 2. Each of the two third electrodes 25 may be located on the fourth surface 21f4 of the substrate main body 21. The two third electrodes 25 are located closer to the +Y direction in the fifth direction D5 than the two second electrodes 23. In other words, the two third electrodes 25 are located on the fourth surface 21f4 of the substrate main body 21 closer to the +Y direction in the fifth direction D5, which is perpendicular to the second direction D2 along the second surface 2f2. Each of the two third electrodes 25 may have a film-like or thin plate-like shape. In each of the two third electrodes 25, the surface of the third electrode 25 opposite the substrate main body 21 constitutes part of the second surface 2f2. The two third electrodes 25 are spaced apart from each other in the −X direction as the second direction D2 along the second surface 2f2 and are arranged side by side in the −X direction as the second direction D2. The two third electrodes 25 include a first third electrode 25 (also referred to as a thirdA electrode 25a) located on the −X direction side as the second direction D2 and a second third electrode 25 (also referred to as a thirdB electrode 25b) located on the +X direction side as the third direction D3.

[0037] Here, the substrate 2 may include wiring (also referred to as first connection wiring) 26a electrically connecting the second-A electrode 23a and the third-A electrode 25a, and wiring (also referred to as second connection wiring) 26b electrically connecting the second-B electrode 23b and the third-B electrode 25b. In other words, the second-A electrode 23a and the third-A electrode 25a may form a single electrode (also referred to as a fourth-A electrode) E4a. The second-B electrode 23b and the third-B electrode 25b may form a single electrode (also referred to as a fourth-B electrode) E4b. The first connection wiring 26a and the second connection wiring 26b may be located on the fourth surface 21f4 of the substrate main body 21, similar to the two second electrodes 23 and the two third electrodes 25, respectively. The first connection wiring 26a and the second connection wiring 26b may have a film-like or thin-plate-like shape. The surface of the first connection wiring 26a on the opposite side to the substrate main body 21 constitutes part of the second surface 2f2. The surface of the second connection wiring 26b on the opposite side to the substrate main body 21 constitutes part of the second surface 2f2.

[0038] Here, for example, the 3A electrode 25a may be electrically connected to the 1A electrode 22a by a first through-hole wiring, and the 3B electrode 25b may be electrically connected to the 1B electrode 22b by a second through-hole wiring. In other words, the substrate 2 may include a first through-hole wiring electrically connecting the 1A electrode 22a and the 3A electrode 25a, and a second through-hole wiring electrically connecting the 1B electrode 22b and the 3B electrode 25b. Here, the 3A electrode 25a and the 3B electrode 25b may each function as an electrode supplying power to the electronic component 5. For example, the 3A electrode 25a may function as a positive electrode, and the 3B electrode 25b may function as a negative electrode. The 3A electrode 25a may function as a negative electrode, and the 3B electrode 25b may function as a positive electrode. The 4A electrode E4a and the 4B electrode E4b may each function as an electrode supplying power to the light-emitting element 3. For example, the fourth A electrode E4a can function as a positive electrode and the fourth B electrode E4b can function as a negative electrode. For example, the fourth A electrode E4a may function as a negative electrode and the fourth B electrode E4b may function as a positive electrode.

[0039] The materials constituting the third electrode 25, the first connection wiring 26a and the second connection wiring 26b may be conductive materials such as W, Mo, Mn or Cu, similar to the first electrode 22 and the second electrode 23.

[0040] <<Reflector>> The reflector 24 is located closer to the second surface 2f2 than the substrate main body 21. The reflector 24 may be located on the fourth surface 21f4 of the substrate main body 21. Here, for example, it is assumed that the light emitting device 1 is viewed from above in the −Z direction, which is the first direction D1. In this case, as shown in FIG. 4, for example, the fourth surface 21f4 of the substrate main body 21 includes a region A2 (also referred to as a second region) that surrounds the light emitting element 3. The reflector 24 is located on the second region A2 on the fourth surface 21f4 and has at least a part of the first region A1 on the second surface 2f2.

[0041] The reflector 24 may be located over the entire second region A2, or may be located in a portion of the second region A2. The reflector 24 may be located in an area on the fourth surface 21f4 of the substrate main body 21 where the two second electrodes 23 and the two third electrodes 25 are not located. From another perspective, when the light-emitting device 1 is seen through in a plan view in the −Z direction as the first direction D1, the reflector 24 may be located in a form that surrounds the light-emitting element 3.

[0042] The reflecting portion 24 may have a film-like or thin plate-like shape. The surface of the reflecting portion 24 on the opposite side to the substrate main body 21 constitutes part of the second surface 2f2. In other words, when the substrate 2 includes the reflecting portion 24, the surface of the reflecting portion 24 on the opposite side to the substrate main body 21 constitutes part of the second surface 2f2. In other words, the reflecting portion 24 may include part of the second surface 2f2.

[0043] The reflecting portion 24 has a higher light reflectance at the second surface 2f2 than at the fourth surface 21f4 of the substrate main body 21. This can reduce the amount of excitation light emitted from the light-emitting element 3 and the light emitted in response to the incidence of excitation light in the wavelength conversion portion 4 that is absorbed by the second surface 2f2 of the substrate 2. This can increase the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of excitation light by the light-emitting element 3. As a result, light can be efficiently emitted to the outside of the light-emitting device 1.

[0044] Here, for example, the reflecting portion 24 may be positioned in a form that includes the entire outer periphery of the second surface 2f2 of the substrate 2. With this configuration, the amount of excitation light emitted from the light-emitting element 3 and the amount of light emitted in response to the incidence of excitation light by the wavelength conversion portion 4 that are absorbed by the second surface 2f2 of the substrate 2 can be further reduced. This can further increase the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of excitation light. As a result, light can be emitted to the outside of the light-emitting device 1 more efficiently.

[0045] The material of the reflective portion 24 may be, for example, a material in which a white material is added to a silicone resin. For example, titanium oxide may be used as the white material. The material of the reflective portion 24 is not limited to this, and any material may be used as long as the reflectance of light at the reflective portion 24 is higher than the reflectance of light at the fourth surface 21f4.

[0046] <1-1-2. Light-emitting element> The light-emitting element 3 is located on the second surface 2f2 of the substrate 2. More specifically, the light-emitting element 3 may be electrically connected to two second electrodes 23. The light-emitting element 3 is operated by power supplied from the two first electrodes 22 to the two second electrodes 23, and can emit light. The light emitted from the light-emitting element 3 functions as excitation light. The light-emitting element 3 included in the light-emitting device 1 is also referred to as an excitation light-emitting element.

[0047] The light-emitting element 3 may be capable of emitting light having a spectrum with a peak of light intensity (also referred to as light intensity) in a wavelength range of, for example, 360 nanometers (nm) or more and 430 nm or less. In the present disclosure, the wavelength range of 360 nm or more and 430 nm or less is also referred to as a purple light wavelength range (also referred to as a purple light range).

[0048] In the present disclosure, a light intensity peak in a light spectrum may be a point (also referred to as a maximum point) where the light intensity is at a maximum value in a graph showing the light spectrum. Note that in the present disclosure, a wavelength in the light spectrum where the light intensity is at a maximum value in a graph showing the light spectrum may be referred to as a peak wavelength in the light spectrum. Furthermore, the peak wavelength in the light spectrum may include the wavelength at the apex of a mountain-shaped portion located between two adjacent valley-shaped portions in the light spectrum in the graph showing the light spectrum.

[0049] For example, a light emitting diode (LED) is applied to the light emitting element 3. An LED can emit light to the outside by recombining electrons and holes at a PN junction where a P-type semiconductor and an N-type semiconductor are joined. The light emitting element 3 is not limited to an LED, and may be another light emitting device (also called a light emitting device).

[0050] The light-emitting element 3 may be mounted on the second surface 2f2 of the substrate 2. The light-emitting element 3 may be electrically connected to two second electrodes 23 located on the second surface 2f2 side of the substrate 2 via a bonding medium such as brazing material or solder. When the light-emitting device 1 is viewed from above in the −Z direction as the first direction D1, the light-emitting element 3 may be located on the two second electrodes 23 in a manner covering at least a portion of each of the two second electrodes 23. When the light-emitting device 1 is viewed from above in the −Z direction as the first direction D1, the light-emitting element 3 may cover a portion of each of the two second electrodes 23, may cover the entirety of each of the two second electrodes 23, may cover a portion of the second-A electrode 23a and the entirety of the second-B electrode 23b, or may cover the entirety of the second-A electrode 23a and the entirety of the second-B electrode 23b. 4, the light-emitting element 3 is positioned so as to entirely cover each of the two second electrodes 23. When the light-emitting device 1 is seen through in a plan view in the −Z direction as the first direction D1, the light-emitting element 3 may cover at least a part of the first connection wiring 26 a and the second connection wiring 26 b.

[0051] The light-emitting element 3 may be mounted on the substrate 2 by flip-chip bonding. Here, when the light-emitting device 1 is viewed from above in the −Z direction as the first direction D1, each of the two second electrodes 23 and a bonding medium such as brazing material or solder are covered by the light-emitting element 3. By adopting this configuration, the proportion of the excitation light emitted from the light-emitting element 3 and the light emitted in the wavelength conversion unit 4 in response to the incidence of the excitation light that is incident on the two second electrodes 23 and the bonding medium can be reduced. Therefore, the proportion of the excitation light emitted from the light-emitting element 3 and the light emitted in the wavelength conversion unit 4 in response to the incidence of the excitation light that is absorbed by the two second electrodes 23 and the bonding medium can be reduced. This can increase the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of excitation light by the light-emitting element 3. As a result, light can be efficiently emitted to the outside of the light-emitting device 1.

[0052] For example, assume that the light-emitting element 3 is mounted on the substrate 2 by wire bonding. In this case, at least a portion of the wire used for wire bonding is not covered by the light-emitting element 3. Therefore, the excitation light emitted from the light-emitting element 3 and a portion of the light emitted in response to the incidence of the excitation light in the wavelength conversion unit 4 may be absorbed by the wire. Therefore, if the light-emitting element 3 is mounted on the substrate 2 by flip-chip bonding, the amount of light emitted to the outside of the light-emitting device 1 in response to the emission of excitation light by the light-emitting element 3 may be greater than when the light-emitting element 3 is mounted on the substrate 2 by wire bonding. As a result, light can be efficiently emitted to the outside of the light-emitting device 1.

[0053] 4 to 6, one light-emitting element 3 is mounted on the second surface 2f2 of the substrate 2, but this is not limited to this. For example, two or more light-emitting elements 3 may be mounted on the second surface 2f2 of the substrate 2. Here, when the light-emitting device 1 is seen through in a plan view in the −Z direction as the first direction D1, the two or more light-emitting elements 3 may be positioned in a manner that does not overlap each other.

[0054] The light-emitting element 3 may include, for example, a light-transmitting substrate and an optical semiconductor layer located on the light-transmitting substrate. The material of the light-transmitting substrate may be, for example, a material on which an optical semiconductor layer can be grown using a chemical vapor deposition method such as metalorganic chemical vapor deposition or molecular beam epitaxy. The material of the light-transmitting substrate may be, for example, sapphire, gallium nitride, aluminum nitride, zinc oxide, zinc selenide, silicon carbide, silicon (Si), or zirconium diboride. The light-transmitting substrate may have a thickness of, for example, 50 μm or more and 1000 μm or less. The light-transmitting substrate may have, for example, a plate-like shape. The thickness of the light-transmitting substrate may be the length of the light-transmitting substrate in the −Z direction, which is the first direction D1 of the light-transmitting substrate.

[0055] The optical semiconductor layer includes, for example, a first semiconductor layer, a light-emitting layer, and a second semiconductor layer. The first semiconductor layer may be located on a light-transmitting substrate. The light-emitting layer may be located on the first semiconductor layer. The second semiconductor layer may be located on the light-emitting layer. The materials of the first semiconductor layer, the light-emitting layer, and the second semiconductor layer may be, for example, a Group III nitride semiconductor or a Group III-V semiconductor. The Group III nitride semiconductor may be, for example, gallium nitride, aluminum nitride, or indium nitride. The Group III-V semiconductor may be, for example, gallium phosphide or gallium arsenide. The thickness of the first semiconductor layer may be, for example, 1 μm or more and 5 μm or less. The thickness of the light-emitting layer may be, for example, 25 nm or more and 150 nm or less. The thickness of the second semiconductor layer may be, for example, 50 nm or more and 600 nm or less.

[0056] <1-1-3. Wavelength Conversion Section> The wavelength conversion section 4 is located on the second surface 2f2 of the substrate 2 and covers the light-emitting element 3. In other words, the wavelength conversion section 4 is located on the second surface 2f2 of the substrate 2 and covers the light-emitting element 3 from the region on the opposite side of the substrate 2 with the light-emitting element 3 sandwiched therebetween. In other words, the wavelength conversion section 4 is located on the +Z direction side of the substrate 2 and the light-emitting element 3. From another perspective, the light-emitting element 3 is sandwiched between the substrate 2 and the wavelength conversion section 4. The wavelength conversion section 4 may be in contact with the second surface 2f2 of the substrate 2. More specifically, the wavelength conversion section 4 may be in contact with the first region A1 on the second surface 2f2 of the substrate 2.

[0057] The wavelength conversion unit 4 may be in contact with the surface of the reflecting unit 24 in a portion of the second surface 2f2 that is formed by the surface of the reflecting unit 24. In other words, the wavelength conversion unit 4 may be located on the fourth surface 21f4 of the substrate main body 21 via the reflecting unit 24. The wavelength conversion unit 4 may be in contact with the fourth surface 21f4 of the substrate main body 21 in a portion of the second surface 2f2 that is not formed by the surface of the reflecting unit 24.

[0058] The wavelength conversion unit 4 may seal the light emitting element 3 by filling the space above the light emitting element 3. In other words, the wavelength conversion unit 4 may seal the light emitting element 3 located on the second surface 2f2 of the substrate 2 from the region on the opposite side of the substrate 2 across the light emitting element 3. The wavelength conversion unit 4 may be formed, for example, by being applied in a paste state onto the second surface 2f2 of the substrate 2 and then cured.

[0059] As described above, the wavelength conversion unit 4 can emit light having a spectrum different from that of light (excitation light) incident from the light-emitting element 3 onto the wavelength conversion unit 4. The wavelength conversion unit 4 can convert the light incident on the wavelength conversion unit 4 from the light-emitting element 3 into light (also referred to as converted light) having a spectrum with a peak wavelength in the wavelength range of 360 nm or more and 780 nm or less. The wavelength conversion unit 4 can emit this converted light to the outside of the wavelength conversion unit 4. In the present disclosure, the wavelength range of 360 nm or more and 780 nm or less is also referred to as the visible light range (also referred to as the visible light range). The wavelength conversion unit 4 may be excited by the light emitted by the light-emitting element 3 to emit light having a spectrum with a peak wavelength in the visible light range.

[0060] The wavelength conversion unit 4 may include a light-transmitting base material and a plurality of phosphors.

[0061] The substrate may be made of, for example, a resin having light-transmitting properties and insulating properties, or a light-transmitting glass. The resin constituting the substrate may be, for example, a light-transmitting resin such as a fluororesin, a silicone resin, an acrylic resin, or an epoxy resin. The refractive index of the substrate may be, for example, 1.4 or more and 1.6 or less.

[0062] The multiple phosphors may be located in a dispersed state within the substrate. Here, a large number of phosphors may be located in a substantially uniformly dispersed state within the wavelength conversion unit 4. For example, when excitation light emitted from the light-emitting element 3 enters the wavelength conversion unit 4, the phosphors are excited by the excitation light and can emit light (also referred to as fluorescence). The multiple phosphors may convert the incident excitation light into light (fluorescence) having a spectrum with a variety of different peak wavelengths.

[0063] The plurality of phosphors may include, for example, a phosphor (also referred to as a blue phosphor) that converts the excitation light into light (also referred to as blue light or blue fluorescence) having a spectrum with a peak wavelength in the wavelength region from 400 nm to 500 nm. The material of the blue phosphor is, for example, BaMgAl １０ O １７ :Eu, (Sr, Ca, Ba) １０ (P.O. ４ ) ６ Cl １２ : Eu or (Sr, Ba) １０ (P.O. ４ ) ６ Cl ２ :Eu, etc. In the present disclosure, the ratio of multiple elements separated by commas in parentheses may be set arbitrarily as long as it is within the range of the molecular formula.

[0064] The plurality of phosphors may include, for example, a phosphor (also referred to as a blue-green phosphor) that converts the excitation light into light having a spectrum with a peak wavelength in the wavelength region from 450 nm to 550 nm (also referred to as blue-green light or blue-green fluorescence). The material of the blue-green phosphor may be, for example, (Sr, Ba, Ca). ５ (P.O. ４ ) ３ Cl:Eu or Sr ４ Al １４ O ２５ :Eu, etc.

[0065] The plurality of phosphors may include, for example, a phosphor (also referred to as a green phosphor) that converts the excitation light into light (also referred to as green light or green fluorescence) having a spectrum with a peak wavelength in the wavelength region from 500 nm to 600 nm. The material of the green phosphor may be, for example, SrSi ２ (O, Cl) ２ N ２ :Eu, (Sr, Ba, Mg) ２ SiO ４ :Eu ２＋ , ZnS: Cu, Al or Zn ２ SiO ４ : Mn, etc.

[0066] The plurality of phosphors may include, for example, a phosphor (also referred to as a red phosphor) that converts the excitation light into light (also referred to as red light or red fluorescence) having a spectrum with a peak wavelength in the wavelength region from 600 nm to 700 nm. ２ O ２ S: Eu, Y ２ O ３ S: Eu, SrCaClAlSiN ３ :Eu ２＋ , CaAlSiN ３ : Eu or CaAlSi(ON) ３ :Eu, etc.

[0067] The plurality of phosphors may include, for example, a phosphor (also referred to as a near-infrared phosphor) that converts the excitation light into light (also referred to as near-infrared light or near-infrared fluorescence) having a spectrum with a peak wavelength in the wavelength range of 780 nm to 1000 nm. The near-infrared light may include light in the wavelength range of 780 nm to 2500 nm. The material of the near-infrared phosphor may be, for example, 3Ga ５ O １２ : Cr, etc.

[0068] The combination of types of phosphors constituting the multiple phosphors included in the wavelength conversion unit 4 is not particularly limited. The types of phosphors constituting the multiple phosphors in the wavelength conversion unit 4 are not limited to the above-described blue phosphor, blue-green phosphor, green phosphor, red phosphor, and near-infrared phosphor. The multiple phosphors may include various phosphors different from the above-described blue phosphor, blue-green phosphor, green phosphor, red phosphor, and near-infrared phosphor. Furthermore, each of the materials of the blue phosphor, blue-green phosphor, green phosphor, red phosphor, and near-infrared phosphor may include a material different from the materials listed above.

[0069] As described above, the excitation light incident on the wavelength conversion unit 4 from the light-emitting element 3 may be converted into light having a spectrum with various peak wavelengths that differ depending on the phosphors. The peak wavelength in the spectrum of this converted light (converted light) may be included in the visible light range. Depending on the combination of phosphors constituting the multiple phosphors included in the wavelength conversion unit 4, the light converted by the wavelength conversion unit 4 (converted light) may have a spectrum with multiple peak wavelengths. For example, if the multiple phosphors included in the wavelength conversion unit 4 include a blue phosphor, a blue-green phosphor, and a green phosphor, the light converted by the wavelength conversion unit 4 (converted light) has a spectrum with peak wavelengths corresponding to blue light, blue-green light, and green light. If the multiple phosphors included in the wavelength conversion unit 4 contain only one type of phosphor material, the light converted by the wavelength conversion unit 4 (converted light) has a spectrum with a peak wavelength corresponding to this one type of phosphor. The multiple phosphors are not limited to the above example and may include various combinations of materials. The color of the light emitted from the wavelength converting unit 4 can be determined by one or more types of materials contained in the multiple phosphors. In other words, the light (converted light) after conversion by the wavelength converting unit 4 can have various spectra.

[0070] The light emitting device 1 according to the first embodiment can emit light having various spectra by combining materials constituting the multiple phosphors included in the wavelength conversion unit 4. The light emitting device 1 may be capable of emitting light having, for example, the spectrum of direct sunlight from the sun, the spectrum of sunlight that has reached a predetermined depth in the ocean, the spectrum emitted by a candle flame, or the spectrum of light emitted by a firefly. In other words, the light emitting device 1 may be capable of emitting light having any color. Furthermore, the light emitting device 1 may be capable of emitting light having any color temperature.

[0071] The wavelength conversion unit 4 may have a fifth surface 4f5, a sixth surface 4f6, and one or more seventh surfaces (also referred to as side surfaces or conversion unit side surfaces) 4f7. The fifth surface 4f5 may be a surface of the wavelength conversion unit 4 located on the substrate 2 side. The fifth surface 4f5 may be in contact with the first region A1 of the second surface 2f2 of the substrate 2. The sixth surface 4f6 may be a surface of the wavelength conversion unit 4 located on the opposite side from the fifth surface 4f5. In other words, the sixth surface 4f6 may be a surface of the wavelength conversion unit 4 located on the opposite side from the substrate 2. Each of the one or more seventh surfaces 4f7 may connect the fifth surface 4f5 and the sixth surface 4f6. The sixth surface 4f6 and each of the one or more seventh surfaces 4f7 may be exposed to the outside of the light emitting device 1. If this configuration is adopted, it is not necessary to provide a frame or a dam surrounding the wavelength conversion unit 4 from the sides on the substrate 2, which makes it possible to reduce the size of the light emitting device 1. The light emitting device 1 having this structure is also called a chip size package (CSP) type light emitting device.

[0072] When the outer edge of the second surface 2f2 of the substrate 2 is rectangular, the three-dimensional shape of the wavelength conversion unit 4 may be rectangular. This configuration may increase the distance that the excitation light emitted from the light-emitting element 3 travels through the wavelength conversion unit 4. This may increase the rate at which the excitation light is converted into light (converted light) having a spectrum different from that of the excitation light in the wavelength conversion unit 4 (also referred to as the conversion rate). For example, when the light-emitting device 1 is viewed in a planar view in the -Z direction, the outer edge of the wavelength conversion unit 4 may be rectangular. In other words, the fifth surface 4f5 may have a rectangular outer edge, and the sixth surface 4f6 may have a rectangular outer edge. The sixth surface 4f6 may also be a rectangular surface.

[0073] The wavelength converting portion 4 may have a fifth width of, for example, approximately 1 mm or more and approximately 4 mm or less. The fifth width of the wavelength converting portion 4 may be the length of the wavelength converting portion 4 in the −X direction, which is the second direction D2 of the wavelength converting portion 4. The wavelength converting portion 4 may have a sixth width of, for example, approximately 1 mm or more and approximately 4 mm or less. The sixth width of the wavelength converting portion 4 may be the length of the wavelength converting portion 4 in the −Y direction, which is the fourth direction D4 of the wavelength converting portion 4. The fifth width may be simply referred to as the width, and the sixth width may be referred to as the depth. For example, if the outer edge of the sixth surface 4f6 has a rectangular shape, the sixth surface 4f6 may be a rectangular surface having the fifth width and the sixth width.

[0074] If the outer edges of the fifth surface 4f5 and the sixth surface 4f6 are rectangular, the one or more seventh surfaces 4f7 may be four seventh surfaces 4f7. The shape of each of the one or more seventh surfaces 4f7 may be flat or convex toward the outside of the wavelength conversion unit 4. If the seventh surface 4f7 is convex, the distance that the excitation light emitted from the light-emitting element 3 travels through the wavelength conversion unit 4 may be increased. This may increase the proportion of excitation light converted into light (converted light) having a spectrum different from that of the excitation light in the wavelength conversion unit 4.

[0075] In the examples of Figures 1 to 6, the four seventh surfaces 4f7 include a first seventh surface 4f71 facing in the -X direction as the second direction D2, a second seventh surface 4f72 facing in the +X direction as the third direction D3, a third seventh surface 4f73 facing in the -Y direction as the fourth direction D4, and a fourth seventh surface 4f74 facing in the +Y direction as the fifth direction D5.

[0076] When the light emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, the wavelength conversion unit 4 may be located up to the outer periphery of the second surface 2f2 of the substrate 2. If this configuration is adopted, the amount of excitation light emitted from the light emitting element 3, reflected by the second surface 2f2, and then incident on the wavelength conversion unit 4 can be increased. As a result, the proportion of excitation light emitted from the light emitting element 3 that is converted into converted light in the wavelength conversion unit 4 can be increased.

[0077] Here, it is assumed that the light-emitting device 1 is viewed in a planar perspective view in the -Z direction as the first direction D1. In this case, for example, as shown in FIG. 4, the wavelength conversion unit 4 may include a region A3 (also referred to as a third region) that overlaps with the reflector 24, and a region A4 (also referred to as a fourth region) that is located outside the third region A3 and does not overlap with the reflector 24. If this configuration is adopted, the distance that the excitation light emitted from the light-emitting element 3 travels through the wavelength conversion unit 4 after being reflected by the reflector 24 may be increased. This may increase the proportion of excitation light converted into light (converted light) having a spectrum different from that of the excitation light in the wavelength conversion unit 4.

[0078] Here, it is assumed that the light emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1. In this case, the fourth region A4 may have a portion located closer to the −X direction as the second direction D2 than the third region A3, a portion located closer to the +X direction as the third direction D3 than the third region A3, a portion located closer to the −Y direction as the fourth direction D4 than the third region A3, or a portion located closer to the +Y direction as the fifth direction D5 than the third region A3.

[0079] 4, when the light-emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, the fourth region A4 may surround the entire outer periphery of the third region A3. If this configuration is adopted, the distance over which the excitation light emitted from the light-emitting element 3 is reflected by the reflector 24 and passes through the wavelength conversion unit 4 can be increased in the region along the entire lateral circumference of the wavelength conversion unit 4. This can increase the proportion of excitation light converted into light (converted light) having a spectrum different from that of the excitation light in the wavelength conversion unit 4.

[0080] <1-1-4. Electronic Components> The electronic component 5 is located on the second surface 2f2 of the substrate 2. More specifically, the electronic component 5 may be electrically connected to two third electrodes 25. In other words, the electronic component 5 may be mounted on the second surface 2f2 of the substrate 2. The electronic component 5 may be electrically connected to two third electrodes 25 located on the second surface 2f2 side of the substrate 2 via a bonding medium such as brazing material or solder. When the light-emitting device 1 is seen through from above in the −Z direction as the first direction D1, the electronic component 5 may be located on the two third electrodes 25 in a manner covering at least a portion of each of the two third electrodes 25. When the light-emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, the electronic component 5 may cover a portion of each of the two third electrodes 25, may cover the entirety of each of the two third electrodes 25, may cover a portion of the third-A electrode 25a and the entirety of the third-B electrode 25b, or may cover the entirety of the third-A electrode 25a and the entirety of the third-B electrode 25b. In the example of FIG. 4 , the electronic component 5 is positioned in a manner that covers the entirety of each of the two third electrodes 25. When the light-emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, the electronic component 5 may cover at least a portion of the first connection wiring 26a and the second connection wiring 26b. When the light emitting device 1 is viewed in plan view in the -Z direction as the first direction D1, at least a portion of the first connection wiring 26a and the second connection wiring 26b may be covered by the wavelength conversion section 4 without being covered by either the light emitting element 3 or the electronic component 5.

[0081] The electronic component 5 may be, for example, a Schottky diode. The electronic component 5 may be capable of controlling the voltage between the third-A electrode 25a and the third-B electrode 25b. In other words, the electronic component 5 may be capable of controlling the voltage between the fourth-A electrode E4a and the fourth-B electrode E4b.

[0082] <1-2. Shape of the Light-Emitting Device> The substrate 2 includes a first portion 2p1 and a second portion 2p2. The first portion 2p1 is a portion of the substrate 2 located on the first surface 2f1 side in the first direction D1. The second portion 2p2 is a portion of the substrate 2 located on the second surface 2f2 side in the first direction D1. The second portion 2p2 and the first portion 2p1 may each be a portion of the substrate 2 when the substrate 2 is virtually divided into multiple portions in the −Z direction as the first direction D1. In the examples of FIGS. 5 and 6, the imaginary boundary between the first portion 2p1 and the second portion 2p2 on the substrate 2 is indicated by a thin two-dot chain line. Here, the first portion 2p1 may be referred to as the lower portion of the substrate, and the second portion 2p2 may be referred to as the upper portion of the substrate. The first portion 2p1 includes, for example, a portion of the substrate main body 21 located on the third surface 21f3 side. The second portion 2p2 includes, for example, a portion of the substrate main body 21 that is located on the fourth surface 21f4 side. The first portion 2p1 may include two first electrodes 22. The second portion 2p2 may include two second electrodes 23, a reflecting portion 24, or two third electrodes 25.

[0083] The first portion 2p1 may be, for example, a portion of the substrate 2 that includes the first surface 2f1 and occupies a region of a first predetermined percentage of the thickness of the substrate 2 from the first surface 2f1. The first predetermined percentage may be, for example, any percentage within a range of 20% to 90%. The first predetermined percentage may be, for example, 20%, 30%, 50%, 70%, 80%, or 90%. For example, if the first predetermined percentage is 50%, the first portion 2p1 may be a portion of the substrate 2 that is located closer to the first surface 2f1 than the center in the −Z direction as the first direction D1.

[0084] In other words, for example, when the substrate 2 is virtually equally divided into M1 regions (M1 is a natural number greater than or equal to 2) in the first direction D1, the first portion 2p1 may be a portion occupying N1 regions (N1 is a natural number smaller than M1) located on the first surface 2f1 side of the M1 regions. For example, when M1 is 100, N1 may be any number within a range of 20 to 90. N1 may be, for example, 20, 30, 50, 70, 80, or 90. For example, when M1 is 100 and N1 is 50, the first portion 2p1 may be a portion of the substrate 2 located closer to the first surface 2f1 than the center in the −Z direction as the first direction D1.

[0085] The second portion 2p2 may be, for example, a portion of the substrate 2 that includes the second surface 2f2 and occupies a region of a second predetermined percentage of the thickness of the substrate 2 from the second surface 2f2. The second predetermined percentage may be, for example, any percentage within a range of 10% to 80%. The second predetermined percentage may be, for example, 10%, 20%, 30%, 50%, 70%, or 80%. For example, if the second predetermined percentage is 50%, the second portion 2p2 may be a portion of the substrate 2 that is located closer to the second surface 2f2 than the center in the +Z direction, which is the opposite direction to the first direction D1.

[0086] In other words, for example, when the substrate 2 is virtually equally divided into M2 regions (M2 is a natural number greater than or equal to 2) in the first direction D1, the second portion 2p2 may be a portion occupying N2 regions (N2 is a natural number smaller than M2) located on the second surface 2f2 side of the M2 regions. For example, when M2 is 100, N2 may be any number within a range from 10 to 80. N2 may be, for example, 10, 20, 30, 50, 70, or 80. For example, when M2 is 100 and N2 is 50, the second portion 2p2 may be a portion of the substrate 2 located closer to the second surface 2f2 than the center in the +Z direction, which is the opposite direction to the first direction D1.

[0087] In the first embodiment, the second portion 2p2 may be, for example, the remaining portion of the substrate 2 excluding the first portion 2p1. The substrate 2 may include, for example, a step St1 located along the boundary between the first portion 2p1 and the second portion 2p2. Here, if the surface of the first portion 2p1 that constitutes the substrate side surface 2fs is defined as a first surface 2fsa and the surface of the second portion 2p2 that constitutes the substrate side surface 2fs is defined as a second surface 2fsb, the step St1 may be present between the first surface 2fsa and the second surface 2fsb.

[0088] <1-2-1. Protruding Relationship of Each Part> <<Protruding Relationship of Each Part in the Second Direction>> Figure 7 is a front view showing region VII surrounded by a dashed line in the rectangle in Figure 2. As shown in Figure 7, the first portion 2p1 of the substrate 2 may protrude more than the wavelength converting portion 4 in the -X direction as the second direction D2. Furthermore, the wavelength converting portion 4 may protrude more than the second portion 2p2 of the substrate 2 in the -X direction as the second direction D2. In other words, in the -X direction as the second direction D2, the length L1a by which the first portion 2p1 of the substrate 2 protrudes relative to the second portion 2p2 of the substrate 2 (also referred to as the 1A protrusion length) may be greater than the length L1b by which the wavelength converting portion 4 protrudes relative to the second portion 2p2 of the substrate 2 (also referred to as the 1B protrusion length). In the examples of Figures 1 to 7, the first seventh surface 4f71 of the wavelength conversion unit 4 is located closer to the -X direction in the second direction D2 than the second surface 2fsb (also referred to as the first second surface 2fsb1), which constitutes part of the first substrate side surface 2fs1 of the second portion 2p2, and the first surface 2fsa (also referred to as the first first surface 2fsa1), which constitutes part of the first substrate side surface 2fs1 of the first portion 2p1, is located closer to the -X direction in the second direction D2 than the first seventh surface 4f71.

[0089] Here, the first portion 2p1 protrudes further than the wavelength conversion unit 4 in the −X direction as the second direction D2. Therefore, for example, when the light emitting device 1 is held and lifted by a robot hand or a tool in the −X direction as the second direction D2 and the +X direction as the third direction D3, the substrate 2 is held in a pinched position, thereby reducing the external force applied to the wavelength conversion unit 4. This reduces deformation of the wavelength conversion unit 4 and peeling of the wavelength conversion unit 4 from the substrate 2 due to the application of an external force to the wavelength conversion unit 4. Therefore, damage to the light emitting device 1 due to external forces can be reduced.

[0090] Furthermore, for example, the first width of the substrate 2 may be relatively large in the −X direction as the second direction D2 compared to the fifth width of the wavelength conversion unit 4, thereby increasing the volume of the substrate 2 relative to the volume of the wavelength conversion unit 4. This may increase the rate at which heat generated when the light-emitting element 3 emits light moves to the substrate 2. As a result, for example, when the light-emitting device 1 is mounted in an illumination device, the rate at which heat is dissipated from the light-emitting device 1 via the two first electrodes 22 may increase. Therefore, the cooling rate due to heat dissipation in the light-emitting device 1 may increase. Furthermore, for example, the areas of the first surface 2f1 of the substrate 2 and the third surface 21f3 of the substrate main body 21 may be increased, thereby facilitating the arrangement of the two first electrodes 22.

[0091] Here, the relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the −X direction as the second direction D2 is also referred to as a “first protruding relationship.” This first protruding relationship may be, for example, a relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the −X direction as the second direction D2 when the light emitting device 1 is viewed in a plan view in the +Y direction as the fifth direction D5. In the examples of FIGS. 1 to 7 , the first protruding relationship may be a relative positional relationship in the −X direction as the second direction D2 between a first first surface 2fsa1 constituting a part of the first substrate side surface 2fs1 of the first portion 2p1, a first second surface 2fsb1 constituting a part of the first substrate side surface 2fs1 of the second portion 2p2, and the first seventh surface 4f71.

[0092] The first protrusion relationship in the light-emitting device 1 may be recognized, for example, by using an image (also referred to as a first image) obtained by photographing the light-emitting device 1 while observing it with an optical microscope in the +Y direction as the fifth direction D5. Here, for example, the first protrusion relationship may be recognized by performing the following [Process 1a] and [Process 1b] in this order.

[0093] [Process 1a] In the first image, a virtual line segment (also referred to as a first virtual line) along the outer edge of the first portion 2p1 located at the end of the -X direction as the second direction D2, a virtual line segment (also referred to as a second virtual line) along the outer edge of the second portion 2p2 located at the end of the -X direction as the second direction D2, and a virtual line segment (also referred to as a third virtual line) along the outer edge of the wavelength conversion unit 4 located at the end of the -X direction as the second direction D2 are set. The first virtual line, the second virtual line, and the third virtual line may be set parallel to each other, for example. Here, for example, if a minute protrusion (also referred to as a burr) generated during the formation of the seventh surface 4f7 of the wavelength conversion unit 4 is present on the seventh surface 4f7, the burr may be ignored and the third virtual line may be set. Furthermore, for example, if there is a tiny protrusion (burr) on the substrate side surface 2fs that was generated during the formation of the substrate side surface 2fs, the first virtual line and the second virtual line may be set with the burr ignored.

[0094] [Process 1b] The first protrusion relationship is recognized from the positional relationship between the first virtual line, the second virtual line, and the third virtual line in the −X direction as the second direction D2. Here, the distance between the first virtual line and the second virtual line in the −X direction as the second direction D2 may be the first-A protrusion length L1a, and the distance between the second virtual line and the third virtual line in the −X direction as the second direction D2 may be the first-B protrusion length L1b.

[0095] Here, the length L1c (also called the first protrusion difference) obtained by subtracting the 1B protrusion length L1b from the 1A protrusion length L1a may be, for example, approximately 5 μm to 30 μm, approximately 5 μm to 50 μm, or approximately 5 μm to 100 μm.

[0096] 7, for example, a step St1 may exist between a first surface 2fsa constituting the substrate side surface 2fs located at the end of the first portion 2p1 in the −X direction as the second direction D2, and a second surface 2fsb constituting the substrate side surface 2fs located at the end of the second portion 2p2 in the −X direction as the second direction D2. In the example of FIGS. 1 to 7, a step St1 (also referred to as a first step St11) exists between a first first surface 2fsa1 constituting the first substrate side surface 2fs1 of the first portion 2p1 and a first second surface 2fsb1 constituting the first substrate side surface 2fs1 of the second portion 2p2.

[0097] <<Protrusion Relationship of Each Portion in the Third Direction>> Figure 8 is a front view showing a region VIII surrounded by a rectangular dashed line in Figure 2. In the first embodiment, for example, as shown in Figure 8, the wavelength conversion portion 4 may further protrude beyond the second portion 2p2 of the substrate 2, and the first portion 2p1 of the substrate 2 may further protrude beyond the wavelength conversion portion 4 in the +X direction as the third direction D3. In other words, in the +X direction as the third direction D3, the length L2a by which the first portion 2p1 of the substrate 2 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as the secondA protrusion length) may be greater than the length L2b by which the wavelength conversion portion 4 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as the secondB protrusion length). In the examples of Figures 1 to 8, the second seventh surface 4f72 of the wavelength conversion unit 4 is located closer to the +X direction in the third direction D3 than the second surface 2fsb (also referred to as the second second surface 2fsb2), which constitutes part of the second substrate side surface 2fs2 of the second portion 2p2, and the first surface 2fsa (also referred to as the second first surface 2fsa2), which constitutes part of the second substrate side surface 2fs2 of the first portion 2p1, is located closer to the +X direction in the third direction D3 than the second seventh surface 4f72.

[0098] Here, the first portion 2p1 protrudes further than the wavelength conversion unit 4 in both the −X direction as the second direction and the +X direction as the third direction D3. Therefore, for example, when the light emitting device 1 is held and lifted by a robot hand or a tool in the −X direction as the second direction D2 and the +X direction as the third direction D3, the substrate 2 is held in a pinched position, thereby further reducing the external force applied to the wavelength conversion unit 4. This can further reduce deformation of the wavelength conversion unit 4 and peeling of the wavelength conversion unit 4 from the substrate 2 due to the application of an external force to the wavelength conversion unit 4. Therefore, damage to the light emitting device 1 due to external forces can be further reduced.

[0099] Furthermore, for example, the first width of the substrate 2 may be relatively large with respect to the fifth width of the wavelength conversion unit 4 in each of the −X direction as the second direction D2 and the +X direction as the third direction D3, thereby increasing the volume of the substrate 2 relative to the volume of the wavelength conversion unit 4. This may increase the rate at which heat generated when the light-emitting element 3 emits light moves to the substrate 2. As a result, for example, when the light-emitting device 1 is mounted in an illumination device, the rate at which heat is dissipated from the light-emitting device 1 via the two first electrodes 22 may increase. Therefore, the cooling rate due to heat dissipation in the light-emitting device 1 may increase. Furthermore, for example, the areas of the first surface 2f1 of the substrate 2 and the third surface 21f3 of the substrate main body 21 may be increased, thereby facilitating the arrangement of the two first electrodes 22.

[0100] Here, the relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the +X direction as the third direction D3 is also referred to as a "second protruding relationship." This second protruding relationship may be, for example, a relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the +X direction as the third direction D3 when the light emitting device 1 is viewed in a plan view in the +Y direction as the fifth direction D5. In the examples of FIGS. 1 to 8 , the second protruding relationship may be a relative positional relationship in the +X direction as the third direction D3 between the second first surface 2fsa2 constituting a part of the second substrate side surface 2fs2 of the first portion 2p1, the second second surface 2fsb2 constituting a part of the second substrate side surface 2fs2 of the second portion 2p2, and the second seventh surface 4f72.

[0101] The second protrusion relationship in the light-emitting device 1 may be recognized, for example, in the same way as the first protrusion relationship, by using an image (also referred to as a second image) obtained by photographing the light-emitting device 1 while observing it with an optical microscope in the +Y direction as the fifth direction D5. Here, for example, the second protrusion relationship may be recognized by performing the following [Process 2a] and [Process 2b] in the order described.

[0102] [Process 2a] In the second image, a virtual line segment (also referred to as a fourth virtual line) along the outer edge of the first portion 2p1 located at the end of the +X direction as the third direction D3, a virtual line segment (also referred to as a fifth virtual line) along the outer edge of the second portion 2p2 located at the end of the +X direction as the third direction D3, and a virtual line segment (also referred to as a sixth virtual line) along the outer edge of the wavelength conversion unit 4 located at the end of the +X direction as the third direction D3 are set. The fourth virtual line, the fifth virtual line, and the sixth virtual line may be set parallel to each other, for example. Here, for example, if a minute protrusion (burr) that occurred during the formation of the seventh surface 4f7 of the wavelength conversion unit 4 is present on the seventh surface 4f7, this burr may be ignored when setting the sixth virtual line. Furthermore, for example, if a minute protrusion (burr) that occurred during the formation of the substrate side surface 2fs is present on the substrate side surface 2fs, this burr may be ignored when setting the fourth virtual line and the fifth virtual line.

[0103] [Process 2b] The second protrusion relationship is recognized from the positional relationship between the fourth virtual line, the fifth virtual line, and the sixth virtual line in the +X direction as the third direction D3. Here, the distance between the fourth virtual line and the fifth virtual line in the +X direction as the third direction D3 may be the second-A protrusion length L2a, and the distance between the fifth virtual line and the sixth virtual line in the +X direction as the third direction D3 may be the second-B protrusion length L2b.

[0104] Here, the length L2c (also called the second protrusion difference) obtained by subtracting the second B protrusion length L2b from the second A protrusion length L2a may be, for example, approximately 5 μm to 30 μm, approximately 5 μm to 50 μm, or approximately 5 μm to 100 μm.

[0105] 8, for example, a step St1 may exist between a first surface 2fsa constituting the substrate side surface 2fs located at the end of the first portion 2p1 in the +X direction as the third direction D3, and a second surface 2fsb constituting the substrate side surface 2fs located at the end of the second portion 2p2 in the +X direction as the third direction D3. In the examples of FIGS. 1 to 8, a step St1 (also referred to as a second step St12) exists between a second first surface 2fsa2 constituting the second substrate side surface 2fs2 of the first portion 2p1 and a second second surface 2fsb2 constituting the second substrate side surface 2fs2 of the second portion 2p2.

[0106] <<Protrusion Relationship of Each Part in the Fourth Direction>> Figure 9 is a side view showing a region IX surrounded by a dashed line in the rectangle in Figure 3. In the first embodiment, for example, as shown in Figure 9, the wavelength conversion portion 4 may further protrude beyond the second portion 2p2 of the substrate 2, and the first portion 2p1 of the substrate 2 may further protrude beyond the wavelength conversion portion 4, in the -Y direction as the fourth direction D4. In other words, in the -Y direction as the fourth direction D4, the length L3a by which the first portion 2p1 of the substrate 2 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as the 3A protrusion length) may be greater than the length L3b by which the wavelength conversion portion 4 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as the 3B protrusion length). In the examples of Figures 1 to 9, the third seventh surface 4f73 of the wavelength conversion portion 4 is located closer to the -Y direction in the fourth direction D4 than the second surface 2fsb (also referred to as the third second surface 2fsb3), which constitutes part of the third substrate side surface 2fs3 of the second portion 2p2, and the first surface 2fsa (also referred to as the third first surface 2fsa3), which constitutes part of the third substrate side surface 2fs3 of the first portion 2p1, is located closer to the -Y direction in the fourth direction D4 than the third seventh surface 4f73.

[0107] Here, the first portion 2p1 protrudes further than the wavelength conversion unit 4 in each of the -X direction as the second direction, the +X direction as the third direction D3, and the -Y direction as the fourth direction D4. Therefore, for example, when the light-emitting device 1 is clamped and lifted by a robot hand or tool from the -X direction as the second direction D2 and the +X direction as the third direction D3, or when the light-emitting device 1 is clamped and lifted by a robot hand or tool from the -Y direction as the fourth direction D4 and the +Y direction as the fifth direction D5, the substrate 2 is clamped, thereby further reducing the external force applied to the wavelength conversion unit 4. This can further reduce deformation of the wavelength conversion unit 4 and peeling of the wavelength conversion unit 4 from the substrate 2 due to the application of an external force to the wavelength conversion unit 4. Therefore, damage to the light-emitting device 1 due to external forces can be further reduced.

[0108] Furthermore, for example, the first width of the substrate 2 is relatively larger than the fifth width of the wavelength conversion section 4 in each of the −X direction (second direction D2) and the +X direction (third direction D3), and the second width of the substrate 2 is relatively larger than the sixth width of the wavelength conversion section 4 in the −Y direction (fourth direction D4). Therefore, the volume of the substrate 2 can be relatively larger than the volume of the wavelength conversion section 4. This can increase the rate at which heat generated when the light-emitting element 3 emits light moves to the substrate 2. As a result, for example, when the light-emitting device 1 is mounted in an illumination device, the rate of heat dissipation from the light-emitting device 1 via the two first electrodes 22 can be increased. Therefore, the cooling rate due to heat dissipation in the light-emitting device 1 can be increased. Furthermore, for example, the areas of the first surface 2f1 of the substrate 2 and the third surface 21f3 of the substrate main body 21 can be increased, which can facilitate the arrangement of the two first electrodes 22.

[0109] Here, the relationship in which the first portion 2p1, the second portion 2p2, and the wavelength conversion portion 4 relatively protrude in the −Y direction as the fourth direction D4 is also referred to as a “third protrusion relationship.” This third protrusion relationship may be, for example, a relationship in which the first portion 2p1, the second portion 2p2, and the wavelength conversion portion 4 relatively protrude in the −Y direction as the fourth direction D4 when the light emitting device 1 is viewed in a plan view in the +X direction as the third direction D3. In the examples of FIGS. 1 to 9 , the third protrusion relationship may be a relative positional relationship in the −Y direction as the fourth direction D4 between a third first surface 2fsa3 constituting a part of the third substrate side surface 2fs3 of the first portion 2p1, a third second surface 2fsb3 constituting a part of the third substrate side surface 2fs3 of the second portion 2p2, and the third seventh surface 4f73.

[0110] The third protrusion relationship in the light-emitting device 1 may be recognized, for example, by using an image (also referred to as a third image) obtained by photographing the light-emitting device 1 while observing it with an optical microscope in the +X direction as the third direction D3. Here, for example, the third protrusion relationship may be recognized by performing the following [Process 3a] and [Process 3b] in this order.

[0111] [Process 3a] In the third image, a virtual line segment (also referred to as a seventh virtual line) along the outer edge of the first portion 2p1 located at the end of the -Y direction as the fourth direction D4, a virtual line segment (also referred to as an eighth virtual line) along the outer edge of the second portion 2p2 located at the end of the -Y direction as the fourth direction D4, and a virtual line segment (also referred to as a ninth virtual line) along the outer edge of the wavelength conversion unit 4 located at the end of the -Y direction as the fourth direction D4 are set. The seventh virtual line, the eighth virtual line, and the ninth virtual line may be set parallel to each other, for example. Here, for example, if a minute protrusion (burr) that occurred during the formation of the seventh surface 4f7 of the wavelength conversion unit 4 is present on the seventh surface 4f7, this burr may be ignored when setting the ninth virtual line. Furthermore, for example, if a minute protrusion (burr) that occurred during the formation of the substrate side surface 2fs is present on the substrate side surface 2fs, this burr may be ignored when setting the seventh virtual line and the eighth virtual line.

[0112] [Process 3b] The third protrusion relationship is recognized from the positional relationship between the seventh virtual line, the eighth virtual line, and the ninth virtual line in the −Y direction as the fourth direction D4. Here, the distance between the seventh virtual line and the eighth virtual line in the −Y direction as the fourth direction D4 may be the third-A protrusion length L3a, and the distance between the eighth virtual line and the ninth virtual line in the −Y direction as the fourth direction D4 may be the third-B protrusion length L3b.

[0113] Here, the length L3c (also called the third protrusion difference) obtained by subtracting the third B protrusion length L3b from the third A protrusion length L3a may be, for example, approximately 5 μm to 30 μm, approximately 5 μm to 50 μm, or approximately 5 μm to 100 μm.

[0114] 9, for example, a step St1 may exist between a first surface 2fsa constituting the substrate side surface 2fs located at the end of the first portion 2p1 in the −Y direction as the fourth direction D4, and a second surface 2fsb constituting the substrate side surface 2fs located at the end of the second portion 2p2 in the −Y direction as the fourth direction D4. In the example of FIGS. 1 to 9, a step St1 (also referred to as a third step St13) exists between a third first surface 2fsa3 constituting the third substrate side surface 2fs3 of the first portion 2p1 and a third second surface 2fsb3 constituting the third substrate side surface 2fs3 of the second portion 2p2.

[0115] <<Protrusion Relationship of Each Part in Fifth Direction>> Figure 10 is a side view showing a region X surrounded by a dashed line in the rectangle in Figure 3. In the first embodiment, for example, as shown in Figure 10, the wavelength conversion portion 4 may further protrude beyond the second portion 2p2 of the substrate 2, and the first portion 2p1 of the substrate 2 may further protrude beyond the wavelength conversion portion 4 in the +Y direction as the fifth direction D5. In other words, in the +Y direction as the fifth direction D5, the length L4a by which the first portion 2p1 of the substrate 2 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as a 4A protrusion length) may be greater than the length L4b by which the wavelength conversion portion 4 protrudes beyond the second portion 2p2 of the substrate 2 (also referred to as a 4B protrusion length). 9 and 10 , in each of the −Y direction as the fourth direction D4 and the +Y direction as the fifth direction D5, the wavelength conversion portion 4 may protrude more than the second portion 2p2 of the substrate 2, and the first portion 2p1 of the substrate 2 may protrude more than the wavelength conversion portion 4. In the example of FIGS. 1 to 10 , the fourth seventh surface 4f74 of the wavelength conversion portion 4 is located closer to the +Y direction as the fifth direction D5 than the second surface 2fsb (also referred to as the fourth second surface 2fsb4) that constitutes part of the fourth substrate side surface 2fs4 of the second portion 2p2, and the first surface 2fsa (also referred to as the fourth first surface 2fsa4) that constitutes part of the fourth substrate side surface 2fs4 of the first portion 2p1 is located closer to the +Y direction as the fifth direction D5 than the fourth seventh surface 4f74.

[0116] Here, the first portion 2p1 protrudes further than the wavelength conversion unit 4 in each of the -X direction as the second direction, the +X direction as the third direction D3, the -Y direction as the fourth direction D4, and the +Y direction as the fifth direction. Therefore, for example, when the light-emitting device 1 is clamped and lifted by a robot hand or tool from the -X direction as the second direction D2 and the +X direction as the third direction D3, or when the light-emitting device 1 is clamped and lifted by a robot hand or tool from the -Y direction as the fourth direction D4 and the +Y direction as the fifth direction D5, the external force applied to the wavelength conversion unit 4 can be further reduced by clamping the substrate 2. This can facilitate handling of the light-emitting device 1. Therefore, damage to the light-emitting device 1 due to external forces can be more reliably reduced.

[0117] Furthermore, for example, the first width of the substrate 2 is relatively larger than the fifth width of the wavelength conversion section 4 in each of the −X direction (second direction D2) and the +X direction (third direction D3), and the second width of the substrate 2 is relatively larger than the sixth width of the wavelength conversion section 4 in each of the −Y direction (fourth direction D4) and the +Y direction (fifth direction D5). Therefore, the volume of the substrate 2 can be relatively larger than the volume of the wavelength conversion section 4. This can increase the rate at which heat generated when the light-emitting element 3 emits light moves to the substrate 2. As a result, for example, when the light-emitting device 1 is mounted in an illumination device, the rate of heat dissipation from the light-emitting device 1 via the two first electrodes 22 can be increased. Therefore, the cooling rate due to heat dissipation in the light-emitting device 1 can be increased. Furthermore, for example, the areas of the first surface 2f1 of the substrate 2 and the third surface 21f3 of the substrate main body 21 can be increased, making it easier to arrange the two first electrodes 22.

[0118] Here, the relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the +Y direction as the fifth direction D5 is also referred to as a "fourth protruding relationship." This fourth protruding relationship may be, for example, a relationship in which the first portion 2p1, the second portion 2p2, and the wavelength converting portion 4 relatively protrude in the +Y direction as the fifth direction D5 when the light emitting device 1 is viewed in a plan view in the +X direction as the third direction D3. In the examples of FIGS. 1 to 10 , the fourth protruding relationship may be a relative positional relationship in the +Y direction as the fifth direction D5 between a fourth first surface 2fsa4 constituting a part of the fourth substrate side surface 2fs4 of the first portion 2p1, a fourth second surface 2fsb4 constituting a part of the fourth substrate side surface 2fs4 of the second portion 2p2, and the fourth seventh surface 4f74.

[0119] The fourth protrusion relationship in the light-emitting device 1 may be recognized, for example, in the same manner as the third protrusion relationship, by using an image (also referred to as a fourth image) obtained by photographing the light-emitting device 1 while observing it with an optical microscope in the +X direction as the third direction D3. Here, for example, the fourth protrusion relationship may be recognized by performing the following [Process 4a] and [Process 4b] in this order.

[0120] [Process 4a] In the fourth image, a virtual line segment (also referred to as a tenth virtual line) is set along the outer edge of the first portion 2p1 located at the end of the +Y direction as the fifth direction D5, a virtual line segment (also referred to as an eleventh virtual line) is set along the outer edge of the second portion 2p2 located at the end of the +Y direction as the fifth direction D5, and a virtual line segment (also referred to as a twelfth virtual line) is set along the outer edge of the wavelength conversion unit 4 located at the end of the -Y direction as the fifth direction D5. The tenth virtual line, the eleventh virtual line, and the twelfth virtual line may be set parallel to each other, for example. Here, for example, if a minute protrusion (burr) that occurred during the formation of the seventh surface 4f7 of the wavelength conversion unit 4 is present on the seventh surface 4f7, the burr may be ignored and the twelfth virtual line may be set. Furthermore, for example, if there is a tiny protrusion (burr) on the substrate side surface 2fs that occurred during the formation of the substrate side surface 2fs, this burr may be ignored when setting the tenth and eleventh virtual lines.

[0121] [Process 4b] The fourth protrusion relationship is recognized from the positional relationship between the tenth virtual line, the eleventh virtual line, and the twelfth virtual line in the +Y direction as the fifth direction D5. Here, the distance between the tenth virtual line and the eleventh virtual line in the +Y direction as the fifth direction D5 may be the fourth-A protrusion length L4a, and the distance between the eleventh virtual line and the twelfth virtual line in the +Y direction as the fifth direction D5 may be the fourth-B protrusion length L4b.

[0122] Here, the length L4c (also called the fourth protrusion difference) obtained by subtracting the fourth B protrusion length L4b from the fourth A protrusion length L4a may be, for example, approximately 5 μm to 30 μm, approximately 5 μm to 50 μm, or approximately 5 μm to 100 μm.

[0123] 10, for example, a step St1 may be present between a first surface 2fsa constituting the substrate side surface 2fs located at the end of the first portion 2p1 in the +Y direction as the fifth direction D5, and a second surface 2fsb constituting the substrate side surface 2fs located at the end of the second portion 2p2 in the +Y direction as the fifth direction D5. In the example of FIGS. 1 to 10, a step St1 (also referred to as a fourth step St14) may be present between a fourth first surface 2fsa4 constituting the fourth substrate side surface 2fs4 of the first portion 2p1 and a fourth second surface 2fsb4 constituting the fourth substrate side surface 2fs4 of the second portion 2p2.

[0124] <1-2-2. Method for realizing the protruding relationship of each part> Each of the first protruding relationship, the second protruding relationship, the third protruding relationship, and the fourth protruding relationship in the light-emitting device 1 described above can be realized by one or more types of processing among a plurality of types of processing such as cutting, grinding, and polishing.

[0125] Here, for example, a case is assumed in which a layer (also referred to as a light-emitting device layer) including a plurality of portions corresponding to a plurality of light-emitting devices 1 is formed on an adhesive tape such as ultraviolet (UV) tape, and this light-emitting device layer is divided into a plurality of individual pieces by dicing to manufacture a plurality of light-emitting devices 1. The light-emitting device layer may have a configuration in which, for example, a layer (also referred to as a first layer) including a plurality of portions corresponding to a plurality of substrates 2 and a layer (also referred to as a second layer) including a plurality of portions corresponding to a plurality of wavelength conversion units 4 are stacked in this order on an adhesive tape. For example, a plurality of light-emitting devices 1 may be manufactured by cutting the light-emitting device layer into a lattice pattern by dicing.

[0126] <<Method using dicing and processing>> For example, the plurality of individual pieces obtained by dicing the light-emitting device layer may be subjected to one or more types of processing, such as cutting, grinding, and polishing, to thereby realize each of the first protrusion relationship, the second protrusion relationship, the third protrusion relationship, and the fourth protrusion relationship in the light-emitting device 1.

[0127] For example, when dicing the light-emitting device layer, a disk-shaped blade (also referred to as a blade) is used to cut the second layer and the first layer from above. This results in a plurality of individual pieces separated from the light-emitting device layer. Each of the individual pieces is then subjected to one or more processes, such as cutting, grinding, and polishing, to achieve the first, second, third, and fourth protruding relationships of the light-emitting device 1. Here, the shape of one or more seventh faces 4f7 of the wavelength converting portion 4 or the shape of one or more substrate side faces 2fs of the substrate 2 may be controlled by one or more processes performed on each of the individual pieces.

[0128] <<Method Using Two-Stage Dicing>> For example, the first protruding relationship, the second protruding relationship, the third protruding relationship, and the fourth protruding relationship in the light emitting device 1 may each be achieved by employing two-stage dicing.

[0129] Here, as the two-stage dicing, for example, dicing in which the following step d1 and step d2 are performed in this order can be adopted.

[0130] [Step d1] A first stage of dicing is performed in which a disk-shaped blade (also referred to as a first blade) having a first thickness is used to cut the second layer from above and cut partway through the first layer (also referred to as the top of the first layer).

[0131] [Step d2] A second stage of dicing is performed in which the first layer (also referred to as the lower part of the first layer) is cut from above along the cut portion of step d1 using a disk-shaped blade (also referred to as the second blade) having a second thickness smaller than the first thickness. Here, the second blade passes inside the groove-shaped portion cut out by dicing in the upper part of the first layer.

[0132] Here, in step d1, for example, the following mechanism (also referred to as the first mechanism) may be used to realize a configuration in which the wavelength conversion unit 4 protrudes beyond the second portion 2p2 of the substrate 2 in a direction perpendicular to the surface (also referred to as the cut surface) generated by dicing the first and second layers. If the elastic modulus of the second layer is smaller than that of the first layer, the portion of the second layer in contact with the rotating first blade may be pulled in the rotational direction of the first blade. Therefore, at a location along the cut surface generated by cutting with the first blade in the second layer, the portion that was pulled in the rotational direction of the first blade returns to its original shape due to elastic force after the first blade passes. On the other hand, since the elastic modulus of the first layer is larger than that of the second layer, the portion of the first layer in contact with the rotating second blade is less likely to be pulled in the rotational direction of the first blade. As a result, the width of the portion cut by dicing in the second layer may be narrower than the width of the groove-shaped portion cut by dicing in the upper part of the first layer. This makes it possible to realize a configuration in which the wavelength conversion section 4 protrudes further than the second portion 2p2 of the substrate 2 in a direction perpendicular to the surface (cut surface) created by dicing the second layer and the upper portion of the first layer.

[0133] Furthermore, in step d1, for example, the following other mechanism (also referred to as the second mechanism) may be used to realize a configuration corresponding to a form in which the wavelength conversion unit 4 protrudes beyond the second portion 2p2 of the substrate 2 in a direction perpendicular to the surface (cut surface) of the first and second layers generated by dicing. If the elastic modulus of the second layer is smaller than that of the first layer, the portion of the second layer in contact with the first blade may be compressed in the normal direction to the side surface of the first blade by the pressure of the side surface of the first blade. Therefore, at a location of the second layer along the cut surface generated by cutting with the first blade, after the first blade passes, the portion compressed by the pressure of the side surface of the first blade returns to its original shape by elastic force. On the other hand, since the elastic modulus of the first layer is larger than that of the second layer, the portion of the first layer in contact with the second blade is less likely to be compressed in the normal direction to the side surface of the first blade by the pressure of the side surface of the first blade. As a result, the width of the portion cut by dicing in the second layer may be narrower than the width of the groove-shaped portion cut by dicing in the upper part of the first layer, thereby realizing a configuration corresponding to a form in which the wavelength converting unit 4 protrudes beyond the second portion 2p2 of the substrate 2 in a direction perpendicular to a surface (cut surface) generated by cutting by dicing in the second layer and the upper part of the first layer.

[0134] Furthermore, in step d2, the width of the portion cut by dicing in the lower part of the first layer may be narrower than the width of the groove-shaped portion cut by dicing in the upper part of the first layer. This may result in a configuration in which the first portion 2p1 of the substrate 2 protrudes more than the second portion 2p2 of the substrate 2 in a direction perpendicular to the surface (cut surface) of the first and second layers created by dicing. Here, for example, by adjusting the relationship between the first thickness and the second thickness and the relationship between the elastic modulus of the first layer and the elastic modulus of the second layer, a configuration in which the first portion 2p1 of the substrate 2 protrudes more than the wavelength conversion unit 4 in a direction perpendicular to the surface (cut surface) of the first and second layers created by dicing may be realized. For example, a possible embodiment is one in which the first thickness is 0.25 mm and the second thickness is 0.2 mm.

[0135] Dicing conditions other than the relationship between the first thickness and the second thickness may be adjusted. These dicing conditions may include, for example, the rotational speed of the first blade and the second blade, the speed at which the first blade and the second blade penetrate the second layer and the first layer, and the shape of the first blade and the second blade (also referred to as blade shape). For example, the rotational speed of the first blade may be faster than the rotational speed of the second blade. Alternatively, the rotational speed of the first blade may be slower than the rotational speed of the second blade. Alternatively, the speed at which the first blade penetrates the second layer and the first layer (also referred to as first penetration speed) may be higher than the speed at which the second blade penetrates the second layer and the first layer (also referred to as second penetration speed). Alternatively, the first penetration speed may be lower than the second penetration speed. Regarding the blade shape, for example, the first blade may differ from the second blade in at least one of the diameter, thickness, surface roughness, and side shape of the blade. Specifically, the first blade may be larger or smaller than the second blade in at least one of the blade diameter, thickness, surface roughness, and side surface shape. For example, when the light-emitting device layer is cut into a lattice pattern by dicing, the dicing conditions may include a condition specifying whether the cut along the X-axis direction or the cut along the Y-axis direction is performed first. Depending on the dicing conditions, for example, the shape of one or more seventh surfaces 4f7 of the wavelength conversion unit 4 may be controlled, or the shape of one or more substrate side surfaces 2fs of the substrate 2 may be controlled. The shape of the seventh surface 4f7 and the shape of the substrate side surfaces 2fs may be further controlled by one or more processes selected from a plurality of processes, such as cutting, grinding, and polishing.

[0136] <1-3. Summary of the First Embodiment> In the light-emitting device 1 according to the first embodiment, the first portion 2p1 of the substrate 2 protrudes further than the wavelength conversion unit 4 in the −X direction, which is the second direction D2. Therefore, when the light-emitting device 1 is held and lifted by a robot hand or a tool in the −X direction, which is the second direction D2, and in the +X direction, which is the third direction D3, the substrate 2 is held in a pinched position, which can reduce the external force applied to the wavelength conversion unit 4. This can reduce deformation of the wavelength conversion unit 4 and peeling of the wavelength conversion unit 4 from the substrate 2 due to the application of an external force to the wavelength conversion unit 4. Therefore, damage to the light-emitting device 1 caused by external forces can be reduced.

[0137] 2. Other Embodiments The present disclosure is not limited to the first embodiment described above, and various modifications and improvements can be made without departing from the gist of the present disclosure.

[0138] 2-1. Second Embodiment In the first embodiment described above, for example, as shown in FIGS. 11 to 16, the substrate 2 may include a third portion 2p3 located between the first portion 2p1 and the second portion 2p2 in the −Z direction (first direction D1). Here, the substrate 2 may have, for example, a side surface (also referred to as an inclined side surface) Ts1 in the third portion 2p3 that is inclined with respect to the −Z direction (first direction D1) from the first portion 2p1 to the second portion 2p2. This configuration may result in a configuration in which the length (also referred to as the width) of the substrate 2 in a direction perpendicular to the thickness direction (also referred to as the width direction) of the substrate 2 continuously changes in a direction (also referred to as the thickness direction) along the −Z direction (first direction D1) of the substrate 2. Therefore, when the substrate 2 is clamped in the width direction of the substrate 2, stress concentration in the substrate 2 can be alleviated. This may reduce damage to the light-emitting device 1 due to external forces.

[0139] Fig. 11 is a front view showing the appearance of an example of the light emitting device 1 according to the second embodiment. Fig. 12 is a side view showing the appearance of an example of the light emitting device 1 according to the second embodiment. Fig. 13 is a front view showing an area XIII surrounded by a dashed line in a rectangle in Fig. 11. Fig. 14 is a front view showing an area XIV surrounded by a dashed line in a rectangle in Fig. 11. Fig. 15 is a side view showing an area XV surrounded by a dashed line in a rectangle in Fig. 12. Fig. 16 is a side view showing an area XVI surrounded by a dashed line in a rectangle in Fig. 12.

[0140] The second portion 2p2, the third portion 2p3, and the first portion 2p1 may each represent a portion of the substrate 2 when the substrate 2 is virtually divided into multiple portions in the −Z direction as the first direction D1. Here, the third portion 2p3 may be referred to as a central portion of the substrate. The third portion 2p3 may include a portion of the substrate main body 21 that is located between the first portion 2p1 and the second portion 2p2. The third portion 2p3 may be, for example, the remaining portion of the substrate 2 excluding the first portion 2p1 and the second portion 2p2.

[0141] In the second embodiment, for example, in the substrate side surface 2fs, the surface of the third portion 2p3 that constitutes part of the substrate side surface 2fs may be an inclined side surface Ts1 that is inclined with respect to each of the first surface 2fsa that constitutes part of the substrate side surface 2fs of the first portion 2p1 and the second surface 2fsb that constitutes the substrate side surface 2fs of the second portion 2p2. In other words, for example, in the substrate side surface 2fs, the third portion 2p3 may have an inclined side surface Ts1 that is located between the first surface 2fsa and the second surface 2fsb. Each of the first surface 2fsa and the second surface 2fsb may be a surface that extends along the −Z direction as the first direction D1. Here, the portion of the substrate 2 that has the surface that constitutes the inclined side surface Ts1 may be the third portion 2p3.

[0142] In the second embodiment, for example, as shown in Figures 11 and 13, the outer edge of the third portion 2p3 located at the end in the -X direction (the second direction D2) may have a shape that progresses in the -X direction (the second direction D2) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, an inclined side surface Ts1 (also referred to as a first inclined side surface Ts11) that is a surface that constitutes a part of the first substrate side surface 2fs1 of the third portion 2p3 may be present between a first surface 2fsa (first first surface 2fsa1) that constitutes a part of the first substrate side surface 2fs1 of the first portion 2p1 and a second surface 2fsb (first second surface 2fsb1) that constitutes a part of the first substrate side surface 2fs1 of the second portion 2p2. In other words, for example, the first substrate side surface 2fs1 may have a first first surface 2fsa1, a first inclined side surface Ts11, and a first second surface 2fsb1. In the first substrate side surface 2fs1, for example, the first inclined side surface Ts11 may be connected to the first first surface 2fsa1 in the first portion 2p1 and may also be connected to the first second surface 2fsb1 in the second portion 2p2.

[0143] In the second embodiment, for example, as shown in Figures 11 and 14, the outer edge of the third portion 2p3 located at the end in the +X direction (the third direction D3) may have a shape that progresses in the +X direction (the third direction D3) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, an inclined side surface Ts1 (also referred to as a second inclined side surface Ts12) that is a surface that constitutes a part of the second substrate side surface 2fs2 of the third portion 2p3 may be present between a first surface 2fsa (a second first surface 2fsa2) that constitutes a part of the second substrate side surface 2fs2 of the first portion 2p1 and a second surface 2fsb (a second second surface 2fsb2) that constitutes a part of the second substrate side surface 2fs2 of the second portion 2p2. In other words, for example, the second substrate side surface 2fs2 may have a second first surface 2fsa2, a second inclined side surface Ts12, and a second second surface 2fsb2. In the second substrate side surface 2fs2, for example, the second inclined side surface Ts12 may be connected to the second first surface 2fsa2 in the first portion 2p1 and may also be connected to the second second surface 2fsb2 in the second portion 2p2.

[0144] In the second embodiment, for example, as shown in Figures 12 and 15, the outer edge of the third portion 2p3 located at the end in the -Y direction (the fourth direction D4) may have a shape that progresses in the -Y direction (the fourth direction D4) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, an inclined side surface Ts1 (also referred to as a third inclined side surface Ts13) that is a surface that constitutes a part of the third substrate side surface 2fs3 of the third portion 2p3 may be present between the first surface 2fsa (the third first surface 2fsa3) that constitutes a part of the third substrate side surface 2fs3 of the first portion 2p1 and the second surface 2fsb (the third second surface 2fsb3) that constitutes a part of the third substrate side surface 2fs3 of the second portion 2p2. In other words, for example, the third substrate side surface 2fs3 may have a third first surface 2fsa3, a third inclined side surface Ts13, and a third second surface 2fsb3. In the third substrate side surface 2fs3, for example, the third inclined side surface Ts13 may be connected to the third first surface 2fsa3 in the first portion 2p1 and may also be connected to the third second surface 2fsb3 in the second portion 2p2.

[0145] In the second embodiment, for example, as shown in Figures 12 and 16, the outer edge of the third portion 2p3 located at the end in the +Y direction (as the fifth direction D5) may have a shape that progresses in the +Y direction (as the fifth direction D5) as it progresses in the -Z direction (as the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, an inclined side surface Ts1 (also referred to as a fourth inclined side surface Ts14) that is a surface that constitutes a part of the fourth substrate side surface 2fs4 of the third portion 2p3 may be present between the first surface 2fsa (fourth first surface 2fsa4) that constitutes a part of the fourth substrate side surface 2fs4 of the first portion 2p1 and the second surface 2fsb (fourth second surface 2fsb4) that constitutes a part of the fourth substrate side surface 2fs4 of the second portion 2p2. In other words, for example, the fourth substrate side surface 2fs4 may have a fourth first surface 2fsa4, a fourth inclined side surface Ts14, and a fourth second surface 2fsb4. In the fourth substrate side surface 2fs4, for example, the fourth inclined side surface Ts14 may be connected to the fourth first surface 2fsa4 in the first portion 2p1 and may also be connected to the fourth second surface 2fsb4 in the second portion 2p2.

[0146] 2-2. Third Embodiment In the second embodiment described above, for example, as shown in FIGS. 17 to 22, the substrate 2 may have a curved side surface (also referred to as a curved side surface Cs1) at the third portion 2p3. If this configuration is adopted, the width of the substrate 2 may change more continuously in the thickness direction along the −Z direction, which is the first direction D1 of the substrate 2. Therefore, when the substrate 2 is held by a robot hand or a tool in the width direction of the substrate 2, stress concentration in the substrate 2 may be further alleviated. This may further reduce damage to the light-emitting device 1 due to external forces.

[0147] FIG. 17 is a front view showing the appearance of an example of a light-emitting device 1 according to the third embodiment. FIG. 18 is a side view showing the appearance of an example of a light-emitting device 1 according to the third embodiment. FIG. 19 is a front view showing a region XIX surrounded by a dashed-dotted rectangular line in FIG. 17. FIG. 20 is a front view showing a region XX surrounded by a dashed-dotted rectangular line in FIG. 17. FIG. 21 is a side view showing a region XXI surrounded by a dashed-dotted rectangular line in FIG. 18. FIG. 22 is a side view showing a region XXII surrounded by a dashed-dotted rectangular line in FIG. 18. In the examples of FIGS. 17 to 22, a virtual boundary between the third portion 2p3 and the second portion 2p2 on the substrate 2 is indicated by a thin dashed-dotted line.

[0148] The light-emitting device 1 according to the third embodiment may be based on the light-emitting device 1 according to the second embodiment, with the inclined side surface Ts1 replaced with a curved side surface Cs1. In other words, for example, in the substrate side surface 2fs, the third portion 2p3 may have a curved side surface Cs1 located between the first surface 2fsa and the second surface 2fsb. Here, the portion of the substrate 2 having the surface constituting the curved side surface Cs1 may be the third portion 2p3. The curved side surface Cs1 may be, for example, a concavely curved surface. The second surface 2fsb and the curved side surface Cs1 may be connected in a manner that forms a single continuous surface without, for example, a concave corner or a step. In other words, the second surface 2fsb and the curved side surface Cs1 may form a single continuous surface. The curved side surface Cs1 may have, for example, a shape that follows a portion of an imaginary paraboloid or a shape that follows a portion of an imaginary cylindrical surface.

[0149] In the third embodiment, for example, as shown in Figures 17 and 19, the outer edge of the third portion 2p3 located at the end in the -X direction (the second direction D2) may have a shape that progresses in the -X direction (the second direction D2) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, a curved side surface Cs1 (also referred to as a first curved side surface Cs11) that is a surface that constitutes a part of the first substrate side surface 2fs1 of the third portion 2p3 may be present between a first first surface 2fsa1 that constitutes a part of the first substrate side surface 2fs1 of the first portion 2p1 and a first second surface 2fsb1 that constitutes a part of the first substrate side surface 2fs1 of the second portion 2p2. In other words, for example, the first substrate side surface 2fs1 may have a first first surface 2fsa1, a first curved side surface Cs11, and a first second surface 2fsb1. In the first substrate side surface 2fs1, for example, the first curved side surface Cs11 may be connected to the first first surface 2fsa1 in the first portion 2p1 and to the first second surface 2fsb1 in the second portion 2p2. The first second surface 2fsb1 and the first curved side surface Cs11 may be connected to each other in a manner that forms a single continuous surface without, for example, a concave corner or a step. In other words, the first second surface 2fsb1 and the first curved side surface Cs11 may form a single continuous surface. The first curved side surface Cs11 may have a shape that follows a portion of an imaginary paraboloid or a portion of an imaginary cylindrical surface.

[0150] In the third embodiment, for example, as shown in Figures 17 and 20, the outer edge of the third portion 2p3 located at the end in the +X direction (the third direction D3) may have a shape that progresses in the +X direction (the third direction D3) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, a curved side surface Cs1 (also referred to as a second curved side surface Cs12) that is a surface that constitutes a part of the second substrate side surface 2fs2 of the third portion 2p3 may be present between a second first surface 2fsa2 that constitutes a part of the second substrate side surface 2fs2 of the first portion 2p1 and a second second surface 2fsb2 that constitutes a part of the second substrate side surface 2fs2 of the second portion 2p2. In other words, for example, the second substrate side surface 2fs2 may have a second first surface 2fsa2, a second curved side surface Cs12, and a second second surface 2fsb2. In the second substrate side surface 2fs2, for example, the second curved side surface Cs12 may be connected to the second first surface 2fsa2 in the first portion 2p1 and to the second second surface 2fsb2 in the second portion 2p2. The second second surface 2fsb2 and the second curved side surface Cs12 may be connected to each other in a manner that forms a single continuous surface without, for example, a concave corner or a step. In other words, the second second surface 2fsb2 and the second curved side surface Cs12 may form a single continuous surface. The second curved side surface Cs12 may have a shape that follows a portion of an imaginary paraboloid or a portion of an imaginary cylindrical surface.

[0151] In the third embodiment, for example, as shown in Figures 18 and 21, the outer edge of the third portion 2p3 located at the end in the -Y direction (the fourth direction D4) may have a shape that progresses in the -Y direction (the fourth direction D4) as it progresses in the -Z direction (the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, a curved side surface Cs1 (also referred to as a third curved side surface Cs13) that is a surface that constitutes a part of the third substrate side surface 2fs3 of the third portion 2p3 may be present between a third first surface 2fsa3 that constitutes a part of the third substrate side surface 2fs3 of the first portion 2p1 and a third second surface 2fsb3 that constitutes a part of the third substrate side surface 2fs3 of the second portion 2p2. In other words, for example, the third substrate side surface 2fs3 may have a third first surface 2fsa3, a third curved side surface Cs13, and a third second surface 2fsb3. In the third substrate side surface 2fs3, for example, the third curved side surface Cs13 may be connected to the third first surface 2fsa3 in the first portion 2p1 and to the third second surface 2fsb3 in the second portion 2p2. The third second surface 2fsb3 and the third curved side surface Cs13 may be connected to each other in a manner that forms a single continuous surface without, for example, a concave corner or a step. In other words, the third second surface 2fsb3 and the third curved side surface Cs13 may form a single continuous surface. The third curved side surface Cs13 may have a shape that follows a portion of an imaginary paraboloid or a portion of an imaginary cylindrical surface.

[0152] In the third embodiment, for example, as shown in Figures 18 and 22, the outer edge of the third portion 2p3 located at the end in the +Y direction (as the fifth direction D5) may have a shape that progresses in the +Y direction (as the fifth direction D5) as it progresses in the -Z direction (as the first direction D1). Here, as in the examples of Figures 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, a curved side surface Cs1 (also referred to as a fourth curved side surface Cs14) that is a surface that constitutes a part of the fourth substrate side surface 2fs4 of the third portion 2p3 may be present between a fourth first surface 2fsa4 that constitutes a part of the fourth substrate side surface 2fs4 of the first portion 2p1 and a fourth second surface 2fsb4 that constitutes a part of the fourth substrate side surface 2fs4 of the second portion 2p2. In other words, for example, the fourth substrate side surface 2fs4 may have a fourth first surface 2fsa4, a fourth curved side surface Cs14, and a fourth second surface 2fsb4. In the fourth substrate side surface 2fs4, for example, the fourth curved side surface Cs14 may be connected to the fourth first surface 2fsa4 in the first portion 2p1 and to the fourth second surface 2fsb4 in the second portion 2p2. The fourth second surface 2fsb4 and the fourth curved side surface Cs14 may be connected to each other in a manner that forms a single continuous surface without, for example, a concave corner or a step. In other words, the fourth second surface 2fsb4 and the fourth curved side surface Cs14 may form a single continuous surface. The fourth curved side surface Cs14 may have a shape that follows a portion of an imaginary paraboloid or a portion of an imaginary cylindrical surface.

[0153] Here, for example, as shown in Figures 23 to 26, the first surface 2fsa and the curved side surface Cs1 may be connected in a manner that forms a single continuous surface without any sharp corners or steps. In other words, the first surface 2fsa, the curved side surface Cs1, and the second surface 2fsb may form a single continuous surface. If this configuration is adopted, the width of the substrate 2 may change more continuously in the thickness direction along the -Z direction, which is the first direction D1 of the substrate 2. Therefore, when the substrate 2 is held in the width direction of the substrate 2 by a robot hand or tool, stress concentration in the substrate 2 can be further alleviated. This can further reduce damage to the light-emitting device 1 due to external forces.

[0154] Fig. 23 is a front view showing a region XXIII surrounded by a dashed-dotted rectangular line in Fig. 17. Fig. 24 is a front view showing a region XXIV surrounded by a dashed-dotted rectangular line in Fig. 17. Fig. 25 is a side view showing a region XXV surrounded by a dashed-dotted rectangular line in Fig. 18. Fig. 26 is a side view showing a region XXVI surrounded by a dashed-dotted rectangular line in Fig. 18. In the examples of Figs. 23 to 26, the imaginary boundaries between the first portion 2p1 and the third portion 2p3 and the imaginary boundaries between the third portion 2p3 and the second portion 2p2 on the substrate 2 are each indicated by a thin two-dot chain line.

[0155] 1 to 6, it is assumed that the outer edges of the first surface 2f1 and the second surface 2f2 are rectangular, and the substrate 2 has four substrate side surfaces 2fs. In this case, for example, as shown in FIG. 23, the first first surface 2fsa1 and the first curved side surface Cs11 may be connected to each other in a manner that forms a single continuous surface without, for example, sharp corners or steps. In other words, the first first surface 2fsa1, the first curved side surface Cs11, and the first second surface 2fsb1 may be connected to each other in a manner that forms a single continuous surface. For example, as shown in FIG. 24, the second first surface 2fsa2 and the second curved side surface Cs12 may be connected to each other in a manner that forms a single continuous surface without, for example, sharp corners or steps. In other words, the second first surface 2fsa2, the second curved side surface Cs12, and the second second surface 2fsb2 may form a single continuous surface. For example, as shown in FIG. 25 , the third first surface 2fsa3 and the third curved side surface Cs13 may be connected to form a single continuous surface without, for example, sharp corners or steps. In other words, the third first surface 2fsa3, the third curved side surface Cs13, and the third second surface 2fsb3 may form a single continuous surface. For example, as shown in FIG. 26 , the fourth first surface 2fsa4 and the fourth curved side surface Cs14 may be connected to form a single continuous surface without, for example, sharp corners or steps. In other words, the fourth first surface 2fsa4, the fourth curved side surface Cs14, and the fourth second surface 2fsb4 may form one continuous surface.

[0156] 2-3. Fourth Embodiment In each of the first to third embodiments described above, for example, as shown in FIG. 27 , the thickness of the first portion 2p1 of the substrate 2 may be greater than the thickness of the second portion 2p2 of the substrate 2 in the −Z direction as the first direction D1. The thickness of the first portion 2p1 may be the length of the first portion 2p1 in the −Z direction as the first direction D1. The thickness of the second portion 2p2 may be the length of the second portion 2p2 in the −Z direction as the first direction D1. From another perspective, the first predetermined proportion of the first portion 2p1 may be greater than the second predetermined proportion of the second portion 2p2. More specifically, the thickness of the first portion 2p1 of the substrate 2 may be greater than half the thickness of the substrate 2 in the −Z direction as the first direction D1. The thickness of the substrate 2 may be the length of the substrate 2 in the −Z direction as the first direction D1. In other words, the thickness of the second portion 2p2 of the substrate 2 in the −Z direction (first direction D1) may be less than half the thickness of the substrate 2. From another perspective, the first predetermined ratio of the first portion 2p1 may be greater than 50%. In other words, the second predetermined ratio of the second portion 2p2 may be less than 50%. In one example of the fourth embodiment, for example, a portion or all of the curved side surface Cs1 may be located closer to the second surface 2f2 than the center of the substrate 2 in the +Z direction (the opposite direction to the first direction D1) than the center of the substrate 2 in the −Z direction (first direction D1). In other words, for example, a portion or all of the curved side surface Cs1 may be located closer to the second surface 2f2 than the center of the substrate 2 in the +Z direction (the opposite direction to the first direction D1). In the fourth embodiment, because a large proportion of the first portion 2p1 occupies the substrate 2, stress concentration in the substrate 2 can be further alleviated when the substrate 2 is clamped in the width direction of the substrate 2 by a robot hand or tool. This can further reduce damage to the light-emitting device 1 due to external forces.

[0157] FIG. 27 shows a portion of an example of the configuration of the light-emitting device 1 according to the fourth embodiment, and is a front view illustrating a region corresponding to the rectangular region XIX enclosed by a dashed-dotted line in FIG. 17 . In the example of FIG. 27 , the imaginary boundaries between the first portion 2p1 and the third portion 2p3 on the substrate 2 and between the third portion 2p3 and the second portion 2p2 are indicated by thin dashed-dotted lines. An example of the outer shape of the light-emitting device 1 according to the fourth embodiment may be plane-symmetric or approximately plane-symmetric with respect to a virtual plane along the XZ plane, or plane-symmetric or approximately plane-symmetric with respect to a virtual plane along the YZ plane. An example of the outer shape of the light-emitting device 1 according to the fourth embodiment may be four-fold rotationally symmetric with respect to a virtual line along the first direction D1.

[0158] 27 , the seventh surface 4f7 as a side surface of the wavelength conversion unit 4 may be inclined with respect to the −Z direction as the first direction D1 in a direction away from the substrate 2, as the seventh surface 4f7 moves away from the light-emitting element 3. The direction away from the light-emitting element 3 may be, for example, a direction along the second surface 2f2 of the substrate 2 and away from the light-emitting element 3, or a direction perpendicular to the −Z direction as the first direction D1 and away from the light-emitting element 3. In other words, the seventh surface 4f7 as a side surface of the wavelength conversion unit 4 may be inclined with respect to the −Z direction as the first direction D1 in a direction away from the light-emitting element 3 and away from the +Z direction as the opposite direction to the first direction D1. From another perspective, in the wavelength conversion unit 4, the seventh surface 4f7 may be inclined with respect to the −Z direction as the first direction D1 in a manner that progresses outward from the fifth surface 4f5 side toward the sixth surface 4f6 side. The outward direction may be, for example, a direction along the second surface 2f2 of the substrate 2 and a direction from a portion of the wavelength converting unit 4 on the light-emitting element 3 (also referred to as an inner portion) toward the seventh surface 4f7 located on the outer periphery. Alternatively, the outward direction may be, for example, a direction along the second surface 2f2 of the substrate 2 and a direction away from the light-emitting element 3. Here, for example, in the −Z direction as the first direction D1, the thickness of the first portion 2p1 of the substrate 2 may be greater than the thickness of the second portion 2p2 of the substrate 2, may be equal to the thickness of the second portion 2p2 of the substrate 2, or may be smaller than the thickness of the second portion 2p2 of the substrate 2.

[0159] Here, for example, at the outer edge of the wavelength conversion unit 4 located at the end of the −X direction (hereinafter also simply referred to as the −X direction) as the second direction D2, the seventh surface 4f7 may be inclined with respect to the −Z direction (hereinafter also simply referred to as the −Z direction) as the first direction D1, in a manner that progresses in the −X direction as it moves toward the +Z direction (hereinafter also simply referred to as the +Z direction) as the opposite side to the substrate 2 or the direction opposite to the first direction D1. From another perspective, for example, at the outer edge of the wavelength conversion unit 4 located at the end of the −X direction, the seventh surface 4f7 may be inclined with respect to the −Z direction, in a manner that progresses in the −X direction as it moves from the fifth surface 4f5 side to the sixth surface 4f6 side. The outer edges of the wavelength conversion unit 4 located at the end of the +X direction as the third direction D3, the end of the −Y direction as the fourth direction D4, and the end of the +Y direction as the fifth direction D5 may have shapes that are plane-symmetric or rotationally symmetric with respect to the outer edge of the wavelength conversion unit 4 located at the end of the −X direction.

[0160] Here, as described above, it is assumed that the outer edges of the fifth surface 4f5 and the sixth surface 4f6 are rectangular, and the wavelength conversion unit 4 has a first seventh surface 4f71, a second seventh surface 4f72, a third seventh surface 4f73, and a fourth seventh surface 4f74. In this case, for example, as shown in FIG. 27 , the first seventh surface 4f71 of the wavelength conversion unit 4 may be inclined with respect to the −Z direction in a manner that progresses in the −X direction as it moves toward the side opposite the substrate 2 or the +Z direction. From another perspective, the first seventh surface 4f71 may be inclined with respect to the −Z direction in a manner that progresses in the −X direction as it moves from the fifth surface 4f5 side toward the sixth surface 4f6 side. Each of the second, third and fourth seventh surfaces (4f72, 4f73 and 4f74) may have a shape corresponding to the first seventh surface 4f71, in a form in which the first to fourth seventh surfaces (4f71, 4f72, 4f73 and 4f74) are four-fold rotationally symmetric with respect to a virtual straight line along the first direction D1.

[0161] In other words, in the wavelength converting unit 4, the width of the sixth surface 4f6 may be larger than the width of the fifth surface 4f5 in the direction along the second surface 2f2 of the substrate 2. Here, for example, the width of the sixth surface 4f6 may be larger than the width of the fifth surface 4f5 in the −X direction as the second direction D2.

[0162] As described above, when the seventh surface 4f7 is inclined, for example, in the direction away from the light-emitting element 3 or in the outward direction, the length by which the portion of the seventh surface 4f7 on the sixth surface 4f6 side protrudes relative to the portion of the seventh surface 4f7 on the fifth surface 4f5 side may be referred to as the inclination width. In this case, for example, the inclination width of the seventh surface 4f7 of the wavelength converting unit 4 may be set to be less than the length by which the first portion 2p1 of the substrate 2 protrudes relative to the second portion 2p2 of the substrate 2 in the direction away from the light-emitting element 3 or in the outward direction.

[0163] Here, for example, with respect to the outer edge of the wavelength conversion unit 4 located at the end in the −X direction, the length by which the portion of the seventh surface 4f7 on the sixth surface 4f6 side protrudes in the −X direction relative to the portion of the seventh surface 4f7 on the fifth surface 4f5 side may be referred to as the first slope width. In this case, for example, the first slope width may be set to be less than the length by which the first portion 2p1 of the substrate 2 protrudes relative to the second portion 2p2 of the substrate 2 in the −X direction. The outer edges of the wavelength conversion unit 4 located at the end in the +X direction as the third direction D3, the end in the −Y direction as the fourth direction D4, and the end in the +Y direction as the fifth direction D5 may have shapes that are plane-symmetric or rotationally symmetric with respect to the outer edge of the wavelength conversion unit 4 located at the end in the −X direction.

[0164] Here, as described above, it is assumed that the outer edges of the fifth surface 4f5 and the sixth surface 4f6 are rectangular. In this case, for example, the length (first inclined width) by which the portion of the first seventh surface 4f71 on the sixth surface 4f6 side protrudes relative to the portion of the first seventh surface 4f71 on the fifth surface 4f5 side in the −X direction may be set to be less than the length by which the first portion 2p1 of the substrate 2 protrudes relative to the second portion 2p2 of the substrate 2. The second, third, and fourth seventh surfaces (4f72, 4f73, and 4f74) may each have a shape corresponding to the first seventh surface 4f71, such that the first to fourth seventh surfaces (4f71, 4f72, 4f73, and 4f74) are four-fold rotationally symmetric with respect to an imaginary line along the first direction D1.

[0165] 2-4. Fifth Embodiment In each of the first to fourth embodiments described above, for example, the reflecting portion 24 may not be present.

[0166] Fig. 28 is a front view showing the appearance of an example of a light emitting device 1 according to a fifth embodiment. Fig. 29 is a diagram showing an example of the configuration of a light emitting device 1 according to the fifth embodiment. Fig. 30 is a cross-sectional view showing a virtual cross section of an example of a light emitting device 1 at a position XXX-XXX shown in Fig. 29 as viewed in the +Y direction.

[0167] 28 to 30 , in the light-emitting device 1 according to the fifth embodiment, for example, the second region A2 of the fourth surface 21f4 of the substrate main body 21 may be the first region A1 of the second surface 2f2 of the substrate 2. For example, the wavelength conversion unit 4 may be in contact with the second region A2, or may be in contact with the entire or substantially entire second region A2. The light-emitting device 1 of the example of FIGS. 28 to 30 is based on the light-emitting device 1 of the example of FIGS. 1 to 6 , for example, and has a configuration in which the reflector 24 has been removed and the wavelength conversion unit 4 is present in the area where the reflector 24 was previously present.

[0168] 2-5. Sixth Embodiment The light emitting device 1 according to each of the first to fifth embodiments may be applied to, for example, an illumination device 100.

[0169] FIG. 31 is a schematic diagram showing the appearance of an example of the lighting device 100. As shown in FIG.

[0170] As shown in FIG. 31 , the lighting device 100 may include, for example, a plurality of light-emitting devices 1. Each of the plurality of light-emitting devices 1 may be, for example, the light-emitting device 1 according to any one of the first to fifth embodiments described above. Here, when the lighting device 100 is manufactured, when each of the plurality of light-emitting devices 1 is clamped and lifted by a robot hand or a tool, the substrate 2 is clamped, thereby reducing the external force applied to the wavelength conversion unit 4. This reduces deformation of the wavelength conversion unit 4 and peeling of the wavelength conversion unit 4 from the substrate 2 due to application of an external force to the wavelength conversion unit 4. As a result, damage to the light-emitting device 1 due to external forces can be reduced when the lighting device 100 is manufactured. Therefore, in a lighting device 100 including a plurality of light-emitting devices 1, damage to the light-emitting device 1 due to external forces can be reduced.

[0171] The lighting device 100 can emit light emitted by a plurality of light-emitting devices 1 as illumination light. For example, the lighting device 100 may independently control the intensity of light emitted by each of the plurality of light-emitting devices 1, or may control the intensity of light emitted by each of the plurality of light-emitting devices 1 in a manner that correlates the intensity of light. The spectra of light emitted by each of the plurality of light-emitting devices 1 may be the same or different from each other. For example, the lighting device 100 may emit light (also referred to as composite light) obtained by combining the light emitted by each of the plurality of light-emitting devices 1 as illumination light. For example, the lighting device 100 may control the spectrum of the combined light as illumination light by controlling the intensity of light emitted by each of the plurality of light-emitting devices 1 in a manner that correlates the intensity of light. For example, the lighting device 100 may selectively emit light from some of the plurality of light-emitting devices 1. In other words, the lighting device 100 may emit light emitted from some of the plurality of light-emitting devices 1 as illumination light.

[0172] 31 , the lighting device 100 may include, for example, a housing 111, a wiring board 112, and a plurality of light-emitting devices 1. The housing 111 houses, for example, the wiring board 112 and the plurality of light-emitting devices 1. The lighting device 100 emits, for example, light emitted by the plurality of light-emitting devices 1 in the housing 111 to the outside of the housing 111 as illumination light. In the example of FIG. 31 , the lighting device 100 has an elongated rectangular parallelepiped shape with its longitudinal direction aligned with the +X direction as the third direction D3.

[0173] The housing 111 has, for example, an opening facing the +Z direction, which is the direction opposite to the -Z direction, which is the first direction D1. The housing 111 has, for example, a function of dissipating heat generated by the multiple light-emitting devices 1 to the outside. The material of the housing 111 may be, for example, a metal such as aluminum, copper, or stainless steel, or may be plastic or resin. In the example of FIG. 31 , the housing 111 has, for example, an elongated rectangular parallelepiped outer shape with a longitudinal direction aligned with the +X direction, which is the third direction D3, and a width direction aligned with the +Y direction, which is the fifth direction D5.

[0174] The housing 111 includes, for example, a main body (also referred to as a housing main body) 121 and two lids 122. The housing main body 121 has, for example, a long, narrow groove-like outer shape with a longitudinal direction along the +X direction (third direction D3), a U-shaped cross section along the YZ plane, and a width direction along the +Y direction (fifth direction D5). In other words, the housing main body 121 has, for example, a first opening facing the +Z direction, a second opening located at a first end in the longitudinal direction along the +X direction, and a third opening located at a second end in the longitudinal direction along the −X direction. The two lids 122 close, for example, the first opening and the second opening located at both ends of the longitudinal direction of the housing main body 121 along the +X direction.

[0175] The wiring board 112 is located within the housing 111 and fixed thereto, for example. The wiring board 112 may be fixed to a surface of the housing 111 facing the +Z direction, for example. The wiring board 112 may be a printed circuit board such as a rigid board, a flexible board, or a rigid-flexible board. The wiring board 112 may have a plate-like shape with elongated rectangular front and back surfaces. The wiring board 112 may have a function of dissipating heat generated by the light-emitting device 1 to the outside, for example. The wiring board 112 may include a portion made of a metal material such as aluminum, copper, or stainless steel, an organic resin material, or a composite material containing these. The shape of the wiring board 112 may be elongated and rectangular in plan view in the −Z direction, which is the first direction D1. The shape of the wiring board 112 is not limited to this and may be various other shapes.

[0176] The plurality of light emitting devices 1 are mounted on a wiring board 112 within a housing 111, for example. The two first electrodes 22 of the light emitting device 1 may be electrically connected to the wiring of the wiring board 112 via solder or a conductive adhesive, for example. The plurality of light emitting devices 1 may be arranged, for example, along an imaginary straight line extending along the longitudinal direction of the housing 111, or may be arranged in a grid or houndstooth pattern, or may be positioned in various other patterns.

[0177] Here, a signal from the wiring board 112 may be transmitted to the light-emitting element 3 via the substrate 2, causing the light-emitting element 3 to emit light. Power may be supplied to the wiring board 112 from an external power source via wiring. The power source may be, for example, a button battery or various other power sources. A control unit capable of outputting a control signal for controlling the light-emitting element 3 may be mounted on the wiring board 112. The control unit may be composed of, for example, a processor.

[0178] The lighting device 100 may further include, for example, a light-transmitting substrate 113. The light-transmitting substrate 113 may seal the wiring substrate 112 and the plurality of light-emitting devices 1 housed inside the housing 111. The light-transmitting substrate 113 may be positioned, for example, in a state of closing a first opening of the housing 111 facing the +Z direction. The light-transmitting substrate 113 is made of a material that allows light emitted from each of the plurality of light-emitting devices 1 to pass through. The material of the light-transmitting substrate 113 may be, for example, acrylic resin or glass. The light-transmitting substrate 113 may be, for example, a plate-like body having a front surface and a back surface of an elongated rectangle. The shape of the light-transmitting substrate 113 is not limited thereto and may be various other shapes.

[0179] The lighting device 100 may include, for example, a sealing material or the like disposed in a predetermined portion, such as between the housing 111 and the light-transmitting substrate 113. This can reduce the intrusion of water, dust, dirt, and the like into the housing 111. As a result, the reliability of the lighting device 100 can be improved regardless of the environment in which the lighting device 100 is installed. Furthermore, for example, the lighting device 100 may include a moisture absorbent or the like disposed in the housing 111.

[0180] <3. Others> In each of the first to sixth embodiments described above, for example, when the light-emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, the shapes of the outer edges of the light-emitting device 1, the second surface 2f2 of the substrate 2, and the wavelength conversion unit 4 are not limited to a rectangular shape, but may be, for example, a quadrilateral shape including a parallelogram or a rhombus, a polygonal shape different from a quadrilateral, or a shape having a curved outer edge such as a circular or elliptical shape. Here, for example, when the light-emitting device 1 is viewed in a planar perspective view in the −Z direction as the first direction D1, as long as the shapes of the outer edges of the first surface 2f1 and the second surface 2f2 of the substrate 2 are curved shapes such as a circular or elliptical shape, the substrate 2 may have one substrate side surface 2fs. Therefore, the substrate 2 may have one or more substrate side surfaces 2fs. For example, when the light emitting device 1 is seen through in a plan view in the −Z direction as the first direction D1, if the shape of the sixth surface 4f6 of the wavelength converting unit 4 has a curved outer edge, such as a circular or elliptical shape, the wavelength converting unit 4 may have one seventh surface 4f7. Therefore, the wavelength converting unit 4 may have one or more seventh surfaces 4f7.

[0181] In each of the above-described first and fourth embodiments, for example, at least one of the convex corners and concave corners along the step St1 in the substrate 2 may not be sharp, and may have the same shape as the shape after chamfering such as R chamfering or C chamfering has been performed.

[0182] In each of the second and fourth embodiments described above, for example, the convex corner along the boundary between the inclined side surface Ts1 of the substrate side surface 2fs and the first surface 2fsa may not be sharp, and may have the same shape as the shape after chamfering such as R chamfering or C chamfering has been performed.

[0183] In each of the first to sixth embodiments described above, for example, the light emitting devices 1 may be individually manufactured without dicing to produce a plurality of light emitting devices 1. In this case, for example, the shapes of the substrate side surface 2fs and the seventh surface 4f7 may be realized by one or more types of processing among a plurality of types of processing such as cutting, grinding, and polishing.

[0184] In each of the first to sixth embodiments described above, for example, the surface of the reflector 24 (also referred to as the reflector side surface) of the substrate side surface 2fs may be inclined with respect to the −Z direction as the first direction D1, so that the surface moves away from the light-emitting element 3 as it moves away from the wavelength conversion unit 4. In other words, the reflector side surface may be inclined with respect to the −Z direction as the first direction D1, so that the surface moves away from the light-emitting element 3 as it moves closer to the fourth surface 21f4 of the substrate main body 21. In this case, the probability that excitation light emitted from the fifth surface 4f5 of the wavelength conversion unit 4 is reflected by the reflector side surface and enters the wavelength conversion unit 4 from the fifth surface 4f5 may be increased. This may increase the rate at which excitation light is converted into light (converted light) having a spectrum different from that of the excitation light in the wavelength conversion unit 4.

[0185] In each of the first to sixth embodiments, for example, the sixth surface 4f6 of the wavelength converting unit 4 may be a flat surface or a concave surface. If the sixth surface 4f6 of the wavelength converting unit 4 is a concave surface, the converted light emitted from the sixth surface 4f6 of the wavelength converting unit 4 can be condensed.

[0186] In each of the first to sixth embodiments described above, for example, the corner formed by the fifth surface 4f5 and the seventh surface 4f7 in the fourth region A4 of the wavelength conversion unit 4 may be a sharp corner or a blunt corner. The shape of the blunt corner may be, for example, a shape equivalent to the shape of a chamfered corner. The chamfering may be, for example, a C-chamfer or an R-chamfer. For example, if the corner formed by the fifth surface 4f5 and the seventh surface 4f7 in the fourth region A4 of the wavelength conversion unit 4 is a blunt corner, the weight (also referred to as the wavelength conversion unit 4's own weight) of the wavelength conversion unit 4 may reduce the occurrence of deformation in which the fourth region A4 of the wavelength conversion unit 4 sags in the −Z direction (the first direction D1).

[0187] In each of the above first to sixth embodiments, for example, the configuration of the substrate 2 may be changed to a configuration inverted with respect to a virtual plane along the XZ plane, or may be changed to a configuration inverted with respect to a virtual plane along the YZ plane.

[0188] In each of the first to sixth embodiments described above, for example, the outer shape of the light emitting device 1 does not have to be plane-symmetric with respect to a virtual plane along the XZ plane, and it does not have to be plane-symmetric with respect to a virtual plane along the YZ plane. In other words, the outer shape of the light emitting device 1 may be asymmetric in the +X direction, or may be asymmetric in the +Y direction.

[0189] In this disclosure, the terms "first" and "second" are identifiers for distinguishing between components. Components distinguished by terms such as "first" and "second" in this disclosure may be interchanged within the scope of the numbers in these components without causing a contradiction. The order of arrangement and formation of components, and the presence of identifiers with lower numbers, are not determined solely based on the terms such as "first" and "second" in this disclosure.

[0190] In the present disclosure, the X-axis, Y-axis, and Z-axis are provided for convenience of explanation and may be interchanged. The configuration according to the present disclosure has been described using a right-handed Cartesian coordinate system formed by the X-axis, Y-axis, and Z-axis, but the directions along the X-axis, Y-axis, and Z-axis are not limited to being orthogonal to each other and may be interchanged to intersect each other.

[0191] Although the light-emitting device and the illumination device have been described in detail above, the above description is illustrative in all respects and the disclosure is not limited thereto. Furthermore, the various examples described above may be combined unless they are mutually inconsistent. Furthermore, countless examples not illustrated may be envisioned without departing from the scope of the disclosure.

[0192] This disclosure includes the following:

[0193] In one embodiment, (1) a light emitting device includes a substrate having a first surface and a second surface opposite to the first surface, a light emitting element located on the second surface, and a wavelength converting portion located on the second surface and covering the light emitting element, wherein the substrate includes a first portion located on the first surface side and a second portion located on the second surface side in a first direction along a direction perpendicular to the first surface, and when the substrate, the light emitting element, and the wavelength converting portion are viewed in a plan view in the first direction, the second surface includes a first region surrounding the light emitting element, the light emitting element emits excitation light, the wavelength converting portion is in contact with the first region, and emits light having a spectrum different from that of the excitation light in response to the incidence of the excitation light, and in a second direction along the second surface, the wavelength converting portion protrudes more than the second portion, and the first portion protrudes more than the wavelength converting portion.

[0194] (2) In the light emitting device of (1) above, in a third direction opposite to the second direction, the wavelength converting portion may protrude more than the second portion, and the first portion may protrude more than the wavelength converting portion.

[0195] (3) In the light emitting device of (2) above, the wavelength converting portion may protrude more than the second portion, and the first portion may protrude more than the wavelength converting portion, in each of a fourth direction that is along the second surface and intersects the second direction, and a fifth direction that is opposite to the fourth direction.

[0196] (4) In the light emitting device according to any one of (1) to (3) above, the second surface may have a rectangular outer periphery.

[0197] (5) In any one of the light-emitting devices (1) to (4) above, the substrate includes an insulating main body portion and a reflecting portion located closer to the second surface than the main body portion, and the main body portion has a third surface located closer to the first surface and a fourth surface located closer to the second surface, and when the light-emitting device is viewed in a planar perspective view in the first direction, the fourth surface includes a second region surrounding the light-emitting element, and the reflecting portion is located on the second region and has at least a part of the first region, and may have a higher light reflectivity on the second surface than on the fourth surface.

[0198] (6) In the light emitting device of (5) above, when the light emitting device is viewed in a planar perspective in the first direction, the wavelength converting portion may include a third region overlapping the reflecting portion and a fourth region located outside the third region and not overlapping the reflecting portion.

[0199] (7) In the light emitting device of (6) above, when the light emitting device is seen through a plan view in the first direction, the fourth region may surround the entire outer periphery of the third region.

[0200] (8) In the light emitting device according to any one of (5) to (7) above, the reflecting portion may include the entire outer periphery of the second surface.

[0201] (9) In the light emitting device according to any one of (1) to (8) above, the substrate may include a step located along the boundary between the first portion and the second portion.

[0202] (10) In any one of the light-emitting devices (1) to (8) above, the substrate may include a third portion located between the first portion and the second portion in the first direction, and the substrate may have a side surface inclined with respect to the first direction from the first portion to the second portion in the third portion.

[0203] (11) In any one of the light-emitting devices (1) to (8) above, the substrate may include a third portion located between the first portion and the second portion in the first direction, and the substrate may have a curved side at the third portion.

[0204] (12) In any one of the light-emitting devices (1) to (11) above, the wavelength conversion section has a fifth surface that is in contact with the first region of the second surface, a sixth surface that is located on the opposite side of the fifth surface, and one or more seventh surfaces that connect the fifth surface and the sixth surface, and each of the sixth surface and the one or more seventh surfaces may be exposed to the outside of the light-emitting device.

[0205] In one embodiment, (13) a lighting device includes a plurality of light-emitting devices according to any one of (1) to (12) above.

[0206] REFERENCE SIGNS LIST 1 Light emitting device 100 Illumination device 2 Substrate 21 Substrate main body 21f3 Third surface 21f4 Fourth surface 24 Reflection portion 2f1 First surface 2f2 Second surface 2fs Substrate side surface 2p1 First portion 2p2 Second portion 2p3 Third portion 3 Light emitting element 4 Wavelength conversion portion 4f5 Fifth surface 4f6 Sixth surface 4f7 Seventh surface A1 First region A2 Second region A3 Third region A4 Fourth region Cs1 Curved side surface D1 First direction D2 Second direction D3 Third direction D4 Fourth direction D5 Fifth direction St1 Step Ts1 Inclined side surface

Claims

1. A light emitting device comprising: a substrate having a first surface and a second surface opposite to the first surface; a light emitting element located on the second surface; and a wavelength converting section located on the second surface and covering the light emitting element, wherein the substrate includes, in a first direction along a direction perpendicular to the first surface, a first portion located on the first surface side and a second portion located on the second surface side, and the first portion protrudes further than the wavelength converting section in the second direction along the second surface.

2. A light emitting device according to claim 1, wherein the wavelength converting portion protrudes beyond the second portion in the second direction.

3. A light-emitting device according to claim 1 or claim 2, wherein, when the substrate, the light-emitting element, and the wavelength conversion unit are viewed in a plan view in the first direction, the second surface includes a first region surrounding the light-emitting element, and the wavelength conversion unit is in contact with the first region and emits light having a spectrum different from that of excitation light emitted from the light-emitting element in response to the incidence of the excitation light.

4. A light emitting device according to any one of claims 1 to 3, wherein the wavelength converting portion protrudes more than the second portion and the first portion protrudes more than the wavelength converting portion in a third direction opposite to the second direction.

5. A light-emitting device according to claim 4, wherein the wavelength converting portion protrudes beyond the second portion, and the first portion protrudes beyond the wavelength converting portion, in each of a fourth direction that is along the second surface and intersects with the second direction, and a fifth direction that is opposite to the fourth direction.

6. A light emitting device according to any one of claims 1 to 5, wherein the second surface has a rectangular outer periphery.

7. A light-emitting device according to claim 1 or 2, wherein, when the substrate, the light-emitting element, and the wavelength conversion unit are viewed in a planar perspective in the first direction, the second surface includes a first region surrounding the light-emitting element, the substrate includes an insulating main body and a reflecting portion located closer to the second surface than the main body, the main body has a third surface located on the first surface side and a fourth surface located on the second surface side, and when the light-emitting device is viewed in a planar perspective in the first direction, the fourth surface includes the second region surrounding the light-emitting element, and the reflecting portion is located on the second region and has at least a part of the first region, and has a higher light reflectance on the second surface than on the fourth surface.

8. A light-emitting device according to claim 7, wherein, when the light-emitting device is viewed in a planar perspective in the first direction, the wavelength converting section includes a third region that overlaps with the reflecting section, and a fourth region that is located outside the third region and does not overlap with the reflecting section.

9. A light emitting device according to claim 8, wherein when the light emitting device is viewed in plan view in the first direction, the fourth region surrounds the entire outer periphery of the third region.

10. A light emitting device according to any one of claims 7 to 9, wherein the reflecting portion comprises the entire outer periphery of the second surface.

11. A light emitting device according to any one of claims 1 to 10, wherein the substrate includes a step located along the boundary between the first portion and the second portion.

12. A light-emitting device according to any one of claims 1 to 10, wherein the substrate includes a third portion located between the first portion and the second portion in the first direction, and the substrate has a side surface inclined with respect to the first direction from the first portion to the second portion in the third portion.

13. A light-emitting device according to any one of claims 1 to 10, wherein the substrate includes a third portion located between the first portion and the second portion in the first direction, and the substrate has a curved side surface at the third portion.

14. A light-emitting device as defined in claim 1 or claim 2, wherein, when the substrate, the light-emitting element, and the wavelength converting unit are viewed in plan view in the first direction, the second surface includes a first region surrounding the light-emitting element, and the wavelength converting unit has a fifth surface in contact with the first region of the second surface, a sixth surface located on the opposite side from the fifth surface, and one or more seventh surfaces connecting the fifth surface and the sixth surface, and each of the sixth surface and the one or more seventh surfaces is exposed to the outside of the light-emitting device.

15. A light emitting device according to any one of claims 1 to 14, wherein the thickness of the first portion in the first direction is greater than the thickness of the second portion.

16. A light-emitting device according to any one of claims 1 to 15, wherein the side surface of the wavelength conversion section is inclined in a direction away from the light-emitting element as it moves away from the substrate with respect to the first direction.

17. A lighting device comprising a plurality of light-emitting devices according to any one of claims 1 to 16.

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