Camera module

Abstract

This camera module comprises: a first body including a hole; a lens module coupled to the hole; and a substrate module arranged in the first body, wherein: the substrate module includes a first substrate having an upper surface on which an image sensor facing the lens module in the optical axis direction is arranged, a second substrate arranged on the rear side of the first substrate, and an electronic component arranged on the rear surface of the first substrate; a concave groove is arranged on the upper surface of the second substrate, and a metal layer is arranged in the groove; and the lower surface of the electronic component is in contact with the upper surface of the metal layer.

Description

camera module

[0001] This embodiment relates to a camera module.

[0002]

[0003] Recently, ultra-small camera modules have been developed and are widely used in small electronic products such as smartphones, laptops, and game consoles.

[0004] As automobiles become more widespread, miniature cameras are increasingly being used not only in small electronic devices but also in vehicles. Examples include black box cameras for vehicle protection or to collect objective data on traffic accidents, rearview cameras that allow drivers to monitor blind spots at the rear of the vehicle, ensuring safety when backing up, and perimeter cameras that monitor the vehicle's surroundings.

[0005] A camera may include a lens, a body to which the lens is attached, an image sensor that converts an image of a subject captured by the lens into an electrical signal, and a printed circuit board on which the image sensor is mounted. In addition to the image sensor, the printed circuit board may also house numerous other electronic components for operating the camera.

[0006] Electronic components generate heat when operated. This heat significantly affects the lifespan and operation of electronic components, making heat dissipation essential.

[0007]

[0008] The present embodiment provides a camera module capable of improving heat dissipation efficiency by improving the structure.

[0009]

[0010] A camera module according to the present embodiment comprises: a first body including a hole; a lens module coupled to the hole; and a substrate module disposed within the first body, wherein the substrate module comprises: a first substrate having an image sensor disposed on an upper surface thereof facing the lens module in an optical axis direction; a second substrate disposed on a rear surface of the first substrate; and an electronic component disposed on a rear surface of the first substrate, wherein a concave groove is disposed on an upper surface of the second substrate, and a metal layer disposed in the groove, and a lower surface of the electronic component is in contact with an upper surface of the metal layer.

[0011] The cross-sectional area of ​​the above metal layer may be larger than the cross-sectional area of ​​the above electronic component.

[0012] The above metal layer may be a ground region.

[0013] A third substrate is included between the first substrate and the second substrate, and the third substrate may include a hole in which the electronic component is placed.

[0014] The cross-sectional area of ​​the hole is larger than the cross-sectional area of ​​the electronic component, and the side surface of the electronic component can be spaced apart from the inner surface of the hole.

[0015] It may include a first connecting portion connecting the first substrate and the third substrate, and a second connecting portion connecting the second substrate and the third substrate.

[0016] The cross-sectional area of ​​the first substrate may be larger than the cross-sectional area of ​​the second substrate.

[0017] The thickness of the third substrate may be thicker than the thickness of the first substrate and thinner than the thickness of the second substrate.

[0018] The thickness of the above electronic component may be thicker than the thickness of the third substrate.

[0019] A second body is coupled to the rear of the first body and includes a space in which the substrate module is arranged, and the second substrate can be in contact with the second body.

[0020]

[0021] Through this embodiment, the contact structure between the electronic components and the metal layer allows the driving heat of the image sensor, the first substrate, and the electronic components to be directly transferred to the metal layer, so there is an advantage in that the heat dissipation efficiency of the camera module can be further improved.

[0022] In addition, the structure for receiving electronic components through holes allows the optical axis height of the substrate module to be reduced, which has the advantage of enabling miniaturization.

[0023]

[0024] FIG. 1 is a perspective view showing the appearance of a camera module according to an embodiment of the present invention.

[0025] Figure 2 is an exploded perspective view of a camera module according to an embodiment of the present invention.

[0026] Figure 3 is a cross-sectional view of a substrate module according to an embodiment of the present invention.

[0027] Figure 4 is a cross-sectional view showing the combined structure of the first substrate, the second substrate, and the third substrate according to an embodiment of the present invention.

[0028] Figure 5 is a plan view showing the upper surface of a second substrate according to an embodiment of the present invention.

[0029] Figure 6 is a plan view of a third substrate according to an embodiment of the present invention.

[0030]

[0031] Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the attached drawings.

[0032] However, the technical idea of ​​the present invention is not limited to some of the embodiments described, but can be implemented in various different forms, and within the scope of the technical idea of ​​the present invention, one or more of the components between the embodiments can be selectively combined or substituted for use.

[0033] In addition, terms (including technical and scientific terms) used in the embodiments of the present invention may be interpreted as having a meaning that can be generally understood by a person of ordinary skill in the technical field to which the present invention belongs, unless explicitly and specifically defined and described, and terms that are commonly used, such as terms defined in a dictionary, may be interpreted in consideration of the contextual meaning of the relevant technology.

[0034] Additionally, the terms used in the embodiments of the present invention are intended to describe the embodiments and are not intended to limit the present invention.

[0035] In this specification, the singular may also include the plural unless specifically stated otherwise in the phrase, and when it is described as “A and / or at least one (or more) of B, C”, it may include one or more of all combinations that can be combined with A, B, C.

[0036] Additionally, in describing components of embodiments of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only intended to distinguish the components from other components, and are not intended to limit the nature, order, or sequence of the components.

[0037] And, when a component is described as being 'connected', 'coupled', or 'connected' to another component, it may include not only cases where the component is 'connected', 'coupled', or 'connected' directly to the other component, but also cases where the component is 'connected', 'coupled', or 'connected' by another component between the component and the other component.

[0038] Additionally, when described as being formed or arranged "above" or "below" each component, "above" or "below" includes not only cases where the two components are in direct contact with each other, but also cases where one or more other components are formed or arranged between the two components. Furthermore, when expressed as "above" or "below," the meaning may include not only the upward direction but also the downward direction based on one component.

[0039] The term "optical axis direction" used below is defined as the optical axis direction of the lens. Meanwhile, "optical axis direction" may correspond to "up-down direction", "z-axis direction", etc.

[0040] Hereinafter, the present invention will be described in more detail with reference to the attached drawings.

[0041] FIG. 1 is a perspective view showing the appearance of a camera module according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of a camera module according to an embodiment of the present invention, FIG. 3 is a cross-sectional view of a substrate module according to an embodiment of the present invention, FIG. 4 is a cross-sectional view showing a bonding structure of a first substrate, a second substrate, and a third substrate according to an embodiment of the present invention, FIG. 5 is a plan view showing an upper surface of a second substrate according to an embodiment of the present invention, and FIG. 6 is a plan view of a third substrate according to an embodiment of the present invention.

[0042] Referring to FIGS. 1 to 6, a camera module (10) according to an embodiment of the present invention may be a vehicle camera module. The camera module (10) may be coupled to a vehicle. The camera module (10) may be used in at least one of a front camera, a side camera, a rear camera, and a black box of the vehicle. The camera module (10) may be placed at the front of the vehicle. The camera module (10) may be placed at the rear of the vehicle. The camera module (10) may be coupled to the windshield of the vehicle. The camera module (10) may be coupled to the windshield of the front or rear of the vehicle. The camera module (10) may be placed on the side of the vehicle. The camera module (10) may photograph a subject and output the image as an image on a display (not shown).

[0043] The camera module (10) may include a first body (100), a second body (200), a lens module (300), a substrate module (400), and a sealing member (900).

[0044] The camera module (10) may include a first body (100). The first body (100) may be named any one of a front body, a front housing, an upper housing, a first housing, and a front cover. The first body (100) may be placed in front of the second body (200).

[0045] The first body (100) may include a body portion (110) and a barrel portion (130). The body portion (110) and the barrel portion (130) may be formed integrally.

[0046] The body part (110) may be placed on the second body (200). The body part (110) may be coupled to the second body (200). The lower end of the body part (110) may be fixed to the second body (200). A coupling part (120) may be formed on the rear side of the body part (110) to protrude more rearwardly than other areas. The coupling parts (120) may be provided in multiple numbers and may be arranged at each of the four corner areas of the body part (110). A screw hole for coupling with a screw may be formed on the rear side of the coupling part (120). The coupling part (120) may be coupled to a coupling groove (230) of the second body (200) to be described later. The coupling part (120) may be coupled to the coupling groove (230) by a screw.

[0047] The body portion (110) may be formed in a rectangular shape with an open bottom. The corners of the body portion (110) may be formed to be rounded. The body portion (110) may include a top plate (112) and a first side plate (114) extending downward from an edge of the top plate (112). The top plate (112) may be formed in a rectangular shape. The top plate (112) may extend outward from the lower outer surface of the barrel portion (130). The first side plate (114) may extend downward from the outer edge of the top plate (112). A plurality of first side plates (114) may be provided. The first side plate (114) may include four side plates. The first side plate (114) may be formed in a rectangular plate shape. The first side plate (114) may include a first-first side plate, a first-second side plate, a first-third side plate positioned opposite the first-first side plate, and a first-fourth side plate positioned opposite the first-second side plate. The first side plate (114) may include first-first to first-fourth corners positioned between the first-first to first-fourth side plates, respectively. Each of the first-first to first-fourth corners may include a round shape at least in part.

[0048] A space that is separated from other areas may be formed on the inside of the body portion (110). The space may be open at the bottom and covered at the top by the barrel portion (130) and the lower surface of the lens module (300).

[0049] The body portion (110) may include a guide (not shown). The guide may have a shape that protrudes downward from the lower surface of the upper plate (112). The guide may be in contact with the upper surface of the substrate module (400). The guide may be in contact with the upper surface of the first substrate (410) of the substrate module (400), which will be described later. The substrate module (400) may be supported in the space within the camera module (10) through the guide.

[0050] The barrel portion (130) may be placed on the body portion (110). The barrel portion (130) may have a circular cross-sectional shape. The barrel portion (130) may have a shape that protrudes upward from the upper surface of the upper plate (120). The barrel portion (130) may accommodate a lens module (300) therein. A hole (132) into which the lens module (300) is coupled may be formed at the center of the barrel portion (130). The space within the hole (132) may be communicated with the space within the body portion (110). The lens module (300) may be coupled to the hole (132) of the barrel portion (130).

[0051] The camera module (10) may include a second body (200). The second body (200) may be named any one of a rear body, a rear housing, a lower housing, a second housing, and a rear cover. The second body (200) may be formed in a rectangular shape with an open upper portion. The second body (200) may be formed of a metal material. The second body (200) may be placed below the first body (100). The second body (200) may be coupled with the first body (100). The second body (200) may form an internal space through coupling with the first body (100). The second body (200) may include a space portion (202) with an open upper surface.

[0052] The second body (200) may include a lower plate (220). The lower plate (220) may face the upper plate (112) of the first body (100) in the optical axis direction. The lower plate (220) may be spaced apart from the upper plate (112) of the first body (100) in the optical axis direction. The lower plate (220) may be parallel to the upper plate (112) of the first body (100). The lower plate (220) may be formed in a square shape. In this case, at least some corners of the lower plate (220) may include a round shape.

[0053] The second body (200) may include a second side plate (210). The second side plate (210) may extend from the lower plate (220). The second side plate (210) may extend upward from an outer edge of the lower plate (220). A shield member (not shown) may be disposed on the second side plate (210). The shield member may be in surface contact with an inner surface of the second side plate (210). The upper end of the second side plate (210) may be coupled to the first body (100). The upper surface of the second side plate (210) may be disposed to face the lower surface of the first side plate (114) in the optical axis direction. The upper surface of the second side plate (210) may be in contact with the lower surface of the first side plate (114). The first side plate (114) and the second side plate (210) can be joined to each other by at least one method selected from welding, adhesive, and fusion. The outer surface of the second side plate (210) can be arranged on the same plane as the outer surface of the first side plate (114) of the first body (100). A sealing member (900) is arranged between the first side plate (114) and the second side plate (210), thereby preventing external foreign substances from entering the space inside the camera module (10) through the space between the first side plate (114) and the second side plate (210).

[0054] A coupling groove (230) may be formed on the upper surface of the second body (200). The coupling groove (230) may have a concave shape that is concave rearward compared to other areas from the upper surface of the second body (200). A plurality of coupling grooves (230) may be provided, and may be respectively arranged in the four corner areas of the second body (200). The coupling portion (120) of the first body (100) may be coupled to the coupling groove (230). A screw hole is formed on the bottom surface of the coupling groove (230), and a screw may penetrate the screw hole of the second body (200) and be screw-coupled to the screw hole formed on the lower surface of the coupling portion (120) of the first body (100).

[0055] The second body (200) may include a connector outlet (not shown). The connector outlet may have a shape that protrudes downward from the lower surface of the lower plate (220). A connector (490), which will be described later, may be arranged inside the connector outlet. The connector outlet may be formed of a metal material. The connector outlet may have a hollow pipe shape inside. A sealing member (not shown) may be arranged between the inner surface of the connector outlet and the outer surface of the connector (490), thereby preventing external foreign substances from entering the space inside the camera module (10).

[0056] The camera module (10) may include a lens module (300). The lens module (300) may be coupled to the first body (100). The lens module (300) may be coupled to the hole (132) of the barrel portion (130). At least a portion of the lens module (300) may be disposed inside the barrel portion (130), and the remaining portion may be disposed to protrude upward from the first body (100).

[0057] The lens module (300) may include a lens barrel (310) and one or more lenses (330) accommodated in the lens barrel (310). The lens barrel (310) may have a cylindrical shape with open upper and lower surfaces. A space in which the lens (330) is accommodated may be formed inside the lens barrel (310). A flange (320) having a shape that protrudes outward more than other areas is arranged on a side surface of the lens barrel (310), and when the lens module (300) and the first body (100) are coupled, the lower surface of the flange (320) may be arranged to face the upper surface of the barrel portion (130) of the first body (100) in the optical axis direction. A sealing member (not shown) may be arranged between the lower surface of the flange (320) and the upper surface of the barrel portion (130), thereby preventing external foreign substances from entering the space within the camera module (10).

[0058] The lens (330) may be placed in a space within the lens barrel (310). The lens (330) may be placed to face the image sensor (412) in the substrate module (400) described later in the optical axis direction. The lens (330) may be aligned with the image sensor (412) in the optical axis direction. The lenses (330) may be provided in multiple numbers and may be placed spaced apart from each other along the optical axis direction within the lens barrel (310). Among the multiple lenses (330), the outermost lens may be exposed upward of the camera module (10) through an opening formed on the lens barrel (310).

[0059] The camera module (10) may include a substrate module (400). The substrate module (400) may be placed in a space within the camera module (10). The substrate module (400) may be placed between the first body (100) and the second body (200).

[0060] The substrate module (400) may include a first substrate (410), a second substrate (430), and a third substrate (450).

[0061] The first substrate (410) may be a printed circuit board (PCB). The first substrate (410) may be formed in a plate shape. An image sensor (412) may be arranged on the upper surface of the first substrate (410). The image sensor (412) may be arranged to face the lens (330) in the optical axis direction. The image sensor (412) may be soldered onto the first substrate (410) via a solder ball. The first substrate (410) may have a first thickness (t1).

[0062] The second substrate (430) may be arranged on the rear side of the first substrate (410). The second substrate (430) may be a printed circuit board (PCB). The second substrate (430) may be arranged to be spaced apart from the first substrate (410) in the optical axis direction. A connector (490) may be arranged on the rear side of the second substrate (430). The connector (490) may be soldered to the rear side of the second substrate (430). A plurality of electronic components (482, 484) may be arranged on the surface of the second substrate (430). For example, an upper electronic component (482) may be arranged on the upper surface of the second substrate (430) facing the first substrate (410), and a lower electronic component (484) may be arranged on the rear side of the second substrate (430). The upper electronic component (482) and the lower electronic component (484) can each be soldered to the surface of the second substrate (430).

[0063] The second substrate (430) may have a second thickness (t2) that is thicker than the first thickness (t1) of the first substrate (410). The cross-sectional area of ​​the second substrate (430) may be larger than the cross-sectional area of ​​the first substrate (410) and the cross-sectional area of ​​the third substrate (450).

[0064] A first pad (431) may be arranged on the upper surface of the second substrate (430). The first pad (431) is for electrical connection with the third substrate (450) and may be a metal pad. A plurality of first pads (431) may be provided and arranged along the perimeter of the metal layer (433) arranged in the center, as illustrated in FIG. 5.

[0065] A metal layer (433) may be arranged on the second substrate (430). The metal layer (433) may have a ground power source. Since the metal layer (433) has a ground power source, it may be called a ground layer or a grounding portion. As another example, the metal layer (433) may be called a metal pad. The metal layer (433) may be a pad made of a metal material. In this case, a groove for bonding the metal layer (433) may be formed on the upper surface of the second substrate (430). The groove may have a shape in which a portion of the upper surface of the second substrate (430) is concave downward. The cross-sectional area of ​​the groove may correspond to the cross-sectional area of ​​the metal layer (433). In contrast, the cross-sectional area of ​​the groove is formed to be larger than the cross-sectional area of ​​the metal layer (433), and a bonding means such as a molding member (not shown) or an adhesive member (not shown) may be provided between the inner surface of the groove and the side surface of the metal layer (433).

[0066] The upper surface of the metal layer (433) may form the same plane as the upper surface of the second substrate (430). The cross-sectional area of ​​the metal layer (433) may be formed to be larger than the cross-sectional area of ​​the electronic component (460) to be described later. The upper surface of the metal layer (433) may be in contact with the lower surface of the electronic component (460) to be described later.

[0067] As another example, the metal layer (433) may be an area where the copper foil in the second substrate (430) is exposed upward.

[0068] A third substrate (450) may be disposed between the first substrate (410) and the second substrate (430). The third substrate (450) may be a printed circuit board (PCB). The third substrate (450) may be electrically connected to the first substrate (410) and the second substrate (430). A first connection portion (472) may be disposed between the first substrate (410) and the third substrate (450). A second connection portion (474) may be disposed between the second substrate (430) and the third substrate (450). The first connection portion (472) and the second connection portion (474) may be soldering areas for electrically and physically connecting between the first substrate (410) and the third substrate (450), and between the second substrate (430) and the third substrate (450), respectively.

[0069] The third substrate (450) may have a third thickness (t3) that is thicker than the thickness (t1) of the first substrate (410) and thinner than the thickness (t2) of the second substrate (430). The cross-sectional area of ​​the third substrate (450) may be smaller than the cross-sectional area of ​​the first substrate (410).

[0070] As illustrated in FIG. 6, a second pad (456) may be placed on the upper or lower surface of the third substrate (450). The second pad (456) may be a metal pad for electrical connection with the first substrate (410) or the second substrate (430). The second pads (456) may be provided in multiple numbers and may be placed along the perimeter of a hole (452) positioned in the center as illustrated in FIG. 6.

[0071] The substrate module (400) may include an electronic component (460). The electronic component (460) may be placed on the lower surface of the first substrate (410). The electronic component (460) may be soldered to the lower surface of the first substrate (410). The electronic component (460) may be electrically connected to the first substrate (410) via a third connector (476). The electronic component (460) may be a communication chip for transmitting an image acquired from the image sensor (412) to the outside via a connector (490).

[0072] The third substrate (450) may include a hole (452) in which at least a portion of the electronic component (460) is arranged. The hole (452) may have a shape extending from the upper surface to the lower surface of the third substrate (450). The cross-sectional area of ​​the hole (452) may be formed to be larger than the cross-sectional area of ​​the electronic component (460). Accordingly, the side surface of the electronic component (460) may be spaced apart from the inner surface of the hole (452) in a direction perpendicular to the optical axis direction.

[0073] The electronic component (460) may be positioned to penetrate the hole (452). The lower surface of the electronic component (460) may be in contact with the upper surface of the metal layer (433). Accordingly, the heat of the first substrate (410) and the heat of the electronic component (460) may be conducted to the metal layer (433) and the second substrate (430), thereby enabling heat dissipation.

[0074] The cross-sectional area of ​​the electronic component (460) may be smaller than the cross-sectional area of ​​the metal layer (433). The lower surface of the electronic component (460) may be positioned lower than the lower surface of the third substrate (450). The thickness of the electronic component (460) may be thicker than the thickness (t3) of the third substrate (450).

[0075] According to the structure as described above, the contact structure of the electronic component (460) and the metal layer (433) through the hole (452) allows the driving heat of the image sensor (412), the first substrate (410), and the electronic component (460) to be directly transferred to the metal layer (433), so there is an advantage that the heat dissipation efficiency of the camera module (10) can be further improved.

[0076] In addition, the structure for receiving electronic components (460) through the hole (452) can lower the height of the optical axis of the substrate module (400), which has the advantage of enabling miniaturization.

[0077] Meanwhile, a guide (not shown) for supporting the second substrate (430) is formed on the inner surface of the second body (200) facing the second substrate (430), so that heat can be more easily discharged to the outside through the contact structure of the second substrate (430) and the second body (200).

[0078] Additionally, an additional electronic component (461) other than the electronic component (460) may be placed on the back of the first substrate (410), and may be accommodated in the additional electronic component (461) or the hole (452).

[0079] Although all components constituting the embodiments of the present invention have been described above as being combined or operating in combination, the present invention is not necessarily limited to these embodiments. That is, within the scope of the purpose of the present invention, all components may be selectively combined and operated one or more times. In addition, terms such as "include," "comprise," or "have" described above, unless specifically stated to the contrary, mean that the corresponding component may be inherent, and therefore should be interpreted as including other components rather than excluding other components. All terms, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains, unless otherwise defined. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related technology, and shall not be interpreted in an ideal or excessively formal sense, unless explicitly defined in the present invention.

[0080] The above description is merely an illustrative description of the technical idea of ​​the present invention, and those skilled in the art will appreciate that various modifications and variations may be made without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are intended to illustrate rather than limit the technical idea of ​​the present invention, and the scope of the technical idea of ​​the present invention is not limited by these embodiments. The scope of protection of the present invention should be interpreted by the following claims, and all technical ideas within a scope equivalent thereto should be interpreted as being included in the scope of the rights of the present invention.

Claims

1. A first body including a hole; a lens module coupled to the above hole; and Includes a substrate module arranged within the first body, The above substrate module, A first substrate on which an image sensor is arranged facing the lens module in the optical axis direction on the upper surface; A second substrate arranged at the rear of the first substrate; and Including electronic components arranged on the back of the first substrate, A concave groove is arranged on the upper surface of the second substrate, Including a metal layer arranged in the above home, A camera module in which the lower surface of the above electronic component is in contact with the upper surface of the above metal layer.

2. In paragraph 1, A camera module in which the cross-sectional area of ​​the metal layer is larger than the cross-sectional area of ​​the electronic component.

3. In paragraph 1, The above metal layer is a camera module which is a ground area.

4. In paragraph 1, Including a third substrate arranged between the first substrate and the second substrate, The above third substrate is a camera module including a hole in which the electronic component is placed.

5. In paragraph 4, The cross-sectional area of ​​the above hole is larger than the cross-sectional area of ​​the above electronic component, A camera module whose side of the above electronic component is spaced apart from the inner surface of the above hole.

6. In paragraph 4, A camera module including a first connecting portion connecting the first substrate and the third substrate, and a second connecting portion connecting the second substrate and the third substrate.

7. In paragraph 4, A camera module in which the cross-sectional area of ​​the first substrate is larger than the cross-sectional area of ​​the second substrate.

8. In paragraph 4, A camera module in which the thickness of the third substrate is thicker than that of the first substrate and thinner than that of the second substrate.

9. In paragraph 4, A camera module in which the thickness of the above electronic component is thicker than the thickness of the third substrate.

10. In paragraph 1, A second body is coupled to the rear of the first body and includes a space in which the substrate module is placed, The above second substrate is a camera module that comes into contact with the above second body.

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