Display device and manufacturing method therefor

Abstract

This display device comprises: a glass substrate; a plurality of micro LEDs arranged on a first surface of the glass substrate; a first driving unit arranged on a second surface of the glass substrate in order to drive that the plurality of micro LEDs emit light in a row line order; and a second driving unit arranged on the second surface of the glass substrate in order to provide an image data signal through a data line connected to at least one of the plurality of micro LEDs. The plurality of micro LEDs are grouped into a plurality of groups along a row line, and each group of the plurality of groups is connected to a different data line. At least one micro LED belongs to the same column line.

Description

Display device and manufacturing method thereof

[0001] The present disclosure relates generally to a display device, and more particularly, to a display device capable of implementing a fine pitch display and a method for manufacturing the same.

[0002] A micro LED may be, or may include, an ultra-small inorganic light-emitting material that can emit light on its own without a color filter and / or backlight. For example, a micro LED may refer to an ultra-small LED that has a length that may be shorter (or smaller) than a typical light-emitting diode (LED) chip (for example, the length of a micro LED may be about one-tenth the length of a typical LED). As another example, the area of ​​a micro LED may be smaller than the area of ​​a typical LED (for example, the area of ​​a micro LED may be about one-hundredth the area of ​​a typical LED). As another example, the width, length, and height of a micro LED may be 10 to 100 micrometers (μm).

[0003] Micro LEDs can produce a variety of colors, including white, through R, G, and B micro LEDs that can emit red, green, and blue colors, respectively.

[0004] When implementing a display device using micro LEDs mounted on a PCB substrate, the pixel pitch may become relatively large, which may make it difficult to manufacture a fine-pitch display and may result in a problem of relatively high material costs required for PCB manufacturing.

[0005] According to one aspect of the present disclosure, a display device includes a glass substrate, a plurality of micro LEDs arranged on a first surface of the glass substrate, a first driving unit arranged on a second surface of the glass substrate to drive the plurality of micro LEDs to emit light in a row line order, and a second driving unit arranged on the second surface of the glass substrate to provide an image data signal through a data line connected to at least one micro LED among the plurality of micro LEDs. The plurality of micro LEDs are grouped into a plurality of groups according to the row lines, and each group of the plurality of groups is connected to a different data line. The at least one micro LED belongs to the same column line.

[0006] According to one aspect of the present disclosure, a method for manufacturing a display device includes a step of determining a first position of a plurality of micro LEDs arranged on a first surface of a glass substrate of the display device, a step of determining a second position of a first driving unit and a second driving unit arranged on a second surface of the glass substrate, a step of implementing a scan line for connecting the plurality of micro LEDs and the first driving unit using a plurality of metal wires formed on the first surface and the second surface of the glass substrate, and a step of implementing a data line for connecting the plurality of micro LEDs and the second driving unit using a plurality of metal wires formed on the first surface and the second surface of the glass substrate, respectively.

[0007] The step of implementing a data line for connecting the second driving unit includes a step in which the plurality of micro LEDs are grouped into a plurality of groups according to scan lines, and each group of the plurality of groups is connected to a different data line.

[0008] Additional aspects may be set forth in some of the following description, some of which may be obvious from the description, or some of which may be learned through practice of the embodiments presented.

[0009] Specific embodiments, other aspects, features and advantages of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings.

[0010] FIG. 1 is a block diagram showing the configuration of a display device according to various embodiments of the present disclosure.

[0011] FIG. 2 and FIG. 3 are drawings showing the configuration of a driving unit according to various embodiments of the present disclosure.

[0012] FIGS. 4 to 6 are diagrams illustrating a wiring structure of a data line according to various embodiments of the present disclosure.

[0013] FIG. 7 is a drawing illustrating a layer configuration of a glass substrate according to various embodiments of the present disclosure.

[0014] FIG. 8 is a diagram illustrating the operation of a driving unit according to various embodiments of the present disclosure.

[0015] FIGS. 9 to 11 are flowcharts illustrating a method for manufacturing a display device according to various embodiments of the present disclosure.

[0016] The following description, with reference to the accompanying drawings, is provided to facilitate a comprehensive understanding of the embodiments of the present disclosure defined by the claims and their equivalents. While various specific details are included to aid understanding, such details are intended to be exemplary only. Accordingly, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present disclosure. Furthermore, descriptions of well-known functions and structures are omitted for clarity and brevity.

[0017] In connection with the description of the drawings, similar reference numbers may be used to indicate similar or related elements.

[0018] The terms used in the embodiments of this disclosure have been selected from widely used, current terms, taking into account the functions of this disclosure. However, these terms may vary depending on the intentions of those skilled in the art, precedents, the emergence of new technologies, etc. Furthermore, in certain cases, terms may be arbitrarily selected by the applicant, and their meanings will be described in detail in the description of the relevant disclosure. Therefore, the terms used in this disclosure should not be defined simply as names of terms, but rather based on the meanings of the terms and the overall content of this disclosure.

[0019] In this specification, expressions such as “has,” “may have,” “includes,” or “may include” indicate, but are not limited to, the presence of a corresponding feature (e.g., a number, function, operation, or component such as a part), and may not exclude the presence of additional features.

[0020] In this disclosure, expressions such as “A or B,” “at least one of A and / or B,” or “one or more of A or / and B” can include all possible combinations of the listed items. For example, “A or B,” “at least one of A and B,” or “at least one of A or B” can all refer to (1) including at least one A, (2) including at least one B, or (3) including both at least one A and at least one B.

[0021] As used herein, the expressions “first,” “second,” “first,” or “second,” etc., may describe various components, regardless of order and / or importance, and are only used to distinguish one component from another, but do not limit the components.

[0022] When it is said that a component (e.g., a first component) is “operatively or communicatively coupled with / to” or “connected to” another component (e.g., a second component), it should be understood that the component may be directly coupled to the other component, or may be connected through another component (e.g., a third component).

[0023] When a component or layer is referred to as being “above,” “over,” “below,” “beneath,” “connected to,” or “joined to” another component or layer, it may be directly above, below, connected to, or joined to the other component or layer, or there may be intervening components or layers. Conversely, when a component is referred to as being “directly above,” “directly below,” “directly beneath,” “directly connected to,” or “directly joined to” another component or layer, there are no intervening components or layers.

[0024] As used herein, singular expressions may include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "consist of" are intended to indicate the presence of a feature, number, step, operation, component, part, or combination thereof described in the specification, but should be understood not to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0025] In the present disclosure, a "module" or "part" performs at least one function or operation and may be implemented as hardware or software, or as a combination of hardware and software. Furthermore, multiple "modules" or multiple "parts" may be integrated into at least one module and implemented as at least one processor (not shown), excluding any "modules" or "parts" that need to be implemented as specific hardware.

[0026] The terms “upper,” “middle,” “lower,” etc. may be replaced with terms used to describe the relative positions of components, such as “first,” “second,” “third.” The terms “first,” “second,” “third,” etc. may be used to describe various components, but if the components are not limited by the terms, a “first component” may be referred to as a “second component.” Alternatively or additionally, the terms “first,” “second,” “third,” etc. may be used to distinguish components from one another and do not limit the present disclosure. For example, the terms “first,” “second,” “third,” etc. may not necessarily have an ordering or any form of numerical meaning.

[0027] Throughout this disclosure, references to "one embodiment," "an embodiment," "an example embodiment," or similar language may indicate that a particular feature, structure, or characteristic described in connection with the indicated embodiment is included in at least one embodiment of the present solution. Thus, throughout this disclosure, references to the phrases "in one embodiment," "in an embodiment," "in an example embodiment," and similar language may, but do not necessarily, all refer to the same embodiment. The embodiments described herein are exemplary embodiments, and the present disclosure is not limited thereto and may be implemented in various other forms.

[0028] It should be understood that the specific order or hierarchy of blocks in the disclosed process / flowcharts is merely an example of a preferred approach. It should be understood that the specific order or hierarchy of blocks in the process / flowcharts may be rearranged according to design preference. Furthermore, some blocks may be combined or omitted. The appended claims present components of various blocks in a sample order and are not intended to be limited to the specific order or hierarchy presented.

[0029] Embodiments of the present disclosure may be described and explained in terms of blocks that perform the described function or functions as illustrated in the drawings. Such blocks, which may be referred to in the present disclosure as units or modules or the like, or as devices, logic, circuits, controllers, counters, comparators, generators, converters or the like, may be physically implemented by analog and / or digital circuits that include one or more of logic gates, integrated circuits, microprocessors, microcontrollers, memory circuits, passive electronic components, active electronic components, optical components, and the like.

[0030] In this disclosure, the articles "a" and "an" are intended to include one or more items, and can be used interchangeably with "one or more." When only one item is intended, the term "a" or similar language is used. For example, the term "processor" can refer to a single processor or multiple processors. When a processor is described as performing a task and the processor is referred to as performing additional tasks, the multiple tasks can be performed by either a single processor or multiple processors, or a combination of both.

[0031] Various embodiments of the present disclosure will be described in more detail with reference to the attached drawings below.

[0032] FIG. 1 is a block diagram showing the configuration of a display device according to various embodiments of the present disclosure.

[0033] The display device (100) is a device that displays video content, and may be, or include, a TV, a desktop PC, a laptop, a video wall, a large format display (LFD), a digital signage, a digital information display (DID), a projector display, a DVD (digital video disk) player, a smartphone, a tablet PC, a monitor, smart glasses, a smart watch, etc. Any device that can display an input video may be used.

[0034] The display device (100) may include a pixel array arranged in a matrix form. The pixel array may include a plurality of row lines and / or a plurality of column lines. Depending on the embodiment, the row lines may be referred to as horizontal lines, and the column lines may be referred to as vertical lines. The terms row line, horizontal line, column line, and vertical line may be used to refer to lines formed by pixels on the pixel array.

[0035] Additionally, the terms "scan line" and "data line" may be used to refer to wiring for transmitting data and / or signals to each pixel, but are not limited thereto. A scan line may be connected to a pixel belonging to a row line of a pixel array to provide a scan signal to each pixel. A data line may be connected to a pixel belonging to a column line of a pixel array to provide an image data signal to each pixel.

[0036] Each pixel of the pixel array may include three sub-pixels (e.g., red (R), green (G), and blue (B) sub-pixels). For example, a single pixel may include three types of sub-pixels, such as a red color sub-pixel (R sub-pixel) for representing red, a green color sub-pixel (G sub-pixel) for representing green, and a blue color sub-pixel (B sub-pixel) for representing blue. However, the present disclosure is not limited in this regard. For example, a pixel may include a different number of sub-pixels (e.g., four or more) and may include sub-pixels of different colors (e.g., white sub-pixels).

[0037] In the display device (100) according to various embodiments of the present disclosure, each sub-pixel may be implemented as a micro LED (Micro Light Emitting Diode). For example, the micro LED is manufactured to be ultra-small, with a size of 100 micrometers (㎛) or less, and can implement ultra-high resolution when applied to TVs of various sizes or small wearable devices (e.g., smart watches, etc.). Hereinafter, the 'sub-pixel' and the 'micro LED' may be described as having the same configuration.

[0038] Referring to FIG. 1, the display device (100) may include a glass substrate (110), a plurality of micro LEDs (120), and a driving unit (130). However, the present invention is not limited thereto, and the display device (100) may be implemented in a form in which some components are excluded, or may be implemented in a form in which other components are further included.

[0039] A plurality of micro LEDs (120) may be arranged on one surface of a glass substrate (110). For example, the plurality of micro LEDs (120) may be arranged in a matrix form including a plurality of row lines or a plurality of column lines.

[0040] The driving unit (130) is arranged on the other surface of the glass substrate (110) and may include a first driving unit (131) and a second driving unit (132). The first driving unit (131) drives the micro LEDs (120) so that the plurality of micro LEDs (120) emit light in a row-line order. The second driving unit (132) provides an image data signal through a data line connected to the plurality of micro LEDs (120).

[0041] For example, the first driving unit (131) may be arranged in the horizontal direction of the glass substrate (110) and may provide scan signals for each scan line electrically connected to a plurality of micro LEDs (120). The second driving unit (132) may be arranged in the vertical direction of the glass substrate (110) and may provide image data signals through data lines electrically connected to a plurality of micro LEDs (120).

[0042] In one embodiment, a plurality of micro LEDs (120) may be grouped into a plurality of groups according to row lines, and each group may be connected to a different data line. For example, when a plurality of micro LEDs (120) are arranged in 240 column lines and 270 row lines, the plurality of micro LEDs (120) may be grouped into three groups by grouping 90 row lines in each group. That is, the plurality of micro LEDs (120) may be grouped such that the first to the 90th row lines among the 270 row lines are grouped as a first group, the 91st to the 180th row lines are grouped as a second group, and the 181st to the 270th row lines are grouped as a third group. Alternatively, the plurality of micro LEDs (120) may be grouped into two groups, with the first row to the 135th row line as a first group and the 136th row line to the 270th row line as a second group. However, the present invention is not limited thereto, and the plurality of micro LEDs (120) may be grouped into various groups in consideration of the load of the driving unit (130) or the wiring formed on the glass substrate (110). For example, the plurality of micro LEDs (120) may be arranged in different numbers of column lines and / or row lines, may be grouped into more groups (for example, four or more), and the groups may include different numbers of rows.

[0043] Additionally, the plurality of micro LEDs (120) may be connected to different data lines for each group according to the column lines. For example, if the plurality of micro LEDs (120) are arranged in 240 column lines and 270 row lines, and the 270 row lines are grouped into 3 groups, the total number of data lines connected to the plurality of micro LEDs (120) may be 720. However, the present disclosure is not limited thereto.

[0044] The second driving unit (132) can provide the same image data signal to the data lines connected to the micro LEDs (120) belonging to the same column line among the plurality of micro LEDs (120). For example, when the plurality of micro LEDs (120) are grouped into three groups to form 720 data lines, the second driving unit (132) can provide the image data signal to the plurality of micro LEDs (120) through the 720 channels. The first group of the first column line among the plurality of micro LEDs (120) can be connected to the first channel of the second driving unit (132) through the first data line, the second group of the first column line can be connected to the second channel of the second driving unit (132) through the second data line, and the third group of the first column line can be connected to the third channel of the second driving unit (132) through the third data line. That is, the second driving unit (132) can provide the same image data signal to the micro LEDs (120) belonging to the first column line among the plurality of micro LEDs (120) through the first channel, the second channel, and the third channel.

[0045] The operation of grouping multiple micro LEDs (120) into multiple groups and connecting data lines is described through FIG. 4.

[0046] FIGS. 2 and 3 are diagrams showing the configuration of a driving unit according to various embodiments of the present disclosure. FIGS. 2 and 3 show the configuration of a first driving unit and a second driving unit arranged on the other surface of a glass substrate (110). For example, FIG. 2 may show the configuration of a first driving unit (210) and a plurality of second driving units (e.g., an upper second driving unit (221) and a lower second driving unit (222)) arranged on the other surface of a glass substrate (110) when the display device (100) is implemented with a resolution of 120x160. The first driving unit (210) and the plurality of second driving units (221, 222) of FIG. 2 may include the first driving unit (131) and the second driving unit (132) described above with reference to FIG. 1, respectively, or may be similar in many aspects, and may include additional functions not mentioned above. Consequently, redundant descriptions of the first driving unit (210) and the plurality of second driving units (221, 222) described above with reference to FIG. 1 may be omitted for brevity.

[0047] In one embodiment, the display device (100) may be implemented to have a resolution of 120x160. In the resolution of 120x160, 120 may represent the number of column lines for the plurality of micro LEDs (120) arranged on one surface of the glass substrate (110), and 160 may represent the number of row lines for the plurality of micro LEDs (120). However, the present disclosure is not limited thereto, and the display device (100) may be implemented to have various other resolutions, or may be configured to have various other numbers of column lines and / or row lines.

[0048] Referring to FIG. 2, a first driving unit (210) may be disposed in the horizontal direction of a glass substrate (110), and upper and lower second driving units (221, 222) may be disposed in the vertical direction of the glass substrate (110). The first driving unit (210) may be electrically connected to a plurality of micro LEDs (120) arranged on one surface of the glass substrate (110), and may provide scan signals to the plurality of micro LEDs (120) in row line order. For example, when the number of row lines for the plurality of micro LEDs (120) is 160, the first driving unit (210) may sequentially provide scan signals starting from the plurality of micro LEDs (120) included in the first row line to the 160th row line.

[0049] In FIG. 2, the upper second driving unit (221) may be arranged on the upper side of the glass substrate (110), and the lower second driving unit (222) may be arranged on the lower side of the glass substrate (110). For example, when there are 160 row lines for the plurality of micro LEDs (120), 80 row lines arranged on the upper side may be electrically connected to the upper second driving unit (221), and 80 row lines arranged on the lower side may be electrically connected to the lower second driving unit (222). In one embodiment, the wiring formed on one side of the glass substrate (110) and the wiring formed on the other side for connecting the plurality of micro LEDs (120) to the first driving unit (210) and the upper and lower second driving units (221, 222) may be connected through a TGV penetrating the glass substrate (110).

[0050] FIG. 3 illustrates the configuration of the first driving unit and the second driving unit arranged on the other side of the glass substrate (110) when the display device (100) is implemented with a resolution of 240x160, which is higher than the resolution of the display device illustrated in FIG. 2. At the resolution of 240x160, 240 may represent the number of column lines for a plurality of micro LEDs (120) arranged on one side of the glass substrate (110), and 160 may represent the number of row lines for the plurality of micro LEDs (120).

[0051] Referring to FIG. 3, two first driving units (e.g., a left first driving unit (311), a right first driving unit (312)) may be arranged in the horizontal direction of the glass substrate (110), and a plurality of second driving units (e.g., an upper left second driving unit (321), an upper right second driving unit (322), a lower left second driving unit (323), a lower right second driving unit (324)) may be arranged in the vertical direction of the glass substrate (110). The left and right first driving units (311, 312) and the plurality of second driving units (321, 322, 323, 324) of FIG. 3 may include or be similar in many respects to the first driving units (131, 210) and the second driving units (132, 221, 222) described above with reference to FIGS. 1 and 2, respectively, and may include additional functions not mentioned above. Therefore, redundant descriptions of the left and right first driving units (311, 312) and the plurality of second driving units (321, 322, 323, 324) described above with reference to FIGS. 1 and 2 may be omitted for the sake of brevity.

[0052] In one embodiment, the left first driving unit (311) may be electrically connected to the micro LEDs (120) of the first column line to the 120th column line among the plurality of micro LEDs (120) arranged on one surface of the glass substrate (110). The right first driving unit (312) may be electrically connected to the micro LEDs (120) of the 121st column line to the 240th column line among the plurality of micro LEDs (120). In addition, the left and right first driving units (311, 312) may sequentially provide scan signals from the first row line to the 160th row line among the plurality of micro LEDs (120).

[0053] In FIG. 3, the upper left and upper right second driving units (321, 322) may be arranged on the upper side of the glass substrate (110), and the lower left and lower right second driving units (323, 324) may be arranged on the lower side of the glass substrate (110). For example, when a plurality of micro LEDs (120) are arranged at a resolution of 240x160, the plurality of micro LEDs (120) arranged from the first row line to the 80th row line and from the first column line to the 120th column line may be electrically connected to the upper left second driving unit (321). Among the plurality of micro LEDs (120), the plurality of micro LEDs (120) arranged from the first row line to the 80th row line and from the 121st column line to the 240th column line may be electrically connected to the upper right second driving unit (322). Among the plurality of micro LEDs (120), the plurality of micro LEDs (120) arranged from the 81st row line to the 160th row line and from the 1st column line to the 120th column line may be electrically connected to the second driving unit (323) at the lower left. Among the plurality of micro LEDs (120), the plurality of micro LEDs (120) arranged from the 81st row line to the 160th row line and from the 121st column line to the 240th column line may be electrically connected to the second driving unit (324) at the lower right.

[0054] In one embodiment, the wires for connecting the plurality of micro LEDs (120) to the left and right first driving units (311, 312) and the upper and lower second driving units (321, 322, 323, 324) may be connected through TGVs penetrating the glass substrate (110).

[0055] In this way, the display device (100) according to the present disclosure can implement a bezel-less display by arranging a plurality of micro LEDs (120) on one surface of a glass substrate (110), arranging a driving unit on the other surface of the glass substrate (110), and connecting the wiring formed on the one surface and the wiring formed on the other surface through a TGV penetrating the glass substrate (110). In addition, by forming the wiring through the one surface and the other surface of the glass substrate (110), a plurality of wirings can be formed without using a high-level layer.

[0056] FIGS. 4 to 6 are diagrams illustrating a wiring structure of a data line according to various embodiments of the present disclosure. For example, FIG. 4 illustrates a display device (100) having a resolution of 480x270. In the resolution of 480x270, 480 may represent the number of column lines for a plurality of micro LEDs (120) arranged on one surface of a glass substrate (110), and 270 may represent the number of row lines for the plurality of micro LEDs (120). In addition, FIGS. 5 and 6 may be diagrams illustrating data lines for grouping a plurality of micro LEDs (120) and connecting them to a second driving unit for each group according to various embodiments of the present disclosure.

[0057] As described above in FIG. 1, a plurality of micro LEDs (120) may be arranged on one surface of the glass substrate (110), and the driving unit may be arranged on the other surface of the glass substrate (110). For example, when a plurality of micro LEDs (120) are arranged on the upper surface of the glass substrate, the driving unit may be arranged on the lower surface of the glass substrate (110). However, in FIG. 4, for convenience of explanation, a plurality of micro LEDs (120) and a plurality of second driving units (e.g., an upper left second driving unit (411), an upper middle second driving unit (412), an upper right second driving unit (413), a lower left second driving unit (414), a lower middle second driving unit (415), and a lower right second driving unit (416)) are illustrated and described on the same plane. The plurality of second driving units (411 to 416) of FIG. 4 may include or be similar in many respects to the second driving units (132, 221, 222, and 321 to 324) described above with reference to FIGS. 1 to 3, and may include additional functions not mentioned above. Therefore, a repetitive description of the plurality of second driving units (411 to 416) described above with reference to FIGS. 1 to 3 may be omitted for the sake of brevity. In addition, the first driving unit in FIG. 4 may be omitted for the sake of convenience of explanation.

[0058] According to FIG. 4, a plurality of second driving units (411 to 416) may be arranged in the vertical direction of the glass substrate (110). Upper second driving units (411, 412, 413) may be arranged on the upper side of the glass substrate (110), and lower second driving units (414, 415, 416) may be arranged on the lower side of the glass substrate (110).

[0059] For example, if the display device (100) is implemented with a resolution of 480x270, the number of row lines for the plurality of micro LEDs (120) arranged on one surface of the glass substrate (110) may be 270. The first driving unit may sequentially provide a scan signal for each row line starting from the first row line (R1) among the plurality of micro LEDs (120) to the 270th row line (R270).

[0060] In one embodiment, the plurality of second driving units (411 to 416) may be connected to micro LEDs (120) belonging to 135 row lines among the plurality of micro LEDs (120). For example, the upper second driving units (411, 412, 413) disposed on the upper side of the glass substrate (110) may be connected to micro LEDs (120) belonging to the first row line (R1) to the 135th row line (R135) among the plurality of micro LEDs (120). The lower second driving units (414, 415, 416) disposed on the lower side of the glass substrate (110) may be connected to micro LEDs (120) belonging to the 136th row line (R136) to the 270th row line (R270) among the plurality of micro LEDs (120). That is, the 270 row lines can be grouped into two groups each having 135 row lines, and the upper second driving units (411 to 413) can be connected to one group and the lower second driving units (414 to 416) can be connected to the other group. However, the present disclosure is not limited thereto, and the display device (100) can have various other numbers of row lines, which can be grouped into various other numbers of groups (e.g., three or more), or each group can have the same or different numbers of row lines.

[0061] In addition, among the plurality of micro LEDs (120), the micro LEDs (120) belonging to the first row line (R1) to the 45th row line (R45) may be grouped into an upper first group and connected to upper second driving units (411, 412, 413), respectively. Among the plurality of micro LEDs (120), the micro LEDs (120) belonging to the 46th row line (R46) to the 90th row line (R90) may be grouped into an upper second group, and the micro LEDs (120) belonging to the 91st row line (R91) to the 135th row line (R135) may be grouped into an upper third group and connected to upper second driving units (411, 412, 413), respectively.

[0062] In addition, among the plurality of micro LEDs (120), the micro LEDs (120) belonging to the 136th low line (R136) to the 180th low line (R180) may be grouped into a lower first group and connected to the lower second driving unit (414, 415, 416), respectively. Among the plurality of micro LEDs (120), the micro LEDs (120) belonging to the 181st low line (R181) to the 225th low line (R225) may be grouped into a lower second group, and among the plurality of micro LEDs (120), the micro LEDs (120) belonging to the 226th low line (R226) to the 270th low line (R270) may be grouped into a lower third group and connected to the lower second driving unit (414, 415, 416), respectively.

[0063] The same image data signal may be provided to data lines connected to micro LEDs (120) belonging to the same column line among a plurality of micro LEDs (120). For example, in FIG. 4, the same image data signal may be provided to a first data line (421) connected to a first channel (Ch1) of the upper left second driving unit (411), a second data line (422) connected to a second channel (Ch2), a third data line (423) connected to a third channel (Ch3), a 1440 data line (431) connected to a 1440th channel (Ch1440) of the lower left second driving unit (414), a 1439th data line (432) connected to a 1439th channel (Ch1439), and a 1438th data line (433) connected to a 1438th channel (Ch1438).

[0064] FIG. 5 is a diagram illustrating a plurality of micro LEDs (120) connected to a second driving unit (510). That is, FIG. 5 is a diagram illustrating a wiring structure for a data line when a plurality of micro LEDs (120) are grouped into three groups. The second driving unit (510) of FIG. 5 may include or be similar in many aspects to the second driving units (132, 221, 222, 321 to 324, 411 to 416) described above with reference to FIGS. 1 to 4, and may include additional functions not mentioned above. Therefore, a redundant description of the second driving unit (510) described above with reference to FIGS. 1 to 4 may be omitted for the sake of brevity.

[0065] Referring to FIG. 5, a plurality of micro LEDs (120) arranged on a glass substrate (110) can be grouped into three groups. For example, when a plurality of micro LEDs (120) are arranged in 90 row lines, they can be grouped into three groups by classifying them by 30 row lines. A first group (520) may include micro LEDs (120) belonging to the first row line (SCAN1) to the 30th row line (SCAN30) among the plurality of micro LEDs (120). A second group (530) may include micro LEDs (120) belonging to the 31st row line (SCAN31) to the 60th row line (SCAN60) among the plurality of micro LEDs (120). The third group (540) may include micro LEDs (120) belonging to the 61st row line (SCAN61) to the 90th row line (SCAN90) among the plurality of micro LEDs (120). In addition, the second driving unit (510) may form different data lines for each group to provide image data signals to the plurality of micro LEDs (120).

[0066] In Fig. 5, the micro LED (120) belonging to the first column line can be implemented as an R sub-pixel (Red color sub-pixel), the micro LED (120) belonging to the second column line can be implemented as a G sub-pixel (Green color sub-pixel), and the micro LED (120) belonging to the third column line can be implemented as a B sub-pixel (Blue color sub-pixel). Thereafter, the same order can be repeated along the vertical direction.

[0067] As a result, when examining each pixel signal based on the data line to which the image data signal is provided from the second driving unit (510), the image data signal provided to the data line may be applied in the order of RRRGGGBBB. However, the present disclosure is not limited thereto, and the image data signal may be applied in various orders depending on the configuration and / or arrangement of the sub-pixels of the plurality of micro LEDs (120).

[0068] The first driving unit can sequentially drive the plurality of micro LEDs (120) from the first row line (SCAN1) to the last row line (SCAN90) so that the plurality of micro LEDs (120) emit light in the row line order. The second driving unit (510) can provide an image data signal to the plurality of micro LEDs (120) for each column line. For example, when the first driving unit applies a driving voltage to the first row line (SCAN1) to emit light on the first row line (SCAN1), the second driving unit (510) can provide an image data signal corresponding to the first row line (SCAN1) to the plurality of micro LEDs (120) for each column line. When the second driving unit (510) provides an image data signal to the third column line, the B sub-pixel belonging to the third column line of the first row line (SCAN1) among the plurality of micro LEDs (120) can emit light.

[0069] In one embodiment, the second driving unit (510) can provide the same image data signal to a data line (541) connected to the seventh channel, a data line (542) connected to the eighth channel, and a data line (543) connected to the ninth channel.

[0070] FIG. 6 is a diagram illustrating a wiring structure for a data line when a plurality of micro LEDs (120) are grouped into two groups.

[0071] Referring to FIG. 6, a plurality of micro LEDs (120) arranged on a glass substrate (110) can be grouped into two groups. For example, when a plurality of micro LEDs (120) are arranged in 90 row lines, they can be grouped into two groups by classifying them by 45 row lines. The first group (620) can include micro LEDs (120) belonging to the first row line (SCAN1) to the 45th row line (SCAN45) among the plurality of micro LEDs (120). The second group (630) can include micro LEDs (120) belonging to the 46th row line (SCAN46) to the 90th row line (SCAN90) among the plurality of micro LEDs (120).

[0072] In Fig. 6, the micro LED (120) belonging to the first column line can be implemented as an R sub-pixel, the micro LED (120) belonging to the second column line can be implemented as a G sub-pixel, and the micro LED (120) belonging to the third column line can be implemented as a B sub-pixel. Thereafter, the same order can be repeated along the vertical direction. Consequently, when examining each pixel signal based on the data line to which the image data signal is provided from the second driver (610), the image data signal provided to the data line can be applied in the order of RRGGBB.

[0073] As with FIG. 5, the second driving unit (610) can provide image data signals to a plurality of micro LEDs (120) for each column line. The second driving unit (610) of FIG. 6 may include or be similar in many respects to the second driving units (132, 221, 222, 321 to 324, 411 to 416, 510) described above with reference to FIGS. 1 to 5, and may include additional functions not mentioned above. Consequently, a redundant description of the second driving unit (610) described above with reference to FIGS. 1 to 5 may be omitted for the sake of brevity.

[0074] For example, when the first driving unit applies a driving voltage to the second row line (SCAN2) to cause the second row line (SCAN2) to emit light, the second driving unit (610) can provide an image data signal corresponding to the second row line (SCAN2) to the plurality of micro LEDs (120) for each column line. When the second driving unit (610) provides an image data signal to the fifth column line, the G sub-pixel belonging to the fifth column line of the second row line (SCAN2) among the plurality of micro LEDs (120) can emit light. In one embodiment, the second driving unit (610) can provide the same image data signal to the data line (641) connected to the 9th channel and the data line (642) connected to the 10th channel.

[0075] FIG. 7 is a diagram illustrating a layer configuration of a glass substrate according to various embodiments of the present disclosure. FIG. 7 illustrates each component illustrated in FIG. 1 and a wiring layer structure for connecting each component. In FIG. 7, the display device (100) is described based on an embodiment implemented using a PM (Passive Matrix) driving method. However, the present disclosure is not limited thereto, and the display device may be implemented using various other methods without departing from the scope of the present disclosure. If the display device (100) is implemented using an AM (Active Matrix) driving method, the glass substrate may further include a layer for implementing a thin film transistor (TFT).

[0076] According to FIG. 7, a third metal wire (711) for electrically connecting the driving unit (130) and the micro LED (120) may be formed on one surface of the glass substrate (110). The third metal wire (711) may be formed to transmit a scan signal provided from the first driving unit (131) to the micro LED (120). A fourth metal wire (721) for electrically connecting the first driving unit (131) and the micro LED (120) may be formed on the other surface of the glass substrate (110). The fourth metal wire (721) may be formed to transmit a scan signal provided from the first driving unit (131) to the micro LED (120). That is, the third metal wire (711) and the fourth metal wire (721) may form a scan line for electrically connecting the first driving unit (131) and a plurality of micro LEDs (120). In one embodiment, a third metal wire (711) formed on one surface of a glass substrate (110) and a fourth metal wire (721) formed on the other surface of the glass substrate (110) can be connected using a TGV (730) penetrating the glass substrate (110).

[0077] In addition, referring to FIG. 7, a second metal wiring (712) for electrically connecting the driving unit (130) and the micro LED (120) may be formed on one surface of the glass substrate (110). The second metal wiring (712) may be formed to transmit an image data signal provided from the second driving unit (132) to the micro LED (120). The second metal wiring (712) may be implemented in a structure laminated on a layer constituting the third metal wiring (711). In one embodiment, a second insulating layer (713) may be formed between the third metal wiring (711) and the second metal wiring (712) to insulate the third metal wiring (711) and the second metal wiring (712).

[0078] A fifth metal wire (722) for electrically connecting the driving unit (130) and the micro LED (120) may be formed on the other surface of the glass substrate (110). The fifth metal wire (722) may be formed to transmit an image data signal provided from the second driving unit (132) to the micro LED (120). That is, the second metal wire (712) and the fifth metal wire (722) may form a data line for electrically connecting the second driving unit (132) and a plurality of micro LEDs (120). The fifth metal wire (722) may be implemented in a structure laminated on a layer constituting the fourth metal wire (721).

[0079] In one embodiment, a third insulating layer (723) may be formed between the fourth metal wiring (721) and the fifth metal wiring (722) to insulate the fourth metal wiring (721) and the fifth metal wiring (722). In addition, the second metal wiring (712) formed on one surface of the glass substrate (110) and the fifth metal wiring (722) formed on the other surface of the glass substrate (110) may be connected using a TGV (730) penetrating the glass substrate (110).

[0080] A plurality of first connection pads and third connection pads electrically connected to the micro LED (120) may be formed on one surface of the glass substrate (110). The first connection pads may be implemented to electrically connect the micro LED (120) and the second metal wiring (712), respectively. The third connection pads may be implemented to electrically connect the micro LED (120) and the third metal wiring (711), respectively. The first connection pads and the third connection pads may be implemented using a first metal layer (714). In addition, the first metal layer (714) may be implemented in a structure laminated on a layer constituting the second metal wiring (712). In one embodiment, a first insulating layer (715) may be formed between the first metal layer (714) and the second metal wiring (712) to insulate the first metal layer (714) and the second metal wiring (712).

[0081] When connecting the first metal layer (714) and the second metal wiring (712) to form a wiring path between the micro LED (120) and the second metal wiring (712), the first metal layer (714) and the second metal wiring (712) can be connected using a via penetrating the first insulating layer (715).

[0082] In addition, when connecting the first metal layer (714) and the third metal wiring (711) to form a wiring path between the micro LED (120) and the third metal wiring (711), the first metal layer (714) and the third metal wiring (711) may be connected using a via penetrating the first insulating layer (715) and the second insulating layer (713). In one embodiment, a second metal pattern may be formed between the first insulating layer (715) and the second insulating layer (713) to facilitate the connection between the first metal layer (714) and the third metal wiring (711).

[0083] A plurality of second connection pads and a fourth connection pad electrically connected to the driving unit (130) may be formed on the other surface of the glass substrate (110). The second connection pads may be implemented to electrically connect the second driving unit (132) and the fifth metal wiring (722), respectively. The fourth connection pad may be implemented to electrically connect the first driving unit (131) and the fourth metal wiring (721), respectively. The second connection pads and the fourth connection pads may be implemented using a sixth metal layer (724). In addition, the sixth metal layer (724) may be implemented in a structure laminated on a layer constituting the fifth metal wiring (722). In one embodiment, a fourth insulating layer (725) may be formed between the sixth metal layer (724) and the fifth metal wiring (722) to insulate the sixth metal layer (724) and the fifth metal wiring (722).

[0084] When connecting the sixth metal layer (724) and the fifth metal wiring (722) to form a wiring path between the driving unit (130) and the fifth metal wiring (722), the sixth metal layer (724) and the fifth metal wiring (722) can be connected using a via penetrating the fourth insulating layer (725).

[0085] In addition, when connecting the sixth metal layer (724) and the fourth metal wiring (721) to form a wiring path between the driving unit (130) and the fourth metal wiring (721), the sixth metal layer (724) and the fourth metal wiring (721) may be connected using a via penetrating the third insulating layer (723) and the fourth insulating layer (725). In one embodiment, a fifth metal pattern may be formed between the third insulating layer (723) and the fourth insulating layer (725) to facilitate connection between the sixth metal layer (724) and the fourth metal wiring (721).

[0086] A BM (Black Matrix) (716) may be formed on one surface of the glass substrate (110). For example, the BM (Black Matrix) (716) may be implemented in a structure laminated on the first insulating layer (715) or the first metal layer (714).

[0087] The BM (Black Matrix) (716) can represent a black area that distinguishes between RGB (red, green, blue) subpixels in a display. The BM can be formed before arranging the micro LEDs for the RGB subpixels and can act as a partition that distinguishes each subpixel area. In addition, the BM can prevent light leakage from the LED backlight, prevent color mixing of the RGB subpixels, and prevent an increase in leakage current of the TFT (thin film transistor) due to an external light source. The BM can be formed through a photolithography process on a glass substrate before arranging the micro LEDs. Once the BMs are formed, the micro LEDs for the RGB subpixels can be arranged between the formed BMs.

[0088] The plurality of second connection pads and the plurality of fourth connection pads may be electrically connected to the driving unit (130) via FOG (Film On Glass) wiring. The FOG method may refer to a technology that simultaneously implements mechanical connection and electrical conductivity (e.g., for a substantially similar time) by bonding glass and a flexible circuit board at a specific temperature, pressure, and / or time. The driving unit (130) may be electrically connected to the second connection pad and the fourth connection pad via wiring implemented as a film.

[0089] Meanwhile, in FIG. 7, the second metal wiring (712) and the fifth metal wiring (722) are used as wiring for implementing a data line, and the third metal wiring (711) and the fourth metal wiring (721) are used as wiring for implementing a scan line, but this is not limited to this, and may be implemented through various stacking orders and wiring structures. For example, the second metal wiring (712) and the fifth metal wiring (722) may be used as wiring for implementing a scan line, and the third metal wiring (711) and the fourth metal wiring (721) may be used as wiring for implementing a data line.

[0090] FIG. 8 is a diagram illustrating the operation of a driving unit according to various embodiments of the present disclosure.

[0091] When the display device (100) is implemented with a PM (passive matrix) driving method, image data information can be driven and displayed in sub-frame units. For example, when the timing controller provides image data information to the driving unit (820) in frame units, the driving unit (820) can directly control the image data information in sub-frame units. In one embodiment, when a frame memory is included in the driving unit (820), a lot of power is consumed and heat may be generated in the driving unit (820) in the process of converting the image data information in frame units stored in the frame memory into image data information in sub-frame units. In addition, excessive heat generated in the driving unit may potentially prevent the display device (100) from implementing a high-luminance display.

[0092] The display device (100) according to various embodiments of the present disclosure can potentially reduce the load of the driving unit (130) and reduce the heat generation of the driving unit (130) by having the timing controller (810) directly process (control) the driving of sub-frame units for image data information, compared to related display devices.

[0093] Referring to FIG. 8, the display device (100) may further include a timing controller (810) for providing a scan signal and an image data signal to a driver integrated circuit (IC) (820) so that a plurality of micro LEDs (120) emit light in a row-line order based on an image data signal. The timing controller (810) may include a frame memory (811) and a timing control unit (812).

[0094] The frame memory (811) is a configuration for storing image data information input to the display device (100). The frame memory (811) may be implemented in the form of a memory embedded in the timing controller (810). For example, the frame memory (811) may be implemented as at least one of a volatile memory (e.g., dynamic RAM (DRAM), static RAM (SRAM), synchronous dynamic RAM (SDRAM), etc.), a non-volatile memory (e.g., one time programmable ROM (OTPROM), programmable ROM (PROM), erasable and programmable ROM (EPROM), electrically erasable and programmable ROM (EEPROM), mask ROM, flash ROM, flash memory (e.g., NAND flash or NOR flash), a hard drive, or a solid state drive (SSD)).

[0095] The timing control unit (812) can convert the image data information in units of frames stored in the frame memory (811) into image data information in units of sub-frames and output the converted information. For example, the timing control unit (812) can compare the image data information in units of frames stored in the frame memory (811) according to preset conditions and convert the image data information into image data information in units of sub-frames.

[0096] The driving unit (820) may include an interface (821), a line memory (822), and an output buffer (823). The interface (821) is configured to receive sub-frame unit image data information provided from the timing control unit (812). The interface (821) may be implemented as an interface that operates at a relatively high speed. For example, the interface (821) may receive sub-frame unit image data information from the timing control unit (812) at a transmission speed of several gigabits per second.

[0097] When the frame memory is included in the driving unit (820), the driving unit (820) can receive image data information in units of frames from the timing controller, and thus can receive data through a relatively low-speed interface such as LVDS or SPI. In one embodiment, the driving unit (820) can receive image data information in units of frames through an interface that operates in units of 120 Hz and store the received image data information in the memory.

[0098] However, if the frame memory (811) is included in the timing controller (810), the timing controller (810) can convert the image data information in units of frames stored in the frame memory (811) into image data information in units of sub-frames and transmit the data in units of sub-frames to the driving unit (820). Therefore, since the interface (821) of the driving unit (820) must receive data in units of sub-frames, relatively high-speed operation may be required compared to when receiving data in units of frames.

[0099] The line memory (822) is configured to convert and store sub-frame unit image data information input from the timing controller (810) into line unit image data information. For example, the line memory (822) can store sub-frame unit image data information as scan line unit image data information for providing to a plurality of micro LEDs (120).

[0100] The output buffer (823) is configured to convert line-by-line image data information provided from the line memory (822) into an image data signal and output it. The signal output through the output buffer (823) can be provided to a plurality of micro LEDs (120).

[0101] The number and arrangement of components of the driving unit (820) illustrated in FIG. 9 are provided as examples. In practice, there may be additional, fewer, different, or differently arranged components than those illustrated in FIG. 9. Furthermore, two or more of the components illustrated in FIG. 9 may be implemented within a single component, or a single component illustrated in FIG. 9 may be implemented as multiple distributed components. Alternatively or additionally, a set of one or more components illustrated in FIG. 9 may be integrated with one another, or implemented as an integrated circuit, software, and / or a combination of circuits and software.

[0102] FIGS. 9 to 11 are flowcharts illustrating a method for manufacturing a display device according to various embodiments of the present disclosure.

[0103] According to FIG. 9, the positions of a plurality of micro LEDs arranged on one surface of a glass substrate can be determined (S910). In addition, the positions of a first driving unit and a second driving unit arranged on the other surface of the glass substrate can be determined (S920). Depending on the positions of the plurality of micro LEDs, the first driving unit, and the second driving unit arranged on the glass substrate, wiring for implementing scan lines and data lines can be determined. In addition, depending on the positions of the plurality of micro LEDs, the first driving unit, and the second driving unit arranged on the glass substrate, the positions of the connection pads can be determined.

[0104] Once the positions of the plurality of micro LEDs and the first driving unit are determined on the glass substrate, scan lines for connecting the plurality of micro LEDs and the first driving unit are implemented using a plurality of metal wires formed on one surface and the other surface of the glass substrate, respectively (S930). In one embodiment, the metal wires formed on one surface of the glass substrate and the metal wires formed on the other surface of the glass substrate may be connected via a TGV penetrating the glass substrate.

[0105] In addition, when the positions of the plurality of micro LEDs and the second driver are determined on the glass substrate, data lines for connecting the plurality of micro LEDs and the second driver are implemented using a plurality of metal wires formed on one surface and the other surface of the glass substrate, respectively (S940). In one embodiment, the metal wires formed on one surface of the glass substrate and the metal wires formed on the other surface of the glass substrate may be connected through a TGV penetrating the glass substrate. The metal wires may be formed so that the plurality of micro LEDs and the second driver are grouped into a plurality of groups according to scan lines and each group is connected to a different data line.

[0106] FIG. 10 is a drawing illustrating a method for implementing a data line for connecting a plurality of micro LEDs and a second driving unit by forming a plurality of metal wires on one side and the other side of a glass substrate.

[0107] According to FIG. 10, a second metal wiring may be formed on one surface of a glass substrate to connect a plurality of micro LEDs and a second driving unit (S1010). For example, the second metal wiring may be arranged in a vertical direction on one surface of the glass substrate.

[0108] A fifth metal wire for connecting a plurality of micro LEDs and a second driving unit may be formed on the other side of the glass substrate (S1020). For example, when a plurality of micro LEDs and a second driving unit are arranged as in FIG. 2 or FIG. 3, a second metal wire for implementing a data line in a vertical direction may be formed on one side of the glass substrate, and a fifth metal wire for connecting the second metal wire and each channel of the second driving unit may be formed on the other side of the glass substrate.

[0109] Additionally, the second metal wire and the fifth metal wire may be connected through a TGV formed by penetrating the glass substrate (S1030). For example, the second metal wire formed on one side of the glass substrate and the fifth metal wire formed on the other side of the glass substrate may be electrically connected through a TGV at the intersection where they intersect.

[0110] In one embodiment, a first connection pad electrically connected to each of a plurality of micro LEDs may be formed on one surface of a glass substrate. The first connection pad may be formed using a first metal layer on one surface of the glass substrate. The first connection pad may be formed to connect the micro LEDs and the second driving unit. For example, the first connection pad may electrically connect each micro LED to the second metal wire. In one embodiment, a via may be formed between the first metal layer and the second metal wire to electrically connect the first connection pad and the second metal wire, respectively. The via may be formed by penetrating an insulating layer between the first metal layer and the second metal wire.

[0111] A second connection pad, electrically connected to a second driving unit, may be formed on the other surface of the glass substrate. The second connection pad may be formed on the other surface of the glass substrate using a sixth metal layer. The second connection pad may be formed to electrically connect the second driving unit and the fifth metal wire. In one embodiment, a via may be formed between the sixth metal layer and the fifth metal wire to electrically connect the second connection pad and the fifth metal wire, respectively. The via may be formed by penetrating an insulating layer between the sixth metal layer and the fifth metal wire. The second connection pad may be electrically connected to the second driving unit through a FOG (Film On Glass) wire.

[0112] FIG. 11 is a drawing illustrating a method for implementing a scan line for connecting a plurality of micro LEDs and a first driving unit by forming a plurality of metal wires on one side and the other side of a glass substrate.

[0113] According to FIG. 11, a third metal wiring may be formed on one surface of a glass substrate to connect a plurality of micro LEDs and a first driving unit (S1110). For example, the third metal wiring may be arranged in a horizontal direction on one surface of the glass substrate.

[0114] A fourth metal wire may be formed on the other side of the glass substrate to connect a plurality of micro LEDs and the first driving unit (S1120). For example, when a plurality of micro LEDs and the first driving unit are arranged as in FIG. 2 or FIG. 3, a third metal wire may be formed on one side of the glass substrate to implement a scan line in a horizontal direction, and a fourth metal wire may be formed on the other side of the glass substrate to connect the third metal wire and each scan terminal of the first driving unit.

[0115] Additionally, the third metal wire and the fourth metal wire can be connected through a TGV formed by penetrating the glass substrate (S1130). The third metal wire formed on one side of the glass substrate and the fourth metal wire formed on the other side of the glass substrate can be electrically connected through the TGV at the intersection where they intersect.

[0116] In one embodiment, a third connection pad, each electrically connected to a plurality of micro LEDs, may be formed on one surface of a glass substrate. The third connection pad may be formed on one surface of the glass substrate using a first metal layer. The first connection pad and the third connection pad may be connected to the anode and cathode of each micro LED.

[0117] A third connection pad may be formed to connect the micro LED and the first driver. For example, the third connection pad may electrically connect each micro LED and the third metal wire. In one embodiment, a via may be formed between the third connection pad and the third metal wire to electrically connect the third connection pad and the third metal wire, respectively. The via may be formed by penetrating an insulating layer between the first metal layer and the third metal wire. In some embodiments, a second metal pattern may be formed between the first metal layer and the third metal wire, and a via may be formed that penetrates an insulating layer between the first metal layer and the second metal pattern and an insulating layer between the second metal pattern and the third metal wire.

[0118] A fourth connection pad, electrically connected to each of the first driving unit and the fourth metal wire, may be formed on the other surface of the glass substrate. The fourth connection pad may be formed using a sixth metal layer on the other surface of the glass substrate. The fourth connection pad may be formed to electrically connect the first driving unit and the fourth metal wire. In one embodiment, a via may be formed between the fourth connection pad and the fourth metal wire to electrically connect the fourth connection pad and the fourth metal wire, respectively. The via may be formed by penetrating an insulating layer between the sixth metal layer and the fourth metal wire. The fourth connection pad may be electrically connected to the first driving unit through a FOG (Film On Glass) wire.

[0119] In this way, the display device and the manufacturing method thereof according to various embodiments of the present disclosure can potentially reduce the manufacturing cost of the display device and implement a fine-pitch display by forming wiring using a low-layer metal layer on a glass substrate. In addition, the display device and the manufacturing method thereof according to various embodiments of the present disclosure can potentially reduce the load of the driving unit for driving the plurality of micro LEDs by grouping a plurality of micro LEDs into a plurality of groups according to row lines and connecting them to different data lines, and the driving unit provides image data signals based on the grouped data lines.

[0120] According to an embodiment of the present disclosure, the various embodiments described above can be implemented as software including instructions stored in a storage medium (e.g., machine-readable storage media) that can be read by a machine (e.g., a computer). The device is a device that can call instructions stored from the storage medium and operate according to the called instructions, and may include a display device according to the disclosed embodiments. When an instruction is executed by a processor, the processor can perform a function corresponding to the instruction directly or under the control of the processor by using other components. The instruction may include code generated or executed by a compiler or interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' means that the storage medium does not contain a signal and is tangible, but does not distinguish between data being stored semi-permanently or temporarily in the storage medium.

[0121] In addition, according to various embodiments of the present disclosure, the method described above may be provided as included in a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be provided in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or an application store (e.g., Play Store). TM ) may be distributed online. In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a storage medium such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0122] In addition, each of the components (e.g., modules or programs) according to the various embodiments described above may be composed of a single or multiple entities, and some of the corresponding sub-components described above may be omitted, or other sub-components may be further included in various embodiments. Alternatively or additionally, some components (e.g., modules or programs) may be integrated into a single entity, which may perform the same or similar functions as those performed by each of the corresponding components prior to integration. Operations performed by modules, programs or other components according to various embodiments may be executed sequentially, in parallel, iteratively or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0123] Although the preferred embodiments of the present disclosure have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above, and various modifications may be made by a person having ordinary skill in the art to which the present disclosure pertains without departing from the gist of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical idea or prospect of the present disclosure.

Claims

1. In the display device, glass substrate; A plurality of micro LEDs arranged on a first surface of the glass substrate; A first driving unit arranged on the second surface of the glass substrate to drive the plurality of micro LEDs to emit light in a row-line order; and A second driving unit is disposed on the second surface of the glass substrate and provides an image data signal through a data line connected to at least one micro LED among the plurality of micro LEDs; The above plurality of micro LEDs are grouped into a plurality of groups according to the row lines, and each group of the plurality of groups is connected to a different data line, A display device wherein at least one of the micro LEDs belongs to the same column line.

2. In paragraph 1, The above data line is, A first metal wiring formed on a first surface of the glass substrate and connected to the plurality of micro LEDs; A second metal wiring formed on the second surface of the glass substrate and connected to the second driving unit; and A display device, comprising a TGV connecting the first metal wiring and the second metal wiring by penetrating the glass substrate.

3. In paragraph 2, Further comprising a plurality of first connection pads formed of a first metal layer on a first surface of the glass substrate, The above plurality of first connection pads are, A display device, each of which connects the plurality of micro LEDs and the first metal wire.

4. In paragraph 2, Further comprising a plurality of second connection pads formed of a second metal layer on the second surface of the glass substrate, The above plurality of second connection pads are, A display device, which connects the second driving unit and the second metal wiring, respectively.

5. In paragraph 1, Scan lines are, A first metal wiring formed on a first surface of the glass substrate and connected to the plurality of micro LEDs; A second metal wiring formed on the second surface of the glass substrate and connected to the first driving unit; and A TGV connecting the first metal wiring and the second metal wiring by penetrating the glass substrate is included; The above first driving unit is, A display device configured to provide scan signals to the plurality of micro LEDs using the scan lines.

6. In paragraph 5, Further comprising a plurality of first connection pads arranged on the first surface of the glass substrate and formed of a first metal layer, The above plurality of first connection pads are, A display device, each of which connects the plurality of micro LEDs and the first metal wire.

7. In paragraph 5, Further comprising a plurality of second connection pads arranged on the first surface of the glass substrate and formed of a second metal layer, The above plurality of second connection pads are, A display device, which connects the first driving unit and the second metal wiring, respectively.

8. In paragraph 1, Further comprising a timing controller that provides a scan signal and an image data signal to the first driving unit and the second driving unit; The above timing controller, A frame memory for storing the above image data information; and A display device, comprising a timing control unit that converts image data information stored in the frame memory into image data information in sub-frame units and outputs the converted image data information in sub-frame units.

9. In paragraph 8, The above second driving unit, An interface configured to receive image data information in units of sub-frames provided from the timing control unit; A line memory configured to convert and store image data information of the subframe unit into image data information of the line unit; and A display device, comprising an output buffer configured to convert the image data information of the line unit obtained from the line memory into an image data signal and output it.

10. In a method for manufacturing a display device, A step of determining a first position of a plurality of micro LEDs arranged on a first surface of a glass substrate of the display device; A step of determining a second position of a first driving unit and a second driving unit arranged on a second surface of the glass substrate; A step of implementing a scan line for connecting a plurality of micro LEDs and a first driving unit using a plurality of metal wires formed on the first surface and the second surface of the glass substrate, respectively; and A step of implementing a data line for connecting a plurality of micro LEDs and a second driving unit using a plurality of metal wires formed on the first surface and the second surface of the glass substrate, respectively; The step of implementing a data line for connecting the second driving unit is as follows: A method for manufacturing a display device, comprising: grouping the plurality of micro LEDs into a plurality of groups according to scan lines, and connecting each group of the plurality of groups to different data lines; 11. In paragraph 10, The step of implementing a data line for connecting the second driving unit is as follows: A step of forming a first metal wire for connecting the plurality of micro LEDs and the second driving unit on the first surface of the glass substrate among the plurality of metal wires; A step of forming a second metal wire for connecting the plurality of micro LEDs and the second driving unit on the second surface of the glass substrate among the plurality of metal wires; and A method for manufacturing a display device, comprising: a step of connecting the first metal wire and the second metal wire through a TGV formed by penetrating the glass substrate.

12. In paragraph 11, A step of forming a plurality of first connection pads arranged on a first surface of the glass substrate and respectively connected to the plurality of micro LEDs; and A method for manufacturing a display device, further comprising: forming a via for connecting the plurality of first connection pads and the first metal wiring, respectively.

13. In paragraph 11, A step of forming a plurality of second connection pads arranged on the second surface of the glass substrate and each connected to the second driving unit; and A method for manufacturing a display device, further comprising: forming a via for connecting the plurality of second connection pads and the second metal wiring, respectively.

14. In paragraph 10, The step of implementing a scan line for connecting the above first driving unit is: A step of forming a first metal wire for connecting the plurality of micro LEDs and the first driving unit on the first surface of the glass substrate among the plurality of metal wires; A step of forming a second metal wire for connecting the plurality of micro LEDs and the first driving unit on the second surface of the glass substrate among the plurality of metal wires; and A method for manufacturing a display device, comprising: a step of connecting the first metal wire and the second metal wire through a TGV formed by penetrating the glass substrate.

15. In paragraph 14, A step of forming a plurality of third connection pads arranged on the first surface of the glass substrate and respectively connected to the plurality of micro LEDs; A step of forming a via for connecting the plurality of third connection pads and the first metal wiring, respectively; A step of forming a plurality of fourth connection pads arranged on the second surface of the glass substrate and connected to the first driving unit; and A method for manufacturing a display device, further comprising: forming a via for connecting the plurality of fourth connection pads and the second metal wiring, respectively.

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