Display panel, manufacturing method therefor and tiled display apparatus

Abstract

A display panel, a manufacturing method therefor and a tiled display apparatus. The display panel comprises: a substrate, a first electrode and a connecting lead. The substrate comprises a first surface and a second surface which are opposite to each other, a plurality of side surfaces between the first surface and the second surface, a first transition surface connecting the first surface and a side surface, and a second transition surface connecting the second surface and a side surface. At least one of the plurality of side surfaces is a selected side surface. The connecting lead extends from the first surface and successively passes through the first transition surface, the selected side surface and the second transition surface to reach the second surface. The connecting lead comprises a first lead section, a second lead section, a third lead section and a fourth lead section which are successively connected, the first lead section being located on the first surface, the second lead section being located on the first transition surface, the third lead section being located on the selected side surface, the fourth lead section being located on the second transition surface, and the width of at least one of the second lead section and the fourth lead section being greater than the average width of the third lead section.

Description

Display panel and manufacturing method thereof, and spliced ​​display device Technical Field

[0001] The present disclosure relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a spliced ​​display device. Background Art

[0002] The use of micro light-emitting diodes (MLDs) or sub-millimeter light-emitting diodes (MLDs) as pixels of display panels has attracted widespread attention and research. Currently, a method of splicing small-sized display devices is usually adopted to assemble a large-sized spliced ​​display device.

[0003] Summary of the Invention

[0004] In one aspect, a display panel is provided. The display panel includes a substrate, a first electrode, and a connecting lead. The substrate includes a first surface and a second surface facing each other, a plurality of side surfaces located between the first surface and the second surface, a first transition surface connecting the first surface and the side surface, and a second transition surface connecting the second surface and the side surface; at least one of the plurality of side surfaces is a selected side surface. The first electrode is located on the first surface and disposed proximate to the selected side surface. One end of the connecting lead is connected to the first electrode, and the connecting lead extends from the first surface through the first transition surface, the selected side surface, the second transition surface, and finally to the second surface.

[0005] The connecting lead includes a first lead segment, a second lead segment, a third lead segment and a fourth lead segment connected in sequence, the first lead segment is located on the first surface, the second lead segment is located on the first transition surface, the third lead segment is located on the selected side surface, and the fourth lead segment is located on the second transition surface. The minimum width of at least one of the second lead segment and the fourth lead segment is greater than the average width of the third lead segment.

[0006] In some embodiments, a minimum thickness of at least one of the second lead segment and the fourth lead segment is greater than an average thickness of the third lead segment.

[0007] In some embodiments, the first lead segment includes a first sub-section and a second sub-section connected to each other, the first sub-section being connected to the first electrode, and the second sub-section being connected to the second lead segment. The maximum width of the first sub-section is less than the average width of the second sub-section, and the width of the second sub-section gradually increases in a direction perpendicular to the selected side surface. The minimum width of the second lead segment is greater than the average width of the first sub-section.

[0008] In some embodiments, the thickness of the second sub-portion gradually increases along a direction perpendicular to the selected side surface.

[0009] In some embodiments, a minimum thickness of the second lead segment is greater than an average thickness of the first subsection.

[0010] In some embodiments, the third lead segment includes a third sub-section, a fourth sub-section, and a fifth sub-section, which are sequentially connected. The third sub-section is connected to the second lead segment, and the fifth sub-section is connected to the fourth lead segment. The minimum width of the third sub-section is greater than the average width of the fourth sub-section, and the width of the third sub-section gradually increases in a direction perpendicular to the first surface. The minimum width of the second lead segment is greater than the average width of the fourth sub-section.

[0011] In some embodiments, the thickness of the third sub-portion gradually increases along a direction perpendicular to the first surface.

[0012] In some embodiments, a minimum thickness of the second lead segment is greater than an average thickness of the fourth subsection.

[0013] In some embodiments, the third lead segment includes a third sub-segment, a fourth sub-segment, and a fifth sub-segment connected in sequence, the third sub-segment being connected to the second lead segment, and the fifth sub-segment being connected to the fourth lead segment. The minimum width of the fifth sub-segment is greater than the average width of the fourth sub-segment, and the width of the fifth sub-segment gradually increases in a direction perpendicular to the second surface. The minimum width of the fourth lead segment is greater than the average width of the fourth sub-segment.

[0014] In some embodiments, the thickness of the fifth sub-portion gradually increases along a direction perpendicular to the second surface.

[0015] In some embodiments, a minimum thickness of the fourth lead segment is greater than an average thickness of the fourth sub-portion.

[0016] In some embodiments, the connecting lead further includes a fifth lead segment located on the second surface. The fifth lead segment includes a sixth sub-section and a seventh sub-section connected thereto. The sixth sub-section is closer to the selected side surface than the seventh sub-section and is connected to the fourth lead segment. The maximum width of the seventh sub-section is less than the average width of the sixth sub-section, and the width of the sixth sub-section gradually increases in a direction perpendicular to the selected side surface. The minimum width of the fourth lead segment is greater than the average width of the seventh sub-section.

[0017] In some embodiments, the thickness of the sixth sub-portion gradually increases along a direction perpendicular to the selected side surface.

[0018] In some embodiments, a minimum thickness of the fourth lead segment is greater than an average thickness of the seventh sub-section.

[0019] In some embodiments, the average thickness of the first lead segment is D1, the average thickness of the second lead segment is D2, the average thickness of the third lead segment is D3, and the average thickness of the fourth lead segment is D4. 1.5D1≤D2≤3D1; and / or, 1.5D3≤D2≤3D3; and / or, 1.5D1≤D4≤3D1; and / or, 1.5D3≤D4≤3D3.

[0020] In another aspect, a spliced ​​display device is provided. The spliced ​​display device includes a circuit board and a plurality of spliced ​​display panels according to any of the above embodiments. The circuit board is connected to the display panels and is configured to drive the display panels to display images.

[0021] In another aspect, a method for manufacturing a display panel is provided. The display panel includes a substrate; the substrate includes a first surface and a second surface facing each other, a plurality of side surfaces located between the first and second surfaces, a first transition surface connecting the first surface and the side surfaces, and a second transition surface connecting the second surface and the side surfaces; at least one of the plurality of side surfaces is a selected side surface. The method for manufacturing a display panel includes the following steps.

[0022] The connecting leads are formed by a multiple printing method. The connecting leads extend from the first surface through the first transition surface, the selected side surface, the second transition surface, and finally to the second surface.

[0023] During the printing process, at least one printing parameter is adjusted so that the amount of slurry printed per unit time on the first transition surface and / or the second transition surface is greater than the amount of slurry printed per unit time on the selected side surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0025] FIG1 is a planar structural diagram of a spliced ​​display device according to some embodiments;

[0026] FIG2 is a cross-sectional structural diagram of a display panel according to some embodiments;

[0027] FIG3 is a planar structural diagram of a display device according to some embodiments;

[0028] FIG4 is an enlarged structural diagram of area G2 in FIG2 ;

[0029] FIG5 is a side view of a selected side surface of the display panel according to FIG2 ;

[0030] FIG6 is a cross-sectional structural diagram obtained along the cross-sectional line CC in FIG1 ;

[0031] FIG7 is a flow chart of a method for manufacturing a display panel according to some embodiments;

[0032] FIG8 is a cross-sectional structural diagram corresponding to step S21 in the method for manufacturing a display panel according to some embodiments;

[0033] FIG9 is a cross-sectional structural diagram corresponding to step S22 in the method for manufacturing a display panel according to some embodiments;

[0034] FIG10 is a cross-sectional structural diagram corresponding to step S23 in the method for manufacturing a display panel according to some embodiments;

[0035] FIG11 is a structural diagram corresponding to step S23 in the method for manufacturing a display panel according to some embodiments;

[0036] FIG12 is an enlarged structural diagram of the area G1 on one side of the first surface in FIG1 ;

[0037] FIG13 is a side view of a display panel on a selected side surface according to some embodiments;

[0038] FIG. 14 is an enlarged structural diagram of the area G1 on the second surface side in FIG. 1 . DETAILED DESCRIPTION

[0039] The following will be combined with the accompanying drawings to clearly and completely describe the technical solutions in some embodiments of the present disclosure. Obviously, the embodiments described are only some embodiments of the present disclosure, not all embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by ordinary technicians in this field are within the scope of protection of the present disclosure.

[0040] Unless the context requires otherwise, throughout the specification and claims, the term "comprise" and its other forms, such as the third person singular form "comprises" and the present participle form "comprising", are to be interpreted as open and inclusive, that is, "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "example", "specific example" or "some examples" are intended to indicate that the particular features, structures, materials or characteristics associated with the embodiment or example are included in at least one embodiment or example of the present disclosure. The schematic representation of the above terms does not necessarily refer to the same embodiment or example. In addition, the particular features, structures, materials or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0041] In the following, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present disclosure, unless otherwise specified, "plurality" means two or more.

[0042] When describing some embodiments, the expressions "coupled" and "connected" and their derivatives may be used. The term "connected" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. The term "coupled" indicates, for example, that two or more components are in direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that are not in direct contact with each other, but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents of this document.

[0043] “At least one of A, B and C” has the same meaning as “at least one of A, B or C” and both include the following combinations of A, B and C: A only, B only, C only, the combination of A and B, the combination of A and C, the combination of B and C, and the combination of A, B and C.

[0044] “A and / or B” includes the following three combinations: A only, B only, and a combination of A and B.

[0045] As used herein, the term "if" is optionally interpreted to mean "when" or "upon" or "in response to determining" or "in response to detecting," depending on the context. Similarly, the phrases "if it is determined that" or "if [stated condition or event] is detected" are optionally interpreted to mean "upon determining" or "in response to determining" or "upon detecting [stated condition or event]" or "in response to detecting [stated condition or event]," depending on the context.

[0046] The use of "adapted to" or "configured to" herein is intended to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps.

[0047] Additionally, the use of “based on” is meant to be open and inclusive, as a process, step, calculation, or other action “based on” one or more stated conditions or values ​​may, in practice, be based on additional conditions or values ​​beyond those stated.

[0048] As used herein, "about," "substantially," or "approximately" includes the stated value and an average value that is within an acceptable range of deviation from the particular value as determined by one of ordinary skill in the art taking into account the measurements in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0049] As used herein, "parallel", "perpendicular", and "equal" include the situations described and situations similar to the situations described, and the range of the similar situations is within an acceptable deviation range, wherein the acceptable deviation range is as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equals is less than or equal to 5% of either one.

[0050] It will be understood that when a layer or element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present therebetween.

[0051] Exemplary embodiments are described herein with reference to cross-sectional and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but rather include deviations in shape due to, for example, manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shape of regions of the device and are not intended to limit the scope of the exemplary embodiments.

[0052] Figure 1 is a planar structural diagram of a spliced ​​display device 100 according to some embodiments. Figure 2 is a cross-sectional structural diagram of a display panel according to some embodiments. To facilitate illustration of the connection between the display panel 10 and the circuit board 20, Figure 2 shows the circuit board 20 in addition to the display panel 10.

[0053] An embodiment of the present disclosure provides a spliced ​​display device 100 . As shown in FIG1 , the spliced ​​display device 100 includes a plurality of spliced ​​display panels 10 .

[0054] Exemplarily, the spliced ​​display device 100 further includes a circuit board 20 connected to the display panel 10. The circuit board 20 is configured to drive the display panel 10 to display an image. Multiple display panels 10 may be connected to the same circuit board 20, or, as shown in FIG2 , each of the multiple display panels 10 may be connected to a separate circuit board 20.

[0055] A large-scale display device (a spliced ​​display device 100) is formed by splicing and assembling multiple small-scale display panels 10. Thus, if a display abnormality or other problem occurs in any display area of ​​the spliced ​​display device 100, since the multiple display panels 10 are independently manufactured and then spliced ​​and assembled, the display abnormality problem in the large-scale display device can be resolved by repairing the display panel 10 corresponding to that display area. Furthermore, during repair, the display panel 10 can be individually disassembled for repair, which can reduce the difficulty and cost of repairing product failures compared to a single large-scale display device.

[0056] In addition, the method of assembling a large-size display device by splicing multiple small-size display panels 10 is easier to transport than a large-size display device because a single display panel 10 is smaller in size, and can reduce the probability of the product being bumped and damaged during transportation, thereby improving product reliability and reducing product transportation costs.

[0057] FIG. 3 is a planar structural diagram of a display device according to some embodiments.

[0058] The embodiment of the present disclosure further provides a display device 200. As shown in Figures 2 and 3, the display device 200 includes a display panel 10 and a circuit board 20 connected to the display panel 10. The circuit board 20 is configured to drive the display panel 10 to display an image.

[0059] The display device 200 and the tiled display device 100 described above can be any device that displays any image, whether in motion (e.g., video), stationary (e.g., still image), text, or text. More specifically, it is contemplated that the embodiments described herein can be implemented in or associated with a variety of electronic devices, such as (but not limited to) mobile phones, wireless devices, personal data assistants (PDAs), handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, watches, clocks, calculators, television monitors, flat-panel displays, computer monitors, automotive displays (e.g., speedometer displays, etc.), navigation systems, cockpit controls and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging, and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0060] Exemplarily, the circuit board 20 includes but is not limited to a PCB (Printed Circuit Board) and an FPC (Flexible Printed Circuit Board).

[0061] For example, the display device 200 and the spliced ​​display device 100 may further include a frame and other electronic components, etc. The display panel 10 may be disposed within the frame, for example.

[0062] In some embodiments, as shown in FIG2 , a display panel has a display area AA and a peripheral area AN located at least to one side of the display area AA. The display panel includes a substrate 1, a first electrode 2, and a connecting lead 3'. The substrate 1 includes a first surface 1a and a second surface 1b facing each other, a plurality of side surfaces 1c located between the first surface 1a and the second surface 1b, a first transition surface 1d connecting the first surface 1a and the side surfaces 1c, and a second transition surface 1e connecting the second surface 1b and the side surfaces 1c. At least one of the plurality of side surfaces 1c is a selected side surface 1cc.

[0063] As shown in Figure 2, a first electrode 2 is disposed on the first surface 1a of the substrate 1, near the selected side surface 1cc. The first electrode 2 is located in the peripheral area AN. One end of a connecting lead 3' is connected to the first electrode 2. The other end of the connecting lead 3' extends from the first surface 1a through the first transition surface 1d, the selected side surface 1cc, and the second transition surface 1e to the second surface 1b.

[0064] For example, as shown in FIG2 , the display panel further includes a film structure including a drive circuit layer 4 and a light-emitting device layer 5 disposed within the display area AA. The light-emitting device layer 5 and the drive circuit layer 4 are disposed on the first surface 1a side of the substrate 1. The light-emitting device layer 5 is located on the side of the drive circuit layer 4 away from the substrate 1 and is connected to the drive circuit layer 4. One end of the first electrode 2 is connected to the drive circuit layer 4, for example, and the other end is connected to a connecting lead 3'.

[0065] The drive circuit layer 4 includes a plurality of signal lines located in the display area AA. Each first electrode 2 has one end connected to, for example, a signal line, and the other end connected to, for example, a connecting lead 3'. The first electrode 2 is configured to transmit a drive signal (e.g., a light-emitting drive signal) transmitted by the connecting lead 3' to the drive circuit layer 4. At least a portion of the plurality of signal lines is connected to the light-emitting device layer 5 and is configured to provide the light-emitting drive signal to the light-emitting device layer 5.

[0066] 2 , the light emitting device layer 5 includes a plurality of light emitting devices 51 . The light emitting devices 51 are configured to emit light under the control of a driving signal from the driving circuit layer 4 .

[0067] Exemplarily, the light-emitting device 51 includes but is not limited to OLED (Organic Light-Emitting Diode), Mini LED (Mini Light-Emitting Diode), Micro LED (Micro Light-Emitting Diode), etc.

[0068] In some embodiments, as shown in FIG2 , the light emitting device layer 5 further includes a plurality of pixel driving chips 52 . The pixel driving chips 52 are configured to provide driving signals to the light emitting devices 51 .

[0069] In other embodiments, the light emitting device layer 5 may not have the pixel driving chip 52 , but utilizes thin film transistors disposed in the driving circuit layer 4 to provide driving signals to the light emitting devices 51 .

[0070] This is merely an illustrative description of the present disclosure and is not intended to limit the present disclosure.

[0071] In some embodiments, as shown in FIG2 , the end portion of the connecting lead 3′ located on the second surface 1b is connected to the circuit board 20, thereby conducting the driving circuit layer 4 on the first surface 1a side of the substrate 1 with the driving structure (e.g., the circuit board 20) on the second surface 1b side through the connecting lead 3′, so that the driving signal emitted by the driving structure can be transmitted to the light-emitting device layer 5 to drive the light-emitting device 51 to emit light.

[0072] For example, the connecting lead 3 ′ may be formed by adopting a 3D printing process, or a “sputtering-laser etching” process. Of course, it may also be formed by adopting other process methods.

[0073] FIG. 4 is an enlarged structural diagram of a region G2 in FIG. 2 , and FIG. 5 is a side view of a selected side surface of the display panel in FIG. 2 .

[0074] As shown in Figures 2 and 4 , the portions located on the same surface of substrate 1 have the same or substantially the same thickness. In some examples, the portions of connecting lead 3' located on different surfaces of substrate 1 have the same or substantially the same thickness. In other examples, due to factors such as the material and manufacturing process, the thickness of the portion of connecting lead 3' located on the first transition surface 1d and the second transition surface 1e of substrate 1 is less than the thickness of the portion of connecting lead 3' located on the remaining surfaces of substrate 1.

[0075] For example, a 3D printing process is used to form the connecting lead 3'. During the preparation process, slurry is printed onto the substrate 1 multiple times from one side of the first surface 1a of the substrate 1, from one side of the selected side surface 1cc of the substrate 1, and from one side of the second surface 1b of the substrate 1. After the slurry is cured, the connecting lead 3' is formed.

[0076] During the slurry printing process, a portion of the slurry printed from the first surface 1a and the selected side surface 1cc flows into the first transition surface 1d, thereby forming the portion of the connecting lead 3' located within the first transition surface 1d. A portion of the slurry printed from the second surface 1b and the selected side surface 1cc flows into the second transition surface 1e, thereby forming the portion of the connecting lead 3' located within the second transition surface 1e from the first surface 1a.

[0077] When the thickness of each portion of the connecting lead 3' is greater than or equal to the first set thickness H1, the drive signal in the display panel can be transmitted normally and stably through the connecting lead 3'. However, as shown in Figures 2, 4, and 5, during the slurry printing process, due to factors such as insufficient amount of printing slurry flowing into the first transition surface 1d and the second transition surface 1e, and shrinkage caused by slurry solidification, the average thickness H2 of the connecting lead 3' may be less than the first set thickness H1, that is, 0≤H2

[0078] For example, as shown in Figures 2 and 4, the maximum thickness of the connecting lead 3' at the corner position of the substrate 1 may be less than the first set thickness H1, and the minimum thickness of the connecting lead 3' may even be 0, that is, the connecting lead 3' may be disconnected at the corner position of the substrate 1.

[0079] When the thickness h1 of the connecting lead 3' is not 0 and is less than the first set thickness H1, the connecting lead 3' may have a problem of poor signal transmission; and since the thickness of the connecting lead 3' is less than the first set thickness H1, this will cause the line resistance of the connecting lead 3' to increase, thereby increasing the power consumption of the display panel.

[0080] Furthermore, when the connecting lead 3' is disconnected at the corner of the substrate 1, abnormal signal transmission may occur in the display panel. The driving signal cannot be transmitted to the light-emitting device layer 5 through the connecting lead 3', thereby causing abnormal display of the display panel.

[0081] At the same time, the parts of the connecting lead 3' located on different surfaces of the substrate 1 need to be formed in batches through multiple steps. As shown in Figure 5, when the parts of the same connecting lead 3' located on different surfaces of the substrate 1 are formed in different process steps, alignment deviation may occur, causing the actual alignment connection size of the part where the parts of the same connecting lead 3' located on different surfaces of the substrate 1 are connected to be smaller than the set alignment connection size, resulting in the problem that the width of the connecting lead 3' in this part is too narrow.

[0082] If there is alignment deviation during the preparation of the connecting lead 3 ′, combined with the material shrinkage during curing, the connecting lead 3 ′ is more likely to be too narrow or even broken. ​

[0083] Based on this, an embodiment of the present disclosure provides a display panel 10 and a manufacturing method thereof. The display panel 10 and the manufacturing method thereof provided by the present disclosure, and a spliced ​​display device 100 including the display panel 10 are respectively introduced below.

[0084] Figure 6 is a cross-sectional structural diagram of a single display panel 10 obtained along the cross-sectional line CC in Figure 1. Figure 7 is a flow chart of a method for preparing a display panel according to some embodiments. Figures 8, 9, and 10 are corresponding cross-sectional structural diagrams during the preparation process of the display panel 10. In order to clearly illustrate the preparation process of the connecting lead 3, Figures 8 to 10 illustrate the connecting lead 3 formed by multiple printings as multiple parts. It can be understood that the connecting lead 3 actually formed is a complete, continuous overall structure. The boundary lines between the various parts of the connecting lead 3 in the drawings do not mean that the final connecting lead 3 is divided into different parts.

[0085] The embodiments of the present disclosure also provide a method for manufacturing a display panel 10. The display panel 10 includes a substrate 1; the substrate 1 includes a first surface 1a and a second surface 1b opposite to each other, a plurality of side surfaces 1c located between the first surface 1a and the second surface 1b, a first transition surface 1d connecting the first surface 1a and the side surface 1c, and a second transition surface 1e connecting the second surface 1b and the side surface 1c; at least one of the plurality of side surfaces 1c is a selected side surface 1cc.

[0086] As shown in FIG. 7 , the method for manufacturing the display panel 10 includes the following steps.

[0087] S1. As shown in FIG8 , a first electrode 2 is formed on a first surface 1a of a substrate 1. The first electrode 2 is disposed close to a selected side surface 1cc of the substrate 1.

[0088] 1 and 3 , the display panel 10 may include a plurality of first electrodes 2 , which are spaced apart along the second direction Y. Each first electrode 2 may extend along the first direction X, from the display area AA toward the selected side surface 1 cc.

[0089] S2. As shown in Figures 8, 9, 10, and 11, a multiple-printing method is used to form connecting leads 3. One end of connecting lead 3 is connected to first electrode 2, and the other end extends from first surface 1a through first transition surface 1d, selected side surface 1cc, and second transition surface 1e to second surface 1b. During the printing process, at least one printing parameter is adjusted so that the amount of slurry printed per unit time on first transition surface 1d and / or second transition surface 1e is greater than the amount of slurry printed per unit time on selected side surface 1cc.

[0090] For example, the display panel 10 may include a plurality of connecting leads 3 . The number of the connecting leads 3 is the same as the number of the first electrodes 2 , and each connecting lead 3 is connected to one second electrode 2 .

[0091] For example, during the printing process, at least one printing parameter can be adjusted so that the amount of slurry printed per unit time on the first transition surface 1d and / or the second transition surface 1e is greater than the amount of slurry printed per unit time on the first surface 1a and / or the second surface 1b.

[0092] As shown in Figures 8, 9, 10, and 11, during multiple printing processes, by adjusting printing parameters, the printing paste is caused to fall more on the front corner of the substrate 1 (at the first transition surface 1d) and the back corner of the substrate 1 (at the second transition surface 1e) than at other locations, thereby forming a pile of material at the corner positions of the substrate 1. This ensures that the thickness h2 of the formed connecting lead 3 at any position within the first transition surface 1d and the second transition surface 1e of the substrate 1 is greater than the first set thickness H1, and the thickness h3 of the remaining portion of the connecting lead 3 at any position is greater than or equal to the first set thickness H1, and h2 is greater than h3. For example, as shown in Figure 10, 1.5h3≤h2≤3h3.

[0093] By increasing the amount of slurry printed per unit time on the first transition surface 1d and / or the second transition surface 1e, sufficient slurry can flow into the first transition surface 1d and the second transition surface 1e during the process of printing the slurry and curing the slurry, thereby ensuring that the thickness of the portion of the connecting lead 3 formed by curing the slurry located within the first transition surface 1d and the second transition surface 1e is greater than or equal to the second set thickness H2, and the second set thickness H2 is greater than the first set thickness H1, thereby ensuring that a complete and continuous connecting lead 3 can be formed during multiple printing processes, and the thickness of the connecting lead 3 at each position is greater than or equal to the first set thickness H1.

[0094] As shown in Figures 10 and 11, the connecting lead 3 is formed by the above-mentioned step S2. Since the amount of slurry printed on the first transition surface 1d and / or the second transition surface 1e is relatively large, even if problems such as shrinkage caused by slurry curing occur during the slurry curing process, the thickness h2 of the finally formed connecting lead 3 at the corner position of the substrate 1 can still be greater than or equal to the first set thickness H1, ensuring that the connecting lead 3 can stably and effectively transmit signals, thereby improving the transmission stability of the driving signal in the display panel 10.

[0095] Furthermore, by adjusting the printing parameters to form a pile at the corner of the substrate 1, the thickness of the portion of the connecting lead 3 corresponding to the pile is increased, and the width of the portion of the connecting lead 3 corresponding to the pile is also increased. In this way, even if the portions of the same connecting lead 3 located on different surfaces of the substrate 1 experience misalignment during the printing process, the portions of the connecting lead 3 located on different surfaces of the substrate 1 can still be effectively aligned and connected, so that the width of each portion of the ultimately formed connecting lead 3 is greater than or equal to the set width, and the problem of the width being too narrow will not occur, thereby improving the production yield of the connecting lead 3.

[0096] As shown in FIG6 , the connecting lead 3 is prepared by the above-mentioned preparation method. In step S2, by adjusting the printing parameters, more slurry can be printed on the first transition surface 1d and / or the second transition surface 1e per unit time, so that the portion of the connecting lead 3 finally formed at the corner position of the substrate 1 (the portion located on the first transition surface 1d and / or the portion located on the second transition surface 1e) can have a larger thickness, and the thickness of the connecting lead 3 at the corner position of the substrate 1 is greater than the thickness of the remaining portion of the connecting lead 3 located on the substrate 1.

[0097] The connecting lead 3 formed in the aforementioned step S2 includes at least a first lead segment 31 located on the first surface 1a of the substrate 1, a second lead segment 32 located on the first transition surface 1d of the substrate 1, a third lead segment 33 located on the selected side surface 1cc of the substrate 1, and a fourth lead segment 34 located on the second transition surface 1e of the substrate 1. The first lead segment 31, the second lead segment 32, the third lead segment 33, and the fourth lead segment 34 are connected in sequence.

[0098] The thickness of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than that of the third lead segment 33 , illustratively including but not limited to the following situations.

[0099] In some embodiments, the minimum thickness of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the maximum thickness of the first lead segment 31 and greater than the maximum thickness of the third lead segment 33. For example, as shown in FIG6 , the minimum thickness of the second lead segment 32 is greater than the maximum thickness of the first lead segment 31 and greater than the maximum thickness of the third lead segment 33; and the minimum thickness of the fourth lead segment 34 is greater than the maximum thickness of the first lead segment 31 and greater than the maximum thickness of the third lead segment 33.

[0100] In other embodiments, the average thickness of the second lead segment 32 is D2, and the average thickness of the fourth lead segment 34 is D4. The average thickness of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the average thickness D1 of the first lead segment 31 and greater than the average thickness D3 of the third lead segment 33. That is, D2>D1, and D2>D3; and / or D2>D1, and D2>D3. For example, 1.5D1≤D2≤3D1; and / or 1.5D3≤D2≤3D3; and / or 1.5D1≤D4≤3D1, and / or 1.5D3≤D4≤3D3.

[0101] If connecting lead 3 further includes a fifth lead segment 35 located on second surface 1 b of substrate 1 , fifth lead segment 35 is connected to fourth lead segment 34 . The minimum thickness of at least one of second lead segment 32 and fourth lead segment 34 is greater than the maximum thickness of fifth lead segment 35 ; and / or the average thickness of at least one of second lead segment 32 and fourth lead segment is greater than the average thickness D5 of fifth lead segment 35 . For example, 1.5D5 ≤ D2 ≤ 3D5 ; and / or 1.5D5 ≤ D4 ≤ 3D5 .

[0102] In some embodiments, adjusting at least one printing parameter in step S2 includes at least one of the following operations A1, A2, and A3.

[0103] A1. Adjust the moving speed of the printing needle.

[0104] A2. Adjust the injection speed of the slurry in the printing needle.

[0105] A3. Before printing on the first transition surface 1d and / or the second transition surface 1e, a slurry droplet is formed at the printing needle in advance.

[0106] During multiple printing processes, at least one of the above-mentioned adjustment methods A1, A2, and A3 can be used to increase the slurry printed on the first transition surface 1d and / or the second transition surface 1e per unit time, thereby ensuring that a complete and continuous connecting lead 3 with an actual thickness greater than or equal to the set thickness can be formed, so as to ensure that the driving signal in the display panel 10 can be transmitted to the light-emitting device layer 5 through the connecting lead 3.

[0107] During the multiple printing processes, each printing starts from the corner position of the substrate 1 (the position of the first transition surface 1d / the second transition surface 1e).

[0108] Exemplarily, as shown in Figures 8 and 10, when the print head prints from the first surface 1a or the second surface 1b of the substrate 1, it starts from the selected side surface 1cc of the substrate 1 and moves in a direction away from the selected side surface 1cc (for example, the first direction X shown in Figures 8 and 10) to print the portion corresponding to the connecting lead 3.

[0109] For example, as shown in Figure 8, when printing to form the first lead segment 31 and part of the second lead segment 32 (the first sublayer 321) from the side of the first surface 1a of the substrate 1, the printing needle starts printing from the side of the first transition surface 1d close to the selected side surface 1cc, and moves in the direction away from the selected side surface 1cc.

[0110] For example, as shown in Figure 10, when printing to form part of the fifth lead segment 35 and the fourth lead segment 34 (the fourth sublayer 341) from the side of the second surface 1b of the substrate 1, the printing needle starts printing from the side of the second transition surface 1e close to the selected side surface 1cc, and moves in the direction away from the selected side surface 1cc.

[0111] For example, as shown in FIG9 , when the print head prints from the selected side surface 1cc of the substrate 1, it may start from the second transition surface 1e and move in a direction away from the second surface 1b (e.g., the third direction Z shown in FIG9 ) to print the portion corresponding to the connecting lead 3. Alternatively, the print head may start from the first transition surface 1d and move in a direction away from the first surface 1a (e.g., the third direction Z shown in FIG9 ).

[0112] In the process of multiple printings, no matter which side the printing is started from, the slurry droplets can be pre-generated (the aforementioned printing parameter adjustment operation A3) so that more slurry can be printed at the printing starting position.

[0113] The method for forming the connecting lead 3 in step S2 is described in detail below.

[0114] In some embodiments, step S2 includes the following steps S21 to S23.

[0115] S21, as shown in FIG8, the printing needle moves from the first transition surface 1d close to the selected side surface 1cc, and moves from the first transition surface 1d in a direction away from the selected side surface 1cc at a first moving speed V 11 and the first slurry injection rate V 21 The first sub-layer 321 is formed on the first transition surface 1d, and the second moving speed V 12 and the second slurry injection rate V 22 A first lead segment 31 is formed on the first surface 1 a ; and the first sub-layer 321 is connected to the first lead segment 31 .

[0116] Among them, the first moving speed V 11 Less than the second moving speed V 12 ; and / or, the first slurry injection speed V 21 Greater than the second slurry injection speed V 22 and / or, before starting printing, a slurry droplet is formed at the printing needle; during the printing process, the droplet falls into the corresponding area of ​​the first transition surface 1d.

[0117] For example, 1.5V 11 ≤V 12 ≤3V 11 The second moving speed V 12 It can be the first moving speed V 11 1.5 to 3 times of.

[0118] For example, 1 / 3V 22 ≤V 21 ≤2 / 3V 22 The first slurry injection speed V 21 The second slurry injection speed V 22 One third to two thirds times.

[0119] For example, as shown in FIG8 , the printing needle moves in the direction of the arrow in the figure from the right side to the left side in FIG8 , and prints the first sub-layer 321 on the first transition surface 1 d and prints the first lead segment 31 on the first surface 1 a. In step S21 , the printing needle moves at a relatively slow speed (the first moving speed V 11 ) and / or a larger discharge volume per unit time (first slurry injection speed V 21 ) prints the slurry on the first transition surface 1d, and the printing needle moves at a faster speed (the second moving speed V 12 ) and / or a smaller discharge volume per unit time (second slurry injection speed V 22 ) Print slurry on the first surface 1a.

[0120] Before printing begins, the printing needle moves to the vicinity of the first transition surface 1d, and a slurry droplet may be formed at the printing needle tip. The droplet falls into the area corresponding to the first transition surface 1d. Combined with the slurry printed by the printing needle on the first transition surface 1d, a large amount of slurry is printed on the first transition surface 1d, so that there is a certain degree of material accumulation on the first transition surface 1d. In this way, even if part of the slurry on the first transition surface 1d flows toward the first surface 1a and / or flows toward the selected side surface 1cc, there is still enough slurry left in the first transition surface 1d to solidify into a continuous and complete first sub-layer 321, and the first sub-layer 321 and the first lead segment 31 form a complete and continuous film layer structure.

[0121] The continuous and complete first sub-layer 321 means that each part of the first sub-layer 321 has a certain thickness (the thickness of each part is greater than 0).

[0122] After starting printing, the print head moves at a slower speed (the first moving speed V 11 ) and / or a larger discharge volume per unit time (first slurry injection speed V 21 ) The slurry is printed on the first transition surface 1d, so that more slurry is printed in the first transition surface 1d, so that there is a certain degree of material accumulation in the first transition surface 1d. In this way, even if part of the slurry on the first transition surface 1d flows to the first surface 1a and / or flows to the selected side surface 1cc, there is still enough slurry left in the first transition surface 1d to solidify into a continuous and complete first sub-layer 321.

[0123] Then, the printing needle moves at a faster speed (the second moving speed V 12 ) and / or a smaller discharge volume per unit time (second slurry injection speed V 22 ) prints slurry on the first surface 1a, thereby forming a first lead segment 31 connected to the first sub-layer 321 on the first surface 1a. Because the amount of material output per unit time during printing on the first surface 1a is smaller (compared to the amount of material output per unit time during printing on the first transition surface 1d), no material accumulation occurs on the first surface 1a.

[0124] S22. As shown in FIG9, the printing needle forms a third sub-layer 341 on the second transition surface 1e from one side of the selected side surface 1cc, forms a third lead segment 33 on the selected side surface 1cc, and forms a second sub-layer 322 on the first transition surface 1d.

[0125] Exemplarily, step S22 includes S22a or S22b.

[0126] S22a, as shown in FIG9, the printing needle moves from the side of the selected side surface 1cc, from the second surface 1b toward the first surface 1a at a third moving speed V 13 and the third slurry injection rate V 23 The third sub-layer 341 is formed on the second transition surface 1e, and the fourth moving speed V 14 and the fourth slurry injection speed V 24 The third lead segment 33 is formed on the selected side surface 1cc at a third moving speed V 13 and the third slurry injection rate V 23 The second sub-layer 322 is formed on the first transition surface 1 d .

[0127] The first sub-layer 321 and the second sub-layer 322 overlap to form the second lead segment 32; the third moving speed V13 Less than the fourth moving speed V 14 ; and / or, the third slurry injection speed V 23 Greater than the fourth slurry injection speed V 24 and / or, before starting printing, a slurry droplet is formed at the printing needle; during the printing process, the droplet falls into the corresponding area of ​​the first transition surface 1d or the second transition surface 1e.

[0128] S22b, the printing needle moves from the side of the selected side surface 1cc, from the first surface 1a in the direction toward the second surface 1b, at a third moving speed V 13 and the third slurry injection rate V 23 The second sub-layer 322 is formed on the first transition surface 1d, and the fourth moving speed V 14 and the fourth slurry injection speed V 24 The third lead segment 33 is formed on the selected side surface 1cc at a third moving speed V 13 and the third slurry injection rate V 23 The third sub-layer 341 is formed on the second transition surface 1 e .

[0129] The first sub-layer 321 and the second sub-layer 322 overlap to form the second lead segment 32; the third moving speed V 13 Less than the fourth moving speed V 14 ; and / or, the third slurry injection speed V 23 Greater than the fourth slurry injection speed V 24 and / or, before starting printing, a slurry droplet is formed at the printing needle; during the printing process, the droplet falls into the corresponding area of ​​the first transition surface 1d or the second transition surface 1e.

[0130] For example, 1.5V 13 ≤V 14 ≤3V 13 . Fourth moving speed V 14 It can be the third moving speed V 13 1.5 to 3 times of.

[0131] For example, 1 / 3V 24 ≤V 23 ≤2 / 3V 24 The third slurry injection speed V 23 The fourth slurry injection speed V 24 One third to two thirds times.

[0132] Referring to the description of step S21 above, in step S22, before printing starts, the printing needle can be located near the first transition surface 1d or the second transition surface 1e, and a method of pre-generating slurry droplets can be adopted so that after printing starts, the slurry droplets and the printed slurry fall onto the first transition surface 1d or the second transition surface 1e, so that more slurry is printed on the first transition surface 1d or the second transition surface 1e, so that there is a certain degree of material piling on the first transition surface 1d or the second transition surface 1e, thereby ensuring that the slurry on the first transition surface 1d or the second transition surface 1e can be solidified into a continuously completed second sub-layer 321 or third sub-layer 341.

[0133] After starting printing, the print head moves at a slower speed (the third moving speed V 13 ) and / or a larger discharge volume per unit time (the third slurry injection speed V 23 ) The slurry is printed on the first transition surface 1d, so that more slurry is printed in the first transition surface 1d, so that there is a certain degree of material accumulation in the first transition surface 1d. In this way, even if part of the slurry on the first transition surface 1d flows to the first surface 1a and / or flows to the selected side surface 1cc, there is still enough slurry left in the first transition surface 1d to solidify into a continuous and complete second sub-layer 322.

[0134] Then, the printing needle moves at a faster speed (the fourth moving speed V 14 ) and / or a smaller discharge volume per unit time (the fourth slurry injection speed V 24 ) The slurry is printed on the selected side surface 1cc. Since the amount of material discharged by the printing needle during the process (compared to the amount of material discharged per unit time during the printing process on the first transition surface 1d) is small, no material pile-up phenomenon will occur on the selected side surface 1cc.

[0135] During the printing process, in step S21 and step S22, the slurry printed on the first transition surface 1d may partially flow toward the first surface 1a and / or the selected side surface 1cc due to the presence of material piles. As shown in Figures 11 and 12, the width of the end of the first lead segment 31 close to the selected side surface 1cc will be greater than the width of the end of the first lead segment 31 away from the selected side surface 1cc, and the thickness of the end of the first lead segment 31 close to the selected side surface 1cc will be greater than the thickness of the end of the first lead segment 31 away from the selected side surface 1cc.

[0136] S23, as shown in FIG10, the printing needle moves from the side of the second surface 1b and from the side of the second transition surface 1e close to the selected side surface 1cc, in a direction away from the selected side surface 1cc at a fifth moving speed V 15 and the fifth slurry injection speed V 25The fourth sub-layer 342 is formed on the second transition surface 1e, and the sixth moving speed V 16 and the sixth slurry injection speed V 26 A fifth lead segment 35 is formed on the second surface 1 b ; the fourth sub-layer 342 is connected to the fifth lead segment 35 ; and the third sub-layer 341 and the fourth sub-layer 342 are overlapped to form the fourth lead segment 34 .

[0137] Among them, the fifth moving speed V 15 Less than the sixth moving speed V 16 ; and / or, the fifth slurry injection speed V 25 Greater than the sixth slurry injection speed V 26 ; and / or, before starting printing, a slurry droplet is formed at the printing needle; during the printing process, the droplet falls into the corresponding area of ​​the second transition surface 1e.

[0138] For example, 1.5V 15 ≤V 16 ≤3V 15 . Fifth moving speed V 15 It can be the sixth moving speed V 16 1.5 to 3 times of.

[0139] For example, 1 / 3V 26 ≤V 25 ≤2 / 3V 26 The fifth slurry injection speed V 25 The sixth slurry injection speed V 26 One third to two thirds times.

[0140] The order of steps S21, S22, and S23 is not limited. Furthermore, in at least one of steps S21, S22, and S23, the slurry printed per unit time is increased on at least one of the first transition surface 1d and the second transition surface 1e, thereby achieving a material accumulation on the first transition surface 1d or the second transition surface 1e. In the resulting connecting lead 3, the width of the second lead segment 32 or the fourth lead segment 34 is greater than the average width of the third lead segment 33.

[0141] Of course, it is also possible to form a pile on the first transition surface 1d or the second transition surface 1e in each step. In this way, the second lead segment 32 and the fourth lead segment 34 finally formed have a larger width and thickness, which is more conducive to avoiding the connection lead 3 from being disconnected at this position.

[0142] Moreover, when there is a large amount of material piled on the first transition surface 1d, part of the material piled on the first transition surface 1d will flow into the first surface 1a and / or the selected side surface 1cc, so that the width and thickness of the first lead segment 31 and / or the third lead segment 33 finally formed at the end connected to the second lead segment 32 are also increased, which is more conducive to achieving the purpose of avoiding the connection lead 3 from being disconnected at this position.

[0143] Correspondingly, when there is a large amount of material piled on the second transition surface 1e, part of the material piled on the second transition surface 1e will flow into the second surface 1b and / or the selected side surface 1cc, so that the width and thickness of the fifth lead segment 35 and / or the third lead segment 33 finally formed at the end connected to the fourth lead segment 34 are also increased, which is more conducive to achieving the purpose of avoiding the connection lead 3 from being disconnected at this position.

[0144] Referring to the description of step S21 and step S22 in the previous text, in step S22, at least one of the aforementioned printing parameter adjustment operations A1, A2 and A3 can be used to allow material to be piled up on the second transition surface 1e during the printing process, thereby ensuring that the thickness of the portion of the connecting lead 3 located on the second transition surface 1e is greater than or equal to the set thickness (first set thickness H1), thereby ensuring that a complete and continuous connecting lead 3 can be formed through multiple printings, and the thickness and width of each part of the connecting lead 3 can meet the design requirements, thereby improving the signal transmission stability of the connecting lead 3 and the reliability of the connecting lead 3.

[0145] During the preparation process of the connecting lead 3, in steps S21, S22 and S23, by adjusting the printing parameters, the connecting lead 3 is piled up at the position where poor connection and disconnection problems are likely to occur. The corresponding part of the connecting lead 3 formed after the piled part is solidified has a larger thickness and width, so that the connecting lead 3 can be effectively aligned and connected in this part (for example, the corner position of the aforementioned substrate 1), and the width of this part can be guaranteed to be greater than or equal to the set width, and the thickness of this part can meet the requirement of being greater than or equal to the set thickness.

[0146] While being able to form complete and continuous connecting leads 3 and improve the preparation yield of the connecting leads 3 , the line resistance of the connecting leads 3 can also be reduced, thereby facilitating the effect of reducing the power consumption of the display panel 10 .

[0147] An embodiment of the present disclosure further provides a display panel 10 , which may be formed using the above-mentioned preparation method.

[0148] In some embodiments, as shown in Figures 12, 13, and 14, the display panel 10 includes a substrate 1, a first electrode 2, and a connecting lead 3. The connecting lead 3 includes a first lead segment 31, a second lead segment 32, a third lead segment 33, and a fourth lead segment 34, which are sequentially connected. The first lead segment 31 is located on the first surface 1a, the second lead segment 32 is located on the first transition surface 1d, the third lead segment 33 is located on the selected side surface 1cc, and the fourth lead segment 34 is located on the second transition surface 1e. The first lead segment 31 is connected to the first electrode 2, and the minimum width of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the average width of the third lead segment 33.

[0149] Second lead segment 32 serves as the intermediate connecting segment between first lead segment 31 located on first surface 1a and third lead segment 33 located on selected side surface 1cc. Second lead segment 32 is located at a corner of substrate 1 (first transition surface 1d). Therefore, compared to first and third lead segments 31 and 33, second lead segment 32 is subject to greater stress, posing a risk of cracking. Furthermore, as previously mentioned, during the fabrication of connecting lead 3, factors such as process precision and material shrinkage can affect second lead segment 32, resulting in defects such as excessively narrow line width or disconnection. Similarly, fourth lead segment 34, located at a corner on the other side of substrate 1 (second transition surface 1e), faces the same aforementioned issues.

[0150] In this embodiment, by increasing the width of the second lead segment 32 and / or the fourth lead segment 34, a complete and continuous lead segment can be formed at the corner position of the substrate 1 during the preparation process of the connecting lead 3, and the various parts of the connecting lead 3 will not have the problem of too narrow line width and disconnection, thereby improving the reliability of the connecting lead 3.

[0151] It is understandable that during the preparation process of the connecting leads, there is only a certain probability that defects such as line width being too narrow or disconnected will occur at the corner position of the substrate 1. For example, when using a technical solution in which the thickness and width of the connecting leads are the same, 10% to 15% of defects will occur during the preparation process of the connecting leads, and the preparation yield of the connecting leads is 85% to 90%.

[0152] By adopting the technical solution of this embodiment, by increasing the width of either the second lead segment 32 or the fourth lead segment 34 to be greater than the average width of the third lead segment 33, the preparation yield of the connecting lead 3 can be improved to 92% to 95%; when the widths of the second lead segment 32 and the fourth lead segment 34 are set to be greater than the average width of the third lead segment 33, the preparation yield of the connecting lead 3 can be improved to 99.6% to 100%.

[0153] For example, referring to the description of the method for preparing the display panel in the previous text, in the preparation process of the display panel 10, the connecting leads 3 can be formed on the substrate 1 by adopting a multiple printing method. During each printing process, by adjusting at least one printing parameter, the printing slurry is piled on the first transition surface 1d and / or the second transition surface 1e, thereby forming the connecting leads 3 as shown in Figure 10.

[0154] Exemplarily, the material of the connecting lead 3 may be a metal material including gold, silver, copper, platinum, nickel gold, etc.

[0155] Taking the example of the connection lead 3 formed by printing with conductive silver paste, by increasing the width of the second lead segment 32 located on the first transition surface 1d, or increasing the width of the fourth lead segment 34 located on the second transition surface 1e, in the preparation process of the connection lead 3, there will be more silver paste at the corner position of the substrate 1 (on the first transition surface 1d or the second transition surface 1e), thereby ensuring that the width of the final connection lead 3 at the corner position of the substrate 1 can be greater than or equal to the set width, and the thickness can be greater than or equal to the set thickness, thereby ensuring the signal transmission stability of the connection lead 3.

[0156] Furthermore, the thickness of at least a portion of the connecting lead 3 is increased, thereby reducing the line resistance of the connecting lead 3 , thereby facilitating the effect of reducing the power consumption of the display panel 10 .

[0157] For example, the minimum width of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the average width of the third lead segment 33 , including but not limited to the following situations.

[0158] In some embodiments, the width of at least one of the second lead segment 32 and the fourth lead segment 34 at any location is greater than the maximum width of the third lead segment 33. In this case, the minimum width of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the maximum width of the second lead segment 32. The width of the third lead segment 33 at all locations can be the same or substantially the same; alternatively, as shown in FIG13 , the width of the end of the third lead segment 33 connected to the second lead segment 32 can be greater than the width of the middle portion of the third lead segment 33.

[0159] In other embodiments, as shown in FIG13 , along the extension direction of the third lead segment 33 (e.g., the third direction Y shown in FIG13 ), the widths of both ends of the third lead segment 33 are greater than the width of the middle portion. In this case, the width of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the width of the middle portion of the third lead segment 33.

[0160] The maximum width of the end portion of the third lead segment 33 connected to the second lead segment 32 may be less than or equal to the minimum width of the second lead segment 32, and the average width of the third lead segment 33 may be less than the minimum width of the second lead segment 32. Of course, the maximum width of the end portion of the third lead segment 33 connected to the second lead segment 32 may also be greater than the minimum width of the end portion of the second lead segment 32 connected to the third lead segment 33. The maximum width of the third lead segment 33 may also be less than or equal to the minimum width of the second lead segment 32.

[0161] The maximum width of the end portion where the third lead segment 33 connects to the fourth lead segment 34 can be less than or equal to the minimum width of the fourth lead segment 34, and the average width of the third lead segment 33 can be less than the minimum width of the fourth lead segment 34. Of course, the maximum width of the end portion where the third lead segment 33 connects to the fourth lead segment 34 can also be greater than the minimum width of the end portion where the fourth lead segment 34 connects to the third lead segment 33. The maximum width of the third lead segment 33 can also be less than or equal to the minimum width of the fourth lead segment 34.

[0162] It should be noted that, as described above in the method for manufacturing a display panel, the width and thickness of the first lead segment 31, the second lead segment 32, the third lead segment 33, and the fourth lead segment 34 of the connecting lead 3 are related to printing parameters. When the printing needle uses different movement speeds and slurry injection speeds, the amount of slurry printed on the substrate 1 per unit time by the printing needle varies. Therefore, the width and thickness of each portion of the ultimately formed connecting lead 3 are related to the selected printing parameters. Specific printing parameters can be selected based on actual needs.

[0163] In some embodiments, as shown in FIG. 10 , the minimum thickness of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the average thickness of the third lead segment 33 .

[0164] By increasing the thickness of the second lead segment 32 and / or the fourth lead segment 34, the line resistance of the connecting lead 3 can be reduced, thereby reducing the power consumption of the connecting lead 3. In addition, the connecting lead 3 can be effectively prevented from being disconnected at the corner positions (first transition surface 1d and second transition surface 1e) of the substrate 1, ensuring that the connecting lead 3 can achieve stable and effective signal transmission.

[0165] As described above, during the preparation of the connecting lead 3, material stacking is achieved on the first transition surface 1d and / or the second transition surface 1e by adjusting the printing parameters, so that the thickness of the second lead segment 32 or the fourth lead segment 34 finally formed is greater than the thickness of the rest of the connecting lead 3.

[0166] For different situations where the minimum thickness of at least one of the second lead segment 32 and the fourth lead segment 34 is greater than the average thickness of the third lead segment 33, please refer to the previous description of the minimum width of at least one of the second lead segment 32 and the fourth lead segment 34 being greater than the average width of the third lead segment 33, which will not be repeated here.

[0167] In some embodiments, as shown in FIG12 , the first lead segment 31 includes a first sub-portion 311 and a second sub-portion 312 connected to each other. The first sub-portion 311 is connected to the first electrode 2, and the second sub-portion 312 is connected to the second lead segment 32. The minimum width of the second lead segment 32 is greater than the average width of the first sub-portion 311. The maximum width of the first sub-portion 311 is less than the average width of the second sub-portion 312, and the width of the second sub-portion 312 gradually increases in a direction perpendicular to the selected side surface 1cc.

[0168] Exemplarily, the maximum width of the second sub-portion 312 is less than or equal to the average width of the second lead segment 32 .

[0169] The width d2 of the second sub-portion 312 gradually increases in a direction perpendicular to the selected side surface 1cc. This means that the width d2 of the second sub-portion 312 gradually increases in a direction perpendicular to the selected side surface 1cc and toward the selected side surface 1cc. In other words, the width of the second sub-portion 312 closer to the selected side surface 1cc is greater than the width of the second sub-portion 312 farther from the selected side surface 1cc.

[0170] The width of the first subsection 311 at each position may be the same or substantially the same, or the width of the end of the first subsection 311 connected to the second subsection 312 may be greater than the width of the rest of the first subsection 311. The maximum width of the first subsection 311 may be less than the average width of the second subsection 312, including but not limited to the following situations.

[0171] In some embodiments, the maximum width of the first subsection 311 is smaller than the minimum width of the second subsection 312, that is, the width of the second subsection 312 at any position is greater than the maximum width of the first subsection 311. For example, as shown in FIG12 , the width of the first subsection 311 at all positions is d1, and the width d2 of the second subsection 312 at any position is greater than d1.

[0172] In other embodiments, the maximum width of the first sub-portion 311 is greater than or equal to the minimum width of the second sub-portion 312 , but the maximum width of the first sub-portion 311 is less than the average width of the second sub-portion 312 .

[0173] In some embodiments, as shown in FIG12 , the minimum width of the second lead segment 32 is greater than the maximum width of the first sub-portion 311. That is, the width of the second lead segment 32 at any position is greater than the maximum width of the first sub-portion 311. For example, as shown in FIG12 , the width of the second lead segment 32 at any position is d3, and for any d3 and d1, d3>d1 is satisfied.

[0174] One end of the second sub-section 312 is connected to the first sub-section 311, and the other end is connected to the second lead segment 32. The width of the second sub-section 312 located between the two gradually increases in the direction from the smaller one to the larger one, thereby ensuring that the width of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the side surface of the connecting lead 3 is a smooth and continuous plane or curved surface.

[0175] In some embodiments of the present disclosure, along the direction perpendicular to the selected side surface 1cc, the width of the second sub-portion 312 gradually increases from the width of the first sub-portion 311 to the width of the second lead segment 32. In this way, the side surface of the connecting lead 3 in this part is a smooth and continuous plane or curved surface, which can effectively avoid the problem of easy breakage of the connecting lead 3 due to the uneven surface of the connecting lead 3, thereby increasing the reliability of the connecting lead 3.

[0176] 12 , the first lead segment 31 extends along a first direction X perpendicular to the selected side surface 1 cc, and a width d2 of the second sub-portion 312 gradually increases along the first direction X toward the selected side surface 1 cc.

[0177] As mentioned above, in order to ensure that the parts of the connecting leads 3 located on different surfaces of the substrate 1 can be effectively aligned and connected, during the preparation process of the connecting leads 3, the printing parameters are adjusted at the corner positions of the substrate 1 to achieve material stacking, so that the width of the finally formed connecting leads 3 at the corner positions of the substrate 1 and the parts near the corner positions will be larger than the width of the remaining parts.

[0178] Because the printing paste is fluid, the deposited material on the first transition surface 1d flows toward the first surface 1a, causing the width of the portion of the first lead segment 31 near the first transition surface 1d (the second sub-portion 312) to be greater than the width of the remaining portion of the first lead segment 31. Thus, in the resulting connecting lead 3, the width of the second sub-portion 312 of the first lead segment 31 located near the selected side surface 1cc on the first surface 1a is greater than the width of the first sub-portion 311 relatively farther from the selected side surface 1cc.

[0179] In the display panel 10 provided in this embodiment, the width of at least a portion of the connecting lead 3 (for example, the widths d2 and d3 shown in Figure 12) is greater than the width of the remaining portion (for example, the width d1 shown in Figure 12), thereby reducing the overall line resistance of the connecting lead 3 and reducing the power consumption of the connecting lead 3.

[0180] In some embodiments, as shown in FIG. 10 , the thickness d3 of the second sub-portion 312 gradually increases along a direction perpendicular to the selected side surface 1 cc.

[0181] One end of the second sub-section 312 is connected to the first sub-section 311, and the other end is connected to the second lead segment 32. The thickness of the second sub-section 312 located between the two gradually increases from the one with smaller thickness to the one with larger thickness, thereby ensuring that the thickness of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface.

[0182] In some embodiments of the present disclosure, the upper surface of the connecting lead 3 is a smooth and flat plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easily broken due to the uneven surface, thereby increasing the reliability of the connecting lead 3.

[0183] 10 and 12 , the second sub-portion 312 extends along a first direction X perpendicular to the selected side surface 1 cc, and a thickness d3 of the second sub-portion 312 gradually increases along the first direction X and toward the selected side surface 1 cc.

[0184] As previously mentioned, due to the fluidity of the printing paste, the deposited material within the first transition surface 1d flows toward the first surface 1a, resulting in a greater thickness in the portion of the first lead segment 31 near the first transition surface 1d (the second sub-portion 312) than in the remaining portion of the first lead segment 31. Thus, in the resulting connecting lead 3, the second sub-portion 312 of the first lead segment 31 located near the selected side surface 1cc on the first surface 1a is thicker than the first sub-portion 311 located relatively farther from the selected side surface 1cc.

[0185] 8 , when the printing tip is larger than the first lead segment 31 , the printing parameters remain unchanged. Therefore, when the slurry in the first transition surface 1 d does not overflow into the first surface 1 a , the width and thickness of each part of the first lead segment 31 remain substantially consistent.

[0186] When the slurry in the first transition surface 1d overflows into the first surface 1a, since the slurry flows from the first transition surface 1d to the first surface 1a, the amount of the slurry overflowing toward the first surface 1a gradually decreases as it moves away from the selected side surface 1cc. Accordingly, in the finally formed first lead segment 31, the width and thickness of the second sub-portion 312 close to the first transition surface 1e gradually increase in the direction toward the selected side surface 1cc.

[0187] Thus, in the finally formed display panel 10 , the thickness of the second sub-portion 312 of the connecting lead 3 is greater than the thickness of the first sub-portion 311 , thereby reducing the overall line resistance of the connecting lead 3 and the power consumption of the connecting lead 3 .

[0188] In some embodiments, as shown in FIG. 10 , the minimum thickness of the second lead segment 32 is greater than the average thickness of the first sub-portion 311 .

[0189] The thickness of the first sub-section 311 can be the same or substantially the same at all locations, or the thickness of the end of the first sub-section 311 connected to the second sub-section 312 can be greater than the thickness of the rest of the first sub-section 311. The minimum thickness of the second lead segment 32 being greater than the average thickness of the first sub-section 311 includes, but is not limited to, the following situations.

[0190] In some embodiments, as shown in FIG. 10 , the minimum thickness of the second lead segment 32 is greater than the maximum thickness of the first sub-portion 311 , ie, the thickness at any position of the second lead segment 32 is greater than the maximum thickness of the first sub-portion 311 .

[0191] In some other embodiments, the maximum thickness of the first sub-portion 311 is greater than the minimum thickness of the second lead segment 32 , but the maximum thickness of the first sub-portion 311 is less than the average thickness of the second lead segment 32 .

[0192] As previously described, during the manufacturing process of the display panel 10, the printing parameters are adjusted to achieve a buildup of material on the first transition surface 1d, resulting in a thicker second lead segment 32. Furthermore, due to the fluidity of the printing paste, some of the buildup of material on the first transition surface 1d flows into the first surface 1a, resulting in a thicker second sub-portion 312 than the first sub-portion 311.

[0193] As mentioned above, the amount of material piled in the first transition surface 1d is related to the specific printing parameters. When the amount of material piled in the first transition surface 1d is small, the slurry in the first transition surface 1d may not overflow to the first surface 1a. Therefore, the thickness of the second lead segment 32 can be greater than or equal to the thickness of the second sub-section 312.

[0194] Moreover, during each printing process, the print head keeps moving, and the amount of slurry printed per unit time by the print head in the corresponding area of ​​the first transition surface 1d is more than the amount of slurry printed per unit time in the corresponding area of ​​the first surface 1a. Therefore, the print head will print more slurry at the junction of the first transition surface 1d and the first surface 1a than at the portion corresponding to the first sub-portion 311. The thickness of the second sub-portion 312 finally formed will be thicker than that of the first sub-portion 311, but still less than the thickness of the second lead segment 32.

[0195] In some embodiments, as shown in Figures 12 and 13, the third lead segment 33 includes a third sub-section 331, a fourth sub-section 332, and a fifth sub-section 333, which are sequentially connected. The third sub-section 331 is connected to the second lead segment 32, and the fifth sub-section 333 is connected to the fourth lead segment 34. The minimum width of the second lead segment 32 is greater than the average width of the fourth sub-section 332. The minimum width of the third sub-section 331 is greater than the average width of the fourth sub-section 332, and the width d4 of the third sub-section 331 gradually increases along a direction perpendicular to the first surface 1a.

[0196] For example, the minimum width of the second lead segment 32 is greater than the maximum width of the fourth sub-section 332. Regarding the relationship between the widths of the second lead segment 32 and the fourth sub-section 332, please refer to the above description of the relationship between the widths of the second lead segment 32 and the first sub-section 311, and will not be repeated here. Regarding the relationship between the widths of the third sub-section 331 and the fourth sub-section 332, please refer to the above description of the relationship between the widths of the first sub-section 311 and the second sub-section 312, and will not be repeated here.

[0197] One end of the third sub-section 331 is connected to the fourth sub-section 332, and the other end is connected to the second lead segment 32. The width of the third sub-section 331 located between the two gradually increases from the smaller one to the larger one, thereby ensuring that the width of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the side surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easy to break due to the uneven side surface, thereby increasing the reliability of the connecting lead 3.

[0198] Furthermore, the increase in the width d4 of the third sub-portion 331 can also reduce the overall line resistance of the connecting lead 3 , thereby reducing the power consumption of the connecting lead 3 , which is beneficial to achieving the technical effect of reducing the power consumption of the display panel 10 .

[0199] In some embodiments, as shown in FIG. 10 and FIG. 13 , the thickness of the third sub-portion 331 gradually increases along a direction perpendicular to the first surface 1 a .

[0200] One end of the third sub-section 331 is connected to the fourth sub-section 332, and the other end is connected to the second lead segment 32. The thickness of the third sub-section 331 located between the two gradually increases from the one with smaller thickness to the one with larger thickness, thereby ensuring that the thickness of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easy to break due to the uneven upper surface of the connecting lead 3, thereby increasing the reliability of the connecting lead 3.

[0201] In some embodiments of the present disclosure, the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easily broken due to the uneven surface, thereby increasing the reliability of the connecting lead 3.

[0202] 10 and 13 , the third sub-portion 331 extends along a third direction Z that is perpendicular to the first surface 1 a and parallel to the selected side surface 1 cc. The thickness of the third sub-portion 331 gradually increases along the third direction Z and toward the second surface 1 b.

[0203] In some embodiments, as shown in FIG. 10 and FIG. 11 , the minimum thickness of the second lead segment 32 is greater than the average thickness of the fourth sub-portion 332 .

[0204] For example, the minimum thickness of the second lead segment 32 is greater than the maximum thickness of the fourth sub-portion 332. Regarding the thickness relationship between the second lead segment 32 and the fourth sub-portion 332, please refer to the above description of the thickness relationship between the second lead segment 32 and the first sub-portion 311, which will not be repeated here.

[0205] The second lead segment 32, located on the first transition surface 1d, is located at a corner of the substrate 1. Compared to the fourth sub-section 332 located on the selected side surface 1cc, the second lead segment 32 is subject to greater stress and is more susceptible to defects such as narrowing or breakage during the manufacturing process. Increasing the thickness of the second lead segment 32 reduces the risk of stress and defects during the manufacturing process, thereby improving the reliability of the connecting lead 3.

[0206] In some embodiments, as shown in Figures 12 and 13, the third lead segment 33 includes a third sub-section 331, a fourth sub-section 332, and a fifth sub-section 333, which are sequentially connected. The third sub-section 331 is connected to the second lead segment 32, and the fifth sub-section 333 is connected to the fourth lead segment 34. The minimum width of the fourth lead segment 34 is greater than the average width of the fourth sub-section 332. The minimum width of the fifth sub-section 333 is greater than the average width of the fourth sub-section 332, and the width of the fifth sub-section 333 gradually increases in a direction perpendicular to the second surface 1b.

[0207] For example, the minimum width of the fourth lead segment 34 is greater than the maximum width of the fourth sub-section 332. The width relationship between the fourth lead segment 34 and the fourth sub-section 332 can be found in the description of the width relationship between the second lead segment 32 and the first sub-section 311, and will not be repeated here. The width relationship between the fifth sub-section 333 and the fourth sub-section 332 can be found in the description of the width relationship between the first sub-section 311 and the second sub-section 312, and will not be repeated here.

[0208] One end of the fifth sub-section 333 is connected to the fourth sub-section 332, and the other end is connected to the fourth lead segment 34. The width of the fifth sub-section 333 located between the two gradually increases from the smaller one to the larger one, thereby ensuring that the width of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the side surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easy to break due to the uneven side surface, thereby increasing the reliability of the connecting lead 3.

[0209] Furthermore, the increase in the width d4 of the fifth sub-portion 333 can also reduce the overall line resistance of the connecting lead 3 , thereby reducing the power consumption of the connecting lead 3 , which is beneficial to achieving the technical effect of reducing the power consumption of the display panel 10 .

[0210] In some embodiments, as shown in FIG. 10 and FIG. 13 , the thickness of the fifth sub-portion 333 gradually increases along a direction perpendicular to the second surface 1 b .

[0211] One end of the fifth sub-section 333 is connected to the fourth sub-section 332, and the other end is connected to the fourth lead segment 34. The thickness of the fifth sub-section 333 located between the two gradually increases from the one with smaller thickness to the one with larger thickness, thereby ensuring that the thickness of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easy to break due to the uneven upper surface of the connecting lead 3, thereby increasing the reliability of the connecting lead 3.

[0212] In some embodiments of the present disclosure, the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easily broken due to the uneven surface, thereby increasing the reliability of the connecting lead 3.

[0213] Exemplarily, as shown in FIG. 10 and FIG. 13 , the fifth sub-portion 333 extends along the third direction Z, and the thickness of the fifth sub-portion 333 gradually increases along the third direction Z and in a direction toward the first surface 1 a .

[0214] In some embodiments, as shown in FIG. 10 and FIG. 11 , the minimum thickness of the fourth lead segment 34 is greater than the average thickness of the fourth sub-portion 332 .

[0215] For example, the minimum thickness of the fourth lead segment 34 is greater than the maximum thickness of the fourth sub-portion 332. For the thickness relationship between the fourth lead segment 34 and the fourth sub-portion 332, please refer to the above description of the thickness relationship between the second lead segment 32 and the first sub-portion 311, which will not be repeated here.

[0216] The fourth lead segment 34, located on the second transition surface 1e, is located at a corner of the substrate 1. Compared to the fourth sub-portion 332 located on the selected side surface 1cc, the fourth lead segment 34 is subject to greater stress and is more susceptible to defects such as narrowing or breakage during the manufacturing process. Increasing the thickness of the fourth lead segment 34 reduces the risk of stress and defects during the manufacturing process, thereby improving the reliability of the connecting lead 3.

[0217] In some embodiments, as shown in Figures 12 and 13, the connecting lead 3 further includes a fifth lead segment 35 located on the second surface 1b. The fifth lead segment 35 includes a sixth sub-portion 351 and a seventh sub-portion 352. The sixth sub-portion 351 is closer to the selected side surface 1cc than the seventh sub-portion 352. The sixth sub-portion 351 is connected to the fourth lead segment 34. The minimum width of the fourth lead segment 34 is greater than the average width of the seventh sub-portion 352. The maximum width of the seventh sub-portion 352 is less than the average width of the sixth sub-portion 351. The width of the sixth sub-portion 351 gradually increases in a direction perpendicular to the selected side surface 1cc.

[0218] For example, the minimum width of the fourth lead segment 34 is greater than the maximum width of the seventh sub-portion 352. The width relationship between the fourth lead segment 34 and the seventh sub-portion 352 can be found in the above description of the width relationship between the second lead segment 32 and the first sub-portion 311, which will not be repeated here.

[0219] For example, the maximum width of the seventh subsection 352 is smaller than the minimum width of the sixth subsection 351. For the width relationship between the sixth subsection 351 and the seventh subsection 352, refer to the above description of the width relationship between the first subsection 311 and the second subsection 312, which will not be repeated here.

[0220] One end of the sixth sub-section 351 is connected to the seventh sub-section 352, and the other end is connected to the fourth lead segment 34. The width of the sixth sub-section 351 located between the two gradually increases from the smaller one to the larger one, thereby ensuring that the width of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the side surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easy to break due to the uneven side surface, thereby increasing the reliability of the connecting lead 3.

[0221] Furthermore, the increased width of the sixth sub-portion 351 can also reduce the overall line resistance of the connecting lead 3 , thereby reducing the power consumption of the connecting lead 3 , which is beneficial to achieving the technical effect of reducing the power consumption of the display panel 10 .

[0222] In some embodiments, as shown in FIG. 10 and FIG. 13 , the thickness of the sixth sub-portion 351 gradually increases along a direction perpendicular to the selected side surface 1 cc.

[0223] One end of the sixth sub-section 351 is connected to the fourth sub-section 332, and the other end is connected to the fourth lead segment 34. The thickness of the sixth sub-section 351 located between the two gradually increases from the one with smaller thickness to the one with larger thickness, thereby ensuring that the thickness of each part of the connecting lead 3 is continuous and gradually changes, thereby ensuring that the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface.

[0224] In some embodiments of the present disclosure, the upper surface of the connecting lead 3 is a smooth and continuous plane or curved surface, which can effectively avoid the problem of the connecting lead 3 being easily broken due to the uneven upper surface of the connecting lead 3, thereby increasing the reliability of the connecting lead 3.

[0225] Exemplarily, as shown in FIG. 10 and FIG. 13 , the sixth sub-portion 351 extends along the first direction X, and the thickness of the sixth sub-portion 351 gradually increases along the first direction X and in a direction toward the selected side surface 1 cc.

[0226] In some embodiments, as shown in FIG. 10 and FIG. 11 , the minimum thickness of the fourth lead segment 34 is greater than the average thickness of the seventh sub-portion 352 .

[0227] For example, the minimum thickness of the fourth lead segment 34 is greater than the maximum thickness of the seventh sub-portion 352. The thickness relationship between the fourth lead segment 34 and the seventh sub-portion 352 can be referred to the above description of the thickness relationship between the second lead segment 32 and the first sub-portion 311, which will not be repeated here.

[0228] The fourth lead segment 34, located on the second transition surface 1e, is located at a corner of the substrate 1. Compared to the seventh sub-portion 352 located on the second surface 1b, the fourth lead segment 34 is subject to greater stress and is more susceptible to defects such as narrowing or breakage during the manufacturing process. Increasing the thickness of the fourth lead segment 34 reduces the risk of stress and defects during the manufacturing process, thereby improving the reliability of the connecting lead 3.

[0229] In some embodiments, the connecting lead 3 includes a first lead segment 31, a second lead segment 32, a third lead segment 33, and a fourth lead segment 34, which are sequentially connected. The first lead segment 31 has an average thickness of D1, the second lead segment 32 has an average thickness of D2, the third lead segment 33 has an average thickness of D3, and the fourth lead segment 34 has an average thickness of D4.

[0230] The average thickness D2 of the second lead segment 32 is greater than the average thickness D1 of the first lead segment 31, D2>D1; and / or, the average thickness D2 of the second lead segment 32 is greater than the average thickness D3 of the third lead segment 33, D2>D3; and / or, the average thickness D4 of the fourth lead segment 34 is greater than the average thickness D1 of the first lead segment 31, D4>D1; and / or, the average thickness D4 of the fourth lead segment 34 is greater than the average thickness D3 of the third lead segment 33, D4>D3.

[0231] Illustratively, 1.5D1≤D2≤3D1; and / or, 1.5D3≤D2≤3D3; and / or, 1.5D1≤D4≤3D1; and / or, 1.5D3≤D4≤3D3.

[0232] When the thickness of each portion of the connecting lead 3 is greater than or equal to the first set thickness H1, the drive signal in the display panel can be normally and stably transmitted through the connecting lead 3. When forming the connecting lead 3 by multiple printing processes, the printing parameters are adjusted so that the printing paste falls more on the front corner of the substrate 1 (the first transition surface 1d) and the back corner of the substrate 1 (the second transition surface 1e) than on other locations. This ensures that the thickness h2 of the connecting lead 3 formed at any location within the first transition surface 1d and the second transition surface 1e of the substrate 1 is greater than the first set thickness H1, and the thickness h3 of the remaining portion of the connecting lead 3 at any location is greater than or equal to the first set thickness H1, and h2 is greater than h3.

[0233] By increasing the thickness of the connecting lead 3 at the front corner of the substrate 1 and / or the back corner of the substrate 1, and controlling the ratio range between the thickness of the portion of the connecting lead 3 located at the corner position of the substrate 1 and the thickness of the portion of the connecting lead 3 located on the rest of the surface of the substrate 1, the problem of the connecting lead 3 being too small in width / thickness or being broken during the preparation process is reduced, and the preparation yield of the connecting lead 3 is improved. While ensuring the stability of signal transmission in the display panel 10, there will not be a large difference in the width and thickness of each portion of the connecting lead 3, thereby ensuring the width uniformity and thickness uniformity of the connecting lead 3.

[0234] In some other embodiments, the connecting lead 3 further includes a fifth lead segment 35 having an average thickness D5. The average thickness D2 of the second lead segment 32 is greater than the average thickness D5 of the fifth lead segment 35, where D2>D5; and / or the average thickness D4 of the fourth lead segment 34 is greater than the average thickness D5 of the fifth lead segment 35, where D4>D5.

[0235] Illustratively, 1.5D5≤D2≤3D5; and / or, 1.5D5≤D4≤3D5.

[0236] For the technical effects brought about by the thickness ratio relationship between the second lead segment 32 and the fourth lead segment 34 and the fifth lead segment 35, please refer to the technical effects brought about by the thickness ratio relationship between the second lead segment 32 and the fourth lead segment 34 and the first lead segment 31 and the third lead segment 33 described above, which will not be repeated here.

[0237] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that a person skilled in the art can conceive within the technical scope disclosed in the present disclosure should be included within the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A display panel, comprising: A substrate comprising a first surface and a second surface opposite to each other, a plurality of side surfaces located between the first surface and the second surface, a first transition surface connecting the first surface and the side surfaces, and a second transition surface connecting the second surface and the side surfaces; At least one of the plurality of side surfaces is a selected side surface; a first electrode, located on the first surface and disposed near the selected side surface; a connecting lead, one end of which is connected to the first electrode, and the connecting lead extends from the first surface to the second surface via the first transition surface, the selected side surface, and the second transition surface in sequence; Wherein, the connecting lead includes a first lead segment, a second lead segment, a third lead segment and a fourth lead segment connected in sequence, the first lead segment is located on the first surface, the second lead segment is located on the first transition surface, the third lead segment is located on the selected side surface, and the fourth lead segment is located on the second transition surface, and the minimum width of at least one of the second lead segment and the fourth lead segment is greater than the average width of the third lead segment.

2. The display panel according to claim 1, wherein A minimum thickness of at least one of the second lead segment and the fourth lead segment is greater than an average thickness of the third lead segment.

3. The display panel according to claim 1 or 2, wherein: The first lead segment includes a first sub-portion and a second sub-portion connected to each other, the first sub-portion is connected to the first electrode, and the second sub-portion is connected to the second lead segment; The maximum width of the first subsection is smaller than the average width of the second subsection, and the width of the second subsection gradually increases along a direction perpendicular to the selected side surface; the minimum width of the second lead segment is larger than the average width of the first subsection.

4. The display panel according to claim 3, wherein: The thickness of the second sub-portion gradually increases along a direction perpendicular to the selected side surface.

5. The display panel according to claim 3 or 4, wherein: A minimum thickness of the second lead segment is greater than an average thickness of the first subsection.

6. The display panel according to any one of claims 1 to 5, wherein: The third lead segment includes a third sub-portion, a fourth sub-portion, and a fifth sub-portion connected in sequence, the third sub-portion is connected to the second lead segment, and the fifth sub-portion is connected to the fourth lead segment; The minimum width of the third subsection is greater than the average width of the fourth subsection, and the width of the third subsection gradually increases in a direction perpendicular to the first surface; the minimum width of the second lead segment is greater than the average width of the fourth subsection.

7. The display panel according to claim 6, wherein: The thickness of the third sub-portion gradually increases along a direction perpendicular to the first surface.

8. The display panel according to claim 6 or 7, wherein: A minimum thickness of the second lead segment is greater than an average thickness of the fourth sub-portion.

9. The display panel according to any one of claims 1 to 8, wherein: The third lead segment includes a third sub-portion, a fourth sub-portion, and a fifth sub-portion connected in sequence, the third sub-portion is connected to the second lead segment, and the fifth sub-portion is connected to the fourth lead segment; The minimum width of the fifth sub-section is greater than the average width of the fourth sub-section, and the width of the fifth sub-section gradually increases along a direction perpendicular to the second surface; the minimum width of the fourth lead segment is greater than the average width of the fourth sub-section.

10. The display panel according to claim 9, wherein: The thickness of the fifth sub-portion gradually increases along a direction perpendicular to the second surface.

11. The display panel according to claim 9 or 10, wherein: A minimum thickness of the fourth lead segment is greater than an average thickness of the fourth sub-portion.

12. The display panel according to any one of claims 1 to 11, wherein: The connecting lead further includes a fifth lead segment located on the second surface, the fifth lead segment including a sixth sub-portion and a seventh sub-portion connected to each other, the sixth sub-portion being closer to the selected side surface than the seventh sub-portion, and the sixth sub-portion being connected to the fourth lead segment; The maximum width of the seventh subsection is smaller than the average width of the sixth subsection, and the width of the sixth subsection gradually increases along a direction perpendicular to the selected side surface. The minimum width of the fourth lead segment is larger than the average width of the seventh subsection.

13. The display panel according to claim 8, wherein: The thickness of the sixth sub-portion gradually increases along a direction perpendicular to the selected side surface.

14. The display panel according to claim 12 or 13, wherein: A minimum thickness of the fourth lead segment is greater than an average thickness of the seventh sub-portion.

15. The display panel according to any one of claims 1 to 14, wherein: The average thickness of the first lead segment is D1, the average thickness of the second lead segment is D2, the average thickness of the third lead segment is D3, and the average thickness of the fourth lead segment is D4; 1.5D1≤D2≤3D1; and / or, 1.5D3≤D2≤3D3; and / or, 1.5D1≤D4≤3D1; and / or, 1.5D3≤D4≤3D3.

16. A spliced ​​display device, comprising: A plurality of display panels according to any one of claims 1 to 15, which are spliced ​​together; A circuit board is connected to the display panel, and is configured to drive the display panel to display an image.

17. A method for manufacturing a display panel, the display panel comprising a substrate, the substrate comprising a first surface and a second surface opposite to each other, a plurality of side surfaces located between the first surface and the second surface, a first transition surface connecting the first surface and the side surfaces, and a second transition surface connecting the second surface and the side surfaces; At least one of the plurality of side surfaces is a selected side surface; The preparation method comprises: A connecting lead is formed by a multiple-printing method, wherein the connecting lead extends from the first surface through the first transition surface, the selected side surface, the second transition surface, and to the second surface; During the printing process, at least one printing parameter is adjusted so that the amount of slurry printed per unit time on the first transition surface and / or the second transition surface is greater than the amount of slurry printed per unit time on the selected side surface.

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