Display module and display apparatus

Abstract

The present application relates to the technical field of display, and discloses a display module and a display apparatus. The display module comprises a display panel, a plurality of driving chips, and a plurality of first buffer portions. The driving chips and the first buffer portions are all connected to the side of a second panel portion facing away from a first panel portion, and in a direction perpendicular to a display surface, the thickness of the first buffer portions is greater than the thickness of the driving chips. Therefore, when a display apparatus in which the display module is mounted is pressed, the first buffer portions can withstand the pressing force. The first buffer portions have a good buffer effect, so that when the first buffer portions are pressed, under the buffer effect of the first buffer portions on the pressing force, the pressing force can be dissipated by the first buffer portions, so as to lower the probability of the driving chips being pressed, thereby avoiding the probability of damage to the driving chips due to pressing. In this way, the first buffer portions can protect the driving chips, improving the reliability of the display apparatus in which the display module is mounted.

Description

Display module and display device

[0001] This application claims priority to Chinese patent application No. 202410232338.3 filed on February 29, 2024, entitled “Display Module and Display Device,” the entire contents of which are incorporated herein by reference. Technical Field

[0002] The present application relates to the field of display technology, and in particular to a display module and a display device. Background Art

[0003] With the development of display technology, the demand and application scope of display devices are constantly expanding. Commonly used display devices include televisions, tablet computers, laptops, and monitors.

[0004] A display device may generally include: a display module and a housing. The display module may include: a display panel and a driver chip bound and connected to the display panel.

[0005] However, when the display device is squeezed, the housing of the display device will also squeeze the driver chip in the display module, causing the driver chip to be easily damaged, thereby resulting in low reliability of the display device. Summary of the Invention

[0006] The present application provides a display module that can solve the problem in the prior art where the driver chip is easily damaged by squeezing. The technical solution is as follows:

[0007] In one aspect, a display module is provided, comprising:

[0008] A display panel, the display panel comprising: a first panel portion and a second panel portion arranged opposite to each other, and a panel bending portion for connecting the first panel portion and the second panel portion, wherein the first panel portion has a display surface;

[0009] a plurality of driver chips fixedly connected to a side of the second panel portion facing away from the first panel portion;

[0010] and a first buffer portion located between two adjacent driving chips, the first buffer portion being connected to a side of the second panel portion facing away from the first panel portion;

[0011] Wherein, in a direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driving chip.

[0012] Optionally, in the length extension direction of the second panel portion, a first gap is provided between the first buffer portion and the adjacent driving chip.

[0013] Optionally, there is at least one first buffer portion between two adjacent driving chips, the first buffer portion is strip-shaped, and a length extension direction of the first buffer portion is parallel to a length extension direction of the second panel portion.

[0014] Optionally, when there are multiple first buffer portions between two adjacent driving chips, a distance between two adjacent first buffer portions is greater than or equal to an extension length of the first buffer portion.

[0015] Optionally, the second panel portion has a plurality of connection areas corresponding one-to-one to the plurality of driver chips, and the driver chips are closer to the panel bending portion than to the corresponding connection areas;

[0016] The display module further includes: a plurality of flexible circuit boards connected to the plurality of connection areas in a one-to-one correspondence, and a second buffer portion located between two adjacent flexible circuit boards, the second buffer portion being connected to the back surface of the first panel portion;

[0017] Wherein, in a direction perpendicular to the display surface, a thickness of the second buffer portion is greater than a distance between a surface of the flexible circuit board facing away from the first panel portion and a back surface of the first panel portion.

[0018] Optionally, in the length extension direction of the second panel portion, a second gap is provided between the second buffer portion and the adjacent flexible circuit board;

[0019] In a direction perpendicular to the length extension of the second panel portion, a third gap is defined between the first buffer portion and the connecting region.

[0020] Optionally, both the first buffer portion and the second buffer portion include: a colloid layer, a support layer, and an elastic buffer layer that are stacked, and the colloid layer is closer to the display panel than the elastic buffer layer.

[0021] Optionally, the first buffer portion and the second buffer portion are provided separately.

[0022] Optionally, in a direction perpendicular to the length extension of the second panel portion, a distance between the second buffer portion and the second panel portion is greater than or equal to a width of the second buffer portion.

[0023] Optionally, the support layer in the first buffer portion and the support layer in the second buffer portion are an integral structure, and the elastic buffer layer in the first buffer portion and the elastic buffer layer in the second buffer portion are an integral structure.

[0024] Optionally, the thickness of the colloid layer in the first buffer portion is smaller than the thickness of the colloid layer in the second buffer portion.

[0025] Optionally, a side of the colloid layer in the first buffer portion facing away from the second panel portion is flush with a side of the colloid layer in the second buffer portion facing away from the first panel portion.

[0026] Optionally, both the first buffer portion and the second buffer portion are strip-shaped, and an extension direction of the first buffer portion intersects with an extension direction of the second buffer portion.

[0027] Optionally, when the number of the first buffer portion between two adjacent driving chips is one, and the number of the second buffer portion between two adjacent flexible circuit boards is one, an end portion of the second buffer portion is connected to a central portion of the first buffer portion;

[0028] Alternatively, when there are two first buffer portions between two adjacent driving chips and two second buffer portions between two adjacent flexible circuit boards, an end portion of the second buffer portion is connected to an end portion of the first buffer portion.

[0029] On the other hand, a display device is provided, including: a housing, and a display module connected to the housing, wherein the display module is any one of the display modules described above.

[0030] The beneficial effects of the technical solutions provided in the embodiments of the present application include at least:

[0031] A display module includes: a display panel, multiple driver chips and multiple first buffer parts. Since the driver chip and the first buffer part in the display module are both connected to the side of the second panel part away from the first panel part, and the thickness of the first buffer part is greater than the thickness of the driver chip in the direction perpendicular to the display surface. Therefore, when the display device equipped with the display module is squeezed, the first buffer part can withstand the squeezing force. The first buffer part has a good buffering effect. After the first buffer part is squeezed, the squeezing force can be dissipated by the first buffer part through the buffering effect of the first buffer part on the squeezing force, so that the probability of the driver chip being squeezed is low, thereby avoiding the probability of the driver chip being damaged due to squeezing. In this way, the first buffer part can protect the driver chip and improve the reliability of the display device equipped with the display module. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] FIG1 is a top view of a display module provided in an embodiment of the present application;

[0034] FIG2 is a cross-sectional view of the display module shown in FIG1 taken along line AA′;

[0035] FIG3 is a partial enlarged view of a display module provided in an embodiment of the present application;

[0036] FIG4 is a top view of another display module provided in an embodiment of the present application;

[0037] FIG5 is a partial enlarged view of the display module shown in FIG4;

[0038] FIG6 is a cross-sectional view of a display module provided in an embodiment of the present application;

[0039] FIG7 is a partial enlarged view of another display module shown in FIG4;

[0040] FIG8 is a schematic structural diagram of a display module provided in an embodiment of the present application;

[0041] FIG9 is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0042] FIG10 is a top view of another display module provided in an embodiment of the present application;

[0043] FIG11 is a schematic structural diagram of another display module provided in an embodiment of the present application;

[0044] FIG12 is a partial enlarged view of the display module shown in FIG10 ;

[0045] FIG13 is a top view of a display module provided in another embodiment of the present application;

[0046] FIG14 is a schematic structural diagram of a display device provided in an embodiment of the present application;

[0047] FIG15 is a schematic structural diagram of another display device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0048] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0049] An embodiment of the present application provides a display module. Referring to Figures 1 and 2 , Figure 1 is a top view of a display module according to an embodiment of the present application, and Figure 2 is a cross-sectional view of the display module shown in Figure 1 taken along line AA'. The display module 000 may include a display panel 100, a plurality of driver chips 200, and a plurality of first buffers 300.

[0050] The display panel 100 may include: a first panel portion 101 and a second panel portion 102 disposed opposite each other, and a panel bending portion 103 for connecting the first panel portion 101 and the second panel portion 102. The panel bending portion 103 may be located between the first panel portion 101 and the second panel portion 102, with one side of the panel bending portion 103 connected to the first panel portion 101 and the other end of the panel bending portion 103 connected to the second panel portion 102. The first panel portion 101 in the display panel 100 may have a display surface.

[0051] The driver chip 200 in the display module 000 can be fixedly connected to the side of the second panel portion 102 facing away from the first panel portion 101. It should be noted that signal traces are integrated into the first panel portion 101, the second panel portion 102, and the panel bend portion 103 in the display panel 100. The signal traces in the panel bend portion 103 can connect the signal traces in the first panel portion 101 with the signal traces in the second panel portion 102. The signal traces in the first panel portion 101 can be electrically connected to the sub-pixels in the first panel portion 101. After the driver chip 200 is attached to the second panel portion 102 in the display panel 100, the driver chip 200 can be electrically connected to the signal traces in the second panel portion 102. In this way, the driver chip 200 can send drive signals to the sub-pixels in the first panel portion 101 via these signal traces, causing the sub-pixels in the first panel portion 101 to emit light outward, thereby allowing the display surface of the first panel portion 101 to display the corresponding image.

[0052] In the embodiment of the present application, the first buffer portion 300 in the display module 000 can be located between two adjacent driver chips 200, and the first buffer portion 300 can be connected to a side of the second panel portion 102 facing away from the first panel portion 101. In a direction perpendicular to the display surface P of the first panel portion 101, the thickness of the first buffer portion 300 can be greater than the thickness of the driver chip 200.

[0053] In this way, because the driver chip 200 and the first buffer portion 300 in the display module 000 are both connected to the side of the second panel portion 102 facing away from the first panel portion 101, and the thickness of the first buffer portion 300 is greater than that of the driver chip 200 in a direction perpendicular to the display surface P, when the display device with the display module 000 mounted thereon is subjected to pressure, the first buffer portion 300 can withstand the pressure. Furthermore, the first buffer portion 300 provides a strong cushioning effect. When the first buffer portion 300 is subjected to pressure, the pressure is dissipated by the first buffer portion 300, reducing the probability of the driver chip 200 being subjected to pressure and, in turn, the probability of damage to the driver chip 200 caused by pressure. In this way, the first buffer portion 300 protects the driver chip 200, improving the reliability of the display device with the display module 000 mounted thereon.

[0054] In summary, an embodiment of the present application provides a display module, comprising: a display panel, a plurality of driver chips and a plurality of first buffer portions. Since the driver chip and the first buffer portion in the display module are both connected to the side of the second panel portion facing away from the first panel portion, and in the direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driver chip. Therefore, when the display device equipped with the display module is squeezed, the first buffer portion can withstand the squeezing force. And the first buffer portion has a good buffering effect. After the first buffer portion is squeezed, the squeezing force can be dissipated by the first buffer portion through the buffering effect of the first buffer portion on the squeezing force, so that the probability of the driver chip being squeezed is low, thereby avoiding the probability of the driver chip being damaged due to squeezing. In this way, the first buffer portion can protect the driver chip and improve the reliability of the display device equipped with the display module.

[0055] In this application, please refer to Figure 3, which is a partial enlarged view of a display module provided in an embodiment of the present application. In the longitudinal extension direction of the second panel portion 102 in the display panel 100, a first gap D1 may be formed between the first buffer portion 300 and the driver chip 200 in the display module 000.

[0056] It should be noted that after the first buffer portion 300 is squeezed, it can deform, providing a cushioning effect and thereby dissipating the squeezing force on the first buffer portion 300. Therefore, when a first gap D1 is provided between the first buffer portion 300 and the driver chip 200, the first buffer portion 300 will not contact the driver chip 200 when it deforms. This prevents the deformed first buffer portion 300 from squeezing the driver chip 200, further protecting the driver chip 200.

[0057] It should also be noted that, along the lengthwise extension of the second panel portion 102 of the display panel 100, the first gap D1 between the first buffer portion 300 and the driver chip 200 can be the sum of the outer tolerance of the first buffer portion 300, the lamination tolerance of the first buffer portion 300, and the material tolerance of the driver chip 200. The length of the first gap D1 between the first buffer portion 300 and the driver chip 200 can be in the range of 0.1 mm to 1 mm. For example, the length of the first gap D1 between the first buffer portion 300 and the driver chip 200 can be 1.5 mm.

[0058] In the present application, a fourth gap B1 may also be provided between the first buffer portion 300 and the outer edge of the panel bend portion 103 in a direction perpendicular to the length of the second panel portion 102. Similarly, when the first buffer portion 300 is deformed by the squeezing force, the fourth gap B1 provided between the first buffer portion 300 and the outer edge of the panel bend portion 103 ensures that the first buffer portion 300 does not contact the panel bend portion 103 during deformation, thereby preventing the deformed first buffer portion 300 from squeezing the panel bend portion 103 and protecting the panel bend portion 103.

[0059] It should be noted that, in the length extension direction perpendicular to the second panel portion 102, the length of the fourth gap B1 between the outer edge of the first buffer portion 300 and the panel bending portion 103 can be in the range of 1 mm to 3 mm. For example, the length of the fourth gap B1 between the first buffer portion 300 and the outer edge of the panel bending portion 103 can be 1.5 mm.

[0060] In the present application, in a direction perpendicular to the length of the second panel portion 102, the first buffer portion 300 can be closer to the outer edge of the panel bend portion 103 relative to the driver chip 200. Thus, compared to a case where the driver chip 200 is closer to the outer edge of the panel bend portion 103 relative to the first buffer portion 300, when the first buffer portion 300 is closer to the outer edge of the panel bend portion 103 relative to the driver chip 200, the width B4 of the first buffer portion 300 in the direction perpendicular to the length of the second panel portion 102 can be sufficiently large, so that the first buffer portion 300 can have a better buffering effect, thereby better protecting the driver chip 200.

[0061] Alternatively, please refer to Figure 4, which is a top view of another display module provided in an embodiment of the present application. The number of first buffer portions 300 between two adjacent driver chips 200 in the display module 000 may be at least one. The first buffer portion 300 in the display module 000 may be strip-shaped, and the length of the first buffer portion 300 may extend parallel to the length of the second panel portion 102.

[0062] It should be noted that, as shown in FIG3 , when there is only one first buffer portion 300 between two adjacent driver chips 200 in the display module 000, the distance B2 between two adjacent driver chips 200 in the lengthwise direction of the second panel portion 102 is approximately in the range of 33 mm to 42 mm. Since the length D1 of the first gap between the first buffer portion 300 and the driver chip 200 between the two adjacent driver chips 200 can be in the range of 0.1 mm to 1 mm, the extended length B3 of the first buffer portion 300 in the lengthwise direction of the second panel portion 102 can be in the range of 35 mm to 40 mm. For example, the extended length B3 of the first buffer portion 300 in the lengthwise direction of the second panel portion 102 can be 38.25 mm.

[0063] In this application, please refer to Figure 5, which is a partial enlarged view of the display module shown in Figure 4. When there are multiple first buffer sections 300 between two adjacent driver chips 200 in display module 000, the distance B5 between two adjacent first buffer sections 300 can be greater than or equal to the extended length B3 of the first buffer section 300. Thus, compared to the case where there is only one first buffer section 300 between two adjacent driver chips 200 in display module 000, when there are multiple first buffer sections 300 between two adjacent driver chips 200 in display module 000, the first buffer section 300 can protect the driver chip 200 while reducing the material used for the first buffer section 300, thereby lowering the manufacturing cost of the display device equipped with display module 000.

[0064] It should be noted that when there are multiple first buffers 300 between two adjacent driver chips 200 in the display module 000, a first gap D1 is defined between each driver chip 200 and the adjacent first buffer 300 along the lengthwise extension of the second panel portion 102. A fourth gap B1 is also defined between each first buffer 300 and the outer edge of the panel bend portion 103 along the lengthwise extension perpendicular to the second panel portion 102.

[0065] In this application, please refer to Figures 4 and 6. Figure 6 is a cross-sectional view of a display module provided in an embodiment of the present application. The second panel portion 102 of the display panel 100 can have multiple connection areas 400 corresponding to the multiple driver chips 300. The connection areas 400 in the second panel portion 102 can be closer to the panel bend 103 than to the driver chips 200.

[0066] The display module 000 may also include: a plurality of flexible circuit boards 500 connected one-to-one with the plurality of connection areas of the second panel portion 102, and a second buffer portion 600 located between two adjacent flexible circuit boards 500. Here, the driver chip 200 can be electrically connected to the corresponding flexible circuit board 500 via the corresponding connection area 400. The second buffer portion 600 in the display module 000 can be connected to the back surface of the first panel portion 101.

[0067] In the direction perpendicular to the display surface P, the thickness of the second buffer portion 600 in the display module 000 may be greater than the distance between a surface of the flexible circuit board 500 facing away from the first panel portion 101 and the back surface of the first panel portion 101 .

[0068] It should be noted that, as shown in FIG6 , there is a height difference between the back surface of the first panel portion 101 and the surface of the second panel portion 102 facing away from the first panel portion 101 in the display panel 100. Thus, the flexible printed circuit board 500 extends from the surface of the second panel portion 102 facing away from the first panel portion 101 to the back surface of the first panel portion 101. Here, in a direction perpendicular to the display surface, the thickness of the second buffer portion 600 can be greater than the distance between the surface of the flexible printed circuit board 500 facing away from the first panel portion 101 and the back surface of the first panel portion 101. In this way, the thickness of the second buffer portion 600 can be greater than the distance between the surface of the flexible printed circuit board 500 facing away from the first panel portion 101 and the back surface of the first panel portion 101.

[0069] Therefore, when the display device with display module 000 mounted thereon is squeezed, it is the second buffer portion 600 that bears the squeeze force. The second buffer portion 600 provides excellent cushioning. When squeezed, the squeeze force is dissipated by the second buffer portion 600, minimizing the chance of the flexible circuit board 500 being squeezed and, in turn, minimizing damage to the flexible circuit board 600 due to the squeeze. Thus, the second buffer portion 600 protects the flexible circuit board 500, improving the reliability of the display device with display module 000 mounted thereon.

[0070] In this application, please refer to FIG. 7 , which is a partial enlarged view of another display module shown in FIG. In the longitudinal extension direction of the second panel portion 102 , a second gap D2 may be provided between the second buffer portion 600 and the adjacent flexible circuit board 500 . Thus, when the second buffer portion 600 is squeezed and deformed, the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 ensures that the second buffer portion 600 will not contact the flexible circuit board 500 when the second buffer portion 600 is deformed, thereby preventing the deformed second buffer portion 600 from squeezing the flexible circuit board 500 and further protecting the flexible circuit board 500.

[0071] For example, along the lengthwise extension direction of the second panel portion 102, the second gap D2 between the second buffer portion 600 and the adjacent flexible printed circuit board 500 can be defined as the sum of the outer tolerance of the second buffer portion 600, the fitting tolerance of the second buffer portion 600, and the material tolerance of the flexible printed circuit board 500. Along the lengthwise extension direction of the second panel portion 102, the length of the second gap D2 between the second buffer portion 600 and the adjacent flexible printed circuit board 500 can be within a range of 0.1 mm to 1 mm. For example, along the lengthwise extension direction of the second panel portion 102, the length of the second gap D2 between the second buffer portion 600 and the adjacent flexible printed circuit board 500 can be 0.5 mm.

[0072] In the present application, as shown in FIG7 , a third gap D3 is defined between the first buffer portion 300 and the connection region 400 in a direction perpendicular to the length of the second panel portion 102. This third gap D3 prevents the first buffer portion 300 from contacting the connection region 400 when the first buffer portion 300 is squeezed and deformed, thereby preventing the deformed first buffer portion 300 from squeezing the connection region 400 and ensuring a reliable connection between the driver chip 200 and the flexible printed circuit board 500.

[0073] For example, in a direction perpendicular to the length of the second panel portion 102, the third gap D3 between the first buffer portion 300 and the connection area 400 can be the sum of the outer tolerance of the first buffer portion 300, the fitting tolerance of the first buffer portion 300, and the material tolerance of the driver chip 200. In a direction perpendicular to the length of the second panel portion 102, the length of the third gap D3 between the first buffer portion 300 and the connection area 400 can be in the range of 0.1 mm to 1 mm. For example, in a direction perpendicular to the length of the second panel portion 102, the length of the third gap D3 between the first buffer portion 300 and the connection area 400 can be 0.5 mm.

[0074] It should be noted that, along the lengthwise extension direction of the second panel portion 102, at the end of the flexible circuit board 500 away from the corresponding connection area 400, the distance between two adjacent flexible circuit boards 500 in the display module 000 can be within a range of 4 mm to 8 mm. Since the second gap D2 between the second buffer portion 600 and the adjacent flexible circuit board 500 is within a range of 0.1 mm to 1 mm, the width of the second buffer portion 600 along the lengthwise extension direction of the second panel portion 102 can be within a range of 5 mm to 7 mm. For example, the width of the second buffer portion 600 along the lengthwise extension direction of the second panel portion 102 can be 0.5 mm.

[0075] Optionally, please refer to Figure 8, which is a structural schematic diagram of a display module provided in an embodiment of the present application. The first buffer part 300 and the second buffer part 600 in the display module 000 may each include: a stacked colloid layer K1, a support layer K2, and an elastic buffer layer K3. The colloid layer K1 may be closer to the display panel 100 relative to the elastic buffer layer K2. Among them, the colloid layer K1 can play a fixing role to fix the first buffer part 300 and the second buffer part 600 on the display panel 100. The elastic buffer layer K3 can play a buffering role. When the first buffer part 300 and the second buffer part 600 are squeezed, the elastic buffer layer K3 can be deformed to eliminate the squeezing force. The support layer K2 can play a supporting role to support the elastic buffer layer. Here, the elastic buffer part K3 can be a foam with good cushioning properties.

[0076] In the present application, as shown in FIG7 , the first buffer portion 300 and the second buffer portion 600 in the display module 000 may be separately provided. Here, the colloid layer K1 in the first buffer portion 300 and the colloid layer K1 in the second buffer portion 600 are separately provided, the supporting layer K2 in the first buffer portion 300 and the supporting layer K2 in the second buffer portion 600 are separately provided, and the elastic buffer layer K3 in the first buffer portion 300 and the elastic buffer portion K3 in the second buffer portion 600 are separately provided.

[0077] As shown in Figure 8 , the colloid layer K1 in the first buffer portion 300 secures the first buffer portion 300 to the side of the second panel portion 102 facing away from the first panel portion 101. In a direction perpendicular to the display surface P of the first panel portion 101, the thickness H1 of the driver chip 200 can be smaller than the thickness H2 of the first buffer portion 300. This allows the elastic buffer layer K3 in the first buffer portion 300 to be compressed and deformed to dissipate the pressure, thereby reducing the likelihood of the driver chip 200 being compressed.

[0078] As shown in Figure 9, Figure 9 is a schematic structural diagram of another display module provided in an embodiment of the present application. The colloid layer K1 in the second buffer portion 600 can fix the second buffer portion 600 to the back of the first panel portion 101. In the direction perpendicular to the display surface P of the first panel portion 101, the thickness H3 of the second buffer portion 600 can be greater than the distance H4 between the side of the entire flexible circuit board 500 facing away from the first panel portion 101 and the back of the first panel portion 101. In this way. When the second buffer portion 600 is squeezed, the elastic buffer layer K3 in the second buffer portion 600 can be squeezed and deformed to eliminate the squeezing force, thereby reducing the probability of the flexible circuit board 500 being squeezed.

[0079] In this application, please refer to Figure 10, which is a top view of another display module provided in an embodiment of the present application. The first buffer portion 300 and the second buffer portion 600 in the display module 000 can be an integral structure. Since the first buffer portion 300 is connected to the side of the second panel portion 102 facing away from the first panel portion 101, the second buffer portion 300 is connected to the back of the first panel portion 101, and there is a height difference between the back of the first panel portion 101 and the side of the second panel portion 102 facing away from the first panel portion 101, in this case, please refer to Figure 11, which is a structural schematic diagram of another display module provided in an embodiment of the present application. The support layer K2 in the first buffer portion 300 can be an integral structure with the support layer K2 in the second buffer portion 600, and the elastic buffer layer K3 in the first buffer portion 300 can be an integral structure with the elastic buffer layer K3 in the second buffer portion 600.

[0080] In the present application, as shown in FIG11 , the height difference between the back surface of the first panel portion 101 and the surface of the second panel portion 102 facing away from the first panel portion 101 allows the thickness H5 of the colloidal layer K1 in the first buffer portion 300 to be less than the thickness H6 of the colloidal layer K1 in the second buffer portion 600. The difference between the thickness of the colloidal layer K1 in the first buffer portion 300 and the thickness of the colloidal layer K1 in the second buffer portion 600 is the height difference.

[0081] Optionally, as shown in FIG11 , the side of the colloid layer K3 in the first buffer portion 300 facing away from the second panel portion 102 is flush with the side of the colloid layer K3 in the second buffer portion 600 facing away from the first panel portion 101. Furthermore, the thickness of the support layer K2 provided on the side of the colloid layer K3 in the first buffer portion 300 facing away from the second panel portion 102 is the same as the thickness of the support layer K2 provided on the side of the colloid layer K3 in the second buffer portion 600 facing away from the first panel portion 101. Therefore, the support layer K2 in the first buffer portion 300 and the support layer K2 in the second buffer portion 600 may be an integral structure. Similarly, the thickness of the elastic buffer layer K3 provided on the side of the support layer K2 in the first buffer portion 300 facing away from the second panel portion 102 is the same as the thickness of the elastic buffer layer K3 provided on the side of the colloidal layer K3 in the second buffer layer 600 facing away from the first panel portion 101. Therefore, the elastic buffer layer K3 in the first buffer portion 300 can be an integral structure with the elastic buffer layer K3 in the second buffer portion 600.

[0082] In this way, when the first buffer part 300 and the second buffer part 600 are squeezed, the first buffer part 300 and the second buffer part 600 can withstand the squeeze at the same time, and the elastic buffer layer K3 of the first buffer part 300 and the second buffer part 600, which is an integrated structure, can be deformed to eliminate the squeezing force, thereby reducing the probability of the driving chip 200 and the flexible circuit board 500 being squeezed.

[0083] In this application, please refer to Figure 12, which is a partial enlarged view of the display module shown in Figure 10. The first buffer portion 300 and the second buffer portion 600 in the display module can both be strip-shaped, and the extension direction of the first buffer portion 300 can intersect with the extension direction of the second buffer portion 600. Here, the extension direction of the first buffer portion 300 can be the longitudinal extension direction of the second panel portion 102, and the extension direction of the second buffer portion 600 can be perpendicular to the longitudinal extension direction of the second panel portion 102. In other words, the first buffer portion 300 can intersect the second buffer portion 600 at a right angle.

[0084] For example, the length of the first buffer portion 300 in the direction extending longitudinally of the second panel portion 102 can be in a range of 35 mm to 40 mm, and the width of the first buffer portion 300 in a direction perpendicular to the length extending of the second panel portion 102 can be in a range of 2.5 mm to 4 mm. The width of the second buffer portion 600 in the direction extending longitudinally of the second panel portion 102 can be in a range of 5 mm to 7 mm. In the direction extending perpendicular to the length extending of the second panel portion 102, one end of the second buffer portion 600 can intersect with the first buffer portion 300, and the other end can be flush with the end of the flexible printed circuit board 500 facing away from the driver chip 200.

[0085] Optionally, as shown in Figure 12, when the number of first buffer portions 300 between two adjacent driving chips 200 in the display module 000 is one and the number between two adjacent flexible circuit boards 500 is one, the end of the second buffer portion 600 can be connected to the central portion of the first buffer portion 300.

[0086] Alternatively, please refer to Figure 13, which is a top view of a display module provided by another embodiment of the present application. In a display module 000, when there are two first buffers 300 between two adjacent driver chips 200 and two second buffers 600 between two adjacent flexible circuit boards 500, the ends of the second buffers 600 can be connected to the ends of the first buffers 300. Thus, compared to a display module 000 in which there are only one first buffer 300 between two adjacent driver chips 200 and one second buffer 600 between two adjacent flexible circuit boards 500, the overall material consumption of the first and second buffers 300, 600, is reduced, thereby saving costs.

[0087] It should be noted that, as shown in Figures 10 and 13, when the first buffer portion 300 and the second buffer portion 600 in the display module 000 are connected together, while the first buffer portion 300 protects the driver chip 200 and the second buffer portion 600 protects the flexible circuit board 500, the connection area 400 between the driver chip 200 and the flexible circuit board 500 can also be protected, so that the probability of the connection area 400 being squeezed is lower, thereby improving the reliability of the connection between the driver chip 200 and the flexible circuit board 500, and further improving the reliability of the display device installed with the display module 000.

[0088] In summary, an embodiment of the present application provides a display module, comprising: a display panel, a plurality of driver chips and a plurality of first buffer portions. Since the driver chip and the first buffer portion in the display module are both connected to the side of the second panel portion facing away from the first panel portion, and in the direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driver chip. Therefore, when the display device equipped with the display module is squeezed, the first buffer portion can withstand the squeezing force. And the first buffer portion has a good buffering effect. After the first buffer portion is squeezed, the squeezing force can be dissipated by the first buffer portion through the buffering effect of the first buffer portion on the squeezing force, so that the probability of the driver chip being squeezed is low, thereby avoiding the probability of the driver chip being damaged due to squeezing. In this way, the first buffer portion can protect the driver chip and improve the reliability of the display device equipped with the display module.

[0089] The present application also provides a display device, which can be a television, tablet computer, laptop computer, or the like. Please refer to Figure 14, which is a schematic diagram of the structure of a display device provided by the present application. Display device 001 may include a housing 011 and a display module 000 connected to the housing. Display module 000 may be any of the display modules 000 described above.

[0090] In this application, please refer to Figures 14 and 15. Figure 15 is a schematic diagram of the structure of another display device provided in an embodiment of the present application. The housing 011 in the display device 001 may include a cover plate 0111 and a frame 0112. The frame 0112 in the housing 011 may be fixedly connected to the four sides of the display module 000 to secure the display module 000 within the housing 011. The cover plate 0111 in the housing 011 may be fixedly connected to the side of the frame 0112 facing away from the display surface. When the display device 001 is squeezed, the portion of the cover plate 0111 not fixedly connected to the frame 0112 may move toward the display panel 100 in the display module 000. This allows the first buffer portion 300 to withstand the squeeze from the cover plate 0111. When squeezed, the first buffer portion 300 may deform to dissipate the squeeze, thereby reducing the probability of damage to the driver chip 200 caused by the squeeze. In this way, the reliability of the display device 001 is improved.

[0091] It should be noted that in the accompanying drawings, the sizes of layers and regions may be exaggerated for clarity of illustration. It will also be understood that when an element or layer is referred to as being "on" another element or layer, it may be directly on the other element, or there may be an intermediate layer. In addition, it will be understood that when an element or layer is referred to as being "under" another element or layer, it may be directly under the other element, or there may be more than one intermediate layer or element. In addition, it will also be understood that when a layer or element is referred to as being "between" two layers or elements, it may be the only layer between the two layers or elements, or there may also be more than one intermediate layer or element. Similar reference numerals throughout the text indicate similar elements.

[0092] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance. The term "plurality" refers to two or more than two, unless expressly limited otherwise.

[0093] The above description is merely an optional embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the scope of protection of the present application.

Claims

1. A display module, characterized in that: include: A display panel, the display panel comprising: a first panel portion and a second panel portion arranged opposite to each other, and a panel bending portion for connecting the first panel portion and the second panel portion, wherein the first panel portion has a display surface; a plurality of driver chips fixedly connected to a side of the second panel portion facing away from the first panel portion; and a first buffer portion located between two adjacent driving chips, the first buffer portion being connected to a side of the second panel portion facing away from the first panel portion; Wherein, in a direction perpendicular to the display surface, the thickness of the first buffer portion is greater than the thickness of the driving chip.

2. The display module according to claim 1, wherein: In the longitudinal extension direction of the second panel portion, a first gap is defined between the first buffer portion and the adjacent driving chip.

3. The display module according to claim 1, wherein: There is at least one first buffer portion between two adjacent driving chips. The first buffer portion is strip-shaped, and a lengthwise extension direction of the first buffer portion is parallel to a lengthwise extension direction of the second panel portion.

4. The display module according to claim 3, wherein: When there are a plurality of first buffer portions between two adjacent driving chips, a distance between two adjacent first buffer portions is greater than or equal to an extension length of the first buffer portion.

5. The display module according to any one of claims 1 to 4, characterized in that: The second panel portion has a plurality of connection areas corresponding to the plurality of driver chips, and the driver chips are closer to the panel bending portion than the corresponding connection areas; The display module further includes: a plurality of flexible circuit boards connected to the plurality of connection areas in a one-to-one correspondence, and a second buffer portion located between two adjacent flexible circuit boards, the second buffer portion being connected to the back surface of the first panel portion; Wherein, in a direction perpendicular to the display surface, a thickness of the second buffer portion is greater than a distance between a surface of the flexible circuit board facing away from the first panel portion and a back surface of the first panel portion.

6. The display module according to claim 5, wherein: In the longitudinal extension direction of the second panel portion, a second gap is formed between the second buffer portion and the adjacent flexible circuit board; In a direction perpendicular to the length extension of the second panel portion, a third gap is defined between the first buffer portion and the connecting region.

7. The display module according to claim 5, wherein: The first buffer portion and the second buffer portion each include a colloidal layer, a supporting layer, and an elastic buffer layer that are stacked. The colloidal layer is closer to the display panel than the elastic buffer layer.

8. The display module according to claim 7, wherein: The first buffer portion and the second buffer portion are separately provided.

9. The display module according to claim 8, wherein: In a direction perpendicular to the length extension of the second panel portion, a distance between the second buffer portion and the second panel portion is greater than or equal to a width of the second buffer portion.

10. The display module according to claim 7, wherein: The support layer in the first buffer portion and the support layer in the second buffer portion are an integral structure, and the elastic buffer layer in the first buffer portion and the elastic buffer layer in the second buffer portion are an integral structure.

11. The display module according to claim 10, wherein: The thickness of the colloid layer in the first buffer portion is smaller than the thickness of the colloid layer in the second buffer portion.

12. The display module according to claim 11, wherein: A side of the colloid layer in the first buffer portion facing away from the second panel portion is flush with a side of the colloid layer in the second buffer portion facing away from the first panel portion.

13. The display module according to any one of claims 10 to 12, characterized in that: The first buffer portion and the second buffer portion are both strip-shaped, and an extending direction of the first buffer portion intersects with an extending direction of the second buffer portion.

14. The display module according to claim 13, wherein: When the number of the first buffer portion between two adjacent driving chips is one, and the number of the second buffer portion between two adjacent flexible circuit boards is one, an end portion of the second buffer portion is connected to a central portion of the first buffer portion; Alternatively, when there are two first buffer portions between two adjacent driving chips and two second buffer portions between two adjacent flexible circuit boards, an end portion of the second buffer portion is connected to an end portion of the first buffer portion.

15. A display device, characterized in that: The device comprises: a housing, and a display module connected to the housing, wherein the display module is the display module according to any one of claims 1 to 14.

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