Mounting head, mounting device, and control method

Abstract

A mounting head according to the present disclosure is used in a mounting device executing mounting processing for mounting an object on a substrate and collects the object with a collection member, the mounting head comprising: a head body that is held by the mounting device so as to be movable in a collection direction in which the object and the substrate are brought close to or separated from each other; an attachment part which is disposed on the head body so as to be movable in the collection direction and to which the collection member is detachably attached; an attachment moving part that moves the attachment part in the collection direction; and an imaging part that is attached to the head body so as not to be movable at least in the collection direction with respect to the head body, and can image at least one of the collection member and the object collected by the collection member, from a direction intersecting the collection direction.

Description

Mounting head, mounting device, and control method

[0001] The present invention relates to a mounting head, a mounting device, and a control method.

[0002] A mounting head has been proposed for use in a mounting device that performs a mounting process to mount components on a circuit board, and that picks up components with a component suction nozzle (see, for example, Patent Document 1). This head includes a head body that detachably holds the component suction nozzle, an imaging unit that is positioned so that the side of the component is within its field of view and captures an image of the side of the component picked up by the component suction nozzle, and a position switching device that moves the imaging unit up and down. When performing the mounting process, this mounting head uses the position switching device to move the imaging unit up and down to prevent interference between the component picked up by the component suction nozzle and the imaging unit.

[0003] Patent No. 6108414

[0004] However, with the above-mentioned mounting head, the movable part of the position switching device may shift during the mounting process, causing a shift in the position or angle of the imaging unit. If a shift in the position or angle of the imaging unit occurs, it may be impossible to obtain a proper captured image, or the imaging unit may interfere with the object to be picked up by the component suction nozzle.

[0005] The mounting head, mounting device, and control method of the present disclosure have as their main objectives the acquisition of an appropriate captured image and the suppression of interference between the target object and the imaging unit.

[0006] The mounting head, mounting device, and control method of the present disclosure employ the following means to achieve the above-mentioned main object.

[0007] The mounting head of the present disclosure is used in a mounting device that executes a mounting process of mounting an object on a base, and is a mounting head that collects the object with a collection member, and comprises: a head main body that is held by the mounting device so as to be movable in a collection direction that moves the object and the base closer to and away from each other; an attachment section that is disposed on the head main body so as to be movable in the collection direction and to which the collection member is detachably attached; an attachment movement section that moves the attachment section in the collection direction; and an imaging section that is attached to the head main body so as to be immovable at least in the collection direction relative to the head main body, and is capable of capturing an image of at least one of the collection member and the object collected by the collection member from a direction intersecting the collection direction.

[0008] In the mounting head disclosed herein, the attachment unit is disposed on the head body so as to be movable in the collection direction, and the collection member is detachably attached thereto. The imaging unit is attached to the head body so as to be immovable at least in the collection direction relative to the head body. The attachment movement unit moves the attachment unit in the collection direction. Thus, in the mounting head, positional deviation of the imaging unit relative to the head body at least in the collection direction is suppressed, and positional deviation of the imaging unit relative to the attachment unit disposed on the head body and the collection member attached to the attachment unit is also suppressed. This allows the mounting head to capture images of at least one of the collection member and the object collected by the collection member at the appropriate position, thereby obtaining an appropriate captured image. Furthermore, in the mounting head, by moving the attachment unit in the collection direction, interference between the imaging unit and the target component can be suppressed. As a result, the mounting head can obtain an appropriate captured image and suppress interference between the object and the imaging unit.

[0009] 1 is a schematic explanatory diagram of a mounting system 10 according to an example of the present disclosure; FIG. 1 is an explanatory diagram showing an example of a mounting head 22 to which a cover member 76 is attached; FIG. 2 is an explanatory diagram showing an example of the mounting head 22 as viewed from below; FIG. 2 is an explanatory diagram showing an example of a mounting head 22 to which an imaging unit 49 is attached; FIG. 3 is an explanatory diagram of an example of a mounting head 22 to which a rotary tool 22a is attached; FIG. 4 is an explanatory diagram of an example of a mounting head 22 to which a single nozzle 22b is attached; and FIG. 5 is a flowchart showing an example of a mounting processing routine; FIG. 3 is an explanatory diagram showing an example of the positions of a component P1 and the imaging unit 49 after component pickup; FIG. 4 is an explanatory diagram showing an example of the positions of a component P2 and the imaging unit 49 after component pickup; FIG. 5 is an explanatory diagram showing an example of the positions of a pre-attached component P3, a component P1, and the imaging unit 49; and FIG. 6 is an explanatory diagram showing an example of the positions of a pre-attached component P3, a component P2, and the imaging unit 49.

[0010] This embodiment will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram of a mounting system 10 according to an example of the present disclosure. FIG. 2 is an explanatory diagram illustrating an example of a mounting head 22 with an imaging unit 49 covered by a cover member 76. FIG. 3 is an explanatory diagram illustrating an example of a mounting head 22 with the imaging unit 49 covered by the cover member 76, viewed from below. FIG. 4 is an explanatory diagram illustrating an example of a mounting head 22 to which an imaging unit 49 is attached. FIG. 5 is an explanatory diagram illustrating an example of a mounting head 22 with a rotary tool 22a attached to an attachment unit 42. FIG. 6 is an explanatory diagram illustrating an example of a mounting head 22 with a single nozzle 22b attached to an attachment unit 42. The mounting system 10 is, for example, a system that executes a process of mounting a component P as an object on a substrate S as a base. The mounting system 10 includes a mounting device 11, a management device 50, a printing device, a print inspection device, a mounting inspection device, a conveying device, a reflow device, and the like, all of which are not shown. The mounting system 10 is configured as a mounting line in which a plurality of mounting devices 11 that perform a mounting process of mounting components P on a substrate S are arranged from upstream to downstream. Here, the substrate S is described as the base, but there is no particular limitation as long as it is something that mounts components P, and the base may be a three-dimensional object. In this embodiment, the left-right direction (X-axis), front-back direction (Y-axis), and up-down direction (Z-axis) are as shown in Figures 1 to 5, 7, and 8.

[0011] As shown in FIG. 1 , the mounting apparatus 11 includes a substrate processing unit 12, a component supply unit 13, a standby unit 19, a mounting unit 20, and a control device 30. The substrate processing unit 12 is a unit that loads, transports, fixes at a mounting position, and unloads a substrate S. The component supply unit 13 is a unit that supplies components P to the mounting unit 20. The component supply unit 13 is equipped with a plurality of feeders 15 each having a tape holding the components P. The feeder 15 sends the components P held on the tape to a picking position. The component supply unit 13 may also include a tray unit having a tray on which a plurality of components P are arranged. The components P used in the mounting apparatus 11 include components P1, P2, etc. of different sizes. The components P1 are standard components that can be picked up by a picking member 23a attached to the mounting head 22, such as fine chip components. An example of component P2 is a large component that, when picked up by the picking member 23b, will interfere with components picked up by other picking members 23. The waiting section 19 is a waiting place where tool members that have not yet been attached to the mounting head 22, such as the rotary tool 22a and the single nozzle 22b, are kept waiting.

[0012] The mounting unit 20 is a unit that picks up components P from the component supply unit 13 and places them on a board S fixed to the board processing unit 12. As shown in FIGS. 1 to 6, the mounting unit 20 includes a head holding unit 20a, an X-axis slider 21a, a Y-axis slider 21b, a Zs-axis slider 21c, a mounting head 22, and a picking member 23.

[0013] The head holding unit 20a is configured as a member that holds the mounting head 22. The X-axis slider 21a is driven by an X-axis motor 21d and guided by a guide rail to move the head holding unit 20a left and right. The Y-axis slider 21b is driven by a Y-axis motor 21e and guided by a guide rail to move the head holding unit 20a forward and backward. The Zs-axis slider 21c is driven by a Zs-axis motor 21f and guided by a guide rail attached to the head holding unit 20a to move the head main body 41 of the mounting head 22 up and down to adjust the height of the mounting head 22. The Zs-axis motor 21f moves the mounting head 22 along a pickup direction that moves the component P and the board S closer to and farther from each other. In this mounting unit 20, the pickup direction is the up and down direction, and the Zs-axis motor 21f raises and lowers the head main body 41 of the mounting head 22 up and down.

[0014] The mounting head 22 includes a head main body 41, an attachment portion 42, a Z1-axis motor 43, an R-axis motor 44, a Q-axis motor 46, a Z2-axis motor 48, and an imaging portion 49. The head main body 41 is held by the head holding portion 20a so as to be movable in the vertical direction by a Zs-axis slider 21c. The head main body 41 is a housing that houses each component of the mounting head 22 inside or is disposed outside it. The head main body 41 is held by the head holding portion 20a in a state where it can be moved along the collection direction and in a removable state.

[0015] As shown in FIGS. 5 and 6 , the mounting portion 42 is configured as a shaft member disposed on the head body 41 and movable in the vertical direction. A tool member having at least one collection member 23 is detachably attached to the lower end of the mounting portion 42. Examples of the tool member include a rotary tool 22a and a single nozzle 22b. As shown in FIG. 5 , the rotary tool 22a is a rotatable tool member having multiple collection members 23a arranged circumferentially at predetermined angular intervals (e.g., 30 degrees) on a circumference, which collect components P1 as components P. The collection members 23a can collect components P1 with different outer dimensions. Examples of components P1 that can be collected by the collection members 23a include components with outer dimensions of 0.4 mm × 0.2 mm to 4.5 mm × 4.5 mm. The rotary tool 22a can change the size of the parts P1 that can be picked by thinning out some of the picking members 23a and changing the circumferential spacing of the picking members 23a. As shown in FIG. 6 , the single nozzle 22b is a tool member that has one picking member 23b arranged therein and that picks up a part P2 as a part P and uses negative pressure to suction the part P2. The picking member 23b can pick up parts with different outer sizes as the parts P2. The parts P2 that can be picked up by the picking member 23b have a longest side, which is the longest side of the outer shape, that is longer than the longest side of the part P1 that can be picked up by the picking member 23a. Examples of parts P2 that can be picked up by the picking member 23b include parts with an outer size of 1.6 mm × 0.8 mm or more and 200 mm × 150 mm or less. The number of collection members 23 provided in the tool member may be any number, such as one, two, four, six, or twelve.

[0016] The Z1-axis motor 43, the R-axis motor 44, the Q-axis motor 46, and the Z2-axis motor 48 are disposed on the head main body 41. The Z1-axis motor 43 is a mounting movement unit that moves the mounting unit 42 up and down. This Z1-axis motor 43 adjusts the height of the rotary tool 22a and the single nozzle 22b attached to the mounting unit 42. The R-axis motor 44 rotates the rotary tool 22a to rotate (revolve) the multiple collection members 23, and rotates the single nozzle 22b to rotate the collection members 23. The Q-axis motor 46 rotates each collection member 23 when the rotary tool 22a is attached to the mounting unit 42 to adjust the angle of the part P1. The Z2-axis motor 48 moves each collection member 23 up and down by moving a gripping member 48a that grips a pusher attached to each collection member 23 up and down when the rotary tool 22a is attached to the mounting unit 42, thereby adjusting the height of the collection members 23.

[0017] The imaging unit 49 is an imaging device, and is a camera that captures images of the parts P picked by the rotary tool 22a or the single nozzle 22b from the front-rear direction, which intersects the up-down direction. As shown in FIGS. 5 and 6 , the imaging unit 49 is immovably attached to the head body 41 in a position where it can capture images of at least one of the parts P and the picking member 23 when the picking member 23 picks the parts P. In addition to the imaging element 49a, the imaging unit 49 also includes an illumination unit (not shown) that can irradiate the parts P held by the picking member 23 with light, and an image processing unit (not shown) that generates image data based on the charge input from the imaging element 49a. The imaging element 49a generates and outputs charge upon receiving light. The imaging element 49a may be, for example, a CMOS image sensor. The imaging unit 49 captures images and outputs the captured image data to the control device 30. As shown in FIGS. 2 and 3 , the imaging unit 49 is covered in the up-down, rearward, and left-right directions by a cover member 76 attached to the head body 41. The cover member 76 prevents interference between the imaging unit 49 and the components P mounted on the circuit board S. Because the imaging unit 49 is attached to the head body 41, it is more robust than a unit that can be raised and lowered relative to the head body 41. Furthermore, because the imaging unit 49 is attached so as not to be movable in the vertical direction relative to the head body 41, vertical displacement of the imaging unit 49 relative to the head body 41 is prevented. This also prevents displacement of the imaging unit 49 relative to the collection member 23 attached to the mounting portion 42 disposed on the head body 41. Therefore, the imaging unit 49 can capture an image of at least one of the collection member 23 and the components P collected by the collection member 23 at an appropriate position, thereby obtaining an appropriate captured image.

[0018] The control device 30 is configured as a microprocessor centered on a control unit 31 including a CPU, and includes a memory unit 32 that stores various data. The control device 30 outputs control signals to the substrate processing unit 12, the component supply unit 13, and the mounting unit 20, and inputs signals from the component supply unit 13 and the mounting unit 20. The memory unit 32 stores mounting condition information, picked member information, and the like. The mounting condition information includes information on the picking order and placement order when mounting the components P, identification information (ID) of the components P, and placement positions (coordinates) on the substrate S. The picked member information includes information on the type of tool member to be attached to the attachment unit 42, and the like.

[0019] The management device 50 is a computer that manages information about each device in the mounting system 10. As shown in FIG. 1 , the management device 50 includes a control unit 51, a memory unit 52, a display unit, and an input device. The control unit 51 is configured as a microprocessor centered around a CPU. The memory unit 52 is a device, such as an HDD, that stores various data such as processing programs. The memory unit 52 may store mounting condition information for each mounting device 11 as a database. The display unit is an LCD screen that displays various information. The input device includes a keyboard, mouse, etc., through which the operator inputs various commands.

[0020] Next, the operation of the mounting system 10 of this embodiment configured as described above will be described, in particular the mounting process for placing the component P on the board S. Fig. 7 is a flowchart showing an example of a mounting process routine executed by the control unit 31 of the control device 30 of the mounting device 11. This routine is executed by the control unit 31 based on a mounting start input by the operator.

[0021] When this routine starts, the control unit 31 causes the standby unit 19 to mount the pickup member 23 on the mounting head 22 based on the pickup member information stored in the memory unit 32 (S100). The control unit 31 attaches the rotary tool 22a as a tool member to the attachment unit 42 based on the pickup member information, and then attaches the pickup member 23a to the rotary tool 22a. Alternatively, the control unit 31 attaches the single nozzle 22b directly to the attachment unit 42 based on the pickup member information.

[0022] Next, the control unit 31 determines the type of component attached to the mounting unit 42 (S110). When the rotary tool 22a is attached to the mounting unit 42, the control unit 31 controls the Zs-axis motor 21f so that the Zs-axis slider 21c moves downward and the head main body 41 moves in a direction in which the pickup member 23a approaches the board S, i.e., downward, and controls the Z1-axis motor 43 so that the mounting unit 42 moves in the direction in which the pickup member 23a approaches the board S, i.e., downward (S120). Next, the control unit 31 controls the X-axis motor 21d and the Y-axis motor 21e so that the mounting head 22 moves to the pickup position (S140). Then, the control unit 31 performs the component pickup process (S150). During the component picking process when the rotary tool 22a is attached to the attachment unit 42, the control unit 31 rotates the rotary tool 22a to rotate (revolve) the multiple picking members 23a, while controlling the R-axis motor 44, Q-axis motor 46, and Z2-axis motor 48 so that the picking members 23a descend while swiveling, and the negative pressure supply device applies negative pressure to the picking members 23a, causing the picking members 23a to pick up the component P1. Figure 8 is an explanatory diagram showing an example of the positions of the component P1 and the imaging unit 49 after the component P1 has been picked up when the rotary tool 22a is attached to the attachment unit 42. Because the component P1 is a standard component having a size that can be picked up by each of the picking members 23a, the component picking process can be performed without interference between the component P1 and the imaging unit 49.

[0023] When the single nozzle 22b is attached to the attachment portion 42, the control unit 31 controls the Zs-axis motor 21f so that the Zs-axis slider 21c moves upward and the head main body 41 moves in a direction separating the picking member 23b from the board S, and also controls the Z1-axis motor 43 so that the attachment portion 42 moves in a direction approaching the board S (S130). The control unit 31 then controls the X-axis motor 21d and the Y-axis motor 21e so that the mounting head 22 moves to the picking position (S140). The control unit 31 then performs the component picking process (S150). In the component picking process when the single nozzle 22b is attached to the attachment portion 42, the control unit 31 controls the Z1-axis motor 43 and the R-axis motor 44 so that the picking member 23b moves downward while rotating, and the negative pressure supply device applies negative pressure to the picking member 23b, causing the picking member 23b to pick up the component P2. 9 is an explanatory diagram showing an example of the positions of component P2 and the imaging unit 49 after component pickup when the single nozzle 22b is attached to the attachment unit 42. When component P2 is picked up by the pickup member 23b, it has a size that causes it to interfere with components picked up by other pickup members 23. Therefore, when the pickup unit 49 is in a low position during the component pickup process, there is a possibility that component P2 will interfere with the imaging unit 49. In this embodiment, the control unit 31 moves the head main body 41 in a separating direction that separates the pickup member 23b from the board S, thereby moving the imaging unit 49 upward, and moves the attachment unit 42 in a approaching direction to move the pickup member 23b downward, thereby suppressing interference between component P2 and the imaging unit 49.

[0024] Next, the control unit 31 controls the X-axis motor 21d and the Y-axis motor 21e to move the mounting head 22 to a predetermined position above the board S (S160). The control unit 31 then causes the imaging unit 49 to perform an imaging process (S170). In the imaging process, the control unit 31 controls the imaging unit 49 to capture an image of at least one of the collection member 23 and the components P picked up by the collection member 23 at the predetermined position, thereby obtaining the captured image. The imaging unit 49 is attached to the head body 41 so as not to be movable in the vertical direction relative to the head body 41, i.e., in the collection direction in which the collection member 23 and the board S move closer to and away from each other in S130. This prevents the imaging unit 49 from shifting in position relative to the head body 41 in the collection direction. This allows the mounting head 22 to capture an image of the collection member 23 and the components P picked up by the collection member 23 at the appropriate position, thereby obtaining an appropriate captured image.

[0025] The control unit 31 then determines whether or not there is a collection abnormality based on the captured image data acquired in the imaging process (S180). Examples of collection abnormalities include abnormal posture of the component P picked by the picking member 23. If the control unit 31 determines that there is a collection abnormality, it discards the component P (S190). The control unit 31 then transmits collection abnormality information to the management device 50 (S200) and proceeds to step S220. Upon receiving the collection abnormality information, the management device 50 displays the collection abnormality information on the display device. The collection abnormality information includes information that a collection abnormality has occurred and that the component P will be discarded. A worker who views the display device can confirm the displayed information and perform the necessary work.

[0026] When the control unit 31 determines that there is no abnormality in the collection, it performs the mounting operation (S210). Fig. 10 is an explanatory diagram for explaining an example of the positions of the pre-attached component P3, the component P1, and the imaging unit 49 when the rotary tool 22a is attached to the attachment unit 42. Fig. 11 is an explanatory diagram for explaining an example of the positions of the pre-attached component P3, the component P2, and the imaging unit 49 when the single nozzle 22b is attached to the attachment unit 42. The pre-attached component P3 is a component that has already been attached to the board S.

[0027] In S210, when the rotary tool 22a is attached to the attachment unit 42, the control unit 31 controls the R-axis motor 44 to rotate the attachment unit 42 and rotate (revolve) the multiple picking members 23a as needed, and controls the Q-axis motor 46 and the Z2-axis motor 48 to lower the picking members 23a while rotating them, waiting for the components P1 held by the picking members 23a to contact the board S. The control unit 31 then applies positive pressure to the picking members 23a using the positive pressure supply device to mount the components P1 on the board S, and then controls the Z2-axis motor 48 to lift the picking members 23a. Because the head body 41 and the attachment unit 42 are moved in the approach direction in S120, the amount of descent of the picking members 23a can be reduced. Therefore, the mounting device 11 requires less time to perform the mounting operation than a mounting device that requires a greater amount of descent of the picking members 23a to the board S. This allows the mounting device 11 to improve the efficiency of the mounting operation. At this time, because component P1 is a standard component having a size that can be picked up by each of the picking members 23a attached to the mounting head 22, there is a relatively large amount of free space around the multiple picking members 23a. Therefore, by adjusting the predetermined position in S160, the mounting operation can be performed without interference between the pre-attached component P3 and component P1 or the imaging unit 49. In addition, because the imaging unit 49 is covered below by the cover member 76, interference between the imaging unit 49 and components that have fallen onto the board S is avoided. Therefore, the mounting device 11 can protect the imaging unit 49.

[0028] In S210, when the single nozzle 22b is attached to the attachment portion 42, the control unit 31 controls the Z1-axis motor 43 and the R-axis motor 44 to rotate and lower the pickup member 23b, waiting for the component P2 held by the pickup member 23b to contact the board S. The control unit 31 then applies positive pressure to the pickup member 23b using the positive pressure supply device to mount the component P2 on the board S, and then controls the Z1-axis motor 43 to raise the pickup member 23b. Because the attachment portion 42 is moved in the approach direction in S130, the amount of descent of the pickup member 23b can be reduced, shortening the time required for the mounting operation. This allows the mounting device 11 to improve the efficiency of the mounting operation. If the imaging unit 49 is in a low position during the mounting operation, there is a possibility of interference with the pre-attached component P3. At this time, the head main body 41 is moved in the separation direction that separates the board S and the component P, thereby suppressing interference between the imaging unit 49 and the pre-attached component P3. Furthermore, since the imaging unit 49 is covered from below by the cover member 76, interference between the imaging unit 49 and components that have fallen onto the board S is avoided. This allows the mounting device 11 to protect the imaging unit 49.

[0029] When the mounting operation is completed in this manner, the control unit 31 determines whether or not there is a next component P to be mounted (S220). If the control unit 31 determines that there is a next component P to be mounted, the process returns to S170. If the control unit 31 determines that there is no next component P to be mounted, the process then determines whether or not all components P have been mounted on the board S (S230). If not all components P have been mounted on the board S, the control unit 31 returns to S100. If all components P have been mounted on the board S, the control unit 31 ends this routine.

[0030] Here, the correspondence between the components of this embodiment and the components of the present disclosure will be clarified. The mounting device 11 of this embodiment is an example of a mounting device of the present disclosure, the collection member 23 is an example of a collection member, the mounting head 22 is an example of a mounting head, the head main body 41 is an example of a head main body, the attachment unit 42 is an example of an attachment unit, the Z1-axis motor 43 is an example of an attachment movement unit, and the imaging unit 49 is an example of an imaging unit. Note that in this embodiment, an example of a control method of the present disclosure is also clarified by explaining the operation of the mounting system 10.

[0031] According to the mounting system 10 of this embodiment described above, in the mounting head 22, the head main body 41 is held by the head holding portion 20a so as to be movable in the collection direction, the attachment portion 42 is arranged on the head main body 41 so as to be movable in the collection direction, the collection member 23 is detachably attached, the imaging unit 49 is attached to the head main body 41 so as not to be able to move in the collection direction relative to the head main body 41, and the Z1-axis motor 43 moves the attachment portion 42 in the collection direction, thereby making it possible to obtain an appropriate captured image and suppress interference between the component P and the imaging unit 49.

[0032] Furthermore, the mounting portion 42 has a detachable attachment of a collection member 23b capable of collecting components P2 of different external sizes, or a detachable attachment of a tool member to which a plurality of collection members 23a capable of collecting components P1 of different external sizes can be detachably attached, and the longest side of the component P2 that can be collected by the collection member 23b and has the longest longest side, which is the longest side in terms of its external shape, is longer than the longest side of the component P1 that can be collected by the collection member 23a and has the longest longest side, so that the mounting head 22 can prevent interference between the components P1, P2 and the imaging unit 49.

[0033] Furthermore, since the mounting head 22 includes a cover member 76 that is attached to the head main body 41 and covers at least a part of the imaging unit 49 , the imaging unit 49 can be protected by the cover member 76 .

[0034] Furthermore, the imaging unit 49 is attached in a position where it can image the components P1 and P2 without interfering with the components P1 and P2 when the collection members 23a and 23b collect the components P1 and P2, so the mounting head 22 can obtain more accurate images and suppress interference between the components P1 and P2 and the imaging unit 49.

[0035] In the above-described embodiment, the imaging unit 49 is covered in the up-down, rearward, and left-right directions by the cover member 76. However, it is sufficient that the imaging unit 49 is covered in at least one of the up-down, front-back, and left-right directions by the cover member 76. For example, the imaging unit 49 may be covered in the down-down and front-back directions by the cover member 76. Furthermore, although the cover member 76 is attached to the head main body 41, it may also be attached to the imaging unit 49. Furthermore, the imaging unit 49 does not have to be covered by the cover member 76.

[0036] In the above-described embodiment, the imaging unit 49 is attached so as to be immovable in the vertical direction relative to the head main body 41. However, the imaging unit 49 may be attached so as to be immovable at least in the vertical direction relative to the head main body 41, and may also be attached so as to be immovable in the front-rear direction or the left-right direction.

[0037] In the above-described embodiment, when the rotary tool 22a is attached to the attachment portion 42, the control portion 31 moves the head body 41 and the attachment portion 42 in a proximity direction in which the sampling member 23a and the substrate S approach each other. However, since the control portion 31 only needs to move the head body 41 and the attachment portion 42 to positions in which the component P1, the pre-attached component P3 already attached to the substrate S, and the imaging unit 49 do not interfere with each other, depending on the sizes of the component P1 and the components already attached to the substrate S, at least one of the head body 41 and the attachment portion 42 may be moved in a separation direction in which the sampling member 23a and the substrate S move away from each other.

[0038] In the above-described embodiment, when the single nozzle 22b is attached to the attachment portion 42, the control unit 31 moves the head main body 41 in a separating direction in which the sampling member 23b and the substrate S are separated, and moves the attachment portion 42 in a proximity direction in which the sampling member 23b and the substrate S are brought closer together. However, since the control unit 31 only needs to move the head main body 41 and the attachment portion 42 to positions where the component P2, the pre-attached component P3, and the imaging unit 49 do not interfere with each other, depending on the sizes of the component P2 and the pre-attached component P3, the head main body 41 may be moved in the proximity direction or the attachment portion 42 may be moved in the separating direction.

[0039] In the above-described embodiment, the collection member 23 is disposed above the board S, and the collection direction in which the collection member 23 moves the collected components P toward and away from the board S is the up-down direction. However, the collection direction may be changed as appropriate depending on the orientation of the board S, and may be the front-back direction or the left-right direction.

[0040] In the above embodiment, the collection members 23a and 23b are members capable of collecting parts P1 and P2 having different outer sizes. However, the collection members 23a and 23b may be members capable of collecting parts P1 and P2 of a single size, and the longest side of the outer size of part P1 may be shorter than the longest side of part P2.

[0041] In the above-described embodiment, the control unit 31 returns to S100 when all components P have not been mounted on the board S in S230. However, when all components P are picked up using the same rotary tool 22a or single nozzle 22b, the control unit 31 may return to S140 when all components P have not been mounted on the board S in S230.

[0042] This specification also discloses the technical idea of ​​changing "the mounting head according to claim 1 or 2" in claim 4 at the time of filing to "the mounting head according to any one of claims 1 to 3," the technical idea of ​​changing "the mounting head according to claim 1 or 2" in claim 5 at the time of filing to "the mounting head according to any one of claims 1 to 4," the technical idea of ​​changing "the mounting device according to claim 6" in claim 10 at the time of filing to "the mounting device according to any one of claims 6 to 9," and the technical idea of ​​changing "the mounting head according to claim 1" to "the mounting head according to any one of claims 1 to 5" in claim 11 at the time of filing.

[0043] The present disclosure is applicable to industries such as the manufacturing of mounting heads and mounting devices.

[0044] 10 Mounting system, 11 Mounting device, 12 Substrate processing section, 13 Component supply section, 15 Feeder, 19 Waiting section, 20 Mounting section, 20a Head holding section, 21a X-axis slider, 21b Y-axis slider, 21c Zs-axis slider, 21d X-axis motor, 21e Y-axis motor, 21f Zs-axis motor, 22 Mounting head, 22a Rotary tool, 22b Single nozzle, 23, 23a, 23b Picking member, 30 Control device, 31, 51 Control section, 32, 52 Memory section, 41 Head main body, 42 Mounting section, 43 Z1-axis motor, 44 R-axis motor, 46 Q-axis motor, 48 Z2-axis motor, 48a Grip member, 49 Imaging section, 49a Imaging element, 50 Management device, 76 Cover member, P, P1, P2 parts, P3 pre-attached part, S circuit board.

Claims

1. A mounting head used in a mounting device that executes a mounting process to mount an object on a base, and that collects the object with a collection member, comprising: a head main body that is held by the mounting device so as to be movable in a collection direction that moves the object and the base closer to and away from each other; an attachment section that is disposed on the head main body so as to be movable in the collection direction, and to which the collection member is detachably attached; an attachment movement section that moves the attachment section in the collection direction; and an imaging section that is attached to the head main body so as to be immovable at least in the collection direction relative to the head main body, and that is capable of capturing images of at least one of the collection member and the object collected by the collection member from a direction intersecting the collection direction.

2. A mounting head as claimed in claim 1, wherein the attachment section is detachably attached with a first collection member as the collection member capable of collecting objects of different external sizes, or a tool member to which a plurality of second collection members as the collection members capable of collecting objects of different external sizes are detachably attached, and the longest side of the first object that is the longest of the objects that can be collected by the first collection member is longer than the longest side of the second object that is the longest of the objects that can be collected by the second collection member.

3. A mounting head as claimed in claim 1, wherein the attachment section is detachably attached with a first collection member as the collection member for collecting a first object as the object, or a tool member to which a plurality of second collection members as the collection members for collecting a second object as the object, the longest side of which is the longest side in its outer shape and is shorter than the longest side of the first object, are detachably attached.

4. A mounting head according to claim 1 or 2, comprising a cover member attached to the head body and covering at least a part of the imaging unit.

5. A mounting head according to claim 1 or 2, wherein the imaging unit is attached at a position where it can image the object without interfering with the object when the collection member collects the object.

6. A mounting device that performs a mounting process to mount an object on a base, comprising: a head holding unit capable of holding the mounting head described in claim 1; a main body moving unit that moves the head main body in the collection direction; and a control unit that controls the mounting moving unit and the main body moving unit.

7. A mounting device according to claim 6, wherein the control unit controls the mounting movement unit and the main body movement unit so that, when the collection member is attached to the mounting unit, the mounting unit moves in a proximity direction in which the object and the base body approach each other, and the head main body moves in either the proximity direction or a separating direction in which the object and the base body move away from each other depending on the size of the object.

8. A mounting device according to claim 7, wherein the mounting section is detachably attached with a first collection member as the collection member capable of collecting the objects having different external sizes, or a tool member to which a plurality of second collection members as the collection members capable of collecting the objects having different external sizes are detachably attached, the longest side that is the longest side of the external shape of the object that can be collected by the first collection member is longer than the longest side of a second object that has the longest longest side among the objects that can be collected by the second collection member, and the control section, when the first collection member is attached to the mounting section, controls the mounting movement section and the main body movement section so that the head main body moves in the separating direction and the mounting section moves in the approaching direction, and when the tool member is attached to the mounting section, controls the mounting movement section and the main body movement section so that the head main body and the mounting section move in the approaching direction.

9. A mounting device as described in claim 7, wherein the mounting section has a first collection member detachably attached thereto as the collection member for collecting a first object as the object, or a tool member detachably attached thereto to which a plurality of second collection members detachably attached as the collection member for collecting a second object as the object, the second collection member having a longest side that is the longest side in its outer shape shorter than the longest side of the first object, and the control section, when the first collection member is attached to the mounting section, controls the mounting movement section and the body movement section so that the head body moves in the separating direction and the mounting section moves in the approaching direction, and when the tool member is attached to the mounting section, controls the mounting movement section and the body movement section so that the head body and the mounting section move in the approaching direction.

10. A mounting device according to claim 6, wherein the control unit determines whether the collection member has caused an abnormality in collection based on the image captured by the imaging unit.

11. A control method for controlling a mounting device comprising a head holding unit capable of holding the mounting head described in claim 1 and a body moving unit that moves the head body in the collection direction, the control method including the step of controlling the attachment moving unit and the body moving unit so that, when the collection member is attached to the attachment unit, the attachment unit moves in the approaching direction in which the object and the base approach each other, and the head body moves in the approaching direction or the separating direction in which the object and the base move away from each other depending on the size of the object.

Images