Laminate and laminate production method

Abstract

Provided is a laminate production method that realizes both debris inhibition and excellent positioning accuracy in transferring articles such as semiconductor chips. A high-quality display device or semiconductor device can be obtained by said laminate production method. The present invention is a laminate production method having: a step for preparing a laminate a1x having a first substrate and a light absorption layer in the stated order; a step for temporarily fixing articles to the light absorption layer; a step for pattern-processing the light absorption layer; a step for preparing a laminate a2 having a second substrate and a second adhesion layer in the stated order; and a step for irradiating the light absorption layer with an activated actinic ray from the first substrate side of the light absorption layer in a state of having a gap between the articles provided to the first substrate and the second adhesion layer provided to the second substrate, to thereby transfer the articles from the light absorption layer to the second adhesion layer. The plurality of articles are in contact with the light absorption layer. Recess parts are formed on the light absorption layer.

Description

Laminate and method for manufacturing laminate

[0001] The present invention relates to a laminate and a method for manufacturing a laminate. More specifically, the present invention relates to a laminate that is suitably used when transferring an article such as a semiconductor chip by laser, a method for manufacturing a laminate, and a method for manufacturing a display device or a semiconductor device using the same.

[0002] In recent years, electronic terminal devices have become more functional, smaller, thinner, and lighter. These electronic terminal devices are equipped with semiconductor devices, such as processors and memories. Generally, in the semiconductor manufacturing process, semiconductor chips incorporated into the semiconductor devices are transferred and mounted on printed wiring boards or the like by a pick-and-place method using a flip-chip bonder or the like. As semiconductor devices become more powerful and smaller, the semiconductor chips incorporated into the semiconductor devices are also becoming smaller and thinner, and the number of semiconductor chips mounted is also increasing. Therefore, a method is needed that can mount a large number of miniaturized semiconductor chips in a short period of time.

[0003] Additionally, technologies related to organic electroluminescence displays, quantum dot displays, and micro light-emitting diode (LED) displays are being actively researched for thin displays such as smartphones and televisions. Micro-LED displays, in particular, offer features such as high brightness, high contrast, fast response, low power consumption, and a wide viewing angle, and are therefore expected to be used in new applications such as signage, AR, VR, and transparent displays. Micro-LED displays are displays in which LEDs, which are semiconductor chips with sides measuring several micrometers to several hundred micrometers, are arranged at each pixel. Therefore, the conventional pick-and-place method poses a significant problem of reduced productivity. Therefore, a method that can mount a large number of LEDs in a short time is needed to reduce process time.

[0004] One example of a method for high-speed semiconductor chip mounting is a laser transfer technique in which a semiconductor chip is placed on a support substrate via an adhesive layer, and then a laser is irradiated from the support substrate side to ablate the adhesive layer, thereby transferring the semiconductor chip to another substrate (see, for example, Patent Documents 1 and 2). Transfer refers to the transfer of a semiconductor chip from one substrate to another. Ablation refers to the phenomenon in which, when light such as a laser is irradiated onto a solid or liquid surface of an object, the surface of the object instantaneously melts and evaporates along with light absorption, the thermalization of light energy, and plasma generation, releasing ions, electrons, radicals, molecules, clusters, solid fragments, and the like, resulting in the explosive release of constituent materials from the solid or liquid surface.

[0005] International Publication No. 2022 / 201767 Japanese Patent Application Laid-Open No. 2020-188037

[0006] However, in the method described in Patent Document 1, when a laser is irradiated to ablate the adhesive layer and transfer the semiconductor chip, residue from the adhesive layer is generated on the surface of the semiconductor chip after transfer. There is also the issue of residue adhering to the surface of the destination substrate due to scattering of the adhesive layer during ablation. Furthermore, there is the issue of reduced positional accuracy during semiconductor chip transfer due to misalignment or variation in the laser irradiation position. The residue of the adhesive layer on the surface of the semiconductor chip and the residue on the surface of the destination substrate are referred to as debris. The method described in Patent Document 2 is effective in suppressing debris during semiconductor chip transfer because the adhesive layer is a thin film with a thickness of 0.1 to 0.5 μm and is patterned by etching. However, there is the issue of reduced positional accuracy during semiconductor chip transfer.

[0007] Therefore, the methods described in Patent Documents 1 and 2 do not combine debris suppression and positional accuracy during transfer, and further improvement in characteristics is desired. An object of the present invention is to combine debris suppression and excellent positional accuracy during transfer of an article such as a semiconductor chip, and to obtain a display device or semiconductor device with high accuracy.

[0008] In order to solve the above-mentioned problems, the laminate manufacturing method and the laminate of the present invention provide the following [1] to

[20] . [1] A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12) a step of temporarily fixing an article to the light absorbing layer (hereinafter referred to as step (12)); (13) a step of patterning the light absorbing layer (hereinafter referred to as step (13)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22) a step of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer, with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, to transfer the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)), wherein in step (12) a plurality of articles are in contact with the light absorbing layer, and in step (13) recesses are formed in the light absorbing layer.

[0009] [2] In the step (13), the indentation elastic modulus of the light absorbing layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or, in the step (13), the glass transition temperature of the light absorbing layer is −50 to 150° C.

[0010] [3] The method for producing a laminate according to [1] or [2], further comprising (01) a step of forming an article on a donor substrate, wherein the step (12) comprises (12a) a step of irradiating the article provided on the donor substrate with activated actinic rays from the donor substrate side of the article in a state where the article is in contact with a light absorbing layer provided on a first substrate, thereby transferring the article from the donor substrate to the light absorbing layer (hereinafter referred to as step (12a)), wherein in step (12a), the light absorbing layer is irradiated with activated actinic rays using the article as a mask, and at least a part of the light absorbing layer irradiated with the activated actinic rays is removed.

[0011] [4] The method for producing a laminate according to any one of [1] to [3], wherein in the step (13), the light absorbing layer exists as a light absorbing layer of a plurality of convex portions and a light absorbing layer of a recessed portion while in contact with the first substrate, the thickness of the light absorbing layer of the recessed portions is smaller than the thickness of the light absorbing layer of the plurality of convex portions, and further wherein each of the plurality of articles is independently in contact with at least one of the light absorbing layers of the plurality of convex portions.

[0012] [5] The method for producing a laminate according to any one of [1] to [3], wherein in the step (13), the light absorbing layer is present as a plurality of island-shaped light absorbing layers in contact with the first substrate, and the plurality of articles are each independently in contact with at least one of the plurality of island-shaped light absorbing layers.

[0013] [6] The method for producing a laminate according to any one of [1] to [5], wherein in the step (13), any one of the following conditions (a) to (c) is satisfied: (a) the light-absorbing layer is a layer made of a positive-type photosensitive composition, and the step (13) comprises: (13a) a step of patterning the light-absorbing layer by photolithography (hereinafter referred to as step (13a)); (b) the light-absorbing layer is a layer made of a positive-type photosensitive composition or a negative-type photosensitive composition, and the step (13) comprises: (13b) a step of patterning the light-absorbing layer by etching (hereinafter referred to as step (13b)); or (c) the light-absorbing layer is a layer made of a non-photosensitive composition, and the step (13) comprises: (13b) a step of patterning the light-absorbing layer by etching; and the indentation elastic modulus of the light-absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is -50 to 150°C.

[0014] [7] The method for producing a laminate according to [6], wherein the condition (a) is satisfied in the step (13), and the step (13a) comprises: (13a-1) a step of irradiating the light absorbing layer with actinic rays from the article side of the light absorbing layer using the article as a mask; and (13a-2) a step of developing with a developer to pattern the light absorbing layer.

[0015] [8] The method for producing a laminate according to [6], wherein the step (13) satisfies the condition (c), and the step (13b) comprises: (13b-1a) a step of patterning the light absorbing layer by dry etching from the article side of the light absorbing layer using the article as a mask; or (13b-1b) a step of patterning the light absorbing layer by wet etching from the article side of the light absorbing layer using the article as a mask.

[0016] [9] The method for producing a laminate according to any one of [1] to [8], further comprising, before or after the step (13), a step (14) of crosslinking the pattern of the light absorbing layer (hereinafter referred to as step (14)), wherein the step (14) comprises: (14a) a step of heating the pattern of the light absorbing layer to crosslink it; or (14b-1) a step of irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer.

[0017]

[10] A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12z) a step of temporarily fixing an article to the light absorbing layer and ablating the light absorbing layer (hereinafter referred to as step (12z)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22) a step of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, thereby transferring the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)), wherein in step (12z) a plurality of articles are in contact with the light absorbing layer, and in step (12z) recesses are formed in the light absorbing layer.

[0018]

[11] A laminate having a first substrate, a light absorbing layer, and an article in this order, the laminate having a plurality of articles in contact with the light absorbing layer, the light absorbing layer having a recess, and an indentation elastic modulus of the light absorbing layer at 50°C of 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is −50 to 150° C.

[0019]

[12] The laminate according to

[11] , wherein the light absorbing layer exists as a light absorbing layer of a plurality of convex portions and a light absorbing layer of a recessed portion while in contact with the first substrate, and the thickness of the light absorbing layer of the recessed portions is smaller than the thickness of the light absorbing layer of the plurality of convex portions, and further wherein each of the plurality of articles is independently in contact with at least one of the light absorbing layers of the plurality of convex portions.

[0020]

[13] The laminate according to

[11] , wherein the light absorbing layer is present as a plurality of island-shaped light absorbing layers in contact with the first substrate, and the plurality of articles are each independently in contact with at least one of the plurality of island-shaped light absorbing layers.

[0021]

[14] The laminate according to any one of

[11] to

[13] , wherein the thickness of the light absorbing layer is less than 5.0 μm.

[0022]

[15] The laminate according to any one of

[11] to

[14] , wherein the light absorbing layer is a layer made of a positive photosensitive composition.

[0023]

[16] The area of ​​the first a surface of the light absorbing layer on the first substrate side is (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ) the laminate according to any one of

[11] to

[15] , wherein the relationship of formula (S-1) is satisfied. (S １ａ ) ≧ (S ２ａ ) (S-1).

[0024]

[17] The area of ​​the first surface a (S １ａ ) and the area of ​​the second surface a (S ２ａ ) is the ratio (S １ａ ) / (S ２ａ ), then (S １ａ ) / (S ２ａ ) is 1.10 or more and 3.00 or less.

[0025]

[18] The laminate according to any one of

[11] to

[17] , wherein the maximum absorbance per 1.0 μm thickness of the light absorbing layer at a wavelength of 180 to 550 nm is 0.3 to 10.0.

[0026]

[19] The laminate according to any one of

[11] to

[18] , wherein the light-absorbing layer contains an ultraviolet absorber (XDa), and the ultraviolet absorber (XDa) contains a resin having a triazine structure and / or a benzotriazole structure in a structural unit of the resin.

[0027]

[20] The laminate according to any one of

[11] to

[19] , wherein the light-absorbing layer satisfies any one of the following conditions (α) to (γ): (α) The light-absorbing layer is a layer formed from a positive-type photosensitive composition, and the positive-type photosensitive composition satisfies at least one of the following conditions (1), (3), and (4). (β) The light-absorbing layer is a layer formed from a negative-type photosensitive composition, and the negative-type photosensitive composition satisfies at least one of the following conditions (2) to (4). (γ) The light-absorbing layer is a layer formed from a non-photosensitive composition, and the non-photosensitive composition satisfies the following condition (5) and / or the following condition (6). (1) Contains (C1) a naphthoquinone diazide compound and (F) a crosslinking agent. (2) Contains (C2) a photopolymerization initiator and (B) a radically polymerizable compound. (3) Contains (C3) a photoacid generator and (F) a crosslinking agent. (4) Contains (C4) a photobase generator and (F) a crosslinking agent. (5) Contains (F) a crosslinking agent. (6) Contains (B) a radically polymerizable compound.

[0028] The laminate of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling a display device or semiconductor device to be obtained with high accuracy. Furthermore, the method for manufacturing the laminate of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling a display device or semiconductor device to be obtained with high accuracy.

[0029] 1 is a process diagram showing a part of a manufacturing process of a micro LED display using the laminate manufacturing method of the third and fourth aspects of the present invention; 2 is a process diagram showing a part of a manufacturing process of a micro LED display using the laminate manufacturing method of the fifth and sixth aspects of the present invention; 3 is a process diagram showing a part of a manufacturing process of a micro LED display using the laminate manufacturing method of the seventh and eighth aspects of the present invention;

[0030] The method for manufacturing a laminate of the present invention will be described below as one embodiment of a manufacturing process for a laminate to which semiconductor micro light-emitting diodes (LEDs) have been transferred. FIGS. 1 to 3 are process diagrams illustrating a portion of a manufacturing process for a micro LED display using the laminate manufacturing method. In the drawings, (1) is to be read as (Step 1). The laminate shown in (6) of FIGS. 1 and 2 or (4) or (5) of FIG. 3 is a laminate including at least an article and having a recess in the light-absorbing layer, and the article is to be transferred to another laminate. In one embodiment of the present invention, a first substrate includes a light-absorbing layer and an article, in this order. This is referred to as a first embodiment of the laminate. In another embodiment of the present invention, a first substrate includes a light-absorbing layer, a first adhesive layer, and an article, in this order. This is referred to as a second embodiment of the laminate. Representative manufacturing methods, such as the presence or absence of a first adhesive layer on the first substrate, a method for supplying the article, and a method for patterning the light-absorbing layer, will be described below as third to eighth embodiments of manufacturing laminates. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible within the scope of the invention, as long as the object of the invention can be achieved and the gist of the invention is not deviated from.

[0031] In this specification, a silicone structure refers to a structure having an Si-O-Si bond as the main backbone and two organic groups on the silicon atom. That is, the silicon atom in the silicone structure is bonded to two organic groups and two oxygen atoms. Furthermore, a siloxane structure refers to a structure having an Si-O-Si bond as the main backbone and one organic group on the silicon atom. That is, the silicon atom in the siloxane structure is bonded to one organic group and three oxygen atoms.

[0032] The laminates according to the first and second aspects of the present invention will be described. When referring to the laminate of the present invention, the description relates to the laminates according to the first and second aspects of the present invention. On the other hand, when referring to a laminate of a specific aspect, the description will be referred to as the laminate according to the first aspect of the present invention.

[0033] <Laminate (Laminate 1X)> The laminate according to the first aspect of the present invention has the configuration described above in

[11] . The first substrate 1 includes a light absorbing layer 2 and an article 4, with the light absorbing layer 2 having a recess. By adopting the above configuration, the method for manufacturing a laminate including the laminate according to the first aspect of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling the production of a display device or semiconductor device with high accuracy. This means that the light absorbing layer has a recess, which reduces the volume of the light absorbing layer compared to a case without a recess. As a result, when transferring an article from the light absorbing layer, the volume of the light absorbing layer that is ablated is reduced, thereby reducing the scattering of the light absorbing layer, which is presumed to be effective in suppressing debris. Furthermore, the recesses in the light absorbing layer have reduced ablation properties, and the openings in the light absorbing layer are not ablated, which is presumed to counteract laser irradiation position misalignment and variation in irradiation position, thereby achieving excellent positional accuracy. For example, the volume of the light absorbing layer can be reduced by patterning the areas of the light absorbing layer that are not in contact with the article as recesses or openings. Forming a light absorbing layer having recesses formed by patterning or forming a light absorbing layer having openings formed by patterning is more suitable for achieving the effects of debris suppression based on the above-described estimated mechanism and the effects of excellent positional accuracy.

[0034] Furthermore, because the indentation modulus of the light-absorbing layer is within a specific range and / or the glass transition temperature of the light-absorbing layer is within a specific range, it is believed that the light-absorbing layer can maintain an appropriate holding force for the article, thereby suppressing excessive adhesive strength between the light-absorbing layer and the article. As a result, when transferring the article from the light-absorbing layer, transfer is possible with less energy, which is thought to suppress the light-absorbing layer from remaining on the article surface and scattering during ablation, thereby contributing to debris suppression. Furthermore, because transfer is possible with less energy, the behavior of the article during transfer is stable, and the absolute value of variation in irradiation energy is also reduced, which is thought to contribute to excellent positional accuracy.

[0035] <Laminate (Laminate 1Y)> A laminate according to a second aspect of the present invention is a laminate including a first substrate, a light absorbing layer, a first adhesive layer, and an article in this order, wherein the laminate includes a plurality of articles in contact with the first adhesive layer, and the light absorbing layer and the first adhesive layer have recesses, and the first adhesive layer has an indentation modulus of elasticity at 50°C of 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the first adhesive layer is -50 to 150°C.

[0036] By adopting the above configuration, the laminate according to the second aspect of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling the production of a display device or semiconductor device with high accuracy. This means that, because the light absorbing layer portion and the first adhesive layer have recesses, the volume of the light absorbing layer and the volume of the first adhesive layer are reduced compared to when the recesses are not present. As a result, for the same reasons as the laminate according to the first aspect of the present invention, it is presumed that the effects of suppressing debris and excellent positional accuracy are achieved. Furthermore, because the indentation modulus of the first adhesive layer is within a specific range and / or the glass transition temperature of the first adhesive layer is within a specific range, it is believed that the first adhesive layer can maintain an appropriate force for holding the article, thereby suppressing excessive adhesive force between the first adhesive layer and the article. As a result, for the same reasons as the laminate according to the first aspect of the present invention, it is presumed that the effects of suppressing debris and excellent positional accuracy are achieved.

[0037] Furthermore, it is believed that the stack 1X and the stack 1Y are effective in suppressing debris and providing excellent positional accuracy, thereby improving the light emission characteristics of semiconductor chips, etc. In other words, it is estimated that the light extraction efficiency from semiconductor chips, etc. is improved, resulting in excellent light emission brightness.

[0038] <Configuration of Laminate> The laminate of the first aspect of the present invention has a first substrate, a light absorbing layer, and an article in this order. The laminate of the first aspect of the present invention has a plurality of articles in contact with the light absorbing layer, and the light absorbing layer has a recess. It is preferable that the light absorbing layer has a plurality of recesses. It is preferable that the light absorbing layer satisfies either of the following conditions (p) and (q): (p) The light absorbing layer has a recess, and the recess is formed by removing at least a portion of the light absorbing layer, thereby reducing the thickness. (q) The light absorbing layer has a recess, and the recess is an opening.

[0039] In the laminate of the first aspect of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the light absorbing layer is preferably present as a light absorbing layer of a plurality of convex portions in contact with the first substrate. In the laminate of the first aspect of the present invention, it is preferable that each of the plurality of articles is independently in contact with at least one of the light absorbing layers of the plurality of convex portions. In the laminate of the first aspect of the present invention, it is more preferable that each of the light absorbing layers of the plurality of convex portions is independently in contact with at least one of the plurality of articles.

[0040] In the laminate of the first aspect of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the light absorbing layer preferably exists as a plurality of island-shaped light absorbing layers in contact with the first substrate. In the laminate of the first aspect of the present invention, it is preferable that each of the plurality of articles is independently in contact with at least one of the plurality of island-shaped light absorbing layers. In the laminate of the first aspect of the present invention, it is more preferable that each of the plurality of island-shaped light absorbing layers is independently in contact with at least one of the plurality of articles.

[0041] In the present invention, a laminate having a first substrate, a light absorbing layer, and an article in this order may be referred to as a laminate 1X. Also, a laminate having a first substrate and a light absorbing layer in this order may be referred to as a laminate a1x.

[0042] A laminate according to a second aspect of the present invention has a first substrate, a light absorbing layer, a first adhesive layer, and an article, in this order. The laminate according to the second aspect of the present invention has a plurality of articles in contact with the first adhesive layer, and the light absorbing layer and the first adhesive layer have recesses. It is preferable that the light absorbing layer and the first adhesive layer have a plurality of recesses. It is preferable that the light absorbing layer and the first adhesive layer satisfy either of the following conditions (py) and (qy): (py) The light absorbing layer and the first adhesive layer have recesses, and the recesses are openings in the first adhesive layer, and at least a portion of the light absorbing layer is removed in the recesses, reducing their thickness. (qy) The light absorbing layer and the first adhesive layer have recesses, and the recesses are openings.

[0043] In the laminate of the second aspect of the present invention, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that the light absorbing layer exists as a light absorbing layer in the multiple convex portions and a light absorbing layer in the recessed portions while in contact with the first substrate, and that the thickness of the light absorbing layer in the recessed portions is smaller than the thickness of the light absorbing layer in the multiple convex portions. In the laminate of the second aspect of the present invention, from the viewpoint of the same inventive effects, it is preferable that the first adhesive layer exists as a first adhesive layer in the multiple convex portions while in contact with at least one of the light absorbing layers in the multiple convex portions. It is also preferable that the first adhesive layer exists as a first adhesive layer in the multiple recessed portions while in contact with at least one of the light absorbing layers in the multiple recessed portions. In the laminate of the second aspect of the present invention, it is preferable that each of the multiple articles independently contacts at least one of the first adhesive layers in the multiple convex portions. In a second aspect of the laminate of the present invention, the light absorbing layer is present as a light absorbing layer of a plurality of convex portions in contact with the first substrate, and the first adhesive layer is present as a first adhesive layer of a plurality of convex portions in contact with at least one of the light absorbing layers of the plurality of convex portions, and further, it is preferable that each of the plurality of articles independently contacts at least one of the first adhesive layers of the plurality of convex portions (hereinafter referred to as specific configuration 1 of the laminate). In a second aspect of the laminate of the present invention, it is more preferable that each of the first adhesive layers of the plurality of convex portions independently contacts at least one of the plurality of articles. In a second aspect of the laminate of the present invention, it is more preferable that each of the light absorbing layers of the plurality of convex portions independently contacts at least one of the first adhesive layers of the plurality of convex portions.

[0044] In the laminate of the second aspect of the present invention, the light absorbing layer preferably exists as a plurality of island-shaped light absorbing layers in contact with the first substrate, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy. In the laminate of the second aspect of the present invention, the first adhesive layer preferably exists as a plurality of island-shaped first adhesive layers in contact with at least one of the plurality of island-shaped light absorbing layers, from the viewpoint of the same inventive effects. In the laminate of the second aspect of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the plurality of island-shaped first adhesive layers. In the laminate of the second aspect of the present invention, it is preferable that the light absorbing layer exists as a plurality of island-shaped light absorbing layers in contact with the first substrate, and the first adhesive layer exists as a plurality of island-shaped first adhesive layers in contact with at least one of the plurality of island-shaped light absorbing layers, and further, each of the plurality of articles independently contacts at least one of the plurality of island-shaped first adhesive layers (hereinafter referred to as specific configuration 2 of the laminate). In the laminate of the second aspect of the present invention, it is more preferable that each of the plurality of island-shaped first adhesive layers independently contacts at least one of the plurality of articles. In the laminate according to the second aspect of the present invention, it is more preferable that each of the plurality of island-shaped light absorbing layers is independently in contact with at least one of the plurality of island-shaped first adhesive layers.

[0045] In the present invention, a laminate having a first substrate, a light absorbing layer, a first adhesive layer, and an article in this order may be referred to as laminate 1Y. Also, a laminate having a first substrate, a light absorbing layer, and a first adhesive layer in this order may be referred to as laminate a1y.

[0046] <First Substrate> The laminate of the present invention has a first substrate. From the viewpoint of reducing the energy of laser irradiation and improving positional accuracy, the first substrate is preferably a light-transmitting substrate. The light-transmitting substrate refers to a substrate having a maximum transmittance of 60% or more at a wavelength of 180 to 1100 nm. The maximum transmittance of the light-transmitting substrate at a wavelength of 180 to 1100 nm is preferably 70% or more, more preferably 80% or more, and even more preferably 90% or more. From the viewpoint of reducing the energy of laser irradiation and improving positional accuracy, the light-transmitting substrate preferably has a maximum transmittance within the above range at a wavelength of 180 to 550 nm, and more preferably has a maximum transmittance within the above range at a wavelength of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm. When the first substrate has a multilayer structure, the first substrate refers to a substrate having a maximum transmittance of 60% or more at a wavelength of 180 to 1100 nm when formed as a multilayer structure. The transmittance at wavelengths of 180 to 1100 nm may be adjusted by adjusting the thickness of the first substrate.

[0047] From the viewpoint of improving impact resistance, the light-transmitting substrate is preferably an inorganic substrate. The inorganic substrate as the light-transmitting substrate preferably contains silicon dioxide or dialuminum trioxide, and is more preferably an alkali glass substrate, a non-alkali glass substrate, a borosilicate glass substrate, a quartz glass substrate, a quartz crystal substrate, or a sapphire substrate. The thickness of the inorganic substrate as the light-transmitting substrate can be selected within a range that does not impair the above-mentioned transmittance, and from the viewpoint of improving handleability, it is preferably 0.10 mm or more, more preferably 0.30 mm or more. On the other hand, from the viewpoint of easy availability, the thickness is preferably 5.0 mm or less, more preferably 3.0 mm or less.

[0048] The light-transmitting substrate is preferably an organic substrate from the viewpoints of improving flexibility and ease of handling. The organic substrate serving as the light-transmitting substrate is preferably a polyethylene terephthalate substrate, an aramid substrate, a polyester substrate, a polypropylene substrate, a cycloolefin polymer substrate, a polycarbonate substrate, a cellulose triacetate substrate, or a polyimide substrate. The thickness of the organic substrate serving as the light-transmitting substrate can be selected within a range that does not impair the above-mentioned transmittance, and from the viewpoint of improving ease of handling, it is preferably 0.050 mm or more, more preferably 0.10 mm or more. On the other hand, from the viewpoint of suppressing light scattering during laser irradiation, the thickness is preferably 3.0 mm or less, more preferably 1.0 mm or less.

[0049] In the step (22) of irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer with a gap between the article provided on the first substrate and the second adhesive layer provided on the second substrate and transferring the article from the light absorbing layer to the second adhesive layer, the first substrate more preferably has a maximum transmittance of 60% or more at the wavelength of the actinic rays irradiated. Examples and preferred descriptions of the maximum transmittance are the same as those of the maximum transmittance at a wavelength of 180 to 1100 nm described above.

[0050] Furthermore, it is more preferable that the first substrate has a maximum transmittance of 60% or more at the wavelength of the actinic ray irradiated in the step (14b-1) of irradiating the light absorbing layer with actinic ray from the first substrate side of the light absorbing layer, which will be described later. Examples and preferred descriptions regarding the maximum transmittance are the same as the examples and preferred descriptions regarding the maximum transmittance at a wavelength of 180 to 1100 nm described above.

[0051] <Light absorbing layer; physical properties of light absorbing layer> The laminate according to the first aspect of the present invention has a light absorbing layer. In the laminate according to the first aspect of the present invention, the light absorbing layer has a recess. In the laminate according to the first aspect of the present invention, the indentation elastic modulus of the light absorbing layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is −50 to 150° C. The shape of the light absorbing layer is as described above.

[0052] The laminate according to the second aspect of the present invention has a light absorbing layer. In the laminate according to the second aspect of the present invention, the light absorbing layer has a recess. In the laminate according to the second aspect of the present invention, the indentation elastic modulus of the light absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa and / or the glass transition temperature of the light absorbing layer is preferably from -50 to 150°C.

[0053] The indentation elastic modulus of the light absorption layer at 50°C is set to 1.0 × 10 from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. ３ Pa or more is preferable, and 1.0 × 10 ４ Pa or more is more preferable, and 5.0 × 10 ４ Pa or more is more preferable, and 1.0 × 10 ５ Pa or more is even more preferable, and 5.0 × 10 ５ On the other hand, from the viewpoint of the same effects of the present invention, the indentation elastic modulus at 50°C is preferably 2.0 × 10 ９ Pa or less, and 5.0 × 10 ８ Pa or less is more preferable, and 2.0 × 10 ８ The indentation elastic modulus is more preferably 5.0×10 Pa or less. ７ Pa or less, and 2.0 × 10 ７ Pa or less is more preferable, and 5.0 × 10 ６ Pa or less is more preferable, and 2.0 × 10 ６ Pa or less is particularly preferred.

[0054] From the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the glass transition temperature of the light absorbing layer is preferably −50° C. or higher, more preferably −30° C. or higher, and even more preferably −10° C. or higher. On the other hand, from the viewpoint of the same effects of the invention, the glass transition temperature is preferably 150° C. or lower, more preferably 100° C. or lower, even more preferably 70° C. or lower, even more preferably 50° C. or lower, particularly preferably 30° C. or lower, and most preferably 10° C. or lower.

[0055] In the laminate of the present invention, the ratio of the indentation elastic modulus at 50°C of the light absorbing layer after any one of the following treatments (x1), (x2), and (x3) to the indentation elastic modulus at 50°C of the light absorbing layer before the treatment (hereinafter referred to as the indentation elastic modulus ratio of the light absorbing layer before and after the specific treatment): (indentation elastic modulus after treatment) / (indentation elastic modulus before treatment) is 1.0 × 10 ２ ~1.0 x 10 ４ In the laminate of the present invention, the difference between the glass transition temperature of the light absorbing layer after any of the following treatments (x1), (x2), and (x3) and the glass transition temperature of the light absorbing layer before the treatment (hereinafter referred to as the glass transition temperature difference of the light absorbing layer before and after the specific treatment) is preferably 30 to 100°C. (x1) Heating the light absorbing layer at 150°C for 30 minutes (x2) Applying 300 mJ / cm of activated actinic rays having a maximum wavelength in the wavelength range of 180 to 450 nm to the light absorbing layer ２ (x3) Irradiate the light absorbing layer with activating actinic rays having a maximum wavelength in the wavelength range of 180 to 450 nm at 300 mJ / cm ２ After irradiation, the light absorbing layer is heated at 100° C. for 30 minutes.

[0056] The indentation elastic modulus ratio of the light absorbing layer before and after the specific treatment is (x1), (x2), or (x3), and at least one of the indentation elastic modulus ratios of the light absorbing layer before and after the treatment is 1.0 × 10 ２ ~1.0 x 10 ４ With regard to the difference in glass transition temperature of the light absorbing layer before and after the specific treatment, it is preferable that at least one of the differences in glass transition temperature of the light absorbing layer before and after any one of the treatments (x1), (x2), and (x3) is 30 to 100°C.

[0057] The ratio of the indentation elastic modulus of the light absorbing layer before and after the specific treatment is set to 1.0×10 from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. ２ More preferably, 3.0 × 10 ２ More preferably, 5.0 × 10 ２ More preferably, 7.0 × 10 ２ More preferably, 1.0 x 10 ３On the other hand, from the viewpoint of the same effects of the present invention, the indentation elastic modulus ratio is more preferably 1.0 × 10 ４ Preferably, the following is 7.0 x 10 ３ More preferably, 5.0 x 10 ３ The following is even more preferred:

[0058] The difference in glass transition temperature of the light absorbing layer before and after the specific treatment is preferably 30° C. or higher, more preferably 40° C. or higher, and even more preferably 50° C. or higher, from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. On the other hand, from the viewpoint of the same effects of the invention, the difference in glass transition temperature is preferably 100° C. or lower, more preferably 90° C. or lower, and even more preferably 80° C. or lower.

[0059] The indentation modulus at 50°C of the light-absorbing layer, the glass transition temperature of the light-absorbing layer, the ratio of the indentation modulus of the light-absorbing layer before and after the specific treatment, and the difference in the glass transition temperature of the light-absorbing layer before and after the specific treatment can be adjusted within the above ranges by using a suitable (XA) binder resin in the light-absorbing layer described below. In particular, (XA1x) resins having a siloxane structure and / or a silicone structure in the structural unit of the resin, (XA1x) resins having an oxyalkylene structure in the structural unit of the resin, (XA2) resins which are acrylic resins having units derived from a (meth)acrylic acid ester derivative containing an aliphatic group having 4 to 20 carbon atoms, and (XA2) resins having a siloxane structure and / or a silicone structure in the structural unit of the resin, and (XA2) resins having an oxyalkylene structure in the structural unit of the resin are suitable for adjusting the physical properties of these light-absorbing layers within the above ranges. In order to adjust the physical properties of these light-absorbing layers within the above-mentioned ranges, it is also preferable to contain other structures in the structural units of the resins in the (XA1x) resins and (XA2) resins, or to use two or more types of (XA) binder resins in the suitable light-absorbing layers described below.

[0060] From the viewpoint of reducing the energy of laser irradiation and suppressing debris, the thickness of the light absorbing layer is preferably less than 5.0 μm, more preferably 4.0 μm or less, even more preferably 3.0 μm or less, even more preferably 2.0 μm or less, and particularly preferably 1.0 μm or less. On the other hand, from the viewpoint of improving positional accuracy, the thickness of the light absorbing layer is preferably 0.10 μm or more, more preferably 0.30 μm or more, and even more preferably 0.50 μm or more. The thickness of the light absorbing layer corresponds to the thickness of the light absorbing layer of the convex portions.

[0061] The thickness of the light absorbing layer in the recessed portions is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the light absorbing layer does not exist in the portions corresponding to the recessed portions.

[0062] The maximum absorbance per 1.0 μm thickness of the light absorbing layer at wavelengths of 180 to 550 nm, and the absorbance per 1.0 μm thickness of the light absorbing layer at wavelengths of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm are preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more, from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy. Furthermore, the maximum absorbance and the absorbance are preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of suppressing debris and improving positional accuracy, the maximum absorbance and the absorbance are preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum value of the absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0063] The maximum absorbance per 1.0 μm thickness of the light-absorbing layer at wavelengths of 180 to 550 nm can be adjusted within the above range by using a suitable (XDa) ultraviolet absorber and / or (XDb) colorant in the light-absorbing layer, as described below. In particular, (XDa) ultraviolet absorbers having one or more selected from the group consisting of a triazine structure, a benzotriazole structure, a benzophenone structure, an isocyanuric acid structure, and at least two benzene structures, as described below, and (XDa) ultraviolet absorbers with specific structures, are suitable for adjusting the absorbance of the light-absorbing layer within the above range. To adjust the absorbance of the light-absorbing layer within the above range, it is also preferable to include an (XDa) ultraviolet absorber or (XDb) colorant other than the above (XDa) ultraviolet absorber, or to use two or more types of suitable (XDa) ultraviolet absorbers and / or (XDb) colorants in the light-absorbing layer, as described below.

[0064] It is more preferable that the light absorbing layer has an absorbance in the above-mentioned range at the wavelength of the irradiated actinic rays in the process (22) described below, in which an article provided on the first substrate and a second adhesive layer provided on the second substrate are spaced apart, and the article is transferred from the light absorbing layer to the second adhesive layer, by irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer.

[0065] Furthermore, it is more preferable that the light absorbing layer has an absorbance of transmittance within the above range at the wavelength of the irradiated actinic ray in the step (14b-1) of irradiating the light absorbing layer with actinic ray from the first substrate side of the light absorbing layer, which will be described later.

[0066] <Configuration of Light Absorption Layer> From the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the area of ​​the surface 1a of the light absorption layer, which is on the first substrate side, is set to (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ), it is preferable that the relationship of formula (S-1) is satisfied. １ａ ) ≧ (S ２ａ ) (S-1) When the relationship of the above formula (S-1) is satisfied, the area of ​​the first a-surface (S １ａ ) and the area of ​​the second surface (S ２ａ ) is the ratio (S １ａ ) / (S ２ａ ), then (S１ａ ) / (S ２ａ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.70 or more, and particularly preferably 2.00 or more. １ａ ) / (S ２ａ ) is preferably 5.00 or less, more preferably 4.50 or less, even more preferably 4.00 or less, still more preferably 3.50 or less, and particularly preferably 3.00 or less, from the viewpoint of reducing the energy of laser irradiation.

[0067] When the light absorbing layer is in contact with the first substrate and exists as a light absorbing layer of a plurality of convex portions or a plurality of island-shaped light absorbing layers, it is more preferable that the light absorbing layer satisfy the relationship of the above formula (S-1) from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. Furthermore, when the laminate of the first aspect of the present invention has the above-mentioned configuration

[12] or

[13] , it is particularly preferable that the light absorbing layer satisfy the relationship of the above formula (S-1). Furthermore, when the laminate of the second aspect of the present invention has the specific configuration 1 or 2 of the laminate, it is particularly preferable that the light absorbing layer satisfy the relationship of the above formula (S-1).

[0068] When the light absorbing layer is present as a light absorbing layer with multiple convex portions or a light absorbing layer with multiple island-like portions in contact with the first substrate and satisfies the relationship of formula (S-1) above, the taper angle of the inclined side in the cross section of the light absorbing layer with multiple convex portions or a light absorbing layer with multiple island-like portions is 90° or less. From the viewpoint of suppressing debris and improving positional accuracy, the taper angle of the inclined side in the cross section of the light absorbing layer with multiple convex portions or a light absorbing layer with multiple island-like portions is preferably 90° or less, more preferably 85° or less, even more preferably 80° or less, even more preferably 75° or less, and particularly preferably 70° or less. On the other hand, from the viewpoint of reducing the energy of laser irradiation, the taper angle of the inclined side is preferably 30° or more, more preferably 45° or more, and even more preferably 60° or more. The taper angle of the inclined side in the cross section of the light absorbing layer refers to the angle formed between the edge of the first substrate with which the surface 1a of the light absorbing layer is in contact and the inclined side of the light absorbing layer.

[0069] It is believed that by having the light absorbing layer satisfy the relationship of the above formula (S-1), the contact area between the light absorbing layer and the article can be reduced, and excessive adhesive strength between the light absorbing layer and the article can be suppressed. As a result, when transferring the article from the light absorbing layer, transfer is possible with less energy, which suppresses the light absorbing layer from remaining on the surface of the article and the scattering of the light absorbing layer during ablation, and it is presumed that the effect of debris suppression is significant. Furthermore, since transfer is possible with less energy, the behavior of the article during transfer is stable, and the absolute value of variation in irradiation energy is also reduced, which is presumed to significantly improve the effect of excellent positional accuracy.

[0070] The light absorbing layer of the plurality of convex portions or the light absorbing layer of the plurality of island portions has an area (hereinafter referred to as the area of ​​the convex portions or the island-shaped light absorbing layer) of (S ｘ ), and the area of ​​each of the multiple items in contact with each other is (S ｙ ), it is preferable that the relationship of formula (S-xy) is satisfied. ｘ ) ≧ (S ｙ ) (S-xy) When the relationship of the above formula (S-xy) is satisfied, the area (S ｘ ) and the area of ​​the item (S ｙ ) is the ratio (S ｘ ) / (S ｙ ), then (S ｘ ) / (S ｙ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more. ｘ ) / (S ｙ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0071] Of the area of ​​the surface 1a of the light absorbing layer, which faces the first substrate, and the area of ​​the surface 2a of the light absorbing layer, which faces the surface 1a, the area of ​​the island-shaped light absorbing layer corresponds to the area of ​​the surface 1a, which faces the first substrate.

[0072] The areas of the light-absorbing layer at the convex portions and the concave portions are determined by determining the concave portions and convex portions of the light-absorbing layer using the following methods (a1) to (a4). (a1) In a plan view, any item in contact with the light-absorbing layer and any items adjacent to the any item (hereinafter referred to as "adjacent items") are determined. (a2) The thickness of the light-absorbing layer is measured at 10 points on each line connecting the shortest distance between the any item and each adjacent item. (a3) ​​For each of the 10 measured light-absorbing layer thicknesses, the minimum value is determined and the average of the minimum values ​​is calculated. (a4) Regions where the light-absorbing layer thickness is less than the average value obtained above + 0.10 μm are determined as concave portions of the light-absorbing layer, and regions where the light-absorbing layer thickness is the average value obtained above + 0.10 μm or more are determined as convex portions of the light-absorbing layer.

[0073] The plane in the plan view above refers to a plane horizontal to the article. Furthermore, the plan view refers to a plan view of the xy-axis plane as seen from the z-axis direction, where the plane horizontal to the article is the xy-axis plane and the direction perpendicular to the xy-axis plane is the z-axis direction, and the xy-axis plane is seen from the article side. When focusing on a specific component in the plan view, the view is taken as being seen through another component overlapping the specific component. When the article is not flat, the xy-plane is a plane horizontal to the light absorbing layer in contact with the article.

[0074] In addition, the first adhesive layer of the plurality of convex portions described later or the first adhesive layer of the plurality of island-like portions described later has an area (hereinafter referred to as the area of ​​the convex portions or the island-like first adhesive layer) of (S ｐ ), and the area of ​​each of the multiple items in contact with each other is (S ｑ ), it is preferable that the relationship of formula (S-pq) is satisfied. ｐ ) ≧ (S ｑ ) (S-pq) When the relationship of the above formula (S-pq) is satisfied, the area (S ｐ ) and the area of ​​the item (S ｑ ) is the ratio (S ｐ ) / (S ｑ ), then (S ｐ ) / (S ｑFrom the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more. ｐ ) / (S ｑ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0075] Of the area of ​​the surface of the first adhesive layer facing the light absorbing layer and the area of ​​the surface opposite to that surface, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface facing the light absorbing layer.

[0076] The areas of the first adhesive layer at the convex portions and the first adhesive layer at the concave portions are determined by determining the concave portions and convex portions of the first adhesive layer using the following methods (b1) to (b4). (b1) In a plan view, an arbitrary article in contact with the first adhesive layer and an article adjacent to the arbitrary article (hereinafter referred to as "each adjacent article") are determined. (b2) The thickness of the first adhesive layer is measured at 10 points on each line connecting the shortest distance between the arbitrary article and each adjacent article. (b3) For each of the 10 measured thicknesses of the first adhesive layer, the minimum thickness of the first adhesive layer is determined and the average of the minimum values ​​is calculated. (b4) Regions where the thickness of the first adhesive layer is less than the average value obtained above + 0.10 μm are determined as concave portions of the first adhesive layer, and regions where the thickness of the first adhesive layer is the average value obtained above + 0.10 μm or more are determined as convex portions of the first adhesive layer.

[0077] The plane in the plan view above refers to a plane horizontal to the article. Furthermore, the plan view refers to a plan view of the xy-axis plane as seen from the z-axis direction, where the plane horizontal to the article is the xy-axis plane and the direction perpendicular to the xy-axis plane is the z-axis direction, and the xy-axis plane is seen from the z-axis direction, toward the article. When focusing on a specific component in the plan view, the view is taken as being seen through another component overlapping the specific component. When the article is not flat, the xy-plane refers to a plane horizontal to the first adhesive layer in contact with the article.

[0078] From the viewpoint of improving the positional accuracy, the area of ​​the first a surface of the light absorbing layer, which is on the first substrate side, is set to (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ), it is also preferable that the relationship of formula (S-2) is satisfied. １ａ ) < (S ２ａ ) (S-2) When the relationship of the above formula (S-2) is satisfied, (S ２ａ ) / (S １ａ From the viewpoint of improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.70 or more, and particularly preferably 2.00 or more. ２ａ ) / (S １ａ From the viewpoint of improving positional accuracy, the value of the saturation angle θ is preferably 5.00 or less, more preferably 4.50 or less, even more preferably 4.00 or less, still more preferably 3.50 or less, and particularly preferably 3.00 or less.

[0079] When the light absorbing layer is in contact with the first substrate and exists as a light absorbing layer of a plurality of convex portions or a plurality of island-shaped light absorbing layers, it is more preferable that the light absorbing layer satisfies the relationship of the above formula (S-2) from the viewpoint of improving positional accuracy. Furthermore, when the laminate of the first aspect of the present invention has the above-mentioned configuration

[12] or

[13] , it is more preferable that the light absorbing layer satisfies the relationship of the above formula (S-2). Furthermore, when the laminate of the second aspect of the present invention has the specific configuration 1 or 2 of the laminate, it is more preferable that the light absorbing layer satisfies the relationship of the above formula (S-2).

[0080] When the light absorbing layer is present as a light absorbing layer with multiple convex portions or multiple island-shaped light absorbing layers in contact with the first substrate and satisfies the relationship of formula (S-2) above, the taper angle of the inclined side in the cross section of the light absorbing layer with multiple convex portions or multiple island-shaped light absorbing layers exceeds 90°. From the viewpoint of improving positional accuracy, the taper angle of the inclined side in the cross section of the light absorbing layer with multiple convex portions or multiple island-shaped light absorbing layers is preferably greater than 90°, more preferably 95° or more, even more preferably 100° or more, even more preferably 105° or more, and particularly preferably 110° or more. On the other hand, from the viewpoint of improving positional accuracy, the taper angle of the inclined side is preferably 150° or less, more preferably 135° or less, and even more preferably 120° or less. The taper angle of the inclined side in the cross section of the light absorbing layer refers to the angle formed between the edge of the first substrate with which the surface 1a of the light absorbing layer is in contact and the inclined side of the light absorbing layer.

[0081] It is believed that when the light absorbing layer satisfies the relationship of the above formula (S-2), the contact area between the light absorbing layer and the first substrate can be reduced, and the reaction force that the light absorbing layer receives from the first substrate during ablation can be suppressed. As a result, it is presumed that the excess energy transmitted from the light absorbing layer to the article due to the reaction force can be suppressed, and the behavior of the article during transfer can be stabilized, resulting in a remarkable effect of excellent positional accuracy.

[0082] The light-absorbing layer is preferably a layer made of a photosensitive composition or a layer made of a non-photosensitive composition. That is, the light-absorbing layer is preferably a layer formed from a photosensitive composition or a layer formed from a non-photosensitive composition. The photosensitive composition is preferably a positive-type photosensitive composition or a negative-type photosensitive composition.

[0083] <Binder Resin (XA) in Light-Absorbing Layer> The light-absorbing layer preferably contains a binder resin (XA). The binder resin (XA) in the light-absorbing layer is preferably the binder resin (A) in the composition described below, and a resin having a structure derived from the binder resin (A) in the composition is also preferred. From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the binder resin (XA) preferably has an acidic group, and more preferably has an acidic group in the structural unit of the resin. The acidic group is preferably one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, a mercapto group, a carboxy group, a carboxylic anhydride group, and a sulfonic acid group, and (WA) a weakly acidic group: one or more groups selected from the group consisting of a phenolic hydroxyl group, a hydroxyimide group, a hydroxyamide group, a silanol group, and a mercapto group is more preferred. The binder resin (XA) having a weakly acidic group (WA) may also be referred to as a weakly acidic group-containing resin (XA1).

[0084] From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the binder resin (XA) preferably has a radical polymerizable group, and more preferably has a radical polymerizable group in a structural unit of the resin. The radical polymerizable group preferably has an ethylenically unsaturated double bond group, and more preferably a photoreactive group, an alkenyl group having 2 to 5 carbon atoms, or an alkynyl group having 2 to 5 carbon atoms. The photoreactive group is preferably a styryl group, a cinnamoyl group, a maleimide group, a nadimide group, or a (meth)acryloyl group, and from the viewpoints of suppressing debris and improving positional accuracy, a (meth)acryloyl group is more preferred. On the other hand, the alkenyl group having 2 to 5 carbon atoms or the alkynyl group having 2 to 5 carbon atoms is preferably a vinyl group, an allyl group, a 2-methyl-2-propenyl group, a crotonyl group, a 2-methyl-2-butenyl group, a 3-methyl-2-butenyl group, a 2,3-dimethyl-2-butenyl group, an ethynyl group, or a 2-propargyl group, and from the viewpoints of suppressing debris and improving positional accuracy, a vinyl group or an allyl group is more preferable.

[0085] The binder resin (XA) preferably contains one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, polysiloxane, silicone resin, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, phenol resin, polyhydroxystyrene, phenol group-containing epoxy resin, phenol group-containing acrylic resin, acrylic resin, polycyclic side chain-containing resin, acid-modified epoxy resin, urethane resin, epoxy resin, and copolymers thereof.

[0086] In view of the effects of the invention described above, the binder resin (XA) preferably contains a weakly acidic group-containing resin (XA1) (hereinafter referred to as "resin (XA1)"). The resin (XA1) preferably contains a resin (XA1x): a resin having one or more structures selected from the group consisting of imide structures, amide structures, oxazole structures, siloxane structures, and silicone structures (hereinafter referred to as "imide structures, etc.") in its structural units, and / or a resin (XA1y): a resin having a phenolic hydroxyl group in its structural units.

[0087] From the viewpoint of the effects of the present invention, the (XA1x) resin preferably has one or more structures selected from the group consisting of imide structures, amide structures, and oxazole structures in its structural units, and more preferably has a siloxane structure and / or a silicone structure in its structural units. From the viewpoint of the effects of the present invention, the (XA1x) resin preferably also has an oxyalkylene structure in its structural units. The (XA1x) resin more preferably has one or more structures selected from the group consisting of imide structures, amide structures, and oxazole structures in its structural units, and more preferably has an oxyalkylene structure in its structural units.

[0088] Among the (XA1x) resins having one or more structures selected from the group consisting of imide structures and the like in the structural unit of the resin, resins having a siloxane structure and / or a silicone structure in the structural unit of the resin and resins having an oxyalkylene structure in the structural unit of the resin have a flexible skeleton derived from the siloxane structure, silicone structure, or oxyalkylene structure, and also have improved mechanical properties due to the imide structure, amide structure, or oxazole structure, and thereby the indentation modulus of the light absorbing layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ and adjusting the glass transition temperature of the light absorbing layer to within a range of −50 to 150° C. The (XA1x) resin is particularly suitable from the viewpoint of at least one of adjusting the indentation elastic modulus ratio of the light absorbing layer before and after the specific treatment to 1.0×10 ２ ~1.0 x 10 ４ and adjusting the difference in glass transition temperature of the light absorbing layer before and after the specific treatment to within a range of 30 to 100°C.

[0089] The siloxane structure and silicone structure in the (XA1x) resin are bonded to at least two alkylene groups, and are preferably divalent or higher structures via these alkylene groups. The divalent or higher structures are more preferably trivalent or higher, and even more preferably tetravalent or higher. On the other hand, the divalent or higher structures are preferably hexavalent or lower. The number of silicon atoms in the siloxane structure and / or silicone structure is preferably 5 or higher, more preferably 10 or higher, even more preferably 15 or higher, and particularly preferably 20 or higher. On the other hand, the number of silicon atoms is preferably 50 or lower, more preferably 40 or lower, even more preferably 30 or lower, even more preferably 27 or lower, and particularly preferably 25 or lower.

[0090] The siloxane structure in the (XA1x) resin is preferably a monoalkylsiloxane structure. The number of carbon atoms in the alkyl group in the monoalkylsiloxane structure is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of carbon atoms in the alkyl group is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less. The silicone structure in the (XA1x) resin is preferably a dialkylsilicone structure and / or a monoalkylsilicone structure. The number of carbon atoms in the alkyl group in the dialkylsilicone structure and monoalkylsilicone structure is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of carbon atoms in the alkyl group is preferably 10 or less, more preferably 8 or less, and even more preferably 6 or less.

[0091] The oxyalkylene structure in the (XA1x) resin is preferably a divalent or higher structure, more preferably a trivalent or higher structure, and even more preferably a tetravalent or higher structure. On the other hand, the oxyalkylene structure is preferably a hexavalent or lower structure. The number of oxyalkylene groups in the oxyalkylene structure in the (XA1x) resin is preferably 2 or more, more preferably 4 or more, even more preferably 8 or more, and particularly preferably 10 or more. On the other hand, the number of oxyalkylene groups is preferably 30 or less, more preferably 25 or less, even more preferably 20 or less, and particularly preferably 15 or less. The number of carbon atoms in the oxyalkylene group in the oxyalkylene structure is preferably 1 or more, more preferably 2 or more, and even more preferably 3 or more. On the other hand, the number of carbon atoms in the oxyalkylene group is preferably 6 or less, more preferably 4 or less. The oxyalkylene group is more preferably an oxyethylene group, an oxypropylene group, or an oxybutylene group.

[0092] The oxyalkylene structure in the (XA1x) resin preferably has two or more different oxyalkylene groups, more preferably three or more different oxyalkylene groups. The two or more different oxyalkylene groups may have different carbon numbers. The oxyalkylene structure more preferably has two or more selected from the group consisting of an oxyethylene group, an oxypropylene group, and an oxybutylene group, even more preferably an oxyethylene group, an oxypropylene group, and an oxybutylene group.

[0093] The structural unit having an imide structure or the like and the structural unit having a phenolic hydroxyl group are both structural units that constitute the resin, and are repeating units having a repeating number of 2 or more. The repeating number of these units is preferably 2 or more, more preferably 5 or more, and even more preferably 10 or more. On the other hand, the repeating number is preferably 1,000 or less.

[0094] The (XA1) resin preferably includes an (XA1x) resin. The (XA1x) resin preferably includes one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, polysiloxane, silicone resin, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, and more preferably includes one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof (hereinafter referred to as polyimide-based resins having weak acidic groups). The (XA1x) resin may be a single resin or a copolymer thereof. The polyimide-based resin having a weak acidic group preferably includes an amine residue having a phenolic hydroxyl group, and more preferably the amine residue having a phenolic hydroxyl group includes at least two cyclic structures having phenolic hydroxyl groups. The phenolic hydroxyl group in the amine residue having a phenolic hydroxyl group may react with a structure and / or group in the resin to form a benzoxazole ring. That is, in a resin having a benzoxazole ring in its structural unit, the benzoxazole ring may have an amine residue having a phenolic hydroxyl group.

[0095] The (XA1x) resin has a (WA) weakly acidic group and an imide structure or the like in its structural unit, which is thought to increase hydrogen bond formation and intermolecular interactions in the light-absorbing layer, generating internal stress and suppressing excessive adhesive force between the light-absorbing layer and the article. As a result, transfer is possible with less energy, which is thought to significantly reduce debris and improve positional accuracy.

[0096] The (XA1) resin preferably includes an (XA1y) resin. The (XA1y) resin preferably includes one or more resins selected from the group consisting of phenolic resins, polyhydroxystyrenes, phenolic group-containing epoxy resins, and phenolic group-containing acrylic resins. The (XA1y) resin may be a single resin or a copolymer thereof. The phenolic resin is preferably a novolac resin, a resole resin, or a phenol aralkyl resin. The polyhydroxystyrene may have units derived from a styrene derivative or units derived from a (meth)acrylic acid ester derivative. The phenolic group-containing epoxy resin is preferably a phenolic group-containing cardo resin or a phenolic group-containing epoxy ester resin. The phenolic group-containing acrylic resin may have units derived from a styrene derivative. Note that the phenolic group-containing acrylic resin is a resin different from polyhydroxystyrene.

[0097] The (XA1y) resin has a weak acidic group (WA), which is thought to increase hydrogen bond formation and intermolecular interactions in the light-absorbing layer, generating internal stress and suppressing excessive adhesive force between the light-absorbing layer and the article. As a result, transfer is possible with less energy, which is thought to significantly reduce debris and improve positional accuracy.

[0098] In view of the effects of the invention described above, the (XA) binder resin preferably contains a (XA2) resin (hereinafter referred to as (XA2) resin) that does not have a weakly acidic group, and preferably has a carboxy group, a carboxylic acid anhydride group, or a sulfonic acid group. The (XA2) resin may be a resin that does not have an acidic group. The (XA2) resin preferably contains one or more resins selected from the group consisting of acrylic resins, polycyclic side chain-containing resins, acid-modified epoxy resins, urethane resins, and epoxy resins. The (XA2) resin may be a single resin or a copolymer thereof. The acrylic resin may contain units derived from a styrene derivative. The polycyclic side chain-containing resin is preferably a cardo resin. The acid-modified epoxy resin is preferably an epoxy (meth)acrylate resin.

[0099] The (XA2) resin has a carboxy group, a carboxylic anhydride group, or a sulfonic acid group, which is thought to increase hydrogen bond formation and intermolecular interactions in the light-absorbing layer, thereby generating internal stress. Furthermore, the structural units of acrylic resins, polycyclic side chain-containing resins, acid-modified epoxy resins, urethane resins, and epoxy resins are thought to be able to maintain an appropriate level of article-holding strength and suppress excessive adhesive strength between the light-absorbing layer and the article. As a result, transfer is possible with less energy, which is thought to significantly reduce debris and improve positional accuracy.

[0100] In view of the effects of the invention described above, the (XA2) resin preferably contains an acrylic resin and has units derived from a (meth)acrylic acid ester derivative containing an aliphatic group having 4 to 20 carbon atoms. The carbon number of the aliphatic group in the (XA2) resin is preferably 4 or more, more preferably 6 or more, even more preferably 8 or more, and particularly preferably 10 or more. On the other hand, the carbon number of the aliphatic group is preferably 20 or less, more preferably 15 or less, and even more preferably 12 or less. The aliphatic group is preferably a linear or branched alkyl group, alkenyl group, or alkynyl group. It is also preferable that the aliphatic group in the (XA2) resin contains two or more different aliphatic groups. The two or more different aliphatic groups may have different numbers of carbon atoms.

[0101] Among the resins (XA2), the acrylic resin having a unit derived from a (meth)acrylic acid ester derivative containing an aliphatic group having 4 to 20 carbon atoms has improved flexibility and mechanical properties due to the unit derived from a (meth)acrylic acid ester derivative containing an aliphatic group, and has an indentation modulus of the light absorbing layer at 50°C of 1.0 × 10 ３ ~2.0 x 10 ９ and adjusting the glass transition temperature of the light absorbing layer to within a range of −50 to 150° C. The (XA2) resin is particularly suitable from the viewpoint of at least one of adjusting the indentation elastic modulus ratio of the light absorbing layer before and after the specific treatment to 1.0×10 ２ ~1.0 x 10 ４and adjusting the difference in glass transition temperature of the light absorbing layer before and after the specific treatment to within a range of 30 to 100°C.

[0102] When the light-absorbing layer is a layer made of a positive-type photosensitive composition, from the viewpoint of the effects of the invention described above, the (XA2) resin preferably contains an acrylic resin and has a unit derived from a (meth)acrylic acid ester derivative containing an aromatic group having 6 to 15 carbon atoms, or a unit derived from a styrene derivative having 6 to 15 carbon atoms. The aromatic group in the (XA2) resin preferably has 6 or more carbon atoms, more preferably 10 or more carbon atoms. On the other hand, the aromatic group preferably has 15 or less carbon atoms, more preferably 14 or less carbon atoms. The aromatic group may have a condensed polycyclic structure.

[0103] From the viewpoint of the effects of the present invention described above, it is also preferable that the resin (XA2) contains a resin having, in its structural unit, one or more structures selected from the group consisting of an imide structure, an amide structure, an oxazole structure, a siloxane structure, and a silicone structure (hereinafter referred to as an imide structure, etc.).

[0104] From the viewpoint of the effects of the present invention, the (XA2) resin more preferably has one or more structures selected from the group consisting of imide structures, amide structures, and oxazole structures in its structural units, and even more preferably has a siloxane structure and / or a silicone structure in its structural units. From the viewpoint of the effects of the present invention, the (XA2) resin also more preferably has an oxyalkylene structure in its structural units. It is even more preferable that the (XA2) resin has one or more structures selected from the group consisting of imide structures, amide structures, and oxazole structures in its structural units, and has an oxyalkylene structure in its structural units.

[0105] Examples and preferred descriptions of the siloxane structure, silicone structure, and oxyalkylene structure in the (XA2) resin are the same as those given above for the (XA1x) resin.

[0106] Among the (XA2) resins having one or more structures selected from the group consisting of imide structures and the like in the structural unit of the resin, resins having a siloxane structure and / or a silicone structure in the structural unit of the resin and resins having an oxyalkylene structure in the structural unit of the resin have a flexible skeleton derived from the siloxane structure, silicone structure, or oxyalkylene structure, and also have improved mechanical properties due to the imide structure, amide structure, or oxazole structure, and thereby the indentation modulus of the light absorbing layer at 50°C can be increased to 1.0 x 10 ３ ~2.0 x 10 ９ and adjusting the glass transition temperature of the light absorbing layer to within a range of −50 to 150° C. The (XA2) resin is particularly suitable from the viewpoint of at least one of adjusting the indentation elastic modulus ratio of the light absorbing layer before and after the specific treatment to 1.0×10 ２ ~1.0 x 10 ４ and adjusting the difference in glass transition temperature of the light absorbing layer before and after the specific treatment to within a range of 30 to 100°C.

[0107] The (XA2) resin preferably contains one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, polysiloxane, silicone resin, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, and copolymers thereof, and more preferably contains one or more resins selected from the group consisting of polyimide, polyimide precursor, polybenzoxazole, polybenzoxazole precursor, polyamideimide, polyamideimide precursor, polyamide, and copolymers thereof (hereinafter referred to as polyimide-based resins not having weakly acidic groups). The (XA2) resin may be either a single resin or a copolymer thereof.

[0108] Since the (XA2) resin has an imide structure or the like in its structural unit, it is thought that the formation of hydrogen bonds and intermolecular interactions in the light absorbing layer increase, generating internal stress and suppressing excessive adhesive force between the light absorbing layer and the article. As a result, transfer is possible with less energy, which is presumed to significantly reduce debris and improve positional accuracy.

[0109] Examples of polyimide precursors include polyamic acid, polyamic acid ester, polyamic acid amide, and polyisoimide. Examples of polyimides include resins obtained by dehydrating and cyclizing a polyimide precursor. Examples of polybenzoxazole precursors include polyhydroxyamide. Examples of polybenzoxazoles include resins obtained by dehydrating and cyclizing a polybenzoxazole precursor. Examples of polyamideimide precursors include resins obtained by reacting, for example, tricarboxylic acid anhydrides with diamines. Examples of polyamideimides include resins obtained by dehydrating and cyclizing a polyamideimide precursor. Examples of polyamides include resins obtained by reacting, for example, dicarboxylic acid chlorides with diamines.

[0110] In addition, when the (XA1x) resin, (XA1y) resin, and (XA2) resin each have a structure or group that constitutes a different resin, they are classified into one of the classification methods shown in Table 1-1 below. When a resin can be classified into two or more of the (XA1x) resin, (XA1y) resin, and (XA2) resin, the classification method is used to determine which resin it falls into.

[0111]

[0112] <(XDa) Ultraviolet absorber and (XDb) colorant in light-absorbing layer> The light-absorbing layer preferably contains an (XDa) ultraviolet absorber and / or an (XDb) colorant. The (XDa) ultraviolet absorber in the light-absorbing layer is preferably the (Da) ultraviolet absorber in the composition described below, and a compound having a structure derived from the (Da) ultraviolet absorber in the composition is also preferred. The (XDb) colorant in the absorbing layer is preferably the (Db) colorant in the composition described below, and a compound having a structure derived from the (Db) colorant in the composition is also preferred.

[0113] The (XDa) ultraviolet absorber refers to a compound that absorbs light with a wavelength in the ultraviolet region (less than 380 nm). From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the (XDa) ultraviolet absorber preferably has a phenolic hydroxyl group, and more preferably has at least two phenolic hydroxyl groups. The number of phenolic hydroxyl groups possessed by the (XDa) ultraviolet absorber is preferably one or more, more preferably two or more, even more preferably three or more, and particularly preferably four or more. On the other hand, the number of phenolic hydroxyl groups is preferably eight or less, more preferably six or less.

[0114] From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the ultraviolet absorber (XDa) preferably contains a compound having one or more selected from the group consisting of a triazine structure, a benzotriazole structure, a benzophenone structure, an isocyanuric acid structure, and at least two benzene structures, and more preferably contains a compound having at least two triazine structures, at least two benzotriazole structures, at least two benzophenone structures, or at least two isocyanuric acid structures.

[0115] The number of triazine structures, benzotriazole structures, benzophenone structures, or isocyanuric acid structures contained in the (XDa) ultraviolet absorber is preferably 2 or more, more preferably 3 or more.On the other hand, the number of triazine structures, benzotriazole structures, benzophenone structures, or isocyanuric acid structures is preferably 4 or less.Furthermore, the number of benzene structures contained in the (XDa) ultraviolet absorber is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more.On the other hand, the number of benzene structures is preferably 8 or less, more preferably 6 or less.

[0116] When the light-absorbing layer contains an (XDa) ultraviolet absorber, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the (XDa) ultraviolet absorber preferably contains a resin having a triazine structure, a benzotriazole structure, a benzophenone structure, or an isocyanuric acid structure in its structural unit (hereinafter referred to as an (XDa) ultraviolet absorber of a specific structure), and more preferably contains a resin having a triazine structure and / or a benzotriazole structure in its structural unit. Note that the (XDa) ultraviolet absorber of a specific structure is a resin different from the above-mentioned (XA) binder resin, but the (XDa) ultraviolet absorber of a specific structure corresponds to both an (XDa) ultraviolet absorber and an (XA) binder resin. In other words, when the light-absorbing layer contains an (XDa) ultraviolet absorber of a specific structure, the light-absorbing layer is considered to contain an (XDa) ultraviolet absorber and an (XA) binder resin.

[0117] From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the (XDa) ultraviolet absorber having a specific structure preferably contains one or more resins selected from the group consisting of polysiloxane, silicone resin, maleimide resin, maleimide-styrene resin, maleimide-triazine resin, maleimide-oxazine resin, phenol resin, polyhydroxystyrene, phenol group-containing epoxy resin, phenol group-containing acrylic resin, acrylic resin, polycyclic side chain-containing resin, acid-modified epoxy resin, urethane resin, epoxy resin, and copolymers thereof, and more preferably contains one or more resins selected from the group consisting of phenol group-containing acrylic resin, acrylic resin, maleimide-styrene resin, polyhydroxystyrene, and copolymers thereof.

[0118] Among the (XDa) ultraviolet absorbers, compounds having one or more selected from the group consisting of a triazine structure, a benzotriazole structure, a benzophenone structure, an isocyanuric acid structure, and at least two benzene structures, and (XDa) ultraviolet absorbers having a specific structure are particularly suitable for adjusting the maximum absorbance per 1.0 μm thickness of the light absorbing layer at a wavelength of 180 to 550 nm to within a range of 0.3 to 10.0.

[0119] The (XDb) colorant refers to a compound that imparts color by absorbing light in the wavelength range of visible light (380 to 780 nm). "Coloring" refers to imparting red, orange, yellow, green, blue, or purple. The (XDb) colorant preferably contains a pigment and / or dye. The (XDb) colorant preferably contains one or more types selected from the group consisting of a black agent, a mixture of two or more colorants, and a non-black colorant. From the viewpoints of reducing the energy of laser irradiation and improving positional accuracy, the black agent preferably contains an organic black pigment and / or an inorganic black pigment. From the viewpoints of suppressing debris and improving positional accuracy, the black agent preferably contains a black dye. The black color of the (XDb) colorant is as described in paragraphs

[0284] and

[0285] of WO 2019 / 087985.

[0120] The organic black pigment preferably includes one or more selected from the group consisting of benzofuranone-based black pigments, perylene-based black pigments, azo-based black pigments, anthraquinone-based black pigments, aniline-based black pigments, azo-based black pigments, and carbon black. The carbon black is preferably resin-coated, dye-coated, oxidized, surface-modified with an organic group having an ionic group, or surface-treated with a sulfonic acid group.

[0121] The inorganic black pigment preferably contains one or more elements selected from the group consisting of nitrides, carbides, oxynitrides, fine particles, oxides, composite oxides, sulfides, sulfates, nitrates, and carbonates, and also contains one or more metal elements selected from the group consisting of zirconium, vanadium, niobium, hafnium, tantalum, titanium, copper, iron, manganese, cobalt, chromium, nickel, zinc, calcium, and silver. The inorganic black pigment also preferably contains graphite or a silver-tin alloy.

[0122] The black dye preferably includes a black dye containing a metal element or a black dye not containing a metal element, more preferably a black dye not containing a metal element, and preferably an azo-based black dye.

[0123] The mixture of two or more colors of colorants preferably includes a mixture of two or more color pigments and / or a mixture of two or more color dyes, and more preferably the two or more colors include blue and / or purple, and red and orange. The colorant other than black preferably includes a color pigment and / or a color dye. The color pigment preferably includes an anthraquinone-based pigment, a diketopyrrolopyrrole-based pigment, a perylene-based pigment, an isoindoline-based pigment, an isoindolinone-based pigment, an imidazolone-based pigment, a quinacridone-based pigment, a pyranthrone-based pigment, a phthalocyanine-based pigment, an indanthrone-based pigment, or a dioxazine-based pigment. The color dye preferably includes a squarylium-based dye, a xanthene-based dye, a triarylmethane-based dye, or a phthalocyanine-based dye.

[0124] The maximum absorbance per 1.0 μm thickness at a wavelength of 180 to 550 nm of the binder resin (XA), the ultraviolet absorber (XDa), or the colorant (XDb) is preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more, from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy. Furthermore, the maximum absorbance is preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of suppressing debris and improving positional accuracy, the maximum absorbance is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0125] The absorbance per 1.0 μm thickness of the (XA) binder resin, (XDa) ultraviolet absorber, or (XDb) colorant at a wavelength of 193 nm, 248 nm, 266 nm, 308 nm, 351 nm, 355 nm, or 532 nm is preferably 0.3 or more, more preferably 0.5 or more, and even more preferably 1.0 or more, from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy. Furthermore, the absorbance is preferably 1.5 or more, more preferably 2.0 or more, even more preferably 2.5 or more, and particularly preferably 3.0 or more. On the other hand, from the viewpoint of suppressing debris and improving positional accuracy, the absorbance is preferably 10.0 or less, more preferably 8.0 or less, even more preferably 7.0 or less, and particularly preferably 6.0 or less. Furthermore, the maximum value of the absorbance is preferably 5.0 or less, more preferably 4.5 or less, and even more preferably 4.0 or less.

[0126] It is more preferable that the (XA) binder resin, (XDa) ultraviolet absorber, or (XDb) colorant have an absorbance in the above-mentioned range at the wavelength of the irradiated actinic rays in the process (22) described below, in which a gap is provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, and the article is transferred from the light absorbing layer to the second adhesive layer, by irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer.

[0127] Furthermore, it is more preferable that the (XA) binder resin, (XDa) ultraviolet absorber, or (XDb) colorant has an absorbance of transmittance within the above range at the wavelength of the actinic ray irradiated in the step (14b-1) of irradiating the light absorbing layer with actinic ray from the first substrate side of the light absorbing layer, which will be described later.

[0128] <Light-Absorbing Layer Made of Photosensitive Composition or Non-Photosensitive Composition> From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the light-absorbing layer is preferably a layer made of a positive-type photosensitive composition. Furthermore, when the laminate according to the first aspect of the present invention has the above-mentioned configuration

[12] or

[13] , the light-absorbing layer is particularly preferably a layer made of a positive-type photosensitive composition. Furthermore, when the laminate according to the second aspect of the present invention has the above-mentioned specific configuration 1 or 2 of the laminate, the light-absorbing layer is particularly preferably a layer made of a positive-type photosensitive composition. When the light-absorbing layer is a layer made of a positive-type photosensitive composition, it preferably contains one or more compounds selected from the group consisting of (C1) a naphthoquinone diazide compound, (C3) a photoacid generator, and (C4) a photobase generator in the composition described below, and it is also preferable that the light-absorbing layer contain a compound having a structure derived from these compounds in the composition.

[0129] When the light-absorbing layer is a layer made of a positive-type photosensitive composition, it is more preferable that the laminate of the first aspect of the present invention satisfies the relationship of formula (S-1) above from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, and it is particularly preferable that it has the structure

[12] or

[13] above and satisfies the relationship of formula (S-1) above. When the light-absorbing layer is a layer made of a positive-type photosensitive composition, it is more preferable that the laminate of the second aspect of the present invention satisfies the relationship of formula (S-1) above from the viewpoint of the same inventive effects, and it is particularly preferable that it has the specific structure 1 or 2 of the laminate above and satisfies the relationship of formula (S-1) above. Examples and preferred descriptions regarding the relationship of formula (S-1) above are as described above.

[0130] When the light-absorbing layer is a layer made of a positive-type photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferred descriptions regarding the thickness of the light-absorbing layer are as described above.

[0131] From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the light-absorbing layer is preferably a layer made of a negative-type photosensitive composition. Furthermore, when the laminate according to the first aspect of the present invention has the above-mentioned configuration

[12] or

[13] , the light-absorbing layer is more preferably a layer made of a negative-type photosensitive composition. Furthermore, when the laminate according to the second aspect of the present invention has the above-mentioned specific configuration 1 or 2 of the laminate, the light-absorbing layer is more preferably a layer made of a negative-type photosensitive composition. When the light-absorbing layer is a layer made of a negative-type photosensitive composition, it preferably contains one or more compounds selected from the group consisting of (C2) a photopolymerization initiator, (C3) a photoacid generator, and (C4) a photobase generator in the composition described below, and it is also preferable that the light-absorbing layer contains a compound having a structure derived from these compounds in the composition.

[0132] When the light-absorbing layer is a layer made of a negative-type photosensitive composition, the laminate of the first aspect of the present invention more preferably satisfies the relationship of formula (S-1) above from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, and even more preferably has the structure

[12] or

[13] above and satisfies the relationship of formula (S-1) above. When the light-absorbing layer is a layer made of a negative-type photosensitive composition, the laminate of the second aspect of the present invention more preferably satisfies the relationship of formula (S-1) above from the viewpoint of the same inventive effects, and even more preferably has the specific structure 1 or 2 of the laminate above and satisfies the relationship of formula (S-1) above. Examples and preferred descriptions regarding the relationship of formula (S-1) are as described above.

[0133] When the light-absorbing layer is a layer made of a negative-type photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferred descriptions regarding the thickness of the light-absorbing layer are as described above.

[0134] From the viewpoint of improving positional accuracy, the light-absorbing layer is preferably a layer made of a non-photosensitive composition. Furthermore, when the laminate according to the first aspect of the present invention has the above-mentioned configuration

[12] or

[13] , the light-absorbing layer is more preferably a layer made of a non-photosensitive composition. Furthermore, when the laminate according to the second aspect of the present invention has the above-mentioned specific configuration 1 or 2 of the laminate, the light-absorbing layer is more preferably a layer made of a non-photosensitive composition. When the light-absorbing layer is a layer made of a non-photosensitive composition, it preferably contains a crosslinking agent (F) and / or a radically polymerizable compound (B) in the composition described below, and it is also preferable that the light-absorbing layer contains a compound having a structure derived from these compounds in the composition.

[0135] When the light-absorbing layer is a layer made of a non-photosensitive composition, the laminate of the first aspect of the present invention more preferably satisfies the relationship of formula (S-1) above from the viewpoint of improving positional accuracy, and even more preferably has the structure

[12] or the structure

[13] above and satisfies the relationship of formula (S-1) above. When the light-absorbing layer is a layer made of a non-photosensitive composition, the laminate of the second aspect of the present invention more preferably satisfies the relationship of formula (S-1) above from the viewpoint of improving positional accuracy, and even more preferably has the specific structure 1 or 2 of the laminate above and satisfies the relationship of formula (S-1) above. Examples and preferred descriptions regarding the relationship of formula (S-1) above are as described above.

[0136] When the light-absorbing layer is a layer made of a non-photosensitive composition, the thickness of the light-absorbing layer is more preferably less than 5.0 μm. Examples and preferred descriptions regarding the thickness of the light-absorbing layer are as described above.

[0137] From the viewpoint of improving positional accuracy, the laminate according to the first aspect of the present invention preferably satisfies the relationship of the above formula (S-2), and more preferably has the above configuration

[12] or

[13] and satisfies the relationship of the above formula (S-2). From the viewpoint of improving positional accuracy, the laminate according to the second aspect of the present invention preferably satisfies the relationship of the above formula (S-2), and more preferably has the above specific configuration 1 or 2 of the laminate and satisfies the relationship of the above formula (S-2). Examples and preferred descriptions regarding the relationship of the above formula (S-2) are as described above.

[0138] From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, it is preferable that the light absorbing layer satisfy any one of the following conditions (α) to (γ): (α) The light-absorbing layer is a layer formed from a positive-type photosensitive composition, and the positive-type photosensitive composition satisfies at least one of the following conditions (1), (3), and (4). (β) The light-absorbing layer is a layer formed from a negative-type photosensitive composition, and the negative-type photosensitive composition satisfies at least one of the following conditions (2) to (4). (γ) The light-absorbing layer is a layer formed from a non-photosensitive composition, and the non-photosensitive composition satisfies the following condition (5) and / or the following condition (6). (1) Contains (C1) a naphthoquinone diazide compound and (F) a crosslinking agent. (2) Contains (C2) a photopolymerization initiator and (B) a radically polymerizable compound. (3) Contains (C3) a photoacid generator and (F) a crosslinking agent. (4) Contains (C4) a photobase generator and (F) a crosslinking agent. (5) Contains (F) a crosslinking agent. (6) Contains (B) a radically polymerizable compound.

[0139] When the light-absorbing layer satisfies the above condition (α), the positive-type photosensitive composition preferably also satisfies at least one of the above conditions (2) and (6).When the light-absorbing layer satisfies the above condition (β), the negative-type photosensitive composition preferably also satisfies at least one of the above conditions (1), (5), and (6).

[0140] <First adhesive layer> The laminate according to the second aspect of the present invention has a first adhesive layer. In the laminate according to the second aspect of the present invention, the first adhesive layer has a recess. In the laminate according to the second aspect of the present invention, the indentation modulus of the first adhesive layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the first adhesive layer is -50 to 150°C. The above-mentioned light absorbing layer and first adhesive layer preferably satisfy either of the following conditions (py) and (qy): (py) the light absorbing layer and the first adhesive layer have a recess, the recess is an opening in the first adhesive layer, and at least a part of the light absorbing layer is removed in the recess, thereby reducing the thickness; (qy) the light absorbing layer and the first adhesive layer have a recess, the recess is an opening.

[0141] The examples and preferred descriptions regarding the indentation modulus at 50°C of the first adhesive layer and the glass transition temperature of the first adhesive layer are the same as the examples and preferred descriptions regarding the indentation modulus at 50°C of the light absorbing layer and the glass transition temperature of the light absorbing layer described above, respectively.

[0142] Furthermore, in the laminate that is the second aspect of the present invention, examples and preferred descriptions regarding the difference between the indentation modulus at 50°C of the first adhesive layer after any of the treatments (x1), (x2), and (x3) above and the indentation modulus at 50°C of the first adhesive layer before the treatment, and the difference between the glass transition temperature of the first adhesive layer after any of the treatments (x1), (x2), and (x3) above and the glass transition temperature of the first adhesive layer before the treatment, are the same as the examples and preferred descriptions regarding the indentation modulus ratio of the light absorbing layer before and after the specific treatment and the glass transition temperature of the light absorbing layer before and after the specific treatment, respectively.

[0143] From the viewpoint of reducing the energy of laser irradiation and suppressing debris, the thickness of the first adhesive layer is preferably less than 5.0 μm, more preferably 4.0 μm or less, even more preferably 3.0 μm or less, even more preferably 2.0 μm or less, and particularly preferably 1.0 μm or less. On the other hand, from the viewpoint of improving positional accuracy, the thickness of the first adhesive layer is preferably 0.10 μm or more, more preferably 0.30 μm or more, and even more preferably 0.50 μm or more.

[0144] The thickness of the first adhesive layer in the recessed portion is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the first adhesive layer is not present in the portion corresponding to the recessed portion.

[0145] Examples and preferred descriptions regarding other physical properties and other configurations of the first adhesive layer are the same as those for the light-absorbing layer described above. Examples and preferred descriptions regarding the (XA) binder resin, (XDa) ultraviolet absorber, and (XDb) colorant in the first adhesive layer are the same as those for the light-absorbing layer described above. The first adhesive layer is preferably a layer made of a positive-type photosensitive composition, a layer made of a negative-type photosensitive composition, or a layer made of a non-photosensitive composition. The first adhesive layer may also be a layer made of the same composition as the light-absorbing layer described above.

[0146] The first adhesive layer is preferably a layer containing a resin having a polydialkyl silicone structure in its structural units, more preferably a layer containing a resin in which units having a polydialkyl silicone structure are the main component units, and even more preferably a layer containing these resins as the main component. The main component unit in the resin refers to the unit that is most abundant in the structural units of the resin on a molar ratio basis. The main component in the first adhesive layer refers to the component that is most abundant in the constituent components of the first adhesive layer on a mass basis. The polydialkyl silicone structure is more preferably a polydimethyl silicone structure. Furthermore, these resins may further have a polymonoalkyl monoaryl silicone structure in their structural units.

[0147] <Article> The laminate of the first aspect of the present invention has an article. The laminate of the first aspect of the present invention has a plurality of articles in contact with the light absorbing layer. The laminate of the second aspect of the present invention has an article. The laminate of the second aspect of the present invention has a plurality of articles in contact with the first adhesive layer.

[0148] The laminate of the present invention is preferably transferred to another laminate and then incorporated into an electronic component, electronic device, mobile object, building, or window. Examples of electronic components include semiconductor devices, antennas, display devices, optical devices, printed wiring boards, semiconductor packages, active components including semiconductor devices, and passive components. The laminate of the present invention is preferably used in the manufacture of the above-mentioned electronic components, electronic devices, mobile objects, buildings, or windows.

[0149] Examples of semiconductor devices include semiconductor devices having a fan-out wafer-level package structure, a fan-out panel-level package structure, or an antenna-in-package structure. Examples of antennas include a microstrip line antenna or a strip line antenna. Examples of display devices include an organic electroluminescent (EL) display, a quantum dot display, a micro LED display, a mini LED display, or a liquid crystal display. Examples of metal-clad laminates include printed wiring boards. It is also preferable that the electronic component has a hollow structure. The hollow structure has a hollow structure support material and a hollow structure roof material. Examples of electronic components having a hollow structure include MEMS (Micro Electro Mechanical Systems). The above-mentioned package structure in the semiconductor device may be either a single-die or multi-die structure, and a multi-die structure is preferred from the viewpoints of improving integration density and suppressing transmission loss between wiring. The structure including the multi-die preferably has a chiplet structure, and more preferably includes one or more types of die selected from the group consisting of logic, memory, analog IC (analog integrated circuit), RF circuit (radio frequency circuit), and power semiconductor, and even more preferably includes two or more types of die.

[0150] The laminate of the present invention is preferably used for producing semiconductor devices, antennas, display devices, optical devices, printed wiring boards, semiconductor packages, active components including semiconductor devices, or passive components having the above-mentioned configuration.

[0151] <Article; Semiconductor Chip> The article is preferably a semiconductor chip. The semiconductor layer preferably contains silicon, silicon carbide, gallium nitride, indium gallium nitride, aluminum gallium nitride, digallium trioxide, gallium arsenide, aluminum gallium arsenide, gallium arsenide phosphide, indium phosphide, gallium phosphide, zinc selenide, aluminum indium gallium phosphide, indium tin oxide, indium zinc oxide, indium gallium zinc oxide, diamond, aluminum zinc oxide, or zinc oxide as a main component. The main component in the semiconductor layer refers to the component that is contained in the largest amount by mass among the components of the semiconductor layer.

[0152] The semiconductor chip preferably has a flip-chip structure having multiple electrode terminals on one surface. When the article has multiple electrode terminals on one surface, the surface of the article facing the light absorbing layer is designated as surface 1b, and the surface opposite surface 1b is designated as surface 2b, the article preferably has multiple electrode terminals on surface 1b. The above configuration is suitable from the viewpoint of inhibiting corrosion of the electrode terminals and improving reliability when forming the recesses or openings in the light absorbing layer of the laminate according to the first aspect of the present invention by alkaline development or etching. The above configuration is also suitable from the viewpoint of inhibiting corrosion of the electrode terminals and improving reliability when forming the recesses or openings in the light absorbing layer and the recesses or openings in the first adhesive layer of the laminate according to the second aspect of the present invention by alkaline development or etching.

[0153] The semiconductor chip is also preferably a vertical type having a plurality of electrode terminals on one surface and another surface different from the first surface. The vertical structure is more preferably a structure having a plurality of electrode terminals on one surface and an opposite surface. The above-described configuration is suitable for the manufacture of electronic components and the like using the laminate of the present invention, from the viewpoint of achieving high integration of semiconductor devices and improving the resolution of display devices.

[0154] The electrode terminal is preferably a conductive layer. －８ ~1.0 x 10 －４It refers to a layer having a resistivity of Ω·cm. The electrode terminal preferably contains Ag, Cu, Au, In, Sb, Sn, Pb, Ti, Al, Ni, Mo, or Cr as a main component element. The main component element in the electrode terminal refers to the element that is contained in the largest amount by mass among the constituent elements of the electrode terminal. The length of one side of the electrode terminal is preferably 0.20 μm or more and 100 μm or less. The height of the electrode terminal is preferably 0.10 μm or more and 50 μm or less.

[0155] Preferably, the article is a semiconductor chip, and the semiconductor chip is a light-emitting element. Preferably, the semiconductor chip, which is a light-emitting element, is provided in a display device. Preferably, the display device having the above configuration is a micro LED display or a mini LED display. Preferably, the display device has a semiconductor chip, which is a light-emitting element, a wiring layer, a rewiring layer, and an interlayer insulating layer for the rewiring layer, and the semiconductor chip and the wiring layer and / or the semiconductor chip and the rewiring layer are electrically connected. Furthermore, preferably, the display device further has a partition layer and / or a planarizing layer. Preferably, the semiconductor chip, which is a light-emitting element, is a PN junction diode in which a P-type semiconductor and an N-type semiconductor are joined.

[0156] The length of one side of the semiconductor chip that is the light-emitting element is preferably 0.50 μm or more, more preferably 5.0 μm or more, and even more preferably 10 μm or more. On the other hand, the length of one side is preferably 200 μm or less, more preferably 100 μm or less, and even more preferably 50 μm or less. The thickness of one side of the semiconductor chip that is the light-emitting element is preferably 0.50 μm or more, more preferably 1.0 μm or more, and even more preferably 5.0 μm or more. On the other hand, the thickness of one side is preferably 100 μm or less, more preferably 50 μm or less, and even more preferably 20 μm or less. The laminate of the present invention is preferably used in the manufacture of a display device having the above configuration.

[0157] It is also preferable that the article is a semiconductor chip, and that the semiconductor chip is a light-emitting element, a light-receiving element, an optical coupling element, an optical filter element, an optical modulation element, or an optical amplification element (hereinafter referred to as an optical communication element, etc.). The semiconductor chip that is an optical communication element, etc. is preferably provided in an optical device. The optical device having the above configuration preferably has a semiconductor chip that is an optical communication element, etc., a logic semiconductor chip, a package substrate, and a printed wiring board.

[0158] In the optical device, it is preferable that a semiconductor chip such as an optical communication element encapsulated on a package substrate and a logic semiconductor chip encapsulated on the package substrate are electrically connected on a printed wiring board. Furthermore, it is more preferable that the optical device has a semiconductor chip such as an optical communication element encapsulated on a package substrate, and the semiconductor chip such as an optical communication element encapsulated on the logic semiconductor chip via the package substrate. Furthermore, it is more preferable that the optical device further has an interposer, and the semiconductor chip such as an optical communication element encapsulated on the logic semiconductor chip via the interposer, and the semiconductor chip such as an optical communication element encapsulated on the package substrate. Furthermore, it is particularly preferable that the optical device has a semiconductor chip such as an optical communication element encapsulated on a logic semiconductor chip and the semiconductor chip such as an optical communication element encapsulated on the package substrate. When the semiconductor chip such as an optical communication element encapsulated on the logic semiconductor chip and the logic semiconductor chip are encapsulated on the package substrate, it is preferable that the electrodes are electrically connected by bump bonding, and it is more preferable that the electrodes are electrically connected directly without using bumps. In addition, it is also preferable that the optical device has a semiconductor chip such as an optical communication element and a logic semiconductor chip formed on the same substrate and electrically connected to each other.

[0159] The length of one side of a semiconductor chip such as an optical communication element is preferably 10 μm or more, more preferably 30 μm or more, and even more preferably 50 μm or more. On the other hand, the length of one side is preferably 2000 μm or less, more preferably 1500 μm or less, and even more preferably 1000 μm or less. The ratio of the long side length to the short side length of a semiconductor chip such as an optical communication element is preferably 2.0 or more, more preferably 3.0 or more, even more preferably 5.0 or more, even more preferably 7.0 or more, and particularly preferably 10 or more. On the other hand, the ratio of the long side length to the short side length is preferably 200 or less, more preferably 150 or less, and even more preferably 100 or less. The ratio of the long side length to the short side length is preferably 70 or less, more preferably 50 or less, even more preferably 40 or less, even more preferably 30 or less, and particularly preferably 20 or less. The thickness of one side of a semiconductor chip, such as an optical communication element, is preferably 0.10 μm or more, more preferably 0.50 μm or more, and even more preferably 1.0 μm or more. On the other hand, the thickness of one side is preferably 20 μm or less, more preferably 10 μm or less, and even more preferably 5.0 μm or less. The laminate of the present invention is preferably used for producing an optical device having the above configuration.

[0160] <Laminate 0A; Donor Substrate and Article> A laminate having a donor substrate and an article in this order may be referred to as laminate 0A. The article in the laminate according to the first aspect of the present invention is preferably transferred from the laminate 0A to the light absorbing layer of the laminate a1x. The article in the laminate according to the second aspect of the present invention is preferably transferred from the laminate 0A to the first adhesive layer of the laminate a1y.

[0161] From the viewpoint of controlling the conductivity and insulation, the donor substrate is preferably a substrate having a semiconducting layer, more preferably a substrate having a semiconductor layer. －４ ~1.0 x 10 ８It refers to a layer having a resistivity of Ω cm. The semiconductor layer preferably contains Ga, As, Al, In, Zn, Se, Si, Sn, nitrogen, phosphorus, carbon, or oxygen as a main component element. The main component element in the semiconductor layer refers to the element that is most abundant on a mass basis among the constituent elements of the semiconductor layer. Furthermore, the semiconductor layer preferably contains silicon, silicon carbide, gallium nitride, indium gallium nitride, aluminum gallium nitride, gallium trioxide, gallium arsenide, aluminum gallium arsenide, gallium arsenide phosphide, indium phosphide, gallium phosphide, zinc selenide, aluminum indium gallium phosphide, indium tin oxide, indium zinc oxide, indium gallium zinc oxide, diamond, aluminum zinc oxide, or zinc oxide as a main component. The main component in the semiconductor layer refers to the component that is most abundant on a mass basis among the constituent components of the semiconductor layer. It is also preferable that the donor substrate is a substrate consisting of multiple layers having a semiconductor layer, and the semiconductor layer is the layer that is the main component. The "major component layer" in the donor substrate refers to the layer that accounts for the largest mass among the multiple layers constituting the donor substrate. The donor substrate is preferably a semiconductor layer. The donor substrate is also preferably a substrate consisting of multiple layers including an insulating layer and a semiconductor layer, and the insulating layer is preferably an alkali glass substrate, a non-alkali glass substrate, a borosilicate glass substrate, a quartz glass substrate, a quartz crystal substrate, or a sapphire substrate.

[0162] The donor substrate preferably has a photodegradable layer. That is, at least one of the layers constituting the donor substrate is preferably a photodegradable layer. Furthermore, the laminate OA is preferably a laminate having a donor substrate, a photodegradable layer, and an article in this order.

[0163] <Laminate 0B and laminate a0; 0th substrate, 0th adhesive layer, and article> A laminate having a 0th substrate, a 0th adhesive layer described later, and an article in this order may be referred to as laminate 0B. A laminate having a 0th substrate and a 0th adhesive layer described later in this order may also be referred to as laminate a0. The article in the laminate of the first aspect of the present invention is preferably transferred from laminate 0A to the 0th adhesive layer of laminate a0, and then transferred from laminate 0B to the light absorbing layer of laminate a1x. The article in the laminate of the second aspect of the present invention is preferably transferred from laminate 0A to the 0th adhesive layer of laminate a0, and then transferred from laminate 0B to the first adhesive layer of laminate a1y.

[0164] The 0th substrate is preferably an inorganic substrate from the viewpoint of improving impact resistance. The 0th substrate is preferably an organic substrate from the viewpoint of improving flexibility and ease of handling. The inorganic substrate is also preferably a substrate having a semiconductor layer.

[0165] The 0th substrate is preferably a light-transmitting substrate from the viewpoints of reducing the energy of laser irradiation and improving positional accuracy, an inorganic substrate from the viewpoint of improving impact resistance, and an organic substrate from the viewpoints of improving flexibility and ease of handling.

[0166] Examples and preferred descriptions regarding the light-transmitting substrate, inorganic substrate, organic substrate, substrate having a semiconducting layer, and substrate having a semiconductor layer are the same as the examples and preferred descriptions regarding the first substrate and donor substrate, respectively.

[0167] It is also preferred that the 0th adhesive layer is a layer containing a resin having a polydialkyl silicone structure in its structural unit. Examples and preferred descriptions regarding the polydialkyl silicone structure are the same as those for the first adhesive layer described above. The 0th adhesive layer may be made of a known material, such as a known adhesive layer. The 0th adhesive layer may also be a layer made of a known composition. The 0th adhesive layer may also be a layer made of the same composition as the first adhesive layer described above.

[0168] <Laminate 2 and Laminate a2; Second Substrate, Second Adhesive Layer, and Article> A laminate having a second substrate, a second adhesive layer (described later), and an article in this order may be referred to as laminate 2. A laminate having a second substrate and a second adhesive layer (described later) in this order may be referred to as laminate a2. The article in the laminate according to the first aspect of the present invention is preferably transferred from laminate 1X to the second adhesive layer of laminate a2. The article in the laminate according to the second aspect of the present invention is preferably transferred from laminate 1Y to the second adhesive layer of laminate a2.

[0169] The second substrate is preferably an inorganic substrate from the viewpoint of improving impact resistance, and is preferably an organic substrate from the viewpoint of improving flexibility and ease of handling. The inorganic substrate is also preferably a substrate having a semiconductor layer.

[0170] The second substrate is preferably a light-transmitting substrate from the viewpoints of reducing the energy of laser irradiation and improving positional accuracy, an inorganic substrate from the viewpoint of improving impact resistance, and an organic substrate from the viewpoints of improving flexibility and ease of handling.

[0171] When the article in the laminate according to the first aspect of the present invention is to be transferred from laminate 1X to the second adhesive layer of laminate a2 and then electrically connect the electrode terminals and the like of the article to the wiring of laminate 2, the second substrate is preferably a substrate having a semiconductive layer from the viewpoint of conductivity control and insulation control, and more preferably a substrate having a semiconductor layer. When the article in the laminate according to the second aspect of the present invention is to be transferred from laminate 1Y ... 2 is to be transferred from the laminate of the present invention and then electrically connect the electrode terminals and the like of the article to the wiring of laminate 2, the laminate 2 preferably has an insulating layer. The insulating layer has a volume resistivity of 1.0 x 10 ８ ~1.0 x 10 １８ This refers to a layer with a resistivity of Ω·cm.

[0172] Examples and preferred descriptions regarding the light-transmitting substrate, inorganic substrate, organic substrate, substrate having a semiconducting layer, and substrate having a semiconductor layer are the same as the examples and preferred descriptions regarding the first substrate and donor substrate, respectively.

[0173] It is also preferred that the second adhesive layer is a layer containing a resin having a polydialkyl silicone structure in its structural unit. The examples and preferred descriptions of the polydialkyl silicone structure are the same as those for the first adhesive layer. The second adhesive layer may be made of a known material, such as a known adhesive layer. The second adhesive layer may also be a layer made of a known composition. The second adhesive layer may also be a layer made of the same composition as the first adhesive layer.

[0174] When the item transferred from the laminate of the present invention is a semiconductor chip, and the semiconductor chip is the above-mentioned optical communication element or the like, the maximum transmittance of the second adhesive layer at a wavelength of 1300 to 1600 nm is preferably 60% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more.

[0175] <Laminate 3J, Laminate 3, and Laminate a3; Element Substrate, Third Adhesive Layer, and Article> A laminate having an element substrate, a third adhesive layer (described later), and an article in this order may be referred to as laminate 3. A laminate having an element substrate and a third adhesive layer (described later) in this order may be referred to as laminate a3. A laminate having an element substrate and an article in this order may be referred to as laminate 3J. The article in the laminate of the present invention is preferably transferred from laminate 2 to the third adhesive layer of laminate a3. Laminate 2 refers to a laminate in which an article is transferred onto the second substrate and the second adhesive layer according to the present invention. The article in the laminate of the present invention is preferably transferred from laminate 2 to the element substrate. The element substrate preferably has wiring provided on the element substrate.

[0176] When an article in the laminate of the present invention is to be transferred from laminate 2 to the third adhesive layer of laminate a3 and then electrically connected to the wiring of laminate 3, the element substrate is preferably a substrate having a semiconductive layer, more preferably a substrate having a semiconductor layer, from the viewpoint of controlling conductivity and insulation. When an article transferred from the laminate of the present invention is to be electrically connected to the wiring of laminate 3, the element substrate is preferably a substrate having a semiconductive layer, more preferably a substrate having a semiconductor layer. When an article transferred from the laminate of the present invention is to be electrically connected to the wiring of laminate 3, the element substrate is preferably a substrate having an insulating layer. The insulating layer has a volume resistivity of 1.0 × 10 ８ ~1.0 x 10 １８ This refers to a layer with a resistivity of Ω·cm.

[0177] When an article in the laminate of the present invention is transferred from the laminate 2 to an element substrate and then an electrode terminal or the like provided on the article is electrically connected to wiring provided on the element substrate, the element substrate is preferably a substrate having a semiconductive layer from the viewpoint of controlling conductivity and insulation, and more preferably a substrate having a semiconductor layer. When an electrode terminal or the like provided on the article transferred from the laminate of the present invention is electrically connected to wiring provided on the element substrate, the element substrate preferably has an insulating layer. The insulating layer has a volume resistivity of 1.0 × 10 ８ ~1.0 x 10 １８ This refers to a layer with a resistivity of Ω·cm.

[0178] Also preferred is an embodiment in which the element substrate is used as a support substrate and some or all of the layers of the element substrate are peeled off, which is suitable for use in a chip-first (RDL-last) manufacturing process in which an article such as a semiconductor chip is disposed on the element substrate as a support substrate and then metal wiring, an interlayer insulating layer, etc. are formed, or in a chip-last (RDL-first) manufacturing process in which an article such as a semiconductor chip is disposed on the element substrate as a support substrate and then metal wiring, an interlayer insulating layer, etc. are formed.

[0179] When the element substrate is used as a support substrate, it is preferable that the element substrate has an inorganic substrate layer from the viewpoint of improving impact resistance. Furthermore, it is preferable that the element substrate has an organic substrate layer from the viewpoint of improving flexibility and ease of handling. The electrical connection between the electrode terminals and the like of the article and the wiring of the element substrate is preferably by solder bonding, bonding using an anisotropic conductive film, or direct bonding. For direct bonding, bonding by surface activation using plasma treatment such as hybrid bonding is preferred. Examples and preferred descriptions of the light-transmitting substrate, inorganic substrate, organic substrate, substrate having a semiconducting layer, and substrate having a semiconductor layer are the same as the examples and preferred descriptions of the first substrate and donor substrate, respectively.

[0180] It is also preferred that the third adhesive layer is a layer containing a resin having a polydialkyl silicone structure in its structural unit. The examples and preferred descriptions of the polydialkyl silicone structure are the same as those for the first adhesive layer. The third adhesive layer may be made of a known material, such as a known adhesive layer. The third adhesive layer may also be a layer made of a known composition. The third adhesive layer may also be a layer made of the same composition as the first adhesive layer.

[0181] When the item transferred from the laminate of the present invention is a semiconductor chip, and the semiconductor chip is the above-mentioned optical communication element, etc., the maximum transmittance of the third adhesive layer at a wavelength of 1300 to 1600 nm is preferably 60% or more, more preferably 70% or more, even more preferably 80% or more, and particularly preferably 90% or more.

[0182] <Laminates 1X, a1x, 1Y, and a1y; Photosensitive Composition and Non-Photosensitive Composition> The following describes the light absorbing layer in the laminate of the first aspect of the present invention, and the composition for forming the light absorbing layer or first adhesive layer in the laminate of the second aspect of the present invention. The composition is a photosensitive composition or a non-photosensitive composition. However, the photosensitive composition or non-photosensitive composition is not limited to the following embodiments, and various modifications are naturally possible as long as the object of the invention can be achieved and the gist of the invention is not deviated from. The photosensitive composition is a positive-type photosensitive composition or a negative-type photosensitive composition.

[0183] <(A) Binder Resin> The composition preferably contains an (A) binder resin. The (A) binder resin is a heat-resistant resin, at least a portion of which remains in a cured product obtained by curing the composition. The (A) binder resin is preferably a resin that cures by forming a crosslinked structure through a reaction. The reaction may be by heating, by irradiation with energy rays, or the like, and the crosslinked structure may also be formed by a crosslinking agent (F) described below. The (A) binder resin is preferably a thermosetting resin. The (A) binder resin is preferably an alkali-soluble resin having an acidic group or an organic solvent-soluble resin having an organic solvent-soluble structure. The (A) binder resin is preferably a resin that is imparted with positive or negative photosensitivity by a (C) photosensitizer described below and has solubility that allows the formation of a positive or negative pattern. Examples and preferred descriptions of the (A) binder resin are the same as those of the (XA) binder resin in the light-absorbing layer described above.

[0184] <(B) Radical Polymerizable Compound> The composition preferably further contains a (B) radical polymerizable compound (hereinafter referred to as a (B) compound) and / or a (F) crosslinking agent. The (B) compound refers to a compound having a radical polymerizable group. Examples and preferred descriptions regarding the radical polymerizable group are the same as those for the (XA) binder resin in the light-absorbing layer. The radical polymerizable group is preferably a (meth)acryloyl group from the viewpoints of suppressing debris and improving positional accuracy. The number of radical polymerizable groups possessed by the (B) compound is preferably 2 or more, more preferably 3 or more, and even more preferably 4 or more, from the viewpoints of suppressing debris and improving positional accuracy. On the other hand, the number of radical polymerizable groups is preferably 12 or less, more preferably 10 or less, even more preferably 8 or less, and particularly preferably 6 or less, from the viewpoints of suppressing debris and improving positional accuracy.

[0185] <(C) Photosensitizer> The photosensitive composition contains a (C) photosensitizer. The (C) photosensitizer refers to a compound that imparts positive or negative photosensitivity to the composition by undergoing bond cleavage, reaction, or structural change upon exposure to generate another compound. The (C) photosensitizer preferably contains one or more selected from the group consisting of a (C1) naphthoquinone diazide compound (hereinafter referred to as a (C1) compound), a (C2) photopolymerization initiator (hereinafter referred to as a (C2) compound), a (C3) photoacid generator, and a (C4) photobase generator. Imparting positive photosensitivity to the composition is suitable for forming recesses or openings in the light absorbing layer of the laminate according to the first embodiment of the present invention by alkaline development. Furthermore, imparting positive photosensitivity to the composition is suitable for forming recesses or openings in the light absorbing layer and recesses or openings in the first adhesive layer of the laminate according to the second embodiment of the present invention by alkaline development.

[0186] The (C1) compound refers to a compound that undergoes a structural change upon exposure to generate an indenecarboxylic acid and / or a sulfoindenecarboxylic acid. The inclusion of the (C1) compound is suitable for positive-tone pattern formation. During exposure, the acidic compound resulting from the structural change of the (C1) compound selectively solubilizes the exposed portion of the film of the composition in an alkaline developer, resulting in significant effects of debris suppression and improved positional accuracy. From the viewpoint of debris suppression and improved positional accuracy, the (C1) compound preferably contains a compound having a 1,2-naphthoquinonediazide-5-sulfonic acid ester structure (hereinafter referred to as a 5-ester structure) and / or a compound having a 1,2-naphthoquinonediazide-4-sulfonic acid ester structure (hereinafter referred to as a 4-ester structure), and more preferably contains a compound having a 5-ester structure and a compound having a 4-ester structure. The (C1) compound preferably has a 5-ester structure of a phenolic hydroxyl group or a 4-ester structure of a phenolic hydroxyl group.

[0187] The (C2) compound refers to a compound that generates radicals upon bond cleavage and / or reaction upon exposure. The inclusion of the (C2) compound is suitable for negative-tone pattern formation. Even if only a small amount of radicals are generated from the (C2) compound during exposure, radical polymerization of the (B) compound or the like proceeds in a chain reaction, resulting in significant effects of debris suppression and improved positional accuracy. The (C2) compound is preferably a benzyl ketal-based compound, an α-hydroxyketone-based compound, an α-aminoketone-based compound, a biimidazole-based compound, a phosphine oxide-based compound, an oxime ester-based compound, an acridine-based compound, a titanocene-based compound, a benzophenone-based compound, an acetophenone-based compound, an aromatic ketoester-based compound, or a benzoic acid ester-based compound. From the viewpoint of debris suppression and improved positional accuracy, an oxime ester-based compound is more preferred. The oxime ester-based compound preferably contains a compound having an oxime ester structure (α-oxime structure) and / or a compound having an oxime ester carbonyl structure (β-oxime structure).

[0188] The (C3) photoacid generator refers to a compound that generates an acid by bond cleavage and / or reaction upon exposure. The (C3) compound is different from the (C1) compound. The inclusion of the (C3) compound is suitable for negative pattern formation from the viewpoint of promoting cationic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by an acid-dissociable group, the acidic group is liberated upon exposure, making it suitable for positive pattern formation, and the effect of improving sensitivity upon exposure is significant. Examples of the (C3) compound include ionic compounds and nonionic compounds. The ionic compound is preferably a triorganosulfonium salt compound. The nonionic compound is preferably a halogen-containing compound, a diazomethane compound, a sulfone compound, a sulfonate ester compound, a carboxylate ester compound, a sulfonimide compound, a phosphate ester compound, or a sulfonebenzotriazole compound.

[0189] The (C4) photobase generator refers to a compound that generates a base by bond cleavage and / or reaction upon exposure. The inclusion of a (C4) compound is suitable for negative-tone pattern formation from the viewpoint of promoting anionic polymerization, etc. On the other hand, when a resin or the like has an acidic group protected by a base-dissociable group, it is suitable for positive-tone pattern formation from the viewpoint of liberating the acidic group upon exposure, and the effect of improving sensitivity during exposure is remarkable. Examples of the (C4) compound include ionic compounds and nonionic compounds. Preferred ionic compounds are diazabicycloalkene salt compounds, triazabicycloalkene salt compounds, α-keto quaternary ammonium salt compounds, benzyl quaternary ammonium salt compounds, guanidine salt compounds, and biguanide salt compounds. Preferred ionic compounds have a ketoprofen structure, an oxoxanthene structure, a benzofuran structure, or a naphthalene structure. The nonionic compound is preferably a nitrobenzyl carbamate compound, an anthracenyl carbamate compound, a benzoin-based carbamate compound, an anthraquinone-based carbamate compound, a hydroxycinnamamide-based compound, or a coumarinamide-based compound.

[0190] <(Da) Ultraviolet Absorber and (Db) Colorant> The composition preferably further contains a (Da) ultraviolet absorber and / or a (Db) colorant. The (Da) ultraviolet absorber refers to a compound that absorbs light in the ultraviolet wavelength range (less than 380 nm). The (Db) colorant refers to a compound that imparts color by absorbing light in the visible wavelength range (380 to 780 nm). "Coloring" refers to imparting red, orange, yellow, green, blue, or purple. Examples and preferred descriptions of the (Da) ultraviolet absorber and (Db) colorant are the same as those of the (XDa) ultraviolet absorber and (XDb) colorant in the light-absorbing layer described above. Note that, like the (XDa) ultraviolet absorber with a specific structure in the light-absorbing layer, the (Da) ultraviolet absorber with a specific structure is a resin different from the (A) binder resin described above, but the (Da) ultraviolet absorber with a specific structure corresponds to both the (Da) ultraviolet absorber and the (A) binder resin. That is, when the composition contains an ultraviolet absorber (Da) having a specific structure, the composition is considered to contain the ultraviolet absorber (Da) and the binder resin (A).

[0191] <(E) Dispersant> From the viewpoint of improving the dispersion stability of the pigment, it is preferable that the composition further contains a (E) dispersant. The (E) dispersant refers to a compound having a structure that interacts with the pigment surface and a structure that inhibits approach of pigments to each other. The (E) dispersant preferably has a basic group, an acidic group, or a salt structure thereof, and more preferably has a basic group or a salt structure thereof.

[0192] <(F) Crosslinking Agent> The composition preferably further contains a (B) compound and / or a (F) crosslinking agent. The (F) crosslinking agent refers to a compound having a crosslinkable group, a cationically polymerizable group, or an anionically polymerizable group capable of reacting with a resin or the like. From the viewpoint of suppressing debris and improving positional accuracy, the (F) crosslinking agent preferably has one or more groups selected from the group consisting of an alkoxyalkyl group, a hydroxyalkyl group, an epoxy group, an oxetanyl group, and a blocked isocyanate group (hereinafter referred to as a specific crosslinkable group). The alkoxyalkyl group is preferably an alkoxymethyl group or an alkoxyethyl group, and more preferably a methoxymethyl group or a methoxyethyl group. The hydroxyalkyl group is preferably a methylol group or an ethylol group. From the viewpoint of suppressing debris and improving positional accuracy, the number of specific crosslinkable groups possessed by the (F) crosslinking agent is preferably 2 or more, more preferably 3 or more, even more preferably 4 or more, and particularly preferably 6 or more. On the other hand, from the viewpoint of suppressing debris and improving positional accuracy, the number of specific crosslinkable groups is preferably 12 or less, more preferably 10 or less, and even more preferably 8 or less.

[0193] <Other Additives and Solvents> The composition preferably further contains a dissolution promoter, a sensitizer, a chain transfer agent, a polymerization inhibitor, a silane coupling agent, an ink repellent, or a surfactant. Known additives may be used as these additives. The composition preferably further contains a solvent. When the composition contains a pigment and further contains a dispersant, the solvent is preferably a compound having an acetate bond, a propionate bond, or a butyrate bond, from the viewpoint of improving the dispersion stability of the pigment.

[0194] <Method for producing laminate (Laminate 1X)> Hereinafter, the methods for producing laminates according to the third, fourth, fifth, sixth, seventh, and eighth aspects of the present invention will be described. When referring to the method for producing a laminate according to the present invention, this refers to the method for producing a laminate according to the third, fourth, fifth, sixth, seventh, and eighth aspects of the present invention. On the other hand, when describing a method for producing a laminate according to a specific aspect, it is referred to as the method for producing a laminate according to the third aspect of the present invention. However, the present invention is not limited to the following embodiments, and various modifications are naturally possible within the scope of achieving the object of the invention and not departing from the gist of the invention.

[0195] The method for manufacturing a laminate according to the third aspect of the present invention has the configuration described above in [1]. By adopting the above configuration, the method for manufacturing a laminate according to the third aspect of the present invention can achieve both debris suppression and excellent positional accuracy when transferring an article such as a semiconductor chip, thereby enabling the production of a display device or semiconductor device with high accuracy. This means that, because a recess is formed in the light absorbing layer, the volume of the light absorbing layer is reduced compared to when no recess is formed. As a result, for the same reasons as the laminate according to the first aspect of the present invention, it is presumed that the effects of debris suppression and excellent positional accuracy are achieved. Furthermore, because the article is transferred by irradiating the active actinic ray with a gap between the first and second substrates, it is presumed that the light absorbing layer evaporated during ablation is efficiently released outside the system. As a result, it is presumed that the effect of debris suppression is achieved because re-deposition on the second substrate after ablation can be reduced. It is presumed that the effects of debris suppression and excellent positional accuracy are achieved. It is presumed that the effects of debris suppression and excellent positional accuracy are achieved, thereby improving the light-emitting characteristics of semiconductor chips, etc. In other words, it is presumed that the light extraction efficiency from semiconductor chips, etc. is improved, resulting in excellent light-emitting brightness.

[0196] <Laminate Manufacturing Method (Laminate 1X)> A laminate manufacturing method according to a fourth aspect of the present invention is a laminate manufacturing method including: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12) a step of temporarily fixing articles to the light absorbing layer (hereinafter referred to as step (12)); and (13) a step of patterning the light absorbing layer (hereinafter referred to as step (13)), wherein in step (12), a plurality of articles are provided in contact with the light absorbing layer; and in step (13), the light absorbing layer has recesses; and in step (13), the light absorbing layer has an indentation elastic modulus of 1.0×10 at 50° C. ３ ~2.0 x 10 ９ Pa, and / or in the step (13), the glass transition temperature of the light absorbing layer is −50 to 150° C.

[0197] By adopting the above configuration, the laminate manufacturing method of the fourth aspect of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling display devices and semiconductor devices to be obtained with high accuracy. This means that, because a recess is formed in the light-absorbing layer, the volume of the light-absorbing layer is reduced compared to when no recess is formed. As a result, for the same reasons as with the laminate of the first aspect of the present invention, it is presumed that the effects of debris suppression and excellent positional accuracy are achieved. Furthermore, because the indentation modulus of the light-absorbing layer is within a specific range and / or the glass transition temperature of the light-absorbing layer is within a specific range, it is presumed that the light-absorbing layer can maintain an appropriate force for holding the article, thereby suppressing excessive adhesive strength between the light-absorbing layer and the article. As a result, for the same reasons as with the laminate of the first aspect of the present invention, it is presumed that the effects of debris suppression and excellent positional accuracy are achieved. Furthermore, it is presumed that the effects of debris suppression and excellent positional accuracy are achieved, thereby improving the light-emitting characteristics of semiconductor chips and the like. In other words, it is presumed that the light-extraction efficiency from semiconductor chips and the like is improved, resulting in excellent light-emitting brightness.

[0198] <Method for manufacturing laminate (Laminate 1Y)> A method for manufacturing a laminate according to a fifth aspect of the present invention includes: (10y) a step of preparing a laminate a1y having a first substrate, a light absorbing layer, and a first adhesive layer in this order; (12y) a step of temporarily fixing an article to the first adhesive layer (hereinafter referred to as step (12y)); (13y) a step of patterning the light absorbing layer and the first adhesive layer (hereinafter referred to as step (13y)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22y) a step of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer, with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, to transfer the article from the first adhesive layer to the second adhesive layer (hereinafter referred to as step (22y)), In the step (12y), the method for producing a laminate includes a plurality of articles in contact with the first adhesive layer, and in the step (13y), recesses are formed in the light absorbing layer and the first adhesive layer.

[0199] By adopting the above configuration, the laminate manufacturing method of the fifth aspect of the present invention can suppress debris during transfer of an article such as a semiconductor chip while maintaining excellent positional accuracy, thereby enabling the production of a display device or semiconductor device with high accuracy. This means that, because recesses are formed in the light absorbing layer portion and the first adhesive layer, the volume of the light absorbing layer and the first adhesive layer are reduced compared to when recesses are not formed. As a result, for the same reasons as in the laminate of the first aspect of the present invention, it is presumed that the effects of debris suppression and excellent positional accuracy are achieved. Furthermore, because the article is transferred by irradiating the active actinic rays with a gap between the first substrate and the second substrate, it is presumed that the light absorbing layer and / or the first adhesive layer evaporated during ablation are efficiently released outside the system. As a result, it is presumed that the effect of debris suppression is achieved because re-deposition on the second substrate after ablation can be reduced. It is also presumed that the effects of debris suppression and excellent positional accuracy are achieved. It is presumed that the effects of debris suppression and excellent positional accuracy are achieved, thereby improving the light-emitting characteristics of semiconductor chips, etc. In other words, it is presumed that the light extraction efficiency from the semiconductor chips, etc. is improved, resulting in excellent light-emitting brightness.

[0200] <Laminate manufacturing method (Laminate 1Y)> A laminate manufacturing method according to a sixth aspect of the present invention is a laminate manufacturing method including: (10y) a step of preparing a laminate a1y having a first substrate, a light absorbing layer, and a first adhesive layer in this order; (12y) a step of temporarily fixing articles to the first adhesive layer (hereinafter referred to as step (12y)); and (13y) a step of patterning the light absorbing layer and the first adhesive layer (hereinafter referred to as step (13y)), wherein in step (12y), a plurality of articles are in contact with the first adhesive layer, and in step (13y), recesses are formed in the light absorbing layer and the first adhesive layer, and in step (13y), the first adhesive layer has an indentation elastic modulus at 50°C of 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or in the step (13y), the glass transition temperature of the first adhesive layer is −50 to 150° C.

[0201] By adopting the above configuration, the laminate manufacturing method of the sixth aspect of the present invention can suppress debris during transfer of an article such as a semiconductor chip while achieving excellent positional accuracy, thereby enabling the production of a display device or semiconductor device with high accuracy. This means that, because recesses are formed in the light absorbing layer portion and the first adhesive layer, the volume of the light absorbing layer and the volume of the first adhesive layer are reduced compared to when no recesses are formed. As a result, for the same reasons as in the laminate of the first aspect of the present invention, it is estimated that the effects of debris suppression and excellent positional accuracy are achieved. It is also believed that the effects of debris suppression and excellent positional accuracy are achieved, thereby improving the light emission characteristics of semiconductor chips and the like. In other words, it is estimated that the light extraction efficiency from semiconductor chips and the like is improved, resulting in excellent light emission brightness.

[0202] The seventh aspect of the present invention is a method for producing a laminate having the configuration of

[10] above. That is, the seventh aspect of the present invention is a method for producing a laminate comprising: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12z) a step of temporarily fixing an article to the light absorbing layer and patterning the light absorbing layer (hereinafter referred to as step (12z)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22) a step of irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer, with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, and transferring the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)), wherein the (12z) step has a plurality of articles in contact with the light absorbing layer, and the (12z) step forms a recess in the light absorbing layer.

[0203] By adopting the above configuration, the method for manufacturing a laminate according to the seventh aspect of the present invention is presumed to achieve the effects of debris suppression and excellent positional accuracy for the same reasons as the method for manufacturing a laminate according to the third aspect of the present invention. For the same reasons, it is believed that the light-emitting characteristics of semiconductor chips and the like are improved. That is, it is presumed that the light extraction efficiency from semiconductor chips and the like is improved, resulting in excellent light-emitting brightness.

[0204] The method for producing a laminate according to an eighth aspect of the present invention includes: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; and (12z) a step of temporarily fixing articles to the light absorbing layer and patterning the light absorbing layer (hereinafter referred to as step (12z)), wherein in step (12z), a plurality of articles are in contact with the light absorbing layer, and in step (12z), recesses are formed in the light absorbing layer, and in step (12z), an indentation elastic modulus at 50°C of the light absorbing layer is 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or in the step (12z), the glass transition temperature of the light absorbing layer is −50 to 150° C.

[0205] By adopting the above configuration, the laminate manufacturing method of the eighth aspect of the present invention is presumed to achieve the effects of debris suppression and excellent positional accuracy for the same reasons as the laminate manufacturing method of the fourth aspect of the present invention. For the same reasons, it is believed that the light-emitting characteristics of semiconductor chips and the like are improved. That is, it is presumed that the light extraction efficiency from semiconductor chips and the like is improved, resulting in excellent light-emitting brightness.

[0206] <Step of Preparing Donor Substrate and Laminate> The method for producing a laminate of the present invention preferably includes a step of preparing a laminate OA having a donor substrate and an article in this order. The laminate OA preferably includes a plurality of articles.

[0207] The exemplary and preferred descriptions regarding the laminate OA are as described above. The process for preparing these laminates may be a process for preparing by manufacturing a laminate. Alternatively, the process for preparing these laminates may be a process for preparing an already manufactured laminate.

[0208] <Donor Substrate; Step of Forming an Article> The method for producing a laminate of the present invention can include step (01), i.e., a step of forming an article on a donor substrate. It is preferable that the method for producing a laminate of the present invention includes a plurality of articles in step (01). The examples and preferred descriptions regarding the donor substrate and the articles are as described above. Having a plurality of articles in step (01) refers to the state after step (01). That is, in step (01), a plurality of articles are formed on the donor substrate. The step (01) of forming an article on a donor substrate is preferably a step of forming a semiconductor chip on the donor substrate. Examples of methods for forming articles in these steps include a method of forming one or more layers selected from the group consisting of a conductive layer, an insulating layer, and a semiconductive layer, and a method of forming one or more layers selected from the group consisting of a conductive inorganic layer, an insulating resin layer, an insulating inorganic layer, and a semiconductor layer is preferred.

[0209] <0th substrate; step of preparing laminate> The method for producing a laminate of the present invention preferably includes a step of preparing a laminate a0 having a 0th substrate and a 0th adhesive layer in this order. The method for producing a laminate of the present invention preferably includes a step of preparing a laminate OB having a 0th substrate, a 0th adhesive layer, and an article in this order. It is preferable that the laminate OB has a plurality of articles. Examples and preferred descriptions regarding the laminate a0 and the laminate OB are as described above. The step of preparing these laminates may be a step of manufacturing and preparing a laminate. Furthermore, the step of preparing these laminates may be a step of preparing an already manufactured laminate.

[0210] <0th substrate; step of forming 0th adhesive layer> The method for producing a laminate of the present invention preferably includes (02) a step of forming a temporary fixing layer on the 0th substrate. Examples and preferred descriptions regarding the 0th adhesive layer are as described above. Methods for forming the 0th adhesive layer in these steps include, for example, a method of applying a composition or a method of arranging a film made of the composition. Examples and preferred descriptions regarding these methods are the same as the examples and preferred descriptions in step (11) described below.

[0211] <0th substrate; step of temporarily fixing an article> The method for producing a laminate of the present invention preferably includes (03) a step of temporarily fixing an article to the 0th adhesive layer (hereinafter referred to as step (03)). The method for producing a laminate of the present invention more preferably includes the above step (01) and step (03). The method for producing a laminate of the present invention preferably includes a plurality of articles in contact with the 0th adhesive layer in step (03).

[0212] The examples and preferred descriptions regarding the article are as described above. Having a plurality of articles in step (03) refers to the state after step (03). That is, in step (03), a plurality of articles are temporarily fixed to the zeroth adhesive layer. Step (03) preferably includes: (03a) a step of irradiating the articles provided on the donor substrate with activated actinic rays from the donor substrate side while the articles are in contact with the zeroth adhesive layer provided on the zeroth substrate, thereby transferring the articles from the donor substrate to the zeroth adhesive layer (hereinafter referred to as step (03a)); or (03b) a step of irradiating the articles provided on the donor substrate with activated actinic rays from the donor substrate side while a gap is provided between the articles provided on the donor substrate and the zeroth adhesive layer provided on the zeroth substrate, thereby transferring the articles from the donor substrate to the zeroth adhesive layer (hereinafter referred to as step (03b)).

[0213] From the viewpoint of reducing process time, in steps (03a) and (03b), it is preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the 0th adhesive layer in one go. It is also preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the 0th adhesive layer in two or more separate steps, and it is also preferable to transfer them sequentially in two or more separate steps. Sequentially transferring multiple articles means continuously transferring multiple articles one by one. It is preferable for the donor substrate to have the photodegradation layer, or for the laminate 0A to have the photodegradation layer, in order to transfer articles from the donor substrate to the 0th adhesive layer in step (03a) or step (03b).

[0214] Step (03) preferably includes a step of contacting and bonding the article provided on the donor substrate with the 0th adhesive layer provided on the 0th substrate before step (03a) or step (03b). Step (03) more preferably includes a heating step, and even more preferably a thermocompression bonding step, after these steps. Examples and preferred descriptions regarding the heating step and the thermocompression bonding step are the same as examples and preferred descriptions in (12) step of temporarily fixing an article to a light absorbing layer, which will be described later.

[0215] <First substrate; step of preparing a laminate> The manufacturing method of a laminate according to the third, fourth, seventh, and eighth aspects of the present invention includes (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order. The manufacturing method of a laminate according to the fifth and sixth aspects of the present invention includes (10y) a step of preparing a laminate a1y having a first substrate, a light absorbing layer, and a first adhesive layer in this order. The manufacturing method of a laminate according to the third, fourth, seventh, and eighth aspects of the present invention preferably includes (1X) a step of preparing a laminate 1X, which is a laminate of the present invention. The manufacturing method of a laminate according to the fifth and sixth aspects of the present invention preferably includes (1Xy) a step of preparing a laminate 1Y, which is a laminate of the present invention. The examples and preferred descriptions of the laminate a1x, laminate a1y, laminate 1X, and laminate 1Y are as described above. The step of preparing these laminates may be a step of manufacturing and preparing a laminate, or may be a step of preparing an already manufactured laminate.

[0216] <First substrate; step of forming a light absorbing layer> The methods for producing a laminate according to the third, fourth, seventh, and eighth aspects of the present invention preferably include (11) a step of forming a light absorbing layer on the first substrate. The methods for producing a laminate according to the fifth and sixth aspects of the present invention preferably include (11y-1) a step of forming a light absorbing layer on the first substrate.

[0217] Examples and preferred descriptions regarding the first substrate and the light absorbing layer are as described above. Methods for forming the light absorbing layer in these steps include, for example, a method of applying a composition or a method of disposing a film made of the composition. Examples of methods for applying the composition include spin coating, curtain flow coating, spray coating, and slit coating. Furthermore, a method of pre-baking after applying the composition is preferred. The pre-baking temperature is preferably 50 to 150°C. The pre-baking time is preferably 30 seconds to 10 minutes. Examples of methods for disposing a film made of the composition include a method of bonding a film made of the composition by thermocompression bonding. Preferred methods for bonding by thermocompression are heat pressing, heat lamination, or thermal vacuum lamination.

[0218] A preferred method involves applying the composition, pre-baking, and then further post-baking. Another preferred method involves bonding a film made of the composition by thermocompression bonding, followed by further post-baking. The post-baking temperature is preferably greater than 150°C and up to 300°C. The post-baking time is preferably 5 to 300 minutes. Examples of the treatment atmosphere include an air, oxygen, nitrogen, helium, neon, argon, krypton, or xenon atmosphere; a gas atmosphere containing 1 to 10,000 ppm by mass (0.0001 to 1% by mass) of oxygen, or a vacuum atmosphere. The pre-baking and post-baking methods may involve heating in two or more stages. For the pre-baking and post-baking methods, an oven, a hot plate, infrared radiation, a flash annealing device, a laser annealing device, or the like may be used.

[0219] <First substrate; step of forming a first adhesive layer> The laminate manufacturing methods according to the fifth and sixth aspects of the present invention preferably include a step (11y-2) of forming a first adhesive layer in contact with the light absorbing layer. Examples and preferred descriptions regarding the first adhesive layer are as described above. Methods for forming the first adhesive layer in these steps include, for example, a method of applying a composition or a method of arranging a film made of the composition. Examples and preferred descriptions regarding these methods are the same as the examples and preferred descriptions for step (11) above.

[0220] <First substrate; step of irradiating the light absorbing layer and / or the first adhesive layer with activated actinic rays> The laminate manufacturing methods of the third and fourth aspects of the present invention preferably include a step (11z) of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer before the step (12) described below, from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy (hereinafter referred to as step (11z)). The laminate manufacturing methods of the seventh and eighth aspects of the present invention preferably include a step (11z) before the step (12z) described below, from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy. When the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention include step (11z), it is preferable that the above condition (b) be satisfied in step (13), from the viewpoint of the effects of the above invention.

[0221] In terms of reducing the energy of laser irradiation and improving positional accuracy, the laminate manufacturing method of the fifth and sixth aspects of the present invention preferably further includes a step of irradiating the light absorbing layer and the first adhesive layer with activated actinic rays from the first substrate side of the (11zy) light absorbing layer before the (12y) step described below (hereinafter referred to as the (11zy) step). When the laminate manufacturing method of the fifth and sixth aspects of the present invention includes the (11zy) step, in terms of the effects of the above invention, it is preferable that the (13y) step satisfies the above condition (by).

[0222] When the light-absorbing layer and / or the first adhesive layer are layers made of a negative-type photosensitive composition, irradiation with actinic rays partially promotes photocuring, improving the degree of crosslinking in these layers. Therefore, when temporarily fixing an article to these layers, it is thought that the article is prevented from being embedded in the light-absorbing layer or the first adhesive layer. As a result, when transferring an article from the light-absorbing layer or the first adhesive layer, transfer is possible with less energy, which stabilizes the behavior of the article during transfer, and the absolute value of the variation in irradiation energy is also reduced, resulting in a significant effect of excellent positional accuracy. Examples and preferred descriptions of the step of irradiating actinic rays in these steps are the same as the examples and preferred descriptions of steps (14) and (14y) described below, respectively.

[0223] <First substrate; step of temporarily fixing an article> The methods for manufacturing a laminate according to the third and fourth aspects of the present invention include (12) a step of temporarily fixing an article to the light absorbing layer (hereinafter referred to as step (12)). The methods for manufacturing a laminate according to the fifth and sixth aspects of the present invention include (12y) a step of temporarily fixing an article to the first adhesive layer (hereinafter referred to as step (12y)). The methods for manufacturing a laminate according to the seventh and eighth aspects of the present invention include (12z) a step of temporarily fixing an article to the light absorbing layer and patterning the light absorbing layer (hereinafter referred to as step (12z)).

[0224] The laminate manufacturing methods of the third and fourth aspects of the present invention have a plurality of articles in contact with the light absorbing layer in step (12). The laminate manufacturing methods of the fifth and sixth aspects of the present invention have a plurality of articles in contact with the first adhesive layer in step (12y). The laminate manufacturing methods of the seventh and eighth aspects of the present invention have a plurality of articles in contact with the light absorbing layer in step (12z).

[0225] Examples and preferred descriptions regarding the articles are as described above. In step (12), having a plurality of articles in contact with the light absorbing layer refers to the state after step (12). In step (12y), having a plurality of articles in contact with the first adhesive layer refers to the state after step (12y). In step (12z), having a plurality of articles in contact with the light absorbing layer refers to the state after step (12z). That is, in step (12), a plurality of articles are temporarily fixed to the light absorbing layer. In step (12y), a plurality of articles are temporarily fixed to the first adhesive layer. In step (12z), a plurality of articles are temporarily fixed to the light absorbing layer.

[0226] In the laminate manufacturing methods according to the seventh and eighth aspects of the present invention, recesses are formed in the light absorbing layer in step (12z). Forming recesses in the light absorbing layer in step (12z) refers to processing the light absorbing layer to such a state in step (12z). That is, in step (12z), recesses are formed in the light absorbing layer by patterning the light absorbing layer. It is also preferable that the light absorbing layer has openings by patterning the light absorbing layer in step (12z). In step (12z), it is preferable that the light absorbing layer satisfies either of the following conditions (p) or (q): (p) Recesses are formed in the light absorbing layer, and the recesses are formed by removing at least a portion of the light absorbing layer, resulting in a reduced thickness; or (q) Recesses are formed in the light absorbing layer, and the recesses are openings.

[0227] The laminate manufacturing methods according to the third and fourth aspects of the present invention preferably include the above step (01) and step (12). The laminate manufacturing methods according to the third and fourth aspects of the present invention also preferably include the above step (01) and step (03), and step (12). The laminate manufacturing methods according to the fifth and sixth aspects of the present invention preferably include the above step (01) and step (12y). The laminate manufacturing methods according to the fifth and sixth aspects of the present invention also preferably include the above step (01) and step (03), and step (12y). The laminate manufacturing methods according to the seventh and eighth aspects of the present invention preferably include the above step (01) and step (12z). The laminate manufacturing methods according to the seventh and eighth aspects of the present invention also preferably include the above step (01) and step (03), and step (12z).

[0228] <Step of temporarily fixing an article (step of transferring an article by irradiating with activating actinic rays)> The step (12) preferably includes: (12a) a step of irradiating the article provided on the donor substrate with activating actinic rays from the donor substrate side of the article in a state in which the article is in contact with the light absorbing layer provided on the first substrate, thereby transferring the article from the donor substrate to the light absorbing layer (hereinafter referred to as step (12a)); or (12b) a step of irradiating the article provided on the donor substrate with activating actinic rays from the donor substrate side of the article in a state in which a gap is provided between the article provided on the donor substrate and the light absorbing layer provided on the first substrate, thereby transferring the article from the donor substrate to the light absorbing layer (hereinafter referred to as step (12b)).

[0229] In steps (12a) and (12b), from the viewpoint of reducing process time, it is preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the light absorbing layer in one go. It is also preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the light absorbing layer in two or more separate steps, or it is also preferable to transfer them sequentially in two or more separate steps. Sequentially transferring multiple articles means continuously transferring multiple articles one by one. It is preferable for the donor substrate to have the photodecomposition layer, or for the laminate OA to have the photodecomposition layer, in order to transfer articles from the donor substrate to the light absorbing layer in step (12a) or step (12b).

[0230] The (12y) step preferably includes: (12ya) a step of irradiating an article provided on a donor substrate with activated actinic rays from the donor substrate side of the article while the article is in contact with a first adhesive layer provided on a first substrate, thereby transferring the article from the donor substrate to the first adhesive layer (hereinafter referred to as the (12ya) step); or (12yb) a step of irradiating an article provided on a donor substrate with activated actinic rays from the donor substrate side of the article while a gap is provided between the article provided on the donor substrate and the first adhesive layer provided on the first substrate, thereby transferring the article from the donor substrate to the first adhesive layer (hereinafter referred to as the (12yb) step).

[0231] In steps (12ya) and (12yb), from the viewpoint of reducing process time, it is preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the first adhesive layer in one go. It is also preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the first adhesive layer in two or more separate steps, or it is also preferable to transfer them sequentially in two or more separate steps. Sequentially transferring multiple articles means continuously transferring multiple articles one by one. It is preferable for the donor substrate to have the photodegradation layer, or for the laminate OA to have the photodegradation layer, in order to transfer articles from the donor substrate to the first adhesive layer in step (12ya) or step (12yb).

[0232] The step (12z) preferably includes: (12za) a step of irradiating the article provided on the donor substrate with actinic rays from the donor substrate side of the article while the article is in contact with the light absorbing layer provided on the first substrate, transferring the article from the donor substrate to the light absorbing layer, and patterning the light absorbing layer (hereinafter referred to as step (12za)); or (12zb) a step of irradiating the article provided on the donor substrate with actinic rays from the donor substrate side of the article while a gap is provided between the article provided on the donor substrate and the light absorbing layer provided on the first substrate, transferring the article from the donor substrate to the light absorbing layer, and patterning the light absorbing layer (hereinafter referred to as step (12zb)).

[0233] In steps (12za) and (12zb), from the viewpoint of reducing process time, it is preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the light absorbing layer in one go. It is also preferable to transfer multiple articles provided on the donor substrate from the donor substrate to the light absorbing layer in two or more separate steps, or it is also preferable to transfer them sequentially in two or more separate steps. Sequentially transferring multiple articles means continuously transferring multiple articles one by one. It is preferable for the donor substrate to have the photodecomposition layer, or for the laminate 0A to have the photodecomposition layer, in order to transfer articles from the donor substrate to the light absorbing layer in step (12za) or step (12zb).

[0234] In steps (12a), (12b), (12ya), and (12yb), it is also preferable to irradiate the article with actinic radiation from the donor substrate side of the article through a photomask. From the viewpoint of suppressing the deterioration of the light absorbing layer and / or the first adhesive layer due to actinic radiation, the photomask includes a light-transmitting portion and a light-shielding portion, and the area of ​​the light-transmitting portion is preferably within the area of ​​the donor substrate where the article is provided, and more preferably corresponds to the area where the article is provided. Furthermore, it is preferable that the area of ​​the light-shielding portion is larger than the area of ​​the donor substrate where the article is not provided, and more preferably corresponds to the area where the article is not provided. Examples and preferred descriptions of the step of irradiating actinic radiation in these steps are the same as the examples and preferred descriptions in steps (22) and (22y) described below, respectively.

[0235] In steps (12a), (12b), (12za), and (12zb), from the viewpoints of reducing process time, reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that the light absorbing layer is also irradiated with activated actinic rays using an article as a mask, and at least a portion of the light absorbing layer irradiated with activated actinic rays is removed. In steps (12ya) and (12yb), from the viewpoint of similar inventive effects, it is preferable that the first adhesive layer is also irradiated with activated actinic rays using an article as a mask, and at least a portion of the first adhesive layer irradiated with activated actinic rays is removed. Furthermore, in steps (12ya) and (12yb), from the viewpoint of similar inventive effects, it is more preferable that the light absorbing layer and the first adhesive layer are also irradiated with activated actinic rays using an article as a mask, and at least a portion of the light absorbing layer irradiated with activated actinic rays and at least a portion of the first adhesive layer in contact with the light absorbing layer are removed.

[0236] In step (12), the light absorbing layer preferably satisfies either of the following conditions (p) and (q): (p) A recess is formed in the light absorbing layer, and the recess is formed by removing at least a portion of the light absorbing layer to reduce the thickness. (q) A recess is formed in the light absorbing layer, and the recess is an opening. In step (12y), the light absorbing layer and the first adhesive layer preferably satisfy either of the following conditions (py) and (qy): (py) A recess is formed in the light absorbing layer and the first adhesive layer, and the recess is an opening in the first adhesive layer, and the recess is formed by removing at least a portion of the light absorbing layer to reduce the thickness. (qy) A recess is formed in the light absorbing layer and the first adhesive layer, and the recess is an opening.

[0237] In steps (12a), (12b), (12za), and (12zb), if the light absorbing layer satisfies the above condition (p), it is preferable that at least a portion of the light absorbing layer irradiated with actinic rays is removed to reduce its thickness.In steps (12a), (12b), (12za), and (12zb), if the light absorbing layer satisfies the above condition (q), it is preferable that at least a portion of the light absorbing layer irradiated with actinic rays is removed to provide an opening.

[0238] In such a configuration, it is also preferable that the laminate manufacturing method according to the seventh and eighth aspects of the present invention does not include the step (13) described below. In the step (12za) or (12zb) of the laminate manufacturing method according to the seventh and eighth aspects of the present invention, at least a part of the light absorbing layer irradiated with actinic rays is removed. As a result, the step (13) or (13y) described below is not required, and the effect of reducing the process time is significant.

[0239] When the laminate manufacturing methods according to the third and fourth aspects of the present invention satisfy the condition (a) described below in step (13), it is preferable that the light absorbing layer is also irradiated with actinic rays using the article as a mask in steps (12a) and (12b), from the viewpoints of reducing process time, reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. In such a configuration, it is also preferable that step (13a) described below does not include step (13a-1) described below.

[0240] When the laminate manufacturing method of the fifth and sixth aspects of the present invention satisfies the condition (ay) described below in step (13y), steps (12ya) and (12yb) are preferably performed by irradiating the light absorbing layer with activated actinic rays using an article as a mask, from the viewpoint of the same inventive effects. It is also preferable that steps (12ya) and (12yb) are performed by irradiating the light absorbing layer and the first adhesive layer with activated actinic rays using an article as a mask, from the viewpoint of the same inventive effects. In such a configuration, it is also preferable that step (13ya) described below does not have step (13ya-1) described below.

[0241] When the light absorbing layer and / or the first adhesive layer is a layer made of a positive photosensitive composition, the light absorbing layer and / or the first adhesive layer is also irradiated with actinic rays in step (12a), step (12b), step (12ya), or step (12yb), thereby causing bond cleavage, reaction, or structural change in the photosensitizer to proceed and become alkali-soluble. As a result, step (13a-1) or step (13ya-1) in step (13a) or step (13ya) described below becomes unnecessary, resulting in a significant effect of reducing process time.

[0242] In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, "at least a portion of the light absorbing layer has been removed" means that the thickness of the light absorbing layer has been reduced. Preferably, at least a portion of the light absorbing layer has been removed to form recesses in the light absorbing layer. More preferably, the light absorbing layer exists as a light absorbing layer in multiple convex portions and as a light absorbing layer in the recesses, and the thickness of the light absorbing layer in the recesses is smaller than the thickness of the light absorbing layer in the multiple convex portions. Preferably, at least a portion of the light absorbing layer has been removed to expose at least a portion of the first substrate, and more preferably, the light absorbing layer in the corresponding portion has been completely removed. Furthermore, it is particularly preferred that at least a portion of the light absorbing layer has been removed to form a plurality of island-shaped light absorbing layers.

[0243] In the laminate manufacturing method of the fifth and sixth aspects of the present invention, "at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed" means that the thickness of the light absorbing layer and the thickness of the first adhesive layer have been reduced. Preferably, at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, forming recesses in the light absorbing layer and the first adhesive layer. Preferably, the light absorbing layer exists as a light absorbing layer in a plurality of convex portions and as a light absorbing layer in the recesses, and the thickness of the light absorbing layer in the recesses is smaller than the thickness of the light absorbing layer in the plurality of convex portions, and the first adhesive layer exists as a first adhesive layer in the plurality of convex portions. Preferably, at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, exposing at least a portion of the first substrate. More preferably, the first adhesive layer in the corresponding locations has been completely removed, and even more preferably, the light absorbing layer and the first adhesive layer in the corresponding locations have been completely removed. Furthermore, it is particularly preferred that at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, so that the light absorbing layer and the first adhesive layer exist as a plurality of island-shaped light absorbing layers and a plurality of island-shaped first adhesive layers.

[0244] As described above, the volume of the light absorbing layer and / or the first adhesive layer can be reduced by patterning the portions of the light absorbing layer and / or the first adhesive layer that are not in contact with the article as recesses or openings. Providing a light absorbing layer and / or a first adhesive layer with recesses formed by patterning or a light absorbing layer and / or a first adhesive layer with openings formed by patterning is more preferable in terms of significantly achieving the effects of debris suppression and excellent positional accuracy based on the estimated mechanism described above.

[0245] The thickness of the light absorbing layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the light absorbing layer at the corresponding location is completely removed and does not exist. The thickness of the first adhesive layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the first adhesive layer at the corresponding location is completely removed and does not exist.

[0246] In the steps (12) and (12z), the area of ​​each of the plurality of convex light absorbing layers or the plurality of island-shaped light absorbing layers (hereinafter referred to as the area of ​​the convex light absorbing layers or the island-shaped light absorbing layers) is (S ｘ ), and the area of ​​each of the multiple items in contact with each other is (S ｙ ), it is preferable that the relationship of formula (S-xy) is satisfied. ｘ ) ≧ (S ｙ ) (S-xy) When the relationship of the above formula (S-xy) is satisfied, the area (S ｘ ) and the area of ​​the item (S ｙ ) is the ratio (S ｘ ) / (S ｙ ), then (S ｘ ) / (S ｙ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more.ｘ ) / (S ｙ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0247] Of the area of ​​the surface 1a of the light absorbing layer facing the first substrate and the area of ​​the surface 2a of the light absorbing layer facing the surface 1a, the area of ​​the island-shaped light absorbing layer corresponds to the area of ​​the surface 1a of the light absorbing layer facing the first substrate. The areas of the light absorbing layer in the convex portions and the light absorbing layer in the concave portions are determined by determining the concave portions and convex portions of the light absorbing layer by the methods (a1) to (a4) described above.

[0248] In the step (12y), the area of ​​each of the plurality of convex first adhesive layers or the plurality of island-shaped first adhesive layers (hereinafter referred to as the area of ​​the convex or island-shaped first adhesive layer) is (S ｐ ), and the area of ​​each of the multiple items in contact with each other is (S ｑ ), it is preferable that the relationship of formula (S-pq) is satisfied. ｐ ) ≧ (S ｑ ) (S-pq) When the relationship of the above formula (S-pq) is satisfied, the area (S ｐ ) and the area of ​​the item (S ｑ ) is the ratio (S ｐ ) / (S ｑ ), then (S ｐ ) / (S ｑ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more. ｐ ) / (S ｑ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0249] Of the area of ​​the surface of the first adhesive layer facing the light absorbing layer and the area of ​​the surface facing the light absorbing layer, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface facing the light absorbing layer. The areas of the first adhesive layer in the convex portions and the first adhesive layer in the concave portions are determined by determining the concave portions and convex portions of the first adhesive layer using the methods (b1) to (b4) described above. Examples and preferred descriptions of the convex light absorbing layer, the island-shaped light absorbing layer, the convex first adhesive layer, and the island-shaped first adhesive layer in steps (12), (12y), and (12z) are the same as the examples and preferred descriptions in step (13) described below.

[0250] When the laminate manufacturing methods according to the third and fourth aspects of the present invention satisfy the condition (a) described below in step (13), it is preferable that in steps (12a) and (12b), the light absorbing layer is also irradiated with actinic rays using the article as a mask, from the viewpoints of reducing process time, reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. In such a configuration, it is preferable that step (13a) described below does not include step (13a-1) described below.

[0251] When the laminate manufacturing method of the fifth and sixth aspects of the present invention satisfies the condition (ay) described below in step (13y), steps (12ya) and (12yb) are preferably performed by irradiating the light absorbing layer with activated actinic rays using an article as a mask, from the viewpoint of the same inventive effects. Steps (12ya) and (12yb) are preferably performed by irradiating the light absorbing layer and the first adhesive layer with activated actinic rays using an article as a mask, from the viewpoint of the same inventive effects. In such a configuration, step (13ya) described below preferably does not include step (13ya-1) described below.

[0252] When the light absorbing layer and / or the first adhesive layer is a layer made of a positive photosensitive composition, the light absorbing layer and / or the first adhesive layer is also irradiated with actinic rays in step (12a), step (12b), step (12ya), or step (12yb), thereby causing bond cleavage, reaction, or structural change in the photosensitizer to proceed and become alkali-soluble. As a result, step (13a-1) or step (13ya-1) in step (13a) or step (13ya) described below becomes unnecessary, resulting in a significant effect of reducing process time.

[0253] Step (12) preferably includes, before step (12a), a step of contacting and laminating the article provided on the donor substrate with the light-absorbing layer provided on the first substrate. Step (12y) preferably includes, before step (12ya), a step of contacting and laminating the article provided on the donor substrate with the first adhesive layer provided on the first substrate. Step (12z) preferably includes, before step (12za), a step of contacting and laminating the article provided on the donor substrate with the light-absorbing layer provided on the first substrate. Steps (12), (12y), and (12z) preferably include a heating step after these steps, and even more preferably a thermocompression bonding step. The thermocompression bonding method is preferably a heat press treatment, a thermal lamination treatment, or a thermal vacuum lamination treatment. Examples of the thermocompression bonding method include a method using a device capable of controlling the pressure during thermocompression bonding, such as a press, a wafer bonder, or a vacuum laminator.

[0254] The heating temperature is preferably 50°C or higher, more preferably 60°C or higher, and even more preferably 80°C or higher. On the other hand, the heating temperature is preferably 150°C or lower, more preferably 120°C or lower, and even more preferably 100°C or lower. The heating time is preferably 10 seconds or longer, more preferably 30 seconds or longer, even more preferably 60 seconds or longer, and particularly preferably 180 seconds or longer. On the other hand, the heating time is preferably 30 minutes or shorter, more preferably 20 minutes or shorter, even more preferably 10 minutes or shorter, and particularly preferably 5.0 minutes or shorter.

[0255] The thermocompression bonding temperature is preferably 20°C or higher, more preferably 40°C or higher, even more preferably 50°C or higher, and particularly preferably 60°C or higher. On the other hand, the thermocompression bonding temperature is preferably 150°C or lower, more preferably 120°C or lower, even more preferably 100°C or lower, and particularly preferably 80°C or lower. The thermocompression bonding time is preferably 10 seconds or higher, more preferably 30 seconds or higher, and even more preferably 60 seconds or higher. On the other hand, the thermocompression bonding time is preferably 30 minutes or lower, more preferably 20 minutes or lower, even more preferably 10 minutes or lower, and particularly preferably 5.0 minutes or lower. The thermocompression bonding pressure is preferably 0.050 MPa or higher, more preferably 0.10 MPa or higher. On the other hand, the thermocompression bonding pressure is preferably 10 MPa or lower, more preferably 5 MPa or lower. The heating step and the thermocompression bonding step may be performed in two or more stages. The treatment atmosphere is preferably an air, oxygen, nitrogen, helium, neon, argon, krypton or xenon atmosphere; a gas atmosphere containing 1 to 10,000 ppm by mass (0.0001 to 1% by mass) of oxygen; or a vacuum atmosphere.

[0256] <Step of temporarily fixing an article (step of bonding and transferring an article)> The (12) step preferably includes a step (12c) of contacting and bonding an article provided on a donor substrate with a light absorbing layer provided on a first substrate, and transferring the article from the donor substrate to the light absorbing layer (hereinafter referred to as step (12c)). The (12y) step preferably includes a step (12yc) of contacting and bonding an article provided on a donor substrate with a first adhesive layer provided on the first substrate, and transferring the article from the donor substrate to the first adhesive layer (hereinafter referred to as step (12yc)). The (12z) step preferably includes a step (12zc) of contacting and bonding an article provided on a donor substrate with a light absorbing layer provided on the first substrate, and transferring the article from the donor substrate to the light absorbing layer, and patterning the light absorbing layer (hereinafter referred to as step (12zc)). In steps (12c) and (12zc), the article and the light absorbing layer are preferably heated and more preferably thermocompression bonded together in a state where they are in contact with each other. In step (12yc), the article and the first adhesive layer are preferably heated and more preferably thermocompression bonded together in a state where they are in contact with each other. Examples and preferred descriptions of the heating step and the thermocompression bonding step are the same as those of step (12) above.

[0257] The (12) step preferably includes a step (12d) of contacting and bonding an article provided on the 0th substrate with a light absorbing layer provided on the first substrate, and transferring the article from the 0th adhesive layer to the light absorbing layer (hereinafter referred to as the (12d) step). The (12y) step preferably includes a step (12yd) of contacting and bonding an article provided on the 0th substrate with a first adhesive layer provided on the first substrate, and transferring the article from the 0th adhesive layer to the first adhesive layer (hereinafter referred to as the (12yd) step). The (12z) step preferably includes a step (12zd) of contacting and bonding an article provided on the 0th substrate with a light absorbing layer provided on the first substrate, and transferring the article from the 0th adhesive layer to the light absorbing layer, and patterning the light absorbing layer (hereinafter referred to as the (12zd) step). In steps (12d) and (12zd), the article and the light absorbing layer are preferably heated and more preferably thermocompression bonded together in a state where they are in contact with each other. In step (12yd), the article and the first adhesive layer are preferably heated and more preferably thermocompression bonded together in a state where they are in contact with each other. Examples and preferred descriptions for the heating step and the thermocompression bonding step are the same as those for step (12) above.

[0258] <First substrate; step of patterning the light absorbing layer and / or the first adhesive layer> The methods for producing a laminate according to the third and fourth aspects of the present invention include (13) a step of patterning the light absorbing layer (hereinafter referred to as step (13)). The methods for producing a laminate according to the fifth and sixth aspects of the present invention include (13y) a step of patterning the light absorbing layer and the first adhesive layer (hereinafter referred to as step (13y)). The methods for producing a laminate according to the seventh and eighth aspects of the present invention preferably include (13) a step of patterning the light absorbing layer (hereinafter referred to as step (13)).

[0259] In the laminate manufacturing methods according to the third and fourth aspects of the present invention, recesses are formed in the light absorbing layer in step (13). In the laminate manufacturing methods according to the fifth and sixth aspects of the present invention, recesses are formed in the light absorbing layer and the first adhesive layer in step (13y). In the laminate manufacturing methods according to the seventh and eighth aspects of the present invention, it is preferable that the light absorbing layer has recesses in step (13). Forming recesses in the light absorbing layer in step (13) refers to processing the light absorbing layer and the first adhesive layer to such a state in step (13). Forming recesses in the light absorbing layer and the first adhesive layer in step (13y) refers to processing the light absorbing layer and the first adhesive layer to such a state in step (13y). That is, in step (13), recesses are formed in the light absorbing layer by patterning the light absorbing layer. It is also preferable that in step (13), the light absorbing layer has openings by patterning the light absorbing layer. In addition, in step (13y), recesses are formed in the light absorbing layer and the first adhesive layer by patterning the light absorbing layer and the first adhesive layer. In addition, in the step (13y), it is also preferable that the light absorbing layer and the first adhesive layer are patterned to have openings in the light absorbing layer and the first adhesive layer. Note that in the laminate manufacturing methods of the seventh and eighth aspects of the present invention, recesses are formed in the light absorbing layer in the step (12z), and therefore, the light absorbing layer is allowed to be further patterned in the step (13).

[0260] In step (13), the light absorbing layer preferably satisfies either of the following conditions (p) and (q): (p) A recess is formed in the light absorbing layer, and the recess is formed by removing at least a portion of the light absorbing layer to reduce the thickness. (q) A recess is formed in the light absorbing layer, and the recess is an opening. In step (13y), the light absorbing layer and the first adhesive layer preferably satisfy either of the following conditions (py) and (qy): (py) A recess is formed in the light absorbing layer and the first adhesive layer, and the recess is an opening in the first adhesive layer, and the recess is formed by removing at least a portion of the light absorbing layer to reduce the thickness. (qy) A recess is formed in the light absorbing layer and the first adhesive layer, and the recess is an opening.

[0261] In the seventh and eighth aspects of the laminate manufacturing method of the present invention, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that in step (12z), the light absorbing layer exists as a light absorbing layer in the plurality of convex portions and a light absorbing layer in the concave portions while in contact with the first substrate, and the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions. In the seventh and eighth aspects of the laminate manufacturing method of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the light absorbing layers in the plurality of convex portions. In step (12z), the above-mentioned aspect refers to the state after step (12z). That is, in step (12z), the light absorbing layer is patterned so that the light absorbing layer exists as a light absorbing layer in the plurality of convex portions. Furthermore, in step (12z), the light absorbing layer is patterned so that each of the plurality of articles independently contacts at least one of the light absorbing layers in the plurality of convex portions.

[0262] In the laminate manufacturing methods of the seventh and eighth aspects of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, it is preferable that in step (12z), the light absorbing layer exists as a plurality of island-shaped light absorbing layers in contact with the first substrate. In the laminate manufacturing methods of the seventh and eighth aspects of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the plurality of island-shaped light absorbing layers. In step (12z), the above-mentioned aspect refers to the state after step (12z). That is, in step (12z), the light absorbing layer is patterned so that the light absorbing layer exists as a plurality of island-shaped light absorbing layers. Furthermore, in step (12z), the light absorbing layer is patterned so that each of the plurality of articles independently contacts at least one of the plurality of island-shaped light absorbing layers.

[0263] In step (13), it is preferable that at least a portion of the light absorbing layer is removed. In step (13y), it is preferable that at least a portion of the first adhesive layer is removed. Furthermore, in step (13y), it is more preferable that at least a portion of the light absorbing layer and at least a portion of the first adhesive layer in contact with the light absorbing layer are removed.

[0264] In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, "at least a portion of the light absorbing layer has been removed" means that the thickness of the light absorbing layer has been reduced. Preferably, at least a portion of the light absorbing layer has been removed to form recesses in the light absorbing layer. More preferably, the light absorbing layer exists as a light absorbing layer in multiple convex portions and as a light absorbing layer in the recesses, and the thickness of the light absorbing layer in the recesses is smaller than the thickness of the light absorbing layer in the multiple convex portions. Preferably, at least a portion of the light absorbing layer has been removed to expose at least a portion of the first substrate, and more preferably, the light absorbing layer in the corresponding portion has been completely removed. Furthermore, it is particularly preferred that at least a portion of the light absorbing layer has been removed to form a plurality of island-shaped light absorbing layers.

[0265] In the laminate manufacturing method of the fifth and sixth aspects of the present invention, "at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed" means that the thickness of the light absorbing layer and the thickness of the first adhesive layer have been reduced. Preferably, at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, forming recesses in the light absorbing layer and the first adhesive layer. Preferably, the light absorbing layer exists as a light absorbing layer in a plurality of convex portions and as a light absorbing layer in the recesses, and the thickness of the light absorbing layer in the recesses is smaller than the thickness of the light absorbing layer in the plurality of convex portions, and the first adhesive layer exists as a first adhesive layer in the plurality of convex portions. Preferably, at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, exposing at least a portion of the first substrate. More preferably, the first adhesive layer in the corresponding locations has been completely removed, and even more preferably, the light absorbing layer and the first adhesive layer in the corresponding locations have been completely removed. Furthermore, it is particularly preferred that at least a portion of the light absorbing layer and at least a portion of the first adhesive layer have been removed, so that the light absorbing layer and the first adhesive layer exist as a plurality of island-shaped light absorbing layers and a plurality of island-shaped first adhesive layers.

[0266] As described above, the volume of the light absorbing layer and / or the first adhesive layer can be reduced by patterning the portions of the light absorbing layer and / or the first adhesive layer that are not in contact with the article as recesses or openings. Providing a light absorbing layer and / or a first adhesive layer with recesses formed by patterning or a light absorbing layer and / or a first adhesive layer with openings formed by patterning is more preferable in terms of significantly achieving the effects of debris suppression and excellent positional accuracy based on the estimated mechanism described above.

[0267] The thickness of the light absorbing layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the light absorbing layer at the corresponding location is completely removed and does not exist. The thickness of the first adhesive layer after at least a portion is removed is preferably 2.0 μm or less, more preferably 1.0 μm or less, even more preferably 0.50 μm or less, even more preferably 0.30 μm or less, and particularly preferably 0.10 μm or less. It is also preferable that the first adhesive layer at the corresponding location is completely removed and does not exist.

[0268] In the step (13), the area of ​​each of the plurality of convex light absorbing layers or the plurality of island-shaped light absorbing layers (hereinafter referred to as the area of ​​the convex light absorbing layers or the island-shaped light absorbing layers) is (S ｘ ), and the area of ​​each of the multiple items in contact with each other is (S ｙ ), it is preferable that the relationship of formula (S-xy) is satisfied. ｘ ) ≧ (S ｙ ) (S-xy) When the relationship of the above formula (S-xy) is satisfied, the area (S ｘ ) and the area of ​​the item (S ｙ ) is the ratio (S ｘ ) / (S ｙ ), then (S ｘ ) / (S ｙ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more. ｘ) / (S ｙ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0269] Of the area of ​​the surface 1a of the light absorbing layer facing the first substrate and the area of ​​the surface 2a of the light absorbing layer facing the surface 1a, the area of ​​the island-shaped light absorbing layer corresponds to the area of ​​the surface 1a of the light absorbing layer facing the first substrate. The areas of the light absorbing layer in the convex portions and the light absorbing layer in the concave portions are determined by determining the concave portions and convex portions of the light absorbing layer by the methods (a1) to (a4) described above.

[0270] In the step (13y), the area of ​​each of the plurality of convex first adhesive layers or the plurality of island-shaped first adhesive layers (hereinafter referred to as the area of ​​the convex or island-shaped first adhesive layer) is (S ｐ ), and the area of ​​each of the multiple items in contact with each other is (S ｑ ), it is preferable that the relationship of formula (S-pq) is satisfied. ｐ ) ≧ (S ｑ ) (S-pq) When the relationship of the above formula (S-pq) is satisfied, the area (S ｐ ) and the area of ​​the item (S ｑ ) is the ratio (S ｐ ) / (S ｑ ), then (S ｐ ) / (S ｑ From the viewpoint of suppressing debris and improving positional accuracy, (S) is preferably 1.10 or more, more preferably 1.30 or more, even more preferably 1.50 or more, even more preferably 1.65 or more, and particularly preferably 1.90 or more. ｐ ) / (S ｑ ) is preferably 4.50 or less, more preferably 4.00 or less, even more preferably 3.50 or less, even more preferably 3.00 or less, and particularly preferably 2.70 or less, from the viewpoint of reducing the energy of laser irradiation.

[0271] Of the area of ​​the surface of the first adhesive layer facing the light absorbing layer and the area of ​​the surface facing the light absorbing layer, the area of ​​the island-shaped first adhesive layer corresponds to the area of ​​the surface facing the light absorbing layer. The areas of the first adhesive layer at the convex portions and the first adhesive layer at the concave portions are determined by determining the concave portions and convex portions of the first adhesive layer using the methods (b1) to (b4) described above.

[0272] In the manufacturing methods of the laminate according to the third, fourth, seventh, and eighth aspects of the present invention, it is preferable that the step (13) satisfies any one of the above conditions (a) to (c). (a) The light-absorbing layer is a layer made of a positive-type photosensitive composition, and the step (13) includes a step (13a) of patterning the light-absorbing layer by photolithography (hereinafter referred to as step (13a)), (b) The light-absorbing layer is a layer made of a positive-type photosensitive composition or a negative-type photosensitive composition, and the step (13) includes a step (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as step (13b)), or (c) The light-absorbing layer is a layer made of a non-photosensitive composition, and the step (13) includes a step (13b) of patterning the light-absorbing layer by etching (hereinafter referred to as step (13b)), and further the indentation elastic modulus of the light-absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is -50 to 150°C.

[0273] In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, it is preferable that any one of the above conditions (ay) to (cy) is satisfied in the step (13y). "Satisfying the condition" in the step (13) refers to the state after the step (13). "Satisfying the condition" in the step (13y) refers to the state after the step (13y). (ay) the light absorbing layer and / or the first adhesive layer is a layer made of a positive photosensitive composition, and the step (13y) comprises (13ya) a step of patterning the light absorbing layer and the first adhesive layer by photolithography (hereinafter referred to as step (13ya)); (by) the light absorbing layer and / or the first adhesive layer is a layer made of a positive photosensitive composition or a negative photosensitive composition, and the step (13y) comprises (13yb) a step of patterning the light absorbing layer and the first adhesive layer by etching (hereinafter referred to as step (13yb)); (cy) the light absorbing layer and / or the first adhesive layer is a layer made of a non-photosensitive composition, and the step (13y) comprises (13yb) a step of patterning the light absorbing layer and the first adhesive layer by etching (hereinafter referred to as step (13yb)), and further the indentation elastic modulus of the first adhesive layer at 50°C is 1.0 x 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the first adhesive layer is -50 to 150°C.

[0274] <Patterning Step (Photolithography Processing Step)> In the laminate manufacturing methods according to the third, fourth, seventh, and eighth aspects of the present invention, it is preferable that the step (13) satisfies the above condition (a) from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. "Satisfying the condition" in the step (13) refers to the state after the step (13). From the viewpoint of similar inventive effects, when the above condition (a) is satisfied in the step (13), the manufacturing methods of the laminate that are the third, fourth, seventh, and eighth aspects of the present invention preferably include the steps of: (13a) patterning the light absorbing layer by photolithography (hereinafter referred to as step (13a)); (13a-1) irradiating the light absorbing layer with actinic rays from the article side of the light absorbing layer using the article as a mask (hereinafter referred to as step (13a-1)); and (13a-2) developing with a developer to pattern the light absorbing layer (hereinafter referred to as step (13a-2)).

[0275] From the viewpoint of the effects of the same invention, the manufacturing method of the laminate which is the fifth aspect and the sixth aspect of the present invention preferably satisfies the above condition (ay) in the step (13y). Satisfying the condition in the step (13y) refers to the state after the step (13y). From the viewpoint of the effects of the same invention, the manufacturing method of the laminate which is the fifth aspect and the sixth aspect of the present invention preferably satisfies the above condition (ay) in the step (13y). When the manufacturing method of the laminate which is the fifth aspect and the sixth aspect of the present invention satisfies the above condition (ay), (13ya) the step of patterning the light absorbing layer and the first adhesive layer by photolithography (hereinafter referred to as the (13ya) step) (13ya-1) from the article side of the light absorbing layer, using the article as a mask, the light absorbing layer and the first adhesive layer It is preferable to have a step of irradiating the active actinic ray (hereinafter referred to as the (13ya-1) step), and (13ya-2) developing using a developer, and patterning the light absorbing layer and the first adhesive layer (hereinafter referred to as the (13ya-2) step).

[0276] As described above, the volume of the light absorbing layer and / or the first adhesive layer can be reduced by patterning the portions of the light absorbing layer and / or the first adhesive layer that are not in contact with the article as recesses or openings. Providing a light absorbing layer and / or a first adhesive layer with recesses formed by patterning or a light absorbing layer and / or a first adhesive layer with openings formed by patterning is more preferable in terms of significantly achieving the effects of debris suppression and excellent positional accuracy based on the estimated mechanism described above.

[0277] Examples of methods for irradiating the article with actinic rays in steps (13a-1) and (13ya-1) include patterning exposure methods using an exposure machine such as a stepper, scanner, mirror projection mask aligner (MPA), or parallel light mask aligner (PLA). In steps (13a) and (13ya), the article is irradiated with actinic rays using the article as a mask, so a photomask may not be used. Furthermore, from the viewpoint of suppressing damage to the article caused by actinic rays, the article may be irradiated with actinic rays via a photomask.

[0278] The maximum wavelength of the activated actinic rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the activated actinic rays is preferably 450 nm or less, more preferably 420 nm or less, and even more preferably 400 nm or less. The activated actinic rays are preferably the j-line (wavelength 313 nm) of a mercury lamp, the i-line (wavelength 365 nm) of a mercury lamp, the h-line (wavelength 405 nm) of a mercury lamp, or the g-line (wavelength 436 nm), and more preferably a mixture of the i-line, h-line, and g-line of a mercury lamp. The activated actinic rays are also preferably ArF laser (wavelength 193 nm), KrF laser (wavelength 248 nm), XeCl laser (wavelength 308 nm), XeF laser (wavelength 351 nm), or YAG laser (wavelength 266 nm, wavelength 355 nm, or wavelength 532 nm).

[0279] The exposure dose of actinic rays is 10 mJ / cm in terms of i-line illuminance value. ２ More than 50 mJ / cm is preferable. ２ More preferably, 100 mJ / cm or more２ More preferably, 200 mJ / cm or more ２ More preferably, 300 mJ / cm or more ２ On the other hand, the exposure dose is 3000 mJ / cm in terms of i-line illuminance value. ２ Preferably, 2000 mJ / cm or less ２ More preferably, 1500 mJ / cm or less ２ More preferably, 1000 mJ / cm or less ２ Even more preferably, 500 mJ / cm ２ The following are particularly preferred:

[0280] After irradiation with actinic rays, post-exposure baking is preferably performed from the viewpoints of improving sensitivity, improving resolution after development, and expanding the allowable range of development conditions. In particular, when the light-absorbing layer or the first adhesive layer is a layer made of a chemically amplified positive-working photosensitive composition or a layer made of a chemically amplified positive-working photosensitive composition, post-exposure baking is preferred.

[0281] Examples of the development method in steps (13a-2) and (13ya-2) include a method using an automatic developer. Examples of the development method include puddle development, spray development, and dip development. When the light-absorbing layer or the first adhesive layer is a layer made of a positive photosensitive composition, a pattern can be formed in which the exposed areas are removed with a developer.

[0282] The developer is preferably an alkaline solution, and a solution of an organic alkaline compound or an aqueous solution of an alkaline compound is preferred. Examples of organic alkaline compounds or alkaline compounds include 2-aminoethanol, 2-(dimethylamino)ethanol, 2-(diethylamino)ethanol, diethanolamine, trimethylamine, triethylamine, sodium hydroxide, potassium hydroxide, sodium carbonate, potassium carbonate, tetramethylammonium hydroxide, and tetraethylammonium hydroxide. Known compounds may also be used. The alkaline concentration of the alkaline solution is preferably 0.010% by mass or more, more preferably 0.10% by mass or more, even more preferably 1.0% by mass or more, and particularly preferably 2.0% by mass or more. On the other hand, the alkaline concentration is preferably 20% by mass or less, more preferably 10% by mass or less, even more preferably 5.0% by mass or less, and particularly preferably 3.0% by mass or less.

[0283] The developer is preferably an organic solvent. The organic solvent may be the solvent in the composition described above. The developer may be a mixed solution containing an organic solvent and a poor solvent for the light absorbing layer or the first adhesive layer.

[0284] The temperature of the developer is preferably 10° C. or higher, more preferably 20° C. or higher, even more preferably 30° C. or higher, and particularly preferably 40° C. or higher. On the other hand, the temperature of the developer is preferably 100° C. or lower, more preferably 80° C. or lower, and even more preferably 60° C. or lower. The development time is preferably 10 seconds or longer, more preferably 30 seconds or longer, and even more preferably 60 seconds or longer. On the other hand, the development time is preferably 10 minutes or shorter, more preferably 5.0 minutes or shorter, and even more preferably 3.0 minutes or shorter.

[0285] After development, the resulting pattern is preferably washed with a rinse. When an alkaline solution is used as the developer, the rinse is preferably water. The rinse may be an aqueous solution of an alcohol, an ester, an acidic compound, or an organic solvent.

[0286] In step (13a-2), the dissolution rate in the film thickness direction of the exposed portion of the light absorbing layer is preferably 1.0 μm / min or more, more preferably 3.0 μm / min or more, even more preferably 5.0 μm / min or more, still more preferably 10.0 μm / min or more, and particularly preferably 15.0 μm / min or more, while the dissolution rate in the film thickness direction is preferably 100 μm / min or less, more preferably 50.0 μm / min or less, and even more preferably 30.0 μm / min or less.

[0287] In step (13a-2), the ratio of the dissolution rate in the film thickness direction of the exposed portion of the light-absorbing layer to that of the unexposed portion is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, still more preferably 7 or more, and particularly preferably 10 or more. On the other hand, the ratio of the dissolution rates is preferably 50 or less, more preferably 30 or less, and even more preferably 20 or less.

[0288] In the step (13ya-2), the dissolution rate in the film thickness direction of the exposed portion of the light absorbing layer is preferably 1.0 μm / min or more, more preferably 3.0 μm / min or more, even more preferably 5.0 μm / min or more, still more preferably 10.0 μm / min or more, and particularly preferably 15.0 μm / min or more. On the other hand, the dissolution rate in the film thickness direction is preferably 100 μm / min or less, more preferably 50.0 μm / min or less, and even more preferably 30.0 μm / min or less.

[0289] In the step (13ya-2), the ratio of the dissolution rate in the film thickness direction of the exposed portion of the light-absorbing layer to the unexposed portion of the light-absorbing layer is preferably 1 or more, more preferably 3 or more, even more preferably 5 or more, even more preferably 7 or more, and particularly preferably 10 or more. On the other hand, the dissolution rate ratio is preferably 50 or less, more preferably 30 or less, and even more preferably 20 or less.

[0290] In the (13ya-2) step, examples and preferred descriptions regarding the dissolution rate in the film thickness direction in the exposed portion of the first adhesive layer and the ratio of the dissolution rate in the film thickness direction in the exposed portion to that in the unexposed portion of the first adhesive layer are the same as the examples and preferred descriptions regarding the dissolution rate in the film thickness direction in the exposed portion of the light absorbing layer and the ratio of the dissolution rate in the film thickness direction in the exposed portion to that in the unexposed portion of the light absorbing layer, respectively.

[0291] <Patterning Step (Etching Step)> In the laminate manufacturing methods according to the third, fourth, seventh, and eighth aspects of the present invention, it is preferable that the step (13) satisfies the above condition (b) from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy. "Satisfying this condition" in the step (13) refers to the state after the step (13). From the viewpoint of similar inventive effects, when the condition (b) above is satisfied in the step (13), the manufacturing methods of the laminate that are the third, fourth, seventh, and eighth aspects of the present invention preferably include the step (13b) of patterning the light absorbing layer by etching (hereinafter referred to as the step (13b)), which comprises: (13b-1a) a step of patterning the light absorbing layer from the article side of the light absorbing layer by dry etching using the article as a mask (hereinafter referred to as the step (13b-1a)); or (13b-1b) a step of patterning the light absorbing layer from the article side of the light absorbing layer by wet etching using the article as a mask (hereinafter referred to as the step (13b-1b)).

[0292] From the viewpoint of the effects of the same invention, the laminate manufacturing methods of the fifth and sixth aspects of the present invention preferably satisfy the above condition (by) in the step (13y). Satisfying the condition in the step (13y) refers to the state after the step (13y). From the viewpoint of the effects of the same invention, the laminate manufacturing methods of the fifth and sixth aspects of the present invention, when the above condition (by) is satisfied in the step (13y), preferably have the steps of (13yb) patterning the light absorbing layer and the first adhesive layer by etching (hereinafter referred to as the step (13yb)), (13yb-1a) patterning the light absorbing layer and the first adhesive layer from the article side of the light absorbing layer by dry etching using the article as a mask (hereinafter referred to as the step (13yb-1a)), or (13yb-1b) patterning the light absorbing layer and the first adhesive layer from the article side of the light absorbing layer by wet etching using the article as a mask (hereinafter referred to as the step (13yb-1b)).

[0293] From the viewpoint of improving positional accuracy, the laminate manufacturing methods according to the third, fourth, seventh, and eighth aspects of the present invention preferably satisfy the condition (c) in step (13). Satisfying the condition in step (13) refers to the state after step (13). From the viewpoint of improving positional accuracy, the laminate manufacturing methods according to the third, fourth, seventh, and eighth aspects of the present invention preferably include the steps of: (13b-1a) patterning the light absorbing layer from the article side of the light absorbing layer by dry etching using the article as a mask; or (13b-1b) patterning the light absorbing layer from the article side of the light absorbing layer by wet etching using the article as a mask.

[0294] From the viewpoint of improving positional accuracy, the laminate manufacturing methods according to the fifth and sixth aspects of the present invention preferably satisfy the above condition (cy) in step (13y). Satisfying the condition in step (13y) refers to the state after step (13y). From the viewpoint of improving positional accuracy, when step (13y) satisfies the above condition (cy), the laminate manufacturing methods according to the fifth and sixth aspects of the present invention preferably include: (13yb-1a) a step of patterning the light absorbing layer from the article side of the light absorbing layer by dry etching using the article as a mask; or (13yb-1b) a step of patterning the light absorbing layer from the article side of the light absorbing layer by wet etching using the article as a mask.

[0295] As described above, the volume of the light absorbing layer and / or the first adhesive layer can be reduced by patterning the areas of the light absorbing layer and / or the first adhesive layer that are not in contact with the article as recesses or openings. Forming the light absorbing layer and / or the first adhesive layer with recesses formed by such patterning, or forming the light absorbing layer and / or the first adhesive layer with openings formed by patterning, is more preferable in terms of significantly enhancing the effects of debris suppression and excellent positional accuracy based on the estimated mechanism described above. Examples and preferred descriptions of the indentation modulus at 50°C of the light absorbing layer and the glass transition temperature of the light absorbing layer are as described above. Examples and preferred descriptions of the indentation modulus at 50°C of the first adhesive layer and the glass transition temperature of the first adhesive layer are as described above.

[0296] Examples of the dry etching method in steps (13b-1a) and (13yb-1a) include reactive gas etching in which an etching gas is exposed, plasma etching in which an etching gas ionized or radicalized by electromagnetic waves is exposed, and reactive ion etching in which an etching gas ionized or radicalized by electromagnetic waves is accelerated by applying a bias and allowed to collide.

[0297] The etching gas is preferably a gas containing oxygen, argon, fluorine, or chlorine as a main component element. The main component element in the etching gas refers to the element that is most abundant on a mass basis among the constituent elements of the etching gas. The etching gas is preferably a gas containing one or more elements selected from the group consisting of oxygen, ozone, argon, fluorine, and chlorine, and more preferably a gas containing oxygen or ozone. The total content of oxygen, ozone, argon, fluorine, and chlorine in the etching gas is preferably 10 mass% or more, more preferably 30 mass% or more, even more preferably 50 mass% or more, even more preferably 70 mass% or more, and particularly preferably 80 mass% or more. On the other hand, the total content of oxygen, ozone, argon, fluorine, and chlorine in the etching gas is preferably 100 mass% or less. The etching gas is preferably a gas containing oxygen, ozone, argon, fluorine, or chlorine as a main component. The main component in the etching gas refers to the component that is most abundant on a mass basis among the constituent components of the etching gas. Known etching gases may be used.

[0298] The dry etching temperature is preferably 10°C or higher, more preferably 20°C or higher, even more preferably 30°C or higher, and particularly preferably 40°C or higher. On the other hand, the dry etching temperature is preferably 200°C or lower, more preferably 150°C or lower, and even more preferably 120°C or lower. Furthermore, the dry etching temperature is preferably 100°C or lower, more preferably 80°C or lower, and even more preferably 60°C or lower. The dry etching time is preferably 10 seconds or higher, more preferably 30 seconds or higher, even more preferably 60 seconds or higher, even more preferably 180 seconds or higher, and particularly preferably 300 seconds or higher. On the other hand, the dry etching time is preferably 60 minutes or lower, more preferably 30 minutes or lower, even more preferably 20 minutes or lower, and particularly preferably 10 minutes or lower.

[0299] The etching rate in the film thickness direction of the light absorbing layer in steps (13b-1a) and (13yb-1a) is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, still more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the film thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0300] In steps (13b-1a) and (13yb-1a), the ratio of the etching rate in the film thickness direction to the in-plane direction of the light absorbing layer is preferably 3 or more, more preferably 5 or more, even more preferably 10 or more, still more preferably 20 or more, and particularly preferably 30 or more. On the other hand, the etching rate ratio is preferably 200 or less, more preferably 100 or less, and even more preferably 50 or less.

[0301] In the (13yb-1a) step, examples and preferred descriptions regarding the etching rate in the film thickness direction of the first adhesive layer and the ratio of the etching rate in the film thickness direction to the in-plane direction of the first adhesive layer are the same as the examples and preferred descriptions regarding the etching rate in the film thickness direction of the light absorbing layer and the ratio of the etching rate in the film thickness direction to the in-plane direction of the light absorbing layer, respectively.

[0302] Examples of the wet etching method in steps (13b-1b) and (13yb-1b) include applying an etching solution, spraying an atomized etching solution, immersing the substrate in the etching solution, or immersing the substrate in the etching solution followed by ultrasonic irradiation. The etching solution is preferably an alkaline solution, and is preferably a solution of an organic alkaline compound or an aqueous solution of an alkaline compound. Examples and preferred descriptions of the alkaline solution are the same as those for the developer described above.

[0303] The etching solution is also preferably an acidic solution. The acidic solution is preferably an aqueous solution of a compound exhibiting acidity. Examples of acidic solutions include hydrofluoric acid, hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, phosphorous acid, acetic acid, and oxalic acid, and known solutions may be used. The etching solution is also preferably an organic solvent. The organic solvent may be the solvent in the above-mentioned composition. Examples of organic solvents include cyclopentanone, cyclohexanone, propylene glycol monomethyl ether acetate, diethylene glycol mono-n-butyl ether, N-methyl-2-pyrrolidone, and γ-butyrolactone, and known solutions may be used. The etching solution may be a mixed solution containing an organic solvent and a poor solvent for the light absorbing layer or the first adhesive layer. Examples and preferred descriptions of conditions for the wet etching method are the same as the examples and preferred descriptions of conditions for the development method described above.

[0304] The etching rate in the film thickness direction of the light absorbing layer in step (13b-1b) is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, still more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the film thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0305] The etching rate in the film thickness direction of the light absorbing layer in step (13yb-1b) is preferably 0.10 μm / min or more, more preferably 0.50 μm / min or more, even more preferably 1.0 μm / min or more, still more preferably 2.0 μm / min or more, and particularly preferably 3.0 μm / min or more. On the other hand, the etching rate in the film thickness direction is preferably 10.0 μm / min or less, more preferably 7.0 μm / min or less, and even more preferably 5.0 μm / min or less.

[0306] In step (13yb-1b), examples and preferred descriptions regarding the etching rate in the film thickness direction of the first adhesive layer are the same as the examples and preferred descriptions regarding the etching rate in the film thickness direction of the light absorbing layer described above. In steps (13b-1a), (13yb-1a), (13b-1b), and (13yb-1b), dry etching or wet etching is performed using the article as a mask, so a photoresist pattern does not need to be formed. Furthermore, from the viewpoint of suppressing damage to the article by etching gas or etching solution, a photoresist pattern may be formed in contact with the light absorbing layer or the first adhesive layer. When a photoresist pattern is formed, it is preferable to remove the photoresist pattern after dry etching or wet etching. Examples of methods for removing the photoresist pattern include a removal method using a resist stripper or a removal method by ashing.

[0307] The examples and preferred descriptions regarding the light absorbing layer and the first adhesive layer being layers made of a positive photosensitive composition, a negative photosensitive composition, or a non-photosensitive composition are as described above. The examples and preferred descriptions regarding the above conditions (a) to (c) and the above conditions (ay) to (cy) are the same as the examples and preferred descriptions regarding the above conditions (α) to (γ), respectively.

[0308] In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that in step (13), the light absorbing layer exists as a light absorbing layer in the plurality of convex portions and a light absorbing layer in the concave portions while in contact with the first substrate, and the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions. In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the light absorbing layers in the plurality of convex portions. The above aspect in step (13) refers to the state after step (13). That is, in step (13), the light absorbing layer is patterned so that the light absorbing layer exists as a light absorbing layer in the plurality of convex portions and a light absorbing layer in the concave portions. Furthermore, in step (13), the light absorbing layer is patterned so that each of the plurality of articles independently contacts at least one of the light absorbing layers in the plurality of convex portions. In the laminate manufacturing methods according to the seventh and eighth aspects of the present invention, in step (12z), the light absorbing layer is present as a light absorbing layer in the plurality of convex portions and a light absorbing layer in the concave portions while being in contact with the first substrate, and the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions, and the same configuration is also present in step (13).

[0309] In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, it is preferable that in step (13), the light absorbing layer exists as a plurality of island-shaped light absorbing layers in contact with the first substrate. In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the plurality of island-shaped light absorbing layers. In step (13), the above-mentioned aspect refers to the state after step (13). That is, in step (13), the light absorbing layer is patterned so that the light absorbing layer exists as a plurality of island-shaped light absorbing layers. Furthermore, in step (13), the light absorbing layer is patterned so that each of the plurality of articles independently contacts at least one of the plurality of island-shaped light absorbing layers. In the laminate manufacturing methods according to the seventh and eighth aspects of the present invention, the light absorbing layer is present as a plurality of island-shaped light absorbing layers in contact with the first substrate in step (12z), and is present in a similar manner in step (13).

[0310] In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that in step (13y), the light absorbing layer exists as a light absorbing layer in the plurality of convex portions and a light absorbing layer in the concave portions while in contact with the first substrate, and the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions. In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, from the viewpoint of similar inventive effects, it is preferable that in step (13y), the first adhesive layer exists as a first adhesive layer in the plurality of convex portions while in contact with at least one of the light absorbing layers in the plurality of convex portions. It is also preferable that the first adhesive layer exists as a first adhesive layer in the plurality of concave portions while in contact with at least one of the light absorbing layers in the plurality of concave portions. In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the first adhesive layers in the plurality of convex portions. The above-mentioned aspect in step (13y) refers to the state after step (13y). That is, in step (13y), the light absorbing layer and the first adhesive layer are patterned so that the first adhesive layer exists as the first adhesive layer of the plurality of convex portions. Also, in step (13y), the light absorbing layer and the first adhesive layer are patterned so that the plurality of articles are each independently in contact with at least one of the first adhesive layers of the plurality of convex portions.

[0311] In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, from the viewpoints of reducing laser irradiation energy, suppressing debris, and improving positional accuracy, it is preferable that in step (13y), the light absorbing layer exists as a plurality of island-shaped light absorbing layers in contact with the first substrate. In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, from the viewpoint of similar inventive effects, it is preferable that in step (13y), the first adhesive layer exists as a plurality of island-shaped first adhesive layers in contact with at least one of the plurality of island-shaped light absorbing layers. In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, it is preferable that each of the plurality of articles independently contacts at least one of the plurality of island-shaped first adhesive layers. The above-mentioned aspect in step (13y) refers to the state after step (13y). That is, in step (13y), the light absorbing layer and the first adhesive layer are patterned so that the first adhesive layer exists as a plurality of island-shaped first adhesive layers. In the step (13y), the light absorbing layer and the first adhesive layer are patterned so that each of the plurality of articles is independently in contact with at least one of the plurality of island-shaped first adhesive layers.

[0312] <Patterning Step (Configuration and Physical Properties of Light Absorbing Layer and / or First Adhesive Layer)> In the method for producing a laminate of the present invention, from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the area of ​​the 1a surface of the light absorbing layer on the first substrate side is (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ), it is preferable that the relationship of formula (S-1) is satisfied. １ａ ) ≧ (S ２ａ) (S-1) In step (13), the light absorbing layer satisfying the relationship of formula (S-1) refers to the state after step (13). In step (13y), the light absorbing layer satisfying the relationship of formula (S-1) refers to the state after step (13y). In step (12), step (12y), or step (12z), the light absorbing layer satisfying the relationship of formula (S-1) refers to the state after step (12), step (12y), or step (12z). Examples and preferred descriptions regarding the relationship of formula (S-1) are as described above.

[0313] In step (13), step (13y), step (12), step (12y), or step (12z), the light absorbing layer or the first adhesive layer satisfies the relationship of formula (S-1) above, thereby reducing the contact area between the light absorbing layer and the article, or between the first adhesive layer and the article. Therefore, it is believed that excessive adhesive strength between the light absorbing layer and the article, or between the first adhesive layer and the article, can be suppressed. As a result, when transferring an article from the light absorbing layer or the first adhesive layer, transfer is possible with less energy, which suppresses the residue of the light absorbing layer or the first adhesive layer on the surface of the article and the scattering of the light absorbing layer or the first adhesive layer during ablation, resulting in a significant debris suppression effect. Furthermore, because transfer is possible with less energy, the behavior of the article during transfer is stable, and the absolute value of the variation in irradiation energy is reduced, resulting in a significant effect of excellent positional accuracy.

[0314] In the method for producing a laminate of the present invention, from the viewpoint of improving positional accuracy, in the step (13), the step (13y), the step (12), the step (12y), or the step (12z), the area of ​​the 1a surface of the light absorbing layer on the first substrate side is (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ), it is also preferable that the relationship of formula (S-2) is satisfied. １ａ ) < (S ２ａ) (S-2) In the step (13), the light absorbing layer satisfying the relationship of formula (S-2) refers to the state after the step (13). In the step (13y), the light absorbing layer satisfying the relationship of formula (S-2) refers to the state after the step (13y). In the step (12), step (12y), or step (12z), the light absorbing layer satisfying the relationship of formula (S-2) refers to the state after the step (12), step (12y), or step (12z). Examples and preferred descriptions regarding the relationship of formula (S-2) are as described above.

[0315] In step (13), step (13y), step (12), step (12y), or step (12z), the light absorbing layer or the first adhesive layer satisfies the relationship of formula (S-2) above, thereby reducing the contact area between the light absorbing layer and the first substrate or the contact area between the first adhesive layer and the light absorbing layer. Therefore, it is believed that the reaction force that the light absorbing layer receives from the first substrate or the reaction force that the first adhesive layer receives from the light absorbing layer during ablation can be suppressed. As a result, it is believed that the excess energy transmitted from the light absorbing layer or the first adhesive layer to the article due to the reaction force can be suppressed, and the behavior of the article during transfer is stabilized, resulting in a remarkable effect of excellent positional accuracy.

[0316] In the method for producing a laminate according to the fourth aspect of the present invention, in the step (13), the indentation elastic modulus of the light absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or in step (13), the glass transition temperature of the light absorbing layer is −50 to 150° C. In the method for producing a laminate according to the third aspect of the present invention, in step (13), the indentation elastic modulus of the light absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or in the step (13), the glass transition temperature of the light absorbing layer is preferably -50 to 150°C.

[0317] In the eighth aspect of the present invention, in the step (12z), the indentation elastic modulus of the light absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９Pa, and / or in step (12z), the glass transition temperature of the light absorbing layer is −50 to 150° C. In the method for producing a laminate according to the seventh aspect of the present invention, in step (12z), the indentation elastic modulus of the light absorbing layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or in the step (12z), the glass transition temperature of the light absorbing layer is preferably -50 to 150°C.

[0318] In the method for producing a laminate according to the sixth aspect of the present invention, in the step (13y), the indentation modulus of the first adhesive layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or in step (13y), the glass transition temperature of the first adhesive layer is −50 to 150° C. In the method for producing a laminate according to the fifth aspect of the present invention, in step (13y), the indentation modulus of the first adhesive layer at 50° C. is 1.0×10 ３ ~2.0 x 10 ９ Pa, and / or in step (13y), the glass transition temperature of the first adhesive layer is preferably -50 to 150°C.

[0319] In step (13), the indentation modulus and / or glass transition temperature being within the above range refers to the state after step (13). In step (13y), the indentation modulus and / or glass transition temperature being within the above range refers to the state after step (13y). In step (12z), the indentation modulus and / or glass transition temperature being within the above range refers to the state after step (12z). Examples and preferred descriptions regarding the indentation modulus at 50°C and the glass transition temperature of the light absorbing layer are as described above. Examples and preferred descriptions regarding the indentation modulus at 50°C and the glass transition temperature of the first adhesive layer are as described above. Examples and preferred descriptions regarding the other configurations and physical properties of the light absorbing layer are as described above. Furthermore, examples and preferred descriptions regarding the other configurations and physical properties of the first adhesive layer are as described above.

[0320] <First substrate: step of crosslinking the light absorbing layer and / or the first adhesive layer> From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the laminate manufacturing methods of the third and fourth aspects of the present invention preferably further include a step (14) of crosslinking the pattern of the light absorbing layer (hereinafter referred to as step (14)) before or after step (13). From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the laminate manufacturing methods of the seventh and eighth aspects of the present invention preferably further include a step (14) of crosslinking the pattern of the light absorbing layer (hereinafter referred to as step (14)) after step (12z). In the manufacturing methods of the laminate according to the third, fourth, seventh, and eighth aspects of the present invention, from the viewpoint of similar inventive effects, it is preferable that the step (14) includes a step (14a) of heating the pattern of the light absorbing layer (hereinafter referred to as step (14a)), or a step (14b-1) of irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer (hereinafter referred to as step (14b-1)).

[0321] The laminate manufacturing methods of the third and fourth aspects of the present invention preferably include a step (14) after step (12) and before step (13). The laminate manufacturing methods of the third and fourth aspects of the present invention also preferably include a step (14) after step (13) and before step (20), or after step (13) and before step (21). Furthermore, the laminate manufacturing methods of the seventh and eighth aspects of the present invention preferably include a step (14) after step (12z) and before step (20), or after step (12z) and before step (21).

[0322] When the laminate manufacturing methods according to the third, fourth, seventh, and eighth aspects of the present invention include step (14), in terms of the effects of the invention described above, it is preferable that step (13) satisfies any one of the above conditions (a) to (c), more preferably satisfies the above condition (a) and / or condition (b), and even more preferably satisfies the above condition (a).

[0323] The fifth and sixth aspects of the present invention are methods for producing a laminate, and from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, it is preferable to have a step (14y) before or after the step (13y), further comprising a step (14y) of crosslinking the pattern of the light absorbing layer and / or the pattern of the first adhesive layer (hereinafter referred to as the step (14y)). From the viewpoint of the effects of the same invention, the sixth and sixth aspects of the present invention are methods for producing a laminate, and it is preferable to have a step (14y) of heating the pattern of the light absorbing layer and / or the pattern of the first adhesive layer (hereinafter referred to as the step (14ya)), or a step (14yb-1) of irradiating the light absorbing layer and the first adhesive layer with activated actinic rays from the first substrate side of the light absorbing layer (hereinafter referred to as the step (14yb-1)).

[0324] The laminate manufacturing methods according to the fifth and sixth aspects of the present invention preferably include a step (14y) after the step (12y) and before the step (13y). The laminate manufacturing methods according to the fifth and sixth aspects of the present invention also preferably include a step (14y) after the step (13y) and before the step (20), or after the step (13y) and before the step (21).

[0325] When the laminate manufacturing methods according to the fifth and sixth aspects of the present invention include the step (14y), in terms of the effects of the invention described above, it is preferable that the step (13y) satisfies any one of the above conditions (ay) to (cy), it is more preferable that the above condition (ay) and / or the condition (by) is satisfied, and it is even more preferable that the above condition (ay) is satisfied.

[0326] When the light-absorbing layer and / or the first adhesive layer are layers made of a negative-type photosensitive composition, irradiation with actinic rays promotes photocuring, improving the degree of crosslinking in these layers. Furthermore, heating promotes curing through the generation of radicals, acids, or bases, improving the degree of crosslinking in these layers. When the light-absorbing layer and / or the first adhesive layer are layers made of a positive-type photosensitive composition, irradiation with actinic rays promotes bond cleavage, reaction, or structural change in the photosensitizer, increasing the number of carboxyl groups, phenolic hydroxyl groups, etc. As a result, the polarity in these layers changes significantly, increasing hydrogen bond formation and intermolecular interactions within the layers. Furthermore, heating promotes curing through the generation of radicals, acids, or bases, improving the degree of crosslinking in these layers. Therefore, internal stress is generated in these layers, which is thought to suppress excessive adhesive strength between the light-absorbing layer and the article or between the first adhesive layer and the article. As a result, when transferring an article from the light absorbing layer or the first adhesive layer, transfer is possible with less energy, which prevents the light absorbing layer or the first adhesive layer from remaining on the surface of the article and prevents the light absorbing layer or the first adhesive layer from scattering during ablation, and it is presumed that the effect of debris suppression is significant. Furthermore, because transfer is possible with less energy, the behavior of the article during transfer is stable, and the absolute value of variation in irradiation energy is also small, which is presumed to result in a significant effect of excellent positional accuracy.

[0327] Examples of the heating method in steps (14a) and (14ya) include heating using an oven, a hot plate, infrared rays, a flash annealing device, or a laser annealing device.

[0328] The heating temperature is preferably 50°C or higher, more preferably 80°C or higher, even more preferably 100°C or higher, even more preferably 120°C or higher, and particularly preferably 150°C or higher. On the other hand, the heating temperature is preferably 500°C or lower, more preferably 400°C or lower, even more preferably 300°C or lower, even more preferably 250°C or lower, and particularly preferably 200°C or lower. The heating time is preferably 10 seconds or longer, more preferably 30 seconds or longer, even more preferably 60 seconds or longer, even more preferably 180 seconds or longer, and particularly preferably 300 seconds or longer. On the other hand, the heating time is preferably 60 minutes or shorter, more preferably 30 minutes or shorter, even more preferably 20 minutes or shorter, and particularly preferably 10 minutes or shorter. The heating step may be performed in two or more stages. The treatment atmosphere is preferably an air, oxygen, nitrogen, helium, neon, argon, krypton or xenon atmosphere; a gas atmosphere containing 1 to 10,000 ppm by mass (0.0001 to 1% by mass) of oxygen; or a vacuum atmosphere.

[0329] Examples of the method for irradiating with actinic rays in steps (14b-1) and (14yb-1) include exposure methods using an exposure machine such as a stepper, a scanner, a mirror projection mask aligner (MPA), or a parallel light mask aligner (PLA).

[0330] The maximum wavelength of the activated actinic rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the activated actinic rays is preferably 450 nm or less, more preferably 420 nm or less, and even more preferably 400 nm or less. The activated actinic rays are preferably the j-line (wavelength 313 nm) of a mercury lamp, the i-line (wavelength 365 nm) of a mercury lamp, the h-line (wavelength 405 nm) of a mercury lamp, or the g-line (wavelength 436 nm), and more preferably a mixture of the i-line, h-line, and g-line of a mercury lamp. The activated actinic rays are also preferably ArF laser (wavelength 193 nm), KrF laser (wavelength 248 nm), XeCl laser (wavelength 308 nm), XeF laser (wavelength 351 nm), or YAG laser (wavelength 266 nm, wavelength 355 nm, or wavelength 532 nm).

[0331] The exposure dose of actinic rays is 10 mJ / cm in terms of i-line illuminance value. ２ More than 50 mJ / cm is preferable. ２ More preferably, 100 mJ / cm or more ２ More preferably, 200 mJ / cm or more ２ More preferably, 300 mJ / cm or more ２ On the other hand, the exposure dose is 3000 mJ / cm in terms of i-line illuminance value. ２ Preferably, 2000 mJ / cm or less ２ More preferably, 1500 mJ / cm or less ２ More preferably, 1000 mJ / cm or less ２ Even more preferably, 500 mJ / cm ２ The following are particularly preferred:

[0332] In the laminate manufacturing methods of the third, fourth, seventh, and eighth aspects of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, if the method includes step (13a), it is preferable that the wavelength of the actinic rays in step (14b-1) is different from the wavelength of the actinic rays in step (13a). In the laminate manufacturing methods of the fifth and sixth aspects of the present invention, from the viewpoints of similar inventive effects, if the method includes step (13ya), it is preferable that the wavelength of the actinic rays in step (14yb-1) is different from the wavelength of the actinic rays in step (13ya). In the laminate manufacturing methods of the seventh and eighth aspects of the present invention, from the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, it is preferable that the wavelength of the actinic rays in step (14b-1) is different from the wavelength of the actinic rays in step (12z). The above-described configuration allows for application of a light absorbing layer and / or a first adhesive layer that is not crosslinked by the activated actinic rays in step (13a), step (13ya), or step (12z), and is also suitable from the viewpoint of selectively crosslinking the light absorbing layer and / or the first adhesive layer by the activated actinic rays in step (14b-1) or step (14yb-1).

[0333] In the manufacturing methods of the laminate according to the third, fourth, seventh, and eighth aspects of the present invention, from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, when the step (14) includes the step (14b-1), it is preferable to further include a step (14b-2) of heating the pattern of the light absorbing layer after the step (14b-1) (hereinafter referred to as the step (14b-2)). In the manufacturing methods of the laminate according to the fifth and sixth aspects of the present invention, from the viewpoint of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, when the step (14y) includes the step (14yb-1), it is preferable to further include a step (14yb-2) of heating the pattern of the light absorbing layer after the step (14yb-1) (hereinafter referred to as the step (14yb-2)). Examples and preferred descriptions regarding the heating step in steps (14b-2) and (14yb-2) are the same as the examples and preferred descriptions in steps (14a) and (14ya) above, respectively.

[0334] <Second substrate; step of preparing a laminate> The methods for producing a laminate according to the third, fifth, and seventh aspects of the present invention include a step (20) of preparing a laminate a2 having a second substrate and a second adhesive layer in this order (hereinafter referred to as step (20)). The methods for producing a laminate according to the fourth, sixth, and eighth aspects of the present invention preferably further include a step (20) of preparing a laminate a2 having a second substrate and a second adhesive layer in this order (hereinafter referred to as step (20)). Examples and preferred descriptions regarding the laminate a2 are as described above. The step of preparing these laminates may be a step of producing a laminate and preparing it. Furthermore, the step of preparing these laminates may be a step of preparing an already produced laminate.

[0335] <Second substrate; step of forming a second adhesive layer> The methods for producing a laminate according to the third, fifth, and seventh aspects of the present invention preferably include a step (21) of forming a second adhesive layer on the second substrate. The methods for producing a laminate according to the fourth, sixth, and eighth aspects of the present invention preferably further include a step (21) of forming a second adhesive layer on the second substrate. Examples and preferred descriptions of the second substrate and the second adhesive layer are as described above. Methods for forming the second adhesive layer in these steps include, for example, a method of applying a composition or a method of arranging a film made of the composition. Examples and preferred descriptions of these methods are the same as the examples and preferred descriptions of step (11) above.

[0336] <Second substrate; step of transferring an article> The laminate manufacturing method according to the third and seventh aspects of the present invention includes a step (22) of irradiating the light absorbing layer with active actinic rays from the first substrate side of the light absorbing layer with a gap between the article provided on the first substrate and the second adhesive layer provided on the second substrate, and transferring the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)). From the viewpoint of improving yield and reliability, the laminate manufacturing method according to the fourth and eighth aspects of the present invention preferably further includes step (22). The laminate manufacturing method according to the third, fourth, seventh, and eighth aspects of the present invention preferably includes a plurality of articles in contact with the second adhesive layer in step (22).

[0337] A fifth aspect of the present invention relates to a method for producing a laminate, and the method includes a step (22y) of irradiating the light absorbing layer with actinic radiation from the first substrate side of the light absorbing layer with a gap between the article provided on the first substrate and the second adhesive layer provided on the second substrate, thereby transferring the article from the first adhesive layer to the second adhesive layer (hereinafter referred to as step (22y)). A sixth aspect of the present invention relates to a method for producing a laminate, and the method preferably further includes step (22y). The fifth and sixth aspects of the present invention relate to a method for producing a laminate, and the method preferably includes a plurality of articles in contact with the second adhesive layer in step (22).

[0338] Examples and preferred descriptions regarding the articles are as described above. Having a plurality of articles in step (22) refers to the state after step (22). Having a plurality of articles in step (22y) refers to the state after step (22y). That is, in step (22), a plurality of articles are transferred from the light absorbing layer to the second adhesive layer. Also, in step (22y), a plurality of articles are transferred from the first adhesive layer to the second adhesive layer.

[0339] In step (22), from the viewpoint of improving yield and reliability, it is preferable to transfer the plurality of articles provided on the first substrate from the light absorbing layer to the second adhesive layer in two or more steps, and it is more preferable to transfer them sequentially in two or more steps. In step (22y), from the viewpoint of improving yield and reliability, it is preferable to transfer the plurality of articles provided on the first substrate from the first adhesive layer to the second adhesive layer in two or more steps, and it is more preferable to transfer them sequentially in two or more steps. Transferring the plurality of articles sequentially means transferring the plurality of articles one by one in succession.

[0340] In steps (22) and (22y), the gap provided between the article and the second adhesive layer is preferably 10 μm or more, more preferably 20 μm or more, even more preferably 30 μm or more, and particularly preferably 50 μm or more from the viewpoint of suppressing debris. On the other hand, the gap provided between the article and the second adhesive layer is preferably 500 μm or less, more preferably 300 μm or less, even more preferably 200 μm or less, and particularly preferably 100 μm or less from the viewpoint of reducing the energy of laser irradiation and improving positional accuracy.

[0341] In steps (22) and (22y), it is also preferable to irradiate the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer through a photomask. From the viewpoints of reducing the energy of laser irradiation, suppressing debris, and improving positional accuracy, the photomask includes a light-transmitting portion and a light-shielding portion, and the region of the light-transmitting portion is preferably within the region of the first substrate where the article is provided, and more preferably corresponds to the region where the article is provided. Furthermore, it is preferable that the region of the light-shielding portion is equal to or larger than the region of the first substrate where the article is not provided, and more preferably corresponds to the region where the article is not provided.

[0342] From the viewpoints of reducing process time, suppressing debris, and improving positional accuracy, the actinic radiation is preferably a laser. Also, from the viewpoint of reducing process time, the actinic radiation is preferably incoherent light. Examples of the laser include a YAG laser and a YVO ４ Examples of lasers include solid-state lasers such as lasers, fiber lasers, and semiconductor lasers; and gas lasers such as carbon dioxide lasers, excimer lasers, and argon lasers. The laser beam shape and laser spot size are not limited. When the laser spot size is smaller than the article, the laser spot may be scanned to irradiate the entire surface of the article.

[0343] The maximum wavelength of the activating actinic rays is preferably 180 nm or more, more preferably 200 nm or more, even more preferably 240 nm or more, even more preferably 300 nm or more, and particularly preferably 340 nm or more. On the other hand, the maximum wavelength of the activating actinic rays is preferably 550 nm or less, more preferably 450 nm or less, even more preferably 420 nm or less, and particularly preferably 400 nm or less. Preferred activating actinic rays are mercury lamp j-line (wavelength 313 nm), mercury lamp i-line (wavelength 365 nm), mercury lamp h-line (wavelength 405 nm), and mercury lamp g-line (wavelength 436 nm), and more preferably a mixture of mercury lamp i-line, h-line, and g-line. When the actinic radiation is a laser, the laser is particularly preferably an ArF laser (wavelength 193 nm), a KrF laser (wavelength 248 nm), a XeCl laser (wavelength 308 nm), a XeF laser (wavelength 351 nm), or a YAG laser (wavelength 266 nm, wavelength 355 nm, or wavelength 532 nm).

[0344] The laser energy density is set to 100 mJ / cm from the viewpoint of reducing the process time. ２ More than 300 mJ / cm is preferable. ２ More preferably, 300 mJ / cm or more ２ On the other hand, from the viewpoints of improving yield, improving reliability, suppressing debris, and improving positional accuracy, the energy density is preferably 3000 mJ / cm. ２ Preferably, 2000 mJ / cm or less ２More preferably, 1000 mJ / cm or less ２ The following is even more preferred:

[0345] <Element substrate; step of preparing laminate> The method for producing a laminate of the present invention preferably further includes a step (30) of preparing a laminate a3 having an element substrate and a third adhesive layer in this order (hereinafter referred to as step (30)). Examples and preferred descriptions regarding the laminate a3 are as described above. The step of preparing these laminates may be a step of manufacturing and preparing a laminate. Furthermore, the step of preparing these laminates may be a step of preparing an already manufactured laminate.

[0346] <Element substrate; step of forming a third adhesive layer> The manufacturing method of the present invention preferably further includes (31) a step of forming a third adhesive layer on the element substrate (hereinafter referred to as step (31)). Examples and preferred descriptions regarding the element substrate and the third adhesive layer are as described above. Examples of methods for forming the third adhesive layer in these steps include a method of applying a composition or a method of arranging a film made of the composition. Examples and preferred descriptions regarding these methods are the same as the examples and preferred descriptions for step (11) above.

[0347] <Element substrate; step of transferring an article to the third adhesive layer> The method for producing a laminate of the present invention preferably further includes (32) a step of contacting and bonding an article provided on the second substrate with the third adhesive layer provided on the element substrate, and transferring the article from the second adhesive layer to the third adhesive layer (hereinafter referred to as step (32)). In step (32), it is more preferable to heat the article and the third adhesive layer in a state where they are in contact and bonded together, and more preferably to perform thermocompression bonding. In step (32), the method for producing a laminate of the present invention preferably includes a plurality of articles in contact with the third adhesive layer.

[0348] <Element substrate; step of transferring an article to the element substrate> The method for producing a laminate of the present invention preferably further includes a step (32J) of contacting and bonding the article provided on the second substrate with the element substrate and / or wiring provided on the element substrate, and transferring the article from the second adhesive layer to the element substrate (hereinafter referred to as step (32J)). When the method for producing a laminate of the present invention includes step (32J), it preferably does not include steps (30) and (31) described above. In step (32J), it is more preferable to heat the article and the element substrate and / or wiring provided on the element substrate in a state where they are in contact with each other and bonded together, and even more preferable to perform thermocompression bonding.

[0349] The method for producing a laminate of the present invention preferably further includes a step (31J) of plasma treating the element substrate and / or wiring provided on the element substrate (hereinafter referred to as step (31J)). The method for producing a laminate of the present invention preferably includes the step (32J) described above after step (31J). The method for producing a laminate of the present invention preferably includes a plurality of articles in contact with the element substrate and / or wiring provided on the element substrate in step (32J). Examples and preferred descriptions regarding the articles are as described above. In step (32), "having a plurality of articles" refers to the state after step (32). In step (32J), "having a plurality of articles" refers to the state after step (32J). That is, in step (32), a plurality of articles are transferred from the second adhesive layer to the third adhesive layer. Also, in step (32J), a plurality of articles are transferred from the second adhesive layer to the element substrate. Examples and preferred descriptions regarding the heating step and the thermocompression bonding step in these steps are the same as the examples and preferred descriptions in step (12) above, respectively.

[0350] In the method for producing a laminate of the present invention, it is preferable that, in the above step (32) or after the above step (32), the electrode terminals of the article and the wiring of the element substrate are electrically connected by solder bonding or bonding with an anisotropic conductive film. In the method for producing a laminate of the present invention, it is preferable that, in the above step (32J) or after the above step (32J), the electrode terminals of the article and the wiring of the element substrate are electrically connected by solder bonding, bonding with an anisotropic conductive film, or direct bonding.

[0351] The laminate manufacturing method of the present invention is preferably used in the manufacture of electronic components, electronic devices, mobile objects, buildings, or windows. Examples of electronic components include semiconductor devices, antennas, displays, optical devices, printed wiring boards, semiconductor packages, active components including semiconductor devices, and passive components. Examples and preferred descriptions of electronic components, semiconductor devices, antennas, displays, optical devices, printed wiring boards, semiconductor packages, active components including semiconductor devices, and passive components are as described above.

[0352] <Schematic Cross-Sectional Diagram of the Manufacturing Process of a Micro LED Display> A manufacturing process of a micro LED display having an LED semiconductor chip using the laminate manufacturing method according to the third and fourth aspects of the present invention will be described with reference to the schematic cross-sectional diagram in FIG. 1 . In the figure, (1) represents (Step 1), and the same applies below. (Step 1) First, a pre-baked film of a light-absorbing layer 2, which is a layer made of a positive-type photosensitive composition, is formed on a first substrate (quartz glass substrate) 1. (Step 2) Next, a semiconductor chip (LED) 4 having a gallium nitride semiconductor and equipped with electrode terminals 4a is prepared and placed on a donor substrate (sapphire substrate) 3. The light-absorbing layer 2 and the semiconductor chip 4 are bonded together. (Step 3) Next, a laser 5 is irradiated only onto the semiconductor chip 4 from the donor substrate 3 side, transferring the semiconductor chip 4 from the donor substrate 3 to the light-absorbing layer 2. (Step 4) After that, the donor substrate 3 is peeled off and removed from the semiconductor chip 4. (Step 5) Next, the light absorbing layer 2 is irradiated with actinic rays 6 from the semiconductor chip 4 side using the semiconductor chip 4 as a mask, forming an alkali-soluble exposed light absorbing layer 7 and an unexposed light absorbing layer 8. (Step 6) Next, the exposed light absorbing layer 7 is removed by development with an alkaline developer to obtain a pattern of the light absorbing layer 2, and the unexposed light absorbing layer 8 is then heated and crosslinked to form a crosslinked light absorbing layer 9. (Step 7) Next, a second adhesive layer 11 is formed on a second substrate (an alkali-free glass substrate) 10. Thereafter, a laser 5 is irradiated onto the semiconductor chip 4 from the first substrate 1 side, with a gap between the semiconductor chip 4 and the second adhesive layer. At this time, the laser 5 is irradiated in two or more separate passes, sequentially transferring the semiconductor chips 4 from the first substrate 1 to the second adhesive layer 11. (Step 8) Multiple semiconductor chips 4 are transferred to desired positions on the second adhesive layer 11 with excellent positional accuracy while suppressing debris during laser transfer. A post-laser light absorbing layer 12 is formed on the first substrate 1, or alternatively, no post-laser light absorbing layer 12 remains due to ablation during laser irradiation. Thereafter, a semiconductor chip 4 is placed on a support substrate or the like, and a micro LED display is obtained by a known chip-first (RDL-last) manufacturing process in which metal wiring, interlayer insulating layers, and the like are formed.

[0353] The manufacturing process of steps 1 to 8 corresponds to the method for manufacturing a laminate according to the third aspect of the present invention. The manufacturing process of steps 1 to 5 or the manufacturing process of steps 1 to 6 corresponds to the method for manufacturing a laminate according to the fourth aspect of the present invention. The laminate obtained in step 5 or step 6 corresponds to the laminate according to the first aspect of the present invention.

[0354] The manufacturing process of a micro LED display having an LED semiconductor chip using the laminate manufacturing method according to the fifth and sixth aspects of the present invention is described below with reference to a schematic cross-sectional view in FIG. 2 . (Step 1) First, a pre-baked light-absorbing layer 2 made of a positive-type photosensitive composition is formed on a first substrate (quartz glass substrate) 1, followed by a pre-baked first adhesive layer 2a made of a positive-type photosensitive composition. (Step 2) Next, a semiconductor chip (LED) 4 having a gallium nitride semiconductor and equipped with electrode terminals 4a is prepared and placed on a donor substrate (sapphire substrate) 3. The first adhesive layer 2a is then bonded to the semiconductor chip 4. (Step 3) Next, a laser 5 is irradiated only onto the semiconductor chip 4 from the donor substrate 3 side, transferring the semiconductor chip 4 from the donor substrate 3 to the first adhesive layer 2a. (Step 4) The donor substrate 3 is then peeled off and removed from the semiconductor chip 4. (Step 5) Next, using the semiconductor chip 4 as a mask, the light absorbing layer 2 and the first adhesive layer 2a are irradiated with actinic radiation 6 from the semiconductor chip 4 side, forming an alkali-soluble exposed light absorbing layer and first adhesive layer 7a, and an unexposed light absorbing layer 8 and unexposed first adhesive layer 8a. (Step 6) Next, the exposed light absorbing layer and first adhesive layer 7a are removed by development with an alkaline developer to obtain a pattern of the light absorbing layer 2 and a pattern of the first adhesive layer 2a. The unexposed light absorbing layer 8 and the unexposed first adhesive layer 8a are then heated and crosslinked to form a crosslinked light absorbing layer 9 and a crosslinked first adhesive layer 9a. (Step 7) Next, a second adhesive layer 11 is formed on a second substrate (alkali-free glass substrate) 10. Then, with a gap between the semiconductor chip 4 and the second adhesive layer, a laser 5 is irradiated onto the semiconductor chip 4 from the first substrate 1 side. At this time, the laser 5 is irradiated in two or more separate passes, and the semiconductor chips 4 are sequentially transferred from the first substrate 1 to the second adhesive layer 11. (Step 8) While suppressing debris during laser transfer, the multiple semiconductor chips 4 are transferred with excellent positional accuracy to desired positions on the second adhesive layer 11. Either a light absorbing layer and a first adhesive layer 12a are formed on the first substrate 1 after laser irradiation, or no light absorbing layer or a first adhesive layer 12a remains after laser irradiation due to ablation during laser irradiation.Thereafter, the semiconductor chip 4 is placed on a support substrate or the like, and a micro LED display is obtained by a known manufacturing process of Chip-first (RDL-last) in which metal wiring, interlayer insulating layers, etc. are formed.

[0355] The manufacturing process of steps 1 to 8 corresponds to the method for manufacturing a laminate according to the fifth aspect of the present invention. The manufacturing process of steps 1 to 5 or the manufacturing process of steps 1 to 6 corresponds to the method for manufacturing a laminate according to the sixth aspect of the present invention. The laminate obtained in step 5 or step 6 corresponds to the laminate according to the second aspect of the present invention.

[0356] The manufacturing process of a micro LED display having LEDs as semiconductor chips using the laminate manufacturing methods of the seventh and eighth aspects of the present invention will be described with reference to the schematic cross-sectional view in Figure 3. (Step 1) First, a pre-baked film of a light-absorbing layer 2, which is a layer made of a positive-type photosensitive composition, is formed on a first substrate (quartz glass substrate) 1. (Step 2) Next, a semiconductor chip (LED) 4 having a gallium nitride semiconductor and equipped with electrode terminals 4a is prepared and placed on a donor substrate (sapphire substrate) 3, and the light-absorbing layer 2 and the semiconductor chip 4 are bonded together. (Step 3) Next, a laser 5 is irradiated onto the semiconductor chip 4 from the donor substrate 3 side, and the laser 5 is also irradiated onto the light-absorbing layer 2 using the semiconductor chip 4 as a mask. The semiconductor chip 4 irradiated with the laser 5 is transferred from the donor substrate 3 to the light-absorbing layer 2, and the light-absorbing layer 2 in the areas irradiated with the laser 5 is removed to form an unexposed light-absorbing layer 8. That is, in this step, the semiconductor chip 4 is transferred to the light absorbing layer 2, and a pattern of the light absorbing layer 2 is obtained. (Step 4) The donor substrate 3 is then peeled off and removed from the semiconductor chip 4. (Step 5) The unexposed light absorbing layer 8 is then heated and crosslinked to form a crosslinked light absorbing layer 9. (Step 6) A second adhesive layer 11 is then formed on a second substrate (an alkali-free glass substrate) 10. Then, with a gap between the semiconductor chip 4 and the second adhesive layer, a laser 5 is irradiated onto the semiconductor chip 4 from the first substrate 1 side. During this process, the laser 5 is irradiated in two or more separate passes, sequentially transferring the semiconductor chips 4 from the first substrate 1 to the second adhesive layer 11. (Step 7) Multiple semiconductor chips 4 are transferred to desired positions on the second adhesive layer 11 with excellent positional accuracy while suppressing debris during laser transfer. A light absorbing layer 12 is formed on the first substrate 1 after laser irradiation, or no light absorbing layer 12 remains after laser irradiation due to ablation during laser irradiation. Thereafter, the semiconductor chip 4 is placed on a support substrate or the like, and a micro LED display is obtained by a known manufacturing process of Chip-first (RDL-last) in which metal wiring, interlayer insulating layers, etc. are formed.

[0357] The manufacturing process of steps 1 to 7 corresponds to the method for manufacturing a laminate according to the seventh aspect of the present invention. The manufacturing process of steps 1 to 4 or the manufacturing process of steps 1 to 5 corresponds to the method for manufacturing a laminate according to the eighth aspect of the present invention. The laminate obtained in step 4 or step 5 corresponds to the laminate according to the first aspect of the present invention.

[0358] The present invention will be described in more detail below with reference to Examples, Reference Examples, and Comparative Examples, but the present invention is not limited to these examples. For compounds used in the following explanations or tables that use abbreviations, the names corresponding to the abbreviations are listed in Tables 1-2. The structures corresponding to the abbreviated compounds ADMS1, ADMS2, and OADA are shown below.

[0359]

[0360]

[0361] <Synthesis Examples of Each Resin> The compositions of the resins obtained in Synthesis Examples 1 to 19 as the (A) binder resin are summarized in Tables 1-3 to 1-5. Each resin was synthesized by a known method based on a method described in a known literature, with the monomer compounds to be used as monomers and the copolymerization ratios appropriately changed. The copolymerization ratios of the monomers are as shown in Tables 1-3 to 1-5.

[0362] In Synthesis Example 3, the esterifying agent DFA was reacted with the amic acid structural units in the resin, resulting in structural conversion to amic acid ester structural units having methyl groups. In Synthesis Example 10, GMA having epoxy groups was reacted with carboxy groups derived from MAA in the resin, resulting in ring-opening addition of all of the epoxy groups in the GMA. In Synthesis Examples 16 and 17, MOI having isocyanate groups was reacted with hydroxy groups derived from HEA in the resin, resulting in addition of all of the isocyanate groups in the MOI.

[0363] The phenol group-containing acrylic resins (PAC-1) and (PAC-3) obtained in Synthesis Examples 8 and 10 correspond to the (Da) ultraviolet absorber having the specific structure described above. That is, the phenol group-containing acrylic resins (PAC-1) and (PAC-3) correspond to both the (Da) ultraviolet absorber and the (A) binder resin. Similarly, the phenol group-containing acrylic resins (PAC-1) and (PAC-3) in the light-absorbing layer correspond to the (XDa) ultraviolet absorber having the specific structure described above, and also correspond to both the (XDa) ultraviolet absorber and the (XA) binder resin.

[0364]

[0365]

[0366]

[0367] The structural units and structures of the resins obtained in each synthesis example and the resins used in each example, reference example, and comparative example are collectively shown in Table 2-1.

[0368]

[0369] <Preparation Examples of Each Pigment Dispersion> The compositions of the pigment dispersions obtained in Preparati...

Claims

1. A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12) a step of temporarily fixing an article to the light absorbing layer (hereinafter referred to as step (12)); (13) a step of patterning the light absorbing layer (hereinafter referred to as step (13)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22) a step of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer, with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, to transfer the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)), wherein in step (12) a plurality of articles are in contact with the light absorbing layer, and in step (13) recesses are formed in the light absorbing layer.

2. In the step (13), the indentation elastic modulus of the light absorbing layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ 2. The method for producing a laminate according to claim 1, wherein the glass transition temperature of the light absorbing layer is −50 to 150° C., and / or the glass transition temperature of the light absorbing layer is −50 to 150° C. in the step (13).

3. The method for producing a laminate according to claim 1 or 2, further comprising (01) a step of forming an article on a donor substrate, wherein the step (12) comprises (12a) a step of irradiating the article provided on the donor substrate with activated actinic rays from the donor substrate side of the article while the article is in contact with a light absorbing layer provided on a first substrate, thereby transferring the article from the donor substrate to the light absorbing layer (hereinafter referred to as step (12a)), wherein in step (12a), the light absorbing layer is irradiated with activated actinic rays using the article as a mask, and at least a portion of the light absorbing layer irradiated with activated actinic rays is removed.

4. A method for producing a laminate according to claim 1 or 2, wherein in step (13), the light absorbing layer exists as a light absorbing layer in a plurality of convex portions and a light absorbing layer in a concave portion while in contact with the first substrate, the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions, and further wherein each of the plurality of articles is independently in contact with at least one of the light absorbing layers in the plurality of convex portions.

5. A method for producing a laminate according to claim 1 or 2, wherein in step (13), the light absorbing layer exists as a plurality of island-shaped light absorbing layers in contact with the first substrate, and each of the plurality of articles is independently in contact with at least one of the plurality of island-shaped light absorbing layers.

6. The method for producing a laminate according to claim 1 or 2, wherein in step (13), any one of the following conditions (a) to (c) is satisfied: (a) the light-absorbing layer is a layer made of a positive-type photosensitive composition, and the step (13) comprises (13a) a step of patterning the light-absorbing layer by photolithography (hereinafter referred to as step (13a)); (b) the light-absorbing layer is a layer made of a positive-type photosensitive composition or a negative-type photosensitive composition, and the step (13) comprises (13b) a step of patterning the light-absorbing layer by etching (hereinafter referred to as step (13b)); (c) the light-absorbing layer is a layer made of a non-photosensitive composition, and the step (13) comprises (13b) a step of patterning the light-absorbing layer by etching, and further the indentation elastic modulus of the light-absorbing layer at 50°C is 1.0 × 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is −50 to 150° C.

7. The method for producing a laminate according to claim 6, wherein the condition (a) is satisfied in the step (13), and the step (13a) comprises: (13a-1) a step of irradiating the light absorbing layer with actinic rays from the article side of the light absorbing layer using the article as a mask; and (13a-2) a step of developing with a developer to pattern the light absorbing layer.

8. The method for producing a laminate according to claim 6, wherein the step (13) satisfies the condition (c), and the step (13b) comprises: (13b-1a) a step of patterning the light absorbing layer by dry etching from the article side of the light absorbing layer using the article as a mask; or (13b-1b) a step of patterning the light absorbing layer by wet etching from the article side of the light absorbing layer using the article as a mask.

9. The method for producing a laminate according to claim 1 or 2, further comprising, before or after step (13), a step (14) of crosslinking the pattern of the light absorbing layer (hereinafter referred to as step (14)), wherein step (14) comprises: (14a) a step of heating the pattern of the light absorbing layer to crosslink it; or (14b-1) a step of irradiating the light absorbing layer with actinic rays from the first substrate side of the light absorbing layer.

10. A method for manufacturing a laminate, comprising: (10) a step of preparing a laminate a1x having a first substrate and a light absorbing layer in this order; (12z) a step of temporarily fixing an article to the light absorbing layer and ablating the light absorbing layer (hereinafter referred to as step (12z)); (20) a step of preparing a laminate a2 having a second substrate and a second adhesive layer in this order; and (22) a step of irradiating the light absorbing layer with activated actinic rays from the first substrate side of the light absorbing layer, with a gap provided between the article provided on the first substrate and the second adhesive layer provided on the second substrate, to transfer the article from the light absorbing layer to the second adhesive layer (hereinafter referred to as step (22)), wherein in step (12z) a plurality of articles are in contact with the light absorbing layer, and in step (12z) a recess is formed in the light absorbing layer.

11. A laminate having a first substrate, a light absorbing layer, and an article in this order, wherein the laminate has a plurality of articles in contact with the light absorbing layer, the light absorbing layer has a recess, and the indentation elastic modulus of the light absorbing layer at 50°C is 1.0 x 10 ３ ~2.0 x 10 ９ Pa, and / or the glass transition temperature of the light absorbing layer is −50 to 150° C.

12. The laminate according to claim 11, wherein the light absorbing layer exists as a light absorbing layer in a plurality of convex portions and a light absorbing layer in a concave portion while in contact with the first substrate, the thickness of the light absorbing layer in the concave portions is smaller than the thickness of the light absorbing layer in the plurality of convex portions, and further wherein each of the plurality of articles is independently in contact with at least one of the light absorbing layers in the plurality of convex portions.

13. The laminate according to claim 11, wherein the light absorbing layer is present as a plurality of island-shaped light absorbing layers in contact with the first substrate, and each of the plurality of articles is independently in contact with at least one of the plurality of island-shaped light absorbing layers.

14. The laminate according to claim 12 or 13, wherein the thickness of the light absorbing layer is less than 5.0 μm.

15. The laminate according to claim 12 or 13, wherein the light-absorbing layer is a layer made of a positive-type photosensitive composition.

16. The area of ​​the first a surface of the light absorbing layer on the first substrate side is (S １ａ ), and the area of ​​the second a-surface of the light absorbing layer facing the first a-surface is (S ２ａ ) the laminate according to claim 13, which satisfies the relationship of formula (S-1). １ａ ) ≧ (S ２ａ ) (S-1) 17. The area of ​​the first surface (S １ａ ) and the area of ​​the second surface a (S ２ａ ) and the ratio (S １ａ ) / (S ２ａ ), then (S １ａ ) / (S ２ａ 17. The laminate according to claim 16, wherein the value of (a) is 1.10 or more and 3.00 or less.

18. The laminate according to claim 12 or 13, wherein the maximum absorbance per 1.0 μm thickness of the light-absorbing layer at wavelengths of 180 to 550 nm is 0.3 to 10.

0.

19. The laminate according to claim 12 or 13, wherein the light-absorbing layer contains an ultraviolet absorber (XDa), and the ultraviolet absorber (XDa) includes a resin having a triazine structure and / or a benzotriazole structure in the structural unit of the resin.

20. The laminate according to claim 12 or 13, wherein the light-absorbing layer satisfies any one of the following conditions (α) to (γ): (α) The light-absorbing layer is a layer formed from a positive-type photosensitive composition, and the positive-type photosensitive composition satisfies at least one of the following conditions (1), (3), and (4). (β) The light-absorbing layer is a layer formed from a negative-type photosensitive composition, and the negative-type photosensitive composition satisfies at least one of the following conditions (2) to (4). (γ) The light-absorbing layer is a layer formed from a non-photosensitive composition, and the non-photosensitive composition satisfies the following condition (5) and / or the following condition (6). (1) Contains (C1) a naphthoquinone diazide compound and (F) a crosslinking agent. (2) Contains (C2) a photopolymerization initiator and (B) a radically polymerizable compound. (3) Contains (C3) a photoacid generator and (F) a crosslinking agent. (4) Contains (C4) a photobase generator and (F) a crosslinking agent. (5) Contains (F) a crosslinking agent. (6) Contains (B) a radically polymerizable compound.

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