Method and system for assembling a product kit for manufacturing a laminated product

Abstract

A method and system of assembling a product kit (K). The product kit (K)comprising an ordered stack (S) of plies (1,2, 3, 4, 5, 6, 7, 8) arranged according to a predetermined stack sequence (Os) for manufacturing (M) a laminated product (P) The plies are picked from consecutively available arrangements of cutouts (10,20) comprising at least a first arrangement of cutouts (10) and a second arrangement of cutouts (20) A processor (105) generates, for each consecutively available arrangement of cutouts (10,20), a respective set of pick and place instructions (11-14,15-18) for picking and placing each ply from the available arrangement of cutouts (10,20) onto a plurality of sub-stacks (81,82,83) occupying respective buffer areas (B1,B2,B3). For each consecutively available arrangement of cutouts (10,20), the respective set of pick and place instructions (11-14, 15-18) is generated so that, at each time, each of the plurality of substacks (81,82,83) is respectively formed by a single subsequence(01,02,03) of consecutive plies according to the predetermined stack sequence (Os).

Description

[0001] Title: METHOD AND SYSTEM FOR ASSEMBLING A PRODUCT KIT

[0002] FOR MANUFACTURING A LAMINATED PRODUCT

[0003] TECHNICAL FIELD AND BACKGROUND

[0004] The present disclosure relates to methods of assembling a product kit for manufacturing a laminated product, computer program products causing such methods to be executed, and systems for executing such methods.

[0005] As background, WO 2021 / 010831 Al describes the processing of stacks of mutually fixated fiber reinforced plies, and in particular the processing of consolidated stacks of fiber reinforced plies. Such stacks are generally known, and may be used for manufacturing fiber reinforced laminated and / or composite products. Typically, such stacks comprise plies that are sequentially laid up in a prescribed order and / or with a particular (directional) alignment. The plies may be mutually fixated together e.g. by spot or friction welding, or may be consolidated together by head and / or pressure to form a (fully) consolidated stack. The plies may e.g. be cut from a sheet of fiber material or be sectioned from a web of fiber material tape. Generally, a fiber reinforced ply comprises a reinforcement in the form of fibers that is embedded in a matrix material. The fibers may e.g. include carbon fibers, aramid fibers or other types of reinforcement fibers, and the matrix material may e.g. include thermosetting resin, or thermoplastic plastics material. The fiber reinforced material may be dry, but may also be wet or impregnated. In addition, the plies or sheets may comprise a backing material.

[0006] As further background, WO 2020 / 263093 Al describes a preforming system comprising a placement robot with a ply manipulating part for automated sequential laying of plies at a desired location with a preselected attitude to pre-form a composite structure; and a method for automated sequential laying of plies at a desired location with a preselected attitude to pre-form a composite structure. During the fabrication of composite or so-called laminate structures, generally a group of plies may be sequentially laid up at desired locations on a substrate in order to strengthen, stiffen and / or otherwise provide a structure with required structural and / or performance characteristics. Often, a layup process may be performed by hand. For example, using hand layup techniques, a technician places each ply individually on the substrate at a precise location and orientation relative to the substrate and / or other plies. Usually, the hand layup process requires plies to be placed one at a time, and ply size may be limited to what the technician can handle manually. The hand layup techniques are time consuming, labor intensive and costly. Automated tape laying or automated fiber placement techniques may be used for the fabrication of relatively complex and / or large scale laminate structures. However, these techniques are not well suited for all applications. Besides, certain ply materials may be relatively delicate and / or susceptible to wrinkling, creasing and / or tearing when processed with these techniques.

[0007] WO 2020 / 263093 Al describes that, by providing a buffer comprising two or more carriers each arranged to carry at least one presorted ply, a convenient arrangement for buffering presorted plies may be obtained. Each carrier may be embodied as, or may include shelves or trays. By providing a controller that keeps track of a position, type and sequential order of the at least one presorted ply per carrier, the system is familiar with an assortment of next-in-sequence plies and may anticipate accordingly for efficient throughput of plies. By providing a placement robot with a ply manipulating part, the system may reduce or prevent ply wrinkling, creasing and / or tearing and may provide more control over the sequential laying of plies. When the controller controls the placement robot to manipulate and transport the at least one ply by means of the ply manipulating part from a selected carrier of the two or more carriers to the substrate and to place the at least one ply at the desired location with the preselected attitude, the automated sequential laying of plies to pre-form a composite structure may be simplified, e.g. without requiring optical recognition of next-in-sequence plies.

[0008] It is desired to further improve upon the known methods and systems. In particular, it is desired more efficiently assemble a product kit comprising an ordered stack of plies arranged according to a predetermined stack sequence for manufacturing a laminated product.

[0009] SUMMARY

[0010] The present disclosure provides methods, systems, and computer program products aimed at improving the assembly of a product kit. A product kit generally comprises an ordered stack of plies. In particular, the stack of plies is arranged according to a predetermined stack sequence. The predetermined stack sequence facilitates the manufacturing a laminated product using the product kit.

[0011] As realized by the inventors, the assembly of a product kit may be complicated by various circumstances of the manufacturing process. For example, it may be desired that a product kit is formed of plies that are picked from different sheets and / or different arrangements of cutouts. This may allow greater flexibility and / or more efficient use of material. For example, various shapes may be cut from subsequent sheets of material, wherever there is still space available, to make most efficient use of the material. However, the subsequent arrangements of cutouts may only be available one at a time. For example, while plies are picked from a first arrangement of cutouts, a second arrangement of cutouts may not be accessible and / or may yet to be formed, e.g. in a preceding cutting process. Furthermore, once plies have been picked from the first arrangement, the first arrangement may be discarded to make room for the second arrangement. When there are non-consecutive plies (according to the predetermined stack sequence) in the first arrangement of cutouts, with an intermediate ply in the second arrangement of cutouts, the first arrangement of cutouts cannot be all placed on a stack without later having to rearrange the stack in the correct order.

[0012] In order to address these and other issues, one aspect of the present disclosure provides a processor is programmed to generate, for each available arrangement of cutouts, a respective set of pick and place instructions for sequentially picking and placing each ply from the available arrangement of cutouts onto a plurality of sub-stacks occupying respective buffer areas. In particular, the pick and place instructions are generated as follows. If, in the available arrangement of cutouts, there is a consecutive ply that is consecutive, according to the predetermined stack sequence, with any topside plie of a matching sub-stack disposed on an occupied buffer area, the consecutive ply is placed onto the topside plie of the matching substack. Otherwise, e.g. if there is no matching stack available, a non- consecutive ply in the available arrangement of cutouts is placed onto an empty buffer area, creating a new sub-stack. In other words, if possible, a next ply from an available arrangement of cutouts is placed directly onto a topside plie of an existing sub-stack, if the next ply follows directly after (or before) the topside plie according to the predetermined stack sequence. And if this is not possible, i.e. no sub-stack exists wherein the topside plie is consecutive with the next ply, the next ply is placed on a still empty buffer area to form a new sub-stack. In this way, it can be ensured that each of the plurality of sub-stacks is respectively formed by a single subsequence of consecutive plies according to the predetermined stack sequence. In other words, each sub-stack is preferably built up to exclusively consists of a single subsequence of the predetermined stack sequence, without any out-of- sequence ply being placed between two other plies. Advantageously, this may allow on the one hand greater flexibility and / or more efficient use of material while preventing errors which may occur when having to rearrange stack sequences after placement. The sequentially ordered sub-stacks may be easily combined to form the final stack, without requiring any rearrangement or dividing of sub-stacks preventing errors such as inadvertent sticking of plies.

[0013] BRIEF DESCRIPTION OF DRAWINGS

[0014] These and other features, aspects, and advantages of the apparatus, systems and methods of the present disclosure will become better understood from the following description, appended claims, and accompanying drawing wherein:

[0015] FIGs 1A - IE illustrate picking and placing of plies from a first arrangement of cutouts onto respective sub-stacks;

[0016] FIGs 2A - 2E illustrate picking and placing of plies from a second arrangement of cutouts onto respective sub-stacks, e.g. following the sequence of FIGs 1A- IE;

[0017] FIGs 3A - 3C illustrate combining of sub-stacks to form a combined stack of plies, e.g. following the sequence of FIGs 2A - 2E;

[0018] FIG 3D illustrates placing the stack of plies in a container to form a product kit, e.g. following the sequence of FIGs 3A - 30;

[0019] FIG 3E illustrates a product kit comprising a stack of plies, e.g. formed according to FIG 3D;

[0020] FIG 3F illustrates processing a stack of plies, e.g. retrieved from the product kit according to FIG 3E;

[0021] FIG 3G illustrates a laminated product, e.g. formed of the processed a stack of plies according to FIG 3F;

[0022] FIG 3H illustrates predetermined stack sequence for a stack of plies, e.g. according to FIG 3E, and respective sub-sequences of sub-stacks, e.g. as illustrated in FIG 3A;

[0023] FIGs 4A and 4B illustrate a system comprising a robotic device for picking and placing of plies;

[0024] FIGs 5A and 5B illustrate a system comprising a signaling device for picking and placing of plies; FIGs 6A illustrates a system with a buffer system comprising a move able surface;

[0025] FIGs 6B illustrates a system with a buffer system comprising a stack of moveable surfaces;

[0026] FIG 7 A illustrates a processor configured to generate instructions; FIG 7B illustrates a generating of instructions;

[0027] FIGs 8A and 8B illustrate different arrangements of cutouts.

[0028] DESCRIPTION OF EMBODIMENTS

[0029] Terminology used for describing particular embodiments is not intended to be limiting of the invention. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The term "and / or" includes any and all combinations of one or more of the associated listed items. It will be understood that the terms "comprises" and / or "comprising" specify the presence of stated features but do not preclude the presence or addition of one or more other features. It will be further understood that when a particular step of a method is referred to as subsequent to another step, it can directly follow said other step or one or more intermediate steps may be carried out before carrying out the particular step, unless specified otherwise. Likewise it will be understood that when a connection between structures or components is described, this connection may be established directly or through intermediate structures or components unless specified otherwise.

[0030] Within the context of this application, the term “ply” should be construed to include a wide variety of shapes and reinforced plastics. Often, reinforced plastics may comprise fiber reinforced material with a dispersed reinforcement phase embedded in a continuous matrix phase having a fine interphase region. In general, the reinforcement is in the form of (dis)continuous fibers, such as carbon fibers or aramid fibers, embedded in a matrix material, such as thermosetting resin or thermoplastic plastics material. In addition, the plies may comprise a backing material. Such plies are generally known and are used for manufacturing laminated or composite products. Typically plies may be pliable sheet-like or planar materials that are to be laid up sequentially for fabrication of composite or laminated structures. A variety of plies may be manipulated, i.e. lifted, oriented and / or placed, such as thermoplastics, prepregs, thermosets, metal foils, backing material and adhesive layers.

[0031] The invention is described more fully hereinafter with reference to the accompanying drawings, in which embodiments of the invention are shown. In the drawings, the absolute and relative sizes of systems, components, layers, and regions may be exaggerated for clarity. Embodiments may be described with reference to schematic and / or crosssection illustrations of possibly idealized embodiments and intermediate structures of the invention. In the description and drawings, like numbers refer to like elements throughout. Relative terms as well as derivatives thereof should be construed to refer to the orientation as then described or as shown in the drawing under discussion. These relative terms are for convenience of description and do not require that the system be constructed or operated in a particular orientation unless stated otherwise.

[0032] FIGs 1 - 3 illustrate various steps leading to the assembly of a product kit “K”. As illustrated in FIG 3E and 3H, the product kit “K” comprises an ordered stack “S” of plies 1,2, 3, 4, 5, 6, 7, 8 arranged according to a predetermined stack sequence “Os”. As illustrated in FIGs 3F and 3G, the stack “S” may be used for manufacturing “M” a laminated product “P”.

[0033] In some embodiments, e.g. as illustrated in FIGs 1A and 2A, the plies are picked from consecutively available arrangements of cutouts 10,20 comprising at least a first arrangement of cutouts 10 and a second arrangement of cutouts 20. In one embodiment, e.g. as illustrated in FIGs ID and IE, there are at least some non-consecutive plies 2,4; 4,6 in the first arrangement of cutouts 10, which non-consecutive plies 2,4; 4,6 have a respective at least one intermediate ply 3,5, according to the predetermined stack sequence “Os”, in the second arrangement of cutouts 20. In another or further embodiment, e.g. as illustrated in FIG 3H, the respective at least one intermediate ply 3,5 from the second arrangement of cutouts 20 is positioned in the ordered stack “S” of plies 1,2, 3, 4, 5, 6, 7, 8 between said non- consecutive plies 2,4; 4,6 from the first arrangement of cutouts 10.

[0034] In some embodiments, e.g. as illustrate in FIGs IB through IE and FIGs 2B through 2E, the method of assembly comprises generating, e.g. by a processor, for each available arrangement of cutouts 10 and 20, a respective set of pick and place instructions 11-14 and 15-18. When executed, the pick and place instructions 11-14 and 15-18 may cause sequentially picking and placing each ply from the available arrangement of cutouts 10 and 20 onto a plurality of sub-stacks S1,S2,S3 occupying respective buffer areas B1,B2,B3. Preferably, the respective set of pick and place instructions 11-14 and 15-18 are generated as follows. If, in the available arrangement of cutouts 10 and 20, there is a consecutive ply 2 (e.g. as illustrated in FIG 1C) that is consecutive, according to the predetermined stack sequence “Os”, with any topside plie 1 of a matching sub-stack Si disposed on an occupied buffer area Bl, the consecutive ply 2 is placed onto the topside plie 1 of the matching sub-stack Si. Otherwise, e.g. as illustrated in FIG ID a non- consecutive ply 4 in the available arrangement of cutouts 10 and 20 is placed onto an empty buffer area B2, thus creating a new sub-stack S2. As illustrated in FIG 2E, the plies may thus be placed so that each of the plurality of sub-stacks S1,S2,S3 is respectively formed by a single subsequence 01,02,03 of consecutive plies according to the predetermined stack sequence “Os”. While the present figures illustrate each subsequence 01,02,03 of consecutive plies being arranged in ascending order, it will be understood that the plies may also be placed in descending order. For example, in the final stack, the order of a respective sub-stack may be reversed by flipping the respective sub-stack; or by consecutively picking plies from the respective sub-stack and placing these onto the final stack. In some embodiments, e.g. as illustrated in FIGs 3B and 3C, the method of assembly comprises generating, e.g. by a processor, a set of stack combining instructions 19,110. In one embodiment, e.g. as illustrated in FIG 3B, the a set of stack combining instructions comprise an instruction 19 for combining a first sub-stack Si of the plurality of sub-stacks S1,S2,S3, with a second sub-stack S2 of the plurality of sub-stacks S1,S2,S3 to form a combined sub-stack S1+S2. Advantageously, the combined sub-stack S1+S2 may consist of a (combined) single subsequence 01+02 of consecutive plies according to the predetermined stack sequence “Os”. In another or further embodiment, e.g. as illustrated in FIG 30, the process continues until all sub-stacks S1,S2,S3 are combined to form the stack “S” of plies

[0035] 1,2, 3, 4, 5, 6, 7, 8 arranged according to the predetermined stack sequence “Os”. In a preferred embodiment, each of the stack combining instructions is generated to displace only an entire sub-stack on top of another (entire) sub-stack. For example, FIG 3B illustrates the entire second sub-stack S2 is placed on top of the first sub-stack Si. Similarly, the entire third sub-stack “S”3 is placed on top of the combined sub-stack S1+S2. Advantageously, the inventors find that displacing the previously formed sub-stacks as a whole may prevent inadvertent displacement of plies sticking to each other when moving a partial sub-stack and / or minimize the number of displacement actions. Because each sub-stack S1,S2 is previously formed to respectively consists of single subsequence 01,02 of consecutive plies according to the predetermined stack sequence “Os”, the combined stack may again form a single combined sub-sequence 01+02, assuming that the subsequence 01 and 02 are consecutive sequences.

[0036] In some embodiments, e.g. as shown, the stack combining instructions are executed only after executing all of the pick and place instructions 11-14 and 15-18, e.g. after picking all plies from all of the arrangements of layouts 10,20. In other words, first all plies are picked and placed from the respective arrangement of cutouts 10,20 to the respective sub-stacks; and only thereafter are the sub-stacks combined. In other embodiments (not shown), sub-stacks may be combined in between the execution of pick and place instructions, e.g. if respective sub-stacks consist of consecutive sub-sequences. For example, in the situation as shown in FIG 2B, the subsequence of the then formed second sub-stack S2 is consecutive with the subsequence of the then formed first sub-stack Si (e.g. the plie position “4” is consecutive to the subsequence “1,2,3”). In this case, it may be envisaged to execute a combining instruction to combined the sub-stacks Si and S2, which could have the advantage of clearing the buffer area B2 without adding further steps (e.g. the combining step of FIG 3B would no longer be needed). For example, the intermediate combining of sub-stacks may be performed in case there would otherwise be insufficient buffer areas available. Combining of sub-stacks and picking and placing from the respective available arrangement of cutouts 10 and 20 may also occur simultaneously, e.g. using separate devices and / or workers (not shown).

[0037] In some embodiments, e.g. as illustrated in FIGs 5A and 5B, a processor 105 is configured to transmit respective set of pick and place instructions I la, I lb and / or stack combining instructions (not shown) to a robotic device 103r configured to execute the instructions. For example, the robotic device 103r comprises a pick and place robot. In one embodiment, the robotic device 103r is configured to pick up a respective ply from a respective available arrangement of cutouts 10 and 20, e.g. provided by a supply system 101, and place the respective ply at a destination location such as an empty buffer area or existing stack, e.g. provided by a buffer system 102. In another or further embodiment, the same or other robotic device is configured to combine one sub-stack with another sub-stack. In one embodiment, e.g. as shown, the robotic device 103r comprises a robotic arm configured to move plies between respective locations of the supply system 101 and buffer system 102 and / or move stacks between different buffer locations. Various ways of picking up plies and / or stacks can be envisaged, such as vacuum suction cups, electrostatic grippers, magnetic grippers (e.g. in case of metal plies), a (micro)spatula or blade (e.g. a thin, flat end effector can slide underneath a ply or stack to gently lift), clamping grippers, et cetera. It can also be envisaged that the buffer system 102 is adapted to facilitate the combining of sub-stacks. For example, the buffer areas may comprise a respective slot or slit beneath the stack facilitating a spatula or gripper to grip below a respective stack. The buffer system 102 may also comprise moving parts configure to execute or facilitate the combining of stacks. Also other types of robotic devices can be envisaged.

[0038] In other or further embodiments, e.g. as illustrated in FIGs 5A and 5B, a processor 105 is configured to transmit respective set of pick and place instructions I la, I lb and / or stack combining instructions (not shown) to a signaling device 103s configured to output respective signals “L” indicating how to execute the instructions. In one embodiment, the signaling device 103s is configured to indicate a respective ply from a respective available arrangement of cutouts 10 and 20, e.g. provided by the supply system 101, and indicate a destination location “B” for the respective ply such as an empty buffer area or existing stack, e.g. provided by the buffer system 102. In another or further embodiment, the same or other signaling device 103s is configured to indicate a respective sub-stack and a destination location B such as another sub-stack to be combined.

[0039] The signaling device 103s may be capable of outputting various types of signals, such as visual signals and / or audio signals. In some embodiments, a worker may be aided in assembling a product kit by using the respective signals as guidance. For example, the signals may provide optimal guidance, e.g. indicating respective locations where to pick and place plies and / or combine stacks. It can also be envisaged to combine robotic and / or signaling devices to perform either one or both of the respective set of pick and place instructions 11-14 and 15-18 and / or set of stack combining instructions 19,110 automatically and / or semi-automatically (e.g. with human oversight).

[0040] In some embodiments (not shown), a monitoring system is configured to monitor the actual displacement and / or position of plies and / or stacks. In this way, a next instruction may be provided when a previous instruction has been executed (automatically and / or manually). In one embodiment, the monitoring system is configured to adapt instructions based on the actual situation. For example, a worker may override an instructed placement and the system may adapt to the actual placement. Alternatively, or additionally, the monitoring system may provide instructions for correction of misplaced plies and / or stacks.

[0041] In a preferred embodiment, e.g. as illustrated in FIGs 5A and 5B, the signaling device 103s comprises a light projector configured to simultaneously or consecutively project a first pattern of light LI onto a respective plie 1 of an available arrangement of cutouts 10 and 20, and project a second pattern of light L2 onto a destination location for the respective plie. For example, the destination location is an empty buffer area of the buffer system 102 and / or a matching sub-stack. In other or further embodiments (not shown), the same or other light projector may project respective patterns of light on respective sub-stack to be combined. In principle, any type of projector may be used. Preferably, the projector is capable of projecting patterned light, e.g. in the shape of a respective ply to be picked from a respective available arrangement of cutouts 10 and 20, and / or in the shape of a respective buffer areas B1,B2,B3,B4 and / or matching stack.

[0042] In some embodiments, e.g. as illustrated in FIGs 1A and 2A, a respective set of supply instructions 10, 15 may be generated, e.g. by a processor, for consecutively supplying the first arrangement of cutouts 10 and the second arrangement of cutouts 20. In other or further embodiments, e.g. as illustrated in FIGs 4 and 5, the arrangements of cutouts 10,20 are consecutively supplied by a supply system 101. In one embodiment, the respective set of supply instructions 10; 15, when executed by the supply system 101, causes the supply system 101 to consecutively supply the arrangements of cutouts 10,20.

[0043] In some embodiments, e.g. as illustrated in FIGs 4 and 5, the supply system 101 is configured to consecutively transport each arrangement of cutouts to a picking zone Z2. The picking zone Z2 may be an accessible zone or area which allows the plies to be picked. For example, the picking zone Z2 is accessible by a robotic device 103r and / or accessible for manually picking the plies from the respective arrangement (e.g. based on signals of a signaling device 103s). In other or further embodiments, the picking zone Z2 may allow access to only one arrangement of cutouts at a time. In other words, the second arrangement of cutouts 20 may not be accessible while picking the first arrangement of cutouts 10.

[0044] In some embodiments, the second arrangement of cutouts 20 is only available for picking after all plies have been picked from the first arrangement of cutouts 10. For example, there may be insufficient space to hold multiple arrangement of cutouts at the picking zone Z2. Alternatively, or in addition, the next arrangement of cutouts 20 may not yet be (fully) formed while picking the first arrangement of cutouts 10. In one embodiment, e.g. as shown, the supply system 101 comprises a conveyor surface, e.g. formed by an endless belt or reciprocating surface. Also other types of arrangements or devices for supplying and / or transporting a respective arrangement of cutouts to a picking zone Z2 may be envisaged. In one embodiment, the processor 105 is configured to transmit a respective set of supply instructions to a supply system 101. For example, the supply system 101 is configured to consecutively supply the arrangements of cutouts 10,20 to a picking zone Z2 accessible to the robotic device 103r and / or signaling device 103s.

[0045] In some embodiments, e.g. as illustrated in FIGs 1A through 2E, the processor 105 is configured to cause consecutive execution of: a first supply instruction 10 for supplying the first arrangement of cutouts 10 to a picking zone Z2; a first set of pick and place instructions 11,12,13,14 for picking each of the plies 1,2, 4, 6 from the first arrangement of cutouts 10 supplied at the picking zone Z2; a second supply instruction 15 for supplying the second arrangement of cutouts 20 to the picking zone Z2, e.g. while removing the first arrangement of cutouts 10 from the picking zone Z2 (or this can be done sequentially); and a second set of pick and place instructions 16,17,18,19 for picking each of the plies 3, 5, 7,8 from the second arrangement of cutouts 20. For example, the respective supply instructions 10,15 are transmitted to and / or received by the supply system 101; and the respective pick and place instructions 11-14 and 15-18 are transmitted to and / or received by the robotic device 103r and / or signaling device 103s. Also further instructions and / or actions may be executed in between and / or during the execution of the supply and / or pick and place instructions.

[0046] In some embodiments, the processor 105 is configured to generate a respective set of cutting instructions “Ic” for cutting one or more sheets of material to form respective arrangements of cutouts 10 and 20. In other or further embodiments, e.g. as illustrated in FIGs 4 and 5, the arrangements of cutouts 10,20 are cut by a cutting system 104. In one embodiment, the respective set of cutting instructions “Ic”, when executed by the cutting system 104, causes the cutting system 104 to (consecutively) cut the arrangements of cutouts 10,20. Timing of the supply, cutting, and / or picking instructions may be controlled by the processor 105 and / or the executing components such as the supply system 101, cutting system 104, and / or robotic / signaling device 103r / 103s. Preferably, the cutting system 104 comprises a laser cutter. Also other or further cutting devices can be used such as a knife cutting machine, waterjet cutter, plotter cutter, ultrasonic cutter, et cetera. In one embodiment, each arrangement of cutouts is cut while holding at least part of a sheet of material in a cutting zone Zl. Preferably, the cutting zone Zl is shielded from the picking zone Z2, e.g. by a dividing wall 10 Iw or other barrier, or shielding. This may improve safety and / or contain debris from the cutting zone Zl.

[0047] In some embodiments, the cutting system 104 is configured to consecutively cut each arrangement of cutouts from a sheet, e.g. while moving the sheet through the cutting zone Zl and / or holding the sheet in the cutting zone Zl. In one embodiment, a respective cutting instruction Ic to produce a next arrangement of cutouts 20 is executed while the picking and placing of a preceding arrangement of cutouts 10 is executed. These executions may also be consecutive. While the present figures illustrate each arrangement of cutouts is cut from a separate sheet, which may be formed of the same or different material, it can also be envisaged to cut consecutive arrangements of cutouts from a single sheet, e.g. a continuous sheet of the same material. One or more sheets may be supplied to the picking zone Z2 from one or more rolls (not shown), and / or the one or more material sheets may be partially or fully manufactured in situ.

[0048] In some embodiments, e.g. as illustrated in FIG 1A, a plurality of buffer areas B1,B2,B3,B4 is formed by surface areas of a buffer system 102. In other or further embodiments, e.g. as illustrated in any of FIGs 1 - 5, the buffer system 102 comprises a table. In one embodiment, e.g. as illustrated in FIG 6A, the buffer system 102 comprises a moveable surface. For example, respective arrangements of cutouts 10,20 are supplied on a first moveable surface of the supply system 101, from which the plies are picked and place onto a second moveable surface of the buffer system 102. In one embodiment, the second moveable surface is configured to move a target buffer area B and / or target sub-stack into closer proximity for placement of the next ply and / or withing reach of a robotic device 103r and / or signaling device 103s. In the embodiment shown, a movement direction of the second moveable surface is oriented transverse, e.g. perpendicular, to a movement direction of the first moveable surface. Also other movement directions may be envisaged. While the present figure shows the moveable surface being formed by a conveyor surface, e.g. endless belt, also other moveable surfaces may be envisaged. Preferably, one or more of the moveable surfaces is actuated by a motor, e.g. to automatically move the respective surface as needed.

[0049] In some embodiments, e.g. as illustrated in FIG 6B, the buffer system 102 comprises multiple buffer surfaces. In one embodiment, multiple buffer surfaces are stacked vertically, e.g. one above another. This may save space. Each layer of the stack may comprise one or more buffer surfaces. In another or further embodiment, the buffer system 102 comprises a set of shelves, trays, or drawers, each forming a respective one or more buffer surfaces. This may allow easy access to respective buffer surfaces. In one embodiment, each of the multiple buffer surfaces, e.g. trays, may be extended and / or retracted. For example, a target buffer surface may be extended to allow placement of a respective ply. One or more other buffer surfaces may be retracted to allow easy access to the target buffer surface. Advantageously, the buffer surfaces may be formed as shelves, drawers, or trays in a cabinet. Preferably, the buffer surfaces are configured to automatically extend and / or retract, as needed. For example, the buffer system 102 comprises an actuator. Alternatively, buffer surfaces such as drawers may also be operated manually.

[0050] Some aspects of the present disclosure may be embodied as computer program. For example, a non-transitory computer-readable medium may store program instructions that, when executed by one or more processors 105, cause the one or more processors 105 to perform the method according to any of the preceding claims. For example, FIG 7 A illustrates a processor 105 programmed with instructions “Ip” for generating instruction 10 - 19. In some embodiments, the program instructions “Ip”, cause the processor 105 to generate, based on a predetermined layout sequence “01” of consecutive available arrangements of cutouts 10 and 20, and based on a predetermined stack sequence “Os”, a respective set of pick and place instructions 11-14 and 15-18.

[0051] In some embodiments, the program instructions “Ip” may also cause the processor 105 to transmit the respective set of pick and place instructions 11-14 and 15-18 to a robotic device 103r and / or signaling device 103s, e.g. as described with reference to FIGs 4 and 5, and / or otherwise control the system 100 for executing the instructions. Respective parts of the pick and place instructions may also be transmitted to an active buffer system 102, e.g. as illustrated in FIGs 6A and 6B. For example, this may cause the buffer system to provide a respective target buffer area. In other or further embodiments, the program instructions “Ip” cause the processor 105 to generate a respective set of supply instructions 10; 15. In other or further embodiments, e.g. as illustrated in FIG 4A and 5A, the program instructions “Ip” cause the processor 105 to transmit the respective set of supply instructions 10; 15 to a supply system 101, e.g. causing consecutive supply of respective arrangements of cutouts 10, 20 according to the predetermined layout sequence “01”. Of course, it will be understood that the generating of these or other instructions, and control of the system 100 based on respective instructions, may also be performed by different processors and / or controllers.

[0052] FIG 7B illustrates an embodiment for determining a respective set of pick and place instructions 11-14 and 15-18 and / or supply instructions 10; 15. In one embodiment, the processor receives as input a predetermined stack sequence “Os” which includes the position of each ply in the stack “S” of plies 1,2, 3, 4, 5, 6, 7, 8 to be formed, as well as a respective origin arrangement of cutouts 10,20 from which the ply is to be picked. In some embodiments, a respective set of pick and place instructions 11-14 and 15-18 and / or supply instructions 10; 15 is determined by calculating backward from the end result of the stack “S”. Also other or further ways of calculating sequences may be envisaged, e.g. taking into account other or further aspects such as optimizing available buffer space.

[0053] In one embodiment, e.g. as shown, the predetermined stack sequence “Os” is split into a plurality of sub-stacks. At each time, each substack is preferably formed by a single sub-sequence of the predetermined stack sequence “Os”. Furthermore, the plurality of sub-stacks may be formed to take into account the consecutive availability of the respective arrangements of cutouts 10,20. In particular, it may be noted that plies from the first arrangement of cutouts 10 are not placed above plies from the second arrangement of cutouts 20. In one embodiment, e.g. as shown, each sub-stack is formed by a set of consecutive plies, starting from one or more plies that are picked from the first arrangement of cutouts 10, and on top of those, one or more plies picked from the second arrangement of cutouts 20. Of course it can also be envisaged that more than two arrangements cutouts are used, in which case the sub-stacks may be formed of plies picked from other combinations of arrangements; or some sub-stacks may be formed of only one arrangement (e.g. if the last available arrangement comprises a bottom ply). As further shown, each sub-stacks may be further subdivided into the respective plies picked from each arrangement. In this way the respective set of pick and place instructions 11-14 and 15-18 may be calculated for each arrangement of cutouts 10, 20. Also the respective set of supply instructions 10; 15 may be determined, e.g. in between the instructions for each layout.

[0054] In some embodiments, the program instructions “Ip” cause the processor 105 to generate a respective set of cutting instructions “Ic”. In other or further embodiments, the program instructions “Ip” cause the processor 105 to transmit the respective set of cutting instructions “Ic” to a cutting system 104, e.g. causing the respective cutting of respective arrangements of cutouts 10, 20 according to the predetermined layout sequence “01”.

[0055] In some embodiments, the respective set of cutting instructions “Ic” include instructions for the specific set of shapes to be cut out of a respective sheet of material. Each set of shapes may form a respective arrangement of cutouts 10 and 20 and / or plies. While FIGs 1-3 illustrate the arrangement of cutouts 10 and 20 all consisting of the same shape, which is done for ease of understanding, it will be understood that, in general, each arrangement of cutouts may comprise different shapes, positions, and / or sizes; and / or different arrangements of cutouts may comprise different shapes, positions, and / or sizes. Furthermore, while FIGs 1-3 illustrate the arrangement of cutouts 10 and 20 being cut from different sheets, the arrangements may also be cut from a single continuous sheet. While FIGs 1- 3 illustrate each arrangement of cutouts 10 and 20 comprising four cutouts, and the product “P” being formed of only eight cutouts, it will be appreciated that in practice the number of cutouts in each arrangement may be variable and different between layouts; and the number of layers forming a laminated product “P” may be any number. Typically, a laminated product “P” or product kit “K”, e.g. formed according to the methods and systems described herein, may comprise at least ten layers, at least twenty layers, at least forty layers, up to one hundred layers, or more. Furthermore, the laminated product “P” of product kit “K” may be formed of different material layers and / or shapes. Furthermore, while the product kit “K” may comprise a stack “S” of plies arranged according to a predetermined stack sequence “Os”, the laminated product “P”, built from the product kit “K” may have the same sequence, or a different sequence. For example, the laminated product “P” may comprise reverse sequence of the product kit “K” when plies are picked consecutively from the product kit “K” onto a product stack. It can also be envisaged that some plies are picked from a respective stack of the product kit “K” and placed adjacent each other, and / or partially overlapping in the laminated product “P” and / or that plies forming one laminated product “P” are picked from multiple stacks of plies in a product kit “K”.

[0056] In some embodiments, the processor 105 is configured to predetermine a respective size and / or shape of each ply to be placed in a respective sub-stack, and reserve a target buffer area having an adjustable surface area and / or position based on a largest size and / or shape of all plies to be placed in the respective sub-stack. Advantageously, the respective set of pick and place instructions may thus be adapted to optimize usage of available buffer space. It may also be envisaged that the processor generates instructions favoring a smaller ply to be placed on top a larger ply, if possible. Also other or further optimizations may be envisaged.

[0057] In some embodiments, e.g. as illustrated in FIGs 8A and 8B, a respective arrangement of cutouts 10,20 comprises respective subsets of cutouts belonging to different products Pl, P2. In one embodiment, the first arrangement of cutouts 10 comprises a first subset of cutouts forming respective plies 1,2,4 for manufacturing a first laminated product “Pl” from a first ordered stack of plies 1,2, 3, 4, 5 arranged according to a predetermined first stack sequence. In another or further embodiment, the first arrangement of cutouts 10 comprises a second subset of cutouts forming respective plies l’,4’ for manufacturing a second laminated product “P2” from a second ordered stack of plies l’,2’,3’,4’,5’ arranged according to a predetermined second stack sequence.

[0058] In one embodiment, there are at least some non-consecutive plies 2,5 in the first arrangement of cutouts 10, which non-consecutive plies 2,5 have a respective at least one intermediate ply 3,4, according to the predetermined first stack sequence, in the second arrangement of cutouts 20. In another or further embodiment, there are at least some non- consecutive plies l’,4’ in the first arrangement of cutouts 10, which non- consecutive plies l’,4’ have a respective at least one intermediate ply 2’, 3’, according to the predetermined second stack sequence, in the second arrangement of cutouts 20. Of course it may also be the case to a respective arrangement of cutouts has only consecutive plies of one or more of the stack sequences; or that a respective arrangement of cutouts has no ply of one or more of the stack sequences. In one embodiment (not shown), the first arrangement of cutouts 10 may have some non-consecutive plies of the first stack and only consecutive plies of the second sequence; or no plies of the second subsequence.

[0059] In some embodiments, the processor 105 is configured to generate a first set of pick and place instructions for picking and placing plies from the first subset of cutouts onto a first set of sub-stacks, each forming a single sub-sequence of the predetermined first stack sequence; and a second set of pick and place instructions for picking and placing plies from the second subset of cutouts onto a second set of sub-stacks, each forming a single subsequence of the predetermined first second sequence. Preferably, the first set of sub-stacks is kept separate from the second set of sub-stacks, each set of sub-stacks occupying a respective set of buffer area. Advantageously, multiple products may thus be manufactured in parallel, possibly sharing one or more sheets of material to provide respective cutouts.

[0060] According to some aspects, the methods described herein may be executed by a corresponding system 100 configured to assemble a product kit “K”. In one embodiment, e.g. as shown in FIGs 4 and 5, the system 100 comprises a cutting system 104 configured to cut respective arrangements of cutouts 10,20 from a respective sheet of material disposed at a cutting zone Zl. In another or further embodiment, the system 100 comprises a supply system 101 is configured to consecutively supply the respective arrangements of cutouts 10,20, comprising respective subsets of the plies, to a picking zone Z2, separated from the cutting zone Zl by a barrier 10 Iw. In another or further embodiment, the system 100 comprises a buffer system 102 forming respective buffer areas B1,B2,B3. In another or further embodiment, the system 100 comprises a robotic device 103r and / or signaling device 103s configure to pick and place, or cause picking and placing, of plies from the picking zone Z2 onto the respective buffer areas B1,B2,B3 of the buffer system 102. In another or further embodiment, the system 100 comprises a processor 105 configured the generate and / or transmit instructions for the assembling of the product kit “K”.

[0061] According to other or further aspects, the methods and / or systems for assembling a product kit “K” may be followed by methods and / or systems for the manufacturing M of a laminated product P. In one embodiment, the manufacturing M comprises executing the instructions, e.g. generated by the processor 105, as described herein, to assemble a product kit K comprising an ordered stack S of plies 1,2, 3, 4, 5, 6, 7, 8. In another or further embodiment, the manufacturing M comprises retrieving the plies 1,2, 3, 4, 5, 6, 7, 8 from the stack S of the product kit K and placing the plies according to a stacked product arrangement. In another or further embodiment, the manufacturing M comprises laminating the plies in the stacked product arrangement together to form the laminated product P.

[0062] For the purpose of clarity and a concise description, features are described herein as part of the same or separate embodiments, however, it will be appreciated that the scope of the invention may include embodiments having combinations of all or some of the features described. In interpreting the appended claims, it should be understood that the word "comprising" does not exclude the presence of other elements or acts than those listed in a given claim; the word "a" or "an" preceding an element does not exclude the presence of a plurality of such elements; any reference signs in the claims do not limit their scope; several "means" may be represented by the same or different item(s) or implemented structure or function; any of the disclosed devices or portions thereof may be combined together or separated into further portions unless specifically stated otherwise.

Claims

CLAIMS1. A method of assembling a product kit (K), the product kit (K) comprising an ordered stack (S) of plies (1,2, 3, 4, 5, 6, 7, 8) arranged according to a predetermined stack sequence (Os) for manufacturing (M) a laminated product (P), wherein the plies are picked from consecutively available arrangements of cutouts (10,20) comprising at least a first arrangement of cutouts (10) and a second arrangement of cutouts (20), the method comprising: generating, by a processor (105), for each consecutively available arrangement of cutouts (10,20), a respective set of pick and place instructions (11-14, 15-18) for picking and placing each ply from the available arrangement of cutouts (10,20) onto a plurality of substacks (S1,S2,S3) occupying respective buffer areas (B1,B2,B3), wherein, for each consecutively available arrangement of cutouts (10,20), the respective set of pick and place instructions (11-14, 15- 18) is generated so that, at each time, each of the plurality of substacks (S1,S2,S3) is respectively formed by a single subsequence (01,02,03) of consecutive plies according to the predetermined stack sequence (Os).

2. The method according to the preceding claim, wherein there are at least some non-consecutive plies (2,4; 4,6) in the first arrangement of cutouts (10), which non-consecutive plies (2,4; 4,6) have a respective at least one intermediate ply (3,5), according to the predetermined stack sequence (Os), in the second arrangement of cutouts (20), and the respective at least one intermediate ply (3,5) from the second arrangement of cutouts (20) is positioned in the ordered stack (S) of plies (1,2, 3, 4, 5, 6, 7, 8) between said non-consecutive plies (2,4; 4,6)from the first arrangement of cutouts (10);3. The method according to any of the preceding claims, wherein, for each consecutively available arrangement of cutouts (10,20), the respective set of pick and place instructions (11-14, 15-18) is generated based on the condition that if, in the available arrangement of cutouts (10,20), there is a consecutive ply (2) that is consecutive, according to the predetermined stack sequence (Os), with any topside plie (1) of a matching sub-stack (Si), the consecutive ply (2) is placed onto the topside plie (1) of the matching sub-stack (Si), and otherwise, a non-consecutive ply (4) in the available arrangement of cutouts (10,20) is placed onto an empty buffer area (B2), creating a new sub-stack (S2),4. The method according to any of the preceding claims, further comprising generating, by the processor (201), a set of stack combining instructions (19,110) for combining a first sub-stack (Si) of the plurality of sub-stacks (S1,S2,S3), with a second sub-stack (S2) of the plurality of sub-stacks (S1,S2,S3) to form a combined sub-stack (S1+S2), wherein the combined sub-stack (S1+S2) consists of a single subsequence (O1+O2) of consecutive plies according to the predetermined stack sequence (Os), and wherein all sub-stacks (S1,S2,S3) are ultimately combined to form the stack (S) of plies (1,2, 3, 4, 5, 6, 7, 8) arranged according to the predetermined stack sequence (Os).

5. The method according to the preceding claim, wherein each of the stack combining instructions is generated to displace only an entire sub-stack ontop of another sub-stack.

6. The method according to any of the preceding claims, wherein the processor (105) is configured to predetermine a respective size and / or shape of each ply to be placed in a respective sub-stack, and reserve a target buffer area having an adjustable surface area and / or position based on a largest size and / or shape of all plies to be placed in the respective sub-stack.

7. The method according to any of the preceding claims, wherein the processor (105) is configured to generate a respective set of supply instructions (10; 15) for consecutively supplying the first arrangement of cutouts (10) and the second arrangement of cutouts (20); wherein the processor (105) is configured to transmit the respective set of supply instructions (10; 15) to a supply system (101), wherein the supply system (101) is configured to consecutively supply the arrangements of cutouts (10,20) to a picking zone (Z2) accessible to a robotic device (103r) and / or signaling device (103s).

8. The method according to any of the preceding claims, wherein the processor (105) is configured to cause consecutive execution of: a first supply instruction (10) for supplying the first arrangement of cutouts (10) to a picking zone (Z2); a first set of pick and place instructions (11,12,13,14) for picking each of the plies (1,2, 4, 6) from the first arrangement of cutouts (10) supplied at the picking zone (Z2); a second supply instruction (15) for supplying the second arrangement of cutouts (20) to the picking zone (Z2); and a second set of pick and place instructions (16,17,18,19) for picking each of the plies (3, 5, 7, 8) from the second arrangement of cutouts9. The method according to any of the preceding claims, wherein the first arrangement of cutouts (10) comprises a first subset of cutouts forming respective plies (1,2,4) for manufacturing a first laminated product (P 1) from a first ordered stack of plies (1,2, 3, 4, 5) arranged according to a predetermined first stack sequence; and a second subset of cutouts forming respective plies (l’,4’) for manufacturing a second laminated product (P2) from a second ordered stack of plies (l’,2’,3’,4’,5’) arranged according to a predetermined second stack sequence; wherein there are at least some non-consecutive plies (2,5) in the first arrangement of cutouts (10), which non-consecutive plies (2,5) have a respective at least one intermediate ply (3,4), according to the predetermined first stack sequence, in the second arrangement of cutouts (20); wherein the processor (105) is configured to generate a first set of pick and place instructions for picking and placing plies from the first subset of cutouts onto a first set of sub-stacks, each forming a single sub-sequence of the predetermined first stack sequence; and a second set of pick and place instructions for picking and placing plies from the second subset of cutouts onto a second set of sub-stacks, each forming a single subsequence of the predetermined first second sequence; wherein the first set of sub-stacks is kept separate from the second set of sub-stacks, each set of sub-stacks occupying a respective set of buffer area.

10. The method according to any of the preceding claims, wherein the processor (105) is configured to generate a respective set of cuttinginstructions (Ic) for cutting one or more sheets of material to form the respective arrangements of cutouts (10,20).

11. The method according to any of the preceding claims, wherein the processor (105) is configured to transmit the respective set of pick and place instructions (11-14, 15-18) to at least one of: a robotic device (103r) configured to execute the instructions; and a signaling device (103s) configured to output respective signals (L) for executing the instructions.

12. The method according to the preceding claim, wherein the signaling device (103s) comprises a light projector configured to project a first pattern of light (LI) onto a respective plie (1) of an available arrangement of cutouts (10,20), and project a second pattern of light (L2) onto a destination location for the respective plie.

13. A method of manufacturing (M) a laminated product (P), the method comprising executing the instructions generated by the processor (105) according to the method of any of the preceding claims, to assemble a product kit (K) comprising an ordered stack (S) of plies (1,2, 3, 4, 5, 6, 7, 8); retrieving the plies (1,2, 3, 4, 5, 6, 7, 8) from the stack (S) of the product kit (K) and placing the plies according to a stacked product arrangement; and laminating the plies in the stacked product arrangement together to form the laminated product (P).

14. A non-transitory computer-readable medium storing program instructions (Ip) that, when executed by one or more processors (105), cause the one or more processors (105) to perform the method according to any ofthe preceding claims.

15. A system (100) configured to assemble a product kit (K) according to the method of any of the preceding claims, the system (100) comprising a cutting system (104) configured to cut respective arrangements of cutouts (10,20) from a respective sheet of material disposed at a cutting zone (Z 1); a supply system (101) configured to consecutively supply the respective arrangements of cutouts (10,20), comprising respective subsets of the plies, to a picking zone (Z2), separated from the cutting zone (Zl) by a barrier (10 Iw); a buffer system (102) forming respective buffer areas (B1,B2,B3); and a robotic device (103r) and / or signaling device (103s) configure to pick and place, or cause picking and placing, of plies from the picking zone (Z2) onto the respective buffer areas (B1,B2,B3) of the buffer system (102); and a processor (105) configured the generate and / or transmit instructions for the assembling of the product kit (K).

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