Zero dead-leg orifice bypass

Abstract

A zero dead-leg orifice bypass apparatus includes a first multi-port valve, a second multi-port valve, and. a flow restrictor. The first multi-port valve includes a first plurality of valve legs with an inlet port. The second multi-port valve includes a second plurality of valve legs with an outlet port. The first plurality of valve legs and the second plurality of valve legs form at least one unrestricted path between the inlet port and the outlet port. The flow restrictor is pneumatically coupled to the first multi-port valve and the second multi-port, valve. The first plurality of valve legs and the second plurality of valve legs form at least one restricted path between the inlet port and the outlet port, with the at least one restricted path passing through a restricted port of the flow restrictor.

Description

ZERODEAD-LEGORIFICEBYPASSCLAIM OF PRIORITY

[0001] This application claims the benefit of priority to U.S. Patent Application Serial No.63 / 561,173, filed on March 4, 2024, which is incorporated by reference herein in its entirety. TECHNICAL FIELD

[0002] The subject matter disclosed herein generally relates to methods, systems, and machine-readable storage media for zero dead-leg orifice bypass configurations. BACKGROUND

[0003] Semiconductor substrate processing systems are used to process semiconductor substrates by techniques including etching, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma-enhanced chemical vapor deposition (PECVD), atomic layer deposition (ALD), plasma-enhanced atomic layer deposition (PEALD), pulsed deposition layer (PDL), plasma- enhanced pulsed deposition layer (PEPDL), and resist removal. One type of semiconductor substrate processing apparatus is a plasma processing apparatus using CCP that includes a vacuum chamber containing electrodes. A radio frequency (RF) power is applied between the electrodes to excite a process gas into plasma for processing semiconductor substrates in the reaction chamber. Another type of semiconductor substrate processing apparatus is an ICP plasma processing apparatus.

[0004] In semiconductor substrate processing systems, the delivery of fluids into the process chamber (e.g., process gas, purging gas, etc.) is often associated with restricted flow and “dead leg” zones, which increases the “green- to-green” time and reduces tool productivity.Attorney Docket No.4948.157WO1 -1- Client Ref. No.11403-1WO

[0005] The background description provided herein is to present the general context of the disclosure. It should be noted that the information described in this section is presented to provide the skilled artisan some context for the subject matter disclosed below and should not be considered as admitted prior art. More specifically, the work of the presently named inventor(s), to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. SUMMARY

[0006] Methods, systems, and computer programs are presented for zero dead-leg orifice bypass in a substrate processing system. One general aspect of the disclosure is a zero dead-leg orifice bypass apparatus, including a first multi- port valve comprising a first plurality of valve legs. The first plurality of valve legs includes an inlet port. The apparatus includes a second multi-port valve with a second plurality of valve legs. The second plurality of valve legs includes an outlet port. The first plurality of valve legs and the second plurality of valve legs form at least one unrestricted path between the inlet port and the outlet port. The apparatus includes a flow restrictor pneumatically coupled to the first multi-port valve and the second multi-port valve. The first plurality of valve legs and the second plurality of valve legs form at least one restricted path between the inlet port and the outlet port, with the at least one restricted path passing through a restricted port of the flow restrictor.

[0007] Another general aspect is a system that includes a gas source configured to generate process gas and a vacuum chamber with a processing zone. The vacuum chamber is configured to receive the process gas for a plasma-based process of a substrate. The system further includes a zero dead-leg orifice bypass pneumatically coupled to the gas source and the vacuum chamber. The zero dead- leg orifice bypass includes a first multi-port valve, a second multi-port valve, and a flow restrictor. The first multi-port valve includes a first plurality of valve legs. The first plurality of valve legs includes an inlet port pneumatically coupled to theAttorney Docket No.4948.157WO1 -2- Client Ref. No.11403-1WOgas source. The second multi-port valve includes a second plurality of valve legs. The second plurality of valve legs includes an outlet port pneumatically coupled to the vacuum chamber. The flow restrictor is pneumatically coupled to the first multi-port valve and the second multi-port valve. The system further includes a controller coupled to the zero dead-leg orifice bypass and the gas source. The controller is to activate a restricted path of the zero dead-leg orifice bypass during the plasma-based process. The restricted path includes the flow restrictor. The controller further causes the delivery of the process gas into the vacuum chamber via the restricted path.

[0008] Yet another general aspect includes a method for delivering fluid into a vacuum chamber. The method includes activating a restricted path of a zero dead-leg orifice bypass during a plasma-based process. The restricted path includes a first set of valve legs and a flow restrictor of the zero dead-leg orifice bypass. The method further includes causing the delivery of process gas from a gas source to a vacuum chamber via the restricted path. The vacuum chamber is pneumatically coupled to the zero dead-leg orifice bypass. The method further includes enabling the supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process. The method further includes causing delivery of the purge gas to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass. The unrestricted path includes a second set of valve legs of the zero dead-leg orifice bypass.

[0009] An additional general aspect includes a non-transitory machine- readable storage medium, including instructions that, when executed by a machine, cause the machine to perform operations to deliver fluid into a vacuum chamber. The operations include activating a restricted path of a zero dead-leg orifice bypass during a plasma-based process. The restricted path includes a first set of valve legs and a flow restrictor of the zero dead-leg orifice bypass. The operations further include causing delivery of process gas from a gas source to a vacuum chamber via the restricted path. The vacuum chamber is pneumatically coupled to the zero dead-leg orifice bypass. The operations further include enabling the supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process. The operations further include causing delivery ofAttorney Docket No.4948.157WO1 -3- Client Ref. No.11403-1WOthe purge gas to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass, the unrestricted path including a second set of valve legs of the zero dead-leg orifice bypass. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Various ones of the appended drawings merely illustrate example embodiments of the present disclosure and cannot be considered as limiting its scope.

[0011] FIG. 1 illustrates a reactor system with a vacuum chamber, such as a deposition chamber, for manufacturing substrates, according to some example embodiments.

[0012] FIG.2 is a block diagram of a zero dead-leg orifice bypass module used with the vacuum chamber of FIG. 1, according to some example embodiments.

[0013] FIG. 3A is a perspective view of a zero dead-leg orifice bypass module configured with two 3-port valves and a flow restrictor, according to some example embodiments.

[0014] FIG. 3B is a side view of the zero dead-leg orifice bypass module of FIG.3A, according to some example embodiments.

[0015] FIG. 4 is a perspective view of a zero dead-leg orifice bypass module configured with two 3-port valves, a flow restrictor, and a manifold, according to some example embodiments.

[0016] FIG.5 is a side view of the zero dead-leg orifice bypass module of FIG. 4, according to some example embodiments.

[0017] FIG.6 is a block diagram of a zero dead-leg orifice bypass module using 3-port valves arranged on opposite sides of a manifold, according to some example embodiments.

[0018] FIG.7 is a flowchart of a method for delivering fluid into a vacuum chamber, according to some example embodiments.Attorney Docket No.4948.157WO1 -4- Client Ref. No.11403-1WO

[0019] FIG. 8 is a block diagram illustrating an example of a machine upon which one or more example method embodiments may be implemented or by which one or more example embodiments may be controlled. DETAILED DESCRIPTION

[0020] Example methods, systems, and computer programs are directed to zero dead-leg orifice bypass in substrate manufacturing equipment. Examples merely typify possible variations. Unless explicitly stated otherwise, components and functions are optional and may be combined or subdivided, and operations may vary in sequence or be combined or subdivided. In the following description, numerous specific details are set forth to provide a thorough understanding of example embodiments. It will be evident to one skilled in the art, however, that the present subject matter may be practiced without these specific details.

[0021] As used herein, the term “dead leg” refers to a portion of a connection (e.g., a flow path) between a gas source and a process chamber which portion is not used to transfer fluid for a preconfigured time but is in proximity to the fluid during the transfer. The dead leg can also be referred to as a volume within the fluid delivery line that does not get flushed during a purging process. The term “plasma-based process” can comprise a deposition process, an etch process, or a multi-step process (e.g., a deposition process followed by an etch process).

[0022] In substrate processing systems, a restrictor (orifice) is used to stabilize the flow of fluids to deliver specific hazardous low-vapor pressure semiconductor deposition precursors consistently. This process flow can be approximately about 1 standard liter per minute (slm) or less. In order to maintain the processing system, the gas flow paths (e.g., the gas lines) are opened to the atmosphere. This requires that the hazardous materials be flushed (purged) from the lines before they are opened, and then after they are resealed, they can be purged of moisture and other contaminants. Since there is an orifice restriction in the purge path, the length of time for purges / flushes can be excessive (e.g., 12-24Attorney Docket No.4948.157WO1 -5- Client Ref. No.11403-1WOhours). This dramatically increases the “green-to-green” time and reduces tool productivity.

[0023] The disclosed techniques can be used to configure a zero dead-leg orifice bypass module using a set of valves (e.g., multi-port valves such as 3-port valves) and at least one gas manifold (e.g., including a flow restrictor) that allows a restricted flow of gases and vapors for wafer processing use, with no “dead-legs” in the flow path. A volume that does not get flushed (e.g., a dead leg) can accumulate particles or reactants in the unflushed areas that may be released later, contaminating wafers and leading to wafer scrap and lost productivity. However, the disclosed zero dead-leg orifice bypass module can be efficiently flushed by opening the valves, thus providing the ability to perform high-flow flushes / purges. The disclosed techniques provide both zero dead-leg and high flush capability in a single subsystem, which yields faster tool “green-to-green” time and increases tool productivity.

[0024] A general description of a vacuum chamber using the disclosed zero dead-leg orifice bypass module is provided in connection with FIG. 1. Additional configurations of a zero dead-leg orifice bypass module are discussed in connection with FIG. 2 - FIG. 7. An example machine upon which one or more example method embodiments may be implemented is discussed in connection with FIG. 8.

[0025] FIG. 1 illustrates a reactor system with a vacuum chamber, such as a deposition chamber, for manufacturing substrates, according to some example embodiments. As illustrated in FIG. 1, a reactor system 100 includes a process chamber 136 that encloses other components of the reactor system 100 and serves to contain plasma generated by a capacitive-discharge type system, including a showerhead 108 working in conjunction with a grounded heater block 132. A high-frequency (HF) radio frequency (RF) HFRF generator 102 and a low- frequency (LF) radio frequency (RF) LFRF generator 104 are connected to a matching network 106 and the showerhead 108. The power and frequency supplied by the matching network 106 may be sufficient to generate plasma from process gases supplied to process chamber 136. In a typical process, the HFRFAttorney Docket No.4948.157WO1 -6- Client Ref. No.11403-1WOcomponent may generally be between 5 MHz to 60 MHz, e.g., 13.56 MHz. In operations where there is an LF component, the LF component may be from about 100 kHz to 2 MHz, e.g., 430 kHz.

[0026] Within the process chamber 136, a pedestal 130 supports a substrate (e.g., wafer 128). The pedestal 130 includes a chuck, a fork (not shown), or lift pins (not shown) to hold and transfer the wafer 128 into and out of process chamber 136 between operations. The chuck may be an electrostatic chuck, a mechanical chuck, or various other types of chuck that are available for use in the industry and for research.

[0027] Various process gases may be introduced via inlet 124. Multiple source gas lines (e.g., gas line 118, gas line 120) are connected to a manifold 122. The gases may or may not be premixed. Corresponding valving and mass flow control (MFC) mechanisms (e.g., valve 110, valve 116) may be employed to ensure that the correct process gases are delivered during the deposition and plasma treatment phases of each operation in the process. In the case where a chemical precursor(s) is delivered in liquid form, liquid flow control mechanisms may be employed. Such liquids may then be vaporized and mixed with process gases during transportation in a manifold heated above the vaporization point of the chemical precursor supplied in liquid form before reaching process chamber 136.

[0028] A dispenser 114 connects to the inlet 124. The dispenser 114 dispenses chemicals such as TMA, zinc, magnesium, or fluorine contained in a vial 126 that is coupled to the dispenser 114. In one example embodiment, the precursor in the vial 126 includes chemicals (e.g., TMA) that coat an interior wall of the process chamber 136. These coatings prevent diffusion and release of substrate materials (e.g., aluminum), prevent chemical attack (e.g., fluorine), provide desired electrical properties, or repair damage to the surface (e.g., from in situ cleans.

[0029] Process gases may exit process chamber 136 via outlet 112. A vacuum pump 134 (e.g., a one or two-stage mechanical dry pump and turbomolecular pump) may be used to draw process gases out of the processAttorney Docket No.4948.157WO1 -7- Client Ref. No.11403-1WOchamber 136 and to maintain a suitably low pressure within the process chamber 136 by using a closed-loop-controlled flow restriction device (not shown), such as a throttle valve or a pendulum valve.

[0030] As discussed above, the techniques for deposition discussed herein may be implemented on a multi-station or single-station tool. In some implementations, tools for processing 450 mm wafers may be used. In various implementations, the wafers may be indexed after every deposition process or can be indexed after etching steps if the etching chambers or stations are also part of the same tool, or multiple depositions and treatments may be conducted at a single station before indexing the wafer. In some implementations, the wafers may be indexed after each layer is deposited, such as after an underlayer is deposited or after an atomically smooth layer is deposited.

[0031] In some embodiments, an apparatus may be provided that is configured to perform the techniques described herein. A suitable apparatus may include hardware for performing various process operations as well as a system controller 138 having instructions for controlling process operations in accordance with the disclosed embodiments. The system controller 138 includes one or more memory devices and one or more processors communicatively connected with various process control equipment, e.g., valves, RF generators, wafer handling systems, etc., and configured to execute the instructions so that the apparatus will perform a technique in accordance with the disclosed embodiments. Machine- readable media containing instructions for controlling process operations in accordance with the present disclosure may be coupled to the system controller 138. The system controller 138 may be communicatively connected with various hardware devices, e.g., dispenser 114, mass flow controllers, valves, RF generators, vacuum pumps, etc., to facilitate control of the various process parameters that are associated with the deposition operations as described herein.

[0032] In some embodiments, the system controller 138 controls all of the activities of the reactor system 100. The system controller 138 may execute system control software stored in a mass storage device, loaded into a memory device, and executed on a processor. Alternatively, the control logic may be hardAttorney Docket No.4948.157WO1 -8- Client Ref. No.11403-1WOcoded in the system controller 138. Applications Specific Integrated Circuits, Programmable Logic Devices (e.g., field-programmable gate arrays, or FPGAs), and the like may be used for these purposes. In the following discussion, wherever "software" or "code" is used, functionally comparable hard-coded logic may be used in its place. The system control software may include instructions for controlling the timing of dispensing chemicals from the vial 126, the timing of gas flows, wafer movement, RF generator activation, etc., as well as instructions for controlling the mixture of gases, the chamber and / or station pressure, the chamber and / or station temperature, the wafer temperature, the target power levels, the RF power levels, the substrate pedestal, chuck, and / or susceptor position, and other parameters of a particular process performed by the reactor system 100. The system control software may be configured in any suitable way. For example, various process tool component subroutines or control objects may be written to control the operation of the process tool components necessary to carry out various process tool processes. The system control software may be coded in any suitable computer-readable programming language.

[0033] The system controller 138 may typically include one or more memory devices and one or more processors configured to execute the instructions so that the apparatus will perform a technique in accordance with the present disclosure. Machine-readable media containing instructions for controlling process operations in accordance with disclosed embodiments may be coupled to the system controller 138.

[0034] The method and apparatus described herein may be used in conjunction with lithographic patterning tools or processes, such as the fabrication or manufacture of semiconductor devices, displays, LEDs, photovoltaic panels, and the like. Typically, though not necessarily, such tools / processes will be used or conducted together in a common fabrication facility. Lithographic patterning of a film typically includes some or all of the following steps, each step performed with a number of possible tools: (1) application of photoresist on a workpiece (e.g., substrate or multi-layer stack as provided in disclosed embodiments), using a spin-on or spray-on tool; (2) curing a photoresist using a hot plate or furnace or UV curing tool; (3) exposing the photoresist to visible or UV or x-ray light with aAttorney Docket No.4948.157WO1 -9- Client Ref. No.11403-1WOtool such as a wafer stepper; (4) developing the resist so as to selectively remove the resist and thereby pattern it using a tool such as a wet bench; (5) transferred the resist pattern into an underlying film or workpiece, such as an amorphous carbon underlayer, by using a dry or plasma-assisted etching tool; and (6) removing the resist using a tool such as an RF or microwave plasma resist stripper.

[0035] In some embodiments, the reactor system 100 further includes a zero dead-leg orifice bypass module (or OBM) 123. In some aspects, OBM 123 can be configured along one or more fluid connections (e.g., process gas and / or purge gas connections) between the manifold 122 and the process chamber 136. Even though FIG. 1 illustrates a single OBM 123, the disclosure is not limited in this regard, and additional OBMs can be used at different locations along the inlet 124. Additional configurations of the OBM 123 are discussed in connection with FIGS.2-7.

[0036] FIG.2 is a block diagram of a zero dead-leg orifice bypass module used with the vacuum chamber of FIG. 1, according to some example embodiments. Referring to FIG. 2, the zero dead-leg orifice bypass module of FIG. 1 (e.g., OBM 123) includes a plurality of multi-port valves, such as a first multi-port valve 202 and a second multi-port valve 204. The OBM 123 further includes a flow restrictor 206.

[0037] In some embodiments, the first multi-port valve 202 and the second multi-port valve 204 are 3-port valves (e.g., as illustrated in the various embodiments of FIGS. 3A-6). Even though FIGS. 3A-6 illustrate 3-port valves, the disclosure is not limited in this regard and valves with a different number of ports may be used as well.

[0038] FIG.3A is a perspective view 300 of a zero dead-leg orifice bypass module (e.g., OBM 123) configured with two 3-port valves and a flow restrictor, according to some example embodiments. Referring to FIG. 3A, OBM 123 includes the first multi-port valve 202, the second multi-port valve 204, and the flow restrictor 206.

[0039] In some aspects, the first multi-port valve 202 includes valve legs 304, 306, and 308, with each leg having one of its openings fluidly connected toAttorney Docket No.4948.157WO1 -10- Client Ref. No.11403-1WOannulus 302. The first multi-port valve 202 also includes a diaphragm 303 (or membrane) configured to open or close the opening of valve leg 306. In this regard, when diaphragm 303 is closed, fluid can pass between the inlet port 301 of valve leg 304 and valve leg 308 via the annulus 302. When the diaphragm 303 is open, fluid can pass between valve legs 304, 306, and 308 via the annulus 302.

[0040] In some aspects, the second multi-port valve 204 includes valve legs 312, 314, and 316, with each leg having one of its openings fluidly connected to annulus 310. The second multi-port valve 204 also includes a diaphragm 311 (or membrane) configured to open or close the opening of valve leg 314. In this regard, when diaphragm 311 is closed, fluid can pass between valve leg 312, valve leg 316, and outlet port 317 via the annulus 310. When the diaphragm 311 is open, fluid can pass between valve legs 312, 314, and 316 via the annulus 310.

[0041] FIG. 3B is a side view 320 of the zero dead-leg orifice bypass module of FIG.3A, according to some example embodiments. Referring to FIG. 3B, flow restrictor 206 may include a restriction on one of its ports associated with a passageway through the flow restrictor. For example, flow restrictor 206 includes a restriction 319 on passageway 318, which restriction is close to an opening of valve leg 308.

[0042] In some aspects, during an example operation, diaphragms 303 and 311 are closed. Process gas then flows from the inlet port 301 of valve leg 304 to annulus 302, to valve leg 308, through restriction 319 on passageway 318, through valve leg 312, through annulus 310, and outlet port 317 of valve leg 316.

[0043] In an example purge (or flush) operation (e.g., when a faster purge is desired), diaphragms 303 and 311 can be opened. Valve legs 306 and 314 can be connected via a separate passageway (e.g., as illustrated in FIG. 5). In this regard, the purge gas can flow in an unrestricted path formed between the inlet port 301, valve leg 304, annulus 302, valve legs 306 and 314, annulus 310, and outlet port 317 of valve leg 316.

[0044] In this regard, OBM 123 includes no unflushed volumes in the flow path for process operation (i.e., there are no “dead legs” during the flow of process gas between the inlet and outlet ports). To perform a flush or a purge operation,Attorney Docket No.4948.157WO1 -11- Client Ref. No.11403-1WOthe two valves are opened (e.g., diaphragms 303 and 311 are opened) so that gas can flow from valve leg 306 of the first multi-port valve 202 to valve leg 314 of the second multi-port valve 204 without restriction. The unrestricted flow can be higher (e.g., 30 slm or more) than through the orifice with the restriction 319. This configuration leads to significantly reduced flush / purge times (e.g., 1 / 3 or less than without the bypass using the unrestricted path). This configuration also reduces the green-to-green time and thus raises tool productivity.

[0045] In some embodiments, the open and closed state of diaphragms 303 and 311 can be controlled by the system controller 138. Additionally, the system controller 138 can control the extent (e.g., size) of restriction 319.

[0046] FIG. 4 is a perspective view 400 of the OBM 123 as configured with two 3-port valves (e.g., multi-port valves 202 and 204), a flow restrictor 206, and a manifold 402, according to some example embodiments.

[0047] FIG. 5 is a side view 500 of the zero dead-leg orifice bypass module of FIG. 4, according to some example embodiments.

[0048] Referring to FIG. 4 and FIG. 5, flow restrictor 206 can be configured between the first multi-port valve 202 and the manifold 402. The manifold 402 can be configured with passageways that are pneumatically connected to corresponding valve legs of multi-port valves 202 and 204. For example, manifold 402 includes passageway 502 (e.g., connecting inlet port 501 with valve leg 304), passageway 504 (e.g., connecting valve legs 308 and 312), passageway 508 (e.g., connecting valve legs 306 and 314), and passageway 506 (e.g., connecting valve leg 316 with outlet port 507).

[0049] In some aspects, flow restrictor 206 includes the restriction 319 configured at valve leg 308. In some embodiments, flow restrictor 206 can be configured between the second multi-port valve 204 and the manifold 402 (in which case, the restriction 319 can be configured at valve leg 312).

[0050] In some aspects, multi-port valves 202 and 204 can be arranged on the same side of manifold 402 (e.g., as illustrated in FIG.4 and FIG.5). However,Attorney Docket No.4948.157WO1 -12- Client Ref. No.11403-1WOthe disclosure is not limited in this regard, and other arrangements are possible as well (e.g., as illustrated in FIG. 6).

[0051] FIG. 6 is a block diagram 600 of a zero dead-leg orifice bypass module using 3-port valves arranged on opposite sides of a manifold, according to some example embodiments. Referring to FIG. 6, in some embodiments, multi-port valves 202 and 204 are arranged on opposite sides of manifold 402.

[0052] FIG. 7 is a flowchart of method 700 for delivering fluid into a vacuum chamber, according to some example embodiments. Method 700 includes operations 702, 704, 706, and 708, which may be performed by a controller (e.g., system controller 138 of FIG. 1) or a processor (e.g., processor 802 of FIG. 8).

[0053] Referring to FIG. 7, at operation 702, a restricted path of a zero dead-leg orifice bypass is activated during a plasma-based process. For example, the restricted path of OBM 123 in FIGS. 3A-5 includes a first set of valve legs (e.g., valve legs 304, 308, 312, and 316) and a flow restrictor (e.g., flow restrictor 206) of the zero dead-leg orifice bypass.

[0054] At operation 704, the process gas is delivered from a gas source (e.g., manifold 122) to a vacuum chamber (e.g., process chamber 136) via the restricted path. The vacuum chamber can be pneumatically coupled to the zero dead-leg orifice bypass.

[0055] At operation 706, the supply of purge gas is enabled from the gas source to the zero dead-leg orifice bypass during a purge process.

[0056] At operation 708, the purge gas is delivered to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass. For example, the unrestricted path can be enabled by opening both diaphragms 303 and 311 and includes a second set of valve legs of the zero dead-leg orifice bypass (e.g., the unrestricted path can include valve legs 304, 306, 314, and 316).

[0057] FIG.8 is a block diagram illustrating an example of a machine 800 upon or by which one or more example process embodiments described herein may be implemented or controlled. In alternative embodiments, the machine 800Attorney Docket No.4948.157WO1 -13- Client Ref. No.11403-1WOmay operate as a standalone device or may be connected (e.g., networked) to other machines. In a networked deployment, the machine 800 may operate in the capacity of a server machine, a client machine, or both in server-client network environments. In an example, machine 800 may act as a peer machine in a peer- to-peer (P2P) (or other distributed) network environment. Further, while only a single machine 800 is illustrated, the term “machine” shall also be taken to include any collection of machines that individually or jointly execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein, such as via cloud computing, software as a service (SaaS), or other computer cluster configurations.

[0058] Examples, as described herein, may include, or may operate by, logic, several components, or mechanisms. Circuitry is a collection of circuits implemented in tangible entities that include hardware (e.g., simple circuits, gates, logic). Circuitry membership may be flexible over time and underlying hardware variability. Circuitries include members that may, alone or in combination, perform specified operations when operating. In an example, the hardware of the circuitry may be immutably designed to carry out a specific operation (e.g., hardwired). In an example, the hardware of the circuitry may include variably connected physical components (e.g., execution units, transistors, simple circuits), including a computer-readable medium physically modified (e.g., magnetically, electrically, by the moveable placement of invariant massed particles) to encode instructions of the specific operation. In connecting the physical components, the underlying electrical properties of a hardware constituent are changed (for example, from an insulator to a conductor or vice versa). The instructions enable embedded hardware (e.g., the execution units or a loading mechanism) to create members of the circuitry in hardware via the variable connections to carry out portions of the specific operation when in operation. Accordingly, the computer- readable medium is communicatively coupled to the other components of the circuitry when the device is operating. In some aspects, any of the physical components may be used in more than one member of more than one circuitry. For example, under operation, execution units may be used in a first circuit of aAttorney Docket No.4948.157WO1 -14- Client Ref. No.11403-1WOfirst circuitry at one point in time and reused by a second circuit in the first circuitry or by a third circuit in a second circuitry at a different time.

[0059] The machine (e.g., computer system) 800 may include a hardware processor 802 (e.g., a central processing unit (CPU), a hardware processor core, or any combination thereof), a graphics processing unit (GPU) 803, a main memory 804, and a static memory 806, some or all of which may communicate with each other via an interlink (e.g., bus) 808. The machine 800 may further include a display device 810, an alphanumeric input device 812 (e.g., a keyboard), and a user interface (UI) navigation device 814 (e.g., a mouse). In an example, the display device 810, alphanumeric input device 812, and UI navigation device 814 may be a touch screen display. The machine 800 may additionally include a mass storage device (e.g., drive unit) 816, a signal generation device 818 (e.g., a speaker), a network interface device 820, and one or more sensors 821, such as a Global Positioning System (GPS) sensor, compass, accelerometer, or another sensor. The machine 800 may include an output controller 828, such as a serial (e.g., universal serial bus (USB)), parallel, or other wired or wireless (e.g., infrared (IR), near field communication (NFC)) connection to communicate with or control one or more peripheral devices (e.g., a printer, card reader).

[0060] In an example embodiment, the hardware processor 802 may perform the functionalities of the system controller 138 discussed hereinabove in connection with at least FIG. 1 - FIG.7.

[0061] The mass storage device 816 may include a machine-readable medium 822 on which is stored one or more sets of data structures or instructions 824 (e.g., software) embodying or utilized by any one or more of the techniques or functions described herein. The instructions 824 may also reside, completely or at least partially, within the main memory 804, within the static memory 806, within the hardware processor 802, or the GPU 803 during execution thereof by the machine 800. In an example, one or any combination of the hardware processor 802, the GPU 803, the main memory 804, the static memory 806, or the mass storage device 816 may constitute machine-readable media.Attorney Docket No.4948.157WO1 -15- Client Ref. No.11403-1WO

[0062] While the machine-readable medium 822 is illustrated as a single medium, the term “machine-readable medium” may include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) configured to store the instructions 824.

[0063] The term “machine-readable medium” may include any medium that is capable of storing, encoding, or carrying instructions 824 for execution by machine 800 and that causes machine 800 to perform any one or more of the techniques of the present disclosure, or that is capable of storing, encoding, or carrying data structures used by or associated with such instructions 824. Non- limiting machine-readable medium examples may include solid-state memories and optical and magnetic media. In an example, a massed machine-readable medium comprises a machine-readable medium 822 with a plurality of particles having invariant (e.g., rest) mass. Accordingly, massed machine-readable media are not transitory propagating signals. Specific examples of massed machine- readable media may include non-volatile memory, such as semiconductor memory devices (e.g., Electrically Programmable Read-Only Memory (EPROM), Electrically Erasable Programmable Read-Only Memory (EEPROM)) and flash memory devices; magnetic disks, such as internal hard disks and removable disks; magneto-optical disks; and CD-ROM and DVD-ROM disks.

[0064] The instructions 824 may further be transmitted or received over a communications network 826 using a transmission medium via the network interface device 820.

[0065] Implementation of the preceding techniques may be accomplished through any number of specifications, configurations, or example deployments of hardware and software. It should be understood that the functional units or capabilities described in this specification may have been referred to or labeled as components or modules to emphasize their implementation independence more particularly. Any number of software or hardware forms may embody such components. For example, a component or module may be implemented as a hardware circuit comprising custom very-large-scale integration (VLSI) circuits or gate arrays, off-the-shelf semiconductors such as logic chips, transistors, orAttorney Docket No.4948.157WO1 -16- Client Ref. No.11403-1WOother discrete components. A component or module may also be implemented in programmable hardware devices such as field-programmable gate arrays, programmable array logic, programmable logic devices, or the like. Components or modules may also be implemented in software for execution by various types of processors. An identified component or module of executable code may, for instance, comprise one or more physical or logical blocks of computer instructions, which may, for instance, be organized as an object, procedure, or function. Nevertheless, the executables of an identified component or module need not be physically located together but may comprise disparate instructions stored in different locations, which, when joined logically together, comprise the component or module and achieve the stated purpose for the component or module.

[0066] Indeed, a component or module of executable code may be a single instruction or many instructions and may even be distributed over several different code segments, among different programs, and across several memory devices or processing systems. In particular, some aspects of the described process (such as code rewriting and code analysis) may take place on a different processing system (e.g., in a computer in a data center) than that in which the code is deployed (e.g., in a computer embedded in a sensor or robot). Similarly, operational data may be identified and illustrated herein within components or modules and may be embodied in any suitable form and organized within any suitable type of data structure. The operational data may be collected as a single data set or may be distributed over different locations, including over different storage devices, and may exist, at least partially, merely as electronic signals on a system or network. The components or modules may be passive or active, including agents operable to perform desired functions.

[0067] Additional Notes and Examples of the Disclosed Subject Matter

[0068] Example 1 is a zero dead-leg orifice bypass apparatus comprising a first multi-port valve comprising a first plurality of valve legs, the first plurality of valve legs including an inlet port, a second multi-port valve comprising a second plurality of valve legs, the second plurality of valve legs including an outletAttorney Docket No.4948.157WO1 -17- Client Ref. No.11403-1WOport, the first plurality of valve legs and the second plurality of valve legs forming at least one unrestricted path between the inlet port and the outlet port; and a flow restrictor pneumatically coupled to the first multi-port valve and the second multi- port valve, the first plurality of valve legs and the second plurality of valve legs forming at least one restricted path between the inlet port and the outlet port, and the at least one restricted path passing through a restricted port of the flow restrictor.

[0069] In Example 2, the subject matter of Example 1 includes subject matter where at least a first valve leg of the first plurality of valve legs and at least a first valve leg of the second plurality of valve legs are shared between the restricted path and the unrestricted path.

[0070] In Example 3, the subject matter of Example 2 includes subject matter where at least a second valve leg of the first plurality of valve legs and at least a second valve leg of the second plurality of valve legs are associated with the unrestricted path without being associated with the restricted path.

[0071] In Example 4, the subject matter of Examples 1–3 includes a manifold pneumatically coupled to the flow restrictor and the second multi-port valve.

[0072] In Example 5, the subject matter of Example 4 includes subject matter where the manifold further comprises a first set of passageways associated with the unrestricted path and a second set of passageways associated with the restricted path.

[0073] In Example 6, the subject matter of Example 5 includes subject matter where one or more passageways of the first set of passageways are included in the second set of passageways.

[0074] In Example 7, the subject matter of Examples 4–6 includes subject matter where the flow restrictor and the second multi-port valve are pneumatically coupled to the same surface of the manifold.Attorney Docket No.4948.157WO1 -18- Client Ref. No.11403-1WO

[0075] In Example 8, the subject matter of Examples 4–7 includes subject matter where the flow restrictor and the second multi-port valve are pneumatically coupled to opposite surfaces of the manifold.

[0076] In Example 9, the subject matter of Examples 1–8 includes subject matter where the first multi-port valve further comprises a first annulus and a first diaphragm disposed within the first annulus.

[0077] In Example 10, the subject matter of Example 9 includes subject matter where the second multi-port valve further comprises a second annulus and a second diaphragm disposed within the second annulus.

[0078] In Example 11, the subject matter of Example 10 includes subject matter where when the first diaphragm and the second diaphragm are in a closed state: the first diaphragm covers at least one of the first plurality of valve legs. The second diaphragm covers at least one of the second plurality of valve legs, causing fluid to flow between the inlet port and the outlet port via the restricted path.

[0079] In Example 12, the subject matter of Example 11 includes the subject matter where when the first diaphragm and the second diaphragm are in an open state: the first diaphragm opens a first passageway through the at least one of the first plurality of valve legs, and the second diaphragm opens a second passageway through the at least one of the second plurality of valve legs, causing fluid to flow between the inlet port and the outlet port via the unrestricted path, wherein the unrestricted path includes the first passageway and the second passageway.

[0080] Example 13 is a substrate processing system comprising: a gas source configured to generate process gas; a vacuum chamber comprising a processing zone, the vacuum chamber configured to receive the process gas for a plasma-based process of a substrate; a zero dead-leg orifice bypass pneumatically coupled to the gas source and the vacuum chamber, the zero dead-leg orifice bypass comprising: a first multi-port valve comprising a first plurality of valve legs, the first plurality of valve legs including an inlet port pneumatically coupled to the gas source; a second multi-port valve comprising a second plurality of valveAttorney Docket No.4948.157WO1 -19- Client Ref. No.11403-1WOlegs, the second plurality of valve legs including an outlet port pneumatically coupled to the vacuum chamber; and a flow restrictor pneumatically coupled to the first multi-port valve and the second multi-port valve; and a controller coupled to the zero dead-leg orifice bypass and the gas source, the controller to: activate a restricted path of the zero dead-leg orifice bypass during the plasma-based process, the restricted path including the flow restrictor; and cause delivery of the process gas into the vacuum chamber via the restricted path.

[0081] In Example 14, the subject matter of Example 13 includes subject matter where the first multi-port valve further comprises a first annulus and a first diaphragm disposed within the first annulus.

[0082] In Example 15, the subject matter of Example 14 includes subject matter where the second multi-port valve further comprises a second annulus and a second diaphragm disposed within the second annulus.

[0083] In Example 16, the subject matter of Example 15 includes the subject matter of where to activate the restricted path; the controller is to configure the first diaphragm and the second diaphragm in a closed state, causing fluid to flow between the inlet port and the outlet port via the restricted path.

[0084] In Example 17, the subject matter of Example 16 includes subject matter where the closed state causes the first diaphragm to cover at least one of the first plurality of valve legs and the second diaphragm to cover at least one of the second plurality of valve legs.

[0085] In Example 18, the subject matter of Examples 16–17 includes subject matter where the controller is to enable the supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process.

[0086] In Example 19, the subject matter of Example 18 includes subject matter where the controller is to configure the first diaphragm and the second diaphragm in an open state during the purge process, causing the purge gas to flow between the inlet port and the outlet port via an unrestricted path.

[0087] Example 20 is a method for delivering fluid into a vacuum chamber, the method comprising activating a restricted path of a zero dead-legAttorney Docket No.4948.157WO1 -20- Client Ref. No.11403-1WOorifice bypass during a plasma-based process, the restricted path including a first set of valve legs and a flow restrictor of the zero dead-leg orifice bypass; causing delivery of process gas from a gas source to a vacuum chamber via the restricted path, the vacuum chamber pneumatically coupled to the zero dead-leg orifice bypass; enabling supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process; and causing delivery of the purge gas to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass, the unrestricted path including a second set of valve legs of the zero dead-leg orifice bypass.

[0088] In Example 21, the subject matter of Example 20 includes configuring at least one diaphragm of the zero dead-leg orifice bypass in a closed state, causing the delivery of the process gas via the restricted path.

[0089] In Example 22, the subject matter of Example 21 includes configuring at least one diaphragm of the zero dead-leg orifice bypass in an open state, causing the delivery of the purge gas via the unrestricted path.

[0090] Example 23 is a non-transitory machine-readable storage medium including instructions that, when executed by a machine, cause the machine to perform operations for delivering fluid into a vacuum chamber, the operations comprising activating a restricted path of a zero dead-leg orifice bypass during a plasma-based process, the restricted path including a first set of valve legs and a flow restrictor of the zero dead-leg orifice bypass; causing delivery of process gas from a gas source to a vacuum chamber via the restricted path, the vacuum chamber pneumatically coupled to the zero dead-leg orifice bypass; enabling supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process; and causing delivery of the purge gas to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass, the unrestricted path including a second set of valve legs of the zero dead-leg orifice bypass.

[0091] In Example 24, the subject matter of Example 23 includes the operations further comprising configuring at least one diaphragm of the zero dead- leg orifice bypass in a closed state, causing the delivery of the process gas via the restricted path.Attorney Docket No.4948.157WO1 -21- Client Ref. No.11403-1WO

[0092] In Example 25, the subject matter of Example 24 includes the operations further comprising configuring the at least one diaphragm of the zero dead-leg orifice bypass in an open state, causing the delivery of the purge gas via the unrestricted path.

[0093] Example 26 is at least one machine-readable medium including instructions that, when executed by processing circuitry, cause the processing circuitry to perform operations to implement any of Examples 1–25.

[0094] Example 27 is an apparatus comprising means to implement any of Examples 1–25.

[0095] Example 28 is a system to implement any of Examples 1–25.

[0096] Example 29 is a method to implement any of Examples 1–25.

[0097] Throughout this specification, plural instances may implement components, operations, or structures described as a single instance. Although individual operations of one or more methods are illustrated and described as separate operations, one or more of the individual operations may be performed concurrently, and nothing requires that the operations be performed in the order illustrated. Structures and functionality are presented as separate components. For example, configurations may be implemented as a combined structure or component. Similarly, structures and functionality presented as a single component may be implemented as separate components. These and other variations, modifications, additions, and improvements fall within the scope of the subject matter herein.

[0098] The embodiments illustrated herein are described in sufficient detail to enable those skilled in the art to practice the teachings disclosed. Other embodiments may be used and derived therefrom, such that structural and logical substitutions and changes may be made without departing from the scope of this disclosure. The Detailed Description, therefore, is not to be taken in a limiting sense, and the scope of various embodiments is defined only by the appended claims, along with the full range of equivalents to which such claims are entitled.Attorney Docket No.4948.157WO1 -22- Client Ref. No.11403-1WO

[0099] The claims may not set forth every feature disclosed herein as embodiments may feature a subset of said features. Further, embodiments may include fewer features than those disclosed in a particular example. Thus, the following claims are hereby incorporated into the Detailed Description, with a claim standing on its own as a separate embodiment.

[0100] As used herein, the term “or” may be construed in either an inclusive or exclusive sense. Moreover, plural instances may be provided for resources, operations, or structures described herein as a single instance. Additionally, boundaries between various resources, operations, modules, engines, and data stores are somewhat arbitrary, and particular operations are illustrated in the context of specific illustrative configurations. Other allocations of functionality are envisioned and may fall within the scope of various embodiments of the present disclosure. In general, structures and functionality presented as separate resources in the example configurations may be implemented as a combined structure or resource. Similarly, structures and functionality presented as a single resource may be implemented as separate resources. These and other variations, modifications, additions, and improvements fall within a scope of embodiments of the present disclosure as represented by the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.Attorney Docket No.4948.157WO1 -23- Client Ref. No.11403-1WO

Claims

CLAIMS What is claimed is:

1. A zero dead-leg orifice bypass apparatus comprising: a first multi-port valve comprising a first plurality of valve legs, the first plurality of valve legs including an inlet port; a second multi-port valve comprising a second plurality of valve legs, the second plurality of valve legs including an outlet port, the first plurality of valve legs and the second plurality of valve legs forming an unrestricted path between the inlet port and the outlet port; and a flow restrictor pneumatically coupled to the first multi-port valve and the second multi-port valve, the first plurality of valve legs and the second plurality of valve legs forming a restricted path between the inlet port and the outlet port, and the restricted path passing through a restricted port of the flow restrictor.

2. The zero dead-leg orifice bypass apparatus of claim 1, wherein at least a first valve leg of the first plurality of valve legs and at least a first valve leg of the second plurality of valve legs are common between the restricted path and the unrestricted path.

3. The zero dead-leg orifice bypass apparatus of claim 2, wherein at least a second valve leg of the first plurality of valve legs and at least a second valve leg of the second plurality of valve legs are associated with the unrestricted path, without being associated with the restricted path.Attorney Docket No.4948.157WO1 -24- Client Ref. No.11403-1WO4. The zero dead-leg orifice bypass apparatus of claim 1, further comprising: a manifold pneumatically coupled to the flow restrictor and the second multi-port valve.

5. The zero dead-leg orifice bypass apparatus of claim 4, wherein the manifold further comprises: a first set of passageways associated with the unrestricted path; and a second set of passageways associated with the restricted path.

6. The zero dead-leg orifice bypass apparatus of claim 5, wherein one or more passageways of the first set of passageways are included in the second set of passageways.

7. The zero dead-leg orifice bypass apparatus of claim 4, wherein the flow restrictor and the second multi-port valve are pneumatically coupled to a same surface of the manifold.

8. The zero dead-leg orifice bypass apparatus of claim 4, wherein the flow restrictor and the second multi-port valve are pneumatically coupled to opposite surfaces of the manifold.

9. The zero dead-leg orifice bypass apparatus of claim 1, wherein the first multi-port valve further comprises: a first annulus; and a first diaphragm disposed within the first annulus.Attorney Docket No.4948.157WO1 -25- Client Ref. No.11403-1WO10. The zero dead-leg orifice bypass apparatus of claim 9, wherein the second multi-port valve further comprises: a second annulus; and a second diaphragm disposed within the second annulus.

11. The zero dead-leg orifice bypass apparatus of claim 10, wherein when the first diaphragm and the second diaphragm are in a closed state: the first diaphragm covers at least one of the first plurality of valve legs; and the second diaphragm covers at least one of the second plurality of valve legs, causing fluid to flow between the inlet port and the outlet port via the restricted path.

12. The zero dead-leg orifice bypass apparatus of claim 11, wherein when the first diaphragm and the second diaphragm are in an open state: the first diaphragm opens a first passageway through the at least one of the first plurality of valve legs; and the second diaphragm opens a second passageway through the at least one of the second plurality of valve legs, causing fluid to flow between the inlet port and the outlet port via the unrestricted path, wherein the unrestricted path includes the first passageway and the second passageway.

13. A substrate processing system comprising: a gas source configured to generate process gas; a vacuum chamber comprising a processing zone, the vacuum chamber configured to receive the process gas for a plasma-based process of a substrate; a zero dead-leg orifice bypass pneumatically coupled to the gas source and the vacuum chamber, the zero dead-leg orifice bypass comprising:Attorney Docket No.4948.157WO1 -26- Client Ref. No.11403-1WOa first multi-port valve comprising a first plurality of valve legs, the first plurality of valve legs including an inlet port pneumatically coupled to the gas source; a second multi-port valve comprising a second plurality of valve legs, the second plurality of valve legs including an outlet port pneumatically coupled to the vacuum chamber; and a flow restrictor pneumatically coupled to the first multi-port valve and the second multi-port valve; and a controller coupled to the zero dead-leg orifice bypass and the gas source, the controller to: activate a restricted path of the zero dead-leg orifice bypass during the plasma-based process, the restricted path including the flow restrictor; and cause delivery of the process gas into the vacuum chamber via the restricted path.

14. The substrate processing system of claim 13, wherein the first multi-port valve further comprises a first annulus and a first diaphragm disposed within the first annulus, and wherein the second multi-port valve further comprises a second annulus and a second diaphragm disposed within the second annulus.

15. The substrate processing system of claim 14, wherein to activate the restricted path, the controller is to: configure the first diaphragm and the second diaphragm in a closed state, causing fluid to flow between the inlet port and the outlet port via the restricted path; and enable supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process.Attorney Docket No.4948.157WO1 -27- Client Ref. No.11403-1WO16. The substrate processing system of claim 15, wherein the closed state causes the first diaphragm to cover at least one of the first plurality of valve legs and the second diaphragm to cover at least one of the second plurality of valve legs.

17. The substrate processing system of claim 15, wherein the controller is to: configure the first diaphragm and the second diaphragm in an open state during the purge process, causing the purge gas to flow between the inlet port and the outlet port via an unrestricted path.

18. A method for delivering fluid into a vacuum chamber, the method comprising: activating a restricted path of a zero dead-leg orifice bypass during a plasma-based process, the restricted path including a first set of valve legs and a flow restrictor of the zero dead-leg orifice bypass; causing delivery of process gas from a gas source to a vacuum chamber via the restricted path, the vacuum chamber pneumatically coupled to the zero dead-leg orifice bypass; enabling supply of purge gas from the gas source to the zero dead-leg orifice bypass during a purge process; and causing delivery of the purge gas to the vacuum chamber via an unrestricted path of the zero dead-leg orifice bypass, the unrestricted path including a second set of valve legs of the zero dead-leg orifice bypass.

19. The method of claim 18, further comprising: configuring at least one diaphragm of the zero dead-leg orifice bypass in a closed state, causing the delivery of the process gas via the restricted path.Attorney Docket No.4948.157WO1 -28- Client Ref. No.11403-1WO20. The method of claim 19, further comprising: configuring the at least one diaphragm of the zero dead-leg orifice bypass in an open state, causing the delivery of the purge gas via the unrestricted path.Attorney Docket No.4948.157WO1 -29- Client Ref. No.11403-1WO

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