Integrated processor module, server and assembly method for integrated processor module

Abstract

The present application relates to the technical field of server devices. Disclosed are an integrated processor module, a server and an assembly method for an integrated processor module. The integrated processor module comprises a support body; a first limiting member, rotatably installed on the support body, the first limiting member and a second side frame limiting processor components in a first direction; and a second limiting member, rotatably installed on the support body, the second limiting member and a back plate limiting the processor components in a second direction, the second direction being perpendicular to the first direction, and the second direction being parallel to the direction in which the processor components enter and exit a chamber. By means of mounting heat dissipation components on processor components, the integrated processor module provided by the present application improves heat dissipation of the processor components, and also partially reduces the noise environment impacts on maintenance personnel, thus improving the heat dissipation performance of the processor components without increasing user's experience of noise, and reducing vibrations generated by newly-added heat dissipation components, so as to reduce impacts on entire servers.

Description

Processor integrated module, server, and processor integrated module assembly method

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to a Chinese patent application filed with the Patent Office of China on March 15, 2024, with application number 202410302149.9 and entitled “A Processor Integrated Module, Server and Processor Integrated Module Assembly Method,” the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present application relates to the technical field of server equipment, and in particular to a processor integrated module, a server, and a method for assembling the processor integrated module. Background Art

[0004] Currently, in server chassis, the fan module is usually placed between the hard disk module and the front CPU (Central Processing Unit). As the power supported by the server increases, the CPU needs to dissipate more and more heat, which causes the air inlet temperature of the GPU (Graphics Processing Unit) to become higher and higher. At the same time, because the GPU module is close to the rear window of the chassis, the GPU module is far away from the fan module in the front of the chassis and is subject to relatively small wind pressure, which makes the heat dissipation conditions of the GPU module even worse.

[0005] In the related art, in order to improve the heat dissipation effect of the GPU module, the fan module speed is generally increased to provide a greater wind pressure. However, a higher speed will lead to increased noise, which not only affects the user experience, but also easily causes the hard disk head in the hard disk module to shift, the reading and writing efficiency to decrease, and write errors to cause write errors, resulting in sector failure and even the hard disk being scrapped. Alternatively, in order to reduce noise, the related art uses sound-absorbing cotton to be attached to the path between the hard disk module and the fan module in the chassis, or uses a honeycomb mesh to be added to the air inlet of the fan module. However, the above operations will lead to increased costs and have little effect on reducing noise.

[0006] Therefore, how to reduce noise while meeting the heat dissipation requirements of the GPU module is a technical problem that those skilled in the art currently need to solve. Summary of the Invention

[0007] The purpose of this application is to provide a processor integrated module, a server and a processor integrated module assembly method, which can effectively reduce the noise and vibration effects generated by the heat dissipation components, while meeting the heat dissipation requirements of the processor components and achieving firm positioning of the processor components.

[0008] To achieve the above objectives, this application provides the following technical solutions:

[0009] According to the first aspect, the present application provides a processor integrated module, comprising: a bracket body, the bracket body comprising a backplate, and a first side frame and a second side frame arranged opposite to each other, the backplate, the first side frame and the second side frame forming a chamber; and a support portion for placing a processor assembly is provided on the bracket body located in the chamber, and the processor assembly has a heat dissipation component; a first limiting member, rotatably mounted on the bracket body, the first limiting member and the second side frame limit the processor assembly along a first direction; a second limiting member, rotatably mounted on the bracket body, the second limiting member and the backplate limit the processor assembly along a second direction, the second direction being perpendicular to the first direction, and the second direction being parallel to the direction in which the processor assembly enters and exits the chamber.

[0010] In one embodiment, it also includes: a first locking member, used to lock or unlock the first limiting member and the first side frame; one side of the first limiting member is hinged to the first side frame or the back panel, and the other end is connected to the first locking member, the first locking member is movably installed on the first side frame, and when the first locking member is unlocked, the first limiting member can swing relative to the first side frame; a second locking member, used to lock or unlock the second limiting member and the second side frame; one side of the second limiting member is hinged to the second side frame or the back panel, and the other end is connected to the second locking member, the second locking member is movably installed on the second side frame, and when the second locking member is unlocked, the second limiting member can swing relative to the second side frame.

[0011] In one embodiment, the first locking member is a threaded fastener, and a threaded hole is provided on the first side frame. The threaded fastener can be assembled into the threaded hole and fastened; the second locking member includes a slider and a locking edge, the locking edge is located at the movable end of the second limiting member, and the slider is set on the second side frame. When the second limiting member is close to the second side frame, the slider can slide to the locking edge and engage to lock the position of the second limiting member.

[0012] In one embodiment, the support portion includes a plurality of first slides located on the inner wall of the first side frame, and a plurality of second slides located on the inner wall of the second side frame. The first slides are arranged parallel to the second slides, and the two ends of the processor assembly along the first direction slide along the first slides and the second slides respectively to enter and exit the chamber.

[0013] In one embodiment, the movable end of the first limiting member is further provided with a limiting edge, and a limiting groove is provided inside the limiting edge. The limiting groove is used for the corners of the processor component to be placed therein to limit the processor component in the first direction and the second direction.

[0014] In one embodiment, a notch is provided on the side of the first side frame facing away from the back plate, and the rotation of the first limiting member can rotate the limiting edge to the notch, so that the limiting groove in the limiting edge is connected to the first slideway.

[0015] In one embodiment, it further includes at least two handles for holding, a groove is provided on the bracket body, the handle is arc-shaped, and a rotating shaft is provided at both ends of the handle. The handle is installed in the groove through the rotating shaft and can be rotated to extend out of the groove.

[0016] In one embodiment, it also includes: a first rotating shaft, one side of the first limiting member is rotatably connected to the first rotating shaft, and the other side can be rotated relative to the first rotating shaft and opened toward the outside of the first side frame, and the side of the first limiting member away from the first rotating shaft is detachably connected to the first side frame; a second rotating shaft, one side of the second limiting member is rotatably connected to the second rotating shaft, and the other side can be rotated relative to the second rotating shaft and opened toward the outside of the second side frame, and the side of the second limiting member away from the second rotating shaft is detachably connected to the second side frame; the bracket body also includes a top plate, the top plate is perpendicular to the back plate, and the first side frame is connected to the top plate and the back plate. One end, the second side frame is connected to the other end of the top plate and the back plate; the first rotating shaft is located on the connecting edge of the first side frame and the top plate, or the first rotating shaft is located on the connecting edge of the first side frame and the back plate, and the extension direction of the first rotating shaft is parallel to the plane where the first side frame is located; the second rotating shaft is located at the corner of the second side frame away from the top plate and the back plate, and the extension direction of the second rotating shaft is perpendicular to the plane where the second side frame is located; the first rotating shaft is also provided with a first angle limiting portion for limiting the maximum rotation angle of the first limiting member, and the second rotating shaft is also provided with a second angle limiting portion for limiting the maximum rotation angle of the second limiting member.

[0017] In one embodiment, a third locking member is further included. A locking edge is provided on the side of the first limit member facing away from the first side frame. The locking edge can be suspended on the surface of the air duct of the server or inserted into the shell of the air duct. The third locking member is arranged on the locking edge and can be fastened to the air duct.

[0018] In one embodiment, a plurality of reinforcing ribs are provided between the locking edge and the first limiting member, and ventilation channels are provided between adjacent reinforcing ribs to allow gas to flow from the outside of the first limiting member into the interior of the cavity of the bracket body.

[0019] In one embodiment, the processor assembly includes: a processor body; a heat dissipation component for dissipating heat for the processor body; a heat dissipation mounting frame, the heat dissipation mounting frame is arranged at one end of the processor body along the first direction, and the heat dissipation component is detachably arranged on the heat dissipation mounting frame.

[0020] In one embodiment, the heat dissipation mounting frame is installed at the first end of the processor body along the first direction, the heat dissipation mounting frame is connected to the first side frame, the second end of the processor body along the first direction is connected to the second side frame, and a plurality of ventilation slots are provided on the first side frame.

[0021] In one embodiment, the heat dissipation mounting bracket includes an extension piece and a heat dissipation limit piece, and a heat dissipation space for placing the heat dissipation component is provided between the heat dissipation limit piece and the extension piece; the extension piece is connected to the processor body, and the heat dissipation limit piece and the extension piece are detachably connected; and a support edge is provided on the edge of the extension piece facing away from the processor body, and the support edge is cooperatively connected with the support portion in the bracket body.

[0022] In one embodiment, both ends of the heat dissipation component are provided with heat dissipation fixing holes, the extension piece and the heat dissipation limit piece are provided with mounting frame fixing holes, and the heat dissipation fixing holes and the mounting frame fixing holes are detachably connected through heat dissipation fixing pieces.

[0023] In one embodiment, a shock-absorbing pad is also included, and the heat dissipation fixing member includes a fixing member body, a first fixing column and a second fixing column. The first fixing column is connected to the heat dissipation fixing hole by interference fit, and the shock-absorbing pad wraps the fixing member body and the second fixing column, and the position of the shock-absorbing pad close to the second fixing column is connected to the fixing hole of the mounting frame by interference fit.

[0024] In one embodiment, it also includes: an in-place detection component for detecting whether the processor assembly is installed in place in the chamber; a warning component, connected to the in-place detection component, for issuing a warning signal after the processor assembly is installed in place; a power mechanism, for driving the movement of the first limit member and the movement of the second limit member; a controller, connected to the warning component, for controlling the first limit member to rotate to fit with the first side frame and controlling the second limit member to rotate to fit with the second side frame after receiving the warning signal.

[0025] According to the second aspect, the present application also provides a server comprising any one of the processor integrated modules described above.

[0026] According to the third aspect, the present application also provides a method for assembling a processor integrated module, comprising the following steps: Step S1: Rotate the first limit member and the second limit member so that the first limit member and the second limit member are away from the cavity; Step S2: Place the processor assembly into the cavity of the bracket body; Step S3: When the processor assembly is installed in place, lock the first limit member on the first side frame so that the first limit member and the second side frame limit the processor assembly along the first direction; lock the second limit member on the second side frame so that the second limit member and the back panel limit the processor assembly along the second direction.

[0027] The beneficial effects of the present application are that: the provided processor integrated module is surrounded by a back plate, a first side frame and a second side frame to form a cavity for placing the processor component, and in order to facilitate the placement of the processor component, a support portion is provided inside the bracket body in the cavity. When the processor component needs to be installed, the processor component can be placed directly on the support portion or pushed into the cavity along the support portion. When the processor component needs to be removed, the reverse operation can be performed. In order to achieve the heat dissipation effect of the processor component, a heat dissipation component is provided on the processor component, and the processor component is directly cooled by the heat dissipation component without increasing the speed of the fan module to achieve the purpose of cooling the processor component. Since the heat dissipation component is directly installed on the processor component, the heat dissipation effect of the heat dissipation component on the processor component is more direct and effective, and the speed and wind pressure of the heat dissipation component do not need to be too large to meet the heat dissipation requirements of the processor component. Therefore, by providing a heat dissipation component on the processor component, the impact of high noise on the user can be effectively avoided.

[0028] In the present application, by setting the first limiting member and the second limiting member, the first limiting member and the second side frame are used to limit the processor assembly along the first direction, and the second limiting member and the back plate are used to limit the processor assembly along the second direction, thereby achieving all-round limitation of the processor assembly in different directions and reducing the noise and vibration effects caused by the installation of heat dissipation components; at the same time, in the process of locking the first limiting member and the first side frame, the first limiting member will press the processor assembly against the second side frame, thereby achieving limitation and fixation of the processor assembly in the first direction.

[0029] Similarly, in the process of locking the second limit member and the second side frame, the second limit member will press the processor assembly against the back panel, or press the processor assembly against the support portion, thereby limiting and fixing the processor assembly in the second direction, thereby effectively reducing the vibration and noise problems caused by the installation of the heat dissipation component, and at the same time, reducing the risk of the processor assembly shaking or falling in the chamber.

[0030] The processor integrated module provided in the present application increases the air inlet pressure of the processor assembly in a more targeted manner by installing a heat dissipation component on the processor assembly, thereby improving the heat dissipation of the processor assembly. There is no need to increase the rotation speed of the fan module in the front of the server chassis as a whole, thereby reducing the impact of the fan noise at high speed on the hard disk transmission performance, thereby reducing the use of noise reduction measures, and also partially reducing the noise environment impact of operation and maintenance personnel. While improving the heat dissipation performance of the processor assembly, it does not increase the user's experience of noise perception, and at the same time reduces the vibration generated by the newly added heat dissipation components, thereby reducing the impact on the entire server.

[0031] The server provided in this application is provided with the above-mentioned processor integrated module. Since the processor integrated module has the above-mentioned technical effects, the server provided with the processor integrated module should also have the corresponding technical effects.

[0032] The processor integrated module assembly method provided in the present application avoids the processor component by rotating the first limit member and the second limit member, thereby facilitating the installation of the processor component into the cavity of the bracket body, and after the processor component is installed in place, the first limit member is rotated to tighten one end of the processor component in the first direction to achieve the limitation of the processor component in the first direction, and the second limit member is rotated to tighten one side of the processor component in the second direction to achieve the limitation of the processor component in the second direction, and then the first limit member is locked on the first side frame and the second limit member is locked on the second side frame to complete the assembly process of the processor integrated module and achieve multi-angle fixation of the processor component, thereby effectively reducing the noise and vibration effects caused by the setting of the heat dissipation component on the processor component, and reducing the impact on user experience on the premise of meeting the heat dissipation requirements of the processor component. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or related technologies, the following briefly introduces the drawings required for use in the embodiments or related technical descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0034] FIG1 is a schematic structural diagram of a specific embodiment of a processor integrated module provided by the present application;

[0035] FIG2 is an exploded view of the processor integrated module shown in FIG1 ;

[0036] FIG3 is a schematic diagram of a bracket module in a processor integrated module provided by the present application;

[0037] FIG4 is an enlarged schematic diagram of structure A in the bracket module shown in FIG3 ;

[0038] FIG5 is an enlarged schematic diagram of structure B in the bracket module shown in FIG3;

[0039] FIG6 is a schematic diagram of a bracket module in a processor integrated module provided by the present application from another perspective;

[0040] FIG7 is an enlarged schematic diagram of the C structure in the bracket module shown in FIG6;

[0041] FIG8 is a schematic diagram of the structure of the processor component in the processor integrated module provided by the present application;

[0042] FIG9 is an exploded view of the processor assembly shown in FIG8 ;

[0043] FIG10 is a schematic structural diagram of a heat dissipation component in the processor assembly shown in FIG8 ;

[0044] FIG11 is a schematic structural diagram of an extension member in the processor assembly shown in FIG8 ;

[0045] FIG12 is a schematic structural diagram of a heat dissipation limiter in the processor assembly shown in FIG8 ;

[0046] FIG13 is a schematic structural diagram of a heat dissipation fixture in the processor assembly shown in FIG8 ;

[0047] FIG14 is a cross-sectional view of the heat dissipation fixing member shown in FIG13;

[0048] FIG15 is a schematic diagram of the server layout provided by this application;

[0049] Figure 16 is a schematic diagram of the server cover provided by this application;

[0050] FIG17 is a top view of the server provided in this application with the cover opened;

[0051] FIG18 is a flow chart of a specific implementation of the processor integrated module assembly method provided in this application.

[0052] Reference numerals: 10 - processor integrated module; 20 - hard disk module; 30 - fan module; 40 - front air guide cover; 50 - rear air guide cover; 60 - chassis base; 70 - power supply module; 80 - chassis cover; 90 - CPU; 1 - bracket body; 11 - back plate; 12 - first side frame; 121 - first slide; 122 - notch; 13 - second side frame; 131 - second slide; 14 - top plate; 141 - handle; 15 - first locking member; 16 - second locking member; 161 - slider; 162 - locking edge; 17 - first rotating shaft; 18 - second rotating shaft; 19 - third locking member; 2 - first limiting member; 21 - limiting edge; 211 - limiting groove; 22-locking edge; 23-reinforcement rib; 3-second limiter; 4-processor assembly; 41-processor body; 42-heat dissipation component; 421-heat dissipation fixing hole; 43-heat dissipation mounting bracket; 431-extension member; 4311-support edge; 4312-assembly hole; 432-heat dissipation limiter; 4321-threaded fastener; 433-heat dissipation fixing member; 4331-fixing member body; 4332-first fixing column; 4333-second fixing column; 434-shock-absorbing pad; 435-mounting bracket fixing hole; 5-adapter card. DETAILED DESCRIPTION

[0053] The core of this application is to provide a processor integrated module, a server and a processor integrated module assembly method, which can reduce noise and reduce the impact of vibration.

[0054] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0055] Please refer to Figures 1 and 2. In this embodiment, the processor integrated module 10 includes: a bracket body 1, the bracket body 1 includes a backplate 11, and a first side frame 12 and a second side frame 13 arranged opposite to each other, the backplate 11, the first side frame 12 and the second side frame 13 surround to form a chamber; and a support portion for placing the processor component 4 is provided on the bracket body 1 in the chamber, and the processor component 4 has a heat dissipation component 42; a first limiting member 2, which can be rotatably mounted on the bracket body 1, and the first limiting member 2 and the second side frame 13 limit the processor component 4 along a first direction; a second limiting member 3, which can be rotatably mounted on the bracket body 1, and the second limiting member 3 and the backplate 11 limit the processor component 4 along a second direction, the second direction is perpendicular to the first direction, and the second direction is parallel to the direction in which the processor component 4 enters and exits the chamber.

[0056] The processor integrated module 10 includes a bracket module, which includes a bracket body 1, a first limiting member 2 and a second limiting member 3. Through the setting of the bracket body 1, the first side frame 12 and the second side frame 13 are respectively located at the two ends of the back plate 11 along the first direction. The back plate 11, the first side frame 12 and the second side frame 13 are used to surround a chamber for placing the processor component 4. In addition, in order to facilitate the placement of the processor component 4, a support portion is provided in the interior of the bracket body 1 in the chamber. When the processor component 4 needs to be installed, the processor component 4 can be placed directly on the support portion or pushed into the chamber along the support portion. When the processor component 4 needs to be removed, the reverse operation can be performed. Specifically, the support portion is arranged on the first side frame 12 and the second side frame 13, and is specifically arranged on the side opposite to the first side frame 12 and the second side frame 13. The purpose is to support the processor component 4 in the first direction. Support is provided at both ends. Since the size of the processor component 4 in the first direction is large, by supporting the processor component 4 at both ends in the first direction, on the one hand, the installation efficiency of the processor component 4 can be improved, and on the other hand, the stability of the processor component 4 in the length direction can be ensured; in order to achieve the heat dissipation effect of the processor component 4, a heat dissipation component 42 is provided on the processor component 4, and the heat dissipation component 42 is used to directly cool the processor component 4, and the purpose of cooling the processor component 4 can be achieved without increasing the rotation speed of the fan module 30. Since the heat dissipation component 42 is directly installed on the processor component 4, the heat dissipation effect of the heat dissipation component 42 on the processor component 4 is more direct and effective, and the rotation speed and wind pressure of the heat dissipation component 42 do not need to be too large to achieve the heat dissipation requirements of the processor component 4. Therefore, by providing the heat dissipation component 42 on the processor component 4, the impact of high noise on the user can be effectively avoided.

[0057] In the present application, by setting the first limiting member 2 and the second limiting member 3, the first limiting member 2 and the second side frame 13 are used to limit the processor assembly 4 along the first direction, and the second limiting member 3 and the back plate 11 are used to limit the processor assembly 4 along the second direction, thereby achieving all-round limitation of the processor assembly 4 in different directions, reducing the noise and vibration effects caused by the installation of the heat dissipation component 42; at the same time, in the process of locking the first limiting member 2 and the first side frame 12, the first limiting member 2 will press the processor assembly 4 against the second side frame 13, thereby achieving limitation and fixation of the processor assembly 4 in the first direction.

[0058] Similarly, in the process of locking the second limit member 3 and the second side frame 13, the second limit member 3 will press the processor component 4 against the back plate 11, or press the processor component 4 against the support part, thereby achieving the limitation and fixation of the processor component 4 in the second direction, thereby effectively reducing the vibration and noise problems caused by the installation of the heat dissipation component 42, and at the same time, reducing the risk of the processor component 4 shaking or falling in the chamber.

[0059] The processor integrated module 10 provided in the present application increases the air inlet pressure of the processor component 4 in a more targeted manner by installing a heat dissipation component 42 on the processor component 4, thereby improving the heat dissipation of the processor component 4. There is no need to increase the rotation speed of the fan module 30 in the front of the server chassis as a whole, thereby reducing the impact of the fan noise at high speed on the hard disk transmission performance, thereby reducing the use of noise reduction measures, and also partially reducing the noise environment impact of operation and maintenance personnel. While improving the heat dissipation performance of the processor component 4, it does not increase the user's experience of noise perception, and at the same time reduces the vibration generated by the newly added heat dissipation component 42, thereby reducing the impact on the entire server.

[0060] In some embodiments, please refer to FIG4 , further comprising: a first locking member 15 for locking or unlocking the first limiting member 2 and the first side frame 12; one side of the first limiting member 2 is hinged to the first side frame 12 or the back panel 11, and the other end is connected to the first locking member 15; the first locking member 15 is movably mounted on the first side frame 12, and when the first locking member 15 is unlocked, the first limiting member 2 can swing relative to the first side frame 12. Specifically, the function of the first locking member 15 is to fix the relative position of the first limiting member 2 and the first side frame 12, thereby achieving the fastening of the processor assembly 4 in the first direction; of course, in some cases, the first locking member 15 may not be provided. For example, an elastic structure may be provided on the first limiting member 2. After the first limiting member 2 is opened and the installation of the processor assembly 4 is completed, the first limiting member 2 can be driven to remain in the locked state by an elastic reset method.

[0061] In some embodiments, please refer to Figure 5, further comprising: a second locking member 16 for locking or unlocking the second limiting member 3 and the second side frame 13; one side of the second limiting member 3 is hinged to the second side frame 13 or the back panel 11, and the other end is connected to the second locking member 16. The second locking member 16 is movably mounted on the second side frame 13, and when the second locking member 16 is unlocked, the second limiting member 3 can swing relative to the second side frame 13. Similarly, the function of the second locking member 16 is to fix the relative position of the second limiting member 3 and the second side frame 13, thereby achieving the fastening of the processor assembly 4 in the second direction; of course, in some cases, the second locking member 16 may not be provided. For example, an elastic structure may be provided on the second limiting member 3. After the second limiting member 3 is opened and the installation of the processor assembly 4 is completed, the second limiting member 3 can be driven to remain in the locked state by an elastic reset method.

[0062] In some embodiments, please refer to Figure 4, the first locking member 15 is a threaded fastener 4321, and a threaded hole is provided on the first side frame 12. The threaded fastener 4321 can be assembled into the threaded hole and fastened; specifically, when the processor component 4 needs to be installed, the threaded fastener 4321 is loosened, and after the threaded fastener 4321 is separated from the first side frame 12, the first limiting member 2 can be rotated. After the processor component 4 is installed, the first limiting member 2 is rotated in the opposite direction until the first limiting member 2 is in contact with the first side frame 12. At this time, the threaded fastener 4321 can be tightened in the threaded hole of the first side frame 12; specifically, before the first locking member 15 takes effect, the first limiting member 2 has already contacted the processor component 4. During the locking process of the first locking member 15, further pressure will be generated on the first limiting member 2, thereby pressing the processor component 4 to ensure the stability of the processor component 4 and reduce noise and vibration.

[0063] In some embodiments, please refer to Figure 5, the second locking member 16 includes a slider 161 and a locking edge 162, the locking edge 162 is located at the movable end of the second limiting member 3, and the slider 161 is set on the second side frame 13. When the second limiting member 3 is close to the second side frame 13, the slider 161 can slide to the locking edge 162 and engage to lock the position of the second limiting member 3. Specifically, when the processor component 4 needs to be installed, the slider 161 is pushed. After the slider 161 is separated from the second limit member 3, the second limit member 3 can be rotated. After the processor component 4 is installed, the second limit member 3 is rotated in the opposite direction until the second limit member 3 is in contact with the second side frame 13. At this time, the slider 161 can be slid to the position of the lock edge 162 again; specifically, before the second locking member 16 takes effect, the second limit member 3 has already contacted the processor component 4. During the locking process of the second locking member 16, further pressure will be generated on the second limit member 3, thereby pressing the processor component 4 to ensure the stability of the processor component 4 and reduce noise and vibration.

[0064] In some embodiments, a first magnetic locking member is provided on the first limiting member 2, and a first magnetic component is provided on the first side frame 12, and the first magnetic component can adsorb the first magnetic locking member; when the first limiting member 2 is opened, the magnetic force between the first magnetic component and the first magnetic locking member is weakened, and when the first limiting member 2 needs to be closed, the first limiting member 2 can be quickly attached to the first side frame 12 under the adsorption action of the first magnetic component and the first magnetic locking member to achieve locking, which can effectively improve assembly efficiency. Of course, the first magnetic locking member can be used as a power source for the rotation of the first limiting member 2, and can also be used as a locking member. Since the locking effect of magnetic attraction is limited, it can be used in conjunction with the first locking member 15 when combined with the first magnetic locking member, for example, in conjunction with the threaded fastener 4321, to perform structural locking, further improving the stability of the processor assembly 4 in the first direction.

[0065] In some embodiments, a second magnetic locking member is provided on the second limiting member 3, and a second magnetic component is provided on the second side frame 13, and the second magnetic component can adsorb the second magnetic locking member; when the second limiting member 3 is opened, the magnetic force between the second magnetic component and the second magnetic locking member is weakened. When the second limiting member 3 needs to be closed, the second limiting member 3 can be quickly attached to the second side frame 13 under the adsorption action of the second magnetic component and the second magnetic locking member to achieve locking, which can effectively improve assembly efficiency. Of course, the second magnetic locking member can be used as a power source for the rotation of the second limiting member 3, and can also be used as a locking member. Since the locking effect of magnetic attraction is limited, it can be used in conjunction with the second locking member 16 when combined with the second magnetic locking member, such as in conjunction with the slider 161 and the lock edge 162, to perform structural locking, further improving the stability of the processor assembly 4 in the second direction.

[0066] In some embodiments, referring to FIG5 and FIG7 , the support portion includes a plurality of first slides 121 located on the inner wall of the first side frame 12, and a plurality of second slides 131 located on the inner wall of the second side frame 13. The first slides 121 are arranged parallel to the second slides 131, and the two ends of the processor assembly 4 along the first direction slide along the first slides 121 and the second slides 131 respectively to enter and exit the chamber. Specifically, the provision of the first slides 121 and the second slides 131 can facilitate the entry and exit of the processor assembly 4, and the assembly efficiency is high; specifically, the number of the first slides 121 and the second slides 131 can be multiple, and the number of the first slides 121 and the second slides 131 is the same and corresponds one to one; the number of the first slides 121 and the second slides 131 determines the number of processor assemblies 4 that can be placed, and can be set as needed.

[0067] In some embodiments, please refer to Figure 7, the movable end of the first limiting member 2 is further provided with a limiting edge 21, and a limiting groove 211 is provided inside the limiting edge 21. The limiting groove 211 is used for the corners of the processor component 4 to be placed, so as to limit the processor component 4 in the first direction and the second direction. The limiting groove 211 can limit the corners of the processor component 4, for example, the bracket in the processor component 4, in the up and down directions, and limit the processor component 4 along the outside of the second direction. With this arrangement, even if the length of the processor component 4 along the first direction is large, the setting of the limiting edge 21 and the limiting groove 211 can prevent the processor component 4 from approaching one end of the first side frame 12 and escaping along the second direction, further ensuring the limitation of the processor component 4 at various positions. Specifically, the number of limiting edges 21 is the same as the number of first slides 121 and corresponds one to one, so as to achieve the limitation of each processor component 4.

[0068] In some embodiments, referring to FIG7 , a notch 122 is provided on a side of the first side frame 12 facing away from the back plate 11. Rotation of the first limiting member 2 can cause the limiting edge 21 to rotate toward the notch 122, thereby connecting the limiting groove 211 within the limiting edge 21 to the first slide 121. Specifically, when the limiting groove 211 within the limiting portion is connected to the first slide 121, the first limiting member 2 and the first side frame 12 can be locked. The provision of the notch 122 can reduce the area of ​​the first side frame 12. The notch 122 can also achieve a ventilation effect, facilitating heat dissipation of the processor assembly 4.

[0069] In some embodiments, please refer to Figure 3, which also includes at least two handles 141 for holding. The handles 141 are used for lifting, plugging and unplugging the entire processor integrated module 10. A groove is provided on the bracket body 1, and the handle 141 is arc-shaped. There are rotating shafts at both ends of the handle 141. The handle 141 is installed in the groove through the rotating shaft and can be rotated to extend out of the groove; specifically, when the handle 141 is in use, it is rotated to be perpendicular to the groove, and when the handle 141 is not in use, it is placed in the groove; in one embodiment, an anti-slip portion is provided on the handle 141 to facilitate the user's grip and increase friction.

[0070] In some embodiments, please refer to Figures 4 and 5, further comprising: a first rotating shaft 17, one side of the first limiting member 2 is rotatably connected to the first rotating shaft 17, and the other side can be rotated relative to the first rotating shaft 17 and opened toward the outside of the first side frame 12, and the side of the first limiting member 2 away from the first rotating shaft 17 is detachably connected to the first side frame 12, so as to facilitate the opening or closing of the first limiting member 2; a second rotating shaft 18, one side of the second limiting member 3 is rotatably connected to the second rotating shaft 18, and the other side can be rotated relative to the second rotating shaft 18 and opened toward the outside of the second side frame 13, and the side of the second limiting member 3 away from the second rotating shaft 18 is detachably connected to the second side frame 13, so as to facilitate the opening and closing of the second limiting member 3;

[0071] In some embodiments, please refer to Figure 6, the bracket body 1 also includes a top plate 14, the top plate 14 is perpendicular to the back plate 11, the first side frame 12 is connected to one end of the top plate 14 and the back plate 11, and the second side frame 13 is connected to the other end of the top plate 14 and the back plate 11; the first rotating shaft 17 is located on the connecting edge of the first side frame 12 and the top plate 14, or the first rotating shaft 17 is located on the connecting edge of the first side frame 12 and the back plate 11, and the extension direction of the first rotating shaft 17 is parallel to the first side frame 12. plane; the second rotation axis 18 is located at the corner of the second side frame 13 away from the top plate 14 and the back plate 11, and the extension direction of the second rotation axis 18 is perpendicular to the plane where the second side frame 13 is located; specifically, the first rotation axis 17 is located on the connecting edge of the first side frame 12 and the back plate 11. With this arrangement, the rotation direction of the first limiting member 2 is parallel to the extension direction of the processor assembly 4, which can facilitate the limiting groove 211 on the limiting edge 21 of the first limiting member 2 to be stuck into the corner of the processor assembly 4, thereby facilitating assembly.

[0072] In some embodiments, a first angle limiter is further provided on the first rotating shaft 17 for limiting the maximum rotation angle of the first limiting member 2, and a second angle limiter is further provided on the second rotating shaft 18 for limiting the maximum rotation angle of the second limiting member 3. Specifically, the first angle limiter and / or the second angle limiter is a limiter plate tilted at a certain angle, or a limiter block installed on the first rotating shaft 17 or the second rotating shaft 18, and any method is used to limit the angle of the first rotating shaft 17 or the second rotating shaft 18. This arrangement is to prevent the first limiting member 2 and the second limiting member 3 from interfering with other structures due to excessive rotation angles, while also saving time when the first limiting member 2 and the second limiting member 3 are closed, thereby improving assembly efficiency.

[0073] In some embodiments, please refer to Figures 4 and 17, and further include a third locking member 19. A locking edge 22 is provided on the side of the first limiting member 2 facing away from the first side frame 12. The locking edge 22 can be suspended on the surface of the air duct of the server, or inserted into the shell of the air duct to facilitate fixation with other structures. The third locking member 19 is provided on the locking edge 22 and can be fastened to the air duct. Specifically, in one embodiment, the third locking member 19 is a hand screw, and a threaded hole or nut is provided on the air duct. Through the provision of the third locking member 19, the bracket body 1 group after the installation of the processor assembly 4 can be assembled to the air duct, thereby realizing the assembly of the processor integrated module 10 with other structures in the server, further reducing the noise and vibration caused by the heat dissipation component 42.

[0074] In some embodiments, referring to FIG4 , a plurality of reinforcing ribs 23 are provided between the locking edge 22 and the first retaining member 2 , and ventilation channels are provided between adjacent reinforcing ribs 23 to allow air to flow from the outside of the first retaining member 2 into the chamber of the bracket body 1 . Specifically, the reinforcing ribs 23 should be parallel to the first direction so that the ventilation channels between adjacent reinforcing ribs 23 are parallel to the wind direction, reducing airflow obstruction while also ensuring the strength of the locking edge 22 and, therefore, ensuring the secure installation of the processor integrated module 10 .

[0075] In some embodiments, please refer to Figure 2, which also includes an adapter card 5, which is fixed to the bracket body 1 by screws. The adapter card 5 is connected to the processor component 4 for data transmission; the bracket body 1 is also provided with a wire buckle for fixing the transmission cable.

[0076] In some embodiments, please refer to Figures 8 and 9, the processor assembly 4 includes: a processor body 41; a heat dissipation component 42, used to dissipate heat for the processor body 41; a heat dissipation mounting frame 43, the heat dissipation mounting frame 43 is arranged at one end of the processor body 41 along the first direction, the heat dissipation component 42 is detachably arranged on the heat dissipation mounting frame 43, and the heat dissipation component 42 and the heat dissipation mounting frame 43 can follow the processor body 41 into and out of the chamber.

[0077] Specifically, the processor body 41 can be a graphics processor or other processors, and any processor that can be module-integrated can be used; in one embodiment, the heat dissipation component 42 is a fan dedicated to the processor, and of course, it can also be other heat dissipation components 42 that can generate airflow; the heat dissipation mounting frame 43 not only serves to fix the heat dissipation component 42, but also serves as a slide rail for cooperating and connecting with the support part inside the bracket body 1.

[0078] In some embodiments, referring to Figures 8 and 9, a heat sink mounting bracket 43 is mounted on a first end of the processor body 41 along a first direction, the heat sink mounting bracket 43 is connected to the first side frame 12, and a second end of the processor body 41 along the first direction is connected to the second side frame 13. A plurality of ventilation slots are provided on the first side frame 12. The provision of the ventilation slots ensures airflow efficiency, reduces airflow obstruction, and ensures heat dissipation of the processor body 41. It should be noted that the first side frame 12 should be positioned close to the fan module 30, i.e., the airflow direction of the heat sink 42 is the same as that of the fan module 30, to ensure a cooling effect.

[0079] In some embodiments, please refer to Figures 11 and 12, the heat dissipation mounting bracket 43 includes an extension piece 431 and a heat dissipation limiting piece 432, and a heat dissipation space for the heat dissipation component 42 to be placed is provided between the heat dissipation limiting piece 432 and the extension piece 431; the extension piece 431 is connected to the processor body 41, and the heat dissipation limiting piece 432 is detachably connected to the extension piece 431; and the edge of the extension piece 431 facing away from the processor body 41 is provided with a supporting edge 4311, and the supporting edge 4311 is cooperated and connected with the supporting portion in the bracket body 1; specifically, the extension piece 431 includes a bottom plate and a side plate, and the extension piece 431 can be an integral structure or a structure pre-assembled with the bottom plate and the side plate, the heat dissipation component 42 can be detachably mounted on the extension piece 431, and the extension piece 431 can be detachably mounted on the processor body 41, specifically, the extension piece 431 is provided with an assembly hole 4312, which is fixed to the processor body 41 by screws; the heat dissipation limiting piece 43 2 is used to fix the heat dissipation component 42; the side panel is located on one side of the bottom panel, and the heat dissipation limiter 432 is located in the middle of the bottom panel. By installing the heat dissipation limiter 432 in the middle of the bottom panel, a certain space can be reserved for the bottom panel, which is matched with the support portion; a heat dissipation space for the heat dissipation component 42 is formed between the side panel and the heat dissipation limiter 432; the side panel is detachably connected to the processor body 41, and the heat dissipation limiter 432 is detachably connected to the bottom panel. After the heat dissipation component 42 is installed, the heat dissipation limiter 432 is connected to the bottom panel; in one embodiment, the side panel and the heat dissipation limiter 432 are both U-shaped structures, and the openings of the side panel and the heat dissipation limiter 432 are facing the heat dissipation component 42, which can better limit the heat dissipation component 42 and increase the contact area with the bottom panel, making the connection more firm; and a supporting edge 4311 is provided on the edge of the bottom panel away from the processor body 41, and the supporting edge 4311 is matched with the support portion in the bracket body 1. Specifically, the heat dissipation limiter 432 is connected to the base plate by a threaded fastener 4321. The threaded fastener 4321 can be a hand-turned screw. A connecting hole is provided on the base plate, and the connecting hole can also be replaced by a nut. The threaded fastener 4321 passes through the heat dissipation limiter 432 and is fixed on the connecting hole of the base plate, thereby realizing a fixed connection between the heat dissipation limiter 432 and the base plate of the extension member 431. When the heat dissipation component 42 needs to be disassembled or replaced, the heat dissipation limiter 432 and the extension member 431 can be separated by rotating the threaded fastener 4321 in the opposite direction, which is convenient to use.

[0080] In some embodiments, referring to FIG10 , both ends of the heat dissipation component 42 are provided with heat dissipation fixing holes 421, and the extension piece 431 and the heat dissipation limiting piece 432 are provided with mounting bracket fixing holes 435. The heat dissipation fixing holes 421 and the mounting bracket fixing holes 435 are detachably connected via heat dissipation fixing pieces 433. Specifically, the heat dissipation fixing holes 421 and the mounting bracket fixing holes 435 can be fixed by bolts or rivets, and any method that can achieve detachable connection between the heat dissipation fixing holes 421 and the mounting bracket fixing holes 435 via the heat dissipation fixing pieces 433 is available. With the detachable connection method, the heat dissipation component 42 can be installed on the required processor body 41. That is, each processor body 41 is provided with a heat dissipation mounting frame 43, and the heat dissipation component 42 can be installed on the heat dissipation mounting frame 43 as needed. If there is no heat dissipation requirement, the mounting bracket fixing holes 435 and the heat dissipation fixing pieces 433 can be omitted.

[0081] In the above arrangement, the heat dissipation limiter 432 is designed to be fixed to the extension piece 431 without tools, and the heat dissipation component 42 is assembled and fixed to the extension piece 431 or the heat dissipation limiter 432 through the heat dissipation fixing piece 433; the extension piece 431 is designed with a mounting bracket fixing hole 435 and a connecting hole, the connecting hole can lock the heat dissipation limiter 432, and the heat dissipation limiter 432 has a hand-screw. These functions can realize the tool-free fixing of the heat dissipation component 42 to the extension piece 431.

[0082] In some embodiments, please refer to Figures 13 to 14, which also include a shock-absorbing pad 434. The heat dissipation fixing part 433 includes a fixing part body 4331, a first fixing column 4332 and a second fixing column 4333. The first fixing column 4332 is interference fit connected to the heat dissipation fixing hole 421. The shock-absorbing pad 434 wraps the fixing part body 4331 and the second fixing column 4333, that is, the outer rubber pad of the heat dissipation fixing part 433 is partially rubber-wrapped, and the rubber-wrapping is achieved by in-mold two-color injection molding, and the shock-absorbing pad 434 is interference fit connected to the mounting frame fixing hole 435 near the second fixing column 4333. Specifically, the arrangement of the fixing body 4331, the first fixing post 4332, and the second fixing post 4333 facilitates interference fit connection between the heat dissipation fixing member 433 and the heat dissipation fixing hole 421 or the mounting bracket fixing hole 435. Furthermore, in one embodiment, the fixing body 4331 is annular, which ensures the secure positioning of the shock-absorbing pad 434. Specifically, the end of the shock-absorbing pad 434, away from the first fixing post 4332, is truncated cone-shaped, facilitating insertion into the mounting bracket fixing hole 435. In one embodiment, the shock-absorbing pad 434 is a rubber pad. The provision of the shock-absorbing pad 434 further reduces the vibration generated by the heat dissipation component 42 and reduces noise.

[0083] In some embodiments, it also includes: an in-place detection component for detecting whether the processor component 4 is installed in place in the chamber. The in-place detection component can be a sensor or a spring pin, and any structure that can detect the in-place position and remind the installation is in place; a warning component, connected to the in-place detection component, for sending a warning signal after the processor component 4 is installed in place. The warning signal can be a light signal or an acoustic signal; a power mechanism for driving the movement of the first limit member 2 and the movement of the second limit member 3. The power structure can be a motor, cylinder or other structure installed on the first limit member 2 and / or the second limit member 3; a controller, connected to the warning component, for controlling the first limit member 2 to rotate to fit with the first side frame 12 after receiving the warning signal, and controlling the second limit member 3 to rotate to fit with the second side frame 13, thereby realizing automatic control of the first limit member 2 or the second limit member 3; the above-mentioned settings can be applied to the fully automatic installation of the processor integrated module 10 to realize automated assembly.

[0084] The processor integrated module 10 provided in the present application is compared with the processor fan in the related art. Some of the related processor fans simply add a processor fan and a fixing bracket at the air inlet end of the processor, which increases the weight of the processor component 4 while failing to achieve reliable fixation of the air inlet end of the processor, resulting in poor processor fixation reliability and affecting processor performance. In the processor integrated module 10 of the present application, the heat dissipation component 42 is compatible with the processor extension component 431 in the related art, and does not affect the reliable fixation of the original processor; compared with the processor fan in the related art, some processor fans in the related art are directly integrated into the processor, but this method cannot predict in advance the actual heat dissipation impact of the processor in the system, that is, some configuration systems have better heat dissipation, and there may be situations where a dedicated heat dissipation fan for the processor is not needed, which results in an unnecessary increase in the cost of the processor fan; in the processor integrated module 10 of the present application, the heat dissipation component 42 is a detachable optional accessory, which can be increased or decreased according to the needs of system design, and is more cost-effective; compared with the fan fixing method in the related art, the shock-absorbing pad 434 and the heat-dissipating fixing part 433 in the related art are usually separate parts, and there is a problem that the rubber pad is easy to fall off during installation; in the processor integrated module 10 of the present application, the shock-absorbing pad 434 adopts two-color injection molding, which ensures the strength of the heat-dissipating fixing part 433 while maintaining a good vibration reduction effect of the shock-absorbing pad 434, and can reduce the labor installation cost, and avoid the problem of the shock-absorbing pad 434 easily falling off during the installation of the heat dissipation component 42.

[0085] In addition to the above-mentioned processor integrated module 10, the present application also provides a server including the above-mentioned processor integrated module 10. For the structure of other parts of the server, please refer to the relevant technology about the server, which will not be repeated in this article.

[0086] Please refer to Figures 15 and 16. The server also includes a chassis base 60, a hard disk module 20, a fan module 30, a CPU 90, an air duct, a power module 70, and a chassis cover 80. The hard disk module 20, the fan module 30, the air duct, the power module 70, and the chassis cover 80 are all mounted on the chassis base 60, and the processor integrated module 10 is mounted on the air duct. Specifically, the air duct includes a front air duct 40 and a rear air duct 50. The chassis base 60 is mainly used to integrate server-related components to realize server-related functions. The chassis base 60 is installed with the hard disk module 20, the fan module 30, the front air duct 40, the rear air duct 50, the processor integrated module 10, and the power module 70 from front to back. The fan module 30 is used to dissipate heat for the CPU 90. The hard disk module 20 is usually a mechanical hard disk. As shown in Figure 17, the processor integrated module 10 is fixed to the rear air duct 50 by a third locking member.

[0087] In addition to the above-mentioned processor integrated module 10 and server, please refer to Figure 18. The present application also provides a processor integrated module assembly method, including the following steps: rotating the first limit member 2 and the second limit member 3 so that the first limit member 2 and the second limit member 3 are away from the cavity; placing the processor component 4 into the cavity of the bracket body 1; when the processor component 4 is installed in place, locking the first limit member 2 on the first side frame 12 so that the first limit member 2 and the second side frame 13 limit the processor component 4 along the first direction; locking the second limit member 3 on the second side frame 13 so that the second limit member 3 and the back panel 11 limit the processor component 4 along the second direction.

[0088] The processor integrated module assembly method avoids the processor component 4 by rotating the first limit member 2 and the second limit member 3, thereby facilitating the installation of the processor component 4 into the cavity of the bracket body 1, and after the processor component 4 is installed in place, the first limit member 2 is rotated to tighten one end of the processor component 4 in the first direction to achieve the limitation of the processor component 4 in the first direction, and the second limit member 3 is rotated to tighten one side of the processor component 4 in the second direction to achieve the limitation of the processor component 4 in the second direction, and then the first limit member 2 is locked on the first side frame 12, and the second limit member 3 is locked on the second side frame 13, so as to complete the assembly process of the processor integrated module 10 and achieve multi-angle fixation of the processor component 4, thereby effectively reducing the noise and vibration effects of the processor component 4 caused by the provision of the heat dissipation component 42, and reducing the impact on the user experience under the premise of meeting the heat dissipation requirements of the processor component 4.

[0089] Specifically, in a specific embodiment, the processor integrated module assembly method includes: fixing the adapter card 5 to the bracket body with screws; fixing the heat dissipation mounting frame 43 to one end of the processor body 41 with screws, and then interferingly installing each heat dissipation fixing member 433 on the heat dissipation component 42 and the heat dissipation mounting frame 43, respectively, with two heat dissipation fixing members 433 on the left and right sides of the lower part of one side of the heat dissipation component 42, and then installing the other two heat dissipation fixing members 433 on the other side of the heat dissipation component 42, and then assembling the heat dissipation limiting member 432 and the heat dissipation fixing member 433, and then using The threaded fastener 4321 fixes the heat dissipation limiter 432 to the base plate; rotate the first limiter 2 and the second limiter 3 to open, and then install the processor assembly 4 into the chamber along the first slide 121 and the second slide 131, and then fix the first limiter 2 to press one side of the processor assembly 4, and rotate the second limiter 3 to lock and fix the other side of the processor assembly 4; install the processor integrated module 10 onto the chassis base 60, and fix the processor integrated module 10 to the rear air guide cover 50 through the third locking member 19, and cover the chassis cover 80.

[0090] By adding a heat dissipation component 42 dedicated to the processor body 41 to the processor body 41, the heat dissipation problem of the processor body 41, such as the GPU card, can be solved more specifically, avoiding the overall increase in the system fan speed. This can avoid the increase in the cost of more noise reduction measures to solve the impact of noise on the hard disk transmission performance after the system fan speed is increased; at the same time, it can also avoid the impact of the increased noise of the fan module 30 on the noise environment of the operation and maintenance personnel, thereby affecting the user experience.

[0091] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0092] The above is a detailed introduction to the processor integrated module, server, and processor integrated module assembly method provided by this application. Specific examples are used herein to illustrate the principles and implementation methods of this application. The description of the above embodiments is only intended to help understand the method and core ideas of this application. It should be pointed out that, for those skilled in the art, without departing from the principles of this application, several improvements and modifications can be made to this application, and these improvements and modifications also fall within the scope of protection of this application.

Claims

1. A processor integrated module, characterized in that: include: A bracket body (1), the bracket body (1) comprising a back plate (11), and a first side frame (12) and a second side frame (13) arranged opposite to each other, the back plate (11), the first side frame (12) and the second side frame (13) surrounding each other to form a cavity; and a support portion configured to place a processor assembly (4) is provided on the bracket body (1) within the cavity, the processor assembly (4) having a heat dissipation component (42); A first limiting member (2) is rotatably mounted on the bracket body (1), wherein the first limiting member (2) and the second side frame (13) limit the processor assembly (4) along a first direction; A second limiting member (3) is rotatably mounted on the bracket body (1), and the second limiting member (3) and the back plate (11) limit the processor assembly (4) along a second direction, wherein the second direction is perpendicular to the first direction and parallel to the direction in which the processor assembly (4) enters and exits the chamber.

2. The processor integrated module according to claim 1, wherein: Also includes: a first locking member (15) configured to lock or unlock the first limiting member (2) and the first side frame (12); one side of the first limiting member (2) is hinged to the first side frame (12) or the back panel (11), and the other end is connected to the first locking member (15); the first locking member (15) is movably mounted on the first side frame (12), and when the first locking member (15) is unlocked, the first limiting member (2) can swing relative to the first side frame (12); The second locking member (16) is configured to lock or unlock the second limiting member (3) and the second side frame (13); one side of the second limiting member (3) is hinged to the second side frame (13) or the back panel (11), and the other end is connected to the second locking member (16); the second locking member (16) is movably mounted on the second side frame (13), and when the second locking member (16) is unlocked, the second limiting member (3) can swing relative to the second side frame (13).

3. The processor integrated module according to claim 2, wherein: The first locking member (15) is a threaded fastener (4321), and a threaded hole is provided on the first side frame (12), and the threaded fastener (4321) can be assembled into the threaded hole and fastened; The second locking member (16) includes a slider (161) and a locking edge (162), wherein the locking edge (162) is located at the movable end of the second limiting member (3), and the slider (161) is arranged on the second side frame (13). When the second limiting member (3) is in close contact with the second side frame (13), the slider (161) can slide to the locking edge (162) and engage to lock the position of the second limiting member (3).

4. The processor integrated module according to claim 1, wherein: The second limiting member (3) is provided with an elastic structure, and after the second limiting member (3) is opened and the installation of the processor assembly (4) is completed, the elastic structure drives the second limiting member (3) to remain in a locked state.

5. The processor integrated module according to claim 1, wherein: The support portion comprises a plurality of first slides (121) located on the inner wall of the first side frame (12), and a plurality of second slides (131) located on the inner wall of the second side frame (13), wherein the first slides (121) are arranged parallel to the second slides (131), and the two ends of the processor assembly (4) along the first direction slide along the first slides (121) and the second slides (131) respectively to enter and exit the chamber.

6. The processor integrated module according to claim 5, characterized in that: The movable end of the first limiting member (2) is further provided with a limiting edge (21), and a limiting groove (211) is provided inside the limiting edge (21), and the limiting groove (211) is configured to receive the corner of the processor assembly (4) so ​​as to limit the processor assembly (4) in the first direction and the second direction.

7. The processor integrated module according to claim 6, wherein: A notch portion (122) is provided on the side of the first side frame (12) facing away from the back plate (11), and the rotation of the first limiting member (2) can cause the limiting edge (21) to rotate to the notch portion (122), so that the limiting groove (211) in the limiting edge (21) is connected to the first slideway (121).

8. The processor integrated module according to claim 1, wherein: The bracket body (1) is provided with a groove, and the handles (141) are arc-shaped. Rotating shafts are provided at both ends of the handles (141). The handles (141) are installed in the grooves through the rotating shafts and can be rotated to extend out of the grooves.

9. The processor integrated module according to claim 1, wherein: Also includes: a first rotating shaft (17), one side of the first limiting member (2) being rotatably connected to the first rotating shaft (17), the other side of the first limiting member (2) being rotatable relative to the first rotating shaft (17) and opening toward the outside of the first side frame (12), and a side of the first limiting member (2) away from the first rotating shaft (17) being detachably connected to the first side frame (12); a second rotating shaft (18), one side of the second limiting member (3) being rotatably connected to the second rotating shaft (18), and the other side being rotatable relative to the second rotating shaft (18) and opening toward the outside of the second side frame (13), and a side of the second limiting member (3) away from the second rotating shaft (18) being detachably connected to the second side frame (13); The bracket body (1) further includes a top plate (14), the top plate (14) is perpendicular to the back plate (11), the first side frame (12) is connected to one end of the top plate (14) and the back plate (11), and the second side frame (13) is connected to the other end of the top plate (14) and the back plate (11); the first rotating shaft (17) is located on the connecting edge of the first side frame (12) and the top plate (14), or the first rotating shaft (17) is located on the connecting edge of the first side frame (12) and the back plate (11), and the extension direction of the first rotating shaft (17) is parallel to the plane where the first side frame (12) is located; the second rotating shaft (18) is located at the corner of the second side frame (13) away from the top plate (14) and the back plate (11), and the extension direction of the second rotating shaft (18) is perpendicular to the plane where the second side frame (13) is located; The first rotating shaft (17) is also provided with a first angle limiting portion, which is configured to limit the maximum rotation angle of the first limiting member (2), and the second rotating shaft (18) is also provided with a second angle limiting portion, which is used to limit the maximum rotation angle of the second limiting member (3).

10. The processor integrated module according to claim 1, wherein: The server also includes a third locking member (19); a locking edge (22) is provided on the side of the first limiting member (2) facing away from the first side frame (12); the locking edge (22) can be suspended on the surface of the air duct of the server, or inserted into the shell of the air duct; the third locking member (19) is arranged on the locking edge (22) and can be fastened to the air duct.

11. The processor integrated module according to claim 10, wherein: A plurality of reinforcing ribs (23) are provided between the locking edge (22) and the first limiting member (2), and ventilation channels are provided between adjacent reinforcing ribs (23) to allow gas to flow from the outside of the first limiting member (2) into the interior of the cavity of the bracket body (1).

12. The processor integrated module according to claim 1, wherein: The first limiting member (2) is provided with a first magnetic locking member, the first side frame (12) is provided with a first magnetic component, and the first magnetic component attracts the first magnetic locking member; A second magnetic locking piece is provided on the second limiting piece (3), and a second magnetic component is provided on the second side frame (13), and the second magnetic component attracts the second magnetic locking piece.

13. The processor integrated module according to any one of claims 1 to 12, characterized in that: The processor component (4) comprises: Processor body (41); a heat dissipation component (42) configured to dissipate heat for the processor body (41); A heat dissipation mounting frame (43) is provided at one end of the processor body (41) along the first direction, and the heat dissipation component (42) is detachably provided on the heat dissipation mounting frame (43).

14. The processor integrated module according to claim 13, wherein: The heat dissipation mounting frame (43) is mounted on a first end of the processor body (41) along the first direction, the heat dissipation mounting frame (43) is connected to the first side frame (12), the second end of the processor body (41) along the first direction is connected to the second side frame (13), and the first side frame (12) is provided with a plurality of ventilation slots.

15. The processor integrated module according to claim 14, wherein: The heat dissipation mounting frame (43) includes an extension piece (431) and a heat dissipation limiting piece (432), and a heat dissipation space for placing the heat dissipation component (42) is provided between the heat dissipation limiting piece (432) and the extension piece (431); the extension piece (431) is connected to the processor body (41), and the heat dissipation limiting piece (432) and the extension piece (431) are detachably connected; and a support edge (4311) is provided on the edge of the extension piece (431) away from the processor body (41), and the support edge (4311) is cooperatively connected to the support portion in the bracket body (1).

16. The processor integrated module according to claim 15, wherein: Both ends of the heat dissipation component (42) are provided with heat dissipation fixing holes (421), the extension piece (431) and the heat dissipation limiting piece (432) are provided with mounting frame fixing holes (435), and the heat dissipation fixing holes (421) and the mounting frame fixing holes (435) are detachably connected via heat dissipation fixing pieces (433).

17. The processor integrated module according to claim 16, wherein: It also includes a shock-absorbing pad (434), and the heat dissipation fixing part (433) includes a fixing part body (4331), a first fixing column (4332) and a second fixing column (4333), the first fixing column (4332) is connected to the heat dissipation fixing hole (421) by interference fit, and the shock-absorbing pad (434) is arranged to wrap the fixing part body (4331) and the second fixing column (4333), and the shock-absorbing pad (434) is connected to the mounting frame fixing hole (435) by interference fit at a position close to the second fixing column (4333).

18. The processor integrated module according to claim 15, wherein: The extension piece (431) comprises a bottom plate and a side plate, wherein the side plate is located on one side of the bottom plate and is detachably connected to the processor body (41), and the heat dissipation limiting piece (432) is located in the middle of the bottom plate and is detachably connected to the bottom plate.

19. The processor integrated module according to claim 18, wherein: The side plate and the heat dissipation limiting member (432) are both U-shaped structures, and the openings of the side plate and the heat dissipation limiting member (432) face the heat dissipation component (42); The edge of the bottom plate facing away from the processor body (41) is provided with a supporting edge (4311), and the supporting edge (4311) is cooperatively connected with the supporting portion in the bracket body (1).

20. The processor integrated module according to any one of claims 1 to 12, characterized in that: Also includes: an in-place detection component, configured to detect whether the processor assembly (4) is in place within the chamber; a warning component connected to the in-place detection component and configured to send out a warning signal after the processor assembly (4) is installed in place; a power mechanism, configured to drive the movement of the first limiting member (2) and the movement of the second limiting member (3); A controller is connected to the warning component and is configured to control the first limiting member (2) to rotate to fit the first side frame (12) and control the second limiting member (3) to rotate to fit the second side frame (13) after receiving the warning signal.

21. A server comprising a processor integrated module (10), characterized in that: The processor integrated module (10) is the processor integrated module according to any one of claims 1 to 20.

22. A method for assembling a processor integrated module, configured to assemble a processor integrated module (10) according to any one of claims 1 to 20, characterized in that: The following steps are involved: Rotating the first limiting member (2) and the second limiting member (3) so that the first limiting member (2) and the second limiting member (3) are away from the chamber; placing the processor assembly (4) into the cavity of the support body (1); When the processor assembly (4) is installed in place, the first limiting member (2) is locked on the first side frame (12), so that the first limiting member (2) and the second side frame (13) limit the processor assembly (4) along the first direction; the second limiting member (3) is locked on the second side frame (13), so that the second limiting member (3) and the back plate (11) limit the processor assembly (4) along the second direction.

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