Inductor assembly, filter module, and electronic device

The combined structure of differential common-mode integrated inductors and air core inductors solves the problem of large board area occupied by the filter module, achieving the effect of reducing board area and improving integration while maintaining performance.

WO2025195002A1PCT designated stage Publication Date: 2025-09-25HUAWEI TECH CO LTD
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Patent Information

Application Number
PCT/CN2025/072962
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-03-22
Filing Date
2025-01-17
Publication Date
2025-09-25

AI Technical Summary

Technical Problem

How to reduce the board area of ​​the filter module while meeting the filtering performance and lightning protection performance to improve its integration and support miniaturization development.

Method used

A combination structure of differential common-mode integrated inductors and air core inductors is adopted. By integrating the common-mode inductor and the differential-mode inductor into a differential common-mode integrated inductor and stacking it with the air core inductor, the board area of ​​the inductor component is reduced. At the same time, the air core inductance is increased through multi-layer PCB winding and three-dimensional winding design.

Benefits of technology

While maintaining filtering and lightning protection performance, the board area of ​​the inductor components and filter modules is significantly reduced, the integration level is improved, and miniaturization is supported.

✦ Generated by Eureka AI based on patent content.

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Abstract

An inductor assembly, a filter module, and an electronic device. The inductor assembly comprises: an air core inductor and an integrated differential-common-mode inductor, and a magnetic core window is formed on the integrated differential-common-mode inductor. The air core inductor comprises a printed circuit board (PCB) winding, the PCB winding comprises a PCB and a first winding arranged on the PCB, the integrated differential-common-mode inductor is fixed on the PCB, and the projection of the integrated differential-common-mode inductor on the PCB overlaps with the first winding; or the inductor assembly further comprises a circuit board, the air core inductor comprises a three-dimensional winding, the three-dimensional winding and the integrated differential-common-mode inductor are both fixed on the circuit board, and the three-dimensional winding is located in the magnetic core window. By means of the arrangement, the board occupation area of the inductor assembly can be reduced on the premise that the filtering performance and the surge protection performance of the filter module are satisfied, so that the occupied area of the filter module is reduced, thereby improving the integration level of the filter module, and better supporting miniaturization evolution.
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Description

Inductor components, filter modules and electronic equipment Technical Field

[0001] The present application relates to the field of filtering technology, and in particular to an inductor component, a filtering module and an electronic device. Background Art

[0002] Wireless base station products, such as remote radio units (RRUs) and multiple-input multiple-output (MIMO) systems, typically have internal filter modules, which may include decoupling inductors, common-mode inductors, and differential-mode inductors. These inductors work together to provide cored common-mode inductance, cored differential-mode inductance, and air-core inductance, thereby providing lightning protection and filtering. With the development of wireless base station products, power supply power has increased year by year, placing higher demands on the performance of filter modules. Consequently, the board area occupied by filter modules has also increased.

[0003] To increase power density, the filter module's footprint needs to be reduced. This is typically achieved by miniaturizing the decoupling, common-mode, and differential-mode inductors. However, this reduces the inductance of each inductor, making it difficult to achieve the desired filtering and lightning protection performance of the filter module.

[0004] Therefore, how to reduce the board area of ​​the filter module while meeting the filtering performance and lightning protection performance of the filter module is a technical problem that needs to be solved urgently. Summary of the Invention

[0005] In order to solve the above technical problems, the present application provides an inductor component, a filter module and an electronic device, which can reduce the board area of ​​the inductor component while meeting the filtering performance and lightning protection performance of the filter module, thereby reducing the occupied area of ​​the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.

[0006] In the first aspect of the present application, an inductor component is provided, comprising: an air core inductor and a differential common mode integrated inductor. A magnetic core window is formed on the differential common mode integrated inductor. The differential common mode integrated inductor may refer to an inductor that can simultaneously perform differential mode filtering and common mode filtering. When the inductor component is applied to a filter module, the differential common mode integrated inductor can provide core common mode inductance, core differential mode inductance and air core inductance, and the air core inductor can provide air core inductance. Thus, the differential common mode integrated inductor and the air core inductor can work together to provide sufficient core common mode inductance, core differential mode inductance and air core inductance, thereby achieving filtering performance and lightning protection performance of the filter module.

[0007] Regarding the structure of an air core inductor, in one possible embodiment, the air core inductor includes a printed circuit board (PCB) winding, the PCB winding including a PCB board and a first winding disposed on the PCB board, and a differential common mode integrated inductor is fixed to the PCB board, with the projection of the differential common mode integrated inductor on the PCB board overlapping with the first winding. In other words, the differential common mode integrated inductor and the air core inductor are stacked in a direction perpendicular to the PCB board. When the filter module is applied to an electronic device, the PCB board can be fixed within the housing of the electronic device as the circuit board of the filter module and connected to the switching power supply in the electronic device. Therefore, the board area of ​​the PCB board is the board area occupied by the inductor component and the filter module. Compared with the technical solution of fixing the decoupling inductor, common-mode inductor and differential-mode inductor separately on the circuit board, the present application integrates the common-mode inductor and the differential-mode inductor into a differential common-mode integrated inductor, and stacks the differential common-mode integrated inductor and the air core inductor, thereby reducing the PCB board area of ​​the air core inductor, thereby reducing the board area occupied by the inductor component, and further reducing the board area occupied by the filter module. Therefore, the present application can reduce the board area occupied by the inductor component while meeting the filtering performance and lightning protection performance of the filter module, thereby reducing the occupied area of ​​the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.

[0008] In another possible embodiment, the inductor assembly further includes a circuit board. That is, in this embodiment, the inductor assembly includes a circuit board, an air core inductor and a differential common mode integrated inductor. The air core inductor includes a three-dimensional winding, and the three-dimensional winding and the differential common mode integrated inductor are both fixed on the circuit board, and the three-dimensional winding is located in the magnetic core window. In this way, the total board area occupied by the three-dimensional winding and the differential common mode integrated inductor is the same as the board area occupied by the differential common mode integrated inductor. Compared with the technical solution of fixing the decoupling inductor, common mode inductor and differential mode inductor on the circuit board respectively, the present application integrates the common mode inductor and the differential mode inductor into a differential common mode integrated inductor, and arranges the three-dimensional inductor in the magnetic core window of the differential common mode integrated inductor, thereby reducing the board area of ​​the circuit board, thereby reducing the board area occupied by the inductor assembly and the filter module. Therefore, the present application can reduce the occupied area of ​​the inductor assembly and the filter module while meeting the filtering performance and lightning protection performance of the filter module, thereby improving the integration of the filter module and better supporting the miniaturization evolution.

[0009] When the air-core inductor includes a PCB winding, the first winding and the differential common-mode integrated inductor are located on the same side of the PCB, with a gap between the first winding and the differential common-mode integrated inductor perpendicular to the PCB. In a specific configuration, solder pads can be provided on the surface of the PCB where the first winding is located, and the ports of the differential common-mode integrated inductor can be connected to the solder pads, thereby facilitating electrical connection between the differential common-mode integrated inductor and the PCB. Furthermore, the solder pads on the PCB and the first winding can be manufactured in the same process, thereby improving the ease of manufacturing the inductor assembly.

[0010] Furthermore, one side of the PCB includes a first area and a second area, with the second area surrounding the first area. The first winding is located in the first area, and the differential and common-mode integrated inductors are fixed to the second area, with their projections on the PCB covering those of the air-core inductors. This fully utilizes the PCB surface area, further reducing the area occupied by the inductor assembly and, consequently, the filter module.

[0011] Regarding the number of layers of the PCB winding, in one possible embodiment, the air core inductor includes multiple layers of PCB windings stacked in sequence, and the differential common mode integrated inductor is arranged on the PCB board of the top layer of PCB windings. The first windings of each two adjacent layers of PCB windings are connected. In this way, the first end of the first winding in the bottom layer of PCB windings can serve as the first end of the air core inductor, and the second end of the first winding of the top layer of PCB windings that is not connected to other layers of PCB windings can serve as the second end of the air core inductor. Since the inductance is positively correlated with the number of layers of PCB windings, when the air core inductor includes multiple layers of PCB windings, the air core inductance provided by the air core inductor can be increased. Moreover, the stacked multiple layers of PCB windings do not increase the board area of ​​the PCB board. Therefore, this solution can increase the air core inductance while keeping the board area of ​​the inductor component unchanged. In another possible embodiment, the air core inductor may include a single layer of PCB windings.

[0012] Furthermore, with respect to the number of first windings in the PCB winding, in one possible embodiment, the PCB winding may include multiple first windings, each of which has the same winding direction, and the first ends of each first winding are connected, as well as the second ends of each first winding. Thus, when current passes through the air core inductor, it can enter each first winding from the first end, flow through each first winding, and then exit from the second end of each first winding. Multiple first windings can provide greater inductance. Furthermore, the current flowing through each first winding is more similar in magnitude, meaning that the current is more evenly distributed across each first winding, further improving the air core inductance.

[0013] Furthermore, the length of each first winding is the same, thereby making the current flowing through each first winding more uniform, thereby further increasing the air core inductance provided by the air core inductor.

[0014] In another possible implementation, the PCB winding may include a first winding. In order to increase the air core inductance generated by the first winding, the cross-sectional size of the first winding may be increased.

[0015] In some embodiments, the PCB board includes a first board surface and a second board surface relative to each other; the first winding includes multiple parallel first conductive wires, multiple parallel second conductive wires and multiple parallel third conductive wires, the multiple first conductive wires are all arranged on the first board surface, the multiple second conductive wires are all arranged on the second board surface, the projections of the first conductive wires on the second board surface intersect with the second conductive wires, the multiple third conductive wires pass through from the first board surface to the second board surface, and each third conductive wire connects a first conductive wire and a second conductive wire.

[0016] Regarding the structure of a differential common-mode integrated inductor, in one possible embodiment, the differential common-mode integrated inductor includes a base, a first magnetic core, a second magnetic core, a second winding, and a third winding. The first magnetic core and the second magnetic core are parallel, the second winding is wound around the first magnetic core, and the third winding is wound around the second magnetic core. A magnetic core window is formed between the second and third windings, and the winding direction of the second winding is opposite to that of the third winding. The direction of the magnetic field generated within the first magnetic core is opposite to that of the magnetic field generated within the second magnetic core, thereby forming a common magnetic circuit structure. As a result, the differential common-mode integrated inductor can provide cored common-mode inductance and cored differential-mode inductance.

[0017] When the air-core inductor includes a PCB winding, the axial directions of the first and second magnetic cores are both parallel to the PCB. This allows the magnetic fields generated by the second and third windings of the differential-common-mode integrated inductor to be parallel to the PCB, while the magnetic field generated by the first winding of the air-core inductor is perpendicular to the PCB. This means that the magnetic fields generated by the differential-common-mode integrated inductor and the air-core inductor are orthogonal, thus preventing cross-linking and the effects of mutual inductance, which in turn prevents any degradation in filtering effectiveness due to mutual inductance.

[0018] When the air core inductor includes a three-dimensional winding, in one example, the axial direction of the first magnetic core and the axial direction of the second magnetic core are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding and the third winding of the differential common mode integrated inductor is parallel to the circuit board, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board. In other words, the magnetic field generated by the differential common mode integrated inductor is orthogonal to the magnetic field generated by the air core inductor, thereby avoiding cross-linkage, thereby avoiding the influence of mutual inductance, and further avoiding the reduction of filtering effect due to mutual inductance. In another example, the axial direction of the first magnetic core and the axial direction of the second magnetic core are both parallel to the axial direction of the three-dimensional winding.

[0019] Regarding the structure of a differential common-mode integrated inductor, in another possible embodiment, the differential common-mode integrated inductor includes a first magnetic ring, a second magnetic ring disposed outside the first magnetic ring with a gap therebetween, a second winding, and a third winding. The surface of the second magnetic ring includes a connected third region and a fourth region. The second winding is wound around the third region, and the third winding is wound around the fourth region. The second and third windings are wound in opposite directions. Thus, the differential common-mode integrated inductor with this structure can also form a common magnetic circuit structure, thereby enabling the differential common-mode integrated inductor to provide both cored common-mode inductance and cored differential-mode inductance.

[0020] When the air-core inductor includes a PCB winding, the axial directions of the first and second magnetic rings are both perpendicular to the PCB. This allows the magnetic fields generated by the second and third windings of the differential-common-mode integrated inductor to be parallel to the PCB, while the magnetic field generated by the first winding of the air-core inductor is perpendicular to the PCB. In other words, the magnetic fields generated by the differential-common-mode integrated inductor and the air-core inductor are orthogonal, thus preventing cross-linking and mutual inductance, which in turn prevents any degradation in filtering effectiveness due to mutual inductance.

[0021] When the air-core inductor includes a three-dimensional winding, the axial directions of the first and second magnetic rings are both perpendicular to the axial directions of the three-dimensional winding. This allows the magnetic fields generated by the second and third windings of the differential common-mode integrated inductor to be parallel to the circuit board, while the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board. In other words, the magnetic fields generated by the differential common-mode integrated inductor are orthogonal to those generated by the air-core inductor, thus avoiding cross-linkage and the effects of mutual inductance, which in turn prevents any reduction in filtering effectiveness due to mutual inductance.

[0022] In some embodiments of the present application, the differential and common-mode integrated inductor further includes a magnetic conductive structure, a portion of which is connected to the interior of the first magnetic ring and a portion of which is connected between the first and second magnetic rings. The second and third windings are respectively located on either side of the magnetic conductive structure. The magnetic conductive structure has a low magnetic permeability, thereby conducting the magnetic circuit generated by the second winding and the magnetic circuit generated by the third winding, thereby increasing the cored differential-mode inductance provided by the differential and common-mode integrated inductor.

[0023] Furthermore, the magnetic conductive structure includes at least two first magnetic conductive bodies and a second magnetic conductive body. Each first magnetic conductive body is connected between the first magnetic ring and the second magnetic ring, and the second magnetic conductive body is connected inside the first magnetic ring. The two first magnetic conductive bodies are located in opposite directions of the second magnetic conductive body. This improves the magnetic circuit conduction function, thereby further increasing the core differential mode inductance provided by the differential common mode integrated inductor.

[0024] Furthermore, both the first magnetic conductor and the second magnetic conductor may comprise magnetic adhesive, so that the first magnetic ring and the second magnetic ring can be bonded together by the magnetic adhesive.

[0025] Regarding the number of ports of the inductor component, in one possible embodiment, the inductor component includes four ports, wherein the first end of the third winding of the differential common mode integrated inductor is connected to the first end of the air core inductor, the second end of the second winding of the differential common mode integrated inductor, the first end and the second end of the third winding serve as three ports of the inductor component respectively, and the second end of the air core inductor serves as one of the ports of the inductor component.

[0026] In another possible embodiment, the inductor assembly includes six ports. The first end and the second end of the second winding of the differential common mode integrated inductor, as well as the first end and the second end of the third winding, respectively serve as four of the ports of the inductor assembly, and the first end and the second end of the air core inductor respectively serve as two of the ports of the inductor assembly.

[0027] In a second aspect of the present application, a filter module is provided, comprising a protective device and an inductor assembly according to any of the above embodiments, wherein the protective device is fixed to a PCB or circuit board of the inductor assembly. The filter module can achieve all the effects of the inductor assembly.

[0028] In a third aspect of the present application, an electronic device is provided, comprising a housing and the aforementioned filter module, wherein the filter module is fixed in the housing. The electronic device can achieve all the effects of the filter module. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0030] FIG1 is a circuit diagram of a filter module and a switching power supply connected in the related art;

[0031] FIG2 is a schematic structural diagram of the differential mode inductor in FIG1 ;

[0032] FIG3 a is a schematic diagram showing the direction of the magnetic flux generated by the first winding and the second winding when a common-mode interference signal flows through the common-mode inductor in FIG1 ;

[0033] FIG3 b is a schematic diagram showing the direction of the magnetic flux generated by the first winding and the second winding when the differential mode current flows through the common mode inductor in FIG1 ;

[0034] FIG4 is a side view of FIG1;

[0035] FIG5 is a current variation curve of the filter module of the embodiment shown in FIG1 under surge or impact;

[0036] FIG6 is a schematic structural diagram of an inductor assembly in the first embodiment of the present application;

[0037] FIG7 is a side view of FIG6;

[0038] FIG8 is a top view of FIG6;

[0039] FIG9 is a circuit diagram of a filter module using the inductor assembly shown in FIG6 ;

[0040] FIG10 is a schematic diagram of a first structural example of an air core inductor according to the embodiment shown in FIG6 ;

[0041] FIG11 is a schematic diagram of a second structure of the air core inductor in the embodiment shown in FIG6 ;

[0042] FIG12 is a schematic diagram of a third structure of the air core inductor in the embodiment shown in FIG6 ;

[0043] FIG13 is a schematic diagram of a fourth structure of the air core inductor in the embodiment shown in FIG6 ;

[0044] FIG14 is a current distribution diagram obtained after testing the current distribution of the air core inductor shown in FIG10;

[0045] FIG15 is a current distribution diagram obtained after testing the current distribution of an air-core inductor including a first winding in a PCB winding;

[0046] FIG16 is a comparison diagram of air core inductances obtained after testing the air core inductances of the air core inductor shown in FIG10 and the air core inductor including a first winding in the PCB winding;

[0047] FIG17 is a schematic structural diagram of a differential and common-mode integrated inductor according to the embodiment shown in FIG6 ;

[0048] FIG18 is a schematic diagram of magnetic flux distribution obtained after testing the magnetic field generated by the differential and common-mode integrated inductors in the inductor assembly of the embodiment shown in FIG6 ;

[0049] FIG19 is a schematic diagram of magnetic flux distribution obtained after testing the magnetic field generated by the air core inductor in the inductor assembly of the embodiment shown in FIG6 ;

[0050] FIG20 is a schematic structural diagram of an inductor assembly in a second embodiment of the present application;

[0051] FIG21 is a circuit diagram of a filter module using the inductor assembly shown in FIG20;

[0052] FIG22 is a schematic structural diagram of an inductor assembly in a third embodiment of the present application;

[0053] FIG23 is a schematic structural diagram of an inductor assembly in a fourth embodiment of the present application;

[0054] FIG24 is a top view of FIG23;

[0055] FIG25 is a top view of FIG23;

[0056] FIG26 is a comparison diagram of the core common mode inductance obtained after testing the core common mode inductance provided by three filter modules with different structures;

[0057] FIG27 is a comparison diagram of the core differential mode inductance obtained after testing the core differential mode inductance provided by three filter modules with different structures;

[0058] FIG28 is a comparison diagram of air core differential mode inductance obtained after testing the air core differential mode inductance provided by three filter modules with different structures;

[0059] FIG29 is a back-end freewheeling comparison diagram obtained after testing the back-end freewheeling effect of the filter module including the inductor assembly shown in FIG9 with air core differential mode inductances of 1.08uH and 3.03uH;

[0060] FIG30 is a schematic structural diagram of an inductor assembly in a fifth embodiment of the present application;

[0061] FIG31 is a schematic structural diagram of the inductor assembly shown in FIG30 at the same viewing angle as the second plate surface and the second conductive line;

[0062] FIG32 is a schematic diagram showing the positional relationship among the first conductive line, the second conductive line, and the third conductive line of the inductor assembly shown in FIG30 .

[0063] Icons: 100-filter module; 200-switching power supply; 1-protection device; 2-capacitor; 3-inductor component; 301-decoupling inductor; 302-differential mode inductor; 3021-magnetic core; 3022-winding; 303-common mode inductor; 3031-magnetic core; 3032-first winding; 3033-second winding; 31-air core inductor; 311-PCB winding; 3111-PCB board; 3112-first winding; 3113-first board surface; 3114-second board surface; 3115-first conductive Wire; 3116-second conductive wire; 3117-third conductive wire; 312-gap; 32-differential common-mode integrated inductor; 321-base; 3211-connecting plate; 322-first magnetic core; 323-second magnetic core; 324-second winding; 325-third winding; 326-first magnetic ring; 327-second magnetic ring; 3271-third area; 3272-fourth area; 328-magnetic conductive structure; 3281-first magnetic conductor; 3282-second magnetic conductor; 329-magnetic core window; 33-circuit board. DETAILED DESCRIPTION

[0064] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0065] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one (item)" refers to one or more, and "plurality" refers to two or more. "At least one of the following items" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0066] In the description and claims of the embodiments of this application, the terms "first" and "second" are used to distinguish different objects, rather than to describe a specific order of objects. For example, the terms "first target object" and "second target object" are used to distinguish different objects, rather than to describe a specific order of objects.

[0067] "Connected", "connected" and similar words are used to express the intercommunication or interaction between different components, which may include direct connection or indirect connection through other components. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, including a series of steps or units. The method, system, product or device is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices. "Up", "down", "left", "right" and the like are only used with respect to the orientation of the components in the drawings. These directional terms are relative concepts. They are used for description and clarification relative to the description, which may change accordingly according to the change in the orientation of the components in the drawings.

[0068] In the embodiments of this application, words such as "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be interpreted as being preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner.

[0069] In the description of the embodiments of this application, unless otherwise specified, "multiple" means two or more. For example, "multiple processing units" means two or more processing units; "multiple systems" means two or more systems.

[0070] The following is an explanation of the professional terms designed in this application:

[0071] Decoupling: Prevents the current shock generated in the power supply circuit when the current size of the front and rear circuits changes from affecting the normal operation of the product.

[0072] Filtering: Filter out specific frequency bands in the received signal.

[0073] Differential mode interference signal: an unwanted potential difference between any two current-carrying conductors.

[0074] Common-mode interference signal: an unwanted potential difference between any current-carrying conductor and the reference ground.

[0075] Surge: A peak value that instantly exceeds the stable value, including surge voltage and surge current.

[0076] Inrush current: A large current generated inside a load when power is supplied to it.

[0077] Magnetic induction intensity: also known as magnetic flux density or magnetic flux density, it is a physical quantity that represents the magnetic flux passing through a standard area, with the symbol B.

[0078] Magnetization: A vector field representing the permanent or induced dipole magnetic moment of a magnetic material, usually represented by the symbol M.

[0079] Magnetic field strength: In a magnetic medium, if the magnetic induction intensity of a point is B and the magnetization intensity is M, the magnetic field strength of the point is defined as: H = B / μ0-M or B = μ0(H+M), where μ0 is the absolute magnetic permeability of vacuum.

[0080] Magnetic permeability: The degree of magnetization of a material in linear response to an external magnetic field. It is divided into absolute magnetic permeability and relative magnetic permeability. Absolute magnetic permeability is equal to the ratio of magnetic induction intensity B to magnetic field intensity H. The absolute magnetic permeability of vacuum is 4π×10 -7 H / m; relative permeability is the ratio of the absolute permeability of a substance to the absolute permeability of a vacuum. For common materials, magnetic permeability usually refers to relative permeability.

[0081] Core inductance: When the inductor has a magnetic core (relative magnetic permeability > 1), the ratio of the voltage induced in the conductor to the rate of change of the current that produces the voltage.

[0082] Air core inductance: The ratio of the voltage induced in the conductor to the rate of change of the current that produces the voltage when the inductor has no magnetic core (relative magnetic permeability = 1).

[0083] Magnetic flux: In a uniform magnetic field with a magnetic induction intensity of B, assuming a plane with an area of ​​S and perpendicular to the direction of the magnetic field, the product of the magnetic induction intensity B and the area S is the magnetic flux passing through the plane, referred to as magnetic flux.

[0084] Magnetic Circuit: A closed loop containing magnetic flux. Typically contains portions of materials with relative permeability > 1, such as permanent magnets, ferromagnetic materials, and electromagnets, but may also contain air gaps and other materials.

[0085] Air Gap: The air gap in the magnetic circuit.

[0086] Core differential mode leakage inductance: In the common mode inductor magnetic circuit, the magnetic flux in the air is usually not in the ferromagnetic material part, and when the ferromagnetic material part is not saturated, it is called the core differential mode leakage inductance of the common mode inductor.

[0087] Through-current: The maximum current that a conductor can carry when its internal temperature reaches a specified rise relative to room temperature.

[0088] Winding: A set of coils that form an electrical circuit corresponding to a certain inductance value marked on the inductor, with a specific number of turns.

[0089] Number of turns: The number of turns of a coil refers to the number of times the wire wraps around an object.

[0090] Terminal: The part where the load device is connected to the external conductor.

[0091] Interlinked flux: There is interaction between different magnetic circuits, which is called interlinked flux.

[0092] Mutual inductance: There is an interlinked magnetic flux between the two inductive magnetic circuits. Under the influence of this, the self-inductance values ​​of the two inductors will change. The coefficient of interaction between the two inductive magnetic circuits is called the mutual inductance of the two inductive magnetic circuits.

[0093] Litz wire: A special type of stranded wire or cable consisting of multiple individually insulated thin wires twisted or braided together.

[0094] Iron powder core: A magnetic core produced by batching, pressing and coating high-purity iron powder or hydroxyl iron powder.

[0095] Ferrite core: A magnetic core made of a dense and homogeneous ceramic structure non-metallic magnetic material. The materials of the ferrite core include iron oxide (Fe2O3) and one or more oxides or carbonate compounds of other metals (such as manganese, zinc, nickel or magnesium).

[0096] Metal powder core: A magnetic core made of metal alloy powder that can resist loss under high frequency conditions. It mainly includes four categories: iron powder core, sendust core, high flux powder core or molybdenum permalloy powder core.

[0097] Amorphous powder cores: Amorphous materials, also known as amorphous or glassy materials, are a broad class of rigid solids whose atoms and molecules exhibit neither periodicity nor translational symmetry. The long-range order of the crystalline state is destroyed. Only due to the interatomic interactions do they exhibit short-range order within a small region of a few atomic (or molecular) diameters. A magnetic core formed by grinding this material into powder, then pressing and coating it, is called an amorphous powder core.

[0098] Nanocrystalline powder core: A polycrystalline material with crystals measuring only a few nanometers (usually defined as crystals / grains less than 100 nanometers). Unlike amorphous materials, the long-range order of the crystalline state is retained. A magnetic core formed by pressing and coating the ground powder of this material is called a nanocrystalline powder core.

[0099] Sintering: converting powdered materials into dense bodies.

[0100] Ball milling: The materials are crushed and mixed by the impact of falling grinding bodies (such as steel balls) and the grinding action between the grinding bodies and the inner wall of the ball mill.

[0101] Strip throwing: The ultra-rapid cooling technology passes the liquid metal through a high-speed rotating wheel-mounted cooling device, and after high-speed cooling, it forms a solid thin strip with a thickness of 20μm to 40μm.

[0102] Metallization: The process of depositing a thin metal film on a non-metallic surface.

[0103] Through hole: A hole in a printed circuit board that connects the two outermost circuit layers (front and back).

[0104] Blind via: A hole in a printed circuit board that connects the outermost layer circuit to the adjacent inner layer circuit, but not to the opposite side.

[0105] Buried via: A hole in a printed circuit board that connects any two internal circuit layers but does not conduct to the outer layer.

[0106] Wireless base station products such as RRU, MIMO, photovoltaic energy station products or new energy charging piles are usually equipped with a power supply inside. The power port is provided with a filter module 100 as shown in Figure 1. As shown in Figure 1, the filter module 100 is electrically connected to the switching power supply 200. The filter module 100 includes a protective device 1, a capacitor 2 and an inductor component 3. The inductor component 3 includes a decoupling inductor 301, a differential mode inductor 302 and a common mode inductor 303. Among them, the differential mode inductor 302 and the common mode inductor 303 are both filter inductors. The protective device 1 can be a gas discharge tube, a varistor or a transient voltage suppressor diode (TVS tube). The first end of the protective device 1 is connected to the first end of the decoupling inductor 301, the second end of the decoupling inductor 301 and the first end of the capacitor 2 are connected to the first end of the differential mode inductor 302, and the second end of the capacitor 2 and the second end of the common mode inductor 303 are connected to the second end of the protective device 1. The second end of the differential mode inductor 302 is connected to the first end of the common mode inductor 303 , and the third end and the fourth end of the common mode inductor 303 are connected to two ends of the switching power supply 200 respectively.

[0107] The decoupling inductor 301 is used for starting the protection device 1 and the back-end freewheeling control, the common-mode inductor 303 is used for filtering the common-mode noise in the circuit, and the differential-mode inductor 302 is used for filtering the differential-mode noise in the circuit.

[0108] As shown in Figure 2, the differential-mode inductor 302 typically has a unidirectional, single-winding structure. Specifically, the differential-mode inductor 302 includes a magnetic core 3021 and a winding 3022 wound around the magnetic core 3021. Winding 3022 can be one. The differential-mode interference signal in the differential-mode inductor 302 is a current loop signal formed by the two input power lines in opposite directions. When flowing through the differential-mode inductor 302, it generates an induced electromotive force in the opposite direction, thereby weakening or preventing the differential-mode interference signal from changing over time. This effectively separates the signal from the interference in the differential-mode inductor 302.

[0109] As shown in Figures 3a and 3b, the common-mode inductor 303 typically includes a magnetic core 3031, and a first winding 3032 and a second winding 3033 wound in opposite directions around the magnetic core 3031. As shown in Figure 3a, the common-mode interference signal in the common-mode inductor 303 is a current I loop signal formed by the same direction and ground on the two input lines. When the common-mode interference signal flows through the first winding 3032 and the second winding 3033 of the common-mode inductor 303, due to the opposite winding directions of the first winding 3032 and the second winding 3033, the magnetic flux generated by the first winding 3032 and the second winding 3033 can be superimposed, resulting in a larger inductance, thereby filtering out the common-mode interference signal. As shown in Figure 3b, when the differential-mode current I flows through the common-mode inductor 303, the magnetic flux generated by the first winding 3032 and the second winding 3033 cancel each other out, preventing the generation of a reverse induced electromotive force and thus having no effect on the differential-mode current.

[0110] Wireless base station products often experience surge and inrush currents when the grid voltage is unstable or when lightning strikes occur. As shown in Figure 4, the resulting pulse peaks can reach thousands of amperes, potentially damaging circuit components. Decoupling inductor 301 is a differential-mode inductor 302, a common component in power supplies. It works in conjunction with protective device 1 to protect against surge and inrush currents.

[0111] The circuit diagram shown in Figure 1 can be simplified to the circuit diagram shown in Figure 5, where the post-stage working circuit in Figure 5 is equivalent to the combined circuit of capacitor 2, differential mode inductor 302, common mode inductor 303 and switching power supply 200 in Figure 1. As shown in Figure 5, the protection device 1 in the filter module 100 is in a high resistance state under normal conditions, with a flow rate of μA level, which can be considered as an open circuit state. When the voltage across the protection device 1 is higher than the voltage V at which the protection device 1 is turned on, the protection device 1 is turned on. 导通 When , it is in a low-resistance state, and the protective device 1 can be regarded as a conductor. Assuming that the lightning strike is input from the negative phase, because the lightning strike current is all at the KA level, only when I2 is as small as possible can the subsequent working circuit be safe. And I1 = I2 + I3, increasing I3 can reduce I2. The current I2 borne by the subsequent working circuit is usually at most 10% of I1, that is, I3 needs to take away more than 90% of the current of I1. At this time, the protective device 1 must be in a low-resistance state, and the role of the decoupling inductor 301 is to provide the high voltage required to make the protective device 1 in a low-resistance state. The decoupling inductor 301 is connected in parallel with the protective device 1, and the voltage V across the protective device 1 is 防护 ≈V 退耦 , and V 退耦 =L×(dI / dt), where L represents the inductance of the decoupling inductor 301. The voltage across the decoupling inductor 301 is the product of the time-varying rate of the current across the inductor and the inductance. 防护 ≥V 导通When V 防护 ≥V 导通 , the inductance value L of the decoupling inductor 301 needs to be as large as possible.

[0112] The decoupling inductor 301 can provide core inductance and air core inductance. As shown in Figure 4, the current development will go through three stages: rising period, peak period and falling period. For rising current, since the current has not yet caused the magnetic core of the decoupling inductor 301 to reach saturation, the reverse induced electromotive force is induced through the decoupling inductor 301, and the lightning protection device is turned on, which is mainly determined by the core inductance. For peak current and falling current, since the protection device 1 is already turned on and takes on more than 90% of the current-carrying task, it is only necessary to protect the current of about I2=I1×10%. The absolute magnitude of this current is generally about 100A~300A, which is called the back-end freewheeling of the protection device 1. At this time, since the inductor core has usually reached saturation, the core inductance no longer works, and I2 can only be controlled by relying on the air core inductance provided by the coil winding.

[0113] Currently, as shown in Figure 1, wireless base station products contain a decoupling inductor 301, a differential-mode inductor 302, and a common-mode inductor 303. These three inductors account for over 50% of the board area of ​​the filter module 100. To increase power density, the board area of ​​the filter module 100 needs to be reduced. This is typically achieved by miniaturizing the decoupling inductor 301, the common-mode inductor 303, and the differential-mode inductor 302. However, this results in a reduction in the inductance of each inductor, making it difficult to achieve the desired filtering and lightning protection performance of the filter module 100.

[0114] Based on this, as shown in Figures 6, 7 and 8, an embodiment of the present application provides an inductor component 3, which can be applied to the filter module 100 shown in Figure 9. As shown in Figure 9, in addition to the inductor component 3, the filter module 100 may also include a protective device 1 and a capacitor 2. In this embodiment, the inductor component 3 may include four ports, namely a first port a1, a second port a2, a third port a3 and a fourth port a4. The first end of the capacitor 2 is connected to the first end of the protective device 1 and connected to the first port a1 of the inductor component 3, and the second end of the capacitor 2 is connected to the second end of the protective device 1 and connected to the second port a2 of the inductor component 3. The third port a3 of the inductor component 3 is connected to the first end of the switching power supply 200, and the fourth port a4 of the inductor component 3 is connected to the second end of the switching power supply 200.

[0115] As shown in FIG6 , the inductor component 3 may include: an air core inductor 31 and a differential common mode integrated inductor 32. The differential common mode integrated inductor 32 may refer to an inductor that can simultaneously perform differential mode filtering and common mode filtering. The differential common mode integrated inductor 32 can provide core common mode inductance, core differential mode inductance, and air core inductance for the filter module 100 shown in FIG9 , and the air core inductor 31 can provide air core inductance. Thus, the differential common mode integrated inductor 32 and the air core inductor 31 can work together to provide sufficient core common mode inductance, core differential mode inductance, and air core inductance, thereby achieving filtering performance and lightning protection performance of the filter module 100.

[0116] As shown in FIG7 , the air core inductor 31 can be implemented by stacking planar air core inductors 31 . Specifically, the air core inductor 31 can include a PCB winding 311 . As shown in FIG10 , the PCB winding 311 includes a PCB board 3111 and a first winding 3112 disposed on the PCB board 3111 . The differential and common mode integrated inductor 32 shown in FIG6 is fixed to the PCB board 3111 , and the projection of the differential and common mode integrated inductor 32 on the PCB board 3111 overlaps with the first winding 3112 . In other words, the differential and common mode integrated inductor 32 and the air core inductor 31 are stacked in a direction perpendicular to the PCB board 3111 . When the filter module 100 is applied to an electronic device, the PCB board 3111 can serve as the circuit board 33 of the filter module 100 and be fixed within the housing of the electronic device and connected to the switching power supply 200 in the electronic device. Therefore, the surface area of ​​the PCB board 3111 is the board area of ​​the filter module 100 . Compared to the technical solution of fixing the decoupling inductor 301, the common-mode inductor 303 and the differential-mode inductor 302 on the circuit board 33 respectively, the embodiment of the present application integrates the common-mode inductor 303 and the differential-mode inductor 302 into a differential common-mode integrated inductor 32, and stacks the differential common-mode integrated inductor 32 and the air core inductor 31, thereby reducing the board area of ​​the PCB board 3111 of the air core inductor 31, thereby reducing the board area of ​​the filter module 100. Therefore, the embodiment of the present application can reduce the board area of ​​the filter module 100 while meeting the filtering performance and lightning protection performance of the filter module 100, thereby improving the integration of the filter module 100 and better supporting the miniaturization evolution. In addition, by comparing the circuit diagrams shown in Figures 1 and 9, it can be seen that the present embodiment can simplify the circuit topology.

[0117] As shown in FIG7 , the first winding 3112 and the differential and common-mode integrated inductor 32 are located on the same side of the PCB 3111, and a gap 312 is formed between the first winding 3112 and the differential and common-mode integrated inductor 32 in a direction perpendicular to the PCB 3111. In a specific configuration, a solder pad can be provided on the surface of the PCB 3111 where the first winding 3112 is provided, and the ports of the differential and common-mode integrated inductor 32 can be connected to the solder pad, thereby facilitating electrical connection between the differential and common-mode integrated inductor 32 and the circuit board 33. Furthermore, the solder pad on the PCB 3111 and the first winding 3112 can be manufactured in the same process, thereby improving the manufacturing convenience of the inductor assembly 3.

[0118] Furthermore, one side of the PCB 3111 may include a first area and a second area, with the second area surrounding the first area. The first winding 3112 is disposed in the first area, and the differential and common-mode integrated inductor 32 is fixed to the second area, with its projection on the PCB covering the projection of the air-core inductor 31. This fully utilizes the PCB 3111's surface area, further reducing the footprint of the inductor assembly 3 and, consequently, the footprint of the filter module 100.

[0119] Regarding the number of layers of PCB winding 311, in one possible embodiment, as shown in FIG7 , the air core inductor 31 includes multiple layers of sequentially stacked PCB windings 311, with the differential common-mode integrated inductor 32 disposed on the PCB board 3111 of the top PCB winding 311. The first windings 3112 of each two adjacent layers of PCB windings 311 are connected, specifically via copper pillars, metallized through-holes, metallized blind vias, or metallized buried vias. In this way, the first end of the first winding 3112 of the bottom PCB winding 311 can serve as the first end of the air core inductor 31, and the second end of the first winding 3112 of the top PCB winding 311 that is not connected to the other layers of PCB windings 311 can serve as the second end of the air core inductor 31. Because the inductance is positively correlated with the number of layers of PCB winding 311, when the air core inductor 31 includes multiple layers of PCB windings 311, the air core inductance provided by the air core inductor 31 can be increased. Furthermore, the stacked multi-layer PCB winding 311 does not increase the surface area of ​​the PCB board 3111. Therefore, this solution can increase the air core inductance while maintaining the footprint of the inductor component 3. In another possible embodiment, the air core inductor 31 may include a single layer of PCB winding 311.

[0120] Furthermore, regarding the number of first windings 3112 in each PCB winding 311, in one possible embodiment, as shown in FIG10 , the PCB winding 311 may include multiple first windings 3112. These multiple first windings 3112 have the same winding direction, and the first ends of each first winding 3112 are connected, and the second ends of each first winding 3112 are connected. Thus, when current passes through the air core inductor 31, it can enter each first winding 3112 from the first end, flow through each first winding 3112, and then flow out from the second end of each first winding 3112. Multiple first windings 3112 can provide greater inductance. Furthermore, the current flowing through each first winding 3112 is more similar in magnitude, i.e., the current distribution across each first winding 3112 is more even, thereby further improving the air core inductance.

[0121] Moreover, as shown in FIG10 , each first winding 3112 has the same length, thereby making the current flowing through each first winding 3112 more uniform, thereby further increasing the air core inductance provided by the air core inductor 31 .

[0122] In addition, it can be understood that in this embodiment, as shown in Figure 10, multiple first windings 3112 are wound to form a rectangular structure. In other embodiments, multiple first windings 3112 can be wound to form a polygonal structure with other numbers of sides or a circular structure.

[0123] In another possible embodiment, as shown in Figures 11, 12, and 13, the PCB winding 311 may include a first winding 3112. To increase the air core inductance generated by the first winding 3112, the cross-sectional size of the first winding 3112 may be increased. The first winding 3112 may be wound to form a polygonal or circular structure. For example, as shown in Figure 11, the first winding 3112 may be wound into a rectangular structure; or, as shown in Figure 12, the first winding 3112 may be wound into an octagonal structure; or, as shown in Figure 13, the first winding 3112 may be wound into a hexagonal structure. The air core inductor 31 may be manufactured using methods such as wire winding, lamination, or 3D printing.

[0124] Testing the current distribution of the air-core inductor 31 shown in Figure 10, which includes multiple first windings 3112, yielded the current distribution diagram shown in Figure 14. Testing the current distribution of the air-core inductor 31, which includes a single first winding 3112 within the PCB winding 311, yielded the current distribution diagram shown in Figure 15. As can be seen from Figures 14 and 15, the current distribution on each first winding 3112 is more uniform when the air-core inductor 31 includes multiple first windings 3112, compared to an air-core inductor 31 with a single first winding 3112.

[0125] The air core inductances generated by the air core inductor 31 shown in FIG10 , including multiple first windings 3112, and the air core inductor 31 shown in FIG11 , including a single first winding 3112, were tested, resulting in a comparison of the air core inductances shown in FIG16 . As shown in FIG16 , the solid line curve represents the air core inductance curve for the air core inductor 31 including multiple first windings 3112, while the dashed line curve represents the air core inductance curve for the air core inductor 31 including a single first winding 3112. FIG16 shows that the air core inductor 31 shown in FIG10 , including multiple first windings 3112, has a maximum air core inductance of 2.34 uH, while the air core inductor 31 shown in FIG11 , including a single first winding 3112, has a maximum air core inductance of 0.77 uH. This shows that the air core inductor 31 shown in FIG10 has a higher air core inductance.

[0126] As shown in FIG17 , the differential and common-mode integrated inductor 32 can be a horizontal rectangular magnetic toroidal inductor with an air-gap magnetic bridge. Specifically, the differential and common-mode integrated inductor 32 can include a base 321, a first magnetic core 322, a second magnetic core 323, a second winding 324, and a third winding 325. The base 321 includes two opposing connecting plates 3211. The first and second magnetic cores 322, 323 are parallel and fixed between the two connecting plates 3211. The first and second magnetic cores 322, 323 can be made of the same material. Exemplarily, the materials of the first and second magnetic cores 322, 323 can include iron powder cores, ferrite cores (such as manganese zinc and nickel zinc), metal magnetic powder cores (such as nickel iron, nickel iron molybdenum, and sendustine), amorphous powder cores and strips, nanocrystalline powder cores and strips, and the like. The first and second magnetic cores 322, 323 can be manufactured by sintering, ball milling, belt spinning, or integrated molding. Integrated molding can specifically be cold pressing or hot pressing.

[0127] As shown in Figure 17, the second winding 324 is wound around the first magnetic core 322, and the third winding 325 is wound around the second magnetic core 323. A magnetic core window 329 is formed between the second winding 324 and the third winding 325. The winding direction of the second winding 324 is opposite to that of the third winding 325. The direction of the magnetic field generated within the first magnetic core 322 is opposite to that of the magnetic field generated within the second magnetic core 323, thereby forming a common magnetic circuit structure. As a result, the differential common-mode integrated inductor 32 can provide cored common-mode inductance and cored differential-mode inductance.

[0128] As shown in Figure 8 , the axial directions of the first magnetic core 322 and the second magnetic core 323 are both parallel to the PCB board 3111. The magnetic fields generated by the differential common-mode integrated inductor 32 and the air-core inductor 31 in the inductor assembly 3 of the embodiment shown in Figure 6 were tested separately, and the magnetic flux distribution diagrams shown in Figures 18 and 19 were obtained. As can be seen from Figures 18 and 19 , the directions of the magnetic fields generated by the second winding 324 and the third winding 325 of the differential common-mode integrated inductor 32 are parallel to the PCB board 3111 shown in Figure 6 , while the direction of the magnetic field generated by the first winding 3112 of the air-core inductor 31 is perpendicular to the PCB board 3111. In other words, the magnetic field generated by the differential common-mode integrated inductor 32 is orthogonal to the magnetic field generated by the air-core inductor 31, thereby avoiding cross-linkage and thus avoiding the influence of mutual inductance, and thus preventing the reduction of filtering effect due to mutual inductance.

[0129] As shown in Figure 8, the first end of the third winding 325 of the differential common mode integrated inductor 32 is connected to the first end of the air core inductor 31, the first end of the second winding 324 of the differential common mode integrated inductor 32 serves as the first port a1 of the inductor component 3, the second end of the second winding 324 serves as the third port a3 of the inductor component 3, the second end of the third winding 325 serves as the second port a2 of the inductor component 3, and the second end of the air core inductor 31 serves as the fourth port a4 of the inductor component 3.

[0130] In other embodiments of the present application, as shown in FIG20 , the difference from the embodiment shown in FIG6 is that the number of ports of the inductor component 3 is different. In this embodiment, as shown in FIG20 , the inductor component 3 includes six ports, namely a first port a1, a second port a2, a third port a3, a fourth port a4, a fifth port a5 and a sixth port a6. As shown in FIG21 , the first end of the air core inductor 31 serves as the first port a1 of the inductor component 3 and is connected to the first end of the protective device 1. The second end of the air core inductor 31 serves as the second port a2 of the inductor component 3 and is connected to the first end of the capacitor 2. The first end of the second winding 324 of the differential common mode integrated inductor 32 serves as the third port a3 of the inductor component 3 and is connected to the first end of the capacitor 2, and the second end of the second winding 324 serves as the fourth port a4 of the inductor component 3 and is connected to the first end of the switching power supply 200. The first end of the third winding 325 is connected to the second end of the capacitor 2 as the fifth port a5 of the inductor component 3 , and the second end of the third winding 325 is connected to the second end of the switching power supply 200 as the sixth port a6 of the inductor component 3 .

[0131] In other embodiments of the present application, as shown in FIG22 , the difference from the embodiment shown in FIG6 lies in the structure of the air-core inductor 31 and the positional relationship between the air-core inductor 31 and the differential-common-mode integrated inductor 32. Specifically, in this embodiment, as shown in FIG22 , the inductor assembly 3 includes, in addition to the air-core inductor 31 and the differential-common-mode integrated inductor 32, a circuit board 33. The air-core inductor 31 includes a three-dimensional winding, which, along with the differential-common-mode integrated inductor 32, is fixed to the circuit board 33, with the three-dimensional winding located within the magnetic core window 329. In this way, the total board area occupied by the three-dimensional winding and the differential common-mode integrated inductor 32 is the same as the board area occupied by the differential common-mode integrated inductor 32. Compared with the technical solution in which the decoupling inductor 301, common-mode inductor 303, and differential-mode inductor 302 shown in FIG1 are separately fixed on the circuit board 33 shown in FIG22, the embodiment of the present application integrates the common-mode inductor and the differential-mode inductor into the differential common-mode integrated inductor 32, and arranges the three-dimensional inductor in the magnetic core window 329 of the differential common-mode integrated inductor 32, thereby reducing the board area of ​​the circuit board 33 and thus reducing the board area occupied by the inductor component 3. Therefore, the embodiment of the present application can reduce the occupied area of ​​the inductor component 3 while meeting the filtering performance and lightning protection performance of the filter module 100, thereby improving the integration of the inductor component 3 and better supporting the miniaturization evolution.

[0132] In one example, as shown in Figure 22, the axial direction of the first magnetic core 322 and the axial direction of the second magnetic core 323 are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common mode integrated inductor 32 is parallel to the circuit board 33, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board 33. In other words, the magnetic field generated by the differential common mode integrated inductor 32 is orthogonal to the magnetic field generated by the air core inductor 31, thereby avoiding cross-linking, thereby avoiding the influence of mutual inductance, and further avoiding the reduction of filtering effect due to mutual inductance. In another example, the axial direction of the first magnetic core 322 and the axial direction of the second magnetic core 323 are both parallel to the axial direction of the three-dimensional winding.

[0133] In other embodiments of the present application, as shown in Figures 23, 24, and 25, the difference from the embodiment shown in Figure 6 lies in the structure of the differential common-mode integrated inductor 32 and the structure of the air core inductor 31. Specifically, as shown in Figure 24, the differential common-mode integrated inductor 32 includes a first magnetic ring 326, a second magnetic ring 327 that is sleeved outside the first magnetic ring 326 and has a gap with the first magnetic ring 326, a second winding 324, and a third winding 325. The surface of the first magnetic ring 326 includes a third area 3271 and a fourth area 3272 that are connected. The second winding 324 is wound around the third area 3271, and the third winding 325 is wound around the fourth area 3272. The winding directions of the second winding 324 and the third winding 325 are opposite. As a result, the differential common-mode integrated inductor 32 of this structure can also form a common magnetic circuit structure, so that the differential common-mode integrated inductor 32 can provide core common-mode inductance and core differential-mode inductance.

[0134] As shown in Figure 24, the axial direction of the first magnetic ring 326 and the axial direction of the first magnetic ring 326 are both perpendicular to the PCB board 3111. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common-mode integrated inductor 32 is parallel to the PCB board 3111, while the direction of the magnetic field generated by the first winding 3112 of the air-core inductor 31 is perpendicular to the PCB board 3111. In other words, the magnetic field generated by the differential common-mode integrated inductor 32 is orthogonal to the magnetic field generated by the air-core inductor 31, thereby avoiding cross-linkage and the influence of mutual inductance, thereby preventing the reduction of filtering effect due to mutual inductance.

[0135] As shown in FIG24 , the differential and common-mode integrated inductor 32 further includes a magnetic conductive structure 328. A portion of the magnetic conductive structure 328 is connected to the interior of the first magnetic ring 326 and between the first magnetic ring 326 and the second magnetic ring 327. The second winding 324 and the third winding 325 are located on either side of the magnetic conductive structure 328. The low magnetic permeability of the magnetic conductive structure allows for conduction between the magnetic circuits generated by the second winding 324 and the third winding 325, thereby increasing the cored differential-mode inductance provided by the differential and common-mode integrated inductor 32.

[0136] Furthermore, as shown in FIG24 , the magnetic conductive structure 328 includes at least two first magnetic conductive bodies 3281 and a second magnetic conductive body 3282. Each first magnetic conductive body 3281 is connected between the first magnetic ring 326 and the second magnetic ring 327, and the second magnetic conductive body 3282 is connected to the interior of the first magnetic ring 326. The two first magnetic conductive bodies 3281 are located in opposite directions of the second magnetic conductive body 3282. This improves the magnetic circuit conduction function, thereby further increasing the core differential mode inductance provided by the differential common mode integrated inductor 32.

[0137] Moreover, in a specific implementation, the first magnetic conductor 3281 and the second magnetic conductor 3282 may both include magnetic adhesive, so that the first magnetic ring 326 and the second magnetic ring 327 can be bonded together by the magnetic adhesive.

[0138] As shown in Figure 23, the air core inductor 31 includes multiple layers of PCB windings 311. As shown in Figure 25, each layer of PCB windings 311 includes a PCB board 3111 and a first winding 3112. The first windings 3112 of two adjacent layers of PCB windings 311 are connected, so that the first end of the first winding 3112 of the PCB winding 311 on the bottom layer serves as the first end of the air core inductor 31, and the second end of the first winding 3112 of the PCB winding 311 on the top layer serves as the second end of the air core inductor 31.

[0139] As shown in FIG25 , in this embodiment, the first winding 3112 can be wound to form a hexagonal structure. In other embodiments, the first winding 3112 can be wound to form an octagonal structure or a circular structure. Furthermore, in this embodiment, the PCB winding 311 includes a single first winding 3112. In other embodiments, the PCB winding 311 may include multiple first windings 3112.

[0140] The cored common-mode inductance provided by the filter module 100 including the inductor component 3 shown in FIG6 , the filter module 100 including the inductor component 3 shown in FIG23 , and the filter module 100 including only the differential common-mode integrated inductor 32 but not the air-core inductor 31 was tested, resulting in a cored common-mode inductance comparison chart shown in FIG26 . The cored differential-mode inductance provided by the filter module 100 including the inductor component 3 shown in FIG6 , the filter module 100 including the inductor component 3 shown in FIG23 , and the filter module 100 including only the differential common-mode integrated inductor 32 but not the air-core inductor 31 was tested, resulting in a cored differential-mode inductance comparison chart shown in FIG27 . Air core differential mode inductance provided by a filter module 100 including the inductor assembly 3 shown in Figure 6 , a filter module 100 including the inductor assembly 3 shown in Figure 23 , and a filter module 100 including only the differential and common mode integrated inductor 32 but not the air core inductor 31 was tested, resulting in a comparison chart of air core differential mode inductance shown in Figure 28 The parameter table shown in Table 1 can be obtained from Figures 26 , 27 , and 28 .

[0141] Table 1

[0142] It can be seen from Table 1 that the cored common-mode inductance of the filter module 100 including the embodiment shown in Figure 6 and the filter module 100 including the embodiment shown in Figure 23 is both greater than 400uH, the cored differential-mode inductance of the filter module 100 including the embodiment shown in Figure 6 and the filter module 100 including the embodiment shown in Figure 23 is both greater than 10uH, and the air-core differential-mode inductance also has obvious advantages. It can be seen that the cored common-mode inductance of the embodiment shown in Figure 6 and the embodiment shown in Figure 23 can meet the basic requirements while also improving the cored differential-mode inductance and the air-core differential-mode inductance.

[0143] The back-end freewheeling effect of the filter module 100 including the inductor component 3 shown in Figure 9 was tested with air core differential mode inductances of 1.08uH and 3.03uH, and a back-end freewheeling comparison diagram shown in Figure 29 was obtained. Here, the air core differential mode inductance is mainly provided by the air core inductor 31. As can be seen from Figure 29, the back-end freewheeling with an air core differential mode inductance of 1.08uH is significantly greater than the back-end freewheeling with an air core differential mode inductance of 3.03uH, with peak values ​​of 1.5KA and 850A respectively. A higher back-end freewheeling will affect the switching power supply 200, for example, causing the switching power supply 200 to burn out. In other words, the back-end freewheeling with an air core differential mode inductance of 3.03uH is lower, thereby reducing the impact on the switching power supply 200.

[0144] It will be appreciated that, in this embodiment, the air-core inductor 31 is implemented by stacking planar air-core inductors 31. In other embodiments, the air-core inductor 31 may include a three-dimensional winding. In this case, the axial direction of the first magnetic ring 326 and the axial direction of the second magnetic ring 327 are both perpendicular to the axial direction of the three-dimensional winding. In this way, the direction of the magnetic field generated by the second winding 324 and the third winding 325 of the differential common-mode integrated inductor 32 is parallel to the circuit board 33, while the direction of the magnetic field generated by the three-dimensional winding is perpendicular to the circuit board 33. In other words, the magnetic field generated by the differential common-mode integrated inductor 32 is orthogonal to the magnetic field generated by the air-core inductor 31, thereby avoiding cross-linkage, thereby avoiding the influence of mutual inductance, and further preventing the reduction of filtering effect due to mutual inductance.

[0145] In other embodiments of the present application, as shown in Figures 30, 31, and 32, the difference from the embodiment shown in Figure 6 lies in the structure of the air core inductor 31. Specifically, the PCB board 3111 includes a first board surface 3113 as shown in Figure 30 and a second board surface 3114 as shown in Figure 31, with the first board surface 3113 and the second board surface 3114 being arranged opposite each other. The first winding 3112 includes a plurality of parallel first conductive wires 3115 as shown in Figure 30, a plurality of parallel second conductive wires 3116 as shown in Figure 31, and a plurality of parallel third conductive wires 3117 as shown in Figure 32. As shown in Figure 30, the plurality of first conductive wires 3115 are all arranged on the first board surface 3113. As shown in Figure 31, the plurality of second conductive wires 3116 are all arranged on the second board surface 3114. As shown in Figure 32, the projection of the first conductive line 3115 on the second board surface 3114 intersects with the second conductive line 3116, and multiple third conductive lines 3117 pass through from the first board surface 3113 to the second board surface 3114, and each third conductive line 3117 connects one first conductive line 3115 and one second conductive line 3116.

[0146] It is understood that the embodiments of the present application list several structures of air core inductors 31 as shown in Figures 10, 11, 12, 13, 22, and 25. In other embodiments, the differential common mode integrated inductor 32 can also be a planar ring air core wire inductor, etc.

[0147] It is also understood that the embodiments of the present application list two structures of differential common-mode integrated inductors 32, shown in FIG8 and FIG24. In other embodiments, the differential common-mode integrated inductor 32 may also be a UU-type common-mode inductor, a toroidal common-mode inductor, a differential-mode magnetic bridge inductor, an open-gap magnetic bridge inductor, an inner-outer-ring unbalanced winding inductor, a large-and-small-ring nested inductor, or a dual-ring inductor.

[0148] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of this application, ordinary technicians in this field can also make many forms without departing from the purpose of this application and the scope of protection of the claims, all of which are within the protection of this application.

Claims

1. An inductor component, characterized in that: include: An air core inductor and a differential common mode integrated inductor, wherein a magnetic core window is formed on the differential common mode integrated inductor; The air core inductor includes a printed circuit board (PCB) winding, the PCB winding includes a PCB board and a first winding provided on the PCB board, the differential and common mode integrated inductor is fixed on the PCB board, and the projection of the differential and common mode integrated inductor on the PCB board overlaps with the first winding; or, the inductor component also includes a circuit board, the air core inductor includes a three-dimensional winding, the three-dimensional winding and the differential and common mode integrated inductor are both fixed on the circuit board, and the three-dimensional winding is located in the magnetic core window.

2. The inductor assembly according to claim 1, wherein: The first winding and the differential common mode integrated inductor are located on the same side of the PCB board, and a gap is formed between the first winding and the differential common mode integrated inductor along a direction perpendicular to the PCB board.

3. The inductor assembly according to claim 2, characterized in that One side surface of the PCB board includes a first area and a second area, the second area surrounds the first area, the first winding is arranged in the first area, the differential common mode integrated inductor is fixed to the second area, and the projection of the second area on the board surface covers the projection of the air core inductor on the board surface.

4. The inductor assembly according to any one of claims 1 to 3, characterized in that: The air core inductor includes multiple layers of PCB windings stacked in sequence, the differential common mode integrated inductor is arranged on the PCB board of the PCB winding on the top layer, and the first windings in each two adjacent layers of PCB windings are connected.

5. The inductor assembly according to any one of claims 1 to 4, characterized in that: The PCB winding includes a plurality of first windings, and the plurality of first windings are wound in the same direction.

6. The inductor assembly according to claim 5, characterized in that The length of each of the first windings is the same.

7. The inductor assembly according to claim 1, wherein: The PCB board includes a first board surface and a second board surface opposite to each other; The first winding includes multiple parallel first conductive wires, multiple parallel second conductive wires and multiple parallel third conductive wires. The multiple first conductive wires are all arranged on the first board surface, and the multiple second conductive wires are all arranged on the second board surface. The projection of the first conductive wire on the second board surface intersects with the second conductive wire. The multiple third conductive wires pass through from the first board surface to the second board surface, and each of the third conductive wires connects one first conductive wire and one second conductive wire.

8. The inductor assembly according to any one of claims 1 to 7, characterized in that: The differential common-mode integrated inductor includes a base, a first magnetic core, a second magnetic core, a second winding and a third winding. The first magnetic core and the second magnetic core are parallel, the second winding is wound on the first magnetic core, and the third winding is wound on the second magnetic core. The magnetic core window is formed between the second winding and the third winding, and the winding direction of the second winding is opposite to the winding direction of the third winding.

9. The inductor assembly according to claim 8, characterized in that: The axial direction of the first magnetic core and the axial direction of the second magnetic core are both parallel to the PCB board.

10. The inductor assembly according to claim 9, characterized in that: The axial direction of the first magnetic core and the axial direction of the second magnetic core are both perpendicular to the axial direction of the three-dimensional winding.

11. The inductor assembly according to any one of claims 1 to 7, characterized in that: The differential common-mode integrated inductor includes a first magnetic ring, a second magnetic ring arranged outside the first magnetic ring and having a gap with the first magnetic ring, a second winding and a third winding, the surface of the first magnetic ring includes a connected third area and a fourth area, the second winding is wound on the third area, the third winding is wound on the fourth area, and the second winding and the third winding are wound in opposite directions.

12. The inductor assembly according to claim 11, characterized in that The axial direction of the first magnetic ring and the axial direction of the second magnetic ring are both perpendicular to the PCB board.

13. The inductor assembly according to claim 11, wherein: The axial direction of the first magnetic ring and the axial direction of the second magnetic ring are both perpendicular to the axial direction of the three-dimensional winding.

14. The inductor assembly according to any one of claims 11 to 13, characterized in that: The differential common-mode integrated inductor also includes a magnetic conductive structure, part of which is connected to the inside of the first magnetic ring, and part of which is connected between the first magnetic ring and the second magnetic ring, and the second winding and the third winding are respectively located on both sides of the magnetic conductive structure.

15. The inductor assembly according to claim 14, characterized in that: The magnetic conductive structure includes at least two first magnetic conductive bodies connected between the first magnetic ring and the second magnetic ring and a second magnetic conductive body connected inside the first magnetic ring, wherein the two first magnetic conductive bodies are located in two opposite extension directions of the second magnetic conductive body.

16. The inductor assembly according to claim 15, characterized in that The first magnetic conductor and the second magnetic conductor both include magnetic conductive glue.

17. The inductor assembly according to any one of claims 8 to 16, characterized in that: A first end of the third winding is connected to a first end of the air core inductor.

18. A filter module, characterized in that: It comprises a protective device and the inductor assembly according to any one of claims 1 to 17, wherein the protective device is fixed on a PCB board or a circuit board of the inductor assembly.

19. An electronic device, characterized in that: It comprises a housing and the filter module according to claim 18, wherein the filter module is fixed in the housing.

Citation Information

Patent Citations

  • Packaging Substrate

    CN111755411A

  • Inverter and integrated inductor

    CN115458293A

  • Passive low pass filter

    CN206922723U

  • Differential and common mode integrated inductor and inverter

    CN216287947U

  • Protective filter circuit

    CN216356472U