Electronic component

Abstract

[Problem] To enhance capacitance generated between two coils, which form a pair, in an electronic component having a structure in which a plurality of coil patterns are laminated. [Solution] An electronic component 100 has conductor layers L1-L4 embedded in an element body 10 and respectively having coil patterns 31-34 formed thereon. One end 31A of a coil pattern 31 is connected to one end 33A of a coil pattern 33, and one end 32A of a coil pattern 32 is connected to one end 34A of a coil pattern 34. The coil pattern 31 has a widened part 51 in which a pattern width is enlarged, and the coil pattern 32 has a widened part 52 in which a pattern width is enlarged. The widened part 51 and the widened part 51 overlap in the Z direction.

Description

Electronic Components

[0001] The present disclosure relates to electronic components.

[0002] Patent Document 1 discloses a common mode noise filter having a configuration in which first, second, third, and fourth spiral conductors are stacked in this order, the inner peripheral end of the first spiral conductor is connected to the inner peripheral end of the third spiral conductor, and the inner peripheral end of the second spiral conductor is connected to the inner peripheral end of the fourth spiral conductor.

[0003] JP 2012-248917 A

[0004] The characteristics of this type of electronic component change depending on the capacitance that occurs between the two coils that make up the pair.

[0005] This disclosure describes a technique for increasing the capacitance generated between two paired coils in an electronic component having a structure in which multiple coil patterns are stacked.

[0006] An electronic component according to one aspect of the present disclosure includes an element body, a coil section embedded in the element body and formed by alternately stacking a plurality of interlayer insulating films and a plurality of conductor layers, and first, second, third, and fourth terminal electrodes, wherein the plurality of conductor layers include a first conductor layer on which a first coil pattern is formed, a second conductor layer on which a second coil pattern is formed, a third conductor layer on which a third coil pattern is formed, and a fourth conductor layer on which a fourth coil pattern is formed, and the plurality of interlayer insulating films include a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third interlayer insulating film located between the third conductor layer and the fourth conductor layer, and The first coil pattern has a first widened portion in which the pattern width is widened, the second coil pattern has a second widened portion in which the pattern width is widened, and the first widened portion and the second widened portion have overlapping portions via the first interlayer insulating film when viewed in a plane from the stacking direction.

[0007] According to the present disclosure, a technique is provided for increasing the capacitance generated between two paired coils in an electronic component having a structure in which a plurality of coil patterns are stacked.

[0008] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to an embodiment of the technology disclosed herein. FIG. 2 is a schematic cross-sectional view of the electronic component 100. FIG. 3 is a schematic plan view illustrating the structure of a conductor layer L1. FIG. 4 is a schematic plan view illustrating the structure of a conductor layer L2. FIG. 5 is a schematic plan view illustrating the structure of a conductor layer L3. FIG. 6 is a schematic plan view illustrating the structure of a conductor layer L4. FIG. 7 is an equivalent circuit diagram of the electronic component 100.

[0009] Hereinafter, embodiments of the technology according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0010] FIG. 1 is a schematic perspective view showing the appearance of an electronic component 100 according to an embodiment of the technology disclosed herein.

[0011] The electronic component 100 illustrated in FIG. 1 is a four-terminal chip coil component and includes an element body 10 and terminal electrodes 21-24 exposed on the surface of the element body 10. The element body 10 has side surfaces 11 and 12 that form a YZ plane and are located opposite each other, side surfaces 13 and 14 that form an XZ plane and are located opposite each other, and a mounting surface 15 and a top surface 16 that form an XY plane and are located opposite each other. The mounting surface 15 and the side surfaces 11-14 may be orthogonal to each other or may have an angle within a certain range from the orthogonal angle (e.g., within the range of manufacturing error based on the orthogonal angle). The mounting surface 15 faces the circuit board during mounting, and four terminal electrodes 21-24 are exposed on the mounting surface 15. When viewed from the Z direction in a plan view of the element body 10, the X direction is the longitudinal direction and the Y direction is the lateral direction. The terminal electrodes 21 and 22 are adjacent to each other in the X direction, and the terminal electrodes 23 and 24 are adjacent to each other in the X direction. The terminal electrodes 21 and 23 are adjacent to each other in the Y direction, and the terminal electrodes 22 and 24 are adjacent to each other in the Y direction.

[0012] FIG. 2 is a schematic cross-sectional view of the electronic component 100.

[0013] In the example shown in Figure 2, four conductor layers L1 to L4 are embedded inside the element body 10. Interlayer insulating films 90 to 94 and conductor layers L1 to L4 are alternately stacked in the Z direction, which is the stacking direction, to form the coil section 20. Interlayer insulating film 91 is located between conductor layer L1 and conductor layer L2. Interlayer insulating film 92 is located between conductor layer L2 and conductor layer L3. Interlayer insulating film 94 is located between conductor layer L3 and conductor layer L4.

[0014] 3 to 6 are schematic plan views for explaining the structures of the conductor layers L1 to L4, respectively.

[0015] 3 , the conductor patterns provided on the conductor layer L1 include a coil pattern 31 and connection patterns 61, 62, and 65. The coil pattern 31 is a conductor pattern that wraps around for approximately one turn. One end 31A of the coil pattern 31 is connected to the upper conductor layer L2 via a via conductor 713. The other end 31B of the coil pattern 31 is connected to the upper conductor layer L2 via a via conductor 71. The connection patterns 61, 62, and 65 are connected to the upper conductor layer L2 via via conductors 72, 74, and 73, respectively.

[0016] In the example shown in FIG. 4 , the conductor patterns provided on the conductor layer L2 include a coil pattern 32, connection patterns 66-68, and a relay pattern 82. The coil pattern 32 is a conductor pattern that wraps around for approximately one turn. One end 32A of the coil pattern 32 is connected to the upper conductor layer L3 via a via conductor 715. The other end 32B of the coil pattern 32 is connected to the connection pattern 61 located on the conductor layer L1 via a via conductor 72, and is also connected to the upper conductor layer L3 via a via conductor 76. The connection pattern 66 is connected to the other end 31B of the coil pattern 31 located on the conductor layer L1 via a via conductor 71, and is also connected to the upper conductor layer L3 via a via conductor 75. The connection patterns 67 and 68 are connected to the connection patterns 65 and 62 located on the conductor layer L1 via via conductors 73 and 74, respectively, and are also connected to the upper conductor layer L3 via via conductors 77 and 78. The relay pattern 82 is connected to one end 31A of the coil pattern 31 located on the conductor layer L1 through a via conductor 713, and is also connected to the upper conductor layer L3 through a via conductor 714.

[0017] In the example shown in FIG. 5 , the conductor patterns provided on the conductor layer L3 include a coil pattern 33, connection patterns 69, 610, and 611, and a relay pattern 81. The coil pattern 33 is a conductor pattern that wraps around approximately one turn. One end 33A of the coil pattern 33 is connected to a relay pattern 82 located on the conductor layer L2 via a via conductor 714. The other end 33B of the coil pattern 33 is connected to a connection pattern 67 located on the conductor layer L2 via a via conductor 77 and to an upper conductor layer L4 via a via conductor 711. The connection pattern 610 is connected to the other end 32B of the coil pattern 32 located on the conductor layer L2 via a via conductor 76 and to an upper conductor layer L4 via a via conductor 710. The connection patterns 69 and 611 are connected to connection patterns 66 and 68 located on the conductor layer L2 via via conductors 75 and 78, respectively, and are also connected to an upper conductor layer L4 via via conductors 79 and 712. The relay pattern 81 is connected to one end 32A of the coil pattern 32 located on the conductor layer L2 through a via conductor 715, and is also connected to the upper conductor layer L4 through a via conductor 716.

[0018] In the example shown in FIG. 6 , the conductor patterns provided on the conductor layer L4 include a coil pattern 34 and connection patterns 63, 64, and 612. The coil pattern 34 is a conductor pattern that wraps around for approximately one turn. One end 34A of the coil pattern 34 is connected to a relay pattern 81 located on the conductor layer L3 via a via conductor 716. The other end 34B of the coil pattern 34 is connected to a connection pattern 610 located on the conductor layer L3 via a via conductor 712 and to a terminal electrode 24 via a via conductor 717. The connection pattern 64 is connected to the other end 33B of the coil pattern 33 located on the conductor layer L3 via a via conductor 711 and to a terminal electrode 23 via a via conductor 718. The connection patterns 63 and 612 are connected to connection patterns 69 and 610 located on the conductor layer L3 via via conductors 79 and 710, respectively, and are also connected to terminal electrodes 21 and 22 via via conductors 719 and 720.

[0019] With this configuration, one end 31A of coil pattern 31 and one end 33A of coil pattern 33 are connected to each other via relay pattern 82. The other end 31B of coil pattern 31 is connected to terminal electrode 21 via connection patterns 66, 69, and 63 that overlap in the stacking direction. The other end 33B of coil pattern 33 is connected to terminal electrode 23 via connection pattern 64. Furthermore, one end 32A of coil pattern 32 and one end 34A of coil pattern 34 are connected to each other via relay pattern 81. The other end 32B of coil pattern 32 is connected to terminal electrode 22 via connection patterns 610 and 612 that overlap in the stacking direction. The other end 34B of coil pattern 34 is connected to terminal electrode 24.

[0020] When viewed from the stacking direction, connection patterns 61, 610, 612 and connection patterns 62, 68, 611 are arranged in the Y direction. When viewed from the stacking direction, connection patterns 66, 69, 63 and connection patterns 65, 67, 64 are arranged in the Y direction. When viewed from the stacking direction, connection patterns 61, 610, 612 and connection patterns 66, 69, 63 are arranged in the X direction. When viewed from the stacking direction, connection patterns 62, 68, 611 and connection patterns 65, 67, 64 are arranged in the X direction. Furthermore, relay pattern 81 and relay pattern 82 are arranged in the X direction when viewed from the stacking direction.

[0021] FIG. 7 is an equivalent circuit diagram of the electronic component 100 according to this embodiment.

[0022] As shown in Fig. 7, coil patterns 31 and 33 are connected in series between terminal electrodes 21 and 23, thereby forming coil C1. Coil patterns 32 and 34 are connected in series between terminal electrodes 22 and 24, thereby forming coil C2. In the example shown in Figs. 3 to 6, the winding direction of coil C1 starting from terminal electrode 21 is opposite to the winding direction of coil C2 starting from terminal electrode 22. For this reason, for example, if terminal electrodes 21 and 22 are connected to a pair of differential signal lines, respectively, and terminal electrodes 23 and 24 are connected to a power supply circuit, electronic component 100 prevents differential components (signal components) flowing through the differential signal lines from flowing into the power supply circuit, while DC power supply components pass through electronic component 100.

[0023] 3 to 6, the base body 10 includes a magnetic material portion 17 made of a magnetic material and a resin material portion 18 made of a non-magnetic resin material. The magnetic material portion 17 may be made of a composite magnetic member containing a metal magnetic filler made of a magnetic material such as iron (Fe) or permalloy and a resin binder. The resin material portion 18 may be made of a resin material containing an inorganic filler such as silica and a resin binder.

[0024] 3 to 6, all of the conductor patterns formed on the conductor layers L1 to L4 are covered with the resin material portion 18. In other words, the resin material portion 18 is disposed between the conductor patterns formed on the conductor layers L1 to L4 and the magnetic material portion 17, and is not in contact with the magnetic material portion 17. On the other hand, most of the inner diameter region surrounded by the coil patterns 31 to 34 when viewed from the coil axis direction, and most of the outer region located between the coil patterns 31 to 34 and the side surfaces 13 and 14 of the element body 10, are made of the magnetic material portion 17. In contrast, the magnetic material portion 17 is not provided in the outer region located between the coil patterns 31 to 34 and the side surfaces 11 and 12 of the element body 10, and this region is entirely made of the resin material portion 18.

[0025] In the example shown in Fig. 3, widened portions 51 and 55 are provided in the coil pattern 31, where the pattern width is locally enlarged. In the example shown in Fig. 4, widened portions 52 and 56 are provided in the coil pattern 32, where the pattern width is locally enlarged. In the example shown in Fig. 5, widened portions 53 and 57 are provided in the coil pattern 33, where the pattern width is locally enlarged. In the example shown in Fig. 6, widened portions 54 and 58 are provided in the coil pattern 34, where the pattern width is locally enlarged.

[0026] Widened portions 51, 52, 57, and 58 are located at the ends of the coil patterns 31 to 34 on the -X direction side. Widened portion 51 is located between one end 31A and the other end 31B of coil pattern 31 and is sandwiched in the Y direction by connection patterns 61 and 62. Widened portion 52 is located on the one end 32A side of coil pattern 32. Widened portion 52 is located on the -Y direction side of connection pattern 68 and the other end 32B of coil pattern 32 and is sandwiched in the Y direction by section 41 connecting the other end 32B of coil pattern 32 and widened portion 52 via widened portion 56. Widened portion 57 is located between one end 33A and the other end 33B of coil pattern 33 and is sandwiched in the Y direction by connection patterns 610 and 611. Widened portion 58 is located on the one end 34A side of coil pattern 34. The widened portion 58 is located on the +Y direction side of the connection pattern 612 and the other end 34B of the coil pattern 34, and is sandwiched in the Y direction by a section 44 that connects the other end 34B of the coil pattern 34 and the widened portion 58 via the widened portion 54.

[0027] Widened portions 51 and 52 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 91. As a result, the capacitance between coil pattern 31 and coil pattern 32 increases in this portion. Widened portions 52 and 57 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 92. As a result, the capacitance between coil pattern 32 and coil pattern 33 increases in this portion. Widened portions 57 and 58 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 93. As a result, the capacitance between coil pattern 33 and coil pattern 34 increases in this portion.

[0028] In the example shown in FIG. 3 , the peripheral edge constituting the end of the widened portion 51 in the −X direction extends linearly in the Y direction. The peripheral edge of the widened portion 51 may be located on the same line as the edges of the connection patterns 61 and 62 located on the side surface 11, as indicated by dashed line A1. In the example shown in FIG. 4 , the peripheral edge constituting the end of the widened portion 52 in the −X direction extends linearly in the Y direction. The peripheral edge of the widened portion 52 may be located on the same line as the edges of the connection pattern 68 and the section 41 located on the side surface 11, as indicated by dashed line A2. In the example shown in FIG. 5 , the peripheral edge constituting the end of the widened portion 57 in the −X direction extends linearly in the Y direction. The peripheral edge of the widened portion 57 may be located on the same line as the edges of the connection patterns 610 and 611 located on the side surface 11, as indicated by dashed line A3. In the example shown in FIG. 6 , the peripheral edge constituting the end of the widened portion 58 in the −X direction extends linearly in the Y direction. As shown by dashed line A4, the outer peripheral edge of widened portion 58 may be located on the same straight line as connection pattern 612 and the edge located on side surface 11 of section 44. If widened portions 51, 52, 57, and 58 have such a pattern shape, the capacitance generated between coil patterns 31 and 33 and coil patterns 32 and 34 will increase further.

[0029] Furthermore, section 41 of coil pattern 32 overlaps with widened portion 51 of coil pattern 31 via interlayer insulating film 91, and also overlaps with widened portion 57 of coil pattern 33 via interlayer insulating film 92. Section 44 of coil pattern 34 overlaps with widened portion 57 of coil pattern 33 via interlayer insulating film 93. This further increases the capacitance generated between coil patterns 31, 33 and coil patterns 32, 34.

[0030] Furthermore, the widened portion 51 of the coil pattern 31 has a protrusion 98 that protrudes toward the inner diameter region of the coil pattern 31, and this portion overlaps with the relay pattern 81 in the stacking direction. This further increases the capacitance generated between the coil pattern 31 and the coil pattern 32.

[0031] Widened portions 55, 56, 53, and 54 are located at the ends of coil patterns 31 to 34 on the +X-direction side, respectively. Widened portion 55 is located on one end 31A side of coil pattern 31. Widened portion 55 is located on the -Y-direction side of connection pattern 65 and the other end 31B of coil pattern 31, and is sandwiched in the Y-direction by section 43 connecting the other end 31B of coil pattern 31 and widened portion 51. Widened portion 56 is located between one end 32A and the other end 32B of coil pattern 32, and is sandwiched in the Y-direction by connection patterns 66 and 67. Widened portion 53 is located on one end 33A side of coil pattern 33. Widened portion 53 is located on the +Y-direction side of the other end 33B of coil pattern 33, and is sandwiched in the Y-direction by connection pattern 69 and section 42 connecting the other end 33B of coil pattern 33 and widened portion 57. The widened portion 54 is located between one end 34A and the other end 34B of the coil pattern 34, and is sandwiched between the connection patterns 63 and 64 in the Y direction.

[0032] Widened portions 55 and 56 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 91. As a result, the capacitance between coil pattern 31 and coil pattern 32 increases in this portion. Widened portions 56 and 53 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 92. As a result, the capacitance between coil pattern 32 and coil pattern 33 increases in this portion. Widened portions 53 and 54 overlap in the Z direction, which is the stacking direction, via interlayer insulating film 93. As a result, the capacitance between coil pattern 33 and coil pattern 34 increases in this portion.

[0033] In the example shown in FIG. 3 , the peripheral edge constituting the end of the widened portion 55 in the +X direction extends linearly in the Y direction. The peripheral edge of the widened portion 55 may be located on the same line as the connection pattern 65 and the edges of the section 43 located on the side surface 12, as indicated by dashed line B1. In the example shown in FIG. 4 , the peripheral edge constituting the end of the widened portion 56 in the +X direction extends linearly in the Y direction. The peripheral edge of the widened portion 56 may be located on the same line as the edges of the connection patterns 66 and 67 located on the side surface 12, as indicated by dashed line B2. In the example shown in FIG. 5 , the peripheral edge constituting the end of the widened portion 53 in the +X direction extends linearly in the Y direction. The peripheral edge of the widened portion 53 may be located on the same line as the connection pattern 69 and the edges of the section 42 located on the side surface 12, as indicated by dashed line B3. In the example shown in FIG. 6 , the peripheral edge constituting the end of the widened portion 54 in the +X direction extends linearly in the Y direction. As shown by dashed line B4, the outer peripheral edge of widened portion 54 may be located on the same straight line as the edges of connection patterns 63 and 64 located on the side surface 12 side. If widened portions 53 to 56 have such a pattern shape, the capacitance generated between coil patterns 31 and 33 and coil patterns 32 and 34 will be further increased.

[0034] Furthermore, section 43 of coil pattern 31 overlaps with widened portion 56 of coil pattern 32 via interlayer insulating film 91. Section 42 of coil pattern 33 overlaps with widened portion 56 of coil pattern 32 via interlayer insulating film 92, and also overlaps with widened portion 54 of coil pattern 34 via interlayer insulating film 93. This further increases the capacitance generated between coil patterns 31, 33 and coil patterns 32, 34.

[0035] Furthermore, the widened portion 54 of the coil pattern 34 has a protruding portion 99 that protrudes toward the inner diameter region of the coil pattern 34, and this portion overlaps with the relay pattern 82 in the stacking direction. This further increases the capacitance generated between the coil pattern 33 and the coil pattern 34.

[0036] In this way, in electronic component 100 according to this embodiment, coil patterns 31 and 33 constituting coil C1 and coil patterns 32 and 34 constituting coil C2 are alternately stacked with interlayer insulating films 91 to 93 interposed therebetween, and widened portions 51 to 58 are provided in coil patterns 31 to 34, thereby increasing the capacitance between coils C1 and C2. This makes it possible to obtain a desired capacitance without using a separate capacitor component or the like.

[0037] Furthermore, the widened portions 51 to 58 are located in the longitudinal direction and at both ends in the X direction, which is the arrangement direction of the connection patterns 81 and 82, and since the magnetic material portion 17 of the base body 10 does not exist in this region, there is almost no reduction in inductance due to the provision of the widened portions 51 to 58.

[0038] That is, since the connection patterns 61 and 62 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 51 having a wide pattern width between them does not reduce the volume of the magnetic material part 17. Similarly, since the connection pattern 65 and the other end 31B of the coil pattern 31 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 55 having a wide pattern width between them does not reduce the volume of the magnetic material part 17.

[0039] In contrast, the connection pattern 61 and the other end 31B of the coil pattern 31 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. The patterns between the connection pattern 61 and the other end 31B of the coil pattern 31 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them. Similarly, the connection patterns 62 and 65 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. The patterns between the connection patterns 62 and 65 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them.

[0040] Furthermore, since the connection pattern 68 and the other end 32B of the coil pattern 32 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 52 with a wide pattern width between them does not result in a reduction in the volume of the magnetic material part 17. Similarly, since the connection pattern 66 and the connection pattern 67 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 56 with a wide pattern width between them does not result in a reduction in the volume of the magnetic material part 17.

[0041] In contrast, the connection pattern 66 and the other end 32B of the coil pattern 32 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. The patterns between the connection pattern 66 and the other end 32B of the coil pattern 32 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them. Similarly, the connection patterns 67 and 68 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. The patterns between the connection patterns 67 and 68 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them.

[0042] Furthermore, since the connection pattern 69 and the other end 33B of the coil pattern 33 are arranged in the Y direction via the resin material part 18 without via the magnetic material part 17, providing the widened part 53 with a wide pattern width between them does not reduce the volume of the magnetic material part 17. Similarly, since the connection pattern 610 and the connection pattern 611 are arranged in the Y direction via the resin material part 18 without via the magnetic material part 17, providing the widened part 57 with a wide pattern width between them does not reduce the volume of the magnetic material part 17.

[0043] In contrast, the connection pattern 611 and the other end 33B of the coil pattern 33 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. In other words, the patterns between the connection pattern 611 and the other end 33B of the coil pattern 33 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them. Similarly, the connection patterns 69 and 610 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. In other words, the patterns between the connection pattern 69 and the connection pattern 610 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them.

[0044] Furthermore, since the connection patterns 63 and 64 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 54 with a wide pattern width between them does not reduce the volume of the magnetic material part 17. Similarly, since the connection pattern 612 and the other end 34B of the coil pattern 34 are arranged in the Y direction via the resin material part 18 without the magnetic material part 17, providing the widened part 58 with a wide pattern width between them does not reduce the volume of the magnetic material part 17.

[0045] In contrast, the connection pattern 64 and the other end 34B of the coil pattern 34 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. In other words, the patterns between the connection pattern 64 and the other end 34B of the coil pattern 34 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them. Similarly, the connection patterns 63 and 612 are arranged in the X direction via the magnetic material portion 17 and the resin material portion 18, and no widened portion is provided between them. In other words, the patterns between the connection pattern 63 and the connection pattern 612 are formed with approximately the same width. This ensures a sufficient volume for the magnetic material portion 17 located between them.

[0046] The above describes embodiments of the technology according to the present disclosure, but the technology according to the present disclosure is not limited to the above embodiments, and various modifications are possible within the scope of the gist of the technology, and it goes without saying that these modifications are also included within the scope of the technology according to the present disclosure.

[0047] For example, although the electronic component 100 according to the above embodiment has four conductor layers, the number of conductor layers is not particularly limited, and may be six or more.

[0048] The technology according to the present disclosure includes, but is not limited to, the following configuration examples.

[0049] An electronic component according to one aspect of the present disclosure includes an element body, a coil section embedded in the element body and formed by alternately stacking a plurality of interlayer insulating films and a plurality of conductor layers, and first, second, third, and fourth terminal electrodes, wherein the plurality of conductor layers include a first conductor layer on which a first coil pattern is formed, a second conductor layer on which a second coil pattern is formed, a third conductor layer on which a third coil pattern is formed, and a fourth conductor layer on which a fourth coil pattern is formed, and the plurality of interlayer insulating films include a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third interlayer insulating film located between the third conductor layer and the fourth conductor layer, and an end of the first coil pattern electrically connected to one end of the third coil pattern, one end of the second coil pattern electrically connected to one end of the fourth coil pattern, the other end of the first coil pattern electrically connected to the first terminal electrode, the other end of the second coil pattern electrically connected to the second terminal electrode, the other end of the third coil pattern electrically connected to the third terminal electrode, the other end of the fourth coil pattern electrically connected to the fourth terminal electrode, the first coil pattern has a first widened portion where the pattern width is widened, the second coil pattern has a second widened portion where the pattern width is widened, and the first widened portion and the second widened portion have overlapping portions via the first interlayer insulating film when viewed in a plan view from the stacking direction, thereby increasing the capacitance generated between the first coil pattern and the second coil pattern.

[0050] In the electronic component, the second widened portion may be located on one end side of the second coil pattern, since the one end of the second coil pattern is connected to the one end of the fourth coil pattern, making it easier to provide the second widened portion.

[0051] In the electronic component, the third conductor layer may include a first relay pattern that electrically connects one end of the second coil pattern to one end of the fourth coil pattern, and the first widened portion and the first relay pattern may have an overlapping portion when viewed in a plan view from the stacking direction, thereby further increasing the capacitance generated between the first coil pattern and the second coil pattern.

[0052] In the electronic component, the portion of the first widened portion that overlaps with the first relay pattern may protrude toward the inner diameter region of the first coil pattern, thereby enabling the area of ​​the first widened portion to be further increased without increasing the external size of the element body.

[0053] In the electronic component, the second coil pattern may further have a first section connecting the other end of the second coil pattern and the second widened portion, and the first widened portion and the first section may have an overlapping portion interposed between them in a plan view from the stacking direction, with the first interlayer insulating film interposed therebetween, thereby further increasing the capacitance generated between the first coil pattern and the second coil pattern.

[0054] In the electronic component, the third coil pattern may have a third widened portion where the pattern width is widened, and the fourth coil pattern may have a fourth widened portion where the pattern width is widened, and the third widened portion and the fourth widened portion may have an overlapping portion via a third interlayer insulating film when viewed in a plan view from the stacking direction. This increases the capacitance generated between the third coil pattern and the fourth coil pattern.

[0055] In the electronic component, the third widened portion may be located on one end side of the third coil pattern, since the one end of the third coil pattern is connected to the one end of the first coil pattern, making it easy to provide the third widened portion.

[0056] In the electronic component, the second conductor layer may include a second relay pattern that electrically connects one end of the first coil pattern to one end of the third coil pattern, and the fourth widened portion and the second relay pattern may have an overlapping portion when viewed in a plan view from the stacking direction, thereby further increasing the capacitance generated between the third coil pattern and the fourth coil pattern.

[0057] In the electronic component, the portion of the fourth widened portion that overlaps with the second relay pattern in a plan view from the stacking direction may protrude toward the inner diameter region of the fourth coil pattern, thereby enabling the area of ​​the fourth widened portion to be further increased without increasing the external size of the element body.

[0058] In the electronic component, the third coil pattern may further include a second section connecting the other end of the third coil pattern and the third widened portion, and the fourth widened portion and the second section may overlap in the stacking direction via a third interlayer insulating film, thereby further increasing the capacitance generated between the third coil pattern and the fourth coil pattern.

[0059] In the electronic component, the first conductor layer may include a first connection pattern electrically connected to the second terminal electrode and a second connection pattern electrically connected to the fourth terminal electrode, and the first widened portion may be located between the first connection pattern and the second connection pattern, thereby enabling the area of ​​the first widened portion to be enlarged while maintaining the coil diameter of the first coil pattern.

[0060] In the electronic component, the fourth conductor layer may include a third connection pattern electrically connected to the first terminal electrode and a fourth connection pattern electrically connected to the third terminal electrode, and the fourth widened portion may be located between the third connection pattern and the fourth connection pattern, thereby enabling the area of ​​the fourth widened portion to be increased while ensuring the coil diameter of the fourth coil pattern.

[0061] In the electronic component described above, the first connection pattern and the second connection pattern may be arranged in a first direction when viewed from above in the stacking direction, the third connection pattern and the fourth connection pattern may be arranged in the first direction when viewed from above in the stacking direction, the first connection pattern and the third connection pattern may be arranged in a second direction perpendicular to the first direction when viewed from above in the stacking direction, the second connection pattern and the fourth connection pattern may be arranged in the second direction when viewed from above in the stacking direction, and the first relay pattern and the second relay pattern may be arranged in the second direction when viewed from above in the stacking direction. This allows the first to fourth widening portions to be arranged outward in the second direction when viewed from above in the stacking direction.

[0062] In the above electronic component, the base body includes a magnetic material portion made of a magnetic material and a resin material portion made of a non-magnetic resin material, the first conductor layer further includes a fifth connection pattern electrically connected to the third terminal electrode, the second conductor layer includes a sixth connection pattern electrically connected to the first terminal electrode, a seventh connection pattern electrically connected to the third terminal electrode, and an eighth connection pattern electrically connected to the fourth terminal electrode, the fifth connection pattern and the other end of the first coil pattern are arranged in a first direction, and the first connection pattern The first connection pattern and the other end of the first coil pattern are arranged in a second direction, the second connection pattern and the fifth connection pattern are arranged in a second direction, the eighth connection pattern and the other end of the second coil pattern are arranged in a first direction, the sixth connection pattern and the seventh connection pattern are arranged in the first direction, the sixth connection pattern and the other end of the second coil pattern are arranged in the second direction, the seventh connection pattern and the eighth connection pattern are arranged in the second direction, and in the first direction, there is a gap between the first connection pattern and the second connection pattern. In the first direction, no magnetic material portion is arranged, but a part of the resin material portion is arranged, between the fifth connection pattern and the other end of the first coil pattern, in the first direction, no magnetic material portion is arranged, but a part of the resin material portion is arranged, between the fifth connection pattern and the other end of the first coil pattern, in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the first connection pattern and the other end of the first coil pattern, in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the second connection pattern and the fifth connection pattern, in the first direction, It is also acceptable that no magnetic material portion is arranged between the sixth connection pattern and the other end of the second coil pattern, but only a portion of the resin material portion is arranged between the sixth connection pattern and the seventh connection pattern in the first direction, that part of the magnetic material portion and part of the resin material portion are arranged between the sixth connection pattern and the other end of the second coil pattern in the second direction, and that part of the magnetic material portion and part of the resin material portion are arranged between the seventh connection pattern and the eighth connection pattern in the second direction. This prevents a reduction in the volume of the magnetic material portion due to the provision of first and second widened portions with wide pattern widths.

[0063] In the above electronic component, the third conductor layer includes a ninth connection pattern connected to the first terminal electrode, a tenth connection pattern connected to the second terminal electrode, and an eleventh connection pattern connected to the fourth terminal electrode; the fourth conductor layer further includes a twelfth connection pattern connected to the second terminal electrode; the third connection pattern and the fourth connection pattern are arranged in a first direction; the twelfth connection pattern and the other end of the fourth coil pattern are arranged in the first direction; and the fourth connection pattern and the other end of the fourth coil pattern are arranged in a second direction. The third connection pattern and the twelfth connection pattern are arranged in the second direction, the ninth connection pattern and the other end of the third coil pattern are arranged in the first direction, the tenth connection pattern and the eleventh connection pattern are arranged in the first direction, the eleventh connection pattern and the other end of the third coil pattern are arranged in the second direction, the ninth connection pattern and the tenth connection pattern are arranged in the second direction, and in the first direction, no magnetic material portion is arranged between the third connection pattern and the fourth connection pattern, In the first direction, no magnetic material portion is arranged between the twelfth connection pattern and the other end of the fourth coil pattern, and only a portion of the resin material portion is arranged; in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the fourth connection pattern and the other end of the fourth coil pattern; in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the third connection pattern and the twelfth connection pattern; and in the first direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the ninth connection pattern and the third coil pattern. In the first direction, no magnetic material portion is arranged between the tenth connection pattern and the other end of the third coil pattern, but only a part of the resin material portion is arranged, in the first direction, no magnetic material portion is arranged between the tenth connection pattern and the eleventh connection pattern, in the second direction, part of the magnetic material portion and part of the resin material portion are arranged between the eleventh connection pattern and the other end of the third coil pattern, and in the second direction, part of the magnetic material portion and part of the resin material portion are arranged between the ninth connection pattern and the tenth connection pattern. This prevents a reduction in the volume of the magnetic material portion due to the provision of third and fourth widening portions with wider pattern widths.

[0064] In the electronic component described above, the first coil pattern further has a fifth widened portion located on one end side, the second coil pattern further has a sixth widened portion located between the sixth connection pattern and the seventh connection pattern, the third coil pattern further has a seventh widened portion located between the tenth connection pattern and the eleventh connection pattern, the fourth coil pattern further has an eighth widened portion located on one end side, and the fifth widened portion and the sixth widened portion may have overlapping portions across the first interlayer insulating film when viewed in a plan view from the stacking direction, the second widened portion and the seventh widened portion may have overlapping portions across the second interlayer insulating film when viewed in a plan view from the stacking direction, the third widened portion and the sixth widened portion may have overlapping portions across the second interlayer insulating film when viewed in a plan view from the stacking direction, and the seventh widened portion and the eighth widened portion may have overlapping portions across the third interlayer insulating film when viewed in a plan view from the stacking direction. This further increases the capacitance generated between the first coil pattern and the second coil pattern, the capacitance generated between the second coil pattern and the second coil pattern, and the capacitance generated between the third coil pattern and the fourth coil pattern.

[0065] In the above electronic component, the first coil pattern of the first coil pattern may further have a third section connecting the other end thereof to the first widened portion, the fourth coil pattern may further have a fourth section connecting the other end thereof to the fourth widened portion, the sixth widened portion and the third section may have an overlapping portion via the first interlayer insulating film when viewed in a plane from the stacking direction, the sixth widened portion and the second section may have an overlapping portion via the second interlayer insulating film when viewed in a plane from the stacking direction, the seventh widened portion and the first section may have an overlapping portion via the second interlayer insulating film when viewed in a plane from the stacking direction, and the seventh widened portion and the fourth section may have an overlapping portion via the third interlayer insulating film when viewed in a plane from the stacking direction. This increases the capacitance generated between the first coil pattern and the second coil pattern, increases the capacitance generated between the second coil pattern and the second coil pattern, and further increases the capacitance generated between the third coil pattern and the fourth coil pattern.

[0066] This application claims the benefit of Japanese Patent Application No. 2024-046260, filed March 22, 2024, the entire disclosure of which is incorporated herein by reference.

[0067] 10 Base body 11 to 14 Side surface 15 Mounting surface 16 Upper surface 17 Magnetic material portion 18 Resin material portion 20 Coil portion 21 to 24 Terminal electrodes 31 to 34 Coil patterns 31A, 32A, 33A, 34A One end 31B, 32B, 33B, 34B Other end 41 to 44 Sections 51 to 58 Widened portions 61 to 69, 610 to 612 Connection patterns 71 to 79, 710 to 720 Via conductors 81, 82 Connection patterns 90 to 94 Interlayer insulating films 98, 99 Protruding portions 100 Electronic components C1, C2 Coils L1 to L4 Conductor layers

Claims

1. A semiconductor device comprising: an element body; a coil portion embedded in the element body and formed by alternately stacking a plurality of interlayer insulating films and a plurality of conductor layers; and first, second, third and fourth terminal electrodes, wherein the plurality of conductor layers include a first conductor layer having a first coil pattern formed thereon, a second conductor layer having a second coil pattern formed thereon, a third conductor layer having a third coil pattern formed thereon, and a fourth conductor layer having a fourth coil pattern formed thereon; the plurality of interlayer insulating films include a first interlayer insulating film located between the first conductor layer and the second conductor layer, a second interlayer insulating film located between the second conductor layer and the third conductor layer, and a third interlayer insulating film located between the third conductor layer and the fourth conductor layer; one end of the first coil pattern is electrically connected to one end of the third coil pattern; and one end of the second coil pattern is electrically connected to one end of the fourth coil pattern. an electronic component, wherein the other end of the first coil pattern is electrically connected to the first terminal electrode, the other end of the second coil pattern is electrically connected to the second terminal electrode, the other end of the third coil pattern is electrically connected to the third terminal electrode, and the other end of the fourth coil pattern is electrically connected to the fourth terminal electrode, the first coil pattern has a first widened portion in which the pattern width is widened, and the second coil pattern has a second widened portion in which the pattern width is widened, and the first widened portion and the second widened portion have overlapping portions interposed between them, with the first interlayer insulating film interposed between them, when viewed in a plane from the stacking direction.

2. The electronic component according to claim 1, wherein the second widened portion is located on the one end side of the second coil pattern.

3. The electronic component according to claim 2, wherein the third conductor layer includes a first relay pattern that electrically connects the one end of the second coil pattern and the one end of the fourth coil pattern, and the first widened portion and the first relay pattern have overlapping portions when viewed in a plane from the stacking direction.

4. The electronic component according to claim 3, wherein the portion of the first widened portion that overlaps with the first relay pattern protrudes toward an inner diameter region of the first coil pattern.

5. The electronic component according to claim 1, wherein the second coil pattern further has a first section connecting the other end of the second coil pattern and the second widened portion, and the first widened portion and the first section have an overlapping portion via the first interlayer insulating film when viewed in a plane from the stacking direction.

6. The electronic component according to claim 1, wherein the third coil pattern has a third widened portion in which the pattern width is widened, the fourth coil pattern has a fourth widened portion in which the pattern width is widened, and the third widened portion and the fourth widened portion have overlapping portions via the third interlayer insulating film when viewed in a plane from the stacking direction.

7. The electronic component according to claim 6, wherein the third widened portion is located on the one end side of the third coil pattern.

8. The electronic component according to claim 7, wherein the second conductor layer includes a second relay pattern that electrically connects the one end of the first coil pattern and the one end of the third coil pattern, and the fourth widened portion and the second relay pattern have overlapping portions when viewed in a plane from the stacking direction.

9. The electronic component according to claim 8, wherein a portion of the fourth widened portion that overlaps with the second relay pattern when viewed in a plane from the stacking direction protrudes toward an inner diameter region of the fourth coil pattern.

10. The electronic component according to claim 6, wherein the third coil pattern further has a second section connecting the other end of the third coil pattern and the third widened portion, and the fourth widened portion and the second section overlap in the stacking direction via the third interlayer insulating film.

11. An electronic component according to any one of claims 6 to 10, wherein the first conductor layer includes a first connection pattern electrically connected to the second terminal electrode and a second connection pattern electrically connected to the fourth terminal electrode, and the first widened portion is located between the first connection pattern and the second connection pattern.

12. The electronic component described in claim 11, wherein the fourth conductor layer includes a third connection pattern electrically connected to the first terminal electrode and a fourth connection pattern electrically connected to the third terminal electrode, and the fourth widened portion is located between the third connection pattern and the fourth connection pattern.

13. The electronic component according to claim 12, wherein the first connection pattern and the second connection pattern are arranged in a first direction when viewed in a plane from the stacking direction, the third connection pattern and the fourth connection pattern are arranged in the first direction when viewed in a plane from the stacking direction, the first connection pattern and the third connection pattern are arranged in a second direction perpendicular to the first direction when viewed in a plane from the stacking direction, the second connection pattern and the fourth connection pattern are arranged in the second direction when viewed in a plane from the stacking direction, and the first relay pattern and the second relay pattern are arranged in the second direction when viewed in a plane from the stacking direction.

14. The base body includes a magnetic material portion made of a magnetic material and a resin material portion made of a non-magnetic resin material, the first conductor layer further includes a fifth connection pattern electrically connected to the third terminal electrode, the second conductor layer includes a sixth connection pattern electrically connected to the first terminal electrode, a seventh connection pattern electrically connected to the third terminal electrode, and an eighth connection pattern electrically connected to the fourth terminal electrode, the fifth connection pattern and the other end of the first coil pattern are arranged in the first direction, the first connection pattern and the other end of the first coil pattern are arranged in the second direction, the second connection pattern and the fifth connection pattern are arranged in the second direction, the eighth connection pattern and the other end of the second coil pattern are arranged in the first direction, the sixth connection pattern and the seventh connection pattern are arranged in the first direction, and the sixth connection pattern and the other end of the second coil pattern are arranged in the second direction, the seventh connection pattern and the eighth connection pattern are arranged in the second direction; in the first direction, the magnetic material portion is not arranged between the first connection pattern and the second connection pattern, but a part of the resin material portion is arranged; in the first direction, the magnetic material portion is not arranged between the fifth connection pattern and the other end of the first coil pattern, but a part of the resin material portion is arranged; in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the first connection pattern and the other end of the first coil pattern; in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the second connection pattern and the fifth connection pattern; in the first direction, the magnetic material portion is not arranged between the eighth connection pattern and the other end of the second coil pattern, but a part of the resin material portion is arranged; in the first direction, the magnetic material portion is not arranged between the eighth connection pattern and the other end of the second coil pattern, but a part of the resin material portion is arranged;14. The electronic component of claim 13, wherein in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the sixth connection pattern and the other end of the second coil pattern, and in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the seventh connection pattern and the eighth connection pattern.

15. The third conductor layer includes a ninth connection pattern connected to the first terminal electrode, a tenth connection pattern connected to the second terminal electrode, and an eleventh connection pattern connected to the fourth terminal electrode; the fourth conductor layer further includes a twelfth connection pattern connected to the second terminal electrode; the third connection pattern and the fourth connection pattern are arranged in the first direction; the twelfth connection pattern and the other end of the fourth coil pattern are arranged in the first direction; the fourth connection pattern and the other end of the fourth coil pattern are arranged in the second direction; the third connection pattern and the twelfth connection pattern are arranged in the second direction; the ninth connection pattern and the other end of the third coil pattern are arranged in the first direction; the tenth connection pattern and the eleventh connection pattern are arranged in the first direction; and the eleventh connection pattern and the other end of the third coil pattern are arranged in the second direction; the ninth connection pattern and the tenth connection pattern are arranged in the second direction; in the first direction, the magnetic material portion is not arranged between the third connection pattern and the fourth connection pattern, and a part of the resin material portion is arranged; in the first direction, the magnetic material portion is not arranged between the twelfth connection pattern and the other end of the fourth coil pattern, and a part of the resin material portion is arranged; in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the fourth connection pattern and the other end of the fourth coil pattern; in the second direction, a part of the magnetic material portion and a part of the resin material portion are arranged between the third connection pattern and the twelfth connection pattern; in the first direction, the magnetic material portion is not arranged between the ninth connection pattern and the other end of the third coil pattern, and a part of the resin material portion is arranged; In the first direction, the magnetic material portion is not disposed between the tenth connection pattern and the eleventh connection pattern, and a part of the resin material portion is disposed between the tenth connection pattern and the eleventh connection pattern;15. The electronic component of claim 14, wherein in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the 11th connection pattern and the other end of the third coil pattern, and in the second direction, a portion of the magnetic material portion and a portion of the resin material portion are arranged between the 9th connection pattern and the 10th connection pattern.

16. The first coil pattern further has a fifth widened portion located on the one end side, the second coil pattern further has a sixth widened portion located between the sixth connection pattern and the seventh connection pattern, the third coil pattern further has a seventh widened portion located between the tenth connection pattern and the eleventh connection pattern, the fourth coil pattern further has an eighth widened portion located on the one end side, the fifth widened portion and the sixth widened portion have overlapping portions interposed between the first interlayer insulating film when viewed in a plane from the stacking direction, the second widened portion and the seventh widened portion have overlapping portions interposed between the second interlayer insulating film when viewed in a plane from the stacking direction, and the third widened portion and the sixth widened portion have overlapping portions interposed between the second interlayer insulating film when viewed in a plane from the stacking direction. The electronic component according to claim 15 , wherein the seventh widened portion and the eighth widened portion have a portion that overlaps with each other with the third interlayer insulating film interposed therebetween when viewed in a plan view from the stacking direction.

17. The electronic component according to claim 16, wherein the first coil pattern further has a third section connecting the other end of the first coil pattern and the first widened portion, the fourth coil pattern further has a fourth section connecting the other end of the fourth coil pattern and the fourth widened portion, the sixth widened portion and the third section have an overlapping portion interposed between the first interlayer insulating film when viewed in a plane from the stacking direction, the sixth widened portion and the second section have an overlapping portion interposed between the second interlayer insulating film when viewed in a plane from the stacking direction, the seventh widened portion and the first section have an overlapping portion interposed between the second interlayer insulating film when viewed in a plane from the stacking direction, and the seventh widened portion and the fourth section have an overlapping portion interposed between the third interlayer insulating film when viewed in a plane from the stacking direction.

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