Shaping method and shaping device

Abstract

This shaping method, using a shaping device provided with a deflection member that can deflect processing light that is irradiated from a light source, carries out additive shaping onto an object of a shaping material that is supplied toward the object with the processing light. The shaping method carries out: a first step for causing a relative scanning of the processing light over the object by changing the relative positional relationship between the deflection member and the object without changing the deflection direction of deflection of the processing light by the deflection member; and a second step for scanning the processing light by deflection by the deflection member.

Description

Molding method and molding device

[0001] The present invention relates to the technical field of a molding method and a molding apparatus.

[0002] An example of a method for manufacturing a shaped object is described in Patent Document 1. One of the technical challenges of such a processing system is to appropriately set irradiation conditions of a beam for manufacturing the shaped object.

[0003] US Patent Application Publication No. 2019 / 0168499

[0004] According to a first aspect, a modeling method is provided in which a modeling device is provided with a deflection member capable of deflecting processing light incident from a light source, and a modeling material supplied toward the object by the processing light is additively modeled on the object, the modeling method comprising: a first step of changing the relative positional relationship between the deflection member and the object without changing the deflection direction in which the processing light is deflected by the deflection member, and scanning the processing light relative to the object; and a second step of deflecting the processing light with the deflection member and scanning the processing light.

[0005] According to a second aspect, a modeling method is provided in which a modeling device is provided with a deflection member capable of deflecting processing light incident from a light source, and a modeling material supplied toward the object with the processing light is additively modeled, the modeling method comprising: a first step of scanning the processing light and modeling a first portion of the object with the modeling material; and a second step of deflecting the processing light with the deflection member and scanning the processing light without changing the relative positional relationship between the deflection member and the object, thereby modeling a second portion of the object in an area surrounded by the first portion with the modeling material.

[0006] According to a third aspect, there is provided a modeling method for additively modeling modeling material supplied to an object with processing light using a modeling device equipped with a deflecting member capable of deflecting processing light incident from a light source, the method simultaneously performing a relative movement that moves the deflecting member and the object relatively in a first direction and deflecting the processing light by the deflecting member in accordance with the relative movement, scanning the processing light on the object in a second direction that intersects with the first direction, and additively modeling the object with the supplied material.

[0007] According to a fourth aspect, there is provided a modeling apparatus that additively models a modeling material on an object using processing light from a light source, comprising: an irradiation optical system including a deflection member capable of deflecting incident processing light; a moving device capable of moving at least one of the deflection member and the object; and a control device that controls the deflection member and the moving device, wherein the control device is capable of executing a first control that controls the moving device to change the relative positional relationship between the deflection member and the object without the deflection direction of the processing light by the deflection member; and a second control that controls the deflection member so that the moving device deflects the processing light without changing the relative positional relationship between the deflection member and the object.

[0008] According to a fifth aspect, a modeling device is provided that additively models a modeling material on an object using processing light from a light source, the modeling device comprising: an irradiation optical system including a deflection member capable of deflecting incident processing light; a moving device capable of moving at least one of the deflection member and the object; and a control device that controls the deflection member and the moving device, wherein the control device simultaneously performs a first control that controls the moving device to move the deflection member and the object relatively in a first direction, and a second control that controls the deflection member to deflect the processing light in accordance with the first control, thereby scanning the processing light on the object in a second direction that intersects the first direction.

[0009] 15 is a cross-sectional view showing the configuration of the processing system of the present embodiment. FIG. 16 is a block diagram showing the configuration of the processing system of the present embodiment. FIG. 17 is a plan view showing an end face of a material nozzle. FIG. 18 is a cross-sectional view showing the configuration of an irradiation optical system. FIG. 19 is a cross-sectional view showing a process of modeling a three-dimensional structure. FIG. 19 is a cross-sectional view showing a process of modeling a structure layer by a first modeling operation. FIG. 20 is a cross-sectional view showing a process of modeling a structure layer by a second modeling operation. FIG. 21 is a conceptual diagram showing a method of modeling a structured object by the first modeling mode. FIG. 22 is a conceptual diagram showing a method of modeling a structured object by the second modeling mode. FIG. 23 is a conceptual diagram showing a method of modeling a structured object by the third modeling mode. FIG. 24 is a conceptual diagram showing a method of modeling a structured object by the fourth modeling mode. FIG. 25 is a conceptual diagram showing a method of modeling an object by the fifth modeling mode. FIG. 26 is a diagram showing a process of modeling a three-dimensional structure. FIG. 27 is a cross-sectional view showing an example of a turbine blade. FIG. 28 is a cross-sectional view showing an example of a cross section of the turbine blade shown in FIG. 14. FIG. 29 is a flowchart showing the operation of modeling a structured layer by the high-definition mode. FIG. 29 is a flowchart showing the operation of modeling a structured layer by the intermediate mode. FIG. 29 is a flowchart showing the operation of modeling a structured layer by the high-speed mode.

[0010] Hereinafter, a processing system SYS that performs additive processing (additive modeling) based on laser metal deposition (LMD) will be described with reference to the drawings. The additive processing based on laser metal deposition is additive processing that forms a three-dimensional structure ST (modeled object) that is integrated with the workpiece W or that can be separated from the workpiece W by melting a modeling material M supplied to the workpiece W with processing light EL (an energy beam in the form of light).

[0011] In other words, the processing system SYS can be said to be a 3D printer that processes an object using additive manufacturing technology. The additive manufacturing technology may also be called rapid prototyping, rapid manufacturing, or additive manufacturing. Laser build-up welding (LMD) may also be called directed energy deposition (DED).

[0012] In the following description, the positional relationships of the various components constituting the machining system SYS will be described using an XYZ Cartesian coordinate system defined by mutually orthogonal X, Y, and Z axes. For ease of explanation, the X-axis and Y-axis directions are each assumed to be horizontal (predetermined directions within a horizontal plane), and the Z-axis direction is assumed to be vertical (a direction perpendicular to the horizontal plane, essentially the up-down direction). The rotation directions (tilt directions) around the X-axis, Y-axis, and Z-axis are assumed to be the θX direction, θY direction, and θZ direction, respectively. Here, the Z-axis direction may be assumed to be the vertical direction. The XY plane may also be assumed to be horizontal.

[0013] (1) Configuration of the machining system SYS (1-1) Overall configuration of the machining system SYS First, the configuration of the machining system SYS of this embodiment will be described with reference to Figures 1 and 2. Figure 1 is a cross-sectional view that schematically shows the configuration of the machining system SYS of this embodiment. Figure 2 is a block diagram that shows the configuration of the machining system SYS of this embodiment.

[0014] The processing system SYS comprises a stage unit 3 on which a workpiece (object to be processed) W is placed, a processing unit 2 that performs additional processing on the workpiece W, and a control unit 7 (control device) that controls the stage unit 3 and the processing unit 2.

[0015] (1-2) Configuration of Stage Unit 3 The stage unit 3 includes a stage 31 and a stage driving mechanism 32. The stage 31 is disposed in a forming space inside the chamber 6 of the processing system SYS, and the workpiece W is placed thereon. For this reason, the stage 31 may be referred to as a mounting device. Specifically, the workpiece W is placed on a stage mounting surface 311, which is one surface of the stage 31 (e.g., the upper surface facing the +Z side). The stage 31 is capable of supporting the workpiece W placed thereon. The stage 31 may also be capable of holding the workpiece W placed thereon. In this case, the stage 31 may include at least one of a mechanical chuck, an electrostatic chuck, a vacuum chuck, or the like, to hold the workpiece W. Furthermore, the workpiece W may be attached to a holder, or the holder to which the workpiece W is attached may be placed on the stage 31. The holder may also be called a jig, a holder, a holding member, a mounting member, a fixing member, or a clamp.

[0016] In the machining system SYS according to this embodiment, additional machining is performed on the workpiece W to form a three-dimensional structure ST (modeled object) integrated with the workpiece W. The workpiece W is an object, i.e., a three-dimensional structure, and may be another three-dimensional structure modeled by the machining system SYS, i.e., an existing model. Furthermore, the three-dimensional structure ST modeled integrally with the workpiece W may be separable from the workpiece W after modeling. Additionally, in the machining system SYS according to this embodiment, additional machining is performed on the workpiece W (three-dimensional structure ST) placed on the stage 31, but this is not limiting, and the stage 31 may be regarded as the workpiece W, and additional machining may be performed on the stage 31.

[0017] The workpiece W may be made of a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher, similar to the shaping material M described below, and may be the same as or different from the shaping material M. For example, a metallic material or a resinous material can be used as the material of the workpiece W, but other materials may also be used. Examples of metallic materials include a material containing copper, a material containing tungsten, and a material containing stainless steel.

[0018] The stage driving mechanism 32 is a driving mechanism including a driving source such as a motor that can move the stage 31. When the stage driving mechanism 32 moves the stage 31, the relative positional relationship between the processing head 22 (a condensing optical system 50 provided in the processing head 22), which will be described later, and the stage 31 (a workpiece W placed on the stage 31) changes. Therefore, the stage driving mechanism 32 functions as a position changing device (driving device) that can change the relative positional relationship between the stage 31 and the condensing optical system 50, respectively, and the stage 31 and the workpiece W. The stage driving mechanism 32 is configured to be able to move the stage 31 along at least one of the X-axis, Y-axis, Z-axis, θX direction, θY direction, and θZ direction, for example.

[0019] (1-3) Configuration of the processing unit 2 The processing unit 2 includes an irradiation unit 4 that irradiates the workpiece W with processing light EL, a material supply unit 6 that supplies molding material for additional processing on the workpiece W, and a head drive mechanism 23.

[0020] (1-3-1) Configuration of the Material Supply Unit 6 The material supply unit 6 includes a material supply device 61, a gas supply device 62, a mixer 63, and a material nozzle 12. The material supply device 61 is a device capable of supplying a powder modeling material M. The modeling material M is not limited to a powder, and a wire-like modeling material or a gaseous modeling material may also be used. The modeling material M is a material that can be melted by irradiation with processing light EL of a predetermined intensity or higher. For example, a metallic material or a resinous material can be used as such a modeling material M, but other materials may also be used. Examples of metallic materials include a material containing copper, a material containing tungsten, and a material containing stainless steel.

[0021] The gas supply device 62 is a device capable of supplying gas. The mixer 63 is a device connected to the material supply device 61 and the gas supply device 62, and mixes the powdered modeling material M supplied from the material supply device 61 with the gas supplied from the gas supply device 62. In other words, the gas supply device 62 supplies a conveying gas (pressurized gas) for conveying the powdered modeling material M supplied from the material supply device 61 and mixed in the mixer 63. As the conveying gas, for example, a purge gas made of an inert gas such as nitrogen or argon, which is injected to replace the gas in the chamber 6, can be used. The gas supply device 62 can be a cylinder containing an inert gas, or, if the inert gas is nitrogen gas, a nitrogen gas generator that generates nitrogen gas using atmospheric air as a raw material.

[0022] The material nozzle 64 is disposed in the modeling space inside the chamber 6 of the processing system SYS and is capable of supplying the modeling material M. More specifically, the material nozzle 64 is connected to the mixer 63 and injects (sprays, ejects, or sprays) the modeling material M transported by the pressurized gas onto the workpiece W. In other words, the material nozzle 64 supplies the modeling material M together with the transport gas. For this reason, the material nozzle 64 may also be referred to as a material supply member or a supply device (material supply device).

[0023] The material nozzle 64 is formed with a material supply port 641. For example, as shown in FIG. 3 , which is a plan view showing the end face of the material nozzle 64, the end face 640 of the material nozzle 64 may have an annular material supply port 641. In the example shown in FIG. 3 , the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis is circular, but it may have a shape other than circular. For example, the shape of the outer edge of the material supply port 641 in a plane intersecting the Z axis may be elliptical or polygonal. In the example shown in FIG. 3 , the end face 640 of the material nozzle 64 has the material supply port 641, which is a continuous opening in an annular or ring-shaped configuration. However, the end face of the material nozzle 64 may have a plurality of material supply ports 641, which are circular, elliptical, rectangular, or other annular openings, as well as arc-shaped openings.

[0024] (1-3-2) Configuration of Irradiation Unit 4 The irradiation unit 4 includes a light source unit 40 and an irradiation device 21 (FIG. 2). The light source unit 40 includes two light sources 40, which are energy beam sources. The light source 40 is an energy beam source that emits, for example, at least one of infrared light, visible light, and ultraviolet light as processing light EL. However, other types of light may be used as the processing light EL. The processing light EL may include multiple pulsed lights (multiple pulse beams). The processing light EL may be laser light. In this case, the light source 40 may include a laser light source (for example, a semiconductor laser such as a laser diode (LD)). Examples of laser light sources include fiber lasers, CO ２ At least one of a laser, a YAG laser, an excimer laser, etc. may be used. However, the processing light EL does not have to be laser light. The light source 40 may include any light source (for example, at least one of an LED (Light Emitting Diode), a discharge lamp, etc.).

[0025] In the light source unit 40, the characteristics of the processing light EL#1 emitted by the light source 40#1 and the characteristics of the processing light EL#2 emitted by the light source 40#2 may be the same or different. The characteristics include, for example, the wavelength (typically, the peak wavelength, which is the wavelength at which the intensity is greatest in the wavelength band of the processing light EL#1), the wavelength band (typically, the range of wavelengths at which the intensity is equal to or greater than a certain value), the intensity, and the absorptance (with respect to the peak wavelength) in the workpiece W (or the object whose surface MS is the surface of which is the printing surface MS).

[0026] In the present embodiment, the processing system SYS (light source unit 40) is described as having a plurality of light sources 40#1, 40#2. However, the present invention is not limited to this. Two or more light sources may be provided, or a single light source may be provided. For example, when a single light source 40#1 that emits (supplies) light in a wide wavelength band or multiple wavelengths is used, the emitted light may be wavelength-divided to generate processing light EL#1 and processing light EL#2 having different wavelengths, or the emitted light may be amplitude-divided or polarization-divided.

[0027] The irradiation device 21 is a device for emitting processing light EL and includes an irradiation optical system 211 and a focusing optical system 50. The irradiation optical system 211 is an optical system for emitting the processing light EL. Specifically, the irradiation optical system 211 is optically connected to a light source 40 that emits (generates) the processing light EL via an optical transmission member such as an optical fiber or a light pipe.

[0028] The processing system SYS, and thus the light source unit 4, has two light sources 40#1 and 40#2, which are optically connected via optical transmission members so that the light sources 40#1 and 40#2 are incident on the irradiation device 21, and thus the irradiation optical system 211. In the following description, when there is no need to distinguish between the "processing light EL#1" generated by the light source 40#1 and the "processing light EL#2" generated by the light source 40#2, they will be referred to as the "processing light EL."

[0029] (a) Configuration of the Irradiation Device 21 Next, the configuration of the irradiation device 21 will be described with reference to Fig. 4. Fig. 4 is a diagram showing the configuration of the irradiation optical device 21.

[0030] The irradiation device 21 comprises a focusing optical system 50 that focuses light and irradiates it onto the workpiece W (printing surface MS), and an irradiation optical system 211 that causes processing light EL#1 incident from light source 40#1 and processing light EL#2 incident from light source 40#2 to enter the focusing optical system 50.

[0031] The irradiation optical system 211 includes a first optical system 41#1 onto which the processing light EL#1 emitted from the light source 40#1 is incident, and a second optical system 41#2 onto which the processing light EL#2 emitted from the light source 40#2 is incident. The first optical system 41#1 and the second optical system 41#2 have similar configurations, except that they are arranged symmetrically with respect to the irradiation device 21 (the prism mirror 52 described later). The configurations of the first optical system 41#1 and the second optical system 41#2 will be described below. Note that in the following description, when describing the configuration of the first optical system 41#1 related to the processing light EL#1 incident from the light source 40#1 or the processing light EL#1 incident from the light source 40#1, the suffix "#1" is added to the end of the reference numeral of each component to distinguish them from each other. Similarly, in the description intended for the configuration of the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2 or the processing light EL#2 incident from the light source 40#2, "#2" is added to the end of the reference numeral of each component to distinguish and describe it. On the other hand, when the first optical system 41#1 related to the processing light EL#1 incident from the light source 40#1 and the second optical system 41#2 related to the processing light EL#2 incident from the light source 40#2 have the same configuration, or when the processing light EL#1 incident from the light source 40#1 and the processing light EL#2 incident from the light source 40#2 are similar, the description will be made without distinguishing between them and without adding "#1" or "#2" to the end of the reference numeral of each component.

[0032] (b) Configuration of the first optical system 41#1 and the second optical system 41#2 The first optical system 41#1 and the second optical system 41#2 each include a collimator lens 42 (42#1, 42#2), a beam splitter 43 (43#1, 43#2), a galvanometer scanner 44 (44#1, 44#2), and a power meter 47 (47#1, 47#2).

[0033] The processing light EL (EL#1, EL#2) emitted from the light source 40 (40#1, 40#2) is incident on the collimator lens 42 (42#1, 42#2), respectively. The collimator lens 42 converts the processing light EL incident on the collimator lens 42 into parallel light. The processing light EL converted by the collimator lens 42 into parallel light is incident on the beam splitter 43. In this embodiment, the beam splitter 43 uses a parallel plane substrate made of a light-transmitting material such as glass. The beam splitter 43 is disposed obliquely with respect to the optical path of the processing light EL incident on the beam splitter 43. A portion of the processing light EL incident on the beam splitter 43 passes through the beam splitter 43. The other portion of the processing light EL incident on the beam splitter 43 is reflected by the beam splitter 43. In this way, the beam splitter 43 may be any device capable of splitting the incident processing light EL, and may be a plane-parallel substrate or a prism that reflects part of the incident processing light EL and transmits part of it.

[0034] The processing light EL that has passed through the beam splitter 43 is incident on a galvanometer scanner 44. The galvanometer scanner 44 includes a focus control optical system 45 and a galvanometer mirror 46. The processing light EL that has passed through the beam splitter 43 is incident on the focus control optical system 45.

[0035] The focus control optical system 45 is an optical element that can change the focus position CP (CP#1, CP#2) of the processing light EL. In this embodiment, the focus position CP of the processing light EL may refer to the focus position where the processing light EL is focused. The focus position CP of the processing light EL may refer to the convergence position where the processing light EL is most convergent in the irradiation direction (traveling direction) of the processing light EL.

[0036] Specifically, the focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction of the processing light EL emitted from the irradiation device 21. The focus control optical system 45 can change the focus position CP of the processing light EL along the irradiation direction (approximately the Z-axis direction) of the processing light EL that the irradiation device 21 irradiates onto the printing surface MS (e.g., the surface of the workpiece W or the structure layer SL). In the example shown in Fig. 4, the irradiation direction of the processing light EL is a direction intersecting with the printing surface MS, and the irradiation device 21 irradiates the processing light EL onto the printing surface MS from above the workpiece W. Therefore, the focus control optical system 45 can change the focus position CP of the processing light EL along the direction intersecting with the printing surface MS.

[0037] The focus control optical system 45 may include, for example, multiple optical elements (e.g., multiple lenses) aligned along the irradiation direction of the processing light EL. That is, the focus control optical system 45 may include, for example, multiple refractive optical elements aligned along the irradiation direction of the processing light EL. In this case, the focus control optical system 45 changes the focus position CP of the processing light EL by moving at least one of the multiple optical elements (refractive optical elements) along its optical axis direction. However, the focus control optical system 45 may also include a reflective optical element such as a mirror, and the focus position CP of the processing light EL may be changed by moving the reflective optical element.

[0038] When the focus control optical system 45 changes the focus position CP of the processing light EL, the positional relationship between the focus position CP of the processing light EL and the printing surface MS changes. In particular, the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL (approximately the Z-axis direction) changes. Therefore, the focus control optical system 45 changes the positional relationship (positional relationship in the Z-axis direction) between the focus position CP of the processing light EL and the printing surface MS by changing the focus position CP of the processing light EL. The focus control optical system 45 changes the distance (distance in the Z-axis direction) between the focus position CP of the processing light EL and the printing surface MS by changing the focus position CP of the processing light EL.

[0039] The processing light EL emitted from the focus control optical system 45 is incident on the galvanometer mirror 46. The galvanometer mirror 46 deflects the processing light EL to change the emission direction of the processing light EL emitted from the galvanometer mirror 46. For this reason, the galvanometer mirror 46 may also be referred to as a deflection optical system.

[0040] The galvanometer mirror 46 includes, for example, an X-scanning mirror 46MX, an X-scanning motor 46AX, a Y-scanning mirror 46MY, and a Y-scanning motor 46AY. The processing light EL emitted from the focus control optical system 45 is incident on the X-scanning mirror 46MX from the Z-axis direction. The X-scanning mirror 46MX reflects the processing light EL incident on the X-scanning mirror 46MX toward the Y-scanning mirror 46MY. The Y-scanning mirror 46MY reflects the processing light EL incident on the Y-scanning mirror 46MY toward the focusing optical system 50. Note that each of the X-scanning mirror 46MX and the Y-scanning mirror 46MY may be referred to as a galvanometer mirror.

[0041] The X-scan motor 46AX can swing or rotate the X-scan mirror 46MX around a rotation axis along the Y-axis. In other words, the angle of the X-scan mirror 46MX can be changed by the X-scan motor 46AX with respect to the optical path of the processing light EL incident on the X-scan mirror 46MX, thereby changing the deflection angle of the processing light EL. For this reason, the X-scan mirror 46MX may also be referred to as a deflection member. In this case, swinging or rotating the X-scan mirror 46MX allows the processing light EL to scan in a direction perpendicular to the Y-axis (the X-axis direction across the printing surface MS).

[0042] The Y-scan motor 46AY can swing or rotate the Y-scan mirror 46MY around a rotation axis along the X-axis. In other words, the angle of the Y-scan mirror 46MY can be changed relative to the optical path of the processing light EL incident on the Y-scan mirror 46MY, thereby changing the deflection angle of the processing light EL. For this reason, the Y-scan mirror 46MY may also be referred to as a deflection member. In this case, swinging or rotating the Y-scan mirror 46MY allows the processing light EL to scan in a direction perpendicular to the X-axis (the Y-axis direction across the printing surface MS).

[0043] Here, the area within which the galvanometer mirror 46 (46#1, 46#2) can move the irradiation area EA on the printing surface MS while the positional relationship between the irradiation device 21 and the printing surface MS is fixed (without changing) is defined as the processing unit area PUA (PUA#1, PUA#2). In other words, the processing unit area PUA indicates the area (range) within which additional processing can be performed by the processing head 22 scanning the processing light EL and moving the irradiation area EA while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA is the maximum area within which the galvanometer mirror 46 can move the target irradiation area EA on the printing surface MS while the positional relationship between the irradiation device 21 and the printing surface MS is fixed. In other words, the processing unit area PUA is a virtual area located on the printing surface MS at a position determined based on the processing head 22 (irradiation device 21).

[0044] When the emission direction of the processing light EL emitted from the galvanometer mirror 46 is changed, the position where the processing light EL is emitted from the processing head 22 is changed, which in turn moves the irradiation area EA onto the printing surface MS where the processing light EL is irradiated, and moves the irradiation position of the processing light EL on the printing material M. Therefore, the galvanometer mirror 46 functions as a position changing device (irradiation position moving device) that can move the irradiation position of the processing light EL on the printing surface MS or in the space between the material nozzle 64 and the printing surface MS, and also functions as a scanning optical system (deflection scanning optical system) that scans the processing light EL so as to move the irradiation position of the processing light EL.

[0045] The galvano scanner 44 does not necessarily have to include the focus control optical system 45. Even in this case, if the positional relationship between the irradiation optical system 41 and the printing surface MS in the irradiation direction of the processing light EL changes, the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL changes. Therefore, even if the galvano scanner 44 does not include the focus control optical system 45, the processing system SYS can change the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL. For example, the processing system SYS may use the stage drive mechanism 32 or the head drive mechanism 23 described later to change the positional relationship between the focus position CP of the processing light EL and the printing surface MS in the irradiation direction of the processing light EL.

[0046] The processing light EL reflected by the beam splitter 43 enters the power meter 47. The power meter 47 is a device capable of detecting the intensity of the processing light EL (EL#1, EL#2) incident thereon. Because the beam splitters 43 (43#1, 43#2) are disposed on the optical path of the processing light EL between the light source 40 (40#1, 40#2) and the galvanometer mirror 46 (46#1, 46#2), the power meter 43 detects the intensity of the processing light EL traveling along the optical path between the light source 40 and the galvanometer mirror 46. In this case, the power meter 47 can stably detect the intensity of the processing light EL without being affected by the deflection of the processing light EL by the galvanometer mirror 46. However, the position of the power meter 47 is not limited to the example shown in FIG. 4 . For example, the power meter 47 may detect the intensity of the processing light EL traveling along the optical path between the galvanometer mirror 46 and the printing surface MS. The power meter 47 may detect the intensity of the processing light EL traveling along the optical path in the galvanometer mirror 46. The detection result of the power meter 47 is output to the control unit 7, which will be described later.

[0047] The power meter 47 may include, for example, a light-receiving element that detects the processed light EL as light. Furthermore, since the higher the intensity of the processed light EL, the greater the amount of energy in the processed light EL and the greater the amount of heat generated by the processed light EL, the power meter 47 may detect the intensity of the processed light EL by detecting the heat generated by the processed light EL. In this case, the power meter 47 may include a heat-detecting element that detects the heat generated by the processed light EL.

[0048] (c) Configuration of the focusing optical system 50 The focusing optical system 50 includes a prism mirror 51 and an fθ lens 52. In other words, the prism mirror 51 and the fθ lens 52 are integrated as the focusing optical system 50 so that their relative positions do not change. The processing light EL#1 emitted from the first optical system 41#1 and the processing light EL#2 emitted from the second optical system 41#2 are each incident on the prism mirror 51. The prism mirror 51 reflects each of the processing light EL#1 and EL#2 toward the fθ lens 52. The prism mirror 51 reflects the processing light EL#1 and EL#2, which are incident on the prism mirror 51 from different directions, toward approximately the same direction (the fθ lens 52).

[0049] The fθ lens 52 is an optical system that emits the processing light EL (EL#1, EL#2) reflected by the prism mirror 51 toward the printing surface MS. The processing light EL that passes through the fθ lens 52 is irradiated onto the printing surface MS. In other words, the fθ lens 52 is the final optical element for irradiating the processing light EL reflected by the prism mirror 51 onto the printing surface MS.

[0050] The fθ lens 52 is an optical element that emits the processing light EL toward the printing surface MS and can focus the processing light EL on a focusing surface. For this reason, the fθ lens 52 may be referred to as a focusing optical system. The focusing surface of the fθ lens 52 may be set, for example, on the printing surface MS. In this case, the focusing optical system 50 has a projection characteristic of fθ. However, the focusing optical system 50 may have a projection characteristic different from fθ. For example, the focusing optical system 50 may have a projection characteristic of f tan θ or a projection characteristic of f sin θ.

[0051] The optical axis AX of the fθ lens 52 is an axis along the Z-axis. Therefore, the fθ lens 52 emits the processing light EL approximately along the Z-axis direction. In this case, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may both be directions along the optical axis AX of the fθ lens 52. However, the irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 do not have to be the same direction. The irradiation direction of the processing light EL#1 and the irradiation direction of the processing light EL#2 may be mutually different directions.

[0052] If the light reflected from the prism mirror 51 can be focused on a focusing surface, the focusing optical system 50 does not need to include the fθ lens 52. In this case, the final optical element is the prism mirror 51, and the processing light EL reflected from the prism mirror 51 is irradiated onto the printing surface MS.

[0053] (1-4) Configuration of Head Unit 20 In addition to the irradiation device 21 of the irradiation unit 4, the head unit 20 includes a processing head 22 having a material nozzle 64 of the material supply unit 6, and a head drive mechanism 23 that enables the processing head 22 to move within the modeling space inside the chamber 6 of the processing system SYS. The processing head 22, and therefore the head unit 20, may further include a light source unit 40, i.e., the irradiation unit 4, and may further include a mixing device 63.

[0054] The processing head 22 is configured so that the irradiation device 21 and the material nozzle 64 are positioned integrally or at least within a predetermined distance range. Therefore, the processing head 22 is capable of supplying the modeling material M through the material nozzle 64 to the position irradiated with the processing light EL by the focusing optical system 50.

[0055] The head driving mechanism 23 is a driving mechanism including a driving source such as a motor that can move the processing head 22, i.e., the irradiation device 21 and the material nozzle 64, under the control of the control unit 7, which will be described later. When the head driving mechanism 23 moves the processing head 22, the relative positional relationship between the processing head 22 (the focusing optical system 50 provided in the processing head 22) and the stage 31 (the workpiece W placed on the stage 31) changes, just as when the stage driving mechanism 32 moves the stage 31. Therefore, the head driving mechanism 23 functions as a position changing device (driving device) that can change the relative positional relationship between the focusing optical system 50 and each of the stage 31 and the workpiece W. The head driving mechanism 23 is configured to move the processing head 22, for example, along at least one of the X-axis direction, Y-axis direction, Z-axis direction, θX direction, θY direction, and θZ direction.

[0056] (1-5) Configuration of Control Unit 7 Next, the configuration of the control unit 7 will be described. As shown in Fig. 2, the control unit 7 includes a calculation device 71 and a storage device 72. The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. The calculation device 71, the storage device 72, the output device 73, the input device 74, and the display device 75 may be connected to one another.

[0057] The storage device 72 includes at least one memory capable of storing data. The memory may be realized by a group of circuits (e.g., at least one of electronic circuits and electric circuits). For example, the storage device 72 may store a computer program 721 or temporarily store data that the arithmetic device 71 (described later) uses when the arithmetic device 71 is executing the computer program 721. The storage device 72 may also store data that the control unit 7 stores long-term. The storage device 72 may include at least one of a RAM (Random Access Memory), a ROM (Read Only Memory), a hard disk device, a magneto-optical disk device, an SSD (Solid State Drive), and a disk array device. In other words, the storage device 72 may include a non-transitory recording medium.

[0058] The arithmetic device 71 is hardware that includes at least a circuit (for example, at least one of a logic circuit, an electronic circuit, and an electric circuit). For this reason, the arithmetic device 71 may be referred to as a group of circuits.

[0059] The arithmetic device 71 includes at least one processor (one processor or multiple processors) as hardware. The processor may include, for example, a processor conforming to a von Neumann computer architecture. The processor conforming to the von Neumann computer architecture may include at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The processor may include, for example, a processor conforming to a non-von Neumann computer architecture. The processor conforming to the non-von Neumann computer architecture may include at least one of an FPGA (Field Programmable Gate Array) and an ASIC (Application Specific Integrated Circuit). The processor may be realized by a group of circuits (for example, at least one of an electronic circuit and an electric circuit).

[0060] The computing device 71 loads a computer program 721 that includes at least one of computer program code and computer program instructions.

[0061] For example, the arithmetic device 71 may read the computer program 721 stored in a non-transitory computer-readable recording medium using a recording medium reader (not shown) included in the control unit 7. The computer program 721 read from the recording medium may be stored in the storage device 72. The recording medium for recording the computer program 721 may include a device capable of recording the computer program 721 (e.g., a general-purpose device or a dedicated device on which the computer program 721 is implemented in an executable state in at least one of the forms of software and firmware). For example, the recording medium may be at least one of a CD-ROM, CD-R, CD-RW, flexible disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW, and Blu-ray (registered trademark), an optical disk such as a DVD, a magnetic medium such as a magnetic tape, a magneto-optical disk, a semiconductor memory such as a USB memory, and any other medium capable of storing a program.

[0062] Alternatively, the arithmetic device 71 may acquire (download or read) the computer program 721 via a communication device from a device (not shown) that is arranged outside the control unit 7. The downloaded computer program 721 may be stored in the storage device 72.

[0063] The arithmetic device 71 executes the loaded computer program 721. As a result, logical functional blocks for executing processing to be performed by the control unit 7 (e.g., processing for controlling the operation of the machining system SYS) are realized within the arithmetic device 71. Each process or function included in the computer program 721 may be realized by a logical processing block realized within the arithmetic device 71 when the arithmetic device 71 (processor) executes the computer program 721, or may be realized by hardware such as a predetermined gate array (FPGA, ASIC) included in the arithmetic device 71, or may function as a controller or computer for realizing the logical functional blocks for executing processing to be performed by the control unit 7. In other words, the at least one processor included in the arithmetic device 71, the memory (recording medium) included in the storage device 72, etc., and the computer program 721 are configured to cause the control unit 7 to perform processing to be performed by the control unit 7 (e.g., the robot control processing described above).

[0064] The arithmetic device 71 may generate control signals for controlling the operation of the machining system SYS as a result of executing a computer program 721 using logical functional blocks realized within the arithmetic device 71. The arithmetic device 71 may output the generated control signals to at least one of the machining units 2 (particularly the light source 40, the irradiation device 21, the material supply device 61, and the gas supply device 62) and the stage unit 3 via an output device 73 described below. At least one of the machining units 2 and the stage unit 3 may operate based on the control signals output (generated) by the arithmetic device 71. In other words, the machining system SYS machines the workpiece W based on the control signals output (generated) by the arithmetic device 71.

[0065] A computational model that can be constructed by machine learning when the computational device executes the computer program 721 may be implemented in the computational device 71. An example of a computational model that can be constructed by machine learning is a computational model including a neural network (so-called artificial intelligence (AI)). In this case, learning of the computational model may include learning of parameters of the neural network (e.g., at least one of a weight and a bias). The computational device 71 may control the operation of the machining system SYS using the computational model. In other words, the operation of controlling the operation of the machining system SYS may include the operation of controlling the operation of the machining system SYS using the computational model. Note that a computational model that has been constructed by offline machine learning using training data may be implemented in the computational device 71. Furthermore, the computational model implemented in the computational device 71 may be updated by online machine learning on the computational device 71. Alternatively, the calculation device 71 may control the operation of the machining system SYS using a calculation model implemented in a device external to the calculation device 71 (a device provided outside the control unit 7) in addition to or instead of the calculation model implemented in the calculation device 71.

[0066] The control unit 7 is connected to an output device 73, an input device 74, and a display device 75. The control unit 7 may be configured such that the arithmetic unit 71, the storage device 72, the output device 73, the input device 74, and the display device 75 are connected to one another.

[0067] The output device 73 is a device that outputs arbitrary information to the outside of the control unit 7. For example, the output device 73 may output a signal (e.g., the above-mentioned control signal) indicating arbitrary information between the control unit 7 and a device external to the control unit 7 (e.g., at least one of the processing unit 2 (particularly the light source 40, the irradiation device 21, the material supply device 61, and the gas supply device 62), and the stage unit 3). For example, the output device 73 may output a signal as arbitrary information via a communication network connecting the control unit 7 and a device external to the control unit 7 (e.g., at least one of the processing unit 2 (particularly the light source 40, the irradiation device 21, the material supply device 61, and the gas supply device 62), and the stage unit 3). In this case, the output device 73 includes a communication device.

[0068] The output device 73 may output any information to the outside of the control unit 7 using a medium other than a signal. For example, the output device 73 may output information as sound. In this case, the output device 73 includes an audio device (a so-called speaker) capable of outputting sound. For example, the output device 73 may output information on paper. In this case, the output device 73 includes a printing device (a so-called printer) capable of printing desired information on paper.

[0069] The input device 74 is a device that accepts information input to the control unit 7 from outside the control unit 7. For example, the input device 74 may include an operation device (e.g., at least one of a keyboard, a mouse, and a touch panel) that can be operated by a user of the control unit 7. In this case, the input device 74 functions as a device that allows the user to input information. For example, the input device 74 may include a recording medium reading device that can read information recorded as data on a recording medium that can be externally attached to the control unit 7.

[0070] The information input to the input device 74 may be input to the arithmetic device 71. That is, the arithmetic device 71 may acquire the information input to the input device 74. The arithmetic device 71 may control the operation of the machining system SYS based on the information input to the input device 74. For example, the arithmetic device 71 may generate a control signal for controlling the operation of the machining system SYS based on the information input to the input device 74.

[0071] As described above, when the output device 73 includes a communication device, the communication device included in the output device 73 may acquire (receive) information via the data bus or communication network in addition to or instead of outputting (transmitting) information via the data bus or communication network. In this case, the communication device included in the output device 73 may be capable of functioning as an input device to which information is input via the data bus or communication network.

[0072] The display device 75 is a display capable of displaying an image. The display device 75 may display the image under the control of the arithmetic device 71. In this case, the arithmetic device 71 may generate display control information for controlling the display device 75 to display a desired image. The arithmetic device 71 may output the generated display control information to the display device 75. The display device 75 may receive the display control information generated by the arithmetic device 71. The display device 75 may display the desired image based on the display control information generated by the arithmetic device 71. In this way, the arithmetic device 71 may control the display device 75 to display the desired image by outputting the generated display control information to the display device 75.

[0073] The control unit 7 having the above configuration may control (change) the intensity of the processing light EL based on the detection results of the power meters 47 (47#1, 47#2) (detection results of the intensities of the processing light EL (EL#1, EL#2)) input to the control unit 7. More specifically, the control unit 7 may control the intensity of the processing light EL so that the intensity of the processing light EL becomes a desired intensity. To control the intensity of the processing light EL, for example, the control unit 7 may control the light source 40 to change the intensity of the processing light EL emitted from the light source 40 based on the detection results of the power meter 47. This allows the processing system SYS to appropriately form a model on the printing surface MS by irradiating the printing surface MS with processing light EL having an appropriate intensity.

[0074] Alternatively, the control unit 7 may use the galvanometer mirror 46 to control the head drive mechanism 23 that moves the machining head 22 and the stage drive mechanism 32 that moves the stage 31 so that the machining unit area PUA moves on the build surface MS during the period in which the irradiation area EA is moved within the machining unit area PUA. Specifically, for example, the control unit 7 may control at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining unit area PUA moves along a movement trajectory that intersects (or, in some cases, is perpendicular to) the movement direction (scanning direction) of the irradiation area EA within the machining unit area PUA. Conversely, the control unit 7 may control the galvanometer mirror 46 so that the irradiation area EA periodically moves in the machining unit area PUA on the build surface MS along a scanning direction that intersects (or, in some cases, is perpendicular to) the movement trajectory of the movement of at least one of the head drive mechanism 23 and the stage drive mechanism 32.

[0075] In addition to the above, the control unit 7 may control the processing system SYS, for example, the processing unit 2 (at least one of the processing head 22 and the head drive mechanism 2), the stage unit 3 (the stage drive mechanism 32), the light source 40, the material supply device 61, and the gas supply device 62. More specifically, the control unit 7 may control the emission mode of the processing light EL by the irradiation device 21. The emission mode may be, for example, the on / off state of the processing light EL, the intensity of the processing light EL, or the emission timing of the processing light EL. When the processing light EL includes multiple pulsed beams, the emission mode may be, for example, the emission time of the pulsed beams, the emission cycle of the pulsed beams, or the ratio between the length of the emission time of the pulsed beams and the emission cycle of the pulsed beams (the so-called duty ratio). Additionally, the galvano scanner 44 may control the optical system, such as the galvano scanner 44, to change the irradiation position of the light, change the focal position of the light, or otherwise manipulate the light. Furthermore, the control unit 7 may control the movement mode of the processing head 22 by the head driving mechanism 23 and the movement mode of the stage 31 by the stage driving mechanism 32. The movement mode is, for example, the movement amount, the movement speed, the movement direction, and the movement timing (movement time). Furthermore, the control unit 7 may control the supply mode of the modeling material M by the material nozzle 64. The supply mode is, for example, the supply amount (supply amount per unit time) and the supply timing (supply time).

[0076] (2) Modeling Operation Performed by the Machining System SYS Next, the operation performed by the machining system SYS will be described.

[0077] First, a description will be given of the manufacturing operation (additional processing operation for performing additional processing on the workpiece W) performed by the processing system SYS. As described above, the processing system SYS manufactures a three-dimensional structure ST by performing additional processing based on the laser build-up welding method. Therefore, the processing system SYS may manufacture a three-dimensional structure ST by performing a manufacturing operation in accordance with the laser build-up welding method.

[0078] The processing system SYS forms a three-dimensional structure ST on a workpiece W based on three-dimensional model data (three-dimensional model information) of the three-dimensional structure ST to be formed. As the three-dimensional model data, measurement data of a three-dimensional object measured by at least one of a measuring device provided within the processing system SYS and a three-dimensional shape measuring device provided separately from the processing system SYS may be used. To form the three-dimensional structure ST, the processing system SYS sequentially forms, for example, multiple structural layers SL arranged along the Z-axis direction.

[0079] The machining system SYS repeatedly performs operations for forming such a structural layer SL based on the three-dimensional model data of the three-dimensional structure ST under the control of the control unit 7. Specifically, before performing operations for forming the structural layer SL, the control unit 7 first slices the three-dimensional model data at the layer pitch to create slice data. The machining system SYS performs operations for forming the first structural layer SL-1 on the building surface MS corresponding to the surface of the workpiece W based on the slice data corresponding to the structural layer SL-1. Specifically, the control unit 7 acquires path information for forming the first structural layer SL-1, which is generated based on the slice data corresponding to the structural layer SL-1. Then, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to form the first structural layer SL-1. As a result, the structural layer SL-1 is formed on the building surface MS as shown in FIG. 5( a). Thereafter, the machining system SYS sets the surface (upper surface) of the structural layer SL-1 as a new build surface MS, and then builds a second structural layer SL-2 on the new build surface MS. To build the structural layer SL-2, the control unit 7 first controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 so that the machining head 22 moves along the Z axis relative to the stage 31. Specifically, the control unit 7 controls at least one of the head drive mechanism 23 and the stage drive mechanism 32 to move the machining head 22 toward the +Z side and / or move the stage 31 toward the -Z side so that the machining unit areas PUA#1 and PUA#2 are set on the surface of the structural layer SL-1 (the new build surface MS). Thereafter, the control unit 7 controls the machining unit 2 and the stage unit 3 so that the structural layer SL-2 is built on the structural layer SL-1 based on the slice data corresponding to the structural layer SL-2, in a manner similar to the operation for building the structural layer SL-1. As a result, a structural layer SL-2 is formed as shown in Fig. 5(b). Thereafter, the same operation is repeated until all structural layers SL constituting the three-dimensional structure ST to be formed on the workpiece W are formed. As a result, as shown in Fig. 5(c), the three-dimensional structure ST is formed by a layered structure in which multiple structural layers SL are stacked.

[0080] The processing system SYS (mainly the processing unit 2) selectively performs the following manufacturing operations to manufacture each structural layer SL: (i) a first manufacturing operation in which a manufacturing material M is supplied to a molten pool MP formed by irradiating the manufacturing surface MS with processing light EL to manufacture a three-dimensional structure ST, and (ii) a second manufacturing operation in which the manufacturing material M is molten by irradiating the manufacturing surface MS with processing light EL to manufacture a three-dimensional structure ST. The first manufacturing operation and the second manufacturing operation will be described below in order.

[0081] (2-1-1) First modeling operation The first modeling operation is a modeling operation in which processing light EL is irradiated onto the modeling surface MS to form a molten pool MP on the modeling surface MS, and modeling material M is supplied to the formed molten pool MP (the position where the processing light EL is irradiated) to form a model on the modeling surface MS.

[0082] First, the operation of forming each structure layer SL by performing the first forming operation will be described with reference to FIGS. 6( a) and 6(b). Under the control of the control unit 7, the processing system SYS moves at least one of the processing head 22 and the stage 31 so that a processing unit area PUA is set in a desired area on the forming surface MS corresponding to the surface of the workpiece W or the surface of the formed structure layer SL. Then, the irradiation device 21 irradiates the processing unit area PUA with the processing light EL. At this time, the focus position CP of the processing light EL in the Z-axis direction may coincide with the forming surface MS or may be spaced apart from the forming surface MS. As a result, as shown in FIG. 6(a), a molten pool MP is formed on each forming surface MS irradiated with the processing light EL. Furthermore, under the control of the control unit 7, the processing system SYS supplies the forming material M from the material nozzle 64. As a result, the forming material M is supplied to the molten pool MP.

[0083] The shaping material M supplied to the molten pool MP is melted by the energy from the processing light EL irradiated onto the molten pool MP. Alternatively, the shaping material M supplied to the molten pool MP is melted by the heat from the molten material that constitutes the molten pool MP. Even when the shaping material M is melted by the heat from the molten material that constitutes the molten pool MP, since the molten pool MP is formed by the energy of the processing light EL, the shaping material M can be considered to be melted by the energy of the processing light EL that formed the molten pool MP. In other words, the shaping material M is melted indirectly by the processing light EL via the molten pool MP formed by the processing light EL. In either case, the shaping material M is melted by the energy of the processing light EL.

[0084] Furthermore, the irradiation device 21 uses the galvanometer mirrors 46 (46#1, 46#2) to move the irradiation area EA (EA#1, EA#2) within the processing unit area PUA (PUA#1, PUA#2). That is, the irradiation device 21 uses the galvanometer mirrors 46 to scan the processing light EL within the processing unit area PUA. When the irradiation light EL ceases to be irradiated as the irradiation area EA moves, the molten building material M cools and solidifies (coagulates). That is, as the irradiation area EA moves, the position where the molten pool MP is formed also moves. As a result, as shown in FIG. 6B , within the processing unit area PUA, a model made of the solidified building material M is deposited on the building surface MS as the irradiation area EA moves. After irradiating the manufacturing surface MS with processing light EL to form a molten pool MP (narrow sense) in this manner, manufacturing material M is supplied to the molten pool MP (narrow sense), the manufacturing material M melts, and forms a molten pool (broad sense) protruding from the manufacturing surface MS, and the molten pool (broad sense) is cooled and solidified to deposit a structure (structural layer SL) on the manufacturing surface MS.

[0085] Here, the control unit 7 may control the galvanometer mirror 46 to deflect the processing light EA so that the irradiation area EA moves along a single scanning direction within the processing unit area PUA while the processing unit area PUA is stationary (not moving) on ​​the printing surface MS. That is, the control unit 7 may deflect the processing light EA with the galvanometer mirror 46 so that the irradiation area EA moves along the main scanning direction (single scanning direction) within a coordinate system defined based on the processing unit area PUA. In particular, the galvanometer mirror 46 may deflect the processing light EA so that the irradiation area EA periodically moves back and forth along a single scanning direction within each processing unit area PUA. That is, the galvanometer mirror 46 may deflect the processing light EA so that the irradiation area EA scans in the main scanning direction within the processing unit area PUA, then shifts it in a sub-scanning direction perpendicular to the main scanning direction, and then scans the irradiation area EA again in the main scanning direction, repeating this process. In this case, the irradiation area EA may be repeatedly scanned from one side to the other along the main scanning direction, or may be alternately scanned from one side to the other and from the other side to the one side along the main scanning direction. The shape of the processing unit area PUA through which the irradiation area EA moves in this way may be a rectangle whose longitudinal direction is the movement direction of the irradiation area EA.

[0086] 6, for convenience of explanation, the object formed from the solidified shaping material M in the processing unit area PUA#1 is physically separated from the object formed from the solidified shaping material M in the processing unit area PUA#2. However, the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2. In particular, when the processing unit areas PUA#1 and PUA#2 coincide (or partially overlap), the object formed from the solidified shaping material M in the processing unit area PUA#1 may be integrated with the object formed from the solidified shaping material M in the processing unit area PUA#2.

[0087] During the period when the irradiation areas EA#1 and EA#2 are moving within the machining unit areas PUA#1 and PUA#2, respectively, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the build surface MS. In other words, the machining system SYS may move the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2, respectively, and move the machining unit areas PUA#1 and PUA#2 on the build surface MS in parallel.

[0088] Alternatively, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining system SYS does not need to move the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 do not move on the manufacturing surface MS. In other words, during the period when the irradiation area EA#1 within the machining unit area PUA#1 and the irradiation area EA#2 within the machining unit area PUA#2 are moving, the machining head 22 and the stage 31 may be stopped. In this case, after the additional machining (manufacturing) within the machining unit areas PUA#1 and PUA#2 is completed, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 are set in another area on the manufacturing surface MS. In other words, the machining system SYS may move at least one of the machining head 22 and the stage 31 so that the machining unit areas PUA#1 and PUA#2 move on the printing surface MS after the additional machining (printing) in the machining unit areas PUA#1 and PUA#2 is completed. In this case, the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have already been set (the area where the additional machining has already been performed) and the area on the printing surface MS where the machining unit areas PUA#1 and PUA#2 have newly been set (the area where the additional machining will now be performed) may be adjacent to each other, or these areas may be partially overlapping or may not overlap.

[0089] The machining system SYS repeats a series of molding processes, including forming a molten pool MP by irradiating the machining unit area PUA with the machining light EL, supplying the molding material M to the molten pool MP, melting the supplied molding material M, and solidifying the molten molding material M, while moving the machining unit area PUA along a movement trajectory on the molding surface MS. In this case, as the machining unit area PUA moves, a molded object that has a width along the direction intersecting the movement trajectory (X-axis direction) and extends along the Y-axis direction is molded on the molding surface MS.

[0090] As a result, a structure layer SL corresponding to a structured object, which is an aggregate of the melted and then solidified building material M, is formed on the building surface MS. That is, a structure layer SL corresponding to an aggregate of objects formed on the building surface MS in a pattern corresponding to the movement trajectory of the processing unit area PUA is formed. That is, a structure layer SL having a shape corresponding to the movement trajectory of the processing unit area PUA in plan view is formed.

[0091] The movement trajectory of the machining unit area PUA may be referred to as a machining path (tool path). In this case, the control unit 7 may move at least one of the machining head 22 and the stage 31 based on path information indicating the movement trajectory (path information indicating the machining path) so that the machining unit area PUA moves along the movement trajectory on the manufacturing surface MS.

[0092] (2-1-2) Second Modeling Operation In the first modeling operation described above, the processing system SYS melts the modeling material M on the modeling surface MS. On the other hand, in the second modeling operation, the processing system SYS melts the modeling material M in the space between the material nozzle 64 and the modeling surface MS before the modeling material M reaches the modeling surface MS. That is, in the second modeling operation, the processing system SYS irradiates the modeling material M with the processing light EL in the space between the material nozzle 64 and the modeling surface MS to melt the modeling material M. Then, the processing system SYS supplies the molten modeling material M in the space between the material nozzle 64 and the modeling surface MS to the modeling surface MS, thereby modeling a model on the modeling surface MS. Therefore, in the second modeling operation, the processing system SYS does not need to perform the operation of irradiating the modeling surface MS with the processing light EL to form a molten pool MP.

[0093] In the second modeling operation, the processing system SYS, under the control of the control unit 7, moves at least one of the processing head 22 and the stage 31 so that the molten modeling material M is supplied to a desired area on the modeling surface MS corresponding to the surface of the workpiece W or the surface of the modeled structure layer SL, thereby modeling each structure layer SL. In the following explanation, an example will be given of a configuration in which the processing head 22 is moved so that the molten modeling material M is supplied to a desired area on the modeling surface MS, and a three-dimensional structure ST is modeled.

[0094] 7A, under the control of the control unit 7, the processing system SYS emits processing light EL from the irradiation device 21 and supplies the modeling material M from the material nozzle 64. As a result, the modeling material M is irradiated with the processing light EL in the space between the material nozzle 64 and the modeling surface MS.

[0095] Here, in the space between the material nozzle 64 and the printing surface MS, a surface that intersects (is perpendicular to) the direction in which the material nozzle 64 and the printing surface MS face each other (the Z-axis direction) is referred to as a material supply surface PL, and of the multiple material supply surfaces PL between the material nozzle 64 and the printing surface MS, a surface on which the processing light EL is irradiated onto the printing material M is referred to as a material irradiation surface ES. The processing system SYS irradiates the material irradiation surface ES with the processing light EL and supplies the printing material M to the material irradiation surface ES. However, because the material irradiation surface ES is not a physical surface, the processing light EL irradiated onto the material irradiation surface ES not only passes through the material irradiation surface ES, but also the printing material M supplied to the material irradiation surface ES passes through the material irradiation surface ES. Note that because the printing material M passes through the material supply surface PL, the material supply surface PL may also be referred to as a material passing surface.

[0096] When the processing light EL is irradiated onto the modeling material M on the material irradiation surface ES, the modeling material M melts on the material irradiation surface ES. The modeling material M melted on the material irradiation surface ES is supplied from the material irradiation surface ES to the modeling surface MS. As a result, the modeling material M melted on the material irradiation surface ES adheres to the modeling surface MS. The modeling material M supplied to the modeling surface MS then cools and solidifies (coagulates). As a result, as shown in FIG. 7B, a model made of the solidified modeling material M is deposited on the modeling surface MS.

[0097] The processing system SYS repeats a series of modeling processes, including melting the modeling material M on the material irradiation surface ES by irradiating it with the processing light EL, supplying the molten modeling material M to the modeling surface MS, and solidifying the molten modeling material M on the modeling surface MS, while moving the processing head 22 relative to the modeling surface MS. In particular, the processing system SYS repeats the series of modeling processes while moving the processing head 22 relative to the modeling surface MS along at least one of the X-axis direction and the Y-axis direction. In this case, as the processing head 22 moves, a modeled object having a width along a direction intersecting the movement direction of the processing head 22 is modeled on the modeling surface MS. As a result, a structure layer SL corresponding to a modeled object that is an aggregate of the melted and then solidified modeling material M is formed on the modeling surface MS. The structure layer SL corresponding to a aggregate of models modeled on the modeling surface MS in a pattern corresponding to the movement trajectory of the processing head 22 is modeled. In other words, a structure layer SL having a shape corresponding to the movement trajectory of the processing head 22 in a planar view is modeled.

[0098] When such a second-modeling operation is performed, the object (e.g., the workpiece W or the structural layer SL) having the modeling surface MS on its surface is rarely directly melted by the processing light EL. This shortens the time required for the molten modeling material M to cool and solidify. Therefore, the second-modeling operation requires less time to model the three-dimensional structure ST than the first-modeling operation, which is performed by forming a molten pool MP. In other words, the modeling speed of the second-modeling operation is faster than the modeling speed of the first-modeling operation, allowing the three-dimensional structure ST to be modeled quickly.

[0099] In this way, the second-modeling operation can form the three-dimensional structure ST at high speed, and therefore the second-modeling operation may be referred to as a modeling operation conforming to the extreme high speed application (EHLA). The second-modeling operation may also be considered as a modeling operation conforming to the extreme high speed application (EHLA).

[0100] When the second modeling operation is performed, as in the case of the first modeling operation, the processing system SYS may deflect the processing light EL using the galvanometer mirrors 41#16 and 41#26. In this case, the processing system SYS may deflect the processing light EL using the galvanometer mirrors 41#16 and 41#26 to move the beam passing area PA through which the processing light EL passes within a virtual material irradiation surface ES that intersects with the Z-axis between the material nozzle 64 and the modeling surface MS.

[0101] (2-2) Modeling Mode The processing system SYS may select one or more modeling modes from a plurality of modeling modes that have different scanning patterns of the processing light EL, and form a modeled object. Here, the modeling mode constitutes a part of each of the first modeling operation and the second modeling operation described above. For example, in the first modeling operation, one modeling mode may be selected, or another modeling mode may be selected. Similarly, in the second modeling operation, one modeling mode may be selected, or another modeling mode may be selected. The modeling modes will be described in detail below.

[0102] (2-2-1) First Modeling Mode The first modeling mode will be described with reference to Fig. 8. The first modeling mode is a mode in which at least one of the head driving mechanism 23 and the stage driving mechanism 32 is controlled to move the processing head 22 relative to the stage 31, without changing the deflection direction in which the galvanometer mirror 46 deflects the processing light EL, and therefore the emission direction of the processing light EL, to perform modeling. That is, in the first modeling mode, the angles of the X scanning mirror 46MX and the Y scanning mirror 46MY do not change, and therefore the deflection direction of the processing light EL by the galvanometer mirror 46 does not change.

[0103] On the other hand, in the first modeling mode, for example, the machining head 22 moves relatively to the stage 31 along the Y-axis direction in Fig. 8(a) . That is, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction. In this case, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves relatively to the stage 31 along the Y-axis direction.

[0104] In this way, in the first modeling mode, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed while the emission direction of the processing light EL from the galvanometer mirror 46 is kept constant. In this case, the processing light EL may be scanned to trace the movement trajectory MT#1 shown in FIG. 8( a). The movement trajectory MT#1 is the trajectory of the processing light EL irradiated onto the workpiece W. When the processing light EL is scanned to trace the movement trajectory MT#1, a modeling material M may be supplied from the material nozzle 64 to form a model extending along the Y-axis direction, as shown in FIG. 8( b). Note that in the example shown in FIG. 8, the Y-axis direction may be referred to as the (main) scanning direction.

[0105] The width W#1 of the object may vary depending on the beam diameter of the processing light EL (e.g., the spot diameter of the processing light EL in the first modeling operation). For example, the width W#1 when the beam diameter of the processing light EL is relatively large may be wider than the width W#1 when the beam diameter of the processing light EL is relatively small. The width W#1 may also be referred to as the width of the bead. Here, "bead" refers to an object extending along the main scanning direction (in other words, the processing path).

[0106] (2-2-2) Second Modeling Mode The second modeling mode is a mode in which the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, is changed, and the processing light EL is scanned in a predetermined direction, while at least one of the head driving mechanism 23 and the stage driving mechanism 32 is controlled to move the processing head 22 relative to the stage 31, thereby forming a model.

[0107] In the second modeling mode, for example, the processing light EL is deflected by the galvanometer mirror 46 and scanned back and forth along the X-axis direction (a predetermined direction) in FIG. 9A. That is, scanning (movement) of the processing light EL emitted from the galvanometer mirror 46 in the +X direction and scanning (movement) of the processing light EL in the −X direction are alternately repeated, that is, periodically performed. In this case, the angle of the X-scanning mirror 46MX is periodically changed so that the scanning direction of the processing light EL periodically changes along the X-axis direction, while the angle of the Y-scanning mirror 46MY is kept constant.

[0108] In the second modeling mode, the machining head 22 also moves relatively to the stage 31 along the Y-axis direction in Fig. 9(a) . That is, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction. In this case, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves relatively to the stage 31 along the Y-axis direction.

[0109] As described above, in the second modeling mode, the processing light EL is deflected by the galvanometer mirror 46 to scan along the X-axis direction (sub-scanning direction), while the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction (main scanning direction). As a result, as shown in FIG. 9A , the processing light EL undergoes a triangular wave-like movement trajectory MT#2, which is a combination of periodic displacement (movement) in the X-axis direction by the galvanometer mirror 46 and relative displacement (movement) of the stage 31 and the processing head 22 in the Y-axis direction controlled by at least one of the head drive mechanism 23 and the stage drive mechanism 32. The movement trajectory MT#2 is the trajectory of the processing light EL irradiated onto the workpiece W. The operation of periodically scanning the processing light EA with the galvanometer mirror 46 while driving the head driving mechanism 23 and the stage driving mechanism 32 to move the processing head 22 and the workpiece W relative to each other and periodically moving (deflecting) the irradiation area EA on the printing surface MS may be referred to as a wobbling operation. When the processing light EL is being scanned to trace the movement trajectory MT#2, a printing material M may be supplied from the material nozzle 64 to print a printed object extending along the Y-axis direction, as shown in FIG. 9B .

[0110] In the second modeling mode, the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed, and the processing light EL is scanned along the X-axis direction to change the width (bead width) W#2 of the modeled object. On the other hand, in the second modeling mode, the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction to form a bead of a desired shape, thereby modeling the model. When the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 (and therefore the irradiation range over which the processing light EL can be irradiated within this angular range) is relatively large, the width W#2 can be set wider than when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 (and therefore the irradiation range over which the processing light EL can be irradiated within this angular range) is relatively small.

[0111] 9, the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the second modeling mode, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along a first direction (e.g., the Y-axis direction), and the machining light EL is deflected by the galvanometer mirror 46 to be scanned along a second direction (e.g., the X-axis direction) that intersects the first direction.

[0112] (2-2-3) Third Modeling Mode The third modeling mode will be described with reference to Fig. 10. The third modeling mode is a mode in which the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, is changed without changing the relative positional relationship between the processing head 22 and the stage 31, and the processing light EL is scanned to perform modeling. In other words, in the third modeling mode, the relative positional relationship between the processing head 22 and the stage 31, and therefore between the processing head 22 having the galvanometer mirror 46 and the workpiece W, does not change.

[0113] On the other hand, in the third modeling mode, for example, the processing light EL is deflected (the deflection direction is changed) by the galvanometer mirror 46, and the processing light EL is caused to scan so as to trace the scanning trajectory (see the solid arrow) shown in Fig. 10(a). In this case, the angles of the X scanning mirror 46MX and the Y scanning mirror 46MY are changed so that the processing light EL scans so as to trace the scanning trajectory shown in Fig. 10(a).

[0114] In this way, in the third modeling mode, the emission direction of the processing light EL is changed by the galvanometer mirror 46 without changing the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W. In this case, the processing light EL scans to trace the movement trajectory MT#3 shown in FIG. 10( b). The movement trajectory MT#3 is the trajectory of the processing light EL irradiated onto the workpiece W. While the processing light EL is scanning to trace the movement trajectory MT#3, a ring-shaped object may be formed as shown in FIG. 10( b) by supplying the modeling material M from the material nozzle 64.

[0115] Note that "annular" may refer to a shape in which the starting point and the end point of the movement trajectory coincide. Therefore, the concept of "annular" is not limited to circles and ellipses, but also includes polygons such as rectangles. Furthermore, as long as the starting point and the end point of the movement trajectory coincide, a line diagram that can be drawn without passing through a partial trajectory that is a part of the movement trajectory more than once (a line diagram drawn in one stroke) may also be included in the concept of "annular."

[0116] In the third modeling mode, a model is formed by scanning the processing light EL to trace a movement trajectory MT#3 in an irradiation area that maximizes the irradiation range of the processing light EL of the galvanometer mirror 46. In the third modeling mode, after a model is formed in the irradiation area, the relative positional relationship between the processing head 22 and the stage 31 may be changed, and then, in a new irradiation area, the processing light EL may be deflected and scanned by the galvanometer mirror 46 without changing the relative positional relationship between the processing head 22 and the stage 31, to form a model. In this way, in the third modeling mode, when forming a model in the irradiation area, the processing light EL may be deflected and scanned by the galvanometer mirror 46 without changing the relative positional relationship between the processing head 22 and the stage 31, while the relative positional relationship between the processing head 22 and the stage 31 may be changed to change the irradiation area that can be irradiated with the processing light EL by the galvanometer mirror 46.

[0117] The width W#3 of the object (in other words, the width W#3 of the bead) may vary depending on the beam diameter of the processing light EL (for example, the spot diameter of the processing light EL in the first processing operation). For example, the width W#3 when the beam diameter of the processing light EL is relatively large may be wider than the width W#3 when the beam diameter of the processing light EL is relatively small.

[0118] (2-2-4) Fourth Forming Mode The fourth forming mode will be described with reference to Fig. 11 . The fourth forming mode is a mode in which scanning of the processing light EL by the galvanometer mirror 46 and relative movement of the processing head 22 are alternately performed to form multiple beads and form a shaped object. The fourth forming mode differs from the second forming mode in which scanning of the processing light EL in a predetermined direction using the galvanometer mirror 46 and relative movement of the processing head 22 with respect to the stage 31 are simultaneously performed in that scanning of the processing light EL and relative movement of the processing head 22 are alternately performed.

[0119] In the fourth modeling mode, similar to the second modeling mode, the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed to scan along the X-axis direction in FIG. 11A. For example, scanning of the processing light EL emitted from the galvanometer mirror 46 in the +X direction and scanning of the processing light EL in the −X direction are alternately repeated, that is, periodically performed. This allows the processing light EL to scan in the sub-scanning direction. In this case, the angle of the X-scanning mirror 46MX is periodically changed so that the emission direction of the processing light EL periodically changes along the X-axis direction, while the angle of the Y-scanning mirror 46MY is kept constant.

[0120] For example, as shown in Fig. 11(a), the galvanometer mirror 46 deflects the processing light EL, allowing the processing light EL to scan the range SA#1 shown in Fig. 11(b). More specifically, in the fourth modeling mode, the control unit 7 controls the light source 40 so that the processing light EL is irradiated only onto the range SA#1 (processing light ON) and is not irradiated onto the upstream and downstream sides of the range SA#1 in the scanning direction (processing light OFF). In other words, as shown in Fig. 11(b), the control unit 7 controls the light source 40 so that the processing light EL is not irradiated onto the area adjacent to the end of the range SA#1 in the X-axis direction, but is irradiated onto the range SA#1.

[0121] In the fourth modeling mode, the machining head 22 is moved relative to the stage 31 along the Y-axis direction in FIG. 11C . That is, the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction. This allows the position where the machining light EL is irradiated to be moved in the main scanning direction. Note that the spacing in the Y-axis direction (main scanning direction) between adjacent trajectories extending in the X-axis direction (sub-scanning direction), i.e., the movement width of the machining head 22 along the Y-axis direction relative to the workpiece W (stage 31), is set according to the width in the Y-axis direction of the bead formed by scanning the machining light EL in the X-axis direction (sub-scanning direction). Specifically, it is preferable that the spacing in the Y-axis direction between adjacent trajectories extending in the X-axis direction be equal to or less than the width in the Y-axis direction of the bead formed by scanning the machining light EL in the X-axis direction, so that the adjacent beads extend in the X-axis direction and contact each other and even overlap when viewed from the Z direction.

[0122] In the fourth modeling mode, the control unit 7 controls at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the machining head 22 moves relative to the stage 31 along the Y-axis direction during a period when the machining light EL is not being emitted. In other words, in the fourth modeling mode, the relative positional relationship between the machining head 22 and the stage 31 does not change during a period when the machining light EL is being emitted.

[0123] In this way, in the fourth modeling mode, scanning of the processing light EL along the X-axis direction by the galvanometer mirror 46 and relative positional change along the Y-axis direction between the processing head 22 having the galvanometer mirror 46 and the workpiece W are alternately performed, and the processing light EL scans to trace the movement trajectory MT#4 shown in Fig. 11(c) . The movement trajectory MT#4 is the trajectory of the processing light EL irradiated onto the workpiece W (although this is a portion that is not actually irradiated with the processing light EL, the trajectory that would be traced if the processing light EL were irradiated (ON) is shown as a dashed line).

[0124] As described above, in the fourth modeling mode, during the period when the processing light EL is not being emitted, the processing head 22 moves along the Y-axis direction relative to the stage 31. Therefore, while the processing light EL is scanning to describe the movement trajectory MT#4, the modeling material M may be supplied from the material nozzle 64 to model multiple models each extending along the X-axis direction, as shown in FIG.

[0125] The width W#4 of the shaped object in the sub-scanning direction corresponds to the range SA#1 that can be scanned by the processing light EL, i.e., the irradiation distance of the processing light EL in the sub-scanning direction on the workpiece W, and can be set within the angular range over which the processing light EL can be deflected by the galvanometer mirror 46, and therefore within the irradiation range over which the processing light EL can be irradiated. For example, the width W#4 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively large can be set wider than the width W#4 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively small.

[0126] In the example shown in FIG. 11 , the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the fourth modeling mode, a change in the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W along a first direction and a scan along a second direction intersecting the first direction by changing the deflection direction of the machining light EL by the galvanometer mirror 46 and thus the emission direction of the machining light EL may be alternately repeated. The fourth modeling mode may also be referred to as a raster scan mode due to the shape of the movement trajectory MT#4.

[0127] (2-2-5) Fifth Modeling Mode The fifth modeling mode will be described with reference to FIG. 12 . The fifth modeling mode is a mode in which the relative movement of the processing head 22 with respect to the stage 31 and the scanning of the processing light EL in accordance with the relative movement of the processing head 22 are continuously and simultaneously performed. Note that, unlike the fourth modeling mode in which the deflection of the processing light EL and the relative movement of the processing head 22 are alternately performed to form multiple beads and form a model, the fifth modeling mode differs in that the deflection of the processing light EL and the relative movement of the processing head 22 are simultaneously performed. Furthermore, unlike the second modeling mode in which the relative movement of the processing head 22 with respect to the stage 31 and the scanning of the processing light EL in a predetermined direction are continuously and simultaneously performed, the fifth modeling mode differs in that the scanning of the processing light EL is performed in accordance with the relative movement of the processing head 22.

[0128] In the fifth modeling mode, at least one of the head driving mechanism 23 and the stage driving mechanism 32 moves the processing head 22 relative to the stage 31 along the Y-axis direction. In response to this movement in the Y-axis direction, in the fifth modeling mode, the deflection direction of the processing light EL by the galvanometer mirror 46, and therefore the emission direction of the processing light EL, are changed, and the processing light EL is scanned in a direction intersecting the Y-axis direction and the X-axis direction, as shown in Fig. 12(a) . More specifically, the processing light EL emitted from the galvanometer mirror 46 is caused to scan so as to alternately trace a scanning trajectory ST1 heading in the +X direction and a scanning trajectory ST2 heading in the -X direction.

[0129] The scanning trajectory ST1 is a trajectory that is traced by changing the angle of the X scanning mirror 46MX to scan the processing light EL in the +X direction, while changing the angle of the Y scanning mirror 46MY to scan the processing light EL in the opposite direction (-Y direction) to the Y-axis direction of the movement of the processing head 22 relative to the stage 31. Note that the inclination of the scanning trajectory ST1 shown in Figure 12(a) is the inclination of a vector obtained by combining a vector indicating the scanning speed of the processing light EL along the X-axis direction by the galvanometer mirror 46 and a vector indicating the movement speed of the processing head 22 along the Y-axis direction relative to the stage 31 (workpiece W).

[0130] 12A. The scanning trajectory ST2 is a trajectory that is traced by changing the angle of the X scanning mirror 46MX to scan the processing light EL in the −X direction, while changing the angle of the Y scanning mirror 46MY, similar to the scanning trajectory ST1, to scan the processing light EL in the opposite direction (−Y direction) to the Y-axis direction of the movement of the processing head 22 relative to the stage 31. The inclination of the scanning trajectory ST2 shown in FIG. 12A is the inclination of a vector obtained by combining a vector indicating the scanning speed of the processing light EL along the X-axis direction by the galvanometer mirror 46 and a vector indicating the movement speed of the processing head 22 along the Y-axis direction relative to the stage 31 (workpiece W).

[0131] The scanning trajectory ST1 and the scanning trajectory ST2 are drawn by alternately scanning the processing light EL. The processing light EL that draws the scanning trajectory ST1 is moved to the starting point of the scanning trajectory ST2 by moving in the +Y direction by the same amount as the scanning trajectory ST1 moved in the Y direction, without moving in the X-axis direction. Similarly, the processing light EL that draws the scanning trajectory ST2 is moved to the starting point of the scanning trajectory ST1 by moving in the +Y direction by the same amount as the scanning trajectory ST2 moved in the Y direction, without moving in the X-axis direction. Therefore, the scanning trajectory ST1 and the scanning trajectory ST2 intersect in an X-like manner. In this way, the processing light EL is scanned to alternately draw the scanning trajectory ST1 and the scanning trajectory ST2.

[0132] The processing light EL scanned by the galvanometer mirror 46 to trace the scanning trajectories ST1 and ST2 traces a movement trajectory MT#5 by being irradiated onto the stage 31, which is moved along the Y-axis direction relative to the processing head 22, and ultimately onto the workpiece W on the stage 31. In other words, the movement trajectory MT#5 is the trajectory of the processing light EL irradiated onto the workpiece W (although this is actually a portion that is not irradiated with the processing light EL, the trajectory that would be traced if the processing light EL was irradiated (ON) is shown as a dashed line).

[0133] The portion of the movement trajectory MT#5 extending in the X-axis direction (sub-scanning direction) corresponds to the scanning trajectory ST1 and the scanning trajectory ST2, and this portion is traced by changing the angle of the galvanometer mirror 46 (Y scanning mirror 46MY) and scanning the processing light EL in the -Y direction. In other words, the movement of the processing head 22 relative to the stage 31 in the +Y direction is canceled out by scanning the processing light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in the -Y direction, thereby tracing the movement trajectory MT#5 of the processing light EL irradiated onto the workpiece W. As a result, in the portions of the movement trajectory MT#5 corresponding to the scanning trajectory ST1 and the scanning trajectory ST2, there is no movement (displacement) in the Y-axis direction (main scanning direction), and only movement (displacement) in the X-axis direction (sub-scanning direction) of the scanning trajectory ST1 and the scanning trajectory ST2. Therefore, the scanning trajectory ST1 and scanning trajectory ST2 shown in Figure 12 (a) can be said to be trajectories drawn by changing the emission direction of the processing light EL by the galvanometer mirror 46 in accordance with the relative movement between the processing head 22 and the stage 31 (workpiece W), and ultimately by scanning the processing light EL.

[0134] On the other hand, the angle of the galvanometer mirror 46 (Y scanning mirror 46MY) is changed to move the irradiable position of the processing light EL in the +Y direction so that irradiation of the processing light EL can be stopped (OFF) at the end point of the scanning trajectory ST1 and then started (ON) at the start point of the scanning trajectory ST2, and also stopped (OFF) at the end point of the scanning trajectory ST2 and then started (ON) at the start point of the scanning trajectory ST1. As a result, the movement trajectory MT#5 of the processing light EL irradiated onto the workpiece W is arranged in the X-axis direction at an interval that is equal to the movement of the irradiable area of ​​the processing light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in the +Y direction, as well as the movement of the processing head 22 in the +Y direction relative to the stage 31. The spacing in the Y-axis direction (main scanning direction) between adjacent trajectories extending in the X-axis direction (sub-scanning direction) is set according to the width in the Y-axis direction of the bead formed by scanning the processing light EL in the X-axis direction (sub-scanning direction). Specifically, it is preferable that the spacing in the Y-axis direction between adjacent trajectories extending in the X-axis direction be equal to or less than the width in the Y-axis direction of the bead formed by scanning the processing light EL in the X-axis direction, and that the adjacent beads extend in the X-axis direction so that they come into contact with each other and even overlap when viewed from the Z direction.

[0135] In this way, in the fifth modeling mode, the processing light EL is scanned by the galvanometer mirror 46 so that the deflection direction of the processing light EL alternates between scanning trajectory ST1 and scanning trajectory ST2, i.e., periodically, while the relative positional relationship between the processing head 22 having the galvanometer mirror 46 and the workpiece W is changed along the Y-axis direction.

[0136] As described above, in the fifth modeling mode, there are periods when the processing light EL is irradiated (ON) and periods when the processing light EL is not irradiated (OFF). Therefore, while the processing light EL is scanning to describe the movement trajectory MT#5, the modeling material M may be supplied from the material nozzle 64 to form multiple models each extending along the X-axis direction, as shown in Fig. 12(d). Note that the fifth modeling mode can form models similar to the models formed in the fourth modeling mode described above.

[0137] The width W#5 of the shaped object in the sub-scanning direction corresponds to the range SA#1 that can be scanned by the processing light EL, i.e., the irradiation distance of the processing light EL in the sub-scanning direction on the workpiece W, and can be set within the angular range over which the processing light EL can be deflected by the galvanometer mirror 46, and therefore within the irradiation range over which the processing light EL can be irradiated. For example, the width W#5 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively large can be set wider than the width W#5 when the angular range over which the processing light EL can be deflected by the galvanometer mirror 46 is relatively small.

[0138] In the example shown in FIG. 12 , the main scanning direction (Y-axis direction) and the sub-scanning direction (X-axis direction) are perpendicular to each other. However, the main scanning direction and the sub-scanning direction only need to intersect, and do not have to be perpendicular to each other. Therefore, in the fifth modeling mode, a change in the relative positional relationship between the machining head 22 having the galvanometer mirror 46 and the workpiece W along a first direction and a change in the deflection direction of the processing light EL by the galvanometer mirror 46, and thus the emission direction of the processing light EL, may be performed simultaneously. In addition, when the fourth modeling mode is referred to as a raster scan mode, the fifth modeling mode may also be referred to as a pseudo-raster scan mode.

[0139] In the above description, the movement trajectory MT#5 was used as an example, in which the portions corresponding to the scanning trajectories ST1 and ST2 do not undergo movement (displacement) in the Y-axis direction (main scanning direction), but only movement (displacement) in the X-axis direction (sub-scanning direction). However, it is sufficient that the movement of the machining head 22 relative to the stage 31 in the +Y direction is canceled by scanning the machining light EL by the galvanometer mirror 46 (Y scanning mirror 46MY) in the -Y direction. Therefore, the movement trajectory, which is the trajectory of the machining light EL irradiated onto the workpiece W, does not necessarily have to have zero movement (displacement) in the Y-axis direction (main scanning direction) along the X-axis direction. In other words, the movement of the machining head 22 relative to the stage 31 in the +Y direction can be utilized to scan the machining light EL using the galvanometer mirror 46 so as to trace the movement trajectory, which is the trajectory of the machining light EL irradiated onto the workpiece W.

[0140] (2-3) Example of a Method for Forming a Structural Layer SL Next, the method for forming a three-dimensional structure ST described with reference to FIG. 5 will be further described with reference to FIG. 13 . For example, when an nth structural layer SL(n) as part of a three-dimensional structure ST is formed on a forming surface MS corresponding to the surface of the workpiece W, the control unit 7 may acquire path information for forming the structural layer SL(n), which is generated based on slice data corresponding to the structural layer SL(n). Note that “n” is a natural number greater than or equal to 1. Based on the path information, the control unit 7 generates a portion SLf(n) that defines the shape (e.g., outline) of the structural layer SL(n) and a portion SLi(n) that is an area surrounded by the portion SLf(n). Based on the path information, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form the portion SLf(n) that defines the shape (outline) of the structural layer SL(n) (see FIG. 13( a)). Thereafter, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLi(n) (see FIG. 13(b)) in the area surrounded by the portion SLf(n) based on the path information. In other words, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a portion SLi(n) (see FIG. 13(b)) that fills the interior of the portion SLf(n) based on the path information. As a result, a structural layer SL(n) may be formed on the printing surface MS, as shown in FIG. 13(b).

[0141] Thereafter, the processing system SYS may set the surface (upper surface) of the structural layer SL(n) as a new printing surface MS. In this case, the control unit 7 may first control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the processing head 22 moves along the Z axis relative to the stage 31. The control unit 7 may acquire path information for printing the structural layer SL(n+1), which is generated based on slice data corresponding to the (n+1)th structural layer SL(n+1). Based on the path information, the control unit 7 generates the structural layer SL(n+1) into a portion SLf(n+1) that defines the shape (e.g., the contour) and a portion SLi(n+1) of the area surrounded by the portion SLf(n+1). The control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to form a portion SLf(n+1) (see FIG. 13(c)) that defines the shape (outline) of the structural layer SL(n+1). Then, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to form a portion SLi(n+1) (not shown) in an area surrounded by the portion SLf(n+1). As a result, the structural layer SL(n+1) (not shown) may be formed.

[0142] In FIG. 13( b), the portion SLi(n) extends along the X-axis direction, but the extension direction of the portion SLi(n) may be arbitrary. The start position of the machining path (movement trajectory) when the portion SLf(n+1) is formed may be the same as or different from the start position of the machining path when the portion SLf(n) is formed. The orientation of the machining path when the portion SLf(n+1) is formed may be the same as or different from the orientation of the machining path when the portion SLf(n) is formed. The extension direction of the portion SLi(n+1) may be the same as or different from the extension direction of the portion SLi(n).

[0143] When the structural layer SL(n) is to be modeled, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to model a portion SLi(n) (see FIG. 13B) in a region surrounded by the portion SLf(n). Thereafter, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3, based on the path information, to model a portion SLf(n) around the portion SLi(n). According to research by the inventors of the present application, it has been found that when the portion SLi(n) is modeled after the portion SLf(n), modeling accuracy is higher than when the portion SLF(n) is modeled after the portion SLi(n).

[0144] Note that, when the size of the structure layer SL(n) is smaller than the scannable range of the galvanometer mirror 46 that can scan the processing light EL, it is preferable to use at least one of the first to fifth modeling modes described above to model the structure layer SL(n). When the size of the structure layer SL(n) is larger than the scannable range of the galvanometer mirror 46 that can scan the processing light EL, it is preferable to use at least one of the first, second, fourth, and fifth modeling modes in which the processing head 22 is moved relative to the stage 31 by at least one of the head driving mechanism 23 and the stage driving mechanism 32. The structure layer SL(n) may be modeled using a single modeling mode (any of the first to fifth modeling modes). The structure layer SL(n) may also be modeled using two or more modeling modes (two or more of the first to fifth modeling modes). For example, the portion SLf(n) may be formed in the first forming mode, and the portion SLi(n) may be formed in the second forming mode.

[0145] (2-4) Method for Forming Turbine Blades Next, a method for forming a turbine blade as a specific example of a three-dimensional structure ST will be described with reference to Figs. 14 to 18. Fig. 14 is a perspective view showing an example of a turbine blade. Note that the shape of the turbine blade is not limited to the shape shown in Fig. 14. Fig. 15 shows an example of a cross section of the turbine blade shown in Fig. 14 taken along a plane parallel to the XY plane. Note that in Fig. 15, the line width of each cross section corresponds to the width of the bead.

[0146] In the first modeling mode described above, the width W#1 (bead width) corresponds to the beam diameter of the processing light EL. In contrast, the width W#2 in the second modeling mode, the width W#4 in the fourth modeling mode, and the width W#5 in the fifth modeling mode correspond to the irradiation distance on the workpiece W of the processing light EL scanned in the sub-scanning direction by the galvanometer mirror 46. Therefore, the width of the bead formed in the first modeling mode is smaller than the width of the bead formed in each of the second, fourth, and fifth modeling modes. Therefore, when a model is to be formed over an entire area, using at least one of the second, fourth, and fifth modeling modes can form the model more quickly than using the first modeling mode. On the other hand, since the width of the bead formed by the first forming mode is smaller than the width of the bead formed by each of the second forming mode, the fourth forming mode, and the fifth forming mode, the forming accuracy of the first forming mode is higher than the forming accuracy of each of the second forming mode, the fourth forming mode, and the fifth forming mode.

[0147] From the above, when emphasis is placed on modeling accuracy, it is desirable to form a model using the first modeling mode. On the other hand, when the aim is to shorten the modeling time, it is desirable to form a model using one or more of the second, fourth, and fifth modeling modes.

[0148] Therefore, in the machining system SYS, when a turbine blade (in other words, a three-dimensional structure ST) is to be formed, a user of the machining system SYS may select or specify a mode for forming the turbine blade via the input device 74. The control unit 7 of the machining system SYS may control the output device 73 to output (for example, display) a forming mode that can be selected or specified by the user.

[0149] Here, examples of modes that the user can select or specify include a “high-definition mode,” a “medium mode,” and a “high-speed mode.” The “high-definition mode” may be a mode in which a model is formed using only the first modeling mode. The “high-speed mode” may be a mode in which a model is formed using one or more of the second, fourth, and fifth modeling modes. The “intermediate mode” may be a mode in which a part of the model is formed using the first modeling mode, and another part of the model is formed using one or more of the second, fourth, and fifth modeling modes. Note that the user may select or specify any of the “high-definition mode,” “medium mode,” and “high-speed mode” for each of the multiple structural layers used to form the turbine blade. In other words, the modes for forming each of the multiple structural layers may all be the same, or may be at least partially different.

[0150] The control unit 7 may create slice data by slicing the three-dimensional model data of the turbine blade at the layer pitch. The control unit 7 may acquire path information for forming the nth structural layer, which is generated based on the slice data corresponding to the nth structural layer. Note that "n" is a natural number equal to or greater than 1.

[0151] (2-4-1) High-Definition Mode The operation of the control unit 7 when the control unit 7 models the nth structural layer in the high-definition mode based on the path information will be described with reference to the flowchart of FIG. 16 . In FIG. 16 , the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to use the first modeling mode to model a first portion (e.g., portion SLf_hd(n) shown in FIG. 15( a)) that defines the shape (e.g., the contour) of the nth structural layer (step S101). For example, in the processing of step S101, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 to change the relative positional relationship between the machining head 22 and the stage 31 based on the path information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the first portion may be modeled by scanning the processing light EL based on the path information. The shape (e.g., the contour) of the n-th structural layer corresponding to the first portion can be said to be a shape in which the start point and the end point of the movement trajectory indicated by the path information coincide with each other. Therefore, the first portion can be said to be annular.

[0152] Next, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to form a second portion (e.g., portion SLi_hd(n) shown in FIG. 15A) in the area surrounded by the first portion using the first modeling mode (step S102). For example, in the processing of step S102, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 so that the relative positional relationship between the machining head 22 and the stage 31 is changed based on the path information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the second portion may be formed by scanning the processing light EL based on the path information. In other words, the interior of the first portion may be filled with the second portion.

[0153] As a result of the processing of steps S101 and S102, a structural layer SL_hd(n) may be formed. Note that the processing of step S101 may be performed after the processing of step S102. That is, the first portion may be formed after the second portion is formed. In this case, after the second portion is formed in a region surrounded by the first portion, the first portion may be formed around the formed second portion.

[0154] The high-definition mode allows for the creation of a three-dimensional structure ST (e.g., a turbine blade) with relatively high modeling accuracy. In other words, the high-definition mode allows for improved modeling accuracy of the three-dimensional structure ST.

[0155] (2-4-2) Intermediate Mode The operation of the control unit 7 when the control unit 7 models the nth structural layer in the intermediate mode based on the path information will be described with reference to the flowchart of FIG. 17 . In FIG. 17 , the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 to use the first modeling mode to model a first portion (e.g., portion SLf_m(n) shown in FIG. 15( b)) that defines the shape (e.g., the contour) of the nth structural layer (step S201). For example, in the processing of step S201, the control unit 7 may control at least one of the head driving mechanism 23 and the stage driving mechanism 32 to change the relative positional relationship between the machining head 22 and the stage 31 based on the path information, without deflecting and scanning the processing light EL with the galvanometer mirror 46. As a result, the first portion may be modeled by scanning the processing light EL based on the path information.

[0156] Next, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a second part (e.g., part SLi_m(n) shown in Figure 15(b)) in the area surrounded by the first part using one or more of the second, fourth, and fifth forming modes (step S202).

[0157] For example, when the second modeling mode is used in the processing of step S202, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the machining head 22 and the stage 31 along the first direction, change the deflection direction of the machining light EL by the galvanometer mirror 46, and therefore the emission direction of the machining light EL, and to scan the machining light EL along a second direction intersecting the first direction. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

[0158] For example, when the fourth modeling mode is used in the processing of step S202, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information so as to alternately change the relative positional relationship between the machining head 22 and the stage 31 along the first direction and scan the machining light EL along a second direction intersecting the first direction by changing the deflection direction of the machining light EL using the galvanometer mirror 46 and thus the emission direction of the machining light EL. In this case, movement of the machining head 22 along the first direction and scanning of the machining light EL in the second direction may be repeated. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

[0159] For example, when the fifth modeling mode is used in the processing of step S202, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the machining head 22 and the stage 31 along the first direction, change the deflection direction of the machining light EL by the galvanometer mirror 46, and ultimately the emission direction of the machining light EL, and to scan the machining light EL in the first direction, a second direction perpendicular to the first direction, and a direction intersecting each of these. In this case, the relative movement of the machining head 22 relative to the stage 31 in the first direction and the deflection of the machining light EL by the galvanometer mirror 46 in response to the relative movement are simultaneously performed, causing the machining light EL to scan along the second direction intersecting the first direction. As a result, the second part is modeled by scanning the machining light EL based on the path information.

[0160] As a result of the processes of steps S201 and S202, a structure layer SL_m(n) may be formed. The width of the bead formed in the process of step S201 may be narrower than the width of the bead formed in the process of step S202. In other words, the width of the bead formed in the process of step S202 may be wider than the width of the bead formed in the process of step S201. The process of step S201 may be performed after the process of step S202. In other words, the first part may be formed after the second part is formed. In this case, after the second part is formed in a region surrounded by the first part, the first part may be formed around the formed second part.

[0161] According to the intermediate mode, it is possible to achieve a relatively high molding accuracy for the outer wall portion of the three-dimensional structure ST (for example, a turbine blade), and also to shorten the time required to mold the three-dimensional structure ST.

[0162] (2-4-3) High-Speed ​​Mode The operation of the control unit 7 when the control unit 7 models the n-th structural layer in high-speed mode based on the pass information will be described with reference to the flowchart of Fig. 18. In Fig. 18, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to model a first portion (for example, the portion SLf_hs(n) shown in Fig. 15(c)) using one or more modeling modes of the second modeling mode, the fourth modeling mode, and the fifth modeling mode (step S301).

[0163] For example, when the second modeling mode is used in the processing of step S301, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the machining head 22 and the stage 31 along the first direction, change the deflection direction of the machining light EL by the galvanometer mirror 46, and therefore the emission direction of the machining light EL, and to scan the machining light EL along a second direction intersecting the first direction. As a result, the first part may be modeled by scanning the machining light EL based on the path information.

[0164] For example, when the fourth modeling mode is used in the processing of step S301, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information so as to alternately change the relative positional relationship between the machining head 22 and the stage 31 along the first direction and scan the machining light EL along a second direction intersecting the first direction by changing the deflection direction of the machining light EL using the galvanometer mirror 46 and thus the emission direction of the machining light EL. In this case, movement of the machining head 22 along the first direction and scanning of the machining light EL in the second direction may be repeated. As a result, the first part is modeled by scanning the machining light EL based on the path information.

[0165] For example, when the fifth modeling mode is used in the processing of step S301, the control unit 7 controls the machining unit 2 and the stage unit 3 based on the path information to change the relative positional relationship between the machining head 22 and the stage 31 along the first direction, change the deflection direction of the machining light EL by the galvanometer mirror 46, and ultimately the emission direction of the machining light EL, and to scan the machining light EL in the first direction, a second direction perpendicular to the first direction, and a direction intersecting each of these. In this case, the relative movement of the machining head 22 relative to the stage 31 in the first direction and the deflection of the machining light EL by the galvanometer mirror 46 in response to the relative movement are simultaneously performed, thereby scanning the machining light EL along the second direction intersecting the first direction. As a result, the first part is modeled by scanning the machining light EL based on the path information.

[0166] Next, the control unit 7 may control at least one of the processing unit 2 and the stage unit 3 to form a second part (e.g., part SLi_hs(n) shown in Figure 15(c)) in the area surrounded by the first part using one or more of the second, fourth, and fifth forming modes (step S302).

[0167] For example, when the second modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 based on the path information to deflect the machining light EL with the galvanometer mirror 46 and periodically scan the machining light EL along a second direction intersecting the first direction while changing the relative positional relationship between the machining head 22 and the stage 31 along the first direction. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

[0168] For example, when the fourth modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 based on the path information so that a change in the relative positional relationship between the machining head 22 and the stage 31 along a first direction and a scan along a second direction intersecting the first direction by deflecting the machining light EL with the galvanometer mirror 46 are alternately repeated. In this case, scanning of the machining head 22 along the first direction and a change in the scanning position of the machining light EL in the second direction may be repeated. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

[0169] For example, when the fifth modeling mode is used in the processing of step S302, the control unit 7 may control at least one of the machining unit 2 and the stage unit 3 based on the path information so that the relative positional relationship between the machining head 22 and the stage 31 is changed along the first direction, and the machining light EL is deflected by the galvanometer mirror 46 to perform periodic scanning. In this case, the machining head 22 may move relative to the stage 31 in the first direction, and the galvanometer mirror 46 may deflect the machining light EL in accordance with the relative movement simultaneously, thereby scanning the machining light EL along a second direction intersecting the first direction. As a result, the second part may be modeled by scanning the machining light EL based on the path information.

[0170] As a result of the processes of steps S301 and S302, a structure layer SL_hs(n) may be formed. Note that the width of the bead formed in the process of step S301 may be narrower than the width of the bead formed in the process of step S302. In other words, the width of the bead formed in the process of step S302 may be wider than the width of the bead formed in the process of step S301. Note that the process of step S301 may be performed after the process of step S302. In other words, the first part may be formed after the second part is formed. In this case, after the second part is formed in a region surrounded by the first part, the first part may be formed around the formed second part.

[0171] The high-speed mode allows a three-dimensional structure ST (e.g., a turbine blade) to be formed in a relatively short time. In other words, the high-speed mode allows the time required to form the three-dimensional structure ST to be shortened.

[0172] (3) Modifications Next, modifications of the machining system SYS will be described.

[0173] In the above description, the machining unit 2 changes the emission direction of the processing light EL using the galvanometer mirrors 41#16 and 41#26. However, the machining unit 2 may change the emission direction of the processing light EL using an optical system (optical component) other than the galvanometer mirrors 41#16 and 41#26. For example, the machining unit 2 may change the emission direction of the processing light EL using at least one of a polygon mirror and a resonant mirror. For example, the machining unit 2 may change the emission direction of the processing light EL using a resonant scanner that resonates a mirror supported at both ends by a pair of torsion bars. For example, the machining unit 2 may change the emission direction of the processing light EL using an acousto-optic deflector (AOD).

[0174] In the above description, the processing unit 2 includes a plurality of galvanometer mirrors (galvanometer mirrors 41#16 and 41#26) for changing the emission directions of the plurality of processing lights EL, respectively. However, the processing unit 2 may also be configured such that a plurality of processing lights EL are incident on a single galvanometer mirror, and the emission directions of the plurality of processing lights EL may be changed collectively.

[0175] In the above description, the machining unit 2 irradiates the workpiece W with multiple processing light beams EL (processing light beams EL#1 and EL#2). However, the machining unit 2 may irradiate the workpiece W with a single processing light beam EL. In this case, the irradiation device 21 of the machining unit 2 may include a single galvanometer mirror (e.g., a set of one X-scanning mirror and one Y-scanning mirror) to change the emission direction of the single processing light beam EL (and thereby change the irradiation position of the single processing light beam EL). In other words, the irradiation device 21 of the machining unit 2 may not include the second optical system 41#2. Alternatively, the irradiation device 21 of the machining unit 2 may include either the focusing optical system 50 or the prism mirror 51 of the focusing optical system 50, and not the second optical system 41#2. In this case, the processing light beam EL#1 of the first optical system 41#1 is incident on the fθ lens 52 of the focusing optical system 50 or on the printing surface MS. In addition, the irradiation optical system 211 of the processing unit 2 may be equipped with either one X-scanning mirror or one Y-scanning mirror in order to change the emission direction of a single processing light EL, but may not be equipped with the other one X-scanning mirror or one Y-scanning mirror.

[0176] In the above description, the control unit 7 controls at least one of the galvanometer mirrors 41#16 and 41#26 to move the irradiation area EA within the machining unit area PUA set on the manufacturing surface MS, while controlling at least one of the head driving mechanism 23 and the stage driving mechanism 32 to move the machining unit area PUA on the manufacturing surface MS, thereby manufacturing an object on the manufacturing surface MS that extends along the movement direction of the machining unit area PUA on the manufacturing surface MS. However, the control unit 7 may also control the machining unit 2 so that an object having a desired shape pattern is manufactured within the machining unit area PUA.

[0177] In the above description, the processing unit 2 irradiates the shaping material M with the processing light EL to melt the shaping material M. However, the processing unit 2 may irradiate the shaping material M with any energy beam to melt the shaping material M. Examples of the any energy beam include at least one of a charged particle beam and an electromagnetic wave. Examples of the charged particle beam include at least one of an electron beam and an ion beam.

[0178] In the above description, the processing system SYS performs additive processing. However, the processing system SYS may perform remover processing in addition to or instead of additive processing. The remover processing may include irradiating the workpiece W with the processing light EL to remove a portion of the workpiece W. As an example, the processing system SYS may perform additive processing on the workpiece W using at least one of the processing lights EL#1 and EL#2, and then perform remover processing on the workpiece W that has undergone additive processing using at least one of the processing lights EL#1 and EL#2. As another example, the processing system SYS may perform additive processing on a first portion of the workpiece W using one of the processing lights EL#1 and EL#2, while performing remover processing on a second portion of the workpiece W that is different from the first portion using the other of the processing lights EL#1 and EL#2. In other words, the processing system SYS may perform additive processing and remover processing simultaneously. Note that if the processing system SYS does not need to perform additive processing and remover processing simultaneously, the processing system SYS may perform additive processing and remover processing using the same processing light EL.

[0179] The processing system SYS may perform a remelt process in addition to at least one of additive processing and subtractive processing. The remelt process may include a process for melting the surface of the workpiece W once and reducing the surface flatness of the workpiece W (reducing surface roughness, bringing the surface closer to a flat surface). As an example, the processing system SYS may perform at least one of additive processing and subtractive processing on the workpiece W using at least one of the processing beams EL#1 and EL#2, and then perform a remelt process on the workpiece W (or a shaped object formed on the workpiece W by the additive processing) that has been subjected to at least one of additive processing and subtractive processing using at least one of the processing beams EL#1 and EL#2. As another example, the processing system SYS may perform at least one of additive processing and subtractive processing on a first portion of the workpiece W using one of the processing beams EL#1 and EL#2, while performing a remelt process on a second portion of the workpiece W that is different from the first portion using the other of the processing beams EL#1 and EL#2. That is, the processing system SYS may perform at least one of the additional processing and the removal processing and the remelt processing simultaneously. Note that, if the processing system SYS does not need to perform at least one of the additional processing and the removal processing and the remelt processing simultaneously, the processing system SYS may perform at least one of the additional processing and the removal processing and the remelt processing using the same processing light EL.

[0180] The above-described processing unit 2 (processing head 22) may be attached to a robot (typically, an articulated robot). When the processing head 22 is moved by a robot, the head drive mechanism 23 may be the robot. For example, the processing unit 2 (processing head 22) may be attached to a welding robot for welding. For example, the processing unit 2 (processing head 22) may be attached to a self-propelled mobile robot. The self-propelled mobile robot may include, for example, a self-propelled device such as an AGV (Automatic Guided Vehicle) or an AMR (Autonomous Mobile Robot), and a robot arm provided on the self-propelled device.

[0181] At least some of the constituent elements of each of the above-described embodiments can be appropriately combined with at least some of the other constituent elements of each of the above-described embodiments. Some of the constituent elements of each of the above-described embodiments may not be used. Furthermore, to the extent permitted by law, the disclosures of all publications and U.S. patents cited in each of the above-described embodiments are incorporated herein by reference.

[0182] The present invention is not limited to the above-described embodiments, but can be modified as appropriate within the scope of the claims and the gist or idea of ​​the invention as can be read from the entire specification, and processing systems, control devices, control methods, computer programs and recording media that involve such modifications are also included in the technical scope of the present invention.

[0183] SYS Machining system 2 Machining unit 3 Stage unit 4 Irradiation unit 6 Material supply unit 7 Control unit 20 Head unit 21 Irradiation device 22 Machining head 40 Light source unit 71 Arithmetic unit 72 Storage device W Workpiece M Modeling material MS Modeling surface EL Processing light

Claims

1. A modeling method using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, in which a modeling material supplied toward the object by the processing light is additively modeled on the object, the modeling method comprising: a first step of changing the relative positional relationship between the deflection member and the object without changing the deflection direction in which the deflection member deflects the processing light, and scanning the processing light relative to the object; and a second step of deflecting the processing light with the deflection member and scanning the processing light.

2. The shaping method according to claim 1, wherein the second step involves deflecting the processing light with the deflecting member and scanning the processing light without changing the relative positional relationship between the deflecting member and the object.

3. A molding method as described in claim 1 or 2, wherein the first step changes the relative positional relationship between the deflection member and the object so that the relative displacement between the deflection member and the object is larger than the scannable range of the object that can be scanned by the deflection member.

4. A modeling method for additively modeling an object by stacking multiple layers in a stacking direction using the modeling device, wherein the first step and the second step are performed for a single layer. The modeling method according to any one of claims 1 to 3.

5. The method according to any one of claims 1 to 4, wherein a first portion is formed in the first step, and a second portion adjacent to the first portion is formed in the second step.

6. The method according to any one of claims 1 to 5, wherein a first portion is formed in the first step, and a second portion is formed in the area surrounded by the first portion in the second step.

7. The molding method according to claim 6, wherein the second step repeatedly performs scanning along a first direction and changing the scanning position in a second direction intersecting the first direction within the first portion.

8. The molding method according to claim 7, wherein the first portion has an annular shape, and the second step molds the second portion so as to fill the inside of the first portion.

9. A molding method according to any one of claims 1 to 8, wherein the second step involves deflecting the processing light with the deflecting member and scanning the processing light without changing the relative positional relationship between the deflecting member and the object.

10. A molding method as described in claim 6, wherein the second step simultaneously performs a relative movement of the deflection member and the object relative to each other in a third direction and deflects the processing light by the deflection member in accordance with the relative movement, thereby scanning the processing light on the object in a fourth direction intersecting with the third direction.

11. The molding method according to claim 10, wherein the first portion has an annular shape, and the second step molds the second portion so as to fill the inside of the first portion.

12. The modeling method according to any one of claims 1 to 11, wherein the first step and the second step supply the modeling material toward the object in the form of a gas.

13. The modeling method according to claim 12, wherein the first step and the second step supply the modeling material to the part of the object irradiated with the processing light.

14. The method according to claim 12 or 13, wherein the first step and the second step are alternately repeated.

15. A manufacturing method according to any one of claims 1 to 14, wherein the width of the bead formed in the first step is narrower than the width of the bead formed in the second step.

16. The method according to any one of claims 1 to 15, wherein the deflection member is a galvanometer mirror.

17. A modeling method for additively modeling a modeling material supplied to an object with processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method comprising: a first step of scanning the processing light and modeling a first portion of the object with the modeling material; and a second step of deflecting the processing light with the deflection member and scanning the processing light without changing the relative positional relationship between the deflection member and the object, thereby modeling a second portion of the object with the modeling material in an area surrounded by the first portion.

18. The modeling method according to claim 17, wherein the second step repeatedly performs scanning along a first direction and changing the scanning position in a second direction intersecting the first direction within the first portion.

19. The molding method according to claim 18, wherein the first portion has an annular shape, and the second step molds the second portion so as to fill the inside of the first portion.

20. The molding apparatus according to any one of claims 17 to 19, wherein the first step scans the processing light while changing the relative positional relationship between the head and the object.

21. A modeling method for additively modeling modeling of modeling material supplied to an object by processing light using a modeling device equipped with a deflection member capable of deflecting processing light incident from a light source, the method comprising: simultaneously performing relative movement of the deflection member and the object relative to each other in a first direction and deflection of the processing light by the deflection member in accordance with the relative movement; scanning the processing light on the object in a second direction intersecting with the first direction; and additively modeling the object using the supplied material.

22. The method according to claim 21, wherein the processing light is deflected so as to change the scanning speed of the processing light in accordance with the change in the speed of the relative movement.

23. A modeling device that additively models a modeling material on an object using processing light from a light source, comprising: an irradiation optical system including a deflection member capable of deflecting the incident processing light; a movement device that can move at least one of the deflection member and the object; and a control device that controls the deflection member and the movement device, wherein the control device is capable of executing a first control that controls the movement device to change the relative positional relationship between the deflection member and the object without the deflection direction of the processing light by the deflection member; and a second control that controls the deflection member so that the movement device deflects the processing light without changing the relative positional relationship between the deflection member and the object.

24. The modeling method described in claim 23, further comprising a material supply device that supplies the modeling material to the object using gas, wherein the control device controls the material supply device to supply the modeling material to the object when the first control and the second control are each executed.

25. A modeling device that additively models a modeling material on an object using processing light from a light source, comprising: an irradiation optical system including a deflection member capable of deflecting the incident processing light; a movement device capable of moving at least one of the deflection member and the object; and a control device that controls the deflection member and the movement device, wherein the control device simultaneously performs first control to control the movement device to relatively move the deflection member and the object in a first direction, and second control to control the deflection member to deflect the processing light in accordance with the first control, thereby scanning the processing light on the object in a second direction that intersects with the first direction.

26. The modeling method according to claim 25, further comprising a material supply device that supplies the modeling material to the object using gas, and the control device controls, using the movement device, the supply position at which the modeling material is supplied to the object by the material supply device in accordance with the relative movement between the deflection member and the object.

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