Laminate and package

Abstract

Provided are a laminate and a package with which it is possible to transport and store an anisotropic electroconductive member that is easily damaged or otherwise mechanically fragile. This laminate has: an anisotropic electroconductive member having an insulating base material that exhibits electrical insulating properties, and a plurality of electroconductive paths that are provided so as to penetrate in the thickness direction of the insulating base material and are provided with projecting parts projecting from at least one surface of the insulating base material; and an organic film disposed on at least one of the two surfaces of the anisotropic electroconductive member, said surfaces being opposite each other in the thickness direction of the insulating base material. The organic film has a gas permeability of 2.3 × 108 to 4.6 × 109 mL / (m2 ⋅ day ⋅ MPa).

Description

Laminates and packaging

[0001] The present invention relates to a laminate in which an anisotropically conductive member and an organic film are laminated, and a package containing the laminate, and in particular to a laminate and package in which the anisotropically conductive member has a conductive path penetrating through the insulating base material in the thickness direction, and the organic film has gas permeability.

[0002] An anisotropically conductive member has conductive paths formed by filling a plurality of through-holes in an insulating substrate with a conductive material such as metal. An anisotropically conductive member can be inserted between an electronic component such as a semiconductor element and a circuit board and electrically connected therebetween simply by applying pressure. Therefore, it is widely used as an electrical connection member for electronic components such as semiconductor elements, and as an inspection connector for functional testing. Electronic components such as semiconductor elements are particularly prone to downsizing. Conventional methods for directly connecting wiring boards, such as wire bonding, flip-chip bonding, and thermocompression bonding, may not be able to fully ensure the stability of the electrical connection of electronic components. Therefore, anisotropically conductive members have attracted attention as electronic connection members. When used as an electronic connection member, the anisotropically conductive member is mounted on a printed circuit board using a surface mounter such as a chip mounter. In this case, the anisotropically conductive member is transported and stored using a carrier tape or the like.

[0003] For example, Patent Document 1 describes a package including a carrier tape having an electronic component storage section and a cover tape that seals the electronic component storage section. The cover tape includes a base layer having an antistatic surface, an adhesive layer, and an electrostatic induction prevention layer provided between the base layer and the adhesive layer.

[0004] Japanese Patent Application Laid-Open No. 2005-178073

[0005] Patent Document 1 describes a package obtained by continuously sealing both longitudinal edges of a cover tape with a width of 0.3 to 1.0 mm, packaging the product, and winding it onto a reel. It also describes that electronic components and the like are stored or transported in this packaged form. Patent Document 1 also describes peeling off the cover tape and removing the electronic components and the like while checking their presence, orientation, and position using a pickup device. Here, the above-mentioned anisotropically conductive member has an insulating substrate that exhibits electrical insulation. Insulating substrates are generally known to be more mechanically fragile than metal materials, and there is a possibility that the anisotropically conductive member may be damaged by vibration due to external forces when being transferred to a printed circuit board or during storage. However, Patent Document 1 does not take into consideration the handling of mechanically fragile materials, such as those that are easily damaged by vibration. An object of the present invention is to provide a laminate and a package that can transport and store mechanically fragile anisotropically conductive materials, such as those that are easily damaged.

[0006] In order to achieve the above object, invention [1] provides an anisotropically conductive member having an insulating substrate having electrical insulation properties, and a plurality of conductive paths penetrating the insulating substrate in the thickness direction and having protrusions protruding from at least one surface of the insulating substrate, and an organic film disposed on at least one surface of two surfaces of the anisotropically conductive member that face each other in the thickness direction of the insulating substrate, wherein the organic film has a gas permeability of 2.3 × 10 8 ~4.6 x 10 9 ml / (m 2 · day · MPa).

[0007] Invention [2] is the laminate according to Invention [1], in which the organic film is disposed on two opposing surfaces of the insulating substrate in the thickness direction. Invention [3] is the laminate according to Invention [1] or [2], in which the organic film has a spacer disposed on the surface that contacts the anisotropically conductive member. Invention [4] is the laminate according to any one of Inventions [1] to [3], in which the winding core has a core, and the anisotropically conductive member and the organic film are wound around the core in a stacked state. Invention [5] is the laminate according to Invention [4], in which the core is formed into a cylinder, and flanges having a diameter larger than the diameter of the core are provided at both axial ends of the core.

[0008] Invention [6] is the laminate according to any one of Inventions [1] to [5], in which the organic film is a porous film. Invention [7] is the laminate according to any one of Inventions [1] to [6], in which a plurality of anisotropically conductive members are arranged in one direction on at least one surface of the organic film. Invention [8] is the laminate according to any one of Inventions [1] to [7], in which anisotropically conductive members are arranged on each of two surfaces of the organic film that face each other in the thickness direction.

[0009] The invention [9] comprises the laminate according to any one of the inventions [1] to [8] and a storage bag for storing the laminate, wherein the storage bag has a gas permeability of 1×10 -5 ~1 ml / (m 2 Invention

[10] is the package according to invention [9], wherein the storage bag has a light transmittance of up to 1% or less in a wavelength range of 100 to 780 nm.

[0010] According to the present invention, it is possible to provide a laminate and a package that can transport and store anisotropically conductive members that are mechanically fragile, such as those that are easily damaged.

[0011] FIG. 1 is a schematic cross-sectional view showing a first example of a laminate according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a stacked state of the first example of a laminate according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing another example of a stacked state of the first example of a laminate according to an embodiment of the present invention. FIG. 4 is a schematic cross-sectional view showing a second example of a laminate according to an embodiment of the present invention. FIG. 5 is a schematic cross-sectional view showing another example of a stacked state of the second example of a laminate according to an embodiment of the present invention. FIG. 6 is a schematic plan view showing a third example of a laminate according to an embodiment of the present invention. FIG. 7 is a schematic cross-sectional view showing a third example of a laminate according to an embodiment of the present invention. FIG. 8 is a schematic perspective view showing a fourth example of a laminate according to an embodiment of the present invention. FIG. 9 is a schematic cross-sectional view showing a fifth example of a laminate according to an embodiment of the present invention. FIG. 10 is a schematic view showing a first example of a package according to an embodiment of the present invention. FIG. 11 is a schematic perspective view showing a second example of a package according to an embodiment of the present invention. FIG. 12 is a schematic cross-sectional view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. FIG. 13 is a schematic plan view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention.

[0012] The laminate and packaging body of the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings. The drawings described below are illustrative for explaining the present invention and are simplified for explaining the present invention. Therefore, the present invention is not limited to the drawings shown below. In the following, the range of values ​​"to" includes the values ​​written on both sides. For example, when ε is a value ε α ~Number ε β That is, the range of ε is the number ε α and the number ε β The range includes ε α ≦ε≦ε β Unless otherwise specified, the terms "parallel" and "orthogonal" include a generally acceptable error range in the relevant technical field.

[0013] [First Example of Laminate] FIG. 1 is a schematic cross-sectional view showing a first example of a laminate according to an embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing an example of a stacked state of the first example of a laminate according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing another example of a stacked state of the first example of a laminate according to an embodiment of the present invention. Note that, although a plurality of anisotropically conductive members 12 are shown in FIGS. 1 to 3, the number of anisotropically conductive members 12 is not particularly limited to the number shown in FIGS. 1 to 3. The laminate 10 shown in FIG. 1 has a configuration in which anisotropically conductive members 12 and an organic film 14 are stacked. The direction in which the anisotropically conductive members 12 and the organic film 14 are stacked is the stacking direction Ds. In the laminate 10, the organic film 14 is disposed on at least one of two surfaces of the anisotropically conductive member 12 that face each other in the thickness direction of the insulating substrate 50 (see FIG. 13). In FIG. 1, the organic film 14 is disposed on the surface 12a of the anisotropically conductive member 12. The rear surface 14b of the organic film 14 is in contact with the front surface 12a of the anisotropically conductive member 12. The organic film 14 is, for example, １ The anisotropically conductive member 12 is a long member extending in one direction D. １ A plurality of the electrodes are arranged on the rear surface 14b of the organic film 14 at intervals along the line.

[0014] The front surface 12a of the anisotropically conductive member 12 is the front surface 50a (see FIG. 13) of the insulating substrate 50 (see FIG. 13). The back surface 12b of the anisotropically conductive member 12 is the back surface 50b (see FIG. 13) of the insulating substrate 50 (see FIG. 13). The front surface 12a and the back surface 12b of the anisotropically conductive member 12 are surfaces that face each other in the thickness direction Dt (see FIG. 13) of the insulating substrate 50.

[0015] As will be described in detail later, the anisotropically conductive member 12 has an electrically insulating substrate 50 (see FIG. 13 ) and a plurality of conductive paths 52 (see FIG. 13 ) that penetrate the insulating substrate 50 in the thickness direction Dt (see FIG. 13 ) and have protrusions 52 a (see FIG. 13 ) that protrude from at least one surface of the insulating substrate 50. As described above, insulating substrates are generally known to be more mechanically fragile than metal materials.

[0016] The organic film 14 has a gas permeability of 2.3×10 8 ~4.6 x 109 ml / (m 2 The gas permeability of the organic film 14 described above was measured using a hydrodynamic method at a differential pressure of 0.95166 kg / cm 2 The gas permeability can be determined by measuring the flow rate per minute per unit volume under an environment of 700 mmHg (700 mmHg) and a temperature of 25°C. The hydrodynamic method is a method in which the organic membrane to be measured is attached to a gas permeation test device, an arbitrary pressure difference is created, and the speed at which the gas passes through the organic membrane or the change in flow is measured to determine the gas permeability. The organic membrane 14 has a gas permeability of 2.3 x 10 8 ~4.6 x 10 9 ml / (m 2 .day.MPa), for example, when a chip mounter (not shown) is used to bring the head 19 into contact with the surface 14a of the organic film 14 and suck the organic film 14, the anisotropically conductive member 12 can be sucked through the organic film 14, and the anisotropically conductive member 12 can be held by the head 19. Therefore, even if the organic film 14 is between the head 19 and the anisotropically conductive member 12, the anisotropically conductive member 12 can be transported.

[0017] By providing the organic film 14 on the surface 12a of the anisotropically conductive member 12, when, for example, a chip mounter (not shown) is used to transport the anisotropically conductive member 12 by sucking the organic film 14 with the head 19, the organic film 14 exists between the head 19 and the anisotropically conductive member 12, and acts as a buffer to prevent damage to the anisotropically conductive member 12, such as chipping and cracking of the insulating substrate. Furthermore, the anisotropically conductive member 12 has multiple conductive paths 52 (see FIG. 13) with protrusions 52a (see FIG. 13). The presence of the organic film 14 between the head 19 and the anisotropically conductive member 12 also prevents damage to the protrusions 52a (see FIG. 13). In this way, mechanically fragile anisotropically conductive members 12 that are easily damaged can be transported. Damage to the anisotropically conductive member 12 includes, as described above, chipping and cracking of the insulating substrate, deformation and loss of the protrusions of the conductive paths, and the like. For example, if the insulating substrate has a chip or the like, a portion of the insulating substrate may peel off, potentially causing contamination. Furthermore, if the anisotropically conductive member is used as an electronic connection member when a protrusion is deformed and in contact with an adjacent protrusion, proper electrical connection may not be possible. Therefore, it is necessary to prevent damage to the anisotropically conductive member 12.

[0018] Furthermore, in the laminate 10, by providing the organic film 14 on the surface 12a of the anisotropically conductive member 12 as described above, the organic film 14 functions as a buffer material, and therefore damage to the anisotropically conductive member 12 is suppressed even if vibrations due to external forces are applied to the anisotropically conductive member 12 during storage. This allows the anisotropically conductive member 12, which is mechanically fragile and prone to damage, to be stored stably while suppressing damage.

[0019] The laminate 10 may have a configuration in which nothing is provided on the back surface 12b of the anisotropically conductive member 12 on which the organic film 14 is not provided. In this configuration, for example, when the laminate 10 is placed on a support (not shown), the back surface 12b of the anisotropically conductive member 12 contacts the support. The laminate 10 may also have a configuration in which the anisotropically conductive members 12 are stacked in the stacking direction Ds as shown in FIG. 2. In FIG. 2, the anisotropically conductive members 12 are stacked in an overlapping manner in the stacking direction Ds. In this case, the anisotropically conductive members 12 are respectively arranged on two surfaces that face each other in the thickness direction of the organic film 14. The stacking of the laminate 10 is not limited to stacking the anisotropically conductive members 12 in the stacking direction Ds. For example, as shown in FIG. 3, the anisotropically conductive member 12 on the lower side in the stacking direction Ds is stacked in one direction Ds on the anisotropically conductive member 12 on the upper side in the stacking direction Ds. １ 3, the anisotropically conductive members 12 may be arranged in a region 13 between the insulating substrates 12a and 12b so that the anisotropically conductive members 12 do not overlap in the stacking direction Ds. As shown in Fig. 3, by configuring the anisotropically conductive members 12 so that they do not overlap, the force acting on the anisotropically conductive members 12 in the stacking direction Ds can be made smaller than when the anisotropically conductive members 12 are stacked in the stacking direction Ds, and damage to the insulating substrates and protrusions of the anisotropically conductive members 12 can be further suppressed. Note that the specific configuration for stacking the laminate 10 will be described later.

[0020] [Second Example of Laminate] Fig. 4 is a schematic cross-sectional view showing a second example of a laminate according to an embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing an example of a laminated state of the second example of a laminate according to an embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing another example of a laminated state of the second example of a laminate according to an embodiment of the present invention. Note that although Figs. 4 to 6 show a plurality of anisotropically conductive members 12, the number of anisotropically conductive members 12 is not particularly limited to the number shown in Figs. 4 to 6. In Figs. 4 to 6, the same components as those in the laminate 10 shown in Figs. 1 to 3 are designated by the same reference numerals, and detailed description thereof will be omitted.

[0021] The laminate 10 shown in FIG. 4 differs from the laminate 10 shown in FIG. 1 in that the organic film 14 is disposed on two opposing surfaces of the insulating substrate of the anisotropically conductive member 12 in the thickness direction. The other configuration is the same as that of the laminate 10 shown in FIG. 1. The laminate 10 shown in FIG. 4 has an organic film 14 disposed on each of the front surface 12a and back surface 12b of the anisotropically conductive member 12. This configuration protects both surfaces of the anisotropically conductive member 12, further reducing damage to the anisotropically conductive member 12. Therefore, mechanically fragile anisotropically conductive members 12 that are easily damaged can be transported and stored stably while reducing damage. Furthermore, when the anisotropically conductive member 12 is transported using a chip mounter (not shown) as described above, the organic film 14 disposed on either the front surface 12a or back surface 12b of the anisotropically conductive member 12 can be suctioned by the head 19, providing a high degree of freedom in transporting the anisotropically conductive member 12. Furthermore, for example, when the laminate 10 is unwound from a wound state, the organic film 14 is present on both the front surface 12a and the back surface 12b of the anisotropically conductive member 12, so that the degree of freedom in unwinding is high.

[0022] The laminate 10 may also have a configuration in which the anisotropically conductive members 12 are stacked in the stacking direction Ds as shown in Fig. 5. In Fig. 5, the anisotropically conductive members 12 are stacked in the stacking direction Ds. When stacking the laminate 10, it is not limited to stacking the anisotropically conductive members 12 in the stacking direction Ds. For example, as shown in Fig. 6, the anisotropically conductive member 12 on the lower side in the stacking direction Ds may be stacked in one direction Ds with respect to the anisotropically conductive member 12 on the upper side in the stacking direction Ds. １ 6 , by configuring the anisotropically conductive members 12 so that they do not overlap in the stacking direction Ds, the force acting on the anisotropically conductive members 12 in the stacking direction Ds can be made smaller than when the anisotropically conductive members 12 are stacked in the stacking direction Ds, and therefore damage to the insulating substrates and protrusions of the anisotropically conductive members 12 can be further suppressed. Note that the specific configuration for stacking the laminate 10 will be described later.

[0023] The laminate 10 shown in FIG. 4 has an organic film 14 on both the front surface 12a and the back surface 12b of the anisotropically conductive member 12, but this is not limiting. Either one of the organic films 14 on the front surface 12a and the back surface 12b of the anisotropically conductive member 12 does not have to be an organic film 14. For example, a tape made of polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP) other than the organic film 14 may be disposed instead of the organic film 14. A carrier tape used in electronic component mounting devices can be used instead of the organic film 14. Alternatively, an embossed carrier tape having multiple recesses arranged along one direction for accommodating the anisotropically conductive member 12 can be used instead of the organic film 14. In the embossed carrier tape, one anisotropically conductive member is disposed in each recess, allowing the anisotropically conductive member 12 to be more stably accommodated. When an embossed carrier tape is used, the anisotropically conductive member 12 may be placed in the recess, and then the organic film 14 may be placed thereon to seal.

[0024] [Third Example of Laminate] Fig. 7 is a schematic plan view showing a third example of a laminate according to an embodiment of the present invention. Fig. 8 is a schematic cross-sectional view showing a third example of a laminate according to an embodiment of the present invention. Fig. 8 shows a cross section taken along line A-A in Fig. 7. Note that, although Fig. 7 shows a plurality of anisotropically conductive members 12, the number of anisotropically conductive members 12 is not particularly limited to the number shown in Fig. 7. In Figs. 7 and 8, the same components as those in the laminate 10 shown in Figs. 4 to 6 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0025] 7 and 8 differs from the laminate 10 shown in Fig. 4 in that the organic film 14 has a spacer 16 arranged on the surface that contacts the anisotropically conductive member 12, but other configurations are the same as those of the laminate 10 shown in Fig. 4. As shown in Figs. 7 and 8, the laminate 10 has a surface 14a of the organic film 14 on the lower side in the stacking direction Ds, which is a surface 14a of the organic film 14 in one direction D １Spacers 16 are disposed on both sides of the anisotropically conductive member 12 in the width direction Dw, which is perpendicular to the plane of the anisotropically conductive member 12. The spacers 16 restrict movement of the anisotropically conductive member 12 in the width direction Dw and reduce the force acting on the anisotropically conductive member 12 in the stacking direction Ds. This further reduces damage to the anisotropically conductive member 12. The spacers 16 are formed, for example, from a tape made of polytetrafluoroethylene (PTFE), polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP). The thickness of the spacers 16 in the stacking direction Ds is preferably the same as the thickness of the anisotropically conductive member 12 in the stacking direction Ds. This restricts movement of the anisotropically conductive member 12 in the stacking direction Ds, further reducing damage to the anisotropically conductive member 12 even if vibrations due to external forces are applied to the anisotropically conductive member 12 during transport, shipping, or storage.

[0026] [Fourth Example of Laminate] Fig. 9 is a schematic perspective view showing a fourth example of a laminate according to an embodiment of the present invention. In Fig. 9, the same components as those in the laminate 10 shown in Fig. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted. The laminate 11 shown in Fig. 9 has a winding core 22, and is different in that the anisotropically conductive member 12 and the organic film 14 are wound around the winding core 22 in a stacked state, but otherwise has the same configuration as the laminate 10 shown in Fig. 1.

[0027] In the laminate 11 shown in FIG. 9 , the laminated state of the anisotropically conductive member 12 and the organic film 14 is called a laminate material 17. The laminate material 17 is wound around a winding core 22 of a reel 20. The reel 20 has, for example, a cylindrical winding core 22, and flanges 24, each with a diameter larger than that of the winding core 22, at both axial ends of the winding core 22. The winding core 22 has a through-hole 23. A rotating shaft (not shown) for rotating the reel 20 is inserted into the through-hole 23. The flange 24 is, for example, made of a flat plate and has a circular outer shape. As described above, the diameter of the flange 24 is larger than that of the winding core 22. When the outer shape of the flange 24 is circular, the diameter of the flange 24 is the diameter. When the outer shape of the winding core 22 is circular, the diameter of the winding core 22 is the diameter. The laminate material 17 is wound around a winding core 22 of a reel 20 in one direction D. １ One end of the wire is connected to the winding core 22 and wound around the winding core 22 between the flanges 24 .

[0028] The material of the reel 20 is not particularly limited, and may be made of, for example, various plastics. Furthermore, the winding core 22 is not particularly limited to a cylindrical shape and may have any known winding core shape. The diameter and axial length of the winding core 22 are also not particularly limited and are determined appropriately depending on the application, etc. When the curvature of the laminated material 17 wound around the winding core 22 is X (1 / m) and the radius of curvature is R (m), it is preferable that 5≦X (1 / m) ≦ 40, i.e., 0.025 ≦ R (m) ≦ 0.2. When the winding core 22 is cylindrical, the diameter, or when it is not cylindrical, the equivalent circle diameter, is preferably set so that when the laminated material 17 is wound around the winding core 22, the curvature X (1 / m) and the radius of curvature R (m) of the laminated material 17 are set to the above-mentioned 5 ≦ X (1 / m) ≦ 40, i.e., 0.025 ≦ R (m) ≦ 0.2. Although the reel 20 has a flange 24, the present invention is not limited to this configuration and may have a configuration without the flange 24, for example. However, it is preferable that the reel 20 has the flange 24 because the flange 24 regulates the position of the organic film 14 in the width direction Dw and prevents the anisotropically conductive member 12 from falling off the organic film 14. Note that the laminate material 17 may have a configuration in which the organic film 14 is disposed on both sides of the anisotropically conductive member 12, as shown in FIG. 4. When the laminate material 17 is wound around the winding core 22, the anisotropically conductive member 12 has a laminated state as shown in FIGS. 2, 3, 5, and 6, for example.

[0029] [Fifth Example of Laminate] Figure 10 is a schematic cross-sectional view showing a fifth example of a laminate according to an embodiment of the present invention. Note that in Figure 10, components identical to those in the laminate 10 shown in Figure 1 are designated by the same reference numerals, and detailed descriptions thereof will be omitted. The laminate 11a shown in Figure 10 includes a storage container 30, an anisotropically conductive member 12, and an organic film 14. The anisotropically conductive member 12 and the organic film 14 are stacked within the storage container 30, but otherwise have the same configuration as the laminate 10 shown in Figure 1. The storage container 30 includes a container body 32 and a lid 34. The container body 32 is, for example, a cylindrical member having a bottom 32b. The container body 32 is open above the bottom 32b, forming an opening 32c. The lid 34 is a member that closes the opening 32c of the container body 32. The container body 32 and the lid 34 are, for example, cylindrical members, and the opening 32c of the container body 32 has a circular outer shape. The container 30 may be, for example, a silicon wafer case.

[0030] The anisotropically conductive members 12 and the organic films 14 are repeatedly stacked in this order from the bottom 34b side in the interior 32a of the container body 32, and the anisotropically conductive members 12 and the organic films 14 are arranged in this order. In the laminate 11a, for example, the anisotropically conductive members 12 on the lower side in the stacking direction Ds are arranged in the gaps 18 in the lateral direction Dm perpendicular to the stacking direction Ds between the anisotropically conductive members 12 on the upper side in the stacking direction Ds, so that the anisotropically conductive members 12 do not overlap in the stacking direction Ds. This reduces the force acting on the anisotropically conductive members 12 in the stacking direction Ds, and further suppresses damage to the insulating substrates and protruding portions of the anisotropically conductive members 12.

[0031] In Fig. 11, five layers of anisotropically conductive members 12 and five layers of organic films 14 are arranged, but the number of layers to be arranged is determined appropriately depending on the size of the storage container 30 or the size of the anisotropically conductive members 12, and is not particularly limited to the configuration shown in Fig. 11. By storing the anisotropically conductive members 12 in a stacked manner in the storage container 30 as shown in Fig. 11, many anisotropically conductive members 12 can be stored stably while preventing damage, and the storage container 30 can also be transported as is. Even when the storage container 30 is transported, damage to the anisotropically conductive members 12 is prevented.

[0032] Although the anisotropically conductive members 12 are stacked so as not to overlap in the stacking direction Ds, this is not limitative, and the anisotropically conductive members 12 may be stacked so as to overlap in the stacking direction Ds as shown in Fig. 2. Alternatively, organic films 14 may be disposed on the front surface 12a and the back surface 12b of the anisotropically conductive members 12, and the anisotropically conductive members 12 and the organic films 14 may be repeatedly stacked in this order inside the container body 32.

[0033] Furthermore, the above-mentioned spacer 16 (see FIG. 8 ) may be provided between adjacent anisotropically conductive members 12 in the lateral direction Dm perpendicular to the stacking direction Ds. The spacer 16 restricts movement of the anisotropically conductive members 12 in the lateral direction Dm and reduces the force acting on the anisotropically conductive members 12 in the stacking direction Ds. This further reduces damage to the anisotropically conductive members 12. In the laminate 11a, too, it is preferable that the thickness of the spacer 16 in the stacking direction Ds is the same as the thickness of the anisotropically conductive members 12 in the stacking direction Ds. This restricts movement of the anisotropically conductive members 12 in the stacking direction Ds, further reducing damage to the anisotropically conductive members 12 even if vibrations due to external forces are applied to the anisotropically conductive members 12 during transportation or storage.

[0034] [First Example of Packaging Body] Fig. 11 is a schematic diagram showing a first example of a packaging body according to an embodiment of the present invention. In Fig. 11, the same components as those of the laminate 11 shown in Fig. 9 are given the same reference numerals, and detailed description thereof will be omitted. A packaging body 36 shown in Fig. 11 has the laminate 11 and a storage bag 37 for storing the laminate 11. The laminate 11 is stored in an interior 37a of the storage bag 37. The storage bag 37 has a gas permeability of 1 x 10 -5 ~1 ml / (m 2·day·MPa). The gas permeability of the storage bag 37 is measured, for example, using JIS (Japanese Industrial Standards) K 7126-1:2006 Plastics - Films and Sheets - Gas Permeability Test Method. The storage bag 37 of the packaging body 36 prevents oxygen from entering the interior 37a, and if the conductive path of the anisotropically conductive member 12 is made of metal, prevents oxidation of the conductive path. Therefore, the anisotropically conductive member 12 can be transported and stored in a state wound on the reel 20 while preventing deterioration of performance such as conductivity during transportation and storage of the anisotropically conductive member 12.

[0035] The packaging body 36 may include an oxygen absorber 38 in the interior 37a of the storage bag 37, or may include a moisture absorber (not shown) in addition to the oxygen absorber 38. The interior 37a of the storage bag 37 may be inert gas-purged packaging, in which the atmosphere is purged with an inert gas such as argon gas or nitrogen gas, or may be vacuum-packaged. To prevent light from entering the interior 37a of the storage bag 37, the storage bag 37 preferably has light-blocking properties. In this case, the light transmittance of the storage bag 37 is preferably a maximum of 1% or less in the wavelength range of 100 to 780 nm. The light transmittance of the storage bag 37 is measured using a spectrophotometer in the wavelength range of 100 to 780 nm.

[0036] [Second Example of Package] Fig. 12 is a schematic perspective view showing a second example of a package according to an embodiment of the present invention. In Fig. 12, components identical to those of the laminate 11a shown in Fig. 10 and the package 36 shown in Fig. 11 are designated by the same reference numerals, and detailed descriptions thereof will be omitted. The package 36a shown in Fig. 12 includes the laminate 11a and a storage bag 39 for storing the laminate 11a. The laminate 11a is stored in an interior 39a of the storage bag 39. In the package 36a, the storage bag 39 prevents oxygen from entering the interior 39a, and if the conductive paths of the anisotropically conductive member 12 are made of metal, oxidation of the conductive paths is suppressed. Therefore, the anisotropically conductive member 12 can be transported and stored in a state where it is stored in the storage container 30 while suppressing deterioration of performance such as conductivity during transportation and storage of the anisotropically conductive member 12.

[0037] The packaging body 36a may include an oxygen absorber 38 in the interior 39a of the storage bag 39, or may include a moisture absorber (not shown) in addition to the oxygen absorber 38. The interior 39a of the storage bag 39 may be inert gas-purged packaging, in which the atmosphere is purged with an inert gas such as argon gas or nitrogen gas, or may be vacuum-packaged. To prevent light from entering the interior 39a of the storage bag 39, the storage bag 39 preferably has light-blocking properties. In this case, the light transmittance of the storage bag 39 is preferably a maximum of 1% or less in the wavelength range of 100 to 780 nm. The light transmittance of the storage bag 39 is measured using the same method as that for measuring the light transmittance of the storage bag 37 described above.

[0038] (Organic Film) As described above, the organic film has a gas permeability of 2.3×10 8 ~4.6 x 10 9 ml / (m 2 ·day·MPa). The organic film is preferably a porous film to facilitate the attraction of the anisotropically conductive member. The organic film also contains a polymer, which contains, for example, fluorine atoms. The organic film is made of, for example, PTFE (polyethylene terephthalate). More specifically, the Poreflon (registered trademark) Membrane FP series manufactured by Sumitomo Electric Fine Polymer Co., Ltd. can be used as the organic film. The organic film has, for example, a flexural modulus of elasticity of 100 to 10,000 (MPa) at a temperature of 25°C.

[0039] (Storage Bag) As described above, the storage bag has a gas permeability of 1×10 -5 ~1 ml / (m 2·day·MPa). For example, the storage bag may be a gas barrier bag (PTS bag (product name) and aluminum bag (product name)) used in the RP System (registered trademark) manufactured by Mitsubishi Gas Chemical Company, Inc. Furthermore, when the storage bag is to suppress the incidence of light as described above, it is preferable that the storage bag has light-blocking properties. In this case, it is preferable that the light transmittance of the storage bag is a maximum of 1% or less in the wavelength range of 100 to 780 nm. The method for measuring the light transmittance of the storage bag is as described above. The light transmittance of the storage bag is the light transmittance of the film material that forms the storage bag. For example, if the storage bag is made by sealing a resin film material, the light transmittance of the resin film material will be the light transmittance of the storage bag.

[0040] (Anisotropically Conductive Member) FIG. 13 is a schematic cross-sectional view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. FIG. 14 is a schematic plan view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. FIG. 14 is a plan view of FIG. 13 as viewed from the surface side of the anodized film, showing a state without the resin layer 54. The anisotropically conductive member 12 shown in FIG. 13 includes an electrically insulating insulating substrate 50 and a plurality of conductive paths 52 that penetrate the insulating substrate 50 in the thickness direction Dt, are electrically insulated from one another, and have protrusions protruding from at least one surface. The anisotropically conductive member 12 also includes a resin layer 54 covering at least one surface of the insulating substrate 50. The anisotropically conductive member 12 is conductive in the thickness direction Dt of the insulating substrate 50. In the laminate 10 described above (see FIG. 1), the anisotropically conductive member 12 is laminated with the organic film 14 such that the thickness direction Dt of the insulating substrate 50 is parallel to the stacking direction Ds of the laminate 10. In the anisotropically conductive member 12, the resin layer 54 is not necessarily required, and the anisotropically conductive member 12 may have a configuration without the resin layer 54.

[0041] The plurality of conductive paths 52 are provided in the insulating substrate 50 in a state where they are electrically insulated from one another. In this case, for example, the insulating substrate 50 has a plurality of pores 51 penetrating in the thickness direction Dt. The conductive paths 52 are provided in the plurality of pores 51. The conductive paths 52 protrude from the front surface 50a of the insulating substrate 50. The conductive paths 52 also protrude from the back surface 50b of the insulating substrate 50. The conductive paths 52 may protrude from one surface of the insulating substrate 50 in the thickness direction Dt. For example, a resin layer 54 is provided on the surface of the insulating substrate 50 from which the conductive paths 52 protrude. The resin layer 54 covers the protruding portions 52a of the conductive paths 52, and the protruding portions 52a are embedded in the resin layer 54. The resin layer 54 also covers the protruding portions 52b of the conductive paths 52, and the protruding portions 52b are embedded in the resin layer 54. The insulating substrate 50 is formed, for example, of an anodized film. The anodized film is formed by, for example, anodizing a valve metal. The front surface 50a and the back surface 50b of the insulating substrate 50 are surfaces that face each other in the thickness direction Dt of the insulating substrate 50.

[0042] The anisotropically conductive member 12 has anisotropic conductivity and is conductive in the thickness direction Dt as described above, but has sufficiently low conductivity in a direction parallel to the surface 50a of the insulating substrate 50. As shown in FIG. 14 , the anisotropically conductive member 12 has, for example, a rectangular outer shape. The outer shape and size of the anisotropically conductive member 12 are determined appropriately depending on the application, etc. For example, the anisotropically conductive member 12 is bonded without a resin layer 54, or with the resin layer 54 present but with nothing on the surface 54a.

[0043] The structure of the anisotropically conductive member will be described in more detail below. The anisotropically conductive member has the same structure as that described in, for example, WO 2022 / 163260, and can be manufactured in the same manner as the above-mentioned structure.

[0044] <Insulating Substrate> The insulating substrate 50 electrically insulates the plurality of conductive paths 52, which are made of a conductor, from one another. As described above, the insulating substrate 50 has electrical insulation properties. The insulating substrate 50 also has a plurality of pores 51 in which the conductive paths 52 are formed. The composition of the insulating substrate 50 will be described later. The length of the insulating substrate 50 in the thickness direction Dt, i.e., the thickness ht of the insulating substrate 50, is preferably within the range of 1 to 1000 μm, more preferably within the range of 5 to 500 μm, and even more preferably within the range of 10 to 300 μm. When the thickness ht of the insulating substrate 50 is within this range, the insulating substrate 50 is easy to handle. From the viewpoint of ease of winding, the thickness ht of the insulating substrate 50 is preferably 30 μm or less, more preferably 5 to 20 μm.

[0045] The thickness of the insulating substrate can be measured by cutting the insulating substrate in the thickness direction Dt using a focused ion beam (FIB) and capturing an image of the cross section at a magnification of 50,000 times using a field emission scanning electron microscope (FE-SEM). In the captured image, the length of 10 locations corresponding to the thickness of the insulating substrate is measured, and the average length of the 10 measured locations is calculated. This average value is the thickness of the insulating substrate.

[0046] <Average Diameter of Pores> The average diameter of the pores 51 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, even more preferably 40 to 200 nm, and most preferably 50 to 100 nm. When the average diameter d of the pores 51 is 1 μm or less and within the above-mentioned range, conductive paths 52 having the above-mentioned average diameter can be obtained. The average diameter of the pores 51 can be measured by photographing the surface of the insulating substrate 50 from directly above at a magnification of 100 to 10,000 times using a scanning electron microscope (SEM). At least 20 pores with a circular periphery are extracted from the captured image, and their diameters are measured to determine the opening diameter. The average of these opening diameters is calculated as the average diameter of the pores. The magnification can be appropriately selected within the above-mentioned range so as to obtain an image in which 20 or more pores can be extracted. The opening diameter is measured by measuring the maximum distance between the ends of the pore portions. In other words, since the shape of the opening of the pore is not limited to a substantially circular shape, when the opening shape is non-circular, the maximum value of the distance between the ends of the pore portion is taken as the opening diameter. Therefore, even when a pore has a shape in which two or more pores are integrated, this is considered to be a single pore, and the maximum value of the distance between the ends of the pore portion is taken as the opening diameter.

[0047] <Conductive Path> As described above, the multiple conductive paths 52 are provided in the insulating substrate 50, e.g., an anodized film, while being electrically insulated from one another. The multiple conductive paths 52 are electrically conductive. The conductive paths are made of a conductive material. The conductive material is not particularly limited, and examples thereof include metals. Specific examples of metals include gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), zinc (Zn), and cobalt (Co). From the viewpoint of electrical conductivity, copper, gold, aluminum, nickel, and cobalt are preferred, copper and gold are more preferred, and copper is most preferred. Metals have superior ductility and other properties compared to oxide conductors, making them more easily deformable, even when compressed during bonding. Therefore, the conductive paths are preferably made of metal. The height of the conductive paths 52 in the thickness direction Dt is preferably 10 to 300 μm, and more preferably 20 to 30 μm.

[0048] <<Shape of Conductive Paths>> The average diameter d of the conductive paths 52 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, still more preferably 40 to 200 nm, and most preferably 50 to 100 nm. The density of the conductive paths 52 is 20,000 pieces / mm 2 It is preferable that the density is 2 million / mm or more. 2 More preferably, it is 10 million particles / mm or more. 2 More preferably, it is 50 million particles / mm or more. 2 It is particularly preferable that the number of particles is 100 million / mm or more. 2 Furthermore, the center-to-center distance p between adjacent conductive paths 52 is preferably 20 nm to 500 nm, more preferably 40 nm to 200 nm, and even more preferably 50 nm to 140 nm.

[0049] The average diameter of the conductive paths is determined by photographing the surface of the insulating substrate from directly above at a magnification of 100 to 10,000 times using a scanning electron microscope. At least 20 conductive paths with a circular periphery are extracted from the image, and their diameters are measured to determine the opening diameter. The average of these opening diameters is then calculated as the average diameter of the conductive paths. The magnification can be appropriately selected within the above-mentioned range so as to obtain an image that can extract at least 20 conductive paths. Furthermore, when the opening shape is non-circular, the maximum distance between the ends of the conductive path portion is taken as the opening diameter. Therefore, for example, even when two or more conductive paths are integrated, this is considered as a single conductive path, and the maximum distance between the ends of the conductive path portion is taken as the opening diameter. The average diameter d of the conductive paths 52 is the same as the average diameter of the protrusions. The center-to-center distance p of adjacent conductive paths 52 is determined by further identifying the center positions (not shown) of the identified conductive paths in the image of the insulating substrate 50 obtained as described above. The distance between the centers of adjacent conductive paths was determined at 10 locations. This average value was set as the center-to-center distance p between adjacent conductive paths 52. The center position is the center position of the region in the captured image that corresponds to conductive path 52. Note that a known image analysis method is used to calculate the center position of the region in the captured image.

[0050] <<Protrusions>> The protrusions are part of the conductive paths and are columnar. The protrusions are preferably cylindrical because this increases the contact area with the object to be joined. The average protrusion length ha of the protrusions 52a and the average length hb of the protrusions 52b are preferably 10 nm to 1000 nm, more preferably 50 nm to 500 nm. When the average protrusion length ha and the average length hb are 10 nm to 1000 nm, the adhesion between the resin layer 54 and the insulating substrate 50 is improved. The average protrusion length ha of the protrusions 52a and the average length hb of the protrusions 52b are calculated by obtaining cross-sectional images of the protrusions using a scanning electron microscope as described above, and measuring the heights of the protrusions at 10 points on the cross-sectional images.

[0051] The distance between adjacent protrusions of the conductive paths 52 is preferably 20 nm to 200 nm, and more preferably 40 nm to 100 nm. When the distance between adjacent protrusions is within the above range, the distance between the conductive paths 52 can be maintained on the front surface 50a or the back surface 50b of the insulating substrate 50 of the conductive paths 52. This prevents short circuits in the conductive paths 52 when they are bonded to a connection target such as a semiconductor device, further increasing reliability during bonding.

[0052] <<Resin Layer>> As described above, the resin layer covers at least one of the front and back surfaces of the insulating substrate and protects the insulating substrate and the conductive paths. For example, if the conductive paths have protrusions, the resin layer buries the protrusions. That is, the resin layer covers the ends of the conductive paths protruding from the insulating substrate and protects the protrusions. To achieve the above-described functions, the resin layer preferably exhibits fluidity in a temperature range of 50°C to 200°C and hardens at 200°C or higher. The resin layer is a thermoplastic layer made of, for example, a thermoplastic resin, which will be described in detail later. The average thickness hm of the resin layer 54 is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 1 μm or less. When the average thickness hm of the resin layer 54 is 10 μm or less, it can fully protect the protrusions of the conductive paths 52 and fill the periphery of the electrodes when bonding to a connection target such as a semiconductor device. The average thickness hm of the resin layer 54 is the average distance from the surface 50a of the insulating substrate 50 or the average distance from the back surface 50b of the insulating substrate 50. The average thickness hm of the resin layer 54 is determined by cutting the resin layer in the thickness direction Dt of the anisotropically conductive member 12 and obtaining a photographic image of the cross section using a scanning electron microscope. In the photographic image, the distance from the surface 50a of the insulating substrate 50 corresponding to the resin layer is measured at 10 locations, and the average length of the 10 measured locations is calculated. This average value is defined as the average thickness hm of the resin layer 54 on the back surface 50b of the insulating substrate 50. Furthermore, the distance from the back surface 50b of the insulating substrate 50 is measured at 10 locations. The average length of the 10 measured locations is calculated. This average value is defined as the average thickness hm of the resin layer 54 on the back surface 50b of the insulating substrate 50.

[0053] The resin layer may have the following composition. The composition of the resin layer will be described below. For example, the resin layer contains a polymer material and may also contain an antioxidant material. Specific examples of the resin material constituting the resin layer include thermoplastic resins such as ethylene copolymers, polyamide resins, polyester resins, polyurethane resins, polyolefin resins, acrylic resins, acrylonitrile resins, and cellulose resins. Polyacrylonitrile can also be used as the resin material constituting the resin layer 54. In addition to the above-mentioned resin layers, for example, a resin layer containing a main composition including an acrylic polymer, an acrylic monomer, and a maleimide compound, as described in International Publication No. 2022 / 163260, can be used.

[0054] The present invention is basically configured as described above. Although the laminate and package of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements and modifications may be made without departing from the spirit and scope of the present invention.

[0055] 10, 11, 11a Laminate 12 Anisotropically conductive member 12a, 14a, 50a, 54a Surface 12b, 14b, 50b Back surface 13 Region 14 Organic film 16 Spacer 17 Laminated material 18 Space 19 Head 20 Reel 22 Winding core 23 Through hole 24 Flange 30 Storage container 32 Container body 32a, 37a, 39a Interior 32b Bottom 32c Opening 34 Lid 34b Bottom 36 Package 36a Package 37, 39 Storage bag 38 Oxygen absorber 50 Insulating substrate 51 Pore 52 Conductive path 52a, 52b Protrusion 54 Resin layer D １ One direction Dm Transverse direction Ds Stacking direction Dt Thickness direction Dw Width direction d Average diameter hm Average thickness ht Thickness p Center distance

Claims

1. An anisotropically conductive member having an insulating base material having electrical insulation properties, and a plurality of conductive paths penetrating the insulating base material in the thickness direction and having protrusions protruding from at least one surface of the insulating base material; and an organic film disposed on at least one of two surfaces of the anisotropically conductive member that face each other in the thickness direction of the insulating base material, wherein the organic film has a gas permeability of 2.3 x 10 8 ~4.6 x 10 9 ml / (m 2 · day · MPa).

2. The laminate according to claim 1, wherein the organic film is disposed on the two surfaces of the insulating substrate that face each other in the thickness direction.

3. The laminate according to claim 2, wherein the organic film has a spacer disposed on the surface that contacts the anisotropically conductive member.

4. The laminate according to claim 1, which has a winding core, and the anisotropically conductive member and the organic film are wound in a layered state around the winding core.

5. The laminate according to claim 4, wherein the core is cylindrical and has flanges at both axial ends of the core, each flange having a diameter greater than the diameter of the core.

6. The laminate according to claim 1, wherein the organic film is a porous film.

7. The laminate according to claim 1, wherein a plurality of the anisotropically conductive members are arranged in one direction on at least one surface of the organic film.

8. The laminate according to claim 1, wherein the anisotropically conductive members are disposed on two opposing surfaces of the organic film in the thickness direction.

9. A device comprising the laminate according to any one of claims 1 to 8 and a storage bag for storing the laminate, wherein the storage bag has a gas permeability of 1 x 10 -5 ~1 ml / (m 2 .day.MPa).

10. The package according to claim 9, wherein the storage bag has a light transmittance of up to 1% in the wavelength range of 100 to 780 nm.

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