Electronic component

Abstract

This electronic component includes: a first conductor layer having a first line and a second line including a first pattern electromagnetically coupled to the first line; and a second conductor layer disposed in a layer different from the first conductor layer in the stacking direction. The second conductor layer has a ground pattern that, in a plan view in the stacking direction, overlaps at least a part of the second line and does not overlap the first line.

Description

Electronic Components

[0001] The present disclosure relates to electronic components.

[0002] Patent Document 1 discloses a laminated directional coupler with a stripline structure having two coupling lines that face each other in the lamination direction with a dielectric layer interposed between them, in which both coupling lines have a combination of a first spiral pattern that is wound in one direction and a second spiral pattern that continues from the center of the spiral and winds out in the opposite direction to the first spiral pattern and runs parallel to it.

[0003] Japanese Patent Application Laid-Open No. 2004-96347

[0004] In this disclosure, electronic components are described that provide good performance.

[0005] An electronic component according to one aspect of the present disclosure includes a first conductor layer having a first line and a second line including a first pattern that is electromagnetically coupled to the first line, and a second conductor layer that is arranged in a layer different from the first conductor layer in a stacking direction, and the second conductor layer has a ground pattern that overlaps with at least a portion of the second line but does not overlap with the first line in a planar view in the stacking direction.

[0006] According to each aspect and embodiment of the present disclosure, good characteristics can be obtained.

[0007] FIG. 1 is a perspective view of an electronic component according to one embodiment. FIG. 2 is a plan view of the electronic component shown in FIG. 1. FIG. 3 is a view showing a cross section taken along line III-III in FIG. 2. FIG. 4 is a view showing a conductor pattern provided in the electronic component shown in FIG. 1. FIG. 5 is a plan view showing a first conductor layer. FIG. 6 is a view showing the configuration of the electronic component. FIG. 7 is a perspective view of an electronic component according to another embodiment. FIG. 8 is a perspective view of an electronic component according to another embodiment. FIG. 9 is a perspective view of an electronic component according to another embodiment. FIG. 10 is a perspective view of an electronic component according to another embodiment. FIG. 11 is a perspective view of an electronic component according to another embodiment. FIG. 12 is a perspective view of an electronic component according to another embodiment.

[0008] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and redundant description will be omitted.

[0009] [1] Overview of the embodiment (1) An electronic component according to one aspect of the present disclosure includes a first conductor layer having a first line and a second line including a first pattern that is electromagnetically coupled to the first line, and a second conductor layer that is arranged in a layer different from the first conductor layer in the stacking direction, and the second conductor layer has a ground pattern that overlaps with at least a portion of the second line but does not overlap with the first line in a planar view in the stacking direction.

[0010] In an electronic component according to one aspect of the present disclosure, the ground pattern overlaps at least a portion of the second line in a plan view in the stacking direction. This improves isolation between the first line (main line) and the second line (sub-line) in the electronic component. In the electronic component, the ground pattern does not overlap the first line in a plan view in the stacking direction. This prevents coupling between the first line and the ground pattern in the electronic component, thereby reducing loss in the first line. Therefore, the electronic component achieves favorable characteristics.

[0011] (2) The electronic component according to (1), wherein the first conductor layer has a resistive element electrically connected to one end of the second line, and the ground pattern does not overlap with the resistive element in a plan view in the stacking direction. With this configuration, good characteristics can be obtained.

[0012] (3) The electronic component according to (1) or (2), wherein the second line includes a second pattern formed continuously with the first pattern and including one or more bends. With this configuration, the impedance can be adjusted by the second pattern. Furthermore, in the electronic component, the second pattern includes one or more bends, which allows the second pattern to be made compact while ensuring its length. This allows for space-saving arrangement of the second line in the electronic component, thereby enabling the electronic component to be made smaller.

[0013] (4) The electronic component according to (3), wherein the pattern length of the second pattern is equal to or greater than the pattern length of the first pattern. In this configuration, the second pattern can adjust impedance.

[0014] (5) The electronic component according to (3) or (4), wherein the second pattern includes a plurality of bent portions. In this configuration, the second pattern can be formed, for example, in a meandering shape. This allows the pattern length of the second pattern to be equal to or longer than the pattern length of the first pattern, while further reducing the size of the second pattern.

[0015] (6) The electronic component according to any one of (3) to (5), wherein the second pattern includes at least a pattern portion extending parallel to the first pattern in a plan view in the stacking direction, and the pattern length of the pattern portion is shorter than the pattern length of the first pattern. In this configuration, the first pattern and the pattern portion are parallel to each other, so the second pattern can be configured in a meandering shape. As a result, the second pattern in the electronic component can be made more compact.

[0016] (7) The electronic component according to (6), wherein the first distance between the first line and the first pattern is shorter than the second distance between the first pattern and the patterned portion. In this configuration, the strength of the magnetic coupling between the first line and the first pattern can be ensured by making the first distance between the first line and the first pattern shorter than the second distance. Furthermore, in the electronic component, the second distance is longer than the first distance. In the electronic component, shortening the second distance may cause the first pattern and the patterned portion (second pattern) to behave as if they are electrically integrated, even when they are physically separated. The impedance of the second line is adjusted by the length of the second pattern. However, if the first pattern and the patterned portion behave as if they are electrically integrated, the length of the second pattern may not contribute to impedance adjustment. Therefore, in the electronic component, the second distance is longer than the first distance, allowing the impedance to be adjusted by the second pattern.

[0017] (8) The electronic component according to any one of (1) to (6), wherein the ground pattern overlaps with all of the first pattern and the second pattern in a plan view in the stacking direction. This configuration further improves isolation between the first line and the first pattern of the second line.

[0018] (9) The electronic component according to any one of (1) to (8), wherein the ground pattern has a shape that conforms to the shapes of the first pattern and the second pattern in a plan view in the stacking direction. This configuration further improves isolation between the first line and the first pattern of the second line.

[0019] (10) The electronic component according to any one of (1) to (9), wherein the second conductor layer is disposed adjacent to the first conductor layer. This configuration further improves isolation between the first line and the first pattern of the second line.

[0020] [2] Exemplary embodiments Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and duplicated descriptions will be omitted.

[0021] FIG. 1 is a perspective view of an electronic component according to one embodiment. FIG. 2 is a plan view of the electronic component shown in FIG. 1. FIG. 3 is a cross-sectional view taken along line III-III in FIG. 2. The electronic component 1 shown in FIGS. 1 to 3 is a directional coupler. As shown in FIGS. 1 to 3, the electronic component 1 includes a substrate 2, an insulator 3, a first terminal electrode 4, a second terminal electrode 5, a third terminal electrode 6, and a fourth terminal electrode 7. The substrate 2 and the insulator 3 are not shown in FIG. 1. In FIG. 2, the substrate 2 and the insulator 3 are indicated by dashed double-dashed lines.

[0022] The substrate 2 has, for example, a rectangular parallelepiped shape. The rectangular parallelepiped shape may include a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. As shown in Figures 1, 3, and 4, the substrate 2 has, as its outer surfaces, a pair of opposing end faces 2a, 2b, a pair of opposing main faces 2c, 2d, and a pair of opposing side faces 2e, 2f.

[0023] The facing direction in which the pair of end faces 2a, 2b face each other is the first direction D1. The facing direction in which the pair of main faces 2c, 2d face each other is the second direction D2. The facing direction in which the pair of side faces 2e, 2f face each other is the third direction D3. In this embodiment, the first direction D1 is the longitudinal direction of the substrate 2. The second direction D2 is the height direction of the substrate 2 and is perpendicular to the first direction D1. The third direction D3 is the width direction of the substrate 2 and is perpendicular to the first direction D1 and the second direction D2. Viewing from the second direction D2 corresponds to a planar view.

[0024] The pair of end faces 2a, 2b extend in the second direction D2 to connect the pair of main faces 2c, 2d. The pair of end faces 2a, 2b also extend in the third direction D3. The pair of side faces 2e, 2f extend in the second direction D2 to connect the pair of main faces 2c, 2d. The pair of side faces 2e, 2f also extend in the first direction D1.

[0025] The substrate 2 can be made of a material that is chemically and thermally stable, generates little stress, and can maintain a smooth surface. Examples of such materials include, but are not limited to, silicon single crystal, alumina, sapphire, aluminum nitride, MgO single crystal, and SrTiO ３ Single crystal, surface-oxidized silicon, glass, quartz, ferrite, etc. can be used.

[0026] The insulator 3 has a rectangular parallelepiped shape. The insulator 3 has, as its outer surfaces, a pair of end faces 3a, 3b facing each other, a pair of main faces 3c, 3d facing each other, and a pair of side faces 3e, 3f facing each other. The pair of end faces 3a, 3b face each other in a first direction D1. The pair of main faces 3c, 3d face each other in a second direction D2. The pair of side faces 3e, 3f face each other in a third direction D3.

[0027] The pair of end faces 3a, 3b extend in the second direction D2 to connect the pair of principal faces 3c, 3d. The pair of end faces 3a, 3b also extend in the third direction D3. The pair of side faces 3e, 3f extend in the second direction D2 to connect the pair of principal faces 3c, 3d. The pair of side faces 3e, 3f also extend in the first direction D1. In this embodiment, the dimension of the insulator 3 in the first direction D1 is smaller than the dimension of the substrate 2 in the first direction D1. The dimension of the insulator 3 in the third direction D3 is smaller than the dimension of the substrate 2 in the third direction D3. Note that the dimension of the insulator 3 in the first direction D1 may be equal to the dimension of the substrate 2 in the first direction D1, or the dimension of the insulator 3 in the third direction D3 may be equal to the dimension of the substrate 2 in the third direction D3.

[0028] In this embodiment, "equivalent" does not only mean equal, but also may mean values ​​that include slight differences or manufacturing errors within a preset range. For example, if multiple values ​​are within a range of ±5% of the average value of the multiple values, the multiple values ​​are defined as equivalent.

[0029] The insulator 3 is configured by stacking multiple insulator layers. The insulator layers may be configured of an organic insulating material such as polyimide. The insulator layers are stacked in the second direction D2. That is, the second direction D2 is the stacking direction. In an actual insulator 3, the multiple insulator layers are integrated to the extent that the boundaries between the layers are not visible.

[0030] The substrate 2 and the insulator 3 are integrally formed. The substrate 2 and the insulator 3 are disposed such that the main surface 2c and the main surface 2d face each other. A planarizing layer 8 is disposed between the substrate 2 and the insulator 3. The planarizing layer 8 is disposed between the main surface 2c of the substrate 2 and the main surface 3d of the insulator 3. The planarizing layer 8 may be made of silicon nitride, alumina, silicon oxide, or the like.

[0031] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 are disposed on the main surface 3c of the insulator 3. The first terminal electrode 4 may be a signal input terminal. The second terminal electrode 5 may be a signal output terminal. The third terminal electrode 6 may be a coupling terminal. The fourth terminal electrode 7 may be a ground terminal.

[0032] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 have a substantially rectangular shape in a plan view. The rectangular shape may include a shape in which the corners and ridges are chamfered, and a shape in which the corners and ridges are rounded. In this embodiment, the first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 have a rectangular shape with one rounded corner in a plan view. The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6, and the fourth terminal electrode 7 are each disposed at a corner of the insulator 3.

[0033] The first terminal electrode 4 is disposed near the end face 3 a and the side face 3 e. The second terminal electrode 5 is disposed near the end face 3 b and the side face 3 e. The third terminal electrode 6 is disposed near the end face 3 a and the side face 3 f. The fourth terminal electrode 7 is disposed near the end face 3 b and the side face 3 f.

[0034] The first terminal electrode 4 and the second terminal electrode 5 are arranged at an interval in the first direction D1. The third terminal electrode 6 and the fourth terminal electrode 7 are arranged at an interval in the first direction D1. The first terminal electrode 4 and the third terminal electrode 6 are arranged at an interval in the third direction D3. The second terminal electrode 5 and the fourth terminal electrode 7 are arranged at an interval in the third direction D3. The interval (distance) between the electrodes may be set appropriately depending on the specifications required for the electronic component 1, etc.

[0035] The first terminal electrode 4, the second terminal electrode 5, the third terminal electrode 6 and the fourth terminal electrode 7 can be formed of an appropriate conductor (for example, gold, nickel, copper, silver, etc.).

[0036] Fig. 4 is a diagram showing the conductor pattern provided in the electronic component 1 shown in Fig. 1. In the electronic component 1, layers are arranged in the order shown as layer D, layer C, layer B, and layer A in Fig. 4 from the substrate 2 side (the side of the main surface 3d of the insulator 3). As shown in Fig. 4, the electronic component 1 includes a first conductor layer 10, a second conductor layer 11, a third conductor layer 12, and a terminal layer 13. The first conductor layer 10, the second conductor layer 11, the third conductor layer 12, and the terminal layer 13 are arranged on different layers in the second direction D2.

[0037] 4, the first conductor layer 10 has a first line 15, a second line 16, a third conductor pattern 17, and a resistive film (resistive element) 18. The first line 15, the second line 16, and the third conductor pattern 17 can be formed of an appropriate conductor (such as copper).

[0038] In a plan view in the second direction D2, the first line 15 is disposed closer to the side surface 2e of the insulator 3. The first line 15 includes a first pattern portion 15A, a second pattern portion 15B, and a third pattern portion 15C. The first pattern portion 15A, the second pattern portion 15B, and the third pattern portion 15C are electrically connected to each other and may be integrally formed.

[0039] First pattern portion 15A extends linearly along first direction D1. First pattern portion 15A is disposed between second pattern portion 15B and third pattern portion 15C. Second pattern portion 15B is disposed at a position closer to end face 3a and side face 3e. Second pattern portion 15B is connected to one end portion (end portion on the end face 3a side) of first pattern portion 15A in the extension direction. Third pattern portion 15C is disposed at a position closer to end face 3b and side face 3e. Third pattern portion 15C is connected to the other end portion (end portion on the end face 3b side) of first pattern portion 15A in the extension direction. First pattern portion 15A connects second pattern portion 15B and third pattern portion 15C.

[0040] The second line 16 includes a first pattern portion (first pattern) 16A, a second pattern portion (second pattern) 16B, a third pattern portion (second pattern) 16C, a fourth pattern portion 16D, a fifth pattern portion 16E, a first connecting portion (bent portion) 16F, a second connecting portion (bent portion) 16G, and a third connecting portion 16H. The first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the fourth pattern portion 16D, the fifth pattern portion 16E, the first connecting portion 16F, the second connecting portion 16G, and the third connecting portion 16H are electrically connected to each other and may be formed integrally.

[0041] The first pattern portion 16A extends linearly along the first direction D1. The first pattern portion 16A is parallel to the first pattern portion 15A of the first line 15. The second pattern portion 16B extends linearly along the first direction D1. The second pattern portion 16B is parallel to the first pattern portion 16A. The third pattern portion 16C extends linearly along the first direction D1. The third pattern portion 16C is parallel to the second pattern portion 16B. That is, the first pattern portion 16A, the second pattern portion 16B, and the third pattern portion 16C are parallel to one another.

[0042] The pattern length (length in first direction D1) of first pattern portion 16A is longer than the pattern lengths (length in first direction D1) of second pattern portion 16B and third pattern portion 16C. In other words, the pattern lengths of second pattern portion 16B and third pattern portion 16C are shorter than the pattern length of first pattern portion 16A.

[0043] One end of first pattern portion 16A (the end on the end face 3a side) and one end of second pattern portion 16B are connected (coupled) by first connecting portion 16F. The other end of second pattern portion 16B (the end on the end face 3b side) and the other end of third pattern portion 16C are connected by second connecting portion 16G. First pattern portion 16A, second pattern portion 16B, third pattern portion 16C, first connecting portion 16F, and second connecting portion 16G have a serpentine shape.

[0044] First connecting portion 16F and second connecting portion 16G constitute folded portions in the serpentine shape formed by first pattern portion 16A, second pattern portion 16B, third pattern portion 16C, first connecting portion 16F, and second connecting portion 16G. First connecting portion 16F bends second pattern portion 16B 180 degrees relative to first pattern portion 16A. Second connecting portion 16G bends third pattern portion 16C 180 degrees relative to second pattern portion 16B.

[0045] The fourth pattern portion 16D constitutes an end portion of the second line 16. The fourth pattern portion 16D is disposed at a position closer to the end face 3a and the side face 3f. The fourth pattern portion 16D is connected to one end portion (the end portion on the end face 3a side) of the third pattern portion 16C. The fourth pattern portion 16D is connected to one end portion of the third pattern portion 16C by a third connection portion 16H.

[0046] Fifth pattern portion 16E constitutes an end portion of second line 16. Fifth pattern portion 16E is connected to one end portion (end portion on the end surface 3b side) of first pattern portion 16A.

[0047] The third conductor pattern 17 is disposed at a position closer to the end face 3b and closer to the side face 3f. The third conductor pattern 17 has, for example, a substantially L-shape in plan view.

[0048] The resistive film 18 is disposed across the second line 16 and the third conductor pattern 17. The resistive film 18 electrically connects the fifth pattern portion 16E of the second line 16 and the third conductor pattern 17. The resistive film 18 has, for example, a rectangular shape. The resistive film 18 can be formed of an appropriate conductor (for example, nickel, chromium, aluminum, etc.).

[0049] 5 is a plan view showing the first conductor layer 10. As shown in FIG. 5, the pattern length (path length) L1 of the first pattern portion 15A of the first line 15 of the first conductor layer 10 is shorter than the pattern length (path length) L2 of the second line 16. The pattern length L2 of the second line 16 includes the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, the second connecting portion 16G, and the third connecting portion 16H. The pattern length L2 of the second line 16 is preferably two to five times the pattern length L1 of the first pattern portion 15A of the first line 15.

[0050] A distance (first distance) T1 between the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 is shorter than a distance (second distance) T2 between the first pattern portion 16A and the second pattern portion 16B of the second line 16 (T1<T2). In other words, the distance T2 between the first pattern portion 16A and the second pattern portion 16B is longer than the distance T1 between the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 (T2>T1).

[0051] A distance T1 between the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 is shorter than a distance T3 between the second pattern portion 16B and the third pattern portion 16C of the second line 16 (T1 < T3). In this embodiment, a distance T2 between the first pattern portion 16A and the second pattern portion 16B of the second line 16 is equal to a distance T3 between the second pattern portion 16B and the third pattern portion 16C of the second line 16 (T2 = T3).

[0052] 4, the second conductor layer 11 has a first conductor pattern 19, a second conductor pattern 20, a third conductor pattern 21, and a fourth conductor pattern 22. The first conductor pattern 19, the second conductor pattern 20, the third conductor pattern 21, and the fourth conductor pattern 22 can be formed of an appropriate conductor (such as copper, for example).

[0053] The first conductor pattern 19 is arranged closer to the end face 3 a and closer to the side face 3 e. The first conductor pattern 19 is electrically connected to the second pattern portion 15B of the first line 15 of the first conductor layer 10. The second conductor pattern 20 is arranged closer to the end face 3 b and closer to the side face 3 e. The second conductor pattern 20 is electrically connected to the third pattern portion 15C of the first line 15 of the first conductor layer 10. The third conductor pattern 21 is arranged closer to the end face 3 a and closer to the side face 3 f. The third conductor pattern 21 is electrically connected to the fourth pattern portion 16D of the second line 16 of the first conductor layer 10.

[0054] The fourth conductor pattern 22 has a connection pattern portion 22A and a ground pattern portion (ground pattern) 22B. The connection pattern portion 22A and the ground pattern portion 22B are electrically connected and may be integrally formed. The connection pattern portion 22A is located closer to the end face 3b and the side face 3e. The connection pattern portion 22A is electrically connected to the third conductor pattern 17 of the first conductor layer 10.

[0055] The ground pattern portion 22B has a substantially rectangular shape and is disposed between the first conductor pattern 19 and the third conductor pattern 21 in the third direction D3. The ground pattern portion 22B is disposed between the second conductor pattern 20 and the connection pattern portion 22A of the fourth conductor pattern 22 in the third direction D3.

[0056] The ground pattern portion 22B is not disposed between the first conductor pattern 19 and the second conductor pattern 20. That is, the ground pattern portion 22B is not disposed in a position overlapping with the first pattern portion 15A of the first line 15 in plan view in the second direction D2. The ground pattern portion 22B is disposed so as not to be located in a part of the region between the second conductor pattern 20 and the connection pattern portion 22A in the third direction D3. That is, the ground pattern portion 22B is not disposed in a position overlapping with the resistive film 18 in plan view in the second direction D2.

[0057] 4, the third conductor layer 12 has a first conductor pattern 23, a second conductor pattern 24, a third conductor pattern 25, and a fourth conductor pattern 26. The first conductor pattern 23, the second conductor pattern 24, the third conductor pattern 25, and the fourth conductor pattern 26 can be formed of an appropriate conductor (such as copper, for example).

[0058] The first conductor pattern 23 is disposed closer to the end face 3 a and the side face 3 e. The first conductor pattern 23 electrically connects the second conductor pattern 20 of the second conductor layer 11 to the first terminal electrode 4. The second conductor pattern 24 is disposed closer to the end face 3 b and the side face 3 e. The second conductor pattern 24 electrically connects the second conductor pattern 20 of the second conductor layer 11 to the second terminal electrode 5.

[0059] The third conductor pattern 25 is disposed closer to the end face 3 a and the side face 3 f. The third conductor pattern 25 electrically connects the third conductor pattern 21 of the second conductor layer 11 to the third terminal electrode 6. The fourth conductor pattern 26 is disposed closer to the end face 3 b and the side face 3 e. The fourth conductor pattern 26 electrically connects the first conductor pattern 19 (connection pattern portion 22A) of the second conductor layer 11 to the fourth terminal electrode 7.

[0060] As shown in layer D of FIG. 4, the terminal layer 13 has a first terminal electrode 4 , a second terminal electrode 5 , a third terminal electrode 6 , and a fourth terminal electrode 7 .

[0061] 2 , in the electronic component 1, the ground pattern portion 22B is arranged in a position overlapping with the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16 on the first conductor layer 10 in a plan view in the second direction D2. The ground pattern portion 22B is arranged in a position not overlapping with the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16 on the first conductor layer 10 in a plan view in the second direction D2. The ground pattern portion 22B is arranged in a position not overlapping with the first line 15 and the resistive film 18 on the first conductor layer 10 in a plan view in the second direction D2.

[0062] In the electronic component 1, the first pattern portion 15A of the first line 15 constitutes a main line. The first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16 constitute a secondary line (coupling line). In the electronic component 1, the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 are magnetically coupled.

[0063] Fig. 6 is a diagram showing the configuration of the electronic component 1. As shown in Fig. 6, the electronic component 1 includes an input port P1, an output port P2, a coupling port P3, a ground (isolation) port P4, a coupler CP, and a resistor R.

[0064] The input port P1 is formed by a first terminal electrode 4. The output port P2 is formed by a second terminal electrode 5. The coupling port P3 is formed by a third terminal electrode 6. The ground port P4 is formed by a fourth terminal electrode 7. The coupler CP is formed by a first line 15 and a second line 16. The resistor R is formed by a resistive film 18.

[0065] As described above, in the electronic component 1 according to this embodiment, the ground pattern portion 22B overlaps with at least a portion of the second line 16 in a plan view in the second direction D2. This improves isolation between the first line 15 (main line) and the first pattern (sub-line) of the second line 16 in the electronic component 1. In the electronic component 1, the ground pattern portion 22B does not overlap with the first line 15 in a plan view in the second direction D2. This prevents coupling between the first line 15 and the ground pattern portion 22B in the electronic component 1, thereby reducing loss in the first line 15. Therefore, the electronic component 1 achieves favorable characteristics.

[0066] In the electronic component 1 according to this embodiment, the first conductor layer 10 has a resistive film 18 electrically connected to one end of the second line 16. The ground pattern portion 22B does not overlap with the resistive film 18 in a plan view in the second direction D2. This configuration provides good characteristics.

[0067] In electronic component 1 according to this embodiment, second line 16 has a serpentine shape, with first pattern portion 16A and second pattern portion 16B connected by first connecting portion 16F and second pattern portion 16B and third pattern portion 16C connected by second connecting portion 16G. This allows electronic component 1 to make second line 16 more compact while still maintaining the pattern length of second line 16. This allows electronic component 1 to save space in terms of the arrangement of second line 16, thereby enabling electronic component 1 to be made smaller.

[0068] In the electronic component 1 according to this embodiment, the distance T1 between the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 is shorter than the distance T2 between the first pattern portion 16A and the second pattern portion 16B of the second line 16 (T1<T2). In this configuration, by making the distance T1 shorter than the distance T2, the strength of the magnetic coupling between the first pattern portion 15A of the first line 15 and the first pattern portion 16A of the second line 16 can be ensured.

[0069] In the electronic component 1, the distance T2 is longer than the distance T1. In the electronic component 1, if the distance T2 is shortened, the first pattern portion 16A and the second pattern portion 16B may behave as if they are electrically integrated, even if they are physically separated. The impedance of the second line 16 is adjusted by the length of the second pattern portion 16B. However, if the first pattern portion 16A and the second pattern portion 16B behave as if they are electrically integrated, the length of the first pattern portion 16A may not contribute to adjusting the impedance. Therefore, in the electronic component 1, the distance T2 is made longer than the distance T1, so that the impedance can be adjusted by the second pattern portion 16B.

[0070] In the electronic component 1 according to this embodiment, the ground pattern portion 22B overlaps with all of the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G in a plan view in the second direction D2. That is, the ground pattern portion 22B is disposed in the second direction D2 so as to face all of the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G in a plan view in the second direction D2. This configuration improves isolation between the first line 15 and the second line 16.

[0071] Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications are possible without departing from the spirit of the present invention.

[0072] In the above embodiment, the configuration of the second line 16 is not limited to the configuration shown in Fig. 1. Fig. 7 is a perspective view of an electronic component according to another embodiment. Fig. 8 is a perspective view of an electronic component according to another embodiment. As shown in Figs. 7 and 8, the second pattern portion 16B and the third pattern portion 16C of the second line 16 may have shorter pattern lengths in the first direction D1 than the configuration shown in Fig. 1.

[0073] In the above embodiment, the second line 16 has a first connection portion 16F and a second connection portion 16G as bent portions. However, the second line 16 may have at least one bent portion. FIG. 9 is a perspective view of an electronic component according to another embodiment. As shown in FIG. 9, the second line 30 includes a first pattern portion 30A, a second pattern portion 30B, a third pattern portion 30C, a fourth pattern portion 30D, and a connection portion (bent portion) 30E.

[0074] The first pattern portion 30A extends linearly along the first direction D1. The first pattern portion 30A is parallel to the first pattern portion 15A of the first line 15. The second pattern portion 30B extends linearly along the third direction D3. The third pattern portion 30C is connected to an end of the first pattern portion 30A. The fourth pattern portion 30D is connected to an end of the second pattern portion 30B.

[0075] Connection portion 30E connects first pattern portion 30A and second pattern portion 30B. Connection portion 30E bends second pattern portion 30B by 90 degrees relative to first pattern portion 30A. First pattern portion 30A, second pattern portion 30B, and connection portion 30E are, for example, substantially L-shaped.

[0076] In the above embodiment, the ground pattern portion 22B of the second conductor layer 11 overlaps with all of the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16 in a plan view in the second direction D2. However, it is sufficient that the ground pattern portion overlaps with at least a portion of the second line in a plan view in the second direction D2. It is preferable that the ground pattern portion overlaps with at least one bend portion in the second pattern of the second line.

[0077] Fig. 10 is a perspective view of an electronic component according to another embodiment. Fig. 11 is a perspective view of an electronic component according to another embodiment. As shown in Fig. 10 and Fig. 11 , ground pattern portion 22B overlaps with part of first pattern portion 16A, part of second pattern portion 16B, part of third pattern portion 16C, and second connection portion 16G in a plan view in second direction D2.

[0078] In the above embodiment, an example has been described in which the ground pattern portion 22B is also arranged at a position that does not overlap with the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16 on the first conductor layer 10. However, the shape of the ground pattern portion 22B is not limited to this. FIG. 12 is a perspective view of an electronic component according to another embodiment. As shown in FIG. 12 , the ground pattern portion 22B may have a shape that follows the shapes of the first pattern portion 16A, the second pattern portion 16B, the third pattern portion 16C, the first connecting portion 16F, and the second connecting portion 16G of the second line 16.

[0079] In the above embodiment and modified example, the resistive element is the resistive film 18. However, the resistive element is not limited to the resistive film 18 and may have other forms.

[0080] [Supplementary Notes] As described above, various embodiments of the present disclosure can be defined as the following supplementary notes.

[0081] [1] An electronic component comprising: a first conductor layer having a first line and a second line including a first pattern electromagnetically coupled to the first line; and a second conductor layer disposed in a layer different from the first conductor layer in a stacking direction, wherein the second conductor layer has a ground pattern that overlaps with at least a portion of the second line but does not overlap with the first line in a plan view in the stacking direction. [2] The electronic component according to [1], wherein the first conductor layer has a resistive element electrically connected to one end of the second line, and the ground pattern does not overlap with the resistive element in a plan view in the stacking direction. [3] The electronic component according to [1] or [2], wherein the second line includes a second pattern formed continuously with the first pattern and including one or more bent portions. [4] The electronic component according to [3], wherein the pattern length of the second pattern is equal to or greater than the pattern length of the first pattern. [5] The electronic component according to [3] or [4], wherein the second pattern includes a plurality of the bent portions. [6] The electronic component according to any one of [3] to [5], wherein the second pattern includes at least a pattern portion extending parallel to the first pattern in a plan view in the stacking direction, and the length of the pattern portion is shorter than the length of the first pattern. [7] The electronic component according to [6], wherein a first distance between the first line and the first pattern is shorter than a second distance between the first pattern and the pattern portion. [8] The electronic component according to any one of [1] to [7], wherein the ground pattern overlaps with all of the first pattern and the second pattern in a plan view in the stacking direction. [9] The electronic component according to [1] to [8], wherein the ground pattern has a shape that follows the shapes of the first pattern and the second pattern in a plan view in the stacking direction.

[10] The electronic component according to [5], wherein the ground pattern overlaps with at least one of the bent portions of the second pattern in a plan view in the stacking direction.

[11] The electronic component according to any one of [1] to

[10] , wherein the second conductor layer is disposed adjacent to the first conductor layer.

[12] The electronic component according to any one of [1] to

[10] , wherein the second conductor layer is arranged at a position not adjacent to the first conductor layer.

[13] The electronic component according to any one of [1] to

[12] , wherein the pattern length of the second line is at least twice the pattern length of the first line.

[14] The electronic component according to any one of [1] to

[13] , wherein the pattern length of the second line is not more than five times the pattern length of the first line.

[15] The electronic component according to any one of [1] to

[14] , wherein: a first terminal electrically connected to one end of the first line; and a second terminal electrically connected to the other end of the second line; the first line has a portion extending linearly between the first terminal and the second terminal; and the first pattern of the second line extends parallel to the first line.

[0082] 1...electronic component, 10...first conductor layer, 11...second conductor layer, 15...first line, 16...second line, 16A...first pattern portion (first pattern), 16B...second pattern portion (second pattern), 16C...third pattern portion (second pattern), 16F...first connection portion (bent portion), 16G...second connection portion (bent portion), 18...resistive film (resistive element), 22B...ground pattern portion (ground pattern), L1, L2...pattern length.

Claims

1. An electronic component comprising: a first conductor layer having a first line and a second line including a first pattern that electromagnetically couples with the first line; and a second conductor layer that is arranged in a layer different from the first conductor layer in the stacking direction, wherein the second conductor layer has a ground pattern that overlaps at least a portion of the second line but does not overlap the first line in a planar view in the stacking direction.

2. The electronic component according to claim 1, wherein the first conductor layer has a resistive element electrically connected to one end of the second line, and the ground pattern does not overlap with the resistive element in a plan view in the stacking direction.

3. The electronic component according to claim 1 or 2, wherein the second line includes a second pattern formed continuously with the first pattern and including one or more bent portions.

4. The electronic component according to claim 3, wherein the pattern length of the second pattern is equal to or greater than the pattern length of the first pattern.

5. The electronic component according to claim 3, wherein the second pattern includes a plurality of the bent portions.

6. The electronic component according to claim 3, wherein the second pattern includes at least a pattern portion extending parallel to the first pattern in a plan view in the stacking direction, and the pattern length of the pattern portion is shorter than the pattern length of the first pattern.

7. The electronic component according to claim 6, wherein a first distance between the first line and the first pattern is shorter than a second distance between the first pattern and the pattern portion.

8. The electronic component according to claim 3, wherein the ground pattern overlaps with all of the first pattern and the second pattern in a plan view in the stacking direction.

9. The electronic component according to claim 3, wherein the ground pattern has a shape that conforms to the shapes of the first pattern and the second pattern when viewed in a plane in the stacking direction.

10. The electronic component according to claim 1 or 2, wherein the second conductor layer is disposed adjacent to the first conductor layer.

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