Temporary fixing composition and method for producing wafer

Abstract

This temporary fixing composition comprises a polymerizable component (A) that contains (meth)acrylate, a photoradical polymerization initiator (B), and an ultraviolet absorber (C). The ratio of the area of carbon particle generation, as per a specific method, is not less than 0.5%.

Description

Temporary fixing composition and method for manufacturing wafer

[0001] The present invention relates to a temporary fixing composition and a method for producing a wafer.

[0002] In the manufacture of wafers used for electronic devices, etc., measures are required to prevent breakage due to thinning during processing. As such measures, a method has been adopted in which a temporary fixing composition that can be peeled off after processing is applied to the surface (back surface) of the wafer opposite to the surface to be ground, and the wafer is temporarily fixed to a support member.

[0003] Patent Document 1 describes a temporary fixing composition containing the following (A) to (C): (A) a (meth)acrylate containing the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and whose homopolymer has a Tg of -100°C to 60°C; (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and / or a polyisobutene copolymer; and (C) a photoradical polymerization initiator. Patent Document 1 also describes, as problems to be solved, insufficient curing speed, compatibility with spin coating processes, heat resistance, low outgassing under high temperature and vacuum, and peeling speed, and in particular, insufficient suitability for UV laser peeling processes.

[0004] International Publication No. 2021 / 235406

[0005] The present invention provides a temporary fixing composition that can suppress re-adhesion between a wafer and a support member after a certain time has elapsed since laser irradiation.

[0006] According to the present invention, there are provided the following temporary fixing composition and wafer manufacturing method.

[0007] 1. A temporary fixing composition comprising: a polymerizable component (A) containing a (meth)acrylate; a photoradical polymerization initiator (B); and an ultraviolet absorber (C); wherein the ratio of the area where carbon particles are generated by the following method 1 is 0.50% or more. (Method 1) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, the temporary fixing film is irradiated with a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to cure the temporary fixing film, thereby obtaining a cured film. Next, the obtained cured film is irradiated from the glass support member side with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the glass support member on the cured film side at the center is observed and photographed using an optical microscope at 20x magnification. The area (%) of the black part per field of view (200 μm × 200 μm) is calculated using image processing software, assuming the area of ​​one field of view (200 μm × 200 μm) to be 100%, and this is defined as the area (%) of carbon particle generation. 2. The temporary fixing composition according to 1., wherein the carbon particles include carbon black. 3. 1. or 2., wherein the content of carbon particles in the temporary fixing composition is 1.0 mass% or less. 4. The temporary fixing composition according to any one of 1. to 3., wherein the photoradical polymerization initiator (B) contains one or more selected from the group consisting of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime). 5. The temporary fixing composition according to any one of 1. to 4., wherein the ultraviolet absorber (C) has one or more skeletons selected from the group consisting of a benzophenone skeleton, a triazole skeleton, a hydroxyphenyltriazine skeleton, and a phenol skeleton. 6. The temporary fixing composition according to any one of 1. to 5., wherein the ultraviolet absorber (C) has a polymerizable functional group. 7. The temporary fixing composition according to 6., wherein the polymerizable functional group is present at a terminal of the ultraviolet absorber (C). 8. The temporary fixing composition according to 6., wherein the polymerizable functional group includes a (meth)acryloyl group. Or the temporary fixing composition according to 7. 9. The temporary fixing composition according to any one of 1. to 8., wherein the content of the ultraviolet absorber (C) is 0.1 parts by mass or more and 20 parts by mass or less with respect to 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate.10. The temporary fixing composition according to any one of 1. to 9., wherein the content of the polymerizable component (A) containing the (meth)acrylate is 50% by mass or more and 99% by mass or less, relative to 100% by mass of the temporary fixing composition. 11. The temporary fixing composition according to any one of 1. to 10., wherein the content of the photoradical polymerization initiator (B) is 0.1 parts by mass or more and 10 parts by mass or less, relative to 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate. 12. The temporary fixing composition according to any one of 1. to 11., wherein the polymerizable component (A) containing the (meth)acrylate includes one or more selected from the group consisting of monofunctional (meth)acrylates and bifunctional (meth)acrylates. 13. The temporary fixing composition according to any one of 1. to 12., wherein the polymerizable component (A) containing the (meth)acrylate contains one or more selected from the group consisting of monofunctional alkyl (meth)acrylates having an alkyl group, aromatic (meth)acrylates, alicyclic bifunctional (meth)acrylates, and acyclic bifunctional (meth)acrylates. 14. The aromatic (meth)acrylate is 9,9-bis[4-(2-hydroxy C. １ ~C ２０ 9,9-bis[4-(2-(meth)acryloyloxy)phenyl]fluorene di (meth)acrylate, １ ~C ２０ alkoxy)phenyl)]fluorene, C １ ~C ２０ Alkoxylated bisphenol A di(meth)acrylate, benzyl di(meth)acrylate, 1,3-bis(2-(meth)acryloyloxy C １ ~C ２０ 15. The temporary fixing composition according to 13., which contains one or more selected from the group consisting of 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, nonylphenol ethylene oxide-modified (meth)acrylate, and structural isomers thereof. －１The temporary fixing composition according to any one of 1. to 14., wherein the viscosity of the temporary fixing composition measured by FTIR is 100 mPa·s or more and 5000 mPa·s or less. 16. The temporary fixing composition according to any one of 1. to 15., wherein the transmittance of a laser with a wavelength of 355 nm when the following method 2 is carried out is 10.0% or less. (Method 2) Two rectangular Tempax glass sheets (33 mm×50 mm, thickness 700 μm) are prepared, 0.1 g of the temporary fixing composition is dropped onto one of them, and the two sheets are sandwiched together with the other. Next, the obtained laminate is irradiated with a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm in a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) to cure the temporary fixing composition and obtain a test piece for transmittance measurement. Next, the transmittance of the obtained test piece for transmittance measurement is measured using a spectrophotometer at a pitch of 1.0 nm and in a wavelength range of 300 to 800 nm. Next, the transmittance at a wavelength of 355 nm is read from the obtained transmittance data and is defined as the transmittance at a wavelength of 355 nm. 17. Peel strength P immediately after laser irradiation using the following method 3 １ The temporary fixing composition according to any one of 1. to 16., wherein the applied force is 0.01 N or more and 30.0 N or less. (Method 3) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is vertically pulled upward at a speed of 0.5 mm / sec to peel the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ (N). 18. Peel strength P 10 minutes after completion of laser irradiation according to the following method 4 ２ The temporary fixing composition according to any one of 1. to 17., wherein the applied force is 0.01 N or more and 50.0 N or less. (Method 4) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, 10 minutes after the completion of the UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is pulled vertically upward at a speed of 0.5 mm / sec to peel off the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P ２ (N). 19. Peel strength P immediately after laser irradiation according to the following method 5 １ Peel strength P after 10 minutes of laser irradiation ２ The ratio (P ２ / P １ The temporary fixing composition according to any one of 1. to 18., wherein the value of the σ is 2.0 or less. (Method 5) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm is applied to the silicon wafer and the glass support member under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is vertically pulled upward at a speed of 0.5 mm / sec to peel the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ Next, a laminate was obtained under the same conditions as above, and 10 minutes after the completion of the UV laser irradiation, the obtained laminate was placed and fixed on a suction table with the silicon wafer side facing downwards, and a suction arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the suction arm was vertically pulled upward at a speed of 0.5 mm / sec to peel off the glass support member, and the load applied to the suction arm when the glass support member was lifted was measured, and the peel strength P ２ (N). P calculated by the above method １ and P ２ From P ２ / P １is calculated. 20. The temporary fixing composition according to any one of 1. to 19., which is capable of temporarily fixing a support member and a wafer. 21. The temporary fixing composition according to 20., wherein the support member comprises a glass support member. 22. The temporary fixing composition according to 20. or 21., wherein the wafer comprises a semiconductor wafer. 23. A method for manufacturing a wafer, comprising: a peeling step of irradiating a structure comprising, in this order, a support member, a cured film of the temporary fixing composition according to any one of 1. to 22., and a wafer, with a UV laser having a wavelength of 300 nm or more and 385 nm or less from the support member side to decompose at least a part of the cured film of the temporary fixing composition, thereby generating carbon particles, and peeling the wafer from the support member. 24. A composition comprising: a polymerizable component (A); a polymerization initiator (B); and an ultraviolet absorber (C), wherein the ratio of an area where carbon particles are generated by Method 1 below is 0.50% or more. (Method 1) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped film (diameter 150 mm × thickness 50 μm) made of the composition between the silicon wafer and the glass support member. Next, in a nitrogen atmosphere, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied to the silicon wafer. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the film from the glass support member side to cure the film, thereby obtaining a cured film. Next, from the glass support member side, the obtained cured film is irradiated with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the cured film side in the center part of the glass support member is observed and photographed using an optical microscope at 20x magnification. When the area of ​​one visual field (200 μm × 200 μm) is taken as 100%, the area (%) of the black part per visual field is calculated using image processing software, and this is the area (%) of carbon particle generation.

[0008] According to the present invention, it is possible to provide a temporary fixing composition that can suppress re-fixing between a wafer and a support member after a certain time has elapsed since laser irradiation.

[0009] 1 is a micrograph of the cured film side surface at the center part of the glass support member of Example 1. FIG. 2 is a micrograph of the cured film side surface at the center part of the glass support member of Comparative Example 3. FIG. 3 is a diagram illustrating a method for measuring peel strength.

[0010] The present invention will be described below based on embodiments.

[0011] In the present embodiment, the term "(meth)acrylate" represents a concept that encompasses both acrylate and methacrylate. The same applies to similar terms such as "(meth)acrylic."

[0012] The composition of this embodiment will be described below. The composition of this embodiment contains a polymerizable component (A), a polymerization initiator (B), and an ultraviolet absorber (C), and has a carbon particle generation area ratio of 0.50% or more when measured by Method 1 below. (Method 1) A disk-shaped silicon wafer (diameter 150 mm x thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm x thickness 700 μm) are bonded to each other by applying a disk-shaped film (diameter 150 mm x thickness 50 μm) made of the composition between the silicon wafer and the glass support member. Next, the silicon wafer and the glass support member are bonded to each other by applying a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the film from the glass support member side to harden the film, thereby obtaining a cured film. Next, from the glass support member side, the obtained cured film is irradiated with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the cured film side at the center of the glass support member is observed and photographed using an optical microscope at 20x magnification. The area (%) of the black part per visual field (200 μm × 200 μm) is calculated using image processing software, assuming the area of ​​one visual field (200 μm × 200 μm) as 100%, and this is the area (%) of carbon particle generation. As the composition, a temporary fixing composition is preferred.

[0013] 1. Temporary Fixing Composition The temporary fixing composition of this embodiment will be described below.

[0014] The temporary fixing composition of this embodiment contains a polymerizable component (A) containing a (meth)acrylate, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), and has a carbon particle generation area ratio of 0.50% or more when measured by the following Method 1. (Method 1) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, the silicon wafer and the glass support member are bonded together by applying a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, the obtained cured film is irradiated from the glass support member side with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the cured film side in the center part of the glass support member is observed and photographed using an optical microscope at 20x magnification. The area (%) of the black part per field of view (200 μm × 200 μm) is calculated using image processing software, and this is the area (%) of carbon particle generation.

[0015] The mechanism by which the temporary fixing composition of this embodiment can suppress re-sticking between a wafer and a support member after a certain time has elapsed since laser irradiation (hereinafter, this may be simply referred to as re-sticking) is not clear, but it is speculated that carbon particles generated when the temporary fixing composition of this embodiment is irradiated with light such as a UV laser contribute to the suppression of re-sticking.

[0016] <Carbon Particles> Hereinafter, the carbon particles of this embodiment will be described.

[0017] The ratio of the area where carbon particles are generated in this embodiment by the above method 1 is preferably 0.55% or more, more preferably 0.60% or more, even more preferably 0.70% or more, even more preferably 0.75% or more, even more preferably 0.80% or more, even more preferably 0.90% or more, even more preferably 1.00% or more, even more preferably 1.10% or more, and even more preferably 1.20% or more, from the viewpoint of being able to further suppress re-adhesion, and is preferably 20.00% or less, more preferably 10.00% or less, even more preferably 5.00% or less, and even more preferably 3.00% or more, from the viewpoint of being able to suppress contamination by carbon particles. From the viewpoint of a balance between suppressing re-adhesion and suppressing contamination by carbon particles, the content is preferably 0.50% or more and 20.00% or less, more preferably 0.55% or more and 20.00% or less, even more preferably 0.60% or more and 20.00% or less, even more preferably 0.70% or more and 20.00% or less, even more preferably 0.75% or more and 10.00% or less, even more preferably 0.80% or more and 10.00% or less, even more preferably 0.90% or more and 5.00% or less, even more preferably 1.00% or more and 5.00% or less, even more preferably 1.10% or more and 3.00% or less, and even more preferably 1.20% or more and 3.00% or less.

[0018] The image processing software used to calculate the area in the above method 1 is not particularly limited, but for example, Fiji manufactured by the National Institutes of Health can be used.

[0019] The carbon particles of the present embodiment preferably contain carbon black, from the viewpoint of further suppressing re-adhesion.

[0020] From the viewpoint of suppressing contamination by carbon particles, the content of carbon particles in the temporary fixing composition of this embodiment is preferably 1.0% by mass or less, more preferably 0.1% by mass or less, even more preferably 0.01% by mass or less, even more preferably 0.001% by mass or less, and even more preferably 0.0001% by mass or less. That is, the temporary fixing composition of this embodiment preferably does not contain carbon particles as a blending component, and even when a small amount of carbon particles is contained as a blending component, the content is preferably not more than the above-mentioned upper limit value.

[0021] The carbon particles contained as a compounding component in the temporary fixing composition of this embodiment include, for example, carbon black, hard carbon, soft carbon, graphite, etc., and are mainly carbon black.

[0022] <Polymerizable Component (A) Containing (Meth)acrylate> Hereinafter, the polymerizable component (A) containing a (meth)acrylate of this embodiment will be described.

[0023] The (meth)acrylate-containing polymerizable component (A) of the present embodiment preferably contains one or more selected from the group consisting of monofunctional (meth)acrylates and polyfunctional (meth)acrylates, and more preferably contains one or more selected from the group consisting of monofunctional (meth)acrylates and bifunctional (meth)acrylates.

[0024] In this embodiment, the term "multifunctional (meth)acrylate" refers to a (meth)acrylate having two or more functional groups. Bifunctional (meth)acrylates will be described later. Examples of trifunctional (meth)acrylates include ethylene oxide isocyanurate-modified tri(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, and tris[(meth)acryloyloxyethyl]isocyanurate. Examples of tetrafunctional or higher (meth)acrylates include ditrimethylolpropane tetra(meth)acrylate, dimethylolpropane tetra(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol ethoxy tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0025] The polyfunctional (meth)acrylate of the present embodiment may be a polyfunctional (meth)acrylate monomer or a polyfunctional (meth)acrylate polymer, or a mixture thereof, but preferably includes a polyfunctional (meth)acrylate polymer, more preferably includes a (meth)acrylic group-containing polybutyl (meth)acrylate, and even more preferably includes an acrylic group-containing polybutyl acrylate.

[0026] (Meth)acrylic group-containing polybutyl(meth)acrylate can be produced by the methods described in, for example, JP-A Nos. 61-207478, 61-31330, 10-278207, 9-40741, and 8-357621.

[0027] In this embodiment, the weight-average molecular weight of the polyfunctional (meth)acrylate polymer is preferably 5,000 to 500,000, more preferably 10,000 to 300,000, even more preferably 30,000 to 200,000, and even more preferably 50,000 to 100,000. Having a weight-average molecular weight within the above range allows the viscosity of the temporary fixing composition and the crosslink density of the cured product to be within preferred ranges. In this embodiment, the weight-average molecular weight of the polyfunctional (meth)acrylate polymer is a value measured by gel permeation chromatography (GPC) in terms of standard polystyrene. Specifically, for example, the weight-average molecular weight can be determined under the following conditions using tetrahydrofuran as a solvent, a GPC system (SC-8010 manufactured by Tosoh Corporation), and a calibration curve created using commercially available standard polystyrene. Flow rate: 1.0 ml / min Set temperature: 40°C Column configuration: One Tosoh "TSK guard column MP (xL)" 6.0 mm ID x 4.0 cm and two Tosoh "TSK-GELMULTIPORE HXL-M" 7.8 mm ID x 30.0 cm (theoretical plate number 16,000), a total of three (total theoretical plate number 32,000), Sample injection volume: 100 μl (sample solution concentration 1 mg / ml) Delivery pressure: 39 kg / cm ２ Detector: RI detector

[0028] The (meth)acrylate-containing polymerizable component (A) of the present embodiment preferably contains one or more selected from the group consisting of a monofunctional alkyl (meth)acrylate having an alkyl group, an aromatic (meth)acrylate, an alicyclic bifunctional (meth)acrylate, and an acyclic bifunctional (meth)acrylate, and from the viewpoint of being able to provide a rigid structure, more preferably contains one or more selected from the group consisting of an aromatic (meth)acrylate and an alicyclic bifunctional (meth)acrylate, and even more preferably contains an aromatic (meth)acrylate.

[0029] The alkyl group of the alkyl group-containing monofunctional alkyl (meth)acrylate of this embodiment (hereinafter may be simply referred to as the alkyl group of this embodiment) preferably includes one or more types selected from the group consisting of a linear alkyl group, a branched alkyl group, and an alicyclic alkyl group.

[0030] The alkyl group of this embodiment preferably contains an alkyl group having 18 to 40 carbon atoms, and more preferably an alkyl group having 18 to 32 carbon atoms. This can enhance the aliphatic hydrocarbon properties of the polymerizable component (A) containing the (meth)acrylate of this embodiment (preferably the aliphatic hydrocarbon properties of the entire system), thereby improving low volatility, chemical resistance, and heat resistance.

[0031] The alkyl group of this embodiment preferably includes one or more types selected from the group consisting of branched alkyl groups and alicyclic alkyl groups, and more preferably includes one or more types selected from the group consisting of branched alkyl groups and cycloalkyl groups such as an isostearyl group, an isotetracosanyl group (e.g., a 2-decyl-1-tetradecanyl group), an isotriacontanyl group (e.g., a 2-tetradecyl-1-octadecanyl group), etc. This can improve the compatibility of the polymerizable component (A) containing the (meth)acrylate of this embodiment with other components.

[0032] The monofunctional alkyl (meth)acrylate having an alkyl group of the present embodiment preferably includes one or more selected from the group consisting of stearyl (meth)acrylate, isostearyl (meth)acrylate, behenyl (meth)acrylate, 2-decyl-1-tetradecanyl (meth)acrylate, 2-dodecyl-1-hexadecanyl (meth)acrylate, and 2-tetradecyl-1-octadecanyl (meth)acrylate, more preferably includes one or more selected from the group consisting of stearyl (meth)acrylate and isostearyl (meth)acrylate, and even more preferably includes isostearyl (meth)acrylate.

[0033] The aromatic (meth)acrylate of the present embodiment is preferably 9,9-bis[4-(2-hydroxy C １ ~C ２０ 9,9-bis[4-(2-(meth)acryloyloxy)phenyl]fluorene di (meth)acrylate, １ ~C ２０ alkoxy)phenyl)]fluorene, C １ ~C ２０ Alkoxylated bisphenol A di(meth)acrylate, benzyl di(meth)acrylate, 1,3-bis(2-(meth)acryloyloxy C １ ~C ２０ The copolymer contains one or more selected from the group consisting of 9,9-bis[4-(2-(meth)acryloyloxy)phenyl]benzene, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, nonylphenol ethylene oxide-modified (meth)acrylate, and structural isomers thereof, and more preferably 9,9-bis[4-(2-(meth)acryloyloxy)phenyl]propane, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, nonylphenol ethylene oxide-modified (meth)acrylate, and structural isomers thereof. １ ~C ２０ The compound preferably contains one or more compounds selected from the group consisting of 9,9-bis[4-(2-acryloyloxyethoxy)phenyl)]fluorene and nonylphenol ethylene oxide-modified (meth)acrylate, and more preferably contains one or two compounds selected from the group consisting of 9,9-bis[4-(2-acryloyloxyethoxy)phenyl)]fluorene and nonylphenol ethylene oxide-modified acrylate.

[0034] The alicyclic bifunctional (meth)acrylate of the present embodiment is preferably C １ ~C ２０ Alkoxylated hydrogenated bisphenol A di(meth)acrylate, 1,3-di(meth)acryloyloxyadamantane, tricyclo C １０ ~C ２０ Alkanedimethanol di(meth)acrylate, dicyclo C ５ ~C ２０ The compound preferably contains one or more selected from the group consisting of di(meth)acrylates and structural isomers thereof, and more preferably C １ ~C ２０ It includes alkoxylated hydrogenated bisphenol A di(meth)acrylate, and more preferably includes ethoxylated hydrogenated bisphenol A di(meth)acrylate.

[0035] The acyclic bifunctional (meth)acrylate of the present embodiment preferably includes one or more compounds selected from the group consisting of 1,3-butanediol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, neopentyl glycol-modified trimethylolpropane di(meth)acrylate, stearic acid-modified pentaerythritol di(meth)acrylate, tripropylene glycol di(meth)acrylate, and caprolactone-modified hydroxypivalic acid neopentyl glycol di(meth)acrylate, and more preferably includes 1,10-decanediol di(meth)acrylate.

[0036] The content of the polymerizable component (A) containing a (meth)acrylate in the temporary fixing composition of the present embodiment is, relative to 100% by mass of the temporary fixing composition of the present embodiment, preferably 50% by mass or more and 99% by mass or less, more preferably 60% by mass or more and 99% by mass or less, more preferably 70% by mass or more and 99% by mass or less, even more preferably 80% by mass or more and 99% by mass or less, and still more preferably 85% by mass or more and 99% by mass or less.

[0037] <Photoradical Polymerization Initiator (B)> Hereinafter, the photoradical polymerization initiator (B) of this embodiment will be described.

[0038] The photoradical polymerization initiator (B) of the present embodiment is a compound whose molecules are cleaved and split into two or more radicals when irradiated with, for example, ultraviolet light or visible light (for example, a wavelength of 350 to 700 nm, preferably 365 to 500 nm, more preferably 385 to 450 nm).

[0039] From the viewpoint of a balance between suppressing re-sticking, improving the reaction rate, and improving the heat resistance after curing, the photoradical polymerization initiator (B) of the present embodiment may be, for example, bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, 2,4,6-trimethylbenzoyldiphenylphosphine oxide, bis(η5-2,4-cyclopentadiene-1-yl)-bis(2,6-difluoro-3-(1H-pyrrol-1-yl)-phenyl)titanium, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-ylphenyl)-butan-1-one, 1-[ The compound contains one or more compounds selected from the group consisting of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime), preferably one or more compounds selected from the group consisting of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime), more preferably bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide.

[0040] The content of the photoradical polymerization initiator (B) in the temporary fixing composition of this embodiment is preferably 0.1 parts by mass or more and 10 parts by mass or less, more preferably 0.5 parts by mass or more and 5.0 parts by mass or less, even more preferably 1.0 parts by mass or more and 3.0 parts by mass or less, and still more preferably 1.2 parts by mass or more and 2.0 parts by mass or less, relative to 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate of this embodiment, from the viewpoint of a balance between suppressing re-fixing, improving the reaction rate, and improving the heat resistance after curing.

[0041] <Ultraviolet Absorbent (C)> Hereinafter, the ultraviolet absorbent (C) of this embodiment will be described.

[0042] From the viewpoints of suppressing re-sticking, the degree of overlap of the UV absorption wavelength region with the UV laser wavelength, and the balance of UV absorption properties at the same wavelength, the ultraviolet absorber (C) of the present embodiment preferably has one or more skeletons selected from the group consisting of a benzophenone skeleton, a triazole skeleton (preferably a benzotriazole skeleton), a hydroxyphenyltriazine skeleton, and a phenol skeleton (preferably a hindered phenol skeleton), more preferably one or two or more skeletons selected from the group consisting of a benzophenone skeleton and a triazole skeleton (preferably a benzotriazole skeleton), and even more preferably one or two or more skeletons selected from the group consisting of a benzophenone skeleton and a benzotriazole skeleton.

[0043] From the viewpoints of suppressing re-adhesion, the degree of overlap of the UV absorption wavelength region with the UV laser wavelength, and the balance of UV absorption properties at the same wavelength, the ultraviolet absorbent (C) of the present embodiment preferably contains both an ultraviolet absorbent (C) having a benzophenone skeleton and an ultraviolet absorbent (C) having a benzotriazole skeleton.

[0044] The ultraviolet absorber (C) of this embodiment preferably has a polymerizable functional group.

[0045] The polymerizable functional group of the present embodiment is preferably present at the terminal of the ultraviolet absorber (C) of the present embodiment.

[0046] The polymerizable functional group in this embodiment is preferably a (meth)acryloyl group.

[0047] The ultraviolet absorber (C) of the present embodiment preferably includes one or two, and more preferably two, types selected from the group consisting of 2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole (product name: RUVA-93, manufactured by Otsuka Chemical Co., Ltd.) and 2,2′-dihydroxy-4,4′-diacryloyloxybenzophenone (product name: DAINSORB P-66, manufactured by Daiwa Kasei Co., Ltd.).

[0048] The content of the ultraviolet absorber (C) in the temporary fixing composition of the present embodiment, relative to 100 parts by mass of the polymerizable component (A) containing a (meth)acrylate of the present embodiment, is preferably 0.1 parts by mass or more, more preferably 0.5 parts by mass or more, even more preferably 1.0 parts by mass or more, even more preferably 1.5 parts by mass or more, even more preferably 2.0 parts by mass or more, and even more preferably 2.5 parts by mass or more, from the viewpoint of improving heat resistance and durability, it is preferably 20 parts by mass or less, more preferably 15 parts by mass or less, and even more preferably 10 parts by mass or less, and from the viewpoint of a balance between the prevention of re-sticking, the improvement of heat resistance, and the improvement of durability, it is preferably 0.1 parts by mass or more and 20 parts by mass or less, more preferably 0.5 parts by mass or more and 20 parts by mass or less, even more preferably 1.0 parts by mass or more and 15 parts by mass or less, even more preferably 1.5 parts by mass or more and 15 parts by mass or less, even more preferably 2.0 parts by mass or more and 10 parts by mass or less, and even more preferably 2.5 parts by mass or more and 10 parts by mass or less, from the viewpoint of a balance between the prevention of re-sticking, the improvement of heat resistance, and the improvement of durability.

[0049] <Other Components> The temporary fixing composition of the present embodiment may contain components other than those described above, and may contain known components such as, for example, a solvent, an antifoaming agent, a surfactant, a colorant, a polymerization inhibitor, a stabilizer, an adhesion modifier, a release agent, a filler, etc. The contents of these other components can be set arbitrarily as necessary.

[0050] <Physical Properties of Temporary Fixing Composition> Hereinafter, the physical properties of the temporary fixing composition of this embodiment will be described.

[0051] (Viscosity) Using an E-type viscometer, the temperature was 23°C and the shear rate was 75 s －１The viscosity of the temporary fixing composition of this embodiment, measured by the above method, is preferably 100 mPa·s or more and 5000 mPa·s or less, more preferably 500 mPa·s or more and 4000 mPa·s or less, even more preferably 1000 mPa·s or more and 3000 mPa·s or less, still more preferably 1000 mPa·s or more and 2000 mPa·s or less, and still more preferably 1100 mPa·s or more and 1500 mPa·s or less. This can improve the workability when applying the temporary fixing composition of this embodiment.

[0052] (Transmittance of a laser with a wavelength of 355 nm) When the following method 2 is carried out, the transmittance of a laser with a wavelength of 355 nm of the temporary fixing composition of this embodiment is preferably 10.0% or less, more preferably 5.0% or less, even more preferably 1.0% or less, even more preferably 0.5% or less, and even more preferably 0.1% or less. This allows the laser to be well absorbed by the cured product of the temporary fixing composition, facilitating peeling. (Method 2) Two rectangular Tempax glass sheets (33 mm x 50 mm, thickness 700 μm) are prepared, 0.1 g of the temporary fixing composition is dropped onto one of them, and the two sheets are sandwiched together with the other. Next, the obtained laminate is irradiated with a UV-LED with a wavelength of 405 nm (illuminance 100 mW / cm) under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) to cure the temporary fixing composition and obtain a test piece for transmittance measurement. Next, the transmittance of the obtained test piece for transmittance measurement is measured using a spectrophotometer at a pitch of 1.0 nm and in a wavelength range of 300 to 800 nm. Next, the transmittance at a wavelength of 355 nm is read from the obtained transmittance data and used as the transmittance at a wavelength of 355 nm. Prior to the transmittance measurement, two rectangular Tempax glass sheets (33 mm x 50 mm, 700 μm thick) are prepared, 0.1 g of water is dropped onto one of them, and the other is sandwiched between them to obtain a test piece for baseline measurement. The baseline of the spectrophotometer is measured using the obtained test piece for baseline measurement.

[0053] (Peel strength immediately after laser irradiation P １ ) Peel strength P immediately after laser irradiation of the temporary fixing composition of this embodiment by the following method 3 １is, for example, 0.01 N or more and preferably 30.0 N or less, more preferably 25.0 N or less, even more preferably 20.0 N or less, even more preferably 18.0 N or less, even more preferably 16.0 N or less, even more preferably 14.0 N or less, even more preferably 12.0 N or less, and even more preferably 10.0 N or less, and preferably 0.01 N or more and 30.0 N or less, more preferably 0.01 N or more and 25.0 N or less, even more preferably 0.01 N or more and 20.0 N or less, even more preferably 0.01 N or more and 18.0 N or less, even more preferably 0.01 N or more and 16.0 N or less, even more preferably 0.01 N or more and 14.0 N or less, even more preferably 0.01 N or more and 12.0 N or less, and even more preferably 0.01 N or more and 10.0 N or less. (Method 3) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm × thickness 50 μm) made of a temporary fixing composition between the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member. The adsorption arm is then pulled vertically upward at a speed of 0.5 mm / sec, the glass support member is peeled off, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ Let (N).

[0054] (Peel strength P 10 minutes after laser irradiation is completed ２) Peel strength P 10 minutes after completion of laser irradiation of the temporary fixing composition of this embodiment by the following method 4 ２ is, for example, 0.01 N or more, and preferably 50.0 N or less, more preferably 40.0 N or less, even more preferably 30.0 N or less, even more preferably 25.0 N or less, even more preferably 20.0 N or less, even more preferably 18.0 N or less, even more preferably 16.0 N or less, even more preferably 14.0 N or less, even more preferably 12.0 N or less, and even more preferably 10.0 N or less, and preferably 0.01 N or more and 30.0 N or less, more preferably 0.01 N or more and 25.0 N or less, even more preferably 0.01 N or more and 20.0 N or less, even more preferably 0.01 N or more and 18.0 N or less, even more preferably 0.01 N or more and 16.0 N or less, even more preferably 0.01 N or more and 14.0 N or less, even more preferably 0.01 N or more and 12.0 N or less, and even more preferably 0.01 N or more and 10.0 N or less. (Method 4) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm × thickness 50 μm) made of a temporary fixing composition between the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, 10 minutes after the completion of the UV laser irradiation, the obtained laminate is placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member. The adsorption arm is pulled vertically upward at a speed of 0.5 mm / sec, the glass support member is peeled off, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P ２ Let (N).

[0055] (P ２ / P １ ) Peel strength P immediately after laser irradiation of the temporary fixing composition of this embodiment by the following method 5 １ Peel strength P after 10 minutes of laser irradiation ２ The ratio (P ２ / P １ ) is preferably 3.0 or less, more preferably 2.5 or less, even more preferably 2.0 or less, and even more preferably 1.8 or less. (Method 5) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of a temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member. The adsorption arm is then pulled vertically upward at a speed of 0.5 mm / sec, the glass support member is peeled off, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ Next, a laminate was obtained under the same conditions as above, and 10 minutes after the completion of the UV laser irradiation, the obtained laminate was placed and fixed on a suction table with the silicon wafer side facing downwards, and a suction arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the suction arm was vertically pulled upward at a speed of 0.5 mm / sec to peel off the glass support member, and the load applied to the suction arm when the glass support member was lifted was measured, and the peel strength P ２ (N). P calculated by the above method １ and P ２ From P ２ / P １ Calculate.

[0056] The temporary fixing composition of this embodiment is preferably capable of temporarily fixing a support member and a wafer.

[0057] The support member of this embodiment is not particularly limited, but preferably includes a light-transmitting material. This facilitates wafer peeling by light irradiation such as UV laser irradiation. Examples of light-transmitting materials include inorganic substrates such as crystal, glass, quartz, calcium fluoride, and magnesium fluoride, and organic substrates such as plastic.

[0058] The support member of this embodiment preferably includes one or more types selected from the group consisting of a quartz support member and a glass support member, and more preferably includes a glass support member.

[0059] The wafer of this embodiment preferably comprises a semiconductor wafer.

[0060] 2. Wafer Manufacturing Method Hereinafter, a wafer manufacturing method according to this embodiment will be described.

[0061] The method for producing a wafer of this embodiment includes a peeling step of irradiating a structure including a support member, a cured film of the temporary fixing composition of this embodiment, and a wafer in this order with a UV laser having a wavelength of 300 nm or more and 385 nm or less from the support member side to decompose at least a part of the cured film of the temporary fixing composition, thereby generating carbon particles and peeling the wafer from the support member.

[0062] As described above, by using the temporary fixing composition of the present embodiment, re-fixing between the support member and the wafer is suppressed, and therefore, even if a certain amount of time passes between light irradiation such as UV laser irradiation and peeling, a decrease in workability is suppressed.

[0063] From the viewpoint of further suppressing re-adhesion, the spot diameter of the UV laser in the peeling step is preferably 60 μm or more and 240 μm or less, more preferably 70 μm or more and 230 μm or less, even more preferably 80 μm or more and 220 μm or less, and even more preferably 90 μm or more and 210 μm or less.

[0064] From the viewpoint of further suppressing re-adhesion, the output of the UV laser in the peeling step is preferably 4.1 W or more and 50.0 W or less, more preferably 4.1 W or more and 20.0 W or less, even more preferably 4.1 W or more and 15.0 W or less, and even more preferably 4.2 W or more and 10.0 W or less.

[0065] In the peeling step of this embodiment, the scanning speed of the UV laser is preferably 0.1 m / s or more, more preferably 1.0 m / s or more, even more preferably 2.0 m / s or more, and even more preferably 5.0 m / s or more, from the viewpoint of improving production efficiency, and is preferably 100 m / s or less, more preferably 50 m / s or less, even more preferably 20 m / s or less, and even more preferably 10 m / s or less, from the viewpoint of further suppressing re-adhesion, and is preferably 0.1 m / s or more and 100 m / s or less, more preferably 1.0 m / s or more and 50 m / s or less, even more preferably 2.0 m / s or more and 20 m / s or less, and even more preferably 5.0 m / s or more and 10 m / s or less, from the viewpoint of balancing improvement in production efficiency and suppression of re-adhesion.

[0066] It is preferable that the method for producing a wafer of the present embodiment further includes, before the peeling step, a thinning step of obtaining the structure (a) by thinning the wafer (b) in the structure (b) which includes, in this order, a support member, a cured film of the temporary fixing composition, and the wafer (b).

[0067] The method for producing a wafer according to the present embodiment preferably further includes, before the thinning step, a curing step of irradiating light onto a structure (c) including a support member, a temporary fixing film made of a temporary fixing composition, and a wafer (b) in this order, to cure the temporary fixing film, thereby obtaining a structure (b).

[0068] The thickness of the cured film of this embodiment is preferably 0.1 μm or more and 500 μm or less, more preferably 1.0 μm or more and 200 μm or less, even more preferably 10 μm or more and 100 μm or less, and still more preferably 20 μm or more and 80 μm or less.

[0069] The cured film of this embodiment is preferably a single layer.

[0070] The cumulative amount of light irradiation in the curing step is preferably 1000 mJ / cm from the viewpoint of improving adhesiveness. ２ From the viewpoint of improving productivity, it is preferably 20,000 mJ / cm ２ From the viewpoint of a balance between improving adhesion and improving productivity, it is preferably 1000 mJ / cm or less. ２ More than 10000mJ / cm ２or less, more preferably 3000 mJ / cm ２ More than 8000mJ / cm ２ or less, more preferably 4000 mJ / cm ２ More than 6000mJ / cm ２ The following is the result.

[0071] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations can be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention.

[0072] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0073] Unless otherwise specified, experiments were carried out at 23°C and 50% humidity.

[0074] (Preparation of temporary fixing composition) Each component was mixed at 60°C according to the composition (unit: parts by mass) shown in Tables 1 and 2 below to obtain a temporary fixing composition of each example. The contents of each component are as follows.

[0075] The following was used as the polymerizable component (A) containing (meth)acrylate: A1 (acrylic group-containing polybutyl acrylate represented by the following chemical formula, weight average molecular weight: 72,000)

[0076]

[0077] A-BPEF-2 (9,9-bis[4-(2-acryloyloxyethoxy)phenyl)]fluorene, product name: NK Ester A-BPEF-2, manufactured by Shin-Nakamura Chemical Co., Ltd.) HBPE-4 (ethoxylated hydrogenated bisphenol A diacrylate represented by the following chemical formula, product name: HBPE-4, manufactured by Dai-ichi Kogyo Seiyaku Co., Ltd.)

[0078]

[0079] A-DOD-N (1,10-decanediol diacrylate, product name: A-DOD-N, manufactured by Shin-Nakamura Chemical Co., Ltd.) M-113 (nonylphenol ethylene oxide modified acrylate, number of ethylene oxide groups: 4, product name: Aronix M-113, manufactured by Toagosei Co., Ltd.) ISTA (isostearyl acrylate, product name: ISTA, manufactured by Osaka Organic Chemical Industry Ltd.)

[0080] The following was used as the photoradical polymerization initiator (B): Omnirad 819 (bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, product name: Omnirad 819, manufactured by IGM ResinS).

[0081] The following were used as ultraviolet absorbers (C): RUVA-93 (2-[2-hydroxy-5-[2-(methacryloyloxy)ethyl]phenyl]-2H-benzotriazole, product name: RUVA-93, manufactured by Otsuka Chemical Co., Ltd.) P-66 (2,2'-dihydroxy-4,4'-diacryloyloxybenzophenone, product name: DAINSORB P-66, manufactured by Daiwa Kasei Co., Ltd.)

[0082] (Ratio of Area Where Carbon Particles Are Generated) The ratio of area where carbon particles are generated was determined by the following Method 1. The results are shown in Tables 1 and 2 below. Microscopic images of Example 1 and Comparative Example 3 are shown in FIGS. 1 and 2. (Method 1) A disk-shaped silicon wafer (manufactured by Silicon Technology, surface: mirror finish, conductive type: P-type, diameter 150 mm x thickness 625 μm) and a disk-shaped glass support member (product name: Tempax Glass, manufactured by OPC Corporation, diameter 150 mm x thickness 700 μm) were bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm x thickness 50 μm) made of a temporary fixing composition between them. Next, a UV-LED (device name: LPDCJ1A-48102W, manufactured by Altec, illuminance 100 mW / cm) with a wavelength of 405 nm was applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) was irradiated onto the temporary fixed film from the glass support member side, thereby curing the temporary fixed film and obtaining a cured film. Next, the obtained cured film was irradiated from the glass support member side with a UV laser (apparatus name: TWD-D3000, manufactured by Tatsumo Co., Ltd., YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm so as to scan the entire cured film. Next, the glass support member was peeled off from the silicon wafer, and the cured film side surface in the center portion of the glass support member was observed and photographed at 20x magnification using an optical microscope (apparatus name: MX-63L, manufactured by Evident Co., Ltd.). The area (%) of the black portion per field of view, where the area of ​​one field of view (200 μm × 200 μm) is taken as 100%, was calculated using image processing software (product name: Fiji, manufactured by the National Institutes of Health, USA) and was defined as the area (%) of carbon particle generation.

[0083] (Viscosity) Using an E-type viscometer (device name: DVNXHBCBG, manufactured by Brookfield, cone part number: CPA-40Z, rotation speed: 10 rpm), the viscosity was measured at a temperature of 23°C and a shear rate of 75 s －１ The viscosity of the temporary fixing composition was measured at 100°C. The results are shown in Tables 1 and 2 below.

[0084] (Transmittance of laser with wavelength of 355 nm) The transmittance of the temporary fixing composition to a laser with a wavelength of 355 nm was determined by the following Method 2. The results are shown in Tables 1 and 2 below. (Method 2) Two rectangular Tempax glass sheets (33 mm x 50 mm, thickness 700 μm) were prepared, 0.1 g of the temporary fixing composition was dropped onto one of them, and the two sheets were sandwiched together with the other. Next, the obtained laminate was irradiated with a UV-LED (device name: LPDCJ1A-48102W, manufactured by Altec, illuminance 100 mW / cm) with a wavelength of 405 nm under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２), the temporary fixing composition was cured, and a test piece for transmittance measurement was obtained. Next, the transmittance of the obtained test piece for transmittance measurement was measured using a spectrophotometer (device name: UV-2550, manufactured by Shimadzu Corporation) at a pitch of 1.0 nm and in a wavelength range of 300 to 800 nm. Next, the transmittance at a wavelength of 355 nm was read from the obtained transmittance data and used as the transmittance at a wavelength of 355 nm. Prior to the transmittance measurement, two rectangular Tempax glass sheets (33 mm x 50 mm, thickness 700 μm) were prepared, 0.1 g of water was dropped onto one of them, and the other was sandwiched between them to obtain a test piece for baseline measurement. The baseline of the spectrophotometer was measured using the obtained test piece for baseline measurement.

[0085] (Peel strength immediately after laser irradiation P １ ) Peel strength P immediately after laser irradiation by the following method 3 １ The peel strength was determined. The results are shown in Tables 1 and 2 below. The apparatus used to measure the peel strength is shown in Figure 3. (Method 3) A disk-shaped silicon wafer (manufactured by Silicon Technology Co., Ltd., surface: mirror finish, conductive type: P-type, diameter 150 mm x thickness 625 µm) and a disk-shaped glass support member (product name: Tempax Glass, manufactured by OPC Corporation, diameter 150 mm x thickness 700 µm) were bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm x thickness 50 µm) made of a temporary fixing composition between them. Next, a UV-LED with a wavelength of 405 nm (illuminance 100 mW / cm) was applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) was irradiated onto the temporary fixing film from the glass support member side, thereby curing the temporary fixing film and obtaining a cured film. Next, a UV laser (device name: TWD-D3000, manufactured by Tatsumo Co., Ltd., YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm was irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate was placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the adsorption arm was pulled vertically upward at a speed of 0.5 mm / sec, the glass support member was peeled off, and the load applied to the adsorption arm when the glass support member was lifted was measured, and the peel strength P １ (N).

[0086] (Peel strength P 10 minutes after laser irradiation is completed ２ ) Peel strength P 10 minutes after completion of laser irradiation by the following method 4 ２ was determined. The results are shown in Tables 1 and 2 below. (Method 4) A disk-shaped silicon wafer (manufactured by Silicon Technology Co., Ltd., surface: mirror finish, conduction type: P-type, diameter 150 mm x thickness 625 μm) and a disk-shaped glass support member (product name: Tempax Glass, manufactured by OPC Corporation, diameter 150 mm x thickness 700 μm) were bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm x thickness 50 μm) made of the temporary fixing composition between them. Next, a UV-LED with a wavelength of 405 nm (illuminance 100 mW / cm) was applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) was irradiated onto the temporary fixing film from the glass support member side, thereby curing the temporary fixing film and obtaining a cured film. Next, a UV laser (device name: TWD-D3000, manufactured by Tatsumo Co., Ltd., YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm was irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, 10 minutes after the completion of the UV laser irradiation, the obtained laminate was placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the adsorption arm was pulled up vertically at a speed of 0.5 mm / sec, the glass support member was peeled off, and the load applied to the adsorption arm when the glass support member was lifted was measured, and the peel strength P ２ (N).

[0087] (P ２ / P １ ) Peel strength P immediately after laser irradiation by the following method 5 １ Peel strength P after 10 minutes of laser irradiation ２ The ratio (P ２ / P １ ) was determined. The results are shown in Tables 1 and 2 below. (Method 5) A disk-shaped silicon wafer (manufactured by Silicon Technology Co., Ltd., surface: mirror finish, conduction type: P-type, diameter 150 mm x thickness 625 μm) and a disk-shaped glass support member (product name: Tempax Glass, manufactured by OPC Corporation, diameter 150 mm x thickness 700 μm) were bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm x thickness 50 μm) made of the temporary fixing composition between them. Next, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm was applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２) was irradiated onto the temporary fixing film from the glass support member side, thereby curing the temporary fixing film and obtaining a cured film. Next, a UV laser (device name: TWD-D3000, manufactured by Tatsumo Co., Ltd., YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm was irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate was placed and fixed on an adsorption table with the silicon wafer side facing down, and an adsorption arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the adsorption arm was pulled vertically upward at a speed of 0.5 mm / sec, the glass support member was peeled off, and the load applied to the adsorption arm when the glass support member was lifted was measured, and the peel strength P １ Next, a laminate was obtained under the same conditions as above, and 10 minutes after the completion of the UV laser irradiation, the obtained laminate was placed and fixed on a suction table with the silicon wafer side facing downwards, and a suction arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the suction arm was vertically pulled upward at a speed of 0.5 mm / sec to peel off the glass support member, and the load applied to the suction arm when the glass support member was lifted was measured, and the peel strength P ２ (N). P calculated by the above method １ and P ２ From P ２ / P １ was calculated.

[0088] (Inhibition of Re-sticking) The inhibition of re-sticking was evaluated on a three-point scale from A to C according to the following evaluation criteria. The results are shown in Tables 1 and 2 below. A: P １ and P ２ is 30.0N or less and P ２ / P １ is 2.0 or less B:P １ and P ２ is 30.0N or less and P ２ / P １ is greater than 2.0 C:P １ and / or P ２ exceeds 20.0 N or peeling is not possible

[0089]

[0090]

[0091] The temporary fixing compositions of the examples were evaluated as having good re-sticking inhibition according to the above-mentioned evaluation criteria. That is, the temporary fixing compositions of the examples inhibited re-sticking between the wafer and the support member after a certain time had elapsed since the laser irradiation. This shows that the temporary fixing composition of the present embodiment can inhibit re-sticking between the wafer and the support member after a certain time had elapsed since the laser irradiation.

[0092] This application claims priority based on Japanese Patent Application No. 2024-050950, filed March 27, 2024, the disclosure of which is incorporated herein by reference in its entirety.

Claims

1. A temporary fixing composition comprising a polymerizable component (A) containing a (meth)acrylate, a photoradical polymerization initiator (B), and an ultraviolet absorber (C), wherein the ratio of the area where carbon particles are generated by the following method 1 is 0.50% or more. (Method 1) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, the silicon wafer and the glass support member are bonded together by applying a UV-LED (100 mW / cm irradiance) with a wavelength of 405 nm under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, the obtained cured film is irradiated from the glass support member side with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the cured film side in the center part of the glass support member is observed and photographed using an optical microscope at 20x magnification. The area (%) of the black part per field of view (200 μm × 200 μm) is calculated using image processing software, and this is the area (%) of carbon particle generation.

2. The temporary fixing composition according to claim 1, wherein the carbon particles include carbon black.

3. The temporary fixing composition according to claim 1 or 2, wherein the content of carbon particles in the temporary fixing composition is 1.0 mass % or less.

4. The temporary fixing composition according to claim 1 or 2, wherein the photoradical polymerization initiator (B) comprises one or more selected from the group consisting of bis(2,4,6-trimethylbenzoyl)phenylphosphine oxide, and 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone 1-(O-acetyloxime).

5. A temporary fixing composition according to claim 1 or 2, wherein the ultraviolet absorber (C) has one or more skeletons selected from the group consisting of a benzophenone skeleton, a triazole skeleton, a hydroxyphenyltriazine skeleton, and a phenol skeleton.

6. The temporary fixing composition according to claim 1 or 2, wherein the ultraviolet absorber (C) has a polymerizable functional group.

7. The temporary fixing composition according to claim 6, wherein the polymerizable functional group is present at the end of the ultraviolet absorber (C).

8. The temporary fixing composition according to claim 6, wherein the polymerizable functional group includes a (meth)acryloyl group.

9. A temporary fixing composition according to claim 1 or 2, wherein the content of the ultraviolet absorber (C) is 0.1 parts by mass or more and 20 parts by mass or less per 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate.

10. A temporary fixing composition according to claim 1 or 2, wherein the content of the polymerizable component (A) containing the (meth)acrylate is 50% by mass or more and 99% by mass or less, relative to 100% by mass of the temporary fixing composition.

11. A temporary fixing composition according to claim 1 or 2, wherein the content of the photoradical polymerization initiator (B) is 0.1 parts by mass or more and 10 parts by mass or less per 100 parts by mass of the polymerizable component (A) containing the (meth)acrylate.

12. A temporary fixing composition according to claim 1 or 2, wherein the polymerizable component (A) containing the (meth)acrylate contains one or more selected from the group consisting of monofunctional (meth)acrylates and bifunctional (meth)acrylates.

13. The temporary fixing composition according to claim 1 or 2, wherein the polymerizable component (A) containing the (meth)acrylate contains one or more selected from the group consisting of monofunctional alkyl (meth)acrylates having an alkyl group, aromatic (meth)acrylates, alicyclic bifunctional (meth)acrylates, and acyclic bifunctional (meth)acrylates.

14. The aromatic (meth)acrylate is 9,9-bis[4-(2-hydroxy C １ ~C ２０ 9,9-bis[4-(2-(meth)acryloyloxy)phenyl]fluorene di (meth)acrylate, １ ~C ２０ alkoxy)phenyl)]fluorene, C １ ~C ２０ Alkoxylated bisphenol A di(meth)acrylate, benzyl di(meth)acrylate, 1,3-bis(2-(meth)acryloyloxy C １ ~C ２０ The temporary fixing composition according to claim 13, comprising one or more selected from the group consisting of 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, 2,2-bis(4-(meth)acryloxydiethoxyphenyl)propane, nonylphenol ethylene oxide-modified (meth)acrylate, and structural isomers thereof.

15. Using an E-type viscometer, the temperature is 23°C and the shear rate is 75 s －１ The temporary fixing composition according to claim 1 or 2, wherein the viscosity of the temporary fixing composition measured by a .times. ...

16. The temporary fixing composition according to claim 1 or 2, which has a transmittance of 10.0% or less for a laser with a wavelength of 355 nm when the following method 2 is carried out. (Method 2) Two rectangular Tempax glass sheets (33 mm x 50 mm, 700 µm thick) were prepared, 0.1 g of the temporary fixing composition was dropped onto one of them, and the two sheets were sandwiched together. Next, the obtained laminate was irradiated with a UV-LED having a wavelength of 405 nm (illuminance 100 mW / cm) under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) to cure the temporary fixing composition, thereby obtaining a test piece for transmittance measurement. Next, the transmittance of the obtained test piece for transmittance measurement is measured using a spectrophotometer at a pitch of 1.0 nm and in a wavelength range of 300 to 800 nm. Next, the transmittance at a wavelength of 355 nm is read from the obtained transmittance data, and this is defined as the transmittance at a wavelength of 355 nm.

17. Peel strength P immediately after laser irradiation using method 3 below １ The temporary fixing composition according to claim 1 or 2, wherein the strength is 0.01 N or more and 30.0 N or less. (Method 3) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm × thickness 50 μm) made of the temporary fixing composition between the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is vertically pulled upward at a speed of 0.5 mm / sec to peel the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ Let (N).

18. Peel strength P 10 minutes after completion of laser irradiation according to Method 4 below ２ The temporary fixing composition according to claim 1 or 2, wherein the strength is 0.01 N or more and 50.0 N or less. (Method 4) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped temporary fixing film (diameter 150 mm × thickness 50 μm) made of the temporary fixing composition between the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, 10 minutes after the completion of the UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is pulled vertically upward at a speed of 0.5 mm / sec to peel off the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P ２ Let (N).

19. Peel strength P immediately after laser irradiation using method 5 below １ Peel strength P after 10 minutes of laser irradiation ２ The ratio (P ２ / P １ ) is 2.0 or less. (Method 5) A disk-shaped temporary fixing film (150 mm diameter x 50 μm thickness) made of the temporary fixing composition is applied between a disk-shaped silicon wafer (150 mm diameter x 625 μm thickness) and a disk-shaped glass support member (150 mm diameter x 700 μm thickness), thereby bonding the silicon wafer and the glass support member. Next, a UV-LED (illuminance 100 mW / cm) having a wavelength of 405 nm is applied to the silicon wafer and the glass support member under a nitrogen atmosphere. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the temporary fixing film from the glass support member side to harden the temporary fixing film, thereby obtaining a cured film. Next, a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) with a wavelength of 355 nm is irradiated onto the obtained cured film from the glass support member side so as to scan the entire cured film, thereby obtaining a laminate. Next, within 1 minute after the end of UV laser irradiation, the obtained laminate is placed on an adsorption table with the silicon wafer side facing down and fixed, and an adsorption arm equipped with three suction cups with a diameter of 10 mm is attached to the glass support member, and the adsorption arm is vertically pulled upward at a speed of 0.5 mm / sec to peel the glass support member, and the load applied to the adsorption arm when the glass support member is lifted is measured, and the peel strength P １ Let (N). Next, a laminate was obtained under the same conditions as above, and 10 minutes after the completion of the UV laser irradiation, the obtained laminate was placed and fixed on a suction table with the silicon wafer side facing downwards. A suction arm equipped with three suction cups with a diameter of 10 mm was attached to the glass support member, and the suction arm was vertically pulled upward at a speed of 0.5 mm / sec to peel off the glass support member. The load applied to the suction arm when the glass support member was lifted was measured, and the peel strength P ２ Let (N). P calculated by the above method １ and P ２ From P ２ / P １ Calculate.

20. The temporary fixing composition according to claim 1 or 2, which is capable of temporarily fixing a support member and a wafer.

21. The temporary fixing composition according to claim 20, wherein the support member comprises a glass support member.

22. The temporary fixing composition according to claim 20, wherein the wafer comprises a semiconductor wafer.

23. A method for manufacturing a wafer, comprising a peeling step of irradiating a structure comprising, in this order, a support member, a cured film of the temporary fixing composition according to claim 1 or 2, and a wafer with a UV laser having a wavelength of 300 nm or more and 385 nm or less from the support member side to decompose at least a portion of the cured film of the temporary fixing composition, thereby generating carbon particles and peeling the wafer from the support member.

24. A composition comprising a polymerizable component (A), a polymerization initiator (B), and an ultraviolet absorber (C), wherein the ratio of the area where carbon particles are generated by the following method 1 is 0.50% or more. (Method 1) A disk-shaped silicon wafer (diameter 150 mm × thickness 625 μm) and a disk-shaped glass support member (diameter 150 mm × thickness 700 μm) are bonded to each other by applying a disk-shaped film (diameter 150 mm × thickness 50 μm) made of the composition between the silicon wafer and the glass support member. Next, in a nitrogen atmosphere, a UV-LED (illuminance 100 mW / cm) with a wavelength of 405 nm is applied to the silicon wafer. ２ , irradiation time 50 seconds, cumulative light amount 5000 mJ / cm ２ ) is irradiated onto the film from the glass support member side to cure the film, thereby obtaining a cured film. Next, from the glass support member side, the obtained cured film is irradiated with a UV laser (YAG laser, output 6.5 W, spot diameter 150 μm, irradiation pitch 200 μm, scan speed 8 m / sec, frequency 40 kHz) having a wavelength of 355 nm, so as to scan the entire cured film. Next, the glass support member is peeled off from the silicon wafer, and the surface of the cured film side in the center part of the glass support member is observed and photographed using an optical microscope at 20x magnification. When the area of ​​one visual field (200 μm × 200 μm) is taken as 100%, the area (%) of the black part per visual field is calculated using image processing software, and this is the area (%) of carbon particle generation.

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