Device and system for heat redemption

Abstract

In one aspect, the disclosure relates to devices and systems for heat redemption. The devices and systems can comprise a plate, at least one pair of thermoelectric legs, and a connective housing. This abstract is intended as a scanning tool for purposes of searching in the particular art and is not intended to be limiting of the present disclosure.

Description

DEVICE AND SYSTEM FOR HEAT REDEMPTIONCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This Application claims the benefit of and priority to U.S. Provisional Application No. 63 / 570,539, filed on March 27, 2024, which is incorporated herein by reference in its entirety.BACKGROUND

[0002] As urban areas, such as cities, become more densely populated, every inch of space within the urban area is coveted. Urban areas have undergone significant development, with natural terrain such as grasslands and forests being replaced with man-made environments such as pavements, exposed soils, and concrete. The result of this is that the landscape in an urban area does not as effectively dissipate heat accumulated throughout the day. The accumulation of heat can create a Heat Island Effect (HIE) in a densely developed region. This results in urban areas being subjected to unnaturally high temperatures, particularly during hot seasons of the year. High temperatures can be dangerous for those living and traveling within the urban areas and can put strain on an urban areas electrical grid. Despite advances in heat dissipating technology research, there remains a need for devices and systems that can aid in reducing temperatures caused by the HIE and also aid in reducing the strain on municipal systems, such as the electric grid, in an urban setting.SUMMARY

[0003] In accordance with the purpose(s) of the disclosure, as embodied and broadly described herein, the disclosure, in one aspect, relates to a device (e.g., a heat redemption device), comprising: a plate, comprising a first surface and a second surface; at least one pair of thermoelectric legs, each individual leg of the pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the pair of thermoelectric legs is configured to be in contact with the second surface of the plate; and a connective housing, configured to encase at least each individual second end of each leg of the pair of thermoelectric legs; wherein the plate comprises a thermally conductive material; wherein the pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the connective housing comprises a thermally conductive material and is electrically insulating.

[0004] In another aspect, the disclosure relates to a system (e.g., a heat redemption system) comprising: a first thermoelectric module, comprising: a first plate, comprising a first surface and a second surface; at least one first pair of thermoelectric legs, each individual leg of the first pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the first pair of thermoelectric legs is configured to be incontact with the second surface of the first plate; and a first connective housing, configured to encase at least each individual second end of each leg of the first pair of thermoelectric legs; a second thermoelectric module, configured to be in electrical communication with the first thermoelectric module, comprising: a second plate, comprising a first surface and a second surface; at least one second pair of thermoelectric legs, each individual leg of the second pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the second pair of thermoelectric legs is configured to be in contact with the second surface of the first plate; and a second connective housing, configured to encase at least each individual second end of each leg of the second pair of thermoelectric legs; and a power storage, wherein the power storage is configured to be in electrical communication with the first thermoelectric module and the second thermoelectric module; wherein the first plate and the second plate individually comprise a thermally conductive material; wherein the first pair of thermoelectric legs comprise an n-type leg and a p-type leg; wherein the second pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the first connective housing and the second connective housing individually comprise a thermally conductive material and are electrically insulating.

[0005] In another aspect, the disclosure relates to a system (e.g., an extended heat redemption system) comprising a first slat, comprising at least two heat redemption devices as disclosed herein; a second slat, comprising at least two heat redemption devices as disclosed herein, wherein the second slat is configured to be in electrical communication with the first slat; and a power storage, wherein the power storage is configured to be in electrical communication with the first slat and the second slat.

[0006] Other systems, methods, features, and advantages of the present disclosure will be or become apparent to one with skill in the art upon examination of the following drawings and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the present disclosure, and be protected by the accompanying claims. In addition, all optional and preferred features and modifications of the described aspects are usable in all aspects of the disclosure taught herein. Furthermore, the individual features of the dependent claims, as well as all optional and preferred features and modifications of the described aspects are combinable and interchangeable with one another.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Further aspects of the present disclosure will be more readily appreciated upon review of the detailed description of its various embodiments, described below, when taken in conjunction with the accompanying drawings. The components in the drawings are notnecessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure.

[0008] FIG. 1 shows an illustration of a control study setup.

[0009] FIG. 2 shows a picture of a control study setup.

[0010] FIGs. 3A-3D shows the dimensions of slab A (FIG. 3A) used for prototype testing and slabs B (FIG. 3B), C (FIG. 3C), and D (FIG. 3D) used for asphalt thermal conductivity testing.

[0011] FIG. 4 shows a front view of the asphalt conductivity testing apparatus.

[0012] FIG. 5 shows a bottom view of the asphalt conductivity testing apparatus, where wooden supports for asphalt slabs B, C, and D are visible.

[0013] FIG. 6 shows an inside view of the asphalt conductivity testing apparatus when the heat lamp is turned on.

[0014] FIG. 7 shows AT over time of asphalt slabs B, C, and D.

[0015] FIG. 8 shows the heat lag of asphalt slabs B, C, and D.

[0016] FIG. 9A shows the diamond drill bit and water used to drill 4” holes in slab A.

[0017] FIG. 9B shows slab A, cleaned and dried, with six 4” holes.

[0018] FIG. 10A shows the process of sanding down thermocouple wire using a spindle sander.

[0019] FIG. 10B shows a point of contact between the sanded thermocouple wire pair.

[0020] FIG. 11 shows a front view of the second prototype.

[0021] FIGs. 12A-12B show the performance of the second prototype comparing voltage (FIG. 10A) and current (FIG. 10B) response to changes in AT.

[0022] FIGs. 13A-13B show a road thermoelectric generator (rTEG) prototype pipe manifold schematic.

[0023] FIGs. 14A-14C show an rTEG prototype cold-side pipe manifold schematic.

[0024] FIG. 15 shows an example diagram of a heat redemption system according to various embodiments of the present disclosure.

[0025] FIG. 16 shows an example diagram of a heat redemption device according to various embodiments of the present disclosure.

[0026] FIG. 17 shows an alternate view of a heat redemption system according to various embodiments of the present disclosure.

[0027] FIG. 18 shows an example diagram of a heat redemption system placed within surface infrastructure according to various embodiments of the present disclosure.

[0028] Additionally, further aspects of the present disclosure can be better understood with reference to Appendix A, which follows hereafter. The components in the drawings are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure. Appendix A is hereby incorporated by reference in its entirety.DETAILED DESCRIPTION

[0029] This disclosure is not limited to particular embodiments described, and as such may, of course, vary. The terminology used herein serves the purpose of describing particular embodiments only, and is not intended to be limiting, since the scope of the present disclosure will be limited only by the appended claims.

[0030] Where a range of values is provided, each intervening value, to the tenth of the unit of the lower limit unless the context clearly dictates otherwise, between the upper and lower limit of that range and any other stated or intervening value in that stated range, is encompassed within the disclosure. The upper and lower limits of these smaller ranges may independently be included in the smaller ranges and are also encompassed within the disclosure, subject to any specifically excluded limit in the stated range. Where the stated range includes one or both of the limits, ranges excluding either or both of those included limits are also included in the disclosure.

[0031] Embodiments of the present disclosure will employ, unless otherwise indicated, techniques of chemistry, material science, hydraulic binders, and the like, which are within the skill of the art. Such techniques are explained fully in the literature.

[0032] The following examples are put forth so as to provide those of ordinary skill in the art with a complete disclosure and description of how to perform the methods and use the compositions and compounds disclosed and claimed herein. Efforts have been made to ensure accuracy with respect to numbers (e.g., amounts, temperature, etc.), but some errors and deviations should be accounted for. Unless indicated otherwise, parts are parts by weight, temperature is in °C, and pressure is at or near atmospheric. Standard temperature and pressure are defined as 20 °C and 1 atmosphere.

[0033] It should be noted that ratios, concentrations, amounts, and other numerical data may be expressed herein in a range format. It is to be understood that such a range format is used for convenience and brevity, and thus, should be interpreted in a flexible manner to include not only the numerical values explicitly recited as the limits of the range, but also to include all the individual numerical values or sub-ranges encompassed within that range as if each numerical value and sub-range is explicitly recited. To illustrate, a concentration range of“about 0.1 percent to about 5 percent” should be interpreted to include not only the explicitly recited concentration of about 0.1 weight percent to about 5 weight percent but also include individual concentrations (e.g., 1 percent, 2 percent, 3 percent, and 4 percent) and the subranges (e.g., 0.5 percent, 1.1 percent, 2.2 percent, 3.3 percent, and 4.4 percent) within the indicated range. The term “about” can include traditional rounding according to significant figures of the numerical value. In addition, the phrase “about ‘x’ to ‘y’” includes “about ‘x’ to about ‘y’”.

[0034] Furthermore, the terms “about”, “approximate”, “at or about”, and “substantially” as used herein mean that the amount or value in question can be the exact value or a value that provides equivalent results or effects as recited in the claims or taught herein. That is, it is understood that amounts, sizes, formulations, parameters, and other quantities and characteristics are not and need not be exact, but may be approximate and / or larger or smaller, as desired, reflecting tolerances, conversion factors, rounding off, measurement error and the like, and other factors known to those of skill in the art such that equivalent results or effects are obtained. In some circumstances, the value that provides equivalent results or effects cannot be reasonably determined. In such cases, it is generally understood, as used herein, that “about” and “at or about” mean the nominal value indicated ±10% variation unless otherwise indicated or inferred. In general, an amount, size, formulation, parameter or other quantity or characteristic is “about,” “approximate,” or “at or about” whether or not expressly stated to be such. It is understood that where “about,” “approximate,” or “at or about” is used before a quantitative value, the parameter also includes the specific quantitative value itself, unless specifically stated otherwise.

[0035] Before the embodiments of the present disclosure are described in detail, it is to be understood that, unless otherwise indicated, the present disclosure is not limited to particular materials, reagents, reaction materials, manufacturing processes, dimensions, frequency ranges, applications, or the like, as such can vary. It is also to be understood that the terminology used herein is for purposes of describing particular embodiments only, and is not intended to be limiting. It is also possible in the present disclosure that steps can be executed in different sequence, where this is logically possible. It is also possible that the embodiments of the present disclosure can be applied to additional embodiments involving measurements beyond the examples described herein, which are not intended to be limiting. It is furthermore possible that the embodiments of the present disclosure can be combined or integrated with other measurement techniques beyond the examples described herein, which are not intended to be limiting.

[0036] It should be noted that, as used in the specification and the appended claims, the singular forms “a,” “an,” and “the” include plural referents unless the context clearly dictatesotherwise. Thus, for example, reference to “a support” includes a plurality of supports. In this specification and in the claims that follow, reference will be made to a number of terms that shall be defined to have the following meanings unless a contrary intention is apparent.

[0037] Each of the applications and patents cited in this text, as well as each document or reference cited in each of the applications and patents (including during the prosecution of each issued patent; ‘‘application cited documents”), and each of the PCT and foreign applications or patents corresponding to and / or claiming priority from any of these applications and patents, and each of the documents cited or referenced in each of the application cited documents, are hereby expressly incorporated herein by reference. Further, documents or references cited in this text, in a Reference List before the claims, or in the text itself; and each of these documents or references (“herein cited references”), as well as each document or reference cited in each of the herein-cited references (including any manufacturer’s specifications, instructions, etc.) are hereby expressly incorporated herein by reference.

[0038] Prior to describing the various embodiments, the following definitions are provided and should be used unless otherwise indicated.A. Definitions

[0001] As used herein, “comprising” is to be interpreted as specifying the presence of the stated features, integers, steps, or components as referred to, but does not preclude the presence or addition of one or more features, integers, steps, or components, or groups thereof. Moreover, each of the terms “by”, “comprising,” “comprises”, “comprised of,” “including,” “includes,” “included,” “involving,” “involves,” “involved,” and “such as” are used in their open, non-limiting sense and may be used interchangeably. Further, the term “comprising” is intended to include examples and aspects encompassed by the terms “consisting essentially of’ and “consisting of.” Similarly, the term “consisting essentially of’ is intended to include examples encompassed by the term “consisting of.

[0002] As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Expressions such as “at least one of,” when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list.

[0039] As used herein, “subgrade” refers to the native material underneath a constructed surface of a road, sidewalk, railway track, parking lot, race-car track, airport runway, or other constructed ground surfaces or surface infrastructure. Subgrade can include soil, rock, water, minerals, sand, combinations thereof, and the like.

[0040] As used herein, “surface infrastructure” refers to a constructed surface built on top of natural ground surfaces or other constructed surfaces. Examples of surface infrastructureinclude road, parking, transportation and / or walkway infrastructure, such as roadways, streets, highways, sidewalks, railway tracks, parking lots, race-car tracks, airport runways, and the like. Surface infrastructure is used to refer to both the surface layer or top layer of the surface infrastructure and any lower layers that make up the constructed structure.B. Discussion

[0041] Heat islands are urban areas that experience higher temperatures than surrounding rural areas due to buildings, roads, and other built infrastructures absorbing and re-emitting the sun’s heat more than natural landscapes do. In comparison to the natural sediment and foliage coverage that predated modern development, modern structural and paving materials are significantly less reflective and more absorbent of solar radiation. These materials also have significant thermal capacities. Higher temperatures experienced in these areas are detrimental to public health, thermal comfort, and sustainable energy usage. Road, parking, and walkway infrastructure is a major contributor to heat islands. One approach to addressing this anthropogenic warming is the use of supplementary technologies that can dissipate the accumulated thermal energy and / or make productive use of the energy.

[0042] Potential functional characteristics of a system that can make use of heat in heat islands are: the capability to remove some thermal energy from the infrastructure, such as from pavement, resiliency (long lifespan), and capability to generate usable power. Conventional thermoelectric generators have the potential to satisfy all three of these functional requirements. For example, by embedding thermoelectric generators (TEGs) in the asphalt pavement, the difference in temperature of the hot surface pavement and the deeper, cooler pavement or layers can be utilized to generate a current.

[0043] The underlying principle of TEG cooling, in one aspect, can be described based on the Seebeck effect (also known as the Peltier-Seebeck effect). This effect describes how a temperature gradient in metals and semiconductors can generate an electromotive force, as charge carriers on the hotter side move towards the colder side. When combining two different thermoelectric materials, a positive charge carrying and a negative charge carrying, a thermocouple is formed. When exposing the two opposite connection interfaces of the thermocouple to a temperature differential, a direct current is generated. By wiring multiple thermocouples together, a thermopile is formed; here it is possible to multiply the net electromotive force by wiring these pairs of wires in series. A conventional TEG cell is an optimized arrangement of thermopiles, designed specifically for generating power directly from a heat differential.

[0044] Existing TEG designs, however, have not been optimized for urban scale. Three things that can be considered for an urban scale are: cost, durability, and the temperature gradientalong the depth dimension of the paved surface. To increase cost efficiency, while preserving durability, the disclosed systems and devices use relatively cheap thermal conducting sheeting, such as metal, to cover as much surface area of the road as possible. By connecting the thermal conductors onto the upper connection of the thermocouple wires, a more efficient means of distributing the cooling of the asphalt surface is created.

[0045] The present disclosure, in one aspect, provides for devices and systems for heat recovery or redemption from areas or structures that are significant sources of heat. Any of the devices and systems disclosed herein can be configured to generate and store electricity. Significant sources of heat can include road, parking, and walkway infrastructure such as streets, highways, sidewalks, railway tracks, parking lots, race-car tracks, airport runways, or other man-made surfaces. In one aspect, the device (e.g., a thermoelectric module) takes advantage of a temperature gradient present between an upper layer of surface infrastructure (e.g., pavement in a heat island) and the area or layers beneath the upper layers of the surface infrastructure (e.g., subgrade). The device (e.g., a thermoelectric module) can utilize the temperature gradient to reduce the temperature of the top layer and / or generate electricity.

[0046] FIG. 15 depicts an example heat redemption system 100. The heat redemption system 100 can comprise heat redemption devices 103a-103e (heat redemption devices 103). In one aspect, the heat redemption system can comprise heat redemption devices 103 connected or wired in series with each other (as depicted in FIG. 15) via various components. Alternatively, the heat redemption devices 103 can be wired or connected in parallel. Heat redemption system 100 depicted in FIG. 15 or similar is also referred to as a slat herein. Heat redemption devices 103 can each be comprised of similar materials or materials that function similarly (e.g., different materials that all act as thermally insulating). While the following discussion refers to the heat redemption device 103a for clarity, the discussion is equally applicable to any of the heat redemption devices 103.

[0047] Heat redemption device 103a can comprise a plate 106. Heat redemption device 103a can also comprise a leg housing 109. The leg housing 109 can be thermally insulating, electrically insulating, or a combination thereof. In one aspect, the leg housing 109 can be in contact with, cover, encase, or contain internal electrical components (e.g., legs and / or wires introduced later) and can be configured to prevent damage to the internal electrical components. Heat redemption device 103a can additionally comprise sealed cuff 113. Heat redemption device 103a can further comprise connective housing 116. In one aspect, as depicted in FIG. 15, connective housing 1 16 can continuously extend to be in contact with and / or house some component of each heat redemption device 103a-103e in heat redemption system 100. Connective housing 1 16 can be thermally conductive, electrically insulating, or a combination thereof. In one aspect, the connective housing 116 can be in contact with, cover,encase, or contain internal electrical components (e.g., legs and / or wires as introduced later) and can be configured to prevent damage to the internal electrical components. Connective housing 1 16 can be configured to be in contact with leg housing 109 and / or sealed cuff 113. In another aspect, sealed cuff 1 13 can be in contact with a section where connective housing 116 and leg housing 109 meet. Additionally, heat redemption system 100 can comprise connectivity segments 119a- 119b (connective segments 1 19). Each individual connectivity segment 1 19a-1 19b can be associated with a specific heat redemption device. For example, as depicted in FIG. 15, connectivity segment 1 19a is associated with heat redemption device 103a (e.g., as an electrical input and / or output) and connectivity segment 1 19b is associated with heat redemption device 103e.

[0048] FIG. 16 is a closer view of the heat redemption device 103a of the heat redemption system 100 of FIG. 15. Heat redemption device 103a can have connectivity segments 1 19a and 119c. The heat redemption device 103a can further comprise a leg-plate connection 203. The leg-plate connection 203 can be thermally conductive, electrically conductive, or a combination thereof. Within leg housing 109, there can be leg housing filler material 213. Also within leg housing 109, there can be a pair of thermoelectric legs 206a-206b (pair of thermoelectric legs 206). The pair of thermoelectric legs 206a-206b can include an n-type leg (n-type wire) and a p-type leg (p-type wire). For example, thermoelectric leg 206a can be an n-type leg and thermoelectric leg 206b can be a p-type leg. The thermoelectric legs 206a- 206b can each be surrounded by leg wraps 209a-209b (leg wraps 209). The leg wraps 209a- 209b can be individually electrically insulating, thermally insulating, or a combination thereof. The pair of thermoelectric legs 206a-206b and leg wraps 209a-209b can extend through leg housing 109 into connective housing 1 16. Any one of thermoelectric legs 206a-206b can be configured to connect to or be in contact with a leg of an adjacent heat redemption device at the connectivity segments 1 19a and 119c. For example, thermoelectric leg 206a can be an n- type leg and can be configured to connect to or be in contact with a p-type leg of an adjacent heat redemption device and thermoelectric leg 206b can be an p-type leg and can be configured to connect to or be in contact with a n-type leg of an adjacent heat redemption device (e.g., heat redemption device 103b of heat redemption system 100). FIG. 16 also depicts a break (labeled visual break) in connective housing 116, through which leg wraps 209 can be seen. This break is only intended to provide a view into the inside of connective housing 116 and should not be considered a component of connection housing 116. Regarding plate 106, the leg-plate connection 203 is depicted as electrically connecting thermoelectric legs 206a-206b through the plate. This is merely one possible configuration for the thermoelectric legs 206a-206b and plate 106 contact. In another aspect, the thermoelectric legs 206a-206b can be wired directly together while maintaining contact with plate 106.

[0049] FIG. 17 shows a top-down view of heat redemption system 100 in electrical communication with other heat redemption systems 303a-303b. Previous discussion of heat redemption system 100 is equally applicable to heat redemption systems 303a-303b. FIG. 17 depicts a joining segment 306 which is configured to put heat redemption system 100 in electrical communication with heat redemption system 303a by connecting connectivity segment 119b of heat redemption system 100 to connectivity segment 319a of heat redemption system 303a.

[0050] FIG. 17 depicts heat redemption systems 100, 303a, and 303b connected or wired in series. However, heat redemption systems 100, 303a, and 303b can also be connected or wired in parallel. When the systems are wired in parallel (e.g., wired in parallel to or with a power storage device), loss in functionality of one device or one system will not cause the loss in functionality of the group of systems. The parallel connections can result in a system with balanced current and voltage output.

[0051] In another aspect, disclosed herein is a heat redemption device, such as a thermoelectric module, comprising a plate (e.g., plate 106) made up of a thermally conductive material; at least one pair of thermoelectric legs (e.g., thermoelectric legs 206a-206b), including an n-type leg and a p-type leg, and a connective housing (e.g., connective housing 116), made up of a thermally conductive material and electrically insulated from the surroundings. The plate can comprise a first surface and a second surface, where the first surface is configured to be in contact with a heat source or a heat sink. The pairs of thermoelectric legs can each include a first end and a second end, where the first ends are in contact with the second surface of the plate and the second ends are in contact with and / or at least partially surrounded by the connective housing.

[0052] In one aspect, the thickness of the plate can range from about 0.1 inches to about 1 inch, about 0.1 inches to about 0.8 inches, about 0.1 inches to about 0.6 inches, about 0.1 inches to about 0.4 inches, about 0.3 inches to about 1 inch, about 0.3 inches to about 0.8 inches, or about 0.3 inches to about 0.6 inches. The plate can be made of materials such as iron, aluminum, copper, brass, steel, silicon, carbon, graphite, alloys thereof, or any combination thereof. Additionally, the plate can further include powdered materials such as aluminum nitride, magnesium oxide, and the like, or combinations thereof. The powdered materials can be used in a packed, powdered form. In one aspect, the plate is comprised of materials that are not electrically conductive. In one aspect, the plate is configured to absorb heat from or dispel heat into the surrounding environment. The surrounding environment can be categorized as a heat source or a heat sink. The surrounding environment or heat source can include asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof. In another aspect, the surrounding environment or heat sink can be subgrade and / or includenatural material, such as soil, rock, water, minerals, sand, or a combination thereof. The subgrade may be compacted.

[0053] In one aspect, the legs can individually be comprised of an n-type material and a p- type material. The n-type material can be nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, graphene, graphite, tellurium, bismuth, alloys thereof, or any combination thereof. The p-type material can be nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, lead, phosphorus, zinc, chromium, alloys thereof, or any combination thereof. In one aspect, the thermoelectric legs are individually thermocouple wires of Type K, Type J, Type N, Type T, Type E, Type B, Type R, Type S, or any combinations thereof. In another aspect, the thermoelectric legs comprise a flexible housing (e.g., leg wraps 209a-209b) filled with thermoelectric material in solid (e.g., powder) or liquid form. The thermoelectric legs can also be thermally and electrically insulated from the surrounding environment. Materials that can be used for both thermal and electrical insulation include fiberglass and polytetrafluorethylene.

[0054] In one aspect, the connective housing can be configured to absorb heat from or dispel heat into the surrounding environment. The surrounding environment can be categorized as a heat source or a heat sink. The surrounding environment or heat source can include asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof. In another aspect, the surrounding environment or heat sink can be subgrade and / or include natural material, such as soil, rock, water, minerals, sand, or a combination thereof. The subgrade may be compacted. The housing can be comprised of or filled with a material that is electrically insulating and thermally conductive (e.g., aluminum nitride coated metal or metal powder). In one aspect, the housing is a solid material. The solid material can be thermally conductive and / or electrically insulating. In a further aspect, the connective housing can comprise an additional electrically insulating and / or thermally conductive material, such as an outer layer of material. In one aspect, the connective housing comprises polyvinyl chloride (PVC) or similar material and, optionally, an additional thermally conductive material. The connective housing can comprise additional components that increases its surface area and thus can increase its contact with the surrounding environment. These additional components can include grooves, slits, or cuts that have been molded or cut into the surface of the connective housing. The additional components can also include extended portions of the housing, such as fin-like extensions that stick out from the primary outer surface of the connective housing (e.g., running lengthwise along the connective housing).

[0055] In one aspect, the plate can absorb heat from its surrounding environment while the connective housing can radiate heat into its surrounding environment. This can result in the connective housing portion of the device or system cooler than the upper or plate portion ofthe device or system. This temperature differential between the lower section of the device or system and the upper section of the device or system can result in a temperature differential in the upper section of the thermoelectric legs (which are directly or indirectly in contact with the plate) and lower section of the thermoelectric legs (which are directly or indirectly in contact with the connective housing). This temperature differential can then aid in power generation.

[0056] In another aspect, the heat redemption device can further comprise a leg housing (e.g., leg housing 109). The leg housing can be configured to be electrically insulating from the surrounding environment. The leg housing can encase, surround, cover, or be in contact with the pair of thermoelectric legs between the first ends and the second ends. The leg housing can be in contact with the connective housing. At their connection point, the device can further comprise a sealed cuff (e.g., sealed cuff 113) configured to secure the connection, isolate the connection from any surrounding material, or a combination thereof.

[0057] Also disclosed herein is a heat redemption system including at least two of the heat redemption devices (e.g., thermoelectric modules) in electrical communication with one another and a power storage in electrical communication with the thermoelectric modules. In one aspect, the connective housing of each device can be in contact with the connective housing of an adjacent device. In another aspect, adjacent devices in the system can share the same connective housing. The system can be used to generate and store electricity. Distance between each thermoelectric module in the system can vary, ranging from about 1 inch to about 3 feet, about 1 inch to about 2 feet, about 1 inch to about 1 foot, about 6 inches to about 3 feet, or about 1 foot to about feet as measured between the centers or edges of the plates of the modules. In another aspect, a first leg of a first pair of thermoelectric legs of a first device can be in electrical communication with and / or electrical contact with a second leg of a second pair of thermoelectric legs of a second device, in a similar mannerto that described for FIG. 16. A power storage can be a single device or a system designed to capture and store electricity for later use or release. Examples of types of power storage include electrochemical storage (e.g., batteries), pumped-storage hydropower, thermal energy storage (e.g., using boiling water and steam), flywheel storage, and compressed air storage. The stored power can be used, for example, to power streetlights, stoplights, buildings, kinetic sculptures, water displays (e.g., fountains), or electric billboards.

[0058] Also disclosed herein is an extended heat redemption system (such as that depicted in FIG. 17) including a first heat redemption system in electric communication with a second heat redemption system and a power storage, as disclosed herein, in electric communication with each of the heat redemption systems. Each heat redemption system can be in electrical communication with at least one other heat redemption system (including electrical communication with each other), for example by electrical communication between heatredemption devices of each system (in a manner, for example, as disclosed previously herein). The heat redemption systems can be in electrical communication with one another via the pairs of thermoelectric legs in a series circuit configuration, such as that depicted in FIG. 17, or in a parallel circuit configuration. The heat redemption systems within the extended heat redemption system can also be in electrical communication with the power storage in a series circuit configuration or a parallel circuit configuration.

[0059] Any of the heat redemption systems or devices as disclosed herein can be placed within surface infrastructure. In one aspect, surface infrastructure can be built on top of a natural layer of earth and / or subgrade. Above the natural layer can be a first constructed layer of the surface infrastructure (e.g., a sub-base layer). The first constructed layer can comprise granular or cement-bound materials such as crushed stone, crushed slag, crushed concrete, slate, gravel, or a combination thereof. This layer can be configured for load bearing. In one aspect, this layer may not be needed, such as in areas where heavy loads will not pass over the surface infrastructure (e.g., pedestrian-only walkways). After the first constructed layer or in place of the first constructed layer, there can be a second constructed layer (e.g., base). This second constructed layer can also be configured for load bearing. The second constructed layer can comprise particulate material used such as sand, gravel, crushed stone, concrete, asphalt, or a combination thereof. After the second constructed layer, there can be additional constructed layers. The additional constructed layers can include at least one or at least two primary layers. Primary layers can include layer types such as a surface layer (e.g., surface course, pavers, and the like) that is the top layer of the surface infrastructure. Other primary layers can include an intermediate layer that is located between the top layer and any lower layers, such as a binder course, a paver base, and the like. For asphalt infrastructure (e.g., roadways), and the like, the primary layers can be referred to as lifts. Each lift can be, for example, about 2 inches to about 4 inches thick. The surface infrastructure can include additional layers and materials as known in the art of forming surface infrastructure.

[0060] The connective housing can be buried and / or located in either the subgrade layer or the first constructed layer. In another aspect, the connective housing can be buried and / or located in a lower layer of the surface infrastructure. In another aspect, the connective housing can be buried and / or located in at least one layer of the surface infrastructure lower than the layer the plate is buried and / or located in. Plate(s) of any of the devices or systems disclosed herein can be buried and / or located in either the second constructed layer or any primary layer. When the plate is buried and / or located in a layer below the surface layer, the surface layer can be removed without affecting the operability of the device or system comprising the plate. In another aspect, the plate is not buried and / or located in the surface layer. In anotheraspect, the plate can be buried and / or located in the surface layer and can be optionally not exposed to the environment above the surface layer.

[0061] FIG. 18 depicts the example heat redemption system 100 placed within surface infrastructure. With further reference to FIG. 18, connective housing 1 16 can be located within a sub-base section of surface infrastructure. As an example, during the construction of surface infrastructure, the connective housing can be buried such that the upper section of thermoelectric legs 206a-206b protrude from the layer the connective housing is buried in before it is graded. The legs can also include surrounding electrical insulation and / or thermal insulation. Then, while the layer the connective housing is located in is being evened out, each of the thermoelectric legs 206a-206b can be bent into a loop so that once the legs are indented onto the layer while it's being evened out, the legs can be easily pulled out, such as with a barbed / hooked tool. This can allow for easy cutting of excess wiring or legs of prefabricated devices or systems to whatever appropriate heights are required, despite the natural variances that can occur in the installation process. The plate can then be securely connected to thermoelectric legs and the legs can be fitted into their respective spaces in the plate. Additional layers can then be installed directly on top of the device and / or system.

[0062] In one aspect, the device is buried under or within surface infrastructure. In a further aspect, the plate is the part of the buried device that is closest to the surface. In a further aspect, the top or first surface of the plate is parallel with the top layer of the surface infrastructure. The top or first surface of the plate can be located from about 0.25 inches to about 6 inches beneath the surface of the ground. In another aspect, the top or first surface of the plate is from about 0.25 inches to about 5.5 inches, about 0.5 inches to about 5 inches, about 0.5 inches to about 4 inches, about 0.5 inches to about 3 inches, about 1 inch to about 5 inches, about 2 inches to about 5 inches, or about 2 inches to about 4 inches beneath the surface of the ground. The height or length of the system, from the top or first surface of the plate to the bottom of the housing, can range from about 1 foot to about 6 feet, about 1 foot to about 5 feet, about 1 foot to about 4 feet, about 1 foot to about 3.5 feet, about 1 foot to about 3.0 feet, about 1 foot to about 2.5 feet, about 1 foot to about 2.0 feet, or about 1 .5 feet to about 2.5 feet.

[0063] One arrangement of the thermoelectric devices would have them connected in series (referred to collectively as a slat, e.g., heat redemption system 100 is a slat) running across a surface infrastructure, for example, a road perpendicular to the flow of traffic. Multiple slats could be installed in such a way, adjacent to one another. The slats could then be wired in parallel to a power storage device, the mainline could then be buried or mounted along the side of the road, which could allow for accessible and less obstructive road maintenance. Being wired in parallel could also allow for individual slats to fail independently, such that theefficiency of the whole system decays over the course of sustaining wear and resurfacing damage throughout its service life.

[0064] The use of a disclosed device or system as disclosed herein can have several advantages. In one aspect, the system can be considered a net heat-negative source of renewable energy. When placed within, in, or underneath surface infrastructure, heat can be removed from the surface infrastructure, reducing surface temperatures. The system can be placed far enough below the top layer of surface infrastructure so that typical resurfacing projects would not interfere with the embedded system. The system can be reliable, since the driving force behind is a temperature gradient. The system would also stay active throughout the night, unlike other renewable energy systems such as solar panels.

[0065] While embodiments of the present disclosure are described in connection with the Examples and the corresponding text and figures, there is no intent to limit the disclosure to the embodiments in these descriptions. On the contrary, the intent is to cover all alternatives, modifications, and equivalents included within the spirit and scope of embodiments of the present disclosure.C. Aspects

[0066] The following listing of exemplary aspects supports and is supported by the disclosure provided herein.

[0067] Aspect 1. A device, comprising: a plate, comprising a first surface and a second surface; at least one pair of thermoelectric legs, each individual leg of the pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the pair of thermoelectric legs is configured to be in contact with the second surface of the plate; and a connective housing, configured to encase at least each individual second end of each leg of the pair of thermoelectric legs; wherein the plate comprises a thermally conductive material; wherein the pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the connective housing comprises a thermally conductive material and is electrically insulating.

[0068] Aspect 2. The device of aspect 1 , wherein the plate comprises iron, aluminum, copper, brass, steel, alloys thereof, or any combination thereof.

[0069] Aspect 3. The device of either aspect 1 or aspect 2, wherein the n-type leg comprises nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, graphene, graphite, tellurium, bismuth, alloys thereof, or combinations thereof.

[0070] Aspect 4. The device of any one of aspects 1-3, wherein the p-type leg comprises nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, lead, phosphorus, zinc, chromium, alloys thereof, or combinations thereof.

[0071] Aspect 5. The device of any one of aspects 1-4, wherein the connective housing is configured to be thermally insulating and electrically insulating.

[0072] Aspect 6. The device of any one of aspects 1-5, further comprising a leg housing, wherein the leg housing is configured to encase at least a portion of the pair of thermoelectric legs between the first ends and the second ends and wherein the leg housing is electrically insulating.

[0073] Aspect 7. The device of aspect 6, wherein the leg housing is configured to be in contact with the connective housing.

[0074] Aspect 8. The device of aspect 6 or aspect 7, further comprising a sealed cuff configured to be in contact with both the leg housing and the connective housing.

[0075] Aspect 9. The device of any one of aspects 1-5, wherein the plate is configured to be in contact with first heat source or a first heat sink and wherein the connective housing is configured to be in contact with a second heat source or a second heat sink.

[0076] Aspect 10. The device of aspect 9, wherein the first heat source comprises asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof.

[0077] Aspect 11. The device of aspect 9 or aspect 10, wherein the second heat source comprises asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof.

[0078] Aspect 12. The device of any one of aspects 9-11 , wherein the first heat sink comprises soil, rock, water, minerals, sand, concrete, or a combination thereof.

[0079] Aspect 13. The device of any one of aspects 9-12, wherein the second heat sink comprises soil, rock, water, minerals, sand, concrete, or a combination thereof.

[0080] Aspect 14. The device of any one of aspects 9-13, wherein the plate is configured to be in contact with a first heat source and the connective housing is configured to be in contact with a first heat sink.

[0081] Aspect 15. A system, comprising: a first thermoelectric module, comprising: a first plate, comprising a first surface and a second surface; at least one first pair of thermoelectric legs, each individual leg of the first pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the first pair of thermoelectric legs is configured to be in contact with the second surface of the first plate; and a first connective housing, configured to encase at least each individual second end of each leg of the first pairof thermoelectric legs; a second thermoelectric module, configured to be in electrical communication with the first thermoelectric module, comprising: a second plate, comprising a first surface and a second surface; at least one second pair of thermoelectric legs, each individual leg of the second pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the second pair of thermoelectric legs is configured to be in contact with the second surface of the first plate; and a second connective housing, configured to encase at least each individual second end of each leg of the second pair of thermoelectric legs; and a power storage, wherein the power storage is configured to be in electrical communication with the first thermoelectric module and the second thermoelectric module; wherein the first plate and the second plate individually comprise a thermally conductive material; wherein the first pair of thermoelectric legs comprise an n-type leg and a p-type leg; wherein the second pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the first connective housing and the second connective housing individually comprise a thermally conductive material and are electrically insulating.

[0082] Aspect 16. The system of aspect 15, wherein the first connective housing and the second connective housing comprise a continuous connective housing.

[0083] Aspect 17. The system of aspect 15 or aspect 16, wherein a first thermoelectric leg of the first pair of thermoelectric legs of the first thermoelectric module is in electrical communication with a second thermoelectric leg of the second pair of thermoelectric legs of the second thermoelectric module.

[0084] Aspect 18. The system of any one of aspects 15-17, wherein the power storage comprises electrochemical storage, pumped-storage hydropower, thermal energy storage, flywheel storage, compressed air storage, or a combination thereof.

[0085] Aspect 19. The system of any one of aspects 15-18, wherein the first thermoelectric module and the second thermoelectric module are in electrical communication with one another in a series circuit configuration.

[0086] Aspect 20. A system, comprising: a first slat, comprising at least two thermoelectric modules individually comprising the device of any one of aspects 1-14; a second slat, comprising at least two thermoelectric modules individually comprising the device of any one of aspects 1-14, wherein the second slat is configured to be in electrical communication with the first slat; and a power storage, wherein the power storage is configured to be in electrical communication with the first slat and the second slat.

[0087] Aspect 21 . The system of aspect 20, wherein the first slat and the second slat are in electrical communication with the power storage in a parallel circuit configuration.

[0088] From the foregoing, it will be seen that aspects herein are well adapted to attain all the ends and objects hereinabove set forth together with other advantages which are obvious and which are inherent to the structure.

[0089] While specific elements and steps are discussed in connection to one another, it is understood that any element and / or steps provided herein is contemplated as being combinable with any other elements and / or steps regardless of explicit provision of the same while still being within the scope provided herein.

[0090] It will be understood that certain features and subcombinations are of utility and may be employed without reference to other features and subcombinations. This is contemplated by and is within the scope of the claims.

[0091] Since many possible aspects may be made without departing from the scope thereof, it is to be understood that all matter herein set forth or shown in the accompanying drawings and detailed description is to be interpreted as illustrative and not in a limiting sense.

[0092] It is also to be understood that the terminology used herein is for the purpose of describing particular aspects only, and is not intended to be limiting. The skilled artisan will recognize many variants and adaptations of the aspects described herein. These variants and adaptations are intended to be included in the teachings of this disclosure and to be encompassed by the claims herein.

[0093] Now having described the aspects of the present disclosure, in general, the following Examples describe some additional aspects of the present disclosure. While aspects of the present disclosure are described in connection with the following examples and the corresponding text and figures, there is no intent to limit aspects of the present disclosure to this description. On the contrary, the intent is to cover all alternatives, modifications, and equivalents included within the spirit and scope of the present disclosure.D. Example 1

[0094] Heat islands are urban areas that experience higher temperatures than surrounding rural areas as an effect of buildings, roads, and other built infrastructures absorbing and reemitting the sun’s heat more than natural landscapes do. Higher temperatures experienced in these areas are detrimental to public health, thermal comfort, and sustainable energy usage. Road infrastructure is a major contributor to heat islands. By embedding thermocouple generators (TEGs) in series in the asphalt pavement, the difference in temperature of the hot surface pavement and the deeper, cooler pavement can be utilized to generate a current. Along with decreasing surface asphalt temperatures, this setup can convert thermal energy in the pavement into electricity. A TEG can include a heat exchanger (or hot side), a cold side, and thermoelectric leg pairs connecting the hot side with the cold side. In one aspect, a heatexchanger cab absorb heat from pavement, reducing asphalt surface temperatures, and the temperature difference between the heat exchanger and the cold side, connected via the thermoelectric legs, can create a voltage potential and generate an electrical current.

[0095] Unlike other anthropogenically caused pandemics, such as CO2pollution, the heat island effect is nearly impossible to ignore. Walking through metropolitan cities in the dead of summer can be unbearable during the day, and at night the pavement and structures continue to emanate heat that they have accumulated during the day. With comparison to the natural sediment and foliage coverage that predated development, modern structural and paving materials are significantly less reflective and more absorbent of solar radiation due to coloration differences. Furthermore, these materials have significant thermal capacity, such that they can accumulate a lot of heat at the surface. The combination of these properties is synergetic. Consequently, when a given piece of asphalt is being barraged by solar radiation on a hot summer day, it continues to absorb more thermal energy than it is able to vent off and can get much hotter than the ambient temperature of the same locality. This process is at the root of the heat island effect, and there are many angles from which to tackle this issue. While changing the coloration, surface texture, or material composition are all viable tools in the fight against anthropogenic warming, another approach is the use of supplementary technologies that can dissipate the accumulated thermal energy or make productive use of the energy.

[0096] Potential functional characteristics of a system that can make use of waste heat in heat islands are: capability to remove some thermal energy from the pavement, resiliency (long lifespan), and capability to generate usable power. Conventional thermoelectric generators (TEGs) have the potential to satisfy all three of these functional requirements. Being solid state, the TEGs satisfy the durability needs. TEGs use pairs of thermoelectric materials (legs: one positive and one negative) wired in an alternating fashion, such that the connections are facing alternating and opposite directions. When the two connection sides are exposed to two different temperatures, the material attempts to establish thermal equilibrium. For thermoelectric materials, this shifting towards thermal equilibrium causes the movement of charge, where the hotter, more excited, electrons move towards the colder areas of the thermoelectric materials.

[0097] Test Cases. Due to commercial availability, ductility, and linear thermoelectric properties, Type K thermocouple wires were used as the legs within the asphalt thermoelectric generator.

[0098] Using a single thermocouple pairing, an experimental study was devised to establish a voltage at a given temperature differential (FIG. 1). The wiring was connected by twistingbare ends to each other; the exposed wire connections were then placed in quartz crucibles to insulate charge. One crucible was floated on a room temperature bath of water, while the other was placed on top of an elevated surface to be heated with an electronic heat gun (FIG. 2). With an ambient temperature of approximately 70°F, the following voltage responses were recorded from the given hot side temperatures:

[0099] 170 - 200°F resulted in 4 - 5 mV of potential

[0100] 200 - 270°F resulted in 5 - 6 mV of potential

[0101] Asphalt Thermal Conductivity Testing. A piece of broken pavement was sourced from a material dump pile on a worksite in Easy Nashville. The asphalt slab was used to cut test slabs: three roughly equivalent square-face slabs and a larger rectangular-face slab. The square-face slabs were approximately 6x6 inches with varying depths of 2.25, 3.0, and 3.4 inches (FIGS. 3A-3D). These three slabs were intended for the purposes of testing how fast heat can move through asphalt.

[0102] With the slabs prepared, the next steps were taken to prepare for thermal conductivity testing. Using a reflective insulation board, a test box was built with three 6x6” holes, such that each of the blocks can only have heat transferred from the exposed upper face. The box was approximately 2x2x2’ and was elevated about a foot up (FIG. 4). The elevation was designed for easier access to take measurements and to allow the blocks to sit such that their faces sat flush with the bottom insulation board. To support the blocks from below, supports of varying heights were used to accommodate each of the block depths protruding from the bottom board (FIG. 5). Using fiberglass insulation and aluminum tape, the interior of the box was further insulated. Then, hanging from a metal dowel, a single 250W bulb, heat lamp was positioned centrally inside the box (FIG. 6). Additionally, a rod of aluminum was placed underneath the box to monitor ambient temperature.

[0103] During the testing process baseline temperatures were recorded before the light was actually turned on. Then they were recorded every 5 minutes after that, until the rate of temperature change slowed down. After 40 minutes the temperature measurements were taken every 10 minutes for an hour before the heating rate tapered off further. After that the measurements were taken every 20 minutes until conclusion of recording time. For each set of measurements, the maximum temperatures were read from the top and the bottom faces of each block. Additionally, the ambient temperature was taken from the aluminum bar below the box. Each measurement was taken with two different brands of thermometers: Fluke and Milwaukee.

[0104] The heat lamp was positioned directly over the inner edges of all three blocks. While the radiation intensity was not even across the entire surfaces of the blocks, they all hadapproximately the same flux due to the orientation. Additionally, by taking the maximum temperatures, the positioning became even less relevant. The data collected was sufficient to inform design recommendations for the field and second prototype.

[0105] Results'. The temperature difference between the surface and bottom maximum temperatures were plotted as a function of time (FIG. 7). After the 60-minute interval, AT of all three asphalt slabs B, C, and D leveled out. The magnitude of the terminal AT was the most stark difference exhibited by the three slabs.

[0106] From each of the slabs, the surface temperature at the 10 minute interval was designated as the baseline for the ‘heat lag’ metric. The first point from the bottom side of the slab to exceed the baseline temperature minus the 10 minutes were the intervals defined as ‘heat lags’. The heat lags of the three asphalt slabs B, C, and D followed a linear trend (FIG. 8). As there were only three slabs with varied thicknesses, the trend included only three data points which do not allow for significant statistical analysis. However, this data was insightful in how deep / tall a given rTEG should be depending on the direct sunlight periods for a given location.

[0107] Second Prototype Assembly. Thick gauge Type K thermocouples were acquired. Holes were bored through the larger, rectangular asphalt with a standard masonry bit with the help of some water cooling (FIGS. 9A-9B). After the block was cleaned off, a stand was made to raise it.

[0108] The ends of the thermocouple legs were filed down and the top sides were hammered flat (FIGS. 10A-10B) so that they could have better contact with one another. To compensate for potential contact issues, the connections were wrapped with thin gauge copper wire to improve electrical conductivity. This sufficiently improved reading consistency when applying a heat differential.

[0109] The model system was placed on a table. The circuit was completed with an ammeter connected to either end and a voltmeter was used to measure the voltage (FIG. 11).

[0110] Performance Study. For each test the temperatures of the bottom connections were measured for the cold side temperature data. For the top side, heat was applied using conduction rather than radiation to achieve a wider variety of temperatures. A stovetop was used to heat a large ceramic skillet at various temperatures which was then laid on top of the system to apply the heat to the top connections. The voltage and current readings were recorded as they stabilized, as the heat transfer leveled off. At this point, the topside temperature was measured. The data was consistent with the expected behavior of the system; the data points plotting voltage against temperature differential loosely followed the expected linear trend for thermocouples (FIGS. 12A-12B). The maximum current and voltagefrom the system were 12.9 mA and 18.0 mV, respectively. The maximum power output was 1.115mW per square foot (Eq 1).Power = Current x Voltage = V x A Equation 1

[0111] Conclusion. In place of the Type K thermocouples (chromel / constantan), other materials that could work for the thermoelectric legs would be those that are widely abundant, easy to work with, and relatively nontoxic.

[0112] rTEG systems have the potential to reduce the amplitude of thermal fluctuations in pavement. By mitigating the magnitude of extreme temperature conditions, the pavement would experience less thermal expansion and contraction. Because thermal expansion is a primary driver of critical pavement failure, this could increase the lifespan.

[0113] Including a heat sink on the “cold side’’ of the rTEG could mitigate increases in temperature on the cold side and help maintain a higher AT of the rTEG. Potential heat sinks include water baths and TEG coils.

[0114] It should be emphasized that the above-described embodiments of the present disclosure are merely possible examples of implementations set forth for a clear understanding of the principles of the disclosure. Many variations and modifications may be made to the above-described aspects. All such modifications and variations are intended to be included herein within the scope of this disclosure and protected by the following claims.

Claims

CLAIMSWhat is claimed:

1. A device, comprising: a plate, comprising a first surface and a second surface; at least one pair of thermoelectric legs, each individual leg of the pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the pair of thermoelectric legs is configured to be in contact with the second surface of the plate; and a connective housing, configured to encase at least each individual second end of each leg of the pair of thermoelectric legs; wherein the plate comprises a thermally conductive material; wherein the pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the connective housing comprises a thermally conductive material and is electrically insulating.

2. The device of claim 1 , wherein the plate comprises iron, aluminum, copper, brass, steel, alloys thereof, or any combination thereof.

3. The device of claim 1 , wherein the n-type leg comprises nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, graphene, graphite, tellurium, bismuth, alloys thereof, or combinations thereof.

4. The device of claim 1 , wherein the p-type leg comprises nickel, copper, manganese, aluminum, silicon, platinum, rhodium, tungsten, rhenium, magnesium, lead, phosphorus, zinc, chromium, alloys thereof, or combinations thereof.

5. The device of claim 1 , wherein the connective housing is configured to be thermally insulating and electrically insulating.

6. The device of claim 1 , further comprising a leg housing, wherein the leg housing is configured to encase at least a portion of the pair of thermoelectric legs between the first ends and the second ends and wherein the leg housing is electrically insulating.

7. The device of claim 6, wherein the leg housing is configured to be in contact with the connective housing.

8. The device of claim 6, further comprising a sealed cuff configured to be in contact with both the leg housing and the connective housing.

9. The device of claim 1 , wherein the plate is configured to be in contact with first heat source or a first heat sink and wherein the connective housing is configured to be in contact with a second heat source or a second heat sink.

10. The device of claim 9, wherein the first heat source comprises asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof.11 . The device of claim 9, wherein the second heat source comprises asphalt, concrete, brick, gravel, sand, metal, rock, soil, or a combination thereof.

12. The device of claim 9, wherein the first heat sink comprises soil, rock, water, minerals, sand, concrete, or a combination thereof.

13. The device of claim 9, wherein the second heat sink comprises soil, rock, water, minerals, sand, concrete, or a combination thereof.

14. The device of claim 9, wherein the plate is configured to be in contact with a first heat source and the connective housing is configured to be in contact with a first heat sink.

15. A system, comprising: a first thermoelectric module, comprising: a first plate, comprising a first surface and a second surface; at least one first pair of thermoelectric legs, each individual leg of the first pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the first pair of thermoelectric legs is configured to be in contact with the second surface of the first plate; and a first connective housing, configured to encase at least each individual second end of each leg of the first pair of thermoelectric legs; a second thermoelectric module, configured to be in electrical communication with the first thermoelectric module, comprising: a second plate, comprising a first surface and a second surface; at least one second pair of thermoelectric legs, each individual leg of the second pair of thermoelectric legs comprising a first end and a second end, wherein each individual first end of each leg of the second pair of thermoelectric legs is configured to be in contact with the second surface of the first plate; and a second connective housing, configured to encase at least each individual second end of each leg of the second pair of thermoelectric legs; anda power storage, wherein the power storage is configured to be in electrical communication with the first thermoelectric module and the second thermoelectric module; wherein the first plate and the second plate individually comprise a thermally conductive material; wherein the first pair of thermoelectric legs comprise an n-type leg and a p-type leg; wherein the second pair of thermoelectric legs comprise an n-type leg and a p-type leg; and wherein the first connective housing and the second connective housing individually comprise a thermally conductive material and are electrically insulating.

16. The system of claim 15, wherein the first connective housing and the second connective housing comprise a continuous connective housing.

17. The system of claim 15, wherein a first thermoelectric leg of the first pair of thermoelectric legs of the first thermoelectric module is in electrical communication with a second thermoelectric leg of the second pair of thermoelectric legs of the second thermoelectric module.

18. The system of claim 15, wherein the power storage comprises electrochemical storage, pumped-storage hydropower, thermal energy storage, flywheel storage, compressed air storage, or a combination thereof.

19. The system of claim 15, wherein the first thermoelectric module and the second thermoelectric module are in electrical communication with one another in a series circuit configuration.

20. A system, comprising: a first slat, comprising at least two thermoelectric modules individually comprising the device of claim 1 ; a second slat, comprising at least two thermoelectric modules individually comprising the device of claim 1 , wherein the second slat is configured to be in electrical communication with the first slat; and a power storage, wherein the power storage is configured to be in electrical communication with the first slat and the second slat.21 . The system of claim 20, wherein the first slat and the second slat are in electrical communication with the power storage in a parallel circuit configuration.

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