Latent curing agent, low-temperature-curable photosensitive resin composition, method for preparing patterned cured film, and insulating film

Abstract

The present invention relates to the technical field of photocurable photosensitive materials. Disclosed are a latent curing agent, a low-temperature-curable photosensitive resin composition, a method for preparing a patterned cured film, and an insulating film. The latent curing agent is a quaternary ammonium salt composed of quaternary ammonium cations, and anions containing a sulfonamide structure. A low-temperature-curable thermosetting resin composition comprises the following components in parts by mass: 100 parts of a polyimide precursor, 0.1-10 parts of the latent curing agent, 1-10 parts of a photoinitiator, and 5-50 parts of a cross-linking agent. The method for preparing the patterned cured film comprises: dissolving the low-temperature-curable thermosetting resin composition in an organic solvent, and carrying out exposure, development, and curing. In addition, the insulating film is formed by means of curing. The low-temperature-curable thermosetting resin composition of the present invention comprises a latent curing agent, exhibits a significant effect on improving the development film retention rate of the low-temperature-curable thermosetting resin composition in a patterning process and the tensile strength of a cured thin film, and has a relatively long stable storage period.

Description

Latent curing agent, low-temperature curing photosensitive resin composition, method for preparing patterned cured film, and insulating film TECHNICAL FIELD

[0001] The present application relates to the technical field of photocuring photosensitive material, and particularly relates to a latent curing agent, a low-temperature curing photosensitive resin composition, a method for preparing a patterned cured film, and an insulating film. BACKGROUND

[0002] The photosensitive resin composition can undergo a photocuring reaction when irradiated with light to form a photosensitive resin film. The photosensitive resin film is subjected to a photolithography process to form a photosensitive resin film pattern. In the manufacturing process of electronic components and semiconductor devices, these patterns can be used as insulating film patterns or protective film patterns.

[0003] In the past, in order to facilitate the processing of materials, thermosetting resins were processed in the form of a precursor solution, and were processed to form insulating films with excellent heat resistance, electrical properties and mechanical properties through a high-temperature heating and curing process. However, the high-temperature process can accumulate thermal stress with side effects. At present, in order to achieve low-temperature curing of thermosetting resins, a common measure is to add a curing catalyst or a latent curing catalyst to the precursor solution to obtain better insulating film performance after low-temperature curing and to maintain long-term storage stability. It is a common way to prepare a latent curing agent by reacting a basic substance with an organic acid, but the residual organic acid in the monomer preparation process can reduce the effectiveness of the latent curing agent.

[0004] SUMMARY

[0005] The purpose of the present application is to overcome the defects of the prior art and provide a new latent curing agent. The present application also aims to provide a low-temperature curing thermosetting resin composition, a method for preparing a patterned cured film, and an insulating film.

[0006] To achieve the above-mentioned and other related purposes, the present application provides the following technical solutions.

[0007] In a first aspect, the present application provides a latent curing agent, which is a quaternary ammonium salt composed of a quaternary ammonium cation and a sulfanilamide-containing anion.

[0008] Further, the quaternary ammonium cation and the sulfanilamide-containing anion are as shown in structural formula I-1 and formula I-2:

[0009] wherein R1, R2, R3, R4 and R5 are each independently selected from a hydrogen atom, a hydroxyl group, a cyano group, a C1-C 10 alkyl group, a C1-C 10 alkoxy group, a C6-C20 an aromatic group, or any two of R1, R2, R3, R4, and R5 form an aromatic group; R6 is a bond or a C1-C 10 alkylene group; R7 and R8 are each independently selected from a hydrogen atom or a C1-C 10 alkyl group; R9, R 10 , and R 11 are each independently selected from a C1-C 10 alkyl group, a C1-C 15 cycloalkyl group, a C6-C 20 aromatic group, or R9, R 10 , and R 11 form an imidazole ring structure, a pyridine ring structure, or an isoquinoline ring structure; R 12 is selected from a halogen atom, a C1-C 10 alkyl group, a C1-C 10 haloalkyl group, a C6-C 20 aromatic group, R 13 is selected from a nitro group, a cyano group, a carbonyl group and its derivatives, a sulfonyl group and its derivatives, an amide group, or R 12 and R 13 form a sulfonamide structure.

[0010] wherein the above-mentioned cation and anion can improve the storage stability, film retention, and other properties of the product, because the quaternary ammonium cation reduces the nucleophilicity of the nitrogen atom due to steric hindrance, and the formation of an ionic bond with the anion can improve the gel strength in the crosslinked network formed after exposure due to polyelectrolyte effect, thereby inhibiting swelling and precipitation during development, and thus improving the development film retention while ensuring storage stability.

[0011] Further, at least one of the following technical features is included:

[0012] a1) R1, R2, R3, R4, and R5 are each independently selected from a hydrogen atom, a hydroxyl group, a cyano group, a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a phenyl group, a benzyl group, a phenethyl group, or R2 and R3 form a phenyl group;

[0013] a2) R6 is a bond, a methylene group, or an ethylene group;

[0014] a3) R7 and R8 are each independently selected from a hydrogen atom, a methyl group, or an ethyl group;

[0015] a4) R9, R 10 , and R 11 are each independently selected from a methyl group, an ethyl group, a propyl group, a cyclopentyl group, a cyclohexyl group, a phenyl group, a benzyl group, a phenethyl group, or R9, R 10 , and R 11 form an imidazole ring, a methyl imidazole ring, a pyridine ring, or an isoquinoline ring;

[0016] a5) the R 12 is selected from the group consisting of fluorine atom, methyl, ethyl, propyl, phenyl, benzyl, phenethyl, trifluoromethyl, pentafluoroethyl;

[0017] a6) the R 13 is selected from the group consisting of one of the following structures:

[0018] a7) the R 12 and R 13 is selected from the group consisting of one of the following structures:

[0019] Further, the quaternary ammonium cation is selected from at least one of the following structures:

[0020] wherein, R2and R3are each independently selected from the group consisting of hydrogen atom, hydroxyl, cyano, methyl, ethyl, propyl, methoxy, ethoxy, phenyl, benzyl, phenethyl, or R2and R3form a phenyl group;

[0021] Preferably, the quaternary ammonium cation specifically includes the following structure:

[0022] Further, the sulfonamide-containing anion is selected from at least one of the following structures:

[0023] In the second aspect, the present application provides a low-temperature-cured thermosetting resin composition, comprising the following components by mass fraction:

[0024] Further, the low-temperature-cured thermosetting resin composition comprises at least one of the following technical features:

[0025] c1) the molecular weight of the polyimide precursor is 3000-80000; preferably the molecular weight is 5000-50000, further preferably the molecular weight is 35000-45000, such as 35400, 38900, 41400, 35600, 40100, 39700, 38900;

[0026] c2) the polyimide precursor comprises the following general structure formula II:

[0027] wherein, X is selected from a four-valent organic group having a C6-C 30 aromatic structure; Y is selected from a two-valent organic group having a C6-C 30 aromatic structure or a C1-C 20 alicyclic structure; R21 and R 22 each independently selected from hydrogen atom or C3-C 30 vinyl unsaturated bond, urea group, thiourea group.

[0028] Preferably, said X is selected from at least one of the following structures:

[0029] Preferably, said Y is selected from at least one of the following structures:

[0030] Preferably, said R 21 and R 22 each independently selected from at least one of the following structures:

[0031] R 23 is an alkane structure with carbon atom number 1-8, and n is a positive integer from 1 to 8.

[0032] Preferably, when the end group of said polyimide precursor is amino, the end-capping agent is an anhydride-containing monomer selected from at least one of (meth)acrylic anhydride, (meth)norbornene anhydride, maleic anhydride, 4-methacryloyloxy trimellitic anhydride, phenylacetylene trimellitic anhydride, and 4-phenylacetylene phthalic anhydride.

[0033] Preferably, when the end group of said polyimide precursor is carboxyl, the end-capping agent is an amine-containing monomer selected from at least one of 3-aminophenol, 4-aminophenol, 3-aminophenyl ether, and 4-aminophenyl ether.

[0034] c3) said photoinitiator is selected from at least one of oxime ester photoinitiator, titanocene photoinitiator, acyl phosphine oxide photoinitiator, benzoin photoinitiator, benzophenone photoinitiator, thioxanthone photoinitiator, and quinone photoinitiator.

[0035] Preferably, said photoinitiator is oxime ester photoinitiator.

[0036] Further preferably, the oxime ester photoinitiator is selected from at least one of Irgacure OXE 01, Irgacure OXE 02, Irgacure OXE 03, Irgacure OXE 04, Irgacure OXE 05, TR-PBG-304, TR-PBG-305, TR-PBG-314, TR-PBG-3057, TR-PBG-A, TR-PBG-B, ADEKA ARKLS N-1919T, ADEKA ARKLS NCI-831E, ADEKA ARKLS NCI-930, ADEKA ARKLS NCI-730, SpeedCure PDO;

[0037] c4) the crosslinking agent is selected from at least one of triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, ethylene glycol or polyethylene glycol di(meth)acrylate; propylene glycol or polypropylene glycol di(meth)acrylate; glycerol di- or tri(meth)acrylate; cyclohexane di(meth)acrylate; 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate; neopentyl glycol di(meth)acrylate; bisphenol A di(meth)acrylate; trimethylolpropane tri(meth)acrylate; pentaerythritol tri- or tetra(meth)acrylate; tricyclo[5.2.1.0,2,6]decane dimethanol di(meth)acrylate.

[0038] Preferably, the crosslinking agent is selected from at least one of tetraethylene glycol dimethacrylate, trimethylolpropane trimethacrylate, tricyclo[5.2.1.0,2,6]decane dimethanol dimethacrylate, and pentaerythritol tetramethacrylate.

[0039] Further, the low temperature curable thermoset resin composition further comprises:

[0040] Coupling agent 0.1-10 parts;

[0041] Polymerization inhibitor 0.1-10 parts.

[0042] Further, the coupling agent is selected from silane coupling agent, titanium coupling agent, aluminum coupling agent, zirconium coupling agent, boron coupling agent.

[0043] Preferably, the coupling agent is a silane coupling agent.

[0044] Further preferably, the silane coupling agent is selected from at least one of 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, N-phenyl-3-aminopropyltrimethoxysilane, N-phenyl-3-aminopropyltriethoxysilane, γ-methacryloxypropyltrimethoxysilane, and γ-methacryloxypropyltriethoxysilane.

[0045] Further, the polymerization inhibitor is selected from at least one of hydroquinone, 4-methoxyphenol, tert-butyl hydroquinone, 1,4-benzoquinone, phenothiazine, N-nitrosodiphenylamine, 2,6-di-tert-butyl-4-methylphenol, 1-nitroso-2-naphthol, 2-nitroso-1-naphthol, 2,2,6,6-tetramethylpiperidinooxy, 4-hydroxy-2,2,6,6-tetramethylpiperidinooxy, and N-tert-butyl-a-phenylnitrone.

[0046] In a third aspect, the present application provides a method for preparing a pattern-cured product, which comprises dissolving the low-temperature-cured photosensitive resin composition as described above in an organic solvent, and then performing exposure, development, and curing.

[0047] Further, at least one of the following technical features is included:

[0048] d1) the organic solvent is selected from N-methylpyrrolidone, dimethyl sulfoxide, γ-butyrolactone, propylene glycol monomethyl ether acetate, ethyl lactate, and 2-heptanone; the organic solvent is a polar aprotic solvent;

[0049] Further, the organic solvent is preferably a mixed solution of γ-butyrolactone and ethyl lactate, and further preferably, the mass ratio of γ-butyrolactone to ethyl lactate is 10:1 to 1:1.

[0050] d2) the light source for exposure is a 100-3000W ultraviolet mercury lamp or an LED exposure machine;

[0051] d3) the developing solution is selected from at least one of cyclopentanone, propylene glycol monomethyl ether acetate, N,N-dimethylformamide, and isopropyl alcohol;

[0052] d4) the curing temperature is 150-280°C;

[0053] d5) the curing time is 1-3 hours.

[0054] In a fourth aspect, the present application provides an insulating film formed by curing the low-temperature-cured thermosetting resin composition as described above.

[0055] Compared with the prior art, the present application has the following advantages:

[0056] The low temperature curable thermoset resin composition of the present invention includes a latent curing agent of quaternary ammonium salt consisting of quaternary ammonium cation and anion containing sulfanilamide structure, which has a significant effect on improving the development on-plate retention of the low temperature curable thermoset resin composition during the patterning process and the tensile strength of the film after curing, and has a long storage stability period. DETAILED DESCRIPTION

[0057] Unless otherwise indicated, all parts and percentages in the present application are on a weight basis and all tests and characteristics are determined on the date of filing of the present application. To the extent that any patent, patent application, or publication is cited in this application, the contents of all such citations are hereby incorporated by reference into this application, and their equivalents, in particular, the definitions of the terms found in such documents, are hereby incorporated by reference into this application. If there is a conflict between the definitions found in this application and those found in the documents incorporated by reference, the terms as defined in this application control.

[0058] Numerical ranges in the present application are approximations, and thus the endpoints of ranges are not to be understood as being significantly limited to the precise values. Unless otherwise indicated, the numerical ranges are inclusive of the numbers recited. The number range includes all numbers between the lower and upper limits, inclusive of the limits, provided that there is a gap of at least 2 units between any lower value and any higher value. For example, if a component, physical or otherwise property such as molecular weight, melt index, etc., is stated to be in the range of 100 to 1000, it is intended that all individual values, such as 100, 101, 102, etc., and sub-ranges, such as 100 to 166, 155 to 170, 198 to 200, etc., are expressly enumerated. For ranges containing values less than 1 or containing fractional numbers greater than 1, (e.g., 1.1, 1.5, etc.), the number 1 is understood to be 0.0001, 0.001, 0.01, or 0.1 as appropriate. For ranges ending with a number containing less than 10 (e.g., 1 to 5), the number 1 is typically understood to be 0.1. These are only examples of what is meant by a range. All possible combinations and subcombinations of numerical values contained in the ranges are to be considered as if explicitly written out. Numerical ranges within the application are particularly provided for calcium filler content, mixing temperature, and various characteristics and properties of the components.

[0059] As used in connection with chemical compounds, the singular includes all isomeric forms, unless specifically indicated otherwise (e.g., "hexane" alone or in combination includes all isomeric forms of hexane). Additionally, the use of "a", "an", or "the" to describe a noun also includes the plural form of that noun, unless specifically indicated otherwise.

[0060] The terms "comprising", "including", "containing", and variations thereof do not exclude any component, step or process not specified, and do not have any limitation as to the presence or addition of other components, steps or processes. To the contrary, the term "consisting essentially of" does not exclude the presence of additional components, steps or processes that do not materially affect the basic and novel characteristics of the composition(s) or method(s) under consideration. The term "consisting of" excludes any component, step or process not specifically recited. The term "or" as used in any of the claims or specification means any one member of the alternative, or any combination thereof.

[0061] Embodiments

[0062] The embodiments of the present application will be described in detail below, which are implemented on the premise of the technical solutions of the present application, and detailed implementation modes and specific operation processes are given, but the protection scope of the present application is not limited to the following embodiments.

[0063] It should be noted that the determination methods in the embodiments and comparative examples are as follows:

[0064] I. Synthesis of polyimide precursor A

[0065] Synthesis of polyimide precursor A1

[0066] A four-necked flask under nitrogen protection was added 3,3',4,4'-biphenyl tetracarboxylic dianhydride 58.84 g (0.2 mol), hydroxyethyl methacrylate 52.04 g (0.4 mol) and pyridine 31.64 g (0.4 mol) at room temperature, and dissolved using 120 g of γ-butyrolactone, and stirred for 4 hours. The reaction vessel was transferred to an ice water bath (0-10°C), and 1-hydroxybenzotriazole 51.35 g, N,N'-dicyclohexyl carbodiimide 82.53 g was dissolved in γ-butyrolactone 80 g, and added dropwise to the reaction bottle for half an hour. After the reaction heat was finished, 4,4'-diamino diphenyl ether 38.05 g (0.19 mol) was dispersed in 150 g of γ-butyrolactone, added to the reaction and continued to stir for 2 hours. The reaction liquid was filtered to obtain the filtrate, which was diluted with 2-methyl tetrahydrofuran, precipitated in deionized water, filtered, and dried in a 50°C oven under vacuum for 72 hours to obtain a light yellow solid powder A1 with a weight average molecular weight of 35400.

[0067] Synthesis of polyimide precursor A2

[0068] Except that 3,3',4,4'-diphenyltetracarboxylic dianhydride 58.84 g (0.2 mol) in the synthesis of polyimide precursor Al was changed to 4,4'-diphenyl ether dianhydride 62.04 g (0.2 mol), the rest was reacted and treated by referring to the method in polyimide precursor Al, to obtain a light yellow solid powder A2, the weight average molecular weight was 38900.

[0069] Synthesis of polyimide precursor A3

[0070] Except that 3,3',4,4'-diphenyltetracarboxylic dianhydride 58.84 g (0.2 mol) in the synthesis of polyimide precursor Al was changed to 4,4'-diphenyl ether dianhydride 62.04 g (0.2 mol), the rest was reacted and treated by referring to the method in polyimide precursor Al, to obtain a light yellow solid powder A2, the weight average molecular weight was 38900.

[0071] Synthesis of polyimide precursor A4

[0072] Except that 3,3',4,4'-diphenyltetracarboxylic dianhydride 58.84 g (0.2 mol) in the synthesis of polyimide precursor Al was changed to 4,4'-diphenyl ether dianhydride 62.04 g (0.2 mol), the rest was reacted and treated by referring to the method in polyimide precursor Al, to obtain a light yellow solid powder A2, the weight average molecular weight was 38900.

[0073] Synthesis of polyimide precursor A5

[0074] Except that 3,3',4,4'-diphenyltetracarboxylic dianhydride 58.84 g (0.2 mol) in the synthesis of polyimide precursor Al was changed to 4,4'-diphenyl ether dianhydride 62.04 g (0.2 mol), the rest was reacted and treated by referring to the method in polyimide precursor Al, to obtain a light yellow solid powder A2, the weight average molecular weight was 38900.

[0075] Synthesis of polyimide precursor A6

[0076] Except that 3,3',4,4'-diphenyltetracarboxylic dianhydride 58.84 g (0.2 mol) in the synthesis of polyimide precursor Al was changed to 4,4'-diphenyl ether dianhydride 62.04 g (0.2 mol), the rest was reacted and treated by referring to the method in polyimide precursor Al, to obtain a light yellow solid powder A2, the weight average molecular weight was 38900.

[0077] II. Composition of the low-temperature curing photosensitive resin composition

[0078] 1. Polyimide precursor A, 100 parts

[0079] Polyimide precursors A1 to A6;

[0080] 2. Latent curing agent B, 3 parts

[0081] Other latent curing agents

[0082] Non-latent curing agents

[0083] 3. Initiator C, 4 parts

[0084] C1: Irgacure OXE 02

[0085] C2: TR-PBG-305

[0086] C3: SpeedCure PDO

[0087] 4. Crosslinking agent D, 20 parts

[0088] D1: Tetraethylene glycol dimethacrylate

[0089] D2: Trimethylolpropane trimethacrylate

[0090] D3: Tricyclo[5.2.1.0,2,6]decane dimethanol dimethacrylate

[0091] D4: Pentaerythritol tetramethacrylate

[0092] 5. Coupling agent E, 2 parts

[0093] E1: γ-Glycidoxypropyltrimethoxysilane

[0094] 6. Polymerization inhibitor F, 0.1 parts

[0095] F1: 2,6-Di-tert-butyl-4-methylphenol

[0096] In addition to the above ingredients, the low-temperature curing photosensitive resin composition further adds the following substances (relative to the total number of polyimide precursor A is 100 parts):

[0097] Mixed solvent with mass ratio of γ-butyrolactone / ethyl lactate = 4 / 1, 200 parts

[0098] Example 1

[0099] A low-temperature curing photosensitive resin composition includes the following components in mass parts:

[0100] The low-temperature cured photosensitive resin composition solution was formed on a silicon wafer by spin coating and baking, and exposed to light using a UV mercury lamp with a power of 200 W, with the exposure energy set to 150 mJ. The exposed film was developed in a developer, and the development residual film thickness T1 / original film thickness T0 was measured. If the development residual film thickness was greater than or equal to 90%, it was determined to be excellent; if the development residual film thickness was less than 90% but greater than or equal to 85%, it was determined to be intermediate; and if the development residual film thickness was less than 85%, it was determined to be poor.

[0101] Method for preparing a cured film of a pattern

[0102] The solution was spin coated on a silicon wafer, baked on a contact hot plate at 100°C for 4 minutes, and then exposed to light using a UV mercury lamp with a power of 200 W. The exposed film was developed in a developer, and then cured in a nitrogen oven at a temperature increase rate of 5°C per minute from room temperature to 150°C for 0.5 hours and to 230°C for 3 hours, and then cooled at a rate of 2°C per minute to room temperature. A cured film of a pattern was obtained. The specific storage stability, sensitivity, and elongation at break were as shown in Table 1.

[0103] It should be noted that the test methods for the residual film thickness, tensile strength, and storage stability in the examples and comparative examples were as follows:

[0104] Residual film thickness

[0105] The low-temperature cured photosensitive resin composition solution was formed on a silicon wafer by spin coating and baking, and exposed to light using a UV mercury lamp with a power of 200 W, with the exposure energy set to 150 mJ. The exposed film was developed in a developer, and the development residual film thickness T1 / original film thickness T0 was measured. If the development residual film thickness was greater than or equal to 90%, it was determined to be excellent; if the development residual film thickness was less than 90% but greater than or equal to 85%, it was determined to be intermediate; and if the development residual film thickness was less than 85%, it was determined to be poor.

[0106] Tensile strength

[0107] Tensile test pieces were cut from the cured film obtained in the above step, and placed in an environment of 23°C and 50% relative humidity for 12 hours or more. The tensile strength was measured using a universal tensile tester. If the tensile strength was greater than or equal to 150 MPa, it was determined to be excellent; if the tensile strength was less than 150 MPa but greater than or equal to 130 MPa, it was determined to be intermediate; and if the tensile strength was less than 130 MPa, it was determined to be poor.

[0108] Storage stability:

[0109] The prepared low-temperature curing photosensitive resin composition solution is measured for initial viscosity at room temperature using a Brookfield viscometer, then is filled into a brown glass bottle, sealed, and placed in a constant-temperature oven at 50°C for aging. Further, the viscosity of the composition during aging is measured once a day using a Brookfield viscometer, and the number of days during which the viscosity can be maintained with a change of less than 5% compared to the initial viscosity is counted. If the time is greater than 7 days, it is excellent; if the time is less than 7 days but greater than or equal to 5 days, it is good; and if the time is less than 5 days, it is poor.

[0110] The method of Example 1 is followed, with the coupling agent (γ-glycidoxypropyltrimethoxysilane), the polymerization inhibitor (2,6-di-tert-butyl-4-methylphenol), and the organic solvent (a mixed solvent of γ-butyrolactone / ethyl lactate = 4 / 1) remaining unchanged, and the specific components and proportions of Examples 2-30 and Comparative Examples 1-8 are as shown in Table 1 below.

[0111] Table 1: Components, proportions, and test results of examples and comparative examples

[0112] The results of Examples 1 and 2 show that component B has a significant effect on improving the development yield and the tensile strength of the cured film; the results of Example 2 and Comparative Example 3 show that component D has a significant effect on improving the development yield and the tensile strength of the cured film; the results of Example 2 and Comparative Examples 4-5 show that component B not meeting the structure of the claim is at a disadvantage in the development yield and the tensile strength of the cured film; and the results of Example 2 and Comparative Examples 7 and 8 show that component B meeting the structure of the claim has a significant advantage in storage stability.

[0113] An insulating film is prepared according to the method of preparing a patterned cured film in Example 1, and an insulating film of 1-100 μm can be obtained.

[0114] These insulating films can be used as insulating layers in semiconductors, electronic products, display panels, and photovoltaic devices.

Claims

1. A latent curing agent, characterized in that The latent curing agent is a quaternary ammonium salt composed of a quaternary ammonium cation and an anion containing a sulfonamide structure.

2. The latent curing agent according to claim 1, characterized in that The quaternary ammonium cation and the anion containing a sulfonamide structure are shown in the general structural formula I-1 and the general formula I-2: Wherein, R1, R2, R3, R4 and R5 are independently selected from hydrogen atom, hydroxyl group, cyano group, C1-C 10 Alkyl, C1-C 10 Alkoxy, C6-C 20 R6 is a connecting bond or C1-C 10 R7 and R8 are each independently selected from a hydrogen atom or a C1-C 10 Alkyl; R9, R 10 and R 11 Each independently selected from C1-C 10 Alkyl, C1-C 15 Cycloalkyl, C6-C 20 aromatic group, or R9, R 10 and R 11 Form an imidazole ring structure, a pyridine ring structure or an isoquinoline ring structure; R 12 Selected from halogen atoms, C1-C 10 Alkyl, C1-C 10 Halogenated alkyl, C6-C 20 The aromatic group, R 13 is selected from nitro, cyano, carbonyl and its derivatives, sulfonyl and its derivatives, amide, or R 12 and R 13 It forms a ring with the sulfonamide structure.

3. The latent curing agent according to claim 2, characterized in that Include at least one of the following technical features: a1) R1, R2, R3, R4 and R5 are each independently selected from a hydrogen atom, a hydroxyl group, a cyano group, a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a phenyl group, a benzyl group, a phenylhexyl group, or R2 and R3 form a phenyl group; a2) R6 is a connecting bond, methylene or ethylene; a3) R7 and R8 are each independently selected from a hydrogen atom, a methyl group or an ethyl group; a4) R9, R 10 and R 11 Each independently selected from methyl, ethyl, propyl, cyclopentyl, cyclohexyl, phenyl, benzyl, phenylhexyl or R9, R 10 and R 11 forming an imidazole ring, a methylimidazole ring, a pyridine ring or an isoquinoline ring; a5) R 12 is selected from the group consisting of a fluorine atom, a methyl group, an ethyl group, a propyl group, a phenyl group, a benzyl group, a phenethyl group, a trifluoromethyl group, and a pentafluoroethyl group; a6) R 13 Selected from one of the following structures: a7) R 12 and R 13 The ring formed with the sulfonamide structure is one of the following structures:

4. The latent curing agent according to claim 3, characterized in that Include at least one of the following technical features: b1) The quaternary ammonium cation is selected from at least one of the following structures: wherein R2 and R3 are each independently selected from a hydrogen atom, a hydroxyl group, a cyano group, a methyl group, an ethyl group, a propyl group, a methoxy group, an ethoxy group, a phenyl group, a benzyl group, a phenylhexyl group, or R2 and R3 form a phenyl group; b2) the anion containing the sulfonamide structure is selected from at least one of the following structures:

5. A low-temperature curing thermosetting resin composition, characterized in that: The composition comprises the following components in parts by weight:

6. The low-temperature curing thermosetting resin composition according to claim 5, characterized in that The low-temperature curing thermosetting resin composition includes at least one of the following technical features: c1) the molecular weight of the polyimide precursor is 3000-80000; c2) The polyimide precursor comprises the following structural formula II: wherein X is selected from C6-C 30 Aromatic tetravalent organic group; Y is selected from C6-C 30 Aromatic or C1-C 20 Alicyclic divalent organic group; R 21 and R 22 Each independently selected from a hydrogen atom or a C3-C 30 Organic groups of ethylenically unsaturated bonds, urea groups, thiourea groups; c3) the photoinitiator is at least one selected from the group consisting of oxime ester photoinitiators, titanocene photoinitiators, acylphosphine oxide photoinitiators, benzil photoinitiators, benzophenone photoinitiators, thioxanthone photoinitiators, and quinone photoinitiators; c4) The crosslinking agent is selected from at least one of triethylene glycol dimethacrylate, tetraethylene glycol dimethacrylate, ethylene glycol or polyethylene glycol di(meth)acrylate; propylene glycol or polypropylene glycol di(meth)acrylate; glycerol di- or tri(meth)acrylate; cyclohexane di(meth)acrylate; 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate; neopentyl glycol di(meth)acrylate; bisphenol A di(meth)acrylate; trimethylolpropane tri(meth)acrylate; pentaerythritol tri- or tetra(meth)acrylate; and tricyclo[5.2.1.0,2,6]decanedimethanol di(meth)acrylate.

7. The low-temperature curing thermosetting resin composition according to claim 5, characterized in that The low-temperature curing thermosetting resin composition further comprises: 0.1-10 parts of a coupling agent; and 0.1-10 parts of a polymerization inhibitor.

8. The low-temperature curing thermosetting resin composition according to claim 7, characterized in that The coupling agent is selected from at least one of an alkane coupling agent, a titanium coupling agent, an aluminum coupling agent, a zirconium coupling agent, and a boron coupling agent.

9. The low-temperature curing thermosetting resin composition according to claim 7, characterized in that: The polymerization inhibitor is selected from at least one of hydroquinone, 4-methoxyphenol, tert-butylhydroquinone, 1,4-benzoquinone, phenothiazine, N-nitrosodiphenylamine, 2,6-di-tert-butyl-4-methylphenol, 1-nitroso-2-naphthol, 2-nitroso-1-naphthol, 2,2,6,6-tetramethylpiperidinol, 4-hydroxy-2,2,6,6-tetramethylpiperidinol, and N-tert-butyl-a-phenylnitrone.

10. A method for preparing a patterned cured film, characterized in that: The low-temperature curable thermosetting resin composition according to any one of claims 5 to 9 is dissolved in an organic solvent, and subjected to exposure, development and curing.

11. The method for preparing a patterned cured film according to claim 10, wherein: Include at least one of the following technical features: c1) the organic solvent is at least one selected from butyrolactone and / or ethyl lactate; c2) the exposure light source is selected from a 100-3000W ultraviolet mercury lamp or an LED exposure machine; c3) the developer is selected from at least one of cyclopentanone, propylene glycol monomethyl ether acetate, N,N-dimethylformamide, and isopropyl alcohol; c4) the curing temperature is 150 to 280° C.; c5) The curing time is 1 to 3 hours.

12. An insulating film, characterized in that: It is formed by curing the low-temperature curing thermosetting resin composition according to any one of claims 5 to 9.

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