Display module and electronic device

Abstract

The present application provides a display module and an electronic device. The display module comprises a display layer, an electric connection layer and an electric conductor, wherein the display layer comprises a first signal layer, the electric connection layer is located on a non-display side of the display layer, the electric connection layer comprises a second signal layer, and the electric conductor is located in a non-display area of the display module and is electrically connected between the first signal layer and the second signal layer. According to the embodiments of the present application, the position of a wire located at the edge of the display module can be adjusted, thereby preventing the wire from occupying the peripheral space of the display module, improving the screen-to-body ratio of the electronic device.

Description

Display module and electronic device

[0001] The present application claims priority to the Chinese patent application No. 202410438812.8, filed on April 11, 2024, entitled "Display module and electronic device", the priority of which is hereby claimed in its entirety. The present application claims priority to the Chinese patent application No. 202410789145.8, filed on June 18, 2024, entitled "Display module and electronic device", the priority of which is hereby claimed in its entirety. The contents of the priority applications are hereby incorporated by reference in their entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of electronic devices, in particular to a display module and an electronic device. BACKGROUND

[0003] At present, the edge of the display module of the electronic device is generally bent behind the screen, so that the edge of the display module is electrically connected to the mainboard of the electronic device through the flexible circuit board, thereby realizing the power supply and data transmission of the mainboard to the display module. However, the bending area of the display module occupies the peripheral position of the display module, resulting in a wider screen frame of the electronic device, which brings an adverse visual experience to the user and affects the user experience. SUMMARY

[0004] Embodiments of the present application provide a display module and an electronic device, which can adjust the position of the wire located at the edge of the display module, avoid the wire occupying the peripheral space of the display module, improve the screen-to-body ratio of the electronic device, and thus improve the appearance of the electronic device.

[0005] In a first aspect, the present application provides a display module, comprising a display layer, an electrical connection layer and a conductive body. The display layer comprises a first signal layer, and the side surface of the first signal layer is provided with a first conductive point. The electrical connection layer is located on the non-display side of the display layer, and the electrical connection layer comprises a second signal layer, and the side surface of the second signal layer is provided with a second conductive point. The conductive body is connected to the side surface of the display layer and the side surface of the electrical connection layer, and is electrically connected to the first conductive point and the second conductive point, so as to make the first signal layer and the second signal layer communicate.

[0006] At present, the edge of the display module of the electronic device is generally bent behind the screen, so that the edge of the display module is electrically connected to the mainboard of the electronic device through the flexible circuit board, thereby realizing the power supply and data transmission of the mainboard to the display module. However, the bending area of the display module occupies the edge space of the display module, resulting in a wider frame of the electronic device, a smaller screen-to-body ratio of the electronic device, a smaller touch area and visual area available for user interaction, and thus affecting the user experience.

[0007] The edge bending part of the display module is cancelled in the embodiment of the present application, and the conductor is formed by printing on the side of the display module. The conductor can be close to the side of the display layer and the electric connection layer, and the volume of the conductor is small, so that the edge of the display module does not need to reserve a large space, thereby reducing the area of the frame surrounding the display module in the electronic device, improving the screen ratio of the electronic device, so that the user can enjoy a larger visual area to obtain a better visual experience.

[0008] In addition, when the user uses multiple electronic devices at the same time, the screens of the multiple electronic devices need to be close to each other for use. The display edge of the electronic device has a narrow frame, which can reduce the distance between the display screens of the multiple electronic devices, thereby making it more convenient for the user to read the information on the screens of the two electronic devices at the same time, and improving the user's experience.

[0009] In some embodiments, the display module further comprises a support layer and a first insulator. The support layer is connected between the display layer and the electric connection layer, and the side of the support layer is spaced apart from the conductor. The first insulator is connected between the side of the support layer and the conductor, and is located between the display layer and the electric connection layer.

[0010] In the embodiment, the first insulator can also support the display layer and the electric connection layer, prevent deformation of the edge position of the display layer and the electric connection layer, and ensure that the positions of the first conductive point and the second conductive point do not relatively deviate, so that the conductor can be accurately connected with the first conductive point and the second conductive point.

[0011] In some embodiments, the first signal layer comprises a first subpart and a second subpart. The second subpart is connected between the first subpart and the conductor, and the thickness of the second subpart is greater than the thickness of the first subpart.

[0012] In the embodiment, the thickening of the metal trace at the second subpart can make the area of the connection between the first signal layer and the conductor large enough, so that the first signal layer and the conductor can be stably electrically connected.

[0013] In some embodiments, the display module further comprises a protective layer. The protective layer is connected to the side of the display layer away from the electric connection layer, and the side of the protective layer is protrudingly arranged relative to the conductor.

[0014] In the embodiment, the conductor is hidden below the protective layer, and the conductor does not additionally increase the area of the non-display area of the display module, thereby reducing the area of the frame surrounding the display module in the electronic device, improving the screen ratio of the electronic device, so that the user can enjoy a larger visual area to obtain a better visual experience.

[0015] In some embodiments, the display module further comprises a second insulator. The second insulator is connected to the side of the display layer and the side of the electric connection layer, and covers the conductor.

[0016] In the embodiment, the second insulator can coat the exposed surface of the conductive body, so as to avoid damage of the conductive body caused by external force impact, and prevent the display layer and the electrically connecting layer from being unable to be electrically connected, thereby causing the display module to fail to be connected to the circuit board.

[0017] In some embodiments, the side of the second insulator away from the conductive layer is flush with the side surface of the protective layer.

[0018] In the embodiment, the second insulator requires a smaller installation space and does not protrude relative to the third side surface of the protective layer, so as not to increase the width of the frame of the periphery of the display module, so that a narrower frame can be arranged at the periphery of the display module, thereby improving the screen-to-body ratio of the electronic device, so that the user can enjoy a larger visual area.

[0019] In some embodiments, the display layer includes two non-bending regions and a bending region, the two non-bending regions are located on opposite sides of the bending region, the support layer includes two first parts and a second part, the two first parts are connected to opposite sides of the second part, the two first parts are respectively connected to the two non-bending regions, and the second part is connected to the bending region, and the thickness of the second part is smaller than the thickness of the first part.

[0020] In the embodiment, the two first parts of the support layer can be close to each other, and the second part of the support layer can be bent to complete the folding. The support layer is prepared by using a material with a relatively high elastic modulus, so that the second part will not be irreversibly deformed when the second part of the support layer is bent. The support layer used in the embodiment has the characteristics of low creep.

[0021] In addition, the display layer is generally provided with a back film in the prior art to further protect and support the display layer. The back film and the support layer are combined in the present application, the layer structure of the display module is reduced, which is conducive to the thinning of the display module, and the possibility of peeling between the film layers is reduced, and the use reliability of the display module is improved.

[0022] In some embodiments, the display layer includes two non-bending regions and a bending region, the two non-bending regions are located on opposite sides of the bending region, the support layer includes a first sub-layer and a second sub-layer, the first sub-layer is connected to the display layer, the first sub-layer includes a middle region and two side regions, the two side regions are located on opposite sides of the middle region, one side region is connected to one non-bending region, the middle region is connected to the bending region, and the second sub-layer includes two sub-parts, the two sub-parts are respectively connected to one side of the two side regions away from the non-bending region.

[0023] In the embodiment, the middle region of the first sub-layer is not covered by the second sub-layer, and the middle region of the first sub-layer is easier to bend, so that the side regions on both sides are close to each other, and the electronic device is in a folded state. The first sub-layer and the second sub-layer can jointly support the display layer to keep the display layer in a flat state or a folded state.

[0024] In some embodiments, the display module further comprises an elastic body connected between the two sub-regions of the second sub-layer, and the elastic body is connected to one side of the middle region of the first sub-layer away from the bending region.

[0025] In the embodiment, the elastic body can support the middle region of the first sub-layer, thereby improving the structural strength of the middle part of the support layer. The elastic body has a high elastic modulus, and in the bent state of the middle region of the first sub-layer, the elastic body can easily adapt to the deformation of the middle region of the first sub-layer for bending.

[0026] In some embodiments, the material of the protective layer is a thermosetting material or a light-curing material.

[0027] At present, the display module is generally composed of multiple layers of flexible materials with low rigidity. This way, the module structure is complex and is not conducive to thinning, and in the folding process of the electronic device, peeling may occur between the multiple film layer structures. The present application directly connects the protective layer to the first light-emitting surface and uses only a single layer of protective layer, avoiding the use of a glue layer to connect the protective layer to the first light-emitting surface, thereby reducing the number of layer structures of the display module, facilitating the thinning of the display module, and improving the bonding strength of the protective layer and the display layer, reducing the possibility of peeling between the film layers, and improving the use reliability of the display module.

[0028] In some embodiments, the first signal layer comprises a first sub-signal layer and a second sub-signal layer, the first sub-signal layer is located on the side of the second sub-signal layer facing the electrically connected layer, the side of the first sub-signal layer is provided with a plurality of first conductive points, and the side of the second sub-signal layer is provided with a plurality of first conductive points. The first sub-signal layer is electrically connected to the second signal layer through a conductive body, and the second sub-signal layer is electrically connected to the second signal layer through a conductive body.

[0029] In the embodiment, the bending region of the edge of the display module is cancelled, and the conductive body is formed by printing on the side edge of the display module. The first sub-signal layer is in communication with the second signal layer of the electrically connected layer through the conductive body of the side edge, and the second sub-signal layer is in communication with the second signal layer of the electrically connected layer through the conductive body of the side edge. The conductive body can tightly adhere to the side of the display layer and the electrically connected layer, and the volume of the conductive body is small, so that the edge of the display module does not need to reserve a large space, thereby reducing the area of the frame surrounding the display module in the electronic device, improving the screen ratio of the electronic device, so that the user can enjoy a larger visual area and obtain a better visual experience.

[0030] In a second aspect, the present application also provides a display module, comprising a display layer, an electrical connection layer and a conductive body. The display layer comprises a first signal layer, and the display layer is provided with a first through hole penetrating the first signal layer in the thickness direction of the display layer, and the first through hole is located in the non-display area of the display module. The electrical connection layer comprises a second signal layer, and the electrical connection layer is provided with a second through hole penetrating the second signal layer, and the second through hole is in communication with the first through hole. The conductive body is arranged in the first through hole and the second through hole, and the conductive body is electrically connected with the first signal layer and the second signal layer.

[0031] In some embodiments, the display module further comprises a support layer and an insulator, the support layer is connected between the display layer and the electrical connection layer, the support layer is provided with a third through hole penetrating the support layer in the thickness direction of the support layer, the insulator is located in the third through hole, the insulator is provided with a fourth through hole, the fourth through hole is in communication with the first through hole and the second through hole, and part of the conductive body is located in the fourth through hole.

[0032] In the embodiment, the conductive body can be located inside the display layer, the support layer and the electrical connection layer. The conductive body does not occupy the space of the side of the display layer, the support layer and the electrical connection layer. The conductive body does not occupy the edge position of the display module, so that the area of the edge of the display module which cannot display images is further reduced, and the frame of the display screen of the electronic device is further narrowed, so as to improve the screen-to-body ratio of the electronic device.

[0033] The insulator can be arranged inside the support layer and sleeved around the periphery of the middle part of the conductive body, so that the support layer can be electrically isolated from the conductive body. The isolation of the support layer and the conductive body can ensure that the conductive body will not be short-circuited with the support layer, and ensure that the first signal layer and the second signal layer can normally transmit electrical signals through the conductive body.

[0034] In a third aspect, the present application also provides a display module, comprising a display layer, an electrical connection layer and a conductive body. The display layer comprises a first signal layer and a first electrical connection point, the first electrical connection point is connected to the surface of the display layer for emitting light, and the first electrical connection point is electrically connected with the first signal layer. The electrical connection layer is located on the non-display side of the display layer, and the electrical connection layer comprises a second signal layer and a second electrical connection point, the second electrical connection point is connected to the surface of the electrical connection layer away from the display layer, and the second electrical connection point is electrically connected with the second signal layer. The conductive body comprises a first segment, a second segment and a third segment, the first segment covers the first electrical connection point, the second segment covers the second electrical connection point, and the third segment is connected between the first segment and the second segment, and is connected to the side surface of the display layer and the side surface of the electrical connection layer.

[0035] In the embodiment, the first electric connection point can increase the area of the electrically conductive body electrically connected with the first signal layer of the display layer, so that the electric connection between the electrically conductive body and the first signal layer is more stable, and the transmission quality and stability of the electric signal of the display module are improved. The second electric connection point can increase or decrease the area of the electrically conductive body electrically connected with the second signal layer of the electric connection layer, so that the electric connection between the electrically conductive body and the second signal layer is more stable, the electric connection stability between the display layer and the electric connection layer is better, and the signal transmission stability between the display layer and the electric connection layer is improved.

[0036] In some embodiments, the display layer further comprises a flat layer, the first signal layer comprises a first sub-signal layer and a second sub-signal layer, the first sub-signal layer, the flat layer and the second sub-signal layer are sequentially stacked, the flat layer is located on the side of the first sub-signal layer away from the electric connection layer, the flat layer is provided with a through hole, and the through hole penetrates through the flat layer along the thickness direction of the flat layer. At least part of the first electric connection points are located on the side of the flat layer away from the first sub-signal layer, the number of the first electric connection points is multiple, part of the number of the first electric connection points are electrically connected with the second sub-signal layer, and part of the number of the second electric connection points pass through the through hole and are electrically connected with the first sub-signal layer.

[0037] In the embodiment, the electric connection points of the second sub-signal layer and the electric connection points of the first sub-signal layer are arranged in the same layer and located on the side of the display surface of the display module. In this way, when the electrically conductive body covers the edge of the display surface, the electrically conductive body can be electrically connected with the first electric connection points, so that the driving chip connected with the electric connection layer can be electrically connected with the second sub-signal layer and the first sub-signal layer.

[0038] In some embodiments, the first electric connection point electrically connected with the first sub-signal layer comprises an extension part and a main body, the extension part is located in the through hole and is electrically connected with the first sub-signal layer, the main body is located on the side of the flat layer away from the first sub-signal layer and is connected with the extension part, at least part of the main body is covered by the first section, and the main body protrudes from the side of the extension part facing the third section.

[0039] In the embodiment, the main body can extend from the position of the through hole to the edge of the display area. That is, the main body extends away from the insulating part. Extending the main body away from the edge of the display module can further avoid increasing the width of the non-display area of the edge region of the display module, thereby reducing the black edge position of the display module, further improving the screen-to-body ratio of the display module, and improving the user experience.

[0040] In some embodiments, the first electric connection point electrically connected with the first sub-signal layer comprises an extension part and a main body, the extension part is located in the through hole and is electrically connected with the first sub-signal layer, the main body is located on the side of the flat layer away from the first sub-signal layer and is connected with the extension part, at least part of the main body is covered by the first section, and the main body protrudes from the side of the extension part facing the third section.

[0041] In some embodiments, the display module further comprises a thin film transistor, and the first sub-signal layer is electrically connected with the thin film transistor.

[0042] The second sub-signal layer of the display module can be a touch line of a touch layer of the display module.

[0043] In the current common display module, the edge position of the touch line is generally sunken, so that the display signal line connected with the touch line and the thin film transistor is located in the same layer, and then the touch line and the display signal line are bent and electrically connected with the driving chip. However, since the bending area occupies the edge space of the display module, the edge width of the electronic device cannot be reduced, the wider the frame of the electronic device, the smaller the screen ratio of the electronic device, which leads to a smaller touch area and visual area that the user can interact, and thus the user experience is affected.

[0044] In the present embodiment, the first sub-signal layer for electrical connection with the thin film transistor is arranged in the same layer as the second sub-signal layer for forming the touch line through the first electrical connection point, that is, the electrical connection points of the first sub-signal layer and the second sub-signal layer are located on the surface of the display layer away from the electrical connection layer. At this time, the electrical connection with the first sub-signal layer and the second sub-signal layer can be completed by covering the edge of the surface of the display layer away from the electrical connection layer with the conductive body, so that the first sub-signal layer and the second sub-signal layer can be conductive with the second signal layer, thereby removing the bending area of the display module, and the display layer and the electrical connection layer can be stably electrically connected.

[0045] In a fourth aspect, the present application further provides an electronic device, which comprises a circuit board, an adapter plate and a display module as described above, and the circuit board is electrically connected with the electrical connection layer through the adapter plate. BRIEF DESCRIPTION OF DRAWINGS

[0046] In order to more clearly illustrate the technical solutions of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creating laborious work.

[0047] FIG. 1 is a structural schematic diagram of an electronic device according to an embodiment of the present application;

[0048] FIG. 2 is a partial structural schematic diagram of the electronic device shown in FIG. 1;

[0049] FIG. 3 is a partial structural schematic diagram of a display module in the prior art;

[0050] FIG. 4 is a cross-sectional schematic diagram of the display module shown in FIG. 2 and the adapter plate connected at A-A in the first embodiment;

[0051] FIG5 is a schematic cross-sectional view of the display layer shown in FIG4 ;

[0052] FIG6 is a partial cross-sectional schematic diagram of the display layer shown in FIG5 ;

[0053] FIG7 is a schematic cross-sectional view of the electrical connection layer shown in FIG4 ;

[0054] FIG8 is a schematic diagram of a partial structure of the display module shown in FIG4;

[0055] FIG9 is a partially exploded schematic diagram of the display module shown in FIG4 ;

[0056] FIG10 is a schematic structural diagram of the initial state of the display module shown in FIG4;

[0057] FIG11 is a cross-sectional schematic diagram of a second embodiment of the connection between the display module shown in FIG2 and the adapter plate;

[0058] FIG12 is a schematic cross-sectional view of the display layer shown in FIG11 ;

[0059] FIG13 is a schematic cross-sectional view of the electrical connection layer shown in FIG11;

[0060] FIG14 is a partial structural diagram of a third embodiment of the display module shown in FIG2 ;

[0061] FIG15 is a schematic structural diagram of the elastic body shown in FIG14;

[0062] FIG16 is a schematic structural diagram of the elastic body shown in FIG15 in a bent state;

[0063] FIG17 is another schematic structural diagram of an electronic device provided in an embodiment of the present application;

[0064] FIG18 is a schematic diagram of a partial structure of the electronic device shown in FIG17;

[0065] FIG19 is a schematic cross-sectional view of the display module shown in FIG18 taken at point BB;

[0066] FIG20 is a schematic cross-sectional view of a fifth embodiment of the display module shown in FIG2 ;

[0067] FIG21 is a schematic structural diagram of the first electrical connection point shown in FIG20;

[0068] FIG22 is a partial structural diagram of a sixth embodiment of the display layer shown in FIG2 ;

[0069] FIG23 is a schematic cross-sectional view of a portion CC of the display layer shown in FIG22 ;

[0070] FIG24 is a schematic cross-sectional view of a portion DD of the display layer shown in FIG22 ;

[0071] FIG. 25 is a top view of the display layer shown in FIG. 22;

[0072] FIG. 26 is another top view of the display layer shown in FIG. 22;

[0073] FIG. 27 is a cross-sectional view of a seventh embodiment of the display layer shown in FIG. 2;

[0074] FIG. 28 is a cross-sectional view of an eighth embodiment of the display layer and the first conductive body shown in FIG. 2;

[0075] FIG. 29 is a cross-sectional view of the eighth embodiment of the display layer and the second conductive body shown in FIG. 28. DETAILED DESCRIPTION

[0076] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in other ways different from those described herein, and therefore the present application is not limited to the following embodiments.

[0077] For the convenience of understanding, the terms involved in the embodiments of the present application are first explained.

[0078] Multiple: refers to two or more than two.

[0079] Connection: should be understood broadly, for example, A and B are connected, which can be A and B directly connected, or A and B indirectly connected through intermediate media.

[0080] The specific embodiments of the present application will be described in detail below with reference to the accompanying drawings.

[0081] Please refer to FIG. 1 and FIG. 2, FIG. 1 is a structural schematic diagram of an electronic device 100 provided by an embodiment of the present application. FIG. 2 is a partial structural schematic diagram of the electronic device 100 shown in FIG. 1. An embodiment of the present application provides an electronic device 100. The electronic device 100 includes a housing 20, a circuit board (not shown in the figure), a conversion board 40, a driving chip 50, and a display module 10.

[0082] The housing 20 can provide mounting space for the circuit board, the conversion board 40, the driving chip 50, and the display module 10.

[0083] The circuit board is electrically connected to the display module 10 through the conversion board 40. The circuit board can be the mainboard of the electronic device, and the circuit board can have functions such as power management, communication interface, control and management. The circuit board is the hub connecting and coordinating between various hardware components.

[0084] The adapter plate 40 can be a flexible circuit board.

[0085] The driving chip 50 is connected to the display module 10. The driving chip 50 can convert the signal from the circuit board into a signal required by the display module 10, so that the display module 10 displays an image.

[0086] It should be noted that the purpose of FIG. 2 is only to schematically describe the connection relationship of the circuit board, the adapter plate 40, the driving chip 50, and the display module 10, and not to specifically limit the connection position, specific structure, and quantity of each device. The structure illustrated in the embodiments of the present application does not constitute a specific limitation on the electronic device 100. In other embodiments of the present application, the electronic device 100 can include more or fewer components than illustrated, or combine certain components, or split certain components, or different component arrangements. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.

[0087] At present, please refer to FIG. 3, which is a partial structure diagram of the display module 1 in the prior art. Generally, the display layer 2 of the display module 1 of the electronic device is bent to the back of the substrate structure 3, so that the edge of the display layer 2 can be electrically connected with the flexible circuit board 4. The flexible circuit board 4 can be provided with an electrical connector 5. The electrical connector 5 can be buckled with an electrical connector on the mainboard of the electronic device, thereby realizing power supply and data transmission of the mainboard to the display module 1. However, the bending area of the display layer 2 occupies the peripheral position of the display module 1, resulting in a wider screen frame of the electronic device, which brings a bad visual experience to the user and affects the user experience of the customer.

[0088] Based on this, the present application provides various embodiments of the display module 10, which can optimize the connection mode of the display module 10 and the adapter plate 40, avoid the bending part of the display layer from occupying the peripheral space of the display module 10, and improve the screen-to-body ratio of the electronic device 100, thereby improving the appearance of the electronic device 100.

[0089] In a first possible embodiment, please refer to FIG. 4, which is a cross-sectional view of the first embodiment of the connection between the display module 10 and the adapter plate 40 at A-A in FIG. 2. The display module 10 includes a display part 11, a protection layer 12, a support layer 13, and an electrical connection structure 14. The display part 11 converts electrical signals into visible images by controlling parameters such as color and brightness of the pixel unit. The protection layer 12 is used to protect the display part 11. The support layer 13 can provide structural support to the display part 11. The electrical connection structure 14 is used to conduct two parts of the display module 10.

[0090] The display part 11 comprises a display layer 111 and an electric connection layer 112. The display layer 111 is a layer structure for presenting images for the display module 10. The electric connection layer 112 can be formed for the edge part of the display part 11 without display function. Alternatively, the electric connection layer 112 can also be a kind of circuit board, and the wiring interval in the circuit board can be the same as the wiring interval of the conductive layer in the display layer 111. The specific structure of the electric connection layer 112 will be described in detail below.

[0091] Referring to FIG. 5, FIG. 5 is a schematic cross-sectional view of the display layer 111 shown in FIG. 4. The display layer 111 can comprise a first substrate layer 1111, a buffer layer 1112, a second substrate layer 1113, a first barrier layer 1114, a light shielding layer 1115 (LS), a second barrier layer 1116, an interlayer dielectric 1117 (ILD), a first planarization layer 1118 (PNL), a second planarization layer 1119, a pixel definition layer 1120 (PDL), a first signal layer 1121, and a pixel unit 1122. Along the thickness direction of the display layer 111, the first substrate layer 1111, the buffer layer 1112, the second substrate layer 1113, the first barrier layer 1114, the light shielding layer 1115, the second barrier layer 1116, the interlayer dielectric 1117, the second planarization layer 1119, and the pixel definition layer 1120 are sequentially stacked. The first planarization layer 1118, the first signal layer 1121, and the pixel unit 1122 are arranged inside the stacked structure.

[0092] The first substrate layer 1111 can be a flexible structure. For example, the material of the first substrate layer 1111 can be polyimide (PI).

[0093] In this embodiment, the first substrate layer 1111 can play a supporting role for the display layer 111, so as to make the overall structure of the display module 10 more stable, thereby making the display module 10 have better display effect, and providing better user experience.

[0094] The buffer layer 1112 is connected to the surface of the first substrate layer 1111. For example, the buffer layer 1112 can comprise three sub-layers, which are two silicon oxide layers (SiOx) and one silicon nitride layer (SiNx). The silicon nitride layer can be arranged between the two silicon oxide layers.

[0095] In the embodiment, the buffer layer 1112 can absorb external force received by the display layer 111, avoid the external force from being conducted to the layer structure above the buffer layer 1112 and the pixel unit 1122, protect the pixel unit 1122 and other structures from being impacted by the external force, avoid the display function of the display layer 111 from being damaged due to the impact of the excessive external force, and improve the impact resistance of the display module 10.

[0096] The second substrate layer 1113 is connected to the surface of the buffer layer 1112 away from the first substrate layer 1111. The second substrate layer 1113 can be made of the same material as the first substrate layer 1111, and the function and material of the second substrate layer 1113 can refer to the description of the first substrate layer 1111 above. The second substrate layer 1113 will not be described herein.

[0097] The first barrier layer 1114 is connected to the part of the surface of the second substrate layer 1113 away from the buffer layer 1112. For example, the material of the first barrier layer 1114 can be silicon oxide (SiOx).

[0098] In the embodiment, the first barrier layer 1114 can prevent the second substrate layer 1113 and the light shielding layer 1115 from reacting with each other, ensure that the components of the second substrate layer 1113 and the light shielding layer 1115 do not affect each other, ensure that the materials of the second substrate layer 1113 and the light shielding layer 1115 and other layer structures do not deteriorate, and prevent the second substrate layer 1113 and the light shielding layer 1115 and other layer structures from failing due to the deterioration.

[0099] The light shielding layer 1115 is connected to the part of the surface of the first barrier layer 1114 away from the second substrate layer 1113. For example, the material of the light shielding layer 1115 can be molybdenum (Mo).

[0100] In the embodiment, the light shielding layer 1115 can be located on the side of the pixel unit 1122 facing the first substrate layer 1111. The light shielding layer 1115 can prevent the light of the pixel unit 1122 from being emitted from the side of the first substrate layer 1111, and prevent the side of the first substrate layer 1111 of the display layer 111 from leaking light.

[0101] The second barrier layer 1116 is connected to the surface of the first barrier layer 1114 away from the second substrate layer 1113 and covers the light shielding layer 1115. For example, the material of the second barrier layer 1116 can be silicon oxide (SiOx).

[0102] In the embodiment, the pixel unit 1122 is arranged on the side of the second barrier layer 1116 away from the first barrier layer 1114. Therefore, the second barrier layer 1116 can protect the pixel unit 1122 from impurities, moisture and oxygen in the environment, reduce the defects and leakage of the semiconductor surface of the pixel unit 1122, and improve the stability and reliability of the display module 10.

[0103] The isolation layer 1117 is connected to the portion of the surface of the second barrier layer 1116 facing away from the first barrier layer 1114. There are a plurality of gaps between the isolation layer 1117 and the second barrier layer 1116. For the convenience of description, the two adjacent gaps in FIG. 4 are defined as a first gap 1123 and a second gap 1124. The first gap 1123 and the second gap 1124 can be used to set the partial layer structure of the pixel unit 1122. Exemplarily, the material of the isolation layer 1117 can be an organic material.

[0104] In this embodiment, the isolation layer 1117 covers the side of the partial pixel unit 1122 facing away from the second barrier layer 1116. The isolation layer 1117 can protect the pixel unit 1122 from impurities, moisture and oxygen in the environment.

[0105] The first planar layer 1118 is located on the side of the second gap 1124 facing away from the first gap 1123. Part of the first planar layer 1118 is connected to the portion of the surface of the second barrier layer 1116 facing away from the first barrier layer 1114. Another part of the first planar layer 1118 is connected to the surface of the second base layer 1113 facing away from the buffer layer 1112. The first planar layer 1118 also covers part of the side of the first barrier layer 1114 and the second barrier layer 1116.

[0106] Part of the second planar layer 1119 is connected to the surface of the isolation layer 1117 facing away from the second barrier layer 1116. Another part of the second planar layer 1119 is located on the side of the first planar layer 1118 facing away from the first base layer 1111. Exemplarily, the material of the second planar layer 1119 is an organic material.

[0107] In this embodiment, the second planar layer 1119 can make the surface of the isolation layer 1117 more flat, so that the layer structure (the pixel definition layer 1120 and the structure of the partial pixel unit 1122) above the second planar layer 1119 can be uniformly distributed and attached to the second planar layer 1119, ensuring the uniformity and consistency of the pixel definition layer 1120, thereby improving the display effect of the display layer 111. The second planar layer 1119 can also avoid the direct contact between the light-emitting layer of the pixel unit 1122 and the pixel definition layer 1120, thereby reducing the ion exchange between the light-emitting layer and the pixel definition layer 1120, avoiding the deterioration of the light-emitting layer and the pixel definition layer 1120 caused by ion exchange, and preventing the problems of display chroma change and service life attenuation of the display layer 111.

[0108] The pixel definition layer 1120 is connected to the surface of the second planar layer 1119 away from the isolation layer 1117. The material of the pixel definition layer 1120 can be an organic material, for example. The surface of the pixel definition layer 1120 away from the second planar layer 1119 is the first light emitting surface 1125 of the display layer 111. The light emitted by the pixel unit 1122 can pass through the pixel definition layer 1120 and be emitted from the first light emitting surface 1125. The side of the display module 10 provided with the pixel definition layer 1120 is the display side of the display module 10, for displaying images. The side of the display module 10 away from the pixel definition layer 1120 is the non-display side of the display module 10. That is, the side of the display module 10 provided with the first base layer 1111 is the non-display side of the display module 10.

[0109] In this embodiment, the pixel definition layer 1120 can prevent crosstalk between the pixel units 1122, avoid light leakage from one pixel unit 1122 to another pixel unit 1122, and prevent the display quality of the display layer 111 from being degraded due to light crosstalk.

[0110] Please refer to FIG. 5 and FIG. 6, which is a partial cross-sectional view of the display layer 111 shown in FIG. 5. The first signal layer 1121 includes a first conductor 1127, a second conductor 1128, and a third conductor 1129. The first conductor 1127, the second conductor 1128, and the third conductor 1129 can each be a part of the conductive pattern of the first signal layer 1121. The first conductor 1127, the second conductor 1128, and the third conductor 1129 can be arranged apart from each other.

[0111] The first conductor 1127 is located on the side of the first gap 1123 away from the second gap 1124. A part of the first conductor 1127 is located between the isolation layer 1117 and the second planar layer 1119. Another part of the first conductor 1127 passes through the isolation layer 1117 and is connected to the semiconductor layer. Another part of the first conductor 1127 passes through the isolation layer 1117 and is connected to the light shielding layer 1115.

[0112] At least a part of the second conductor 1128 is located between the first gap 1123 and the second gap 1124. A part of the second conductor 1128 is located between the isolation layer 1117 and the second planar layer 1119. Another part of the second conductor 1128 passes through the isolation layer 1117 and is connected to the semiconductor layer.

[0113] The third conductor 1129 is located on a side of the second gap 1124 facing away from the first gap 1123. The third conductor 1129 is located between the first planar layer 1118 and the second planar layer 1119. The third conductor 1129 includes a first sub-portion 1129a and a second sub-portion 1129b. The second sub-portion 1129b is located on a side of the first sub-portion 1129a facing an edge of the display layer 111. Specifically, the second sub-portion 1129b is located on a side of the first sub-portion 1129a facing a first side of the display layer 111.

[0114] The thickness of the second sub-portion 1129b is greater than the thickness of the first sub-portion 1129a. For example, the thickness of the first sub-portion 1129a is H1. The thickness of the second sub-portion 1129b is H2. The relationship between H1 and H2 can satisfy: 2H1≤H2≤3H1.

[0115] The display layer 111 also has a first side 1126. The first side 1126 is connected to an edge of the first light-emitting surface 1125. The first side 1126 is arranged at an angle with the first light-emitting surface 1125. For example, the first side 1126 can be arranged perpendicular to the first light-emitting surface 1125. The first side 1126 includes a portion of a side of the first base layer 1111, a portion of a side of the first planar layer 1118, a side of the second sub-portion 1129b of the third conductor 1129, a portion of a side of the second planar layer 1119, and a portion of a side of the pixel definition layer 1120. For convenience of description, the side of the second sub-portion 1129b in the first side 1126 is defined as a first conductive point 1110. The number of the first conductive points 1110 can be multiple.

[0116] The pixel unit 1122 can include a semiconductor layer 121, a third barrier layer 122, a cathode 123, and an anode 124. The semiconductor layer 121 can emit light under the action of the cathode 123 and the anode 124. The third barrier layer 122 can insulate the cathode 123 and the anode 124.

[0117] The semiconductor layer 121 is located in the first gap 1123. In the thickness direction of the display layer 111, the projection of the semiconductor layer 121 on the surface of the light-blocking layer 1115 is located in the light-blocking layer 1115. For example, the material of the semiconductor layer 121 can be low-temperature polycrystalline silicon (LTPS) or low-temperature polycrystalline oxide (LTPO). The semiconductor layer 121 can emit light under the excitation of electrons and holes.

[0118] The third barrier layer 122 includes a first sub-portion 1221 and a second sub-portion 1222. The first sub-portion 1221 and the second sub-portion 1222 are spaced apart. Exemplarily, the first sub-portion 1221 and the second sub-portion 1222 can be made of silicon oxide.

[0119] The first sub-portion 1221 is located in the first gap 1123 and between the semiconductor layer 121 and the isolation layer 1117. The first sub-portion 1221 is connected to a surface of the semiconductor layer 121 away from the second barrier layer 1116.

[0120] The second sub-portion 1222 is located in the second gap 1124. The second sub-portion 1222 is connected to a surface of the second barrier layer 1116 away from the first barrier layer 1114.

[0121] The cathode 123 includes a third sub-portion 1231 and a fourth sub-portion 1232. The third sub-portion 1231 and the fourth sub-portion 1232 are spaced apart.

[0122] The third sub-portion 1231 is located in the first gap 1123 and connected between the first sub-portion 1221 and the isolation layer 1117.

[0123] The fourth sub-portion 1232 is located in the second gap 1124 and connected between the second sub-portion 1222 and the isolation layer 1117.

[0124] The partial anode 124 is located between the pixel definition layer 1120 and the second planar layer 1119. The anode 124 is electrically connected with the second conductor 1128 through the second planar layer 1119. Exemplarily, the anode 124 can be made of indium tin oxide (ITO) or silver (Ag).

[0125] It should be noted that the structure of the pixel unit 1122 described above is only illustrative and does not limit the structure of the display layer 111 of the present application. The pixel unit 1122 of the display layer 111 of the present application can also be any light-emitting unit that can realize display of images. The arrangement position of the pixel unit 1122 can be adaptively adjusted. The area of the display layer 111 in which the pixel unit 1122 is arranged is the display area of the display module 10, and the area of the display layer 111 in which the pixel unit 1122 is not arranged is the non-display area of the display module 10. The non-display area can be connected to the periphery of the display area.

[0126] Referring to FIG. 7, FIG. 7 is a schematic cross-sectional view of the electrical connection layer 112 shown in FIG. 4. The electrical connection layer 112 includes a first base layer 1131, a buffer layer 1132, a second base layer 1133, a first barrier layer 1134, a second barrier layer 1136, a first planar layer 1138, a second signal layer 1141, a second planar layer 1139, and a pixel definition layer 1140. The electrical connection layer 112 has a second side 1146. The second side 1146 includes a side of the multi-layer structure in the electrical connection layer 112. The specific structure of the second side 1146 will be described in detail below.

[0127] The first base layer 1131, the buffer layer 1132, and the second base layer 1133 are sequentially stacked in the thickness direction of the electrical connection layer 112.

[0128] The first barrier layer 1134 is connected to a surface of the second base layer 1133 facing away from the buffer layer 1132.

[0129] The second barrier layer 1136 is connected to a surface of the first barrier layer 1134 facing away from the second base layer 1133.

[0130] The first planar layer 1138 covers a surface of the second barrier layer 1136 facing away from the first barrier layer 1134, a part of the surface of the second base layer 1133 facing away from the buffer layer 1132, and at least part of the side surface of the first barrier layer 1134 and at least part of the side surface of the second barrier layer 1136.

[0131] The second signal layer 1141 is connected to a surface of the first planar layer 1138 facing away from the second barrier layer 1136. The second signal layer 1141 can be thickened. For example, the thickness of the second signal layer 1141 can be the same as the thickness of the second sub-portion 1129b of the first signal layer 1121.

[0132] In some embodiments, the second signal layer 1141 can include a third sub-portion 1141a and a fourth sub-portion 1141b. The fourth sub-portion 1141b is located on one side of the third sub-portion 1141a facing the edge of the electrical connection layer 112. Specifically, the fourth sub-portion 1141b is located on one side of the third sub-portion 1141a facing the second side 1146 of the electrical connection layer 112. The thickness of the second sub-portion 1129b is greater than the thickness of the first sub-portion 1129a. For example, the thickness of the third sub-portion 1141a is H3. The thickness of the fourth sub-portion 1141b is H4. The relationship between H3 and H4 can satisfy: 2H3≤H4≤3H3.

[0133] The second planar layer 1139 is connected to a surface of the second signal layer 1141 facing away from the first planar layer 1138.

[0134] The pixel definition layer 1140 is connected to the surface of the second planar layer 1139 away from the second signal layer 1141.

[0135] The second side surface 1146 includes a plurality of sub-portions. The sub-portions of the second side surface 1146 are respectively a portion of the side surface of the first base layer 1131 of the electric connection layer 112, a portion of the side surface of the first planar layer 1138, a portion of the side surface of the second signal layer 1141, a portion of the side surface of the second planar layer 1139, and a portion of the side surface of the pixel definition layer 1140. Among them, for the convenience of description, the portion of the side surface of the second signal layer 1141 in the second side surface 1146 is defined as the second conductive point 1130. The number of the second conductive point 1130 can be multiple.

[0136] The electric connection layer 112 is stacked and spaced apart from the display layer 111. The first base layer 1131 of the electric connection layer 112 is opposite and spaced apart from the first base layer 1111 of the display layer 111. That is, the electric connection layer 112 is located on the non-display side of the display layer 111. The electric connection layer 112 is located on the side away from the first light-emitting surface 1125 of the display layer 111. The second side surface 1146 of the electric connection layer 112 is disposed on the same side as the first side surface 1126 of the display layer 111. And the second side surface 1146 is flush with the first side surface 1126.

[0137] It should be noted that the electric connection layer shown in FIG. 7 is only an exemplary illustration. The electric connection layer 112 can be bent to form an edge portion of the display portion 11. The electric connection layer 112 can have a portion of the signal layer in the display portion 11 without having a pixel unit in the display portion 11. Alternatively, the electric connection layer 112 can also be a special flexible printed circuit board (FPC). The line spacing of the signal layer wiring in the electric connection layer 112 can be similar to the line spacing in the display layer 111. The line width of the signal layer wiring in the electric connection layer 112 can also be similar to the line width in the display layer 111.

[0138] Please refer to FIG. 4 again. The protective layer 12 is connected to the first light-emitting surface 1125 of the display layer 111. The protective layer 12 includes a third side surface 125. The third side surface 125 is disposed on the same side as the display layer 111 and the first side surface 1126 and the second side surface 1146 of the electric connection layer 112. The third side surface 125 is protruded relative to the first side surface 1126 and the second side surface 1146.

[0139] Exemplarily, the material of the protective layer 12 can be a thermosetting material or a photocuring material. In actual production, a semi-solid epoxy film can be attached to the first light-emitting surface 1125 of the display layer 111. Then, the semi-solid epoxy film is cured by heating to form a film to form the protective layer 12. The thickness of the semi-solid epoxy film can range from 10 um to 100 um (including the end values 10 um and 100 um). Alternatively, a glass fiber mesh composite resin can be coated on the first light-emitting surface, and then cured to form a film to form the protective layer 12. The thickness of the glass fiber mesh composite resin coating can range from 10 um to 100 um (including the end values 10 um and 100 um).

[0140] At present, a display module is generally composed of multiple layers of flexible materials with low rigidity. The protective layer can generally be made of polyimide (PI) or polyethylene terephthalate (PET) and the like, and is connected to the display layer by optical clear adhesive (OCA). This way leads to a complex structure of the display module, which is not conducive to thinning, and the multiple film layers can be dislocated during folding of the electronic device. The present application directly connects the protective layer 12 to the first light-emitting surface 1125 and uses only a single layer of the protective layer 12, thereby avoiding the use of an adhesive layer to connect the protective layer 12 to the first light-emitting surface 1125, reducing the number of layer structures of the display module 10, facilitating thinning of the display module 10, improving the bonding strength of the protective layer 12 and the display portion 11, reducing the possibility of peeling between the film layers, and improving the use reliability of the display module 10.

[0141] Please refer to FIG. 4 and FIG. 8, FIG. 8 is a partial structure diagram of the display module 10 shown in FIG. 4. The electronic device 100 can be a foldable electronic device. The display layer 111 includes two non-bending areas 111a and one bending area 111b. The two non-bending areas 111a are respectively located on the opposite sides of the bending area 111b.

[0142] The support layer 13 is located between the display layer 111 and the electrical connection layer 112. The support layer 13 includes two first portions 131 and one second portion 132. The two first portions 131 are located on the opposite sides of the second portion 132.

[0143] One surface of the first portion 131 in the thickness direction can be connected to a non-bending area 111a of the display layer 111 through the adhesive layer 15, and the edge area of the other surface in the thickness direction can be connected to the electrical connection layer 112 through the adhesive layer 16. The first portion 131 includes a fourth side surface 1311, which is located on the same side as the first side surface 1126 and the second side surface 1146. The fourth side surface 1311 can be recessed relative to the first side surface 1126 and the second side surface 1146.

[0144] The other first portion 131 is connected to another non-bending area 111a of the display layer 111 through the adhesive layer 15. The thickness of the first portion 131 can be in the range of 10 um to 150 um, inclusive of the end points 10 um and 150 um. Exemplarily, the material of the first portion 131 can be SUS, titanium alloy, UTG, carbon fiber plate, etc., and the elastic modulus of the material can be in the range of 10 Gpa to 500 Gpa, inclusive of the end points 10 Gpa and 500 Gpa.

[0145] One surface of the second portion 132 in the thickness direction can be connected to the bending area 111b of the display layer 111 through the adhesive layer 15. The thickness of the second portion 132 is smaller than that of the first portion 131. The area of the second portion 132 can be thinned by etching, electrochemical method, or Computerized Numerical Control (CNC) machining. The thickness of the second portion 132 can be in the range of 10 um to 50 um, inclusive of the end points 10 um and 50 um. Exemplarily, the material of the second portion 132 can be SUS, titanium alloy, UTG, carbon fiber plate, etc., and the elastic modulus of the material can be in the range of 10 Gpa to 500 Gpa, inclusive of the end points 10 Gpa and 500 Gpa.

[0146] In the embodiment, the electronic device 100 can be a folding screen device. The two first portions 131 of the support layer 13 can be close to each other, and the second portion 132 of the support layer 13 can be bent to complete the folding. A material with a high elastic modulus is used to prepare the support layer 13, so that when the second portion 132 of the support layer 13 is bent, the second portion 132 will not undergo irreversible plastic deformation. The support layer 13 used in the embodiment has the characteristic of low creep.

[0147] In addition, in the prior art, a Back Film (BF) is generally provided for the display layer to further protect and support the display layer. In the present application, the Back Film and the support layer are combined, the layer structure of the display module is reduced, which is conducive to the thinning of the display module, and the possibility of peeling between the film layers is reduced, and the use reliability of the display module is improved.

[0148] Please refer to FIG. 4 and FIG. 9, FIG. 9 is a partially exploded schematic diagram of the display module 10 shown in FIG. 4. The electric connection structure 14 includes a conductive body 141, a second insulator 142 and a first insulator 143. The conductive body 141 is used to electrically connect the display layer 111 and the electric connection layer 112. The second insulator 142 is used to cover the outside of the conductive body 141 to provide an insulating shell for the conductive body 141, avoiding the conductive body 141, the first conductive point 1110 and the second conductive point 1130 from being damaged due to external force impact. The first insulator 143 can provide an attachment surface for the conductive body 141 and can be insulatively connected to the inside of the conductive body 141, supporting the conductive body 141 while avoiding the conductive body 141 from being short-circuited with the support layer 13 located on the other side of the first insulator 143.

[0149] The number of the conductive body 141 can be multiple. The conductive body 141 is located in the non-display area of the display module 10. The multiple conductive bodies 141 are connected to the first side surface 1126 and the second side surface 1146. The multiple conductive bodies 141 are arranged along the extension direction of the first side surface 1126. One conductive body 141 is electrically connected to one first conductive point 1110 and one second conductive point 1130. The conductive body 141 is recessed relative to the third side surface 125.

[0150] The conductive body 141 can be formed by 3D printing. For example, the conductive body 141 can be formed by a precise direct writing deposition process. The liquid additive of the conductive body 141 can be dropped from a nozzle, and the nozzle movement is controlled by a computer, so that the liquid additive generates a specific pattern on the first side surface 1126 and the second side surface 1146 and solidifies.

[0151] Specifically, in the first step, please refer to FIG. 10, which is a structural schematic diagram of the initial state of the display module 10 shown in FIG. 4. The edge of the display part 11 can be bent to form the stacked display layer 111, the electric connection layer 112 and the bent part 11a. The specific area of the display part 11 can be bent to form the bent part 11a by using a common positioning technology, so as to ensure that the horizontal displacement of the first conductive point 1110 of the display layer 111 and the second conductive point 1130 of the electric connection layer 112 is controlled within a certain tolerance, and the horizontal displacement of the first conductive point 1110 and the second conductive point 1130 can be less than the line distance of the conductive layer (the first signal layer 1121 or the second signal layer 1141). For example, the material of the conductive layer in the bent part 11a can be titanium aluminum titanium. The line width of the conductive layer in the bent part 11a can range from 5 μm to 10 μm (including the end point values 5 μm and 10 μm), the line thickness can range from 200 nm to 10 μm (including the end point values 200 nm and 10 μm), and the spacing between adjacent lines can range from 5 μm to 25 μm (including the end point values 5 μm and 25 μm).

[0152] After the display part 11 is bent, there is no support layer between the edge of the display layer 111 and the edge of the electrical connection layer 112 connected with the bent part 11a, and an insulator (i.e., the first insulator 143 described below) can be filled between the display layer 111 and the electrical connection layer 112 to fix and support the display layer 111 and the electrical connection layer 112. For example, the first insulator 143 can be a UV glue.

[0153] In the second step, the bent part is cut off by laser, so that the first signal layer 1121 in the display layer 111 leaks out of the wire end part, and the wire end part of the first signal layer 1121 is the first conductive point 1110. The second signal layer 1141 in the electrical connection layer 112 leaks out of the wire end part, and the wire end part of the second signal layer 1141 is the second conductive point 1130. The thickness of the wire at the first conductive point 1110 and the thickness of the wire at the second conductive point 1130 can be greater than the conventional wire thickness.

[0154] In this embodiment, the thickening of the metal wire at the first conductive point 1110 can make the area of the first conductive point 1110 large enough, so that the first conductive point 1110 can be stably electrically connected with the conductive body 141. The thickening of the metal wire at the second conductive point 1130 can make the area of the second conductive point 1130 large enough, so that the second conductive point 1130 can be stably electrically connected with the conductive body 141.

[0155] In the third step, a high-precision 3D printed metal wire is used to form the conductive body 141, so that the conductive body 141 connects the first conductive point 1110 and the second conductive point 1130. An insulator (i.e., the second insulator 142 described below) is covered outside the conductive body 141 to protect the conductive body 141. For example, the second insulator 142 can be glue.

[0156] Alternatively, the conductive body 141 can be formed by an electrohydrodynamics (EHD) process. The electrohydrodynamics process refers to a technology of generating a specific pattern of liquid additive on the workpiece surface and solidifying by using a computer to control the movement of the needle tip, through pulling the liquid additive from the needle tip by using an externally applied electric field.

[0157] Further alternatively, the conductive body 141 can be formed by an aerosol printing process. The aerosol printing refers to a technology of generating a specific pattern of liquid additive on the workpiece surface and solidifying by using a computer to control the movement of the nozzle, through atomizing the liquid additive to generate a large number of microdroplets, the microdroplets entering a rare gas to form an aerosol and being transported to the nozzle to be sprayed out in a beam.

[0158] In the embodiment, the conductive body 141 can electrically connect the first signal layer 1121 of the display layer 111 and the second signal layer of the electrically connecting layer 112. The electrically connecting layer 112 can be electrically connected with the circuit board of the electronic device 100 through the adapter plate 40, so as to realize the conduction between the display module 10 and the circuit board.

[0159] The first insulator 143 is located between the display layer 111 and the electrically connecting layer 112, and between the fourth side surface 1311 and the conductive body 141.

[0160] The second insulator 142 is connected to the first side surface 1126 and the second side surface 1146, and covers the conductive body 141. The surface of the second insulator 142 away from the conductive body 141 can be flush with the third side surface 125. The surface of the second insulator 142 away from the protective layer 12 can be protruding relative to the electrically connecting layer 112.

[0161] In the embodiment, the second insulator 142 and the first insulator 143 can collectively cover the exposed surface of the conductive body 141, so as to avoid damage of the conductive body 141 caused by external force impact, and prevent the display layer 111 and the electrically connecting layer 112 from being unable to be electrically connected, thereby causing the connection failure between the display module 10 and the circuit board.

[0162] In addition, the first insulator 143 can also support the display layer 111 and the electrically connecting layer 112, prevent the edge position of the display layer 111 and the electrically connecting layer 112 from being deformed, and ensure that the positions of the first conductive point 1110 and the second conductive point 1130 do not relatively deviate, so that the conductive body 141 can be accurately connected with the first conductive point 1110 and the second conductive point 1130.

[0163] At present, the edge of the display module of the electronic device is generally bent behind the screen, so that the edge of the display module is electrically connected with the mainboard of the electronic device through the flexible circuit board, thereby realizing the power supply and data transmission of the mainboard to the display module. However, the bending area of the display module occupies the edge space of the display module, which causes the edge width of the electronic device to be unable to be reduced. The wider the frame of the electronic device is, the smaller the screen ratio of the electronic device is, which causes the touch area and the visual area that can be interacted by the user to be small, and further causes the user experience to be affected.

[0164] The edge of the display module 10 is cancelled in the embodiment of the present application, and the conductor 141 is formed by printing on the side of the display module 10. The conductor 141 is hidden under the protective layer, and the conductor 141 can be close to the side of the display layer 111 and the electrically connecting layer 112, and the volume of the conductor 141 is small, so that the edge of the display module 10 does not need to reserve a large space, thereby reducing the area of the frame around the display module 10 in the electronic device 100, improving the screen ratio of the electronic device 100, so that the user can enjoy a larger visual area, and obtain a better visual experience.

[0165] In addition, when the user uses multiple electronic devices 100 at the same time, the screens of the multiple electronic devices 100 need to be close to each other for use, and the display edge of the electronic device 100 has a narrower frame, which can reduce the distance between the display screens of the multiple electronic devices 100, thereby making it more convenient for the user to read the information on the screens of the two electronic devices 100 at the same time, and improving the user's experience.

[0166] In the second possible embodiment, please refer to FIG. 11, which is a cross-sectional view of the second embodiment of the display module 10 and the adapter plate 40 shown in FIG. 2. The display module 10 of the second possible embodiment is different from the first possible display module 10 in that the conductor 141 of the display module 10 is not arranged on the side of the display layer 111 and the electrically connecting layer 112, but penetrates the display layer 111 and the electrically connecting layer 112.

[0167] The third side 125 of the protective layer 12 is flush with the first side 1126 of the display layer 111, the second side 1146 of the electrically connecting layer 112, and the fourth side 1311 of the support layer 13.

[0168] Please refer to FIG. 12, which is a cross-sectional view of the display layer 111 shown in FIG. 11. The display layer 111 is provided with a first through hole 113. The first through hole 113 can penetrate the display layer 111 along the thickness direction of the display layer 111. The first through hole 113 penetrates the pixel definition layer 1120, the second flat layer 1119, the first signal layer 1121, the first flat layer 1118, the second base layer 1113, the buffer layer 1112, and the first base layer 1111.

[0169] Referring to FIG. 13, FIG. 13 is a schematic cross-sectional view of the electrically connecting layer 112 shown in FIG. 11. The electrically connecting layer 112 is provided with a second through hole 114. The second through hole 114 can penetrate the electrically connecting layer 112 along the thickness direction of the electrically connecting layer 112. The second through hole 114 is oppositely arranged with the first through hole 113 in the thickness direction of the display module 10. The second through hole 114 penetrates the pixel defining layer 1140, the second planar layer 1139, the second signal layer 1141, the first planar layer 1138, the second base layer 1133, the buffer layer 1132 and the first base layer 1111 of the electrically connecting layer 112. Exemplarily, the diameter of the second through hole 114 can be the same as the diameter of the first through hole 113.

[0170] Referring back to FIG. 11, the support layer 13 is provided with a third through hole 115. The third through hole 115 penetrates the support layer 13 along the thickness direction of the support layer 13. The third through hole 115 is in communication with the first through hole 113 and the second through hole 114 in the thickness direction of the display module 10. The diameter of the third through hole 115 can be greater than the diameters of the first through hole 113 and the second through hole 114.

[0171] The display module 10 is further provided with an insulator 116. The insulator 116 is located in the third through hole 115, and the insulator 116 is provided with a fourth through hole 117. The fourth through hole 117 penetrates the insulator 116 along the axial direction of the insulator 116. The fourth through hole 117 is in communication with the first through hole 113 and the second through hole 114. Exemplarily, the diameter of the fourth through hole 117 can be equal to the diameter of the first through hole 113.

[0172] The electrically conductive body 141 is located in the first through hole 113, the second through hole 114 and the fourth through hole 117. The portion of the electrically conductive body 141 located in the first through hole 113 is electrically connected with the first signal layer 1121. The portion of the electrically conductive body 141 located in the second through hole 114 is electrically connected with the second signal layer 1141.

[0173] In the present embodiment, the electrically conductive body 141 can be located inside the display layer 111, the support layer 13 and the electrically connecting layer 112. The electrically conductive body 141 does not occupy the space of the side of the display layer 111, the support layer 13 and the electrically connecting layer 112. The electrically conductive body 141 does not occupy the edge position of the display module 10, so that the area of the edge of the display module 10 which cannot display images is further reduced, and the frame of the display screen of the electronic device 100 is further narrowed, so as to improve the screen-to-body ratio of the electronic device 100.

[0174] In addition, the insulator 116 can be arranged inside the support layer 13 and wrapped around the periphery of the intermediate portion of the electrically conductive body 141, so that the support layer 13 can be electrically isolated from the electrically conductive body 141. Isolating the support layer 13 from the electrically conductive body 141 can ensure that the electrically conductive body 141 will not be short-circuited with the support layer 13, and ensure that the first signal layer 1121 and the second signal layer 1141 can normally transmit electrical signals through the electrically conductive body 141.

[0175] In a third possible embodiment, referring to FIG. 14, which is a schematic diagram of a partial structure of a third embodiment of the display module 10 shown in FIG. 2. The support layer 13 of the third possible embodiment is different from the support layer 13 of the first possible embodiment in that the support layer 13 of the third possible embodiment can include a first sub-layer 133, a second sub-layer 134, and an elastic body 135.

[0176] The first sub-layer 133 is connected to the surface of the display layer 111 away from the first light-emitting surface 1125. The first sub-layer 133 includes a middle region 1331 and two side regions 1332 located on opposite sides of the middle region 1331. The thickness of the first sub-layer 133 can range from 10 um to 50 um, inclusive of the end points 10 um and 50 um. Exemplarily, the material of the first sub-layer 133 can be steel use stainless (SUS), titanium alloy, ultra-thin glass (UTG), or carbon fiber.

[0177] The second sub-layer 134 includes two sub-portions 1341. The two sub-portions 1341 are located on the side of the first sub-layer 133 away from the display layer 111. The two sub-portions 1341 are respectively connected to the two side regions 1332. The two sub-portions 1341 can be connected to the first sub-layer 133 through an adhesive layer 1342. One of the two sub-portions 1341 is located between the first sub-layer 133 and the electrically connecting layer 112. The thickness of the second sub-layer 134 can range from 50 um to 100 um, inclusive of the end points 50 um and 100 um. Exemplarily, the material of the second sub-layer 134 can be steel use stainless (SUS), titanium alloy, ultra-thin glass (UTG), or carbon fiber.

[0178] The two side regions 1332 of the first sub-layer 133 are respectively connected to the two non-bending regions 111a of the display layer 111. The middle region 1331 of the first sub-layer 133 is connected to the bending region 111b of the display layer 111. The two sub-portions 1341 of the second sub-layer 134 are respectively connected to the side of the two side regions 1332 away from the non-bending regions 111a of the display layer 111.

[0179] In the embodiment, the middle region 1331 of the first sub-layer 133 is not covered by the second sub-layer 134, and the middle region 1331 of the first sub-layer 133 is more easily bent to make the side regions 1332 on both sides close to each other, so that the electronic device 100 is in a folded state. The first sub-layer 133 and the second sub-layer 134 can jointly support the display layer 111 to keep the display layer 111 in a flat state or a folded state.

[0180] Referring to FIG. 15, FIG. 15 is a structural schematic diagram of the elastic body 135 shown in FIG. 14. The elastic body 135 has a first region 1351 and two second regions 1352. The first region 1351 is located at the middle part of the elastic body 135. The two second regions 1352 are respectively located at the opposite sides of the first region 1351. The second region 1352 has a gap with the first region 1351.

[0181] The first region 1351 is provided with a plurality of first openings 1353. The first openings 1353 can penetrate the elastic body 135 along the thickness direction of the elastic body 135. The plurality of first openings 1353 can be arranged in an array in the first region 1351. The first openings 1353 can be long circular holes.

[0182] Each of the second regions 1352 is provided with a plurality of second openings 1354. The second openings 1354 can penetrate the elastic body 135 along the thickness direction of the elastic body 135. The plurality of second openings 1354 can be arranged in an array in the second region 1352. The second openings 1354 can be long circular holes. The density of the second openings 1354 in the second region 1352 is less than the density of the first openings 1353 in the first region 1351. The length of the second openings 1354 in the radial direction is less than the length of the first openings 1353 in the radial direction.

[0183] The elastic body 135 is connected between the two sub-regions 1341 of the second sub-layer 134. The elastic body 135 is connected to the middle region 1331 of the first sub-layer 133. The gap between the first region 1351 and the second region 1352 of the elastic body 135 can be connected to the first sub-layer 133 through the adhesive layer 1342. The thickness of the elastic body 135 can be the same as the thickness of the sub-regions 1341 of the second sub-layer 134. For example, the material of the elastic body 135 can be thermoplastic urethane (TPU), silicone rubber, fluororubber, etc.

[0184] In the embodiment, the elastic body 135 provided with the first openings 1353 and the second openings 1354 is a bamboo book structure of the support layer 13. The first openings 1353 and the second openings 1354 can reduce the rigidity of the elastic body 135, so that the elastic body 135 is more easily bent.

[0185] The elastic body 135 can support the middle region 1331 of the first sub-layer 133, thereby improving the structural strength of the middle portion of the support layer 13. The elastic modulus of the elastic body 135 is relatively high, and in the bent state of the middle region 1331 of the first sub-layer 133, the elastic body 135 can be bent more easily to adapt to the deformation of the middle region 1331 of the first sub-layer 133.

[0186] Referring to FIG. 16, which is a structural schematic diagram of the elastic body 135 in a bent state, the first region 1351 of the elastic body 135 can be bent to a greater extent, and the radial width of the first opening 1353 can be elongated to adapt to the bending deformation of the first region 1351. The second region 1352 of the elastic body 135 can be bent to a smaller extent, thereby transitioning between the first region 1351 of the elastic body 135 and the sub-portion 1341 of the second sub-layer 134 of the support layer 13.

[0187] In a fourth possible embodiment, referring to FIGS. 17, 18 and 19, FIG. 17 is another structural schematic diagram of an electronic device 100 provided in the embodiments of the present application, FIG. 18 is a partial structural schematic diagram of the electronic device 100 shown in FIG. 17, and FIG. 19 is a cross-sectional schematic diagram of the display module 10 at B-B shown in FIG. 18. The electronic device 100 in the fourth possible embodiment is different from the electronic device 100 in the first possible embodiment in that the electronic device 100 in the fourth possible embodiment further includes a back film 17, a polarizer 18, a first adhesive layer 19, a second adhesive layer 22 and a third adhesive layer 21.

[0188] The back film 17 is located between the display layer 111 and the support layer 13. The back film 17 is connected to the side of the display layer 111 away from the first light-emitting surface 1125. For example, the back film 17 can be a copper foil.

[0189] In the present embodiment, the back film 17 can protect and support the display layer 111, preventing the display module 10 from generating film marks due to poor flatness of the display layer 111. The copper foil has a relatively fast heat dissipation speed, so that the heat generated by the display module 10 can be dispersed faster, avoiding overheating of the display module 10 and preventing the display module 10 from displaying images normally.

[0190] The first adhesive layer 19 is located between the back film 17 and the support layer 13. The first adhesive layer 19 is connected to the surface of the back film 17 away from the display module 10. The first adhesive layer 19 can be a grid adhesive. The first adhesive layer 19 is used to fixedly connect the back film 17 and the support layer 13.

[0191] The second adhesive layer 22 is connected between the first adhesive layer 19 and the support layer 13. The second adhesive layer 22 can be a foam adhesive.

[0192] In the embodiment, the second adhesive layer 22 can absorb the impact force received by the support layer 13, avoid the impact force from being transmitted to the display layer 111 to damage the specific structure of the display layer 111, and enable the display module 10 to have a certain impact resistance.

[0193] The polarizer 18 is located between the protective layer 12 and the display layer 111. The polarizer 18 is connected to the first light-emitting surface 1125 of the display layer 111.

[0194] In the embodiment, the polarizer 18 can avoid the influence of external ambient light on the image display of the electronic device 100. Specifically, the polarizer 18 is usually composed of one or more thin films. These thin films can selectively transmit or reflect light waves in a specific direction. When the electronic device 100 displays an image, the polarizer 18 can reduce the light quantity of the ambient light reflected on the surface of the display image of the electronic device 100, improve the contrast of the image, and make the image presented by the electronic device 100 clearer.

[0195] The third adhesive layer 21 can be connected between the protective layer 12 and the polarizer 18. For example, the third adhesive layer 21 can be an optical adhesive. The material of the protective layer 12 has high hardness and high strength.

[0196] In the embodiment, the electronic device 100 can be a straight-line electronic device 100. The electronic device 100 does not need to be bent. The third adhesive layer 21 can fixedly connect the protective layer 12 and the polarizer 18. The protective layer 12 has high hardness and can resist scratches from sharp objects. In addition, the protective layer 12 can absorb or disperse the impact force when the electronic device 100 is impacted, thereby reducing the impact on the display layer 111. In addition, the protective layer 12 can also prevent dust, dirt and other external objects from directly contacting the display layer 111, thereby maintaining the clarity and brightness of the display effect of the display module 10. In addition, the protective layer 12 can also prevent harmful substances such as water and oxygen from penetrating into the display module 10, thereby prolonging the service life of the display module 10.

[0197] In the fifth possible embodiment, please refer to FIG. 20, which is a cross-sectional schematic view of the fifth embodiment of the display module 10 shown in FIG. 2. The display module 10 of the fifth possible embodiment is different from the first possible display module 10 in that the conductive body 141 of the display module 10 also covers part of the surface of the display layer 111 away from the electrically connecting layer 112 and part of the surface of the electrically connecting layer 112 away from the display layer 111.

[0198] Specifically, the display layer 111 is further provided with a first electrical connection point 151, which is electrically connected with the first signal layer 1121 in the display layer 111. The first electrical connection point 151 is located at the edge of the surface of the display layer 111 away from the support layer 13. In some possible embodiments, please refer to FIG. 21, which is a structural schematic diagram of the first electrical connection point 151 shown in FIG. 20. The first electrical connection point 151 can be circular, rectangular, or round rectangular in shape. For example, the first electrical connection point 151 can be formed by electroplating or metal deposition.

[0199] The electrical connection layer 112 is provided with a second electrical connection point 161. The second electrical connection point 161 is electrically connected with the second signal layer 1141 in the electrical connection layer 112. The second electrical connection point 161 is located at the edge of the surface of the electrical connection layer 112 away from the support layer 13. For example, the second electrical connection point 161 can be formed by electroplating or metal deposition. The specific structure of the second electrical connection point 161 can refer to the description of the first electrical connection point 151 above.

[0200] The conductive body 141 includes a first segment 1411, a second segment 1412, and a third segment 1413. The first segment 1411 and the second segment 1412 are respectively bent and connected to the opposite ends of the third segment 1413. The first segment 1411 covers the first electrical connection point 151. That is, the first segment 1411 is connected to the side of the first electrical connection point 151 away from the display layer 111. The second segment 1412 covers the second electrical connection point 161, that is, the second segment 1412 is connected to the side of the second electrical connection point 161 away from the electrical connection layer 112. The third segment 1413 is connected to the first side surface 1126 of the display layer 111 and the second side surface 1146 of the electrical connection layer 112. A plurality of conductive bodies 141 are arranged at intervals along the extension direction of the first side surface 1126. One conductive body 141 connects one first electrical connection point 151 and one second electrical connection point 161. The number of conductive bodies 141 can be multiple. The plurality of conductive bodies 141 are arranged at intervals along the extension direction of the first side surface 1126.

[0201] The second insulating body 142 covers the outer side of the conductive body 141. The second insulating body 142 covers the first segment 1411 of the surface of the display layer 111, the second segment 1412 of the surface of the electrical connection layer 112, and the third segment 1413 located at the side of the display module 10.

[0202] In the present embodiment, the first electrical connection point 151 can increase the area of the electrical conductor 141 electrically connected to the first signal layer 1121 of the display layer 111, thereby making the electrical connection between the electrical conductor 141 and the first signal layer 1121 more stable, and further improving the transmission quality and stability of the electrical signal of the display module 10. The second electrical connection point 161 can increase or decrease the area of the electrical connection between the electrical conductor 141 and the second signal layer 1141 of the electrical connection layer 112, thereby making the electrical connection between the electrical conductor 141 and the second signal layer 1141 more stable, thereby making the electrical connection between the display layer 111 and the electrical connection layer 112 more stable, and improving the stability of the signal transmission between the display layer 111 and the electrical connection layer 112.

[0203] The electrical conductor 141 can be formed by 3D printing. For example, the electrical conductor 141 can be formed by a precision direct writing deposition process. The liquid additive of the electrical conductor 141 can be dropped from a nozzle, and the nozzle can be moved by computer control, so that the liquid additive is generated in a specific pattern on the first side 1126 and the second side 1146 and solidified.

[0204] Specifically, there is no support layer 13 between the edges of the display layer 111 and the edges of the electrical connection layer 112, and the first insulator 143 can be filled between the display layer 111 and the electrical connection layer 112, thereby fixedly supporting the display layer 111 and the electrical connection layer 112.

[0205] The electrical connection layer 112 can be a special flexible circuit board, and the line spacing of the traces of the second signal layer 1141 in the electrical connection layer 112 can be the same as the line spacing of the traces in the first signal layer 1121 in the display layer 111. The first electrical connection point 151 of the display part 11 and the second electrical connection point 161 of the electrical connection layer 112 can be controlled within a certain tolerance (less than the line spacing of the traces) by using a common positioning technology, so that the electrical conductor 141 can be stably connected to the first electrical connection point 151 and the second electrical connection point 161 by 3D printing.

[0206] In a sixth possible embodiment, please refer to FIG. 22, which is a partial structure diagram of a sixth embodiment of the display layer 111 shown in FIG. 2. The display layer 111 of the sixth possible embodiment is different from the layer structure of the fifth possible display layer 111.

[0207] The layer structure of the non-display area outside the display area of the display layer 111 is shown in FIG. 22. The non-display area of the display layer 111 has a plurality of layer structures superimposed. Specifically, the display layer 111 includes a first base layer 1111, a first signal layer 1121, a planar layer 1181, an encapsulation layer 1182, a blocking portion 1183, an insulating portion 1184, and a first electrical connection point 151. Among them, the first signal layer 1121 includes a first sub-signal layer 1121a and a second sub-signal layer 1121b. The first electrical connection point 151 includes a first sub-connection point 151a and a second sub-connection point 1185.

[0208] The first sub-signal layer 1121a is connected to the first base layer 1111. Among them, the first sub-signal layer 1121a can be a display signal line for electrical connection with the pixel. The display signal line is used to electrically connect the pixel and the driving chip 50. The first sub-signal layer 1121a can be electrically connected with the drain of the thin film transistor of the display module, which can be used to control the closing and brightness of the pixel, etc.

[0209] Please refer to FIG. 22 and FIG. 23, FIG. 23 is a cross-sectional view of the display layer 111 at C-C in FIG. 22. The planar layer 1181 is connected to the side of the first sub-signal layer 1121a away from the first base layer 1111. The planar layer 1181 includes a first planar portion 1181a and a second planar portion 1181b. The first planar portion 1181a and the second planar portion 1181b are arranged at intervals. The first planar portion 1181a is located on the side of the edge of the second planar portion 1181b toward the first sub-signal layer 1121a. The first planar portion 1181a is provided with a through hole 1181c. The through hole 1181c penetrates the first planar portion 1181a along the thickness direction of the first planar portion 1181a.

[0210] The blocking portion 1183 is located between the first planar portion 1181a and the second planar portion 1181b. The blocking portion 1183 can include a first blocking portion 1183a and a second blocking portion 1183b. The first blocking portion 1183a and the second blocking portion 1183b are arranged at intervals, and the first blocking portion 1183a is located on the side of the second blocking portion 1183b away from the first planar portion 1181a. The height of the first blocking portion 1183a and the second blocking portion 1183b is greater than the height of the planar layer 1181. The height of the first blocking portion 1183a can be less than the height of the second blocking portion 1183b.

[0211] The encapsulation layer 1182 is connected to the second flat portion 1181b away from the first sub-signal layer 1121a. The encapsulation layer 1182 covers the second flat layer 1181 and the blocking portion 1183. Specifically, the encapsulation layer 1182 includes a first plating layer 1182a, a printing layer 1182b and a second plating layer 1182c. The first plating layer 1182a covers the second flat portion 1181b, the first blocking portion 1183a, the second blocking portion 1183b and part of the first sub-signal layer 1121a. The first plating layer 1182a can be a film layer formed by chemical vapor deposition, for example.

[0212] The printing layer 1182b is located on the side of the first plating layer 1182a away from the second flat portion 1181b. The printing layer 1182b is located on the side of the blocking portion 1183 away from the first flat portion 1181a. The printing layer 1182b is formed by inkjet printing, for example.

[0213] The second plating layer 1182c covers the printing layer 1182b and the first plating layer 1182a. The second plating layer 1182c can be a film layer formed by chemical vapor deposition, for example. The second plating layer 1182c can be made of the same material as the first plating layer 1182a.

[0214] In this embodiment, the encapsulation layer 1182 also covers the pixels (not shown in the figure) of the display module 10. The encapsulation layer 1182 can protect the pixels from impurities, moisture and oxygen in the environment.

[0215] The second sub-signal layer 1121b is connected to the side of the encapsulation layer 1182 away from the second flat layer 1181. The second sub-signal layer 1121b covers the encapsulation layer 1182 and part of the first flat portion 1181a. The second sub-signal layer 1121b is a touch line for electrically connecting the driving chip 50 and the touch electrode (not shown in the figure).

[0216] The electrically connecting layer 112 is located on the side of the first base layer 1111 away from the first sub-signal layer 1121a. The specific structure of the electrically connecting layer 112 in this embodiment can be referred to the description of the electrically connecting layer 112 above, and the electrically connecting layer 112 will not be described herein.

[0217] Please refer to FIG. 23 and FIG. 24, FIG. 24 is a cross-sectional view of the display layer 111 at D-D in FIG. 22. The second sub-connection point 1185 and at least part of the first sub-connection point 151a are located on the side of the flat layer 1181 away from the first sub-signal layer 1121a. The first sub-connection point 151a is electrically connected to the first sub-signal layer 1121a through the through hole 1181c, and the second sub-connection point 1185 is electrically connected to the second sub-signal layer 1121b.

[0218] The first sub-connection point 151a comprises an extension 1511 and a main body 1512. The extension 1511 is located in the through hole 1181c and is electrically connected to the first sub-signal layer 1121a. The main body 1512 is located on the side of the flat layer 1181 facing away from the first sub-signal layer 1121a and is connected to the extension 1511. The main body 1512 protrudes towards the edge of the display layer 111 relative to the extension 1511. The main body 1512 extends from the position of the through hole 1181c towards the edge of the first sub-signal layer 1121a. The main body 1512 can be located between the position of the through hole 1181c and the edge of the display layer 111.

[0219] The first sub-connection point 151a and the second sub-connection point 1185 are spaced apart. In some possible embodiments, referring to FIG. 25, which is a top view of the display layer 111 shown in FIG. 22, the non-display area 10b can be arranged around the periphery of the display area 10a. The first sub-connection point 151a and the second sub-connection point 1185 can be located in the non-display area 10b. The first sub-connection point 151a and the second sub-connection point 1185 can be arranged alternately. The second sub-connection point 1185 can be located between two first sub-connection points 151a. In other possible embodiments, referring to FIG. 26, which is another top view of the display layer 111 shown in FIG. 22, the first sub-connection points 151a can be arranged in a row. A plurality of second sub-connection points 1185 can be distributed at the two ends of the row of first sub-connection points 151a. In the embodiments of the present application, the arrangement of the first sub-connection points 151a and the second sub-connection points 1185 can be set according to actual needs, and the present application does not specifically limit the arrangement of the first sub-connection points 151a and the second sub-connection points 1185.

[0220] Referring back to FIG. 22, the insulating portion 1184 is connected to the side of the first sub-signal layer 1121a, the side of the first flat layer 1181, the side of the first sub-connection point 151a and the side of the second sub-connection point 1185.

[0221] Referring to FIGS. 22-24, the number of conductive bodies 141 is a plurality. Part of the number of conductive bodies is used to communicate the first sub-signal layer 1121a and the electrically connected layer 112, and the other part of the number of conductive bodies 141 is used to communicate the second sub-signal layer 1121b and the electrically connected layer 112. For the convenience of description, the conductive body 141 connecting the first sub-signal layer 1121a and the electrically connected layer 112 is defined as the first sub-conductive body 141a. The conductive body 141 connecting the second sub-signal layer 1121b and the electrically connected layer 112 is defined as the second sub-conductive body 191.

[0222] The first segment 1411 of the first sub-conductive body 141a is connected to the first sub-connection point 151a. The first segment 1411 of the first sub-conductive body 141a covers at least part of the main body 1512 of the first sub-connection point 151a. The second segment 1412 of the first sub-conductive body 141a is connected to the second electrical connection point 161, and the third segment 1413 of the first sub-conductive body 141a is located at the side of the display layer 111 and the side of the electrical connection layer 112. The third segment 1413 of the first sub-conductive body 141a can be connected to the side of the insulating portion 1184 away from the first sub-signal layer 1121a.

[0223] The second sub-conductive body 191 includes a first segment 1911, a second segment 1912, and a third segment 1913. The first segment 1911 is connected to the second sub-connection point 1185. The first segment 1911 covers at least part of the edge portion of the second sub-connection point 1185. The second segment 1912 is connected to one of the second electrical connection points 161. The third segment 1913 is connected between the first segment 1911 and the second segment 1912. The third segment 1913 is located at the side of the display layer 111 and the side of the electrical connection layer 112. The third segment 1913 of the second sub-conductive body 191 can be connected to the side of the insulating portion 1184 away from the second sub-signal layer 1121b.

[0224] In this embodiment, the first sub-conductive body 141a can communicate the first sub-signal layer 1121a and the second signal layer 1141 of the electrical connection layer 112 through the first sub-connection point 151a, so that the first sub-signal layer 1121a can be in communication with the driving chip 50. The first sub-signal layer 1121a can be a touch layer in the display module 10. The driving chip 50 can convert the instructions and signals from the main controller or other input sources into the signals required by the touch layer and deliver them to the touch layer. In this way, the touch layer can perform corresponding operations and responses according to the received signals. The driving chip 50 can also provide sufficient power for the touch layer to detect and process user touch inputs, to ensure the normal operation of the touch layer.

[0225] The second sub-conductive body 191 can communicate the second sub-signal layer 1121b and the second signal layer 1141 of the electrical connection layer 112 through the second sub-connection point 1185, so that the second sub-signal layer 1121b can be in communication with the driving chip 50. The second sub-signal layer 1121b can be electrically connected to the drain of a thin-film transistor in the display module 10. In the display module 10, the thin-film transistors are usually arranged in an array. Each thin-film transistor corresponds to a pixel, and through the control of the driving chip 50, individual control of each pixel can be achieved. The driving chip 50 switches the thin-film transistors in a timely manner according to the input control signals and image data, so that the corresponding pixel points can display the required color.

[0226] In this embodiment, the electrical connection point (the second sub-connection point 1185) of the second sub-signal layer 1121b and the electrical connection point (the first sub-connection point 151a) of the first sub-signal layer 1121a are arranged in the same layer, and the first sub-connection point 151a and the second sub-connection point 1185 are both located on one side of the display surface of the display module 10. In this way, the conductive body (the first sub-conductive body 141a and the second sub-conductive body 191) can be electrically connected with the electrical connection point (the first sub-connection point 151a and the second sub-connection point 1185) when covering the edge of the display surface, so that the driving chip 50 connected with the electrical connection layer 112 can be electrically connected with the second sub-signal layer 1121b and the first sub-signal layer 1121a.

[0227] In a seventh possible embodiment, please refer to FIG. 27, which is a cross-sectional schematic view of a seventh embodiment of the display layer 111 shown in FIG. 2. The display module 10 of the seventh possible embodiment is different from the sixth possible display module 10 in that the main body 1512 of the first sub-connection point 151a of the seventh possible embodiment protrudes away from the side of the third segment 1413 of the first sub-conductive body 141a relative to the extension 1511.

[0228] Specifically, the extension 1511 is located in the through hole 1181c, the extension 1511 is electrically connected with the first sub-signal layer 1121a, the main body 1512 is located on the side of the flat layer 1181 away from the first sub-signal layer 1121a and is connected with the extension 1511, and the main body 1512 protrudes away from the surface of the third segment 1413 of the second sub-conductive body 191 relative to the extension 1511. The main body 1512 extends from the position where the through hole 1181c is located to the position away from the edge of the first sub-signal layer 1121a. The main body 1512 can be located between the position where the through hole 1181c is located and the edge of the display area of the display module 10.

[0229] In this embodiment, the main body 1512 can extend from the position where the through hole 1181c is located to the edge of the display area. That is, the main body 1512 extends away from the insulating portion 1184, at this time, the width of the non-display area 10b of the display module 10 shown in FIG. 23 is narrower than the width of the non-display area 10b of the display module 10 shown in FIG. 22, and the width of the non-display area 10b of the display module 10 shown in FIG. 22 is wider than the width of the non-display area 10b of the display module 10 shown in FIG. 23 by the width of the main body 1512. Extending the main body 1512 to the position away from the edge of the display module 10 can further avoid increasing the width of the non-display area 10b of the edge area of the display module 10, thereby reducing the black edge position of the display module 10, further improving the screen-to-body ratio of the display module 10, and thus improving the user experience.

[0230] In an eighth possible embodiment, referring to FIG. 28 and FIG. 29, FIG. 28 is a cross-sectional view of the display layer 111 and the first sub-conductive body 141a of the eighth embodiment. FIG. 29 is a cross-sectional view of the display layer 111 and the second sub-conductive body 191 of the eighth embodiment. The display module 10 of the eighth possible embodiment is different from the sixth possible display module 10 in that the display layer 111 of the eighth possible embodiment does not have an electrical connection point. The conductive lines of the display layer 111 are exposed at the cross-section, thereby directly electrically connecting with the conductive body.

[0231] Specifically, the number of the first conductive points 1110 is multiple. Part of the number of the first conductive points 1110 are cross-sectional conductive points of the first sub-signal layer 1121a. Part of the number of the first conductive points 1110 are cross-sectional conductive points of the second sub-signal layer 1121b. For the convenience of description, the first conductive points 1110 of the first sub-signal layer 1121a are defined as the first sub-conductive points 1110a. The first conductive points 1110 of the second sub-signal layer 1121b are defined as the second sub-conductive points 1186. The first sub-conductive points 1110a are formed at the circumferential cross-section of the first sub-signal layer 1121a. The second sub-conductive points 1186 are formed at the circumferential cross-section of the second sub-signal layer 1121b. The first sub-conductive points 1110a and the second sub-conductive points 1186 are arranged in a staggered manner.

[0232] The first sub-signal layer 1121a includes a first sub-portion 1129a and a second sub-portion 1129b. The second sub-portion 1129b is located on one side of the edge of the first sub-portion 1129a towards the display layer 111. The thickness of the second sub-portion 1129b is greater than the thickness of the first sub-portion 1129a. The end face of the second sub-portion 1129b away from the first sub-portion 1129a forms the first sub-conductive points 1110a.

[0233] The second sub-signal layer 1121b includes a body portion 1180a and an edge portion 1180b connected to the body portion 1180a. The thickness of the edge portion 1180b is greater than the thickness of the body portion 1180a. The end face of the edge portion 1180b away from the body portion 1180a forms the second sub-conductive points 1186.

[0234] The first sub-conductive body 141a is electrically connected with the first sub-conductive points 1110a and the second conductive points 1130. So that the first sub-signal layer 1121a and the second signal layer 1141 are in communication. There is an insulator 200 between the first sub-conductive body 141a and the second sub-signal layer 1121b. The insulator 200 can prevent the second sub-signal layer 1121b from being electrically connected with the first sub-conductive body 141a.

[0235] The forming manner and insulation method of the second sub-conductive body 191 can refer to the description of the forming manner and insulation method of the first sub-conductive body 141a, and the application will not repeat the forming manner and insulation method of the second sub-conductive body 191. The second sub-conductive body 191 is connected to the side surface of the display layer 111 and the electrically connected layer 112. The second sub-conductive body 191 is electrically connected with the second sub-conductive point 1186 and the second conductive point 1130. So that the second sub-signal layer 1121b and the second signal layer 1141 are communicated. The second sub-conductive body 191 is provided with an insulator 300 between the first sub-signal layer 1121a. The insulator 300 can prevent the first sub-signal layer 1121a from being electrically connected with the second sub-conductive body 191.

[0236] The insulation protection manner of the second sub-conductive body 191 and the first sub-conductive body 141a can refer to the description of the first insulator 143 and the second insulator 142, and the application will not repeat the insulation protection manner of the second sub-conductive body 191 and the first sub-conductive body 141a.

[0237] In the embodiment, the thickening of the metal trace at the first sub-conductive point 1110a can make the area of the first sub-conductive point 1110a large enough, so that the first sub-conductive point 1110a and the first sub-conductive body 141a can be stably electrically connected. The thickening of the metal trace at the second sub-conductive point 1186 can make the area of the second sub-conductive point 1186 large enough, so that the second sub-conductive point 1186 and the second sub-conductive body 191 can be stably electrically connected.

[0238] At present, the edge of the display module of the electronic device is generally bent behind the screen, so that the edge of the display module is electrically connected with the mainboard of the electronic device through the flexible circuit board, so as to realize the power supply and data transmission of the mainboard to the display module. But the bending area of the display module will occupy the edge space of the display module, which leads to the fact that the edge width of the electronic device cannot be reduced. The wider the frame of the electronic device is, the smaller the screen ratio of the electronic device is, which leads to the fact that the touch area and the visual area that the user can interact with are small, which further affects the user experience.

[0239] The edge bending area of the display module 10 is cancelled, and the first sub-conductive body 141a and the second sub-conductive body 191 are formed by printing on the side of the display module 10. The conductive body can be close to the side of the display layer 111 and the electrically connected layer 112, and the volume of the conductive body is small, so that the edge of the display module 10 does not need to reserve a large space, thereby reducing the area of the frame surrounding the display module 10 in the electronic device, improving the screen ratio of the electronic device, so that the user can enjoy a larger visual area, and a better visual experience is obtained. The above is an exemplary embodiment of the present application. It should be pointed out that for those skilled in the art, without departing from the principle of the present application, some improvements and refinements can be made, and these improvements and refinements are also considered to be within the protection scope of the present application.

Claims

1. A display module, characterized in that: include: The display layer includes a first signal layer, wherein a first conductive dot is provided on a side of the first signal layer; an electrical connection layer, located on a non-display side of the display layer, the electrical connection layer including a second signal layer, and a second conductive point is provided on a side surface of the second signal layer; and a conductor connected to a side surface of the display layer and a side surface of the electrical connection layer, and electrically connected to the first conductive point and the second conductive point, so that the first signal layer and the second signal layer are connected.

2. The display module according to claim 1, wherein: The display module further includes a supporting layer and a first insulator, wherein the supporting layer is connected between the display layer and the electrical connection layer, and a gap is formed between a side surface of the supporting layer and the conductor; The first insulator is connected between the side surface of the support layer and the conductor, and is located between the display layer and the electrical connection layer.

3. The display module according to claim 2, wherein: The first signal layer includes a first sub-portion and a second sub-portion, wherein the second sub-portion is connected between the first sub-portion and the conductor, and a thickness of the second sub-portion is greater than a thickness of the first sub-portion.

4. The display module according to claim 2, wherein: The display module further includes a protective layer connected to a side of the display layer facing away from the electrical connection layer, and a side surface of the protective layer is protruding relative to the conductor.

5. The display module according to claim 4, wherein: The display module further includes a second insulator connected to a side surface of the display layer and a side surface of the electrical connection layer, and covering the conductor.

6. The display module according to claim 5, wherein: A side of the second insulator facing away from the conductor is flush with a side surface of the protection layer.

7. The display module according to any one of claims 2 to 6, wherein: The display layer includes two non-bending areas and one bending area, and the two non-bending areas are located on opposite sides of the bending area; The support layer includes two first parts and one second part, the two first parts are connected to opposite sides of one second part, the two first parts are respectively connected to the two non-bending areas, the second part is connected to the bending area, and the thickness of the second part is less than the thickness of the first part.

8. The display module according to any one of claims 2 to 6, wherein: The display layer includes two non-bending areas and a bending area, and the two non-bending areas are located on opposite sides of the bending area. The supporting layer includes a first sublayer and a second sublayer, and the first sublayer is connected to the display layer. The first sublayer includes a middle area and two side areas, and the two side areas are located on opposite sides of the middle area. One side area is connected to one non-bending area, and the middle area is connected to the bending area. The second sublayer includes two sub-parts, and the two sub-parts are respectively connected to the side of the two side areas away from the non-bending area.

9. The display module according to claim 8, wherein: The display module further includes an elastic body, which is connected between the two sub-portions of the second sub-layer and connected to a side of the middle region of the first sub-layer away from the bending region.

10. The display module according to any one of claims 4 to 6, wherein: The material of the protective layer is a heat-curing material or a light-curing material.

11. The display module according to any one of claims 1 to 3, characterized in that: The first signal layer includes a first sub-signal layer and a second sub-signal layer, the first sub-signal layer is located on a side of the second sub-signal layer facing the electrical connection layer, a plurality of the first conductive dots are provided on a side surface of the first sub-signal layer, and a plurality of the first conductive dots are provided on a side surface of the second sub-signal layer; The first sub-signal layer is electrically connected to the second signal layer through the conductor, and the second sub-signal layer is electrically connected to the second signal layer through the conductor.

12. A display module, characterized in that: include: A display layer includes a first signal layer, wherein the display layer is provided with a first through hole, the first through hole penetrating the first signal layer along a thickness direction of the display layer, and the first through hole is located in a non-display area of ​​the display module; an electrical connection layer, comprising a second signal layer, wherein the electrical connection layer is provided with a second through hole, the second through hole passes through the second signal layer, and the second through hole is connected to the first through hole; and a conductor disposed in the first through hole and the second through hole, wherein the conductor is electrically connected to the first signal layer and the second signal layer.

13. The display module according to claim 12, wherein: The display module also includes a supporting layer and an insulator. The supporting layer is connected between the display layer and the electrical connection layer. The supporting layer is provided with a third through hole. The third through hole penetrates the supporting layer along the thickness direction of the supporting layer. The insulator is located in the third through hole. The insulator is provided with a fourth through hole. The fourth through hole is connected to the first through hole and the second through hole. Part of the conductor is located in the fourth through hole.

14. A display module, characterized in that: include: The display layer includes a first signal layer and a first electrical connection point, wherein the first electrical connection point is connected to a surface of the display layer for emitting light, and the first electrical connection point is electrically connected to the first signal layer; an electrical connection layer located on a non-display side of the display layer, the electrical connection layer comprising a second signal layer and a second electrical connection point, the second electrical connection point being connected to a surface of the electrical connection layer facing away from the display layer, and the second electrical connection point being electrically connected to the second signal layer; and a conductor, comprising a first segment, a second segment and a third segment, wherein the first segment covers the first electrical connection point, the second segment covers the second electrical connection point, and the third segment is connected between the first segment and the second segment, and is connected to the side of the display layer and the side of the electrical connection layer.

15. The display module according to claim 14, wherein: The display layer further includes a planar layer, the first signal layer includes a first sub-signal layer and a second sub-signal layer, the first sub-signal layer, the planar layer, and the second sub-signal layer are stacked in sequence, the planar layer is located on a side of the first sub-signal layer away from the electrical connection layer, and the planar layer is provided with a through hole, which penetrates the planar layer along the thickness direction of the planar layer; At least some of the first electrical connection points are located on the side of the flat layer away from the first sub-signal layer. There are multiple first electrical connection points, some of which are electrically connected to the second sub-signal layer, and some of the second electrical connection points are electrically connected to the first sub-signal layer through the through hole.

16. The display module according to claim 15, wherein: The first electrical connection point electrically connected to the first sub-signal layer includes an extension portion and a main body, the extension portion is located in the through hole and electrically connected to the first sub-signal layer, and the main body is located on a side of the planar layer away from the first sub-signal layer and connected to the extension portion; At least a portion of the main body is covered by the first section, and the main body protrudes from a side of the extension portion facing away from the third section.

17. The display module according to claim 15, wherein: The first electrical connection point electrically connected to the first sub-signal layer includes an extension portion and a main body, the extension portion is located in the through hole and electrically connected to the first sub-signal layer, and the main body is located on a side of the planar layer away from the first sub-signal layer and connected to the extension portion; At least a portion of the main body is covered by the first section, and the main body protrudes toward a side of the third section relative to the extension portion.

18. The display module according to any one of claims 15 to 17, wherein: The display module further includes a thin film transistor, and the first sub-signal layer is electrically connected to the thin film transistor.

19. An electronic device, characterized in that: The electronic device includes a circuit board, an adapter board, and a display module according to any one of claims 1 to 18, wherein the circuit board is electrically connected to the electrical connection layer through the adapter board.

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