Electronic circuit board and method for manufacturing same

Abstract

Provided are: an electronic circuit board capable of preventing discharge at a board manufacturing stage of an all-solid-state battery that is surface-mounted on a board; and a method for manufacturing the same.　This electronic circuit board 1 is formed by surface-mounting an all-solid-state battery 10 together with an electronic component. The electronic component and the all-solid-state battery 10 are electrically connected to conductor wiring patterns 2, 4 formed on an electrically insulating board body 8 by soldering to form an electronic circuit. An electric line of the electronic circuit connected to a positive electrode of the all-solid-state battery 10 or an electric line of the electronic circuit connected to a negative electrode of the all-solid-state battery is provided with a switching means 20 for electrically cutting off the electric lines and switching from an electric cut-off state to an electric conduction state.

Description

Electronic circuit board and its manufacturing method

[0001] The present invention relates to an electronic circuit board having an all-solid-state battery surface-mounted together with electronic components, and more particularly to an electronic circuit board capable of preventing discharge of a surface-mounted all-solid-state battery and failure of mounted components during the substrate manufacturing stage, and a manufacturing method thereof.

[0002] In electronic circuit boards in which electronic components are mounted on a board by soldering, such as printed circuit boards on which electrical circuit wiring is printed, batteries such as secondary batteries and high-capacity capacitors may be mounted on the board as power sources for the electronic components (see, for example, Patent Document 1).

[0003] For example, when mounting electronic components on a wiring board using a flow soldering method in which the soldered surface of a printed circuit board on which the soldered portion is located is brought into contact with a jet wave of molten solder to supply molten solder to the soldered portion, the above-mentioned battery is later attached to the board wiring by solder, or is attached to a battery socket soldered to the board wiring, after the immersion process in which the board is immersed in a bath of molten solder is completed and the electronic component is completely mounted on the board.

[0004] JP 2008-108549 A

[0005] However, when an all-solid-state battery is used as such a substrate-mounted battery, particularly when a charged all-solid-state battery is placed on a substrate together with electronic components such as DIP components and then immersed in a molten solder bath to be surface-mounted on the substrate, there is a problem that a short circuit occurs during solder immersion, causing the charge stored in the all-solid-state battery to be discharged. In such a case, as a result, the charge of the all-solid-state battery may decrease or even become zero in the finished substrate on which the all-solid-state battery is surface-mounted together with the electronic components. Furthermore, such a short circuit may cause failure of the all-solid-state battery itself or other electronic components mounted on the electric circuit board.

[0006] The present invention has been made in consideration of the above circumstances, and an object of the present invention is to provide an electronic circuit board and a manufacturing method thereof that can prevent discharge of an all-solid-state battery surface-mounted on a substrate during the substrate manufacturing stage and failure of surface-mounted electronic components.

[0007] In order to solve the above problems, the present invention provides an electronic circuit board having an all-solid-state battery surface-mounted together with electronic components, wherein the electronic components and the all-solid-state battery are electrically connected by soldering to a conductor wiring pattern formed on an electrically insulating substrate body to form an electronic circuit, and wherein an electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery or an electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery is provided with switching means that electrically isolates these electrical lines and can switch from an electrically isolated state to an electrically conductive state.

[0008] According to the above-described configuration of the present invention, a switching means is provided that can electrically isolate the electrical lines connected to the positive and negative electrodes of the all-solid-state battery and switch from this electrically isolated state to an electrically conductive state (a state in which the electrical lines are electrically conductive). Therefore, by presetting the electrical lines to an electrically isolated state by the switching means, when forming an electronic circuit by electrically connecting electronic components and / or the all-solid-state battery to a conductor wiring pattern (forming part of the electrical lines of the electronic circuit) by soldering, even if the charged all-solid-state battery is placed on a substrate together with the electronic components and immersed together in a molten solder bath, the charge stored in the all-solid-state battery will not be discharged due to a short circuit. Furthermore, after soldering is completed, by using the switching means to switch from the electrically isolated state in which the electrical lines are electrically isolated to an electrically conductive state in which the electrical lines are electrically conductive, a desired electronic circuit configuration can be achieved in which the charged state of the all-solid-state battery is maintained in a finished substrate product in which the all-solid-state battery is surface-mounted together with the electronic components.

[0009] In the above configuration, the switching from an electrically disconnected state to an electrically conductive state may be reversible, but is preferably irreversible. Furthermore, in the above configuration, the switching means may have any configuration and / or form as long as it can electrically disconnect the electrical lines in an initial state and switch from the electrically disconnected state to an electrically conductive state. For example, examples of the switching means include a switch provided in the conductor wiring pattern to open and close the electronic circuit, or a cutout that mechanically cuts the conductor wiring pattern. Alternatively, the switching means may be a switching element that switches from an electrically disconnected state to an electrically conductive state upon application of a voltage. Such a switching element may form an electrical circuit including a transistor, a fuse, a nonvolatile memory, or a photocoupler. Furthermore, the switching element may be provided at any position within the electronic circuit, for example, inside or outside the all-solid-state battery.

[0010] The present invention also provides a manufacturing method for manufacturing an electronic circuit board having the above-described configuration, in which an all-solid-state battery is surface-mounted together with electronic components. This manufacturing method includes a soldering step of forming an electronic circuit by electrically connecting electronic components and / or an all-solid-state battery to a conductor wiring pattern formed on an electrically insulating substrate body by soldering, and further includes an electrical disconnection step, prior to the soldering step, of electrically disconnecting the electrical lines by using switching means provided in an electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery or an electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery, and after the soldering step, switching from the electrically disconnected state to an electrically conductive state in which the electrical lines are electrically connected by using the switching means.

[0011] Even in such a manufacturing method, if the electrical lines are set in advance to a state in which they are electrically cut off from each other by the switching means, when the electronic components and / or the all-solid-state battery are electrically connected to the conductor wiring pattern by soldering to form an electronic circuit, even if the all-solid-state battery in a charged state is placed on a substrate together with the electronic components and immersed together in a molten solder bath, the charge stored in the all-solid-state battery will not be discharged due to a short circuit.

[0012] According to the electronic circuit board and the manufacturing method thereof of the present invention, it is possible to prevent discharge of a surface-mounted all-solid-state battery during the substrate manufacturing stage.

[0013] 5A is a schematic perspective view of an electronic circuit board according to a first embodiment of the present invention, which includes a switching means; FIG. 5B is a schematic cross-sectional side view showing a state in which an electronic circuit board having an all-solid-state battery surface-mounted thereon is immersed in a molten solder bath; FIG. 5C is a flowchart showing processing steps of an example of a manufacturing method for manufacturing an electronic circuit board having an all-solid-state battery surface-mounted together with electronic components; FIG. 5D is a schematic perspective view of an electronic circuit board according to a second embodiment of the present invention, which includes a switching means; FIG. 5E is an internal circuit diagram of an all-solid-state battery having a switching element therein; (a) is a perspective view of the all-solid-state battery alone of FIG. 5, and (b) is a schematic perspective view of an electronic circuit board on which the all-solid-state battery of FIG. 5 is surface-mounted; FIG. 5F is an electronic circuit diagram having a switching element similar to that of FIG. 5 outside the all-solid-state battery; and FIG. 5G is an electronic circuit diagram having a switching element of a second form inside the all-solid-state battery. (a) is a perspective view of the all-solid-state battery alone of FIG. 8, and (b) is a schematic perspective view of an electronic circuit board on which the all-solid-state battery of FIG. 8 is surface-mounted; and 1 is a schematic perspective view of an electronic circuit board showing an example of a configuration in which an all-solid-state battery is later attached to a battery socket soldered to board wiring.

[0014] Hereinafter, embodiments of the present invention will be described with reference to the drawings. This embodiment can realize a highly reliable system, particularly in a sensing system, and contributes to the development of resilient infrastructure, and targets "9.1 Develop quality, reliable, sustainable and resilient infrastructure, including regional and transborder infrastructure, to support economic development and human well-being, with a focus on affordable and equitable access for all" in "9. Build resilient infrastructure, promote inclusive and sustainable development, and foster resilience" of the Sustainable Development Goals (SDGs) advocated by the United Nations. In addition, in the following embodiments, the present invention will be described using an all-solid-state battery as an example, but the present invention can also be applied to batteries other than all-solid-state batteries.

[0015] 1 shows an electronic circuit board 1 according to a first embodiment of the present invention. As shown in the figure, this electronic circuit board 1 is configured by surface-mounting an all-solid-state battery 10 together with electronic components (not shown), and includes an electrically insulating substrate main body 8. For example, a pair of conductor wiring patterns 2, 4 are formed on the mounting surface 8a of the substrate main body 8 on which the electronic components and the all-solid-state battery 10 are mounted. As an example, here, one end of one conductor wiring pattern 2 is electrically connected to the positive electrode side of the all-solid-state battery 10 by solder, and one end of the other conductor wiring pattern 4 is electrically connected to the negative electrode side of the all-solid-state battery 10 by solder.

[0016] Each of the conductor wiring patterns 2, 4 extends to a corresponding via 3, 5 as a through hole penetrating the substrate body 8, and a pair of leads (feet) of the electronic component as a DIP component is inserted into each of the pair of vias 3, 5 from the mounting surface 8a side, with the leads protruding from the soldered surface 8b, which is the opposite surface of the substrate body 8. The protruding portions (soldered portions) of the leads are electrically connected by solder to the conductive wiring patterns formed on the soldered surface 8b.

[0017] In this way, the electronic components and the all-solid-state battery 10 are electrically connected by solder to the conductor wiring pattern formed on the substrate body 8, thereby forming an electronic circuit, and therefore the conductor wiring pattern forms part of the electrical line of the electronic circuit together with the electronic components, the internal circuit of the all-solid-state battery 10, etc.

[0018] Furthermore, the electronic circuit board 1 of this embodiment is provided with a switching means for electrically isolating the electrical lines of the electronic circuit connected to the positive electrode of the all-solid-state battery 10 or the electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10 and for switching from the electrically isolated state to an electrically conductive state. In particular, in this embodiment, a switch 20 for opening and closing the electronic circuit is provided as switching means in the middle of the conductor wiring pattern 2 connected to the positive electrode of the all-solid-state battery 10. In this case, the electrical terminal 20b on one end of the switch 20 is electrically connected to the first electrical line 2a of the conductor wiring pattern 2 that is electrically connected to the positive electrode metal terminal 10a of the all-solid-state battery 10, and the electrical terminal 20a on the other end is electrically connected to the second electrical line 2b of the conductor wiring pattern 2 extending from the via 3.

[0019] Therefore, when the switch 20 is open, the electric lines 2a, 2b are electrically disconnected from each other, and therefore, even if a short circuit occurs in the electronic circuit lines due to soldering, the electric line of the electronic circuit connected to the positive electrode of the all-solid-state battery 10 and the electric line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10 are electrically disconnected from each other, preventing discharge of the all-solid-state battery 10. On the other hand, when the switch 20 is closed, an electrically conductive state is established in which the electric lines are electrically connected to each other.

[0020] With the above configuration, for example, as shown in FIG. 2 , when soldering is performed by bringing a soldered surface 8 b of the electronic circuit board 1 (board main body 8) on which a soldered portion of an electronic component is present into contact with a jet wave of molten solder 50 to supply molten solder to the soldered portion, as shown in FIG. 3 , first, after the electronic component and the all-solid-state battery 10 are mounted on the electronic circuit board 1 (mounting surface 8 a of the board main body 8) (step S1) (or may be before mounting), the switching means is set to an electrically disconnected state (step S2).

[0021] Specifically, in the present embodiment, as an example, the positive electrode metal terminal 10a of the all-solid-state battery 10 is electrically connected in advance to the first electrical line 2a of the conductor wiring pattern 2 by soldering, the negative electrode metal terminal 10b of the all-solid-state battery 10 is electrically connected in advance to the conductor wiring pattern 4 by soldering, and the switch 20 is soldered to the electrical lines 2a, 2b as described above. In this state, leads of an electronic component such as a DIP component (not shown) are inserted into the vias 3, 5, and the switch 20 is opened to electrically isolate the electrical lines 2a, 2b from each other. Note that the setting of the electrically isolated state by the switching means may be performed at any stage as long as it is before soldering, which may cause a short circuit.

[0022] Then, in this mounted state, as shown in FIG. 2 , the soldered surface 8 b of the electronic circuit board 1 (board body 8) is brought into contact with a jet wave of molten solder 50, supplying the molten solder to the soldered portion and performing soldering (step S3). At this time, a short circuit may occur in the electronic circuit line during soldering. However, the open switch 20 electrically disconnects the electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery 10 from the electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10, preventing discharge of the all-solid-state battery 10. After that, once soldering is complete and all electronic components are electrically connected to the electronic circuit lines, the switching means is then placed in an electrically conductive state (step S4). Specifically, in this embodiment, the switch 20 is closed.

[0023] As described above, in the present embodiment, the switch 20 is provided which can electrically isolate the electrical lines connected to the positive electrode and the negative electrode of the all-solid-state battery 10 and can switch from this electrically isolated state to an electrically conductive state (a state in which electrical conduction is established between the electrical lines). Therefore, if the electrical lines are previously set to a state in which they are electrically isolated by the switch 20, when forming an electronic circuit by electrically connecting the electronic components and the all-solid-state battery 10 to a conductor wiring pattern (forming part of the electrical lines of the electronic circuit) by soldering, even if the all-solid-state battery 10 in a charged state is placed on a substrate together with the electronic components and they are both immersed in a molten solder bath, the charge stored in the all-solid-state battery 10 will not be discharged due to a short circuit.

[0024] FIG. 4 shows an electronic circuit board 1A according to a second embodiment of the present invention, which includes a switching means. As shown in the figure, the switching means in this embodiment is not a switch 20, which reversibly switches between an electrically disconnected state and an electrically connected state as in the first embodiment, but rather an irreversible switch that switches from an electrically disconnected state to an electrically connected state. That is, the switching means in this embodiment is formed as a cutout 90 that mechanically cuts the conductor wiring pattern 2. In its current state, the cutout 90 electrically disconnects the electrical lines 2a and 2b from each other. However, as described above, once soldering is completed and all electronic components are electrically connected to the electronic circuit lines, the hole is filled with solder, thereby establishing an electrically conductive state in which the electrical lines 2a and 2b are electrically connected to each other. The cutout 90 may be a through hole or a concave hole. Within the cutout 90, a plated region connected to the electrical line 2a and a plated region connected to the electrical line 2b may be formed, electrically disconnected from each other.

[0025] 5 shows another form of switching means provided on an electronic circuit board. In this example, the switching means is formed as a switching element that switches from an electrically disconnected state to an electrically conductive state when a voltage is applied, and is mounted inside the all-solid-state battery. Specifically, in this example, the switching element includes a transistor T and a fuse F, and forms an electric circuit. This will be described below.

[0026] In the illustrated all-solid-state battery 10A according to this example, which incorporates a switching element, an electric line L2 extending from the negative electrode of a power supply unit E is connected to a negative electrode terminal 10b (GND), and an electric line L1 extending from the positive electrode of the power supply unit E is connected to a positive electrode terminal 10a (Vcc). A PMOS transistor T is provided along the electric line L1. Specifically, a wiring portion L1a of the electric line L1 connected to the positive electrode of the power supply unit E is connected to the source (S) of the PMOS transistor T, and a wiring portion L1b of the electric line L1 connected to the positive electrode terminal 10a is connected to the drain (D) of the PMOS transistor T. An electric line L3 extending from the gate (G) of the PMOS transistor T has two series-connected resistors R and is connected to the electric line L2. A fuse F connects the portion of the electric line L3 between the two resistors R to the wiring portion L1a of the electric line L1. The fuse F is connected to a fuse terminal 10c of the all-solid-state battery 10A.

[0027] 6, an electronic circuit board 1B formed by surface-mounting an all-solid-state battery 10A having such a configuration has, in addition to the above-mentioned conductor wiring patterns 2 and 4 connected to the positive electrode terminal 10a and the negative electrode terminal 10b of the all-solid-state battery 10A, a conductor wiring pattern 9 connected to the fuse terminal 10c of the all-solid-state battery 10A. In this case, the conductor wiring pattern 9 extends to a via 7 for mounting an element for applying voltage. In this configuration, the terminals 10a, 10b, and 10c are formed on the same surface of the battery 10A.

[0028] When fuse F is connected to electrical lines L1a and L3 without being broken, no potential difference occurs between the gate and source of transistor T due to the voltage of power supply unit E, and transistor T therefore does not provide electrical continuity between electrical line wiring portions L1a and L1b (Vcc = 0 V). In other words, an electrical disconnection state is established in which the electrical line of the electronic circuit connected to the positive electrode of all-solid-state battery 10A is electrically disconnected from the electrical line of the electronic circuit connected to the negative electrode of all-solid-state battery 10A. Therefore, even if soldering is performed in this state, discharge of the all-solid-state battery 10A does not occur. In contrast, when fuse F is broken by applying a high voltage to fuse terminal 10c, the gate potential of transistor T becomes GND potential and the source potential of transistor T becomes the potential of power supply unit E, creating a potential difference between the gate and source of transistor T, and transistor T provides electrical continuity between electrical line wiring portions L1a and L1b (Vcc = voltage of power supply unit E). That is, an electrical conduction state is established between the electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery 10A and the electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10A. Therefore, if a high voltage is applied to the fuse terminal 10c after soldering is completed, a desired electronic circuit configuration can be achieved in a completed board product in which the all-solid-state battery is surface-mounted together with electronic components, and the charged state of the all-solid-state battery is maintained.

[0029] 7 shows a circuit configuration in which the switching means described in relation to Fig. 5 is provided outside the all-solid-state battery 10. Therefore, in this case, if the circuit configuration described in relation to Fig. 1 is adopted, the electric lines 2a and 2b of the conductor wiring pattern 2 will replace the wiring portions L1a and L1b of the electric line L1 described above, and the conductor wiring pattern 4 will replace the electric line L2 described above.

[0030] 8 shows yet another form of switching means provided on an electronic circuit board. In this example, the switching means is also formed as a switching element that switches from an electrically disconnected state to an electrically conductive state when a voltage (signal) is applied, and is mounted inside the all-solid-state battery. Specifically, in this example, the switching element includes a transistor T and a nonvolatile memory M, and forms an electric circuit. This will be described below.

[0031] In the illustrated all-solid-state battery 10B according to this example, which incorporates a switching element, an electrical line L2 extending from the negative electrode of the power supply unit E is connected to the negative electrode terminal 10b (GND), and an electrical line L1 extending from the positive electrode of the power supply unit E is connected to the positive electrode terminal 10a (Vcc). A PMOS transistor T is provided along the electrical line L1. Specifically, the wiring portion L1a of the electrical line L1 connected to the positive electrode of the power supply unit E is connected to the source (S) of the PMOS transistor T, and the wiring portion L1b of the electrical line L1 connected to the positive electrode terminal 10a is connected to the drain (D) of the PMOS transistor T. An electrical line L3 extending from the gate (G) of the PMOS transistor T is connected to a non-volatile memory M. The non-volatile memory M is also connected to a control terminal 10d and a write / erase terminal 10e of the all-solid-state battery 10B. An electrical line L5 connecting the non-volatile memory M to the control terminal 10d is connected to the electrical line L2 via an electrical line L4 having a resistor R.

[0032] 9, an electronic circuit board 1C formed by surface-mounting an all-solid-state battery 10B having such a configuration has, in addition to the above-mentioned conductor wiring patterns 2 and 4 connected to the positive electrode terminal 10a and the negative electrode terminal 10b of the all-solid-state battery 10B, a conductor wiring pattern 31 connected to the control terminal 10d of the all-solid-state battery 10B and a conductor wiring pattern 33 connected to the write / erase terminal 10e of the all-solid-state battery 10B. Here, the conductor wiring patterns 31 and 33 extend to vias 27 and 29 for mounting elements for applying voltage (signals). In this configuration, the terminals 10a, 10b, 10d, and 10e are formed on the same surface of the battery 10B.

[0033] When the data in the nonvolatile memory M is held at "1" and no potential difference is generated between the gate and source of the transistor T, the transistor T does not establish electrical continuity between the wiring portions L1a and L1b of the electrical line (Vcc = 0 V). That is, an electrical disconnection state is established in which the electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery 10B is electrically disconnected from the electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10B. Therefore, even if soldering is performed in this state, the all-solid-state battery 10B does not discharge. In contrast, when a high-level voltage (signal) is applied to the control terminal 10d and a low-level voltage (signal) is applied to the write / erase terminal 10e, the data in the nonvolatile memory M is erased (data "1" is changed to data "0"), and a potential difference is generated between the gate and source of the transistor T, causing the transistor T to establish electrical continuity between the wiring portions L1a and L1b of the electrical line (Vcc = the voltage of the power supply unit E). That is, an electrically conductive state is established between the electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery 10B and the electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery 10B. Therefore, after soldering is completed, by applying a High-level voltage (signal) to the control terminal 10d and a Low-level voltage (signal) to the write / erase terminal 10e, it is possible to achieve a desired electronic circuit configuration in which the charged state of the all-solid-state battery is maintained in a completed board product in which the all-solid-state battery is surface-mounted together with electronic components.

[0034] Note that, as in the all-solid-state battery 10C shown in FIG. 10, if the switching means has a plurality of nonvolatile memories M and the transistor T does not become conductive unless all of the memories M become "0", the reliability of the PMOS control can be improved.

[0035] 7, when the switching means is provided outside the all-solid-state battery 10, a photocoupler P can be used together with the transistor T instead of the fuse F, as shown in FIG. 11. In this case, if there is no input from the control terminal 60, no potential difference occurs between the gate and source of the transistor T due to the voltage of the power supply unit E, and the transistor T does not conduct electricity between the electrical lines 2a and 2b (Vcc = 0V). In contrast, when a low-level voltage (signal) is applied to the control terminal 60, the output of the photocoupler P becomes "0", a potential difference occurs between the gate and source of the transistor T, and the transistor T conducts electricity between the electrical lines 2a and 2b (Vcc = voltage of the power supply unit E).

[0036] 12 , it is also conceivable that another example of surface-mounting the all-solid-state battery 10 on an electronic circuit board is to later attach the all-solid-state battery 10 to a battery socket 70 whose electrical terminals have already been soldered to the conductor wiring patterns 2, 4. Of course, in this case, the all-solid-state battery 10 is attached to the battery socket 70 after the soldering process, which may cause a short circuit, is completed. External terminals for connecting to the conductor wiring patterns 2, 4 are formed on the outer bottom surface of the socket 70, and internal terminals for connecting to the electrodes of the all-solid-state battery 10 are formed inside the socket 70, and these terminals are electrically connected to each other.

[0037] Although the present invention has been described above in relation to various embodiments, the present invention is not limited to the above-described embodiments and can be modified in various ways without departing from the spirit of the present invention. For example, in the present invention, the form of the switching means, the form of the wiring pattern, the number of electronic components, and the number of all-solid-state batteries are not limited to those of the above-described embodiments. Furthermore, some or all of the above-described embodiments may be combined, or part of the configuration of one of the above-described embodiments may be omitted, without departing from the spirit of the present invention.

[0038] 1, 1A, 1B, 1C Electronic circuit board 10, 10A, 10B, 10C All-solid-state battery 2, 4 Conductor wiring pattern 20 Switch (switching means) 90 Cutout (switching means) F Fuse (switching element) M Non-volatile memory (switching element) P Photocoupler (switching element) T Transistor (switching element)

Claims

1. An electronic circuit board having an all-solid-state battery surface-mounted together with electronic components, wherein the electronic components and the all-solid-state battery are electrically connected by soldering to a conductor wiring pattern formed on an electrically insulating substrate body to form an electronic circuit, and wherein an electrical line of the electronic circuit connected to the positive electrode of the all-solid-state battery or an electrical line of the electronic circuit connected to the negative electrode of the all-solid-state battery is provided with switching means that electrically isolates these electrical lines and can switch from an electrically isolated state to an electrically conductive state.

2. An electronic circuit board having a battery surface-mounted together with electronic components, wherein the electronic components and the battery are electrically connected by soldering to a conductor wiring pattern formed on an electrically insulating board body to form an electronic circuit, and wherein the electrical line of the electronic circuit connected to the positive electrode of the battery or the electrical line of the electronic circuit connected to the negative electrode of the battery is provided with switching means that electrically isolates these electrical lines and can switch from an electrically isolated state to an electrically conductive state.

3. The electronic circuit board according to claim 1 or 2, characterized in that the switching from the electrically disconnected state to the electrically conducting state is irreversible.

4. The electronic circuit board according to claim 1 or 2, wherein the switching means is a switch provided on the conductor wiring pattern for opening and closing the electronic circuit.

5. The electronic circuit board according to claim 1 or 2, wherein the switching means is a cut hole that mechanically cuts the conductor wiring pattern.

6. The electronic circuit board according to claim 1 or 2, wherein the switching means includes a switching element that switches from the electrically disconnected state to the electrically conductive state when a voltage is applied thereto.

7. The electronic circuit board according to claim 6, wherein the switching element comprises a transistor, a fuse, a nonvolatile memory, or a photocoupler to form an electric circuit.

8. The electronic circuit board according to claim 6, wherein the switching element is provided inside the all-solid-state battery.

9. A manufacturing method for manufacturing an electronic circuit board having a battery surface-mounted together with electronic components, comprising: a soldering step of forming an electronic circuit by electrically connecting the electronic components and / or the battery to a conductor wiring pattern formed on an electrically insulating board body by soldering; and an electrical disconnection step, prior to the soldering step, of electrically disconnecting the electrical lines by using switching means provided in the electrical line of the electronic circuit connected to the positive electrode of the battery or the electrical line of the electronic circuit connected to the negative electrode of the battery; and after the soldering step, using the switching means to switch from the electrically disconnected state to an electrically conductive state in which the electrical lines are electrically connected.

10. The manufacturing method according to claim 8, wherein the soldering step is performed by placing the charged battery together with the electronic components on the substrate and immersing the resultant battery in a bath of molten solder.

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