Curable resin composition, cured film, and display device

Abstract

Provided are a curable resin composition, a cured film, and a display device, the curable resin composition comprising: a silicone-based resin derived from at least one monomer of chemical formula 1; a reaction-inducing additive; and particles, wherein the reaction-inducing additive includes a compound having a moiety of chemical formula 4.

Description

Curable resin composition, cured film and display device

[0001] The present invention relates to a curable resin composition, a cured film, and a display device.

[0002]

[0003] As the display industry advances, various display devices utilizing displays are diversifying. There is a growing demand for technologies that enhance the luminous efficiency of self-luminous materials, such as OLEDs or quantum dot displays. Low-refractive index films are being used to improve luminous efficiency by recycling light emitted from OLEDs or quantum dots, and to provide anti-reflection effects with their low refractive index, thereby improving visibility.

[0004] The above low-refractive-index film can be manufactured by applying a curable resin composition to a substrate to a predetermined thickness and then curing it. It may be desirable for the curable resin composition to provide a low-refractive-index film having a low refractive index, excellent adhesion to an inorganic layer, excellent hardness, and excellent optical efficiency. In addition, it may be desirable for the curable resin composition to have high storage stability, thereby increasing the manufacturing processability of the low-refractive-index film.

[0005]

[0006] To provide a curable resin composition having excellent storage stability.

[0007] The present invention provides a curable resin composition that realizes a low refractive index film having excellent adhesion and hardness to an inorganic layer and excellent optical efficiency.

[0008]

[0009] According to one embodiment, a curable resin composition is provided.

[0010] The curable resin composition comprises a silicone resin derived from at least one monomer of the following chemical formula 1, a reaction-inducing additive, and particles, wherein the reaction-inducing additive comprises a compound having a moiety of the following chemical formula 4:

[0011] [Chemical Formula 1]

[0012] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c

[0013] (In the above chemical formula 1,

[0014] R 1 Inland R 4 , a, b and c are as described in the description of the invention below)

[0015] [Chemical Formula 4]

[0016]

[0017] (In the above chemical formula 4, * and R 1 is as described in the description of the invention below)

[0018] According to another embodiment, a cured film is provided.

[0019] The above cured film includes a cured product of the above curable resin composition.

[0020] In another embodiment, a display device is provided.

[0021] The above display device includes the above cured film.

[0022]

[0023] The curable resin composition described above has excellent storage stability, thereby enhancing the manufacturing processability of a low-refractive index film. The curable resin composition provides a low-refractive index film with excellent adhesion and hardness to an inorganic layer and excellent optical efficiency, thereby improving the mechanical properties of a display device and enhancing optical efficiency.

[0024]

[0025] Figure 1 is a plan view schematically illustrating a color conversion panel according to an embodiment.

[0026] Figure 2 is a cross-sectional view schematically illustrating a cross-section taken along line II-II of Figure 1.

[0027] Fig. 3 is a cross-sectional view according to a modified example of Fig. 2.

[0028] Fig. 4 is a cross-sectional view according to a modified example of Figs. 2 and 3.

[0029] Fig. 5 is a cross-sectional view according to a modified example of Fig. 2.

[0030]

[0031] Hereinafter, embodiments of the present application will be described in more detail with reference to the attached drawings. However, the technology disclosed in the present application is not limited to the embodiments described herein and may be embodied in other forms. However, the embodiments introduced herein are provided so that the disclosed content can be thorough and complete and so that the spirit of the present application can be sufficiently conveyed to those skilled in the art. In order to clearly express the components of each device in the drawings, the sizes of the components, such as width and thickness, are somewhat enlarged. However, the sizes of the components, such as width and thickness, in the present invention do not limit the scope of the present invention. The same reference numerals in multiple drawings indicate substantially the same components.

[0032] The terminology used herein is for the purpose of describing exemplary embodiments only and is not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

[0033] In this specification, "upper" and "lower" are defined based on the drawing, and depending on the perspective, "upper" may be changed to "lower" and "lower" may be changed to "upper", and reference to "on" or "on" may include not only directly on but also cases where another structure is interposed in between. On the other hand, reference to "directly on" or "directly above" or "directly formed" indicates cases where there is no intervening other structure such as an intermediate body.

[0034] Unless otherwise specified herein, "alkyl group" means a C1 to C20 alkyl group, "alkenyl group" means a C2 to C20 alkenyl group, "cycloalkenyl group" means a C3 to C20 cycloalkenyl group, "heterocycloalkenyl group" means a C3 to C20 heterocycloalkenyl group, "aryl group" means a C6 to C20 aryl group, "arylalkyl group" means a C6 to C20 arylalkyl group, "alkylene group" means a C1 to C20 alkylene group, "arylene group" means a C6 to C20 arylene group, "alkylarylene group" means a C6 to C20 alkylarylene group, "heteroarylene group" means a C3 to C20 heteroarylene group, and "alkoxylene group" means a C1 to C20 It refers to an alkoxylene group.

[0035] Unless otherwise specified herein, "substitution" means that at least one hydrogen atom is substituted with a halogen atom (F, Cl, Br, I), a hydroxy group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 It means substituted with a C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, a (meth)acryloxy group, a (meth)acrylate group, or a combination thereof.

[0036] Additionally, unless otherwise specified herein, “hetero” means that the chemical formula contains at least one heteroatom of at least one of N, O, S, and P.

[0037] Additionally, unless otherwise specified herein, “(meth)acrylate” means both “acrylate” and “methacrylate”, and “(meth)acrylic acid” means both “acrylic acid” and “methacrylic acid”.

[0038] Unless otherwise specified herein, “combination” means mixing or copolymerization.

[0039] Unless otherwise defined in the chemical formulas herein, if a chemical bond is not drawn at a position where a chemical bond should be drawn, it means that a hydrogen atom is bonded at that position.

[0040] When describing a numerical range in this specification, “X to Y” means X or more and Y or less (X≤ and ≤Y).

[0041] A curable resin composition according to one embodiment exhibits excellent storage stability, thereby enhancing the manufacturing processability of a low-refractive index film. The curable resin composition exhibits excellent adhesion and hardness to an inorganic layer and realizes a low-refractive index film with excellent optical efficiency, thereby improving the mechanical properties of a display device and enhancing optical efficiency.

[0042] The curable resin composition comprises a silicone resin derived from at least one monomer of the following chemical formula 1, a reaction-inducing additive, and particles, wherein the reaction-inducing additive comprises a compound having a moiety of the following chemical formula 4:

[0043] (A) Silicone resin

[0044] The above silicone resin may be a siloxane copolymer.

[0045] According to one embodiment, the silicone resin is derived from one or more monomers of the following chemical formula 1:

[0046] [Chemical Formula 1]

[0047] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c

[0048] (In the above chemical formula 1,

[0049] R 1 Inland R 3are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, R'(C=O)-* (wherein, R' is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), a (meth)acrylate group, a (meth)acryloxy group, or a combination thereof,

[0050] R 4 is hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof,

[0051] a, b, and c are each independently integers 0 or 1, but 0 ≤ a+b+c < 4.)

[0052] For example, the compound of the above chemical formula 1 is tetramethoxysilane, tetraethoxysilane, tetra(i-propoxy)silane, trimethoxysilane, triethoxysilane, methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyl triethoxysilane, methyltriiso-propoxysilane, ethyltriiso-propoxysilane, methacryloxypropyltrimethoxysilane, dimethoxysilane, diethoxysilane, methyldimethoxysilane, methyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldi(i-propoxy)silane, methylethyldimethoxysilane, Methylethyl diethoxysilane, methylethyldi(i-propoxy)silane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, methylpropyldi(i-propoxy)silane, methoxysilane, ethoxysilane, methylmethoxysilane, methylethoxysilane, dimethylmethoxysilane, dimethylethoxysilane, trimethyl methoxysilane, trimethylethoxysilane, trimethyl(i-propoxy)silane, triethylmethoxysilane, triethylethoxysilane, triethyl(i-propoxy)silane, tripropylmethoxysilane, tripropylethoxysilane, tripropyl(i-propoxy)silane, methyldiethylmethoxysilane, methyldiethylethoxysilane, methyldiethyl(i-propoxy)silane, methyldipropylmethoxysilane, methyldipropylethoxysilane, It may include at least one of methyldipropyl(i-propoxy)silane, ethyldimethylethoxysilane, ethyldimethyl(i-propoxy)silane, ethyldipropylmethoxysilane, ethyldipropylethoxysilane, ethyldipropyl(i-propoxy)silane, propyldimethylmethoxysilane, propyl dimethylethoxysilane, propyl dimethyl(i-propoxy)silane, propyl diethyl methoxysilane, propyldiethylethoxysilane, and propyldiethyl(i-propoxy)silane.

[0053] The above silicone resin may be formed by hydrolysis and condensation reaction of 100 mol% of the compound represented by the above chemical formula 1.

[0054] According to one embodiment, the silicone resin may be formed by hydrolysis and condensation reaction of a mixture containing two or more monomers of the above chemical formula 1.

[0055] According to one embodiment, the silicone resin may be represented by the following chemical formula 1-1:

[0056] [Chemical Formula 1-1]

[0057] (R 11 SiO 3 / 2 ) T1 (R 12 SiO 3 / 2 ) T2 (SiO 4 / 2 ) Q

[0058] (In the above chemical formula 1-1,

[0059] 0.5≤Q≤0.9, 0.1≤T1+T2≤0.5, Q +T1 +T2 =1,

[0060] R 11 is an unsubstituted C1 to C30 alkyl group,

[0061] R 12 is a C1 to C30 alkyl group substituted with a (meth)acrylate group, a (meth)acryloxy group, or a combination thereof.

[0062] The above silicone resin can easily implement the effects of the above-described curable resin composition.

[0063] For example, in the chemical formula 1-1, it may be 0.05≤T1≤0.3, 0.05≤T2≤0.4. For example, in the chemical formula 1-1, it may be 0.5≤Q≤0.8, 0.5≤Q≤0.7, 0.5≤Q≤0.6.

[0064] The above silicone resin may be derived from at least one compound represented by the above chemical formula 1 and at least one compound represented by the following chemical formula 2:

[0065] [Chemical Formula 2]

[0066]

[0067] (In the above chemical formula 2,

[0068] L 4 is a single bond, a substituted or unsubstituted C1 to C10 alkylene group, a substituted or unsubstituted C3 to C10 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, or a combination thereof,

[0069] R 6 and R 7 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, or a combination thereof, R 6 and R 7 At least one of them is a substituted or unsubstituted C6 to C30 aryl group,

[0070] R 8 is hydrogen, or a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof,

[0071] m is an integer from 1 to 3)

[0072] When the silicone resin is formed by hydrolysis and condensation of the compounds represented by the chemical formulas 1 and 2, an N-aryl amino group is included as a substituent in the siloxane copolymer, and in this case, the crack resistance and high transparency properties of the curable resin composition according to one embodiment can be further improved. In addition, the N-aryl amino group can increase compatibility with the particles, thereby improving the transparency properties of a cured film manufactured using the curable resin composition.

[0073] The silicone resin comprises 50 to 85 mol% of the compound represented by the chemical formula 1, for example, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68, 69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85 mol%, and 15 to 50 mol% of the compound represented by the chemical formula 2, for example, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50 mol%, for example, 55 to 80 mol% of the compound represented by the above chemical formula 1 and 20 to 45 mol% of the compound represented by the above chemical formula 2, for example, 65 to 75 mol% of the compound represented by the above chemical formula 1 and 25 to 35 mol% of the compound represented by the above chemical formula 2, and may be formed by hydrolysis and condensation reaction. When included in the above range, the crack resistance and transparency properties of the curable resin composition manufactured therefrom can be further improved.

[0074] The above silicone resin may be derived from at least one compound represented by the above chemical formula 1, at least one compound represented by the above chemical formula 2, and at least one compound represented by the following chemical formula 3:

[0075] [Chemical Formula 3]

[0076] (R 7 O) 3-d-e (R 5 ) d (R 6 ) e -Si-Y 1 -Si-(R 8 ) f (R 9 ) g (OR 10 ) 3-f-g

[0077] (In the above chemical formula 3, R 5 , R 6 , R 8 , and R 9 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, R(C=O)- (wherein R is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group), an epoxy group, a (meth)acrylate group, a C1 to C30 alkyl group substituted with a (meth)acrylate group, a (meth)acryloyloxy group, or these It's a combination,

[0078] R 7 and R 10are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof,

[0079] Y 1 is a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, a substituted or unsubstituted C6 to C30 arylene group, or a combination thereof, wherein the substituted or unsubstituted C6 to C30 arylene group is composed of one aromatic ring, or two or more aromatic rings are connected by a single bond, -O-, -S-, -CO-, -COO-, -CONH-, a substituted or unsubstituted C1 to C30 alkylene group, a substituted or unsubstituted C3 to C30 cycloalkylene group, or a combination thereof,

[0080] 0 ≤ d + e < 3, and

[0081] 0 ≤ f + g < 3.

[0082] The silicone resin may be formed by hydrolysis and condensation reaction, including 5 mol% to 30 mol% of the compound represented by the chemical formula 3, for example, 5 mol% to 25 mol%, 5 mol% to 20 mol%, 5 mol% to 15 mol%, 5 mol% to 10 mol%, 10 mol% to 30 mol%, 15 mol% to 30 mol%, 25 mol% to 30 mol%, based on 100 mol% of the silicone resin, but is not limited thereto.

[0083] The polystyrene-converted weight average molecular weight (Mw) of the silicone resin is 1,000 to 50,000 g / mol, for example, 2,000 to 50,000 g / mol, 3,000 to 50,000 g / mol, 5,000 to 50,000 g / mol, 7,000 to 50,000 g / mol, 9,000 to 50,000 g / mol, 10,000 to 50,000 g / mol, 15,000 to 50,000 g / mol, 20,000 to 50,000 g / mol, 25,000 to 50,000 g / mol, 1,000 to 45,000 g / mol, 1,000 to 40,000 g / mol, It may be 1,000 to 35,000 g / mol, 1,000 to 30,000 g / mol, 1,000 to 25,000 g / mol, 1,000 to 10,000 g / mol, but is not limited thereto.

[0084] The above silicone resin may be included in the curable resin composition in an amount of 10 to 50 wt%, for example, 10 to 40 wt%, based on solid content. Within this range, the effects of the above-described curable resin composition may be easily realized.

[0085] In this specification, the term ‘solid content basis’ refers to the remaining components excluding the solvent when the curable resin composition includes the solvent described below.

[0086] Reaction-inducing additives

[0087] The above reaction-inducing additive has a moiety represented by the following chemical formula 4.

[0088] [Chemical Formula 4]

[0089]

[0090] (In the above chemical formula 4, * is the connecting part of the element,

[0091] R 1is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, or the following chemical formula 5.

[0092] [Chemical Formula 5]

[0093] Si(R 2 )(R 3 )R 4 )-O-(C=O)-R 5 -*

[0094] (In the above chemical formula 5, * is the connecting part of the element,

[0095] R 3 , R 3 , R 4 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group,

[0096] R 5 is a substituted or unsubstituted C1 to C30 alkylene group)

[0097] The moiety of the above chemical formula 4 can generate an acid catalyst (e.g., acetic acid) by gradually decomposing as the temperature rises from 100°C to 250°C when the composition is heated and cured. The acid catalyst promotes a reaction between silicone resins to allow the network of the cured film to progress more quickly, thereby maintaining the thickness of the cured film before the pore formation process by the organic polymer having a boiling point of 250°C or lower described below, thereby increasing the hardness of the cured film and increasing the adhesion to the inorganic layer.

[0098] Meanwhile, in the moiety of the above chemical formula 4, *-O-(C=O)-R 1 This structure is not in a free state, but is bound to silicone and protected. This can reduce the possibility that *-O-(C=O)-R exists in a free state in the composition. This can be advantageous for the storage stability of the composition as it is in a pre-cured state, as the curing reaction does not proceed when stored, resulting in a low viscosity increase.

[0099] According to one embodiment, the reaction-inducing additive may be represented by any one of the following chemical formulae 4-1 to 4-4:

[0100] [Chemical Formula 4-1]

[0101]

[0102] [Chemical Formula 4-2]

[0103]

[0104] [Chemical Formula 4-3]

[0105]

[0106] [Chemical Formula 4-4]

[0107]

[0108] In the above chemical formulas 4-1 to 4-4, R 21 , R 22 , R 23 , R 24 , R 31 , R 32 , R 33 , R 41 , R 42 , R 51are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group. In the above chemical formulas 4-1 to 4-4, R a , R b , R c are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, or a substituted or unsubstituted C2 to C30 heterocycloalkyl group.

[0109] For example, R 21 , R 22 , R 23 , R 24 , R 31 , R 32 , R 33 , R 41 , R 42 , R 51 Each independently may be a substituted or unsubstituted C1 to C10 alkyl group, for example, a substituted or unsubstituted C1 to C5 alkyl group. For example, R a , R b , R c Each independently may be a substituted or unsubstituted C1 to C10 alkyl group, for example, a substituted or unsubstituted C1 to C5 alkyl group.

[0110] For example, the reaction-inducing additive may include at least one of silane materials including a -COO- group, such as diacetoxydimethylsilane, triacetoxymethylsilane, propoxytrimethylsilane (Trimethylsilyl Propionate), acetoxytrimethylsilyl Acetate, and bis(trimethylsilyl) malonate.

[0111] The reaction-inducing additive is present in an amount of 0.1 to 5.0 wt% based on solid content in the curable resin composition, for example, 0.1, 0.1, 0.3, 0.4, 0.5, 0.6, 0.7, 0.8, 0.9, 1.0, 1.1, 1.2, 1.3, 1.4, 1.5, 1.6, 1.7, 1.8, 1.9, 2.0, 2.1, 2.2, 2.3, 2.4, 2.5, 2.6, 2.7, 2.8, 2.9, 3.0, 3.1, 3.2, 3.3, 3.4, 3.5, 3.6, 3.7, 3.8, 3.9, 4.0, 4.1, 4.2, It can be included in amounts of 4.3, 4.4, 4.5, 4.6, 4.7, 4.8, 4.9, 5.0 wt%, 0.5 to 3.0 wt%. In the above range, there can be effects of promoting reaction, increasing the hardness of the cured film, and improving storage stability.

[0112] particle

[0113] The above particles may include at least one of hollow particles and solid particles. Here, "solid particles" refer to particles without a hollow core. The hollow particles may provide the effect of reducing the refractive index and further reducing haze compared to a low-refractive-index layer that does not include hollow particles.

[0114] The above particles are metal oxide particles and may include TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, aluminosilicate, or a combination thereof.

[0115] For example, the particle may be spherical.

[0116] The average particle diameter D50 of the above particles may be from 10 nm to 300 nm, for example, from 10 nm to 250 nm, from 10 nm to 200 nm, from 10 nm to 180 nm, from 20 nm to 150 nm, from 20 nm to 130 nm, from 30 nm to 130 nm, from 40 nm to 130 nm, from 50 nm to 130 nm, from 50 nm to 120 nm, from 50 nm to 110 nm, from 60 nm to 100 nm, but is not limited thereto. When the average diameter size of the hollow particles satisfies the above range, the hollow particles can be well dispersed in the polymer matrix, the refractive index of the cured film can be efficiently reduced, and the heat resistance of the film can be increased and / or excellent adhesive properties can be implemented. Here, the average particle diameter D50 may mean a particle diameter meaning the diameter of particles having a cumulative volume of 50% by volume in the particle size distribution.

[0117] The above particles may not be surface-modified, but by being surface-modified, compatibility with the silicone resin can be further increased, thereby further reducing the haze of the low-refractive-index layer.

[0118] According to one embodiment, the particle may include a particle surface-modified with at least one of an alkoxysilane having an alkyl group, an alkoxysilane having a (meth)acryloxy group, and an alkoxysilane having a (meth)acrylate group. The surface-modified particle has good compatibility when combined with the silicone resin, and thus can easily reduce the haze of the low-refractive-index layer.

[0119] According to one embodiment, the particles surface-modified with at least one of the alkoxysilane having an alkyl group, the alkoxysilane having a (meth)acryloxy group, and the alkoxysilane having a (meth)acrylate group may be included in an amount of 90 wt% or more, for example, 95 wt% to 100 wt%, or 100 wt%, of the particles. In the above range, it may be easy to provide the effect of the above-described low refractive index layer.

[0120] According to one embodiment, the total amount of at least one of the alkoxysilane having an alkyl group, the alkoxysilane having a (meth)acryloxy group, and the alkoxysilane having a (meth)acrylate group among the surface modifying materials of the particles may be 90 mol% or more, for example, 95 mol% to 100 mol%.

[0121] For example, the particles may be modified with an alkoxysilane having an alkyl group.

[0122] The alkoxysilane having the above alkyl group may include at least one of monoalkoxysilane, dialkoxysilane, and trialkoxysilane having an alkyl group. For example, the alkoxysilane having the alkyl group may include at least one of methyltrimethoxysilane, methyltriethoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, propyltrimethoxysilane, propyltriethoxysilane, isobutyltriethoxysilane, methyltriiso-propoxysilane, ethyltriiso-propoxysilane, methyldimethoxysilane, methyldiethoxysilane, dimethyldimethoxysilane, dimethyldiethoxysilane, diethyldimethoxysilane, diethyldiethoxysilane, diethyldi(i-propoxy)silane, methylethyldimethoxysilane, methylethyldiethoxysilane, methylethyldi(i-propoxy)silane, methylpropyldimethoxysilane, methylpropyldiethoxysilane, and methylpropyldi(i-propoxy)silane.

[0123] The alkoxysilane having the (meth)acryloxy group may include at least one of monoalkoxysilane, dialkoxysilane, and trialkoxysilane having an alkyl group substituted with a (meth)acryl group or a (meth)acryloxy group. For example, the alkoxysilane having the (meth)acryloyl group may include at least one of (meth)acryloxypropyltrimethoxysilane and (meth)acryloxypropyltriethoxysilane.

[0124] The above surface-modified particles can be purchased as commercially available products or manufactured by performing conventional methods known to those skilled in the art.

[0125] The particles may be included in an amount of 20 to 70 wt%, for example, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70 wt%, or 30 to 50 wt%, of the curable resin composition excluding the solvent. In the above range, the porous low-refractive-index film may be supported, thereby providing an effect of reducing the refractive index.

[0126] The above curable resin composition may further include an organic polymer having a boiling point of 250°C or lower.

[0127] Organic polymers with a boiling point of 250℃ or lower

[0128] The organic polymer having a boiling point of 250°C or lower evaporates from the resin being cured by heating as the temperature rises to 100°C to 250°C when the composition is heated to cure. Accordingly, nanopores are formed in the resin where the organic polymer was present, thereby providing a lower refractive index than a cured film that does not include such nanopores.

[0129] The organic polymer having a boiling point of 100°C to 250°C may include a polyalkylene oxide copolymer, a polyarylene oxide copolymer, a glycol copolymer, an aliphatic polycarbonate copolymer, or a combination thereof.

[0130] Examples of the glycol copolymer include poly(ethylene) glycol, poly(propylene) glycol, etc., and examples of the polyalkylene oxide copolymer or the polyarylene oxide copolymer include polyethylene oxide, polypropylene oxide, polyphenylene oxide, etc., but are not limited thereto.

[0131] The number average molecular weight (Mn) of the organic polymer having the boiling point of 100°C to 250°C is 100 g / mol to 10,000 g / mol, for example, 100 g / mol to 8,000 g / mol, 200 g / mol to 7,000 g / mol, 300 g / mol to 6,000 g / mol, 400 g / mol to 5,500 g / mol, 400 g / mol to 5,000 g / mol, 500 g / mol to 5,000 g / mol, 500 g / mol to 4,500 g / mol, 600 g / mol to 5,000 g / mol, 600 g / mol to 4,500 g / mol, 700 g / mol to 5,000 g / mol, 700 g / mol to 4,500 g / mol, 800 g / mol to 5,000 g / mol, 800 g / mol to 4,500, g / mol, 900 g / mol to 5,000 g / mol, 900 g / mol to 4,500, g / mol, 1,000 g / mol to 5,000 g / mol, 1,000 g / mol to 4,500 g / mol, 1,000 g / mol to 4,000 g / mol, 1,000 g / mol to 3,500 g / mol, 1,000 g / mol to 3,000 g / mol, 1,000 g / mol to 2,500 g / mol, 1,000 g / mol to 2,000 g / mol, but is not limited thereto. The above number average molecular weight can be measured by a conventional method known to those skilled in the art.

[0132] The organic polymer may be included in the curable resin composition in an amount of 10 to 60 wt% based on solid content, for example, 10, 15, 20, 25, 30, 35, 40, 45, 50, 55, 60 wt%, or 20 to 60 wt%, but is not limited thereto.

[0133] The above curable resin composition may further include one or more of a solvent and an additive.

[0134] solvent

[0135] The solvent may be any one solvent or a mixture of two or more solvents usable at a process temperature of 200°C or higher. For example, the solvent may be an alcohol-type solvent such as butanol, isopropanol, etc., a ketone-type solvent such as PMEA, DIBK, etc., and in addition to these, any solvent known in the art that may be used at a process temperature or higher may be used as a mixture of one or two or more solvents.

[0136] When two or more of the above solvents are mixed and used, it may be a mixed form of propylene glycol monomethyl ether acetate (PGMEA), gamma butyrolactone (GBL), and other types of solvents that can be used at a process temperature of 100°C to 230°C.

[0137] In one embodiment, the solvent may be included in an amount of 100 to 2,000 parts by weight, for example, 100 to 1,000 parts by weight, for example, 100 to 500 parts by weight, for example, 100 to 400 parts by weight, for example, 100 to 300 parts by weight, for example, 100 to 200 parts by weight, based on 100 parts by weight of the silicone polymer, but is not necessarily limited thereto.

[0138] The curable resin composition may further include various additives known in the art. Such additives may further include, but are not limited to, leveling agents and surfactants, such as fluorinated surfactants, for improving coating properties and preventing defects during coating of the composition. The additives may be included in an amount of 0.5 to 3 wt% based on solid content in the curable resin composition.

[0139] Another embodiment provides a cured film manufactured by curing the curable resin composition.

[0140] The cured film may have a refractive index of 1.35 or less, for example, 1.30 or less, for example, 1.28 or less, for example, 1.25 or less, for example, 1.20 or less, for example, 1.18 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm, and may have a light transmittance of 90% or more, for example, 92% or more, for example, 95% or more, for a wavelength of 400 nm.

[0141] In order to manufacture a cured film having a low refractive index in the above range, curing at a high temperature of 350°C or higher, or at least 300°C or higher, a method requiring expensive equipment such as chemical vapor deposition (CVD) or expensive hollow silica had to be used. However, even in these cases, it was difficult to reduce the refractive index to the level of 1.2.

[0142] In contrast, the curable resin composition according to one embodiment can be easily manufactured to have the refractive index and transmittance as described above by curing at a low curing temperature, for example, in the range of about 180°C to about 240°C, for a time period of about 10 minutes to about 1 hour, and having a film thickness of about 1 μm to about 10 μm, for example, about 2 μm to about 7 μm, for example, about 2 μm to about 5 μm.

[0143] As described above, the curable resin composition according to one embodiment has a low refractive index and high transmittance as described above, and further, can produce a cured film having excellent heat resistance and adhesiveness.

[0144] For example, a display device including the cured film can be operated for more than 1,000 hours at about 85°C and can maintain a transmittance of more than about 90% at a temperature of 250°C. On the other hand, a cured film manufactured from a composition that does not include hollow particles including a siloxane polymer on the surface among the components of the composition could not secure an operating time of 1,000 hours at about 85°C and also exhibited a transmittance of less than about 85% at a temperature of 250°C, thereby confirming the advantageous effects of a cured film manufactured from a composition according to one embodiment.

[0145] In addition, a cured film manufactured from a curable resin composition according to one embodiment has a very high adhesive strength with an adhesion index of about 5B measured by a cross-cut taping test based on the ASTM D3359 international standard test method, and the adhesion measurement result by a stud pull test as described in the examples described below also showed a high adhesive strength of 30 to 50 MPa. On the other hand, a cured film manufactured from a composition not including hollow particles including a siloxane polymer on the surface had a low adhesive strength index of 0 or 1B or less by the cross-cut taping test, and a low stud pull test value of 5 to 10 MPa.

[0146] Therefore, the cured film according to one embodiment can be used in various fields such as a material for various electronic materials, for example, a low-refractive layer of a color conversion panel, an anti-reflection film on the outermost surface of a display or solar cell, a low-reflection layer of a lens on the outside of a light sensor, and a coating material for an optical member.

[0147] Accordingly, in one embodiment of the present invention, a color conversion panel including the cured film is provided. For example, the color conversion panel,

[0148] substrate;

[0149] A low refractive index layer disposed on one surface of the above substrate;

[0150] A color conversion layer including a color conversion member disposed on the low-refractive-index layer or between the low-refractive-index layer and the substrate; and

[0151] Including a planarizing layer covering the low refractive index layer and the color conversion layer,

[0152] The above low refractive index layer can be manufactured from a curable resin composition according to one embodiment.

[0153] Here, the curable resin composition is the same as described above, so detailed description thereof is omitted.

[0154] In one embodiment, the low-refractive-index layer of the color conversion panel can be manufactured by coating and curing a curable resin composition according to one embodiment on the substrate or the color conversion layer. Specifically, the curable resin composition can be coated on the substrate or the color conversion layer formed on the substrate, and then dried and cured at a temperature of about 150°C to 250°C, for example, 170°C to 250°C, for example, 180°C to 250°C, for example, 180°C to 240°C, for example, 190°C to 240°C, for example, 200°C to 240°C, for example, 210°C to 240°C, for example, 220°C to 240°C, for a time period of about 10 minutes to about 1 hour.

[0155] The method for coating the composition on the substrate or the color conversion layer may use any of various methods known in the art, including, but not limited to, spin coating, slit and spin coating, slit coating, roll coating, or die coating. In one embodiment, the composition may be spin coated on the substrate or the color conversion layer.

[0156] The low-refractive-index layer manufactured as described above may have a thickness of about 100 nm to 10 μm. For example, the cured film may have a thickness of about 1 μm to about 10 μm, for example, about 1 μm to about 8 μm, for example, about 1 μm to about 7 μm, for example, about 1 μm to about 5 μm.

[0157] Hereinafter, a color conversion panel according to one embodiment will be described in detail with reference to the drawings.

[0158] FIG. 1 is a plan view schematically illustrating a color conversion panel (100) according to one embodiment, and FIGS. 2 and 3 are cross-sectional views schematically illustrating a cross-section cut along line II-II of FIG. 1, respectively.

[0159] Referring to FIGS. 2 and 3 together, a color conversion panel (100) according to one embodiment includes a substrate (110), a low-refractive-index layer (120), a color conversion layer (130), and a planarization layer (140). The color conversion layer (130) may include color conversion layers that emit light of two or more different wavelengths, such as a first color conversion layer (132) that emits light of a first wavelength and a second color conversion layer (134) that emits light of a second wavelength. For example, the first color conversion layer (132) may emit red (R) light, and the second color conversion layer (134) may emit green (G) light, but is not limited thereto. In addition, the color conversion panel (100) may further include a third region (C) that emits blue (B) light or white light.

[0160] The substrate (110) is made of a transparent and electrically insulating material, and may further include a protective layer (112) at a position corresponding to the region where the first color conversion layer (132) and the second color conversion layer (134) are positioned. The protective layer (112) is formed on one surface of the substrate (110), so that when the color conversion layer (130) is formed on the substrate (110) later, patterning of the color conversion layer is smoothly performed, and protects the color conversion member within the color conversion layer.

[0161] The low-refractive-index layer (120) may cover a portion of the substrate (110) and the protective layer (112) on one side of the substrate (110), for example, a surface of the substrate (110) on which the protective layer (112) is formed, or, as shown in FIG. 3, the color conversion layer (130) may be first laminated on the protective layer (112), and then laminated on the color conversion layer (130), thereby covering all of the color conversion layer (130), a portion of the substrate (110), and a portion of the protective layer (112). That is, FIGS. 2 and 3 differ only in that the low-refractive-index layer (120) is positioned below the color conversion layer (130) (in the case of FIG. 2) or the low-refractive-index layer (120) is positioned above the color conversion layer (130) (in the case of FIG. 3), and all other components are the same.

[0162] According to one embodiment, the low-refractive layer (120) has a relatively low refractive index of 1.35 or less, for example, 1.32 or less, for example, 1.31 or less, for example, 1.30 or less, for example, 1.29 or less, for example, 1.28 or less, for example, 1.27 or less, for example, 1.26 or less, for example, 1.25 or less, for example, 1.24 or less, for example, 1.23 or less, for example, 1.22 or less, for example, 1.21 or less, for example, 1.20 or less, for example, 1.19 or less, for example, 1.18 or less, for example, 1.17 or less, for example, 1.16 or less, for example, 1.15 or less, for a wavelength of 500 nm to 550 nm. When the low-refractive-index layer (120) is formed above or below, or both above and below, the color conversion layer (130), it is possible to prevent light emitted from the color conversion layer (130) from being reflected toward the substrate (110). That is, when light passes through the low-refractive-index layer (120), it is reflected or refracted due to the difference in refractive index and moves back to the color conversion layer (130), thereby having the effect of reusing the lost light. Accordingly, the luminous efficiency of the color conversion panel (100) according to one embodiment in which the low-refractive-index layer (120) is formed above, below, or on both sides of the color conversion layer (130) can be further improved. The refractive index mentioned herein refers to the absolute refractive index representing the ratio of the speed of light in a vacuum and a medium.

[0163] In addition, the low-refractive-index layer may have an average value of light transmittance for a wavelength of 400 nm to 800 nm of 90% or more, for example, 91% or more, for example, 92% or more, for example, 93% or more, for example, 94% or more, for example, 95% or more, for example, 96% or more, for example, 97% or more, for example, 98% or more, for example, 99% or more, but is not limited thereto. When the average value of light transmittance for a wavelength of 400 nm to 800 nm of the low-refractive-index layer satisfies the above range, the optical properties of the low-refractive-index layer can be further improved.

[0164] In addition, the low-refractive-index layer may have an average reflectance (SCE value) of 10% or less, for example, 7% or less, for example, 5% or less, for example, 3% or less, over the entire wavelength range of 400 nm to 800 nm corresponding to the visible light range. Therefore, the color conversion panel (100) according to one embodiment may have high light transmittance even in a low wavelength range, and may further improve optical characteristics by maintaining low reflectance over the entire wavelength range corresponding to visible light.

[0165] The first color conversion layer (132) and the second color conversion layer (134) each include a first color conversion member (133) that emits light of a first wavelength and a second color conversion member (135) that emits light of a second wavelength, and each of the first color conversion member (133) and the second color conversion member (135) may include quantum dots that convert the wavelength of incident light into light of a different wavelength. These color conversion members may be formed by applying a composition for forming a color conversion layer including quantum dots onto the substrate or the low-refractive-index layer (120) formed on the substrate. The composition for forming the color conversion layer may include quantum dots, a binder resin, a photopolymerizable monomer, a photopolymerization initiator, a solvent, and other additives.

[0166] In one embodiment, the color conversion layer (130) is formed by coating a composition for forming a color conversion layer including a color conversion member (133, 135) including quantum dots on a substrate (110) or a low-refractive layer (120) formed on the substrate (110) and then performing a patterning process. The patterning process may be carried out through processes such as, for example, a step of applying the composition for forming the color conversion layer onto a substrate (110) or a low-refractive-index layer (120) by a spin or slit coating method, a roll coating method, a screen printing method, an applicator method, etc., and drying it to form a film, an exposure step of forming a pattern having a shape corresponding to the first color conversion layer (132) and the second color conversion layer (134) using a mask, a development step of removing unnecessary parts, and a post-treatment step of curing by reheating or irradiating with active rays, etc., in order to obtain a pattern having excellent heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, storage stability, etc., but is not limited thereto.

[0167] The first and second color conversion layers (132, 134) may further include a light scattering body (not shown) in addition to the color conversion member (133, 135) including quantum dots. The light scattering body may be dispersed within the color conversion layer (130) together with the quantum dots. The light scattering body may induce incident light to be incident on the quantum dots, or may induce a radiation direction so that the radiation light emitted from the quantum dots can be emitted outside the color conversion layer (130). Through this, the decrease in the light efficiency of the color conversion layer (130) can be minimized. The light transmitting member (136) may also include a light scattering body.

[0168] A planarization layer (140) is formed on the low-refractive-index layer (120) and the color conversion layer (130). The planarization layer (140) covers and protects the low-refractive-index layer (120) and the color conversion layer (130), and makes the surface of the color conversion panel (100) planar. The planarization layer (140) may be made of a material that is transparent and electrically insulating so that light can be transmitted therethrough. At this time, the planarization layer (140) according to the present embodiment may be made of a polymer matrix that is the same as or different from that of the low-refractive-index layer (120). For example, the planarization layer (140) may be made of a low-refractive-index material including a carbosilane-siloxane copolymer like the low-refractive-index layer (120), thereby further improving the luminous efficiency of the color conversion panel (100). In addition, by minimizing cases where light incident on the low refractive index layer (120) is reflected or scattered when incident on the flattening layer (140), it is possible to provide a color conversion panel (100) with improved light efficiency by minimizing optical loss at the interface.

[0169] Meanwhile, the color conversion layer (130) may further include a transparent member (136) arranged to correspond to the third region (C). The transparent member (136) may emit light received from a light source as is without a separate color conversion. To this end, for example, the transparent member (136) may be formed to have the same height as the color conversion layer (130), or, as shown in FIGS. 2 and 3, may exist as an empty space that is not filled with anything to a certain extent up to the height where the color conversion layers (132, 134) and the planarization layer (140) formed thereon exist. However, the present invention is not limited thereto, and the transparent member (136) may further include quantum dots to emit light converted to a specific wavelength, like the first color conversion layer (132) and the second color conversion layer (134), and may further include the light scattering material described above.

[0170] Fig. 4 is a cross-sectional view according to a variation of Figs. 2 and 3. Fig. 4 is a cross-sectional view showing an example in which the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130). Except for the fact that the low-refractive-index layer (120) is formed on both the upper and lower portions of the color conversion layer (130), the remaining components are all the same as those described in Figs. 2 and 3, and therefore, a detailed description thereof will be omitted. When the low-refractive-index layer (120) is present on both the upper and lower portions of the color conversion layer (130) as shown in Fig. 4, the luminous efficiency of the color conversion panel (100) can be further improved.

[0171] Fig. 5 is a cross-sectional view according to a variation of Fig. 2. Referring to Fig. 5, a color conversion panel (100) according to a variation may further include a first capping layer (150) and a second capping layer (160). Fig. 5 illustrates a variation that includes both the first capping layer (150) and the second capping layer (160), but either one of them may be omitted.

[0172] The first capping layer (150) is formed on the planarization layer (140) and covers the planarization layer (140). Therefore, it can be formed after the step of forming the planarization layer (140). The first capping layer (150) can be formed over the entire surface of the substrate (110).

[0173] The second capping layer (160) is formed between the low-refractive-index layer (120) and the color conversion layer (130), and like the first capping layer (150), can be formed over the entire surface of the substrate (110). Therefore, the second capping layer (160) can be formed between the low-refractive-index layer (120) forming step and the color conversion layer (130) forming step.

[0174] The first capping layer (150) and the second capping layer (160) may also be made of a material having a low refractive index, similar to the low refractive index layer (120), and for example, SiN. xIt may include a material such as . The first capping layer (150) forming an interface with the planarization layer (140), and the second capping layer (160) positioned between the low-refractive-index layer (120) and the planarization layer (140) or between the low-refractive-index layer (120) and the color conversion layer (130) to form an interface therewith are also made of a material having a low refractive index, thereby minimizing cases where light incident on the first capping layer (150) and the second capping layer (160) is reflected or scattered. By minimizing the optical loss at this interface, a color conversion panel (100) with improved light efficiency can be provided.

[0175] In the case of a color conversion panel (100) including a first capping layer (150) and a second capping layer (160), a luminous efficiency increase effect of 150% or more can be exhibited compared to a color conversion panel (100) that does not include a low-refractive-index layer (120), a first capping layer (150), and a second capping layer (160) at all.

[0176] Above, a color conversion panel (100) according to one embodiment of the present invention and a method for manufacturing the same have been described. According to this, a color conversion panel (100) including quantum dots or the like can be provided in which luminous efficiency by quantum dots is improved.

[0177] Another embodiment of the present invention provides a display device including a color conversion panel according to the above embodiment.

[0178] The above display device may be a display device using quantum dots, OLEDs, mini LEDs, micro LEDs, nanorod LEDs, etc., or a flexible display device, but is not limited thereto.

[0179]

[0180] Hereinafter, the structure and operation of the present invention will be described in more detail through preferred embodiments of the present invention. However, these are presented as preferred examples of the present invention and should not be construed as limiting the present invention in any way.

[0181]

[0182] Manufacturing Example 1: Manufacturing of silicone resin

[0183] 1.9 g of methyltrimethoxysilane, 10.4 g of 3-methacryloxypropyltrimethoxysilane, and 17.5 g of tetraethoxysilane (tetraethyl orthosilicate) are stirred with 52 g of propylene glycol monomethyl ether acetate at room temperature. 11 g of distilled water and 7.1 g of 0.1 M HCl aqueous solution are mixed and added for 10 minutes. The mixture is then heated to 60°C and reacted for 16 hours. After cooling to room temperature, the produced methanol and ethanol are removed under reduced pressure to produce a silicone resin (containing 10 mol% of siloxane units derived from methyltrimethoxysilane, 30 mol% of siloxane units derived from 3-methacryloxypropyltrimethoxysilane, and 60 mol% of siloxane units derived from tetraethoxysilane).

[0184]

[0185] Manufacturing Example 2: Manufacturing of surface-modified hollow silica

[0186] To 10 g of a 20 wt% (ethanol) dispersion of unmodified hollow silica, add 2.0 g of 3-(methacryloxy)propyltrimethoxysilane (MAPTMAS) and 0.01 g of n-propylamine and react at 60°C for 1 hour. Slowly add 1 M HCl aqueous solution to neutralize. Then, replace the solvent with ethyl acetate and evaporate to remove the produced alcohol. Then, add water and separate the layers to remove the produced salt. After that, add PGMEA and evaporate again to remove the ethyl acetate to prepare a solution in which hollow silica (average particle size D50: 90 nm) surface-modified with 3-(methacryloyloxy)propyltrimethoxysilane is dispersed in PGMEA.

[0187] .

[0188] Preparation of curable resin composition

[0189] (1) Silicone resin: (A) Silicone resin of Manufacturing Example 1

[0190] (2) Particles: (B1) Surface-modified hollow silica of Manufacturing Example 2, (B2) Nano silica surface-modified with methacrylate (Y4130, manufactured by Nissan, average particle diameter D50: 45 nm)

[0191] (3) Organic polymers with a boiling point of 200℃ or lower: (C) Polypropylene glycol (number average molecular weight 4000g / mol)

[0192] (4) Reaction-inducing additives: (D1) diacetoxydimethylsilane, (D2) triacetoxymethylsilane, (D3) acetic acid, (D4) trimethoxy[3-(methylamino)propyl]silane

[0193] (5) Leveling agent: (E) Surfactant (F-552, fluorine-based, DIC)

[0194] (6) Solvent: Propylene glycol monomethyl ether acetate

[0195]

[0196] Example 1

[0197] Based on the solid content, 23.3 parts by weight of a silicone resin, 48.8 parts by weight of the surface-modified hollow silica of Preparation Example 2, 24.4 parts by weight of polypropylene glycol, 2.5 parts by weight of diacetoxydimethylsilane, and 1.0 parts by weight of a leveling agent were mixed, and a solvent was mixed, stirred for 30 minutes, and then filtered through a 0.45 μm polypropylene (PP) Millipore filter to prepare a curable resin composition according to Example 1. The solvent was included in an amount of 900 parts by weight for a total of 100 parts by weight of the silicone resin, the surface-modified hollow silica of Preparation Example 2, polypropylene glycol, diacetoxydimethylsilane, and the leveling agent.

[0198]

[0199] Examples 2 to 3 and Comparative Examples 1 to 6

[0200] A curable resin composition was prepared in the same manner as in Example 1, except that the type and / or content of each component was changed as shown in Table 1 below. In Table 1 below, '-' means that the content of the corresponding component is 0.

[0201]

[0202] The properties shown in Table 2 below were evaluated using the manufactured curable resin composition. The manufacturing of the cured film was performed as follows.

[0203] Manufacturing of cured film:

[0204] The compositions prepared in the examples and comparative examples were spin-coated on a substrate for evaluating quantum dot efficiency using a spin coater (Mikasa, Opticoat MS-A150) at 200 rpm for 10 seconds, and then pre-baked on a hot plate at 100°C for 120 seconds to form a film. Thereafter, the film was cured and dried at a temperature of 230°C for 20 minutes to obtain a cured film having a thickness of 2.0 μm, and the thickness of the cured film was measured using Alpha-step (Surface profiler KLA, Tencor).

[0205] (1) Initial

[0206] (i) Refractive index: The refractive index at a wavelength of 550 nm of the cured film obtained with the above composition was measured using a spectroscopic ellipsometer (M-2000D, JAWoollam Co.). If the refractive index was 1.3 or less, it was evaluated as ○, and if it was more than 1.3, it was evaluated as X.

[0207] (ii) Adhesion: Each of the above compositions is spin-coated on a silicon wafer having a diameter of 6 inches using a spin coater (Mikasa, Opticoat MS-A100) at 200 rpm for 10 minutes, and then pre-baked at 100°C for 2 minutes using a hot plate to form a film. Thereafter, the film is cured and dried at a temperature of 230°C for 20 minutes to obtain a cured film having a thickness of 2.0 μm. On the cured film, a SiOx upper film is formed using a chemical vapor deposition (PE-CVD) machine. Thereafter, this upper film is cross-cut to a depth of about 100 μm and a final cutting area of ​​about 15 mm X 15 mm in accordance with the ASTM D3359 international standard test method, and then a taping test is performed using a tape of 4.5 N / m. According to the definition of evaluation value disclosed in the ASTM D3359 international standard test method, the ratio of the area torn off by the tape in the cut area is expressed as an adhesion evaluation index as follows: ○ if it is 3B or higher, X if it is 0B to 2B.

[0208] (Adhesion evaluation index)

[0209] 0B: 100% peeling (entire surface peeled)

[0210] 1B: 80% peeling

[0211] 2B: 60% peeling

[0212] 3B: 40% peeling

[0213] 4B: 20% peeling

[0214] 5B: 0% peeling (no peeling)

[0215] (iii) Light efficiency (green efficiency): The cured film obtained with the above composition was placed under a substrate for evaluating quantum dot efficiency, and the quantum dot efficiency was measured on the substrate for evaluating quantum dot efficiency using an Absolute PL Quantum yield spectrometer Quantaurus-QY (modoo technology).

[0216] (iv) Hardness: Measured at room temperature with a 2.0 ㎛ (±0.05) thick coated cured film. The indentation hardness was measured using a HM2000LT Micro Indentor (Fisher). The cured film was loaded for 15 seconds at a constant force of 30 mN using a straight diamond pyramid-shaped micro indenter (Vickers particle) with a square base, and the indentation hardness was measured by creeping for 5 seconds and relaxing for 20 seconds. The average value was obtained by measuring 5 times. HU (Martens / Universal hardness) 35 N / mm 2 If it is above, it is evaluated as ○, and if it is below, it is evaluated as X.

[0217] (2) After 7 days

[0218] (i) Degree of viscosity increase: 10 g of the curable resin compositions of the examples and comparative examples were left at room temperature of 25°C for 7 days. The viscosity V1 before leaving and the viscosity V2 after leaving were obtained, and if the viscosity change rate ((V2-V1) / V1 x 100) exceeded 5%, it was evaluated as X, and if it was 5% or less, it was evaluated as ○.

[0219] (ii) Light efficiency and adhesiveness: Evaluated in the same manner as above.

[0220] (3) Storage stability

[0221] When 10 g of the curable resin composition of the examples and comparative examples was left at room temperature of 25°C for 7 days, if the luminous efficiency and adhesive strength did not change compared to before leaving, they were evaluated as ○, and if they changed, they were evaluated as X.

[0222]

[0223] Silicone resin particle organic polymer additive leveling agent total (A) (B1) (B2) (C) (D1) (D2) (D3) (D4) (E) 100 Comparative example 12450-25----1.0100 Comparative example 220-4039----1.0100 Comparative example 323.34 8.8- 24.4- - 2.5- 1.0100 Comparative example 419.3- 38.6 38.6- -2.5- 1.0100 Comparative example 523.34 8.8- 24.4- - - 2.5 1.0100 Comparative example 619.3- 38.6 38.6- - - 2.5 1.0100 Example 123.34 8.8- 24.4 2.5- - - 1.0100 Example 219.3- 38.638.62.5- - - 1.0100 Example 323.348.8- 24.4- 2.5- - 1.0100

[0224] After the initial 7 days, storage stability, refractive index, adhesive strength, optical efficiency, hardness, optical efficiency, adhesive strength, viscosity, increase degree, Comparative example 1○ⅹ○ⅹ○ⅹ○○Comparative example 2ⅹⅹⅹⅹⅹⅹ○○Comparative example 3○○○○ⅹⅹⅹⅹComparative example 4○○○○ⅹⅹⅹⅹComparative example 5○○○○ⅹⅹⅹComparative example 6○○○○ⅹⅹⅹExample 1○○○○○○○Example 2○○○○○○○Example 3○○○○○○○○○

[0225] As shown in Table 2 above, it can be seen that the additives used in the examples can promote curing and thereby improve properties such as light efficiency, adhesion, light efficiency, and hardness. In addition, it can be seen that the additives used in the examples have superior storage stability as the physical properties are maintained after 7 days compared to other additives.

[0226]

[0227] Simple modifications or changes of the present invention can be easily implemented by a person having ordinary skill in the art, and all such modifications or changes can be considered to be included in the scope of the present invention.

Claims

1. Contains a silicone resin, a reaction-inducing additive, and particles derived from at least one monomer of chemical formula 1, The above reaction-inducing additive is a curable resin composition comprising a compound having a moiety of chemical formula 4: [Chemical Formula 1] (R 1 ) a (R 2 ) b (R 3 ) c -Si-(OR 4 ) 4-a-b-c (In the above chemical formula 1, R 1 Inland R 3 are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, a substituted or unsubstituted C2 to C30 alkenyl group, a substituted or unsubstituted C2 to C30 alkynyl group, R'(C=O)-* (wherein, R' is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, or a substituted or unsubstituted C6 to C30 aryl group), a (meth)acrylate group, a (meth)acryloyloxy group, or a combination thereof, R 4 is hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, or a combination thereof, a, b, and c are each independently integers 0 or 1, but 0 ≤ a+b+c < 4.) [Chemical Formula 4] (In the above chemical formula 4, * is the connecting part of the element, R 1 is a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, or the following chemical formula 5. [Chemical Formula 5] Si(R 2 )(R 3 )R 4 )-O-(C=O)-R 5 -* (In the above chemical formula 5, * is the connecting part of the element, R 3 , R 3 , R 4 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group, R 5 is a substituted or unsubstituted C1 to C30 alkylene group).

2. In the first paragraph, the reaction-inducing additive is a curable resin composition represented by any one of the following chemical formulae 4-1 to 4-4: [Chemical Formula 4-1] [Chemical Formula 4-2] [Chemical Formula 4-3] [Chemical Formula 4-4] In the above chemical formulas 4-1 to 4-4, R 21 , R 22 , R 23 , R 24 , R 31 , R 32 , R 33 , R 41 , R 42 , R 51 are each independently a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, a substituted or unsubstituted C2 to C30 heterocycloalkyl group. In the above chemical formulas 4-1 to 4-4, R a , R b , R c are each independently hydrogen, a substituted or unsubstituted C1 to C30 alkyl group, a substituted or unsubstituted C3 to C30 cycloalkyl group, a substituted or unsubstituted C6 to C30 aryl group, a substituted or unsubstituted C7 to C30 arylalkyl group, a substituted or unsubstituted C1 to C30 heteroalkyl group, or a substituted or unsubstituted C2 to C30 heterocycloalkyl group.

3. A curable resin composition according to claim 1, wherein the reaction-inducing additive comprises at least one of diacetoxydimethylsilane, triacetoxymethylsilane, propoxytrimethylsilane, acetoxytrimethylsilane, and bis(trimethylsilyl) malonate.

4. A curable resin composition according to claim 1, wherein the reaction-inducing additive is included in an amount of 0.1 to 5 wt% based on solid content in the curable resin composition.

5. A curable resin composition according to claim 1, wherein the silicone resin has a weight average molecular weight of 1000 g / mol to 10,000 g / mol.

6. A curable resin composition according to claim 1, wherein the particles include at least one of hollow particles and solid particles.

7. A curable resin composition according to claim 1, wherein the particles include TiO2, SiO2, BaTiO3, Ba2TiO4, ZnO, ZrO2, aluminosilicate, or a combination thereof.

8. In the first paragraph, the particle is a curable resin composition that is surface-modified or not surface-modified.

9. In the 8th paragraph, the particle is a curable resin composition comprising particles surface-modified with at least one of an alkoxysilane having an alkyl group, an alkoxysilane having a (meth)acryloxy group, and an alkoxysilane having a (meth)acrylate group.

10. A curable resin composition according to claim 1, wherein the composition further comprises an organic polymer having a boiling point of 250°C or lower.

11. A curable resin composition according to claim 1, wherein the composition further comprises at least one of a solvent and an additive.

12. A cured film comprising a cured product of the curable resin composition of any one of claims 1 to 11.

13. A display device including the cured film of Article 12.

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