Multi-evaporation-source interval evaporation deposition device and coating method

Abstract

The present invention relates to the technical field of vacuum evaporation deposition devices. Disclosed are a multi-evaporation-source interval evaporation deposition device and a coating method. The device comprises: a plurality of linear evaporation sources, which are arranged in parallel, the linear evaporation sources being able to spray steam for evaporation deposition of a substrate; a mask plate, which is located below the substrate and provided with a plurality of shielding parts and a plurality of opening parts that are arranged alternately; and driving mechanisms, which are used for driving the evaporation sources, a combination of the mask plate and the substrate, or shutters to reciprocate. The linear evaporation sources are opposite to the opening parts during evaporation deposition, and are opposite to the shielding parts or the shutters when evaporation deposition is stopped. Providing the plurality of linear evaporation sources can implement simultaneous and synchronous evaporation deposition of a plurality of positions of the substrate, and providing the mask plate having the opening parts and the shielding parts allows the relative movement distance between the linear evaporation sources and the mask plate or the movement distance of the shutters with respect to the linear evaporation sources to be greatly shortened during repeated evaporation deposition, thus greatly shortening evaporation deposition time, and improving evaporation deposition efficiency.

Description

A multi-evaporation-source interval vapor deposition apparatus and coating method Technical Field

[0001] This invention relates to the field of vacuum evaporation equipment technology, and in particular to a multi-evaporation-source spaced evaporation equipment and coating method. Background Technology

[0002] OLED displays offer numerous advantages over LCD displays, such as superior color reproduction, shorter response times, better low-temperature performance, and the ability to achieve thinner, lighter, and more flexible designs. Consequently, OLED displays are widely used in mobile phones, watches, and other devices. However, the organic film deposition in OLED displays typically employs linear evaporation sources. During deposition, the linear evaporation source scans the substrate along a linearly perpendicular direction to complete the overall deposition. However, when a thicker film needs to be deposited, reciprocating scanning is required to achieve the desired thickness, resulting in longer deposition times, impacting production cycle time and reducing efficiency. Furthermore, to accommodate the reciprocating motion mechanism of the linear evaporation source and the supply device, this deposition equipment requires a large internal space within the deposition chamber, leading to low space utilization.

[0003] It is evident that existing technologies still need improvement and enhancement.

[0004] Summary of the Invention

[0005] In view of the shortcomings of the prior art, the purpose of the present invention is to provide a multi-evaporation source spaced vapor deposition apparatus and deposition method, which aims to improve the efficiency of vacuum vapor deposition.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A multi-evaporation-source intermittent vapor deposition apparatus, comprising:

[0008] Linear evaporation source: Multiple linear evaporation sources are arranged in parallel. These linear evaporation sources can spray vapor for vapor deposition on the substrate.

[0009] Mask plate: It is located below the substrate and has multiple shielding parts and multiple openings arranged at intervals;

[0010] Drive mechanism: It is used to drive the combination of the linear evaporation source, the mask and the substrate, or the shutter to reciprocate between two adjacent shielding parts;

[0011] The linear evaporation source is opposite to the opening during evaporation and opposite to the shielding or shutter when evaporation stops.

[0012] In the multi-evaporation-source interval vapor deposition apparatus, the driving mechanism is connected to multiple linear evaporation sources via a connecting member, and is used to drive the multiple linear evaporation sources to reciprocate between two adjacent shielding portions, so that the linear evaporation sources are opposite to the opening or opposite to the shielding portion.

[0013] In the multi-evaporation-source interval vapor deposition device, there are multiple driving mechanisms, the number of which is equal to the number of linear evaporation sources, and each is connected to the linear evaporation source in a corresponding manner. A track is provided below the linear evaporation source, and the multiple driving mechanisms are slidably connected to the track to make the linear evaporation source reciprocate between adjacent shielding parts along the track.

[0014] In the multi-evaporation source spaced vapor deposition apparatus, the driving mechanism is connected to the mask plate and the substrate in a combined transmission connection, which is used to make the linear evaporation source face the opening or face the shielding part.

[0015] The multi-evaporation source spaced vapor deposition apparatus also includes a shutter, which is disposed between the linear evaporation source and the mask plate, and has a through hole and a shielding part; the shutter is connected to the drive mechanism for shielding the opening or opening the opening.

[0016] The multi-evaporation source spaced vapor deposition apparatus further includes multiple shutters arranged in parallel, which are positioned between the mask plate and the linear evaporation source; multiple driving mechanisms are provided, and each driving mechanism is connected to one of the multiple shutters in a transmission manner; the multiple shutters are used to shield the opening or open the opening.

[0017] In the multi-evaporation source interval evaporation deposition apparatus, the mask plate includes an odd mask plate and an even mask plate. The opening of the odd mask plate is opposite to the shielding portion of the even mask plate, and the opening of the even mask plate is opposite to the shielding portion of the odd mask plate.

[0018] In the multi-evaporation source spaced vapor deposition apparatus, the linear evaporation source is provided with two parallel limiting plates extending along its length direction. The distance between the two limiting plates is less than or equal to the width of the shielding portion, and the length of the two limiting plates is greater than or equal to the length of the substrate.

[0019] In the multi-evaporation source spaced vapor deposition apparatus, the linear evaporation source is provided with two or more rows of nozzles, and the two or more rows of nozzles are arranged symmetrically.

[0020] The multi-evaporation source interval vapor deposition device further includes multiple crucibles, which are connected to multiple linear evaporation sources through pipe-type connectors, and the connectors are equipped with switching valves.

[0021] A coating method is provided, wherein the method employs a multi-evaporation-source spaced vapor deposition apparatus as described above; the method includes: activating a linear evaporation source and a driving mechanism to reciprocate the linear evaporation source relative to a mask, or to reciprocate the combination of the mask and a substrate relative to the linear evaporation source, or to reciprocate the shutter relative to the mask, so that an opening is opened relative to the linear evaporation source, or the opening is blocked; the distance of the reciprocating motion is the distance between two adjacent shielding portions.

[0022] Beneficial Effects: This invention provides a multi-evaporation-source spaced vapor deposition apparatus and method. The multi-evaporation-source spaced vapor deposition apparatus, by setting multiple linear evaporation sources, can simultaneously perform vapor deposition on multiple locations on a substrate, thereby significantly reducing vapor deposition time and improving vapor deposition efficiency. By setting a specially shaped mask plate with spaced-apart shielding portions and openings, when repeated vapor deposition is required on the substrate, the linear evaporation source does not need to move from one end to the other; it only needs to reciprocate between adjacent shielding portions. This greatly reduces vapor deposition time and improves efficiency. Furthermore, since the combination of the linear evaporation source or mask plate and the substrate only reciprocates between two adjacent shielding portions, the movement distance is smaller compared to the existing method where a single linear evaporation source needs to reciprocate along both ends of the substrate, thus requiring a smaller vapor deposition cavity size. Attached Figure Description

[0023] Figure 1 is a schematic diagram of a multi-evaporation source spaced vapor deposition device with relatively moving linear evaporation sources (the upper figure shows the state when the linear evaporation source is opposite to the shielding part, and the lower figure shows the state when the linear evaporation source is opposite to the opening part).

[0024] Figure 2 is a schematic diagram of a multi-evaporation source spaced vapor deposition apparatus with a combination of mask and substrate moving relative to each other (the upper figure shows the state when the linear evaporation source is opposite to the shielding part, and the lower figure shows the state when the linear evaporation source is opposite to the opening part).

[0025] Figure 3 is a schematic diagram of a multi-evaporation source spaced vapor deposition device in which multiple linear evaporation sources move independently relative to each other (the upper figure shows the state when the linear evaporation source is opposite to the shielding part, and the lower figure shows the state when the linear evaporation source is opposite to the opening part).

[0026] Figure 4 is a schematic diagram of the structure of a multi-evaporation source spaced vapor deposition device with relatively moving shutters (the upper figure shows the state when the shutter's blocking part and shielding part are opposite each other, and the lower figure shows the state when the shutter's blocking part and opening part are opposite each other).

[0027] Figure 5 is a schematic diagram of a multi-evaporation source spaced vapor deposition device with multiple shutters and each shutter moving independently (where Figures a and c show the state when the shutters are moved to be opposite to the two shielding parts on the left or right, and Figure b shows the state when the shutters are moved to be opposite to the opening).

[0028] Figure 6 shows a top view of the odd mask (top) and even mask (bottom) relative to the linear evaporation source and substrate.

[0029] Figure 7 is a schematic diagram of one type of linear evaporation source.

[0030] Figure 8 is a schematic diagram of a linear evaporation source with two rows of relatively inclined nozzles.

[0031] Figure 9 is a schematic diagram of a linear evaporation source with multiple rows of nozzles.

[0032] Figure 10 is a schematic diagram of a linear evaporation source with multiple crucibles.

[0033] In the attached diagram, the following labels are used: 1-linear evaporation source, 2-substrate, 3-mask, 4-opening, 5-shielding part, 6-shutter, 7-connector, 8-through hole, 9-shielding part, 10-odd mask, 11-even mask, 12-crucible, 13-heater, 14-cooling mechanism, 15-nozzle, 16-limiting plate, 17-drive mechanism, 18-track, 19-switching valve. Detailed Implementation

[0034] This invention provides a multi-evaporation-source interval evaporation deposition apparatus and deposition method. To make the objectives, technical solutions, and effects of this invention clearer and more explicit, the following embodiments are provided to further illustrate the invention in detail. It should be understood that the specific embodiments described herein are only for explaining the invention and are not intended to limit the invention.

[0035] Please refer to Figures 1-5. A preferred embodiment of the present invention provides a multi-evaporation-source interval vapor deposition apparatus. This apparatus is disposed in the vapor deposition chamber of the vapor deposition equipment and includes:

[0036] Linear evaporation source 1: Multiple linear evaporation sources are arranged in parallel. The linear evaporation source 1 can spray vapor for vapor deposition on the substrate 2.

[0037] Mask plate 3: It is disposed between substrate 2 and evaporation source. The mask plate 3 has a plurality of shielding parts 5 and openings 4 arranged at intervals. The shielding parts 5 can isolate vapor and are used to define the evaporation area of ​​substrate 2. The openings 4 can allow vapor to pass through and form the evaporation area on substrate 2.

[0038] During operation, when the linear evaporation source 1 is opposite to the opening 4, the vapor it emits can pass through the opening 4 to reach the surface of the substrate 2 and perform vapor deposition on the substrate 2; when the linear evaporation source 1 is opposite to the shielding part 5, the vapor it emits is blocked by the shielding part 5, and the vapor deposition on the substrate 2 can be stopped.

[0039] Drive mechanism 17: It can be a motor or other device that can reciprocate or swing at a specific distance. It is connected to the object to be driven through the connecting member 7. For example, it can be connected to the linear evaporation source 1 through the connecting member 7, or connected to the combination of the mask plate 3 and the substrate 2 through the connecting member 7, or connected to the shutter 6. Through the action of the drive mechanism 17, the linear evaporation source, or the combination of the mask plate 3 and the substrate 2, or the shutter 6 can reciprocate between the two shielding parts, thereby shielding or opening the linear evaporation source 1, so as to repeatedly vapor deposit the substrate 2 to obtain a vapor deposit film of the target thickness.

[0040] In this embodiment, by setting multiple parallel linear evaporation sources 1, simultaneous evaporation deposition can be performed on multiple locations of the substrate 2, thereby greatly improving the evaporation efficiency. Especially when depositing a thicker evaporation film, the simultaneous evaporation of multiple linear evaporation sources 1 can significantly save evaporation time. Simultaneously, by setting a specially shaped mask 3 with spaced-apart shielding portions 5 and openings 4, when repeated evaporation deposition is required on the substrate 2, the relative movement distance between the linear evaporation source and the substrate 2 is shortened. Instead of the distance from the beginning to the end of the substrate 2 in the prior art, it becomes the distance between two adjacent shielding portions 5, thus greatly reducing evaporation time and improving evaporation efficiency. Furthermore, since the relative movement distance between the combined linear evaporation source or mask 3 and the substrate 2 becomes the distance between two adjacent shielding portions 5, compared to the existing requirement for a single linear evaporation source 1 to reciprocate along the beginning and end of the substrate 2, the size requirement for the evaporation cavity is smaller, allowing for a smaller evaporation apparatus.

[0041] For example, suppose the area of ​​substrate 2 to be vapor-deposited is 2n units long and n units wide, where n is a natural number greater than 1; the size of mask 3 is the same as or larger than that of substrate 2; and the mask 3 has n equidistant openings 4 and n equidistant shielding portions 5 corresponding to the vapor-deposited area of ​​substrate 2, with the lengths of the openings 4 and shielding portions 5 equal to the width of the vapor-deposited area of ​​substrate 2, and the widths of the openings 4 and shielding portions 5 being the same; below the mask 3 are n equidistant linear evaporation sources 1, the lengths of the n linear evaporation sources 1 being equal to or greater than the lengths of the openings 4, and they are connected to the drive mechanism 17 via connectors 7. The initial positions of the n linear evaporation sources 1 are all opposite to the shielding portions 5. During operation, the drive mechanism 17 drives the linear evaporation sources 1 to reciprocate between two adjacent shielding portions 5. Therefore, the distance that the linear evaporation sources 1 need to move to complete one vapor deposition is less than or equal to 2 units. In the existing technology, since there is only one linear evaporation source 1, the distance that the linear evaporation source 1 needs to move to complete one evaporation is 2n units, which is n times that of this application. When repeated evaporation is required, the time spent also increases exponentially. Therefore, it can be seen that the technical solution described in this invention can greatly reduce the evaporation time and improve the evaporation efficiency.

[0042] As a preferred embodiment, as shown in FIG1, the drive mechanism 17 is connected to a plurality of linear evaporation sources 1 via a connecting member 7. The connecting member 7 is a plate or rod that is horizontally perpendicular to the length direction of the linear evaporation source 1, and its extension direction is the moving direction of the linear evaporation source 1. One end of the connecting member 7 is connected to the output end of the drive mechanism 17. The linear evaporation sources 1 are fixed at equal intervals on the connecting member 7. Under the action of the drive mechanism 17, each linear evaporation source 1 can reciprocate between two adjacent shielding parts 5.

[0043] In another embodiment, as shown in FIG2, in order to achieve relative movement between the linear evaporation source and the substrate 2, the output end of the driving mechanism 17 is connected to the combined transmission connection of the mask 3 and the substrate 2. By driving the combined reciprocating motion of the mask 3 and the substrate 2, a phenomenon is formed in which the linear evaporation source 1 moves relative to each other between adjacent openings 4 and two shielding parts 5, thereby achieving repeated evaporation deposition on the substrate 2. In this embodiment, the path of the combined reciprocating motion of the mask 3 and the substrate 2 is such that the linear evaporation source repeatedly scans the openings 4 located between two adjacent shielding parts 5.

[0044] However, when the deposition rates of each linear evaporation source 1 differ, using a single drive mechanism 17 to simultaneously drive multiple linear evaporation sources 1 or to drive the mask plate 3 and substrate 2 in relative motion will result in inconsistent overall deposition film thickness on the substrate 2 due to the different deposition rates of the linear evaporation sources 1 despite the same moving speed. To address this, in a preferred embodiment, as shown in Figure 3, multiple drive mechanisms 17 are provided, each corresponding to one of the linear evaporation sources 1. A horizontal track 18 perpendicular to the length of each linear evaporation source 1 is provided below each drive mechanism 17, and the multiple drive mechanisms 17 are slidably connected to the track 18 to allow the linear evaporation sources to reciprocate along the track 18 between adjacent masking sections. Therefore, during deposition, the speed at which each linear evaporation source 1 moves along the track 18 can be set according to its deposition rate, and the scanning time of each linear evaporation source 1 can be adjusted individually to achieve a consistent overall deposition film thickness on the substrate 2. It should be noted that during the actual coating process, the start time of each drive mechanism can be set according to the evaporation rate of the linear evaporation source. Generally speaking, the linear evaporation source with the slowest evaporation time starts first, and the linear evaporation source with the fastest evaporation rate starts later, so as to ensure that the movement of the linear evaporation source is not disturbed and that the thickness of the final film layer is uniform.

[0045] Since the vapor deposition apparatus involves multiple structural components, whether it is the linear evaporation source 1 or the combination of the mask and substrate 2, the requirements for the equipment are high when the linear evaporation source 1 or the combination of the mask and substrate 2 is driven to reciprocate by the drive mechanism 17. To address this, in a preferred embodiment, as shown in Figure 4, the vapor deposition is controlled by a shutter 6. Specifically, the apparatus includes a shutter 6, which is a flat plate large enough to fully cover the substrate 2, positioned between the linear evaporation source 1 and the mask 3. The shutter 6 has through holes 8 that allow vapor to pass through and blocking parts 9 that block vapor from passing through. The number of through holes 8 is the same as the number of openings 4 in the mask 3, and they are arranged in a one-to-one correspondence, with the same size as the openings 4. The shutter 6 is connected to the drive mechanism 17. In this embodiment, multiple linear evaporation sources 1 are respectively directly opposite multiple openings 4 in the mask, and the distance between the limiting plates 16 of the linear evaporation sources 1 and the openings 4 is equal to or greater than the width of the openings 4. During operation, the drive mechanism 17 drives the shutter 6 to reciprocate horizontally, and the distance of its reciprocating motion is the width of the opening 4. When the through hole 8 of the shutter 6 is opposite to the opening 4, the linear evaporation source 1 can perform vapor deposition on the substrate 2. When the through hole 8 of the shutter 6 is opposite to the shielding part 5, the vapor from the linear evaporation source 1 is blocked, stopping the vapor deposition on the substrate 2, thus controlling the opening and closing of the vapor deposition process. It should be noted that in this embodiment, the distance between the two limiting plates of the linear evaporation source is greater than or equal to the width of the opening.

[0046] However, when the evaporation rates of the linear evaporation sources 1 differ, controlling all linear evaporation sources 1 simultaneously using a single shutter 6 will also result in uneven evaporation film. Therefore, in another embodiment, as shown in Figure 5, a shutter 6 is configured for each linear evaporation source 1. This shutter 6 is a flat plate with the same size as the opening 4. A drive mechanism 17 is provided for each shutter 6. That is, multiple independent shutters 6 are arranged side by side between the mask plate and the linear evaporation sources 1, with each shutter 6 facing one linear evaporation source 1. A drive mechanism 17 is connected to the end of each shutter 6, and each drive mechanism 17 drives the shutter 6 to move independently. Furthermore, the multiple linear evaporation sources 1 are vertically opposite to the opening 4 one by one, and the distance between the two limiting plates 16 of the linear evaporation sources 1 is greater than or equal to the width of the opening 4, which can completely cover the opening 4. During operation, each drive mechanism 17 can drive the corresponding shutter 6 to move independently. When the projections of the linear evaporation source 1, shutter 6, and opening 4 overlap, the shutter 6 blocks the linear evaporation source 1, preventing it from performing vapor deposition. When the projections of the shutter 6 and the shielding part 5 of the mask plate 3 overlap, the linear evaporation source 1 and the opening 4 are opposite each other and unobstructed. At this time, the linear evaporation source 1 can perform vapor deposition on the substrate 2.

[0047] In the above embodiments, since the mask 3 is provided with a shielding portion 5, it is impossible to achieve full vapor deposition of the substrate 2 in a single vapor deposition. Therefore, in a preferred embodiment, as shown in FIG6, the mask 3 includes an odd mask 10 and an even mask 11. The odd mask 10 and the even mask 11 are masks with complementary openings 4. That is, the opening 4 of the odd mask 10 is opposite to the shielding portion 5 of the even mask 11, and the opening 4 of the even mask 11 is opposite to the shielding portion 5 of the odd mask 10. Furthermore, the size of the opening 4 of the odd mask 10 is the same as the size of the shielding portion 5 of the even mask 11, and the size of the shielding portion 5 of the odd mask 10 is the same as the size of the opening 4 of the even mask 11. Therefore, for the same substrate 2, full vapor deposition of the substrate 2 can be achieved by complementary deposition of the odd mask 10 and the even mask 11. In the specific implementation process, the substrate 2 is first vapor-deposited using the odd mask 10, and then the even mask 11 is used for vapor deposition, so that the substrate 2 can be fully vapor-deposited.

[0048] As one embodiment, as shown in FIG7, the linear evaporation source 1 includes: a crucible 12, a plurality of heaters 13 disposed outside the crucible 12, a cooling mechanism 14 disposed outside the heaters 13, and two limiting plates 16 disposed at the nozzle 15 of the crucible 12 to limit the direction of vapor movement. The width of the two limiting plates 16 is equal to or greater than the width of the opening 4, but less than or equal to the width of the shielding plate. Through the action of the limiting plates 16, the vapor can be moved in a vertically upward direction.

[0049] Because the existing linear evaporation source 1 uses a single row of nozzles in its crucible 12, the vapor-deposited film at the center line of the nozzles tends to be thicker, while the film on both sides of the center line is thinner, resulting in uneven film thickness, especially when the distance between the two limiting plates 16 is relatively wide. To address this, in a preferred embodiment, as shown in Figures 8 and 9, the linear evaporation source 1 has two or more rows of nozzles, and these rows are equidistant. For example, as shown in Figure 8, the linear evaporation source has two symmetrically arranged nozzles, which are tilted relative to each other. Because the tilted nozzles are positioned further away from the center line, the vapor concentration on both sides of the center line increases. Simultaneously, since the vapor emitted from the two nozzles at the center line can overlap, the vapor distribution between the two limiting plates 16 becomes more uniform. Therefore, even when the distance between the two limiting plates 16 is wide, the vapor in the area defined by the two limiting plates 16 remains relatively uniform, resulting in a more uniform vapor-deposited film. In practice, the direction of the nozzle tilt can be adjusted according to actual needs to make the sprayed steam more uniform.

[0050] For example, as shown in Figure 9, the linear evaporation source is provided with multiple rows of nozzles, which are equally spaced, so that the steam between the two limiting plates can be more uniform.

[0051] In some vapor deposition scenarios, vapor deposition requires the use of mixed vapors of multiple materials. To accommodate this mixed vapor deposition method, in a preferred embodiment, as shown in Figure 10, the device includes multiple crucibles 12. These crucibles 12 are connected to multiple linear evaporation sources 1 via pipe-type connectors 7, and a switching valve 19 is provided on the pipe. The multiple crucibles 12 are used to generate vapors of multiple materials, which are then transported to the linear evaporation sources 1 via the pipe-type connectors 7, thus enabling simultaneous vapor deposition of multiple materials. Furthermore, compared to the linear evaporation source 1 in the previous embodiment, the linear evaporation source 1 in this embodiment does not contain crucibles 12; it is essentially a linear jet structure, with the jetted vapor supplied through external crucibles 12. Additionally, in this embodiment, the pipe-type connectors 7 and the opening and closing of the switching valves 19 allow for uniform mixing of two or more vapors during transport, or for the same vapor to achieve a higher deposition rate. Furthermore, in this embodiment, repeated vapor deposition can be achieved by moving the substrate 2 and the mask 3, or by using the shutter 6 to control the switching of vapor deposition, so that the linear evaporation source 1, the mask 3 and the substrate 2 do not need to be moved, which is more convenient.

[0052] A second aspect of the present invention also provides a coating method, which employs a device with a driving mechanism as described above and a drive mechanism connected to multiple linear evaporation sources, or a device with a driving mechanism as described above and a combination of a mask and a substrate connected to it, or a device with multiple driving mechanisms, each connected to a linear evaporation source. The method includes: activating the linear evaporation source and the driving mechanism, causing the linear evaporation source to reciprocate relative to the mask, or causing the combination of the mask and the substrate to reciprocate relative to the linear evaporation source, or causing the shutter to reciprocate relative to the mask, so that the opening is open relative to the linear evaporation source, or the opening is blocked; the distance of the reciprocating motion is the distance between two adjacent blocked portions. Therefore, compared with existing vapor deposition methods that require the linear evaporation source to move relative to the beginning and end of the mask during vapor deposition, this method can greatly save vapor deposition time, improve vapor deposition efficiency, accelerate production cycle, and increase product yield.

[0053] In summary, the multi-evaporation-source interval vapor deposition apparatus of the present invention, by setting multiple linear evaporation sources 1, can simultaneously perform synchronous vapor deposition on multiple positions of the substrate 2, thereby greatly reducing vapor deposition time, improving vapor deposition efficiency, and ultimately accelerating production cycle and increasing product output. By setting a specially shaped mask plate 3, which has spaced-apart shielding portions 5 and opening portions 4, when repeated vapor deposition of the substrate 2 is required, the linear evaporation source does not need to move from the first end to the last end of the substrate 2; it only needs to reciprocate between adjacent opening portions 4 and shielding portions 5. Therefore, vapor deposition time can be greatly reduced and vapor deposition efficiency improved. Furthermore, since the combination of the linear evaporation source or mask plate 3 and the substrate 2 only reciprocates between two adjacent opening portions 4 and shielding portions 5, the movement distance is much smaller than that of a single linear evaporation source 1, which needs to reciprocate along the first and last ends of the substrate 2.

[0054] In the description of the embodiments of the present invention, it should be noted that the terms "inner," "outer," "upper," "lower," "left," and "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0055] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0056] It is understandable that those skilled in the art can make equivalent substitutions or changes based on the technical solution and inventive concept of the present invention, and all these changes or substitutions should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A multi-evaporation-source interval vapor deposition apparatus, characterized in that, include: Linear evaporation source: Multiple linear evaporation sources are arranged in parallel. These linear evaporation sources can spray vapor to perform vapor deposition on a portion of the entire vapor deposition area of ​​the substrate. Mask plate: It is located below the substrate and has multiple shielding parts and multiple openings arranged at intervals; Drive mechanism: It is used to drive the combination of the linear evaporation source, the mask and the substrate, or the shutter to reciprocate between two adjacent shielding parts; The linear evaporation source is opposite to the opening during evaporation and opposite to the shielding or shutter when evaporation stops.

2. The multi-evaporation-source interval vapor deposition apparatus according to claim 1, characterized in that, The drive mechanism is connected to multiple linear evaporation sources via a connecting member, and is used to drive the multiple linear evaporation sources to reciprocate between two adjacent shielding parts, so that the linear evaporation sources are opposite to the opening or opposite to the shielding part.

3. The multi-evaporation-source interval vapor deposition apparatus according to claim 1, characterized in that, The driving mechanism is provided in multiple ways, the number of which is equal to the number of linear evaporation sources, and each is connected to the linear evaporation source in a corresponding manner. A track is provided below the linear evaporation source, and the multiple driving mechanisms are slidably connected to the track to make the linear evaporation source reciprocate between two adjacent shielding parts along the slide rail.

4. The multi-evaporation-source interval vapor deposition apparatus according to claim 1, characterized in that, The drive mechanism is connected to the mask plate and the substrate in a combined transmission connection, and is used to make the linear evaporation source face the opening or face the shielding part.

5. The multi-evaporation-source interval vapor deposition apparatus according to claim 1, characterized in that, It also includes a shutter, which is disposed between the linear evaporation source and the mask plate, and has a through hole and a blocking part; the shutter is connected to the drive mechanism for shielding the opening or opening the opening.

6. The multi-evaporation-source interval vapor deposition apparatus according to claim 1, characterized in that, It also includes multiple shutters arranged in parallel, which are located between the mask plate and the linear evaporation source; multiple driving mechanisms are provided, and each driving mechanism is connected to one of the multiple shutters in a transmission manner; the multiple shutters are used to cover the opening or open the opening.

7. The multi-evaporation-source interval vapor deposition apparatus according to any one of claims 1-6, characterized in that, The mask includes an odd mask and an even mask, wherein the opening of the odd mask is opposite to the shielding portion of the even mask, and the opening of the even mask is opposite to the shielding portion of the odd mask.

8. The multi-evaporation-source interval vapor deposition apparatus according to claim 7, characterized in that, The linear evaporation source is provided with two parallel limiting plates extending along its length direction. The distance between the two limiting plates is less than or equal to the width of the shielding portion, and the length of the two limiting plates is greater than or equal to the length of the substrate.

9. The multi-evaporation-source interval vapor deposition apparatus according to claim 8, characterized in that, The linear evaporation source is provided with two or more rows of nozzles, and the two or more rows of nozzles are arranged symmetrically.

10. The multi-evaporation-source interval vapor deposition apparatus according to any one of claims 4-6, characterized in that, It also includes multiple crucibles, which are connected to multiple linear evaporation sources via pipe-type connectors, and the connectors are equipped with switching valves.

11. A coating method, characterized in that, The method employs the multi-evaporation source spaced vapor deposition apparatus as described in any one of claims 2-4; the method includes: activating the linear evaporation source and the driving mechanism, causing the linear evaporation source to reciprocate relative to the mask plate, or causing the combination of the mask plate and the substrate to reciprocate relative to the linear evaporation source, or causing the shutter to reciprocate relative to the mask plate, so that the opening is open relative to the linear evaporation source, or the opening is blocked; the distance of the reciprocating motion is the distance between two adjacent shielding portions.

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