Substrate cleaning device and cleaning method, and coating and developing apparatus

Abstract

A substrate cleaning device and cleaning method, and a coating and developing apparatus. The substrate cleaning device (10) comprises a chuck main body (200), a plurality of clamping members (300), a back-face cleaning mechanism (100), and a chuck driving mechanism (400). The plurality of clamping members (300) are arranged in a circular pattern on the surface of the chuck main body (200) for clamping a substrate (20) and driving the substrate (20) to self-rotate. The back-face cleaning mechanism (100) is used for cleaning the side of the substrate (20) close to the chuck main body (200), i.e., a back face (21) of the substrate (20), during the self-rotation of the substrate (20). The chuck driving mechanism (400) is connected to the chuck main body (200) and is used for driving the chuck main body (200) to rotate so as to spin-dry the cleaned substrate (20). The device clamps and drives the substrate to self-rotate by means of the clamping members, enabling the back-face cleaning mechanism to perform overall cleaning on the back face of the substrate. This avoids the problems in the prior art where a central portion and a peripheral portion of the back face of the substrate are cleaned sequentially, which impairs the substrate cleaning efficiency and increases the risk of causing secondary pollution to the central portion of the back face of the substrate, and thus can improve both the cleaning effect and cleaning efficiency of the back face of the substrate.

Description

Substrate cleaning apparatus, cleaning method and coating and developing equipment Technical Field

[0001] This application relates to the field of semiconductor equipment, and further to a substrate cleaning apparatus, cleaning method, and coating and developing equipment. Background Technology

[0002] Currently, the inline setup for photolithography consists of a coating and developing machine and a photolithography machine. The general process of photolithography is as follows: after the substrate is coated in the coating and developing machine, it is sent to the photolithography machine for exposure. After exposure, the substrate is returned to the coating and developing machine for development.

[0003] After the substrate has been coated with adhesive and before it is transferred to the lithography machine for exposure, the back side of the substrate needs to be cleaned. The purpose of this cleaning is to prevent contaminant particles on the back side of the substrate from being transferred into the lithography machine. During the exposure process, these contaminant particles can become trapped between the substrate and the substrate support stage, causing the substrate surface to bend and form local bulges. This can lead to the inability of the focus to align during exposure, resulting in defocusing, which affects the accuracy of the substrate exposure pattern and ultimately reduces the substrate processing yield.

[0004] Chinese patent document application number 200710160027.7 discloses a substrate cleaning apparatus and a substrate cleaning method. The substrate cleaning apparatus includes two substrate holding units for supporting the substrate from the back side. The support areas of the two substrate holding units on the back side of the substrate do not overlap, allowing for alternating support of the substrate during cleaning, so that the cleaning mechanism can clean different support areas on the back side of the substrate sequentially. Specifically, the first substrate holding unit includes an adsorption pad configured to support and adsorb onto the periphery of the back side of the substrate; the second substrate holding unit includes a rotating chuck configured to support and adsorb onto the central portion of the back side of the substrate; the cleaning mechanism includes a cleaning brush. During substrate cleaning, the periphery of the back side of the substrate is first supported by the adsorption pad, allowing the cleaning mechanism to clean the central portion of the back side of the substrate; then, the central portion of the back side of the substrate is supported by the rotating chuck, allowing the cleaning mechanism to clean the periphery of the back side of the substrate, thereby achieving cleaning of the entire back side of the substrate.

[0005] However, the above solution still has drawbacks. After the cleaning mechanism completes the cleaning of the central part of the back side of the substrate, the chuck needs to be rotated to support the central part of the back side of the substrate in order to clean the peripheral part of the back side of the substrate. The cleaning efficiency is low, and during this period, there is a risk that the contaminant particles on the rotating chuck will cause secondary contamination to the back side of the substrate, which will affect the cleaning effect of the device on the back side of the substrate. There is still a risk that the contaminant particles on the back side of the substrate will be transferred into the lithography machine. Summary of the Invention

[0006] In view of the above-mentioned technical problems, the purpose of this application is to improve the cleaning effect and cleaning efficiency of the substrate cleaning device on the back side of the substrate.

[0007] To achieve the above objectives, this application provides a substrate cleaning apparatus, a cleaning method, and a coating and developing device.

[0008] In some embodiments, the substrate cleaning apparatus includes: a chuck body; a plurality of clamping members arranged in a circle on the surface of the chuck body for clamping the substrate and driving the substrate to rotate; a back cleaning mechanism for cleaning the side of the substrate near the chuck body during the substrate's rotation; and a chuck driving mechanism connected to the chuck body for driving the chuck body to rotate to spin-dry the cleaned substrate.

[0009] In some embodiments, this substrate cleaning method is applicable to a substrate cleaning apparatus, the substrate cleaning apparatus comprising: a chuck body; a plurality of clamping members arranged in a circle on the surface of the chuck body for clamping a substrate and driving the substrate to rotate; a back cleaning mechanism for cleaning the side of the substrate near the chuck body; and a chuck driving mechanism for driving the chuck body to rotate; wherein the substrate cleaning method comprises: step S10, carrying and clamping the substrate to be processed by at least some of the clamping members; step S20, driving the substrate to be processed to rotate by at least some of the clamping members, and the back cleaning mechanism cleaning the side of the substrate to be processed near the chuck body; and step S30, driving the chuck body to rotate by the chuck driving mechanism to spin-dry the cleaned substrate.

[0010] In some embodiments, the coating and developing equipment includes a front-end module, a process station, and an interface station connected in sequence. The process station includes: a coating unit for coating a substrate; a developing unit for developing the substrate; a heat treatment unit for heat treating the substrate; and the aforementioned substrate cleaning device for cleaning the coated substrate.

[0011] Compared with the prior art, this application has the following beneficial effects: This application clamps and drives the substrate to rotate, so that the back cleaning mechanism can clean the back of the substrate as a whole. This avoids the prior art of cleaning the central and peripheral parts of the back of the substrate in sequence, which affects the substrate cleaning efficiency and increases the risk of secondary contamination to the central part of the back of the substrate. Furthermore, the chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate, thereby achieving the technical effect and cleaning efficiency of improving the back cleaning effect of the substrate.

[0012] Overview of the attached figures

[0013] The features and performance of this application are further described by the following embodiments and accompanying drawings.

[0014] The preferred embodiments will now be described in a clear and easy-to-understand manner, in conjunction with the accompanying drawings, to further explain the above-mentioned characteristics, technical features, advantages, and implementation methods of the present invention.

[0015] Figure 1 is a schematic diagram of a substrate cleaning apparatus according to an embodiment of this application;

[0016] Figure 2 is a cross-sectional view of Figure 1 along line aa;

[0017] Figure 3 is a schematic diagram of Figure 2 during substrate clamping;

[0018] Figure 4 is a three-dimensional structural diagram of the clamping component.

[0019] Preferred embodiments of this application

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation methods of the present invention will be described below with reference to the accompanying drawings. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings and other implementation methods can be obtained based on these drawings without any creative effort.

[0021] To keep the drawings concise, each figure only schematically shows the parts relevant to the invention, and these do not represent the actual structure of the product. Furthermore, to facilitate understanding, in some figures, only one of components with the same structure or function is schematically depicted, or only one is labeled. In this document, "one" not only means "only one," but can also mean "more than one."

[0022] In this document, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0023] Furthermore, in the description of this application, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] Figures 1 and 2 illustrate a substrate cleaning apparatus 10 according to an embodiment of this application. The substrate cleaning apparatus 10 includes a chuck body 200, a plurality of clamping members 300, a back-side cleaning mechanism 100, and a chuck drive mechanism 400. Referring to Figure 1, the clamping members 300 are arranged in a circular pattern on the surface of the chuck body 200 to clamp the substrate 20 and drive the substrate 20 to rotate. Referring to Figure 3, the back-side cleaning mechanism 100 cleans the side of the substrate 20 closest to the chuck body 200 (the back side 21 of the substrate 20) during the substrate 20's rotation. The chuck drive mechanism 400 is connected to the chuck body 200 and drives the chuck body 200 to rotate and spin-dry the cleaned substrate 20.

[0025] In this embodiment, the clamping member 300 clamps and drives the substrate 20 to rotate, allowing the back-side cleaning mechanism 100 to perform overall cleaning of the back side of the substrate 20. This avoids the need for two separate cleaning processes on the central and peripheral portions of the back side of the substrate, as is done in the prior art, which affects the cleaning efficiency and increases the risk of secondary contamination to the central portion of the back side of the substrate. After cleaning the back side 21 of the substrate 20, this embodiment further drives the chuck body 200 to rotate via the chuck drive mechanism 400 to spin-dry the cleaned substrate 20, thereby improving the back-side cleaning effect and efficiency of the substrate 20.

[0026] Specifically, as shown in Figure 4, the clamping member 300 includes a sliding portion 320 and a limiting portion 330 from bottom to top. The sliding portion 320 has a frustum structure that is larger at the bottom and smaller at the top, and is configured to provide an upward vertical force to the edge of the back surface 21 of the substrate 20 when the clamping member 300 slides inward along the radial direction r of the chuck body 200, thereby causing the substrate 20 to rise. The limiting portion 330 has an annular groove 331 that matches the edge of the substrate 20, providing friction to the edge of the substrate 20 during rotation of the clamping member 300 to drive the substrate 20 to rotate. Furthermore, the sliding portion 320 can support the substrate via the side of the frustum structure. During substrate 20 loading, the substrate 20 is first loaded between the clamping members 300 and supported by the side of the frustum structure; then, at least one clamping member 300 slides inward along the radial direction r, causing the substrate 20 to rise until it is engaged in the annular groove 331.

[0027] Preferably, the clamping member 300 further includes a support portion located at the bottom end of the sliding portion 320. Referring again to FIG4, in one embodiment, the support portion 310 has an annular support surface 311 disposed around the sliding portion 310 for supporting the substrate 20. During substrate 20 loading, the substrate 20 is first loaded between the clamping members 300 and supported by the annular support surface 311; then, at least one clamping member 300 slides inward along the radial direction r, providing an upward vertical force to the edge of the substrate 20 through the side of the frustum structure of the sliding portion 320, so that the substrate 20 rises until it is engaged in the annular slot 331.

[0028] Preferably, referring again to Figures 1 and 2, the clamping member 300 includes a plurality of first clamping members 340 and a plurality of second clamping members 350, and the substrate cleaning device 10 further includes: a plurality of first radial drive members 341, a plurality of second radial drive members 351, a plurality of rotary drive members 352, and a pressure supply line 360. The first radial drive members 341 and the second radial drive members 351 include cylinders (e.g., single-acting spring return cylinders) or hydraulic cylinders; the rotary drive members 352 include pneumatic motors or hydraulic motors.

[0029] Specifically, a plurality of first radial drive members 341 are used to simultaneously drive a plurality of first clamping members 340 to slide along the radial direction r, and each of the first radial drive members 341 has a first starting pressure (the minimum hydraulic or pneumatic pressure used to start the first radial drive member 341; only when the first radial drive member 341 is provided with a hydraulic or pneumatic pressure not lower than the first starting pressure can the first radial drive member 341 drive the first clamping member 340 to slide and cause the substrate 20 to rise until it is locked in the annular slot 331). A plurality of second radial drive members 351 are used to simultaneously drive a plurality of second clamping members 350 to slide along the radial direction r, and each of the second radial drive members 351 has a second starting pressure (similar to the definition of the first starting pressure, and will not be repeated here), and the second starting pressure is not less than the first starting pressure. A plurality of rotary drive members 352 are used to simultaneously drive a plurality of second clamping members 350 to rotate, thereby causing the substrate 20 to rotate. Each rotary drive member 352 has a third starting pressure (the minimum hydraulic or pneumatic pressure required to start the rotary drive member 352; only when a hydraulic or pneumatic pressure not lower than the third starting pressure is supplied to the rotary drive member 352 can the rotary drive member 352 drive the second clamping members 350 to rotate, thereby causing the substrate 20 to rotate). The third starting pressure is greater than the second starting pressure. Pressure supply lines 360 are connected to the first radial drive member 341, the second radial drive member 351, and the rotary drive member 352, respectively, for connecting an external pressure source 361 (e.g., a pneumatic or hydraulic source) to the first radial drive member 341, the second radial drive member 351, and the rotary drive member 352 to simultaneously provide pressure.

[0030] Preferably, the second starting pressure is configured to be greater than the first starting pressure. The substrate cleaning apparatus 10 is configured such that, during substrate 20 loading, the substrate 20 is first loaded between each of the first clamping members 340 and the second clamping member 350, and simultaneously supported by a plurality of annular support surfaces 311. Subsequently, referring to FIG3, the pressure supply line 360 ​​first provides a first pressure to the first radial drive member 341, the second radial drive member 351, and the rotary drive member 352 simultaneously. The first pressure is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first radial drive member 341 drives the first clamping member 340 to slide inward radially r, thereby driving the substrate 20 to rise and clamp the substrate 20. Afterward, the pressure supply line 360 ​​provides a second pressure, which is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member 350 clamps the substrate 20 later than the first clamping member 340.

[0031] Preferably, the substrate cleaning apparatus 10 is configured such that, during substrate 20 cleaning, the pressure supply line 360 ​​simultaneously provides a third pressure to the first radial drive member 341, the second radial drive member 351, and the rotary drive member 352, the third pressure being greater than or equal to a third starting pressure, so that the rotary drive member 352 drives the second clamping member 350 to rotate the substrate 20. At this time, the back surface 21 of the substrate 20 is cleaned by the back surface cleaning mechanism 100.

[0032] Preferably, the substrate cleaning apparatus 10 is configured such that after the substrate 20 has been cleaned, the pressure provided by the pressure supply line 360 ​​to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 simultaneously decreases from the third pressure to below the third starting pressure and is greater than or equal to the first starting pressure, so that the second clamping member 350 stops driving the substrate 20 to rotate, and then the chuck drive mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0033] Preferably, the substrate cleaning apparatus 10 is configured such that after the substrate 20 has been cleaned, the pressure provided by the pressure supply line 360 ​​to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 simultaneously decreases from the third pressure to below the third starting pressure and greater than or equal to the second starting pressure, so that the second clamping member 350 stops driving the substrate 20 to rotate, and then the chuck drive mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate 20.

[0034] In this embodiment, during substrate 20 loading, the first clamping member 340 first lifts and clamps the substrate 20, pre-positioning it. Then, the second clamping member 350 clamps the substrate 20, increasing the clamping force on the substrate 20 and thus increasing the stability of its rotation during cleaning and its revolution during spin-drying. A faster clamping speed can cause wear on the substrate edges. Therefore, by first lifting and clamping the substrate 20 under a first pressure using the first clamping member 340, and then clamping it under a second pressure using the second clamping member 350, wear on the substrate 20 edges during lifting can be reduced. Furthermore, this embodiment controls the working states of the first radial drive member 341, the second radial drive member 351, and the rotary drive member 352 simultaneously through a single pressure supply line 360, thereby achieving independent control of the first clamping member 340, the second clamping member 350, and the rotary drive member 352. This avoids the need to use multiple pressure supply lines 360 to control the first clamping member 340, the second clamping member 350, and the rotary drive member 352 separately, thus reducing the processing difficulty of setting the pressure supply line 360 ​​in the substrate 20 cleaning apparatus 10.

[0035] In other embodiments of this application, the second starting pressure is configured to be equal to the first starting pressure, and the substrate cleaning apparatus 10 is configured such that during substrate 20 loading, the substrate 20 is first loaded between the first clamping members 340 and the second clamping members 350. Subsequently, the pressure supply line 360 ​​first provides a first pressure to the first radial drive member 341, the second radial drive member 351 and the rotary drive member 352 simultaneously. The first pressure is greater than or equal to the first starting pressure and less than the third starting pressure, so that the first radial drive member 341 and the second radial drive member 351 respectively drive the first clamping member 340 and the second clamping member 350 to slide simultaneously inward along the radial direction r, so as to drive the substrate 20 to rise and clamp the substrate 20.

[0036] Furthermore, during the unloading of the substrate 20, the pressure supply line 360 ​​provides a pressure drop below the first start pressure, so that the second radial drive 351 drives the second clamping member 350 to slide outward along the radial r, and the first radial drive 341 drives the first clamping member 340 to slide outward along the radial r, so as to release the substrate 20 and lower the substrate 20 until it is supported by the annular support surface 311, and then unloaded by the robot arm 30.

[0037] In other embodiments of this application, during the unloading of the substrate 20, the robot arm 30 first moves to below the substrate 20 and above the annular support surface 311. The pressure supply line 360 ​​provides pressure that drops below the first starting pressure, causing the second radial drive member 351 to drive the second clamping member 350 to slide outward radially r, and causing the first radial drive member 341 to drive the first clamping member 340 to slide outward radially r, thereby releasing the substrate 20 and allowing the substrate to be supported by the robot arm 30, which then unloads the substrate. Compared to the previous embodiment, in this embodiment, the substrate 20 is already supported by the robot arm 30 before it descends to contact the annular support surface 311, thus avoiding the substrate 20 from contacting the annular support surface 311 again and increasing the risk of edge contamination of the substrate 20.

[0038] Specifically, the chuck drive mechanism 400 includes a rotating shaft 410 and a hollow motor 420. The rotating shaft 410 is installed at the bottom of the chuck body 200 and is coaxially arranged with the chuck body 200. The hollow motor 420 is installed on the side wall of the rotating shaft 410 and is used to drive the rotating shaft 410 to rotate. The rotating shaft 410 has a central hole channel, which can be used as a pressure supply line 360.

[0039] Preferably, the back-side cleaning mechanism 100 includes a cleaning brush 110, a cleaning brush moving assembly 120, a first nozzle 130, and a cleaning brush rotation drive assembly 140. The cleaning brush 110 has its brush surface 111 facing upwards and is mounted at the end of the cleaning brush moving assembly 120. The cleaning brush moving assembly 120 moves the cleaning brush 110 below the substrate 20 during back-side cleaning of the substrate 20, allowing the brush surface 111 to brush the back-side 21 of the substrate 20. The cleaning brush rotation drive assembly 140 is mounted at the end of the cleaning brush moving assembly 120 and connected to the cleaning brush 110. It drives the cleaning brush 110 to rotate during back-side cleaning of the substrate 20. The first nozzle 130 is mounted on the cleaning brush moving assembly 120 and sprays cleaning liquid (e.g., DIW) toward the back-side of the substrate 20 during back-side cleaning of the substrate 20 to enhance the cleaning effect of the cleaning brush 110 on the back-side of the substrate 20. In addition, a second nozzle 210 is provided on the surface of the chuck body 200 for spraying cleaning liquid toward the back side 21 of the substrate 20 during back side cleaning, so as to keep the back side of the substrate 20 moist during back side cleaning and prevent local drying of the back side of the substrate 20 to form water stains.

[0040] In this embodiment, during the back-side cleaning of the substrate 20, the clamping member 300 only rotates on its own axis and does not revolve around the revolution. The cleaning brush 110 can move between two adjacent clamping members 300 to the underside of the substrate 20. While the substrate 20 rotates, the cleaning brush 110 reciprocates along the radial direction r to clean the back-side 21 of the substrate 20. The rotation of the clamping member 300 does not prevent the cleaning brush 110 from moving to the underside of the substrate 20 to clean the back-side 21 of the substrate 20, so that the back-side cleaning mechanism 100 can continuously and thoroughly clean the back-side 21 of the substrate 20.

[0041] Preferably, the substrate cleaning apparatus 10 further includes a substrate edge cleaning mechanism 500, used to rinse the chemical solution sputtered onto the edge of the upper surface of the substrate 20 after the back side cleaning of the substrate 20 is completed. Specifically, the substrate edge cleaning mechanism 500 includes a third nozzle 510 and a nozzle moving mechanism 520. The nozzle moving mechanism 520 is used to drive the third nozzle 510 to move above the edge of the substrate 20, so that after the back side cleaning of the substrate 20 is completed, the chemical solution on the edge of the upper surface of the substrate 20 is rinsed through the third nozzle 510.

[0042] This application also discloses a substrate cleaning method, applicable to a substrate cleaning apparatus, and the structure of the substrate cleaning apparatus is the same as that of the substrate cleaning apparatus 10 in any of the above embodiments, and will not be described again here. The substrate cleaning method includes:

[0043] Step S10: The substrate to be processed is carried and clamped by at least some of the clamping members 300.

[0044] In step S20, at least some of the clamping members 300 drive the substrate to be processed to rotate, and the back cleaning mechanism 100 cleans the side of the substrate to be processed that is close to the chuck body 200.

[0045] In step S30, the chuck body 200 is driven to rotate by the chuck drive mechanism 400 to spin dry the cleaned substrate.

[0046] Preferably, the second starting pressure is configured to be greater than the first starting pressure, and step S10 includes:

[0047] Step S11: The substrate to be processed is loaded between each clamp 300 and supported by the clamp 300;

[0048] Step S12: The pressure supply line 360 ​​provides a first pressure, which is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member 340 drives the substrate to be processed to rise and clamps the substrate to be processed.

[0049] Step S13: The pressure supply line 360 ​​provides a second pressure, which is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member 350 clamps the substrate to be processed.

[0050] Preferably, step S20 includes:

[0051] Step S21: The pressure supply line 360 ​​provides a third pressure, which is greater than or equal to the third starting pressure, so that the second clamping member 350 drives the substrate to be processed to rotate.

[0052] Step S22: The substrate to be processed is cleaned by the back cleaning mechanism 100.

[0053] Preferably, step S30 includes:

[0054] Step S31: The pressure supply line 360 ​​provides pressure that drops below the third starting pressure but is greater than or equal to the second starting pressure, so that the second clamping member 350 stops rotating the substrate that has been cleaned;

[0055] Step S32: The chuck drive mechanism 400 drives the chuck body 200 to rotate to spin dry the cleaned substrate.

[0056] Preferably, the substrate cleaning method further includes: step S40, unloading the substrate after spin-drying from the substrate cleaning apparatus 10.

[0057] Specifically, step S40 includes:

[0058] Step S411: The pressure supply line 360 ​​provides pressure that drops below the first starting pressure, and the clamp 300 slides outward along the radial direction r to release the substrate after the spin-drying process and lower it until it is supported by the annular support surface 311.

[0059] Step S412: Unload the substrate supported by the annular support surface 311 by the robot arm 30.

[0060] In another embodiment of this application, step S40 includes:

[0061] Step S421: The robot arm 30 moves to a position below the substrate after the spin-drying process is completed, and above the annular support surface 311;

[0062] Step S422: The pressure supply line 360 ​​provides pressure that drops below the first starting pressure, and the clamp 300 slides outward along the radial direction r to release the substrate after the spin-drying process and support it by the robot arm 30.

[0063] This application also discloses a coating and developing apparatus, comprising a front-end module, a process station, and an interface station connected in sequence. The process station includes a coating unit, a developing unit, a heat treatment unit, and a substrate cleaning device 10.

[0064] The system includes a coating unit for coating the substrate, a developing unit for developing the substrate, and a heat treatment unit for heat treating the substrate. A substrate cleaning apparatus 10 cleans the coated substrate to prevent contaminant particles from the back of the substrate from transferring into the lithography machine. These contaminant particles would become trapped between the substrate and the substrate stage during exposure, causing the substrate surface to bend and form localized protrusions. This would prevent the focus from aligning during exposure, resulting in defocusing, affecting the accuracy of the substrate exposure pattern, and ultimately reducing the substrate processing yield.

[0065] It should be noted that the above embodiments can be freely combined as needed. The above are merely preferred embodiments of the present invention. For those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A substrate cleaning apparatus, characterized in that, include: Chuck body; Several clamping components are arranged in a circle on the surface of the chuck body to clamp the substrate and drive the substrate to rotate. A back-side cleaning mechanism is used to clean the side of the substrate near the chuck body during the substrate's rotation. A chuck drive mechanism, connected to the chuck body, is used to drive the chuck body to rotate in order to spin-dry the substrate after cleaning.

2. The substrate cleaning apparatus according to claim 1, characterized in that, The clamping components, from bottom to top, include: The sliding part has a frustum structure that is larger at the bottom and smaller at the top. The sliding part is configured to provide a vertically upward component force to the edge of the substrate when the clamping member slides inward along the radial direction of the chuck body, so as to make the substrate rise. The limiting part has an annular groove that is adapted to the edge of the substrate.

3. The substrate cleaning apparatus according to claim 2, characterized in that, The clamping element further includes: The support portion is located at the bottom end of the sliding portion; wherein, The support portion has an annular support surface surrounding the sliding portion for supporting the substrate.

4. The substrate cleaning apparatus according to claim 1, characterized in that, The plurality of clamping members include a plurality of first clamping members and a plurality of second clamping members, and the substrate cleaning device further includes: A plurality of first radial drive members are used to simultaneously drive the plurality of first clamping members to slide along the radial direction of the chuck body, and the plurality of first radial drive members all have a first starting pressure; A plurality of second radial driving members are used to simultaneously drive the plurality of second clamping members to slide along the radial direction, and the plurality of second radial driving members each have a second starting pressure, the second starting pressure being not less than the first starting pressure; A plurality of rotary drive members are used to simultaneously drive the plurality of second clamping members to rotate, thereby causing the substrate to rotate, and the plurality of rotary drive members all have a third starting pressure, the third starting pressure being greater than the second starting pressure.

5. The substrate cleaning apparatus according to claim 4, characterized in that, The substrate cleaning apparatus further includes: The pressure supply line is connected to the first radial drive, the second radial drive, and the rotary drive respectively, and is used to simultaneously provide pressure to the first radial drive, the second radial drive, and the rotary drive.

6. The substrate cleaning apparatus according to claim 5, characterized in that, The second starting pressure is greater than the first starting pressure, and the substrate cleaning device is configured as follows: During substrate loading, the pressure supply line first provides a first pressure, which is greater than or equal to the first start-up pressure and less than the second start-up pressure, so that the first clamping member drives the substrate to rise and clamps the substrate. Then, the pressure supply line provides a second pressure, which is greater than or equal to the second start-up pressure and less than the third start-up pressure, so that the second clamping member clamps the substrate.

7. The substrate cleaning apparatus according to claim 5, characterized in that, The substrate cleaning apparatus is configured as follows: During substrate cleaning, the pressure supply line provides a third pressure, which is greater than or equal to the third start-up pressure, so that the second clamping member drives the substrate to rotate.

8. The substrate cleaning apparatus according to claim 5, characterized in that, The substrate cleaning apparatus is configured as follows: After the substrate is cleaned, the pressure supplied by the pressure supply line drops to below the third starting pressure but is greater than or equal to the first starting pressure, so that the second clamping member stops driving the substrate to rotate. Then, the chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

9. The substrate cleaning apparatus according to claim 5, characterized in that, The substrate cleaning apparatus is configured as follows: After the substrate is cleaned, the pressure supplied by the pressure supply line drops to below the third starting pressure but is greater than or equal to the second starting pressure, so that the second clamping member stops driving the substrate to rotate. Then, the chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

10. The substrate cleaning apparatus according to claim 4, characterized in that, The rotary drive component includes a pneumatic motor or a hydraulic motor; And / or, the first radial drive and the second radial drive include a pneumatic cylinder or a hydraulic cylinder.

11. The substrate cleaning apparatus according to claim 1, characterized in that, The back cleaning mechanism includes: A cleaning brush, wherein the brush surface of the cleaning brush is positioned upwards; A cleaning brush moving assembly is used to move the cleaning brush below the substrate during the substrate's rotation, so that the brush face can brush the back side of the substrate.

12. A substrate cleaning method, characterized in that, A substrate cleaning apparatus is applicable, comprising: a chuck body; a plurality of clamping members arranged in a circle on the surface of the chuck body for clamping a substrate and driving the substrate to rotate; a back cleaning mechanism for cleaning the side of the substrate near the chuck body; and a chuck driving mechanism for driving the chuck body to rotate; wherein the substrate cleaning method includes: Step S10: The substrate to be processed is carried and clamped by at least a portion of the clamping members. Step S20: The substrate to be processed is rotated by at least some of the clamping members, and the back cleaning mechanism cleans the side of the substrate to be processed that is close to the chuck body. Step S30: Drive the chuck body to rotate through the chuck drive mechanism to spin dry the cleaned substrate.

13. The substrate cleaning method according to claim 12, characterized in that, The plurality of clamping members include a plurality of first clamping members and a plurality of second clamping members, and the substrate cleaning apparatus further includes: A plurality of first radial drive members are used to simultaneously drive the plurality of first clamping members to slide along the radial direction of the chuck body, and the plurality of first radial drive members all have a first starting pressure; A plurality of second radial driving members are used to simultaneously drive the plurality of second clamping members to slide along the radial direction, and the plurality of second radial driving members each have a second starting pressure, the second starting pressure being greater than the first starting pressure; A plurality of rotary drive members are used to simultaneously drive the plurality of second clamping members to rotate, thereby causing the substrate to rotate, and the plurality of rotary drive members all have a third starting pressure, the third starting pressure being greater than the second starting pressure; A pressure supply line is connected to the first radial drive, the second radial drive, and the rotary drive, respectively, for simultaneously providing pressure to the first radial drive, the second radial drive, and the rotary drive; wherein, step S10 includes: Step S11: The substrate to be processed is loaded between each of the clamping members and supported by the clamping members; Step S12: The pressure supply line provides a first pressure, which is greater than or equal to the first starting pressure and less than the second starting pressure, so that the first clamping member drives the substrate to be processed to rise and clamps the substrate to be processed. Step S13: The pressure supply line provides a second pressure, which is greater than or equal to the second starting pressure and less than the third starting pressure, so that the second clamping member clamps the substrate to be processed.

14. The substrate cleaning method according to claim 13, characterized in that, Step S20 includes: Step S21: The pressure supply line provides a third pressure, which is greater than or equal to the third starting pressure, so that the second clamping member drives the substrate to be processed to rotate. Step S22: Clean the substrate to be processed using the back cleaning mechanism.

15. The substrate cleaning method according to claim 13, characterized in that, Step S30 includes: Step S31: The pressure supplied by the pressure supply line drops to below the third starting pressure, but is greater than or equal to the second starting pressure, so that the second clamping member stops driving the cleaned substrate to rotate. Step S32: The chuck drive mechanism drives the chuck body to rotate to spin dry the cleaned substrate.

16. A coating and developing apparatus, comprising a front-end module, a process station, and an interface station connected in sequence, characterized in that, The process station includes: A coating unit is used to coat a substrate. The developing unit is used to develop the substrate. A heat treatment unit is used to heat treat the substrate; And a substrate cleaning apparatus as described in any one of claims 1-11, for cleaning the substrate after coating treatment.

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