Gasket structure and electronic device including gasket structure

Abstract

An electronic device according to an embodiment may comprise at least one gasket structure. The electronic device according to an embodiment may comprise: a display; a plate which is disposed on the rear surface of the display and to which at least one gasket structure is coupled; and a substrate which is disposed on the rear surface of the plate and supports the display and the plate. The at least one gasket structure according to an embodiment may comprise: a coupling part forming the body of the at least one gasket structure and having contact surfaces formed at both ends thereof so as to be coupled to the plate; an S-clip-shaped bending part extending from an area connecting the coupling parts at both ends; a first contact part formed in a first bending area of the bending part to contact the rear surface of the display; and a second contact part formed in a second bending area of the bending part to contact the front surface of the substrate.

Description

Gasket structure and electronic device including gasket structure

[0001] The present disclosure relates to an electronic device including a gasket structure.

[0002] Electronic devices may have a gap formed between the display and the plate, and electromagnetic components interacting between the display and the plate may cause interference with the antenna within the electronic device or generate noise in the display.

[0003] Therefore, the gap between the display and the plate requires some sort of grounding mechanism. One method for grounding the display and the plate is to weld a conductor to one side of each of the display and the plate.

[0004] However, simply welding the conductor has the disadvantage of the possibility of detachment, and there is the hassle of having to weld on each side.

[0005] The present disclosure provides a gasket structure that provides a rigid bonding structure in a laminated structure between a display and a substrate, improves antenna efficiency by grounding electromagnetic components generated between the display and the substrate, and eliminates display noise.

[0006] An electronic device according to one embodiment may include at least one gasket structure. The electronic device according to one embodiment may include a display, a plate disposed on a rear surface of the display and to which the at least one gasket structure is coupled, and a substrate disposed on a rear surface of the plate and supporting the display and the plate. The at least one gasket structure according to one embodiment may include a body of the at least one gasket structure, a coupling portion having contact surfaces formed at both ends to be coupled with the plate, a bending portion in the shape of an S-clip extending from a region connecting the coupling portions at both ends, a first contact portion formed to be in contact with the rear surface of the display in a first bending region of the bending portion, and a second contact portion formed to be in contact with the front surface of the substrate in a second bending region of the bending portion.

[0007] A gasket structure according to one embodiment may include a body of the gasket structure, a joining portion having contact surfaces formed at both ends to be joined to a plate of an electronic device, a bending portion in the shape of an S-clip extending from an area connecting the joining portions at both ends, a first contact portion formed to be in contact with a rear surface of a display of the electronic device in a first bending area of ​​the bending portion, and a second contact portion formed to be in contact with a front surface of a substrate of the electronic device in a second bending area of ​​the bending portion.

[0008] FIG. 1 is a perspective view of an electronic device according to one embodiment.

[0009] FIG. 2 is a rear perspective view of an electronic device according to one embodiment.

[0010] FIG. 3 is a perspective view of an unfolded electronic device according to one embodiment.

[0011] FIG. 4 is a drawing for explaining the positional relationship of a gasket structure according to one embodiment.

[0012] FIG. 5 is a perspective view of a gasket structure according to one embodiment.

[0013] FIG. 6 illustrates a state in which a gasket structure according to one embodiment is viewed from a display position.

[0014] FIG. 7 illustrates a state of a gasket structure according to one embodiment as viewed from the substrate position.

[0015] FIG. 8 illustrates a side wall formed around a gasket structure according to one embodiment.

[0016] Fig. 9 is a cross-sectional view of the gasket structure and side wall of Fig. 8 viewed from the side.

[0017] Fig. 10 illustrates a mounting process of a gasket structure according to one embodiment.

[0018] Fig. 11 illustrates a modified example of a contact portion of a gasket structure according to one embodiment.

[0019] Fig. 12 illustrates a modified example of a banding portion of a gasket structure according to one embodiment.

[0020] FIG. 13 is a block diagram of an electronic device within a network environment according to various embodiments.

[0021] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described in detail below together with the attached drawings. However, the present invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are provided only to ensure that the disclosure of the present invention is complete and to fully inform those skilled in the art of the scope of the invention, and the present invention is defined only by the scope of the claims. Like reference numerals refer to like elements throughout the specification.

[0022] Unless otherwise defined, all terms (including technical and scientific terms) used herein may be used in their common sense to those of ordinary skill in the art to which the present invention pertains. Furthermore, terms defined in commonly used dictionaries are not to be interpreted ideally or excessively unless explicitly and specifically defined otherwise. The terminology used herein is for the purpose of describing embodiments and is not intended to limit the present invention. In this specification, singular forms also include plural forms, unless specifically stated otherwise.

[0023] The terms "comprises" and / or "comprising" as used in the specification do not exclude the presence or addition of one or more other components, steps, operations and / or elements.

[0024] FIG. 1 is a perspective view of the front of an electronic device according to one embodiment of the present disclosure. FIG. 2 is a perspective view of the rear of the electronic device of FIG. 1 according to one embodiment of the present disclosure.

[0025] Referring to FIGS. 1 and 2, an electronic device (200) according to one embodiment may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B). In another embodiment (not shown), the housing may refer to a structure that forms a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 1. According to one embodiment, the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers). The second side (210B) may be formed by a substantially opaque back plate (211). The rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials. The side surface (210C) may be formed by a side bezel structure (218) (or “plate”) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and / or polymer. In some embodiments, the rear plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).

[0026] In the illustrated embodiment, the front plate (202) may include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate. In the illustrated embodiment (see FIG. 2), the rear plate (211) may include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge. In some embodiments, the front plate (202) or the rear plate (211) may include only one of the first region (210D) or the second region (210E). In some embodiments, the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B). In the above embodiments, when viewed from the side of the electronic device, the side bezel structure (218) may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).

[0027] According to one embodiment, the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208). In some embodiments, the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.

[0028] The display (201) may be visually exposed, for example, through a substantial portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202), which forms the first side (210A) and the first region (210D) of the side surface (210C). The display (201) may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a digitizer for detecting a magnetic field-type stylus pen. In some embodiments, at least a portion of the sensor modules (204, 219), and / or at least a portion of the key input device (217), may be disposed in the first region (210D), and / or the second region (210E).

[0029] The input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound. The audio output device (207, 214) may include speakers (207, 214). The speakers (207, 214) may include an external speaker (207) and a call receiver (214). In some embodiments, the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214). In some embodiments, the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).

[0030] The sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state. The sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and / or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and / or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210). The fingerprint sensor may be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and / or under the display (201). The electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.

[0031] The camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and / or a flash (213). The camera modules (205, 212) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (213) may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).

[0032] The key input device (217) may be positioned on a side surface (210C) of the housing (210). In another embodiment, the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201). In another embodiment, the key input device (217) may be implemented using a pressure sensor included in the display (201).

[0033] The indicator may be disposed, for example, on the first side (210A) of the housing (210). The indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element). In another embodiment, the light-emitting element may provide a light source that is linked to the operation of the camera module (205), for example. The indicator may include, for example, an LED, an IR LED, and / or a xenon lamp.

[0034] The connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and / or data with an external electronic device, and / or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.

[0035] Some of the camera modules (205, 212), some of the sensor modules (204, 219), or indicators may be arranged to be visually exposed through the display (201). For example, the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201). According to one embodiment, an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area for displaying content. According to one embodiment, the transparent area may be formed to have a transmittance in a range of about 513 to about 2013. Such a transparent area may include an area overlapping with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image. For example, the transparent area of ​​the display (201) may include an area with a lower pixel density than the surrounding area. For example, the transparent area may replace the opening. For example, the camera module (205) may include an under-display camera (UDC). In another embodiment, some sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device. For example, in such a case, the area of ​​the display (201) facing the sensor module may not require a perforated opening.

[0036] According to one embodiment, the electronic device (200) has a bar type or plate type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device (200) may be a part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and / or a rollable electronic device. The terms “foldable electronic device,” “slidable electronic device,” “stretchable electronic device,” and / or “rollable electronic device” may refer to an electronic device in which a display (e.g., the display (330) of FIG. 3) is capable of bending deformation, such that at least a portion thereof is folded, wound, or rolled, at least a portion thereof is expanded, and / or the electronic device can be accommodated inside a housing (e.g., the housing (210) of FIGS. 1 and 2). Foldable electronic devices, slideable electronic devices, stretchable electronic devices and / or rollable electronic devices can be used to expand the screen display area by unfolding the display or exposing a wider area of ​​the display to the outside, depending on the user's needs.

[0037] FIG. 3 is an exploded perspective view of the electronic device of FIG. 1, according to one embodiment of the present disclosure.

[0038] The electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 1 and 2, or may include other embodiments of the electronic device.

[0039] Referring to FIG. 3, an electronic device (300) (e.g., the electronic device (200) of FIG. 1 or FIG. 2) may include a plate (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG. 1), a substrate (340) (e.g., a printed circuit board (PCB), a flexible PCB (FPCB), or a rigid-flexible PCB (RFPCB)), a battery (350), a second support member (360) (e.g., a rear case), an antenna (370), and a rear plate (380) (e.g., a rear cover). In some embodiments, the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 1 or FIG. 2, and any overlapping description will be omitted below.

[0040] The first support member (311) may be disposed inside the electronic device (300) and connected to the plate (310), or may be formed integrally with the plate (310). The first support member (311) may be formed of, for example, a metallic material and / or a non-metallic (e.g., polymer) material. The first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface. A processor, a memory, and / or an interface may be mounted on the substrate (340). The processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.

[0041] The memory may include, for example, volatile memory or non-volatile memory.

[0042] The interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and / or an audio interface. The interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0043] The battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as the substrate (340), for example. The battery (350) may be integrally disposed within the electronic device (300). In another embodiment, the battery (350) may be disposed so as to be detachable from the electronic device (300).

[0044] The antenna (370) may be positioned between the rear plate (380) and the battery (350). The antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging. In another embodiment, the antenna structure may be formed by a part or a combination of the side bezel structure (310) and / or the first support member (311).

[0045] FIG. 4 is a drawing for explaining the positional relationship of a gasket structure according to one embodiment.

[0046] A gasket structure (400) according to one embodiment is a member for supporting a gap between a display (330) and a substrate (340) and at the same time for removing an electromagnetic component generated between the display (330) and the substrate (340).

[0047] If the display (330), plate (310), and substrate (340) are sequentially stacked without the gasket structure (400), a PIM (passive intermodulation distortion) phenomenon occurs due to electromagnetic components generated from the display (330) and substrate (340), and electromagnetic components may be induced in an antenna provided in the electronic device. In addition, the electromagnetic components may also be induced in the display (330), causing display noise.

[0048] According to one embodiment, the plate (310) may be disposed on the back side (e.g., in the -z-axis direction of FIG. 3) of the display (330), and a gasket structure (400) may be coupled thereto. Although not illustrated in FIG. 4, a metal sheet layer may be provided on the back side of the display (330). The metal sheet layer may include at least one of SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or a metal CLAD (e.g., a laminated member in which SUS and Al are alternately disposed). Accordingly, the first contact portion (410 of FIG. 5), which is an upper portion (e.g., in the z-axis direction of FIG. 3) of the gasket structure (400), may be in contact with the metal sheet layer. According to one embodiment, the substrate (340) may be disposed on the back side (e.g., in the -z-axis direction of FIG. 3) of the plate (310) and may support the display (330) and the plate (310). Each of the first contact portion (410 in FIG. 5) which is the upper portion (e.g., in the z-axis direction in FIG. 3) of the gasket structure (400) and the second contact portion (420 in FIG. 5) which is the lower portion (e.g., in the -z-axis direction in FIG. 3) of the gasket structure (400) can contact the back surface (e.g., in the -z-axis direction in FIG. 3) of the display (330), the plate (310), and the substrate (340) respectively to form a grounding structure when the display (330), the plate (310), and the substrate (340) are sequentially combined.

[0049] An electronic device (200) according to one embodiment may include at least one gasket structure (400). The gasket structure (400) according to one embodiment may be coupled to a hole formed in a plate (310).

[0050] FIG. 5 is a perspective view of a gasket structure according to one embodiment.

[0051] A gasket structure (400) according to one embodiment may include a first contact portion (410) provided at the top (based on the +z axis), a second contact portion (420) provided at the bottom (based on the -z axis), a joining portion (430) forming a body of the gasket structure (400) and having contact surfaces formed at both ends to be joined with a plate (310 in FIG. 4), and a connecting portion (440) forming an inclined surface connecting the first contact portion (410) and the second contact portion (420).

[0052] As illustrated in FIG. 5, the gasket structure (400) may be a structure in which the above-described components are integrated, and may be made of a metal such as SUS (steel use stainless) (e.g., STS (stainless steel)), Cu, Al, or metal CLAD, so as to ground the electromagnetic component generated from the display (330) and the substrate (340) to the plate (310).

[0053] A gasket structure (400) according to one embodiment may include an S-clip-shaped bending portion (450) extending from a region connecting a connecting portion (430) where contact surfaces are formed at both ends. The bending portion (450) may include a first contact portion (410) provided at the uppermost portion to contact the display (330) and a second contact portion (420) provided at the lowermost portion to contact the substrate (340).

[0054] According to one embodiment, the first contact portion (410) may be provided in a protruding shape to facilitate point contact with the display (330). According to one embodiment, the second contact portion (420) may be provided in a protruding shape to facilitate contact with the substrate (340).

[0055] According to one embodiment, the banding portion (450) may be provided in an S-clip shape and may have a structure extending along an inclined surface from the center of the connecting portion (430). The banding portion (450) connected to the center of the connecting portion (430) may generate elastic force depending on a force applied in an upward or downward direction.

[0056] Referring to FIGS. 4 and 5 together, a first contact portion (410) according to one embodiment may be formed at a first height in a first direction (+z-axis direction in FIG. 5) from a contact surface. A second contact portion (420) according to one embodiment may be formed at a second height in a second direction (-z-axis direction in FIG. 5) opposite to the first direction from the contact surface. According to one embodiment, the second height may have a value greater than the first height. Accordingly, the second contact portion (420) may be formed to be exposed longer to the coupling portion (430) than the first contact portion (410).

[0057] FIG. 6 illustrates a state of a gasket structure according to one embodiment as viewed from a display position, and FIG. 7 illustrates a state of a gasket structure according to one embodiment as viewed from a substrate position.

[0058] Figures 6 and 7 are drawings illustrating a form in which a gasket structure (400) is coupled to a plate (310).

[0059] Referring to FIG. 6, the gasket structure (400) is coupled from the rear surface of the plate (310) and a portion of the gasket structure (400) is exposed through a hole formed in the plate (310). Through the hole formed in the plate (310), a first contact portion (410), which is a portion of the gasket structure (400), can be exposed in a direction toward the display (330), and when an upward external force is applied through the second contact portion (420), the gasket structure (400) can rise in the direction of the display (330). Since the gasket structure (400) is coupled from the rear surface of the plate (310), it can be prevented from being detached from the hole of the plate (310) by an external force generated in a downward direction.

[0060] Fig. 7 illustrates the rear side of the plate (310). The front surfaces of both ends (430-1, 430-2) of the joint portion (430), which is a part of the gasket structure (400), can be directly contacted and joined with the rear surface of the plate (310) including the hole. For example, the plate (310) may have at least one hole formed into which at least one gasket structure (400) can be joined, and the joint portion (430) of the gasket structure (400) may be joined to the plate (310) in a manner of contacting the periphery of the hole. At this time, the front surfaces of both ends and the rear surface of the hole may be joined through welding, but various adhesive methods or structural methods may also be used for joining. Meanwhile, the gasket structure (400) occupies a part of the formed hole of the plate (310), and the second contact portion (420), which is a part of the gasket structure (400), may be exposed in a direction toward the substrate (340 in Fig. 4). At this time, when the back surface of the plate (310) and the front surface of the substrate (340) are combined, the second contact portion (420) comes into contact with the front surface of the substrate (340).

[0061] FIG. 8 illustrates a side wall formed around a gasket structure according to one embodiment, and FIG. 9 is a cross-sectional view of the gasket structure and side wall of FIG. 8 as viewed from the side.

[0062] As illustrated in FIG. 8, a side wall (w) having a certain height (based on the +y direction of FIG. 8) may be formed around the gasket structure (400) and the hole of the plate (310) on the plate (310). The height of the side wall (w) may be greater than the height at which the first contact portion (410) protrudes. Therefore, even if the gasket structure (400) is coupled with the plate (310) and is coupled with the display (330 of FIG. 4), the first contact portion (410) may not come into contact with the back surface of the display (330). For example, referring to FIG. 9, if the height of the side wall (w) is 0.35 mm, the protruding height of the first contact portion (410) may be 0.3 mm.

[0063] Fig. 10 illustrates a mounting process of a gasket structure according to one embodiment.

[0064] As shown in Fig. 10, the plate (310) can be first combined with the front surface of the plate (310) while the gasket structure (400) is combined, and then the display (330) can be combined with the front surface of the substrate (340) and the back surface of the plate (310) while the display (330) is combined.

[0065] Referring to (A) of FIG. 10, the plate (310) to which the gasket structure (400) is coupled is coupled with the display (330), and since no external force is applied to the gasket structure (400), the first contact portion (410 of FIG. 5) does not rise and does not come into contact with the display (330).

[0066] Referring to (B) of FIG. 10, the plate (310) to which the gasket structure (400) is coupled is coupled to the substrate (340), and an external force is generated on the gasket structure (400) by the substrate (340), causing the first contact portion (410) to rise.

[0067] Referring to (C) of FIG. 10, the plate (310) coupled with the gasket structure (400) is coupled with both the display (330) and the substrate (340), and the second contact portion (420 of FIG. 5) of the gasket structure (400) is secured to the substrate, so that the first contact portion (410) and the second contact portion (420) can each be brought into contact with the display (330) and the substrate (340), respectively. For example, the display (330) and / or the substrate (340) can be electrically connected to the plate (310) through the first contact portion (410) and / or the second contact portion (420).

[0068] In existing mass-produced electronic devices, a C-Clip and a metal sheet were used to ground the substrate (PCB) to the plate (metal), and a conductive gasket and a metal sheet were used to ground the display to the plate (metal), requiring a total of four types of attachments. However, the disclosed embodiment replaces this with a single attachment (gasket structure), thereby reducing material costs and manufacturing process time.

[0069] According to one embodiment, the plate (310) may be coupled to the back surface of the display (330) while at least one gasket structure (400) is coupled thereto. According to one embodiment, the plate (310) may be coupled to the display (330) while the first contact portion (410) does not contact the back surface of the display (330).

[0070] According to one embodiment, the plate (310) is coupled to the front surface of the substrate (340) while being coupled to the display (330), and when the plate (310) is coupled to the substrate (340), the second contact portion (420) can come into contact with the front surface of the substrate (340). The first contact portion (410) can rise in the first direction, which is an upward direction, due to the contact between the second contact portion (420) and the front surface of the substrate (340), and come into contact with the back surface of the display (330).

[0071] At least one gasket structure (400) according to one embodiment can ground electromagnetic components generated in the display (330) and the substrate (340) to the plate (310) through the first contact portion (410) and the second contact portion (420). For example, at least a portion of the plate (310) to which the joining portion (430) of the gasket structure (400) is joined can include a grounding area.

[0072] Fig. 11 illustrates a modified example of a contact portion of a gasket structure according to one embodiment.

[0073] As described above, the first contact portion (410) is configured to contact the back surface of the display (330). Unlike the substrate (340), the display (330) is configured to be vulnerable to physical impact and requires more stable contact than the second contact portion (420) that contacts the substrate (340).

[0074] Accordingly, as illustrated in FIG. 11, the first contact portion (410) can be configured as a double ground structure (410-1, 420-2) to disperse the impact applied by the gasket structure (400) to the display (330).

[0075] According to one embodiment, the first contact portion (410) of the gasket structure (400) may be formed with multiple contact points that come into contact with the display (330) in the first banding region. It should be noted that the multiple contact structure may be formed in a triple or quadruple manner, unlike that illustrated in FIG. 11.

[0076] Fig. 12 illustrates a modified example of a banding portion of a gasket structure according to one embodiment.

[0077] As explained through Fig. 11, the gasket structure (400) is an element that applies physical impact to the display (330), and thus requires a structure capable of buffering the impact.

[0078] According to one embodiment, the banding portion (450 in FIG. 5) of the gasket structure (400) may be formed in an S-clip shape. In this case, the banding portion (450) may include a connecting portion that forms an inclined surface connecting the first contact portion (410) and the second contact portion (420).

[0079] Meanwhile, when the connecting portion is flat, the external force applied to the second contact portion (420) can be directly transmitted to the first contact portion (410). Therefore, by making a part of the connecting portion parallel to the contact surface of the joining portion (420 in FIG. 5), the external force transmitted to the first contact portion (410) can be alleviated.

[0080] According to one embodiment, the banding portion (450) may include a connecting portion that forms an inclined surface connecting the first contact portion (410) and the second contact portion (420). According to one embodiment, the connecting portion may have two bending regions formed such that a portion of the inclined surface is parallel to the contact surface of the coupling portion. At this time, the space between the two bending regions (A, 460-1 of FIG. 12) becomes parallel to the coupling portion and the contact surface. If the space between the two bending regions is made relatively long (B, 460-2 of FIG. 12), the external force transmitted to the first contact portion (410) can be more alleviated.

[0081] FIG. 13 is a block diagram of an electronic device (1301) within a network environment (1300) according to various embodiments. Referring to FIG. 13 , in the network environment (1300), the electronic device (1301) may communicate with the electronic device (1302) via a first network (1398) (e.g., a short-range wireless communication network), or may communicate with at least one of the electronic device (1304) or the server (1308) via a second network (1399) (e.g., a long-range wireless communication network). In one embodiment, the electronic device (1301) may communicate with the electronic device (1304) via the server (1308). According to one embodiment, the electronic device (1301) may include a processor (1320), a memory (1330), an input module (1350), an audio output module (1355), a display module (1360), an audio module (1370), a sensor module (1376), an interface (1377), a connection terminal (1378), a haptic module (1379), a camera module (1380), a power management module (1388), a battery (1389), a communication module (1390), a subscriber identification module (1396), or an antenna module (1397). In some embodiments, the electronic device (1301) may omit at least one of these components (e.g., the connection terminal (1378)), or may have one or more other components added. In some embodiments, some of these components (e.g., sensor module (1376), camera module (1380), or antenna module (1397)) may be integrated into a single component (e.g., display module (1360)).

[0082] The processor (1320) may, for example, execute software (e.g., a program (1340)) to control at least one other component (e.g., a hardware or software component) of the electronic device (1301) connected to the processor (1320) and perform various data processing or operations. According to one embodiment, as at least a part of the data processing or operations, the processor (1320) may store commands or data received from other components (e.g., a sensor module (1376) or a communication module (1390)) in a volatile memory (1332), process the commands or data stored in the volatile memory (1332), and store result data in a non-volatile memory (1334). According to one embodiment, the processor (1320) may include a main processor (1321) (e.g., a central processing unit or an application processor) or an auxiliary processor (1323) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (1321). For example, when the electronic device (1301) includes the main processor (1321) and the auxiliary processor (1323), the auxiliary processor (1323) may be configured to use less power than the main processor (1321) or to be specialized for a given function. The auxiliary processor (1323) may be implemented separately from the main processor (1321) or as a part thereof.

[0083] The auxiliary processor (1323) may control at least a portion of functions or states associated with at least one component (e.g., the display module (1360), the sensor module (1376), or the communication module (1390)) of the electronic device (1301), for example, on behalf of the main processor (1321) while the main processor (1321) is in an inactive (e.g., sleep) state, or together with the main processor (1321) while the main processor (1321) is in an active (e.g., application execution) state. In one embodiment, the auxiliary processor (1323) (e.g., an image signal processor or a communication processor) may be implemented as a part of another functionally related component (e.g., a camera module (1380) or a communication module (1390)). In one embodiment, the auxiliary processor (1323) (e.g., a neural network processing unit) may include a hardware structure specialized for processing artificial intelligence models. The artificial intelligence models may be generated through machine learning. This learning can be performed, for example, on the electronic device (1301) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (1308)). The learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model can include multiple artificial neural network layers.The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to, or alternatively to, a hardware structure, an artificial intelligence model may include a software structure.

[0084] The memory (1330) can store various data used by at least one component (e.g., the processor (1320) or the sensor module (1376)) of the electronic device (1301). The data can include, for example, software (e.g., the program (1340)) and input data or output data for commands related thereto. The memory (1330) can include volatile memory (1332) or non-volatile memory (1334).

[0085] The program (1340) may be stored as software in memory (1330) and may include, for example, an operating system (1342), middleware (1344), or an application (1346).

[0086] The input module (1350) can receive commands or data to be used in a component of the electronic device (1301) (e.g., a processor (1320)) from an external source (e.g., a user) of the electronic device (1301). The input module (1350) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0087] The audio output module (1355) can output audio signals to the outside of the electronic device (1301). The audio output module (1355) can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0088] The display module (1360) can visually provide information to an external party (e.g., a user) of the electronic device (1301). The display module (1360) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device. In one embodiment, the display module (1360) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.

[0089] The audio module (1370) can convert sound into an electrical signal, or vice versa. According to one embodiment, the audio module (1370) can acquire sound through the input module (1350), output sound through the sound output module (1355), or an external electronic device (e.g., electronic device (1302)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (1301).

[0090] The sensor module (1376) can detect the operating status (e.g., power or temperature) of the electronic device (1301) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status. According to one embodiment, the sensor module (1376) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0091] The interface (1377) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (1301) with an external electronic device (e.g., the electronic device (1302)). In one embodiment, the interface (1377) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0092] The connection terminal (1378) may include a connector through which the electronic device (1301) may be physically connected to an external electronic device (e.g., the electronic device (1302)). In one embodiment, the connection terminal (1378) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0093] The haptic module (1379) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations. In one embodiment, the haptic module (1379) may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

[0094] The camera module (1380) can capture still images and videos. In one embodiment, the camera module (1380) may include one or more lenses, image sensors, image signal processors, or flashes.

[0095] The power management module (1388) can manage the power supplied to the electronic device (1301). According to one embodiment, the power management module (1388) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

[0096] A battery (1389) may power at least one component of the electronic device (1301). In one embodiment, the battery (1389) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0097] The communication module (1390) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (1301) and an external electronic device (e.g., electronic device (1302), electronic device (1304), or server (1308)), and the performance of communication through the established communication channel. The communication module (1390) may operate independently from the processor (1320) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (1390) may include a wireless communication module (1392) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (1394) (e.g., a local area network (LAN) communication module, or a power line communication module). Any of these communication modules may communicate with an external electronic device (1304) via a first network (1398) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (1399) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a local area network or a wide area network)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (1392) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (1396) to verify or authenticate the electronic device (1301) within a communication network such as the first network (1398) or the second network (1399).

[0098] The wireless communication module (1392) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology). The NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency communications (URLLC (ultra-reliable and low-latency communications)). The wireless communication module (1392) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate. The wireless communication module (1392) may support various technologies for securing performance in high-frequency bands, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna. The wireless communication module (1392) may support various requirements specified in the electronic device (1301), an external electronic device (e.g., the electronic device (1304)), or a network system (e.g., the second network (1399)). According to one embodiment, the wireless communication module (1392) may support a peak data rate (e.g., 20 Gbps or more) for eMBB implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0099] The antenna module (1397) can transmit or receive signals or power to or from an external device (e.g., an external electronic device). In one embodiment, the antenna module (1397) may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). In one embodiment, the antenna module (1397) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (1398) or the second network (1399), may be selected from the plurality of antennas by, for example, the communication module (1390). A signal or power may be transmitted or received between the communication module (1390) and an external electronic device via the at least one selected antenna. In some embodiments, in addition to the radiator, another component (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module (1397).

[0100] According to various embodiments, the antenna module (1397) may form a mmWave antenna module. In one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band.

[0101] At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).

[0102] According to one embodiment, commands or data may be transmitted or received between the electronic device (1301) and an external electronic device (1304) via a server (1308) connected to a second network (1399). Each of the external electronic devices (1302 or 1304) may be the same or a different type of device as the electronic device (1301). According to one embodiment, all or part of the operations executed in the electronic device (1301) may be executed in one or more of the external electronic devices (1302, 1304, or 1308). For example, when the electronic device (1301) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (1301) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service. One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (1301). The electronic device (1301) may process the result as is or additionally and provide it as at least a portion of a response to the request. For this purpose, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example. The electronic device (1301) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example. In another embodiment, the external electronic device (1304) may include an Internet of Things (IoT) device. The server (1308) may be an intelligent server utilizing machine learning and / or a neural network.According to one embodiment, an external electronic device (1304) or server (1308) may be included within the second network (1399). The electronic device (1301) may be applied to intelligent services (e.g., smart homes, smart cities, smart cars, or healthcare) based on 5G communication technology and IoT-related technology.

[0103] An electronic device (200 of FIGS. 1 and 2, 300 of FIG. 3, and / or 1301 of FIG. 13) according to one embodiment may include at least one gasket structure (400 of FIGS. 4 and 5). The electronic device according to one embodiment may include a display (330 of FIG. 3), a plate (310 of FIG. 3) disposed on the back of the display and having at least one gasket structure coupled thereto, and a substrate (340 of FIG. 3) disposed on the back of the plate and on which the display and the plate are laminated. At least one gasket structure according to one embodiment may include a body of at least one gasket structure, a joining portion (430 in FIG. 5) having contact surfaces formed at both ends to be joined with a plate, an S-clip-shaped bending portion extending from an area connecting the joining portions at both ends, a first contact portion (410 in FIG. 5) formed to be in contact with the back surface of the display in a first bending area of ​​the bending portion (450 in FIG. 5), and a second contact portion (420 in FIG. 5) formed to be in contact with the front surface of the substrate in a second bending area of ​​the bending portion.

[0104] According to one embodiment, a first contact portion (410 in FIG. 5) may be formed at a first height in a first direction from the contact surface, and a second contact portion (420 in FIG. 5) according to one embodiment may be formed at a second height greater than the first height in a second direction opposite to the first direction from the contact surface.

[0105] At least one gasket structure according to one embodiment is capable of engaging a rear surface of at least one hole formed in a plate and a contact surface of a joint in a first direction.

[0106] In one embodiment, the plate may be coupled to the back of the display while at least one gasket structure is coupled thereto, and the first contact portion may not be in contact with the back of the display while coupled to the display.

[0107] In one embodiment, the plate is coupled to the front surface of the substrate while being coupled to the display, and when coupled to the substrate, the second contact portion contacts the front surface of the substrate, and the first contact portion rises in the first direction by contact between the second contact portion and the front surface of the substrate, and the first contact portion can contact the back surface of the display.

[0108] At least one gasket structure according to one embodiment can ground electromagnetic components generated in the display and the substrate to the plate through the first contact portion and the second contact portion.

[0109] According to one embodiment, the first contact portion may have multiple contact points formed in contact with the display in the first banding region.

[0110] According to one embodiment, the banding portion may include a connecting portion forming an inclined surface connecting the first contact portion and the second contact portion.

[0111] In one embodiment, the connecting portion may be formed with two banding regions such that a portion of the inclined surface is parallel to the contact surface of the joining portion.

[0112] A gasket structure (400 of FIGS. 4 and 5) according to one embodiment may include a body of the gasket structure, a joining portion (430 of FIG. 5) having contact surfaces formed at both ends to be joined with a plate of an electronic device, a bending portion (450 of FIG. 5) in the shape of an S-clip extending from an area connecting the joining portions (430 of FIG. 5) at both ends, a first contact portion (410 of FIG. 5) formed to be in contact with the back surface of a display of the electronic device in a first bending area of ​​the bending portion, and a second contact portion (420 of FIG. 5) formed to be in contact with the front surface of a substrate of the electronic device in a second bending area of ​​the bending portion.

[0113] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0114] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0115] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0116] Various embodiments of the present document may be implemented as software (e.g., a program (1340)) including one or more instructions stored in a storage medium (e.g., an internal memory (1336) or an external memory (1338)) readable by a machine (e.g., an electronic device (1301)). For example, a processor (e.g., a processor (1320)) of the machine (e.g., an electronic device (1301)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0117] According to one embodiment, the method according to various embodiments disclosed in this document may be provided as a computer program product. The computer program product may be traded between sellers and buyers as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)) or may be provided through an application store (e.g., Play Store). TM ) or directly between two user devices (e.g., smart phones), online distribution (e.g., downloading or uploading). In the case of online distribution, at least a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0118] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0119] Electronic devices according to the various embodiments disclosed in this document may take various forms. Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances. Electronic devices according to the embodiments of this document are not limited to the aforementioned devices.

[0120] The various embodiments of this document and the terminology used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of the items, unless the context clearly indicates otherwise. In this document, each of the phrases "A or B", "at least one of A and B", "at least one of A or B", "A, B, or C", "at least one of A, B, and C", and "at least one of A, B, or C" can include any one of the items listed together in the corresponding phrase among those phrases, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order). When a component (e.g., a first component) is referred to as "coupled" or "connected" to another (e.g., a second component), with or without the terms "functionally" or "communicatively," it means that the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.

[0121] The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit. A module may be an integral component, or a minimum unit or part of such a component that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0122] Various embodiments of the present document may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)). For example, a processor (e.g., a processor (120)) of the machine (e.g., an electronic device (101)) may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The machine-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.

[0123] According to one embodiment, the method according to various embodiments disclosed in the present document may be provided as included in a computer program product. The computer program product may be traded as a product between a seller and a buyer. The computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., Play Store™) or directly between two user devices (e.g., smart phones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.

[0124] According to various embodiments, each component (e.g., a module or a program) of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components. According to various embodiments, one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. According to various embodiments, the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

Claims

1. In an electronic device including at least one gasket structure, display; A plate disposed on the rear of the display and having at least one gasket structure coupled thereto; and A substrate placed on the rear side of the above plate; At least one gasket structure, A joint portion forming a body of at least one gasket structure and having contact surfaces formed at both ends to be combined with the plate; An S-clip shaped banding portion extending from an area connecting the above two ends of the joint; A first contact portion formed to contact the rear surface of the display in the first banding area of ​​the banding portion; and An electronic device comprising a second contact portion formed to contact the front surface of the substrate in the second bending region of the above-mentioned bending portion.

2. In paragraph 1, The above first contact part is, It is formed at a first height in a first direction from the above contact surface, The above second contact part is, An electronic device formed at a second height greater than the first height in a second direction opposite to the first direction from the contact surface.

3. In paragraph 2, At least one gasket structure, An electronic device in which the rear surface of at least one hole formed in the plate and the contact surface of the coupling portion are coupled in a first direction.

4. In paragraph 3, The above plate, An electronic device in which at least one gasket structure is coupled to the rear surface of the display, and in which the first contact portion does not contact the rear surface of the display when coupled to the display.

5. In paragraph 4, The above plate, An electronic device in which the front surface of the substrate is coupled with the display, and when coupled with the substrate, the second contact portion comes into contact with the front surface of the substrate, the first contact portion rises in the first direction by contact between the second contact portion and the front surface of the substrate, and the first contact portion comes into contact with the back surface of the display.

6. In paragraph 5, At least one gasket structure, An electronic device that grounds electromagnetic components generated from the display and the substrate to the plate through the first contact portion and the second contact portion.

7. In paragraph 1, The above first contact part is, An electronic device in which multiple contact points are formed in contact with the display in the first banding area.

8. In paragraph 1, The above banding part, An electronic device comprising a connecting portion forming an inclined surface connecting the first contact portion and the second contact portion.

9. In paragraph 8, The above connection part, An electronic device in which two banding regions are formed such that a portion of the inclined surface is parallel to the contact surface of the joint.

10. In the gasket structure, A joint portion forming the body of the above gasket structure and having contact surfaces formed at both ends to be combined with a plate of an electronic device; An S-clip shaped banding portion extending from an area connecting the above two ends of the joint; A first contact portion formed to contact the back of the display of the electronic device in the first banding area of ​​the banding portion; and A gasket structure including a second contact portion formed to contact the front surface of the substrate of the electronic device in the second bending region of the above-mentioned banding portion.

Images