Connector assembly

The connector assembly with a conductive or absorptive core and isolating over-mold addresses EMI in electrical sensors, enhancing their performance and compliance with EMC standards by absorbing electromagnetic interference.

WO2025226278A1PCT designated stage Publication Date: 2025-10-30SENSATA TECHNOLOGIES INC
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Patent Information

Application Number
PCT/US2024/026660
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Filing Date
2024-04-26
Publication Date
2025-10-30

AI Technical Summary

Technical Problem

Conventional electrical sensors, particularly pressure sensors, are susceptible to electromagnetic interference (EMI) due to their connectors being electromagnetically open to the environment, leading to degraded functionality and potential interference with other system components.

Method used

A connector assembly comprising a core and an over-mold made of different materials, where the core is conductive or absorptive to reduce EMI and the over-mold provides electrical isolation, with both components optionally coated for enhanced shielding.

Benefits of technology

The solution effectively absorbs EMI, maintaining sensor functionality and reducing interference without additional components, while meeting EMC standards for automotive, industrial, and aerospace applications.

✦ Generated by Eureka AI based on patent content.

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Abstract

Embodiments included herein are directed toward a connector assembly for an electrical sensor. The connector assembly may include a core composed of a first material, where the core may be configured to protect the electrical sensor from electromagnetic interference (EMI). The connector assembly may also include an over-mold composed of a second material operatively connected to the core, where the over-mold may be configured to provide electrical isolation to one or more components included in the electrical sensor.
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Description

Connector AssemblyBackground

[0001] Electrical sensors are generally susceptible to the negative effects of electromagnetic interference or electrical disturbances. For example, pressure sensors convert pressure into an electrical signal which may be interfered with by electromagnetic energy arising from another source and passing through the path of the electrical signal, causing interference with the operation of the receptor. There have been a number of approaches taken to protect sensors from electromagnetic interference. Many of the approaches incorporate shields to encase the circuit (i.e., sealing circuits) and grounds to establish an electrically conductive path away from the sensor. Additionally, sensors may be selectively placed in locations reducing emissions and / or making the equipment less vulnerable. Many drawbacks exist in the current solutions such as requiring additional equipment, increasing manufacturing costs, and increasing the side of the sensor to list a few.Summary

[0002] In one or more embodiments of the present disclosure, a connector assembly for an electrical sensor is provided. The connector assembly may include an outer core composed of a first material, where the outer core may be configured to protect the electrical sensor from electromagnetic interference (EMI). The connector assembly may also include an inner core composed of a second material operatively connected to the outer core, where the inner core may be configured to provide electrical isolation to one or more components included in the electrical sensor.

[0003] One or more of the following features may be included. In some embodiments, the inner core may define a plurality of conical projections interconnected by a central pivot. A proximal end of the inner core may be broader than a distal end of the inner core, such that each conical projection may taper inward. Each conical projection may define a raised section configured to make the inner core flush with an outer surface ofthe outer core. The outer core may he composed of either a conductive plastic having an ohmic resistance lower than 100 Q, or an absorptive plastic that may be configured to reduce ambient electromagnetic interference (EMI). The inner core may be composed of an isolating plastic having an ohmic resistance higher than 20 k . Both the outer core and the inner core may be configured to receive one or more coatings of either a partially conductive substance or a fully conductive substance configured to provide increased electrical shielding.

[0004] In one or more embodiments of the present disclosure, an electrical sensor is provided. The electrical sensor may include a sensor body that may include one or more electrical components that may be configured to generate a signal corresponding to a measured change in a pre-determined variable. The electrical sensor may also include a connector assembly that may be operatively connected to the sensor body. The connector assembly may include a core that may be composed of a first material, where the core may be configured to protect the electrical sensor from electromagnetic interference (EMI). The connector assembly may also include an over-mold that may be composed of a second material operatively connected to the core, where the overmold may be configured to provide electrical isolation to one or more components included in the electrical sensor.

[0005] One or more of the following features may be included. In some embodiments, the core may include a first proximal end and a first distal end, and the over-mold may include a second proximal end and a second distal end, where the second distal end of the over-mold may be configured to be inserted into the first proximal end of the core. The core may define a central indentation and a plurality of channels configured to receive the over-mold. The first distal end of the core may define a plurality of clips configured to secure the core to the sensor body. The core may be composed of either a conductive plastic having an ohmic resistance lower than 100 Q, or an absorptive plastic that may be configured to reduce ambient electromagnetic interference (EMI). The over-mold may be composed of an isolating plastic that may have an ohmicresistance higher than 20 kQ. Both the core and the over-mold may be configured to receive one or more coatings of either a partially conductive substance or a fully conductive substance that may be configured to provide increased electrical shielding.

[0006] In another embodiment of the present disclosure, a manufacturing method for a connector assembly is provided. The manufacturing method may include, providing an conductive core that may be composed of a first material included in the connector assembly, where the conductive core may be configured to provide protection from electromagnetic interference (EMI). The manufacturing method may also include, providing a spring portion that may be composed of a second material that may be operatively connected to the conductive core, where the spring portion may be configured to provide electrical isolation to one or more electrical components that may be used in conjunction with the connector assembly. The manufacturing method may further include, combining the conductive core and the spring portion into one continuous structure by inserting the spring portion into the conductive core.

[0007] One or more of the following features may be included. In some embodiments, the manufacturing method may further include coating both the conductive core and the spring portion with one or more coatings of either a partially conductive substance or a fully conductive substance that may be configured to provide increased electrical shielding. The conductive core may define a central indentation and a plurality of channels that may be configured to receive a central pivot and a plurality of conical projections that may be defined by the spring portion. A proximal end of the spring portion may be broader than a distal end of the spring portion, such that each conical projection may taper inward. The conductive core may be composed of either a conductive plastic that may have an ohmic resistance lower than 100 Q or an absorptive plastic that may be configured to reduce ambient electromagnetic interference (EMI). The spring portion may be composed of an isolating plastic that may have an ohmic resistance higher than 20 k .

[0008] Additional features and advantages of embodiments of the present disclosurewill be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of embodiments of the present disclosure. The objectives and other advantages of the embodiments of the present disclosure may be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.

[0009] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of embodiments of the invention as claimed.Brief Description of the Drawings

[0010] The accompanying drawings, which are included to provide a further understanding of embodiments of the present disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the present disclosure and together with the description serve to explain the principles of embodiments of the present disclosure.

[0011] FIG. 1 is a perspective view of an electrical sensor consistent with current conventions;

[0012] FIG. 2 is a deconstructed view of a connector assembly illustrating how an overmold may be inserted into a core consistent with embodiments of the present disclosure;

[0013] FIG. 3A is a perspective view of the core from above consistent with embodiments of the present disclosure;

[0014] FIG. 3B is a perspective view of the core from below consistent with embodiments of the present disclosure;

[0015] FIG. 4A is a perspective view of the over-mold from above consistent with embodiments of the present disclosure;

[0016] FIG. 4B is a perspective view of the over-mold from below consistent with embodiments of the present disclosure;

[0017] FIG. 5 A is a perspective view of the combined core and over-mold from above consistent with embodiments of the present disclosure;

[0018] FIG. 5B is a perspective view of the combined core and over-mold from below consistent with embodiments of the present disclosure;

[0019] FIG. 5C is a plan view of the combined core and over-mold from above consistent with embodiments of the present disclosure; and

[0020] FIG. 6 is a flowchart depicting operations consistent with embodiments of the present disclosure.Detailed Description

[0021] This disclosure is directed to, at least in part, a connector for use with an electrical sensor, such as a pressure sensor. Conventionally, sensors, including pressure sensors, are multi-part assemblies made of a number of materials, including, generally, a sensing element and sensing electronics, a housing, and a connector. The connector facilitates attachment of the sensor to electronic components, such as cables, wires, harnesses, plugs, or the like. Conventionally, such connectors are made of a plastic or other non-conductive material, e.g., to reduce weight, reduce material and manufacturing cost, and / or the like. However, as a result of the materials used, the connector may often be the only portion of a sensor that is electromagnetic ally open to the environment. Accordingly, external electrical fields may readily pass through the connector and couple into the sensitive internals of the sensor. As a result, sensor functionality may become degraded under exposure to such fields.

[0022] Some conventional systems may have incorporated shielding to reduce the effects of electrical and / or electromagnetic fields. While shielding may, in some embodiments, reduce the impact of such fields on sensor components, shielding generally only reflects signals. These reflected signals may still bounce around in a larger system, potentially interfering with other components in the system. Moreover, signals at certain frequencies may lead to resonance, where the field strength increases, sometimes dramatically, relative to the external field, further exacerbating the interference.

[0023] Embodiments of this disclosure may he particularly associated with reducinginterference from external electrical and / or electromagnetic fields. For instance, embodiments of this disclosure may relate to an improved electrical sensor that may be configured to absorb electromagnetic interference (EMI). For example, embodiments of this disclosure include an improved connector and / or connector assembly. In some examples, the polymer connector may include a polymeric body entrained with an EMI absorbing material. Also in some embodiments, the polymer connector may be at least partially coated with an EMI absorbing insert. In at least some examples, the connector may absorb EMI without requiring additional components to be introduced into the sensor. Specifically, the connector may maintain the original size, shape, and / or manufacture of the pressure sensor while conferring EMI absorbing capabilities. In still further examples, a sensor according to embodiments of this disclosure may include a support made of an EMI absorbing material that may be coupled to the connector. For instance, the connector may include a conical, cylindrical portion that covers a top portion of the sensor, and an EMI-absorbing supporting ring may be provided to further absorb EMI passing through the connector.

[0024] In some embodiments, the polymer connector facilitates sensor operations. As mentioned above and described further herein, the polymer connector may be entrained with an EMI absorbing material. The polymer connector may be entrained with any EMI absorbing material including, but not limited to, carbon black (flakes), carbon nanotubes, carbon fiber, aluminum, copper, tin, nickel, and / or the like. In some embodiments, more than one EMI absorbing material may be used. In some other embodiments, selecting the EMI absorbing material may be dependent on an anticipated frequency range where a field reduction may be required. Advantageously, entraining the polymer connector with the EMI absorbing material may reduce the number of components used in the pressure sensor. For example, entraining the EMI absorbing material, which dually operates to absorb radio frequency (RF) signals, into the polymer connector may eliminate the need for a redundant and / or additional component singularly operating as an RF absorber.

[0025] In some embodiments, the polymer connector may be coated with an EMT absorbing material. The coating may be located on an outer periphery of the polymer connector. In some other embodiments, the coating may be applied to an interior surface of the polymer connector. In some embodiments, the coating may be applied to the polymer connector via dip, brush, roll, spray, spin, and / or flow coating. The coating may include the same or similar EMI absorbing materials as described above and herein. Additionally, the coating may operate similarly to the entrained polymer connector as described above and herein. The coating may cover at least a portion of the polymer connector. Without limitation, the coating may be used in conjunction with the entrained polymer connector.

[0026] In some embodiments, the polymer connector may be a molded polymer connector. For instance, the connector may be molded from a polymer entrained with the EMI absorbing material. In at least some embodiments, an EMI absorbing material may be provided as an insert, with the connector being molded over the insert. In such examples, the polymer may or may not include the EMI absorbing material entrained therein. For instance, providing both the EMI absorbing insert and the EMI absorbing material entrained in the polymer may provide additional absorption, compared to one or the other. In some embodiments, the polymer connector may be molded via extrusion, compression, blow, injection, and / or rotational molding. The mold may include the same or similar EMI absorbing materials as described above and herein. Additionally, the mold may operate similarly to the entrained polymer connector as described above and herein.

[0027] The polymer connector may further include an EMI absorbing connector sleeve. For example, the polymer connector may include an integrated conical portion that extends down from the polymer connector. The conical portion may further have disposed within it the top portion of the electrical sensor. As described herein, the sleeve may be entrained with an EMI absorbing material, include a coating, and / or include an EMI absorbing mold. The sleeve may be entrained, coated, or molded with an EMIabsorbing material similarly as described above.

[0028] Although examples of this disclosure may be described in connection with a pressure sensor, a pressure sensor may be but one example application. It should be appreciated that the EMI absorbing material and application thereof may be applied to any number and variety of sensors and EMI vulnerable equipment, components, or the like.

[0029] The example EMI absorbing pressure sensor as described herein may include numerous benefits. Some of these benefits may include improved EMI absorption, maintaining the original shape of the sensor, maintaining the original components of the sensor, increasing placement flexibility, and reducing the overall cost of the sensor. These and other benefits of the EMI absorbing pressure sensor may be apparent to those of ordinary skill in the art.

[0030] The present disclosure provides an overall understanding of the principles of the structure, function, device, and system disclosed herein. One or more examples of the present disclosure are illustrated in the accompanying drawings. Those of ordinary skill in the art will understand that the devices and / or the systems specifically described herein and illustrated in the accompanying drawings are non-limiting examples. The features illustrated or described in connection with one example may be combined with the features of other examples. Such modifications and variations are intended to be included within the scope of the appended claims.

[0031] Referring now to FIG. 1, a perspective view of electrical sensor 100 consistent with current conventions is provided. Electrical sensor 100 may be a pressure sensor coupled to a pressurized volume configured to generate a signal corresponding to a change in pressure within the pressurized volume. Electrical sensor 100 may include pressure port 102 that may be configured to facilitate the attachment of electrical sensor 100 to a pressurized vessel and to act as a base for electrical sensor 100. Electrical sensor 100 may further include support casing 104 operatively connected to pressure sensor 102. Support casing 104 may define a sidewall, an outer surface, an innersurface, a top edge, and a bottom edge. Support casing 104 may be coupled to pressure port 102 by a fastener, such as a set of clips disposed along the bottom. Electronic component 106 may be disposed within a conical housing 104 defined by the inner surface of support casing 104. Electronic component 106 may be coupled to a pressure sensing element (to sense a pressure of a coupled apparatus). For example, electronic component 104 may be configured to receive a signal from the pressure sensing element and to process and / or transmit the signal.

[0032] Support casing 104 may further include a plurality of notches located on the sidewall, proximate to the top edge. The notches may be configured to receive a second set of clips that may extend from a body of a polymer connector 108 (i.e., a polymeric body). The second set of clips may be configured to secure polymer connector 108 to support casing 104. In some embodiments, a middle edge of the body of polymer connector 108 may be selectively disposed upon the top edge of the support casing 104. In some other embodiments, a depressed surface of the body of the polymer connector 108 may be selectively disposed within the inner surface of the support casing 104. In some other embodiments, a cylindrical surface of the body of polymer connector 108 may be disposed adjacent to the outer surface of the support casing 104. In some further instances, the lower edge of polymer connector 108 may be disposed atop electronic component 106 and secure electronic component 106 within electrical sensor 100. For example, electronic component 106 may be disposed within support casing 104 and between polymer connector 108 and an internal mass. The body of polymer connector 108 may be further configured to facilitate sensor operations. For example, the body may be coupled to electronic component 106 and may further facilitate an external coupling that may allow for the electrical sensor 100 to operate and transmit data.

[0033] For instance, polymer connector 108 may include a plurality of terminal ports configured to receive a plurality of male terminals or connectors, e.g., to facilitate a wired connection of electrical sensor 100, e.g., to facilitate power and / or data transfer between (e.g., to and / or from) the pressure sensor and an external component. Althoughshown as facilitating a wired connection, in other embodiments electrical sensor 100 may be configured for wireless transmission. For example, electronic component 106 may include one or more wireless transmission components.

[0034] Currently, conventional electrical sensors such as the pressure sensor discussed above may use a metallic casting and a plastic connector (spring guide) made from only one plastic material, to provide electrical energy to the sensor and data signals from the sensor. The plastic may be used to provide suitable dielectric isolation between these signals / connections. However, these plastic parts may often be the prime path for unwanted electromagnetic signals to enter or exit the sensor, which in turn may allow external unwanted electrical fields to easily couple into the sensitive internals of a sensor, and thereby negatively impact the sensors’ ability to function accurately.

[0035] Sensors for automotive, industrial, and aerospace applications may be required to meet stringent electromagnetic compatibility (EMC) standards. However, conventional sensors, such as electrical sensor 100 may not meet the levels of electromagnetic compatibility (EMC) required for automotive, industrial, and aerospace applications. EMC is the ability of an electronic system to function correctly in its intended electromagnetic (EM) environment and not be a source of pollution into that environment. The immunity level of a sensor is the EM environment in which the equipment may operate satisfactorily, without degradation, and with a defined margin of safety. Immunity requirements cover radiated and conducted immunity and may include transient immunity such as electro-static discharge (ESD), electrical fast transient (EFT), and surge. The purpose of controlling emissions is to limit the EM energy emitted and thereby to control the EM environment in which other products operate.

[0036] Referring now to FIG. 2, a deconstructed view of connector assembly 200 consistent with embodiments of the present disclosure is provided. Connector assembly 200 may include core 204 operatively connected to over-mold 202, where core 204 may be configured to protect an electrical sensor from electromagnetic interference (EMI)and over-mold 202 may be configured to provide electrical isolation to one or more components included in the electrical sensor. Core 204 may include first proximal end 206 and first distal end 208, while over-mold 202 may include second proximal end 210 and second distal end 212, such that second distal end 212 of over-mold 202 may be configured to be removably inserted into first proximal end 206 of core 204, as illustrated in FIG. 2.

[0037] In some embodiments, core 204 and over-mold 202 may be composed of two different materials. For example, core 204 may be composed of either a conductive plastic having a low ohmic resistance (lower than 100 Q) or an absorptive plastic configured to reduce ambient electromagnetic interference (EMI), while over-mold 202 may be composed of an isolating plastic having a high ohmic resistance (higher than 20 kfi), and both core 204 and over-mold 202 may be configured to receive one or more coatings of either a partially conductive substance or a fully conductive substance that may be configured to provide increased electrical shielding.

[0038] In some embodiments, connector assembly 200 may be an injection molded connector where the electrical properties of the connector may be independently controlled. Such a design may allow for flexibility and control of the required electrical isolation between connector pins disposed within the connector. More specifically, an injection molded connector may allow for improved flexibility and control of the material’s resistivity, conductivity, and / or the dielectric constant, as well as independent control of the bulk conductivity and / or loss tangent (tan(8) / dissipation factor (Df). For example, by filling the connector with an EMI absorbing material such as carbon black or carbon nanotubes, an external electrical field may be dampened through absorption instead of simply being reflected. Through this absorption, the field strength at resonant frequencies may be significantly decreased. The field strength may also be reduced outside of the resonances, where the magnitude of the reduction may be dependent on the properties of the material.

[0039] Referring now to FIGS. 3 A and 3B, perspective views of core 300 from aboveand below consistent with embodiments of the present disclosure are presented respectively. Core 300 may include a proximal end 302 and a distal end 304. Proximal end 302 may define a central indentation 306 configured to receive and secure a mated protrusion disposed on an over-mold (see FIGS. 4A-4B). Core 300 may also include a plurality of channels 308 A, 308B, 308C extending from proximal end 302 to distal end 304. Each channel from the plurality of channels 308A, 308B, 308C may define a pair of circular openings, such that the opening defined on proximal end 302 is larger than the opening defined on distal end 304. Accordingly, each channel from the plurality of channels 308A, 308B, 308C may taper inward defining an inverted cone to account for the differing sizes of the circular openings. A conical shape for the projections is usually preferred on the customer’s interface and their specifications because the connector is a Spring Guide used for guiding external cables / springs / wires from the customer to properly connect with the sensor and the conical shape makes it easy and possible if the springs are not pointing in the correct direction to connect precisely with the sensor.

[0040] In some embodiments, each channel from the plurality of channels 308 A, 308B, 308C may define an inverted triangular-shaped opening along the sidewall of core 300 that may be configured to receive and secure a mated protrusion disposed on the overmold (see FIGS. 4A-4B). Further, core 300 may include a set of clips 310A, 310B, 310C defined along the sidewall down by distal end 304. The set of clips 310A, 310B, 310C may be configured to operatively connect the connector assembly to a support casing of an electrical sensor (see FIG.l). Central indentation 306 may be used to interconnect each channel from the plurality of channels 308 as illustrated in FIG. 3A where core 300 is viewed from above.

[0041] Referring now to FIGS. 4A and 4B, perspective views of over-mold 400 from above and below consistent with embodiments of the present disclosure are presented respectively. Over-mold 400 may include proximal end 402 and distal end 404. Proximal end 402 may define a plurality of projections 406A, 406B, 406Cinterconnected by a central pivot 408. As mentioned earlier, the core may define a central indentation and a plurality of channels configured to receive and secure central pivot 408 and plurality of projections 406A, 406B, 406C. Proximal end 402 of overmold 400 may define a pair of circular openings, such that the opening defined on proximal end 402 is larger than the opening defined on distal end 404. Accordingly, each projection from the plurality of projections 406A, 406B, 406C may taper inward defining an inverted cone to account for the differing sizes of the circular openings. Further, each projection from the plurality of projections 406 may define a raised section configured to make over-mold flush 400 with an outer surface of the core (see FIGS. 5A-5B). When inserted into the central indentation and the plurality of channels defined in the core, the plurality of projections 406A, 406B, 406C and central pivot 408 may be sized and proportioned to snap into place such that over-mold 400 may be securely connected with the core.

[0042] Referring now to FIGS. 5A, 5B, and 5C, perspective views of connector assembly 500 from above and below, and a plan view from above consistent with embodiments of the present disclosure are presented respectively. Connector assembly 500 may represent the combination of core 502 and the over-mold 504, such that the two pieces are seamlessly connected to one another. In some embodiments, when core 502 and over-mold 504 are combined the resulting structure may be identical in terms of size and dimension to polymer connector 108 discussed in FIG. 1. As such, connector assembly 500 may be substituted for polymer connector 108 and may be operatively connected with electrical sensor 100.

[0043] In some embodiments, core 502 and over-mold 504 may be composed of two different materials. More specifically, core 502 may be a conductive plastic that may require low ohmic resistance (lower than 100 ) such as polyphenylene (PPS) Durafide 2130A1 or an absorbing plastic which may help with electromagnetic compatibility (EMC) performance by protecting the sensor from radiated immunity (RI) disturbance, and over-mold 504 may be an isolating plastic such as PPS Durafide 1140A6, whichmay have high ohmic resistance (higher than 20 kQ) and provide suitable electrical isolation between the pins of the electrical sensor and thereby prevent short-circuits. Typically, the electrical resistance may be above 18.4 k and with a target of 1MQ at 9.2V. Examples of other suitable materials may include Amodel A- 1625 HS Black and Laperos A230 BK430P.

[0044] Referring now to FIG. 6 a flowchart depicting manufacturing method 600 consistent with embodiments of the present disclosure is provided. According to the flowchart manufacturing method 600 may begin by providing 602 an conductive core that may be composed of a first material included in the connector assembly, where the conductive core may be configured to provide protection from electromagnetic interference (EMI), and by providing 604 a spring portion that may be composed of a second material operatively connected to the conductive core, where the spring portion may be configured to provide electrical isolation to one or more electrical components that may be used in conjunction with the connector assembly. Manufacturing method 600 may continue by combining 606 the conductive core and the spring portion into one continuous structure by inserting the spring portion into the conductive core. Manufacturing method 600 may continue by coating 608 both the conductive core and the spring portion with one or more coatings of either a partially conductive substance or a fully conductive substance that may be configured to provide increased electrical shielding.

[0045] It will be apparent to those skilled in the art that various modifications and variations can be made in the embodiments of the present disclosure without departing from the spirit or scope of the invention. Thus, it is intended that embodiments of the present disclosure cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents.

Claims

What Is Claimed Is:

1. A connector assembly for an electrical sensor, the connector assembly comprising: an outer core composed of a first material, wherein the outer core is configured to protect the electrical sensor from electromagnetic interference (EMI); and an inner core composed of a second material operatively connected to the outer core, wherein the inner core is configured to provide electrical isolation to one or more components included in the electrical sensor.

2. The connector assembly of claim 1, wherein the inner core defines a plurality of conical projections interconnected by a central pivot.

3. The connector assembly of claim 2, wherein a proximal end of the inner core is broader than a distal end of the inner core, such that each conical projection tapers inward.

4. The electrical sensor of claim 2, wherein each conical projection defines a raised section configured to make the inner core flush with an outer surface of the outer core.

5. The connector assembly of claim 1, wherein the outer core is composed of either a conductive plastic having an ohmic resistance lower than 100 , or an absorptive plastic configured to reduce ambient electromagnetic interference (EMI).

6. The connector assembly of claim 1, wherein the inner core is composed of an isolating plastic having an ohmic resistance higher than 20 k .

7. The connector assembly of claim 1, wherein both the outer core and the inner core are configured to receive one or more coatings of either a partially conductive substance or a fully conductive substance configured to provide increased electrical shielding.

8. An electrical sensor comprising: a sensor body including one or more electrical components configured to generate a signal corresponding to a measured change in a pre-determined variable; a connector assembly operatively connected to the sensor body; a core composed of a first material included in the connector assembly, wherein the core is configured to protect the electrical sensor from electromagnetic interference (EMI); an over-mold composed of a second material operatively connected to the core, wherein the over-mold is configured to provide electrical isolation to one or more components included in the electrical sensor.

9. The electrical sensor of claim 8, wherein the core includes a first proximal end and a first distal end, and the over-mold includes a second proximal end and a second distal end, and wherein the second distal end of the over-mold is configured to be inserted into the first proximal end of the core.

10. The electrical sensor of claim 9, wherein the core defines a central indentation and a plurality of channels configured to receive the over-mold.

11. The electrical sensor of claim 8, wherein the first distal end of the core defines a plurality of clips configured to secure the core to the sensor body.

12. The electrical sensor of claim 8, wherein the core is composed of either a conductive plastic having an ohmic resistance lower than 100 Q, or an absorptive plastic configured to reduce ambient electromagnetic interference (EMI).

13. The electrical sensor of claim 8, wherein the over-mold is composed of an isolating plastic having an ohmic resistance higher than 20 kQ.

14. The electrical sensor of claim 8, wherein both the core and the over-mold are configured to receive one or more coatings of either a partially conductive substance or a fully conductive substance configured to provide increased electrical shielding.

15. A manufacturing method for a connector assembly, the method comprising: providing an conductive core composed of a first material included in the connector assembly, wherein the conductive core is configured to provide protection from electromagnetic interference (EMI); providing a spring portion composed of a second material operatively connected to the conductive core, wherein the spring portion is configured to provide electrical isolation to one or more electrical components used in conjunction with the connector assembly; and combining the conductive core and the spring portion into one continuous structure by inserting the spring portion into the conductive core.

16. The manufacturing method of claim 15, further including: coating both the conductive core and the spring portion with one or more coatings of either a partially conductive substance or a fully conductive substance configured to provide increased electrical shielding.

17. The manufacturing method of claim 15, wherein the conductive core defines a central indentation and a plurality of channels configured to receive a central pivot and a plurality of conical projections defined by the spring portion.

18. The manufacturing method of claim 15, wherein a proximal end of the spring portion is broader than a distal end of the spring portion, such that each conical projection tapers inward.

19. The manufacturing method of claim 15, wherein the conductive core is composed of either a conductive plastic having an ohmic resistance lower than 100 , or an absorptive plastic configured to reduce ambient electromagnetic interference (EMI).

20. The manufacturing method of claim 15, wherein the spring portion is composed of an isolating plastic having an ohmic resistance higher than 20 kQ.

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