System for reclaiming heat rejected from data centers

The heat transfer system recaptures kinetic and thermal energy from data center exhaust air using a multi-sided heat exchanger with fans and turbines, addressing inefficient waste heat recovery in data centers and enhancing energy efficiency and PUE.

WO2025226378A1PCT designated stage Publication Date: 2025-10-30VERTIV CORP
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Patent Information

Application Number
PCT/US2025/021371
Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-04-22
Filing Date
2025-03-25
Publication Date
2025-10-30

AI Technical Summary

Technical Problem

Existing data center cooling systems waste low-quality waste heat due to inefficient energy recovery, requiring significant energy input, which hampers Power Usage Effectiveness (PUE).

Method used

A heat transfer system that captures both kinetic and thermal energy from data center exhaust air using a multi-sided, geometrically designed heat exchanger system with fans and turbines, leveraging buoyancy forces to drive energy recovery without additional energy input.

Benefits of technology

Enhances energy recovery efficiency by converting waste heat into usable energy, reducing the load on alternative heat sources and improving PUE, while maintaining or reducing the cooling system footprint.

✦ Generated by Eureka AI based on patent content.

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Abstract

A heat transfer system for collecting heat rejected from a heat source is disclosed. The system includes: a first set of heat rejection units arranged adjacent to each other and configured to direct heated air toward a center. The heated air from the heat source flows upward from the center. Each of the first set of heat rejection units includes a housing, a heat exchanger, and a fan arranged facing toward the center of the system and configured to direct the heated air toward the center.
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Description

SYSTEM AND METHOD FOR RECLAIMING HEAT REJECTED FROM DATA CENTERS CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of priority to U.S. Provisional Application Ser. No. 63 / 636,980, entitled “SYSTEM AND METHOD FOR RECLAIMING HEAT REJECTED FROM DATA CENTERS,” filed April 22, 2024, and which is herein incorporated by reference in its entirety. TECHNICAL FIELD

[0002] The present disclosure relates to heat exchangers, and more specifically, to high-density heat exchanger systems and methods for reclaiming heat rejected from a heat source. BACKGROUND

[0003] Buildings or facilities housing numerous electronic devices tend to consume substantial amounts of electrical power. These devices inherently generate heat, which must be effectively managed to prevent failure. Data centers, in particular, are major consumers of energy, much of which is wasted as heat released into the atmosphere. This waste heat is typically rejected at low temperatures using a cooling medium, resulting in energy degradation that makes it challenging to recover and utilize efficiently for other purposes.

[0004] Electronic devices, such as data centers, can be cooled through various methods, typically rejecting waste heat to the ambient air or cooling water without reusing the low- quality waste heat. For example, FIG. 1 illustrates a condenser system 100 for data centers, installed on a rooftop, which transfers heat to the atmosphere via fans, thereby wasting the energy generated by the heat. Many data center operators are seeking ways to recover some of this wasted energy, but this is challenging due to the low quality of the waste heat. Existing technologies for waste energy recovery often require significant energy input, making them less efficient.Docket No. LIE-THM-24-101.US.WO

[0005] In light of these challenges, there is a need for an improvement that captures waste energy for reuse without requiring a high energy input relative to the energy recovered, thereby enhancing power usage effectiveness (PUE). SUMMARY

[0006] Embodiments described herein relate to techniques for recovering energy from waste heat generated by heat rejection devices. Specifically, the systems and methods of the present disclosure are applicable to rooftop cooling systems for data centers and other large buildings, as an example. In these systems, a working fluid (e.g., refrigerant) is compressed by a compressor and transferred to a condenser. The compressed vaporized fluid is then cooled, with the help of a fan, to reject heat through a heat rejection unit. The low-pressure working fluid is partially evaporated at low temperatures and used to cool the air, which in turn cools the data centers. Cooling systems of this nature can reject substantial amounts of heat. For instance, each fan of a large heat rejection unit moving 15-20 kCFM of hot air can provide a significant energy resource, and many data centers utilize thousands of these units.

[0007] The heat rejection devices of the present disclosure use fans to drive cold air through a heat exchanger, extracting heat from the fluid within. The result is that the heat rejection device exhausts air that is hotter than the ambient, usually with some imparted velocity. When the hot air mixes with the cooler ambient air, a buoyancy force is generated, further increasing the upward velocity of the exhausted air. The present disclosure includes methods for recapturing energy from this buoyancy force. While this method can be applied to a single heat rejection unit, the disclosure further discusses configurations of multiple heat rejection units to maximize the buoyancy force and improve energy recovery potential.

[0008] Additionally, waste heat from data centers can be combined with other heat sources, thereby reducing the load on alternative heat sources and improving overall system efficiency. For example, waste heat from data centers may be used to augment heat from solar panels, fuel cell exhaust, combined cycle plants, or other sources, or it may be integrated with the waste heat from other processes.

[0009] The present disclosure also leverages existing rooftop footprints for data center cooling, either maintaining the same cooling effect with a reduced footprint or utilizing the available space to achieve higher cooling effectiveness.Docket No. LIE-THM-24-101.US.WO

[0010] In accordance with an embodiment of the present disclosure, a heat transfer system for collecting heat rejected from a heat source includes: a first set of heat rejection units arranged adjacent to each other and configured to direct heated air toward a center. Heated air from the heat source flows upward through the center. Each of the first set of heat rejection units includes: a housing, a heat exchanger, and a fan arranged facing toward the center of the system to direct the heated air toward the center.

[0011] In some embodiments, the first set of heat rejection units is circumferentially arranged, and a diameter of the internal space varies based on a target energy amount. A number of heat rejection units may also vary based on the target energy amount. In some embodiments, the system further includes a cylindrical frame configured to connect and secure the first set of heat rejection units therein. The heat exchanger may include a fluid flowing therein. Each fan may be disposed to face toward the center to laterally direct the heated air toward the center.

[0012] In some embodiments, the system further includes a second set of heat rejection units arranged adjacent to each other in a closed loop. The second set of heat rejection units is configured to be vertically stacked on the first set of heat rejection units. The system may further include a third set of heat rejection units arranged adjacent to each other in a closed loop and configured to be vertically stacked on the second set of heat rejection units. Internal spaces of the first, second, and third sets of heat rejection units correspond to each other, toward the center of which the fan is configured to blow the heated air.

[0013] In accordance with another embodiment of the present disclosure, a heat transfer system for reclaiming heat rejected from a heat source may include: a first set of heat rejection units arranged adjacent to each other and configured to direct heated air toward a center. Each of the first set of heat rejection units includes: a housing, a heat exchanger, and a fan arranged facing toward the center of the system and configured to direct the heated air toward the center. The system may further include an energy reclaiming device configured to receive the heated air and convert to an energy source.

[0014] In some embodiments, the energy collecting unit includes a turbine fan or rotor disposed at an upper portion of the system. The system may further include a fan ring surrounding the turbine fan and configured to guide the heated air to flow upwardly. The energy collecting unit may include a motor generator disposed at a lower portion of the system. The motor generator includes a rotor configured to rotate by rotation of the turbine fan.

[0015] In some embodiments, the system may further include a support disposed at a lower portion of the system, wherein the support is configured to support the system to be spaced apart from the heat source and the motor generator. The first set of heat rejection units isDocket No. LIE-THM-24-101.US.WO circumferentially arranged, and a diameter of the internal space varies based on a target energy amount. A number of heat rejection units may also vary based on the target energy amount. The system may further include a cylindrical frame configured to connect and secure the first set of heat rejection units therein. Each fan is disposed to face toward the center to laterally direct the heated air toward the center.

[0016] In some embodiments, the system may further include a second set of heat rejection units arranged adjacent to each other in a closed loop. The second set of heat rejection units is configured to be vertically stacked on the first set of heat rejection units. The system may further include a third set of heat rejection units arranged adjacent to each other in a closed loop and configured to be vertically stacked on the second set of heat rejection units. Internal spaces of the first, second, and third sets of heat rejection units correspond to each other, toward the center of which the fan is configured to blow the heated air.

[0017] In accordance with another embodiment of the present disclosure, a heat transfer system arrangement may be disclosed. The arrangement may include a plurality of stacked first, second, and third sets spaced apart from each other.

[0018] Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The disclosure will be readily understood by the following detailed description in conjunction with the accompanying drawings, wherein like reference numerals designate like elements:

[0020] FIG. 1 shows a condenser system according to the related art;

[0021] FIG. 2 shows a perspective view of a heat rejection unit for reclaiming rejected heat from data centers according to one exemplary embodiment of the present disclosure;

[0022] FIG. 3 shows a perspective view of a system for reclaiming rejected heat from data centers according to one exemplary embodiment of the present disclosure;

[0023] FIGS. 4A–4C show perspective, front, and top views of stacked systems with a stand for transferring heat from data centers;

[0024] FIGS. 5A and 5B show a mesh scaling of the system according to various exemplary embodiments of the present disclosure;Docket No. LIE-THM-24-101.US.WO

[0025] FIGS. 5A and 5A show a flow field of the system;

[0026] FIG. 6 shows a face velocity at a hypothetical rotor plane of the system according to exemplary embodiments of the present disclosure;

[0027] FIG. 7 shows a top view of the system connected to an energy-receiving component according to exemplary embodiments of the present disclosure; and

[0028] FIG. 8 shows a side view of the system connected to an energy-receiving component according to exemplary embodiments of the present disclosure.

[0029] FIG. 9 shows a plane view of arrangement of heat exchanger systems according to the related art disposed on a rooftop of a data center; and

[0030] FIG. 10 shows a plane view of arrangement of heat rejection systems for transferring heat from a heat source according to various embodiments disposed on a rooftop of a data center. DETAILED DESCRIPTION

[0031] The figures described above and the written description of specific structures and functions below are not presented to limit the scope of what Applicants have invented or the scope of the appended claims. Rather, the Figures and written description are provided to teach any person skilled in the art to make and use the inventions for which patent protection is sought. Those skilled in the art will appreciate that not all features of a commercial embodiment of the inventions are described or shown for the sake of clarity and understanding. Persons of skill in this art will also appreciate that the development of an actual commercial embodiment incorporating aspects of the present inventions will require numerous implementation-specific decisions to achieve the developer’s goal for the commercial embodiment. Such implementation-specific decisions may include and likely are not limited to, compliance with system-related, business-related, government-related, and other constraints, which may vary by specific implementation, location, and from time to time. While a developer’s efforts might be complex and time-consuming in an absolute sense, such efforts would be, nevertheless, a routine undertaking for those of skill in this art having the benefit of this disclosure. It must be understood that the inventions disclosed and taught herein are susceptible to numerous and various modifications and alternative forms.

[0032] The use of a singular term, such as, but not limited to, “a,” is not intended as limiting of the number of items. The use of relational terms, such as, but not limited to, “top,” “bottom,”Docket No. LIE-THM-24-101.US.WO “left,” “right,” “upper,” “lower,” “down,” “up,” “side,” and the like are used in the written description for clarity in specific reference to the Figures and are not intended to limit the scope of the inventions or the appended claims. The terms “including” and “such as” are for illustrative purposes but not limited thereto. The terms “couple,” “coupled,” “coupling,” “coupler,” and like terms are used broadly herein and can include any method or device for securing, binding, bonding, fastening, attaching, joining, inserting therein, forming thereon or therein, communicating, or otherwise associating, for example, mechanically, magnetically, electrically, chemically, operably, directly or indirectly with intermediate elements, one or more pieces of members together and can further include without limitation integrally forming one functional member with another in a unity fashion. The coupling can occur in any direction, including rotationally. Further, all parts and components of the disclosure that are capable of being physically embodied inherently include imaginary and real characteristics regardless of whether such characteristics are expressly described herein, including but not limited to characteristics such as axes, ends, inner and outer surfaces, interior spaces, tops, bottoms, sides, boundaries, dimensions (e.g., height, length, width, thickness), mass, weight, volume, and density, among others.

[0033] Data centers and the various types of equipment housed within them are well-known in the art. It is also widely understood that data center equipment generates substantial amounts of heat, which must be managed through various means to ensure the proper functioning of the equipment. While it is not feasible to provide an exhaustive list of every type of equipment that might be present in a data center, the term "data center equipment" as used herein refers to any heat-generating component typically found in a protected environment within a data center or similar facility used for housing computer systems, electronics, or controls. Such data center equipment generally includes, but is not limited to, computer systems, electronics, data storage systems, communications equipment, networking equipment, information technology components, and parts thereof, such as servers, processors, motherboards, graphics cards, memory devices, data storage devices, modems, and any other equipment or component currently or prospectively used in the field.

[0034] The present disclosure relates to systems and methods for reclaiming waste heat energy, providing energy-efficient, space-saving, and high-density cooling configurations. These systems and methods are capable of capturing wasted energy (e.g., heat) at the point of heat rejection to the ambient environment. Specifically, the heat generated by the various components typically found in data centers—such as computer systems, electronics, telecommunications equipment, data storage systems, racks, cabinets, and other associatedDocket No. LIE-THM-24-101.US.WO equipment—is captured and utilized. The energy at the heat rejection units (e.g., condensers) exists in two forms: kinetic and thermal. While kinetic energy is more easily reclaimed, the thermal energy from the high-temperature rejected air, being buoyant relative to the ambient air, generates a buoyant acceleration that provides "free energy" to drive a reclaiming device, such as a turbine or rotor. By capturing both forms of energy, overall system efficiency is improved, leading to a reduction in data center Power Usage Effectiveness (PUE).

[0035] High temperatures resulting from the high power consumption of data center servers generate a buoyancy effect and natural convection near the heat rejection devices. This natural convection can be enhanced by mechanical cooling systems and components, such as fans, which are deployed efficiently. The buoyancy effect aids in driving airflow through condensers even when the fans are not in operation, thereby reducing energy consumption. The structural design of this system leverages the space-saving characteristics of multi-sided and geometric shapes. Additionally, the design allows for an increase in cooling capacity by vertically stacking the systems without the need to expand the installation area or footprint on the data center building rooftop.

[0036] The closed-loop modular systems of various embodiments of the present disclosure may incorporate one or more heat rejection units. Each unit may have the same or varying shapes, which can define the overall dimensions of the system and its installation footprint. Based on the required cooling effects, the number, size, and arrangement of these units can vary. This flexibility enables cost-effective, customizable data center cooling solutions tailored to specific customer needs.

[0037] For example, multiple stackable fluid-to-air rejection units (e.g., heat exchangers, condensers, etc.) may be arranged in a ring pattern to form a cylinder or silo. Each rejection unit can be oriented to direct airflow inward, creating a wind tunnel with upward flow due to the location of the exit and the heat transfer from the hot fluid to the air. The resulting low- pressure airflow generates lift, which can drive a fan or turbine at the air exit. This turbine may be connected by a shaft to a generator or other mechanical conversion device, enabling the system to power a generator or operate a water lift pump, thereby providing high-quality energy benefits from the recovered heat.

[0038] FIG. 2 shows a perspective view of a heat rejection unit for reclaiming rejected heat from data centers according to exemplary embodiments of the present disclosure. FIG.3 shows a perspective view of a system for reclaiming rejected heat from data centers according to exemplary embodiments of the present disclosure. FIGS. 4A–4C show perspective, front, and top views of stacked systems for transferring heat from data centers.Docket No. LIE-THM-24-101.US.WO

[0039] FIG. 2 illustrates a heat rejection unit 200 according to various embodiments of the present disclosure. The term "heat rejection unit" may refer to components such as a "condenser," "chiller," or "heat exchanger," which are commonly used in heating, ventilation, and air conditioning (HVAC) technology. In some embodiments, the heat rejection unit 200 comprises a housing 201 with a first panel 210 and a second panel 220. The first and second panels 210, 220 may be rectangular, as shown, though their shape is not limited to rectangles and could include other geometric forms such as triangles, circles, pentagons, hexagons, parallelograms, or other shapes. The housing 201 may also include third and fourth panels 230, 240, which may be triangular, but other shapes (e.g., isosceles, equilateral, scalene, obtuse, acute, right triangles, or even non-triangular shapes such as pentagons or hexagons) are also within the scope of the present disclosure. In some embodiments, the third and fourth panels 230, 240 may be similarly shaped and positioned to face each other in parallel.

[0040] In certain embodiments, the housing 201 further includes a fifth panel 250, on which a fan 260 is mounted. As illustrated in FIG. 2, the fifth panel 250 is located at the top portion of the heat rejection unit 200. The edges of the first through fifth panels 210, 220, 230, 240, 250 are connected to form a prism-like shape, though the housing 201 is not limited to a prism and can be adapted to other 3D shapes. The length and dimensions of each panel may vary based on factors such as the cooling capacity requirements, the size of the heat source building, and the size of the fan 260. Additionally, the number of panels forming the housing 201 is not restricted to five; in other embodiments, the housing 201 may consist of one, two, three, or more panels.

[0041] In some embodiments, the heat rejection unit 200 includes a pair of coils 212, 222, disposed on the first and second panels 210, 220, respectively. These coils may serve as condenser coils, through which a fluid flows during the heat exchange cycle. The coils 212, 222 may be arranged in a V-shape facing each other, though other configurations, such as parallel arrangements, are also possible. The heat rejection unit 200 may further include removable coil guards 270, 290 on the first and second panels 210, 220 to protect the coils 212, 222. The term "coils" is used interchangeably with "heat exchangers."

[0042] In various embodiments, the fluid passing through the coils 212, 222 may be a refrigerant used in an air conditioning system. The coils 212, 222 are in fluid communication with a compressor located inside the data center building. The compressor pressurizes and sends the refrigerant in a heated vapor form, which is then cooled by the coils 212, 222 with the assistance of fans 260, causing the vapor to condense into a liquid. The liquid refrigerant is then returned to the interior of the data center building. Suitable refrigerants for this processDocket No. LIE-THM-24-101.US.WO include, but are not limited to, R22, R410A, R407C, R744, R134a, R1234yf, R290, R600a, R718, R454B, and others.

[0043] FIG. 3 illustrates a system 300 featuring multiple heat rejection units 200 arranged in a closed loop configuration. While the figure depicts a circumferential arrangement, the heat rejection units 200 may also be arranged in other shapes, such as elliptical, rectangular, irregular, or other geometric configurations. In some embodiments, the fifth panel 250 may be oriented toward the center of the arrangement to direct airflow inward. The system 300 may completely form the perimeter of the loop, or alternatively, a wall may be used to complete the loop. Additionally, the system 300 may adopt an open-loop configuration, which could include one, two, or more heat rejection units 200, depending on specific requirements.

[0044] In various embodiments, the system 300 can be stacked vertically, as described below. FIGS. 4A–4C illustrate a structure 400 in which one or more systems 300 are stacked on top of each other, with their internal spaces aligned. The number of stacked systems is not limited to the examples shown (e.g., one, four, or twelve), but can vary depending on factors such as the dimensions of the data center building, required cooling capacity, available power, and other design considerations.

[0045] FIGS. 5A and 5B further illustrate the heat variation within the system 300 and the structure 400. As previously described, the highest temperature is concentrated near the heat source (e.g., closer to the data center), and is further focused toward the center by the multiple fans, with the heat rising due to the buoyancy effect. The system 300 and structure 400 are designed to concentrate the pressure at the lower portion where the heated air is transferred from the heat source (e.g., data center or data center building). As the heated air rises toward the exit or outlet, its temperature decreases with the assistance of the fans, leading to a pressure drop as the air travels upward. For example, in a data center (e.g., near a data rack), heated air accumulates in the hot aisle, and the hot airflow is driven from the aisle through buoyancy or active cooling devices, such as the condenser and the fan.

[0046] FIG. 6 provides a top view of FIG. 5A. The shading in the diagram follows a gradient, where darker shading corresponds to lower temperatures, and lighter shading corresponds to higher temperatures, as indicated by the accompanying temperature scale. Lighter shading is concentrated near the fans 260, with the shading becoming progressively lighter toward the center, where the higher temperatures are concentrated. FIG. 6 also shows that the higher the temperature, the higher the airflow velocity toward the center.

[0047] In various embodiments, the system 300 and structure 400 may also include a frame that connects and secures each element in place. Referring to FIGS. 7 and 8, a system 800 forDocket No. LIE-THM-24-101.US.WO reclaiming heat rejected from a heat source may include the stacked systems 300 or structure 400 arranged circumferentially, with an internal space 810 formed at the center. In some embodiments, the system 800 may include a protective shroud 820 and a turbine fan 830. The protective shroud 820 supports the system 300 or structure 400 and contains the heated air inside the system 800, while cold air from the outside enters the system 800. The fans 260 draw heated air traveling from the heat source toward the center of the internal space 810, as represented by arrow 840. Cold air from outside enters the system 800 and is distributed to each heat rejection unit 200, as shown by arrow 850.

[0048] The system 800 may further include a fan ring 910, a motor / generator 920, and a support structure 930. The fan ring 910 not only supports the turbine fan 830 but also collects the rejected heat exiting the system 800. The turbine fan 830 and motor / generator 920 function as an energy reclaiming unit. More specifically, the turbine fan 830 rotates due to the energy concentrated within the system 800 (e.g., the pressure created by the heated air), which in turn drives the motor / generator 920 to collect energy. The collected energy can be used for various purposes, such as storing energy in a battery or using it to power the data center cooling system. The support structure 930 ensures adequate spacing for the installation of the system 800 and the motor / generator 920.

[0049] The innermost and outermost diameters of the system 800 may vary depending on the desired system capacity and the specific heat rejection units used. The height of the system 800 can also vary based on the number of units in the stacked system 300 and the height of the individual units. The number of stacked systems is not limited to one, four, or twelve, as depicted in the figures, but can vary based on considerations such as the size of the data center building, required cooling capacity, available power, and other factors.

[0050] FIG. 9 illustrates a plan view of an arrangement 900 of heat transfer systems according to the related art, positioned on the rooftop of a data center. FIG. 10 shows a plan view of an arrangement 1000 of systems for reclaiming rejected heat from data centers according to various embodiments, also disposed on a rooftop of a data center. In FIG. 9, due to the positioning of the fan facing upward, only a single heat rejection unit can be placed in the same area, forming a two-dimensional array of heat transfer systems. Specifically, one heat rejection unit can be installed in area 901, while multiple heat rejection units can be installed in area 1001 by vertically stacking them. Additionally, because the heat rejection unit in the related art uses a single fan, a larger fan is required to achieve the desired cooling capacity. In contrast, the heat rejection units of the present disclosure, which may incorporate multiple fans, allow for a more compact design. As a result, the installation area or footprint can be significantlyDocket No. LIE-THM-24-101.US.WO reduced, enabling the installation of a greater number of heat rejection units, which can further increase the overall cooling capacity of the system.

[0051] Process flowcharts discussed herein illustrate the operation of possible implementations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart may represent a module, segment, or portion of code, which comprises one or more executable instructions for implementing the specified logical function(s). It should also be noted that, in some alternative implementations, the functions noted in the blocks might occur out of the order depicted in the figures. For example, blocks shown in succession may be executed substantially concurrently. It will also be noted that each block of flowchart illustration can be implemented by special-purpose hardware-based systems that perform the specified functions or acts, or combinations of special purpose hardware and computer instructions.

[0052] The foregoing description, for purposes of explanation, used specific nomenclature to provide a thorough understanding of the described embodiments. However, it will be apparent to one skilled in the art that the specific details are not required in order to practice the described embodiments. Thus, the foregoing descriptions of the specific embodiments described herein are presented for purposes of illustration and description. They are not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. It will be apparent to one of ordinary skill in the art that many modifications and variations are possible in view of the above teachings.

Claims

Docket No. LIE-THM-24-101.US.WO What is claimed is:

1. A heat transfer system for collecting heat rejected from a heat source, the system comprising: a first set of heat rejection units arranged adjacent to each other and configured to direct heated air toward a center, wherein the heated air from the heat source flows upward from the center, and wherein each of the first set of heat rejection units comprises: a housing; a heat exchanger; and a fan arranged to face toward the center of the system and configured to direct the heated air toward the center.

2. The system of claim 1, wherein the first set of heat rejection units is circumferentially arranged, and wherein a diameter of the internal space varies based on a target energy amount.

3. The system of claim 1, wherein a number of heat rejection units varies based on a target energy amount.

4. The system of claim 1, further comprising a cylindrical frame configured to connect and secure the first set of heat rejection units inside the cylindrical frame.

5. The system of claim 1, wherein the heat exchanger includes a fluid flowing inside the heat exchanger.

6. The system of claim 1, wherein each fan is disposed to face toward the center and configured to laterally direct the heated air toward the center.

7. The system of claim 1, further comprising a second set of heat rejection units arranged adjacent to each other, wherein the second set of heat rejection units is configured to be vertically stacked on the first set of heat rejection units.Docket No. LIE-THM-24-101.US.WO 8. The system of claim 7, further comprising a third set of heat rejection units arranged adjacent to each other and configured to be vertically stacked on the second set of heat rejection units, wherein internal spaces of the first, second, and third sets of heat rejection units correspond to each other, toward the center of which the fan is configured to blow the heated air.

9. A heat transfer system for reclaiming heat rejected from a heat source, the system comprising: a first set of heat rejection units arranged adjacent to each other and configured to direct heated air toward a center, wherein the heated air from the heat source flows upward from the center, and wherein each of the first set of heat rejection units comprises: a housing; and a heat exchanger; and a fan arranged to face toward the center of the system and configured to direct the heated air toward the center; and an energy reclaiming device configured to receive the heated air and convert to an energy source.

10. The system of claim 9, wherein the energy collecting unit comprises a turbine fan disposed at an upper portion of the system.

11. The system of claim 10, further comprising a fan ring surrounding the turbine fan and configured to guide the heated air to flow upwardly.

12. The system of claim 9, wherein the energy collecting unit comprises a motor generator disposed at a lower portion of the system, and wherein the motor generator comprises a rotor configured to rotate by rotation of the turbine fan.

13. The system of claim 12, further comprising a support disposed a lower portion of the system, wherein the support is configured to support the system and the motor generator.Docket No. LIE-THM-24-101.US.WO 14. The system of claim 9, wherein the first set of heat rejection units is circumferentially arranged, and wherein a diameter of the internal space varies based on a target energy amount.

15. The system of claim 9, wherein a number of heat rejection units varies based on a target energy amount.

16. The system of claim 9, further comprising a cylindrical frame configured to connect and secure the first set of heat rejection units inside the cylindrical frame.

17. The system of claim 9, wherein each fan is disposed to face toward the center and configured to laterally direct the heated air toward the center.

18. The system of claim 9, further comprising a second set of heat rejection units arranged adjacent to each other in a closed loop, wherein the second set of heat rejection units is configured to be vertically stacked on the first set of heat rejection units.

19. The system of claim 18, further comprising a third set of heat rejection units arranged adjacent to each other and configured to be vertically stacked on the second set of heat rejection units, wherein internal spaces of the first, second, and third sets of heat rejection units correspond to each other, toward the center of which the fan is configured to blow the heated air.

20. A heat transfer system arrangement having the heat transfer system of claim 19, the arrangement comprises a plurality of stacked first, second, and third sets spaced apart from each other.

Citation Information

Patent Citations

  • Cooling assembly and method for installation thereof

    CA3039419A1

  • Heat exchanger assembly

    CA3039435A1

  • Container fitted in a technical infrastructure

    US20140160672A1

  • System and method for data center heat containment

    US20190110378A1