Electronic device and vehicle

Abstract

A vehicle comprises an electronic device, wherein the electronic device comprises a copper busbar, a first circuit board and a current sensor, the first circuit board being perpendicular to the copper busbar, the first circuit board being partially located in the copper busbar, and the current sensor being arranged on the first circuit board and being at least partially located in the copper busbar.

Description

Electronic device and vehicle

[0001] The present application claims priority to the Chinese patent application No. 202410662842.7, filed on May 24, 2024, and entitled "Electronic device and vehicle", the content of which is incorporated herein by reference in its entirety. TECHNICAL FIELD

[0002] The present application relates to the technical field of vehicle, in particular to an electronic device and a vehicle. BACKGROUND

[0003] At present, the electronic device includes a circuit board, a current sensor and a copper bar arranged on the circuit board, the circuit board and the copper bar are arranged in parallel, U-shaped grooves are formed on both sides of the copper bar, a neck portion is formed in the middle of the copper bar, and the current sensor is installed above the neck portion.

[0004] The structure has a high requirement on the distance between the copper bar and the current sensor in the Z-axis direction (a direction perpendicular to the circuit board, and the direction perpendicular to the circuit board here refers to a direction perpendicular to the large plane of the circuit board), and there is a machining error in actual machining, which leads to a serious inconsistency between the actual sampling range and the theoretical sampling range of the current sensor.

[0005] Therefore, it is necessary to make improvements to at least partially solve the above problems. TECHNICAL PROBLEM

[0006] The actual sampling range of the current sensor is seriously inconsistent with the theoretical sampling range. TECHNICAL SOLUTION

[0007] A series of concepts in simplified form are introduced in the summary section of the application, which will be further described in detail in the detailed description section. The summary section of the present application does not mean to attempt to limit the key features and essential technical features of the claimed technical solution, nor to determine the protection scope of the claimed technical solution.

[0008] In order to at least partially solve the above problems, according to a first aspect of the present application, an electronic device is provided, which comprises:

[0009] A copper bar, wherein a through hole is arranged on the copper bar;

[0010] A first circuit board, wherein the first circuit board is perpendicular to the copper bar, and the first circuit board is partially located in the through hole;

[0011] A current sensor, wherein the current sensor is arranged on the first circuit board and at least partially located in the through hole.

[0012] In some embodiments of the present application, the electronic device further comprises a package, the package covering the current sensor, part of the first circuit board and part of the copper bar at the through hole so as to fixedly connect the first circuit board and the copper bar.

[0013] In some embodiments of the present application, the package comprises an injection shell and a potting glue located in the injection shell, wherein the potting glue covers the current sensor, the first end of the first circuit board and part of the copper bar at the through hole.

[0014] In some embodiments of the present application, the electronic device further comprises a second circuit board, the second circuit board being perpendicular to the first circuit board, and the first circuit board being electrically connected to the second circuit board.

[0015] In some embodiments of the present application, the first circuit board has a plurality of protrusions arranged at intervals, at least one side of the protrusion having a solder pad;

[0016] The second circuit board is provided with a plurality of vias corresponding to the plurality of protrusions;

[0017] The plurality of protrusions are respectively inserted into the plurality of vias, and the solder pad is welded to the second circuit board.

[0018] In some embodiments of the present application, the length of the solder pad is greater than the thickness of the second circuit board;

[0019] Both sides of the second circuit board are provided with solder rings surrounding the vias.

[0020] In some embodiments of the present application, the distance between adjacent protrusions is greater than 8 mil;

[0021] The distance between adjacent solder rings is greater than 8 mil.

[0022] In some embodiments of the present application, the center distance between adjacent protrusions is indefinite; and / or,

[0023] The width of the plurality of protrusions is indefinite.

[0024] In some embodiments of the present application, the protrusion has at least three.

[0025] In some embodiments of the present application, the electronic device is a motor controller, the second circuit board is configured as a control board, and the area of the first circuit board is smaller than the area of the control board.

[0026] According to a second aspect of the present application, a vehicle is provided, comprising the electronic device as described above. Advantages

[0027] According to the electronic device and the vehicle, by arranging the through hole on the copper bar, the first circuit board connected with the current sensor is vertically extended into the through hole, the sensitivity of the current sensor in the Z-axis direction can be significantly reduced, and the consistency of the current sampling range is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0028] The following drawings for this application are hereby incorporated into this application as part of this application for understanding this application. The embodiments of this application and the description thereof shown in the drawings are used to explain the devices and principles of this application. In the drawings,

[0029] Fig. 1 is a perspective view of an electronic device according to an embodiment of the present application, wherein the packaging is not shown;

[0030] Fig. 2 is a front view of the electronic device in Fig. 1;

[0031] Fig. 3 is a top view of the copper bar in Fig. 1;

[0032] Fig. 4 is a front view of the electronic device according to an embodiment of the present application, wherein the packaging is shown;

[0033] Fig. 5 is a structural view of the first side of the first circuit board in Fig. 1;

[0034] Fig. 6 is a structural view of the second side of the first circuit board in Fig. 1;

[0035] Fig. 7 is a structural view of the via on the second circuit board in Fig. 1;

[0036] Fig. 8 is a module view of a vehicle provided by an embodiment of the present application.

[0037] Reference signs: 1000-vehicle, 1100-electronic device, 100-copper bar, 110-through hole, 200-first circuit board, 210-extended part, 211-solder pad, 300-current sensor, 400-packaging, 500-second circuit board, 510-via, 520-solder ring.

[0038] Embodiments of the present application

[0039] In the following description, a large number of specific details are given in order to provide a more thorough understanding of the present application. However, it is obvious to those skilled in the art that the present application can be implemented without one or more of these details. In other cases, in order to avoid obscuring the present application, some technical features known in the art are not described.

[0040] It is to be understood that the application can assume various alternative embodiments, and that no limitation of the scope of the present application is intended by the description or illustration. Further, it should be understood that the description and accompanying drawings are not limited in scope so as to encompass any conceivable embodiments of the application. In other words, it is contemplated that the application will cover any and all adaptations or variations of various embodiments and implementations described. It is intended that these embodiments are presented by way of example only, and that numerous changes in form and detail can be made. The various embodiments, however, make specific reference to a computer device that is adapted according to one embodiment of the present application. As such, like reference numerals will be used to describe similar elements throughout the several embodiments.

[0041] It should be understood that although the terms first, second, third, etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the present application.

[0042] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.

[0043] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising", when used in this specification, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0044] The embodiments of the application can be described, for example, with reference to the accompanying drawings that illustrate various examples of the application. In the drawings, like numbers refer to like elements throughout. The embodiments of the application, however, can assume various alternative shapes and need not be limited to the specific embodiments illustrated herein. Thus, the embodiments of the application should not be limited to the specific shapes and arrangements of parts shown in the drawings, but should be understood to include any shapes and arrangements of parts thereof that are within the scope of the application.

[0045] An electronic device according to an embodiment of the present application is exemplarily described with reference to FIGS. 1-7. The electronic device 1100 includes a copper bar 100, a first circuit board 200, and a current sensor 300.

[0046] Referring to FIG. 1, the copper bar 100 is provided with a through hole 110, and the current sensor 300 is arranged in the through hole 110 to detect the current on the copper bar 100. The design of the opening of the copper bar 100 can reduce the cost of the design and manufacture of the copper bar 100. Because the opening is relatively large, it can be completely manufactured by stamping, which can effectively reduce the cost.

[0047] The through hole 100 is not limited to a circular hole, a rectangular hole, or the like, and can also be a through groove with one side open, which is not limited to a rectangular groove, a ring groove, or the like, and can pass through the copper bar 100 in the thickness direction of the copper bar 100.

[0048] Referring to FIGS. 1 and 2, the first circuit board 200 is mainly used to carry the current sensor 300, and the current sensor 300 is arranged on the first circuit board 200. In some embodiments, the current sensor 300 can be arranged at the first end of the first circuit board 200, that is, the upper end of the first circuit board 200 in FIG. 2. The current sensor 300 can be fixedly connected to the first end of the first circuit board 200 by a method such as welding and electrically connected to the first circuit board 200. The first circuit board 200 is perpendicular to the copper bar 100. Specifically, the first circuit board 200 is a flat plate, and the copper bar 100 is a sheet. The plane on which the first circuit board 200 is located (that is, the plane perpendicular to the thickness direction of the first circuit board 200) is perpendicular to the plane on which the copper bar 100 is located (that is, the plane perpendicular to the thickness direction of the copper bar 100). The first circuit board 200 is partially located in the through hole 110, so that the current sensor 300 arranged on the first circuit board 200 is at least partially located in the through hole 110, so that the current sensor 300 can detect the current passing through the copper bar 100.

[0049] In some embodiments of the present application, the current sensor 300 can be a giant magnetoresistance current sensor or a Hall sensor. When the current sensor 300 is a Hall sensor, the current sensor 300 includes a Hall chip, which is electrically connected to the first circuit board 200 and at least partially located in the through hole 110.

[0050] Because the electronic device of the present application vertically arranges the first circuit board 200 and the copper bar 100, arranges the through hole 110 on the copper bar 100, and vertically inserts the first circuit board 200 connected to the current sensor 300 into the through hole 110, the sensitivity of the current sensor 300 in the Z-axis direction (the direction perpendicular to the first circuit board 200, that is, the up-down direction in FIG. 3) can be effectively reduced, the influence of the Z-axis direction deviation caused by the manufacturing and mounting tolerances on the sampling range of the sensor can be reduced, so that the deviation of the current sampling range can be effectively ensured to be small, and the inconsistency of the current sampling of the electronic device caused by the assembly precision can be reduced.

[0051] Meanwhile, the cross section of the through hole 110 can be configured to be slightly larger than the cross section of the first end of the first circuit board 200 and the current sensor 300 as a whole, so that the first end of the first circuit board 200 and the current sensor 300 as a whole can be inserted into the opening, reducing the installation error of the current sensor 300 and ensuring the consistency of the current sampling range.

[0052] Referring to FIG. 5, in the present embodiment, the first end of the first circuit board 200 (the left end of the first circuit board 200 in FIG. 5) is approximately a cuboid. In some embodiments of the present application, the length L thereof can be 20 mm, the width W can be 8 mm, and the thickness of the first circuit board 200 can be 1.6 mm. The thickness of the current sensor 300 can be 2 mm.

[0053] Referring to FIG. 3, in the present embodiment, the through hole 110 is rectangular, the length a of the through hole 110 is greater than the width of the first end of the first circuit board 200, and the width b of the through hole 110 is greater than the sum of the thicknesses of the first circuit board 200 and the current sensor 300, so that the first end of the first circuit board 200 and the current sensor 300 as a whole can be inserted into the through hole 110. In some embodiments of the present application, the length a of the through hole 110 can be 10 mm, which is greater than the width W of the first end of the first circuit board 200; the width b of the through hole 110 can be 5 mm, which is greater than the sum of the thicknesses of the first circuit board 200 and the current sensor 300, i.e. 3.6 mm.

[0054] In other embodiments, the shape of the through hole 110 can be "convex", matching the cross section of the first end of the first circuit board 200 and the current sensor 300 as a whole in the Z-axis direction, and the area of the through hole 110 is slightly larger than the cross-sectional area of the first end of the first circuit board 200 and the current sensor 300 as a whole.

[0055] In the present embodiment, the electronic device 1100 further comprises a second circuit board 500, which is mainly used to fix the first circuit board 200. The second circuit board 500 is perpendicular to the first circuit board 200, i.e. the plane in which the first circuit board 200 lies (i.e. the plane perpendicular to the thickness direction of the first circuit board 200) is perpendicular to the plane in which the second circuit board 500 lies (i.e. the plane perpendicular to the thickness direction of the second circuit board 500). The first circuit board 200 (i.e. the lower end of the first circuit board 200 in FIG. 2) is electrically connected to the second circuit board 500, so that the first circuit board 200 can be below the second circuit board 500, keeping it in a specific position to detect the current in the copper bar 100.

[0056] Specifically, referring to FIGS. 5 and 6, one end of the first circuit board 200 (i.e., the lower end of the first circuit board 200 in FIG. 2) has a plurality of protrusions 210 arranged at intervals, the plurality of protrusions 210 are comb-shaped, and the adjacent protrusions 210 have grooves therebetween. At least one side of the protrusion 210 has a solder pad 211, and in some embodiments of the present application, both sides of the protrusion 210 can be provided with the solder pad 211. In the present embodiment, the solder pad 211 is rectangular in shape, and the solder pad 211 can be a metal layer such as a copper layer. The second circuit board 500 is provided with a plurality of vias 610 corresponding to the plurality of protrusions 210, the plurality of protrusions 210 are respectively inserted into the plurality of vias 610, and the solder pad 211 is welded to the second circuit board 500. Thus, the first circuit board 200 and the second circuit board 500 are electrically connected, and the current sensor 300 can be electrically connected to the second circuit board 500 through the first circuit board 200.

[0057] It should be noted that the number of protrusions 210 is at least three. Among them, the solder pad 211 on at least one protrusion 210 is used for power supply, the solder pad 211 on at least one protrusion 210 is used for grounding, and the solder pad 211 on at least one protrusion 210 is used for signal transmission. Thus, the current sensor 300 can be electrically connected to the second circuit board 500 through the first circuit board 200, receive power supply from the second circuit board 500, be grounded through the second circuit board 500, and transmit the detection result to the corresponding device on the second circuit board 500. In the present embodiment, there are four protrusions 210, one solder pad 211 on one protrusion 210 is used for power supply, one solder pad 211 on one protrusion 210 is used for grounding, and the other two solder pads 211 on the other two protrusions 210 are used for signal transmission. The second circuit board 500 is provided with four vias 610 corresponding to the four protrusions 210.

[0058] Referring to FIG. 5, in the present embodiment, the length H of the plurality of solder pads 211 is greater than the thickness of the second circuit board 500. Among them, the length H of the solder pad 211 is the length of the solder pad 211 in the direction perpendicular to the second circuit board 500.

[0059] In some embodiments of the present application, the length H of the solder pad 211 can be 2 mm, and the thickness of the second circuit board 500 can be 1.6 mm. Thus, when soldering the solder pad 211 to the second circuit board 500 using solder, the top layer and the bottom layer (i.e., both sides of the second circuit board 500) of the second circuit board 500 can be fixedly soldered, thereby enhancing stability.

[0060] Referring to FIG. 7, in the embodiment, the via holes 610 are all in an elliptical shape, and the size of each via hole 610 matches the size of each protruding part 210, so as to ensure that each protruding part 210 can be inserted into the corresponding opening. In other embodiments, the shape of the via hole 610 can also be rectangular. The second circuit board 500 is provided with a solder ring 520 surrounding the via hole 610 on both sides, and the pads 211 on both sides of the second circuit board 500 can be welded to the solder ring 520, thereby enhancing the stability of the connection.

[0061] Referring to FIG. 5, in the embodiment, the distance between adjacent protruding parts 210 is N1, N2 and N3 respectively, and N1, N2 and N3 are all greater than 8 mil (i.e. 0.2032 mm), so as to ensure the basic electrical clearance and avoid short circuit.

[0062] In some embodiments of the present application, N1, N2 and N3 can be 2.54 mm, 2.5 mm and 2.4 mm respectively.

[0063] In the embodiment, the distance between adjacent solder rings 520 is also greater than 8 mil, so as to ensure the basic electrical clearance and avoid short circuit.

[0064] Referring to FIG. 5, in the embodiment, the center distance between adjacent protruding parts 210 is Z1, Z2 and Z3 respectively, and the center distance between adjacent protruding parts 210 is not fixed, so as to realize the fool-proof design and ensure that the second end of the first circuit board 200 is inserted into the via hole 610 on the second circuit board 500 in the correct direction. It should be noted that the center distance not fixed means that the center distance is not a fixed value, i.e. not all equal, at least one center distance is different from the other center distances, so that if the second end of the first circuit board 200 is inserted into the via hole 610 on the second circuit board 500 in the wrong direction, the plurality of pads 211 cannot be inserted into the corresponding via hole 610.

[0065] In some embodiments of the present application, Z1, Z2 and Z3 can be 3.54 mm, 3.6 mm and 3.65 mm respectively. Correspondingly, the center distance between adjacent via holes 610 is also Z1, Z2 and Z3 respectively, i.e. 3.54 mm, 3.6 mm and 3.65 mm respectively.

[0066] Referring to FIG. 5, in the embodiment, the widths of the plurality of protrusions 210 are M1, M2, M3 and M4 respectively, and the widths of the plurality of protrusions 210 are not fixed, so as to realize the fool-proof design and ensure that the second end of the first circuit board 200 is inserted into the through hole 610 on the second circuit board 500 in the correct direction. It should be noted that the widths of the plurality of protrusions 210 are not fixed means that the widths of the plurality of protrusions 210 are not all equal, that is, at least one protrusion 210 has a width different from that of the other protrusions 210, so that if the second end of the first circuit board 200 is inserted into the through hole 610 on the second circuit board 500 in the wrong direction, the plurality of protrusions 210 cannot be inserted into the corresponding through holes 610.

[0067] In some embodiments of the present application, M1, M2, M3 and M4 can be 1 mm, 1 mm, 1 mm and 1.25 mm respectively.

[0068] In some other embodiments, the electronic device 1100 can be configured such that the center distances between adjacent protrusions 210 are not fixed, and the widths of the plurality of protrusions 210 are the same, so as to realize the fool-proof design, or the center distances between adjacent protrusions 210 are the same, and the widths of the plurality of protrusions 210 are not fixed, so as to realize the fool-proof design. Those skilled in the art can configure as needed.

[0069] Referring to FIG. 4, in the embodiment, the electronic device 1100 further comprises a packaging member 400, which covers the current sensor 300, part of the first circuit board 200 (i.e., the first circuit board 200 at the current sensor 300) and part of the copper bar 100 at the through hole 110, that is, the current sensor 300 is completely covered in the through hole 110, and part of the first circuit board 200 around the current sensor 300 and part of the copper bar 100 near the through hole 110 are covered therein, so as to fixedly connect the first circuit board 200 and the copper bar 100. Thus, it is ensured that the current sensor 300 and the copper bar 100 will not relatively displace, and it is ensured that the electronic device can stably detect the current passing through the copper bar 100 under the working condition of severe vibration, thereby enhancing the current sampling accuracy.

[0070] In some embodiments of the present application, the packaging member 400 comprises an injection shell and a filling glue located in the injection shell. During packaging, the injection shell is first formed by injection, and the injection shell has a containing cavity, and the through hole 110 and the current sensor 300 are located in the containing cavity. Then, the filling glue is filled in the injection shell, and the filling glue covers the current sensor 300, part of the first circuit board 200 (i.e., the first circuit board 200 at the current sensor 300) and part of the copper bar 100 at the through hole 110. The way of first forming the injection shell and then filling the filling glue can effectively avoid damage to the current sensor caused by high temperature during injection.

[0071] In some embodiments of the present application, the injection shell can be made of an engineering plastic that can withstand high temperature of 180 DEG C and low temperature of -50 DEG C, and the potting glue can be silicone potting glue, epoxy resin potting glue or other potting glue that has good impact resistance and cold and hot resistance, so as to avoid the change of the relative position between the current sensor 300 and the copper bar 100 due to thermal expansion and cold contraction of the packaging part 400, and to enhance the accuracy of current sampling. The specific material of the injection shell and the potting glue can be selected by those skilled in the art according to the needs, and the present application does not make specific limitations thereto.

[0072] In some other embodiments, the packaging part 400 can not be provided in the electronic device 1100, and the first circuit board 200 can be fixed only by the second circuit board 500, and the electronic device can be applied to an electronic device without severe vibration.

[0073] In some other embodiments, the second circuit board 500 can not be provided in the electronic device 1100, and the connection and fixation of the copper bar 100, the first circuit board 200 and the current sensor 300 can be achieved only by the packaging part 400.

[0074] In the present embodiment, the electronic device 1100 is a motor controller, and the second circuit board 500 is configured as a control board, on which a controller is provided to achieve the control of the motor. The area of the first circuit board 200 is smaller than that of the control board, and the first circuit board 200 is mainly used to carry the current sensor 300 and achieve the electrical connection between the current sensor 300 and the second circuit board 500. In this way, only a first circuit board 200 with a small area needs to be separately configured to carry the current sensor 300 to achieve current detection, without the need to make a large improvement to the structure of the control board, which is simple and easy to implement, and can effectively reduce the design difficulty and design cost.

[0075] In the present embodiment, the first circuit board 200 can be designed on the process edge of the second circuit board 500 to utilize waste and save manufacturing cost. The second circuit board 500 as a control board should be manufactured and mounted according to the requirements, and the second circuit board 500 should be designed as a rectangle. However, due to the complexity of the internal structure of the electronic device, it is difficult to achieve a completely rectangular design, which requires the addition of a process edge to achieve the design, and the cost of the added process edge will be included in the manufacturing cost of the circuit board. Therefore, the first circuit board 200 can be designed on the process edge of the second circuit board 500 to reduce the waste of the process edge and save manufacturing cost.

[0076] Please refer to FIG. 8, the present application also provides a vehicle 1000, which comprises the electronic device 1100 as described above.

[0077] Although example embodiments have been described herein with reference to the accompanying drawings, it is to be understood that the example embodiments are intended to be illustrative only and are not intended to limit the scope of the present application. Various modifications and changes can be made thereto by those of ordinary skill in the art without departing from the scope and spirit of the application. It is intended that all such modifications and changes be included within the scope of the application as claimed.

[0078] Those skilled in the art can realize the unit and algorithm steps of the examples described in connection with the embodiments disclosed herein can be realized by electronic hardware, or a combination of computer software and electronic hardware. Whether the functions are performed in hardware or software depends on the particular application and design constraints. Skilled persons can realize the described functions by different methods for each particular application but the realization should not be considered to be beyond the scope of the present application.

[0079] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the above-described device embodiments are merely illustrative. For example, the division of the units is merely a logical function division. In actual implementation, another division manner can be used, for example, a plurality of units or components can be combined or integrated into another device, or some features can be omitted or not performed.

[0080] In the specification provided herein, a large number of specific details are described. However, it can be understood that the embodiments of the present application can be practiced without these specific details. In some examples, well-known methods, structures and techniques are not described in detail in order not to obscure the understanding of the specification.

[0081] Similarly, it should be appreciated that the various features of the application set forth in the specification and examples are not to be construed as limitations on the overall scope of the application, but rather as exemplifications of one or more aspects thereof. Those skilled in the art will readily recognize a variety of ways of implementing the application discussed above, some of which have been provided above, and others known to those of ordinary skill in the art. Moreover, not all of the desirable features and aspects can be implemented in every implementation. It is therefore intended that the scope of the application be determined by the following claims rather than by the embodiments provided by way of examples in the specification.

[0082] Those skilled in the art will appreciate that all features described herein (including all features and processes described in the accompanying claims, abstract and drawings) can be combined in any combination. Each feature or process of the description (including any accompanying claims, abstract and drawings) can be replaced by alternative features serving the same, equivalent or similar purpose, unless expressly stated otherwise. Thus, unless expressly stated otherwise, each feature of the description (including any accompanying claims, abstract and drawings) is expressly incorporated in each claim and each claim is expressly incorporated into the description (including any accompanying abstract and drawings).

[0083] Furthermore, those skilled in the art will appreciate that the features described herein merely illustrate rather than limit the application, and that those skilled in the art will be able to design many alternative examples without departing from the scope of the application. For example, in the claims, any of the claimed embodiments can be used in any combination.

[0084] It is noted that the foregoing examples have been provided merely for the purposes of illustration and are not intended to limit the application as claimed. Other examples of variations that may-provide a useful study for those skilled in the art are not provided herein, but can be derived from this document in a conventional manner.

Claims

1. An electronic device (1100), wherein, The electronic device comprises: a copper bar (100) provided with a through hole (110); a first circuit board (200) perpendicular to the copper bar (100), the first circuit board (200) being partially located in the through hole (110); a current sensor (300) provided on the first circuit board (200) and at least partially located in the through hole (110).

2. The electronic device (1100) according to claim 1, wherein The electronic device further comprises a packaging member (400) covering the current sensor (300), a first end of the first circuit board (200), and part of the copper bar (100) at the through hole (110) to fix the first circuit board (200) and the copper bar (100) together.

3. The electronic device (1100) according to claim 2, wherein The packaging member (400) comprises an injection shell and a potting glue located in the injection shell, wherein the potting glue covers the current sensor (300), part of the first circuit board (200), and part of the copper bar (100) at the through hole (110).

4. The electronic device (1100) according to any one of claims 1-3, characterized by, The electronic device further comprises a second circuit board (500) perpendicular to the first circuit board (200), the first circuit board (200) being electrically connected to the second circuit board (500).

5. The electronic device (1100) according to claim 4, wherein One end of the first circuit board (200) is provided with a plurality of spaced apart protrusions (210), at least one side of the protrusion (210) being provided with a solder pad (211); The second circuit board (500) is provided with a plurality of through holes (510) corresponding to the plurality of protrusions (210); The plurality of protrusions (210) are respectively inserted into the plurality of through holes (510), and the solder pad (211) is welded to the second circuit board (500).

6. The electronic device (1100) according to claim 5, wherein The length of the solder pad (211) is greater than the thickness of the second circuit board (500).

7. The electronic device (1100) according to claim 5 or 6, wherein Both sides of the second circuit board (500) are provided with solder rings (520) surrounding the through holes (510).

8. The electronic device (1100) according to any one of claims 5-7, wherein, The distance between adjacent protrusions (210) is greater than 8 mil.

9. The electronic device (1100) according to claim 7 or 8, wherein The distance between adjacent solder rings (520) is greater than 8 mil.

10. The electronic device (1100) according to any one of claims 5-9, wherein, The distance between the centers of adjacent protrusions (210) is indefinite; and / or, The width of the plurality of protrusions (210) is indefinite.

11. The electronic device (1100) according to any one of claims 5-10, wherein, The protrusion (210) is at least three.

12. The electronic device (1100) according to any one of claims 4-11, wherein, The electronic device is a motor controller, the second circuit board (500) is configured as a control board, and the area of the first circuit board (200) is smaller than the area of the control board.

13. A vehicle (1000), characterized by The electronic device (1100) according to any one of claims 1-12 is provided.

Images