Display device and manufacturing method therefor

Abstract

The present disclosure provides a display device and a manufacturing method therefor. The display device may comprise: a substrate, a first terminal, a second terminal, and conductive lines. The manufacturing method for the display device provided in the present disclosure comprises: providing a substrate, wherein the substrate has a first surface, a second surface, and a side surface, the first surface comprises a first binding area, and the second surface comprises a second binding area; forming a first terminal in the first binding area; forming a second terminal in the second binding area; forming a conductive layer on the first binding area, the second binding area, and the side surface of the substrate, wherein at least part of the conductive layer covers the side surface, a first end of the conductive layer extends to the first binding area and covers the first terminal, and a second end of the conductive layer extends to the second binding area and covers the second terminal; and patterning the conductive layer to form conductive lines. The present disclosure improves the side wiring efficiency of the substrate of the display device, and improves the side wiring precision of the substrate.

Description

Display device and method of manufacturing the same

[0001] Cross-reference to related applications

[0002] The present disclosure claims priority to Chinese applications filed on May 21, 2024, with application number 202410635166.4; filed on May 21, 2024, with application number 202410635149.0; filed on May 28, 2024, with application number 202421188372.7, the contents of which are incorporated by reference in their entirety in the present disclosure. TECHNICAL FIELD

[0003] Embodiments of the present disclosure relate to display technology. More specifically, to a display device and a method of manufacturing the same. BACKGROUND

[0004] With the rapid development of Mini LED display technology, Mini LED display products have been applied to the field of ultra-large screen high-definition display. Due to the problem of power consumption, the size of the current Mini LED cannot be made large.

[0005] In order to realize large screen, the mainstream approach is to use multiple small-size display panels with Mini LED as the light source to form a large-size display panel. At present, the bezel-free splicing screen with Mini LED as the light source often adopts a side wiring method. Side wiring is a wiring method that arranges conductive wires or circuit boards along the side of the substrate to connect the binding terminals located on both sides of the substrate. The side wiring can arrange signal transmission lines along the side of the substrate and connect to the binding terminals located on both sides of the substrate. This can effectively transmit signals and power and realize the connection between Mini LED and other circuit elements. At present, silver paste transfer, exposure development etching, stripping process and laser engraving can be used to wire on the side of the substrate of the display panel. However, the side wiring method of the substrate has the problem of low wiring efficiency. SUMMARY

[0006] In a first aspect, embodiments of the present disclosure provide a display device, which can include a substrate, a first terminal, a second terminal, and a conductive wire. The substrate has a first surface, a second surface, and a side surface. The first surface and the second surface are oppositely arranged. The side surface is arranged between the first surface and the second surface. The side surface is arranged at a first end of the substrate. The first surface has a first binding area. The second surface has a second binding area. The first terminal is arranged in the first binding area. The second terminal is arranged in the second binding area. At least part of the conductive wire is arranged on the side surface. A first end of the conductive wire extends to the first surface and is electrically connected to the first terminal; a second end of the conductive wire extends to the second surface and is electrically connected to the second terminal. In the direction from the first surface to the second surface, the part of the middle of the first end of the substrate protrudes outwardly in the direction away from the substrate relative to the parts of the two ends of the first end of the substrate.

[0007] In a second aspect, the embodiments of the present disclosure provide a display device, which can include: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; the first surface having a first binding area, the second surface having a second binding area; a first terminal arranged in the first binding area; a second terminal arranged in the second binding area; a conductive wire, at least a part of the conductive wire being arranged on the side surface; a first end of the conductive wire extending to the first surface and electrically connected with the first terminal; a second end of the conductive wire extending to the second surface and electrically connected with the second terminal; and a connecting film connected by the conductive wire and the substrate, the connecting film covering the side surface, the first binding area, and the second binding area of the substrate.

[0008] In a third aspect, the embodiments of the present disclosure provide a display device, which can include: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; the side surface being provided with a groove; the first surface having a first binding area, the second surface having a second binding area; a first terminal arranged in the first binding area; a second terminal arranged in the second binding area; and a conductive assembly including a conductive wire and a conductive piece arranged in sequence, at least a part of the conductive wire being arranged on the side surface, at least a part of the conductive wire extending into the groove; a first end of the conductive wire extending to the first surface and electrically connected with the first terminal; a second end of the conductive wire extending to the second surface and electrically connected with the second terminal.

[0009] In a fourth aspect, the embodiments of the present disclosure provide a display device, which can include: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; a first terminal for connecting a first binding area of the first surface; a second terminal for connecting a second binding area of the second surface; and a conductive assembly including a conductive wire and a conductive piece arranged in sequence, at least a part of the conductive wire being arranged on the side surface, at least a part of the conductive wire extending into a groove of the side surface; a first end of the conductive wire extending to the first surface and electrically connected with the first terminal; a second end of the conductive wire extending to the second surface and electrically connected with the second terminal.

[0010] In a fifth aspect, the embodiments of the present disclosure provide a manufacturing method of a display device, applied to the display device of the first aspect. The method can include: providing a substrate; the substrate has a first surface, a second surface, and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area. A first terminal is formed in the first binding area, and a second terminal is formed in the second binding area. A conductive layer is formed on the first binding area, the second binding area, and the side surface of the substrate; at least part of the conductive layer covers the side surface, a first end of the conductive layer extends to the first binding area and covers the first terminal, and a second end of the conductive layer extends to the second binding area and covers the second terminal. The conductive layer is patterned to form a conductive wire.

[0011] In a sixth aspect, the embodiments of the present disclosure provide a manufacturing method of a display device, applied to the display device of the second aspect. The method can include: providing a substrate; the substrate has a first surface, a second surface, and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area; a first terminal is formed in the first binding area, and a second terminal is formed in the second binding area; a connecting film is provided, and a conductive wire is formed on a first surface of the connecting film; the connecting film is bent, and the connecting film is attached to the first binding area, the side surface, and the second binding area respectively; and the conductive wire connects at least part of the first terminal and at least part of the second terminal.

[0012] In a seventh aspect, the embodiments of the present disclosure provide a manufacturing method of a display device, applied to the display device of the third aspect. The method can include: providing a substrate; the substrate has a first surface, a second surface, and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the side surface is provided with a groove; the first surface has a first binding area, and the second surface has a second binding area; a first terminal is formed in the first binding area, and a second terminal is formed in the second binding area; a conductive assembly is provided, and a conductive wire and a conductive piece are arranged in the conductive assembly in a stacked manner; at least part of the conductive wire is arranged on the side surface, and at least part of the conductive wire extends into the groove; a first end of the conductive wire extends to the first surface and is electrically connected to the first terminal; and a second end of the conductive wire extends to the second surface and is electrically connected to the second terminal.

[0013] In an eighth aspect, the display device manufacturing method is provided. The method can be applied to the display device of the fourth aspect. The method can include: providing a substrate; the substrate has a first surface, a second surface, and a side surface; the first surface and the second surface are oppositely arranged; the side surface is used to connect the first surface and the second surface; providing a first terminal and a second terminal; the first terminal is used to connect a first binding area of the first surface; the second terminal is used to connect a second binding area of the second surface; providing a conductive assembly; the conductive assembly is arranged with a conductive wire and a conductive piece which are sequentially stacked; at least part of the conductive wire is used to be connected on the side surface; at least part of the conductive wire is used to extend into a groove of the side surface; a first end of the conductive wire is used to extend to the first surface and electrically connected with the first terminal; a second end of the conductive wire is used to extend to the second surface and electrically connected with the second terminal. BRIEF DESCRIPTION OF DRAWINGS

[0014] FIG. 1 is a structural schematic diagram of a display device according to some embodiments;

[0015] FIG. 2 is a flow chart of a manufacturing method of the display device shown in FIG. 1;

[0016] FIG. 3 is a structural schematic diagram of a substrate of the display device shown in FIG. 1;

[0017] FIG. 4 is a structural schematic diagram of the substrate and the first terminal and the second terminal of the display device shown in FIG. 1;

[0018] FIG. 5 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a protective film attached thereon;

[0019] FIG. 6 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a chamfer structure formed thereon;

[0020] FIG. 7 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a conductive layer formed thereon;

[0021] FIG. 8 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a photoresist layer formed thereon;

[0022] FIG. 9 is a structural schematic diagram of a mold of the display device shown in FIG. 1 from a first perspective;

[0023] FIG. 10 is a structural schematic diagram of the mold of the display device shown in FIG. 1 from a second perspective;

[0024] FIG. 11 is a structural schematic diagram of the mold of the display device shown in FIG. 1 extruding the photoresist layer on the substrate;

[0025] FIG. 12 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a first pattern formed thereon;

[0026] FIG. 13 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a conductive wire formed thereon;

[0027] Figure 14 is yet another structural schematic diagram of a display device according to some embodiments;

[0028] Figure 15 is a flowchart of the manufacturing method of the display device shown in Figure 14;

[0029] Figure 16 is a schematic diagram of the structure of the display device shown in Figure 14, in which a conductive layer is formed on the connecting film;

[0030] Figure 17 is a schematic diagram of the structure of the display device shown in Figure 14, in which a photoresist layer is formed on the connecting film;

[0031] Figure 18 is a schematic diagram of the structure of the display device shown in Figure 14, in which conductive lines are formed on the connecting film.

[0032] Figure 19 is a schematic diagram of the structure of the display device shown in Figure 14, in which conductive lines are formed on the connecting film.

[0033] Figure 20 is a schematic diagram of the connection between the substrate and the connecting film of the display device shown in Figure 14;

[0034] Figure 21 is a schematic diagram of the structure for forming conductive lines in the display device shown in Figure 14;

[0035] Figure 22 is yet another structural schematic diagram of a display device according to some embodiments;

[0036] Figure 23 is a schematic diagram of the substrate, first terminal and second terminal of the display device shown in Figure 22;

[0037] Figure 24 is a schematic diagram of the structure of the first end of the substrate of the display device shown in Figure 22 having a chamfer;

[0038] Figure 25 is a schematic diagram of the structure of the display device shown in Figure 22, which has a groove on the side of the substrate.

[0039] Figure 26 is another structural schematic diagram of the display device shown in Figure 22, which has a groove on the side of the substrate.

[0040] Figure 27 is a schematic diagram of the structure in which the first connection layer is formed on the side of the substrate of the display device shown in Figure 22;

[0041] Figure 28 is a schematic diagram of the structure in which the second connection layer is formed on the side of the substrate of the display device shown in Figure 22;

[0042] Figure 29 is a schematic diagram of the structure of the conductive layer formed on the side of the substrate of the display device shown in Figure 22;

[0043] Figure 30 is a schematic diagram of the structure of the protective layer formed on the side of the substrate of the display device shown in Figure 22;

[0044] Figure 31 is another structural schematic diagram of a display device according to some embodiments.

[0045] 100: substrate; 110: first surface; 111: first bonding area; 120: second surface; 121: second bonding area; 130: side surface; 131: first inclined surface; 132: second inclined surface; 133: vertical surface; 134: groove; 200: first terminal; 210: first protrusion; 300: second terminal; 310: second protrusion; 400: conductive layer; 401: conductive component; 410: conductive wire; 411: first connecting layer; 411a: first connecting segment; 411b: second connecting segment; 412: second connecting layer; 412a: third connecting segment; 412b: fourth connecting segment; 420: conductive piece; 430: protective layer; 500: protective film; 510: first protective film; 520: second protective film; 530: connecting film; 600: photoresist layer; 700: mold; 710: mold protrusion; 720: mold body; 730: photoresist layer; 800a: circuit; 800b: chip; 800c: chip on film; 800d: circuit board; 900: encapsulation film layer. DETAILED DESCRIPTION

[0046] An LED lamp plate is one of the key components of a liquid crystal display device, which is used to provide sufficient backlight brightness for a liquid crystal panel so that the liquid crystal panel can normally display images. A Mini LED is a small-sized LED, and its size is about 80-300 pm. A backlight module designed by using a Mini LED has become a current research hotspot in liquid crystal display devices.

[0047] Compared with a traditional LED backlight module, a Mini LED backlight module can adopt a more dense Mini LED arrangement to reduce a light mixing distance, and realize the ultrathin of the backlight module. The Mini LED backlight module adopts a large number of Mini LEDs as backlight sources, has advantages of adjustable regional brightness, color rendering and contrast ratio, and can achieve 8K display effect. Since the multi-zone dynamic backlight of the high-peak-luminance Mini LED backlight module is beneficial to improve the display contrast and high dynamic range, the backlight module using the Mini LED as the light source has been widely applied in many fields such as monitoring command and high-definition broadcasting.

[0048] Mini LED currently has a problem of high power consumption, and the size cannot be increased. In order to realize large screen, a plurality of small size display panels using Mini LED as light source are usually assembled to form a large size display panel. At present, the bezel-free splicing screen using Mini LED as light source usually adopts side wiring. Side wiring is a wiring method in which a wire or a circuit board is arranged along the side of the substrate to connect the binding terminals on both sides of the substrate. The side wiring can arrange the signal transmission line along the side of the substrate and connect to the binding terminals on both sides of the substrate. In this way, the signal and power can be effectively transmitted, and the connection between Mini LED and other circuit elements can be realized. At present, silver paste transfer, exposure development etching, stripping process and laser engraving can be used for side wiring of the substrate of the display panel.

[0049] However, when silver paste transfer technology is used for side wiring of the substrate, silver paste transfer may cause poor adhesion between the wiring and the substrate, uneven stress on the corner of the substrate, and short circuit or open circuit of the line, affecting the connection efficiency of the circuit. When exposure development etching and stripping process technology is used for side wiring of the substrate, exposure, development and etching processes need to be performed on the front surface, side surface and back surface of the substrate respectively. The exposure development etching and stripping process technology has the problems of poor wiring consistency, difficult side surface alignment and complex production steps. Laser engraving process needs to consider the damage to the substrate, so the efficiency of laser engraving is low. Therefore, the existing side wiring method of the substrate has the problem of low wiring efficiency.

[0050] Therefore, the display device and the manufacturing method thereof provided by the embodiments of the present disclosure can include a substrate, a first terminal, a second terminal and a conductive wire. The substrate has a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area. The first terminal is formed in the first binding area; the second terminal is formed in the second binding area. A conductive layer is formed on the first binding area, the second binding area and the side surface of the substrate; at least part of the conductive layer covers the side surface, a first end of the conductive layer extends to the first binding area and covers the first terminal; a second end of the conductive layer extends to the second binding area and covers the second terminal. The patterned conductive layer forms the conductive wire.

[0051] The manufacturing method of the display device can include: simultaneously forming the conductive layer on the first surface, the second surface and the side surface of the substrate, and patterning the conductive layer to form the conductive line to simultaneously wire the first surface, the second surface and the side surface, avoiding the problem of complicated steps when wiring separately, simplifying the wiring steps of the side surface of the display device and improving the wiring efficiency of the side surface of the substrate of the display device. At the same time, the manufacturing method of the display device provided by the embodiment of the present disclosure improves the consistency of the wiring of the side surface of the substrate of the display device, avoids the problem of difficult alignment when wiring the side surface, and improves the precision of the wiring of the substrate.

[0052] It should be understood that the display device provided by the present disclosure can have various implementation forms, for example, can be a television, a smart television, a laser projection device, a monitor, an electronic bulletin board, an electronic table, etc.

[0053] FIG. 1 is a structural schematic diagram of a display device according to some embodiments, as shown in FIG. 1: the substrate 100 has a first surface 110, a second surface 120 and a side surface 130. The first surface 110 and the second surface 120 are oppositely arranged, and the side surface 130 is located between the first surface 110 and the second surface 120, and the two ends of the side surface 130 are connected with the first surface 110 and the second surface 120 respectively. The first surface 110 of the substrate 100 has a first binding area 111. The first binding area 111 is provided with a first terminal 200. The second surface 120 of the substrate 100 has a second binding area 121. The second binding area 121 is provided with a second terminal 300. The side surface 130 is provided with a conductive line 410. The two ends of the conductive line 410 are electrically connected with the first terminal 200 and the second terminal 300 respectively. The first end of the conductive line 410 extends to the first surface 110 and is electrically connected with the first terminal 200; the second end of the conductive line 410 extends to the second surface 120 and is electrically connected with the second terminal 300. The side surface 130 is arranged at the first end of the substrate 100, and along the direction from the first surface 110 to the second surface 120, the part of the middle of the first end of the substrate 100 protrudes outwardly in the direction away from the substrate 100 relative to the parts of the two ends of the first end of the substrate 100.

[0054] In some embodiments, the first surface 110 of the substrate 100 is the top surface of the substrate 100. The second surface 120 of the substrate 100 is the bottom surface of the substrate 100.

[0055] In some embodiments, the first terminal 200 is a connecting end of the first face 110, which is used to connect with other components of the display device to realize display control of the display device. Similarly, the second terminal 300 is a connecting end of the second face 120, which is used to connect with other components of the display device to realize display control of the display device. By arranging the first terminal 200 on the first face 110, arranging the second terminal 300 on the second face 120, and arranging the conductive wire 410 on the side face 130 to connect the first terminal 200 and the second terminal 300, the electrical connection and signal transmission of the display device are realized. The design of the first terminal 200 and the second terminal 300 can ensure stable and reliable connection, avoid loose or disconnection caused by external vibration or movement, and ensure normal operation of the device.

[0056] In some embodiments, the first terminal 200 and the second terminal 300 are usually small connectors made of metal or alloy materials, which are used to connect circuit boards, wires or other electronic components.

[0057] In some embodiments, the side face 130 of the substrate 100 includes a first inclined face 131, a second inclined face 132 and a vertical face 133 connected in sequence, the first inclined face 131 is located between the first face 110 and the vertical face 133, the second inclined face 132 is located between the second face 120 and the vertical face 133, and the vertical face 133 is perpendicular to the first face 110. The conductive wire 410 includes a first conductive segment, a second conductive segment and a third conductive segment, the first conductive segment is located on the first face 110, the second conductive segment is located on the second face 120, and the third conductive segment is located on the side face 130. The third conductive segment connects the first conductive segment and the second conductive segment. At least part of the third conductive segment is located on the first inclined face 131. At least part of the third conductive segment is located on the second inclined face 132.

[0058] By arranging the side face 130 as a first inclined face 131, a second inclined face 132 and a vertical face 133 connected in sequence, arranging the first conductive segment on the first face 110, and arranging at least part of the third conductive segment on the first inclined face 131, the included angle between the extension directions of the first conductive segment and the third conductive segment is reduced, so that the connection between the first conductive segment and the third conductive segment is smoothly transferred between the first face 110 and the first inclined face 131, which is beneficial to improve the adhesion of the conductive wire 410 and the substrate 100, and avoid the conductive wire 410 from peeling off the substrate 100. By arranging the second conductive segment on the second face 120, and arranging at least part of the third conductive segment on the second inclined face 132, the included angle between the extension directions of the second conductive segment and the third conductive segment is reduced, so that the connection between the second conductive segment and the third conductive segment is smoothly transferred between the second face 120 and the second inclined face 132, which is beneficial to improve the adhesion of the conductive wire 410 to the substrate 100, and avoid the conductive wire 410 from peeling off the substrate 100.

[0059] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can be circular arc surfaces, which can help to increase the contact area between the conductive wire 410 and the substrate 100, and improve the adhesion of the conductive wire 410 to the substrate 100, thereby avoiding the peeling of the conductive wire 410 from the substrate 100.

[0060] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can also be flat surfaces. The first inclined surface 131 and the first surface 110 have a first preset included angle. The second inclined surface 132 and the second surface 120 have a second preset included angle. The first preset included angle and the second preset included angle are both obtuse angles, so that the first surface 110 and the first inclined surface 131, and the second inclined surface 132 and the second surface 120 are smoothly connected, thereby avoiding the breakage of the conductive wire 410 at the first inclined surface 131 and the second inclined surface 132, and improving the connection stability of the conductive wire 410.

[0061] In some embodiments, the first terminal 200 includes a plurality of first connection ends. The plurality of first connection ends are arranged at intervals. The second terminal 300 includes a plurality of second connection ends. The plurality of second connection ends are arranged at intervals. The conductive wire 410 has a plurality of wires. The plurality of first connection ends are electrically connected to the first ends of the plurality of conductive wires 410 in a one-to-one correspondence. The second ends of the plurality of conductive wires are electrically connected to the plurality of second connection ends in a one-to-one correspondence. The connection mode of one first connection end, one conductive wire 410 and one second connection end can avoid interference in the process of electrical signal transmission, can ensure the stability and reliability of the electrical signal transmission, and can improve the anti-interference ability of the conductive wire 410.

[0062] FIG. 2 is a flowchart of a manufacturing method of the display device shown in FIG. 1. As shown in FIG. 2, the manufacturing method of the display device mentioned in the above embodiments of the present disclosure can include the following steps:

[0063] S10A: providing a substrate; the substrate has a first surface, a second surface and a side surface, the first surface and the second surface are arranged opposite to each other, and the side surface is arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area.

[0064] FIG. 3 is a structural schematic diagram of the substrate of the display device shown in FIG. 1. As shown in FIG. 3, the substrate 100 can be used as a support structure of the display device to support other structures in the display device. In addition, the substrate 100 can also provide the functions of circuit wiring and connecting elements, so that the display device can work normally. When the substrate 100 is used in the backlight module of the display device, the substrate 100 also needs to have light transmission to ensure that the light can be effectively transmitted to the display screen of the display device to provide bright and uniform lighting effect.

[0065] S20A: forming a first terminal in the first binding area and forming a second terminal in the second binding area.

[0066] FIG. 4 is a structural schematic diagram of the substrate and the first terminal and the second terminal of the display device shown in FIG. 1. As shown in FIG. 4, the first terminal 200 and the second terminal 300 can be used to transmit electrical signals, supply power, or connect other elements. By forming the first terminal 200 on the first surface 110 of the substrate 100 and forming the second terminal 300 on the second surface 120 of the substrate 100, the space of the substrate 100 is reasonably utilized, and the connection and wiring of the circuit can be achieved, thereby realizing the normal work of the display device. In addition, more wiring and connection can be achieved in a limited space.

[0067] FIG. 5 is a structural schematic diagram of the substrate of the display device shown in FIG. 1 with a protective film attached. As shown in FIG. 5, after the first terminal 200 is formed in the first binding area 111 and the second terminal 300 is formed in the second binding area 121, the manufacturing method of the display device further includes attaching a protective film 500 on the substrate 100, the protective film 500 covering the part of the first surface 110 away from the first binding area 111, and the protective film 500 covering the part of the second surface 120 away from the second binding area 121.

[0068] In some embodiments, the protective film 500 can include a first protective film 510 and a second protective film 520. The first protective film 510 is attached on the first surface 110. The first protective film 510 covers the part of the first surface 110 away from the first binding area 111. The second protective film 520 is attached on the second surface 120. The second protective film 520 covers the part of the second surface 120 away from the second binding area 121. Wherein, the first terminal 200 is arranged adjacent to one end of the first protective film 510 close to the first protective film 510, and the second terminal 300 is arranged adjacent to one end of the second protective film 520 close to the second protective film 520. The first protective film 510 and the second protective film 520 are used to protect the part of the substrate 100 which does not need to be subsequently formed with the conductive layer 400.

[0069] In some embodiments, the protective film 500 can be a polyimide film. The polyimide film has high temperature stability and can withstand temperatures as high as 300°C or above. The polyimide film also maintains good dimensional stability at high temperatures and is not prone to shrinkage or deformation. The polyimide film also has insulation properties, preventing short circuits or electrical leakage between circuit elements. The polyimide film also has corrosion resistance and can remain stable in harsh chemical environments. The polyimide film also has mechanical strength and wear resistance and is not prone to breakage or deformation. By arranging the protective film 500 on the part of the first surface 110 of the substrate 100 away from the first binding area 111, damage to the substrate 100 during the manufacturing process of the display device is avoided, and the quality of the substrate 100 is improved.

[0070] FIG. 6 is a schematic view of a chamfer structure formed on a substrate of the display device shown in FIG. 1. As shown in FIG. 6, after the first terminal 200 is formed on the first binding area 111 and the second terminal 300 is formed on the second binding area 121, the manufacturing method of the display device further includes performing passivation treatment on the first end of the substrate 100, and the middle part of the first end of the substrate 100 is convex outward in the direction away from the substrate 100 relative to the two end parts of the first end of the substrate 100.

[0071] In some embodiments, after the first terminal 200 is formed on the first surface 110 and the second terminal 300 is formed on the second surface 120, laser processing is performed on the surface of the substrate 100 by using a laser cutting technology, a first chamfer is formed at the connection between the first surface 110 and the side surface 130 of the substrate 100, and the first chamfer includes a first inclined surface 131; a second chamfer is formed at the connection between the second surface 120 and the side surface 130 of the substrate 100, and the second chamfer includes a second inclined surface 132.

[0072] In some embodiments, after the first terminal 200 is formed on the first surface 110 and the second terminal 300 is formed on the second surface 120, a first chamfer is first formed at the connection between the first surface 110 and the side surface 130 of the substrate 100 by chemical etching or mechanical processing, the first chamfer includes a first inclined surface 131; a second chamfer is formed at the connection between the second surface 120 and the side surface 130 of the substrate 100, and the second chamfer includes a second inclined surface 132; then, the first chamfer and the second chamfer are finely processed by using a chemical mechanical polishing technology to make the surfaces smooth and flat.

[0073] Since the first chamfer and the second chamfer are arranged at the connection between the first surface 110 and the side surface 130 and at the connection between the second surface 120 and the side surface 130, respectively, the subsequently formed side surface 130 wiring can be smoothly transitioned at the corner position, thereby improving the problem that the side edge wiring of the substrate 100 in the prior art is prone to breakage. By forming a flat substrate 100 edge through chamfering, the bending and twisting of the conductive wire 410 can be reduced, and the transmission performance of the conductive wire 410 can be improved.

[0074] S30A: forming a conductive layer on the first binding area, the second binding area and the side surface of the substrate; at least part of the conductive layer covers the side surface, a first end of the conductive layer extends to the first binding area and covers the first terminal; a second end of the conductive layer extends to the second binding area and covers the second terminal.

[0075] FIG. 7 is a schematic diagram of forming a conductive layer structure on the substrate of the display device shown in FIG. 1. As shown in FIG. 7, the conductive layer 400 can be formed on the first binding area 111, the second binding area 121 and the side surface 130 by a physical vapor deposition method. Physical vapor deposition (PVD) is a commonly used thin film deposition technique for depositing thin film materials on solid surfaces. In the physical vapor deposition process, solid materials are converted into a gas phase by heating or sputtering, and then deposited onto the substrate surface in a vacuum or inert atmosphere to form a thin film. Physical vapor deposition has the advantages of fast deposition speed, good thin film uniformity and low film formation temperature.

[0076] In some embodiments, the conductive layer 400 can be a copper layer.

[0077] In some embodiments, as shown in FIG. 7, the conductive layer 400 covers the first terminal 200, the side surface 130 and the second terminal 300. Compared with the process of arranging the conductive wire 410 on the side surface 130 of the conventional substrate 100, the present disclosure does not need to perform multiple exposure and development operations on the first surface 110, the side surface 130 and the second surface 120 respectively, thereby improving the efficiency of wiring on the side surface of the substrate 100 and improving the manufacturing efficiency of the display device.

[0078] In some embodiments, the first conductive layer 400 is formed on the first binding area 111, the first conductive layer 400 covering at least part of the first terminal 200; the second conductive layer 400 is formed on the second binding area 121, the second conductive layer 400 covering at least part of the second terminal 300; the side surface 130 conductive layer 400 is formed on the side surface 130; the first conductive layer 400, the side surface 130 conductive layer 400 and the second conductive layer 400 are sequentially connected.

[0079] S40A: patterning the conductive layer to form a conductive wire.

[0080] In some embodiments, when the patterned conductive layer 400 forms the conductive wire 410, the following method can be used: forming a photoresist layer 600 on the conductive layer 400. Providing a mold 700; using the mold 700 to extrude the photoresist layer 600 to form a first pattern and a second pattern, the first pattern covering the first terminal 200 and the second terminal 300. Removing the first pattern. Removing the second pattern and removing the conductive layer 400 covered by the second pattern to form the conductive wire 410.

[0081] FIG. 8 is a schematic diagram of forming a photoresist layer structure on the substrate of the display device shown in FIG. 1. As shown in FIG. 8, a spin coater can be used to form a photoresist layer 600 on the conductive layer 400, so that the photoresist layer 600 uniformly covers the conductive layer 400.

[0082] Referring to FIGS. 9-13, the first pattern and the second pattern can be formed by extruding the photoresist layer 600 by the mold 700. The first pattern is concave toward the substrate 100 side relative to the second pattern. The first pattern covers the first terminal 200 and the second terminal 300.

[0083] In some embodiments, the mold 700 can include a mold body 720 and a mold protrusion 710. The mold protrusion 710 is disposed on the mold body 720. The mold protrusion 710 extrudes the photoresist layer 600 to form the first pattern.

[0084] In some embodiments, the inner periphery of the mold body 720 covers the first bonding area 111, the side surface 130, and the second bonding area 121 of the substrate 100.

[0085] In some embodiments, during the process of extruding the photoresist layer 600 by the mold 700, a master template is first provided. The top of the master template is formed with the first pattern. The mold body 720 is provided with a secondary first pattern corresponding to the first pattern, i.e., the pattern formed by the mold protrusion 710. By covering the first bonding area 111, the second bonding area 121, and the side surface 130 with the mold body 720, the first pattern provided by the master template is transferred to the substrate 100.

[0086] In some embodiments, the mold 700 can be a flexible template. The two ends of the mold body 720 can be bent relative to the middle part of the mold body 720. The mold 700 is provided with a plurality of mold protrusions 710, which form the secondary first pattern.

[0087] In some embodiments, a holding member for applying force to the mold 700 can also be provided to cause at least part of the photoresist layer 600 on the substrate 100 to be concave toward the substrate 100, thereby forming the first pattern.

[0088] In some embodiments, the thickness of the first pattern is less than the thickness of the second pattern. By extruding the photoresist layer 600 by the mold protrusion 710, the thickness of the first pattern and the second pattern of the photoresist layer 600 is artificially controlled. The conductive layer 400 covered by the first pattern is the conductive wire 410 for subsequent connection of the first terminal 200 and the second terminal 300, and the conductive layer 400 covered by the second pattern is the conductive layer 400 that does not need to be reserved subsequently.

[0089] Since the thickness of the first pattern is less than the thickness of the second pattern, when the first pattern is dissolved by the dissolving agent, at least part of the second pattern is also dissolved when the first pattern is completely dissolved, while part of the second pattern is still not dissolved. In this way, the dissolved first pattern exposes the covered conductive layer 400, and the exposed conductive layer 400 connects the first terminal 200 and the second terminal 300. The exposed conductive layer is a part that needs to be reserved to prepare the conductive wire 410 connecting the first terminal 200 and the second terminal 300 through subsequent processes. By dissolving the first pattern, it is beneficial for the worker to distinguish the conductive layer 400 used to prepare the conductive wire 410 subsequently. The dissolving agent can be any one of ferric chloride or sodium hydroxide.

[0090] In some embodiments, removing the first pattern includes: removing the first pattern; and removing at least part of the second pattern.

[0091] Exemplarily, after the first pattern is completely dissolved, at least part of the second pattern still covers the conductive layer 400. The conductive layer 400 covered by the second pattern is a part that does not need to be reserved in the present disclosure. By etching, the second pattern and the conductive layer 400 covered by the second pattern are removed, so that the conductive layer 400 at the position covered by the second pattern is removed, and the side surface 130 of the substrate 100 is exposed. The conductive layer 400 covered by the first pattern forms the conductive wire 410. By setting the first pattern and the second pattern and using the thickness difference between the first pattern and the second pattern, the first pattern and the second pattern are removed step by step, which is beneficial for forming the conductive wire 410. At the same time, by using the second pattern as a distinction, it is beneficial to distinguish the part of the conductive layer 400 used to prepare the conductive wire 410 and the part used for removal, improve the connection precision of the conductive wire 410 located at the first binding area 111 and the side surface 130, improve the connection precision of the conductive wire 410 located at the second binding area 121 and the side surface 130, improve the precision of preparation of the conductive wire 410, and improve the efficiency of preparation of the conductive wire 410.

[0092] In some embodiments, the remaining photoresist can be removed after the conductive wire is formed. At the same time, the first protective film 510 away from the first binding area 111 of the first surface 110 is removed, and the second protective film 520 away from the second binding area 121 of the second surface 120 is removed.

[0093] The manufacturing method of the display device provided by the embodiments of the present disclosure forms the conductive layer 400 on the first binding area 111, the second binding area 121 and the side surface 130 of the substrate 100 through physical vapor deposition, forms the photoresist layer 600 on the conductive layer 400, extrudes the photoresist layer 600 by using the mold 700 to form the first pattern and the second pattern, removes the first pattern and the second pattern in steps by using the thickness difference between the first pattern and the second pattern, and forms the conductive wire 410. The manufacturing method improves the butt joint accuracy of the conductive wire 410 located at the first binding area 111 and the side surface 130, improves the butt joint accuracy of the conductive wire 410 located at the second binding area 121 and the side surface 130, simplifies the wiring step of the side surface 130 of the display device, and improves the efficiency of the side wiring of the display device.

[0094] In addition, as mentioned above, when the exposure, development, etching and stripping process technology is used to wire the side of the substrate, the exposure, development, etching and stripping process technology needs to be performed on the front surface, side surface and back surface of the substrate respectively. The exposure, development, etching and stripping process technology has the problems of poor wiring consistency, difficult side alignment and complex production steps.

[0095] Specifically, the laser engraving process is easy to damage the substrate. When the silver paste transfer printing technology is used to wire the side of the substrate, the silver paste transfer printing may cause the adhesion between the wiring and the substrate to be weak, the conductive wire is unevenly stressed at the corner of the substrate, and the conductive wire is short-circuited or broken, which affects the connection quality and stability of the circuit. In addition, the line transferred by the silver paste has the problem of excessive impedance, which causes the process of wiring the side of the substrate to be complex and the side wiring to be easy to peel off.

[0096] Therefore, the embodiments of the present disclosure provide another display device and a manufacturing method thereof. The display device can include a substrate, a first terminal, a second terminal, a conductive wire and a connecting film. The display device provided by the embodiments of the present disclosure connects the conductive wire to the substrate through the connecting film, improves the connection strength of the conductive wire and the substrate, avoids the problem of peeling off of the conductive wire on the side of the substrate, improves the connection stability of the conductive wire on the side of the substrate, and improves the use performance of the display device.

[0097] The manufacturing method of the display device can include the following steps. A substrate is provided. The substrate has a first surface, a second surface and a side surface. The first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface. The first surface has a first binding area, and the second surface has a second binding area. A first terminal is formed in the first binding area. A second terminal is formed in the second binding area. A connecting film is provided, and a conductive wire is formed on a first surface of the connecting film. The connecting film is bent, and the connecting film is attached to the first binding area, the side surface and the second binding area respectively. The conductive wire covers at least part of the first terminal and at least part of the second terminal.

[0098] Thus, by modifying the process of forming conductive lines on the substrate to a process of preparing conductive lines on the connecting film, the conventional substrate side edge wiring needs to be wired separately on the first surface, the second surface, and the side surface. This avoids the problem of complicated steps when wiring separately, improves the efficiency of the display device substrate side edge wiring, simplifies the steps of the display device side edge wiring, and improves the efficiency of the display device substrate side edge wiring.

[0099] Meanwhile, the connecting film can be mass-produced, improving the work efficiency of the substrate side edge wiring. By adhering the connecting film to the first binding area, the side surface, and the second binding area, respectively, so that the conductive lines cover at least part of the first terminal and at least part of the second terminal, the precision of the two ends of the conductive lines and the first terminal and the second terminal is improved, the consistency of the display device substrate side edge wiring is improved, and the connecting film connects the substrate, the conductive lines are arranged between the connecting film and the substrate, the connecting film increases the connection strength between the conductive lines and the substrate, avoids the problem of peeling of the conductive lines, improves the quality of the substrate side edge wiring, and improves the display effect of the display device.

[0100] FIG. 14 is another structural schematic diagram of a display device according to some embodiments. As shown in FIG. 14, the substrate 100 has a first surface 110, a second surface 120, and a side surface 130, the first surface 110 and the second surface 120 are oppositely arranged, and the side surface 130 is arranged between the first surface 110 and the second surface 120; the first surface 110 has a first binding area 111, and the second surface 120 has a second binding area 121. The first terminal 200 is arranged in the first binding area 111. The second terminal 300 is arranged in the second binding area 121. At least part of the conductive lines 410 is arranged on the side surface 130; the connecting film 530 is connected by the conductive lines 410 and the substrate 100, and the connecting film 530 covers the side surface 130, the first binding area 111, and the second binding area 121 of the substrate 100.

[0101] In some embodiments, the first end of the conductive lines 410 extends to the first surface 110 and is electrically connected to the first terminal 200; the second end of the conductive lines 410 extends to the second surface 120 and is electrically connected to the second terminal 300 (not shown in FIG. 14).

[0102] In some embodiments, the conductive wire 410 can be arranged between the connecting film 530 and the substrate 100, and the connecting film 530 connects the substrate 100, thereby improving the connection strength of the conductive wire 410 and the substrate 100, avoiding the problem of peeling off of the conductive wire 410 on the side of the substrate 100, improving the quality of the wiring on the side of the substrate 100, and improving the use performance of the display device. At the same time, by modifying the process of forming the conductive wire 410 on the substrate 100 to the process of preparing the conductive wire 410 on the connecting film 530, the problem of complicated steps when wiring on the side of the substrate 100 is avoided, the efficiency of wiring on the side of the substrate 100 of the display device is improved, the steps of wiring on the side of the display device are simplified, and the efficiency of wiring on the side of the substrate 100 of the display device is improved. At the same time, the connecting film 530 can be mass-produced, which improves the working efficiency of wiring on the side of the substrate 100. By adhering the connecting film 530 to the first binding area 111, the side 130, and the second binding area 121, respectively; so that the conductive wire 410 covers at least part of the first terminal 200 and at least part of the second terminal 300, thereby improving the docking accuracy of the two ends of the conductive wire 410 and the first terminal 200 and the second terminal 300, and improving the consistency of wiring on the side of the substrate 100 of the display device.

[0103] In some embodiments, the first surface 110 of the substrate 100 is the top surface of the substrate 100. The second surface 120 of the substrate 100 is the bottom surface of the substrate 100.

[0104] In some embodiments, the first terminal 200 is a connection end of the first surface 110, which is used to connect with other components of the display device. In order to realize the display control of the display device. Similarly, the second terminal 300 is a connection end of the second surface 120, which is used to connect with other components of the display device, so as to realize the display control of the display device. By arranging the first terminal 200 on the first surface 110, arranging the second terminal 300 on the second surface 120, and arranging the conductive wire 410 on the side 130 to connect the first terminal 200 and the second terminal 300, the electrical connection and signal transmission of the display device are realized. The design of the first terminal 200 and the second terminal 300 can ensure stable and reliable connection, avoid loose or disconnection caused by external vibration or movement, and ensure normal operation of the display device.

[0105] In some embodiments, the first terminal 200 and the second terminal 300 are usually small connectors made of metal or alloy materials, which are used to connect circuit boards, wires or other electronic components.

[0106] In some embodiments, the first terminal 200 comprises a plurality of first connecting ends. The plurality of first connecting ends are arranged at intervals. The second terminal 300 comprises a plurality of second connecting ends. The plurality of second connecting ends are arranged at intervals. The plurality of conductive wires 410 are provided. Each of the plurality of first connecting ends is electrically connected to a first end of a corresponding one of the plurality of conductive wires 410. A second end of the corresponding one of the plurality of conductive wires 410 is electrically connected to a corresponding one of the plurality of second connecting ends. The connection mode of one first connecting end, one conductive wire 410 and one second connecting end avoids interference in the process of electrical signal transmission, and can ensure the stability and reliability of electrical signal transmission and improve the anti-interference capability of the conductive wire 410.

[0107] In some embodiments, in the direction from the first face 110 to the second face 120, the portion of the middle of the first end of the substrate 100 protrudes outward in the direction away from the substrate 100 relative to the portions of the two ends of the first end of the substrate 100.

[0108] In some embodiments, the side face 130 of the substrate 100 comprises a first inclined face 131, a second inclined face 132 and a vertical face 133 connected in sequence, the first inclined face 131 is located between the first face 110 and the vertical face 133, the second inclined face 132 is located between the second face 120 and the vertical face 133, and the vertical face 133 is perpendicular to the first face 110. The conductive wire 410 comprises a first conductive segment, a second conductive segment and a third conductive segment, the first conductive segment is located on the first face 110, the second conductive segment is located on the second face 120, and the third conductive segment is located on the side face 130. The third conductive segment connects the first conductive segment and the second conductive segment. At least part of the third conductive segment is located on the first inclined face 131. At least part of the third conductive segment is located on the second inclined face 132.

[0109] By arranging the side face 130 to comprise the first inclined face 131, the second inclined face 132 and the vertical face 133 connected in sequence, and arranging the first conductive segment on the first face 110 and at least part of the third conductive segment on the first inclined face 131, the included angle between the extending directions of the first conductive segment and the third conductive segment is reduced, and the connection between the first conductive segment and the third conductive segment is smoothly transferred between the first face 110 and the first inclined face 131, which is conducive to improving the adhesion between the conductive wire 410 and the substrate 100 and avoiding the peeling of the conductive wire 410 from the substrate 100. By arranging the second conductive segment on the second face 120 and at least part of the third conductive segment on the second inclined face 132, the included angle between the extending directions of the second conductive segment and the third conductive segment is reduced, and the connection between the second conductive segment and the third conductive segment is smoothly transferred between the second face 120 and the second inclined face 132, which is conducive to improving the adhesion between the conductive wire 410 and the substrate 100 and avoiding the peeling of the conductive wire 410 from the substrate 100.

[0110] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can be circular arc surfaces, which can help to increase the contact area between the conductive wire 410 and the substrate 100, and improve the adhesion of the conductive wire 410 to the substrate 100, thereby preventing the conductive wire 410 from peeling off the substrate 100.

[0111] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can also be flat surfaces. The first inclined surface 131 and the first surface 110 have a first preset included angle. The second inclined surface 132 and the second surface 120 have a second preset included angle. The first preset included angle and the second preset included angle are both obtuse angles, so that the first surface 110 and the first inclined surface 131, and the second inclined surface 132 and the second surface 120 are smoothly connected, thereby preventing the conductive wire 410 from being disconnected at the first inclined surface 131 and the second inclined surface 132, and improving the connection stability of the conductive wire 410.

[0112] In some embodiments, the connecting film 530 is a flexible film. The flexible film is a thin film material with soft and bendable properties. It is usually made of polymers or composite materials, and has high flexibility and plasticity, and can be bent without breaking or deforming. By setting the connecting film 530 as a flexible film, when the connecting film 530 is bent, the conductive wire 410 can be connected through the flexible film and the substrate 100. At the same time, the flexible film protects the side surface 130, the first surface 110 and the second surface 120 of the substrate 100, preventing the conductive wire 410 on the substrate 100 from being scratched, worn or otherwise damaged, thereby prolonging the service life of the substrate 100.

[0113] In some embodiments, the connecting film 530 includes a polyimide film. The polyimide film also has mechanical strength and wear resistance, and is not easy to break or deform. By setting the connecting film 530, damage to the substrate 100 during the manufacturing process of the display device is avoided, and the quality of the substrate 100 is improved.

[0114] In some embodiments, the thickness of the connecting film 530 is greater than or equal to 10 μm and less than or equal to 20 μm.

[0115] In some embodiments, when the thickness of the connecting film 530 is greater than 20 μm, the over-thick connecting film 530 reduces its flexibility and bendability, thereby affecting the flexibility of the connecting film 530 when connecting with the substrate 100. At the same time, the over-thick connecting film 530 can cause difficulty in installation, especially in the case of fine butt joint between the conductive wire 410 and the first terminal 200, and between the conductive wire 410 and the second terminal 300 in the present disclosure, which increases the complexity of the connecting film 530 when connecting.

[0116] In some embodiments, when the thickness of the connecting film 530 is less than 10 μm, the connecting film 530 is too thin to be attached to the substrate 100, wrinkles, peeling and other problems are prone to occur, and the connection stability of the conductive wire 410 and the substrate 100 is reduced.

[0117] Therefore, the thickness of the connecting film 530 is set to be greater than or equal to 10 μm and less than or equal to 20 μm, which is beneficial to attach the connecting film 530 to the substrate 100, while ensuring the connection stability of the conductive wire 410 and the substrate 100 located on the connecting film 530.

[0118] FIG. 15 is another flowchart of the manufacturing method of the display device shown in FIG. 14, which can include the following steps:

[0119] S10B: providing a substrate; the substrate has a first surface, a second surface and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area.

[0120] Referring to the foregoing FIG. 3, the substrate 100 can be used as a support structure of the display device to support other structures in the display device; in addition, the substrate 100 can also provide the functions of circuit wiring and connecting elements, so that the display device can work normally. When the substrate 100 is used in the backlight module of the display device, the substrate 100 also needs to have light transmission to ensure that the light can be effectively transmitted to the display screen of the display device to provide bright and uniform lighting effect.

[0121] S20B: forming a first terminal in the first binding area and a second terminal in the second binding area.

[0122] Referring to the foregoing FIG. 4, the first terminal 200 and the second terminal 300 can be used for transmitting electrical signals, power supply or connecting other elements. By forming the first terminal 200 on the first surface 110 of the substrate 100 and the second terminal 300 on the second surface 120 of the substrate 100, the space of the substrate 100 is reasonably utilized, and the connection and wiring of the circuit can be realized, so that the display device can work normally. In addition, more wiring and connection can be realized in limited space.

[0123] In some embodiments, after the first terminal 200 is formed in the first binding area 111 and the second terminal 300 is formed in the second binding area 121, the manufacturing method of the display device further includes:

[0124] attaching a protective film 500 on the substrate 100, the protective film 500 covering the part of the first surface 110 away from the first binding area 111, and the protective film 500 covering the part of the second surface 120 away from the second binding area 121.

[0125] Referring to FIG. 5, the protective film 500 can include a first protective film 510 and a second protective film 520. The first protective film 510 is attached to the first surface 110. The first protective film 510 covers the portion of the first surface 110 away from the first binding area 111. The second protective film 520 is attached to the second surface 120. The second protective film 520 covers the portion of the second surface 120 away from the second binding area 121. The first terminal 200 is disposed adjacent to one end of the first protective film 510, and the second terminal 300 is disposed adjacent to one end of the second protective film 520. The first protective film 510 and the second protective film 520 are used to protect the substrate 100 from damage during the manufacturing process.

[0126] In some embodiments, the protective film 500 can be a polyimide film. The polyimide film has high temperature stability and can withstand temperatures up to 300°C or higher. The polyimide film also maintains good dimensional stability at high temperatures and is not prone to shrinkage or deformation. The polyimide film also has insulating properties, preventing short circuits or electrical leakage between circuit elements. The polyimide film also has corrosion resistance and can maintain stability in harsh chemical environments. The polyimide film also has mechanical strength and wear resistance and is not prone to breakage or deformation. By placing the protective film 500 on the portion of the first surface 110 of the substrate 100 away from the first binding area 111 and on the portion of the second surface 120 of the substrate 100 away from the second binding area 121, damage to the substrate 100 during the manufacturing process of the display device is avoided, and the quality of the substrate 100 is improved.

[0127] In some embodiments, after the first terminal 200 is formed in the first binding area 111 and the second terminal 300 is formed in the second binding area 121, the method for manufacturing the display device further includes:

[0128] The first end of the substrate 100 is passivated. The middle portion of the first end of the substrate 100 protrudes outward in a direction away from the substrate 100 relative to the two end portions of the first end of the substrate 100.

[0129] Referring to FIG. 6, after the first terminal 200 is formed on the first surface 110 and the second terminal 300 is formed on the second surface 120, a laser cutting technique is used to perform laser processing on the surface of the substrate 100. A first chamfer is formed at the junction of the first surface 110 and the side surface 130 of the substrate 100. The first chamfer includes a first inclined surface 131. A second chamfer is formed at the junction of the second surface 120 and the side surface 130 of the substrate 100. The second chamfer includes a second inclined surface 132.

[0130] In some embodiments, after forming the first terminal 200 on the first surface 110 and the second terminal 300 on the second surface 120, a first chamfer is formed at the junction of the first surface 110 and the side surface 130 of the substrate 100 by chemical etching or mechanical processing, the first chamfer comprising a first inclined surface 131; a second chamfer is formed at the junction of the second surface 120 and the side surface 130 of the substrate 100, the second chamfer comprising a second inclined surface 132, and then the first chamfer and the second chamfer are polished using a chemical mechanical polishing technique to smooth the surfaces.

[0131] Because the first surface 110 and the side surface 130 are provided with chamfer structures at the junction, and the second surface 120 and the side surface 130 are provided with chamfer structures at the junction, the conductive wire 410 can be smoothly transitioned at the corner position, thereby improving the problem that the conductive wire 410 of the substrate 100 side edge wiring of the prior art is prone to peeling and breaking. By forming a smooth substrate 100 edge on the substrate 100 through the chamfer structure, the bending and twisting of the conductive wire 410 can be reduced, the bonding strength of the conductive wire 410 and the substrate 100 can be improved, the peeling of the conductive wire 410 can be avoided, and the service life of the conductive wire 410 can be improved.

[0132] S30B: providing a connecting film, and forming a conductive wire on a first surface of the connecting film.

[0133] By modifying the process of forming the conductive wire 410 on the substrate 100 to the process of preparing the conductive wire 410 on the connecting film 530, the conventional substrate side edge wiring needs to be wired on the first surface 110, the second surface 120 and the side surface 130 respectively, and the display device manufacturing method of the present disclosure avoids the problem of complicated steps when wiring respectively, improves the efficiency of the display device substrate 100 side edge wiring, simplifies the steps of the display device side edge wiring, and improves the efficiency of the display device substrate 100 side edge wiring. At the same time, the connecting film 530 can be mass-produced, which improves the work efficiency of the substrate 100 side edge wiring.

[0134] Specifically, as shown in FIGS. 16-19, the following methods can be used to form the conductive wire 410 on the first surface of the connecting film 530:

[0135] A conductive layer 400 is formed on the first surface of the connecting film 530. A photoresist layer 730 is formed on the conductive layer 400. The photoresist layer 730 is exposed and developed. Part of the conductive layer 400 is etched and removed, and the remaining conductive layer 400 forms the conductive wire 410.

[0136] In some embodiments, the process of forming the conductive wire 410 on the connecting film 530 includes: first coating or depositing a conductive material on the first surface of the connecting film 530 to form a conductive layer 400. The conductive layer 400 can be a metal film, a conductive polymer, or the like. Then, a photoresist is coated on the conductive layer 400 to form a photoresist layer 730. The role of the photoresist layer 730 is to protect part of the conductive layer 400 in the subsequent exposure and development process, so as to form a conductive wire pattern. Subsequently, the required conductive wire pattern is transferred to the photoresist layer 730 by exposure, and then a development process is performed to remove the photoresist layer 730 in the unexposed area, exposing the conductive layer 400. Finally, the exposed part of the conductive layer 400 on the photoresist layer 730 is removed by etching technology to form the required conductive wire pattern. The etching process can use chemical etching, physical etching, or the like. Through the above steps, the conductive wire 410 can be formed on the first surface of the connecting film 530 to realize the function of circuit connection or signal transmission.

[0137] S40B: folding the connecting film, and adhering the connecting film to the first binding area, the side surface, and the second binding area respectively; the conductive wire connects at least part of the first terminal and at least part of the second terminal.

[0138] Specifically, as shown in FIGS. 20 and 21, the connecting film 530 can be adhered to the first binding area 111, the side surface 130, and the second binding area 121 respectively, so that the conductive wire 410 covers at least part of the first terminal 200 and at least part of the second terminal 300, thereby improving the alignment accuracy of the two ends of the conductive wire 410 with the first terminal 200 and the second terminal 300, and improving the consistency of the side edge wiring of the display device substrate 100. At the same time, the connecting manner of the conductive wire 410 and the substrate 100 through the connecting film 530 increases the connection strength between the conductive wire 410 and the substrate 100, avoids the problem of peeling of the conductive wire 410, improves the quality of the side edge wiring of the substrate 100, and improves the display effect of the display device.

[0139] In some embodiments, the connecting film 530 is folded, and the connecting film 530 is adhered to the first binding area 111, the side surface 130, and the second binding area 121 respectively; the conductive wire 410 covers at least part of the first terminal 200 and at least part of the second terminal 300, including: aligning the first end of the conductive wire 410 with the first terminal 200, and adhering the first end of the connecting film 530 to the first binding area 111; aligning the second end of the conductive wire 410 with the second terminal 300, and adhering the second end of the connecting film 530 to the second binding area 121.

[0140] The electrically conductive wire 410 and the first terminal 200 are electrically connected by aligning the first end of the electrically conductive wire 410 with the first terminal 200 and covering the first end of the electrically conductive wire 410 on the first terminal 200. The electrically conductive wire 410 and the second terminal 300 are electrically connected by aligning the second end of the electrically conductive wire 410 with the second terminal 300 and covering the second end of the electrically conductive wire 410 on the second terminal 300, thereby improving the connection stability of the electrically conductive wire 410 and the substrate 100 and improving the alignment accuracy of the electrically conductive wire 410 and the first terminal 200 and the second terminal 300.

[0141] In addition, in order to realize large-screen display of the display device, the Mini-LED and the Micro-LED are mainly applied to the large-screen display device through splicing technology. In order to realize seamless splicing in the splicing process, the back bonding technology is often used to reduce the splicing width. The back bonding technology connects the bonding terminal on the front surface of the substrate and the connecting terminal on the back surface of the substrate by arranging the electrically conductive wire on the side surface of the substrate. The splicing technology is to splice a plurality of single substrates to form a large-screen display device on the basis of the electrically conductive wire on the side surface of the substrate transmitting signals from the front surface of the substrate to the back surface of the substrate. The arrangement of the electrically conductive wire on the side surface includes silver paste transfer, exposure development etching and laser engraving.

[0142] However, the electrically conductive wire arranged on the substrate needs to extend along the side surface of the substrate, and the two ends of the electrically conductive wire need to be connected with the bonding terminal on the front surface of the substrate and the connecting terminal on the back surface of the substrate, respectively. Since the side surface of the substrate has a corner between the front surface of the substrate and the back surface of the substrate, the adhesion between the electrically conductive wire prepared by the silver paste transfer method and the substrate is weak at present, and the force is uneven at the corner of the substrate, which is easy to cause the electrically conductive wire to peel off, resulting in short circuit or open circuit of the electrically conductive wire and affecting the display performance of the display device. Therefore, the existing method of arranging the electrically conductive wire on the side surface of the glass substrate has the problem that the electrically conductive wire is easy to peel off.

[0143] Therefore, the display device and the manufacturing method thereof provided in the embodiments of the present disclosure can solve the problem that the electrically conductive wire arranged on the side surface of the substrate is easy to peel off. The display device can include a substrate, a first terminal, a second terminal and an electrically conductive assembly. The substrate has a first surface, a second surface and a side surface. The first surface and the second surface are oppositely arranged. The side surface is arranged between the first surface and the second surface. The side surface is provided with a groove. The first surface has a first bonding area. The second surface has a second bonding area. The first terminal is arranged in the first bonding area. The second terminal is arranged in the second bonding area. The electrically conductive assembly includes an electrically conductive wire and an electrically conductive piece which are sequentially stacked. At least part of the electrically conductive wire is arranged on the side surface. At least part of the electrically conductive wire extends into the groove. The first end of the electrically conductive wire extends to the first surface and is electrically connected with the first terminal. The second end of the electrically conductive wire extends to the second surface and is electrically connected with the second terminal.

[0144] Thus, by providing a groove on the side surface of the substrate and extending at least part of the conductive wire into the groove, the connection area between the conductive wire and the side surface of the substrate is increased, the connection strength between the conductive wire and the side surface of the substrate is increased, and the connection stability between the conductive assembly and the side surface of the substrate is increased, thereby avoiding the problem of peeling of the conductive assembly, improving the quality of the wiring on the side edge of the substrate, and improving the display effect of the display device. By arranging the conductive assembly as the conductive wire and the conductive piece arranged in sequence, the conductive wire increases the connection strength between the conductive assembly and the substrate, and the conductive piece realizes the electrical connection between the first terminal on the first surface of the substrate and the second terminal on the second surface of the substrate, ensuring effective electrical connection of the display device.

[0145] FIG. 22 is another structural schematic diagram of a display device according to some embodiments. As shown in FIG. 22, the display device can include a substrate 100, a first terminal 200, a second terminal 300, and a conductive assembly 410.

[0146] The substrate 100 has a first surface 110, a second surface 120, and a side surface 130. The first surface 110 and the second surface 120 are oppositely arranged. The side surface 130 is arranged between the first surface 110 and the second surface 120. The two ends of the side surface 130 are connected to the first surface 110 and the second surface 120, respectively. The side surface 130 is provided with a groove 134. The first surface 110 has a first binding area. The second surface 120 has a second binding area. The first terminal 200 is arranged in the first binding area. The second terminal 300 is arranged in the second binding area.

[0147] The conductive assembly 401 includes a conductive wire 410 and a conductive piece 420 arranged in sequence. At least part of the conductive wire 410 is arranged on the side surface 130. At least part of the conductive wire 410 extends into the groove 134. The first end of the conductive wire 410 extends to the first surface 110 and is electrically connected to the first terminal 200; the second end of the conductive wire 410 extends to the second surface 120 and is electrically connected to the second terminal 300.

[0148] In some embodiments, the first surface 110 of the substrate 100 is the top surface of the substrate 100. The second surface 120 of the substrate 100 is the bottom surface of the substrate 100.

[0149] In some embodiments, referring to FIG. 22, the first binding area of the first surface 110 of the substrate 100 is provided with the first terminal 200. The second binding area of the second surface 120 of the substrate 100 is provided with the second terminal 300. At least part of the conductive wire 410 is located on the side surface 130 of the substrate 100. The conductive wire 410 connects the first terminal 200 and the second terminal 300 to realize electrical connection and signal transmission of the display device.

[0150] In some embodiments, the first end of the substrate 100 is sequentially provided with the conductive wire 410 and the conductive member 420 along the direction indicated by X in FIG. 22. At least part of the conductive wire 410 is connected to the side surface 130 of the substrate 100. The first end of the conductive wire 410 extends to the first surface 110 and is connected to the first terminal 200, and the second end of the conductive wire 410 extends to the second surface 120 and is connected to the second terminal 300. The conductive member 420 covers the conductive wire 410. By arranging the conductive assembly 401 as the conductive wire 410 and the conductive member 420 sequentially stacked, the conductive wire 410 increases the connection strength of the conductive assembly 401 and the substrate 100, and the conductive member 420 realizes the electrical connection between the first terminal 200 on the first surface 110 of the substrate 100 and the second terminal 300 on the second surface 120 of the substrate 100, thereby ensuring the effective electrical connection of the display device.

[0151] In some embodiments, the side surface 130 of the substrate 100 is provided with a groove 134. At least part of the conductive wire 410 extends into the groove 134. By extending the conductive wire 410 into the groove 134 to connect the substrate 100, the connection area of the conductive wire 410 and the side surface 130 of the substrate 100 is increased, the connection strength of the conductive wire 410 and the side surface 130 of the substrate 100 is increased, and the connection stability of the conductive assembly 401 and the side surface 130 of the substrate 100 is increased, thereby avoiding the peeling problem of the conductive wire 410 located on the side surface 130 of the substrate 100, avoiding the open circuit and open circuit problem that may occur in the conductive assembly 401, and improving the use performance of the display device. The display device provided by the embodiments of the present disclosure improves the connection stability between the conductive assembly 401 and the substrate 100, avoids the peeling problem of the conductive assembly 401, improves the quality of the side edge wiring of the substrate 100, and improves the display effect of the display device.

[0152] In some embodiments, the substrate 100 can be a glass substrate 100.

[0153] FIG. 23 is a structural schematic view of the substrate 100, the first terminal 200 and the second terminal 300 of the display device shown in FIG. 22. As shown in FIG. 23, the first terminal 200 is provided with a first protrusion 210. The first protrusion 210 is located on the surface of the first terminal 200 away from the substrate 100.

[0154] In some embodiments, the second terminal 300 is provided with a second protrusion 310. The second protrusion 310 is located on the surface of the second terminal 300 away from the substrate 100.

[0155] In some embodiments, the first terminal 200 and the second terminal 300 can be respectively prepared on the first face 110 of the substrate 100 and the second face 120 of the substrate 100 by a photolithography mask method. The photolithography mask method is a method of achieving the manufacture of a microstructure by transferring a fine pattern onto the substrate 100 using a photoresist and a mask.

[0156] Further, the first protrusion 210 can be provided on the first terminal 200 and the second protrusion 310 can be provided on the second terminal 300 by the photolithography mask method. The provision of the first protrusion 210 and the second protrusion 310 can increase the contact area of the first terminal 200 and the conductive wire 410, the second terminal 300 and the conductive wire 410, ensure the stability and reliability of the electrical connection of the first terminal 200 and the conductive wire 410, the second terminal 300 and the conductive wire 410, and reduce the contact resistance. At the same time, the provision of the first protrusion 210 and the second protrusion 310 structure can enhance the mechanical connection strength of the connection of the first terminal 200 and the conductive wire 410, the second terminal 300 and the conductive wire 410, and reduce the connection failure caused by mechanical stress.

[0157] FIG. 24 is a structural schematic view of the first end of the substrate 100 of the display device shown in FIG. 22 having a chamfer, as shown in FIG. 24, the side face 130 includes a first inclined face 131, a vertical face 133 and a second inclined face 132 connected in sequence. The first inclined face 131 is located between the first face 110 and the vertical face 133, and the first inclined face 131 is connected to the first face 110. The second inclined face 132 is located between the second face 120 and the vertical face 133, and the second inclined face 132 is connected to the second face 120. The vertical face 133 is perpendicular to the first face 110. In the thickness direction of the substrate 100, the vertical face 133 protrudes outward in a direction away from the substrate 100 relative to the first inclined face 131 and the second inclined face 132 at both ends of the side face 130. The vertical face 133 extends in the thickness direction of the substrate 100. The extension direction of the first inclined face 131 intersects the thickness direction of the substrate 100. The extension direction of the second inclined face 132 intersects the thickness direction of the substrate 100.

[0158] In some embodiments, the conductive wire 410 includes a first segment, a second segment and a third segment, the first segment is located on the first face 110, the second segment is located on the second face 120, and the third segment is located on the side face 130. The third segment connects the first segment and the second segment. At least part of the third segment is located on the first inclined face 131. At least part of the third segment is located on the second inclined face 132.

[0159] By setting the side surface 130 as the first inclined surface 131, the vertical surface 133 and the second inclined surface 132 connected in sequence, and setting the first section on the first surface 110 and setting at least part of the third section on the first inclined surface 131, the included angle between the first section and the third section in the extending direction is reduced, and the connection between the first section and the third section is smoothly transferred between the first surface 110 and the first inclined surface 131, which is beneficial to improve the adhesion of the conductive wire 410 to the substrate 100 and avoid the conductive wire 410 from peeling off the substrate 100. By setting the second section on the second surface 120 and setting at least part of the third section on the second inclined surface 132, the included angle between the second section and the third section in the extending direction is reduced, and the connection between the second section and the third section is smoothly transferred between the second surface 120 and the second inclined surface 132, which is beneficial to improve the adhesion of the conductive wire 410 to the substrate 100 and avoid the conductive wire 410 from peeling off the substrate 100.

[0160] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can be circular arc surfaces, so that the end of the substrate 100 provided with the side surface 130 has a chamfer structure. This helps to increase the contact area of the conductive wire 410 and the substrate 100, and is beneficial to improve the adhesion of the conductive wire 410 to the substrate 100 and avoid the conductive wire 410 from peeling off the substrate 100.

[0161] In some embodiments, the first inclined surface 131 and the second inclined surface 132 can also be planes. The first inclined surface 131 and the first surface 110 have a first preset included angle. The second inclined surface 132 and the second surface 120 have a second preset included angle. The first preset included angle and the second preset included angle are both obtuse angles, so that the first surface 110 and the first inclined surface 131, and the second inclined surface 132 and the second surface 120 are smoothly transferred, which avoids the conductive wire 410 from breaking at the first inclined surface 131 and the second inclined surface 132 and improves the connection stability of the conductive wire 410.

[0162] FIG. 25 is a structural schematic view of the substrate 100 side surface 130 of the display device shown in FIG. 22 having a groove 134. As shown in FIG. 25, the vertical surface 133 is provided with the groove 134. The groove 134 has a slot opening away from the substrate 100. The number of the grooves 134 is multiple. Along the thickness direction of the substrate 100, the multiple grooves 134 are arranged in sequence and at intervals. And / or, along the direction intersecting the thickness direction of the substrate 100, the multiple grooves 134 are arranged in sequence and at intervals.

[0163] In some embodiments, the vertical surface 133 is provided with a groove 134. The groove 134 has a groove opening facing away from the substrate 100. A plurality of grooves 134 are arranged at intervals along the thickness direction of the substrate 100. The thickness direction of the substrate 100 is indicated by Z in FIG. 25. By providing a plurality of grooves 134 and extending at least part of the conductive wire 410 into the grooves 134, the connection area between the conductive wire 410 and the side surface 130 of the substrate 100 is increased, the connection strength between the conductive wire 410 and the side surface 130 of the substrate 100 is increased, and the connection stability between the conductive assembly 401 and the side surface 130 of the substrate 100 is increased, thereby reducing the peeling problem of the conductive assembly 401 located on the side surface 130 of the substrate 100.

[0164] In other embodiments, the vertical surface 133 is provided with a groove 134. The groove 134 has a groove opening facing away from the substrate 100. A plurality of grooves 134 are arranged at intervals along the thickness direction of the substrate 100, i.e., perpendicular to the plane direction composed of X and Z in FIG. 25. By providing a plurality of grooves 134 and extending at least part of the conductive wire 410 into the grooves 134, the connection area between the conductive wire 410 and the side surface 130 of the substrate 100 is increased, the connection strength between the conductive wire 410 and the side surface 130 of the substrate 100 is increased, and the connection stability between the conductive assembly 401 and the side surface 130 of the substrate 100 is increased, thereby reducing the peeling problem of the conductive wire 410 located on the side surface 130 of the substrate 100.

[0165] In some embodiments, the groove 134 can be formed on the side surface 130 of the substrate 100 by laser, etching or grinding.

[0166] In some embodiments, as shown in FIGS. 25 and 26, the cross-sectional shape of the groove 134 along the thickness direction of the substrate 100 includes but is not limited to a square, a rectangle, a semicircle, a trapezoid. The shape of the groove 134 is not limited in the present disclosure.

[0167] In some embodiments, the conductive wire 410 includes at least two connection layers. The at least two connection layers are arranged in sequence on the part of the side surface 130 facing away from the substrate 100. By arranging at least two connection layers on the side surface 130 of the substrate 100, the connection strength between the conductive wire 410 and the substrate 100 is increased, the connection stability between the conductive assembly 401 and the side surface 130 of the substrate 100 is increased, and the overall peeling of the conductive assembly 401 from the side surface 130 of the substrate 100 is avoided.

[0168] In some embodiments, referring to FIGS. 27 and 28, the conductive wire 410 includes a first connecting layer 411 and a second connecting layer 412. The first connecting layer 411 includes a first connecting segment 411a and a second connecting segment 411b connected to each other. The first connecting segment 411a is disposed on the first surface 110 and is electrically connected to the first terminal 200 to achieve electrical connection between the first connecting layer 411 and the first terminal 200. The second connecting segment 411b is disposed on the side surface 130 and is connected to the substrate 100. At least part of the second connecting segment 411b extends into the groove 134.

[0169] The second connecting layer 412 includes a third connecting segment 412a and a fourth connecting segment 412b connected to each other. The third connecting segment 412a is disposed on the second surface 120 and is electrically connected to the second terminal 300 to achieve electrical connection between the second connecting layer 412 and the second terminal 300. The fourth connecting segment 412b is disposed on the side surface 130. The second connecting segment 411b and the fourth connecting segment 412b are sequentially and laminatedly disposed.

[0170] By disposing the first connecting layer 411 and the second connecting layer 412, and electrically connecting the first connecting segment 411a of the first connecting layer 411 to the first terminal 200 and electrically connecting the third connecting segment 412a of the second connecting layer 412 to the second terminal 300, the two ends of the conductive wire 410 are electrically connected to the first terminal 200 and the second terminal 300 respectively, and electrical signal transmission of the conductive wire 410 is achieved.

[0171] As shown in the direction of X in FIG. 28, the second connecting segment 411b of the first connecting layer 411 and the fourth connecting segment 412b of the second connecting layer 412 are sequentially and spacedly disposed on the side surface 130 of the substrate 100, which increases the connection strength between the conductive wire 410 and the side surface 130 of the substrate 100, and further increases the connection stability between the conductive assembly 401 and the side surface 130 of the substrate 100, and reduces the peeling problem of the conductive wire 410 located on the side surface 130 of the substrate 100.

[0172] The first connecting layer 411 covers the first surface 110 and the side surface 130 of the substrate 100, and the second connecting layer 412 covers the second surface 120 and the side surface 130 of the substrate 100, which is conducive to the forming of the first connecting layer 411 and the second connecting layer 412, and saves the materials for preparing the first connecting layer 411 and the second connecting layer 412. In addition, the problem of excessive thickness of the conductive wire 410 located on the first surface 110 is avoided, the problem of excessive thickness of the conductive wire 410 located on the second surface 120 is avoided, and the problem of excessive space occupied by the conductive wire 410 is avoided, and further the problem of excessive thickness of the conductive wire 410 affecting the compactness of the overall design of the display device is avoided.

[0173] In some embodiments, referring to FIGS. 29-30, the conductive assembly 401 can further include a protective layer 430, and the conductive member 420 can include a conductive layer.

[0174] The side surface 130 of the substrate 100 is connected with the second connecting section 411b of the first connecting layer 411 along a direction intersecting the thickness direction of the substrate 100. The direction intersecting the thickness direction of the substrate 100 is indicated by X in FIG. 29. The second connecting section 411b, the fourth connecting section 412b, the conductive layer, and the protective layer 430 are sequentially stacked. The second connecting section 411b and the fourth connecting section 412b can increase the connection strength of the conductive wire 410 with the side surface 130 of the substrate 100, avoid the whole or part of the conductive wire 410 from falling off the side surface 130 of the substrate 100, and avoid the short circuit and open circuit problems caused thereby. The conductive layer is used to electrically connect the first terminal 200 and the second terminal 300, ensure the smooth transmission of current and signals in the circuit 800a, and realize the electrical signal transmission between the first surface 110 of the substrate 100 and the second surface 120 of the substrate 100. The protective layer 430 covers the conductive layer, which can prevent the conductive layer from being physically damaged, such as being scratched or worn, during manufacturing, transportation, and use. At the same time, the protective layer 430 can increase the mechanical strength of the conductive layer and reduce the risk of deformation and fracture of the conductive layer under mechanical stress.

[0175] In some embodiments, the first connecting layer 411, the second connecting layer 412, the conductive layer, and the protective layer 430 can be sequentially formed by physical vapor deposition, atomic layer deposition, magnetron sputtering deposition, or the like.

[0176] In some embodiments, the first connecting layer 411 includes at least one of a titanium layer and a molybdenum layer.

[0177] In some embodiments, the second connecting layer 412 includes at least one of a titanium layer and a molybdenum layer.

[0178] In some embodiments, the titanium layer has good adhesion. Strong bonding force can be formed between titanium atoms and surface atoms of the glass substrate 100. By setting the first connecting layer 411 as a titanium layer, the connection strength of the first connecting layer 411 and the substrate 100 is improved, and the connection stability of the conductive wire 410 and the substrate 100 is further improved.

[0179] In some embodiments, the titanium layer can be deposited on the glass substrate 100 by physical vapor deposition, chemical vapor deposition, and sputtering deposition, or the like. Moreover, by performing surface treatment on the glass substrate 100, such as cleaning, plasma treatment, or chemical treatment, the adhesion of the titanium layer can be significantly improved.

[0180] In some embodiments, the molybdenum layer also has good adhesion. In particular, under high-temperature deposition conditions, molybdenum atoms can form strong bonding forces with the surface of the glass substrate 100. By setting the first connecting layer 411 as a molybdenum layer, the connection strength of the first connecting layer 411 and the substrate 100 is improved, thereby improving the connection stability of the conductive wire 410 and the substrate 100.

[0181] In some embodiments, the molybdenum layer can be deposited on the glass substrate 100 by physical vapor deposition, sputter deposition, and the like. By controlling the deposition rate and temperature, the adhesion of the molybdenum layer is optimized. By surface treating the glass substrate 100, such as cleaning, plasma treatment, or chemical treatment, the adhesion of the molybdenum layer can be significantly improved.

[0182] In some embodiments, the first connecting layer 411 is a titanium layer, and the second connecting layer 412 is a molybdenum layer.

[0183] In some embodiments, the first connecting layer 411 is a titanium layer, and the second connecting layer 412 is a titanium layer.

[0184] In some embodiments, the first connecting layer 411 is an alloy layer formed by titanium and molybdenum, and the second connecting layer 412 is a molybdenum layer.

[0185] In some embodiments, the first connecting layer 411 is an alloy layer formed by titanium and molybdenum, and the second connecting layer 412 is an alloy layer formed by titanium and molybdenum.

[0186] In some embodiments, the conductive layer includes at least one of an aluminum layer, a copper layer, and a silver layer.

[0187] In some embodiments, by setting the conductive layer as a silver layer, the silver layer has good conductivity with a resistivity of about 1.59 μΩ·cm, thereby improving the conductivity efficiency of the conductive member 420.

[0188] In some embodiments, the aluminum layer has the advantages of conductivity and low cost. By setting the conductive layer as an aluminum layer, the conductivity of the conductive member 420 is achieved while the production cost is saved.

[0189] In some embodiments, the copper layer has conductivity, and in addition, the copper layer has good mechanical strength and ductility, facilitating the processing and manufacturing of complex circuit 800a patterns. By setting the conductive layer as a copper layer, the conductivity of the conductive member 420 is achieved, and at the same time, it is beneficial for the staff to prepare the conductive member 420 into the required circuit 800a pattern.

[0190] In some embodiments, the protective layer 430 includes, but is not limited to, an indium tin oxide layer and an indium zinc oxide layer.

[0191] In some embodiments, the indium tin oxide layer has electrical conductivity, chemical stability, corrosion resistance. At the same time, the indium tin oxide layer has mechanical strength and wear resistance.

[0192] In some embodiments, the indium zinc oxide layer has electrical conductivity, flexibility and processability, chemical stability and wear resistance. By setting the protective layer 430 as an indium tin oxide layer or an indium zinc oxide layer with wear resistance, the wear resistance of the conductive assembly 401 is improved while ensuring the electrical conductivity of the conductive assembly 401, avoiding damage to the conductive assembly 401 by external force, and improving the service life of the conductive assembly 401.

[0193] FIG. 31 is another structural schematic diagram of a display device according to some embodiments. As shown in FIG. 31, the display device can further include a circuit 800a, a chip 800b, a chip-on-film 800c and a circuit board 800d. The circuit 800a and the chip 800b are both disposed on the first surface 110. The circuit 800a is connected to the first surface 110. The chip 800b is electrically connected to the circuit 800a.

[0194] The chip-on-film 800c and the circuit board 800d are disposed on the side of the substrate 100 close to the second surface 120. The first end of the chip-on-film 800c is electrically connected to the conductive assembly 401 and the second terminal 300. The second end of the chip-on-film 800c is electrically connected to the circuit board 800d.

[0195] In some embodiments, the display device can further include an encapsulation film layer 900. The encapsulation film layer 900 is disposed on the first surface 110. The encapsulation film layer 900 covers at least part of the circuit 800a, the chip 800b and the conductive assembly 401.

[0196] In some embodiments, the circuit 800a can be a driving circuit. The chip 800b can be an LED chip. The circuit 800a is electrically connected to the chip 800b. The circuit 800a is used to drive the chip 800b to emit light.

[0197] In some embodiments, the chip 800b is a basic light-emitting unit for constructing the display screen of the display device. The LED chip can emit high-brightness light. There are multiple LED chips. Each chip 800b can be individually controlled in brightness and color, thereby realizing high dynamic range and finer image display of the display device.

[0198] In some embodiments, the circuit board 800d can be a flexible circuit board. The circuit board 800d is disposed on the side of the chip-on-film 800c away from the second terminal 300, and the circuit board 800d is connected to the chip-on-film 800c.

[0199] In some embodiments, the encapsulation film layer 900 has protective properties. The encapsulation film layer 900 can effectively block moisture and water, prevent the chip 800b and the circuit 800a from being damp, and prolong their service life. The encapsulation film layer 900 can isolate oxygen, prevent the chip 800b and the metal wire from oxidizing, and maintain the stability of their electrical properties. The encapsulation film layer 900 has good mechanical strength, and can protect the chip 800b from external impact and vibration. The wear resistance of the encapsulation film layer 900 enables it to remain intact during long-term use and is not prone to wear and tear.

[0200] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present disclosure, and not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present disclosure.

Claims

1. A display device, comprising: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; the side surface is arranged at a first end of the substrate; the first surface has a first binding area, and the second surface has a second binding area; a first terminal arranged in the first binding area; a second terminal arranged in the second binding area; a conductive wire, at least a part of the conductive wire being arranged on the side surface; a first end of the conductive wire extends to the first surface and is electrically connected with the first terminal; and a second end of the conductive wire extends to the second surface and is electrically connected with the second terminal; a middle part of the first end of the substrate is convex outward in a direction away from the substrate, relative to two end parts of the first end of the substrate, in a direction from the first surface to the second surface. 2.The display device of claim 1, wherein the first terminal comprises a plurality of first connection ends, the second terminal comprises a plurality of second connection ends, and the conductive wire has a plurality of conductive wires; the plurality of first connection ends are connected with the first ends of the plurality of conductive wires one by one, and the second ends of the plurality of conductive wires are electrically connected with the plurality of second connection ends one by one. 3.A display device, comprising: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; the first surface has a first binding area, and the second surface has a second binding area; a first terminal arranged in the first binding area; a second terminal arranged in the second binding area; a conductive wire, at least a part of the conductive wire being arranged on the side surface; a first end of the conductive wire extends to the first surface and is electrically connected with the first terminal; and a second end of the conductive wire extends to the second surface and is electrically connected with the second terminal; a connecting film connected with the substrate through the conductive wire, the connecting film covering the side surface, the first binding area, and the second binding area of the substrate. 4.The display device of claim 3, wherein a middle part of the first end of the substrate is convex outward in a direction away from the substrate, relative to two end parts of the first end of the substrate, in a direction from the first surface to the second surface. 5.The display device of claim 3, wherein the connecting film is a flexible film. 6.The display device of claim 4, wherein the connecting film comprises a polyimide film. 7.The display device of claim 4, wherein a thickness of the connecting film is greater than or equal to 10μm and less than or equal to 20μm. 8.A display device, comprising: a substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, the side surface being arranged between the first surface and the second surface; the side surface is provided with a groove; the first surface has a first binding area, and the second surface has a second binding area; a first terminal arranged in the first binding area; a second terminal arranged in the second binding area; The conductive assembly comprises: a conductive wire and a conductive piece which are sequentially stacked, at least part of the conductive wire is arranged on the side surface, and at least part of the conductive wire extends into the groove; The first end of the conductive wire extends to the first surface and is electrically connected with the first terminal; and the second end of the conductive wire extends to the second surface and is electrically connected with the second terminal.

9. The display device of claim 8, the conductive wire comprises at least two connection layers, and at least part of the connection layers is sequentially stacked on the side surface in a direction away from the substrate.

10. The display device of claim 9, the conductive wire comprises a first connection layer and a second connection layer; the first connection layer comprises a first connection segment and a second connection segment which are connected with each other, the first connection segment is arranged on the first surface and is electrically connected with the first terminal; and the second connection segment is arranged on the side surface and is connected with the substrate, and at least part of the second connection segment extends into the groove; the second connection layer comprises a third connection segment and a fourth connection segment which are connected with each other, the third connection segment is arranged on the second surface and is electrically connected with the second terminal; and the fourth connection segment is arranged on the side surface; the second connection segment and the fourth connection segment are sequentially stacked.

11. The display device of claim 10, the conductive assembly further comprises a protective layer; and the conductive piece comprises a conductive layer; the second connection segment, the fourth connection segment, the conductive layer and the protective layer are sequentially stacked in a direction intersecting the thickness direction of the substrate.

12. The display device of claim 9, the side surface comprises a first inclined surface, a vertical surface and a second inclined surface which are sequentially connected, the first inclined surface is connected with the first surface, and the second inclined surface is connected with the second surface; the vertical surface is convex outward in a direction away from the substrate relative to the first inclined surface and the second inclined surface at both ends of the side surface in the thickness direction of the substrate; the vertical surface extends in the thickness direction of the substrate, the extending direction of the first inclined surface intersects the thickness direction of the substrate, and the extending direction of the second inclined surface intersects the thickness direction of the substrate.

13. The display device of claim 12, the vertical surface is provided with the groove, and the groove opening faces away from the substrate; a plurality of grooves are provided, and the plurality of grooves are sequentially and spaced arranged in the thickness direction of the substrate; and / or, the plurality of grooves are sequentially and spaced arranged in a direction intersecting the thickness direction of the substrate.

14. The display device of claim 11, the first connection layer comprises at least one of a titanium layer and a molybdenum layer; and / or, the second connection layer comprises at least one of a titanium layer and a molybdenum layer; and / or, the conductive layer comprises at least one of an aluminum layer, a copper layer and a silver layer; and / or, the protective layer comprises, but is not limited to, an indium tin oxide layer and an indium zinc oxide layer.

15. The display device of any one of claims 8-14, wherein the first terminal is provided with a first protrusion on a surface of the first terminal facing away from the substrate. And / or, the second terminal is provided with a second protrusion on a surface of the second terminal facing away from the substrate.

16. The display device of any one of claims 8-14, further comprising: a circuit, a chip, a chip on film, and a circuit board; the circuit and the chip are both provided on the first surface, the circuit and the first surface are connected, and the chip and the circuit are electrically connected; the chip on film and the circuit board are provided on a side of the substrate close to the second surface, a first end of the chip on film is electrically connected to the second terminal through the conductive assembly, and a second end of the chip on film is electrically connected to the circuit board; And / or, the display device further comprises an encapsulation film layer, the encapsulation film layer is provided on the first surface, and the encapsulation film layer covers at least part of the circuit, the chip, and the conductive assembly.

17. A display device, comprising: a substrate, the substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, and the side surface being used to connect the first surface and the second surface; a first terminal, the first terminal being used to connect a first binding area of the first surface; a second terminal, the second terminal being used to connect a second binding area of the second surface; a conductive assembly, the conductive assembly comprising: a conductive wire and a conductive piece being sequentially and layerwisely arranged, at least part of the conductive wire being used to be connected on the side surface, at least part of the conductive wire being used to extend into a groove of the side surface, a first end of the conductive wire being used to extend to the first surface and be electrically connected to the first terminal, and a second end of the conductive wire being used to extend to the second surface and be electrically connected to the second terminal.

18. A manufacturing method of a display device, used for manufacturing the display device of any one of claims 1-2, the manufacturing method of the display device comprising: providing a substrate; the substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, and the side surface being arranged between the first surface and the second surface; the first surface having a first binding area, and the second surface having a second binding area; forming a first terminal in the first binding area and a second terminal in the second binding area; forming a conductive layer on the first binding area, the second binding area, and the side surface of the substrate; at least part of the conductive layer covering the side surface, a first end of the conductive layer extending to the first binding area and covering the first terminal, and a second end of the conductive layer extending to the second binding area and covering the second terminal; patterning the conductive layer to form a conductive wire.

19. A manufacturing method of a display device, used for manufacturing the display device of any one of claims 3-7, the manufacturing method of the display device comprising: providing a substrate; the substrate having a first surface, a second surface, and a side surface, the first surface and the second surface being oppositely arranged, and the side surface being arranged between the first surface and the second surface; The first surface has a first binding area, and the second surface has a second binding area; A first terminal is formed in the first binding area, and a second terminal is formed in the second binding area; A connecting film is provided, and a conductive wire is formed on a first surface of the connecting film; The connecting film is bent, and the connecting film is attached to the first binding area, the side surface, and the second binding area, respectively; The conductive wire connects at least part of the first terminal and at least part of the second terminal.

20. A manufacturing method of a display device, for manufacturing the display device of any one of claims 8-16, the manufacturing method of the display device comprising: providing a substrate; The substrate has a first surface, a second surface, and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the side surface is provided with a groove; the first surface has a first binding area, and the second surface has a second binding area; A first terminal is formed in the first binding area, and a second terminal is formed in the second binding area; A conductive assembly is provided, and a conductive wire and a conductive piece are arranged in the conductive assembly in a sequentially stacked manner; at least part of the conductive wire is arranged on the side surface, and at least part of the conductive wire extends into the groove; a first end of the conductive wire extends to the first surface and is electrically connected to the first terminal; and a second end of the conductive wire extends to the second surface and is electrically connected to the second terminal.

21. A manufacturing method of a display device, for manufacturing the display device of claim 17, the manufacturing method of the display device comprising: providing a substrate; The substrate has a first surface, a second surface, and a side surface, the first surface and the second surface are oppositely arranged, and the side surface is arranged between the first surface and the second surface; the side surface is provided with a groove; the first surface has a first binding area, and the second surface has a second binding area; A first terminal is formed in the first binding area, and a second terminal is formed in the second binding area; A conductive assembly is provided, and a conductive wire and a conductive piece are arranged in the conductive assembly in a sequentially stacked manner; at least part of the conductive wire is arranged on the side surface, and at least part of the conductive wire extends into the groove; a first end of the conductive wire extends to the first surface and is electrically connected to the first terminal; and a second end of the conductive wire extends to the second surface and is electrically connected to the second terminal. ​

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