Display module and display device

Abstract

The present disclosure relates to the technical field of display, and provides a display module and a display device, which can at least solve the problem of a failure in resistance testing due to existing display modules being prone to insufficient grounding. The display module comprises: a display panel. The display panel comprises: a main body portion. The main body portion has a display side and a non-display side arranged opposite to each other. The display module further comprises: a circuit board located on the non-display side of the main body portion, and a reinforcement support layer located on the side of the circuit board close to the main body portion. The reinforcement support layer comprises: a first metal layer, a conductive adhesive layer, and a second metal layer sequentially arranged in the direction facing away from the main body portion. The second metal layer is provided with a groove. The groove exposes a portion of the conductive adhesive layer. The circuit board is located in the groove and is connected to the first metal layer and the second metal layer by means of the conductive adhesive layer.

Description

Display module and display device

[0001] Cross-reference to Related Applications

[0002] This application claims priority to Chinese Utility Model Application No. 202421152100.1, filed May 24, 2024, the entire contents of which are incorporated herein by reference. TECHNICAL FIELD

[0003] The present disclosure belongs to the technical field of display, and specifically relates to a display module and a display device. BACKGROUND

[0004] With the development of flexible display panel technology, the application of foldable display modules is becoming more and more widespread. Due to the characteristics of flexibility and easy bending of foldable display modules, foldable display modules have become the current design mainstream and have great development space.

[0005] In a foldable display module, the copper leakage area of a circuit board is often insufficient, and grounding is insufficient, which leads to unqualified resistance test, and the grounding terminal cannot be effectively turned on. In this case, it will affect the electro-static discharge (ESD) of the foldable display module, and in severe cases, it will also affect the display quality of the foldable display module, reducing the user's experience. SUMMARY

[0006] The present disclosure aims to at least solve one of the technical problems existing in the prior art, and provides a display module and a display device.

[0007] In a first aspect, the embodiments of the present disclosure provide a display module, comprising: a display panel; the display panel comprises: a main body part; the main body part has a display side and a non-display side arranged opposite to each other; the display module further comprises: a circuit board located at the non-display side of the main body part, a reinforcing support layer located at a side of the circuit board close to the main body part;

[0008] The reinforcing support layer comprises: a first metal layer, a conductive adhesive layer and a second metal layer arranged in sequence in a direction away from the main body part;

[0009] The second metal layer has a slot; the slot exposes a part of the conductive adhesive layer; and

[0010] The circuit board is located in the slot and is connected with the first metal layer and the second metal layer through the conductive adhesive layer.

[0011] In some embodiments, the circuit board comprises: a bottom plate, a component located on a side of the bottom plate away from the main body portion, and a grounding terminal located on a side of the bottom plate close to the main body portion and connected to the component; and

[0012] The grounding terminal is connected to the first metal layer and the second metal layer through the conductive adhesive layer.

[0013] In some embodiments, the display panel further comprises: a binding portion, and a bending portion connecting the main body portion and the binding portion.

[0014] The binding portion is located on the non-display side of the main body portion.

[0015] The bending portion is bent towards the non-display side of the main body portion.

[0016] In some embodiments, the first metal layer, the conductive adhesive layer, and the second metal layer all have a projection on the main body portion that at least partially overlaps with a projection of the binding portion on the main body portion.

[0017] In some embodiments, the circuit board further comprises: a binding terminal located on one end of the bottom plate and connected to the component; and

[0018] The component is connected to the binding portion through the binding terminal.

[0019] In some embodiments, the display module further comprises: a first panel support layer; and

[0020] The first panel support layer is located on a side of the main body portion close to the first metal layer.

[0021] In some embodiments, a projection of the first panel support layer on the main body portion at least partially overlaps with a projection of the binding portion on the main body portion.

[0022] In some embodiments, the reinforcing support layer further comprises: a first adhesive layer located on a side of the first metal layer close to the main body portion; and

[0023] The first metal layer is attached to the first panel support layer through the first adhesive layer.

[0024] In some embodiments, the display module further comprises: a second panel support layer; and

[0025] The second panel support layer is located on a side of the binding portion close to the main body portion.

[0026] In some embodiments, the display module further comprises: a second adhesive layer located between the second panel support layer and the second metal layer; and

[0027] The second panel support layer is attached to the second metal layer through the second adhesive layer.

[0028] In some embodiments, the display module further comprises: a third metal layer; and

[0029] The third metal layer is located between the conductive adhesive layer and the ground terminal.

[0030] In some embodiments, the display module further comprises: an electromagnetic shielding layer located on the side of the ground terminal close to the second metal layer; the electromagnetic shielding layer is provided with a first opening; and

[0031] The orthographic projection of the first opening on the main body portion at least partially overlaps the orthographic projection of the ground terminal on the main body portion.

[0032] In some embodiments, the display module further comprises: a third adhesive layer located between the electromagnetic shielding layer and the conductive adhesive layer; the third adhesive layer is provided with a second opening; and

[0033] The orthographic projection of the second opening on the main body portion at least partially overlaps the orthographic projection of the ground terminal on the main body portion.

[0034] In some embodiments, the middle portion of the conductive adhesive layer has a protrusion, which fills the first opening and is in contact with the ground terminal.

[0035] In some embodiments, the second opening and the first opening completely overlap each other in a direction perpendicular to the main body portion.

[0036] In some embodiments, the third metal layer is formed in the first opening.

[0037] In some embodiments, the middle portion of the conductive adhesive layer has a protrusion, which fills the second opening and is connected to the ground terminal through the third metal layer.

[0038] In some embodiments, the thickness of the first metal layer is 30-50 microns.

[0039] In some embodiments, the display module further comprises: a cover plate; and

[0040] The cover plate covers the display side of the main body portion.

[0041] In a second aspect, the embodiments of the present disclosure provide a display device, which comprises the display module provided in any one of the embodiments of the first aspect. BRIEF DESCRIPTION OF DRAWINGS

[0042] FIG. 1 is a schematic diagram of a planar structure of a display module according to an embodiment of the present disclosure.

[0043] FIG. 2 is a schematic diagram of another planar structure of a display module according to an embodiment of the present disclosure.

[0044] FIG. 3 is a schematic diagram of a cross-sectional structure of the display module along the A-A' direction shown in FIG. 1.

[0045] FIG. 4 is a schematic diagram of a structure of a reinforcing support layer in the display module shown in FIG. 3.

[0046] FIG. 5 is a schematic diagram of a planar structure of a display module according to an embodiment of the present disclosure.

[0047] FIG. 6 is a schematic diagram of another planar structure of a display module according to an embodiment of the present disclosure.

[0048] FIG. 7 is a schematic diagram of a cross-sectional structure of the display module along the B-B' direction shown in FIG. 5.

[0049] FIG. 8 is a schematic diagram of a structure of a reinforcing support layer in the display module shown in FIG. 7.

[0050] FIG. 9 is a schematic diagram of another cross-sectional structure of the display module along the B-B' direction shown in FIG. 5. DETAILED DESCRIPTION

[0051] The technical solutions in some embodiments of the present disclosure will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present disclosure, but not all the embodiments. Based on the embodiments provided by the present disclosure, all other embodiments obtained by those skilled in the art belong to the scope of protection of the present disclosure.

[0052] Unless the context clearly requires otherwise, throughout the description and the claims, the term "comprise," and variations thereof (e.g., "comprises" and "comprising"), will be construed both to cover the containing feature or features and additional feature or features not described. In describing some embodiments, the use of "connect" or "connected" or "connecting" can be used. The term "connect" is used broadly and expressly includes connections through intermediaries. The term "connected" is used broadly and expressly includes both direct connections and indirect connections through intermediaries.

[0053] Various elements can be described herein as, for example, "first" and "second". These elements should not be limited by these terms. These terms are only used to distinguish one component from another. Terms, such as "first" and "second", are used only to distinguish one component from another. For example, in one embodiment, an element referred to as a first element in one embodiment can be referred to as a second element in another embodiment. Singular forms of terms can include plural forms unless the context clearly dictates otherwise.

[0054] In describing some embodiments, the use of "connect" or "connected" or "connecting" can be used. The term "connect" is used broadly and expressly includes connections through intermediaries. The term "connected" is used broadly and expressly includes both direct connections and indirect connections through intermediaries.

[0055] "A, B, and C at least one of" has the same meaning as "at least one of A, B, or C". Both of these phrases imply any one of the following possibilities: A alone, B alone, C alone, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A and B and C.

[0056] The use of "adapted to" or "configured to" herein means open and inclusive language that is not limited to devices or steps adapted or configured to perform additional tasks or steps.

[0057] “About” or“approximately,” as used in reference to a measurement or an amount, includes the recited value and means within a reasonable range of the recited value, as determined by one of ordinary skill in the art in light of the measurement or the amount at issue. For example,“about” can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the recited value.

[0058] As used herein,“parallel,”“perpendicular,”“equal” includes the recited condition and conditions approximating the recited condition within a range of acceptable deviation, as determined by one of ordinary skill in the art in light of the measurement at issue and the error associated with a particular amount of measurement (i.e., the limitations of the measurement system). For example,“parallel” includes absolute parallel and near parallel, where near parallel can have an acceptable deviation range of, for example, within 5°;“perpendicular” includes absolute perpendicular and near perpendicular, where near perpendicular can also have an acceptable deviation range of, for example, within 5°. “Equal” includes absolute equality and near equality, where near equality can have an acceptable deviation range of, for example, a difference between the two that is less than or equal to 5% of either.

[0059] It will be understood that when a layer or element is referred to as being“on” another layer or substrate, it can be directly on the other layer or substrate or intervening layers can also be present.

[0060] Exemplary embodiments are described herein with reference to cross-sectional and / or plan view illustrations that are idealized examples. In the interest of clarity, not all of the layer's and regions are shown in the drawings with the same levels of detail. For example, while the drawings can show a number of layers and / or regions separated into individual horizontal strata, the illustrated package can in fact include many more layers and regions. Furthermore, the layers can be formed by depositing one or more films of uniform thickness and / or by etching one or more films to form a desired pattern. The thickness of the layers can be exaggerated in the drawings for clarity. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated in the drawings, which are schematic representations. Rather, the exemplary embodiments are intended to include all shapes of regions that can be formed in the described manner. For example, the etched regions shown as rectangular will typically have curved features.

[0061] In this specification, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0062] In the present disclosure, terms such as "lower", "below", "upper" and "above" and the like are used to explain the relative association of the components shown in the drawings. The terms can be relative concepts and described based on the direction represented in the drawings, but are not limited thereto.

[0063] The term "overlapping" or "overlapped" means that the first object can be above or below the second object or on the side of the second object, and vice versa. In addition, the term "overlapping" can include layering, stacking, facing or facing, extending on, covering or partially covering, or any other suitable term that will be appreciated and understood by those of ordinary skill in the art.

[0064] FIG. 1 is a schematic diagram of a planar structure of a display module according to an embodiment of the present disclosure, and FIG. 2 is a schematic diagram of another planar structure of a display module according to an embodiment of the present disclosure. As shown in FIGS. 1 and 2, the display module has a display area A and a peripheral area B provided on at least one side of the display area A. In FIGS. 1 and 2, the peripheral area B is provided around the display area A as an example.

[0065] As shown in FIGS. 1 and 2, the display area A is an area for displaying an image and is configured to provide a plurality of pixel units P, and the peripheral area B is an area for not displaying an image and is configured to provide a display driving circuit, for example, a gate driving circuit and a source driving circuit.

[0066] The display area A in the display module includes at least one bendable area A1 and at least two non-bendable areas A2. In some examples, as shown in FIGS. 1 and 2, the display panel module can include one bendable area A1 and two non-bendable areas A2.

[0067] For example, as shown in FIG. 1, the bendable area A1 extends in a first direction (X direction), and the two non-bendable areas A2 are respectively provided on both sides of the bendable area A1 in a second direction (Y direction), and the adjacent two non-bendable areas A2 are connected by the bendable area A1.

[0068] Alternatively, as shown in FIG. 2, the bendable area A1 extends in the second direction (Y direction), and the two non-bendable areas A2 are respectively provided on both sides of the bendable area A1 in the first direction (X direction), and the adjacent two non-bendable areas A2 are connected by the bendable area A1.

[0069] In the following, the display module having one bendable area A1 and two non-bendable areas A2 is taken as an example for illustrative description, but the embodiments of the present disclosure are not limited thereto, and a display module having a plurality of bendable areas A1 and a plurality of non-bendable areas A2 can also be considered, as long as the same technical idea is applied.

[0070] Exemplarily, as shown in FIG. 1 and FIG. 2, the two non-bendable areas A2 can be symmetrically arranged relative to the bendable area A1, so that the two non-bendable areas A2 are flush with each other at one end away from the bendable area A1 after the display module is bent.

[0071] In addition, in the case of the inner folding display module, the two non-bendable areas A2 of the display module are arranged in a face-to-face manner after the display module is bent. In the case of the outer folding display module, the two non-bendable areas A2 of the display module are arranged in a back-to-back manner.

[0072] FIG. 3 is a schematic view of a cross-sectional structure of the display module shown in FIG. 1 along the A-A' direction. As shown in FIG. 3, the display module includes a display panel 101, a circuit board 102, and a reinforcing support layer 103. It can be understood that the cross-sectional structure at the corresponding position in FIG. 2 is the same as the structure shown in FIG. 3, and will not be described again.

[0073] The display panel 101 includes a main body part 1011, a binding part 1012, a bending part 1013 connecting the main body part 1011 and the binding part 1012, and the bending part 1013 is located between the main body part 1011 and the binding part 1012.

[0074] The main body part 1011 can be a part of the display panel 101 for displaying images, that is, the above-mentioned display area A (as shown in FIG. 1 and FIG. 2) is located in the main body part 1011, that is, the main body part 1011 has the display area A (as shown in FIG. 1 and FIG. 2).

[0075] The main body part 1011 has a display side and a non-display side arranged oppositely, the display side refers to a side of the main body part 1011 displaying images (the lower side of the main body part 1011 in FIG. 3), and the non-display side refers to the other side opposite to the display side (the upper side of the main body part 1011 in FIG. 3).

[0076] The binding part 1012 is a part of the display panel 101 for binding connection with the circuit board 102, and through a bending process, the bending part 1013 can be bent along a bending axis extending in a first direction (X direction) towards the non-display side of the main body part 1011 of the display panel 101, so that the binding part 1012 is bent to the non-display side of the main body part 1011, thereby reducing the frame of the display module. The bending axis is not an actual structure existing in the display panel 101, but a concept proposed only for the purpose of describing the bending process of the display panel 101.

[0077] As shown in FIG. 3, after the binding part 1012 is bent, the circuit board 102 can be arranged on the non-display side of the main body part 1011 along with the binding part 102, so as to achieve the purpose of reducing the frame of the display module.

[0078] As shown in FIG. 3, the circuit board 102 is located on the main body part 1011 and is connected to the binding part 1012. The circuit board 102 includes a bottom plate 1021, components 1022 located on the side of the bottom plate 1021 away from the main body part 1011, and a grounding terminal 1023 located on the side of the bottom plate 1021 close to the main body part 1011 and connected to the components 1022. The grounding terminal 1023 is generally made of metal materials such as copper, and the area where the grounding terminal 1023 is located can be referred to as a copper leakage area.

[0079] As shown in FIG. 3, the reinforcing support layer 103 is located on the side of the circuit board 102 close to the main body part 1011. FIG. 4 is a structural schematic diagram of the reinforcing support layer in the display module shown in FIG. 3. As shown in FIGS. 3 and 4, the reinforcing support layer 103 generally adopts a four-layer structure, including a first adhesive layer 1031, a substrate layer 1032, an auxiliary adhesive layer 1033, and a metal layer 1034 arranged in sequence in the direction away from the main body part 1011. The first adhesive layer 1031 and the auxiliary adhesive layer 1033 can be made of pressure-sensitive adhesive materials, the substrate layer 1032 can be made of polyimide (PI), and the metal layer 1034 can be made of metal materials such as stainless steel.

[0080] The metal layer 1034 in the reinforcing support layer 103 is connected to the grounding terminal 1023 of the circuit board 102 through conductive glue (which is located between the middle part of the grounding terminal 1023 and the metal layer 1034 as shown in FIG. 3). On the one hand, it can support the circuit board 102, and on the other hand, it can be used as a grounding signal terminal to release static electricity in the circuit board 102 and prevent static electricity from breaking through the components 1022 therein.

[0081] However, due to insufficient copper leakage area in the circuit board 102 and weak adhesion performance of the conductive glue and the metal layer 1034, insufficient grounding is easily caused, leading to unqualified resistance test. In the case that the grounding terminal 1023 cannot be effectively turned on, the Electro-Static Discharge (ESD) of the display module will be affected, and in serious cases, the display quality of the display module will also be affected, reducing the user's experience.

[0082] In order to at least solve one of the above technical problems, other embodiments of the present disclosure provide a display module and a display device. The display module and the display device provided by the embodiments of the present disclosure will be further described in detail below in combination with the drawings and specific embodiments.

[0083] In a first aspect, the display module provided in the embodiments of the present disclosure includes a display panel 101. The display panel 101 includes a main body portion 1011. The main body portion 1011 has a display side and a non-display side opposite to the display side. The display module further includes a circuit board 102 located on the non-display side of the main body portion 1011, and a reinforcing support layer 103 located on the side of the circuit board 102 close to the main body portion 1011. The reinforcing support layer 103 includes a first adhesive layer 1031 (which is optional), a first metal layer 1035, a conductive adhesive layer 1036, and a second metal layer 1037 arranged in sequence away from the main body portion 1011. The second metal layer 1037 has a slot M. The slot M exposes a part of the conductive adhesive layer 1036. The circuit board 102 is located in the slot M and is connected to the first metal layer 1035 and the second metal layer 1037 through the conductive adhesive layer 1036.

[0084] FIG. 7 is a schematic view of a cross-sectional structure of the display module shown in FIG. 5 along the direction of B-B'. As shown in FIG. 7, the display module includes the display panel 101. The display panel 101 includes the main body portion 1011. The main body portion 1011 has a display side and a non-display side opposite to the display side. The display module further includes the circuit board 102 located on the non-display side of the main body portion 1011, and the reinforcing support layer 103 located on the side of the circuit board 102 close to the main body portion 1011. FIG. 8 is a schematic view of the structure of the reinforcing support layer 103 in the display module shown in FIG. 7. As shown in FIG. 7 and FIG. 8, the reinforcing support layer 103 can include the first adhesive layer 1031 (which is optional), the first metal layer 1035, the conductive adhesive layer 1036, and the second metal layer 1037 arranged in sequence away from the main body portion 1011. The second metal layer 1037 has a slot M. The slot M exposes a part of the conductive adhesive layer 1036. The circuit board 102 is located in the slot M and is connected to the first metal layer 1035 and the second metal layer 1037 through the conductive adhesive layer 1036. It can be understood that the cross-sectional structure of the corresponding position in FIG. 6 is the same as that shown in FIG. 7, and will not be described again.

[0085] The display panel 101 can be any one of an organic light-emitting diode (OLED) display panel, a quantum dot light-emitting diode display panel, a micro light-emitting diode display panel, a plasma display panel, a field emission display panel, an electrowetting display panel, or an electrophoretic display panel, which is not limited in the embodiments of the present disclosure.

[0086] The main body portion 1011 can be a part of the display panel 101 used for displaying images, that is, the above-mentioned display area A (as shown in FIG. 5 and FIG. 6) is located in the main body portion 1011, that is, the main body portion 1011 has the display area A (as shown in FIG. 5 and FIG. 6).

[0087] The main body part 1011 has an opposite display side and a non-display side, the display side refers to the side of the main body part 1011 displaying an image (the lower side of the main body part 1011 in FIG. 7), and the non-display side refers to the other side opposite to the display side (the upper side of the main body part 1011 in FIG. 7).

[0088] The circuit board 102 can be a flexible printed circuit (FPC) for example, which is provided with a signal line and the like structure, and can transmit a signal to the display panel 101, so that the display panel 101 realizes a display function.

[0089] The reinforcing support layer 103 can support the circuit board 102, which can adopt a four-layer structure, i.e., a first adhesive layer 1031, a first metal layer 1035, a conductive adhesive layer 1036 and a second metal layer 1037 arranged in turn in the direction away from the main body part 1011.

[0090] The first adhesive layer 1031 can be made of a pressure-sensitive adhesive material, and the first metal layer 1035 thereon can be laminated with other film layers. The first metal layer 1035 and the second metal layer 1037 can be made of a metal material such as stainless steel, and adopt a double-layer metal structure, which can further improve the support performance of the reinforcing support layer 103. The conductive adhesive layer 1036 can laminate the first metal layer 1035 and the second metal layer 1037. Meanwhile, the second metal layer 1037 on the conductive adhesive layer 1036 is provided with a slot M, which can expose a part of the conductive adhesive layer 1036.

[0091] The circuit board 102 is located in the slot M and is directly connected with the conductive adhesive layer 1036, and the conductive adhesive can not be arranged on the circuit board 102, which can reduce the thickness of the circuit board 102. Meanwhile, the circuit board 102 can be sunken, which can reduce the space occupied by the circuit board 102, and provide space for the battery and the like structure in the display module, so as to improve the capacity of the battery and the endurance of the display module.

[0092] The conductive adhesive layer 1036 is laminated with the upper and lower metal layers, i.e., the first metal layer 1035 and the second metal layer 1037, and the first metal layer 1035 and the second metal layer 1037 can serve as a ground signal terminal, which can increase the contact area between the conductive adhesive layer 1036 and the ground signal terminal, avoid insufficient grounding, cause resistance test unqualified, and avoid affecting the electro-static discharge (ESD) of the display module, so as to improve the display quality of the display module and enhance the user experience.

[0093] The first metal layer 1035 and the second metal layer 1037 can be made of metal materials such as stainless steel, wherein the second metal layer 1037 is generally thicker, and the thickness is usually 100-150 microns, for example, 100 microns, so that the depth of the slot M is 100 microns, which can make the circuit board 102 sink 100 microns to provide more space for the battery and other structures in the display module, while reducing the weight of the display module. The thickness of the first metal layer 1035 is generally thinner, and the thickness is usually 30-50 microns, for example, 30 microns, that is, the substrate layer 1032 (polyimide film layer) shown in FIGS. 3 and 4 is replaced by the first metal layer 1035 (stainless steel layer) with a thickness of 30 microns, which can increase the contact area between the conductive adhesive layer 1036 and the ground signal terminal, and to a certain extent, optimize the anti-impact performance of the display module when the pen or ball falls, and improve the anti-impact performance of the display module, thereby improving the service life of the display module and increasing the competitiveness of the display module.

[0094] In some embodiments, as shown in FIG. 7, the circuit board 102 includes a bottom plate 1021, components 1022 located on the side of the bottom plate 1021 away from the main body part 1011, and a ground terminal 1023 located on the side of the bottom plate 1021 close to the main body part 1011 and connected to the components 1022. The ground terminal 1023 is connected to the first metal layer 1035 and the second metal layer 1037 through the conductive adhesive layer 1036.

[0095] The bottom plate 1021 can be made of flexible materials such as polyimide (PI), which can form a flexible bottom plate that can support the components 1022 thereon. The components 1022 can be resistors, capacitors, inductors, etc. and are connected according to a predetermined design to transmit electrical signals. The ground terminal 1023 can be made of metal materials with strong conductivity such as copper.

[0096] The ground terminal 1023 is connected to the first metal layer 1035 and the second metal layer 1035 through the conductive adhesive layer 1036, and the first metal layer 1035 and the second metal layer 1037 can serve as ground signal terminals, which can increase the contact area between the conductive adhesive layer 1036 and the ground signal terminal, avoid insufficient grounding, cause resistance test failure, and avoid affecting the electro-static discharge (ESD) of the display module, thereby improving the display quality of the display module and enhancing the user experience.

[0097] In some embodiments, the display panel further includes a binding part 1012 and a bending part 1013 connecting the main body part 1011 and the binding part 1012. The binding part 1012 is located on the non-display side of the main body part 1011. The bending part 1013 is bent towards the non-display side of the main body part 1011.

[0098] The binding part 1012 is a part of the display panel 101 and the circuit board 102 binding connection, through the bending process, the bending part 1013 can be curved along the bending axis of the first direction (X direction) extending towards the non-display side of the main part 1011 of the display panel 101, so that the binding part 1012 is bent to the non-display side of the main part 1011, thereby reducing the frame of the display module. Wherein, the bending axis is not the actual structure existing in the display panel 101, but a concept proposed for the purpose of illustrating the bending process of the display panel 101.

[0099] As shown in Figure 7, after the binding part 1012 is bent, the circuit board 102 can be arranged on the non-display side of the main part 1011 with the binding part 102 to achieve the purpose of reducing the frame of the display module.

[0100] In some embodiments, as shown in Figure 7, the first metal layer 1035, the conductive adhesive layer 1036 and the second metal layer 1037 are at least partially overlapped with the orthographic projection of the binding part 1012 on the main part 1011.

[0101] The first metal layer 1035, the conductive adhesive layer 1036 and the second metal layer 1037 can continue to extend to the position of the display panel 101 binding part 1012 while supporting the circuit board 102, which can effectively support the main part 1011 of the display panel 101 and improve the strength of the main part 1011 of the display panel 101.

[0102] In some embodiments, as shown in Figure 7, the circuit board 102 further comprises: a binding terminal 1024 located at one end of the bottom plate 1021 and connected with the component 1022; the component 1022 is connected with the binding part 1012 through the binding terminal 1024.

[0103] The binding terminal 1024 can be made of metal materials with strong conductivity such as copper, and the component 1022 can be connected with the binding part 1012 through the binding terminal 1024 to provide electrical signals to the display panel 101.

[0104] In some embodiments, as shown in Figure 7, the display module further comprises: a first panel support layer 104; the first panel support layer 104 is located on the side of the main part 1011 close to the first metal layer 1035.

[0105] The first panel support layer 104 can effectively support the main part 1011 of the display panel 101, which can be made of metal materials or wave-absorbing materials, wherein the metal material has good support performance, and the wave-absorbing material is a kind of material that can absorb or greatly weaken the electromagnetic wave energy received on its surface, reducing the interference of electromagnetic waves.

[0106] In some embodiments, as shown in FIG. 7, the orthographic projection of the first panel support layer 104 on the main body part 1011 at least partially overlaps with the orthographic projection of the binding part 1012 on the main body part 1011. The display module further comprises: a second panel support layer 105; the second panel support layer 105 is located on the side of the binding part 1012 close to the main body part 1011.

[0107] The first panel support layer 104 extends to the position where it overlaps with the binding part 1012, which can effectively support the entire main body part 1011. At the same time, the side of the binding part 1012 close to the main body part 1011 is also provided with the second panel support layer 105, and the first panel support layer 104 and the second panel support layer 105 can jointly effectively support the binding part 1012 thereon to improve the strength of the binding part 1012.

[0108] The second panel support layer 105 can be made of a metal material or a wave-absorbing material, wherein the support performance of the metal material is better, and the wave-absorbing material is a kind of material that can absorb or greatly weaken the electromagnetic wave energy received on its surface and reduce the interference of electromagnetic waves, which can realize electromagnetic shielding.

[0109] In some embodiments, as shown in FIG. 7, the display module further comprises: a second adhesive layer 106 located between the second panel support layer 105 and the second metal layer 1037; the second panel support layer 105 is attached to the second metal layer 1037 through the second adhesive layer 106.

[0110] The second adhesive layer 106 can be made of a pressure-sensitive adhesive or the like, which can attach the second panel support layer 105 to the second metal layer 1037, so that the second metal layer 1037 and the first metal layer 1035 can also effectively support the binding part 1012, thereby further improving the strength of the binding part 1012 of the display panel 101.

[0111] FIG. 9 is another cross-sectional structure schematic view of the display module shown in FIG. 5 along the direction of B-B'. The display module shown in FIG. 9 is different from the display module shown in FIG. 7 in that the circuit board 102 in the display module shown in FIG. 7 can be a six-layer board, and the thickness of the bottom plate 1021 thereof is relatively thick, having a relatively strong support capacity, while the circuit board 102 shown in FIG. 9 can be a two-layer board, and the thickness of the bottom plate 1021 thereof is relatively thin, and its support capacity is also relatively weak. In order to further improve the overall strength of the circuit board 102, as shown in FIG. 9, the display module further comprises: a third metal layer 107; the third metal layer 107 is located between the conductive adhesive layer 1036 and the ground terminal 1023.

[0112] The third metal layer 107 can be made of a metal material such as stainless steel, and is located between the conductive adhesive layer 1036 and the grounding terminal 1023. The third metal layer 107 can support and conduct electricity for the circuit board 102 thereon, and further improve the overall strength of the circuit board 102.

[0113] It should be noted that the second adhesive layer 106 and the third metal layer 107 can both effectively support the circuit board 102 thereon. Since the strength of the second adhesive layer 106 is much smaller than that of the third metal layer 107, the second adhesive layer 106 can be thickened or removed according to actual conditions. For example, when a circuit board 102 with a smaller thickness is needed, the second adhesive layer 106 can be removed to meet the requirement of a smaller overall thickness of the display module. Alternatively, the number of layers or the thickness of the second adhesive layer 106 can be increased to provide higher support for the circuit board 102, so as to avoid deformation or misalignment of the circuit board 102 during preparation, transportation, and application.

[0114] In some embodiments, as shown in FIGS. 7 and 9, the display module further includes an electromagnetic shielding layer 108 located on the side of the grounding terminal 1023 close to the second metal layer 1037. The electromagnetic shielding layer 108 is provided with a first opening OP1. A normal projection of the first opening OP1 on the main body 1011 at least partially overlaps a normal projection of the grounding terminal 1023 on the main body 1011. In addition, as shown in FIG. 9, the third metal layer 107 is located in the first opening OP1 of the electromagnetic shielding layer 108, and the thickness of the third metal layer 107 can be equal to the thickness of the electromagnetic shielding layer 108.

[0115] The electromagnetic shielding layer 108 can be made of a metal material such as copper or stainless steel, and the thickness of the electromagnetic shielding layer 108 is determined according to a specific process. For example, the thickness of the electromagnetic shielding layer 108 can be 15 microns. The electromagnetic shielding layer 108 with this thickness can effectively protect the circuit board 102 thereon, and prevent external electromagnetic waves from interfering with the electrical signals transmitted in the circuit board 102.

[0116] In FIG. 7, the first opening OP1 is provided in the electromagnetic shielding layer 108, so that the grounding terminal 1023 is exposed to enable the grounding terminal 1023 to be connected to the conductive adhesive layer 1036. In other words, the first opening OP1 can be filled with the material of the conductive adhesive layer 1036, or the conductive adhesive layer 1036 can have a protrusion that fills the first opening OP1, so that the grounding terminal 1023 directly contacts the conductive adhesive layer 1036.

[0117] The circuit board 102 in the display module shown in FIG. 9 can be a two-layer board. In order to further improve the overall strength of the circuit board 102, as shown in FIG. 9, the display module further includes a third adhesive layer 109 located between the electromagnetic shielding layer 108 and the conductive adhesive layer 1036; the third adhesive layer 109 is provided with a second opening OP2; the orthographic projection of the second opening OP2 on the main body part 1011 at least partially overlaps the orthographic projection of the ground terminal 1023 on the main body part 1011. In other words, the second opening OP2 can be filled with the material of the conductive adhesive layer 1036, or the conductive adhesive layer 1036 can have a protrusion so that the protrusion fills the second opening OP2, and the first opening OP1 is formed with the third metal layer 107, so that the ground terminal 1023 is effectively connected to the conductive adhesive layer 1036 through the third metal layer 107. For example, in the direction perpendicular to the main body part 1011 (or the bottom plate 1021), the second opening OP2 and the first opening OP1 can completely overlap each other.

[0118] The third adhesive layer 109 can be double-sided tape, which can adhere the electromagnetic shielding layer 108 and the conductive adhesive layer 1036, and at the same time effectively support the circuit board 102 thereon, further improving the strength of the circuit board 102.

[0119] In some implementations, as shown in FIGS. 7 and 9, the display module further includes a cover plate 110; the cover plate 110 covers the display side of the main body part 1011.

[0120] The cover plate 110 can cover the display side of the main body part 1011 and cover at least the display area A of the display panel, which can protect the main body part 1011 of the display panel 101, avoid damage to the main body part 1011 of the display panel 101 by external force during preparation, transportation and application, and affect the display effect of the display panel 101. The material of the cover plate 110 can be flexible glass, such as thin glass.

[0121] It can be understood that a touch layer, a polarizer, optical adhesive and other structures can also be provided between the cover plate 110 and the main body part 1011, which can be set according to the structures in the related art, and will not be described in detail here.

[0122] In a second aspect, the embodiments of the present disclosure provide a display device including the display module of any of the above embodiments. The display device can be, for example, a mobile phone, a tablet computer, a display, a notebook computer, a digital photo frame or any product with a display function. Other essential components of the display device should be understood by those skilled in the art, and will not be described here, nor should it be considered as a limitation on the present disclosure.

[0123] It is understood that the above embodiments are only exemplary for illustrating the principles of the present disclosure, and the present disclosure is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present disclosure, and these modifications and improvements are also considered to be within the scope of protection of the present disclosure.

Claims

1. A display module, the display module comprising: Display panel The display panel comprises a main body part; the main body part has a display side and a non-display side arranged oppositely; the display module further comprises a circuit board located at the non-display side of the main body part, and a reinforcing support layer located at the side of the circuit board close to the main body part; The reinforcing support layer comprises a first metal layer, a conductive adhesive layer and a second metal layer arranged in sequence in the direction away from the main body part; The second metal layer has a slot; the slot exposes a part of the conductive adhesive layer; and The circuit board is located in the slot and connected with the first metal layer and the second metal layer through the conductive adhesive layer.

2. The display module of claim 1, wherein, The circuit board comprises a bottom plate, components located at the side of the bottom plate away from the main body part, and a grounding terminal located at the side of the bottom plate close to the main body part and connected with the components; and The grounding terminal is connected with the first metal layer and the second metal layer through the conductive adhesive layer.

3. The display module of claim 1 or 2, wherein, The display panel further comprises a binding part and a bending part connecting the main body part and the binding part; The binding part is located at the non-display side of the main body part; and The bending part is bent towards the non-display side of the main body part.

4. The display module of any one of claims 1 to 3, wherein, The first metal layer, the conductive adhesive layer and the second metal layer all have their orthographic projections on the main body part at least partially overlapping with the orthographic projection of the binding part on the main body part.

5. The display module of claim 4, wherein, The circuit board further comprises a binding terminal located at one end of the bottom plate and connected with the components; and The components are connected with the binding part through the binding terminal.

6. The display module of claim 5, wherein, The display module further comprises a first panel support layer; and The first panel support layer is located at the side of the main body part close to the first metal layer.

7. The display module of claim 6, wherein, The orthographic projection of the first panel support layer on the main body part at least partially overlaps with the orthographic projection of the binding part on the main body part.

8. The display module of claim 6 or 7, wherein, The reinforcing support layer further comprises a first adhesive layer located at the side of the first metal layer close to the main body part; and The first metal layer is attached with the first panel support layer through the first adhesive layer.

9. The display module of any one of claims 3 to 5, wherein, The display module further comprises a second panel support layer; and The second panel support layer is located at the side of the binding part close to the main body part.

10. The display module of claim 9, wherein, The display module further comprises a second adhesive layer located between the second panel support layer and the second metal layer; and The second panel support layer is attached with the second metal layer through the second adhesive layer.

11. The display module of claim 2, wherein, The display module further comprises a third metal layer; and The third metal layer is located between the conductive adhesive layer and the grounding terminal.

12. The display module of claim 2, wherein, The display module further comprises an electromagnetic shielding layer located at the side of the grounding terminal close to the second metal layer; the electromagnetic shielding layer is provided with a first opening; and The orthographic projection of the first opening on the main body part at least partially overlaps with the orthographic projection of the grounding terminal on the main body part.

13. The display module of claim 12, wherein, The display module further comprises a third adhesive layer located between the electromagnetic shielding layer and the conductive adhesive layer; the third adhesive layer is provided with a second opening; and A normal projection of the second opening on the main body portion at least partially overlaps a normal projection of the ground terminal on the main body portion.

14. The display module of claim 12, wherein, An intermediate portion of the conductive adhesive layer has a protrusion that fills the first opening and is in contact with the ground terminal.

15. The display module of claim 13, wherein, The second opening and the first opening completely overlap each other in a direction perpendicular to the main body portion.

16. The display module of claim 15, wherein, A third metal layer is formed in the first opening.

17. The display module of claim 16, wherein, An intermediate portion of the conductive adhesive layer has a protrusion that fills the second opening and is connected to the ground terminal through the third metal layer.

18. The display module of any one of claims 1 to 17, wherein, The first metal layer has a thickness of 30-50 microns.

19. The display module of any one of claims 1 to 18, wherein, The display module further includes a cover plate; and The cover plate covers the display side of the main body portion.

20. A display device comprising the display module according to any one of claims 1-19.

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