Wire feeding apparatus and wire material processing device

Abstract

A wire feeding apparatus, comprising a wire disc (10), the wire disc (10) being suitable for winding a wire material to be processed; a guide wheel (20) that is adapted to guide the motion of said wire material, the guide wheel (20) being provided with a contact portion (211), the contact portion (211) being adapted to contact said wire material and to guide the motion of said wire material and perform contact limiting on same; and a wire feeding member (30) that is located downstream of the guide wheel (20), a wire feeding inlet of the wire feeding member (30) directly facing the contact portion (211) in a direction of travel of said wire material. According to the described wire feeding apparatus, the wire material to be processed is guided and limited well, wire deviation can be mitigated, and the precision and quality in processing the wire material can be improved. A wire material processing device is also included.

Description

Wire feeding device and wire processing equipment

[0001] Cross-reference to Related Applications

[0002] The present application claims priority to the Chinese patent application No. 202421198618.9, filed on May 29, 2024, entitled "Wire feeding device and wire processing equipment", of Ningde Times New Energy Technology Co., Ltd. TECHNICAL FIELD

[0003] The present application relates to the technical field of wire processing, in particular to a wire feeding device and wire processing equipment. BACKGROUND

[0004] In the related art, during the wire processing, the wire material needs to be pulled from the wire disc to the position of the processing equipment, and then the wire processing is performed in the processing equipment. For example, the wire material is vacuum coated.

[0005] However, the wire material has a certain distance from the wire disc to the processing equipment, and the wire material swings during the wire feeding process, which may cause the wire deviation phenomenon. In the prior art, the guide pipe and guide wheel structures are often used for guiding, but the guiding and limiting effects of the wire material are poor, and the wire deviation phenomenon still exists, which reduces the processing precision.

[0006] SUMMARY

[0007] The present application aims to at least solve one of the technical problems existing in the prior art. To this end, one object of the present application is to provide a wire feeding device and wire processing equipment, which has better guiding and limiting effects on the wire material to be processed, can improve the wire deviation phenomenon, and can improve the wire processing precision and processing quality.

[0008] A wire feeding device comprises a wire disc, a guide wheel and a wire feeding member. The wire disc is adapted to wind the wire material to be processed. The guide wheel is arranged downstream of the wire disc and is adapted to guide the movement of the wire material to be processed. The guide wheel has a contact portion adapted to contact and guide the movement and limit the contact of the wire material to be processed. The wire feeding member is located downstream of the guide wheel, and the wire feeding inlet of the wire feeding member is opposite to the contact portion of the guide wheel in the running direction of the wire material to be processed.

[0009] Thus, by arranging the guide wheel and making the contact portion of the guide wheel contact and limit the wire material to be processed, the swing amplitude of the wire material to be processed is reduced, the wire deviation phenomenon is improved, the wire feeding precision of the wire feeding device is improved, and the processing precision and processing quality of the wire material are further improved.

[0010] According to some embodiments of the present application, the outer diameter L1 of the wire material to be processed and the axial length L2 of the contact portion satisfy: |L1-L2|≤0.75mm.

[0011] According to some embodiments of the present application, the guide wheel comprises a body and guide discs located at both axial ends of the body, the contact part is formed on the outer surface of the body, the inner end of the guide disc is connected with the body, and the outer end of the guide disc extends obliquely away from the contact part, so that the diameter of the outer end of the guide disc is greater than the diameter of the inner end of the guide disc.

[0012] According to some embodiments of the present application, the contact part is configured as an electroplated layer, and the contact part is electroplated on the outer surface of the body.

[0013] According to some embodiments of the present application, the thickness of the electroplated layer is greater than or equal to 1 mm.

[0014] According to some embodiments of the present application, the surface roughness of the electroplated layer is Ra 0.4 to Ra 0.8, and the material particle size of the electroplated layer is 46# to 150#.

[0015] According to some embodiments of the present application, the contact part is formed with contact lines.

[0016] According to some embodiments of the present application, the depth of the contact lines is greater than or equal to 1 mm, the angle between the extension direction of the contact lines and the axial direction is 0 to 60°, and the distance between adjacent contact lines in the circumferential direction is 0.5 mm to 1 mm.

[0017] According to some embodiments of the present application, the wire feeding device further comprises a metering assembly, the metering assembly comprising a sensor group and a display mechanism, the sensor group being signal connected with the display mechanism, the display mechanism being adapted to display the wire feeding meter number recorded by the sensor group, and the sensor group being arranged on the guide wheel and recording the number of rotations of the guide wheel.

[0018] A wire processing equipment comprises the wire feeding device in the above embodiments and a processing device, the processing device being located downstream of the wire feeding device, and the wire feeding outlet of the wire feeding member being arranged adjacent to the feeding port of the processing device.

[0019] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0020] The above and / or additional aspects and advantages of the present application will become apparent and be readily appreciated from the following description, including the appended drawings.

[0021] FIG. 1 is a schematic view of a wire feeding device according to an embodiment of the present application;

[0022] FIG. 2 is a schematic view of a metering assembly and a guide wheel according to an embodiment of the present application;

[0023] Fig. 3 is a schematic view of a meter assembly with another guide wheel according to an embodiment of the present application;

[0024] Fig. 4 is a partially enlarged schematic view of a guide wheel according to an embodiment of the present application;

[0025] Fig. 5 is a schematic view of a yarn processing apparatus according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the scope of protection of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used in the present application have the same meaning as commonly understood by one of ordinary skill in the art to which the present application belongs; the terms used in the specification of the present application are only for the purpose of describing the specific embodiments of the present application, and are not intended to limit the present application; the terms "include" and "have" and any variations thereof in the specification and claims of the present application and the above description of drawings are intended to cover non-exclusive inclusion. The terms "first", "second" and the like in the specification and claims of the present application and the above description of drawings are used to distinguish different objects, and are not intended to describe a particular order or primary and secondary relationship.

[0028] In the present application, the phrase "embodiment" means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The appearance of this phrase at various places in the specification does not necessarily mean the same embodiment, nor is it an independent or alternative embodiment to other embodiments.

[0029] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection", "attach" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or the internal communication of two elements. For those of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0030] The term "and / or" in the present application is only used to describe the relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the front and rear associated objects.

[0031] In the embodiments of the present application, the same reference signs represent the same components, and for the sake of brevity, the detailed description of the same components is omitted in different embodiments. It should be understood that the thickness, length, width and other dimensions of various components in the embodiments of the present application shown in the drawings, as well as the overall thickness, length, width and other dimensions of the integrated device, are only exemplary and should not constitute any limitation on the present application.

[0032] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0033] In the description of the present application, the first feature "above" or "below" the second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them.

[0034] In the description of the present application, the first feature "above", "over" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher in horizontal height than the second feature.

[0035] "Multiple" appearing in the present application means two or more (including two).

[0036] The wire feeding device of the embodiments of the present application can be used to transport material in the form of wire, and can also be used to transport material in the form of belt. The wire material processing equipment can be a vacuum evaporation device, or a processing equipment for processing wire material by other processes, which is not limited in the present application.

[0037] Exemplarily, the wire material processing equipment is a vacuum evaporation device, and is suitable for vacuum evaporation processing of wire material such as aluminum wire material and copper wire material for processing into current collectors.

[0038] The current collector is an essential component of a battery, and its performance plays a crucial role in the performance of the battery. The current collector of a traditional lithium-ion battery is mainly a metal aluminum foil and a copper foil. The metal foil has the advantage of good electrical conductivity, but due to the inherent properties of the metal, it is more prone to bending and tearing, which can cause a decrease in battery performance and pose a serious safety hazard.

[0039] To optimize the energy density and safety performance of the battery, a plated film current collector composed of a metal foil and a polymer film (or polymer layer) has been gradually developed, and the production of the plated film current collector often uses a vacuum plating machine.

[0040] Vacuum evaporation is a production process for depositing metal on the surface of an object. The main principle is to place the material to be evaporated on an evaporation boat, then heat the evaporation boat, causing the material to be evaporated on the evaporation boat to melt and vaporize. The molten and vaporized material in the form of atoms or atomic groups accumulates upward under vacuum conditions onto the object passing above, thereby forming a thin film on the object.

[0041] For example, an aluminum-plated film requires a high-purity aluminum wire to be evaporated into a gaseous state at a high temperature (close to 1000 degrees Celsius) through a vacuum aluminum plating process. Then, a plastic film is passed through a vacuum evaporation chamber, causing the gaseous aluminum molecules to deposit and adhere to the surface of the plastic film to form a soft packaging material that is bright and beautiful and has a strong metallic color.

[0042] A vacuum plating equipment suitable for aluminum-plated film production generally includes a wire feeding device and an evaporation device. The wire feeding device includes a wire reel, a wire feeding guide tube (or a guide wheel), and a wire feeding member. The wire to be processed comes out of the wire reel, passes through the wire feeding guide tube or the guide wheel, and then comes out of the wire feeding member to reach the evaporation device (such as an evaporation boat).

[0043] The wire to be processed moves from the wire feeding device to the evaporation device by a certain distance. During the feeding process, the wire to be processed may deviate, causing the wire feeding direction to deviate, which ultimately leads to aluminum splashing, surface appearance defects such as concave-convex points and holes, and other issues. The wear of the guide wheel and guide tube used for guiding, as well as the poor guiding and limiting effect, can all cause the wire deviation phenomenon.

[0044] For example, during the aluminum wire evaporation process, the wire to be processed coming out of the wire reel deviates before entering the evaporation device, causing the wire feeding direction to deviate, which ultimately leads to aluminum splashing, surface appearance defects such as concave-convex points and holes, and other issues. The wear of the guide wheel and guide tube used for guiding, as well as the poor guiding and limiting effect, can all cause the wire deviation phenomenon.

[0045] The present application provides a wire feeding device. The guide wheel can improve the limiting effect on the wire to be processed through the contact part, reduce the swing amplitude of the wire to be processed, and improve the wire deviation phenomenon, thereby improving the processing effect and processing precision.

[0046] The wire feeding device can transport metal wires such as aluminum wire and copper wire, or composite materials such as carbon fiber wire, polymer film wire, etc., or wires of different geometric shapes such as strip wire and wire.

[0047] The following description, with reference to Figures 1-5, describes the wire feeding device 100 and the wire processing equipment 1000 according to embodiments of this application.

[0048] As shown in Figures 1, 2 and 3, this application provides a wire feeding device 100, including: a wire spool 10, a guide wheel 20 and a wire feeding component 30.

[0049] The wire spool 10 is suitable for winding the wire to be processed. The guide wheel 20 is located downstream of the wire spool 10 and is suitable for guiding the movement of the wire to be processed. The guide wheel 20 has a contact portion 211, which is suitable for contacting the wire to be processed and guiding the movement of the wire to be processed and limiting the contact. The wire feeder 30 is located downstream of the guide wheel 20, and the wire feed inlet of the wire feeder 30 is directly opposite the contact portion 211 of the guide wheel 20 in the direction of travel of the wire to be processed.

[0050] The wire to be processed wound on the wire spool 10 can move to the guide wheel 20 under the traction action, and under the motion guidance and contact limiting action of the contact part 211 on the guide wheel 20, it can move more accurately to the wire feeding inlet of the wire feeding part 30 which is directly opposite the contact part 211 in the direction of travel, and the wire to be processed moving out of the wire feeding outlet can move directly to the processing device 200.

[0051] Both the wire spool 10 and the guide wheel 20 are disc-shaped. At least a portion of the outer peripheral surface of the guide wheel 20 can be formed as a contact portion 211. The contact portion 211 is suitable for contacting the wire to be processed and realizes the swing limit of the wire to be processed based on friction. The swing of the wire to be processed refers to the swing in the axial direction of the guide spool 22. The larger the swing amplitude, the more serious the wire deviation. The smaller the swing amplitude, the smaller the wire deviation amplitude and the higher the processing accuracy.

[0052] According to the embodiment of this application, the wire feeding device 100 provides a guide wheel 20 and limits the contact portion 211 of the guide wheel 20 to contact the wire to be processed, thereby reducing the swaying amplitude of the wire to be processed, thereby improving the wire deviation phenomenon, improving the wire feeding accuracy of the wire feeding device 100, and further improving the processing accuracy and processing quality of the wire.

[0053] The guide wheel 20 can be constructed of steel, or the contact part 211 can be made of steel, in order to reduce costs, reduce processing difficulty, and have higher wear resistance, greater difficulty in deformation, and smaller deformation range, which can extend the service life of the guide wheel 20 and reduce maintenance costs.

[0054] The outer diameter L1 of the wire to be processed and the axial length L2 of the contact part 211 satisfy the following condition: |L1-L2|≤0.75mm.

[0055] The contact part 211 contacts the wire to be processed to achieve guidance and limiting. The outer diameter L1 of the wire to be processed and the axial length L2 of the contact part 211 satisfy the following condition: |L1-L2|≤0.75mm. This can be because the axial length of the contact part 211 is less than or equal to the outer diameter of the wire to be processed, i.e., L1-L2≤0.75mm, or the axial length of the contact part 211 is greater than or equal to the outer diameter of the wire to be processed, i.e., L2-L1≤0.75mm. In other words, -0.75mm≤L1-L2≤0.75mm.

[0056] |L1-L2| Comparison Table with Swing Amplitude

[0057] As shown in the table above, the oscillation amplitude of the filament to be processed can be limited to a range of 0.75mm on the left and right, further reducing the oscillation amplitude of the filament to be processed, improving the filament feeding accuracy, and thus improving the processing accuracy and processing quality.

[0058] As shown in Figures 2 and 3, according to some embodiments of this application, the guide wheel 20 includes: a body 21 and guide discs 22 located at both ends of the body 21 in the axial direction. A contact portion 211 is formed on the outer surface of the body 21. The inner end of the guide disc 22 is connected to the body 21. The outer end of the guide disc 22 extends obliquely away from the contact portion 211, so that the outer end diameter of the guide disc 22 is greater than the inner end diameter of the guide disc 22.

[0059] Both guide discs 22 are frustum-shaped, with the small end face of the frustum connected to the body 21 and the large end face of the frustum located at the axial outer end of the body 21. The direction pointing towards the axial centerline of the guide wheel 20 is defined as the inward direction, and the direction away from the axial centerline of the guide wheel 20 is defined as the outward direction. The guide discs 22 guide the wire to be processed, and the contact part 211 limits the wire to be processed.

[0060] By using the inclined guide plate 22 and the surface or line contact friction limit of the contact part 211, the guiding and limiting effect of the filament to be processed can be improved, the oscillation amplitude of the filament to be processed can be further reduced, thereby improving the filament feeding accuracy, improving the filament deviation phenomenon, and reducing the probability of the filament to be processed detaching from the guide wheel 20, thereby improving the filament feeding reliability and stability of the filament feeding device 100.

[0061] Referring to Figure 2, according to some embodiments of this application, the contact portion 211 is constructed as an electroplated layer, and the contact portion 211 is electroplated on the outer surface of the body 21.

[0062] In some embodiments, the contact portion 211 may be configured as an electroplated layer to be electroplated or coated on the outer surface of the body 21, and the electroplated layer may be configured as a material with uniform particle density and higher hardness than the body 21, which can reduce the wear of the contact portion 211 and extend its service life.

[0063] In other embodiments, the contact portion 211 may also be constructed as a coating layer, which is directly coated on the body 21 and should also meet the requirements of uniform particle density and higher hardness than the body 21.

[0064] According to some embodiments of this application, the thickness of the electroplated layer is ≥1 mm.

[0065] For example, the thickness of the electroplated layer is 1 mm, 1.5 mm, etc., and the thickness of the electroplated layer is not less than 1 mm, so that the thickness of the electroplated layer is more reasonable, the fixation stability and reliability of the electroplated layer on the body 21 are higher, and the contact guidance effect of the wire to be processed is better.

[0066] According to some embodiments of this application, the surface roughness of the electroplated layer is Ra0.4 to Ra0.8, and the particle size of the electroplated layer is 46# to 150#.

[0067] The surface roughness of the electroplated layer can be Ra0.4, Ra0.5, Ra0.6, Ra0.7, Ra0.8, etc., that is, the arithmetic mean deviation of the surface profile of the electroplated layer is 0.4um to 0.8um. ​​The particle size of the electroplated layer can be 46#, 80#, 100#, 150#, etc., which can make the surface roughness and particle size of the electroplated layer more reasonable, so as to avoid the friction being too small, resulting in poor limiting effect on the wire to be processed, and to avoid the friction being too large, resulting in scratches on the wire to be processed.

[0068] This can increase the friction between the contact part 211 and the filament to be processed, reduce the probability of the filament to slip or swing, thereby reducing the swing amplitude, improving feeding stability and accuracy, and avoiding scratching the filament to be processed.

[0069] 46#, 150#, etc. are standard designations for material particle size, which are well known to those skilled in the art. The specific numerical value of the material particle size in μm can be obtained by consulting the corresponding particle size table.

[0070] In other embodiments, the contact portion 211 may not be provided separately. Instead, the outer surface of the body 21 may be used as the contact portion 211, and contact texture 212 may be provided on the contact portion 211, similar to the tread pattern of a vehicle tire. Alternatively, an electroplating layer or a coating layer may be provided on the outer surface of the body 21, and contact texture 212 may be provided on the contact portion 211 to increase friction.

[0071] As shown in Figures 3 and 4, contact patterns 212 are formed on the contact portion 211.

[0072] The contact texture 212 can further enhance the friction between the contact part 211 and the filament to be processed, thereby further improving the feeding stability and accuracy.

[0073] In the embodiment shown in Figure 4, according to some embodiments of this application, the depth of the contact texture 212 is ≥1mm, the angle between the extension direction of the contact texture 212 and the axial direction is 0 to 60°, and the distance between adjacent contact textures 212 in the circumferential direction of the contact portion 211 is 0.5mm to 1mm.

[0074] By setting a reasonable tilt angle, depth, and spacing between adjacent contact lines 212, the probability of the contact lines 212 scratching the workpiece can be reduced while increasing the friction between the contact part 211 and the workpiece, thereby further improving the processing accuracy and quality.

[0075] In some embodiments, contact textures 212 can be directly machined on the outer surface of the body 21. In other embodiments, an electroplating layer or a coating layer can be directly provided on the outer surface of the body 21, and the electroplating layer or coating layer is formed as a contact portion 211. Further, an electroplating layer or a coating layer can be provided on the outer surface of the body 21, and contact textures 212 can be further machined on the electroplating layer or coating layer.

[0076] This application uses technical means such as limiting the size of the contact part 211, setting the guide plate 22, setting the electroplating layer, and setting the contact temperature to effectively improve the roughness of the contact part 211, obtain uniform friction force, achieve stable wire feeding, and improve the wire deviation phenomenon.

[0077] Referring to Figures 2 and 3, according to some embodiments of this application, the wire feeding device 100 further includes a meter counter assembly 40, which includes a sensor group 41 and a display mechanism 42. The sensor group 41 is signal-connected to the display mechanism 42, and the display mechanism 42 is adapted to display the number of meters of wire fed to be processed recorded by the sensor group 41. The sensor group 41 is disposed on the guide wheel 20 and records the number of rotations of the guide wheel 20.

[0078] If the remaining length of the filament to be processed in the filament spool 10 cannot be effectively monitored and not replaced in time, the filament to be processed may be exhausted or the remaining length may be too short during processing. In the embodiment where the processing device 200 is an evaporation device, the exhaustion or shortage of the filament to be processed may result in no filament to be processed being sent to the processing device 200 (e.g., evaporation boat, vapor deposition source), which may lead to uneven coating on the surface of the plated part and the presence of bumps and holes on the surface.

[0079] This application further includes a meter counter assembly 40. The meter counter assembly 40 can read the length of the wire to be processed in a timely manner through the sensor group 41, and based on the initial length of the wire to be processed on the wire spool 10, determine the remaining length of the wire to be processed, and display it on the display mechanism 42 in a timely manner. The display mechanism 42 can also integrate an alarm unit, etc. When the length of the wire to be processed is insufficient, such as when the remaining length is less than 10m, an alarm is issued to remind the user, so that the wire spool 10 can be replaced in time to avoid affecting the deposition amount on the surface of the plated part, so that the surface coating thickness is more uniform and consistent, and the processing quality and precision are higher.

[0080] According to some embodiments of this application, the guide wheel 20 has a mounting bracket 23, and the sensor group 41 includes a signal transmitting end and a signal receiving end 412, one of which is disposed on the guide wheel 20 and the other is disposed on the mounting bracket 23.

[0081] The guide wheel 20 is rotatably mounted on the mounting bracket 23, which can realize the integrated setting of the guide wheel 20 and the sensor group 41, reducing the space occupation of the wire feeding device 100 and reducing the difficulty of arrangement. The signal emitting end of the sensor group 41 can emit light signals, electrical signals, and magnetic signals. The signal receiving end 412 records the number of rotations based on the number of received signals and records the wire feeding length based on the number of rotations. This allows the remaining length of the wire to be processed to be known in a timely manner, avoiding the problem of wire deviation caused by insufficient remaining length of the wire to be processed, and reducing the probability of voids and bumps on the surface of the plated parts, thereby improving the processing accuracy and processing quality.

[0082] For example, the signal transmitter 411 mounted on the guide plate 22 rotates synchronously with the guide wheel 20. When it rotates to the same horizontal line as the signal receiver 412, the signal receiver 412 receives the signal. The signal receiver 412 accumulates one revolution (i.e., the circumference of the contact part 211 of the guide wheel 20 = πd). For example, if the circumference is 0.5 meters, after the signal receiver 412 senses and receives the signal each time, it sends it to the display mechanism 42. The display mechanism 42 is constructed as a display instrument, which accumulates to display 0.5, 1, 1.5... When the displayed value reaches the set value, such as 2000 meters, the equipment issues an alarm to remind that the remaining length of the wire to be processed is insufficient and to replace it in time. This effectively avoids problems such as wire deviation, aluminum sputtering during evaporation, and aluminum film holes caused by insufficient wire to be processed or insufficient remaining wire.

[0083] As shown in Figure 5, this application proposes a wire processing equipment 1000, including: the wire feeding device 100 in the above embodiment and the processing device 200. The processing device 200 is located downstream of the wire feeding device 100, and the wire feeding outlet of the wire feeding component 30 is located adjacent to the feed inlet of the processing device 200.

[0084] Other configurations and operations of the wire processing equipment 1000 according to the embodiments of this application are known to those skilled in the art and will not be described in detail here.

[0085] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this application. The specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0086] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A wire feeder, comprising: The application relates to a wire feeding device. The wire feeding device comprises a wire disc (10) adapted to wind a wire to be processed; a guide wheel (20) arranged downstream of the wire disc (10) and adapted to guide the wire to be processed, the guide wheel (20) having a contact part (211) adapted to contact and guide the wire to be processed; and a wire feeding member (30) arranged downstream of the guide wheel (20), and a wire feeding inlet of the wire feeding member (30) being opposite to the contact part (211) of the guide wheel (20) in the running direction of the wire to be processed. The outer diameter L1 of the wire to be processed and the axial length L2 of the contact part (211) satisfy the condition: |L1-L2|<=0.75mm. The guide wheel (20) comprises a body (21) and guide discs (22) arranged at the axial ends of the body (21), the contact part (211) being formed on the outer surface of the body (21), the inner end of the guide disc (22) being connected to the body (21), and the outer end of the guide disc (22) being inclinedly extended away from the contact part (211) so that the outer end diameter of the guide disc (22) is greater than the inner end diameter of the guide disc (22).

2. The wire feeder of claim 1, wherein, The contact part (211) is configured as an electroplated layer, and the contact part (211) is electroplated on the outer surface of the body (21).

3. The wire feeder of claim 1 or 2, wherein, The thickness of the electroplated layer is greater than or equal to 1mm.

4. The wire feeder of claim 3, wherein, The surface roughness of the electroplated layer is Ra0.4-Ra0.8, and the material granularity of the electroplated layer is 46#-150#.

5. The wire feeder of claim 4, wherein, The contact part (211) is provided with contact lines (212).

6. The wire feeder of claim 4, wherein, The depth of the contact lines (212) is greater than or equal to 1mm, the angle between the extension direction of the contact lines (212) and the axial direction is 0-60 degrees, and the distance between adjacent contact lines (212) in the circumferential direction is 0.5-1mm.

7. The wire feeder of claim 3, wherein, The wire feeding device further comprises a meter counter assembly (40) comprising a sensor group (41) and a display mechanism (42), the sensor group (41) being signal connected to the display mechanism (42), the display mechanism (42) being adapted to display the wire feeding meter number recorded by the sensor group (41), and the sensor group (41) being arranged on the guide wheel (20) and recording the rotation number of the guide wheel (20).

8. The wire feeder of claim 7, wherein, The guide wheel (20) is provided with a mounting bracket (23), the sensor group (41) comprises a signal sending end and a signal receiving end (412), one of the signal sending end and the signal receiving end (412) being arranged on the guide wheel (20), and the other being arranged on the mounting bracket (23).

9. The wire feeder of any of claims 1-8, wherein, The application further relates to a wire feeding device.

10. The wire feeder of claim 9, wherein, The wire feeding device comprises a wire feeding device according to any one of claims 1-10; and a processing device (200) arranged downstream of the wire feeding device, and a wire feeding outlet of the wire feeding member (30) being arranged adjacent to the feeding inlet of the processing device (200).

11. A yarn processing apparatus wherein, ​ ​ ​

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