Heat dissipation system and communication device

Abstract

Disclosed in the present application are a heat dissipation system and a communication device. The heat dissipation system comprises a cooling module and a first external pipeline assembly. The cooling module comprises a mounting shell provided with a closed mounting cavity, wherein a first cooling medium is provided in the mounting cavity and the mounting cavity is used for accommodating an electronic product; the first external pipeline assembly comprises a first communicating pipe and a first liquid pump arranged on the first communicating pipe, and the first communicating pipe is arranged on the outer side of the mounting shell and has a first inlet end and a first outlet end; and the first inlet end and the first outlet end are in communication with the mounting cavity, so as to communicate the first external pipeline assembly with the mounting shell and form a first medium circulation system, and the pressure in a medium flow path of the first medium circulation system is negative pressure.

Description

Cooling systems and communication equipment

[0001] Related applications

[0002] This application claims priority to Chinese patent application No. 202410672978.6, filed on May 28, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of heat dissipation technology, and in particular to a heat dissipation system and a communication device using the heat dissipation system. Background Technology

[0004] Currently, with the increasing integration of electronic components, chip power is rising, and the heat dissipation requirements for chips are also becoming more stringent. Traditional air cooling methods are insufficient to solve the heat dissipation problem of high-power, high-heat-flux-density chips. Therefore, immersion liquid cooling, which has high heat dissipation efficiency, is widely used.

[0005] However, in the traditional immersion liquid cooling system of related technologies, when the pipeline is perforated due to corrosion or other reasons, the cooling medium inside the pipeline is prone to leakage from the perforation. Summary of the Invention

[0006] The main purpose of this application is to provide a heat dissipation system and a communication device.

[0007] To achieve the above objectives, the heat dissipation system proposed in this application includes: a cooling module, the cooling module including a mounting shell, the mounting shell having a closed mounting cavity, the mounting cavity containing a first cooling medium, the mounting cavity being used to house an electronic product; and a first external piping assembly, the first external piping assembly including a first connecting pipe and a first liquid pump disposed on the first connecting pipe, the first connecting pipe being disposed outside the mounting shell and having a first inlet end and a first outlet end; the first inlet end and the first outlet end being connected to the mounting cavity, so that the first external piping assembly and the mounting shell are connected to form a first medium circulation system, the pressure in the medium flow path of the first medium circulation system being a negative pressure.

[0008] This application also proposes a communication device, including the heat dissipation system described above. Attached Figure Description

[0009] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0010] Fig. 1 is a structural schematic diagram of an embodiment of the heat dissipation system of the present application;

[0011] Fig. 2 is a structural schematic diagram of the first outer pipe assembly in Fig. 1;

[0012] Fig. 3 is a schematic diagram of a partial structure of the heat dissipation system in Fig. 1 from one perspective;

[0013] Fig. 4 is a schematic diagram from another perspective of Fig. 3;

[0014] Fig. 5 is a structural schematic diagram of the second outer pipe assembly in Fig. 1;

[0015] Fig. 6 is a structural schematic diagram of another embodiment of the heat dissipation system of the present application.

[0016] Explanation of reference numerals:

[0017] The implementation, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0019] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between components in a certain posture (as shown in the drawings), and if the certain posture changes, the directional indications will also change accordingly.

[0020] In the present application, unless otherwise explicitly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense, for example, "fixation" can be fixed connection, or detachable connection, or integral; can be mechanical connection, or electrical connection; can be direct connection, or indirect connection through an intermediate medium; can be internal connection of two elements or interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0021] In addition, the descriptions involving "first", "second", etc. in the present application are only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second" can explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing throughout the text is to include three parallel schemes, for example, "A and / or B" includes A scheme, or B scheme, or A and B scheme. In addition, the technical solutions of each embodiment can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or cannot be realized, it should be considered that the combination of technical solutions does not exist, nor within the protection scope required by the present application.

[0022] At present, more and more electronic devices tend to use immersion liquid cooling method to improve the heat dissipation effect of electronic devices. However, in the related art, the immersion liquid cooling system is generally set to positive pressure in the system pipeline during use. At this time, when the pipeline is perforated due to corrosion or other reasons, the cooling medium in the pipeline is easy to leak from the perforation, which affects the normal and stable work of the electronic device.

[0023] Therefore, based on the above considerations, in order to solve the problem of leakage of cooling medium of the heat dissipation system in the related art, the present application proposes a new type of heat dissipation system. The heat dissipation system innovatively sets the first cooling medium in the closed installation cavity of the installation shell of the cooling module, and cooperates with the first outer pipeline assembly to form a first medium circulation system. In this way, when the electronic product is placed in the installation cavity, it can be immersed in the first cooling medium in the installation cavity, thereby realizing immersion liquid cooling of the electronic product with high heat dissipation efficiency. At the same time, the pressure in the medium flow path of the first medium circulation system is also set to negative pressure, so that when a certain position of the first medium circulation system is damaged, the first cooling medium will not leak.

[0024] In addition, the type of electronic product to which the heat dissipation system proposed in the present application is applied can be a server, a router, or a switch, etc. The present application does not limit the cooling object to which the heat dissipation system is applied, as long as it is a product that generates heat during work.

[0025] Next, the structure of the heat dissipation system proposed in the present application is explained and described with examples. In an embodiment of the present application, please refer to FIG. 1 and FIG. 2, the heat dissipation system 100 proposed in the present application includes a cooling module 10 and a first external pipeline assembly 20. The cooling module 10 includes a mounting shell 11, which is provided with a closed mounting cavity 111. The first cooling medium 112 is arranged in the mounting cavity 111. The mounting cavity 111 is used to accommodate electronic products. The first external pipeline assembly 20 includes a first communication pipe 21 and a first liquid pump 22 arranged on the first communication pipe 21. The first communication pipe 21 is arranged on the outside of the mounting shell 11 and has a first inlet end 211 and a first outlet end 212. The first inlet end 211 and the first outlet end 212 are communicated with the mounting cavity 111, so as to communicate the first external pipeline assembly 20 and the mounting shell 11, and are configured as a first medium circulation system 23. The pressure in the medium flow path of the first medium circulation system 23 is negative pressure.

[0026] The cooling module 10 can give accommodation space to the first cooling medium 112 and electronic products through the mounting cavity 111 formed by the mounting shell 11. At this time, the electronic products can be at least partially immersed in the first cooling medium 112 when placed in the accommodation space, and can directly exchange heat with the first cooling medium 112 more efficiently when the electronic products work and heat. The shape of the mounting shell 11 can be rectangular, square, or circular, and the present application does not limit the shape of the mounting shell 11. The shape of the mounting cavity 111 in the mounting shell 11 can also be rectangular, square, or circular, and the present application does not limit the shape of the mounting cavity 111. In some embodiments, in order to improve the adaptability between the mounting shell 11 and the electronic products, so as to reduce the overall volume of the cooling module 10 and improve the convenience of subsequent arrangement, the shape of the mounting shell 11 and the mounting cavity 111 can be the same as the shape of the electronic products. Of course, in some embodiments, the shape of the mounting shell 11 and the mounting cavity 111 can also be different from the shape of the electronic products, and even the shape of the mounting shell 11 and the mounting cavity 111 can be set to be different. In addition, the first cooling medium 112 can be oil, fluorinated liquid, or the like. The type of the first cooling medium 112 is not limited in the present application, as long as it is not conductive. In addition, the first cooling medium 112 can fill the mounting cavity 111, and of course it can also not fill the mounting cavity 111, as long as it can at least immerse part of the electronic products placed in the mounting cavity 111.

[0027] The first outer pipe assembly 20 can be arranged outside the mounting shell 11 of the cooling module 10 and in communication with the mounting shell 11 to form a first medium circulation system 23. Specifically, the first cooling medium 112 in the mounting shell 11 can be powered by the first liquid pump 22 to enter the first communication pipe 21 through the first inlet end 211 of the first communication pipe 21 after heat exchange with the electronic product. That is, the first outer pipe assembly 20 outside the mounting shell 11 is cooled, and then reenters the mounting cavity 111 of the mounting shell 11 through the first outlet end 212, thereby achieving circulating cooling of the electronic product in the mounting cavity 111 (as shown by the arrows in FIGS. 1 and 2, the flow direction of the second cooling medium 112). In addition, the first inlet end 211 and the first outlet end 212 can be in communication with the mounting cavity 111 of the mounting shell 11 through the first liquid inlet connector 113 and the first liquid outlet connector 114, respectively, as described below. Of course, the first inlet end 211 and the first outlet end 212 can also be inserted into the mounting shell 11 to directly communicate with the mounting cavity 111 of the mounting shell 11. Alternatively, the first inlet end 211 and the first outlet end 212 can also be in communication with the mounting shell 11 through a communication hole, and then communicate with the mounting cavity 111 through the communication hole. It can be seen that the present application does not limit the connection mode of the first inlet end 211 and the first outlet end 212 with the mounting shell 11, as long as it can realize communication with the mounting cavity 111 of the mounting shell 11 to form a closed first medium circulation system 23. The pressure in the medium flow path of the first medium circulation system 23 is negative, that is, the pressure in the mounting cavity 111 and the communication pipe is less than the atmospheric pressure outside.

[0028] In use, the heat dissipation system 100 of the technical solution of the present embodiment can place the electronic product in the mounting cavity 111 of the mounting shell 11 of the cooling module 10 of the heat dissipation system 100. Since the first cooling medium 112 is arranged in the mounting cavity 111, the electronic product can be immersed in the first cooling medium 112. After the first cooling medium 112 absorbs the heat generated by the electronic product during operation, it can be transported to the outside of the mounting shell 11 through the first outer pipe assembly 20 for heat dissipation, and the first medium circulation system 23 formed by the first outer pipe assembly 20 and the mounting shell 11 can continuously immerse the electronic product in liquid cooling to improve the heat dissipation effect of the electronic product. Moreover, the pressure in the medium flow path of the first medium circulation system 23 of the heat dissipation system 100 in the present solution is negative, so that even if a part of the first medium circulation system 23 is damaged, the first cooling medium 112 will not flow out under the action of the atmospheric pressure outside. That is, the heat dissipation system 100 in the present embodiment can improve the heat dissipation effect while reducing the possibility of leakage and improving the reliability of the heat dissipation system 100.

[0029] Please refer to Fig. 2, in an embodiment of the present application, the first outer pipeline assembly 20 further comprises a first container 24, the first container 24 is arranged in the first communication pipe 21, and the first container 24 stores the first cooling medium 112.

[0030] In the embodiment, the first container 24 can store the first cooling medium 112, so that when the first cooling medium 112 is damaged with use, the first cooling medium 112 in the installation shell 11 can be supplemented in time. At the same time, the pressure in the medium flow path of the first medium circulating system 23 can be vacuumized to form negative pressure through the first container 24. That is, the arrangement of the first container 24 can facilitate vacuumization and supplement of the first cooling medium 112, thereby improving the convenience of manufacturing and use of the heat dissipation system 100.

[0031] Please refer to Fig. 2, in an embodiment of the present application, the first outer pipeline assembly 20 further comprises a first vacuum pump 25, the first vacuum pump 25 is communicated with the first container 24.

[0032] In the embodiment, the first vacuum pump 25 communicated with the first container 24 is arranged, which facilitates vacuumization through the first container 24 at any time to adjust the pressure in the medium flow path of the first medium circulating system 23. In this way, the pressure in the medium flow path of the first medium circulating system 23 can be better maintained within the preset negative pressure value, thereby further improving the reliability of the heat dissipation system 100.

[0033] Please refer to Fig. 2, in an embodiment of the present application, the first outer pipeline assembly 20 further comprises a first connecting pipe 26 and a first control valve 27, the first connecting pipe 26 is communicated with the first vacuum pump 25 and the first container 24, and the first control valve 27 is arranged in the connecting pipe.

[0034] In the embodiment, the first connecting pipe 26 can reduce the requirement for the relative position of the first vacuum pump 25 and the first container 24 when connected, thereby facilitating the arrangement of the first vacuum pump 25 and the first container 24, to further improve the convenience of manufacturing the heat dissipation system 100. Further, cooperating with the first control valve 27, the controllability of the communication between the first vacuum pump 25 and the first container 24 can be improved, and the sealing effect in the medium flow path of the first medium circulating system 23 is improved, so as to be stably maintained at the required negative pressure value. The first control valve 27 can be an electric control valve to improve the automation degree of the heat dissipation system 100. Of course, the first control valve 27 can also be a manual valve to improve the controllability by human.

[0035] Please refer to Fig. 2, in an embodiment of the present application, the first outer pipeline assembly 20 further comprises a first heat exchanger 28, the first heat exchanger 28 is arranged in the first communication pipe 21.

[0036] In the embodiment, the first cooling medium 112 in the installation cavity 111 can exchange heat with the first heat exchanger 28 when flowing through the first heat exchanger 28 after exchanging heat with the electronic product, so that the heat dissipation effect can be further improved. The first heat exchanger 28 can exchange heat with external air. Of course, a fan can be arranged to cool the first heat exchanger 28, so as to further improve the heat exchange effect of the first heat exchanger 28. Alternatively, the first heat exchanger 28 can be formed with a first flow channel and a second flow channel separated from each other. At this time, the first cooling medium 112 in the first medium circulating system 23 can flow through the first flow channel in the first heat exchanger 28. The second flow channel can form a refrigerant circulating system, so that the low-temperature liquid in the refrigerant circulating system can cool the first heat exchanger 28 when flowing through the second flow channel. It can be seen that the heat dissipation mode of the first heat exchanger 28 is not limited in the application.

[0037] Referring to FIG. 1, in an embodiment of the application, the cooling module 10 further comprises an inner pipeline 13 and a cooling piece 15. The inner pipeline 13 is arranged in the installation cavity 111 and has an inflow end 131 and an outflow end 132 which are communicated with the outside of the installation shell 11. The cooling piece 15 is arranged in the inner pipeline 13 and has a medium flow channel which is communicated with the inner pipeline 13.

[0038] In the embodiment, the cooling piece 15 can be attached to a high-power device (for example, CPU, etc., which has a relatively high power and a relatively large heat dissipation amount) of the electronic product. At this time, since the cooling piece 15 has a relatively high heat conduction effect, the heat on the device can be transferred to the second cooling medium 731 in the medium flow channel of the inner pipeline 13 to exchange heat, so as to effectively and timely dissipate heat of the high-power device. At this time, the first medium circulating system 23 is used in combination with the above-mentioned cooling piece 15, so that the advantages of the large heat dissipation coverage area of the first medium circulating system 23 and the high single-point heat dissipation performance of the cooling piece 15 are combined. When the electronic product generally comprises low-power devices (for example, memory stick, hard disk, etc., which have a relatively low power and a relatively small heat dissipation amount) and high-power devices, the cooling system 100 can have a more targeted heat dissipation for the electronic product. That is, the low-power devices are subjected to immersion liquid cooling heat dissipation by the first medium circulating system 23, and the high-power devices are subjected to cold plate liquid cooling heat dissipation by the cooling piece 15, so as to meet the overall heat dissipation demand and the local heat dissipation demand of the electronic product, thereby further improving the heat dissipation effect of the cooling system 100 on the electronic product.

[0039] Referring to FIG. 1, in an embodiment of the application, the number of the cooling pieces 15 is at least two, and the at least two cooling pieces 15 are arranged in series and / or in parallel through the inner pipeline 13.

[0040] In the embodiment, the number of cooling members 15 is set to at least two, which facilitates corresponding bonding of the high-power devices on each position of the electronic product, and further facilitates further improving the heat dissipation effect of the heat dissipation system 100 on the electronic product. The at least two cooling members 15 are connected in series through the inner pipeline 13, and of course, can be connected in parallel, or can be connected in series and parallel. In addition, in some embodiments, the number of cooling members 15 can be set to one. It can be seen that the number and arrangement of the cooling members 15 are not limited in the present application, and can be adaptively set according to the number and arrangement of the high-power devices on the electronic product.

[0041] Referring to FIG. 1, in an embodiment of the present application, the outer side of the mounting shell 11 is provided with a first liquid inlet connector 113 and a first liquid outlet connector 114, the first liquid inlet connector 113 and the first liquid outlet connector 114 are communicated with the mounting cavity 111, the first inlet end 211 is communicated with the first liquid outlet connector 114, and the first outlet end 212 is communicated with the first liquid inlet connector 113.

[0042] In the embodiment, the first liquid inlet connector 113 and the first liquid outlet connector 114 are provided, which facilitates quick plug connection of the first inlet end 211 and the first outlet end 212 of the first communication pipe 21, and further facilitates further improving the convenience of manufacturing the heat dissipation system 100. The first liquid inlet connector 113 and the first liquid outlet connector 114 are fluid connectors, which can be automatically closed when disconnected, and can be liquid-conducting when connected. Further, the type of the first liquid inlet connector 113 and the first liquid outlet connector 114 can be a quick blind plug connector. At this time, the quick blind plug connector is provided with a floating device, and no manual connection operation is required. When the mounting shell 11 is installed in place, the quick blind plug connector can automatically realize connection, which is relatively simple and facilitates further improving the convenience of using the heat dissipation system 100. Of course, it can also be a quick connector or a hand-plug quick connector. After the mounting shell 11 is installed in place, the first liquid inlet connector 113 and the first liquid outlet connector 114 can be connected through manual operation. It can be seen that the type of the first liquid inlet connector 113 and the first liquid outlet connector 114 is not limited in the present application.

[0043] Similarly, the inlets 131 and outlets 132 of the inner tubes 13 are connected to the external tubes, in an embodiment of the present application, the outer side of the mounting shell 11 can be provided with a second liquid inlet connector 115 and a second liquid outlet connector 116, the second liquid inlet connector 115 is connected to the inlet 131, and the second liquid outlet connector 116 is connected to the outlet 132. The second liquid inlet connector 115 and the second liquid outlet connector 116 can also be fluid connectors, which can be automatically closed when disconnected, and can be liquid-conducting when connected. In an embodiment, the second liquid inlet connector 115 and the second liquid outlet connector 116 can be quick blind plug connectors, and of course can also be quick connectors or hand-plug quick connectors. It can be seen that the type of the second liquid inlet connector 115 and the second liquid outlet connector 116 is not limited in the present application.

[0044] Please refer to FIG. 1, FIG. 3 and FIG. 4, in an embodiment of the present application, the number of cooling modules 10 is at least two, and the heat dissipation system 100 further comprises a first liquid inlet distributor 30, a first liquid outlet distributor 40, a second liquid inlet distributor 50 and a second liquid outlet distributor 60; the first liquid inlet distributor 30 is connected to the first outlet end 212, and the first liquid inlet connector 113 in each cooling module 10 is respectively connected to the first liquid inlet distributor 30; the first liquid outlet distributor 40 is connected to the first inlet end 211, and the first liquid outlet connector 114 in each cooling module 10 is respectively connected to the first liquid outlet distributor 40; the inlet 131 in each cooling module 10 is respectively connected to the second liquid inlet distributor 50, and the outlet 132 in each cooling module 10 is respectively connected to the second liquid outlet distributor 60.

[0045] In the present embodiment, the arrangement of at least two cooling modules 10 can be used to dissipate heat for at least two electronic products, thereby facilitating the centralized heat dissipation of the heat dissipation system 100 for at least two electronic products. Further, the arrangement of the first liquid inlet distributor 30, the first liquid outlet distributor 40, the second liquid inlet distributor 50 and the second liquid outlet distributor 60 can achieve that the mounting shell 11 in each cooling module 10 can share a set of first external tube assemblies 20, and the cooling member 15 in each cooling module 10 can also share a set of external tubes, thereby facilitating the simplification of the number and structure of parts of the heat dissipation system 100, and further improving the convenience of manufacturing the heat dissipation system 100. At the same time, such an arrangement can also achieve that the first cooling medium 112 and the second cooling medium 731 flowing through the inner tube 13 can be uniformly distributed to each cooling module 10, thereby improving the uniformity of heat dissipation for the electronic products in each cooling module 10.

[0046] Please refer to FIG. 1, FIG. 3 and FIG. 4, in an embodiment of the present application, the first liquid inlet distributor 30 is provided with at least two first fluid connectors 31, each of which is connected to a first liquid inlet connector 113; the first liquid outlet distributor 40 is provided with at least two second fluid connectors 41, each of which is connected to a first liquid outlet connector 114; the second liquid inlet distributor 50 is provided with at least two third fluid connectors 51, each of which is connected to a second liquid inlet connector 115; and the second liquid outlet distributor 60 is provided with at least two fourth fluid connectors 61, each of which is connected to a second liquid outlet connector 116.

[0047] In the embodiment, the first fluid connectors 31, the second fluid connectors 41, the third fluid connectors 51 and the fourth fluid connectors 61 are provided to facilitate the portable connection with the first liquid inlet connectors 113, the first liquid outlet connectors 114, the second liquid inlet connectors 115 and the second liquid outlet connectors 116, so as to further improve the convenience of manufacturing the heat dissipation system 100. The first fluid connectors 31, the second fluid connectors 41, the third fluid connectors 51 and the fourth fluid connectors 61 can also be fluid connectors, which can be automatically closed when disconnected and can realize liquid conduction when connected. In an embodiment, the first fluid connectors 31, the second fluid connectors 41, the third fluid connectors 51 and the fourth fluid connectors 61 can be quick blind plug connectors, and of course can also be quick connectors or hand-plug quick connectors. It can be seen that the type of the first fluid connectors 31, the second fluid connectors 41, the third fluid connectors 51 and the fourth fluid connectors 61 is not limited in the present application.

[0048] Please refer to FIG. 1 and FIG. 5, in an embodiment of the present application, the heat dissipation system 100 further comprises a second external pipeline assembly 70, which comprises a second communication pipe 71 and a second liquid pump 72 arranged on the second communication pipe 71. The second communication pipe 71 is arranged on the outside of the mounting shell 11 and has a second inlet end 711 and a second outlet end 713. The second liquid inlet distributor 50 is connected to the second outlet end 713, and the second liquid outlet distributor 60 is connected to the second inlet end 711.

[0049] In the embodiment, the second outer pipe assembly 70 is arranged so that the cooling member 15 and the mounting shell 11 can adopt different outer pipes, and thus two sets of medium circulation systems can be formed, i.e., the first medium circulation system 23 corresponding to the mounting shell 11 as described above and the second medium circulation system 74 corresponding to the cooling member 15 as described below. At this time, the two medium circulation systems can be conveniently arranged and controlled respectively, so as to further improve the convenience of manufacturing the heat dissipation system 100. The second liquid pump 72 can be used to provide power to drive the second cooling medium 731 to flow out of the outlet end 132 after absorbing heat in the cooling member 15, and then to flow into the second outer pipe assembly 70 to dissipate heat and then to re-enter the inner pipe 13 and the cooling member 15 through the inlet end 131, so as to realize the circulation heat dissipation of the high-power components of the electronic product (the arrow in FIGS. 1 and 5 indicates the flow direction of the second cooling medium 112).

[0050] Referring to FIG. 5, in an embodiment of the present application, the second outer pipe assembly 70 further comprises a second container 73, which is arranged in the second communication pipe 71 and stores the second cooling medium 731.

[0051] In the embodiment, the second container 73 can store the second cooling medium 731, so that the second cooling medium 731 flowing through the inner pipe 13 and the cooling member 15 can be replenished in time when the second cooling medium 731 is damaged due to use. The second cooling medium 731 can be oil or fluorinated liquid, and the type of the second cooling medium 731 is not limited in the present application as long as it is not conductive. In addition, the types of the second cooling medium 731 and the first cooling medium 112 can be the same or different.

[0052] Referring to FIG. 5, in an embodiment of the present application, the inner pipe 13, the cooling member 15 and the second outer pipe assembly 70 are communicated to form a second medium circulation system 74, and the pressure in the medium flow path of the second medium circulation system 74 is negative pressure.

[0053] In the embodiment, the pressure in the medium flow path of the second medium circulation system 74 is set to negative pressure, so that even if a certain position of the second medium circulation system 74 is damaged, the second cooling medium 731 will not flow out of the damaged position under the action of the external atmospheric pressure, thereby facilitating the further improvement of the reliability of the heat dissipation system 100. In other embodiments, the pressure in the medium flow path of the second medium circulation system 74 can also be set to positive pressure.

[0054] Referring to FIG. 5, in an embodiment of the present application, the second outer pipe assembly 70 further comprises a second vacuum pump 75, which is communicated with the second container 73.

[0055] In the embodiment, the second vacuum pump 75 is arranged in communication with the second container 73, so that the second container 73 can be used to perform vacuumizing at any time, so as to adjust the pressure in the medium flow path of the second medium circulating system 74. In this way, the pressure in the medium flow path of the second medium circulating system 74 can be kept within the preset negative pressure value, so as to further improve the reliability of the heat dissipation system 100.

[0056] Referring to FIG. 5, in an embodiment of the present application, the second outer pipeline assembly 70 further comprises a second connecting pipeline 76 and a second control valve 77. The second connecting pipeline 76 is in communication with the second vacuum pump 75 and the second container 73, and the second control valve 77 is arranged in the second connecting pipeline 76.

[0057] In the embodiment, the second connecting pipeline 76 can reduce the requirement for the relative position of the second vacuum pump 75 and the second container 73 when they are connected, so as to facilitate the arrangement of the second vacuum pump 75 and the second container 73, and further improve the convenience of manufacturing the heat dissipation system 100. Further, in cooperation with the second control valve 77, the controllability of the communication between the second vacuum pump 75 and the second container 73 can be improved, and the sealing effect in the medium flow path of the second medium circulating system 74 can be improved, so as to stably keep the required negative pressure value. The second control valve 77 can be an electric control valve, so as to improve the automation degree of the heat dissipation system 100. Of course, the second control valve 77 can also be a manual valve, so as to improve the controllability by human.

[0058] Referring to FIG. 5, in an embodiment of the present application, the second outer pipeline assembly 70 further comprises a second heat exchanger 78, which is arranged in the second connecting pipeline 71.

[0059] In the embodiment, the second heat exchanger 78 is arranged, so that the second cooling medium 731 in the cooling member 15 can exchange heat with the second heat exchanger 78 when flowing through the second heat exchanger 78 after exchanging heat with the high-power device of the electronic product, so as to further improve the heat dissipation effect. The second heat exchanger 78 can exchange heat with external air. Of course, a fan can be arranged to cool the second heat exchanger 78, so as to further improve the heat exchange effect of the second heat exchanger 78. Alternatively, a third flow path and a fourth flow path can be formed in the second heat exchanger 78. At this time, the second cooling medium 731 in the second medium circulating system 74 can flow through the third flow path in the second heat exchanger 78. The fourth flow path can form a refrigerant circulating system, so that a low-temperature liquid in the refrigerant circulating system can cool the second heat exchanger 78 when flowing through the fourth flow path. It can be seen that the heat dissipation mode of the second heat exchanger 78 is not limited in the present application.

[0060] Referring to FIG. 6, in an embodiment of the present application, the second liquid inlet distributor 50 is connected to the first outlet end 212, and the second liquid outlet distributor 60 is connected to the first inlet end 211.

[0061] In the embodiment, the second liquid inlet distributor 50 and the second liquid outlet distributor 60 are respectively connected to the first outlet end 212 and the first inlet end 211, so that the cooling member 15 and the mounting shell 11 can share a set of external pipelines, i.e., a first external pipeline assembly. In this way, the pipeline design of the heat dissipation system 100 can be simplified, and thus the manufacturing cost can be reduced.

[0062] Referring to FIG. 1, in an embodiment of the present application, the mounting shell 11 has a first surface 117 and a second surface 118 arranged oppositely, and a third surface 119 connecting the first surface 117 and the second surface 118; the first liquid inlet connector 113 and the first liquid outlet connector 114 are arranged on the first surface 117, and the second liquid inlet connector 115 and the second liquid outlet connector 116 are arranged on the second surface 118, or on two third surfaces 119 arranged oppositely.

[0063] In the embodiment, the first liquid inlet connector 113 and the first liquid outlet connector 114 are arranged on the first surface 117, and the second liquid inlet connector 115 and the second liquid outlet connector 116 are arranged on the second surface 118, or on the third surface 119. In this way, the first liquid inlet connector 113 and the first liquid outlet connector 114 are arranged on one side of the mounting shell 11, and the second liquid inlet connector 115 and the second liquid outlet connector 116 are arranged on the other side of the mounting shell 11. Thus, when the first liquid inlet connector 113 and the first liquid outlet connector 114 are arranged, the second liquid inlet connector 115 and the second liquid outlet connector 116 are not easily interfered, and thus the convenience of connecting the mounting shell 11 and the cooling member 15 to the external pipelines can be improved.

[0064] Referring to FIG. 1, in an embodiment of the present application, the heat dissipation system 100 further includes a cabinet 80, the cabinet 80 is provided with a receiving cavity 81 having a taking and placing opening connected to the receiving cavity 81, and at least two cooling modules 10 are arranged in the receiving cavity 81; a cavity wall of the receiving cavity 81 has a first cavity wall 811 arranged opposite to the taking and placing opening and a second cavity wall 813 arranged adjacent to the taking and placing opening, the first liquid inlet distributor 30 and the first liquid outlet distributor 40 are arranged on the first cavity wall 811, and the second liquid inlet distributor 50 and the second liquid outlet distributor 60 are respectively arranged on two second cavity walls 813 arranged oppositely; the first surface 117 is arranged opposite to the first cavity wall 811, and the third surface 119 is arranged opposite to the second cavity wall 813.

[0065] In the embodiment, the cabinet 80 is arranged to facilitate the installation and bearing of the at least two cooling modules 10, so as to simplify the arrangement of the installation and bearing mechanism. Meanwhile, the cabinet 80 can also serve to isolate and protect the cooling modules 10. Further, the first liquid inlet distributor 30 and the first liquid outlet distributor 40 are arranged on the first cavity wall 811, and the first liquid inlet connector 113 and the first liquid outlet connector 114 are arranged on the first surface 117, so that when the cooling module 10 is placed on the cabinet 80, the first liquid inlet distributor 30 and the first liquid outlet distributor 40 can be opposite to the first liquid inlet connector 113 and the first liquid outlet connector 114, thereby facilitating the connection of the two. In particular, when the first liquid inlet connector 113 and the first liquid outlet connector 114 are blind-mate connectors, the first liquid inlet connector 113 and the first liquid outlet connector 114 can be automatically connected with the first liquid inlet distributor 30 and the first liquid outlet distributor 40 when the cooling module 10 is installed in place. The second liquid inlet distributor 50 and the second liquid outlet distributor 60 are arranged on the two second cavity walls 813 opposite to each other, so that after the cooling module 10 is installed in the cabinet 80, the second liquid inlet distributor 50 and the second liquid outlet distributor 60 are not easily blocked by the cooling module 10, thereby facilitating the connection of the second liquid inlet distributor 50 and the second liquid outlet distributor 60 with the second liquid inlet connector 115 and the second liquid outlet connector 116. When the defined pick-and-place opening is arranged forward, the at least two cooling modules 10 can be stacked in the vertical direction to reduce the space occupation in the horizontal direction. In addition, each cooling module 10 can be detachably installed in the cabinet 80, so as to facilitate the maintenance and replacement of the cooling module 10 and the electronic product.

[0066] Referring to FIG. 1, in an embodiment of the present application, the heat dissipation system 100 further comprises at least two liquid inlet pipes and at least two liquid outlet pipes. Each liquid inlet pipe is connected between the second liquid inlet distributor 50 and one second liquid inlet connector 115, and each liquid outlet pipe is connected between the second liquid outlet distributor 60 and one second liquid outlet connector 116.

[0067] In the embodiment, the arrangement of the liquid inlet pipes and the liquid outlet pipes can further reduce the requirement for the installation position of the second liquid inlet distributor 50 and the second liquid outlet distributor 60 when connected with the second liquid inlet connector 115 and the second liquid outlet connector 116, thereby further facilitating the connection of the second liquid inlet distributor 50 and the second liquid outlet distributor 60 with the second liquid inlet connector 115 and the second liquid outlet connector 116.

[0068] The application further provides a communication device comprising the heat dissipation system 100 and an electronic product. The specific structure of the heat dissipation system 100 is referred to the above-mentioned embodiments. Since the communication device adopts all the technical solutions of the above-mentioned embodiments, it has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here. The electronic product is arranged in the mounting cavity 111 of the mounting shell 11 of the cooling module 10 of the heat dissipation system 100. The electronic product can be a server, a router, a switch or the like. The application does not limit the type of the electronic product, but only the product which generates heat during work and needs to be cooled.

[0069] The above-mentioned is only the optional embodiment of the application, and does not limit the patent scope of the application. Any equivalent structural transformation, direct / indirect application in other related technical fields based on the inventive concept of the application and the content of the specification and drawings are included in the patent protection scope of the application.

Claims

1. A heat dissipation system, wherein, The system includes: A cooling module, comprising a mounting housing having a closed mounting cavity containing a first cooling medium, the mounting cavity being used to house an electronic product; and The first external piping assembly includes a first connecting pipe and a first liquid pump disposed on the first connecting pipe. The first connecting pipe is disposed on the outside of the mounting housing and has a first inlet end and a first outlet end. The first inlet end and the first outlet end are connected to the mounting cavity to connect the first external pipeline assembly and the mounting shell, and are configured as a first medium circulation system, wherein the pressure in the medium flow path of the first medium circulation system is negative.

2. The heat dissipation system as described in claim 1, wherein, The first external piping assembly also includes a first container disposed on the first connecting pipe, and the first container stores the first cooling medium.

3. The heat dissipation system as described in claim 2, wherein, The first external piping assembly also includes a first vacuum pump, which is connected to the first container.

4. The heat dissipation system as described in claim 3, wherein, The first external piping assembly further includes a first connecting pipe and a first control valve. The first connecting pipe connects the first vacuum pump and the first container, and the first control valve is located on the connecting pipe.

5. The heat dissipation system as described in claim 1, wherein, The first external piping assembly also includes a first heat exchanger, which is disposed on the first connecting pipe.

6. The heat dissipation system according to any one of claims 1 to 5, wherein, The cooling module further includes an inner pipe and a cooling component. The inner pipe is located inside the mounting cavity and has an inflow end and an outflow end that connect to the outside of the mounting shell. The cooling component is located in the inner pipe and has a medium flow channel that connects to the inner pipe.

7. The heat dissipation system as described in claim 6, wherein, The number of cooling components is at least two, and the at least two cooling components are arranged in series and / or in parallel through the internal pipe.

8. The heat dissipation system as described in claim 6, wherein, The outer side of the mounting housing is provided with a first liquid inlet connector and a first liquid outlet connector. The first liquid inlet connector and the first liquid outlet connector are connected to the mounting cavity. The first inlet end is connected to the first liquid outlet connector, and the first outlet end is connected to the first liquid inlet connector. And / or, the outer side of the mounting housing is provided with a second liquid inlet connector and a second liquid outlet connector, the second liquid inlet connector being connected to the inflow end and the second liquid outlet connector being connected to the outflow end.

9. The heat dissipation system as described in claim 8, wherein, The number of cooling modules is at least two, and the heat dissipation system further includes a first liquid inlet distributor, a first liquid outlet distributor, a second liquid inlet distributor, and a second liquid outlet distributor. The first liquid inlet distributor is connected to the first outlet end, and the first liquid inlet connector in each of the cooling modules is respectively connected to the first liquid inlet distributor; The first liquid outlet distributor is connected to the first inlet end, and the first liquid outlet connector in each of the cooling modules is respectively connected to the first liquid outlet distributor; The inflow end of each of the cooling modules is connected to the second liquid inlet distributor, and the outflow end of each of the cooling modules is connected to the second liquid outlet distributor.

10. The heat dissipation system as claimed in claim 9, wherein, The first liquid inlet separator is provided with at least two first fluid connectors, each of which is connected to one of the first liquid inlet connectors. The first liquid outlet separator is provided with at least two second fluid connectors, each of which is connected to one of the first liquid outlet connectors. The second liquid inlet separator is provided with at least two third fluid connectors, each of which is connected to one of the second liquid inlet connectors; The second liquid outlet separator is provided with at least two fourth fluid connectors, each of which is connected to one of the second liquid outlet connectors.

11. The heat dissipation system as claimed in claim 9, wherein, The heat dissipation system further includes a second external piping assembly, which includes a second connecting pipe and a second liquid pump disposed on the second connecting pipe. The second connecting pipe is disposed on the outside of the mounting housing and has a second inlet end and a second outlet end. The second liquid inlet separator is connected to the second outlet end, and the second liquid outlet separator is connected to the second inlet end.

12. The heat dissipation system as claimed in claim 11, wherein, The second external piping assembly also includes a second container disposed in the second connecting pipe, the second container storing a second cooling medium.

13. The heat dissipation system as claimed in claim 12, wherein, The inner pipe, the cooling component, and the second outer pipe assembly are connected to form a second medium circulation system, and the pressure in the medium flow path of the second medium circulation system is negative.

14. The heat dissipation system as claimed in claim 13, wherein, The second external piping assembly also includes a second vacuum pump, which is connected to the second container.

15. The heat dissipation system as claimed in claim 14, wherein, The second external piping assembly also includes a second connecting pipe and a second control valve. The second connecting pipe connects the second vacuum pump and the second container, and the second control valve is located on the second connecting pipe.

16. The heat dissipation system as claimed in claim 11, wherein, The second external piping assembly also includes a second heat exchanger, which is disposed on the second connecting pipe.

17. The heat dissipation system as claimed in claim 9, wherein, The second liquid inlet separator is connected to the first outlet end, and the second liquid outlet separator is connected to the first inlet end.

18. The heat dissipation system as claimed in claim 9, wherein, The mounting housing has a first surface and a second surface disposed opposite to each other, and a third surface connecting the first surface and the second surface; The first liquid inlet connector and the first liquid outlet connector are disposed on the first surface, and the second liquid inlet connector and the second liquid outlet connector are disposed on the second surface, or respectively disposed on two opposing third surfaces.

19. The heat dissipation system as claimed in claim 18, wherein, The heat dissipation system also includes a cabinet, which has a receiving cavity and an access port communicating with the receiving cavity, and at least two cooling modules are disposed in the receiving cavity; The cavity wall of the accommodating cavity has a first cavity wall facing the inlet and outlet and a second cavity wall adjacent to the inlet and outlet. The first liquid inlet separator and the first liquid outlet separator are disposed on the first cavity wall, and the second liquid inlet separator and the second liquid outlet separator are respectively disposed on the two opposing second cavity walls. The first surface and the first cavity wall are arranged opposite to each other, and the third surface and the second cavity wall are arranged opposite to each other.

20. The heat dissipation system as claimed in claim 19, wherein, The heat dissipation system further includes at least two inlet pipes and at least two outlet pipes, each inlet pipe being connected to the second inlet distributor and a second inlet connector, and each outlet pipe being connected to the second outlet distributor and a second outlet connector.

21. A communication device comprising a heat dissipation system as described in any one of claims 1 to 20.

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